High-precision multi-specification chip feeding equipment

Abstract

The application discloses a high-precision multi-specification chip feeding equipment, which comprises a horizontal moving module and a supporting platform, the horizontal moving module can drive the supporting platform to move in a plane; the supporting platform is rotationally connected with the horizontal moving module and can rotate around its own axis; at least two trays are distributed on the supporting platform, the trays are connected through a synchronous mechanism to drive synchronous rotation between the trays; the trays can rotate around their own axes to adjust the chip placement angle by following the supporting platform through a transmission mechanism. The application can quickly move the required tray to the pickup station below, thereby shortening the replacement time and improving the feeding efficiency; meanwhile, when the supporting platform rotates, each tray rotates around the supporting platform to realize rotation, and cooperates with the horizontal moving module to adjust the tray position and the chip angle placed in the tray, so that the inclination angle of the picked chip can be greatly reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor feeding technology, and in particular to a high-precision multi-specification chip feeding device. Background Technology

[0002] In the semiconductor device packaging process, the diced wafers are formed into several chips. The diced wafers need to be placed in a tray, which is equipped with a blue film for holding the wafers. After the chips are picked up, they are packaged on the corresponding positions on the carrier board. In order to meet the mounting and packaging requirements, the loading device needs to hold multiple chips of different specifications at the same time for picking and mounting according to the mounting requirements.

[0003] The existing feeding device can only drive the tray to move in the horizontal plane to adjust the corresponding tray to the picking station. It can only control the position of the tray through linear movement, but it cannot adjust the angle of the chip on the tray. The chip placement angle is skewed, which in turn causes the chip picked up by the picking mechanism to be skewed. Summary of the Invention

[0004] To address the aforementioned shortcomings, this application provides a high-precision multi-specification chip feeding device that can simultaneously feed chips of various specifications. When switching trays, the tray rotates to adjust the angle of the chips on it, greatly reducing the deviation in chip picking. The following technical solution is adopted:

[0005] A high-precision multi-specification chip loading device includes a transverse module and a support platform, wherein the transverse module can drive the support platform to move in a plane;

[0006] The support platform is rotatably connected to the transverse module, and the support platform can rotate around its own axis;

[0007] The support platform has at least two trays, which are used to hold chips of different specifications. The trays are connected by a synchronization mechanism to drive them to rotate synchronously.

[0008] The support platform is connected to any of the material trays by a transmission mechanism, which drives any of the material trays to rotate around its own axis following the support platform, thereby adjusting the chip placement angle.

[0009] Preferably, the lateral movement module includes a first linear movement mechanism for driving the support platform to move along a first direction, and a second linear movement mechanism for driving the support platform to move along a second direction.

[0010] More preferably, the first linear motion mechanism and the second linear motion mechanism are connected in a layered structure.

[0011] Preferably, a mounting frame is provided between the transverse module and the support platform, and the support platform is rotatably connected to the mounting frame; the material tray is rotatably connected to the support platform.

[0012] Preferably, the synchronization mechanism includes a meshing disc disposed on the side of the material tray, and the meshing discs are connected by a first connecting component.

[0013] Preferably, the transmission mechanism is located at the bottom of the material tray, and the transmission mechanism includes a first transmission component located at the bottom of the support platform and a second transmission component located at the bottom of any of the material trays, with a second connecting component providing a transmission connection between the first transmission component and the second transmission component.

[0014] Preferably, it also includes a power component, which is connected to the support platform for driving the support platform to rotate and switch different material trays to the picking station.

[0015] Compared with the prior art, the beneficial effects of this application are as follows:

[0016] The support platform of this application can rotate around its own axis, driving the various material trays set on it to rotate synchronously. In conjunction with the transverse module, it can quickly move the material tray to be picked up to below the picking station, thereby shortening the changeover time and improving the material supply efficiency.

[0017] Meanwhile, as the support platform rotates, each tray will rotate synchronously with the support platform to achieve its own rotation. In conjunction with the transverse module, while adjusting the position of the tray, the angle of the chip placed in the tray can be adjusted, which can greatly reduce the skew angle of chip picking. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this application;

[0019] Figure 2 This is a partial structural diagram of this application;

[0020] Figure 3 The dashed line in the diagram illustrates the chip's angular deviation.

[0021] In the picture:

[0022] 1. Transverse traverse module; 11. First linear motion mechanism; 12. Second linear motion mechanism;

[0023] 2. Support platform; 3. Material tray; 4. Power assembly; 5. First connecting component; 6. Mounting bracket; 7. First transmission component; 8. Second transmission component; 9. Second connecting component; 10. Engaging disc.

[0024] 100. Chip. Detailed Implementation

[0025] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] See Figures 1 to 2 To further elaborate on this application:

[0027] Combination Figure 1 A high-precision multi-specification chip loading device is used to place chips 100 and provide mounting chips 100 for a picking mechanism. It includes a transverse module 1 and a support platform 2. The support platform 2 is connected to the transverse module 1 and is disposed on the transverse module 1 on one side of the picking mechanism for feeding the picking mechanism. The transverse module 1 can drive the support platform 2 to move in a plane. In this embodiment, the support platform 2 is installed on the top of the transverse module 1, and the transverse module 1 drives the support platform 2 to move in a horizontal plane.

[0028] The support platform 2 is rotatably connected to the transverse module 1, and the support platform 2 can rotate around its own axis. In this embodiment, a mounting frame 6 is provided between the transverse module 1 and the support platform 2, and the support platform 2 is rotatably connected to the mounting frame 6. The material tray 3 is rotatably connected to the support platform 2. The support platform 2, the mounting frame 6, and the material tray 3 can all be connected by rotating components, which can be bearings.

[0029] At least two trays 3 are distributed on the support platform 2. The trays 3 are used to place chips 100. Each tray 3 can hold a chip 100 of one specification, thereby enabling the simultaneous supply of chips 100 of multiple specifications. The trays 3 can rotate with the support platform 2 to adjust the placement angle of the chips 100. In this embodiment, the trays are connected by a synchronization mechanism to drive them to rotate synchronously. The trays 3 are circumferentially distributed on the support platform 2. Of course, they can also be arranged in an array or other forms.

[0030] Compared to existing technologies, this application utilizes the rotatable support platform 2 in conjunction with the transverse module 1 to switch the corresponding material tray 3 to move below the picking station, thereby enabling the supply of chips of various specifications. When switching the material tray 3, the material tray 3 can rotate with the support platform 2. By adjusting the position of the material tray 3 and the angle of the chip 100 on the material tray 3 with the help of the transverse module 1, the skewness of the chip 100 position can be greatly reduced.

[0031] Combination Figure 1 In this embodiment, the synchronization mechanism includes a meshing disc 10 disposed on the side of the material tray 3. Each meshing disc 10 is connected to the other by a first connecting component 5. The first connecting component 5 can be a transmission belt to achieve synchronous rotation of each material tray 3, which is smooth and low cost. Of course, synchronous rotation can also be achieved by a gear, chain drive or other structure.

[0032] The transverse module 1 includes a first linear motion mechanism 11 for driving the support platform 2 to move along a first direction, and a second linear motion mechanism 12 for driving the support platform 2 to move along a second direction; wherein the first linear motion mechanism 11 and the second linear motion mechanism 12 are connected in a layered structure. This arrangement can greatly reduce the space occupied, but is not limited thereto.

[0033] In this embodiment, the second linear motion mechanism 12 is disposed on top of the first linear motion mechanism 11, and the support platform 2 is connected to the second linear motion mechanism 12.

[0034] The support platform 2 can rotate around its own axis; specifically, it also includes a power component 4, which is connected to the support platform 2 and is used to drive the support platform 2 to rotate in order to switch different material trays 3; the power component 4 can be a motor, which can drive the support platform 2 by belt drive, which is smooth, low cost and low noise; but it is not limited to this.

[0035] Combination Figure 2 In this embodiment, a transmission mechanism is provided between the support platform 2 and any of the material trays 3 to drive the material trays 3 to rotate synchronously with the support platform 2. When the support platform 2 rotates, the material trays 3 can synchronously follow the rotation of the support platform 2.

[0036] The transmission mechanism includes a first transmission component 7 located at the bottom of the support platform 2 and a second transmission component 8 located at the bottom of any of the material trays 3. A second connecting component 9 is provided between the first transmission component 7 and the second transmission component 8 for transmission connection. Both the first transmission component 7 and the second transmission component 8 can be pulleys, and the second connecting component 9 can be a transmission belt. The transmission is smooth, with low noise and low cost.

[0037] In an embodiment not shown, any of the trays 3 can be powered by an independent motor to drive the trays 3 to rotate synchronously, thereby adjusting the chip angle.

Claims

1. A high-precision multi-specification chip feeding equipment, characterized in that: The device comprises a horizontal moving module and a supporting platform, the horizontal moving module can drive the supporting platform to move in a plane; The supporting platform is rotationally connected with the horizontal moving module, and the supporting platform can rotate around its own axis; At least two trays are distributed on the supporting platform, the trays are used to respectively place chips of different specifications, and a synchronous mechanism is arranged between the trays to drive the trays to synchronously rotate; The synchronous mechanism comprises engagement plates arranged on the side of the trays, and the engagement plates are drivingly connected through first connecting components; A transmission mechanism is arranged between the supporting platform and any of the trays to drive any of the trays to rotate around its own axis along with the supporting platform, so as to adjust the angle of the chips; The transmission mechanism is arranged at the bottom of the tray, and the transmission mechanism comprises a first transmission component arranged at the bottom of the supporting platform and a second transmission component arranged at the bottom of any of the trays, and the first transmission component and the second transmission component are drivingly connected through a second connecting component.

2. The high-precision multi-specification chip feeding device according to claim 1, characterized in that: The horizontal moving module comprises a first linear moving mechanism for driving the supporting platform to move in a first direction, and a second linear moving mechanism for driving the supporting platform to move in a second direction.

3. The high-precision multi-specification chip feeding device according to claim 2, characterized in that: The first linear moving mechanism and the second linear moving mechanism are overlapped in a layered structure.

4. The high precision multi-specification chip on board equipment according to claim 1, characterized in that: A mounting frame is arranged between the horizontal moving module and the supporting platform, the supporting platform is rotationally connected with the mounting frame, and the trays are rotationally connected with the supporting platform.

5. The high precision multi-specification chip on board equipment of claim 1, wherein: A power assembly is further arranged, the power assembly is drivingly connected with the supporting platform to drive the supporting platform to rotate and switch different trays to a picking station.

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