Polishing solution as well as preparation method and application thereof

Abstract

The invention discloses a polishing solution as well as a preparation method and application thereof. The polishing solution comprises an abrasive, a lubricant, a corrosion inhibitor and a solvent, the grinding material comprises a silicon material; the lubricant comprises water-soluble organic molybdenum; the corrosion inhibitor comprises Guerbet acid and benzotriazole. The polishing solution can form a layer of compact protective film on the surface of a workpiece, protect the surface of the workpiece from being abraded, prevent corrosion pits, rusty spots and other defects on the surface of the workpiece, meanwhile, has a self-repairing effect on microdefects on the surface of the workpiece, eliminates the phenomenon that the surface of the workpiece is blue in the polishing process, and improves the polishing quality. And a polished surface is ensured to present black and bright specular luster, a good fine polishing effect is achieved, and the method can be widely applied to the field of precision part machining.

Description

Technical Field

[0001] This application relates to the technical field of metal polishing, and particularly relates to a polishing liquid, a preparation method thereof, and an application thereof. Background Art

[0002] Polishing refers to a processing method that uses mechanical, chemical, or electrochemical methods to reduce the surface roughness of metal workpieces to obtain a bright and flat surface. Compared with mechanical polishing and chemical polishing, chemical mechanical polishing (CMP) is a technology that combines chemical polishing and mechanical polishing to process the surface of materials. It combines the advantages of chemical polishing and mechanical polishing. While ensuring the material removal efficiency, it can obtain a surface with a flatness significantly higher than that of single chemical polishing and mechanical polishing, and can achieve a surface roughness at the nanometer and atomic levels, achieving the effect of fine polishing. Fine polishing can remove the fine scratches, abrasion marks, and protrusions remaining on the workpiece surface after rough polishing and medium polishing, greatly reducing the surface roughness of the polished surface, and has been widely used in the fields of precision machinery manufacturing, semiconductor device manufacturing, and optical instruments.

[0003] The polishing liquid is an important factor determining the CMP polishing effect. During the CMP process, the abrasive in the polishing liquid interacts with the surface of the material to be polished. Under the action of mechanical force, it micro-cuts and grinds the surface of the material to be polished, gradually removing the protruding parts on the material surface, thereby achieving material removal and surface planarization. At the same time, the chemical substances in the polishing liquid will chemically react with the material surface to form a reaction layer that is easy to remove. This reaction layer is more easily removed under the mechanical action of the abrasive, thereby improving the polishing efficiency. However, the polishing effect of traditional polishing liquids is not good. Especially during fine polishing, blue grinding spot imprints are easily generated on the workpiece surface, and the surface roughness cannot reach the mirror gloss effect. Summary of the Invention

[0004] Based on this, this application provides a polishing liquid that can eliminate the blue grinding spot marks on the workpiece surface, making the polished surface show a black and bright mirror gloss and achieving a good fine polishing effect.

[0005] In the first aspect of this application, a polishing liquid is provided, which includes an abrasive, a lubricant, a corrosion inhibitor, and a solvent;

[0006] The abrasive includes silicon materials;

[0007] The lubricant includes water-soluble organic molybdenum;

[0008] The corrosion inhibitor includes Guerbet acid and benzotriazole.

[0009] In some of the embodiments, the silicon material includes silica sol;

[0010] Optionally, the particle size of the silica sol is 20 nm - 25 nm.

[0011] In some embodiments, the mass content of the abrasive in the polishing liquid is 2% - 8%.

[0012] In some embodiments, the mass content of the lubricant in the polishing liquid is 1% - 8%.

[0013] In some embodiments, the mass content of the corrosion inhibitor in the polishing liquid is 0.05% - 4%.

[0014] And / or, the mass ratio of Guerbet acid to benzotriazole in the corrosion inhibitor is (0.1 - 3) : (0.05% - 1).

[0015] In some embodiments, the polishing liquid further includes a surfactant.

[0016] Optionally, the surfactant includes an alkoxy quaternary ammonium compound.

[0017] Optionally, the mass content of the surfactant in the polishing liquid is 1% - 12%.

[0018] In some embodiments, the polishing liquid satisfies at least one of the following conditions:

[0019] (1) The density of the polishing liquid is 1.01 g / cm 3 - 1.03 g / cm 3 ;

[0020] (2) The pH value of the polishing liquid is 8 - 8.3;

[0021] (3) The viscosity of the polishing liquid is 100 mPa - 120 mPa;

[0022] (4) The surface tension of the polishing liquid < 40 N / m.

[0023] The second aspect of the present application provides a method for preparing the polishing liquid according to the first aspect, including the following steps:

[0024] Prepare the polishing liquid according to the first aspect by using an abrasive, a lubricant, a corrosion inhibitor and a solvent.

[0025] The third aspect of the present application provides an application of the polishing liquid in surface treatment. The polishing liquid is the polishing liquid according to the first aspect of the present application or the polishing liquid prepared by the preparation method according to the second aspect of the present application.

[0026] In some embodiments, the material of the surface is aluminum alloy.

[0027] The polishing liquid of the present application is compounded with an abrasive including silicon material, a lubricant including water-soluble organic molybdenum, and a corrosion inhibitor including Guerbet acid and benzotriazole, which can form a dense protective film on the surface of the workpiece, protect the surface of the workpiece from being worn, prevent defects such as corrosion pits and rust spots on the surface of the workpiece, and at the same time have a self-repairing effect on the microscopic defects on the surface of the workpiece, eliminating the phenomenon of blue grinding marks on the surface of the workpiece during the polishing process, ensuring that the polished surface presents a black and bright mirror-like luster, achieving a good fine polishing effect, and can be widely used in the field of precision part processing. Detailed Embodiments

[0028] For ease of understanding the present application, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0030] The "range" disclosed in this application is defined in the form of a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundary of a specific range. The range defined in this way can include or exclude the end values and can be combined arbitrarily, that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60 - 120 and 80 - 110 are listed for a specific parameter, ranges of 60 - 110 and 80 - 120 are also contemplated. In addition, if the minimum range values 1 and 2 are listed, and if the maximum range values 3, 4, and 5 are listed, then the following ranges are all contemplated: 1 - 3, 1 - 4, 1 - 5, 2 - 3, 2 - 4, and 2 - 5. In this application, unless otherwise stated, the numerical range "a - b" represents an abbreviated representation of any real number combination between a and b, where a and b are both real numbers. For example, the numerical range "0 - 5" means that all real numbers between "0 - 5" have been fully listed herein, and "0 - 5" is only an abbreviated representation of these numerical combinations. Additionally, when it is stated that a certain parameter is an integer ≥2, it is equivalent to disclosing that the parameter is, for example, the integer 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc. For example, when it is stated that a certain parameter is an integer selected from "2 - 10", it is equivalent to listing the integers 2, 3, 4, 5, 6, 7, 8, 9, and 10.

[0031] If there is no special instruction, all embodiments and optional embodiments of this application can be combined with each other to form a new technical solution.

[0032] Unless otherwise specified, all steps of this application can be carried out sequentially or randomly, preferably sequentially. For example, when the method includes steps (a) and (b), it means that the method can include steps (a) and (b) carried out sequentially, or can also include steps (b) and (a) carried out sequentially. For example, when it is mentioned that the method may further include step (c), it means that step (c) can be added to the method in any order. For example, the method can include steps (a), (b) and (c), or can also include steps (a), (c) and (b), or can also include steps (c), (a) and (b), etc.

[0033] Unless otherwise specified, the terms "comprising", "containing" and "including" mentioned in this application mean open-ended, and can also be closed-ended. For the open-ended case, for example, the "comprising", "containing" and "including" can mean that other members, elements or method steps not listed can also be included or contained, or can also only include or contain the listed members, elements or method steps.

[0034] Unless otherwise specified, in this application, the term "or" is inclusive. For example, the phrase "A or B" means "A, B, or both A and B". Further, any of the following conditions satisfies the condition "A or B": A is true (or exists) and B is false (or does not exist); A is false (or does not exist) while B is true (or exists); or both A and B are true (or exist).

[0035] In this application, unless otherwise stated, A (such as B) means that B is a non-limiting example of A, and it can be understood that A is not limited to B.

[0036] In this application, when it comes to "a plurality of", "a variety of", etc., unless otherwise specified, it means greater than 2 or equal to 2 in quantity. For example, "one or more" means one or greater than or equal to two.

[0037] In this application, in "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", etc., the terms "first", "second", "third", "fourth", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can it be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", etc. only serve the purpose of non-exhaustive enumeration and description, and it should be understood that they do not constitute a closed-ended limitation on quantity.

[0038] In this application, for units related to data ranges, if only the right endpoint is followed by a unit, it means that the units of the left endpoint and the right endpoint are the same.

[0039] The first aspect of the embodiment of the present application provides a polishing liquid, which includes an abrasive, a lubricant, a corrosion inhibitor and a solvent;

[0040] The abrasive includes silicon materials;

[0041] The lubricant includes water-soluble organic molybdenum;

[0042] The corrosion inhibitor includes Guerbet acid and benzotriazole.

[0043] Water-soluble organic molybdenum refers to a class of organic molybdenum compounds modified by hydrophilic organic groups, which can be well dissolved or dispersed in water. During the polishing process, a protective film with anti-friction and anti-wear effects can be formed on the surface of the workpiece, effectively reducing the friction coefficient and reducing wear.

[0044] Fullerene nitrogen boron is a special fullerene formed after the carbon atoms on the fullerene carbon cage are replaced by heteroatoms such as nitrogen atoms and boron atoms. It maintains the nano-spherical or cage-like structure of fullerene, and can play a role similar to "ball bearings" on the polishing surface, converting sliding friction into rolling friction, further reducing the friction coefficient. Moreover, it can fill the microscopic defects and unevenness on the surface of metal workpieces, exerting a self-repairing effect, forming a repair layer on the worn surface, filling and repairing the already generated micro-wear, and restoring the flatness and smoothness of the surface. The introduction of nitrogen atoms and boron atoms endows the polishing liquid with certain antioxidant ability, which can capture the free radicals generated during the polishing process, thereby slowing down the oxidation rate of the lubricant and the polishing liquid, and preventing performance degradation and corrosion caused by oxidation.

[0045] The present invention does not make a special limitation on the source of the lubricant. It can be prepared by itself or obtained through commercial purchase. For example, the water-soluble organic molybdenum with the commercial brand number GM4022 contains both water-soluble organic molybdenum and 5% fullerene nitrogen boron by mass.

[0046] Guerbet acid is a type of fatty acid with a long branched alkane at the α-position of the carboxylic acid. The surface of the metal to be polished usually has a certain charge. The carboxyl group of Guerbet acid can be adsorbed on the metal surface through electrostatic attraction, hydrogen bonding and other interactions. At the same time, after being adsorbed on the metal surface, its long alkane branched chains are intertwined and arranged to form a continuous and dense adsorption film, isolating the polished surface from the external corrosive medium, thereby achieving the effect of slowing down corrosion and avoiding pitting during the polishing process.

[0047] Benzotriazole is a multifunctional organic-inorganic heterocyclic compound, mainly used as an anti-rust agent and corrosion inhibitor for anti-rust oils on metals (such as silver, copper, lead, nickel, zinc, etc.), widely used in anti-rust oil (grease) products, and mostly used as a vapor-phase corrosion inhibitor for copper and copper alloys, etc.

[0048] The polishing liquid provided by the present application can better form a dense protective film on the surface of the workpiece by using a compound corrosion inhibitor of Gerber acid and benzotriazole, isolating the workpiece from the corrosive substances in the polishing liquid, preventing defects such as corrosion pits and rust spots on the metal surface, making the surface of the polished workpiece smoother and flatter, improving the surface finish and precision, and is especially suitable for fine polishing operations, which is of great significance for the processing of some precision parts with high surface quality requirements.

[0049] In some of the embodiments, the silica material includes silica sol. The main component of silica sol is silicon dioxide, which has a relatively low Mohs hardness and causes minimal damage to the surface of the metal workpiece during the polishing process, and can obtain a surface with high flatness and low roughness.

[0050] When silica sol and water-soluble organic molybdenum are added to the polishing liquid at the same time, silica sol has excellent filling properties, can fill the microscopic defects on the material surface, and improve the wear resistance of the polished surface. Water-soluble organic molybdenum can form a protective film on the friction surface, reduce direct metal contact, and reduce wear. The nano-spherical or cage-like structure of fullerene nitrogen boron in water-soluble organic molybdenum can further reduce the friction coefficient through the ball bearing effect, and jointly fill the surface pores with silica sol to form a denser protective layer, significantly improving the anti-wear performance. The functions of the three complement each other, and through inorganic filling, organic lubrication, and nano-repair effects, they produce a synergistic effect, making the polished surface show a black and bright mirror-like luster, achieving a surface roughness below the nanometer level and achieving a good fine polishing effect.

[0051] In some of the embodiments, the particle size of the silica sol is 20nm - 25nm. Small-particle-size silica sol can be evenly distributed on the surface to be polished and can more finely trim the surface during the polishing process, filling small pits and scratches, making the flatness of the polished surface higher and the roughness lower. However, too small a particle size will make the abrasive more likely to agglomerate in the polishing liquid, affecting the stability of the polishing liquid. Within the above particle size range, the stability and polishing effect of the polishing liquid can reach a better balance. Exemplarily, the particle size of the silica sol can be 20nm, 21nm, 22nm, 23nm, 24nm, 25nm, or the range composed of any two of the foregoing values.

[0052] In some of these embodiments, the mass content of the abrasive in the polishing liquid is 2% - 8%, especially the mass content of silica sol is 2% - 8%. Within the above content range, the silica sol can form a sufficient and uniform abrasive layer between the polishing liquid and the surface of the material to be polished. There are sufficient nano-silica particles to friction and physicochemically interact with the surface, achieving a higher removal rate, making the surface of the polished material reach high flatness and smoothness, and controlling the surface roughness at a lower level. Exemplarily, the mass content of silica sol in the polishing liquid can be 2%, 3%, 4%, 5%, 6%, 7%, 8% or the range composed of any two of the foregoing values.

[0053] In some of these embodiments, the mass content of the lubricant in the polishing liquid is 1% - 8%. Within the above content range, it helps to form a uniform, dense and properly thick lubricating film on the polished surface, which can play a good protection and buffering role during grinding, making the mechanical grinding more uniform and stable, thereby obtaining a lower surface roughness and achieving a high-quality fine polishing effect. Exemplarily, the content of the lubricant in the polishing liquid can be 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8% or the range composed of any two of the foregoing values.

[0054] In some of these embodiments, the mass content of the corrosion inhibitor in the polishing liquid is 0.05% - 4%. Within the above content range, it helps to form a uniform, dense and properly thick lubricating film on the polished surface, which can play a good protection and buffering role during grinding, making the mechanical grinding more uniform and stable, thereby obtaining a lower surface roughness and achieving a high-quality fine polishing effect. Exemplarily, the content of the lubricant in the polishing liquid can be 0.05%, 0.1%, 0.5%, 1%, 2%, 3%, 4% or the range composed of any two of the foregoing values.

[0055] In some embodiments of the present application, the mass ratio of gerberic acid to benzotriazole in the corrosion inhibitor is (0.1 - 3):(0.05% - 1), and within this ratio range, the technical effects of the present application can be better achieved.

[0056] As a non-limiting example, the Guerbet acids in the embodiments of the present application include one or more of C12 Guerbet acid (Isocarb12 Guerbet acid), C14 Guerbet acid (Isocarb 14 Guerbet acid), and C24 Guerbet acid (Isocarb 24 Guerbet acid). Optionally, the Guerbet acid in the embodiments of the present application is Isocarb 14 Guerbet acid, that is, 2-decyltetradecanoic acid. Isocarb 14 Guerbet acid has a moderate carbon chain length. Compared with Guerbet acids with lower carbon numbers, its sufficient carbon chain length can form a stable and durable protective film, reducing the friction and wear between the polishing tool and the metal workpiece, and also avoiding the adverse effect on the polishing efficiency caused by the too thick protective film generated by too long carbon chain length.

[0057] Some metal workpieces may contain copper elements. During the polishing process, the copper elements may react with the polishing liquid to form blue copper compounds, which adhere to the surface of the metal workpiece to form blue grinding spots. The addition of benzotriazole can coordinate with copper ions to form complexes, and these complexes form a protective film on the surface of the metal workpiece to prevent the excessive corrosion and oxidation of the metal workpiece.

[0058] In some of these embodiments, the mass content of benzotriazole in the polishing liquid is 0.05% - 1%. Exemplarily, the mass content of benzotriazole in the polishing liquid can be 0.05%, 0.1%, 0.2%, 0.5%, 0.8%, 1% or the range composed of any two of the foregoing values.

[0059] In some of these embodiments, the mass content of Guerbet acid in the polishing liquid is 0.1% - 3%. Exemplarily, the mass content of Guerbet acid in the polishing liquid can be 0.1%, 0.3%, 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0% or the range composed of any two of the foregoing values.

[0060] Controlling the mass contents of benzotriazole and Guerbet acid in the polishing liquid within the above ranges can not only effectively play the role of alleviating corrosion, but also avoid the problem of poor polishing efficiency caused by excessive dosage.

[0061] In some embodiments of the present application, the polishing liquid further includes a surfactant, and the surfactant includes an alkoxy quaternary ammonium compound. The addition of the alkoxy quaternary ammonium compound can dissolve and emulsify components such as lubricants and corrosion inhibitors to achieve a better polishing effect. In addition, it can also make the stains generated after polishing easier to clean.

[0062] Further, the mass content of the alkoxy quaternary ammonium compound in the polishing liquid is 1% - 12%. When the dosage of the alkoxy quaternary ammonium compound is excessive, the charge or steric hindrance on the surface of the abrasive will increase excessively, resulting in too large repulsive force between the abrasives and reducing the polishing efficiency. Exemplarily, the mass content of the alkoxy quaternary ammonium compound in the polishing liquid can be 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12% or the range composed of any two of the foregoing values.

[0063] In some embodiments of the present application, by mass percentage, the polishing liquid comprises 2% - 8% of abrasive, 1% - 8% of lubricant, 0.05% - 4% of corrosion inhibitor and 80% - 95.5% of solvent.

[0064] In some embodiments of the present application, by mass percentage, the polishing liquid comprises 2% - 8% of abrasive, 1% - 8% of lubricant, 0.1% - 3% of Guerbet acid, 0.05% - 1% of benzotriazole and 80% - 95.5% of solvent.

[0065] In some embodiments of the present application, by mass percentage, the polishing liquid comprises 2% - 8% of silica sol, 1% - 8% of water-soluble organic molybdenum, 0.1% - 3% of Guerbet acid, 0.05% - 1% of benzotriazole and 80% - 95.5% of water.

[0066] Factors such as the density, pH, viscosity and surface tension of the polishing liquid are key factors affecting the polishing effect of the polishing liquid.

[0067] When the density is relatively low, the fluidity of the polishing liquid is good, it is difficult to form a stable liquid film on the surface of the metal workpiece, and it is also difficult to provide sufficient buoyancy for the abrasive, resulting in uneven distribution of the abrasive in the polishing liquid. However, too large density will lead to uniform spreading of the polishing liquid on the surface of the metal workpiece, affecting the uniformity of polishing. Based on the above considerations, the density of the polishing liquid of the present application is controlled within the range of 1.01 g / cm 3 - 1.03 g / cm 3 , which is beneficial to obtaining a uniformly polished surface.

[0068] Under acidic conditions, metal oxidation can be promoted, which is suitable for rough polishing; under alkaline conditions, chemical etching of non-metallic materials can be enhanced, which is suitable for fine polishing. Based on the above considerations, controlling the pH of the polishing liquid of the present application within the range of 8 - 8.3 is beneficial to obtaining relatively excellent fine polishing effect.

[0069] At low viscosity, the fluidity of the polishing liquid is good, which is suitable for rapid material removal. At high viscosity, the suspension of the polishing liquid is strong, which can reduce abrasive settlement and is suitable for precision polishing. Based on the above considerations, controlling the viscosity of the polishing liquid of the present application within the range of 99 mPa - 160 mPa is beneficial to achieving a good balance between polishing efficiency and precision polishing efficiency.

[0070] A lower surface tension enables the polishing fluid to spread and wet the surface of the metal workpiece, fully enter the tiny depressions, gaps, and pores on the workpiece surface, make full contact with the material to be polished, make the polishing process more uniform, help improve the integrity and consistency of polishing, reduce polishing blind spots, and thus obtain better surface flatness and finish. When the surface tension is high, the polishing fluid is difficult to spread on the surface of the metal workpiece, forms water droplets, cannot completely cover the surface of the metal workpiece, and uneven polishing occurs, affecting the overall polishing quality. Based on the above considerations, controlling the surface tension of the polishing fluid in this application to be <40 N / m is beneficial to obtaining good surface flatness and finish and achieving a precise polishing effect. Especially in the range of 28 N / m - 33 N / m, the technical effects of this application can be better achieved.

[0071] This application can achieve the regulation of the density, pH, viscosity, and surface tension of the polishing fluid by regulating the contents of components such as abrasives, lubricants, corrosion inhibitors, surfactants, and water, and keep them within a reasonable range.

[0072] In some embodiments of this application, the water in the polishing fluid is selected from pure water without ion interference (such as pure water with a resistivity of 16 mΩ·cm - 17 mΩ·cm), which can effectively avoid the deposition of metal ions or other impurities in the water on the surface of the metal workpiece during the polishing process.

[0073] The second aspect of the embodiments of this application provides a preparation method for the polishing fluid described in the first aspect, including the following steps:

[0074] Prepare the polishing fluid described in the first aspect by using abrasives, lubricants, corrosion inhibitors, and solvents.

[0075] This application does not particularly limit the mixing method of each component. Specifically, high-speed stirring, ultrasonic treatment, or microfluidization technology can be used to uniformly disperse each component, avoid agglomeration or sedimentation, and thus keep the prepared polishing fluid in good stability.

[0076] Using the preparation method of the polishing fluid provided in the second aspect of the embodiments of this application, the polishing fluid provided in the first aspect of the embodiments of this application can be prepared. This method is simple and convenient, and the prepared polishing fluid can achieve excellent precision polishing effects.

[0077] Mix the lubricant and the surfactant, stir evenly to make solution A;

[0078] Add the corrosion inhibitor to solution A, stir evenly to make solution B;

[0079] Add solution B to pure water, stir evenly to make solution C;

[0080] Add the abrasive to solution C, stir evenly to prepare the polishing fluid.

[0081] In some of these embodiments, the method for preparing the polishing liquid comprises the following steps:

[0082] S10. Mix a lubricant and a surfactant, and stir evenly to form a first mixture;

[0083] S20. Add a corrosion inhibitor to the first mixture, and stir evenly to form a second mixture;

[0084] S30. Add the second mixture to a solvent, and stir evenly to form a third mixture;

[0085] S40. Add an abrasive to the third mixture, and stir evenly to obtain the polishing liquid.

[0086] In step S10, first mix the surfactant, the lubricant, and the corrosion inhibitor so that the lubricant and the corrosion inhibitor can be better dissolved and emulsified.

[0087] In step S40, finally add the abrasive, which can avoid the occurrence of abrasive agglomeration.

[0088] The third aspect of the embodiments of the present application provides an application of a polishing liquid in surface treatment, wherein the polishing liquid is the polishing liquid provided in the first aspect of the embodiments of the present application or the polishing liquid prepared by the preparation method provided in the second aspect of the embodiments of the present application.

[0089] The embodiments of the present application do not make special limitations on the types of metals. It shows good fine polishing effects on metals such as aluminum and aluminum alloys, copper and copper alloys, stainless steel, and carbon steel. Especially, it shows more excellent performance in the fine polishing of aluminum alloys, making the polished surface present a black and bright mirror surface while also achieving a surface roughness below the hundred-nanometer level, or even within the 10nm level.

[0090] In some of these embodiments, the above polishing liquid can be used to perform chemical mechanical polishing on aluminum alloys at 1000 revolutions per minute - 2000 revolutions per minute and a pressure of 0.5 kg / cm 2 - 3 kg / cm 2 for 2 min - 3 min, and it can achieve a good fine polishing effect at a relatively high polishing efficiency.

[0091] The following describes the embodiments of the present application. The embodiments described below are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. For technologies or conditions not specified in the embodiments, they are carried out according to the technologies or conditions described in the literature in the art or according to the product specifications. For reagents or instruments not specified for the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0092] Examples 1 - 9

[0093] Examples 1 to 9 provide a polishing liquid, and the preparation method is as follows:

[0094] Mix the lubricant and the surfactant, stir evenly to form a first mixture;

[0095] Add the corrosion inhibitor to the first mixture, stir evenly to form a second mixture;

[0096] Add the second mixture to the solvent, stir evenly to form a third mixture;

[0097] Add the abrasive to the third mixture, stir evenly to prepare the polishing liquid.

[0098] Based on the total mass of each component in the polishing liquid being 100 kg, the contents of each component in Examples 1 to 9 are shown in Table 1.

[0099] Table 1: Composition and content of the polishing liquid (kg)

[0100]

[0101] Example 10

[0102] This example provides a polishing liquid, and its preparation method is basically the same as that of Example 1, except that ISOCARB 14 Gerbert acid is replaced with ISOCARB 12.

[0103] Comparative Example 1

[0104] This comparative example provides a polishing liquid, and its preparation method is basically the same as that of Example 1, except that 3 kg of LUDOX® silica sol TM50 is added to 97 kg of pure water and stirred evenly to obtain the polishing liquid.

[0105] Comparative Example 2

[0106] This comparative example provides a polishing liquid, and its preparation method is basically the same as that of Example 1, except that water-soluble organic molybdenum GM4022 is replaced with triethanolamine borate.

[0107] Comparative Example 3

[0108] This comparative example provides a polishing liquid, and its preparation method is basically the same as that of Example 1, except that benzotriazole is not added to the corrosion inhibitor, and the mass is made up with an equal amount of ISOCARB 14 Gerbert acid.

[0109] Comparative Example 4

[0110] This comparative example provides a polishing liquid, whose preparation method is basically the same as that of Example 1. The difference lies in that ISOCARB 14 Guerbet acid is not added to the corrosion inhibitor, and an equal amount of benzotriazole is used to make up the mass.

[0111] Test Example 1. Performance Testing of the Polishing Liquid

[0112] The polishing liquids prepared in the above examples and comparative examples were subjected to performance testing. The specific test indicators and methods are as follows:

[0113] (1) Density: Measure the density of the polishing liquid at an ambient temperature of 25°C.

[0114] (2) Viscosity: Measure the viscosity of the polishing liquid at 25°C according to the ASTM D445 standard test method (using a capillary viscometer with an inner diameter of 0.4 - 0.6 mm).

[0115] (3) pH value: Measure the pH value of the polishing liquid at 25°C using the potentiometric method (pH meter method).

[0116] (4) Surface tension: Measure the surface tension of the polishing liquid at 25°C according to GB / T 27842 - 2011 (rapid bubble method).

[0117] (5) Polishing effect: Use the polishing liquid to polish aluminum alloy at 2000 revolutions per minute and a pressure of 2 kg / cm 2 for 2 minutes, observe the state of the polished surface and measure the surface roughness Ra value of the polished surface.

[0118] The results measured by the above test methods are listed in Table 2.

[0119] Table 2: Performance Test Results of the Polishing Liquid

[0120]

[0121] As can be seen from the results in Table 2, when the polishing liquid prepared in this application is used for polishing the surface of the workpiece, it will not cause blueish abrasion marks on the surface of the workpiece, and the surface roughness reaches a bright black to mirror gloss effect. The surface roughness Ra of the polished workpiece is ≤50 nm, and can even reach Ra ≤10 nm. However, the polishing liquids prepared in Comparative Examples 1-4 cannot achieve the technical effects of this application. Among them, Comparative Example 1 shows that a polishing liquid simply prepared by mixing abrasives with water cannot obtain a bright or mirror surface effect; the triethanolamine borate used in Comparative Example 2 has a relatively high surface tension (43 N / m - 50 N / m), and the surface tension of the prepared polishing liquid > 40 N / m, resulting in insufficient leveling at local positions, especially at the R corner positions. During the polishing process, the locally unleveled positions cause mechanical wear first. At the worn positions, the Cu element is corroded, and Cu(OH)2 adheres to the surface of the mottled marks, presenting blueish mottled marks. At the same time, when ethanolamine borate replaces water-soluble organic molybdenum, the heat resistance stability significantly decreases, resulting in the failure of the lubrication performance during the polishing process and the generation of a large area of blueish abrasion marks.

[0122] The polished surface of the polishing agent prepared in Comparative Example 3 is a uniform light blue mirror surface, indicating that the Cu component in the alloy is uniformly corroded, which belongs to homogeneous corrosion; therefore, the polished surface presents a light blue mirror surface. In Comparative Example 4, due to the absence of Guerbet acid, after the active metals Al / Zn / Mg in the alloy are eroded by dissolved oxygen during the polishing process, the original black mirror surface becomes a grayish mirror surface. It can be seen that the compounding of Guerbet acid and benzotriazole has a good synergistic effect, which can ensure that the workpiece does not turn blue and improve the black and bright mirror gloss effect of the polished surface at the same time.

[0123] The descriptions of the above embodiments tend to emphasize the differences between the embodiments. Their similarities or similarities can be referred to each other. For the sake of brevity, they will not be elaborated herein.

[0124] It should be noted that this application is not limited to the above embodiments. The above embodiments are only examples, and embodiments with the same structure and the same effect as the technical idea within the technical solution scope of this application are all included in the technical scope of this application. In addition, within the scope of not departing from the gist of this application, various deformations that can be thought of by those skilled in the art are applied to the embodiments, and other ways constructed by combining some constituent elements in the embodiments are also included in the scope of this application.

Claims

1. A polishing liquid, characterized in that, It includes abrasives, lubricants, corrosion inhibitors and solvents; The abrasive includes silica materials; The lubricant includes water-soluble organic molybdenum; The corrosion inhibitor includes Guerbet acid and benzotriazole.

2. The polishing liquid according to claim 1, wherein The silica material includes silica sol; Optionally, the particle size of the silica sol is 20nm - 25nm.

3. The polishing liquid according to claim 1, wherein The mass content of the abrasive in the polishing liquid is 2% - 8%.

4. The polishing liquid according to claim 1, wherein The mass content of the lubricant in the polishing liquid is 1% - 8%.

5. The polishing liquid according to claim 1, characterized in that, The mass content of the corrosion inhibitor in the polishing liquid is 0.05% - 4%; And / or, the mass ratio of Guerbet acid to benzotriazole in the corrosion inhibitor is (0.1 - 3):(0.05% - 1).

6. The polishing liquid according to claim 1 or 2, characterized in that, The polishing liquid further includes a surfactant; Optionally, the surfactant includes alkoxy quaternary ammonium compounds; Optionally, the mass content of the surfactant in the polishing liquid is 1% - 12%.

7. The polishing liquid according to claim 1, wherein The polishing liquid satisfies at least one of the following conditions: (1) The density of the polishing liquid is 1.01 g / cm 3 -1.03 g / cm 3 ; (2) The pH value of the polishing liquid is 8 - 8.3; (3) The viscosity of the polishing liquid is 99mpa - 160mpa; (4) The surface tension of the polishing liquid < 40N / m.

8. A method for preparing a polishing liquid according to any one of claims 1 to 7, characterized in that, It includes the following steps: Prepare the polishing liquid from abrasives, lubricants, corrosion inhibitors and solvents.

9. Application of the polishing liquid in surface treatment, characterized in that, The polishing liquid is the polishing liquid described in any one of claims 1 to 7 or the polishing liquid prepared by the preparation method of claim 8.

10. The application according to claim 9, characterized in that, The material of the surface is aluminum alloy.

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