Circuit board test system

Abstract

The invention provides a circuit board test system, and relates to the technical field of circuit board testing, the circuit board test system comprises a test cabinet, two sides in the test cabinet are provided with circuit board storage assemblies, an installation disc is arranged above the test cabinet, the installation disc is connected with the test cabinet through a transmission assembly, the installation disc is provided with a first installation cavity, and the first installation cavity is provided with a second installation cavity. Four groups of first mounting cavities are uniformly arranged, a top plate is mounted above the test cabinet through a connecting seat, a heating assembly is mounted on the inner side of the connecting seat, an assembly disc is mounted below the top plate, and three groups of second mounting cavities are uniformly arranged on the assembly disc; a circuit test assembly, a high-temperature test assembly and a bending resistance test assembly are sequentially mounted in the three groups of second mounting cavities; by designing three groups of parallel test items, a plurality of test links can be simultaneously carried out, and by adopting a rotary design, each group of circuit boards can sequentially enter each test area. Therefore, the testing process of the circuit board is automated, and the testing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board testing, and particularly to a printed circuit board testing system. Background Art

[0002] A printed circuit board is an essential component in electronic products. Its main function is to connect electronic components through conductive paths (such as copper wires) to form a complete circuit. Printed circuit boards are widely used in various electronic devices, such as computers, smartphones, household appliances, automotive electronic devices, etc. With the miniaturization, intelligence, and continuous expansion of functions of electronic devices, the design and production of printed circuit boards face increasingly high technical requirements.

[0003] A printed circuit board not only needs to have good electrical performance but also needs to meet certain mechanical strength, thermal stability, and anti-interference capabilities. Therefore, the quality of a printed circuit board directly affects the performance and stability of electronic devices. To ensure that a printed circuit board can work stably for a long time in actual applications, strict quality inspection and performance testing must be carried out.

[0004] However, in existing testing systems, usually each printed circuit board needs to go through multiple processes, and each process is often carried out serially. This serial testing results in each printed circuit board needing to go through multiple testing steps, with a long testing time and low efficiency. At the same time, most printed circuit board testing relies on manual operation. Especially in the visual inspection and some electrical testing links, operators need to manually set testing parameters and judge testing results. This manual intervention increases the possibility of human errors and affects the accuracy and consistency of testing. Therefore, the present invention proposes a printed circuit board testing system to solve the problems existing in the prior art. Summary of the Invention

[0005] Aiming at the above problems, the purpose of the present invention is to propose a printed circuit board testing system, which has the advantage of improving the testing efficiency of printed circuit boards and can solve the problems existing in the prior art.

[0006] To achieve the object of the present invention, the present invention is realized by the following technical solutions: A circuit board testing system includes a testing cabinet. On both sides inside the testing cabinet, circuit board storage components are installed. Above the testing cabinet, there is an installation disk, and the installation disk is connected to the testing cabinet through a transmission component. There is a first installation cavity on the installation disk, and four groups of first installation cavities are evenly arranged. Inside the first installation cavity, a circuit board placement component is installed. Above the testing cabinet, a top plate is installed through a connecting seat, and the inner side of the connecting seat is arc-shaped. Inside the connecting seat, a heating component is installed, and the position of the heating component corresponds to the position of one group of first installation cavities. Below the top plate, an assembly disk is installed. There is a second installation cavity on the assembly disk, and three groups of second installation cavities are evenly arranged. In the three second installation cavities, a circuit testing component, a high-temperature testing component, and a bending resistance testing component are installed in sequence. On both sides of the connecting seat, a touch display and a testing controller are respectively installed.

[0007] A further improvement lies in that: both the circuit testing component and the high-temperature testing component include a first electric push rod. The first electric push rod is fixedly connected to the assembly disk through a bracket, and the output end of the first electric push rod is installed with a first mounting plate. A circuit board test board is installed on the first mounting plate, and several groups of test probes are arranged on the circuit board test board.

[0008] A further improvement lies in that: the heating component includes an electric heating tube. There is an installation groove on the connecting seat. The electric heating tube is located in the installation groove, and several groups of electric heating tubes are provided. A blower is installed on the outer side of the connecting seat. A blowing port is installed on the inner side of the installation groove, and the output end of the blowing port faces the electric heating tube. The blowing port is connected to the output end of the blower through a pipeline.

[0009] A further improvement lies in that: the bending resistance testing component includes a second electric push rod. The second electric push rod is fixedly connected to the assembly disk through a bracket. The output end of the second electric push rod is installed with a second mounting plate. An extrusion head seat is installed on the second mounting plate. An extrusion head is installed on the extrusion head seat. A rubber layer is installed on the extrusion head. A pressure sensor is provided between the rubber layer and the extrusion head.

[0010] A further improvement lies in that: the circuit board storage component includes an outer frame. The outer side of the outer frame is connected to the testing cabinet through a load-bearing guide rail. Inside the outer frame, several groups of partitions are installed, and a placement rack is installed on the partitions.

[0011] A further improvement lies in that: both ends of the placement rack are provided with first handles. A baffle is installed on the placement rack, and several groups of baffles are evenly arranged. Silicone blocks are installed on both sides of the baffle, and several groups of silicone blocks are provided.

[0012] A further improvement lies in that: the circuit board placement component includes a placement bottom plate, the lower end of the placement bottom plate is connected to the mounting disk through a spring telescopic member, and several groups of spring telescopic members are provided. A fixing plate is installed on the placement bottom plate through bolts, and a circuit board card slot is provided on the fixing plate.

[0013] A further improvement lies in that: on both sides of the first installation cavity, limiting grooves are provided on the mounting disk. A sliding rod is installed inside the limiting groove, a load-bearing ring is installed on the sliding rod, both ends of the placement bottom plate extend into the limiting grooves at corresponding positions, and the sliding rod passes through the placement bottom plate.

[0014] A further improvement lies in that: the transmission component includes a load-bearing shaft, the load-bearing shaft is connected to the test cabinet through a shaft seat, the upper end of the load-bearing shaft passes through the test cabinet and is fixedly connected to the mounting disk, the load-bearing shaft is driven by a servo motor, and an annular slide rail is installed on the test cabinet. The mounting disk is connected to the annular slide rail through an arc-shaped slider.

[0015] A further improvement lies in that: laser induction points are installed on the mounting disk, several groups of laser induction points are evenly provided, laser sensors adapted to the laser induction points are installed on the assembly disk, and several groups of laser sensors are provided.

[0016] A further improvement lies in that: an infrared camera is installed inside the second installation cavity, and the imaging end of the infrared camera faces the first installation cavity.

[0017] The beneficial effects of the present invention are as follows: (1) By designing three groups of parallel test items, the present invention can simultaneously perform multiple test links (circuit test, high-temperature test, bending test), improve the test efficiency, and reduce the overall test time. The parallel test enables different circuit boards to enter different test areas simultaneously, avoiding the time waste of linear operation in the traditional test process and significantly enhancing the production capacity. At the same time, during the test process, the links of manual intervention are reduced, and the situation of human errors is avoided as much as possible.

[0018] (2) The present invention adopts a rotary design, enabling each group of circuit boards to enter each test area in sequence. Thereby, the test process of the circuit board is automated, the test efficiency is improved, and the errors that may occur during the operation are avoided. Subsequently, through the precise test of each circuit board, it can be ensured that the product meets the standard requirements in various performance tests.

[0019] (3) During the test process, the present invention has high flexibility. For example, when the current circuit board is unqualified, the subsequent test items do not need to be carried out. This flexibility avoids redundant tests on unqualified circuit boards, saves time and resources, and brings higher automation, intelligence, and efficiency improvement to the circuit board production line. Brief Description of the Drawings

[0020] Figure 1 is a front view structural schematic diagram of the present invention.

[0021] Figure 2 is a top view structural schematic diagram of the distribution of the first installation cavity of the present invention.

[0022] Figure 3 is a front view schematic diagram of the present invention.

[0023] Figure 4 is a bottom view schematic diagram of the distribution of the second installation cavity of the present invention.

[0024] Figure 5 is a front view structural schematic diagram of the assembly disk of the present invention.

[0025] Figure 6 is a side view schematic diagram of the outer frame of the present invention.

[0026] Figure 7 is a front view structural schematic diagram of the connection state between the placement bottom plate and the sliding rod of the present invention.

[0027] Figure 8 is a three-dimensional schematic diagram of the connection between the connection seat and the top plate of the present invention.

[0028] Wherein: 1. Test cabinet; 2. Installation disk; 3. First installation cavity; 4. Connection seat; 5. Top plate; 6. Assembly disk; 7. Second installation cavity; 8. Touch display; 9. Test controller; 10. First electric push rod; 11. First installation plate; 12. Circuit board test board; 13. Test probe; 14. Electric heating tube; 15. Installation groove; 16. Fan; 17. Air outlet; 18. Second electric push rod; 19. Second installation plate; 20. Extrusion head seat; 21. Extrusion head; 22. Rubber layer; 23. Outer frame; 24. Load-bearing guide rail; 25. Partition board; 26. Placement rack; 27. Baffle; 28. Silicone block; 29. Placement bottom plate; 30. Spring telescopic member; 31. Fixed plate; 32. Circuit board card slot; 33. Sliding rod; 34. Load-bearing ring; 35. Load-bearing shaft; 36. Shaft seat; 37. Annular slide rail; 38. Laser induction point; 39. Laser sensor; 40. Infrared camera; 41. Cable conduction groove. Detailed Description of the Invention

[0029] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with embodiments. These embodiments are only used to explain the present invention and do not limit the protection scope of the present invention.

[0030] Most traditional circuit board testing methods still use serial testing, that is, each test link needs to be completed one by one. This method leads to a long test cycle, especially in the case of large-scale production. Testing each circuit board one by one not only increases the overall test time, but may also cause inefficiency due to insufficient equipment utilization. If a circuit board fails the circuit test, the existing test link may not be stopped, which means that even if some circuit boards have been determined to be unqualified, subsequent test links still need to be executed, wasting a lot of time and testing resources.

[0031] At the same time, existing circuit board test equipment relies on a lot of manual intervention, especially when operators are required to adjust test parameters, observe test results, and judge test data. The test system relies on the operator's decision-making, which may lead to misoperation, misjudgment, or omission of some subtle faults due to human error, thus affecting the accuracy and consistency of the overall test.

[0032] Therefore, according to Figures 1 - 8 As shown, this embodiment provides a circuit board test system, including a test cabinet 1, both sides (left and right sides) of the test cabinet 1 are equipped with circuit board storage components, the circuit board storage components include an outer frame 23, and a second handle is installed on the outer side of the outer frame 23, such as Figure 1 As shown, the outer side of the outer frame 23 is connected to the test cabinet 1 through the load-bearing guide rail 24. The outer frame 23 can move forward and backward under the action of the load-bearing guide rail 24, thereby realizing the function of extracting and retracting the outer frame 23. The purpose of this design is to facilitate the staff to take the circuit board to be tested, and during the test process, the circuit board can be efficiently stored and retrieved in place to reduce the interference of human operation. It should be noted that the movement mode of the outer frame 23 is sliding. The precisely designed load-bearing guide rail 24 and its matching roller ensure the smooth movement of the outer frame 23 to avoid operational difficulties caused by friction or jamming. During operation, the outer frames 23 on the left and right sides are used to store the circuit boards to be tested and the circuit boards that have been tested, respectively, so that the staff can easily organize and classify the circuit boards during the test process. This design ensures efficient management of the circuit boards during the test process, and can avoid confusion between the circuit boards to be tested and the ones that have been tested, thereby improving work efficiency. Accordingly, a partition 25 is installed on the inner side of the outer frame 23, and the partition 25 is provided in several groups. In this embodiment, two groups of partitions 25 are installed on the inner side of each group of outer frames 23, and the partitions 25 are arranged horizontally to form a multi-layer storage structure (three layers in this embodiment), providing more space for storing circuit boards. The height and width of each layer can be customized according to the actual size of the circuit board to ensure that the circuit board is not squeezed and stably placed during storage.

[0033] A placement rack 26 is installed on the partition plate 25, and the circuit board is placed through the provided placement rack 26. Further, first handles are provided at both ends of the placement rack 26, facilitating the staff to pull and place the placement rack 26. A baffle 27 is installed on the placement rack 26, and several groups of baffles 27 are evenly provided. The baffle 27 is vertically arranged, and silica gel blocks 28 are installed on both sides of the baffle 27, and several groups of silica gel blocks 28 are provided. When placing the circuit board, it only needs to be snapped into the space between two groups of baffles 27. The silica gel blocks 28 can provide a flexible limiting effect. When placing the circuit board, the circuit board only needs to be snapped into the space between two groups of baffles 27 to be fixed in the appropriate position. The silica gel blocks 28 have earthquake resistance and buffering properties, and can effectively protect the surface of the circuit board from being scratched or damaged.

[0034] An installation disk 2 is provided above the test cabinet 1. The installation disk 2 is connected to the test cabinet 1 through a transmission assembly. The transmission assembly includes a load-bearing shaft 35, and the lower end of the load-bearing shaft 35 is connected to the test cabinet 1 through a shaft seat 36. The inner side of the shaft seat 36 is connected to the load-bearing shaft 35 through a bearing, allowing the load-bearing shaft 35 to freely rotate within the bearing. The upper end of the load-bearing shaft 35 passes through the test cabinet 1 (the connection between the load-bearing shaft 35 and the test cabinet 1 through a bearing), and is fixedly connected to the installation disk 2, thereby ensuring that the installation disk 2 can rotate with the rotation of the load-bearing shaft 35. The load-bearing shaft 35 is driven by a servo motor. Specifically, the servo motor is fixedly connected to the test cabinet 1 through a bracket (the servo motor is located inside the test cabinet 1), and the output end of the servo motor drives the load-bearing shaft 35 to rotate through a gear. Correspondingly, gears are installed on both the servo motor and the load-bearing shaft 35. A circular slide rail 37 is installed on the test cabinet 1, and the installation disk 2 is connected to the circular slide rail 37 through an arc-shaped slider, ensuring that the installation disk 2 can rotate stably along a circular trajectory during rotation. The circular design of the circular slide rail 37 can prevent the installation disk 2 from shifting, ensuring its precise positioning and stable operation.

[0035] It should be noted that in this embodiment, the servo motor has precise rotational speed control and positioning accuracy to ensure that the installation disk 2 can rotate according to the predetermined steps and accuracy. At the same time, the rated power of the servo motor matches the load demand of the load-bearing shaft 35.

[0036] The installation disk 2 is provided with a first installation cavity 3, and four groups of first installation cavities 3 are evenly provided. The outer ends of the first installation cavities 3 are communicated with the outside. Through the design of four installation cavities and gradually entering different test areas, the system can execute multiple test tasks (circuit test, high-temperature test, bending test) to ensure that the circuit board undergoes a comprehensive inspection.

[0037] Inside the first installation cavity 3, a circuit board placement assembly is installed. The circuit board placement assembly includes a placement bottom plate 29. The lower end of the placement bottom plate 29 is connected to the installation disk 2 through a spring telescopic member 30, and several groups of spring telescopic members 30 are provided. On the placement bottom plate 29, a fixing plate 31 is installed through bolts, and a circuit board card slot 32 is provided on the fixing plate 31. Further, several groups of threaded holes are distributed on the placement bottom plate 29. In this embodiment, through the slot design, the staff can accurately fix the circuit board to be tested on the placement bottom plate. The fixing plate 31 adopts a detachable design, which enables the system to adapt to circuit boards of different sizes and shapes. Before the circuit board test, the staff can pre-design and install a suitable fixing plate 31 according to the size of the test circuit board. This design not only improves the adaptability of the system, but also simplifies the loading and unloading process of the circuit board, improving the convenience and efficiency of the test.

[0038] Further, on both sides of the first installation cavity 3, limit slots are provided on the installation disk 2. Inside the limit slots, slide rods 33 are installed. A load-bearing ring 34 is fixedly installed on the slide rods 33. Both ends of the placement bottom plate 29 extend into the limit slots at corresponding positions. The slide rods 33 pass through the placement bottom plate 29. The function of the load-bearing ring 34 is to limit the position of the placement bottom plate 29. During the test process of the circuit board, a downward pressure design is adopted. When pressure is applied, the elastic effect of the spring telescopic member 30 will cause the placement bottom plate 29 to produce a certain vertical movement. After reaching the predetermined downward pressure position, the load-bearing ring 34 positions and limits the placement bottom plate 29 to ensure that it is always in a stable downward pressure state during the test. The function of the load-bearing ring 34 is to limit the further movement of the bottom plate 29 and ensure that the circuit board maintains an appropriate contact pressure with the test probe 13 during the test.

[0039] Above the test cabinet 1, a top plate 5 is installed through a connecting seat 4. The inner side of the connecting seat 4 is arc-shaped, specifically as shown in Figure 8 shown, and again as shown in Figure 2 shown. Inside the connecting seat 4, a heating component is installed. The position of the heating component corresponds to the position of a group of first installation cavities 3. Its function is to provide a high-temperature environment for the test and simulate the working state of the circuit board under high-temperature conditions.

[0040] The heating component includes an electric heating tube 14. An installation groove 15 is provided on the connection base 4. The electric heating tube 14 is located within the installation groove 15, and there are several groups of electric heating tubes 14 to ensure sufficient heat distribution and stability. To improve the heating effect, a blower 16 is installed on the outer side of the connection base 4. The function of the blower 16 is to blow the air heated by the electric heating tube 14 towards the mounting plate 2. A blowing port 17 is also installed on the inner side of the installation groove 15. The output end of the blowing port 17 faces the electric heating tube 14 to ensure that the hot air can be evenly blown onto the surface of the circuit board, thereby simulating a high-temperature environment. Further, when the position of the first installation cavity 3 corresponds to it, the performance of the circuit board at high temperature is detected. At this time, the electric heating tube 14 and the blower 16 are started. The start of the blower 16 will promote the air flow, heat the air and transport it into the first installation cavity 3 at the corresponding position through the blowing port 17, thereby realizing the simulation of a high-temperature environment.

[0041] It should be noted that the electric heating tube 14 has a temperature controller, which is electrically connected to the test controller 9. The staff can precisely control the heating efficiency of the electric heating tube 14 through the test controller 9. Through the temperature controller, the staff can set the required heating temperature and adjust the temperature in real time through the test controller 9 to ensure that the heating tube can work stably during the high-temperature test. The cooperation between the temperature controller and the electric heating tube 14 makes the heating process more flexible, and the temperature can be adjusted according to different test requirements to avoid test errors caused by overheating or insufficient temperature. Further, a temperature sensor is also provided in the first installation cavity 3, which is electrically connected to the test controller 9. The function of the temperature sensor is to monitor the temperature in the first installation cavity 3 in real time and transmit the data to the test controller 9.

[0042] An assembly plate 6 is installed below the top plate 5. A second installation cavity 7 is provided on the assembly plate 6, and there are three groups of the second installation cavities 7 evenly. A circuit test component, a high-temperature test component, and a bending test component are installed in the three second installation cavities 7 in sequence. In this embodiment, the test steps for the circuit board are as follows: Step 1: The staff places the circuit board to be tested in the current first first installation cavity 3, and then rotates the mounting plate 2 to move the circuit board to the test area. The rotation of the mounting plate 2 moves the circuit board to the second first installation cavity 3 (relative to the first first installation cavity where it was first placed). This step ensures that each circuit board can enter different test links in sequence through automatic rotation; Step 2: At this time, the circuit board to be tested in the first installation cavity enters the circuit test component, and the circuit test component and the test controller 9 work together to conduct a preliminary circuit test. The test content includes detecting whether there are short circuits, open circuits, or other electrical faults on the circuit board. The circuit test component uses precise test probes and sensors to conduct a comprehensive detection through contact with the circuit board; Step 3: When the circuit board passes the circuit test and no unqualified items are found, it will continue to enter the subsequent high-temperature test and bending test procedures. These test procedures can be carried out sequentially, but during the test process, at most three groups of circuit boards can be tested simultaneously. Under parallel testing, the test efficiency is improved. Specifically, the high-temperature test simulates the working state of the circuit board in a high-temperature environment and checks the stability and performance of the circuit board under temperature changes. The bending test checks the bending strength of the circuit board when subjected to external forces by applying pressure.

[0043] It should be noted that during the test process, when the circuit board fails a test in a certain test procedure, there is no need to conduct subsequent tests. For example, if a short circuit or open circuit is detected during the circuit test, the system will automatically stop the subsequent high-temperature test and bending test of the circuit board. The unqualified circuit boards are stored by the staff using the storage rack 26. The setting of multiple groups of storage racks 26 facilitates the classified storage of circuit boards.

[0044] By designing three groups of parallel tests, multiple tests on different circuit boards can be carried out within the same time, improving the test efficiency, reducing the overall test time, and effectively utilizing system resources to avoid production delays caused by excessive time occupation in a single test procedure.

[0045] On both sides of the connection base 4, a touch display 8 and a test controller 9 are respectively installed. The touch display 8 and the test controller 9 are both connected to the connection base 4 through brackets. Correspondingly, the touch display 8 displays the key information during the test in real time, including the status of each test link, the test progress, temperature changes, pressure monitoring and other data. The operator can directly view and monitor the test status of the circuit board through the touch screen. The test controller 9 is the main controller of this system, which has functions of intelligent scheduling, data processing, and circuit board detection. Specifically, intelligent scheduling means determining whether to start the next test link for the circuit board detection according to the real-time feedback data of each test link; data processing is responsible for collecting the data of each test link, including electrical data (such as voltage, current), temperature data (high-temperature test), pressure data (flexural test), etc., and processing them according to the preset detection program; circuit board detection means judging whether there are faults such as short circuits and open circuits in the circuit board through the received electrical data. In the high-temperature test, it can monitor the stability of the circuit board at different temperatures. That is, in this embodiment, the test controller 9 corresponds to a computer. Correspondingly, the touch display 8 and the test controller 9 cooperate closely, and use standard industrial communication protocols (such as Modbus, Ethernet, CAN bus, etc.) for data exchange and command transmission to ensure the accuracy and real-time update of information. The display provides real-time feedback, and the controller performs data processing and task scheduling. The information flow between the two ensures the real-time and accuracy during the test. The operator can input test commands (such as start, stop, set parameters, etc.) through the touch display 8, and schedule the equipment and adjust the test process through the test controller 9. The display not only provides the operation interface of the system, but also can reflect the test results in real time through the feedback system.

[0046] Both the circuit test component and the high-temperature test component include a first electric push rod 10. The first electric push rod 10 is fixedly connected to the assembly plate 6 through a bracket. And the output end of the first electric push rod 10 is installed with a first mounting plate 11. A circuit board test board 12 is installed on the first mounting plate 11. And a plurality of groups of test probes 13 are provided on the circuit board test board 12. The test probes 13 are used to contact the circuit board and perform electrical performance tests. The circuit board test board 12 integrates circuits connected to the test probes 13. Through these circuits, the probes 13 are electrically connected to the test controller 9 to ensure that the test data can be transmitted to the test controller 9 in real time. In this embodiment, the circuit board test board 12 is electrically connected to the test controller 9 through a cable to achieve real-time data transmission and control. After receiving the signal from the test board, the test controller 9 can analyze the electrical performance of the circuit board and make corresponding judgments.

[0047] In this embodiment, cable conduction grooves 41 are opened on the top plate 5 and the assembly plate 6 to facilitate the passage of cables.

[0048] It should be noted that the main function of the first electric push rod 10 is to precisely adjust the position of the circuit board test board 12 to ensure that the test probe 13 can accurately contact the electrical contact points of the circuit board. The stroke and force of the push rod need to be precisely controlled to ensure appropriate contact pressure and avoid damaging the circuit board. At the same time, through the control of the first electric push rod 10, the entire test process can be automatically completed. The operator only needs to place the circuit board and start the system without manual intervention, improving automation and efficiency. At the same time, the number and distribution of the test probes 13 are customized according to the contact points and test requirements of the circuit board to ensure that each test point can be accurately detected. For the testing of circuit boards with different shapes, it is used by replacing different circuit board test boards 12.

[0049] The bending resistance test assembly includes a second electric push rod 18. The second electric push rod 18 is fixedly connected to the assembly disk 6 through a bracket. The output end of the second electric push rod 18 is provided with a second mounting plate 19. A squeezing head seat 20 is mounted on the second mounting plate 19, and a squeezing head 21 is mounted on the squeezing head seat 20 for applying pressure and performing the bending resistance test. The design of the squeezing head 21 has good pressure distribution ability to ensure that the pressure is evenly applied to the circuit board during the test process. To protect the circuit board and ensure the uniformity of the applied pressure, a rubber layer 22 is mounted on the squeezing head 21. The rubber layer 22 not only provides flexible protection but also can evenly distribute the pressure during the test process to prevent damage to the circuit board caused by direct metal contact. More importantly, a pressure sensor is provided between the rubber layer 22 and the squeezing head 21, and this pressure sensor is used to monitor the applied pressure in real time and feedback it to the test controller 9.

[0050] It should be noted that in this embodiment, the function of the second electric push rod 18 is to precisely adjust the pressure applied to the circuit board. It is servo-controlled to precisely adjust the pressure within a set range, thereby simulating the external pressure encountered by the circuit board during actual use. During the test, it maintains the pressure for a certain period of time. After the test is completed, the staff needs to observe the circuit board to check whether there are any bends, deformations or other structural damages. At this time, the staff will evaluate the bending resistance of the circuit board through visual inspection or using relevant tools to determine whether it meets the design requirements.

[0051] The laser induction points 38 are installed on the mounting disc 2, and several groups of the laser induction points 38 are evenly arranged. The laser sensors 39 adapted to the laser induction points 38 are installed on the assembly disc 6, and several groups of the laser sensors 39 are provided. In this embodiment, four groups of the laser induction points 38 are evenly arranged, while three groups of the laser sensors 39 are evenly arranged for adapting to the corresponding first installation cavity 3 and the second installation cavity 7. The laser sensors 39 are electrically connected to the test controller 9 (the general controller can control all the electronic components in the system). The purpose is to position the rotation angle of the mounting disc 2. When the mounting disc 2 rotates, when the corresponding signal is sensed by the laser sensors 39, the mounting disc 2 stops rotating. At this time, the second installation cavity 7 is directly above the first installation cavity 3 at the corresponding position.

[0052] It should be noted that in this embodiment, a laser emitter is installed inside the laser induction point 38. This emitter usually uses a semiconductor laser or a diode laser, and the emitted laser beam propagates outward at a specific angle. These laser beams will gradually change direction as the mounting disc 2 rotates. When the mounting disc 2 rotates, the laser beams emitted by the laser induction points 38 will also rotate accordingly, and the direction and position of the laser beams change. When the mounting disc 2 rotates to a certain predetermined angle, the corresponding laser sensor 39 will sense the signal of the laser induction point 38 and transmit the signal to the test controller 9. At this time, the test controller 9 will automatically stop the rotation of the mounting disc 2 according to the received signal to ensure that the second installation cavity 7 is precisely directly above the first installation cavity 3, preparing for the corresponding test operation.

[0053] An infrared camera 40 is installed inside the second installation cavity 7, and the imaging end of the infrared camera 40 faces the first installation cavity 3. The infrared camera 40 can provide a real-time video image during the test, enabling the staff to directly view the state of the circuit board in each test link. For example, during the high-temperature test and the bending test, the staff can observe the performance of the circuit board in real time through the infrared camera 40 to ensure that there is no damage caused by excessive temperature or uneven external force application.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the framework and scope of application of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board testing system, comprising a test cabinet (1), characterized in that: On both sides inside the test cabinet (1), circuit board storage components are installed, and above the test cabinet (1), there is an installation plate (2). The installation plate (2) is connected to the test cabinet (1) through a transmission component. On the installation plate (2), there is a first installation cavity (3), and four groups of the first installation cavities (3) are evenly arranged. Inside the first installation cavity (3), a circuit board placement component is installed. Above the test cabinet (1), a top plate (5) is installed through a connecting seat (4), and the inner side of the connecting seat (4) is arc-shaped. Inside the connecting seat (4), a heating component is installed, and the position of the heating component corresponds to the position of one group of the first installation cavities (3). Below the top plate (5), an assembly plate (6) is installed. On the assembly plate (6), there is a second installation cavity (7), and three groups of the second installation cavities (7) are evenly arranged. Inside the three groups of the second installation cavities (7), a circuit test component, a high-temperature test component, and a bending test component are installed in sequence. On both sides of the connecting seat (4), a touch display (8) and a test controller (9) are respectively installed.

2. The circuit board testing system according to claim 1, wherein: Both the circuit test component and the high-temperature test component include a first electric push rod (10). The first electric push rod (10) is fixedly connected to the assembly plate (6) through a bracket, and the output end of the first electric push rod (10) is installed with a first mounting plate (11). On the first mounting plate (11), a circuit board test board (12) is installed, and on the circuit board test board (12), several groups of test probes (13) are provided.

3. A circuit board testing system according to claim 1, characterized in that: The heating component includes an electric heating tube (14). An installation groove (15) is provided on the connecting seat (4). The electric heating tube (14) is located in the installation groove (15), and several groups of the electric heating tubes (14) are provided. A blower (16) is installed on the outer side of the connecting seat (4). An air outlet (17) is installed inside the installation groove (15), and the output end of the air outlet (17) faces the electric heating tube (14). The air outlet (17) is connected to the output end of the blower (16) through a pipeline.

4. A circuit board testing system according to claim 1, characterized in that: The bending test component includes a second electric push rod (18). The second electric push rod (18) is fixedly connected to the assembly plate (6) through a bracket. The output end of the second electric push rod (18) is installed with a second mounting plate (19). On the second mounting plate (19), a squeezing head seat (20) is installed. On the squeezing head seat (20), a squeezing head (21) is installed. On the squeezing head (21), a rubber layer (22) is installed, and a pressure sensor is provided between the rubber layer (22) and the squeezing head (21).

5. A circuit board testing system according to claim 1, wherein: The circuit board storage component includes an outer frame (23). The outer side of the outer frame (23) is connected to the test cabinet (1) through a load-bearing guide rail (24). Inside the outer frame (23), partitions (25) are installed, and several groups of the partitions (25) are provided. On the partitions (25), placement racks (26) are installed.

6. A circuit board testing system according to claim 5, characterized in that: Both ends of the placement rack (26) are provided with first handles. A baffle (27) is installed on the placement rack (26), and several groups of baffles (27) are evenly arranged. Silicone blocks (28) are installed on both sides of the baffle (27), and several groups of silicone blocks (28) are provided.

7. A circuit board testing system according to claim 1, characterized in that: The circuit board placement assembly includes a placement bottom plate (29). The lower end of the placement bottom plate (29) is connected to the mounting disc (2) through a spring telescopic member (30), and several groups of spring telescopic members (30) are provided. A fixing plate (31) is installed on the placement bottom plate (29) by bolts, and a circuit board card slot (32) is provided on the fixing plate (31).

8. A circuit board testing system according to claim 7, characterized in that: Limit slots are provided on the mounting disc (2) on both sides of the first installation cavity (3). A sliding rod (33) is installed inside the limit slot. A load-bearing ring (34) is installed on the sliding rod (33). Both ends of the placement bottom plate (29) extend into the limit slots at corresponding positions, and the sliding rod (33) passes through the placement bottom plate (29).

9. A circuit board testing system according to claim 1, wherein: The transmission assembly includes a load-bearing shaft (35). The load-bearing shaft (35) is connected to the test cabinet (1) through a shaft seat (36). The upper end of the load-bearing shaft (35) passes through the test cabinet (1) and is fixedly connected to the mounting disc (2). The load-bearing shaft (35) is driven by a servo motor. A circular slide rail (37) is installed on the test cabinet (1), and the mounting disc (2) is connected to the circular slide rail (37) through an arc-shaped slider.

10. A circuit board testing system according to claim 1, characterized in that: Laser induction points (38) are installed on the mounting disc (2), and several groups of laser induction points (38) are evenly arranged. Laser sensors (39) adapted to the laser induction points (38) are installed on the assembly disc (6), and several groups of laser sensors (39) are provided.

11. A circuit board testing system according to claim 1, characterized in that: An infrared camera (40) is installed inside the second installation cavity (7), and the imaging end of the infrared camera (40) faces the first installation cavity (3).

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