Control panel structure and superconducting quantum computer
By introducing the superstructure design of circuit board dielectric layer, through-hole and shield hole into the superconducting quantum computer control board structure, the problems of easy shedding and high cost of the hot balls are solved, and higher welding quality and reliability are achieved, and the integration is improved.
Patent Information
- Application Number
- CN202510552088.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2025-07-11
AI Technical Summary
The existing superconducting quantum computer control board structure is prone to fall off and deform when the soldering ball is soldered. The manufacturing cost is high when the soldering pad is soldered, and the through holes is difficult to process, and the product yield is low.
The overlapping design is adopted, including a support plate, an intermediate layer and an integrated board. The intermediate layer is a circuit board dielectric layer, and is provided with through holes and shielding holes, and is connected through the first pad. The intermediate layer provides support force to stabilize the integrated board, reduce high-frequency signal transmission losses, and improve signal isolation.
It improves welding quality, reduces processing costs, improves product quality and reliability, improves integration, and increases welding yield by at least 20%.
Smart Images
Figure CN120302873A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of superconducting quantum computers, and particularly to a control board structure and a superconducting quantum computer. Background Art
[0002] Quantum computing is a new computing system based on the principle of coherent superposition of quantum mechanics, with superior performance beyond traditional computing systems. Superconducting quantum computing has received extensive attention due to its potential in scale scalability. The main structures of a superconducting quantum computer include superconducting qubits, a superconducting control system, an operating system and software system of the quantum computer, etc. The more qubits a quantum computer has, the stronger its computing power. However, the more qubits there are, the more ports there will be on the control system board.
[0003] In order to implement qubits in a superconducting state, it needs to operate in an ultra-low temperature environment. In this case, the more connectors and wires there are, the greater the stress generated and the more complex the stress distribution. Whether the encapsulation carrier board material (such as glass / silicon-based / epoxy / hydrocarbon) can withstand this stress in an ultra-low temperature environment becomes a challenge. In a conventional bump fan-out POP (Package on Package) stacking structure, chips usually adopt two welding methods. Refer to Figure 1 One is the welding method using solder balls 300'. The chip 500' is welded to the carrier board 200' through the solder balls 300', and the carrier board 200' and the support board 100' are welded and connected through the solder balls 300'. The other is the welding method using pads 700'. Refer to Figure 2 The chip 500' is welded to the carrier board 200' or the support board 100' through the pads 700', and the carrier board 200' and the support board 100' are interconnected through the TSV holes 400' (Through Silicon Via) technology on the solder balls 300' and the silicon substrate 600'.
[0004] For the POP structure board using the solder ball welding method, the height of the devices mounted on the carrier board and the support board is affected by the height of the solder balls, resulting in limited mounting height. And when a certain weight is borne on the board surface, deformation will occur, and there are reliability risks of solder ball detachment and deformation during welding or after assembly. For the POP structure board using the pad welding method, the manufacturing costs of the silicon substrate and the TSV are relatively high, and the processing of vias is difficult with low yield. Summary of the Invention
[0005] The object of the present invention is to provide a control board structure and a superconducting quantum computer, aiming to solve the problems that when the existing control board structure adopts the solder ball welding method, the solder balls are easy to fall off and deform, and when the pad welding method is adopted, the manufacturing cost is high, the via hole processing is difficult, and the product yield is low. The control board structure and the superconducting quantum computer effectively improve the welding quality and reduce the processing cost through the stacked structure design.
[0006] To achieve this object, the present invention adopts the following technical solutions:
[0007] A control board structure, comprising:
[0008] A support board;
[0009] An intermediate layer, arranged above the support board, the intermediate layer is set as a circuit board dielectric layer, and a plurality of hole groups are arranged on the intermediate layer. Each hole group includes a via hole and a shielding hole penetrating the upper and lower surfaces of the intermediate layer. There are a plurality of shielding holes, and the plurality of shielding holes are arranged around the periphery of the via hole. The via hole and the shielding hole are both connected to the support board through a first pad;
[0010] An integrated board, arranged above the intermediate layer, the integrated board is connected to the via hole and the integrated board is connected to the shielding hole through a first pad.
[0011] In some possible implementation manners, the intermediate layer is set as an annular structure, and the control board structure further includes a first chip, and the first chip is arranged on the bottom surface of the integrated board and received in the middle hole of the annular structure.
[0012] In some possible implementation manners, the annular structure is set as a circular annular structure or a square annular structure.
[0013] In some possible implementation manners, the control board structure further includes a second chip and a plurality of devices arranged on the top surface of the integrated board. The plurality of devices are spaced outside the second chip, and the second chip is welded to the integrated board through solder balls or pads.
[0014] In some possible implementation manners, the first chip is welded to the integrated board through solder balls or pads.
[0015] In some possible implementation manners, the via hole and the plurality of shielding holes of each hole group form a plum blossom structure.
[0016] In some possible implementation manners, each hole group includes one via hole and six shielding holes spaced around the periphery of the via hole.
[0017] In some possible implementation manners, an anti-damage layer is arranged on the bottom surface of the support board.
[0018] In some possible embodiments, the anti-damage layer is set as a copper layer.
[0019] The superconducting quantum computer provided by the present invention includes a control board structure as described in any of the above solutions.
[0020] Advantages of the present invention: For the control board structure of the present invention, by setting the intermediate layer as a circuit board dielectric layer, it is convenient to regulate the thickness of the intermediate layer, which is not affected by the height of the solder balls, so that the mounting height can be adjusted according to requirements, and it is also convenient for processing vias and shielding holes; each hole group includes a via and a shielding hole that penetrate the upper and lower surfaces of the intermediate layer, and a plurality of shielding holes are arranged around the via. This kind of setting is beneficial to ensuring the requirements for signal isolation and signal integrity, and is beneficial to reducing high-frequency signal transmission loss; when a large number of devices are installed on the integrated board, due to the setting of the intermediate layer, the intermediate layer can provide a certain supporting force for the integrated board, making the integrated board not easily deformed and improving the product quality.
[0021] The superconducting quantum computer provided by the present invention includes the above control board structure. By setting the above control board structure, the integrated board of the superconducting quantum computer can carry more devices, improving the integration degree, and the setting of the intermediate layer improves the use reliability of the superconducting quantum computer. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 is a conventional concave-convex fan-out POP stacking structure using a solder ball welding method in the prior art;
[0023] Figure 2 is an unconventional concave-convex fan-out POP stacking structure using a pad welding method in the prior art;
[0024] Figure 3 is a schematic structural diagram of the control board structure provided by an embodiment of the present invention;
[0025] Figure 4 is a top view of the intermediate layer provided by an embodiment of the present invention;
[0026] Figure 5 is a schematic structural diagram when the connecting member is a coaxial cable provided by an embodiment of the present invention.
[0027] In the figure:
[0028] 100’, support plate; 200’, carrier plate; 300’, solder ball; 400’, TSV hole; 500’, chip; 600’, silicon substrate; 700’, pad;
[0029] 100, Support plate; 200, Intermediate layer; 211, Via hole; 212, Shielding hole; 300, Integrated board; 400, First chip; 500, Second chip; 600, Device; 700, First pad; 800, Solder ball; 900, Connector. Detailed implementation manner
[0030] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.
[0031] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include that the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.
[0033] In the description of this embodiment, the orientation or positional relationship such as "above", "below", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] This embodiment provides a control board structure and a superconducting quantum computer, aiming to solve the problems that when the existing control board structure uses the solder ball welding method, the solder balls are prone to falling off and deforming, and when using the pad welding method, the manufacturing cost is high, the via holes are difficult to process, and the product yield is low. The control board structure and the superconducting quantum computer effectively improve the welding quality and reduce the processing cost through the stacked structure design.
[0035] As Figure 3 and Figure 4 shown, the control board structure includes a support board 100, an intermediate layer 200, and an integrated board 300. The support board 100 is mainly used to carry the connected lines (such as optical fibers or coaxial cables). The intermediate layer 200 is disposed above the support board 100, and the intermediate layer 200 is set as a circuit board dielectric layer. Optionally, the circuit board dielectric layer is set as a circuit board material, and its main material is an epoxy resin system material. For example, it can be set as an FR-4 board. In other embodiments, the material of the intermediate layer 200 can also be set as other circuit board materials according to needs, such as high-frequency and high-speed PTFE materials or hydrocarbon materials. A plurality of hole groups are provided on the intermediate layer 200, and each hole group includes a via hole 211 and a shielding hole 212 that penetrate the upper and lower surfaces of the intermediate layer 200. There are a plurality of shielding holes 212, and the plurality of shielding holes 212 are arranged around the periphery of the via hole 211. The via hole 211 and the shielding hole 212 are both connected to the support board 100 through a first pad 700; the integrated board 300 is disposed above the intermediate layer 200, and the integrated board 300 is connected to the via hole 211 and the integrated board 300 is connected to the shielding hole 212 through the first pad 700.
[0036] For the above control board structure, by setting the intermediate layer 200 as a circuit board dielectric layer, it is convenient to adjust the thickness of the intermediate layer 200, which is not affected by the height of the solder balls 800, so that the mounting height can be adjusted according to requirements, and it is also convenient to process the via holes 211 and the shielding holes 212; each hole group includes a via hole 211 and a shielding hole 212 that penetrate the upper and lower surfaces of the intermediate layer 200, and a plurality of shielding holes 212 are arranged around the periphery of the via hole 211. This setting is beneficial to ensuring the requirements for signal isolation and signal integrity, and is beneficial to reducing the high-frequency signal transmission loss; when a large number of devices 600 are installed on the integrated board 300, due to the setting of the intermediate layer 200, the intermediate layer 200 can provide a certain supporting force for the integrated board 300, so that the integrated board 300 is not easily deformed, improving the product quality; the control board structure improves the welding process yield by at least 20%; the via hole 211 and the shielding hole 212 are both welded to the support board 100 through the first pad 700, and the via hole 211 and the shielding hole 212 are both welded to the integrated board 300 through the first pad 700. Compared with the solder ball 800 welding, the first pad 700 welding also makes the thickness of the intermediate layer 200 not affected by the height of the solder balls 800, and when welding with the first pad 700, the operation is simple and the welding effect is stable.
[0037] Optionally, an anti-damage layer is provided on the bottom surface of the support plate 100. Connectors 900 are usually installed on the bottom surface of the support plate 100. By providing the anti-damage layer, the complex stress generated by the connectors 900 can be prevented from damaging the support plate 100. Exemplarily, the anti-damage layer can be set as a copper layer, and the thickness of the copper layer can be set to 40μm - 60μm. Additionally, the material of the support plate 100 can be set as a material with relatively high strength, such as high-strength steel plate or high-strength aluminum plate, etc. Optionally, the connectors 900 can be devices, coaxial cables or optical fibers. Refer to Figure 5 , Figure 5 the schematic structural diagram when the connector 900 in
[0038] Preferably, the intermediate layer 200 is arranged in an annular structure. The control board structure further includes a first chip 400, and the first chip 400 is arranged on the bottom surface of the integrated board 300 and received in the intermediate hole of the annular structure. With such an arrangement, the setting of the intermediate layer 200 does not affect the installation of the first chip 400. Additionally, since the first chip 400 is received in the intermediate hole of the annular structure, the intermediate layer 200 can prevent the first chip 400 from being damaged by the outside and play a protective role. Optionally, the annular structure is set as a circular ring structure or a square ring structure. In other embodiments, the intermediate layer 200 can also be set as an annular structure with other regular shapes or irregular shapes, or can also be set as a combination of multiple smaller annular structures, or can also be set as a solid block structure, which can be set according to needs.
[0039] In this embodiment, the via holes 211 and multiple shielding holes 212 of each hole group of the intermediate layer 200 form a plum blossom shape structure. The multiple shielding holes 212 are arranged around the circumference of the via hole 211, which improves the signal isolation effect. Secondly, being arranged in a plum blossom shape structure can also improve the aesthetic degree. Refer to Figure 4 , each hole group of this embodiment includes one via hole 211 and six shielding holes 212 spaced around the via hole 211. In other embodiments, the specific numbers of the via holes 211 and the shielding holes 212 can be set according to requirements.
[0040] In this embodiment, the first chip 400 and the integrated board 300 are welded by solder balls 800 or pads. During actual assembly, the specific welding method can be selected according to needs. Optionally, the control board structure further includes a second chip 500 and several devices 600 arranged on the top surface of the integrated board 300. The several devices 600 are spaced outside the second chip 500. The second chip 500 and the integrated board 300 are welded by solder balls 800 or pads. During actual assembly, the specific welding method can be selected according to needs.
[0041] In actual implementation, the integrated board 300 can be set as a high-integration board, that is, a high-density circuit board or a carrier board, so as to facilitate the completion of complex circuit connections. A high-integration board usually integrates multiple hardware modules together, including system components such as a processor, a memory, a storage, and an input / output interface.
[0042] The superconducting quantum computer provided by this embodiment includes the above control board structure. By setting the above control board structure, the integrated board 300 of the superconducting quantum computer can carry more devices 600, improving the integration degree. Moreover, the setting of the intermediate layer 200 improves the reliability of use of the superconducting quantum computer.
[0043] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. A control board structure, characterized in that, Comprising: Support plate (100); Intermediate layer (200), disposed above the support plate (100), the intermediate layer (200) is set as a circuit board dielectric layer, a plurality of hole groups are provided on the intermediate layer (200), each of the hole groups includes a via hole (211) penetrating the upper and lower surfaces of the intermediate layer (200) and shielding holes (212), there are a plurality of the shielding holes (212), and the plurality of shielding holes (212) are arranged around the periphery of the via hole (211), and both the via hole (211) and the shielding holes (212) are connected to the support plate (100) through a first pad (700); Integrated board (300), disposed above the intermediate layer (200), the integrated board (300) is connected to the via hole (211) and the integrated board (300) is connected to the shielding holes (212) through a first pad (700).
2. The control board structure according to claim 1, wherein, The intermediate layer (200) is set as an annular structure, and the control board structure further includes a first chip (400), and the first chip (400) is disposed on the bottom surface of the integrated board (300) and received in the middle hole of the annular structure.
3. The control board structure according to claim 2, wherein, The annular structure is set as a circular annular structure or a square annular structure.
4. The control board structure according to claim 2, characterized in that, The control board structure further includes a second chip (500) disposed on the top surface of the integrated board (300) and several devices (600), and the several devices (600) are spaced outside the second chip (500), and the second chip (500) is welded to the integrated board (300) through solder balls (800) or pads.
5. The control board structure according to claim 2, characterized in that, The first chip (400) is welded to the integrated board (300) through solder balls (800) or pads.
6. The control board structure according to any one of claims 1-5, characterized in that, The via hole (211) of each hole group and the plurality of shielding holes (212) form a plum blossom structure.
7. The control board structure according to claim 6, characterized in that, Each hole group includes one via hole (211) and six shielding holes (212) spaced around the periphery of the via hole (211).
8. The control board structure according to any one of claims 1-5, characterized in that, The bottom surface of the support plate (100) is provided with an anti-damage layer.
9. The control board structure according to claim 8, wherein, The anti-damage layer is set as a copper layer.
10. A superconducting quantum computer, characterized in that, Including the control board structure according to any one of claims 1-9.