Ultrathin rolled copper stamping fuse assembly and production process thereof

Abstract

The invention relates to an ultrathin rolled copper stamping fuse assembly and a production process thereof. The fuse assembly single body comprises a sheet-shaped copper substrate which is made of rolled copper and is micron-sized in thickness, and a first PI thermosetting film and a second PI thermosetting film which cover the upper surface and the lower surface of the sheet-shaped copper substrate respectively. The sheet-shaped copper substrate is provided with a wavy-line-shaped safety part, and the line width of the safety part is 0.15 + / -0.02 mm. According to the invention, the ultrathin rolled copper foil is punched by adopting a high-precision die punching mode, a fuse semi-finished product is directly formed, particularly, an extremely thin fuse part is punched and formed at one time, the defects of flanging deformation and the like caused by multiple times of punching are avoided, and the size and the performance of the fuse part are stable; and high-efficiency precise production is carried out through a high-speed rotating die cutting production process, so that the fuse part in the fuse is packaged in the film material, and the trepanning area and the end part area for electric connection are exposed, the production efficiency and the subsequent use efficiency are improved, the overall production efficiency can be improved to 5000 pcs / H, and the yield is improved to about 95%.

Description

Technical Field:

[0001] The present invention relates to the technical field of fuses and their production, and particularly to an ultra-thin rolled copper stamping fuse assembly and its production process. Background Art:

[0002] Traditional fuses mainly include surface mount fuses, plug-in fuses, tubular fuses, as well as RH square type, RP resistor type, RY metal shell self-recovery fuses, etc. The size rules of such fuses are all above several millimeters or dozens of millimeters. With the development of the electronic product industry, the precision requirements for spare parts products are getting higher and higher. In some high-precision products, specifications below millimeters are required, and traditional fuses are difficult to meet the requirements. For example, for batteries, integrated busbars, wire harness integrated components, etc. used in new energy vehicles, energy storage devices, etc., higher requirements and demands are put forward for fuse products. In the prior art, when producing fuses using copper substrates, laser cutting mode is selected, and the production efficiency of laser cutting is low and the qualified rate is low, only about 400 - 500 pcs / H, and the yield is about 80%. Therefore, it is necessary to develop fuse products with smaller and thinner volumes and supporting production processes. Summary of the Invention:

[0003] The purpose of the present invention is to overcome the above deficiencies of the prior art and provide an ultra-thin rolled copper stamping fuse assembly and its production process.

[0004] The technical solution adopted by the present invention is:

[0005] An ultra-thin rolled copper stamping fuse assembly, the single body of the fuse assembly includes a sheet-shaped copper substrate made of rolled copper with a thickness in the micron level, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet-shaped copper substrate; wherein, the sheet-shaped copper substrate is divided into three regions along the length direction, which are an opening region, a fuse region and an end region in sequence; a number of through holes are arranged at intervals in an array in the opening region; the fuse region includes a width-gradual connection part with two ends respectively connected to the diagonal corners of the opening region and the end region, and a bending part connecting the two connection parts, and a fuse part in a wavy line shape is provided in the middle of the bending part, the line width of the fuse part is 0.15 ± 0.02 mm and is smaller than the line width of the main body of the bending part; a number of small windows arranged at intervals are respectively opened on the first PI thermosetting film and the second PI thermosetting film, and each small window region includes the through holes in the same row in the width direction of the sheet-shaped copper substrate and the surrounding regions of the through holes; the outer end of the end region protrudes from the first PI thermosetting film and the second PI thermosetting film.

[0006] In the above fuse assembly, two curved hollow parts are respectively provided on the parts of the first PI thermosetting film and the second PI thermosetting film located in the fuse region, and are arranged along the outer edges of the connection part and the bending part of the fuse region.

[0007] In the above fuse component, the fuse part has at least two wave crests and two wave troughs; the length of the opening area accounts for 60% ± 5% of the total length of the sheet copper substrate; the length of the end area accounts for 10% ± 5% of the total length of the sheet copper substrate, and the remaining area is the fuse area; the aperture of the through hole is 0.50 ± 0.05 mm, the through hole array has 12 groups along the length direction of the sheet copper substrate, with 3 in each group, the spacing between adjacent through holes along the length direction of the sheet copper substrate is 2.00 ± 0.05 mm, and the spacing between adjacent through holes along the width direction of the sheet copper substrate is 1.50 ± 0.05 mm.

[0008] The present invention also provides a production process for an ultra-thin rolled copper stamping fuse component, which is carried out by a high-speed rotary die cutter. This production process includes the following steps:

[0009] Step 1: Punch and remove waste from the rolled copper strip with a thickness of micron level by a punching device, so as to form the connecting part, the bending part in the fuse area of the fuse monomer, the fuse part with a wavy shape in the middle of the bending part, and all the through holes in the opening area on the rolled copper strip, that is, to form a semi-finished copper substrate uniformly arranged along the length direction of the strip on the rolled copper strip, and after removing the waste, compound a first bottom protective film strip on the lower surface of the strip and then wind it up for standby;

[0010] Step 2: On the high-speed rotary die cutter, with the rolled copper strip and the first bottom protective film strip obtained in Step 1 as the main material strip running direction, perform the first die cutting on the main material strip by the first round knife die cutting roller group. The first die cutting cuts out the contour lines on both sides and at both ends of the sheet copper substrate around each semi-finished copper substrate on the rolled copper strip, and the contour lines on both sides of the sheet copper substrate intersect with the outer contour line of the fuse area formed in Step 1; at the same time, form a straight break line on the strip near the outer end side of the opening area, and then remove the waste of the copper foil strip outside the frame above the straight break line, and retain the rolled copper marking strip with positioning corner marks below the straight break line; form sheet copper substrate products arranged at intervals and with complete contour lines, and the rolled copper marking strip with positioning corner marks on the first bottom protective film strip;

[0011] Step 3: Align and compound the first PI thermosetting film strip after die-cutting above the main material strip. Specifically: Above the running main material strip, the self-adhesive film and thermosetting glue surface of the first PI thermosetting film strip face downwards. The first sticky protective film strip and the second bottom protective film strip are successively compounded on the non-thermosetting glue surface of the first PI thermosetting film strip. The sticky surface of the first sticky protective film strip is compounded with the non-thermosetting glue surface of the first PI thermosetting film strip. Then, the self-adhesive film of the first PI thermosetting film strip is removed from below the compounding roller. Next, the first PI thermosetting film strip and the first sticky protective film strip and the second bottom protective film strip thereon are subjected to a second die-cutting by the second circular knife die-cutting roller group. The knife roller of the second circular knife die-cutting roller group is located below, that is, the blade of the second circular knife die-cutting roller group just cuts through the first sticky protective film strip from the thermosetting glue surface of the first PI thermosetting film strip upwards, and a number of sets of first small window contour lines arranged at intervals are die-cut on the first PI thermosetting film strip and the first sticky protective film strip. At the same time, a continuous first PI thermosetting film upper contour line along the length direction of the strip is formed on the first PI thermosetting film strip. After the second die-cutting, the second bottom protective film strip and the waste of the first PI thermosetting film and the waste of the first sticky protective film within the first small window contour line frame attached thereto are removed from above. The remaining first PI thermosetting film strip with the first small window and the first sticky protective film strip are then compounded with the upper surface of the copper substrate finished product on the main material strip running below through the first heating roller group, so that the position of each group of first small windows on the first PI thermosetting film strip corresponds to the position of each group of through holes on each copper substrate finished product on the main material strip, that is, it is ensured that each group of through holes is correspondingly located within each small window area. Then, the first sticky protective film strip is removed from above, and the first bottom protective film strip is removed from below, so that the remaining first PI thermosetting film strip on the main material strip and the copper substrate finished products arranged at intervals bonded and compounded below it;

[0012] Step 4: Similarly, align and compound the second PI thermosetting film strip after die-cutting below the main material strip after Step 3. Specifically:

[0013] Below the running of the main material tape, the self - carrying film and the thermosetting glue surface of the second PI thermosetting film tape face upward. On the non - thermosetting glue surface of the second PI thermosetting film tape, a second sticky protective film tape and a third bottom - supporting protective film tape are successively laminated. The sticky surface of the second sticky protective film tape is laminated with the non - thermosetting glue surface of the second PI thermosetting film tape. Then, after passing around the upper lamination roller from above, the self - carrying film of the second PI thermosetting film tape is removed downward. Next, the second PI thermosetting film tape and the second sticky protective film tape and the third bottom - supporting protective film tape on its lower surface are subjected to a third die - cutting by a third round knife die - cutting roller group. The knife roller of the third round knife die - cutting roller group is located above, that is, the cutting edge of the third round knife die - cutting roller group just cuts through the second sticky protective film tape from the thermosetting glue surface of the second PI thermosetting film tape upward, and a number of groups of second small window contour lines arranged at intervals are die - cut on the second PI thermosetting film tape and the second sticky protective film tape. At the same time, a continuous second PI thermosetting film upper - end contour line along the length direction of the tape is formed on the second PI thermosetting film tape. After the third die - cutting, the third bottom - supporting protective film tape and the waste of the second PI thermosetting film and the second sticky protective film within the second small window contour line frame attached to it are removed from below. The remaining second PI thermosetting film tape with second small windows and the second sticky protective film tape are then laminated with the lower surface of the copper - substrate finished product on the main material tape running above through a second heating roller group, so that the position of each group of first small windows on the second PI thermosetting film tape corresponds to the position of each group of through - holes of each copper - substrate finished product on the lower surface of the main material tape, that is, it is ensured that each group of through - holes is correspondingly located within each small window area. At this time, from bottom to top, the main material tape is successively: the second sticky protective film tape, the second PI thermosetting film tape formed with second small windows, the copper - substrate finished products arranged at intervals, and the first PI thermosetting film tape formed with first small windows;

[0014] Step Five: After laminating a fourth bottom - supporting protective film tape below the main material tape after Step Four, a fourth die - cutting is carried out by a fourth round knife die - cutting roller group. The cutting edge of the fourth round knife die - cutting roller group just cuts through the second sticky protective film tape from top to bottom, and forms a curved hollow - out part contour line corresponding to the connecting part of the insurance area of the copper - substrate finished product and the outer edge of the bending part on the first PI thermosetting film tape and the second PI thermosetting film tape; and the area where the curved hollow - out part contour line is located is at the vacant part of the insurance area of the copper - substrate finished product, so the copper - substrate finished product is not cut. Then, the fourth bottom - supporting protective film tape and the waste of the first PI thermosetting film, the second PI thermosetting film, and the second sticky protective film within the curved hollow - out part contour line attached to it are removed from below. At this time, from bottom to top, the main material tape is successively: the second sticky protective film tape, the second PI thermosetting film tape formed with second small windows and curved hollow - out parts, the copper - substrate finished products arranged at intervals, and the first PI thermosetting film tape formed with first small windows and curved hollow - out parts;

[0015] Step Six: The main material tape after Step Five is subjected to the fifth die-cutting by the fifth round die-cutting roller group. The cutting edge of the fifth round die-cutting roller group just cuts through the second PI thermosetting film tape from top to bottom, and forms the contour lines on both sides and at the lower end of the first PI thermosetting film and the second PI thermosetting film in each component on the first PI thermosetting film tape and the second PI thermosetting film tape; the contour lines on both sides and at the lower end intersect with the upper contour line of the first PI thermosetting film and the upper contour line of the second PI thermosetting film formed in Step Three and Step Four respectively, so as to form a complete closed contour line of the first PI thermosetting film and the second PI thermosetting film); the cutting edge of the fifth die-cutting is located outside the contour line of the copper substrate finished product and does not cut the copper substrate finished product; then the waste outside the second thermosetting film tape frame, the rolled copper marking tape, and the waste outside the first PI thermosetting film tape frame are peeled off from above; then the finished product carrier film tape is laminated from above, and the second sticky protective film tape is removed from below; finally, the finished product isolation film tape is laminated during winding. At this time, the main material tape from bottom to top is successively: the finished product isolation film tape, the second PI thermosetting films arranged at intervals, the sheet copper substrate finished product, the first PI thermosetting film, the finished product carrier film tape; among them, the second PI thermosetting films arranged at intervals, the sheet copper substrate finished product, and the first PI thermosetting film are the finished product of the fuse monomer.

[0016] In the above process, in Step Two, the main material tape formed by laminating the rolled copper tape and the first bottom protective film tape is subjected to Y-direction compensation adjustment by the deviation rectifier before the first die-cutting, and X-direction compensation adjustment by the first color mark sensor before the first die-cutting; in Step Three, X-direction compensation adjustment is performed on the main material tape by the second color mark sensor after the second die-cutting and before the first heating roller group lamination; in Step Four, X-direction compensation adjustment is performed on the main material tape by the third color mark sensor before the second heating roller group lamination; in Step Five, X-direction compensation adjustment is performed on the main material tape by the fourth color mark sensor before the fourth die-cutting; in Step Six, X-direction compensation adjustment is performed on the main material tape by the fifth color mark sensor before the fifth die-cutting. By performing X-direction compensation adjustment on the tape by multiple color mark sensors before lamination and die-cutting respectively, the accuracy of lamination and die-cutting can be further enhanced, ensuring the product qualification rate.

[0017] In the above process, in Step Two, the cutter roller of the first round die-cutting roller group is provided with first contour line cutting edges corresponding to the contour lines on both sides and at both ends of the sheet copper substrate, and first auxiliary cutting edges for waste discharging and second auxiliary cutting edges corresponding to the straight disconnection lines are arranged between adjacent first contour line cutting edges, and first marking line cutting edges for forming the first positioning mark line are provided.

[0018] In the third and fourth steps, on the cutter rollers of the second round die cutting roller group and the third round die cutting roller group, there are respectively a first small window contour line cutter edge and a second small window contour line cutter edge corresponding to the first small window contour line and the second small window contour line, and there are respectively a first PI thermosetting film upper contour line cutter edge corresponding to the upper contour line of the first PI thermosetting film and a second PI thermosetting film upper contour line cutter edge corresponding to the upper contour line of the second PI thermosetting film; there are also respectively a second marking line cutter edge for forming the second positioning mark line and a third marking line cutter edge for forming the third positioning mark line;

[0019] In the fifth step, on the cutter roller of the fourth round die cutting roller group, there is a hollowed-out part contour line cutter edge corresponding to the contour line of the bent hollowed-out part, and there is a fourth marking line cutter edge for forming the fourth positioning mark line;

[0020] In the sixth step, on the cutter roller of the fifth round die cutting roller group, there is a semi-closed cutter edge corresponding to the contour lines on both sides and the lower end of the first PI thermosetting film and the second PI thermosetting film, and there is a fifth marking line cutter edge for forming the fifth positioning mark line;

[0021] The positions of the first positioning mark line, the second positioning mark line, the third positioning mark line, the fourth positioning mark line, and the fifth positioning mark line respectively correspond to the positions of 5 adjacent positioning corner marks on the rolled copper strip.

[0022] Among them, the process of the stamping equipment punching the rolled copper strip with a thickness of micron level in the first step is as follows:

[0023] S1, through the first station of the die, punch out the strip pitch positioning holes and positioning grooves on both side edges of the rolled copper strip, and remove the corresponding hole waste and edge waste;

[0024] S2, through the second station of the die, punch out two adjacent and spaced-apart first closed areas on the rolled copper strip, and a wavy contour line is formed inside the two first closed areas, that is, a complete fuse part in a wavy shape in the fuse is formed, and the waste corresponding to the two first closed areas on both sides is removed. The length of the first closed area is equivalent to the length occupied by the wavy shape, and the width is 8 - 12 times the line width of the fuse part;

[0025] S3, through the third station of the die, punch out a second closed area on the rolled copper strip. The second closed area partially overlaps with the outer side of one of the first closed areas, and the two intersection points of the contour line of the second closed area and the contour line of the first closed area are respectively the two end points of the wavy contour line on this side; the other contour lines of the second closed area outside the first closed area form part of the contour lines of the connection part and the bending part; and the inner frame waste of the second closed area is removed;

[0026] S4. Punch out a third closed area on the rolled copper strip through the fourth station of the die. The third closed area partially overlaps with the outer side of the first closed area on the other side. The two intersection points of the contour line of the third closed area and the contour line of the first closed area on the other side are the two endpoints of the wavy contour line on this side. The other contour lines of the third closed area outside the first closed area form the other part of the contour lines of the connection part and the bending part. And remove the inner frame waste of the third closed area. The third closed area does not intersect with the second closed area, and the connection part and the bending part are formed between them. At the same time, the fourth station also forms a positioning corner mark at the lower edge of the strip.

[0027] S5. Punch out two columns of through-holes on the rolled copper strip through the fifth station of the die. The two columns of through-holes are arranged in a staggered manner along the width direction of the strip, and each through-hole is in a different row.

[0028] S6. Punch out another two columns of through-holes on the rolled copper strip through the sixth station of the die. The two columns of through-holes are arranged in a staggered manner along the width direction of the strip, and the two columns of through-holes are symmetric with respect to the center line of the fuse monomer with the two columns of through-holes in S5.

[0029] S7. Punch out a column of through-holes on the rolled copper strip through the seventh station of the die. This column of through-holes is located in the middle of the two columns of through-holes in S5 / S6.

[0030] S8. Punch out another column of through-holes on the rolled copper strip through the eighth station of the die. This column of through-holes is also located in the middle of the two columns of through-holes in S5 / S6 and is arranged in a staggered manner with the through-holes formed in S7.

[0031] The die at the first station has a die-cutting frame positioning groove, a border cutting edge with a pitch positioning hole, and a positioning hole cutting edge. The die at the second station has two first closed cutting edges corresponding to the shape of the contour line of the first closed area. The die at the third station is provided with a second closed cutting edge corresponding to the shape of the contour line of the second closed area. The die at the fourth station is provided with a third closed cutting edge corresponding to the shape of the contour line of the third closed area. The dies at the fifth station, the sixth station, the seventh station, and the eighth station are respectively provided with through-hole cutting edges corresponding to the formed through-holes.

[0032] There are two empty steps between the first station and the second station, five empty steps between the second station and the third station, four empty steps between the third station and the fourth station, and two empty steps between the fourth station and the fifth station. There are two empty steps between the fifth station and the sixth station. There are three empty steps between the sixth station and the seventh station. There are two empty steps between the seventh station and the eighth station.

[0033] The present invention uses a high-precision die cutting method to punch ultra-thin rolled copper foil, directly forming a semi-finished fuse. In particular, the extremely thin fuse part is formed in one punching operation, avoiding defects such as flanging and deformation caused by multiple punching operations, and ensuring the stability of the size and performance of the fuse part. Then, through a high-speed rotary die cutting production process, high-efficiency and precision production is carried out, encapsulating the fuse part in the film material, exposing the opening area and the end area for electrical connection, improving production efficiency and subsequent usage efficiency. By installing electric eye tracking on each circular knife die and compensating and adjusting the die in the X direction, perfect integration of the metal stamping semi-finished product and the circular knife die cutting is achieved. The overall production efficiency can be increased to 5000 pcs / H, and the yield rate is increased to about 95%, thus effectively reducing product costs and improving the market competitiveness of the product. Brief Description of the Drawings:

[0034] Figure 1 and Figure 2 are the exploded structure schematic diagram and the planar structure schematic diagram of a single fuse component of the present invention;

[0035] Figure 3 is the planar schematic diagram of the copper substrate semi-finished product strip of the present invention; (the shaded part in the figure is the waste material to be excluded during stamping);

[0036] Figure 4 is the process schematic diagram of the high-speed rotary die cutting production process of the fuse component of the present invention;

[0037] Figure 4-1 is the schematic diagram of the blade expansion and die cutting effect of the first die cutting in the process of the present invention;

[0038] Figure 4-2 is the schematic diagram of the blade expansion and die cutting effect of the second die cutting in the process of the present invention;

[0039] Figure 4-3 is the schematic diagram of the blade expansion and die cutting effect of the third die cutting in the process of the present invention;

[0040] Figure 4-4 is the schematic diagram of the blade expansion and die cutting effect of the fourth die cutting in the process of the present invention;

[0041] Figure 4-5 is the schematic diagram of the blade expansion and die cutting effect of the fifth die cutting in the process of the present invention;

[0042] Figure 4-6 is the schematic diagram of the superposition effect of the die cutting effects in the process of the present invention;

[0043] Figure 4-7 is the schematic diagram of the superposition effect of the die cutting effect and the copper substrate semi-finished product strip in the process of the present invention;

[0044] Figure 5It is a schematic diagram of the monomer structure of the sheet copper substrate in the present invention;

[0045] Figure 6 It is a schematic diagram of the stamping process in the first step of the present invention ( Figure 6 The red part in it is the schematic diagram of the blade);

[0046] Figure 7 It is a schematic diagram of the superposition of the stamping effects of the rolled copper strip passing through the second station, the third station, and the fourth station. Specific embodiments:

[0047] As Figures 1-2 shown, the present invention relates to an ultra-thin rolled copper stamping fuse component. The monomer of the fuse component includes a sheet copper substrate 1 made of a rolled copper strip 2 with a thickness in the micron range, a first PI thermosetting film 3 and a second PI thermosetting film 4 respectively covering the upper and lower surfaces of the sheet copper substrate. In this embodiment, the PI thermosetting film is a composite tape formed by compounding a PI film and a thermosetting adhesive. Among them, the sheet copper substrate 1 is divided into three regions along the length direction, which are an opening region 11, a fuse region 12, and an end region 13 in sequence. A number of through holes 111 are arranged at intervals in an array in the opening region 11. The fuse region 12 includes a width-varying connecting portion 121 with two ends respectively connected to the diagonal corners of the opening region 11 and the end region 13, and a bending portion 122 connecting the two connecting portions. And there is a wavy fuse portion 123 in the middle of the bending portion 122. The line width of the fuse portion 123 is 0.15 ± 0.02 mm and is smaller than the line width of the main body of the bending portion 122. A number of small windows 31(41) arranged at intervals are respectively opened on the first PI thermosetting film 3 and the second PI thermosetting film 4. Each small window area includes the through holes 111 in the same row in the width direction of the sheet copper substrate 1 and the peripheral area of the through holes 111. The outer end of the end region 13 protrudes from the first PI thermosetting film 3 and the second PI thermosetting film 4; that is, an electrical connection is formed with the external circuit through the exposed end region 13 and the through holes 111 and the peripheral area of the through holes of the sheet copper substrate 1 exposed in the small window area. When the instantaneous current is too large and passes through the fuse portion 123, the fuse portion 123 will melt at high temperature to cut off the circuit and play the role of insurance;

[0048] In the above fuse component, two bent hollow portions 32(42) are respectively provided on the parts of the first PI thermosetting film 3 and the second PI thermosetting film 4 located in the fuse region, and are arranged along the outer edges of the connecting portion 121 and the bending portion 122 of the fuse region; the bent hollow portions 32(42) are beneficial for avoiding other microelectronic components and strengthening the air circulation in the local area, and are beneficial for heat dissipation, etc.;

[0049] In the above fuse component, the fuse part 123 has at least two peaks and two valleys; the length of the opening area 11 accounts for 60% ± 5% of the total length of the sheet copper substrate 1; the length of the end area 13 accounts for 10% ± 5% of the total length of the sheet copper substrate 1, and the remaining area is the fuse area 12; the aperture of the through hole is 0.50 ± 0.05 mm, the through hole array has 12 groups along the length direction of the sheet copper substrate, with 3 in each group, and the distance between adjacent through holes 111 along the length direction of the sheet copper substrate 1 is 2.00 ± 0.05 mm, and the distance between adjacent through holes 111 along the width direction of the sheet copper substrate 1 is 1.50 ± 0.05 mm.

[0050] The present invention also provides a production process for an ultra-thin rolled copper stamping fuse component, which is carried out by a high-speed rotary die cutter. This production process includes the following steps:

[0051] Step 1, punching and removing waste from a rolled copper strip with a thickness of micron level by a stamping device, so as to form the connecting part, the bending part, and the fuse part with a wavy shape in the middle of the bending part in the fuse area of the fuse monomer on the rolled copper strip, and all the through holes in the opening area, that is, forming a semi-finished copper substrate uniformly arranged along the length direction of the strip on the rolled copper strip, and compounding a first bottom protective film strip on the lower surface of the strip after waste removal and then winding it up for standby;

[0052] Specifically, in combination with Figure 3 、 Figures 5-7 as shown, the stamping process of the above ultra-thin rolled copper stamping fuse semi-finished product is as follows:

[0053] S1, punching the strip step pitch positioning holes 201 and the positioning grooves 202 at both side edges of the rolled copper strip 2 through the first station M1 of the die, and removing the corresponding hole waste and edge waste;

[0054] S2, when the strip runs two step pitches and reaches the second station M2, punching out two adjacent and spaced first closed areas 21 on the rolled copper strip 2 through the second station M2 of the die, and a wavy contour line 212 is formed inside the two first closed areas 21, that is, forming the complete fuse part 123 with a wavy shape in the fuse, and removing the waste corresponding to the two first closed areas 21 on both sides. The length of the first closed area is equivalent to the length occupied by the wavy shape, and the width is 8 - 12 times the line width of the fuse part; directly forming the wavy fuse part in one complete time, so that the main body of the fuse part is far away from the subsequent processing area, thus avoiding the occurrence of flanging, deformation, etc. of the fuse part, with more stable dimensions and ensuring product quality;

[0055] S3. The strip runs five pitches and reaches the third station M3. Through the third station M3 of the die, a second closed area 22 is punched out on the rolled copper strip 2. The second closed area 22 partially overlaps with the outer side of the first closed area 21 on one side, and the two intersection points of the contour line 221 of the second closed area and the contour line 211 of the first closed area are respectively the two end points D1 of the wavy contour line 201 on this side. The other contour lines of the second closed area 22 located outside the first closed area 21 form part of the contour lines of the connecting part and the bending part. And the inner frame waste of the second closed area 22 is removed.

[0056] S4. The strip runs four pitches and reaches the fourth station M4. Through the fourth station M4 of the die, a third closed area 23 is punched out on the rolled copper strip 2. The third closed area 23 partially overlaps with the outer side of the first closed area 21 on the other side, and the two intersection points of the contour line 231 of the third closed area and the contour line 211 of the first closed area on the other side are respectively the two end points D2 of the wavy contour line on this side. The other contour lines of the third closed area 23 located outside the first closed area 21 form another part of the contour lines of the connecting part and the bending part. And the inner frame waste of the third closed area is removed. The third closed area 23 does not intersect with the second closed area 22, and the connecting part 121 and the bending part 122 are formed between them. At the same time, the fourth station M4 also forms a positioning corner mark M42 at the lower edge of the strip. The interval between each positioning corner mark formed on the strip is 1 pitch.

[0057] S5. The strip runs two pitches and reaches the fifth station M5. Through the fifth station M5 of the die, two columns of through holes 111 are punched out on the rolled copper strip 2. The two columns of through holes 111 are arranged in a staggered manner along the width direction of the strip, and each through hole 111 is in a different row.

[0058] S6. The strip runs two pitches and reaches the sixth station M6. Through the sixth station M6 of the die, another two columns of through holes 111 are punched out on the rolled copper strip 2. The two columns of through holes 111 are arranged in a staggered manner along the width direction of the strip, and the two columns of through holes are symmetric with respect to the midline of the fuse monomer relative to the two columns of through holes in step S5.

[0059] S7. The strip runs three pitches and reaches the seventh station M7. Through the seventh station M7 of the die, a column of through holes is punched out on the rolled copper strip 2. This column of through holes is located in the middle of the two columns of through holes formed in steps S5 and S6.

[0060] S8. The strip runs two pitches and reaches the eighth station M8. Another row of through-holes is punched out on the rolled copper strip through the eighth station M8 of the die. This row of through-holes is also located in the middle of the two rows of through-holes of S5 / S6 and is arranged in a staggered manner with the through-holes formed in S7. That is, the above-mentioned 12*3 through-hole array is formed by punching four times from S5 to S8. Since they are all 0.5mm-level micro-holes, when punching, try to avoid concentrated punching to damage the strip, or the die design can be optimized to give the die more design space.

[0061] The die at the first station M1 has a die-cutting border positioning groove, a border cutting edge M11 with a pitch positioning hole, and a positioning hole cutting edge M12; the die at the second station M2 has two first closing cutting edges M21 corresponding to the shape of the first closing area contour line; the die at the third station M3 is provided with a second closing cutting edge M31 corresponding to the shape of the second closing area contour line; the die at the fourth station M4 is provided with a third closing cutting edge M41 corresponding to the shape of the third closing area contour line; the dies at the fifth station M5, the sixth station M6, the seventh station M7, and the eighth station M8 are respectively provided with through-hole cutting edges M51 corresponding to the formed through-holes.

[0062] There are two empty pitches between the first station M1 and the second station M2, five empty pitches between the second station M2 and the third station M3, four empty pitches between the third station M3 and the fourth station M4, and two empty pitches between the fourth station M4 and the fifth station M5; there are two empty pitches between the fifth station M5 and the sixth station M6; there are three empty pitches between the sixth station M6 and the seventh station M7; there are two empty pitches between the seventh station M7 and the eighth station M8. Appropriate empty pitches are beneficial for waste discharging and positioning of the strip during the process.

[0063] The ultra-thin rolled copper foil is punched by using a high-precision die punching method to directly form a fuse semi-finished product. In particular, the extremely thin fuse part is punched and formed at one time, avoiding defects such as flanging and deformation caused by multiple punching, and making the size and performance of the fuse part stable; the fuse semi-finished product roll of the present invention is suitable for die-cutting processing in combination with a film material, so that the fuse part in the fuse is encapsulated in the film material, and the opening area and the end area for electrical connection are exposed, improving the production efficiency and the efficiency of subsequent use.

[0064] Step 2: Compound the calendered copper strip 2 obtained in Step 1 with the first bottom protective film T1. On a high-speed rotary die-cutting machine, with the calendered copper strip 2 and the first bottom protective film strip T1 as the main material strip running direction, perform the first die-cutting on the main material strip through the first circular knife die-cutting roller group Y1. The first die-cutting cuts out the contour lines Y101 on both sides of the sheet copper substrate and the contour lines Y102 at both ends of the sheet copper substrate around each semi-finished copper substrate on the calendered copper strip 2, and the contour lines Y101 on both sides of the sheet copper substrate intersect with the outer contour line of the insurance area formed by stamping and waste discharging in Step 1. At the same time, form a straight break line Y103 on the strip near the outer end side of the opening area, and then discharge the waste of the copper foil strip outside the frame above the straight break line Y103, and retain the calendered copper marking strip containing the positioning corner mark M42 below the straight break line Y103. On the first bottom protective film strip T1, form the finished products of the sheet copper substrates 1 arranged at intervals and having complete contour lines, and the calendered copper marking strip containing the positioning corner mark M42.

[0065] Step 3: Align and compound the first PI thermosetting film strip J1 after die-cutting above the main material strip. Specifically: Above the running main material strip, the self-adhesive film J11 of the first PI thermosetting film strip J1 and the thermosetting adhesive surface face downwards. The first adhesive protective film strip B1 (peeling off the self-adhesive film B11) and the second bottom protective film strip T2 are sequentially compounded on the non-thermosetting adhesive surface of the first PI thermosetting film strip J1. The adhesive surface of the first adhesive protective film strip B1 is compounded with the non-thermosetting adhesive surface of the first PI thermosetting film strip J1. Then, the self-adhesive film J11 of the first PI thermosetting film strip is removed from below the compounding roller. Next, the second round die-cutting roller group Y2 performs a second die-cutting on the first PI thermosetting film strip J1 and the first adhesive protective film strip B1 and the second bottom protective film strip T2 thereon. The knife roller of the second round die-cutting roller group Y2 is located below, that is, the cutting edge of the second round die-cutting roller group Y2 just penetrates through the first adhesive protective film strip B1 from the thermosetting adhesive surface of the first PI thermosetting film strip J1 upwards, and a number of sets of first small window contour lines Y201 arranged at intervals are die-cut on the first PI thermosetting film strip J1 and the first adhesive protective film strip B1. The number and position of each set of first small window contour lines Y201 correspond to the number and position of the through holes 111 on each finished sheet copper substrate 1, that is, the first small window contour lines Y201 corresponding to the small windows 31 of the first PI thermosetting film 3. At the same time, a continuous first PI thermosetting film upper contour line Y202 along the length direction of the strip is formed on the first PI thermosetting film strip J1. This first PI thermosetting film upper contour line Y202 is used to form the end wires at the exposed end regions of the first PI thermosetting film 3 towards the copper substrate in each fuse component. After the second die-cutting, the second bottom protective film strip T2 and the waste of the first PI thermosetting film and the waste of the first adhesive protective film within the first small window contour line frame attached thereto are removed from above. The remaining first PI thermosetting film strip J1 with the first small windows 31 and the first adhesive protective film strip B1 are then compounded with the main material strip running below through the first heating roller group H1, so that the position of each set of first small windows 31 on the first PI thermosetting film strip J1 corresponds to the position of each set of through holes 111 on each finished sheet copper substrate 1 on the main material strip, that is, to ensure that each set of through holes 111 is correspondingly located within each first small window area. Then, the first adhesive protective film strip B1 is removed from above, and the first bottom protective film strip T1 is removed from below, leaving the first PI thermosetting film strip J1 on the main material strip and the finished sheet copper substrates 1 arranged at intervals bonded and compounded below it.

[0066] Step 4: Similarly, align and compound the second PI thermosetting film strip J2 after die-cutting below the main material strip after Step 3. Specifically:

[0067] Below the running of the main material tape, the self - carrying film J21 of the second PI thermosetting film tape J2 and the thermosetting glue surface face upward. On the non - thermosetting glue surface of the second PI thermosetting film tape J2, the second sticky protective film tape B2 (stripping the self - carrying film B21) and the third bottom protective film tape T3 are sequentially laminated. And the sticky surface of the second sticky protective film tape B2 is laminated with the non - thermosetting glue surface of the second PI thermosetting film tape J2. Then, it bypasses the upper lamination roller from above and then discharges the self - carrying film J21 of the second PI thermosetting film tape J2 downward. Then, the third round knife die - cutting roller group Y3 performs the third die - cutting on the second PI thermosetting film tape J2 and the second sticky protective film tape B2 and the third bottom protective film tape T3 on its lower surface. The knife roller of the third round knife die - cutting roller group Y3 is located above, that is, the blade of the third round knife die - cutting roller group Y3 feeds from the thermosetting glue surface of the second PI thermosetting film tape J2 and just cuts through the second sticky protective film tape B2, and cuts out a number of groups of second small window contour lines Y301 arranged at intervals on the second PI thermosetting film tape J2 and the second sticky protective film tape B2; the number and position of each group of second small window contour lines Y301 correspond to the number and position of the groups of through - holes 111 on each finished sheet - shaped copper substrate 1, that is, the second small window contour lines Y301 corresponding to the small windows of the second PI thermosetting film 4; at the same time, a continuous second PI thermosetting film upper contour line Y302 along the length direction of the tape is formed on the second PI thermosetting film tape J2; this second PI thermosetting film upper contour line Y302 is used to form the end - lines at the end regions of the second PI thermosetting film 4 exposed to the copper substrate in each fuse component. After the third die - cutting, the third bottom protective film tape T3 and the waste of the second PI thermosetting film and the second sticky protective film within the frame of the second small window contour line Y301 attached to it are discharged from below. The remaining second PI thermosetting film tape J2 with the second small windows 41 and the second sticky protective film tape B2 are then laminated with the main material tape running above through the second heating roller group H2, so that the position of each group of second small windows 41 on the second PI thermosetting film tape J2 corresponds to the position of each group of through - holes 111 of each finished copper substrate on the lower surface of the main material tape, that is, to ensure that each group of through - holes is correspondingly located within each small window area; at this time, from bottom to top, the main material tape is in the order of: the second sticky protective film tape B2, the second PI thermosetting film tape J2 formed with the second small windows 41, the sheet - shaped copper substrate 1 finished products arranged at intervals and the rolled copper marking tape, and the first PI thermosetting film tape J1 formed with the first small windows 31;

[0068] Step Five: After laminating the fourth bottom protective film strip T4 under the main material strip after Step Four, perform the fourth die-cutting through the fourth round die-cutting roller group Y4. The cutting edge of the fourth round die-cutting roller group Y4 just cuts through the second adhesive protective film strip B2 from top to bottom, and forms a curved hollowed-out part contour line Y401 on the first PI thermosetting film strip J1 and the second PI thermosetting film strip J2 corresponding to the connection part of the insurance area of the copper substrate finished product and the curved hollowed-out part set on the outer edge of the bending part; and the area where the curved hollowed-out part contour line Y401 is located is in the vacant part of the insurance area 12 of the copper substrate finished product, so the copper substrate finished product is not cut; then exclude the fourth bottom protective film strip T4 and the waste of the first PI thermosetting film, the second PI thermosetting film, and the second adhesive protective film attached to the curved hollowed-out part contour line Y401 from below. At this time, the main material strip from bottom to top is: the second adhesive protective film strip B2, the second PI thermosetting film strip J2 formed with the second small window 41 and the curved hollowed-out part 42, the copper substrate finished products and the rolled copper marking strips arranged at intervals, the first PI thermosetting film strip J1 formed with the first small window 31 and the curved hollowed-out part 32;

[0069] Step Six: Perform the fifth die-cutting on the main material strip after Step Five through the fifth round die-cutting roller group Y5. The cutting edge of the fifth round die-cutting roller group Y5 just cuts through the second PI thermosetting film strip J2 from top to bottom, and forms the contour lines Y501 on both sides and the lower end of the first PI thermosetting film 3 and the second PI thermosetting film 4 in each component on the first PI thermosetting film strip J1 and the second PI thermosetting film strip J2. The corresponding cutting edge is the semi-enclosed cutting edge R501 corresponding to the contour lines on both sides and the lower end of the first PI thermosetting film and the second PI thermosetting film; the contour lines on both sides and the lower end intersect with the upper end contour line Y202 of the first PI thermosetting film and the upper end contour line Y302 of the second PI thermosetting film formed in Step Three and Step Four respectively, so as to form a complete closed contour line of the first PI thermosetting film 3 and the second PI thermosetting film 4; the cutting edge of the fifth die-cutting is located outside the contour line of the copper substrate finished product and does not cut the copper substrate finished product; then peel off the waste J22 outside the frame of the second PI thermosetting film strip, the rolled copper marking strip 200, and the waste J12 outside the frame of the first PI thermosetting film strip from above; then laminate the finished product carrier film strip B3 (peeling off its own film B31) from above, and then exclude the second adhesive protective film strip B2 from below; finally, laminate the finished product isolation film strip L1 during winding. At this time, the main material strip from bottom to top is: the finished product isolation film strip L1, the second PI thermosetting films 4 arranged at intervals, the sheet copper substrate 1 finished products, the first PI thermosetting film 3, the finished product carrier film strip B3; among them, the second PI thermosetting films 4, the sheet copper substrate 1 finished products, and the first PI thermosetting film 3 arranged at intervals are the finished products of the fuse monomers.

[0070] In the above process, in Step 2, before the first die-cutting, the master tape formed by laminating the rolled copper tape 2 and the first bottom protective film tape T1 is subjected to Y-direction compensation adjustment by the deviation rectifier C, and before the first die-cutting, the master tape is subjected to X-direction compensation adjustment by the first color mark sensor C1; in Step 3, before the first heating roller group H1 is laminated after the second die-cutting, the master tape is subjected to X-direction compensation adjustment by the second color mark sensor C2; in Step 4, before the second heating roller group H2 is laminated, the master tape is subjected to X-direction compensation adjustment by the third color mark sensor C3; in Step 5, before the fourth die-cutting, the master tape is subjected to X-direction compensation adjustment by the fourth color mark sensor C4; in Step 6, before the fifth die-cutting, the master tape is subjected to X-direction compensation adjustment by the fifth color mark sensor C5. By using multiple color mark sensors to perform X-direction compensation adjustment on the tape before lamination and die-cutting respectively, the accuracy of lamination and die-cutting can be further enhanced, ensuring the product qualification rate.

[0071] In the above process, in Step 2, on the cutter roller of the first round die-cutting roller group Y1, there are first contour line cutting edges R101 corresponding to the side contour lines Y101 of the sheet copper substrate and the end contour lines Y102 of the sheet copper substrate, and between adjacent first contour line cutting edges R101, there are first auxiliary cutting edges R102 for waste discharging and second auxiliary cutting edges R103 corresponding to the straight disconnection line Y103, and there is a first marking line cutting edge R104 for forming the first positioning mark line Y104;

[0072] In Step 3 and Step 4, on the cutter rollers of the second round die-cutting roller group Y2 and the third round die-cutting roller group Y3, there are first small window contour line cutting edges R201 and second small window contour line cutting edges R301 corresponding to the first small window contour line Y201 and the second small window contour line Y301 respectively, and there are first PI thermosetting film upper contour line cutting edges R302 corresponding to the upper contour line Y202 of the first PI thermosetting film and second PI thermosetting film upper contour line cutting edges R302 corresponding to the upper contour line Y302 of the second PI thermosetting film respectively; there are also second marking line cutting edges R203 for forming the second positioning mark line Y203 and third marking line cutting edges R303 for forming the third positioning mark line Y303 respectively; the heating temperatures of the first heating roller group H1 and the second heating roller group H2 can be adjusted as needed;

[0073] In Step 5, on the cutter roller of the fourth round die-cutting roller group Y4, there is a hollow part contour line cutting edge R401 corresponding to the bent hollow part contour line Y401, and there is a fourth marking line cutting edge R402 for forming the fourth positioning mark line Y402;

[0074] In the sixth step, the knife roller of the fifth round die cutting roller group Y5 is provided with semi-closed cutting edges R501 corresponding to the contour lines Y501 on both sides and the lower end of the first PI thermosetting film and the second PI thermosetting film, and is also provided with fifth marking line cutting edges R502 for forming the fifth positioning marking line Y502;

[0075] The positions of the first positioning marking line Y104, the second positioning marking line Y203, the third positioning marking line Y303, the fourth positioning marking line Y403, and the fifth positioning marking line Y502 respectively correspond to the positions of 5 adjacent positioning corner marks M42 on the rolled copper strip.

[0076] In the cutting edge area of the knife die corresponding to the above-mentioned formed small windows and hollow parts, ejector pins are provided to facilitate waste discharging.

[0077] The present invention uses a high-precision die cutting method to punch the ultra-thin rolled copper foil, directly forming the fuse semi-finished product. In particular, the extremely thin fuse part is formed in one punching process, avoiding defects such as flanging and deformation caused by multiple punching processes, and making the size and performance of the fuse part stable; then, through the high-speed rotary die cutting production process, high-efficiency and precision production is carried out, so that the fuse part in the fuse is encapsulated in the film material, and the opening area and the end area for electrical connection are exposed, improving the production efficiency and the subsequent use efficiency. By installing an electric eye tracking device on each round die, compensation adjustment is carried out in the X direction of the die, perfectly realizing the integrated forming of the hardware stamping semi-finished product and the round die cutting. The overall production efficiency can be increased to 5000 pcs / H, and the yield rate is increased to about 95%, thus effectively reducing the product cost and improving the market competitiveness of the product.

[0078] The fuse component of the present invention can be used in a CCS module, also known as a battery cover plate component, an integrated busbar or a wire harness board integrated component, a new energy vehicle, and an energy storage device. Its working principle is also to generate a large amount of heat and increase the temperature under abnormal current, so as to fuse and cut off the circuit, playing a protective role for other circuit components.

[0079] The above embodiments are only exemplary embodiments adopted to illustrate the principle of the present invention. However, the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. An ultra-thin rolled copper stamping fuse component, characterized in that: The single fuse component includes a sheet copper substrate made of rolled copper with a thickness in the micron range, a first PI thermosetting film and a second PI thermosetting film respectively covering the upper and lower surfaces of the sheet copper substrate. Among them, the sheet copper substrate is divided into three regions along the length direction, namely an opening region, a fuse region and an end region. A number of through holes are arranged in an array at intervals in the opening region. The fuse region includes a width-gradual connecting portion with both ends respectively connected to the diagonal corners of the opening region and the end region, and a bending portion connecting the two connecting portions. And there is a wavy fuse portion in the middle of the bending portion. The line width of the fuse portion is 0.15±0.02 mm and is smaller than the line width of the main body of the bending portion. A number of small windows arranged at intervals are respectively formed on the first PI thermosetting film and the second PI thermosetting film. Each small window region includes the through holes in the same row in the width direction of the sheet copper substrate and the peripheral region of the through holes. The outer end of the end region protrudes from the first PI thermosetting film and the second PI thermosetting film.

2. The ultra-thin rolled copper stamping fuse component according to claim 1, wherein: On the parts of the first PI thermosetting film and the second PI thermosetting film located in the fuse region, two bent hollow parts are respectively arranged along the outer edges of the connecting portion and the bending portion of the fuse region.

3. The ultra-thin rolled copper stamping fuse component according to claim 1, characterized in that: The fuse portion has at least two wave peaks and two wave valleys. The length of the opening region accounts for 60%±5% of the total length of the sheet copper substrate. The length of the end region accounts for 10%±5% of the total length of the sheet copper substrate. The remaining region is the fuse region. The aperture of the through hole is 0.50±0.05 mm. The through hole array has 12 groups along the length direction of the sheet copper substrate, with 3 in each group. The distance between adjacent through holes along the length direction of the sheet copper substrate is 2.00±0.05 mm. The distance between adjacent through holes along the width direction of the sheet copper substrate is 1.50±0.05 mm.

4. A production process for an ultra-thin rolled copper stamping fuse component, which is carried out by a high-speed rotary die-cutting machine, is characterized in that: This production process includes the following steps: Step 1, use a stamping device to punch and remove waste from a rolled copper strip with a thickness in the micron range, so that the connecting portion, the bending portion and the wavy fuse portion in the middle of the bending portion in the fuse region of the single fuse are formed on the rolled copper strip, and all the through holes in the opening region are formed, that is, a copper substrate semi-finished product uniformly arranged along the length direction of the strip is formed on the rolled copper strip. After discharging the waste, a first bottom protective film strip is compounded on the lower surface of the strip and then wound up for standby. Step 2, on a high-speed rotary die-cutting machine, with the rolled copper strip and the first bottom protective film strip obtained in Step 1 as the main strip running direction, the main strip is first die-cut by a first round knife die-cutting roller group. The first die-cutting cuts out the contour lines on both sides and at both ends of the sheet copper substrate around each copper substrate semi-finished product on the rolled copper strip, and the contour lines on both sides of the sheet copper substrate intersect with the outer contour line of the fuse region formed in Step 1. At the same time, a straight break line is formed on the strip near the outer end of the opening region side, and then the waste of the copper foil strip outside the frame above the straight break line is removed, and the rolled copper marking strip with positioning corner marks below the straight break line is retained. On the first bottom protective film strip, sheet copper substrate finished products arranged at intervals and with complete contour lines, and a rolled copper marking strip with positioning corner marks are formed. Step 3: Align and compound the first PI thermosetting film strip after die-cutting above the main material strip. Specifically: Above the running main material strip, the self-adhesive film and thermosetting glue surface of the first PI thermosetting film strip face downward. The first sticky protective film strip and the second bottom protective film strip are sequentially compounded on the non-thermosetting glue surface of the first PI thermosetting film strip. The sticky surface of the first sticky protective film strip is compounded with the non-thermosetting glue surface of the first PI thermosetting film strip. Then, the self-adhesive film of the first PI thermosetting film strip is removed from below the compounding roller. Next, the first PI thermosetting film strip and the first sticky protective film strip and the second bottom protective film strip thereon are subjected to a second die-cutting by the second round knife die-cutting roller group. The knife roller of the second round knife die-cutting roller group is located below, that is, the blade of the second round knife die-cutting roller group just cuts through the first sticky protective film strip from the thermosetting glue surface of the first PI thermosetting film strip upward, and a number of groups of first small window contour lines arranged at intervals are die-cut on the first PI thermosetting film strip and the first sticky protective film strip. At the same time, a continuous first PI thermosetting film upper contour line along the length direction of the strip is formed on the first PI thermosetting film strip. After the second die-cutting, the second bottom protective film strip and the waste of the first PI thermosetting film and the waste of the first sticky protective film within the first small window contour line frame attached thereto are removed from above. The remaining first PI thermosetting film strip with the first small window and the first sticky protective film strip are then compounded with the main material strip running below through the first heating roller group, so that the position of each group of first small windows on the first PI thermosetting film strip corresponds to the position of each group of through holes on each copper substrate finished product on the main material strip, that is, it is ensured that each group of through holes is correspondingly located within each small window area. Then, the first sticky protective film strip is removed from above, and the first bottom protective film strip is removed from below, so that the remaining first PI thermosetting film strip on the main material strip and the copper substrate finished products arranged at intervals bonded and compounded below it; Step 4: Similarly, align and compound the second PI thermosetting film strip after die-cutting below the main material strip after Step 3. Specifically: Below the running of the main material tape, the self - carrying film and the thermosetting adhesive surface of the second PI thermosetting film tape face upward. The second sticky protective film tape and the third bottom - supporting protective film tape are successively laminated on the non - thermosetting adhesive surface of the second PI thermosetting film tape. And the sticky surface of the second sticky protective film tape is laminated with the non - thermosetting adhesive surface of the second PI thermosetting film tape. Then, it bypasses the upper laminating roller from above and the self - carrying film of the second PI thermosetting film tape is removed downward. Then, the second PI thermosetting film tape and the second sticky protective film tape and the third bottom - supporting protective film tape on its lower surface are subjected to the third die - cutting by the third round knife die - cutting roller group. The knife roller of the third round knife die - cutting roller group is located above, that is, the cutting edge of the third round knife die - cutting roller group just cuts through the second sticky protective film tape from the thermosetting adhesive surface of the second PI thermosetting film tape facing upward. A number of groups of second small window contour lines arranged at intervals are die - cut on the second PI thermosetting film tape and the second sticky protective film tape. At the same time, a continuous second PI thermosetting film upper - end contour line along the length direction of the tape is formed on the second PI thermosetting film tape. After the third die - cutting, the third bottom - supporting protective film tape and the waste of the second PI thermosetting film and the second sticky protective film within the second small window contour line frame attached to it are removed from below. The remaining second PI thermosetting film tape with second small windows and the second sticky protective film tape are then laminated with the main material tape running above through the second heating roller group, so that the position of each first small window on the second PI thermosetting film tape corresponds to the position of each through - hole of each copper substrate finished product on the lower surface of the main material tape, that is, to ensure that each through - hole is correspondingly located within each small window area. At this time, from bottom to top, the main material tape is successively: the second sticky protective film tape, the second PI thermosetting film tape formed with second small windows, the copper substrate finished products arranged at intervals, and the first PI thermosetting film tape formed with first small windows; Step Five: After laminating the fourth bottom - supporting protective film tape below the main material tape after Step Four, the fourth die - cutting is carried out by the fourth round knife die - cutting roller group. The cutting edge of the fourth round knife die - cutting roller group just cuts through the second sticky protective film tape from top to bottom, and forms a curved hollow - out contour line corresponding to the connecting part of the insurance area of the copper substrate finished product and the outer edge of the bending part on the first PI thermosetting film tape and the second PI thermosetting film tape. And the area where the curved hollow - out contour line is located is at the vacant part of the insurance area of the copper substrate finished product. Then, the fourth bottom - supporting protective film tape and the waste of the first PI thermosetting film, the second PI thermosetting film and the second sticky protective film within the curved hollow - out contour line attached to it are removed from below. At this time, from bottom to top, the main material tape is successively: the second sticky protective film tape, the second PI thermosetting film tape formed with second small windows and curved hollow - outs, the copper substrate finished products arranged at intervals, and the first PI thermosetting film tape formed with first small windows and curved hollow - outs; Step 6: The main material tape that has gone through Step 5 is subjected to the fifth die-cutting by the fifth round die-cutting roller group. The cutting edge of the fifth round die-cutting roller group just cuts through the second PI thermosetting film tape from top to bottom, and forms the contour lines on both sides and at the lower end of the first PI thermosetting film and the second PI thermosetting film in each component on the first PI thermosetting film tape and the second PI thermosetting film tape; the contour lines on both sides and at the lower end intersect with the upper contour line of the first PI thermosetting film and the upper contour line of the second PI thermosetting film formed in Step 3 and Step 4 respectively; the cutting edge of the fifth die-cutting is located outside the contour line of the copper substrate finished product; then, the waste outside the second thermosetting film tape frame, the rolled copper marking tape, and the waste outside the first PI thermosetting film tape frame are peeled off from above; then the finished product carrier film tape is laminated from above, and the second adhesive protective film tape is removed from below; finally, the finished product isolation film tape is laminated during winding. At this time, the main material tape from bottom to top is in turn: the finished product isolation film tape, the second PI thermosetting films arranged at intervals, the sheet-shaped copper substrate finished product, the first PI thermosetting film, and the finished product carrier film tape; among them, the second PI thermosetting films arranged at intervals, the sheet-shaped copper substrate finished product, and the first PI thermosetting film are the finished product of the fuse monomer.

5. The production process of the ultra-thin rolled copper stamping fuse component according to claim 4, characterized in that: In Step 2, the main material tape formed by laminating the rolled copper tape and the first bottom protective film tape is subjected to Y-direction compensation adjustment by a rectifier before the first die-cutting, and X-direction compensation adjustment by a first color mark sensor before the first die-cutting; in Step 3, X-direction compensation adjustment is performed on the main material tape by a second color mark sensor after the second die-cutting and before the first heating roller group lamination; in Step 4, X-direction compensation adjustment is performed on the main material tape by a third color mark sensor before the second heating roller group lamination; in Step 5, X-direction compensation adjustment is performed on the main material tape by a fourth color mark sensor before the fourth die-cutting; in Step 6, X-direction compensation adjustment is performed on the main material tape by a fifth color mark sensor before the fifth die-cutting.

6. The production process of the ultra-thin rolled copper stamping fuse component according to claim 4, characterized in that: In the said Step 2, the cutting roller of the first round die-cutting roller group is provided with first contour line cutting edges corresponding to the contour lines on both sides and at both ends of the sheet-shaped copper substrate, and between adjacent first contour line cutting edges, there are first auxiliary cutting edges for waste discharge and second auxiliary cutting edges corresponding to the straight break line, and there is a first marking line cutting edge for forming the first positioning mark line; In the said Step 3 and Step 4, the cutting rollers of the second round die-cutting roller group and the third round die-cutting roller group are respectively provided with first small window contour line cutting edges and second small window contour line cutting edges corresponding to the first small window contour line and the second small window contour line, and are respectively provided with first PI thermosetting film upper contour line cutting edges corresponding to the upper contour line of the first PI thermosetting film and second PI thermosetting film upper contour line cutting edges corresponding to the upper contour line of the second PI thermosetting film; there are also second marking line cutting edges for forming the second positioning mark line and third marking line cutting edges for forming the third positioning mark line respectively; In the fifth step, on the cutter roller of the fourth round die cutting roller group, there is a hollowed-out part contour blade corresponding to the contour line of the bent hollowed-out part, and a fourth marking line blade for forming the fourth positioning marking line is provided; In the sixth step, on the cutter roller of the fifth round die cutting roller group, there is a semi-closed blade corresponding to the contour lines on both sides and the lower end of the first PI thermosetting film and the second PI thermosetting film, and a fifth marking line blade for forming the fifth positioning marking line is provided; The positions of the first positioning marking line, the second positioning marking line, the third positioning marking line, the fourth positioning marking line, and the fifth positioning marking line respectively correspond to the positions of 5 adjacent positioning corner marks on the rolled copper strip.

7. The production process of the ultra-thin rolled copper stamping fuse component according to claim 4, characterized in that: In the first step, the stamping equipment punches and cuts the rolled copper strip with a thickness of micron level as follows: S1, through the first station of the die, punch and cut out the strip pitch positioning holes and positioning grooves on both edges of the rolled copper strip, and remove the corresponding hole waste and edge waste; S2, through the second station of the die, punch and cut out two adjacent and spaced-apart first closed areas on the rolled copper strip, and a wavy contour line is formed inside the two first closed areas, that is, a complete fuse part in the shape of a wave in the fuse is formed, and the waste corresponding to the two first closed areas on both sides is removed. The length of the first closed area is equivalent to the occupied length of the wave shape, and the width is 8 - 12 times the line width of the fuse part; S3, through the third station of the die, punch and cut out a second closed area on the rolled copper strip. The second closed area partially coincides with the outer side of one of the first closed areas, and the two intersection points of the contour line of the second closed area and the contour line of the first closed area are respectively the two end points of the wavy contour line on this side; The other contour lines of the second closed area outside the first closed area form part of the contour lines of the connection part and the bending part; And remove the inner frame waste of the second closed area; S4, through the fourth station of the die, punch and cut out a third closed area on the rolled copper strip. The third closed area partially coincides with the outer side of the other first closed area, and the two intersection points of the contour line of the third closed area and the contour line of the other first closed area are respectively the two end points of the wavy contour line on this side; The other contour lines of the third closed area outside the first closed area form the other part of the contour lines of the connection part and the bending part; And remove the inner frame waste of the third closed area; The third closed area does not intersect with the second closed area and forms the connection part and the bending part between the two; At the same time, the fourth station also forms a positioning corner mark on the lower edge of the strip; S5, through the fifth station of the die, punch and cut out two columns of through holes on the rolled copper strip. The two columns of through holes are arranged in a staggered manner along the width direction of the strip, and each through hole is in a different row; S6, through the sixth station of the die, punch and cut out another two columns of through holes on the rolled copper strip. The two columns of through holes are arranged in a staggered manner along the width direction of the strip, and the two columns of through holes are symmetric with respect to the center line of the fuse monomer with respect to the two columns of through holes in S5; S7, through the seventh station of the die, punch and cut out a column of through holes on the rolled copper strip, and this column of through holes is located at the middle of the two columns of through holes in S5 / S6, At the eighth station of the die, another row of through-holes is punched out on the rolled copper strip. This row of through-holes is also located in the middle of the two rows of through-holes of S5 / S6 and is arranged in a staggered manner with the through-holes formed in S7.

8. The production process of the ultra-thin rolled copper stamping fuse component according to claim 7, characterized in that: The die at the first station has a die-cutting border positioning groove, border cutting edges of the pitch positioning holes, and positioning hole cutting edges; the die at the second station has two first closing cutting edges corresponding to the shape of the first closing area contour line; the die at the third station is provided with a second closing cutting edge corresponding to the shape of the second closing area contour line; the die at the fourth station is provided with a third closing cutting edge corresponding to the shape of the third closing area contour line; the dies at the fifth, sixth, seventh, and eighth stations are respectively provided with through-hole cutting edges corresponding to the formed through-holes.

9. The production process of the ultra-thin rolled copper stamping fuse component according to claim 7, characterized in that: There are two empty steps between the first station and the second station, five empty steps between the second station and the third station, four empty steps between the third station and the fourth station, two empty steps between the fourth station and the fifth station; there are two empty steps between the fifth station and the sixth station; there are three empty steps between the sixth station and the seventh station; there are two empty steps between the seventh station and the eighth station.

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