Expansion offset calibration method and device, readable storage medium and equipment

Abstract

The invention discloses a calibration method and calibration device for expansion offset, a readable storage medium and equipment. The expansion offset calibration method comprises the following steps: acquiring a first scanning result of a to-be-operated piece in a current state; and comparing the first scanning result with a reference scanning result to obtain the swelling amount of the to-be-operated part. Judging whether the swelling amount is greater than a preset value; if the swelling amount is larger than the preset value, the scaling coefficient of the to-be-operated part is calculated. And according to the zoom coefficient, the position of the to-be-operated part is calibrated, so that errors caused by large temperature fluctuation are reduced, and high-precision positioning calibration is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of precision optics, and particularly to a calibration method for expansion offset, a calibration device, a readable storage medium, and a device. Background Art

[0002] In a high-precision independent motion system, temperature changes can cause components to expand, resulting in positioning deviations. In related technologies, the temperature expansion effect is difficult to precisely control, leading to an increase in test errors. Existing temperature control methods often rely on physical isolation or temperature control means, but they cannot solve the test errors caused by large temperature fluctuations. Summary of the Invention

[0003] The main object of the present invention is to provide a calibration method for expansion offset, a calibration device, a readable storage medium, and a device, aiming to solve the technical problem that existing temperature control methods often rely on physical isolation or temperature control means but cannot solve the test errors caused by large temperature fluctuations.

[0004] To achieve the above-mentioned invention object, a calibration method for expansion offset is proposed in the first aspect of the present invention.

[0005] Obtain a first scan result of the workpiece to be operated in the current state;

[0006] Based on the comparison between the first scan result and a reference scan result, obtain the expansion amount of the workpiece to be operated;

[0007] Judge whether the expansion amount is greater than a preset value;

[0008] If the expansion amount is greater than the preset value, calculate the scaling factor of the workpiece to be operated;

[0009] Calibrate the position of the workpiece to be operated according to the scaling factor.

[0010] In one of the embodiments, the step of obtaining the expansion amount of the workpiece to be operated based on the comparison between the first scan result and the reference scan result includes:

[0011] Based on the first scan result, determine the first measurement distances of at least two first marking points on the workpiece to be operated in the first direction; and,

[0012] Obtain the first reference distance corresponding to the reference scan result in the first direction;

[0013] Calculate the difference between the first measurement distance and the first reference distance to obtain the first expansion amount.

[0014] In one embodiment, the step of obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result further includes:

[0015] Based on the first scan result, determining second measurement distances of at least two second marking points on the workpiece to be operated in a second direction; and,

[0016] Obtaining a second reference distance corresponding to the reference scan result in the second direction;

[0017] Calculating the difference between the second measurement distance and the second reference distance to obtain a second expansion amount;

[0018] Wherein, the first direction is perpendicular to the second direction.

[0019] In one embodiment, the step of calculating the scaling factor of the workpiece to be operated if the expansion amount is greater than the preset value includes:

[0020] When the first expansion amount is greater than a first preset value, calculating a first scaling factor of the workpiece to be operated in a first direction;

[0021] When the second expansion amount is greater than a second preset value, calculating a second scaling factor of the workpiece to be operated in a second direction.

[0022] In one embodiment, the distance between two of the first marking points in a preset standard environment is equal to the distance between two of the second marking points in the standard environment;

[0023] The first preset value and the second preset value are equal.

[0024] In one embodiment, after the step of calibrating the position of the workpiece to be operated according to the scaling factor, it includes:

[0025] Based on the first scaling factor, adjusting the step distance of the motion platform in the first direction;

[0026] Based on the second scaling factor, adjusting the step distance of the motion platform in the second direction.

[0027] In one embodiment, before the step of obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result, it includes:

[0028] Judging whether there is a second scan result of the workpiece to be operated in the previous time;

[0029] If it exists, using the first scan result as the reference scan result;

[0030] If not, obtain a preset scan result as the reference scan result.

[0031] The second aspect of the present invention provides a calibration system for expansion offset, which executes the above-mentioned calibration method for expansion offset, including:

[0032] A calibration system for expansion offset, which executes the above-mentioned calibration method for expansion offset, including:

[0033] A scanning device for obtaining a first scan result of the workpiece to be operated in the current state;

[0034] A measuring device for obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result;

[0035] A judging device for judging whether the expansion amount of the workpiece to be operated is greater than a preset value;

[0036] A calculating device for calculating the scaling factor of the workpiece to be operated if the expansion amount of the workpiece to be operated is greater than the preset value;

[0037] An adjusting device for calibrating the position of the workpiece to be operated according to the scaling factor.

[0038] The third aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a computer processor, the above-mentioned calibration method for the effective expansion of the motion platform is implemented.

[0039] The fourth aspect of the present invention provides a computer device, which executes the above-mentioned calibration method for expansion offset.

[0040] Beneficial effects:

[0041] The calibration method for the effective expansion of a motion platform according to the present invention includes the following steps: obtaining a first scan result of the workpiece to be operated in the current state. Comparing the first scan result with the reference scan result to obtain the expansion amount of the workpiece to be operated. Judging whether the expansion amount is greater than a preset value. If the expansion amount is greater than the preset value, calculating the scaling factor of the workpiece to be operated. Calibrating the position of the workpiece to be operated according to the scaling factor. Adjusting the step distance of the workpiece to be operated according to the scaling factor of the workpiece to be operated to calibrate the position of the workpiece to be operated, reduce the error caused by large temperature fluctuations, and achieve high-precision positioning calibration. Description of the Drawings

[0042] Figure 1 It is a flowchart of a calibration method for the effective expansion of a motion platform according to an embodiment of the present invention.

[0043] Figure 2It is a schematic structural diagram of a workpiece to be operated in an embodiment of the present invention.

[0044] The realization of the object, functional features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments. Detailed Embodiments

[0045] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0047] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. It may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0049] Such asFigure 1 As shown, in some embodiments, a calibration method for effective expansion of a motion platform includes the following steps:

[0050] S100. Obtain a first scan result of the workpiece to be operated in the current state.

[0051] S200. Compare the first scan result with a reference scan result to obtain the expansion amount of the workpiece to be operated.

[0052] S300. Determine whether the expansion amount is greater than a preset value.

[0053] S400. If the expansion amount is greater than the preset value, calculate the scaling factor of the workpiece to be operated.

[0054] S500. Calibrate the position of the workpiece to be operated according to the scaling factor. When the expansion amount of the workpiece to be operated is effective expansion, it is determined as the deviation caused by temperature expansion, and the stepping accuracy can be modified to reduce the error caused by large temperature fluctuations and achieve high-precision positioning calibration.

[0055] Specifically, the workpiece to be operated can be a wafer. The motion platform can be a device for carrying and moving the wafer.

[0056] A wafer is a circular thin sheet. The wafer is mainly made of silicon or other semiconductor materials. There are circuit patterns, components, etc. formed on the wafer through various semiconductor manufacturing processes. In this embodiment, the wafer expands due to temperature changes, and this expansion will cause its position on the motion platform to shift. By detecting and calibrating the expansion of the wafer in this embodiment, the motion platform can still accurately position the wafer to the required position under temperature changes to ensure the accuracy of subsequent manufacturing or detection operations.

[0057] For example, in the chip manufacturing process, the size and position accuracy requirements of components such as transistors and capacitors on the wafer are extremely high. When the temperature rises, the wafer expands. If the motion platform does not perform corresponding calibration, then during processes such as lithography, the accuracy of the chip pattern will decrease due to the deviation of the wafer position, affecting the performance and quality of the chip.

[0058] In some embodiments, S100. Obtain a first scan result of the workpiece to be operated in the current state. Specifically, scan the workpiece to be operated through a top-down microscope camera.

[0059] During operation, install the overhead microscope camera in a suitable position to ensure that it can clearly observe the workpiece to be operated. The position of the microscope camera needs to be precisely adjusted, including parameters such as height, angle, and focal length, to obtain the best imaging effect. After starting the microscope camera, according to the set scanning range and resolution, start scanning the workpiece to be operated. The scanning is usually carried out along a preset path. For example, start from one edge of the workpiece to be operated and scan row by row or column by column. If scanning the plane of the workpiece to be operated, like scanning a two-dimensional wafer, it may start from the upper left corner of the wafer and scan row by row along the horizontal direction until the entire plane area is scanned. Or it can also scan column by column along the vertical direction first. During the scanning process, the microscope camera focuses the reflected light or transmitted light on the surface of the workpiece to be operated onto the image sensor through the optical system. The sensor converts the optical signal into an electrical signal and then generates digital image data. This data includes information on the surface of the workpiece to be operated, such as texture, color, shape, marks, or patterns, etc.

[0060] In some embodiments, S200. Compare the first scanning result with the reference scanning result to obtain the expansion amount of the workpiece to be operated.

[0061] During operation, perform feature extraction on the scanned image or data. The feature can be a preset marking point or a specific pattern contour on the surface of the workpiece to be operated. For example, on a semiconductor wafer, there may be some alignment marks for positioning, or the specific pattern boundaries of the chip circuit, etc. as feature points. Through image recognition technology, accurately find the position information of the feature from the scanning result. Take the position in the normal state (without thermal expansion or other interference factors) as the reference position. This reference position can be a coordinate value used to describe the specific position of the feature point in the coordinate system of the workpiece to be operated. Compare the position of the feature point extracted from the current scanning result with the reference position. Calculate the position difference on each coordinate axis of each feature point. This difference is the expansion amount. For the expansion amounts of multiple feature points, some data processing may be required, such as taking the average value, weighted average, etc., to obtain an expansion amount that can better represent the overall offset situation of the workpiece to be operated. This is because a single feature point may be affected by local factors, and by integrating the information of multiple feature points, the overall offset state of the workpiece to be operated can be more accurately reflected.

[0062] As Figure 2 shown, specifically, step S200 of comparing the first scanning result with the reference scanning result to obtain the expansion amount of the workpiece to be operated includes:

[0063] S210. Based on the first scanning result, determine the first measurement distances of at least two first marking points on the workpiece to be operated in the first direction.

[0064] S220. Obtain a first reference distance corresponding to the reference scan result in the first direction.

[0065] S230. Calculate the difference between the first measured distance and the first reference distance to obtain a first expansion amount. The first direction can be the X-axis direction. The second direction can be the Y-axis direction.

[0066] Specifically, step S200 of obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result includes:

[0067] S240. Based on the first scan result, determine second measured distances of at least two second marked points on the workpiece to be operated in the second direction.

[0068] S250. Obtain a second reference distance corresponding to the reference scan result in the second direction.

[0069] S260. Calculate the difference between the second measured distance and the second reference distance to obtain a second expansion amount.

[0070] It should be noted that the motion platform usually has an independent structure in the X-axis direction and the Y-axis direction, and can accurately control the position of the wafer in the plane. The motion platform may include guide rails, sliders, motors, drivers, etc. The motor, under the control of the driver, drives the slider to move along the guide rail in the X-axis direction and the Y-axis direction, so as to realize the position adjustment of the wafer. For example, in the semiconductor manufacturing process, the motion platform needs to accurately move the wafer to the processing area of equipment such as lithography machines and etching machines according to process requirements, or move to a specific position of the detection equipment during the detection process.

[0071] Based on the scan result of the workpiece to be operated, use image analysis technology to locate representative feature elements in the image. For example, feature points or pattern boundaries that are easy to identify and track in the X-axis direction. Take the position where the feature element is located in the normal non-offset state as the reference position and record it in the form of coordinate values. For example, the reference coordinate of a certain marked point in the X-axis direction is X0. Analyze the actual position of the corresponding feature element in the X-axis direction in the current scan result, and obtain its coordinate value X1. By calculating the difference X1 - X0 between the current coordinate value and the reference coordinate value, the first expansion amount of the workpiece to be operated in the first direction (X-axis direction) is obtained. This first expansion amount reflects the position change of the workpiece to be operated in this direction relative to the standard position due to various factors (such as thermal expansion).

[0072] Similarly, operations are performed in the second direction (Y-axis direction). Feature elements distributed in the Y-axis direction are determined in the scan result. Taking the position in the Y-axis direction in the normal state as a reference, for example, the reference coordinate of a certain pattern boundary in the Y-axis direction is Y0. Analyze the actual position Y1 of the feature element in the Y-axis direction in the current scanned image. By calculating Y1 - Y0, the second expansion amount of the workpiece to be operated in the second direction (Y-axis direction) is obtained. This step can obtain the position offsets of the workpiece to be operated in two mutually perpendicular directions, and can comprehensively obtain the position changes of the workpiece to be operated in the plane. By separately measuring the first expansion amount in the first direction and the second expansion amount in the second direction of the workpiece to be operated, the position change of the workpiece to be operated in the two-dimensional space in the plane can be completely presented.

[0073] In addition, the first expansion amount and the second expansion amount are key basic data for subsequent judgment of whether it is effective expansion and calculation of the scaling factor. For example, in semiconductor chip manufacturing and precision optical lens processing that require high-precision positioning, the first expansion amount in the first direction and the second expansion amount in the second direction are used to accurately determine the influence degree of thermal expansion in different directions, and then calculate an appropriate scaling factor to adjust the stepping distance during the processing to achieve precise calibration of the position of the workpiece to be operated and ensure that the processing accuracy is not affected by position offsets.

[0074] In some embodiments, the step S400 of calculating the scaling factor of the workpiece to be operated if the expansion amount is greater than the preset value includes:

[0075] S410. When the first expansion amount is greater than the first preset value, calculate the first scaling factor of the workpiece to be operated in the first direction.

[0076] S420. When the second expansion amount is greater than the second preset value, calculate the second scaling factor of the workpiece to be operated in the second direction.

[0077] It should be noted that this step can judge whether the first expansion amount and the second expansion amount are effective expansions. Effective expansion is the expansion caused by temperature. Compare the measured expansion amount of the workpiece to be operated with the preset effective expansion standard. If the expansion amount is within the standard range, then it is judged that the expansion amount is not caused by effective expansion. If the expansion amount exceeds the standard range, it may be an effective expansion caused by factors such as temperature change. This expansion amount can be the first expansion amount in the first direction and the second expansion amount in the second direction. This step can avoid unnecessary calibration operations for offsets caused by non-expansion factors, so as to place the calibration work on the situation where temperature expansion really needs to be compensated, improving the efficiency and accuracy of calibration.

[0078] Specifically, the distance between the two first marking points in a preset standard environment is equal to the distance between the two second marking points in the standard environment. The first preset value is equal to the second preset value.

[0079] Specifically, when the workpiece to be operated is a wafer, the first preset value and the second preset value can be 1 micrometer.

[0080] It should be noted that the expansion calibration can be based on the previous calibration result as a reference. If the position deviation of the workpiece to be operated exceeds the range of 1 micrometer during the scanning process of the system, it is determined that the deviation is caused by thermal expansion. For example, if the workpiece to be operated expands by 2 micrometers at a distance of 100 millimeters, the scaling factor is calculated as 100.002 / 100.

[0081] Before making the judgment of this expansion calibration, the relevant data obtained from the previous calibration are retrieved. This data includes, but is not limited to, the data of the standard positions of the workpiece to be operated in each direction determined after the previous calibration, the scaling factor calculated at that time, and the environmental information data such as the corresponding temperature. For example, after the previous calibration, it is determined that the standard coordinate position of a key feature point of the workpiece to be operated in the X-axis direction is X0. The standard coordinate position of the corresponding feature point in the Y-axis direction is Y0, and this standard position information will be used as the reference basis for judging the position deviation in this time.

[0082] During the current scanning process, the workpiece to be operated is scanned and detected again by using a top-down microscope camera to obtain its actual position information in each direction. Then, the difference between the current actual position and the standard position determined by the previous calibration is calculated to obtain the position expansion amount in each direction. After it is determined that the position deviation is caused by thermal expansion, the scaling factor is calculated for subsequent calibration compensation operations. Assume that the original length of the workpiece to be operated in the X-axis direction is 100 millimeters, and it expands by 2 micrometers after the temperature change, then the actual length becomes 100.002 millimeters. The scaling factor is 1.00002. This factor will be used for subsequent operations such as adjusting the step distance to compensate for the influence of thermal expansion. The scaling factor can quantify the degree of influence of thermal expansion. The scaling factor presents the change of the size of the workpiece to be operated after thermal expansion relative to the original size through a specific numerical ratio relationship, providing an accurate and operable parameter basis for subsequent calibration compensation operations.

[0083] In some embodiments, after the step S300 of judging whether the expansion amount of the workpiece to be operated is greater than the preset value, the following steps are further included:

[0084] S310. If the expansion amount of the workpiece to be operated is less than the preset value, the steps of the calibration method are ended. That is, the calculation of the scaling factor is not performed.

[0085] It should be noted that if the expansion amount of the workpiece to be operated does not exceed the preset deviation, the current position deviation may be caused by non-temperature expansion and relatively minor factors. For example, mechanical vibration, measurement error, or some minor inherent deviations existing in the system itself. In this case, it is determined that there is no need to perform subsequent scaling factor calculation operations to avoid unnecessary consumption of computing resources and possible introduction of new errors due to over-calibration.

[0086] In some embodiments, before step S200 of obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result, it includes:

[0087] S270. Determine whether there is a second scan result of the workpiece to be operated in the previous time.

[0088] S271. If there is, use the first scan result as the reference scan result, that is, the result of the first scan.

[0089] S272. If not, obtain a preset scan result as the reference scan result. This situation has been described many times.

[0090] The workpiece to be operated is scanned at preset time intervals, and the first scan result of the workpiece to be operated that is updated in real time is obtained. Specifically, this step can always use the result of the first scan as the reference scan result. Specifically, the preset time can be 4 hours.

[0091] It should be noted that according to factors such as the requirements of the processing technology, the material characteristics of the workpiece to be operated, and the processing environment, the preset time for scanning is reasonably set. For example, for some semiconductor material workpieces to be operated that are more sensitive to temperature changes and have high processing accuracy requirements, the preset time may be set to a shorter interval. For some workpieces to be operated that are relatively less affected by temperature and have less extreme accuracy requirements, the preset time can be appropriately extended. The system can be built with a timing module for recording the time interval from the last scan to the current time. When the time interval reaches the preset time, the scanning operation of the workpiece to be operated is triggered.

[0092] The newly obtained scan result is replaced or supplemented with the previously stored scan result to achieve real-time update. For example, there is a dedicated database or data storage area in the system for storing the scan results of the workpiece to be operated obtained from each scan. After each new scan is completed, the latest scan image and other data are stored in the storage area according to the corresponding timestamp and workpiece number and other identification information, and at the same time, the old scan result corresponding to the same workpiece before is overwritten to ensure that the data relied on for subsequent operations is always the latest. The scan result updated in real time will provide basic data support for dynamically supplementing the stepping distance subsequently.

[0093] In some embodiments, step S200 of obtaining the expansion amount of the workpiece to be operated by comparing the first scan result with the reference scan result includes:

[0094] S280. Measure the expansion amount of the workpiece to be operated in real time according to the scan result of the workpiece to be operated updated in real time. By measuring the expansion amount in real time, the position change of the workpiece to be operated during the processing can be grasped timely and accurately. Whether it is expansion caused by temperature change, micro-movement caused by mechanical vibration, or position change caused by other factors, it can be intuitively reflected by the continuously updated expansion amount value.

[0095] In some embodiments, step S400 of calculating the scaling factor of the workpiece to be operated if the expansion amount is greater than the preset value includes:

[0096] S430. Calculate the scaling factor updated in real time according to the expansion amount of the workpiece to be operated measured in real time.

[0097] By calculating the scaling factor updated in real time according to the expansion amount measured in real time, the size change of the workpiece to be operated caused by factors such as temperature expansion at different times can be accurately reflected. Since the temperature is often dynamically changing in the processing environment, the expansion degree of the workpiece to be operated also changes continuously. The scaling factor updated in real time can closely follow this change, so that the subsequent adjustment of the step distance based on this factor can accurately compensate for the position deviation caused by expansion, thereby effectively maintaining the high-precision positioning state of the workpiece to be operated during the processing and reducing the dynamic influence of temperature factors on the processing accuracy.

[0098] In some embodiments, after step S500 of calibrating the position of the workpiece to be operated according to the scaling factor, it includes:

[0099] S510. Adjust the step distance of the motion platform in the first direction based on the first scaling factor.

[0100] S520. Adjust the step distance of the motion platform in the second direction based on the second scaling factor.

[0101] The adjustment method of the step distance of the motion platform is dynamic adjustment. By dynamically adjusting the step distance of the workpiece to be operated, the position deviation caused by temperature expansion can be effectively compensated. During the processing, the temperature change will cause the workpiece to be operated to expand. If it still moves according to the basic step distance, it will cause the workpiece to be operated to fail to reach the predetermined position accurately, affecting the processing accuracy. And adjusting the step distance according to the scaling factor updated in real time can make the moving distance of the workpiece to be operated automatically adapt to the expansion situation, thereby ensuring the positioning accuracy of the processing and improving the product quality.

[0102] In other embodiments, an inflation offset calibration system that executes the above-described calibration method for effective inflation of an inflation offset includes:

[0103] A scanning device configured to obtain a first scanning result of the workpiece to be operated in its current state.

[0104] A measuring device configured to obtain the amount of inflation of the workpiece to be operated by comparing the first scanning result with a reference scanning result.

[0105] A judging device configured to judge whether the amount of inflation of the workpiece to be operated is greater than a preset value.

[0106] A calculating device configured to calculate a scaling factor of the workpiece to be operated if the amount of inflation of the workpiece to be operated is greater than the preset value.

[0107] An adjusting device configured to calibrate the position of the workpiece to be operated according to the scaling factor.

[0108] In other embodiments, a computer-readable storage medium stores a computer program which, when executed by a computer processor, implements the above-described calibration method for effective inflation of a motion platform.

[0109] The computer-readable storage medium in this embodiment can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in conjunction with an instruction execution system, apparatus, or device. In this embodiment, the computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries the computer-readable program code. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. The computer-readable signal medium can also be any computer-readable storage medium other than the computer-readable storage medium, and this computer-readable storage medium can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable storage medium can be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0110] In some embodiments, a computer device executes the above-described calibration method for expansion offset.

[0111] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A calibration method for expansion offset, characterized in that, Including: Obtain a first scan result of the workpiece to be operated in its current state; Based on a comparison between the first scan result and a reference scan result, obtain the expansion amount of the workpiece to be operated; Determine whether the expansion amount is greater than a preset value; If the expansion amount is greater than the preset value, calculate the scaling factor of the workpiece to be operated; Calibrate the position of the workpiece to be operated according to the scaling factor.

2. The calibration method according to claim 1, wherein The step of obtaining the expansion amount of the workpiece to be operated based on a comparison between the first scan result and the reference scan result includes: Based on the first scan result, determine the first measured distances of at least two first marking points on the workpiece to be operated in a first direction; and Obtain the first reference distance corresponding to the reference scan result in the first direction; Calculate the difference between the first measured distance and the first reference distance to obtain a first expansion amount.

3. The calibration method according to claim 2, characterized in that, The step of obtaining the expansion amount of the workpiece to be operated based on a comparison between the first scan result and the reference scan result further includes: Based on the first scan result, determine the second measured distances of at least two second marking points on the workpiece to be operated in a second direction; and Obtain the second reference distance corresponding to the reference scan result in the second direction; Calculate the difference between the second measured distance and the second reference distance to obtain a second expansion amount; wherein the first direction is perpendicular to the second direction.

4. The calibration method according to claim 3, wherein The step of calculating the scaling factor of the workpiece to be operated if the expansion amount is greater than the preset value includes: When the first expansion amount is greater than a first preset value, calculate the first scaling factor of the workpiece to be operated in the first direction; When the second expansion amount is greater than a second preset value, calculate the second scaling factor of the workpiece to be operated in the second direction.

5. The calibration method according to claim 4, characterized in that, The distance between two of the first marking points in a preset standard environment is equal to the distance between two of the second marking points in the standard environment; The first preset value and the second preset value are equal.

6. The calibration method according to claim 4, wherein After the step of calibrating the position of the workpiece to be operated according to the scaling factor, it includes: Based on the first scaling factor, adjust the step distance of the moving platform in the first direction; Based on the second scaling factor, adjust the step distance of the moving platform in the second direction.

7. The calibration method according to claim 6, wherein Before the step of obtaining the expansion amount of the workpiece to be operated based on a comparison between the first scan result and the reference scan result, it includes: Determine whether there is a second scan result of the workpiece to be operated from the previous time; If there is, use the first scan result as the reference scan result; If not, obtain a preset scan result as the reference scan result.

8. An expansion offset calibration system that executes the expansion offset calibration method according to any one of claims 1-7, characterized in that Including: A scanning device for obtaining a first scan result of the workpiece to be operated in its current state; A measuring device for obtaining the expansion amount of the workpiece to be operated based on a comparison between the first scan result and the reference scan result; A judging device for judging whether the expansion amount of the workpiece to be operated is greater than a preset value; A calculating device for calculating the scaling factor of the workpiece to be operated if the expansion amount of the workpiece to be operated is greater than the preset value; An adjusting device for calibrating the position of the workpiece to be operated according to the scaling factor.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, The computer program, when executed by a computer processor, implements the calibration method for expansion offset described in any one of claims 1-7.

10. A computer device, characterized in that, Execute the calibration method for expansion offset described in any one of claims 1-7.

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