System and method for monitoring changes in a structure

Abstract

A system and method for monitoring changes in a structure using a deformation measurement device capable of measuring three-dimensional position changes and wirelessly communicating with an external device. The deformation measuring device has a plurality of magnetic field sensors capable of detecting changes in a magnetic field experienced by the sensors and generated by individually mounted magnets, and located on a structure at a predetermined distance from the sensors. Optionally, any change in the direction of the tilt measuring device may be detected using the tilt measuring device having one or more high or low precision accelerometers, and three-dimensional changes in that direction may be detected and measured. Another version of the system includes a high frequency microphone and / or a low frequency microphone coupled with a target magnet suspended in three dimensions from a damping element, which may be used on a structure or on the ground to detect and analyze seismic activity.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority of U.S. Provisional Application No. 63416314, filed on October 14, 2022. The content of the U.S. Provisional Application No. 63416314, filed on October 14, 2022, is hereby incorporated by reference in its entirety. Technical field

[0003] This disclosure pertains to the technical field of engineering and / or construction equipment. More specifically, this disclosure relates to a system for remotely monitoring changes in defects (such as gaps, cracks, or fractures) in a structure. Background art

[0004] Engineers have developed tools to help them monitor the condition of structures over time. This is useful in situations where it is important to monitor the damage to a building or other structure over time or during a specific event or series of events. For example, workers performing construction, repair, or demolition work on or near a cracked wall or other structure may need to monitor the condition of the crack while working on or near the wall or structure to detect whether the crack becomes more severe during the work. Similarly, if they are attempting to repair a crack in a wall, they will need to monitor the crack during the work. Also, many structures (such as bridges) require long - term monitoring. Currently, divers need to be sent underwater to assess and measure the ongoing damage to a bridge to monitor its safety and develop maintenance and repair plans. Therefore, there is a need in the art for a device or system that can be used for long - term remote monitoring of the condition of bridges.

[0005] Deformation measuring devices are tools commonly used to measure or monitor changes in cracks in the foundation, walls, or masonry of a structure. For example, a device sometimes referred to as a "wire - wound potentiometer" measuring device uses a steel wire rope connected to a movable object (such as a portion of a wall on one side of a crack). The rest of the device is placed on the other side of the crack and is capable of measuring the tension or slack in the wire rope. The movement of the wire rope can be detected by a plurality of conventional devices based on the movement of the wire rope relative to the rest of the device. However, this type of device does not break down the movement of the wall into x, y, and z vectors, but rather produces an overall measurement of the movement in three directions. Therefore, the measurements produced by this device are rather inaccurate.

[0006] Another type of deformation measurement device is to attach two overlapping pieces of plexiglass or similar translucent material to both sides of a crack in a wall. The movement between the two pieces of plexiglass is detected by printing scales on the plexiglass or other means. When the crack moves, the plexiglass blocks move relative to each other and produce readings that can be manually read. This type of measurement device can detect movement on two planes, but not on three planes, and requires a technician to manually inspect the measurement device to read the readings. These readings are susceptible to human error, and the two pieces of plexiglass produce a parallax effect, which interferes with accurate measurement.

[0007] There are also other devices on the market that cannot make up for the above-mentioned shortcomings. For example, a hydraulic strain gauge is designed very much like a typical syringe. A larger piston is connected to an object that may move, and this movement causes fluid to move from a larger tube to a smaller tube, where the applied pressure can be measured (possibly by a Bourdon tube). These devices can detect very small movements well, but cannot be used to detect movement between two different structures.

[0008] The engineering field urgently needs a device and a method of using the same that can allow people to measure the three-dimensional movement of structures near defects in walls or other structures and can transmit data to remote users or devices. Summary of the Invention

[0009] Technical Problem

[0010] The present invention is a method for monitoring changes or movements in a structure. More specifically, the present disclosure details a device and a method of using the device to monitor three-dimensional position changes between multiple structures or parts of the same structure. More specifically, the inventors have developed a new type of deformation measurement device to monitor changes in a physical structure over time. The deformation measurement device used in this method is capable of resolving the movement of a structure in three dimensions rather than one or two dimensions. In addition, it does not require a technician to personally view the deformation measurement device to read the readings. In addition, the deformation measurement device is capable of uploading the readings to a separate device or storing the readings on an internal storage device, and can save them even if the measurement device itself malfunctions or loses power. The method may optionally involve using an inclinometer to enhance the readings of the deformation measurement device.

[0011] Definitions

[0012] Substantially - "substantially" in the present disclosure means within 10 degrees or 10% of the measured value or direction.

[0013] Having means that the structure includes, is attached to, integrated into, located in, or physically contacts another structure.

[0014] Solution to the Problem

[0015] The preferred embodiments of the deformation measurement device described herein and the best mode contemplated by the inventors have two independent parts - a target and a sensor array. The target includes a magnet, which is preferably housed in a housing made of a material that does not interfere with the magnetic field of the magnet. The sensor array includes a circuit board having a plurality of magnetic field sensors (e.g., Hall effect sensors) that are capable of sensing changes in the magnetic field and are preferably contained within a housing or body. The sensor array is used to sample the magnetic field of the magnet from multiple positions to accurately determine the three-dimensional position of the sensor array relative to the target magnet.

[0016] The Hall effect refers to the generation of an electric potential difference or voltage in a current-carrying conductor when the conductor is exposed to a magnetic field. Generally, the effect is strongest when the magnetic field is perpendicular to the flow of charge or current in the conductor. When a current flows through a conductor (usually a semiconductor), the current is exposed to the magnetic field, which deflects the charge carriers sufficiently to generate an electric potential difference. The change in voltage is a direct function of the magnetic field source and can be used to determine the strength and direction of the magnetic field source. When the magnetic field strength generated by a magnet is known and the starting position of the magnet relative to the sensor is known, the measurements of a Hall effect sensor can be used to measure the change in position between the sensor and the magnet. Repeated measurements of the change in voltage can be used to "map" or analyze the magnetic field at different points relative to the magnet and the sensor. This data can be used to detect changes in the magnetic field, which typically occur when there is a change in position or movement between the magnet and the conductor. Thus, when the target moves relative to the sensor, the changes in voltage detected by three Hall effect sensors can be used to calculate the distance and direction of movement of the target, and vice versa. This phenomenon can be used to monitor physical positions and thus monitor the condition of physical structures (such as support beams, piles, or walls) over time. This phenomenon can also be used to measure vibrations or minute movements in natural structures and formations. These field sensors detect changes in the exciting current using the Hall effect through coils that are operatively connected to silicon. Different orientations of the coils in the sensor provide different measurement axes. Multiple magnetic sensors located in different planes can be used to detect and calculate multi-dimensional movements between the sensor and the target magnet.

[0017] The Hall effect or "magnetic field" sensors are capable of detecting changes in the position of the sensor array, thereby detecting three-dimensional position changes of the deformation measurement device, and transmitting this data to a microprocessor that processes and filters the data to generate position data describing the position of the target magnet and the position changes between the target magnet and the sensor array.

[0018] The accuracy of the Hall effect sensor measurement is affected by its positioning. A preferred embodiment of the device includes a sensor array, which includes three Hall effect sensors located on a programmed circuit board such that all three sensors are in a single plane. If the plane is perpendicular or substantially perpendicular to the polar axis of the magnet (i.e., the target magnet) that the target has, the sensors can make more accurate measurements. When the polar axis of the magnet also intersects the center of the triangle formed by the sensors in the plane, the accuracy can be further improved.

[0019] When manufacturing the measurement device, the magnetic field is "mapped" or measured at various points in the space around the magnet. The higher the resolution, that is, the more magnetic field points are mapped, the more accurate the measurement results generated by using the device. After knowing the shape of the magnetic field, a table showing the interpolation between the magnetic field measurement points can be created.

[0020] When the device is in use, the magnetic sensors make multiple measurements of the magnetic field in three dimensions (x, y, and z axes 1 )). There will be a certain degree of error in the individual measurement readings of the sensors. The sensors themselves have an inherent error / noise level. Additional noise may come from transient environmental factors. Therefore, instead of making a single measurement, the magnetic field sensors make hundreds of measurements within a fraction of a second and then calculate the average of these measurement values to reduce the errors or noise that may occur in a single or a small number of measurements. The measurement results are sampled by an analog-to-digital converter and then transmitted in digital form to a microprocessor. Then the generated values are compared with the information generated when initially mapping the magnetic field of the magnet to obtain the position of the magnet in the coordinate system shared with the magnetic field sensor. Then this measurement value is compared with the initial measurement value to reveal the change in the position of the magnet in the target relative to the magnetic field sensor, indicating that some movement has occurred between the target and the sensor housing. Then, the measurement results can be transmitted to a separate processor or receiver capable of storing and / or displaying data. In this way, if the deformation measurement device loses power or is damaged, the data collected and calculated by the deformation measurement device can be safely stored in another location. Other versions of the device include internal memory for storing the same data in case of power failure or other problems that cause data transmission failure.

[0021] The data collected and calculated by the deformation measurement device can be safely stored in another location. Other versions of the device include internal memory for storing the same data in case of power failure or other problems that cause data transmission failure.

[0022] Before the device is put into use, it is necessary to calculate the optimal distance between the target magnet and the sensor array. If the sensor array is too close to the target magnet, the Hall effect sensors will saturate due to the magnetic field of the target magnet, making it impossible to detect changes in the magnetic field. If the target magnet is too far from the sensor array, the readings generated by the magnetic field sensors will be inaccurate. Using a process similar to the original mapping program, calculate the optimal distance between the target magnet and the magnetic field sensor array. The positioning of the magnetic field sensors and the distance from each sensor to the magnet are estimated using the following formula. Repeat the measurements within a certain temperature and time range to characterize the magnetic field changes caused by these factors. Then create a mathematical model to represent the field, time, and temperature at the physical location. Using the known spatial relationships between the sensors and the initial estimate of the target magnet's position, use the gradient descent algorithm to find the magnet position that best satisfies the distance estimate.

[0023] Distance = (f * r) / 2.0

[0024] Where:

[0025] m = sqrt(mx2 + my2 + mz2)

[0026] k = m * 3.0 / 2000.0

[0027] r = m0.25 / k

[0028] f = 8.0 – (0.93 * sqrt(r))

[0029] Therefore, in use, the sensor housing is placed at a certain distance from the target.

[0030] By using magnets with different magnetic field intensities, the effective distance of the system can be increased or decreased. The larger the size of the MEMs element, the better its ability to characterize the performance varying with temperature, the higher the sensitivity of the capacitance measurement, and the better the temperature correction curve - the better the measurement resolution and accuracy.

[0031] In use, the brackets of each component of the deformation measurement device are mounted on the monitored surface, and then the actual components are attached to the brackets. First, determine the installation distance required for installation. The user identifies cracks or gaps in the structure to be detected. The user determines the spacing of the components by measuring the width of the crack or gap and adding the preset distance to this measurement based on the optimal position of the target magnet detailed above.

[0032] The sensor bracket includes a sliding structure or a tongue, which is attached to both the sensor bracket and the target bracket. Once the distance between the target bracket and the sensor bracket is determined, the tongue can be extended to the desired length to set the relative positions of the sensor and the target, where the tongue slides into engagement with the sensor bracket and is attached to the target bracket at one end. The tongue is then temporarily clamped in place by two small screws that tighten a floating plastic protrusion onto the tongue on the sensor bracket. Once the adhesive has cured or the brackets are firmly installed, the tongue can be released and retracted into the body of the sensor bracket. The user will then use a conventional adhesive to fix the bracket to the cracked / deformed structure. The sensor housing and the target housing are then (possibly using conventional fasteners such as screws) mounted on their respective brackets. Once the sensor housing and the target housing are firmly attached to their respective brackets, the measuring device can be used to monitor the movement of the walls on either side of the crack.

[0033] This method can be enhanced by using an inclinometer. The inclinometer uses one or more MEMS accelerometers to measure the acceleration due to gravity in three directions, enabling the device to detect "tilt" or any change in the orientation of the structure relative to the gravity source (the Earth). The deformation measuring device measures the movement of the target magnet relative to the sensor array, while the inclinometer measures the movement of the accelerometer relative to gravity. The two sets of data sets can be combined to make very precise and very accurate measurements of the movement of one or more attached objects. The process of sampling and filtering / processing the data from the accelerometers is generally the same as that described above for the magnetic field sensors. The accelerometers make hundreds of measurements within a fraction of a second and then calculate the average of these measurements to reduce errors or noise that may occur in single or a small number of measurements. The measurement results are sampled by an analog-to-digital converter and then transmitted in digital form to a microprocessor. The processor is enabled by software and is configured to interpret the data from the accelerometers, magnetic field sensors, and any other components to (a) calculate and subtract errors, and (b) calculate the position of the relevant sensors relative to the target magnet or relative to the Earth's gravitational field (i.e., the ground).

[0034] The inclinometer can use more than one accelerometer, a combination of accelerometers and gyroscopes, and / or a combination of low-precision and high-precision accelerometers. One or more low-precision accelerometers can be sampled simultaneously with high-precision accelerometers to detect and thus filter out unwanted high-frequency vibrations from Hall effect sensors and high-precision accelerometers and / or any other system components.

[0035] The initial embodiment of the system employed a strain measurement device physically separated from the tilt measurement device. Updated versions of the system include a single device or housing that includes a sensor array and target of the strain measurement device and an accelerometer of the tilt measurement device.

[0036] Mems accelerometers and Hall effect sensors typically use components whose performance is affected by temperature variations. When the ambient temperature changes, the characteristic frequencies and scale factors of the sensing elements shift, causing measurement errors. The application of this system involves subjecting system components to extreme conditions.

[0037] In addition, temperature also affects magnetic field strength. When the temperature of a magnet decreases, the magnetic field it generates becomes stronger, while when the temperature of the magnet increases, its magnetic field becomes weaker until the magnet is heated enough to lose its magnetism. The degree of influence of temperature changes on the magnetic field strength of a magnet of known composition can be calculated.

[0038] Accordingly, some versions of the system will include one or more temperature sensors operably connected to the Hall effect sensor, mems accelerometer, and / or other components of the system. Thus, the "noise" or variations in magnetic field strength due to temperature can be calculated and subtracted from the measurements of the magnetic field sensor.

[0039] Other variants of the system are specifically configured to detect vibrations and can be used to monitor seismic activity. In some applications, the target magnet is suspended or supported three-dimensionally by springs and / or other damping mechanisms to detect finer movements. Other applications also include a low-frequency microphone that is used to detect additional reference data at frequencies generated within an appropriate bandpass range. The system can be used to detect seismic vibrations on or in the ground, or to detect how vibrations generated by seismic activity on structures such as buildings cause the buildings to vibrate. Since one or more system components (magnetic sensors, accelerometers, target magnets, etc.) are suspended by mounting springs and / or other damping elements and are independent of the housing vibrations, one or more system components effectively act as low-mass blocks for detecting the vibrations of the entire device. These frequencies can be used to filter seismic vibrations as noise in displacement measurements, and to filter seismic vibrations as a separate movement frequency band of the entire reference frame to which the sensors and target are attached. Bandpass filtering can be performed on data from the accelerometer and magnetic sensor arrays to eliminate low-frequency variations in position, thereby highlighting data of high-frequency movements to detect and analyze short-frequency seismic vibrations due to changes in position relative to the accelerometer and / or magnetic sensor arrays. If the microphone is coupled to the housing through a pressure vent, the microphone can also detect changes in air pressure that occur during an earthquake.

[0040] These devices are capable of wireless communication with a third device or a group of devices, which include devices for processing information from the measuring device and presenting it to the end user, as well as storing the information for later retrieval. Some applications may use wireless modulation techniques (such as LoRa) to transmit data. Therefore, the inventors have created a system or method using a new type of deformation measuring device, which can optionally be used in combination with (either separately or integrated) an inclination measuring device to monitor the change in the position of a structure over time. This system can generate more accurate data than previous devices and methods, and requires minimal human intervention.

[0041] Advantages of the present invention

[0042] In a broad embodiment, the present invention is a system for remotely monitoring the condition of a structure. The advantages of the present invention include, but are not limited to, the ability to remotely monitor the change in cracks or gaps in a structure over time or in response to a specific event, without observing the measuring device or without a technician physically inspecting the measuring device. In addition, this method allows the user to monitor the change in cracks or gaps or the three-dimensional (not just one-dimensional or two-dimensional) movement of the structure. Furthermore, the method of the present invention incorporates an inclination measuring device, enabling the user to measure not only the change in the structure gap but also the orientation of the structure relative to the ground. Engineers and technicians working on buildings, walls, or bridges can remotely monitor the impact of their work on the gaps or cracks in the structure and / or the three-dimensional inclination or movement of the structure. In addition, various versions of the system can be used to detect vibrations, thus can be used as a seismograph, calculate the change in the position of the sensor due to vibrations caused by seismic events, and then transfer the data to another component / position. Description of the drawings

[0043] Figure 1 is a perspective view of the deformation measuring device used in the first embodiment of the system;

[0044] Figure 2A is a perspective view with half of the cover or housing removed;

[0045] Figure 2B is a perspective view of the target housing after the magnet is removed;

[0046] Figure 2C is a cross-sectional view of the target;

[0047] Figure 3 is a top view of the circuit board with Hall effect sensors;

[0048] Figure 4A is along Figure 4B the side sectional view of the target housing and the sensor housing cut along the line B-B shown;

[0049] Figure 4B is its top view;

[0050] Figure 4C is its top sectional view;

[0051] Figure 4D is its side view;

[0052] Figure 5A shows a perspective view of an inclination measuring device that can be integrated into other embodiments described herein;

[0053] Figure 5B shows the same inclination measuring device, but with the cover removed to expose the internal components;

[0054] Figure 6A is a perspective view of a measuring device used in a second embodiment of a system for detecting temperature changes;

[0055] Figure 6B is a top perspective view of its internal components;

[0056] Figure 7A is a perspective view of a measuring device used in another embodiment of a system for detecting seismic activity;

[0057] Figure 7B is a top perspective view of its internal components;

[0058] Figure 8 is a rear perspective view of a deformation measuring device used in a first embodiment of the system; and

[0059] Figure 9 is a perspective view of a deformation measuring device near a structure installed in a wall. DETAILED DESCRIPTION

[0060] Figure 1 Shows a deformation measuring device generally labeled 10. As described above, the deformation measuring device 10 has two basic components - a target member 11 and a sensor 16. The target member 11 is a housing or enclosure 12 that encloses a target magnet. The sensor housing 17 contains the remaining components of the measuring device 10.

[0061] Figure 2A Shows the sensor 16 with the upper half of the housing 17 removed. Figure 2AAlso shown is an alignment tongue 22 that connects a sensor bracket and a target bracket described below. The sensor housing 17 contains a first circuit board 24 that has, for example, a microprocessor 33, a wireless module, a charging controller, and other components, the other components including an antenna 28 and an internal storage device 29. The antenna 28 allows the deformation measuring device 10 to transmit data to other devices, and the internal storage device 29 allows the measuring device 10 to store data. This is particularly useful in the event of a power failure, when data collected by the measuring device 10 cannot be transmitted to another device for saving, and the internal storage device 29 can store the same data locally until it can be retrieved safely. There is also a second circuit board 25 that includes or has a magnetic sensor array 35, which, in the preferred embodiment and the intended best mode, is three 3D Hall effect sensors 26 (see Figure 3 ).

[0062] Figure 2B Shown is the target housing 12 with the magnet 14 removed. The target housing 12 is made of a material that does not interfere with, alter, or interact with the magnetic field generated by the internal magnet 14. Figure 2C Shown is a cross-sectional view of the same target member 11, which shows the magnet 14 mounted in the target member 11.

[0063] Figure 3 Shown in more detail is the second circuit board 25 of this embodiment. In the preferred embodiment and the best mode of the system anticipated by the inventor, the magnetic sensors, i.e., the Hall effect sensors 26, are arranged in a triangle on the second circuit board 25. That is, the sensors 26 are arranged at the vertices of a projected triangle on the second circuit board 25. In some embodiments, the projected triangle is an equilateral triangle.

[0064] Figures 4A to 4D Shows the optimal positioning of the target magnet 14 relative to the circuit board 25 that contains the magnetic sensors 26. These figures show a cylindrical target magnet 14, the longitudinal axis of which is perpendicular or substantially perpendicular to the plane formed by the flat surface of the printed circuit board 25. This orientation maximizes the Hall effect experienced by the magnetic sensors 26.

[0065] Figure 5A and Figure 5BShows the tilt measurement device 27 with the cover removed to expose its internal working components. The tilt measurement device 27 includes at least one accelerometer 34 operatively connected to a microprocessor 33. The inventors anticipate using the same sensor bracket 18 to mount the tilt measurement device 27. The tilt measurement device 27 includes one or more three-dimensional MEMS accelerometers 34. The MEMS accelerometers 34 are capable of measuring three-dimensional gravitational acceleration to allow the instrument to indicate the position of the tilt measurement device. The tilt measurement device 27 can be placed on the same structure connected to the deformation measurement device 10 to detect changes in the attitude or orientation of the structure relative to the ground. The tilt measurement device 27 can be used in combination with (or separately from) the deformation measurement device to determine the movement of the entire structure rather than the movement around a defect in the structure. As Figure 4C and 4D shown, the same housing can contain circuit boards 24, 25, which include ((1)) a magnetic sensor array 35 and (2) accelerometers integrated with the tilt measurement device 27.

[0066] As described above, the tilt measurement device 27 uses the accelerometer 34 to detect changes in the direction of the tilt measurement device relative to the Earth's gravity. A preferred embodiment of the tilt measurement device 27 includes at least one high-precision accelerometer and may also include at least one low-precision accelerometer 34. The accelerometer 34 may move or vibrate due to external forces (e.g., a vehicle passing near the sensor). The measurements of the accelerometer are repeatedly sampled in small time increments - as described above, sampled hundreds of times in less than a second to average the measurements and "filter" the data to eliminate errors or "noise".

[0067] Figure 6A and Figure 6B shows another embodiment of the monitoring system. One or more temperature sensors 36 can be integrated into the deformation measurement device 10 or the combined deformation 10 and tilt measurement device 27 so that temperature changes of the magnet, Hall effect sensor, and / or accelerometer can be monitored. As previously mentioned, changes in temperature affect the magnetic field strength generated by the target magnet 12 by a known, calculable amount. Before the system is put into use, the magnetic field of the target magnet 12 at different temperatures needs to be analyzed and characterized so that when taking real-time readings, the measurements of the magnetic sensor 26 can be used to accurately and precisely calculate the position of the target magnet 12 relative to these sensors 26. The temperature sensors can be used to monitor the temperature of any individual component of the system and / or the housing 17 itself to more accurately determine the position of the target magnet 12 relative to the sensor array 35.

[0068] Figure 7A and Figure 7BShows yet another embodiment of a monitoring system that can be used to detect seismic activity. In the strain measurement device 10 of this version, the target magnet 14 is suspended three-dimensionally by mounting springs 37 or a group of mounting springs 37 or other damping devices. Seismic activity can easily cause the entire system to move in the same direction simultaneously, preventing the system from detecting the movement of the entire structure to which the measuring device is attached. However, by suspending the target magnet 14 on one or more mounting springs 37, the magnetic sensor array 35 can detect the movement of the target magnet 14 during suspension, allowing the system to capture movement changes that would cause the entire system to move, such as seismic activity. Figure 7 also shows an optional microphone 38 that can be integrated into this version of the system. In addition to detecting vibrations caused by seismic activity, this microphone can also detect additional reference data within a predetermined frequency range generated by other components of the system. Data from the accelerometer 34 and the magnetic sensor array 35 can be measured and then filtered to eliminate or filter out low-frequency position changes in high-frequency or short-frequency vibrations caused by seismic vibrations.

[0069] Figure 8 Shows the target bracket 13, the sensor bracket 18, and the alignment tongue 22. The brackets 13, 18 and the alignment tongue 22 are used to position the components of the measuring device 10 relative to the crack or other defect being measured. More specifically, the user first determines the mounting positions of each of the brackets 13, 18. Since the magnet 14 used in the preferred embodiment is strong enough, the Hall effect sensor 26 will saturate if placed too close to the magnet 14. Therefore, the user must determine the position of the target piece 11 relative to the sensor 16. This involves measuring the size or at least the width of the crack at the placement point of the strain measurement device 10. The user needs to separate the target piece 11 from the sensor 16 so that if the configuration of the structure to which the system is attached changes such that the magnetic sensor 26 is closer to the target magnet 12, the sensor 26 will not be saturated by the magnetic field and will not be too far from the target magnet 12 to be an effective detector. In the preferred embodiment and the best mode contemplated by the inventor, the cylindrical neodymium magnet 14 is placed in the target housing 12 and is placed at a pre-calculated distance from the Hall effect sensor 26 during use. The preferred embodiment of the device and the best mode contemplated by the inventor include a scale 23 on the alignment tongue 22 to allow the user to easily measure the distance between the sensor bracket 18 and the target bracket 13 during installation.

[0070] The alignment tongue 22 is located in the groove 19 on the sensor bracket 18. The alignment tongue 22 slides in and out of the groove 19. There is also a protrusion 20 whose position overlaps a part of the groove 19 and thus is located above the alignment tongue 22. When the alignment tongue extends from the sensor bracket to position the target bracket 13, the protrusion 20 can be tightened using a screw or other conventional fastener so that the protrusion 20 is fastened onto the alignment tongue 22, thereby locking the alignment tongue 22 in place.

[0071] Once the user determines the required distance between the target member 11 and the sensor 16, the user mounts the target bracket 13 and the sensor bracket 18 onto a surface having (including) a crack, gap, void, fracture, or similar defect. Logically, the target bracket 13 is located on one side of the crack, while the sensor bracket 18 is placed on the other side of the crack. First, the user determines the position of the sensor relative to the crack and measures the crack or the defect itself to determine the placement position of the target bracket. The target bracket 13 and the sensor bracket 18 are attached by the alignment tongue 22, which is an elongated structure attached to the target bracket 13 and the sensor bracket 18. Once the positions of the two brackets are determined, the alignment tongue 22 that engages with the sensor bracket 18 in a slidable manner extends the required, calculated distance from the sensor bracket 18. The alignment tongue 22 is attached at one end to the target bracket 13, which is opposite to the end to which the sensor bracket 18 is attached. By extending the tongue, the user moves the target bracket 13 away from the sensor bracket 18. Next, the user locks the alignment tongue 22 in the appropriate position on the bracket. In a preferred embodiment, the user tightens the screw 21 located near the alignment tongue 22 so that tightening the screw 21 can tighten the alignment tongue 22 in place. The brackets are physically attached to the wall by conventional fasteners or adhesives, and then the alignment tongue 22 is retracted into the sensor bracket 18. Next, the target member 11 and the sensor 16 are mounted onto their respective brackets 13, 18, and then the measuring device 10 can be used.

[0072] Figure 9Shows an intended application of the system, namely installing a measuring device at an appropriate position on a structure. The structure is a wall 30 with a crack 31 therein. The deformation measuring device 10 is placed such that the sensor 16 is on one side of the crack and the target member 11 is on the other side of the crack. In addition, an inclination measuring device 27 is also attached to the same structure. This configuration allows a user to remotely monitor any changes in the crack 31 or the inclination of the wall 30. Each measuring device 10, 27 is operatively connected to a transmitter or includes a transmitter that can transmit the data collected by the measuring device to an external storage device. Each measuring device is also equipped with an electronic storage device that can store the measurement results on or in the measuring device. This enables the user to store the data collected over time and / or retrieve the data after the measuring device is powered off or stops operating.

[0073] In a broad embodiment, the present invention is a system for remotely monitoring the condition of a structure. The advantages of the present invention include, but are not limited to, the ability to remotely monitor changes over time or in response to a specific event in cracks or gaps in a structure without observing the measuring device or without a technician physically inspecting the measuring device. In addition, the method allows a user to monitor changes in cracks or gaps or three-dimensional (not just one-dimensional or two-dimensional) movement of a structure. Further, the method of the present invention incorporates an inclinometer, enabling the user to measure not only changes in gaps in a structure but also the orientation of the structure relative to the ground. Engineers and technicians working on a building, wall, or bridge can remotely monitor the impact of their work on gaps or cracks in the structure and / or the three-dimensional inclination or movement of the structure.

[0074] References throughout the specification to features, advantages, or similar language do not imply that all features and advantages of the invention should be or are present in any single embodiment of the invention. Instead, language referring to features and advantages should be understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Thus, discussions of features and advantages and similar language throughout the specification may, but do not necessarily, refer to the same embodiment.

[0075] In addition, the features, advantages, and characteristics described in the present invention may be combined in any suitable manner in one or more embodiments. Those skilled in the relevant art will recognize that the present invention may be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized that are not present in all embodiments of the invention.

[0076] It should be understood that the above embodiments are only used to illustrate the application of the principles of the present invention. The present invention can be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments (including the best mode) should be considered illustrative rather than restrictive in all respects. Therefore, the scope of the present invention is represented by the appended claims (if any) in combination with the foregoing specification.

[0077] Although the foregoing written description of the present invention enables a person of ordinary skill in the art to make and use what is currently considered to be the best mode of the invention, a person of ordinary skill in the art will understand and recognize the existence of variations, combinations, and equivalents of the specific embodiments, methods, and examples herein. Therefore, the present invention should not be limited by the embodiments, methods, and examples described above, but should be limited by all embodiments and methods within the scope and spirit of the present invention.

[0078] Referring to FIG. 10, FIG. 10 shows a hardware block diagram of a computing device 600, which can perform functions associated with operations, and the above operations are discussed in connection with the techniques described herein. Figures 1 to 9 In various embodiments, a computing device or apparatus (e.g., computing device 600 or any combination of computing devices 600) can be configured as any entity (e.g., microprocessor 33) or multiple entities as discussed in connection with the techniques shown, in order to perform the operations of the various techniques discussed herein. Figures 1 to 9

[0079] In at least one embodiment, the computing device 600 can be any device that can include one or more processors 602, one or more memory elements 604, a memory 606, a bus 608, one or more network processor units 610 interconnected with one or more network input / output (I / O) interfaces 612, one or more I / O interfaces 614, and control logic 620. In various embodiments, the instructions associated with the logic of the computing device 600 can overlap in any manner and are not limited to the specific allocation of instructions and / or operations described herein.

[0080] In at least one embodiment, the processor 602 is at least one hardware processor configured to perform the various tasks, operations, and / or functions of the computing device 600 described herein according to the software and / or instructions configured for the computing device 600. The processor 602 (e.g., a hardware processor) can execute any type of instruction related to data to implement the operations detailed herein. In one example, the processor 602 can convert an element or item (e.g., data, information) from one state or thing to another state or thing. Any possible processing element, microprocessor, digital signal processor, controller, system, manager, logic, and / or machine described herein can be interpreted as being included within the broad term "processor".

[0081] In at least one embodiment, the storage element 604 and / or the memory 606 are configured to store data, information, software, and / or instructions related to the computing device 600, and / or the logic configured for the storage element 604 and / or the memory 606. For example, in various embodiments, any combination of the storage element 604 and / or the memory 606 can be used to store any logic described herein (e.g., control logic 620) for the computing device 600. Note that in some embodiments, the memory 606 may be incorporated with the storage element 604 (and vice versa), or may overlap / exist in any other suitable manner.

[0082] In at least one embodiment, the bus 608 may be configured as an interface such that one or more elements and / or sensors of the computing device 600 can communicate to exchange information and / or data. The bus 608 can be implemented as any architecture designed to transfer control, data, and / or information between a processor, memory elements / storage devices, peripherals, and / or any other hardware and / or software components that may be configured for the computing device 600.

[0083] In various embodiments, the network processor unit 610 can implement communication between the computing device 600 and other systems, entities, etc. via the network I / O interface 612 (wired and / or wireless) to facilitate the operations discussed for the various embodiments described herein. In various embodiments, the network processor unit 610 can be configured as a combination of hardware and / or software, such as one or more Ethernet drivers and / or controllers, wireless receivers / transmitters / transceivers, baseband processors / modems, and / or other similar network interface drivers and / or controllers known now or developed later, to implement communication between the computing device 600 and other systems, entities, etc., thereby facilitating the operations of the various embodiments described herein. In various embodiments, the network I / O interface 612 can be configured as one or more Ethernet ports, any other I / O ports, and / or antennas / antenna arrays known now or developed later. Thus, the network processor unit 610 and / or the network I / O interface 612 can include appropriate interfaces for receiving, transmitting, and / or otherwise wirelessly transferring data and / or information to another processor to monitor the data.

[0084] In various embodiments, the control logic 620 can include instructions that, when executed, cause the processor 602 to perform operations that can include, but are not limited to: providing overall control operations of the computing device; interacting with other entities, systems, etc. described herein; maintaining and / or interacting with stored data, information, parameters, etc. (e.g., storage elements, memories, data structures, databases, tables, etc.); combinations of the above; and / or facilitating the various operations of the embodiments described herein.

[0085] The programs described herein (e.g., control logic 620) can be identified according to the applications they implement in a particular embodiment. However, it should be understood that any specific program nomenclature herein is used for convenience only; thus, the use of the embodiments herein should not be limited to any particular application identified and / or implied by such nomenclature.

[0086] In various embodiments, any entity or device described herein can store data / information in any suitable volatile and / or non-volatile storage device (e.g., magnetic hard disk drive, solid state drive, semiconductor storage device, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), application specific integrated circuit (ASIC), etc.), software, logic (fixed logic, hardware logic, programmable logic, analog logic, digital logic), hardware, and / or any other suitable component, device, element, and / or object. Any storage device discussed herein should be interpreted as being included within the broad term "storage element". As discussed herein, the data / information being tracked and / or sent to one or more entities can be provided in any database, table, register, list, cache, memory, and / or storage structure: all of which can be referenced within any suitable time frame. Any such storage option is also included within the broad term "storage element" used herein.

[0087] It should be noted that in some example embodiments, the operations described herein can be implemented by logic encoded in one or more tangible media that are capable of storing instructions and / or digital information, and can include non-transitory tangible media and / or non-transitory computer-readable storage media for execution by one or more processors and / or other similar machines (e.g., embedded logic provided in an ASIC, digital signal processing (DSP) instructions, software [which may include object code and source code], etc.). Generally, the storage element 604 and / or the memory 606 can store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations of the above, and / or the like for the operations described herein. This includes the storage element 604 and / or the memory 606 that are capable of storing data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations of the above, or the like to perform operations in accordance with the teachings of the present disclosure.

[0088] As used herein, unless otherwise expressly stated, the use of the phrases "at least one," "one or more," "and / or," and variations or similar expressions thereof are open-ended expressions that are both conjunctive and disjunctive in operation with respect to any and all possible combinations of the associated listed items. For example, each of the expressions "at least one of X, Y, and Z," "at least one of X, Y, or Z," "one or more of X, Y, and Z," "one or more of X, Y, or Z," and "X, Y, and / or Z" can mean any of the following: 1) including X, but not including Y and not including Z; 2) including Y, but not including X and not including Z; 3) including Z, but not including X and not including Y; 4) including X and Y, but not including Z; 5) including X and Z, but not including Y; 6) including Y and Z, but not including X; or 7) including X, Y, and Z.

[0089] Each exemplary embodiment disclosed herein presents one or more different features. However, all of the disclosed example embodiments are designed to work together as part of a single, larger system or method. The present disclosure expressly contemplates composite embodiments that combine multiple of the previously discussed features from different example embodiments into a single system or method.

[0090] Furthermore, unless otherwise expressly stated, the terms "first," "second," "third," etc. are intended to distinguish the particular nouns that they modify (e.g., elements, conditions, nodes, modules, activities, operations, etc.). Unless otherwise expressly stated, the use of these terms is not intended to imply any type of order, rank, importance, temporal order, or hierarchy of the nouns being modified. For example, "first X" and "second X" are intended to denote two "X" elements that are not necessarily subject to any order, rank, importance, temporal order, or hierarchy of the two elements. Additionally, as mentioned herein, "at least one" and "one or more" can be denoted using the "(s)" nomenclature (e.g., one or more elements).

[0091] Industrial Applicability

[0092] References throughout the specification to features, advantages, or similar language do not imply that all features and advantages of the invention should be present in or are in any single embodiment of the invention. Rather, language referring to features and advantages should be understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Thus, discussions of features and advantages and similar language throughout the specification may, but do not necessarily, refer to the same embodiment.

[0093] In addition, the features, advantages, and characteristics described in the present invention can be combined in any suitable manner in one or more embodiments. Those skilled in the relevant art will recognize that the present invention can be implemented by omitting one or more specific features or advantages of a particular embodiment. In other cases, additional features and advantages that may not be present in all embodiments of the present invention may be recognized in some embodiments.

[0094] It should be understood that the above embodiments are only used to illustrate the application of the principles of the present invention. The present invention can be embodied in other specific forms without departing from its spirit or basic characteristics. The described embodiments (including the best mode) should be considered illustrative rather than restrictive in all respects. Therefore, the scope of the present invention is represented by the appended claims (if any) in combination with the foregoing description.

[0095] Although the foregoing written description of the present invention enables those of ordinary skill in the art to make and use what is currently considered to be the best mode of the invention, those of ordinary skill in the art will understand and recognize the existence of variations, combinations, and equivalents of the specific embodiments, methods, and examples herein. Therefore, the present invention should not be limited by the embodiments, methods, and examples described above, but rather by all embodiments and methods within the scope and spirit of the present invention.

[0096] Clause 1: A system for detecting changes in a structure, the system comprising: a deformation measurement device, the deformation measurement device comprising: a target magnet positioned at a predetermined location; and an array of magnetic sensors operably connected to a microprocessor, the microprocessor configured to determine the position of the target magnet based on one or more signals received from the array of magnetic sensors.

[0097] Clause 2: The system according to Clause 1, wherein the array of magnetic sensors is located at the vertices of a projected triangle and attached to a single circuit board.

[0098] Clause 3: The system according to Clause 2, wherein the target magnet is positioned such that the magnetic field of the target magnet is substantially perpendicular to the flow of current in the conductors of the array of magnetic sensors.

[0099] Clause 4: The system according to Clause 3, further comprising an inclination measurement device for determining the three-dimensional angular displacement of the structure, the inclination measurement device comprising a three-axis accelerometer operably connected to the microprocessor.

[0100] Clause 5: The system according to Clause 1, further comprising an inclination measurement device, the inclination measurement device comprising a three-axis accelerometer operably connected to the microprocessor, the three-axis accelerometer for determining the angular orientation of the structure.

[0101] Clause 6: The system according to Clause 5 further includes a temperature sensor operably connected to measure the temperature of the system.

[0102] Clause 7: The system according to Clause 6, wherein the microprocessor is further configured to determine the position of the target magnet based further on the temperature of the system.

[0103] Clause 8: The system according to Clause 2, wherein the magnetic sensor array is a Hall effect sensor; and the projection triangle is an equilateral triangle.

[0104] Clause 9: The system according to Clause 1 further includes a low-frequency microphone operably connected to the microprocessor, the low-frequency microphone being configured to measure vibrations.

[0105] Clause 10: The system according to Clause 9 further includes a mounting spring operably coupled to the target magnet, the mounting spring being configured to suspend the target magnet on a structure.

[0106] Clause 11: The system according to Clause 1 further includes a mounting plate configured to position the target magnet at the predetermined position, wherein the predetermined position is determined relative to the magnetic sensor array.

[0107] Clause 12: A system for detecting changes in a structure, the system comprising: a deformation measuring device including: a sensor array including three three-dimensional magnetic sensors arranged in a triangle within a single plane; wherein the sensor array is operably connected to a microprocessor; a target magnet having a magnetic field that is substantially perpendicular to the plane in which the magnetic sensors are arranged; wherein the microprocessor is configured to detect changes in the distance of each sensor relative to the target magnet to determine a three-dimensional position change of the target magnet; and an inclination measuring device including: a plurality of three-axis accelerometers operably connected to the microprocessor, the microprocessor further equipped with software that interprets data from the plurality of three-axis accelerometers to detect a three-dimensional position change of the plurality of three-axis accelerometers relative to the earth's gravity.

[0108] Clause 13: The system according to Clause 12 further includes a temperature sensor operably connected to measure the temperature of the system, the temperature sensor being operably connected to the microprocessor, the microprocessor being configured to calculate a change in the magnetic field strength of the target magnet caused by temperature fluctuations and compensate the measurement results of the sensor array and the plurality of three-axis accelerometers caused by temperature fluctuations.

[0109] Clause 14: The system according to Clause 12 further includes a mounting spring operably coupled to the target magnet, the mounting spring configured to suspend the target magnet on the structure.

[0110] Clause 15: The system according to Clause 14 further includes a low-frequency microphone operably connected to the microprocessor, the low-frequency microphone configured to measure low-frequency vibrations of the structure, components of the sensor array, and / or the plurality of triaxial accelerometers.

[0111] Clause 16: The system according to Clause 15 further includes a high-frequency microphone operably connected to the microprocessor, the high-frequency microphone configured to measure high-frequency vibrations of the structure, components of the sensor, and / or the plurality of triaxial accelerometers.

[0112] Clause 17: A method of detecting a change in a structure, the method comprising: arranging a magnetic sensor array on the structure; arranging a target magnet at a predetermined position on the structure relative to the magnetic sensor array; calibrating the magnetic sensor array based on the position of the target magnet; monitoring, by a microprocessor, one or more signals from the magnetic sensor array indicative of a magnetic field generated by the target magnet; and determining, by the microprocessor, a change in the position of the target magnet based on the monitoring results.

[0113] Clause 18: The method according to Clause 17 further includes detecting an ambient temperature by a temperature sensor; wherein the change in the position of the target magnet is further determined based on the detected ambient temperature.

[0114] Clause 19: The method according to Clause 17, wherein arranging the target magnet on the structure includes: aligning the target magnet with the magnetic sensor array by an alignment tab; mounting the target magnet to the structure; and removing the alignment tab from the target magnet.

[0115] Clause 20: The method according to Clause 17, wherein the magnetic sensor array includes three magnetic sensors disposed substantially equidistant from each other.

Claims

1. A system for detecting changes in a structure, the system comprising: A deformation measuring device, the deformation measuring device comprising: A target magnet positioned at a predetermined position; and A magnetic sensor array operably connected to a microprocessor, the microprocessor configured to determine the position of the target magnet based on one or more signals received from the magnetic sensor array.

2. The system according to claim 1, wherein the magnetic sensor array is located at the vertices of a projected triangle and attached to a single circuit board.

3. The system according to claim 2, wherein the target magnet is positioned such that the magnetic field of the target magnet is substantially perpendicular to the current flow in the conductors of the magnetic sensor array.

4. The system according to claim 3, further comprising an inclination measuring device for determining the three-dimensional angular displacement of the structure, the inclination measuring device comprising a three-axis accelerometer operably connected to the microprocessor.

5. The system according to claim 1, further comprising an inclination measuring device, the inclination measuring device comprising a three-axis accelerometer operably connected to the microprocessor, the three-axis accelerometer for determining the angular orientation of the structure.

6. The system according to claim 5, further comprising a temperature sensor operably connected to measure the temperature of the system.

7. The system according to claim 6, wherein the microprocessor is further configured to determine the position of the target magnet based further on the temperature of the system.

8. The system according to claim 2, wherein the magnetic sensor array is a Hall effect sensor; and the projected triangle is an equilateral triangle.

9. The system according to claim 1, further comprising a low-frequency microphone operably connected to the microprocessor, the low-frequency microphone for measuring vibrations.

10. The system according to claim 9, further comprising a mounting spring operably coupled to the target magnet, the mounting spring configured to suspend the target magnet on the structure.

11. The system according to claim 1, further comprising a mounting plate configured to position the target magnet at the predetermined position, wherein the predetermined position is determined relative to the magnetic sensor array.

12. A system for detecting changes in a structure, the system comprising: A deformation measuring device, the deformation measuring device comprising: A sensor array, the sensor array comprising: three three-dimensional magnetic sensors arranged in a triangle in a single plane; wherein the sensor array is operably connected to a microprocessor; A target magnet having a magnetic field that is substantially perpendicular to the plane in which the magnetic sensors are arranged; wherein the microprocessor is configured to detect changes in the distance of each sensor relative to the target magnet to determine a three-dimensional position change of the target magnet; and an inclination measuring device, the inclination measuring device comprising: A plurality of three-axis accelerometers operably connected to the microprocessor, the microprocessor configured to interpret data from the plurality of three-axis accelerometers to detect a three-dimensional position change of the plurality of three-axis accelerometers relative to the earth's gravity.

13. The system according to claim 12, further comprising a temperature sensor operably connected to measure the system temperature, the temperature sensor being operably connected to a microprocessor, the microprocessor being configured to calculate a change in the magnetic field strength of the target magnet caused by temperature fluctuations and compensate the measurement results of the sensor array and the plurality of triaxial accelerometers caused by temperature fluctuations.

14. The system according to claim 12, further comprising a mounting spring operably coupled to the target magnet, the mounting spring being configured to suspend the target magnet on a structure.

15. The system according to claim 14, further comprising a low-frequency microphone operably connected to the microprocessor, the low-frequency microphone being configured to measure low-frequency vibrations of the structure, components of the sensor array, and / or the plurality of triaxial accelerometers.

16. The system according to claim 15, further comprising a high-frequency microphone operably connected to the microprocessor, the high-frequency microphone being configured to measure high-frequency vibrations of the structure, components of the sensor, and / or the plurality of triaxial accelerometers.

17. A method for detecting changes in a structure, the method comprising: Arranging a magnetic sensor array on the structure; Arranging a target magnet on the structure at a predetermined position relative to the magnetic sensor array; Calibrating the magnetic sensor array according to the position of the target magnet; Monitoring, by a microprocessor, one or more signals from the magnetic sensor array indicative of a magnetic field generated by the target magnet; and Determining, by the microprocessor, a change in the position of the target magnet based on the monitoring results.

18. The method according to claim 17, further comprising detecting an ambient temperature by a temperature sensor; wherein the change in the position of the target magnet is further determined based on the detected ambient temperature.

19. The method according to claim 17, wherein arranging the target magnet on the structure comprises: Aligning the target magnet with the magnetic sensor array by an alignment tab; Mounting the target magnet to the structure; Removing the alignment tab from the target magnet.

20. The method according to claim 17, wherein the magnetic sensor array comprises three magnetic sensors arranged substantially equidistant from each other.

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