Dielectric body for an electrical component

Abstract

A method of assembling an electrical component (102) is provided. The method includes providing a dielectric body (110) configured to support an electrical conductor (200). The dielectric body includes a polymer resin (120). The dielectric body includes a glass filler element (130) embedded in a polymer resin, and the dielectric body includes a gas chamber (140) embedded in the polymer resin.

Description

Technical Field

[0001] The subject matter of this disclosure generally relates to low dielectric thermoplastic compositions. Background Art

[0002] High-speed communication devices such as electrical connectors, input / output modules, backplanes, etc. are used in high-speed communication networks. High-performance polymer materials with low dielectric constant and low dielectric loss have been widely used in components of high-speed communication networks. In high-speed communication network applications, unsatisfactory dielectric properties are an obstacle to the signal throughput of components. Dielectric materials with low dielectric constant are used in high-speed communication networks to improve the overall performance of the device because of their lower dielectric constant than traditional dielectric materials, which allows for faster signal transmission. However, low dielectric constant materials are expensive and have limitations in use in high-speed communication devices.

[0003] There is still a need for reliable and cost-effective dielectric materials for high-speed communication devices. Summary of the Invention

[0004] In one embodiment, a method of assembling an electrical component is provided. The method includes providing a dielectric body configured to support an electrical conductor. The dielectric body includes a polymer resin. The dielectric body includes glass filler elements embedded in the polymer resin, and the dielectric body includes air chambers embedded in the polymer resin.

[0005] In another embodiment, a dielectric body for an electrical component is provided. The dielectric body includes a polymer resin. The dielectric body includes glass filler elements embedded in the polymer resin. The dielectric body includes air chambers embedded in the polymer resin between the glass filler elements.

[0006] In another embodiment, an electrical component is provided, and the electrical component includes a substrate that includes a dielectric body. The dielectric body includes a polymer resin. The dielectric body includes glass filler elements embedded in the polymer resin, and the dielectric body includes air chambers embedded in the polymer resin. The electrical component includes an electrical conductor held by the substrate and at least partially surrounded by the dielectric body. Brief Description of the Drawings

[0007] Figure 1 A substrate according to an exemplary embodiment is shown.

[0008] Figure 2 An electrical component according to an exemplary embodiment is shown, which includes a substrate formed of a dielectric body.

[0009] Figure 3 A process for assembling an electrical component according to an exemplary embodiment is shown.

[0010] Figure 4FIG. 400 is a flowchart showing a method of assembling an electrical component according to an exemplary embodiment.

[0011] Figure 5 FIG. is a perspective view of a portion of an electrical component according to an exemplary embodiment.

[0012] Figure 6 FIG. is a perspective view of a portion of an electrical component according to an exemplary embodiment.

[0013] Figure 7 FIG. is a perspective view of a portion of an electrical component according to an exemplary embodiment. DETAILED DESCRIPTION

[0014] Figure 1 FIG. shows a substrate 100 according to an exemplary embodiment. The substrate 100 includes a dielectric body 110 made of a dielectric material having a low dielectric constant (low-k: k ≤ 2.5). In an exemplary embodiment, the dielectric body 110 has a dielectric constant less than 2.0. In an exemplary embodiment, the dielectric body 110 has a dielectric constant less than 1.7. In an exemplary embodiment, the dielectric body 110 has a dielectric constant less than 1.5. The substrate 100 can be used as a part of an electrical component, such as a high-speed communication device for a high-speed communication network. The substrate 100 can hold one or more electrical conductors, such as contacts, terminals, wires, traces, or other types of electrical conductors.

[0015] The dielectric body 110 includes a polymer resin 120. The dielectric body 110 includes glass filler elements 130 embedded in the polymer resin 120. The dielectric body 110 includes air chambers 140 embedded in the polymer resin 120. The glass filler elements 130 are included in the dielectric body 110 to reduce the dielectric constant of the dielectric body 110 compared to a dielectric body 110 consisting only of the polymer resin 120. The air chambers 140 are included in the dielectric body 110 to reduce the dielectric constant of the dielectric body 110 compared to a dielectric body 110 consisting only of the polymer resin 120. The air chambers 140 are included in the dielectric body 110 to reduce the dielectric constant of the dielectric body 110 compared to a dielectric body 110 consisting only of the polymer resin 120 and the glass filler elements 130. In an exemplary embodiment, the dielectric body 110 is manufactured by a process configured to provide a two-stage reduction in dielectric constant. For example, the manufacturing process includes a first-stage reduction from embedding the glass filler elements 130 in the polymer resin 120. The manufacturing process includes a second-stage reduction from embedding the air chambers 140 in the polymer resin 120.

[0016] Polymer resin 120 is a polymeric material. The polymer resin 120 is selected based on the characteristics of the polymeric material, including the dielectric constant of the polymeric material. In an exemplary embodiment, the polymer resin 120 is a low dielectric constant material, such as a material having a dielectric constant less than or equal to 2.5. In various embodiments, the polymer resin 120 is a liquid crystal polymer (LCP) material. The polymer resin 120 may be a polyimide material. The polymer resin 120 may be a polymer nanoparticle (PNP) material. The polymer resin 120 may be a fluoropolymer material. In various embodiments, the polymer resin 120 may be a polytetrafluoroethylene (PTFE) material. The polymer resin 120 may be a polyolefin material. The polymer resin 120 may be a polymethylpentene (PMP) material. The polymer resin 120 may be a polybenzoxazole material. The polymer resin 120 may be a polyarylether material. In one exemplary embodiment, the polymer resin 120 is manufactured by an extrusion process. For example, the polymeric material may be melted and extruded. The glass filler element 130 may be added during a compounding process. The glass filler element 130 may be added to the molten polymeric material during the extrusion process. The air chamber 140 may be added during a molding process. The air chamber 140 may be formed in the molten polymeric material during the extrusion process.

[0017] The glass filler element 130 is injected, mixed, compounded, or otherwise embedded in the polymer resin 120 to reduce the dielectric constant of the dielectric 110. In an exemplary embodiment, the glass filler element 130 has a lower dielectric constant than the material of the polymer resin to effectively reduce the dielectric constant of the dielectric 110. For example, the glass filler element 130 may be filled with a gas, such as air, to reduce the dielectric constant. The glass filler element 130 occupies some volume of the dielectric 110, such as greater than 5% of the volume of the dielectric 110, to reduce the dielectric constant of the dielectric 110. In various embodiments, the glass filler element 130 occupies greater than 20% of the volume of the dielectric 110 to reduce the dielectric constant of the dielectric 110. In various embodiments, the glass filler element 130 occupies greater than 50% of the volume of the dielectric 110 to reduce the dielectric constant of the dielectric 110. The amount of the glass filler element 130 may be selected to occupy between 0% and 75% of the volume of the dielectric 110.

[0018] In an exemplary embodiment, the glass filler element 130 is a gas-filled glass filler element having an outer structure 132 that surrounds and encloses an interior 134 filled with a gas such as air. The outer structure 132 has one or more outer surfaces 136. The polymer resin 120 and / or the air chamber 140 surrounds the glass filler element 130 at the outer surface 136. In various embodiments, the glass filler element 130 is a glass bubble. In other embodiments, the glass filler element 130 is a glass flake or a glass fiber. In alternative embodiments, the glass filler element 130 is an aerogel particle. Other types of fillers such as aerogels, expanders, hollow silica, etc. may be used in alternative embodiments to reduce the dielectric constant of the dielectric 110.

[0019] In an exemplary embodiment, the glass filler elements 130 are dispersed substantially uniformly within the polymer resin 120. The glass filler elements 130 may be spaced apart from each other within the polymer resin 120. For example, the polymer resin 120 may be located between the glass filler elements 130. The air chambers 140 may be located between the glass filler elements 130, such as not attached to the glass filler elements 130 in the polymer resin 120. The glass filler elements 130 may have non-uniform shapes and / or sizes. In alternative embodiments, the glass filler elements 130 may have uniform shapes and / or sizes.

[0020] In an exemplary embodiment, the polymeric material of the dielectric 110 is a porous polymeric material. For example, pores or voids are introduced into the polymer resin 120 to reduce the dielectric constant of the dielectric 110. In an exemplary embodiment, the air chamber 140 is generated by a foaming process during the manufacture of the dielectric 110. The air chamber 140 creates voids or pores in the dielectric 110 to reduce the dielectric constant of the dielectric 110. For example, the air chamber 140 may allow air to fill a portion of the volume of the dielectric 110 to reduce the dielectric constant of the dielectric 110. In various embodiments, the air chamber 140 occupies more than 5% of the volume of the dielectric 110 to reduce the dielectric constant of the dielectric 110. In various embodiments, the air chamber 140 occupies more than 10% of the volume of the dielectric 110 to reduce the dielectric constant of the dielectric 110. The number of air chambers 140 can be selected to occupy between 0% and 15% of the volume of the dielectric 110. The number of air chambers 140 can be selected to occupy a high percentage of the volume of the dielectric 110, such as more than 50%. In some examples, the number of air chambers 140 can be selected to occupy approximately 95% of the volume of the dielectric 110. The amount of air chambers 140 added can depend on the process used to add the air chambers 140. For example, the air chambers 140 can be added by a foaming process during injection molding, and the air chambers 140 can occupy up to 30% of the volume. The air chambers 140 can be added by a foaming process during extrusion, and the air chambers can occupy up to 95%-98% (such as for polystyrene foam).

[0021] In an exemplary embodiment, the air chamber 140 is introduced into the extruded or molten polymer resin 120 by a foaming process. For example, a chemical blowing agent can be introduced into the polymer resin 120 to generate the air chamber 140. The chemical blowing agent is activated at a predetermined temperature (activation temperature), such as by introducing heat during the extrusion process, to generate the air chamber 140. The chemical agent can be introduced into the polymer resin 120 as a resin, powder, or liquid. The chemical agent can be used in a concentrated resin masterbatch. In an alternative embodiment, the foaming process can be a physical forming process by physically adding gas or bubbles to the polymer resin 120 to generate the air chamber 140. The foaming process increases the volume of the dielectric 110 per unit dimension by introducing air or other gas into the dielectric to ultimately reduce the dielectric constant of the dielectric 110. In various embodiments, a nucleating agent can be used to control the formation of the air chambers 140 in the polymer resin 120.

[0022] In an exemplary embodiment, the two-stage dielectric constant reduction achieved by introducing both the glass filler element 130 and the air chamber 140 into the polymer resin 120 can reduce the dielectric constant in the dielectric 110 by at least 10%. In some embodiments, the two-stage dielectric constant reduction achieved by introducing both the glass filler element 130 and the air chamber 140 into the polymer resin 120 can reduce the dielectric constant in the dielectric 110 by 20% or more. The two-stage dielectric constant reduction allows the use of polymer resin materials with a higher initial dielectric constant, which can allow the use of less expensive polymer resin materials as starting materials, but the glass filler element 130 and the air chamber 140 are both used to reduce the dielectric constant to the target level for high-speed electrical components. For example, the low dielectric constant of the dielectric in the dielectric 110 has a low dielectric loss to meet the dielectric performance requirements for signal transmission at high speeds (such as speeds of 224G or higher). In various embodiments, the first-stage reduction from embedding the glass filler element 130 in the polymer resin 120 can reduce the dielectric constant between 0.2 and 0.5, and the second-stage reduction from embedding the air chamber 140 in the polymer resin 120 can reduce the dielectric constant between 0.2 and 0.5, resulting in a total dielectric constant reduction between 0.4 and 1.0. For example, the polymer resin material can have a dielectric constant of approximately 2.5, and the first-stage reduction from the glass filler element 130 can reduce the dielectric constant to 2.2, and the second-stage reduction from the air chamber 140 can further reduce the dielectric constant to 1.7. In other examples, the polymer resin material can have a dielectric constant of approximately 2.5, and the first-stage reduction from the glass filler element 130 can reduce the dielectric constant to 2.0, and the second-stage reduction from the air chamber 140 can further reduce the dielectric constant to 1.7. The amount of reduction from the glass filler element 130 can depend on the type of glass filler element used, the amount (by volume) of the glass filler element used, the dielectric constant of the glass filler element used, etc. The amount of reduction from the air chamber 140 can depend on the type of process used to add the air chamber, such as the type of foaming process, the amount of foaming agent used, etc.

[0023] In an exemplary embodiment, the glass filler element 130 can form nucleation sites for the air chamber 140. For example, the air chamber 140 can be formed on the outer surface 136 of the glass filler element 130. The air chamber 140 can be attached to the glass filler element 130 in addition to being located in the space between the glass filler elements 130. The air chamber 140 is uniformly distributed throughout the polymer resin by the glass filler elements.

[0024] Figure 2 An electrical component 102 according to an exemplary embodiment is shown, which includes a substrate 100 formed of a dielectric 110. Figure 2A cross-sectional view of a part of the electrical component 102. In an exemplary embodiment, the electrical component 102 includes a substrate 100 and a conductor 200 held by the substrate 100. The substrate 100 can at least partially surround the conductor 200. For example, the substrate 100 can extend along the top and / or bottom and / or first side and / or second side of the conductor 200. The substrate 100 can separate the conductor 200 from other components (such as other conductors).

[0025] The substrate 100 can be extruded and / or injection molded into a predetermined shape for use with the electrical component 102. For example, the substrate 100 can be a housing, a holder, an organizer, a cover, a shield, or another component of the electrical component 102, which can be combined with other components to form an assembly. In an exemplary embodiment, the substrate 100 includes conductor channels 112 formed in a dielectric 110. The conductor channels 112 receive the conductors 200. The conductors 200 can be wires, contacts, terminals, traces, or another conductive component for transmitting electrical signals within the electrical component 102.

[0026] The substrate 100 can extend along the conductor channels 112, such as above and / or below the conductor channels 112 and / or along the first side and / or along the second side of the conductor channels 112. Optionally, the substrate 100 can include a plurality of conductor channels 112, with the dielectric 110 between the respective conductor channels 112. The conductor channels 112 can be arranged in one or more rows along the substrate 100. In various embodiments, the (plural) conductor channels 112 are pre-formed, and the (plural) conductors 200 are loaded into the conductor channels 112. In other various embodiments, the substrate 100 can be overmolded around the (plural) conductors 200 to form the (plural) conductor channels 112. The material of the dielectric 110 supports and / or surrounds the conductor 200. For example, a polymer resin 120, a glass filler element 130, and an air chamber 140 form the material of the dielectric 110 that supports and / or surrounds the conductor 200.

[0027] Figure 3 A process for assembling the electrical component 102 according to an exemplary embodiment is shown. The process can be performed on one or more machines 300 at one or more manufacturing locations or facilities.

[0028] The method includes a first device 320 for providing the polymer resin 120. The first device 320 can be an extruder for extruding the polymer resin. The first device 320 can heat the polymer resin 120 to a molten state.

[0029] The process includes a second device 330 for providing glass filler elements 130 in a polymer resin 120. The second device 330 embeds the glass filler elements 130 in the polymer resin, such as in a molten state. The second device 330 can be part of an extruder. The second device 330 can inject the glass filler elements 130 into the polymer resin 120. The second device 330 can mix the glass filler elements 130 and the polymer resin 120 to distribute the glass filler elements 130 uniformly in the polymer resin 120.

[0030] The method includes a third device 340 for providing air chambers 140 in a polymer resin 120. The third device can be a polymer foaming machine or device for foaming the polymer resin 120 to form the air chambers 140. The third device 340 embeds the air chambers 140 in the polymer resin, such as in a molten state. The third device 340 can be part of an extruder or an injection molding machine. The third device 340 can inject the air chambers 140 into the polymer resin 120, such as by physically adding air bubbles to the polymer resin 120. The third device 340 can inject or mix a chemical foaming agent into the polymer resin 120. The air chambers 140 can be distributed uniformly in the polymer resin 120.

[0031] The process includes a fourth device 350 for forming a dielectric as a substrate. The fourth device 350 can be an extruder for extruding the dielectric into a predetermined shape for an electrical component 102. The fourth device 350 can be an injection molding machine for injection molding the dielectric into a predetermined shape for the electrical component 102. The fourth device 350 can be a cardboard or card forming machine. The fourth device 350 can be used to form conductor channels in or on the substrate. Other types of molding machines can be used in alternative embodiments.

[0032] The process includes a fifth device 360 for positioning an electrical conductor 200 in or on the substrate. The electrical conductor 200 can be a wire, a contact, a terminal, a trace, or another type of electrical conductor for transmitting electrical signals. The electrical conductor 200 can be loaded into a conductor channel or the substrate. In other embodiments, the fifth device 360 can hold the electrical conductor 200, such as on a carrier strip, and the fourth device 350 can overmold the dielectric 110 around the electrical conductor 200.

[0033] Figure 4 Is a flowchart 400 showing a method of assembling an electrical component. The method includes one or more forming steps at 410 for forming a dielectric. The method includes one or more assembling steps at 420 for assembling an electrical conductor with the dielectric to provide an electrical component.

[0034] The forming step 410 includes the step of providing 412 a polymer resin. The polymer resin can be provided at an extruder. The polymer resin can be a low dielectric constant polymer resin. The forming step 410 includes the step of providing 414 glass filler elements in the polymer resin. The glass filler elements can be injected, mixed, compounded, or otherwise embedded in the polymer resin. The glass filler elements can be embedded in the polymer resin when the polymer resin is in a molten state. The glass filler elements reduce the dielectric constant of the dielectric, such as by being a lower dielectric constant material and / or introducing air into the polymer resin material. The forming step 410 includes the step of providing 416 air chambers in the polymer resin. In an exemplary embodiment, the air chambers are provided by a foaming process. The air chambers can be added by a chemical foaming process or a physical foaming process. The air chambers introduce gas or air into the polymer resin material. The air chambers are formed in the polymer resin when the polymer resin is in a molten state. Optionally, the foaming process occurs after the glass filler elements are added to the polymer resin. The glass filler elements can form nucleation sites for the air chambers. For example, the air chambers can be formed on the outer surface of the glass filler elements. The air chambers are uniformly distributed throughout the polymer resin by the glass filler elements. The air chambers reduce the dielectric constant of the dielectric, for example, by introducing air into the polymer resin material.

[0035] The assembling step 420 includes the step of forming 422 a substrate using the dielectric, the dielectric including the polymer resin, the glass filler elements, and the air chambers. The substrate can be formed into a predetermined shape, for example, by an extruder or an injection molding machine. The forming step 422 can include forming one or more conductor channels in the substrate. The assembling step 420 includes the step of positioning 424 an electrical conductor in or on the substrate. The electrical conductor can be a wire, a contact, a terminal, a trace, or another type of electrical conductor located in or on the substrate. The electrical conductor is assembled with the substrate to form an electrical component.

[0036] Figure 5 is a perspective view of a portion of an electrical component 102a according to an exemplary embodiment. The electrical component 102a includes a substrate 100a that holds a conductor 200a. The conductor 200a is a wire of a cable, such as a coaxial cable. The substrate 100a is a conductor holder molded into a predetermined shape to support the conductor 200a at the end of the cable for termination to a circuit board. The substrate 100a is made of a dielectric 110 that includes a polymer resin 120, glass filler elements 130, and air chambers 140 (as Figure 1 shown). The substrate 100a includes a conductor channel 112a that holds the conductor 200a. The dielectric 110 surrounds portions of the conductor 200a, such as the bottom and sides of the wire, to position the wire and isolate the wire from each other and from a shielding element.

[0037] Figure 6is a perspective view of a portion of an electrical component 102b according to an exemplary embodiment. The electrical component 102b includes a substrate 100b that holds a conductor 200b. The conductor 200b includes contacts and leads of a cable. The contacts are configured to be soldered to the leads to electrically connect the leads to a circuit board. The substrate 100b is a conductor holder molded into a predetermined shape to support the contacts and / or leads. The substrate 100b is made of a dielectric 110 that includes a polymer resin 120, glass filler elements 130, and air chambers 140 (as Figure 1 shown). The substrate 100b includes conductor channels 112b that hold the conductor 200b. For example, the dielectric 110 may be overmolded onto the contacts and include slots or channels that receive ends of the leads. The dielectric 110 surrounds portions of the conductor 200b to position the leads relative to one another and isolate them from each other and from shielding elements.

[0038] Figure 7 is a perspective view of a portion of an electrical component 102c according to an exemplary embodiment. The electrical component 102c is a card-edge connector. The electrical component 102c includes a housing and a contact holder of a substrate 100c that defines a conductor 200c. The conductor 200c is a contact configured to terminate to a circuit board and to mate with a pluggable module, such as an I / O module. The substrate 100c may be a molded part. For example, the substrate 100c may include one or more contact holders overmolded over the contacts. The substrate 100c may include the housing of the card-edge connector. The substrate 100c is made of a dielectric 110 that includes a polymer resin 120, glass filler elements 130, and air chambers 140 ( Figure 1 shown in). The substrate 100c includes conductor channels 112c that hold the conductor 200c. The dielectric 110 surrounds portions of the conductor 200c, such as the top, bottom, and sides of the contacts, to position the contacts and isolate them from each other.

Claims

1. A method of assembling an electrical component (102), the method comprising: Providing a dielectric (110) configured to support an electrical conductor (200), the dielectric including a polymer resin (120), the dielectric including glass filler elements (130) embedded in the polymer resin, and the dielectric including air chambers (140) embedded in the polymer resin.

2. The method according to claim 1, further comprising at least one of: providing an electrical conductor (200) on the dielectric (110) and providing an electrical conductor (200) in the dielectric (110).

3. The method according to claim 1, wherein the glass filler elements (130) are gas-filled glass filler elements.

4. The method according to claim 1, wherein the dielectric (110) has a two-stage dielectric constant reduction, wherein the first stage reduction results from embedding the glass filler elements (130) in the polymer resin (120), and the second stage reduction results from embedding the air chambers (140) in the polymer resin.

5. The method according to claim 1, wherein the air chambers (140) are attached to the glass filler elements (130) in the polymer resin (120).

6. The method according to claim 1, wherein the glass filler elements (130) form nucleation sites for the air chambers (140) to evenly distribute the air chambers throughout the polymer resin (120).

7. The method according to claim 1, wherein the air chambers (140) are provided in the dielectric (110) by a foaming process.

8. The method according to claim 1, wherein the air chambers (140) are provided in the dielectric (110) using a chemical blowing agent.

9. The method according to claim 1, wherein the air chambers (140) are provided in the dielectric (110) using a physical blowing agent.

10. The method according to claim 1, wherein providing the dielectric (110) includes injection molding the dielectric.

11. The method according to claim 1, wherein providing the dielectric (110) includes extruding the dielectric.

12. The method according to claim 1, further comprising forming conductor channels (112) in the dielectric (110).

13. The method according to claim 12, further comprising positioning an electrical conductor (200) in the conductor channels.

14. The method according to claim 1, wherein the glass filler elements (130) occupy at least 5% of the volume of the dielectric (110), and the air chambers (140) occupy at least 5% of the volume of the dielectric.

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