Surface cleaning system and surface cleaning method for electronic components

Abstract

The present application provides a surface cleaning system and a surface cleaning method for electronic components, and relates to the technical field of electronic component processing. The surface cleaning system includes a transmission unit, a cleaning unit, a dust treatment unit, a detection unit, and a control device. The cleaning unit includes a first laser cleaning device, a flipping mechanism, and a second laser cleaning device. The first laser cleaning device and the second laser cleaning device are used to clean the first surface and the second surface of the workpiece respectively; the dust treatment unit is used to remove dust, and the detection unit is provided on the upstream and downstream sides of the cleaning unit to detect the surface of the workpiece; the control device is suitable for controlling the operation or shutdown of the components through a preset program, and adjusting the preset program according to the detection results of the detection unit. The surface cleaning system and surface cleaning method for electronic components provided by the present application combine cleaning, detection, intelligent control and other modules to realize laser cleaning and secondary cleaning of the workpiece.

Description

Technical Field

[0001] The present application relates to the technical field of electronic component processing, and in particular to a surface cleaning system and a surface cleaning method for electronic components. Background Art

[0002] Electronic components, such as zinc oxide resistors, are core components in zinc oxide lightning arresters to protect power systems from transient overvoltages such as lightning overvoltages and switching overvoltages.

[0003] The processing of zinc oxide resistors includes a cleaning process. Conventional cleaning processes usually use ultrasonic cleaning. However, ultrasonic cleaning cannot remove powder in pits or gaps on the surface of zinc oxide resistors, and has the disadvantage of insufficient cleaning. Summary of the Invention

[0004] In view of the above problems, the present application provides a surface cleaning system and surface cleaning method for electronic components, which combines cleaning, detection, intelligent control and other modules to realize laser cleaning and secondary cleaning of workpieces, improve the cleaning effect, achieve deep cleaning of resistors, reduce the unqualified rate, and ensure the cleaning quality of resistors.

[0005] In one aspect, the present application provides a surface cleaning system for electronic components, comprising:

[0006] A transmission unit, used for transmitting the workpiece;

[0007] a cleaning unit disposed in an area adjacent to the transport unit, the cleaning unit comprising a first laser cleaning device, a flipping mechanism, and a second laser cleaning device sequentially arranged along a transport direction of the workpiece, the first laser cleaning device being adapted to clean a first surface of the workpiece, the flipping mechanism being adapted to flip the workpiece, and the second laser cleaning device being adapted to clean a second surface of the workpiece;

[0008] A dust processing unit having a dust suction chamber, wherein the cleaning unit is located in the dust suction chamber, and the transmission unit is arranged through the dust suction chamber, and the dust processing unit is used to remove dust generated during the cleaning process;

[0009] Detection units are provided on the upstream and downstream sides of the cleaning unit to detect the surface of the workpiece;

[0010] A control device is communicatively connected to the transmission unit, the cleaning unit, the dust treatment unit and the detection unit, and is suitable for controlling the operation or shutdown of components through preset programs, and adjusting the preset programs according to the detection results of the detection unit.

[0011] In a possible implementation, the detection unit includes:

[0012] a first detection device, disposed on the upstream side and the downstream side of the first laser cleaning device, to detect the first surface of the workpiece before and after cleaning by the first laser cleaning device;

[0013] a second detection device, provided on the upstream and downstream sides of the second laser cleaning device, to detect the second surface of the workpiece before and after cleaning by the second laser cleaning device;

[0014] The first detection device and the second detection device are configured to detect dirt distribution on the surface of the workpiece and transmit dirt distribution information to the control device.

[0015] In a possible implementation, the first detection device is a visual detection device; and / or the second detection device is a visual detection device.

[0016] In a possible implementation, the first laser cleaning device and the second laser cleaning device both include:

[0017] A first incoming material detection device is used to detect whether the workpiece has reached the preset cleaning position;

[0018] A laser generator, used to generate laser light;

[0019] A scanning reciprocating device, used for reciprocatingly scanning the surface of the workpiece;

[0020] The control device is configured to communicate with the first incoming material detection device, the laser generator and the scanning reciprocating device respectively to control the working states of the laser generator and the scanning reciprocating device according to the detection results of the first incoming material detection device.

[0021] In a possible implementation, the control device includes:

[0022] a scanning trajectory planning module, communicatively connected to the detection unit, for analyzing the workpiece dirt distribution according to the detection feedback of the detection unit and generating a cleaning trajectory;

[0023] The secondary cleaning trigger module is communicatively connected to the detection unit. The secondary cleaning trigger module is configured to trigger a secondary cleaning procedure when the detection unit detects that the workpiece on the transmission unit has been initially cleaned.

[0024] In one possible implementation, the control device is configured to: when the detection unit detects that the cleaning is unqualified, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit, adjusting the suction parameters of the dust treatment unit, and controlling the transmission speed of the transmission unit; after the initial cleaning of the workpiece is completed, trigger instructions to the cleaning unit, the dust treatment unit, and the transmission unit.

[0025] In a possible implementation, the system further includes a picking unit, wherein the picking unit includes:

[0026] a first picking device, communicatively connected to the first detection device, and configured to pick out workpieces that fail detection by the first detection device from the transport unit;

[0027] The second picking device is communicatively connected to the second detection device, and is used to pick out the workpieces that are unqualified when detected by the second detection device from the transmission unit.

[0028] In a possible implementation, the transmission unit includes a transmission belt.

[0029] The first picking device and the second picking device both include:

[0030] A receiving platform is provided on one side of the conveyor belt, and is used to receive unqualified workpieces;

[0031] A push rod is provided on a side of the conveyor belt opposite to the receiving platform, and a piston rod of the push rod is retractable to transfer unqualified workpieces from the conveying unit to the receiving platform.

[0032] In a possible implementation, the control device further includes:

[0033] The classification and labeling module is communicatively connected to the detection unit and is used to label unqualified workpieces in batches according to the depth or area of ​​the stain.

[0034] In a possible implementation, a sorting arm is further included, which is communicatively connected to the control device and is used to sort the workpieces from the receiving platform to different preset storage areas according to the batches of the labeled workpieces.

[0035] In a possible implementation, the flipping mechanism includes:

[0036] The second incoming material detection device is used to detect whether the workpiece has reached the preset turning position;

[0037] A turning piece is connected to the detection unit for communication, and is used for grabbing and turning the workpiece.

[0038] In one possible implementation, the dust processing unit includes:

[0039] A dust collecting hood is arranged on the outside of the cleaning unit, and the dust collecting hood defines the dust suction chamber;

[0040] The dust collection device includes an induced draft fan and an exhaust pipe, wherein the exhaust pipe is connected to the dust collecting hood and extends to positions of the transmission unit corresponding to the first laser cleaning device and the second laser cleaning device.

[0041] In a possible implementation, the dust collection device further includes:

[0042] a concentration sensor, disposed in the dust collection chamber and communicatively connected to the control device, the concentration sensor being used to detect the concentration of dust;

[0043] A plurality of air ducts are respectively connected to the dust collecting hood and the exhaust duct, and the plurality of air ducts are sequentially spaced apart along the conveying direction of the transmission unit;

[0044] A plurality of adjustment plates, each corresponding to the air duct, wherein the adjustment plates are slidably disposed at the air inlet of the air duct and are suitable for adjusting the size of the air inlet of the air duct;

[0045] A plurality of adjusting driving members are communicatively connected to the control device, the driving members are fixedly arranged in the dust collecting cover, the adjusting driving members correspond to the adjusting plates one by one, and the adjusting driving members are transmission-connected to the adjusting plates.

[0046] In one possible implementation, the exhaust pipe is provided with at least one dust outlet, a slidably arranged sealing plate is provided at the dust outlet, and the exhaust pipe is further provided with a sealing drive member, the sealing drive member is transmission-connected to the sealing plate, and the sealing drive member is communicatively connected to the control device;

[0047] The dust processing unit further includes a dust collecting device, which includes:

[0048] A filter element is provided in the exhaust pipe, and the filter element is provided at the dust outlet;

[0049] The dust collecting component is arranged below the dust outlet.

[0050] In a possible implementation, the dust collection device further includes:

[0051] An air hammer is connected to the filter element, and the air hammer is communicatively connected to the control device.

[0052] In a possible implementation, the filter element includes a first filter screen and a second filter screen, the first filter screen and the second filter screen are arranged at intervals along the exhaust pipe, and the second filter screen is arranged on the downstream side of the first filter screen.

[0053] The mesh size of the first filter is larger than the mesh size of the second filter,

[0054] There are two dust collecting pieces, and the two dust collecting pieces correspond to the first filter screen and the second filter screen respectively.

[0055] In a possible implementation, the device further includes: a feeding unit, configured to feed materials to the transmission unit, the feeding unit including:

[0056] A feeding trolley, wherein the feeding trolley is provided with a material platform for carrying workpieces;

[0057] A loading device is used to transfer the workpiece on the material platform to the transmission unit.

[0058] In a possible implementation, the method further includes:

[0059] The collecting unit is provided at the downstream side of the cleaning unit, and is used for receiving the workpieces cleaned by the cleaning unit and qualified by the detection unit from the transmission unit.

[0060] On the other hand, the present application provides a surface cleaning method for electronic components, which is applied to the surface cleaning system for electronic components in any of the above possible implementations, comprising the following steps:

[0061] Controlling the dust treatment unit to start;

[0062] Loading the workpiece onto the transmission unit, and the transmission unit transmits the workpiece to the cleaning unit;

[0063] Controlling the cleaning unit to perform laser cleaning on the workpiece;

[0064] The control detection unit detects the surface of the workpiece to determine whether the cleaning is qualified;

[0065] If qualified, the workpiece that has passed the inspection is transferred to the collection unit;

[0066] If unqualified, the unqualified workpiece will be picked out;

[0067] After the workpieces on the transfer unit have been cleaned for the first time, the secondary cleaning process is triggered;

[0068] The control detection unit detects again.

[0069] In a possible implementation, controlling the cleaning unit to perform laser cleaning on the workpiece includes:

[0070] controlling the first laser cleaning device to clean the first surface of the workpiece;

[0071] Controlling the turning mechanism to turn the workpiece over;

[0072] The second laser cleaning device is controlled to clean the second surface of the workpiece.

[0073] In a possible implementation, controlling the detection unit to detect the surface of the workpiece, and controlling the detection unit to detect again, include:

[0074] performing image detection on the first surface of the workpiece after being cleaned by the first laser cleaning device;

[0075] picking out the workpieces that fail the first surface inspection from the transmission unit;

[0076] performing image detection on the second surface of the workpiece after being cleaned by the second laser cleaning device;

[0077] The workpieces that fail the second surface inspection are sorted out from the transport unit.

[0078] In a possible implementation, picking out unqualified workpieces includes:

[0079] A secondary scanning trajectory is generated based on the dirt distribution of the unqualified workpiece.

[0080] In a possible implementation, picking out unqualified workpieces includes:

[0081] Classify and label unqualified workpieces according to the depth or area of ​​stains and organize them into different batches;

[0082] Corresponding laser parameters and dust collection parameters are obtained for different batches of workpieces.

[0083] In a possible implementation, the laser parameters include laser power, pulse frequency, and scanning speed;

[0084] The dust collection parameters include the size of the air inlet of the induced draft duct and the suction force of the induced draft fan.

[0085] In a possible implementation, the controlling the detection unit to detect again includes:

[0086] If qualified, the workpiece that has passed the inspection is transferred to the collection unit;

[0087] If unqualified, the unqualified workpiece will be picked out.

[0088] The surface cleaning system and surface cleaning method of electronic components disclosed in the present application achieve laser cleaning of the first and second surfaces of a resistor by means of a first laser cleaning device and a second laser cleaning device. Laser cleaning controls the energy of the light beam to penetrate and remove tiny powders in the pits and crevices of the resistor end face, thereby resolving the problem of deep cleaning that is difficult to achieve with ultrasonic cleaning in conventional technologies. Furthermore, laser cleaning does not require direct contact with the workpiece, thus avoiding the physical damage or secondary contamination that may be caused by traditional cleaning methods. Compared to conventional ultrasonic cleaning, which requires the use of more water resources and cleaning agents, laser cleaning does not produce wastewater and has lower energy consumption, thus meeting the requirements of green production. Furthermore, the detection unit and the control device can be used in coordination to achieve secondary cleaning of unqualified workpieces, further improving the cleaning effect and achieving deep cleaning of the resistor.

[0089] Furthermore, this electronic component surface cleaning system adjusts cleaning parameters based on feedback from the inspection unit, laser-cleansing resistors and selectively selects unqualified components for secondary cleaning. This ensures the cleaning quality of the resistors, ensuring that every resistor meets the preset cleaning requirements and reducing the rejection rate. By optimizing cleaning parameters, the cleaned end faces of the resistors are free of residual powder after cleaning, improving the surface cleanliness of the resistors, guaranteeing the qualified rate and current-carrying capacity of the resistors, and ensuring stable and reliable cleaning quality.

[0090] Furthermore, the inclusion of a dust treatment unit effectively controls dust emissions during the cleaning process, ensuring a clean working environment and enhancing operator comfort. Furthermore, this reduces equipment maintenance frequency and downtime, further improving the overall operational efficiency of the production line, optimizing production processes, and ensuring a consistently clean production environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0091] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0092] Figure 1 This is a schematic structural diagram of a surface cleaning system for electronic components according to an embodiment of the present application;

[0093] Figure 2 A schematic structural diagram of the surface cleaning system for electronic components according to an embodiment of the present application from another angle;

[0094] Figure 3 for Figure 2 Schematic diagram of the structure of the medium dust treatment unit;

[0095] Figure 4 for Figure 3 A schematic diagram of the structure of the dust collection device;

[0096] Figure 5 Flowchart of a surface cleaning method for electronic components according to an embodiment of the present application.

[0097] Description of reference numerals:

[0098] 100-transmission unit; 110-transmission belt;

[0099] 200 - cleaning unit; 210 - laser cleaning module; 211 - first laser cleaning device; 212 - second laser cleaning device; 210a - first incoming material detection device; 210b - laser generator; 220 - flipping mechanism; 221 - second incoming material detection device; 222 - flipping member;

[0100] 300 - dust handling unit; 310 - dust collection chamber; 320 - dust collection hood; 330 - dust collection device; 331 - exhaust pipe; 332 - induced draft fan; 333 - concentration sensor; 334 - induced draft pipe; 335 - adjustment plate; 336 - adjustment drive; 340 - dust collection device; 341 - filter element; 341a - first filter screen; 341b - second filter screen; 342 - dust collection element; 343 - air hammer;

[0101] 400 - detection unit; 410 - first detection device; 420 - second detection device; 430 - picking unit; 431 - first picking device; 432 - second picking device; 430a - receiving platform; 430b - push rod;

[0102] 500-feeding unit; 510-feeding trolley; 511-first fence; 520-loading device;

[0103] 600-collection unit; 610-collection trolley; 611-second fence; 620-unloading device;

[0104] 700-Control device. DETAILED DESCRIPTION

[0105] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0106] Electronic components, taking zinc oxide resistors as an example, zinc oxide resistors are the core components of zinc oxide lightning arresters, which are used to protect power systems from transient overvoltages such as lightning overvoltages and switching overvoltages.

[0107] The processing of zinc oxide resistors includes: slurry preparation - granulation - water - molding - debinding - sintering - side insulation treatment - heat treatment - grinding - cleaning - aluminum spraying. Among them, the main purpose of the cleaning process is to remove the powder generated by the previous grinding process to provide a clean and tidy end face for the next aluminum spraying process.

[0108] Conventional cleaning processes typically utilize ultrasonic cleaning, which utilizes cavitation bubbles generated by an ultrasonic generator in a water tank to impact the resistor wafer end face, mechanically removing any adherent powder left behind during the grinding process and achieving the desired cleanliness. Specifically, when strong ultrasonic waves propagate through liquids, they generate acoustic cavitation due to nonlinear effects. The shock waves emitted when cavitation bubbles suddenly close can generate pressures exceeding thousands of atmospheres around them. This direct and repeated impact on the dirt layer disrupts the adsorption of dirt to the surface of the cleaning component and, at the same time, breaks down the dirt layer, freeing it from the surface and dispersing it into the cleaning fluid.

[0109] However, the ultrasonic cleaning method has the disadvantage of insufficient cleaning. For example, the powder in the pits and gaps formed on the end face of the resistor during the grinding process cannot be completely removed. In addition, the powder dispersed in the water will adhere to the end face again. During the test, although the cleaning was carried out four times in different stages, samples were taken from the final product for microscopic observation and wiping, and powder that was not cleaned clean was still observed.

[0110] In addition, the amount of wastewater generated by the ultrasonic cleaning device for resistors is large and its environmental performance is poor. Specifically, the medium used for ultrasonic cleaning is tap water, and the total volume of the cleaning main tank and the overflow circulation auxiliary tank is about 2m 3 , water needs to be changed every two days, with a water consumption of 30 tons per month. In addition, cleaning agents are required in the rough and fine washing steps at the front end, and the wastewater generated needs to be treated before discharge, which puts great pressure on water resources and environmental protection.

[0111] To address this issue, those skilled in the art have implemented various strategies to improve cleaning quality. For example, increasing the power of the ultrasonic generator to impact the resistor end face with stronger-pressure cavitation bubbles, freeing the grinding powder adhering to the end face and the powder trapped in the gaps. Another approach involves increasing the number of cleaning cycles to minimize the reattachment of the detached powder to the end face. Furthermore, adding cleaning agents, primarily water-based surfactants and some chemical additives, to absorb and lubricate the grinding powder, accelerating its suspension and achieving rapid removal. However, despite these measures, the powder trapped in the pits and gaps formed during the grinding process on the resistor end face cannot be completely removed, and some residue remains under microscopic observation.

[0112] In view of this, the present application provides a surface cleaning system and surface cleaning method for electronic components, which realizes laser cleaning of the first and second surfaces of the resistor by means of a first laser cleaning device and a second laser cleaning device. Laser cleaning controls the energy of the light beam to penetrate and peel off the tiny powder in the pits and gaps on the end face of the resistor, thereby solving the problem of deep cleaning that is difficult to achieve with ultrasonic cleaning in conventional technology. In addition, laser cleaning does not require direct contact with the workpiece, avoiding the physical damage or secondary pollution that may be caused by traditional cleaning methods. Compared with conventional ultrasonic cleaning that requires more water resources and cleaning agents, laser cleaning does not produce wastewater, has lower energy consumption, and meets the requirements of green production. In addition, the detection unit and the control device can cooperate to achieve secondary cleaning of unqualified workpieces, further improving the cleaning effect and achieving deep cleaning of the resistor.

[0113] Furthermore, this electronic component surface cleaning system adjusts cleaning parameters based on feedback from the inspection unit, laser-cleansing resistors and selectively selects unqualified components for secondary cleaning. This ensures the cleaning quality of the resistors, ensuring that every resistor meets the preset cleaning requirements and reducing the rejection rate. By optimizing cleaning parameters, the cleaned end faces of the resistors are free of residual powder after cleaning, improving the surface cleanliness of the resistors, guaranteeing the qualified rate and current-carrying capacity of the resistors, and ensuring stable and reliable cleaning quality.

[0114] Furthermore, the inclusion of a dust treatment unit effectively controls dust emissions during the cleaning process, ensuring a clean working environment and enhancing operator comfort. Furthermore, this reduces equipment maintenance frequency and downtime, further improving the overall operational efficiency of the production line, optimizing production processes, and ensuring a consistently clean production environment.

[0115] The following combination Figures 1 to 5 A surface cleaning system for electronic components according to an embodiment of the first aspect of the present application is described.

[0116] This embodiment of the electronic component surface cleaning system, using zinc oxide resistors (hereinafter referred to as resistors) as an example, is primarily designed to improve the cleanliness of the resistor cleaning process. Fundamentally, the goal of improving the cleanliness of the resistor cleaning process is to increase the adhesion between the aluminum electrode and the resistor end surface substrate during the subsequent aluminum spraying process, reduce the contact resistance between the two, and improve the current distribution uniformity during electrical testing, thereby enhancing the quality of the resistor (including both the pass rate and the current carrying capacity). From a process perspective, increased adhesion is determined by the grinding process, primarily characterized by the roughness of the resistor end surface substrate after grinding. Reducing contact resistance and improving current distribution uniformity are dependent on the cleanliness of the cleaning process.

[0117] The grinding process involves grinding the upper and lower end surfaces (i.e., the first and second surfaces) of the circular resistor. This is done, on the one hand, to trim the sintered resistor end surfaces to achieve parallelism and flatness requirements, facilitating stacking during assembly to form a coaxial cylinder. It is also done to ensure that the roughness of the two end surfaces reaches an appropriate range, facilitating the subsequent aluminum spraying process to spray aluminum electrodes and ensure good current-carrying capacity for the upper and lower end surfaces of the resistor. The reason for the appropriate range of roughness is that if the roughness is too high (for example, a diamond grinding wheel with a mesh size of 80), the edges of the cylindrical resistor end surfaces will be chipped during grinding, forming a jagged shape. These defects can cause side flashover during current carrying, rendering the resistor scrapped. If the roughness is too low (for example, a diamond grinding wheel with a mesh size of 200), the end surfaces are too smooth, making it difficult for ionized aluminum powder to adhere to the end surface substrate during aluminum spraying. Heat generated during current carrying can ablate the aluminum electrodes or cause localized breakdown.

[0118] In the ultrasonic cleaning process, the powder state attached to the end face after grinding is covered with the uneven "curved surface" of the end face from the microscopic observation. The main reason for unclean cleaning is that the powder in the depression is not completely separated from the pit during the cavitation crushing pressure impact. In this way, when spraying aluminum, in addition to the convex surface fully adhering to the ionized aluminum powder under the high pressure impact, the powder in the pit position forms a sandwich between the aluminum powder and the bottom of the pit. This sandwich not only reduces the effective contact area between the aluminum powder and the "curved surface" of the substrate, causing the adhesion to decrease, but also the existence of the sandwich increases the contact resistance between the aluminum electrode and the substrate, resulting in uneven current distribution on the end face when carrying current, which can easily cause local excessive current and heat, resulting in breakdown and failure of the resistor.

[0119] It can be seen that the roughness of the grinding process and the cleanliness of the ultrasonic cleaning process will have a significant impact on the current-carrying capacity of the resistor, which will in turn reduce the product qualification rate and long-term operation reliability.

[0120] refer to Figures 1-4The surface cleaning system of electronic components of this embodiment includes a transmission unit 100, a cleaning unit 200, a dust processing unit 300, a detection unit 400 and a control device 700.

[0121] The transmission unit 100 is used to transport a workpiece. In this embodiment, the workpiece is a zinc oxide resistor (hereinafter referred to as a resistor). Optionally, the transmission unit 100 may include a main frame, a stepper motor, a transmission belt 110, and transmission rollers. The main frame can be constructed of standard aluminum alloy or alternatively, 2-series stainless steel. The stepper motor is PID controlled. The transmission belt 110 is constructed of a polyester core material, but nylon or other durable and mildew-resistant materials can also be used. The transmission support rollers are constructed of standard electro-galvanized steel pipes and bearings, and thin-walled stainless steel pipes can also be used.

[0122] In addition, a cleaning unit 200 is provided in the vicinity of the transport unit 100. The cleaning unit 200 includes a laser cleaning module 210 and a flipping mechanism 220. Specifically, the cleaning unit 200 includes a first laser cleaning device 211, a flipping mechanism 220, and a second laser cleaning device 212 arranged sequentially along the transport direction of the workpiece. The first laser cleaning device 211 is suitable for cleaning the first surface of the workpiece, the flipping mechanism 220 is used to flip the workpiece, and the second laser cleaning device 212 is used to clean the second surface of the workpiece. Optionally, both the first laser cleaning device 211 and the second laser cleaning device 212 can be nanosecond pulse laser cleaning machines.

[0123] The dust treatment unit 300 has a dust collection chamber 310. The cleaning unit 200 is located within the dust collection chamber 310, and the transfer unit 100 is disposed within the dust collection chamber 310. The dust treatment unit 300 is used to remove dust generated during the cleaning process. Optionally, the dust treatment unit 300 can be opened before the cleaning unit 200 operates and closed after the transfer unit 100 completes the workpiece transfer. This pre-purifies the air in the dust collection chamber 310, prevents dust from spreading in the environment, and reduces potential dust pollution.

[0124] In this way, the present application can achieve laser cleaning of the first surface and the second surface of the resistor through the first laser cleaning device 211 and the second laser cleaning device 212. Specifically, the laser beam generated by the laser generator 210b is focused on the end face of the resistor for scanning, and the adhered powder on the end face is separated from the end face of the substrate through the thermal effect. Then, the powder is taken away by negative pressure exhaust through the dust treatment unit 300 to achieve the purpose of cleaning the surface.

[0125] The inspection unit 400 is provided on the upstream and downstream sides of the cleaning unit 200 to inspect the surface of the workpiece before and after cleaning by the cleaning unit 200. Optionally, the inspection means may include visual inspection, laser scanning, infrared thermal imaging, etc. to inspect the cleanliness, flatness, defects, etc. of the workpiece surface.

[0126] It can be understood that the detection unit 400 located on the upstream side of the cleaning unit 200 can be used to observe the distribution of stains on the surface of the workpiece and match the instructions of the control device 700, which is suitable for adjusting the parameters of each component during the secondary cleaning; and the detection unit 400 located on the downstream side of the cleaning unit 200 can be used to scan the distribution of stains on the workpiece after cleaning and transmit it to the control device 700.

[0127] The control device 700 is communicatively connected to the transmission unit 100 , the cleaning unit 200 , the dust treatment unit 300 and the detection unit 400 , and is suitable for controlling the operation or shutdown of components through preset programs, and adjusting the preset programs according to the detection results of the detection unit 400 .

[0128] In addition, the control device is also configured to generate corresponding secondary cleaning parameter instructions based on the dirt distribution data provided by the detection unit 400. When the detection unit 400 detects the data on the transmission unit 100 again, the instructions are transmitted to the cleaning unit 200, the dust treatment unit 300 and the transmission unit 100.

[0129] In this way, the present application can determine whether the workpiece is qualified for cleaning through the detection results of the detection unit 400. If it is unqualified, the dirt distribution data of the detection results will be transmitted to the control device 700. Subsequently, the control device 700 will derive a secondary cleaning trajectory based on the dirt distribution data, and derive the corresponding secondary cleaning parameters for the secondary cleaning, such as the laser power, pulse frequency, and scanning speed of the cleaning unit, the suction parameters of the dust treatment unit, and the transmission speed of the control transmission unit, etc., and then prepare a secondary cleaning process for unqualified workpieces.

[0130] As can be seen, the surface cleaning system for electronic components of the present application uses laser cleaning to control the energy of the light beam to penetrate and remove the tiny powder in the pits and gaps on the end face of the resistor, thus solving the problem of deep cleaning that is difficult to achieve with ultrasonic cleaning in conventional technologies. In addition, laser cleaning does not require direct contact with the workpiece, avoiding the physical damage or secondary pollution that may be caused by traditional cleaning methods. Compared with conventional ultrasonic cleaning, which requires more water resources and cleaning agents, laser cleaning does not produce wastewater and has lower energy consumption, meeting the requirements of green production. In addition, the detection unit 400 and the control device 700 can cooperate to achieve secondary cleaning of unqualified workpieces, further improving the cleaning effect and achieving deep cleaning of the resistor.

[0131] Furthermore, the electronic component surface cleaning system adjusts cleaning parameters based on feedback from the detection unit 400, laser-cleansing the resistors and selectively selects unqualified resistors for secondary cleaning. This ensures the cleaning quality of the resistors, ensuring that every resistor meets the preset cleaning requirements and reducing the rejection rate. By optimizing cleaning parameters, the cleaned end surfaces of the resistors are free of residual powder after cleaning, improving the surface cleanliness of the resistors, guaranteeing the qualified rate and current-carrying capacity of the resistors, and ensuring stable and reliable cleaning quality.

[0132] Furthermore, the dust treatment unit 300 effectively controls dust emissions during the cleaning process, ensuring a clean working environment and enhancing operator comfort. Furthermore, it reduces equipment maintenance frequency and downtime, further improving the overall operational efficiency of the production line, optimizing production processes, and ensuring a consistently clean production environment.

[0133] Optionally, the dust treatment unit 300 can also be designed with a concentration detection module to automatically adjust the suction force according to the dust concentration to ensure efficient dust collection. Optionally, the dust treatment unit 300 can also be designed with a dust interception module and a dust collection module to implement regular cleaning after dust interception, maintain high-efficiency filtration performance, further improve dust treatment efficiency, and ensure long-term stable operation of the system.

[0134] In some embodiments, an interlocking control device or a logic control system may be provided between the dust handling unit 300 and the cleaning unit 200 to ensure that the main switch of the cleaning unit 200 is only allowed to be turned on when the dust handling unit 300 is turned on and operating normally.

[0135] In one embodiment, combining Figure 1 and Figure 2 The first laser cleaning device 211 and the second laser cleaning device 212 each include a first incoming material detection device 210a, a laser generator 210b, and a scanning reciprocating device. The first incoming material detection device 210a is used to detect whether the workpiece has reached a preset cleaning position. Optionally, the first incoming material detection device 210a may be equipped with a sensor, such as a photoelectric sensor or a proximity sensor. When the workpiece reaches the preset position, the sensor will send a signal to trigger subsequent operations.

[0136] Laser generator 210b is the core component of the laser cleaning device, used to generate laser light. Laser light has high energy density, controllable direction, and strong focusing ability. It can break the bond between contaminants and the substrate, causing the contaminants to vaporize or fall off, thereby achieving the cleaning purpose. For example, laser generator 210b can be a pulse generator, a continuous laser generator, etc.

[0137] The scanning reciprocating device is used to scan the surface of the workpiece reciprocatingly to ensure the uniformity of the laser; the control device 700 is configured to communicate with the first incoming material detection device 210a, the laser generator 210b and the scanning reciprocating device respectively to control the working status of the laser generator 210b and the scanning reciprocating device according to the detection results of the first incoming material detection device 210a.

[0138] Optionally, the control device 700 may include a touch control screen, a software system, a composite material housing, an aluminum alloy bracket, etc.

[0139] Specifically, the control device 700 receives signals from the first incoming material detection device 210a to determine whether the workpiece has reached the preset position. Based on this determination, the control device 700 controls the on / off state of the laser generator 210b, including parameters such as the laser's output power and pulse frequency. The control device also controls the trajectory, speed, and direction of the scanning reciprocating device to ensure that the laser cleans the workpiece along the preset path, completing the laser cleaning operation.

[0140] Optionally, the control device 700 can also be communicatively connected to the transmission unit 100, the cleaning device, the dust treatment unit 300, the feeding unit 500, the collection unit 600, etc., so as to control the operating units in the surface cleaning system according to the program input by the operator to realize automatic cleaning.

[0141] Optionally, the control device 700 may also have fault alarm and safety protection functions, so as to promptly issue an alarm signal and take corresponding protective measures when a fault or abnormal situation occurs in the equipment.

[0142] The following is a detailed explanation of the principles of laser cleaning. The main processes can be summarized into three categories: vaporization, impact, and oscillation. Specifically, when the laser beam from an ultrashort pulse width (ns), ultrahigh peak power (107–1010W / cm2) laser reaches the surface of the substrate, the surface temperature rises sharply, and the surrounding air is ionized, forming a plasma. The plasma blocks the laser from reaching the material surface. The plasma continues to absorb the laser energy, and the temperature continues to rise, forming a local ultra-high temperature and ultra-high pressure state, which produces a transient impact of 1-100 kbar on the material surface and gradually transmits it into the material. Under the action of the shock wave, the surface contaminants are shattered into tiny dust, particles, or fragments. When the laser moves away from the irradiation position, the plasma disappears, and a local negative pressure is generated, and the contaminant particles or fragments are removed from the surface. In addition to impacting contaminants, the laser beam also impacts and breaks the surface's uneven surfaces. From a macroscopic perspective, the laser beam performs a dot-matrix scan across the surface, moving left and right. Movement in the forward and backward directions controls the spacing between dot-matrix scans. This manifests as wavy lines and increased roughness compared to pre-cleaning. The fragments shattered by the shockwave (including abrasive powder and substrate) are then carried away by negative pressure ventilation, achieving the desired cleaning effect.

[0143] Furthermore, when comparing the impact force of the plasma shockwave generated by laser cleaning with the cavitation bubbles produced by ultrasonic cleaning, the former can reach up to 100 times greater than the latter, which is the main reason for the different cleaning levels between the two methods. Furthermore, the former can change the roughness of the resistor end surface substrate, while the latter cannot, which can also affect the grinding and aluminum spraying processes, thus affecting product quality.

[0144] In principle, laser cleaning offers the following advantages for cleaning ceramic resistors: First, by increasing the roughness, it expands the end face's extended area. Under the same conditions, when aluminum electrodes are sprayed, the electrode area increases accordingly. Second, by increasing the cleanliness, it eliminates pits and interlayers, significantly increasing bonding strength and further reducing contact resistance. These two changes result in increased adhesion after aluminum spraying and reduced end face heat generation during current carrying, thereby reducing electrode ablation and localized breakdown caused by uneven current carrying and improving product qualification rates.

[0145] While the above theoretical analysis demonstrates the numerous differences between this application and existing ultrasonic cleaning processes, many practical challenges remain. The following will explore, through practical examples, the design of automated equipment and the determination of optimal process parameters for laser cleaning of resistors. See Examples 1 through 10 for details. Optionally, a nanosecond pulsed laser cleaning machine may be used as the cleaning basis in Examples 1-10.

[0146] The relationship between the power, frequency, pulse width and scanning mode of the laser generator 210b was compared with the embodiments by means of experimental verification to determine the optimal process parameters suitable for laser cleaning of resistors.

[0147] Example 1

[0148] Step 1: Preparation of resistor sheet before cleaning

[0149] ① 200 D42 resistors from the same batch were sampled and ground using a 170-grit diamond grinding wheel to a grinding height of 24mm. ② 100 resistors were ultrasonically cleaned using the same process parameters as in existing batch production. After cleaning, 5 resistors were tested for surface finish (roughness) and the average value was recorded. See Table 1 - Surface Roughness of Resistors by Different Cleaning Methods (hereinafter referred to as Table 1). ③ The remaining 100 resistors were rinsed with clean water and allowed to air dry for later use.

[0150] Step 2: Laser Cleaning

[0151] ①Preparation and start-up of cleaning device.

[0152] The laser cleaning module 210 is started, and 100 resistor sheets that have not been ultrasonically cleaned are placed on the material table. After the self-test is completed, the system enters the standby state.

[0153] ②Parameter setting.

[0154] The control program sets the laser generator 210b to 150W power, 550kHz frequency, 60ns pulse width, single-row single-shot scanning (straight line), and 6500mm / s scanning speed. Simulate focusing and, upon completion, activate the automatic operation button.

[0155] ③Laser cleaning and cutting.

[0156] In automatic operation, the resistors undergo a complete cleaning process: grabbing the material from the material table, transferring it along a conveyor belt, inspecting it with an infrared light detector, scanning it with a laser, inspecting its image, flipping it over, inspecting it with an infrared light detector, scanning it with a laser, inspecting its image, and finally unloading it. After cleaning, five resistors are sampled for end-face roughness testing, and the average value is recorded. See Table 1 for details.

[0157] Step 3: Aluminum spraying and adhesion and electrical performance testing

[0158] ① The ultrasonically cleaned resistor end faces were aluminum-sprayed, using the same parameters as conventional production. After spraying, three resistors were sampled for adhesion testing. The test values ​​are shown in Table 2 - Adhesion and Electrical Performance Results of Resistors Using Different Cleaning Methods (hereinafter referred to as Table 2). The remaining 97 resistors were then screened using a 2ms square wave, 400A current surge test. After screening, three resistors were sampled for a 65kA high-current surge test using a 4 / 10 waveform. The results are reported in Table 2.

[0159] ② The laser-cleaned resistor end faces were aluminum-sprayed, using the same parameters as conventional production. After spraying, three resistors were sampled for adhesion testing. The test results are shown in Table 2 below. The remaining 97 resistors were then screened using a 2ms square wave, 400A current surge test. After screening, three resistors were sampled for a 65kA high-current surge test using a 4 / 10 waveform. The results are reported in Table 2.

[0160] Since there is no parameter adjustment in ultrasonic cleaning, ultrasonic cleaning sample preparation is not performed in the following Examples 2-10. Example 1 is used as a comparative reference, and the number of samples is 100.

[0161] Example 2:

[0162] The rest is the same as Example 1 except for the following changes: The scanning mode of the laser generator 210b is single row double (tic-tac-toe).

[0163] Example 3:

[0164] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 200W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row single shot, and the scanning speed is 6500mm / s.

[0165] Example 4:

[0166] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row and single time (straight line), and the scanning speed is 6500mm / s.

[0167] Example 5:

[0168] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 700kHz, the pulse width is 60ns, the scanning mode is single row single shot, and the scanning speed is 6500mm / s.

[0169] Example 6:

[0170] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 500kHz, the pulse width is 60ns, the scanning mode is single row single shot, and the scanning speed is 6500mm / s.

[0171] Example 7:

[0172] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 70ns, the scanning mode is single row single shot, and the scanning speed is 6500mm / s.

[0173] Example 8:

[0174] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 50ns, the scanning mode is single row single shot, and the scanning speed is 6500mm / s.

[0175] Example 9:

[0176] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 60ns, the scanning mode is single row single shot, and the scanning speed is 5500mm / s.

[0177] Example 10:

[0178] The rest is the same as Example 1 except for the following changes: the power of the laser generator 210b is 100W, the frequency is 550kHz, the pulse width is 70ns, the scanning mode is single row single shot, and the scanning speed is 7000mm / s.

[0179] Table 1 - Surface roughness of resistors using different cleaning methods

[0180]

[0181] Table 2 - Adhesion and electrical performance of resistors using different cleaning methods

[0182]

[0183] Table 1 shows that laser cleaning significantly increases the roughness of the resistor end face compared to ultrasonic cleaning. This is evident from Table 2, where the adhesion of the two methods is approximately twice that of the former. Electrical performance does not necessarily follow the rule that greater roughness always leads to greater adhesion. Example 2 illustrates this point. The adhesion of the sample shows that not all of the aluminum layer is separated from the bonded, pulled surface of Example 2; a portion remains on the resistor surface. Excessive roughness around the perimeter of the sample creates visible micro-notches, damaging the side insulation and potentially causing side flashover or edge collapse, resulting in product rejection.

[0184] The square wave screening pass rate and high current impact results in Table 2 demonstrate that excessively small or large roughness levels do not improve the electrical performance of the resistor (e.g., Examples 2 and 3). The choice of scanning pattern is also crucial, with a straight line pattern being significantly better than a cross-shaped pattern. The optimal laser cleaning process parameters were determined based on the process parameters of Examples 4, 9, and 10, which performed well.

[0185] As can be seen, Examples 1 to 10, by adjusting parameters suitable for cleaning resistors after grinding, optimizing the parameter range, and designing an automated cleaning system, improved cleaning cleanliness and increased aluminum spray adhesion, thereby contributing 2 to 3 percentage points to the product qualification rate. By studying the relationship between the power, frequency, and pulse width of the laser generator 210b, as well as the scanning mode, and conducting comparative studies using experimental verification, the single-chip single-shot, single-chip double-shot, side-by-side single-shot, and side-by-side multiple-shot schemes suitable for resistor cleaning were verified. The optimal process parameters for resistor laser cleaning were determined, achieving the goal of clean, efficient, and highly adhesive cleaning products, while also being environmentally friendly and energy-saving.

[0186] In addition, in Examples 1 to 10, the first laser cleaning device 211 and the second laser cleaning device 212 use nanosecond pulse laser cleaning machines, which have the advantages of high efficiency, small footprint, low energy consumption, no wastewater generation, and no use of cleaning agents compared to traditional ultrasonic cleaning.

[0187] In one embodiment, combining Figure 1 and Figure 2 There are two first detection devices 410 and two second detection devices 420 respectively. The two first detection devices 410 are respectively arranged on the upstream side and downstream side of the first laser cleaning device 211 to detect the first surface of the workpiece before and after cleaning by the first laser cleaning device 211, so as to observe the dirt distribution on the first surface of the workpiece and determine whether the cleaning quality of the first surface meets the requirements.

[0188] The two second detection devices 420 are respectively arranged on the upstream and downstream sides of the second laser cleaning device 212 to detect the second surface of the workpiece before and after cleaning by the second laser cleaning device 212, so as to observe the dirt distribution on the second surface of the workpiece and determine whether the cleaning quality of the second surface meets the requirements.

[0189] Optionally, the first detection device 410 and the second detection device 420 may use optical detection, image recognition and other technologies to monitor the cleanliness, residues and the like on the surface of the workpiece.

[0190] The first detection device 410 and the second detection device 420 can be configured to detect the dirt distribution on the workpiece surface and transmit the dirt distribution information to the control device 700. Then, under the control of the control device 700, the cleaning unit 200 can cooperate with other components to perform a second cleaning on unqualified workpieces after the normal first cleaning is completed.

[0191] In one embodiment, combining Figure 1 and Figure 2 , the first detection device 410 is a visual detection device; and / or, the second detection device 420 is a visual detection device.

[0192] Specifically, the visual inspection device uses a camera and image processing algorithms to accurately detect minor defects, residues, and cleanliness on a workpiece surface. Furthermore, the visual inspection device does not require direct contact with the workpiece surface, thus avoiding issues such as scratches, contamination, or damage caused by contact.

[0193] In some embodiments, the control device 700 includes a scanning trajectory planning module and a secondary cleaning triggering module. The scanning trajectory planning module is communicatively connected to the detection unit 400 and is used to analyze the workpiece dirt distribution based on the detection feedback of the detection unit 400 and generate a cleaning trajectory.

[0194] Specifically, based on the detection feedback provided by the detection unit 400, the scanning trajectory planning module will conduct an in-depth analysis of the dirt distribution on the workpiece surface, which may include information such as the type, density, and distribution area of ​​the dirt.

[0195] Based on these analysis results, the scanning trajectory planning module can intelligently generate a cleaning trajectory that ensures that the cleaning unit can fully cover the dirt area on the workpiece, thereby achieving the best cleaning effect.

[0196] The secondary cleaning trigger module is communicatively connected to the detection unit 400 . The secondary cleaning trigger module is configured to trigger the secondary cleaning procedure when the detection unit 400 detects that the workpiece on the transmission unit 100 that has been initially cleaned is finished.

[0197] It is understood that once the trigger conditions are met, the secondary cleaning trigger module will initiate a secondary cleaning process. This secondary cleaning process may include adjusting cleaning parameters, replanning the cleaning trajectory, and picking up temporarily stored unqualified workpieces onto the transfer unit 100 to achieve secondary cleaning of the workpieces. In this way, unqualified workpieces can achieve the desired cleanliness through secondary cleaning.

[0198] As can be seen, the scanning trajectory planning module and the secondary cleaning trigger module enhance the intelligence and automation of the cleaning process. The scanning trajectory planning module ensures targeted and efficient cleaning, while the secondary cleaning trigger module provides additional protection, improving the cleaning standard of unqualified workpieces.

[0199] In some embodiments, the control device 700 is configured to: when the detection unit 400 detects that the cleaning is unqualified, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit 200, adjusting the suction parameters of the dust treatment unit 300, and controlling the transmission speed of the transmission unit 100, etc.

[0200] After the workpiece is initially cleaned, instructions are triggered to the cleaning unit 200 , the dust treatment unit 300 and the transmission unit 100 .

[0201] Optionally, after the workpiece is initially cleaned, when the detection unit 400 detects the target workpiece again, the control device 700 triggers instructions to the cleaning unit 200, the dust treatment unit 300 and the transmission unit 100 according to the memorized instructions.

[0202] By memorizing instructions based on the dirt distribution on the workpiece and triggering them after the initial cleaning, the control device 700 can control and optimize the entire cleaning process. This design improves cleaning efficiency and quality, reduces rework and costs caused by improper operation, and improves product quality after secondary cleaning.

[0203] In one embodiment, combining Figure 1 and Figure 2 The electronic component surface cleaning system further includes a picking unit 430, which includes a first picking device 431 and a second picking device 432. The first picking device 431 is connected to the first detection device 410 for communication and is used to pick out workpieces that fail the first detection device 410 from the transport unit 100; the second picking device 432 is connected to the second detection device 420 for communication and is used to pick out workpieces that fail the second detection device 420 from the transport unit 100.

[0204] Specifically, when the first inspection device 410 detects incomplete cleaning, excessive residue, or other quality issues on the first surface of a workpiece, it sends a signal to the first picking device 431. Upon receiving the signal, the first picking device 431 initiates and performs a picking operation, removing unqualified workpieces from the transport unit 100. Correspondingly, after the workpiece has been cleaned by the second laser cleaning device 212 and the second inspection device 420 performs a quality inspection on its second surface, if any quality issues are detected, the second picking device 432 is responsible for picking out the unqualified workpieces from the transport unit 100.

[0205] Exemplarily, the first picking device 431 and the second picking device 432 can be implemented by a robotic arm, a pneumatic gripper or other automated picking mechanisms.

[0206] By setting up a first picking device 431 and a second picking device 432, unqualified workpieces are picked out from the transmission unit 100 according to the signal of the first detection device 410 or the second detection device 420, ensuring that only qualified workpieces can enter the next process, thereby improving the automation level of the surface cleaning system and the product quality control capability.

[0207] In one embodiment, combining Figure 1 and Figure 2 The transport unit 100 includes a transport belt 110 , and the first picking device 431 and the second picking device 432 each include a receiving platform 430 a and a push rod 430 b .

[0208] A receiving platform 430a is located on one side of the conveyor belt 110 and is used to receive rejected workpieces. Optionally, the receiving platform 430a can be designed to be movable or liftable to facilitate removal of rejected workpieces from the system or subsequent processing. Optionally, the receiving platform 430a can also be equipped with sensors or indicator lights to record the location and number of rejected workpieces.

[0209] Push rod 430b is located on the side of conveyor belt 110 opposite receiving platform 430a. The piston rod of push rod 430b is retractable to transfer unqualified workpieces from conveyor unit 100 to receiving platform 430a. Optionally, push rod 430b can be driven pneumatically, hydraulically, or electrically. When the inspection device detects an unqualified workpiece, the control device 700 sends a signal to push rod 430b, causing it to extend its piston rod and push the unqualified workpiece onto receiving platform 430a.

[0210] By providing the receiving platform 430a and the push rod 430b, automation and flexibility are achieved, and the operating efficiency of the cleaning system and the product quality control capability are improved.

[0211] In some embodiments, the control device 700 further includes a classification and labeling module, which is communicatively connected to the detection unit 400 and is used to batch-label unqualified workpieces according to the depth or area of ​​the stain.

[0212] The classification and labeling module then categorizes unqualified workpieces based on indicators such as stain depth or area, grouping workpieces with similar stain characteristics. For each category of unqualified workpiece, the module generates a pre-defined label or code for subsequent processing and identification.

[0213] In some embodiments, the surface cleaning system for electronic components further includes a sorting arm, which is communicatively connected to the control device 700 and is used to sort the workpieces from the receiving platform 430a to different preset storage areas according to the batches of the labeled workpieces.

[0214] Specifically, the sorting arm can sort the workpieces from the receiving platform 430a to a preset storage area according to the instructions of the control device 700. There can be multiple storage areas, and the multiple storage areas can be divided according to factors such as the type of stain on the workpiece and the cleaning requirements.

[0215] By designing a sorting arm, the control device 700 can realize the sorting and storage management of unqualified workpieces, improve production efficiency and quality, and reduce manual intervention and error rate.

[0216] Optionally, the sorting arm may also pick up unqualified workpieces to the transfer unit 100 when the secondary cleaning procedure is triggered.

[0217] In one embodiment, combining Figure 1 and Figure 2 The flipping mechanism 220 includes a second incoming material detection device 221 and a flipping member 222. The second incoming material detection device 221 is used to detect whether the workpiece has reached the preset flipping position. For example, the second incoming material detection device 221 can be implemented by means of a photoelectric sensor, a proximity sensor, or image recognition technology.

[0218] The flipping element 222 is in communication with the detection unit 400 and is used to grasp and flip the workpiece. For example, the flipping element 222 can be implemented using a robotic arm, pneumatic grippers, electromagnets, or the like to automatically grasp or absorb the workpiece. For example, the flipping element 222 can be a four-axis robotic arm. When the second incoming material detection device 221 detects that the workpiece has arrived at a preset position, the control device 700 sends a signal to the flipping element 222, instructing it to grasp and flip the workpiece.

[0219] Specifically, the workpiece is transported to the entrance of the flipping mechanism 220 via the transport unit 100. The second incoming material detection device 221 monitors the workpiece's position in real time. When the workpiece reaches the preset flipping position, it sends a signal to the control device 700. Upon receiving the signal, the control device 700 instructs the flipping member 222 to grasp the workpiece. The flipping member 222 then flips the workpiece at the preset angle and direction. After flipping, the workpiece continues to be transported along the conveyor belt 110.

[0220] In one embodiment, combining Figure 2 and Figure 3 The dust handling unit 300 includes a dust hood 320 and a dust collection device 330. The dust hood 320 is located outside the cleaning unit 200 and defines a dust collection chamber 310. The dust collection device 330 includes an induced draft fan 332 and an exhaust pipe 331. The exhaust pipe 331 is connected to the dust hood 320 and extends to the positions of the transmission unit 100 corresponding to the first laser cleaning device 211 and the second laser cleaning device 212.

[0221] The induced draft fan 332 is a core component of the dust treatment unit 300 and is responsible for sucking the dust and particulate matter sucked into the dust collecting hood 320 through the exhaust pipe 331 for subsequent processing or discharge.

[0222] By extending the exhaust pipe 331 of the dust collection device 330 to the position of the transmission unit 100 corresponding to the first laser cleaning device 211 and the second laser cleaning device 212, it is ensured that the dust and particulate matter generated during the cleaning process can be quickly sucked into the dust collection device 330, reducing the possibility of them accumulating on the transmission unit 100 or spreading into the working environment, thereby reducing the health risks of workers and the degree of pollution in the working environment.

[0223] In some embodiments, combined Figure 2 and Figure 3 The dust collecting device 330 further includes a concentration sensor 333, an air duct 334, an adjustment plate 335, and an adjustment drive member 336. The concentration sensor 333 is disposed in the dust collecting chamber 310 and is communicatively connected to the control device 700. The concentration sensor 333 is used to detect the concentration of dust.

[0224] The main function of the concentration sensor 333 is to monitor the dust concentration in the dust collection chamber 310 in real time. When the concentration exceeds a preset value, a signal is sent to the control device 700, and the control device 700 will adjust the power of the induced draft fan 332 or open more dust collection channels.

[0225] Multiple air ducts 334 are respectively connected to the dust hood 320 and the exhaust duct 331, and the multiple air ducts 334 are arranged in sequence along the conveying direction of the transmission unit 100; the adjustment plate 335 and the air duct 334 correspond one to one, and the adjustment plate 335 can be slidably set at the air inlet of the air duct 334, suitable for adjusting the size of the air inlet of the air duct 334; multiple adjustment driving members 336 are communicatively connected to the control device 700, the adjustment driving member 336 is fixedly set in the dust hood 320, the adjustment driving member 336 and the adjustment plate 335 correspond one to one, and the adjustment driving member 336 is transmission-connected to the adjustment plate 335.

[0226] In this way, the adjustment drive 336 can drive the movement of the adjustment plate 335 according to the dust concentration data fed back by the concentration sensor 333, thereby opening or closing the air inlet, or adjusting the size of the air inlet of the air duct 334, to achieve more efficient dust collection and further improve the efficiency and effect of dust treatment.

[0227] In some embodiments, combined Figure 4 The exhaust pipe 331 is provided with at least one dust outlet for discharging dust from the exhaust pipe 331. A slidable sealing plate is provided at the dust outlet for closing the dust outlet when the induced draft fan 332 is working to prevent dust from leaking out.

[0228] The exhaust pipe 331 is also provided with a sealing drive member, which is connected to the sealing plate by transmission, and is also connected to the control device 700 by communication. In this way, the operation of the sealing drive member can be remotely controlled by the control device 700 to control the opening and closing of the sealing plate, thereby increasing the flexibility and convenience of operation.

[0229] Alternatively, the sealing drive member may be a motor, fixed to the exhaust pipe 331, and the driving end of the sealing drive member is threadedly engaged with the sealing plate, and the sealing plate is driven to open or close the dust removal port by controlling the driving end to rotate forward or reverse. Alternatively, the sealing drive member may be an oil cylinder, an air cylinder, etc.

[0230] In this way, when dust collection is required, the control device 700 turns off the induced draft fan 332 or reduces the power of the induced draft fan 332, and controls the air outlet drive to drive the sealing plate to open the dust outlet, and the dust is discharged from the dust outlet, thereby realizing dust collection.

[0231] The dust treatment unit 300 also includes a dust collection device 340, which includes a filter 341 and a dust collector 342. The filter 341 is disposed within the exhaust duct 331, at the dust outlet; the dust collector 342 is disposed below the dust outlet. Optionally, the filter 341 can be a filter screen.

[0232] It is understandable that after the dust is blocked by the filter element 341, it will accumulate on the attachment surface of the filter element 341. When the sealing plate opens the dust outlet, the dust attached to the filter element 341 will fall into the dust collecting element 342 under the action of its own gravity, thereby realizing dust collection.

[0233] In some embodiments, combined Figure 4 The dust collecting device 340 further includes an air hammer 343 , which is connected to the filter element 341 , and the air hammer 343 is communicatively connected to the control device 700 .

[0234] It is understood that the air hammer 343 can be used to knock the filter element 341 to help the dust fall. The air hammer 343 is communicatively connected to the control device 700, so that the control device 700 can remotely control the operation of the air hammer 343, increasing the flexibility and automation of the system.

[0235] Optionally, the control device 700 may determine when to start the air hammer 343 for cleaning based on preset logic or conditions, such as system operating time.

[0236] In some embodiments, combined Figure 4 Filter element 341 includes a first filter 341a and a second filter 341b, which are spaced apart along the exhaust duct. Second filter 341b is located downstream of first filter 341a. The mesh size of first filter 341a is larger than that of second filter 341b. This allows first filter 341a to initially filter out larger dust particles, while second filter 341b can further filter out smaller dust particles, helping to improve dust collection efficiency and quality.

[0237] Two dust collectors are provided, one for each of the first and second filters 341a, 341b, to collect dust filtered by the respective filters. Because the first and second filters 341a, 341b filter dust particles of different sizes, the two dust collectors 342 can also collect dust of different sizes. This design helps improve the targetedness and efficiency of dust collection.

[0238] In one embodiment, combining Figure 1 and Figure 2 The surface cleaning system further includes: a feeding unit 500 , which is used to feed materials to the transmission unit 100 , and the feeding unit 500 includes a feeding trolley 510 and a loading device 520 .

[0239] The feed trolley 510 is equipped with a material platform for carrying workpieces. Specifically, resistor chips processed in the previous grinding process are stacked on the material platform. Once the resistor chips are loaded, the feed trolley 510 moves and transports them to the vicinity of the loading device 520. Optionally, the feed trolley 510 can be made of stainless steel or aluminum alloy with sufficient load-bearing strength, and the material platform can be made of wear-resistant materials such as stainless steel. Optionally, the material platform can be equipped with a closable or openable first fence 511 to prevent the resistor chips on the material platform from accidentally falling.

[0240] The loading device 520 is used to transfer the workpiece on the material platform to the transmission unit 100. Optionally, the loading device 520 can be implemented by an automated grasping or pushing mechanism such as a robotic arm, pneumatic grippers, or a pushing mechanism. For example, the loading device 520 can be a four-axis robot.

[0241] Optionally, the loading device 520 and the feeding trolley 510 can be communicatively connected. When the feeding trolley 510 transports the workpiece to a designated location, the control device 700 sends a signal to the loading device 520 to instruct it to perform a grabbing or pushing action.

[0242] In this way, by providing the feeding trolley 510 and the loading device 520, the continuous supply and smooth flow of workpieces are ensured, the labor intensity and safety risks of operators are reduced, and the automation level and operation efficiency of the surface cleaning system are improved.

[0243] In one embodiment, combining Figure 1 and Figure 2 The surface cleaning system further includes a collecting unit 600 , which is disposed at the downstream side of the cleaning unit 200 . The collecting unit 600 is configured to receive workpieces that have been cleaned by the cleaning unit 200 and inspected by the inspection unit 400 and have passed inspection from the transmission unit 100 .

[0244] Optionally, the collection unit 600 may include a collection trolley 610. In addition, the oil skimmer unit may also be provided with a feeding device 620. The feeding device 620 may be implemented by an automated grabbing or pushing mechanism such as a robotic arm, a pneumatic gripper, or a pushing mechanism.

[0245] In this way, qualified workpieces can be stored in the collection cart 610 through the unloading device 620, ensuring the collection and storage of qualified workpieces, reducing the labor intensity and safety risks of operators, and improving the automation level and operating efficiency of the surface cleaning system.

[0246] Optionally, a second fence 611 may be provided on the collection trolley 610 to protect qualified workpieces.

[0247] On the other hand, combined Figures 1 to 4 ,as well as Figure 5The present application also provides a surface cleaning method for electronic components, which is applied to the surface cleaning system for electronic components in any of the above embodiments, comprising the following steps:

[0248] S10 controls the activation of the dust treatment unit 300. Before the cleaning process begins, the dust treatment unit 300 must be activated. The dust treatment unit 300 includes a dust hood 320 and a dust suction device 330. The dust hood 320 is located outside the cleaning unit 200, and the dust suction device 330 is connected to the dust hood 320 via an exhaust pipe 331. After the dust treatment unit 300 is activated, the dust suction device 330 begins operating, sucking dust generated during the cleaning process into the dust hood 320 through the exhaust pipe 331 for disposal, thereby maintaining a clean working environment.

[0249] S20 loads the workpiece onto the transmission unit 100, which then transfers the workpiece to the cleaning unit 200. The workpiece to be cleaned (e.g., a resistor chip) needs to be loaded onto the transmission unit 100. The transmission unit 100 typically includes a conveyor belt 110 that can transfer the workpiece from the feeding unit 500 to the cleaning unit 200. The transmission unit 100 transports the workpiece forward along a preset transmission path. When the workpiece reaches a preset position in the cleaning unit 200, the first laser cleaning device 211 and the second laser cleaning device 212 clean the first and second surfaces of the workpiece, respectively. During the cleaning process, the laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device guides the laser beam to scan the workpiece surface back and forth, thereby removing dirt and oxides from the surface.

[0250] S30 controls the cleaning unit 200 to perform laser cleaning on the workpiece.

[0251] S40 controls the inspection unit 400 to inspect the workpiece surface and determine whether the cleaning process has been completed. After cleaning, the inspection unit 400 needs to be controlled to inspect the workpiece surface. The inspection unit 400 typically includes a first inspection device 410 and a second inspection device 420, which are located downstream of the first laser cleaning device 211 and the second laser cleaning device 212, respectively. The inspection devices can use visual inspection technology or other high-precision inspection technologies to inspect the cleanliness, flatness, damage, etc. of the workpiece surface.

[0252] If the workpiece is qualified in step S50 , the qualified workpiece is transferred to the collecting unit 600 . The qualified workpiece is transferred from the transmission unit 100 to the collecting unit 600 .

[0253] If the workpieces are unqualified, the unqualified workpieces are sorted out at step S60. The unqualified workpieces are sorted out and stored in a pre-set unqualified product storage area. The control device 700 records the information of the unqualified workpieces, labels them in batches, and memorizes instructions based on the dirt distribution of the workpieces.

[0254] S70: After the workpieces on the transfer unit 100 have been initially cleaned, a secondary cleaning process is triggered. Specifically, after the workpieces on the transfer unit 100 have been initially cleaned, the sorting arm sorts unqualified workpieces from the unqualified product storage area in batches and transfers them to the transfer unit 100. The detection unit 400 detects surface dirt distribution information on the workpieces and transmits this data to the control device 700. The control device 700 then matches the stored instructions based on the dirt distribution data, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit 200, adjusting the suction parameters of the dust disposal unit 300, and controlling the transfer speed of the transfer unit 100. This initiates secondary cleaning.

[0255] Accordingly, each batch of workpieces will correspond to different instructions. When the detection unit 400 detects the workpieces of the corresponding batch, the control device 700 will match the corresponding instructions until all the workpieces are cleaned.

[0256] S80 controls the detection unit 400 to conduct a second inspection. That is, during the second cleaning, after the first laser cleaning device 211 or the second laser cleaning device 212 cleans the workpiece, the detection unit 400 located downstream of the first laser cleaning device 211 or the second laser cleaning device 212 conducts a second inspection on the workpiece. If the workpiece passes the inspection, it is transferred to the collection unit 600. If the workpiece fails the inspection, it can be sorted out.

[0257] Optionally, the workpieces that have undergone secondary cleaning can be stored separately from the workpieces that have passed the initial cleaning, and the control device 700 can further detect the workpieces that have undergone secondary cleaning, such as information such as size.

[0258] In one embodiment, controlling the cleaning unit 200 to perform laser cleaning on the workpiece includes:

[0259] The first laser cleaning device 211 is controlled to clean the first surface of the workpiece. When the workpiece is transferred to the preset position of the first laser cleaning device 211, the control device 700 receives a corresponding signal and then activates the first laser cleaning device 211, which includes components such as a laser generator 210b and a scanning reciprocating device. The laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device is responsible for guiding the laser beam to scan back and forth across the first surface of the workpiece.

[0260] The flipping mechanism 220 is controlled to flip the workpiece. After cleaning the first surface, the workpiece is transferred to the preset position of the flipping mechanism 220. The control device 700 then activates the flipping mechanism 220 to flip the workpiece for cleaning the second surface. Specifically, the flipping mechanism 220 typically includes a flipping member 222 and a power member. The flipping member 222 is responsible for gripping and securing the workpiece, while the power member provides the power required for flipping.

[0261] The second laser cleaning device 212 is controlled to clean the second surface of the workpiece. When the workpiece is flipped to the preset position of the second laser cleaning device 212, the control device 700 will restart the laser cleaning device to clean the second surface of the workpiece. This cleaning process is similar to the cleaning process for the first surface. The laser generator 210b generates a high-energy laser beam, and the scanning reciprocating device is responsible for guiding the laser beam to scan back and forth on the first surface of the workpiece.

[0262] In one embodiment, controlling the detection unit 400 to detect the surface of the workpiece, and controlling the detection unit 400 to detect again, includes:

[0263] Image inspection is performed on the first surface of the workpiece after cleaning by the first laser cleaning device 211. After the workpiece has been cleaned by the first laser cleaning device 211 and leaves the cleaning area, the control device 700 triggers the first inspection device 410 to perform image inspection on the first surface of the workpiece. The first inspection device 410 typically includes a high-resolution camera and an image processing algorithm. The camera captures an image of the first surface of the workpiece and transmits the image data to the image processing algorithm for analysis. The image processing algorithm identifies defects such as dirt, scratches, and oxide layers in the image and determines whether the first surface of the workpiece is qualified based on preset acceptance criteria.

[0264] Workpieces that fail the first surface inspection are removed from the transport unit 100. If the image inspection results of the first surface indicate a workpiece is unqualified, the picking device, in accordance with instructions from the control device 700, moves above or next to the unqualified workpiece, then grabs or pushes the workpiece and removes it from the transport unit 100. The system records the unqualified product number and triggers a failure warning signal (which can be text, sound, light beam, etc.). The operator then picks up the unqualified product for inspection and determines whether to re-clean or scrap it.

[0265] Image inspection is performed on the second surface of the workpiece after cleaning by the second laser cleaning device 212. After the workpiece is flipped by the flipping mechanism 220 and cleaned by the second laser cleaning device 212, the control device 700 triggers the second inspection device 420 to perform image inspection on the second surface of the workpiece. This inspection step is similar to the inspection of the first surface. The second inspection device 420 captures an image of the second surface of the workpiece and performs image processing and analysis.

[0266] Workpieces that fail the second surface inspection are removed from the transport unit 100. Similar to the first surface inspection procedure, if the image inspection results for the second surface indicate a failed workpiece, the picking device, in accordance with instructions from the control device 700, removes the failed second surface workpiece from the transport unit 100 and places it in the failed product collection area. The system records the failed product number and triggers a failed product alert (which can be text, sound, or a light beam). The operator then picks up and inspects the failed product and determines whether to re-clean or scrap it.

[0267] In this way, the present application realizes the cleaning of the first surface and the second surface of the resistor through the first laser cleaning device 211 and the second laser cleaning device 212. Specifically, the laser beam generated by the laser generator 210b is focused on the end face of the resistor for scanning, and the adhered powder on the end face is separated from the end face of the substrate through the thermal effect. Then, the powder is taken away by negative pressure exhaust through the dust treatment unit 300 to achieve the purpose of cleaning the surface.

[0268] It can be seen that laser cleaning controls the energy of the light beam to penetrate and peel off the tiny powder in the pits and gaps on the end face of the resistor, thereby solving the deep cleaning problem that is difficult to achieve with ultrasonic cleaning in conventional technology. In addition, laser cleaning does not require direct contact with the workpiece, avoiding the physical damage or secondary pollution that may be caused by traditional cleaning methods. Compared with conventional ultrasonic cleaning that requires more water resources and cleaning agents, laser cleaning does not produce wastewater, has lower energy consumption, and meets the requirements of green production.

[0269] In some embodiments, sorting out unqualified workpieces includes generating a secondary scanning trajectory according to the dirt distribution of the unqualified workpieces.

[0270] When identifying an unqualified workpiece, the inspection unit 400 conducts a detailed analysis of the dirt distribution on the workpiece surface and transmits this analysis data to the control device 700. This allows the control device 700 to identify the specific location, size, and shape of the dirt. Based on the dirt distribution analysis results, the control device 700 generates a secondary scanning trajectory for the unqualified workpiece. This trajectory should cover all dirt areas to ensure that the dirt is removed during the secondary cleaning process.

[0271] Optionally, the trajectory generation may take into account parameters such as the scanning speed, power, wavelength of the laser beam, and factors such as the material and shape of the workpiece surface.

[0272] In some embodiments, unqualified workpieces are picked out, including: classifying and labeling the unqualified workpieces according to the depth or area of ​​the stains, and sorting them into different batches; and deriving corresponding laser parameters and dust collection parameters for different batches of workpieces, the parameters being designed to ensure that dirt on the workpiece surface can be removed during the cleaning process, and to protect the workpiece from damage.

[0273] In some embodiments, corresponding laser parameters and dust collection parameters are obtained for different batches of workpieces. The laser parameters include laser power, pulse frequency and scanning speed; the dust collection parameters include the size of the air inlet of the air duct 334 and the suction force of the air fan 332.

[0274] In some embodiments, during the secondary cleaning, the detection unit 400 is controlled to detect again, including: if qualified, transferring the qualified workpiece to the collection unit 600; if unqualified, sorting out the unqualified workpiece.

[0275] From the above, we can see that Figures 1 to 3 The surface cleaning system and surface cleaning method of electronic components provided in the present application sequentially include a feeding preparation stage, a transmission stage, a first surface cleaning stage, a first surface detection and picking stage, a flipping stage, a second surface cleaning stage, a second surface detection and picking stage, a collection stage, a secondary cleaning stage, and a final dust-sealing stage.

[0276] Specifically, during the feeding preparation phase, the feeding cart 510 transports the resistors to be cleaned to the designated location, the dust treatment unit 300 is activated, the conveyor belt is turned on, and the control device 700 then begins a self-test. This test checks the position of the feeding cart 510, the functioning of the conveyor belt, the loading and unloading positions and equipment, the standby state of the cleaning device, and the position of the stacker. After the self-test is complete, the control device 700 determines whether to proceed to the next step based on whether the system configuration requirements are met. After the system self-test is complete, the operator selects the resistor specifications and height according to the stored program. Accordingly, the power, frequency, and pulse width of the laser generator 210b are automatically adjusted accordingly. Once the settings are complete, click the Start button, and the system enters automatic operation mode.

[0277] During the transfer phase, the loading device 520 is activated to transfer the electronic components on the material platform to the transfer unit 100 one by one, and the conveyor belt 110 transfers the electronic components along a preset path.

[0278] During the first surface cleaning phase, when an electronic component reaches the preset cleaning position of the first laser cleaning device 211, the first incoming material detection device 210a detects the workpiece and sends a signal to the control device 700. In response, the control device 700 activates the laser generator 210b and the reciprocating scanning device after receiving the signal. The laser generator 210b generates laser light, and the reciprocating scanning device drives the laser generator 210b to perform a reciprocating scanning cleaning of the first surface of the electronic component.

[0279] The first surface inspection and sorting phase includes the first surface inspection phase and the first sorting phase. During the first surface inspection phase, cleaned electronic components are transferred to the first inspection device 410, which inspects the first surface of the electronic components to determine whether they are clean and undamaged. During the first sorting phase, if the first inspection device 410 detects a defective component, it labels the defective workpiece based on the surface dirt information (stain depth or area) and feeds this information back to the control device 700. The control device 700 generates cleaning parameters based on the workpiece surface information and classifies the defective components according to their data. The first inspection device 410 sends a signal to the first sorting device 431, activating the push rod 430b of the first sorting device 431 and transferring the defective electronic components from the transport unit 100 to the receiving platform 430a. The system records the defective component number and triggers a defective alert signal (which can be text, sound, light beam, etc.). The sorting arm sorts the defective components into the corresponding temporary storage area according to their batch.

[0280] During the flipping stage, the qualified resistor sheet will continue to be transferred to the preset flipping position of the flipping mechanism 220. After the second incoming material detection device 221 detects the workpiece, the flipping member 222 is started to grab and flip the resistor sheet.

[0281] In the second surface cleaning stage, the flipped resistor sheet reaches a preset cleaning position of the second laser cleaning device 212 , and the second laser cleaning device 212 performs laser cleaning on the second surface of the resistor sheet.

[0282] The second surface inspection and sorting stage includes the second surface inspection stage and the second sorting stage. In the second surface inspection stage, the cleaned resistor sheet continues to be transmitted to the second inspection device 420. The second inspection device 420 inspects the second surface of the resistor sheet to ensure that it is clean and undamaged. In the second sorting stage, if the second inspection device 420 detects defective products, the second inspection device 420 will label the defective workpieces based on the surface dirt information, stain depth or area of ​​the defective products, and feed the information back to the control device 700. The control device 700 generates corresponding cleaning parameters based on the surface information of the workpieces and classifies them according to the data information of the defective products. The second inspection device 420 sends a signal to the second sorting device 432, and the second sorting device 432 transfers the defective resistor sheet from the transmission unit 100 to the receiving platform 430a. The sorting hands sort the defective products into the corresponding temporary storage area according to their batches.

[0283] During the collection phase, the resistors that have passed cleaning and testing are continuously transferred to the collection unit 600 , which stores the qualified resistors in an orderly manner.

[0284] During the secondary cleaning stage, the sorting hands place the unqualified products into the transmission unit 100 according to the batches, and the control device 700 matches the corresponding cleaning parameters according to the surface information of the unqualified products, and then performs secondary cleaning. During this process, the workpieces that pass the cleaning are transferred to the collection unit 600, and the unqualified workpieces are picked out. The staff will inspect them to determine whether they need to be cleaned three times or scrapped.

[0285] During the final dust-sealing stage, loading will no longer continue, and the online resistors will be cleaned one by one and collected by the collection unit 600. After there are no resistors on the transmission unit 100, the control device 700 will turn off all devices except the dust collection device 330 and send a signal reminder. The operator turns off the dust collection device 330, then turns off the system button, and the system shuts down.

[0286] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0287] It should be noted that phrases such as "one embodiment," "an embodiment," "exemplary embodiments," and "some embodiments" in this specification may indicate embodiments that may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0288] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a," "an," or "the" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0289] It should be readily understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0290] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A surface cleaning system for electronic components, characterized in that: include: A transmission unit (100), used for transmitting a workpiece; A cleaning unit (200) is provided in a vicinity of the transmission unit (100), the cleaning unit (200) comprising a first laser cleaning device (211), a flipping mechanism (220), and a second laser cleaning device (212) arranged in sequence along the transmission direction of the workpiece, the first laser cleaning device (211) being suitable for cleaning a first surface of the workpiece, the flipping mechanism (220) being used for flipping the workpiece, and the second laser cleaning device (212) being used for cleaning a second surface of the workpiece; The first laser cleaning device (211) and the second laser cleaning device (212) both comprise a first incoming material detection device (210a), a laser generator (210b), and a scanning reciprocating device; the first incoming material detection device (210a) is used to detect whether the workpiece has reached a preset cleaning position; the laser generator (210b) is used to generate laser light; and the scanning reciprocating device is used to reciprocately scan the surface of the workpiece; The dust processing unit (300) has a dust suction chamber (310), the cleaning unit (200) is located in the dust suction chamber (310), the transmission unit (100) is arranged through the dust suction chamber (310), and the dust processing unit (300) is used to remove dust generated during the cleaning process; A detection unit (400) is provided on the upstream side and the downstream side of the cleaning unit (200) to detect the surface of the workpiece; the detection unit (400) comprises a first detection device (410) and a second detection device (420); the first detection device (410) is provided on the upstream side and the downstream side of the first laser cleaning device (211) to detect the first surface of the workpiece before and after cleaning by the first laser cleaning device (211); the second detection device (420) is provided on the upstream side and the downstream side of the second laser cleaning device (212) to detect the second surface of the workpiece before and after cleaning by the second laser cleaning device (212); a control device (700), communicatively connected to the transmission unit (100), the cleaning unit (200), the dust processing unit (300), and the detection unit (400), adapted to control the operation or shutdown of components through a preset program, and to adjust the preset program according to a detection result of the detection unit (400); The control device (700) is configured to be respectively connected to the first incoming material detection device (210a), the laser generator (210b) and the scanning reciprocating device in communication, so as to control the working states of the laser generator (210b) and the scanning reciprocating device according to the detection result of the first incoming material detection device (210a); The first detection device (410) and the second detection device (420) are configured to detect dirt distribution on the surface of the workpiece and transmit dirt distribution information to the control device (700); The control device (700) comprises a scanning trajectory planning module and a secondary cleaning triggering module. The scanning trajectory planning module is communicatively connected to the detection unit (400) and is used to analyze the workpiece dirt distribution according to the detection feedback of the detection unit (400) and generate a cleaning trajectory. The secondary cleaning triggering module is communicatively connected to the detection unit (400). The secondary cleaning triggering module is configured to trigger a secondary cleaning procedure when the detection unit (400) detects that the workpiece on the transmission unit (100) that has been initially cleaned has been completed. The control device (700) is configured to: when the detection unit (400) detects that the cleaning is unqualified, memorize instructions according to the dirt distribution of the workpiece, including adjusting the laser power, pulse frequency, and scanning speed of the cleaning unit (200), adjusting the suction parameters of the dust processing unit (300), and controlling the transmission speed of the transmission unit (100); after the cleaning of the workpiece of the initial cleaning is completed, trigger instructions to the cleaning unit (200), the dust processing unit (300), and the transmission unit (100); The picking unit (430) includes a first picking device (431) and a second picking device (432), wherein the first picking device (431) is communicatively connected to the first detection device (410), and the first picking device (431) is used to pick out the workpieces detected as unqualified by the first detection device (410) from the transmission unit (100); the second picking device (432) is communicatively connected to the second detection device (420), and the second picking device (432) is used to pick out the workpieces detected as unqualified by the second detection device (420) from the transmission unit (100).

2. The surface cleaning system of electronic components according to claim 1, characterized in that: The first detection device (410) is a visual detection device; and / or the second detection device (420) is a visual detection device.

3. The surface cleaning system of electronic components according to claim 1, characterized in that: The transmission unit (100) comprises a transmission belt (110), The first picking device (431) and the second picking device (432) both include: A receiving platform (430a) is provided on one side of the conveyor belt (110), and the receiving platform (430a) is used to receive unqualified workpieces; A push rod (430b) is provided on a side of the conveyor belt (110) opposite to the receiving platform (430a), and a piston rod of the push rod (430b) is retractable to transfer unqualified workpieces from the conveying unit (100) to the receiving platform (430a).

4. The surface cleaning system of electronic components according to claim 3, characterized in that: The control device (700) further includes: A classification and labeling module is communicatively connected to the detection unit (400) and is used to batch-label unqualified workpieces according to the depth or area of ​​the stain.

5. The surface cleaning system of electronic components according to claim 4, characterized in that: It also includes a sorting arm, which is communicatively connected to the control device (700) and is used to sort the workpieces from the receiving platform (430a) to different preset storage areas according to the batches of the numbered workpieces.

6. The surface cleaning system of electronic components according to claim 1, characterized in that: The turning mechanism (220) comprises: A second incoming material detection device (221) is used to detect whether the workpiece has reached a preset turning position; A turning member (222) is communicatively connected to the detection unit (400), and the turning member (222) is used to grasp and turn a workpiece.

7. The surface cleaning system of electronic components according to claim 1, characterized in that: The dust processing unit (300) comprises: A dust collecting hood (320), which is arranged outside the cleaning unit (200), and the dust collecting hood (320) defines the dust suction chamber (310); The dust collecting device (330) comprises an induced draft fan (332) and an exhaust pipe (331), wherein the exhaust pipe (331) is connected to the dust collecting hood (320), and the exhaust pipe (331) extends to positions of the transmission unit (100) corresponding to the first laser cleaning device (211) and the second laser cleaning device (212).

8. The surface cleaning system of electronic components according to claim 7, characterized in that: The dust collecting device (330) further includes: A concentration sensor (333) is provided in the dust collection chamber (310) and is communicatively connected to the control device (700). The concentration sensor (333) is used to detect the concentration of dust. A plurality of air ducts (334) are respectively connected to the dust collecting cover (320) and the exhaust duct (331), and the plurality of air ducts (334) are sequentially spaced apart along the conveying direction of the transmission unit (100); a plurality of adjustment plates (335), the adjustment plates (335) corresponding one to the air inlet duct (334), the adjustment plates (335) being slidably disposed at the air inlet of the air inlet duct (334) and being suitable for adjusting the size of the air inlet of the air inlet duct (334); A plurality of adjustment drive members (336) are communicatively connected to the control device (700), the drive members (336) are fixedly arranged in the dust collecting cover (320), the adjustment drive members (336) and the adjustment plate (335) correspond one to one, and the adjustment drive members (336) are transmission-connected to the adjustment plate (335).

9. The surface cleaning system of electronic components according to claim 8, characterized in that: The exhaust pipe (331) is provided with at least one dust outlet, a slidably arranged sealing plate is provided at the dust outlet, and the exhaust pipe is also provided with a sealing drive member, the sealing drive member is transmission-connected to the sealing plate, and the sealing drive member is communicatively connected to the control device (700); The dust processing unit further includes a dust collecting device, which includes: A filter element (341) is provided in the exhaust pipe (331), and the filter element (341) is provided at the dust outlet; The dust collecting member (342) is arranged below the dust outlet.

10. The surface cleaning system of electronic components according to claim 9, characterized in that: The dust collecting device (340) further includes: An air hammer (343) is connected to the filter element (341), and the air hammer (343) is communicatively connected to the control device (700).

11. The surface cleaning system of electronic components according to claim 9, characterized in that: The filter element (341) comprises a first filter screen (341a) and a second filter screen (341b), wherein the first filter screen (341a) and the second filter screen (341b) are arranged at intervals along the exhaust pipe (331), and the second filter screen (341b) is arranged on the downstream side of the first filter screen (341a). The mesh size of the first filter screen (341a) is larger than the mesh size of the second filter screen (341b), Two dust collecting parts (342) are provided, and the two dust collecting parts (342) correspond to the first filter screen (341a) and the second filter screen (341b) respectively.

12. The surface cleaning system of electronic components according to claim 1, characterized in that: Also includes: A feeding unit (500), the feeding unit (500) is used to feed materials to the transmission unit (100), and the feeding unit (500) comprises: A feeding trolley (510), wherein the feeding trolley (510) is provided with a material platform for carrying workpieces; A loading device (520) is used to transfer the workpiece on the material platform to the transmission unit (100).

13. The surface cleaning system of electronic components according to claim 1, characterized in that: Also includes: A collecting unit (600) is provided at the downstream side of the cleaning unit (200), and the collecting unit (600) is used to receive, from the transmission unit (100), workpieces that have been cleaned by the cleaning unit (200) and qualified by the inspection unit (400).

14. A surface cleaning method for electronic components, applied to the surface cleaning system for electronic components according to any one of claims 1 to 13, characterized in that: The following steps are involved: Controlling the dust treatment unit (300) to start; Loading the workpiece onto the transmission unit (100), and the transmission unit (100) transmits the workpiece to the cleaning unit (200); controlling the cleaning unit (200) to perform laser cleaning on the workpiece; Controlling the detection unit (400) to detect the surface of the workpiece to determine whether the cleaning is qualified; If qualified, the workpiece is transferred to a collection unit (600); If unqualified, the unqualified workpiece will be picked out; After the workpiece to be initially cleaned on the transfer unit (100) is cleaned, a secondary cleaning procedure is triggered; The detection unit (400) is controlled to detect again.

15. The surface cleaning method of electronic components according to claim 14, characterized in that: Controlling the cleaning unit (200) to perform laser cleaning on a workpiece comprises: controlling a first laser cleaning device (211) to clean a first surface of a workpiece; Controlling the turning mechanism (220) to turn the workpiece over; The second laser cleaning device (212) is controlled to clean the second surface of the workpiece.

16. The surface cleaning method of electronic components according to claim 14, characterized in that: The controlling the detection unit (400) to detect the surface of the workpiece, and the controlling the detection unit (400) to detect again, comprise: Performing image detection on the first surface of the workpiece after being cleaned by the first laser cleaning device (211); Picking out workpieces that fail the first surface inspection from the transmission unit (100); Performing image detection on the second surface of the workpiece after being cleaned by the second laser cleaning device (212); The workpiece that fails the second surface inspection is picked out from the transmission unit (100).

17. The surface cleaning method of electronic components according to claim 14, characterized in that: The process of picking out unqualified workpieces includes: A secondary scanning trajectory is generated based on the dirt distribution of the unqualified workpiece.

18. The surface cleaning method of electronic components according to claim 14, characterized in that: The process of picking out unqualified workpieces includes: Classify and label unqualified workpieces according to the depth or area of ​​stains and organize them into different batches; Corresponding laser parameters and dust collection parameters are obtained for different batches of workpieces.

19. The surface cleaning method of electronic components according to claim 18, characterized in that: The laser parameters include laser power, pulse frequency and scanning speed; The dust collection parameters include the size of the air inlet of the induced draft duct (334) and the suction force of the induced draft fan (332).

20. The surface cleaning method of electronic components according to claim 14, characterized in that: The control detection unit (400) detects again, including: If qualified, the workpiece is transferred to a collection unit (600); If unqualified, the unqualified workpiece will be picked out.

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