Multi-stage cleaning pool for photovoltaic welding strip

Abstract

The invention relates to the technical field of welding strip cleaning, and discloses a multi-stage cleaning pool for a photovoltaic welding strip, the photovoltaic welding strip is conveyed to a pretreatment module, a first-stage cleaning pool, a second-stage cleaning pool and an evaporation barrel in sequence through guide wheels, and a brush wheel used for cleaning the surface of the welding strip and a cavity used for collecting chippings are arranged in the pretreatment module; the side face of the pretreatment module is provided with an air outlet, the air outlet faces the evaporation barrel, the air outlet generates air flow movement, so that welding strip surface scraps enter a cavity in the pretreatment module to be collected, air flow finally moves towards the evaporation barrel, air inlet holes are formed in the side face of the evaporation barrel along the edge array, and the air flow moving upwards is arranged in the evaporation barrel. A transition section is arranged between the first-stage cleaning pool and the second-stage cleaning pool, the transition section is located between the pretreatment module and the evaporation barrel in the horizontal direction, and the welding strip is fed after being immersed into the first-stage cleaning pool through the guide wheel and enters the second-stage cleaning pool through the transition section.

Description

Technical Field

[0001] The present invention relates to the technical field of solder strip cleaning, and specifically provides a multi-stage cleaning tank for photovoltaic solder strips. Background Art

[0002] The cleaning tank for photovoltaic solder strips is a key auxiliary device in the production of photovoltaic cell modules. It is mainly used to remove the residual flux, oxides and oil and dirt impurities on the surface of the solder strip. It is usually made of stainless steel, and is internally provided with an ultrasonic generating device, a circulating filtration system and a temperature control module. The cleaning tank is configured with an alkaline or acidic solution in a specific proportion, and uses the ultrasonic cavitation effect to peel off the pollutants on the surface of the solder strip, and cooperates with the mechanical spraying or soaking method to achieve deep cleaning. The circulating filtration system can remove suspended impurities in real time to maintain the cleanliness of the solution, and the temperature control function ensures that the cleaning process meets the process parameter requirements. The cleaned solder strip can effectively improve the welding reliability and avoid problems such as false soldering and over-soldering caused by contamination, thereby improving the current conduction efficiency and the overall service life of the photovoltaic module. Some advanced cleaning tanks are also integrated with an intelligent monitoring function, which can adjust the cleaning parameters in real time and warn of the solution fatigue degree to further ensure the cleaning quality. As a pretreatment link in the photovoltaic manufacturing process, this equipment plays an irreplaceable role in improving the product yield and long-term stability.

[0003] The existing cleaning device for photovoltaic solder strips needs to be provided with a surface pretreatment device and a drying device before and after the cleaning tank respectively, which greatly increases the floor area of the equipment for small and medium-sized enterprises. At the same time, because the air flow generated during the operation of the surface pretreatment and drying devices of the solder strip will cause the air near the cleaning tank to flow, the acid solution in the cleaning tank will volatilize rapidly, increasing the cost. And because of the air flow, the acid solution corrodes other equipment and causes damage, resulting in an increase in maintenance costs. Summary of the Invention

[0004] (1) Technical problems to be solved: In view of the deficiencies of the prior art, the present invention provides a multi-stage cleaning tank for photovoltaic solder strips, which has the advantages of compact structure, small floor area and orderly gas flow, and solves the problems in the solder strip pretreatment and drying processes.

[0005] (2)Technical solution: To achieve the purpose of compact structure, small floor area and orderly gas flow, the present invention provides the following technical solution: A multi-stage cleaning tank for photovoltaic solder tapes, including a pretreatment module, a first-stage cleaning tank, a second-stage cleaning tank, an evaporation cylinder and a guide wheel. The photovoltaic solder tape is sequentially transported to the pretreatment module, the first-stage cleaning tank, the second-stage cleaning tank and the evaporation cylinder through the guide wheel. A brush wheel for cleaning the surface of the solder tape and a cavity for collecting debris are provided in the pretreatment module. An air outlet is provided on the side of the pretreatment module, and the air outlet faces the evaporation cylinder. An air flow movement is generated at the air outlet, so that the debris on the surface of the solder tape enters the cavity in the pretreatment module for collection, and the air flow finally moves towards the evaporation cylinder. Intake holes are arrayed along the edge on the side of the evaporation cylinder, and an upward air flow is provided in the evaporation cylinder. The first-stage cleaning tank and the second-stage cleaning tank are arranged below the pretreatment module, and a transition section is provided between the first-stage cleaning tank and the second-stage cleaning tank. At the same time, the transition section is horizontally located between the pretreatment module and the evaporation cylinder. The solder tape is immersed in the first-stage cleaning tank through the guide wheel and enters the second-stage cleaning tank after passing through the transition section. A solder tape drain groove with a shape consistent with the path of the solder tape is provided on the transition section.

[0006] Preferably, a downward chamfer is provided at the bottom of the air outlet.

[0007] Preferably, the height of the first-stage cleaning tank is higher than that of the second cleaning tank, and the transition section is inclined, with the side close to the first-stage cleaning tank being higher than the side far from the first-stage cleaning tank.

[0008] Preferably, the intake holes are inclined upward, the horizontal height of the outer intake holes is lower than that of the connected inner intake holes, and the intake holes are deflected towards the axis of the evaporation cylinder as a whole.

[0009] Preferably, a reflux plate is provided above the first-stage cleaning tank. A notch for the solder tape to pass through is provided in the middle of the reflux plate. The reflux plate is an acrylic plate with a gap left in the middle, and cooling water passes through the middle gap.

[0010] Preferably, the reflux plate is inclined, and the horizontal position of the side close to the transition section is lower.

[0011] Preferably, wave-shaped protrusions are provided at the bottom of the reflux plate.

[0012] Preferably, an overflow port is provided between the first-stage cleaning tank and the transition section. The overflow port is vertically arranged, and a notch for the solder tape to pass through is left in the middle.

[0013] Preferably, transition section drain grooves perpendicular to itself are provided on both sides of the solder tape drain groove.

[0014] Preferably, the evaporation cylinder is fixed above the second-stage cleaning tank through a fixing member, and the fixing member is fixed in a detachable manner.

[0015] (III) Beneficial effects: Compared with the prior art, the present invention provides a multi-stage cleaning tank for photovoltaic solder tapes, which has the following beneficial effects: 1. In the multi-stage cleaning tank for photovoltaic solder tapes, the pretreatment module physically brushes the surface of the solder tape through a high-speed rotating brush wheel, directly stripping metal debris and dust. The air outlet adsorption airflow started synchronously sucks the debris into the cavity, avoiding secondary pollution and preventing the debris from being brought into the cleaning tank, which would increase the consumption of acid solution. The synchronous design of the brush wheel and the airflow solves the problem of debris scattering in the traditional process. The first-stage cleaning tank uses hydrochloric acid or sulfuric acid to remove oxides, and the second-stage cleaning tank neutralizes the residual acid solution with sodium bicarbonate, forming a "pickling-neutralization" closed-loop reaction chain. The hierarchical treatment avoids excessive consumption of acid solution. At the same time, the salts generated by the neutralization reaction are soluble in water, reducing surface residues. The upward airflow inside the evaporation cylinder is driven by an air pump to accelerate the evaporation of water on the surface of the solder tape. The array of air intake holes on the side ensures uniform distribution of the airflow, and the drying efficiency is significantly improved compared with the traditional hot air. The dried airflow carrying volatile substances is centrally collected and treated, meeting the environmental protection emission standards. The air outlet of the pretreatment module guides the airflow after adsorbing debris to the evaporation cylinder, and uses the pressure difference generated outside and inside the side of the evaporation cylinder to accelerate the outside airflow to enter the evaporation cylinder through the air intake holes to assist in drying the solder tape. Since the airflow brought out by the air outlet of the pretreatment module increases the air pressure outside the evaporation cylinder, the power requirement of the air pump inside the evaporation cylinder itself is reduced. At the same time, the pretreatment module and the evaporation cylinder can be arranged adjacent to each other. The pretreatment module and the evaporation cylinder are located above the cleaning tank, making full use of the vertical space, and the overall floor area is reduced by 50% compared with the traditional horizontal layout, which is especially suitable for the compact workshops of small and medium-sized enterprises. The negative pressure airflow of the evaporation cylinder is separated from the acid solution environment of the cleaning tank at the transition section, avoiding the drying airflow from disturbing the liquid level of the cleaning tank or accelerating the volatilization of the acid solution. This design solves the problem of mutual interference between the drying area and the cleaning area in the traditional equipment, and significantly improves the process stability.

[0016] 2. The multi-stage cleaning tank for photovoltaic solder tapes has the first-stage cleaning tank higher than the second cleaning tank. Under the action of gravity, the solder tapes naturally slide down into the transition section, reducing the demand for mechanical traction and avoiding the stretching deformation of the solder tapes caused by excessive tension. One side of the transition section close to the first-stage cleaning tank is higher, forming an inclination angle of 5° - 10°. The solder tapes enter the second-stage cleaning tank in the form of a "gentle slope", avoiding liquid splashing caused by sharp turns or vertical drops. The air inlet holes deflect towards the axis of the evaporation cylinder, with the outer air inlet holes lower than the inner ones. The airflow enters and naturally forms a spiral upward trajectory. The spiral airflow covers the entire surface of the solder tapes, significantly improving the drying uniformity compared with the traditional vertical airflow, eliminating local wet dead corners. The spiral airflow forms a low-pressure area in the center of the evaporation cylinder, accelerating the replenishment of external air through the air inlet holes, further reducing the power demand of the air pump. In the spiral airflow, the acid mist particles are aggregated by the airflow and can be more effectively concentrated and processed in the recovery device. At the same time, the spiral airflow can effectively scour the cylinder wall, reducing the maintenance cost.

[0017] 3. The multi-stage cleaning tank for photovoltaic solder tapes has a reflux plate above the first-stage cleaning tank. There is a notch in the middle of the reflux plate for the solder tapes to pass through. The reflux plate is an acrylic plate with a gap in the middle, and cooling water passes through the middle gap, causing the volatilized acid mist to be pre-cooled and condense at the bottom of the reflux plate. The amount of acid mist escaping is significantly reduced compared with the traditional open design. The reflux plate is inclined, with the horizontal position on the side close to the transition section being lower. There are wavy protrusions at the bottom of the reflux plate. The wavy structure at the bottom of the plate prolongs the contact time of the acid mist and guides the condensate to flow directionally along the wave valleys into the tank. The reflux plate is inclined towards the transition section side. The condensate and the uncondensed acid mist slide along the plate surface into the cleaning tank under the action of gravity. There is an overflow port between the first-stage cleaning tank and the [missing part]. The overflow port is vertically arranged and has a notch in the middle for the solder tapes to pass through, reducing the movement of the airflow on the surface of the first-stage cleaning tank towards the transition section. At the same time, it avoids the solder tapes splashing with acid liquid. There are transition section drain grooves perpendicular to the solder tape drain grooves on both sides of the solder tape drain groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Structural schematic of the present invention Figure 1 。

[0019] Figure 2 Schematic diagram of the airflow movement of the present invention.

[0020] Figure 3 Structural schematic of the present invention Figure 2 。

[0021] Figure 4 Schematic diagram of the air inlet holes of the present invention.

[0022] Figure 5 Schematic diagram of the airflow movement in the evaporation cylinder of the present invention.

[0023] Figure 6 This is a schematic diagram of the details of the overflow plate of the present invention.

[0024] Figure 7 This is a schematic diagram of the details of the reflux plate of the present invention.

[0025] In the figure: 1. Pretreatment module; 2. First-stage cleaning tank; 3. Second-stage cleaning tank; 4. Evaporation cylinder; 5. Transition section; 11. Air outlet; 21. Reflux plate; 41. Fixing piece; 42. Air inlet hole; 51. Overflow port; 52. Solder strip drainage groove; 53. Transition section drainage groove; 101. Guide wheel. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] Please refer to Figures 1 - 3 , a multi-stage cleaning tank for photovoltaic solder strips, including a pretreatment module 1, a first-stage cleaning tank 2, a second-stage cleaning tank 3, an evaporation cylinder 4, and a guide wheel 101. The photovoltaic solder strips are sequentially transported to the pretreatment module 1, the first-stage cleaning tank 2, the second-stage cleaning tank 3, and the evaporation cylinder 4 through the guide wheel 101. A brush wheel for cleaning the surface of the solder strip and a cavity for collecting debris are provided in the pretreatment module 1. An air outlet 11 is provided on the side of the pretreatment module 1, and the air outlet 11 faces the evaporation cylinder 4. The air outlet 11 generates air flow movement, so that the debris on the surface of the solder strip enters the cavity in the pretreatment module 1 for collection. At the same time, a filter screen is provided between the cavity and the air outlet 11 to prevent the debris from being ejected together with the air flow. The air flow flowing out of the air outlet 11 finally moves towards the evaporation cylinder 4. The side of the evaporation cylinder 4 is provided with air inlet holes 42 arranged in an array along the edge, and an upward air flow is provided in the evaporation cylinder 4. The first-stage cleaning tank 2 and the second-stage cleaning tank 3 are arranged below the pretreatment module 1, and a transition section 5 is provided between the first-stage cleaning tank 2 and the second-stage cleaning tank 3. At the same time, the transition section 5 is located horizontally between the pretreatment module 1 and the evaporation cylinder 4. The solder strip enters the first-stage cleaning tank 2 through the guide wheel 101 and enters the second-stage cleaning tank 3 after passing through the transition section 5. A solder strip drainage groove 52 with a shape consistent with the path of the solder strip is provided on the transition section 5. A downward chamfer is provided at the bottom of the air outlet 11.

[0028] The PV solder ribbon is transported to the pretreatment module 1 through the guide wheel 101. The pretreatment module 1 removes the residual metal debris and dust on the surface of the solder ribbon through the brush wheel, and generates an adsorption air flow through the air outlet 11 to adsorb and collect the metal debris and dust. The exhausted air flow flows towards the evaporation cylinder 4. After being sent out from the pretreatment module 1, the solder ribbon enters the first-stage cleaning tank 2 for pickling. The first-stage cleaning tank 2 contains 5% - 15% hydrochloric acid or 10% - 20% sulfuric acid to dissolve the oxides on the surface of the solder ribbon. Subsequently, the solder ribbon enters the second-stage cleaning tank 3 through the transition section 5 for neutralization. The second-stage cleaning tank 3 contains sodium bicarbonate to neutralize the residual acid on the surface of the solder ribbon. An upward flowing air flow is generated in the evaporation cylinder 4 by the air pump. Since the air flow moves upward and the evaporation cylinder 4 is provided with air inlets 42 on the side, due to the influence of negative pressure, only a gap for the solder ribbon to pass through is left at the bottom of the evaporation cylinder 4, so that the air flow blown out from the air outlet 11 will pass through the air inlets 42 of the evaporation cylinder 4 and enter the interior, dry the solder ribbon in the evaporation cylinder 4, and carry the dried air flow upward for collection. The transition section 5 is arranged between the pretreatment module 1 and the evaporation cylinder 4, and a chamfer is provided on the lower side of the air outlet 11, so that part of the air flow that does not flow into the evaporation cylinder 4 flows downward to apply a downward air flow to the solder ribbon, reducing the residual acid solution on the surface of the solder ribbon. At the same time, the volatilized acid solution is discharged into the solder ribbon drainage tank 52 together. The overall structure has a more orderly air flow movement, and the pretreatment module 1 and the evaporation cylinder 4 are arranged above the cleaning tank, greatly reducing the floor space, saving more space for small and medium-sized enterprises, and the interference between various devices is small, and there is no need to worry about the air flow brought by the evaporation cylinder 4 causing volatilization of the acid solution in the cleaning tank.

[0029] The height of the first-stage cleaning tank 2 is higher than that of the second cleaning tank 3, and the transition section 5 is inclined. The side close to the first-stage cleaning tank 2 is higher than the side far from the first-stage cleaning tank 2, forming an inclination angle of 5° - 10°. The solder ribbon enters the second-stage cleaning tank 3 in the form of a "gentle slope", making the solder ribbon enter the second-stage cleaning tank 3 more smoothly and reducing liquid splashing.

[0030] Refer to Figures 4 - 5 The air inlets 42 are arranged to incline upward. The horizontal height of the outer air inlets 42 is lower than that of the connected inner air inlets 42. The air inlets 42 are deflected towards the axis of the evaporation cylinder 4 as a whole, so that the air flow entering the evaporation cylinder 4 can naturally form a spiral upward flow. The spiral air flow forms a low-pressure area in the center of the evaporation cylinder 4, accelerating the replenishment of external air through the air inlets, reducing the power consumption of the air pump in the evaporation cylinder 4, increasing the service life of the air pump. In the spiral air flow, the acid mist particles are aggregated by the air flow and can be more effectively concentrated and treated in the recovery device. At the same time, the spiral air flow can effectively wash the cylinder wall, reducing the maintenance cost.

[0031] Refer to Figures 6 - 7, a reflux plate 21 is provided above the first-stage cleaning tank 2. A notch for the solder strip to pass through is provided in the middle of the reflux plate 21. The reflux plate 21 is an acrylic plate with a gap in the middle, and cooling water passes through the middle gap, so that the volatilized acid mist is pre-cooled and condensed at the bottom of the reflux plate 21. The amount of acid mist escaping is significantly reduced compared with the traditional open design. The reflux plate 21 is inclined, and the horizontal position of the side close to the transition section 5 is lower. The bottom of the reflux plate 21 is provided with wavy protrusions. The wavy structure at the bottom of the plate extends the contact time of the acid mist, and at the same time guides the condensed liquid to flow directionally along the wave troughs into the tank. The reflux plate 21 is inclined towards the transition section side, and the condensed liquid and the uncondensed acid mist slide along the plate surface under the action of gravity into the cleaning tank.

[0032] Refer to Figure 6 , an overflow port 51 is provided between the first-stage cleaning tank 2 and the transition section 5. The overflow port 51 is vertically arranged, and a notch for the solder strip to pass through is provided in the middle, reducing the movement of the air flow on the surface of the first-stage cleaning tank 2 towards the transition section 5. At the same time, it avoids the acid liquid splashing carried by the solder strip. On both sides of the solder strip drain tank 52, there are transition section drain tanks 53 perpendicular to itself.

[0033] The evaporation cylinder 4 is fixed above the second-stage cleaning tank 3 through a fixing member 41, and the fixing member 41 adopts a detachable fixing.

[0034] Working principle: The photovoltaic solder strip is transported to the pretreatment module 1 through the guide wheel 101. The pretreatment module 1 removes the residual metal debris and dust on the surface of the solder strip through the brush wheel, and generates an adsorption air flow through the air outlet 11 to adsorb and collect the metal debris and dust. The exhausted air flow moves towards the evaporation cylinder 4. After the solder strip is sent out from the pretreatment module 1, it enters the first-stage cleaning tank 2 for pickling. The first-stage cleaning tank 2 contains 5% - 15% hydrochloric acid or 10% - 20% sulfuric acid to dissolve the oxides on the surface of the solder strip. Subsequently, the solder strip enters the second-stage cleaning tank 3 through the transition section 5 for neutralization. The second-stage cleaning tank 3 contains sodium bicarbonate to neutralize the residual acid on the surface of the solder strip. An upward air flow is generated in the evaporation cylinder 4 through an air pump. Because the air flow moves upward and the side of the evaporation cylinder 4 is provided with air inlet holes 42, due to the influence of negative pressure, the air flow blown out from the air outlet 11 will pass through the air inlet holes 42 of the evaporation cylinder 4 and enter the interior to dry the solder strip in the evaporation cylinder 4, and the dried air flow is carried upward for collection. The transition section 5 is arranged between the pretreatment module 1 and the evaporation cylinder 4, and a chamfer is provided on the lower side of the air outlet 11, so that part of the air flow that does not flow into the evaporation cylinder 4 flows downward to apply a downward air flow to the solder strip, reducing the residual acid liquid on the surface of the solder strip. At the same time, the volatilized acid liquid is discharged into the solder strip drain tank 52 together, and the air flow movement of the overall structure is more orderly.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0036] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-stage cleaning tank for photovoltaic solder tapes, comprising a pretreatment module (1), a first-stage cleaning tank (2), a second-stage cleaning tank (3), an evaporation cylinder (4) and a guide wheel (101). The photovoltaic solder tape is sequentially transported to the pretreatment module (1), the first-stage cleaning tank (2), the second-stage cleaning tank (3) and the evaporation cylinder (4) through the guide wheel (101), and is characterized in that: The preprocessing module (1) is provided with a brush wheel for cleaning the surface of the solder tape and a cavity for collecting debris. An air outlet (11) is provided on the side of the preprocessing module (1), and the air outlet (11) faces the evaporation cylinder (4). The air outlet (11) generates air flow movement, enabling the debris on the surface of the solder tape to enter the cavity in the preprocessing module (1) for collection. Finally, the air flow moves towards the evaporation cylinder (4). The side of the evaporation cylinder (4) is arrayed with air intake holes (42) along the edge, and there is an upward air flow in the evaporation cylinder (4). The first-stage cleaning tank (2) and the second-stage cleaning tank (3) are arranged below the preprocessing module (1), and a transition section (5) is provided between the first-stage cleaning tank (2) and the second-stage cleaning tank (3). At the same time, the transition section (5) is horizontally located between the preprocessing module (1) and the evaporation cylinder (4). The solder tape is immersed in the first-stage cleaning tank (2) through a guide wheel (101), and then enters the second-stage cleaning tank (3) after passing through the transition section (5). A solder tape drainage groove (52) with a shape consistent with the path of the solder tape is provided on the transition section (5).

2. A multi-stage cleaning tank for a photovoltaic solder ribbon according to claim 1, characterized in that: A downward chamfer is provided at the bottom of the air outlet (11).

3. A multi-stage cleaning tank for a photovoltaic solder strip according to claim 1, characterized in that: The height of the first-stage cleaning tank (2) is higher than that of the second cleaning tank (3), and the transition section (5) is inclined, with the side close to the first-stage cleaning tank (2) being higher than the side far from the first-stage cleaning tank (2).

4. A multi-stage cleaning tank for photovoltaic solder tapes according to claim 1, characterized in that: The air intake holes (42) are inclined upward, and the horizontal height of the outer air intake holes (42) is lower than that of the connected inner air intake holes (42). The air intake holes (42) are overall deflected towards the axis of the evaporation cylinder (4).

5. A multi-stage cleaning tank for photovoltaic solder ribbons according to claim 1, characterized in that: A reflux plate (21) is provided above the first-stage cleaning tank (2). A notch for the solder tape to pass through is provided in the middle of the reflux plate (21). The reflux plate (21) is an acrylic plate with a gap left in the middle, and cooling water passes through the middle gap.

6. The multi-stage cleaning tank for a photovoltaic solder strip according to claim 5, wherein: The reflux plate (21) is inclined, and the horizontal position of the side close to the transition section (5) is lower.

7. A multi-stage cleaning tank for a photovoltaic solder ribbon according to claim 5, characterized in that: Wave-shaped protrusions are provided at the bottom of the reflux plate (21).

8. A multi-stage cleaning tank for a photovoltaic solder strip according to claim 2, characterized in that: An overflow port (51) is provided between the first-stage cleaning tank (2) and the transition section (5). The overflow port (51) is vertically arranged, and a notch for the solder tape to pass through is left in the middle.

9. A multi-stage cleaning tank for a photovoltaic soldering ribbon according to claim 8, characterized in that: Transition section drainage grooves (53) perpendicular to itself are provided on both sides of the solder tape drainage groove (52).

10. A multi-stage cleaning tank for a photovoltaic solder ribbon according to any one of claims 1-9, characterized in that: The evaporation cylinder (4) is fixed above the second-stage cleaning tank (3) through a fixing member (41), and the fixing member (41) adopts a detachable fixation.

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