Headset earmuff with adsorbent material

Abstract

The invention relates to a headphone earmuff with an adsorbent material. The present invention discloses a headphone earmuff, the headphone earmuff comprising: a frame defining an acoustic cavity acoustically coupled to a driver; an earmuff cushion coupled to the frame and surrounding the acoustic cavity; and a sorbent member acoustically coupled to the acoustic cavity to cause acoustic enlargement of the acoustic cavity.

Description

[0001] Cross - Reference to Related Applications

[0002] This application is a non - provisional application of co - pending U.S. Provisional Patent Application 63 / 079,389, filed on September 16, 2020, which is incorporated herein by reference.

[0003] This application is a divisional application of the Chinese patent application with the application number 202110931654.6, the filing date of August 13, 2021, and the invention title of "Headphone Earcups with Adsorbent Material". Technical Field

[0004] One aspect of the present disclosure relates to headphone earcups, and more particularly to headphone earcups having an adsorbent material to acoustically expand the sound cavity of the earcups. Other aspects are also described and claimed. Background Art

[0005] Whether listening to a portable media player while traveling or listening to a stereo system or a theater system at home, consumers typically choose over - ear headphones. Over - ear headphones generally include a pair of earcups that surround the user's ears and are held together by a headband. Based on the design of the earcups, over - ear headphones can be divided into two categories, namely, rear - closed earcups or rear - open earcups. Rear - closed earcups surround the user's ears and the back of the rear - closed earcups is sealed. Rear - open earcups also surround the user's ears, but the back of the rear - open earcups is open to the surrounding environment around the earcups.

[0006] Both the rear - closed design and the rear - open design have their own acoustic advantages and disadvantages. For example, since rear - closed earcups are sealed against ambient noise, they can have good sound insulation. In addition, the size and clamping force of the earcups can also be modified to further increase the sound insulation. Characteristics of the rear - closed design such as the sealed back, size, and clamping force of the earcups allow this design to mechanically or passively attenuate ambient noise. However, due to the closed design of rear - closed earcups, they can have stronger resonances. For example, standing waves can accumulate in the earcups. These standing waves can reduce the sound quality and the sense of openness that users typically expect. On the other hand, rear - open earcups may feel more open to the user, but may not be ideal in noisy environments because their passive attenuation may not be as good as that of the rear - closed design. Summary of the Invention

[0007] One aspect of the present disclosure may include a headphone earcup that includes an absorbent material for acoustically enlarging the acoustic cavity (e.g., the front volume chamber) of the earcup. The acoustic cavity may be a cavity that receives sound output from an associated driver and surrounds the user's ear. For example, the absorbent material may be incorporated into the earcup and coupled to the acoustic cavity to simulate a larger acoustic cavity (e.g., a larger front volume chamber) and / or maximize the damping characteristics of the acoustic cavity. The acoustic enlargement and / or damping may in turn improve the downlink response and passive attenuation at high frequencies. The absorbent material may be any absorbent material that is capable of providing damping without occupying as much space as other damping materials (e.g., foam). For example, the absorbent material may be any absorbent material that is capable of absorbing gas during sound generation. In some aspects, the absorbent material may be embedded in the earcup cushion (e.g., a ring of material surrounding the user's ear) or integrated into the earcup frame. For example, the absorbent material may be integrated into the foam within the earcup cushion. The absorbent material may include a module that is externally assembled and inserted into the earcup frame or otherwise part of the module. For example, the absorbent material may be housed within a module housing that has at least one opening to the acoustic cavity. For example, the module may be a module housing that has a rigid or sound-impermeable sidewall (e.g., a plastic sidewall) and at least one sound-permeable wall (e.g., a mesh sidewall) that provides an opening to the acoustic cavity. In another aspect, the module may be a flexible housing, such as a housing made of a sound-permeable fabric, within which the absorbent material may be housed and compressed to a desired size / shape. In some aspects, the absorbent material acts as a tuning knob by increasing the acoustic cavity (e.g., the front volume chamber) and damping characteristics, which will have an impact on passive attenuation. The absorbent material may be any type of absorbent material that can cause a simulated acoustic enlargement of the acoustic volume or cavity to which it is coupled. In some aspects, the absorbent material may include absorbent particles that absorb gas during sound generation. For example, the absorbent material may include, but is not limited to, microporous materials such as zeolites. Zeolites are microporous minerals, typically aluminosilicate minerals. For example, the absorbent material may include unbound particles, such as a particulate composition of one or more of zeolite material and / or activated carbon material. In additional examples, the absorbent material may be a zeolite material that includes zeolite particles having a specific silicon to aluminum mass ratio.

[0008] Representatively, in one aspect, a headset includes two headset earcups, each headset earcup including: a frame defining a driver front volume chamber; and an adsorbent member containing zeolite, the adsorbent member being acoustically coupled to the driver front volume chamber to cause acoustic expansion of the driver front volume chamber. The headset may further include an earcup cushion coupled to the frame and surrounding the driver front volume chamber. The adsorbent member may be positioned within the earcup cushion. The earcup cushion may define an opening coupling the adsorbent member to the driver front volume chamber. In some aspects, the earcup cushion may include foam, and the adsorbent member may be integrated into the foam. The adsorbent member may be positioned inside the frame, and the frame includes an opening to acoustically couple the adsorbent member to the driver front volume chamber. The adsorbent member may include an adsorbent material encapsulated within a housing, the housing being coupled to the frame or to the earcup cushion coupled to the frame. The housing may include a plurality of sound-impermeable sidewalls and at least one sound-permeable sidewall to acoustically couple the adsorbent material to the driver front volume chamber. The housing may include a sound-permeable grid. The adsorbent member may include a first adsorbent member and a second adsorbent member, the first adsorbent member being coupled to the frame, the second adsorbent member being coupled to the earcup cushion coupled to the frame.

[0009] In another aspect, a headset earcup includes: a frame defining a sound chamber acoustically coupled to the sound output side of a driver; an earcup cushion coupled to the frame and sized to surround the sound chamber; and an acoustic adsorbent module containing zeolite, the acoustic adsorbent module being acoustically coupled to the sound chamber. The zeolite may be encapsulated within a module housing. The module housing may include a sound-permeable grid material encapsulating the zeolite. The module housing may be partially formed of a sound-permeable fabric. The module housing may compress the zeolite into a smaller volume than the case where the zeolite is not encapsulated within the module housing. The module housing may include at least one plastic sidewall defining an opening to the zeolite. The acoustic adsorbent module may be positioned within the earcup cushion. The acoustic adsorbent module may be integrated into the frame. The acoustic adsorbent module may be formed separately from the frame and the earcup cushion. The zeolite may cause simulated acoustic expansion of the sound chamber and suppress standing waves within the sound chamber.

[0010] The above summary does not include an exhaustive list of all aspects of the present disclosure. It is contemplated that the present disclosure includes all systems and methods that can be implemented by all suitable combinations of the various aspects outlined above, as well as those disclosed in the detailed description below and particularly pointed out in the claims filed with this patent application. Such combinations have specific advantages not specifically recited in the summary above. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Several aspects are shown by way of example and not limitation in the figures of the accompanying drawings, in which like reference numerals indicate similar elements. It should be noted that reference to "one" or "an" aspect in the present disclosure is not necessarily the same aspect, and it means at least one.

[0012] Figure 1 A schematic diagram showing a cross-sectional view of one aspect of a headphone ear cup structure.

[0013] Figure 2 A schematic diagram showing a cross-sectional view of one aspect of a headphone ear cup structure.

[0014] Figure 3 Shows Figure 1 Schematic diagram of an enlarged cross-sectional view of an adsorbent component of a headphone earmuff structure.

[0015] Figure 4 Shows Figure 1 Schematic diagram of an enlarged cross-sectional view of an adsorbent component of a headphone earmuff structure.

[0016] Figure 5 A simplified schematic diagram showing one aspect of an electronic device in which a headphone ear cup structure may be implemented. DETAILED DESCRIPTION

[0017] The following description shows many specific details. However, it should be understood that aspects of the present disclosure can be practiced without these specific details. In other cases, well-known circuits, structures, and techniques are not shown in detail to avoid obscuring the understanding of this description.

[0018] In the following description, reference is made to the accompanying drawings that illustrate several aspects of the present disclosure. It should be understood that other aspects may also be utilized, and that mechanical composition changes, structural changes, electrical changes, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be construed in a limiting sense, and the scope of the aspects of the present disclosure is limited only by the claims of the issued patents.

[0019] The terms used herein are for the purpose of describing particular aspects only and are not intended to limit the present disclosure. Spatially relative terms, such as "beneath," "below," "lower," "above," "upper," etc., may be used herein for convenience in describing one element or feature's relationship to another or other elements or features as illustrated in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. For example, if the device in the figures is turned over, an element described as "beneath" or "below" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "beneath" can encompass both an orientation of above and below. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are to be interpreted accordingly.

[0020] As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the terms "comprises," "comprising" specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0021] The term "or" and "and / or" as used herein shall be interpreted as inclusive or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C." This definition has exceptions only when the combination of elements, functions, steps, or acts are somehow inherently mutually exclusive.

[0022] Figure 1 A schematic diagram showing a cross-sectional view of an aspect of the earcup structure of a headset is shown. It should be understood that the figures show only one of a pair of left and right earcups of the headset 100, which pair of earcups may be connected by a headband (not shown). Thus, each of the features described with reference to the earcup of the headset 100 shown should be understood to apply to the other earcup of the headset 100. The earcup of the headset 100 includes a frame 102 that forms a housing sized to surround a user's ear 106 and form an acoustic cavity 104 around the user's ear. When the earcup of the headset 100 is positioned on the user's head, the acoustic cavity 104 can surround the ear 106, and when not positioned against the user's head, the acoustic cavity may be open to the surrounding environment. Figure 1 The headset 100 shown. Each of the features described with reference to the earcup of the headset 100 should be understood to apply to the other earcup of the headset 100. The earcup of the headset 100 includes a frame 102 that forms a housing sized to surround a user's ear 106 and form an acoustic cavity 104 around the user's ear. When the earcup of the headset 100 is positioned on the user's head, the acoustic cavity 104 can surround the ear 106, and when not positioned against the user's head, the acoustic cavity may be open to the surrounding environment.

[0023] A driver 108 for outputting sound (S) (e.g., a music signal) in the direction of the ear 106 can be mounted to the frame 102. For example, the driver 108 can have a sound output side that is open to the sound cavity 104 such that the sound (S) is output into the sound cavity 104. Thus, the sound cavity 104 can also be considered as the front volume chamber of the driver 108 or as part of the formation of the front volume chamber since the cavity is open to the surrounding environment. The driver 108 can be any type of electroacoustic transducer (e.g., a loudspeaker) having a pressure-sensitive diaphragm and a circuit configured to generate sound in response to an input of an audio electrical signal. The audio electrical signal can be a music signal input to the driver 108 by a sound source 110. The sound source 110 can be any type of audio device capable of outputting an audio signal, such as an audio electronic device such as a smart phone, a portable music player, a home stereo system, or a home theater system capable of outputting an audio signal.

[0024] The earcup of the headset 100 can also include an earcup pad or cushion 112. The earcup cushion 112 can be attached to the side or face of the frame 102 facing the ear 106 and forming the sound cavity 104. In some cases, the earcup cushion 112 can form part of the sound cavity 104 and helps to form a seal between the sound cavity 104 and the user's ear 106. The earcup cushion 112 can be an annular or other similar circular, racetrack-shaped, or oval-shaped structure that surrounds the sound cavity 104 and can seal around or to the user's head or ear 106. When pressed against the user's head and / or ear, the earcup cushion 112 can be compressible and conform to the user's head and / or ear 106, thereby improving user comfort. For example, the earcup cushion 112 can be made of a compressible foam material 114 housed within a cushion cover 116. In some aspects, the earcup cushion 112 can also include an opening 118 through the cover 116 such that the foam material 114 is acoustically open to the sound cavity 104. In this aspect, the foam material 114 can help to suppress standing waves within the sound cavity 104. For example, as Figure 1 shown, as the sound (S) is output upward (or otherwise away from the driver) by the driver 108, the waves also propagate outward and cause standing waves 105A, 105B in different regions of the sound cavity 104. For example, there can be a standing wave 105A within the portion of the cavity defined by the rigid frame 102, and there can be a standing wave 105B within the portion of the cavity defined by the flexible earcup cushion 112. The foam material 114 within the earcup cushion 112 can help to suppress the standing wave 105B.

[0025] The earcup headphone 100 may also include an adsorbent member 120 coupled to the acoustic cavity 104 to suppress standing waves and cause an apparent acoustic enlargement of the acoustic cavity 104. In other words, the adsorbent member 120 may make the volume of the acoustic cavity 104 appear larger than the actual volume, which in turn may improve the acoustic performance. As previously mentioned, the acoustic cavity 104 may form or be part of the driver front volume chamber, and thus its size may affect the overall acoustic performance of the earcup. For example, maximizing the volume of the acoustic cavity 104 may improve the acoustic performance and enhance the user experience and / or comfort. However, increasing the cavity volume of the earcup is typically challenging because it may also be desirable to remain relatively thin and thus maintain a compact footprint such that the headphone does not take up too much space. Accordingly, the adsorbent member 120 may simulate an acoustic enlargement of the volume of the acoustic cavity 104 without affecting the overall footprint and / or size of the headphone earcup. In this regard, the adsorbent member 120 may include an adsorbent material that may have damping characteristics and occupy a minimal space within the earcup. For example, the adsorbent material may include, but is not limited to, zeolite materials or a combination of adsorbent materials (including activated carbon materials and zeolite materials). The adsorbent member 120 may, for example, occupy less space or volume than the foam material 118 while still providing damping characteristics and simulating an acoustic enlargement of the cavity 104.

[0026] In one aspect, the adsorbent member 120 can be positioned within the earcup cushion 112. In this position, the adsorbent member 120 can help to suppress the standing wave 105B within the cushion region of the cavity 104. Representatively, the adsorbent member 120 can be incorporated into the foam material 120 of the earcup cushion 112. For example, the adsorbent member 120 can be positioned within a portion of the foam material 114 adjacent to the opening 118 of the earcup cushion 112 such that the adsorbent member is exposed to the acoustic cavity 104. Representatively, the adsorbent member 120 can be an adsorbent material (e.g., zeolite) embedded within the foam material 120. In a further aspect, the adsorbent member 120 can include a module encapsulating the adsorbent material, and the module can be embedded or encapsulated within the foam material 120. For example, a module encapsulating the adsorbent material can be mounted (or otherwise attached) to an end of the frame 102 to which the earcup cushion 112 is also attached. Loading the module or portion of the foam material with the adsorbent material can involve injecting the adsorbent material (and in some cases in combination with an adhesive material) directly into the module or foam material or mold to achieve a preform, and then loading the preform into the desired mold or material within the cushion 112. The adsorbent member 120 is then positioned within the foam material 114 inside the cushion cover 116. Although the adsorbent member 120 is shown attached to an end of the frame 102, it should be understood that the adsorbent member 120 can be attached to any portion of the earcup cushion 112 or frame 102 that acoustically couples it to the acoustic cavity 104. Additionally, the adsorbent member 120 can be an annular member that extends completely around the earcup cushion 112, or formed as a discrete unit positioned within a portion of the earcup cushion 112 surrounding the cavity 104. Reference will be made Figures 3 to 4 to a representative modular configuration of the adsorbent member 120 in more detail.

[0027] Now referring Figure 2 , Figure 2 FIG. shows another aspect in which the adsorbent member 120 is attached to the headphone earcup 100. In this aspect, the adsorbent member 120 is shown attached or otherwise mounted to a portion of the frame 102. Representatively, the adsorbent member 120 can be attached to a sidewall 202 of the frame 102 that defines a portion of the acoustic cavity 104. For example, the adsorbent member 120 can be attached to the inner sidewall 202 (e.g., the sidewall defining the cavity 104). In some aspects, the adsorbent member 120 is positioned inside the frame 102, positioned between the inner sidewall 202 and the outer sidewall 206 that define the frame 102, as shown. In this aspect, the adsorbent member 120 does not occupy or otherwise reduce the available volume of the acoustic cavity 104. The frame sidewall 202 can include an opening 204 to the adsorbent member 120 such that the adsorbent member is acoustically open to the acoustic cavity 104.

[0028] When as Figure 2When positioned within the frame 102 as shown, the adsorbent member 120 can help suppress the standing wave 105A generated within this region of the cavity 104 and result in an apparent acoustic enlargement of the acoustic cavity 104. Although the adsorbent member 120 is shown attached to the sidewall 202, it should be understood that the adsorbent member 120 can be attached to any sidewall or portion of the frame 102 that acoustically couples it to the acoustic cavity 104. Additionally, the adsorbent member 120 can extend completely around the frame 102 (e.g., an annular structure), or it can be composed of discrete units positioned within portions of the frame 102. Further still, it should be understood that any number of adsorbent members 120 can be used within the earcup housing 100. For example, the earcup housing 100 can include adsorbent members 120 within the earcup cushion as shown in Figure 1 and adsorbent members 120 within the frame as shown in Figure 2 .

[0029] Now referring to Figures 3 to 4 , Figures 3 to 4 a cross-sectional view of a representative adsorbent member that can be integrated into the headset earcup 100 is shown. Figure 3 The adsorbent member 120 is shown, where the adsorbent material 302 is encapsulated within a module housing or enclosure 304. The module housing or enclosure 304 can include a plurality of sidewalls 306, 308, 310, 312 that encapsulate or otherwise contain the adsorbent material 302. For example, the enclosure 302 can include a plurality of relatively rigid and / or sound-impermeable sidewalls 306 to 310 and at least one sound-permeable sidewall 312. The sound-permeable sidewall 312 can be positioned above an opening 314 defined by the sidewalls 306 and 310. The sound-permeable sidewall 312 includes an opening 316 such that the adsorbent material 302 is open to the acoustic cavity and can result in acoustic enlargement, as described previously. For example, the sound-permeable sidewall can be made of a fabric, mesh, or other similar material having openings to allow acoustic transmission between the acoustic cavity and the adsorbent material 302.

[0030] Now referring to Figure 4 , Figure 4 another aspect of the adsorbent member that can be integrated into the headset earcup 100 is shown. Representatively, the adsorbent member 120 can include an adsorbent material 402 encapsulated or otherwise contained within a module housing or enclosure 404. The housing or enclosure 404 can include sidewalls 406, 408, which are similar to those previously referenced in Figure 3The modules discussed. However, in this regard, side walls 406 and 408 may be made of a relatively flexible and acoustically permeable material including openings 416 such that they allow acoustic transmission between the adsorbent material 402 encapsulated therein and the acoustic cavity, as previously described. For example, side walls 406, 408 may be made of sheets of acoustically permeable fabric or mesh material attached together around their edges such that the adsorbent material 402 is fully encapsulated between side walls 406, 408. In some aspects, the adsorbent material 402 may be compressed or otherwise shaped as needed such that the adsorbent member 120 occupies a minimum amount of space within the earcup.

[0031] Either of the previously discussed module housings or enclosures 304, 404 may be integrated into the previously referenced Figures 1 to 2 discussed earcup headphone 100. Representatively, in some aspects, the module housings or enclosures 304, 404 may be formed separately from the headphone earcup 100 and then attached to the frame 102 or earcup cushion 112 during assembly. In one aspect, the module may be mechanically attached to the headphone earcup 100. For example, one or more of the side walls of the module housing or enclosure 304, 404 may include interlocking members that interlock with the side walls of the frame 102 such that the module is attached to the frame 102 or earcup cushion 112 in a snap-fit arrangement. In other aspects, the module housing or enclosure 304, 404 may be mounted to the frame 102 or earcup cushion 112 according to any other suitable fastening mechanism (e.g., molding, adhesive, etc.).

[0032] Figure 5 A simplified schematic illustration of one aspect of an electronic device in which the headphone earcup disclosed herein may be implemented is shown. For example, headphone 100 is an example of a system that may include some or all of the circuits shown in electronic device 500. Electronic device 500 may include, for example, a power supply 502, a storage device 504, a signal processor 506, a memory 508, a processor 510, a communication circuit 512, and an input / output circuit 514. In some aspects, electronic device 500 may include more than one circuit component of each type of circuit component, but for simplicity, only one component of each type is shown Figure 5 herein. Additionally, those skilled in the art will understand that the functions of certain components may be combined or omitted and that additional components or fewer components not shown Figures 1 to 4 herein may be included in, for example, headphone 100.

[0033] Power supply 502 can supply power to components of electronic device 500. In some aspects, power supply 502 can be connected to an electrical grid, such as, for example, a wall power outlet. In some aspects, power supply 502 can include one or more batteries for powering a headset or other types of electronic devices associated with the headset. As another example, power supply 502 can be configured to generate electricity from natural sources (e.g., solar energy using solar cells).

[0034] Storage device 504 can include, for example, a hard disk drive, flash memory, cache, ROM, and / or RAM. Additionally, storage device 504 can be local and / or remote from electronic device 500. For example, storage device 504 can include integrated storage media, removable storage media, storage space on a remote server, wireless storage media, or any combination thereof. Further, storage device 504 can store data, such as, for example, system data, user profile data, and any other relevant data.

[0035] Signal processor 506 can be, for example, a digital signal processor for real-time processing of digital signals that are converted from analog signals by, for example, input / output circuit 514. After the processing of the digital signal is complete, the digital signal can then be converted back to an analog signal. For example, signal processor 506 can be used to analyze digitized audio signals received from ambient or error microphones to determine how much of the audio signal is ambient noise or earcup noise and how much of the audio signal is, for example, a music signal.

[0036] Memory 508 can include any form of temporary memory such as RAM, buffers, and / or cache. Memory 508 can also be used to store data for operating electronic device applications (e.g., operating system instructions).

[0037] In addition to signal processor 506, electronic device 500 can additionally include a general-purpose processor 510. Processor 510 is capable of interpreting system instructions and processing data. For example, processor 510 is capable of executing instructions or programs, such as system applications, firmware applications, and / or any other applications. Additionally, processor 510 has the ability to execute instructions to communicate with any or all components of electronic device 500. For example, processor 510 can execute instructions stored in memory 508 to enable or disable ANC, or execute instructions to open or close a passive control assembly valve.

[0038] Communication circuit 512 can be any suitable communication circuit that operates to initiate communication requests, connect to a communication network, and / or transmit communication data to one or more servers or devices within the communication network. For example, communication circuit 512 can support Wi-Fi (e.g., 802.11 protocol), One or more of a high-frequency system, infrared, GSM, GSM plus EDGE, CDMA, or any other communication protocol, and / or any combination thereof.

[0039] Input / output circuit 514 can convert (and encode / decode if necessary) analog signals and other signals (such as physical contact inputs, physical movements, analog audio signals, etc.) into digital data. Input / output circuit 514 can also convert digital data into any other type of signal. The digital data can be provided to processor 510, storage device 504, memory 508, signal processor 506, or any other component of electronic device 500, and can be received from these components. Input / output circuit 514 can be used to interact with any suitable input or output device. In addition, electronic device 500 can include dedicated input circuits associated with input devices, such as one or more proximity sensors, accelerometers, etc. Electronic device 500 can also include dedicated output circuits associated with output devices, such as one or more speakers, headphones, etc.

[0040] Finally, bus 516 can provide a data transmission path for transmitting data to, from, or between processor 510, storage device 504, memory 508, communication circuit 512, and any other component included in electronic device 500. Although bus 516 is shown as a single component in Figure 5 it should be understood by those skilled in the art that electronic device 500 can include one or more components.

[0041] Although certain aspects have been described and illustrated in the figures, it should be understood that such aspects are merely illustrative of the broad disclosure and not limiting, and the present disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications can be envisioned by those of ordinary skill in the art. Accordingly, the description is to be regarded as illustrative rather than restrictive. In addition, to assist the Patent Office and any readers of any patent issued on this application, the applicant wishes to point out that they do not intend any of the appended claims or claim elements to invoke 35 U.S.C. 112(f), unless the specific term "means for..." or "step for..." is expressly used in a particular claim.

Claims

1. An earphone, comprising: An earphone earcup, comprising: A rigid frame having an outer wall and an inner wall, defining a driver front volume chamber around a driver mounted thereon; and An adsorbent member including zeolite, the adsorbent member being located within the frame, between the outer wall and the inner wall, and acoustically coupled to the driver front volume chamber through an opening in the inner wall.

2. The earphone according to claim 1, further comprising an earcup cushion coupled to the frame and surrounding the driver front volume chamber.

3. The earphone according to claim 2, wherein the adsorbent member is a first adsorbent member, and a second adsorbent member is located within the earcup cushion.

4. The earphone according to claim 3, wherein the earcup cushion defines an opening that couples the second adsorbent member to the driver front volume chamber.

5. The earphone according to claim 1, further comprising an earcup cushion coupled to the frame and surrounding the driver front volume chamber, and wherein the earcup cushion includes foam, and the adsorbent member is a first adsorbent member, and a second adsorbent member is integrated into the foam.

6. The earphone according to claim 1, wherein the adsorbent member includes an adsorbent material located within a housing, and the housing includes an interlocking member for coupling the housing to the inner wall.

7. The earphone according to claim 1, wherein the adsorbent member includes an adsorbent material encapsulated within a housing coupled to the frame.

8. The earphone according to claim 7, wherein the housing includes a plurality of sound-impermeable sidewalls and at least one sound-permeable sidewall to acoustically couple the adsorbent material to the driver front volume chamber.

9. The earphone according to claim 7, wherein the housing includes a sound-permeable grid.

10. An earphone earcup, comprising: A frame defining a sound chamber acoustically coupled to a sound output side of a driver; An earcup cushion coupled to the frame and sized to surround the sound chamber; And A module including sidewalls encapsulating a zeolite material, and the encapsulated zeolite material is acoustically coupled to the sound chamber.

11. The earphone earcup according to claim 10, wherein the earcup cushion includes a foam material, and the sidewalls separate the zeolite material from the foam material.

12. The earphone earcup according to claim 11, wherein the sidewalls include a sound-permeable grid material encapsulating the zeolite material.

13. The earphone earcup according to claim 11, wherein the sidewalls are partially formed of a sound-permeable fabric.

14. The earphone earcup according to claim 13, wherein the sound-permeable fabric compresses the zeolite material encapsulated therein.

15. The earphone earcup according to claim 11, wherein at least one of the sidewalls is a plastic sidewall defining an opening to the zeolite material.

16. The earphone earcup according to claim 10, wherein the module is located within the earcup cushion.

17. The earphone earcup according to claim 10, wherein the module is integrated into the frame.

18. The earcup of a headphone according to claim 10, wherein the module is formed separately from the frame and the earcup cushion.

19. The earcup of a headphone according to claim 10, wherein the zeolite material causes an analog acoustic expansion of the sound cavity and suppresses standing waves within the sound cavity.

20. A headphone, comprising: a frame that defines a sound cavity acoustically coupled to the sound output side of a driver; a cushion including a foam material, the cushion being coupled to the frame and sized to surround the sound cavity; and an acoustic adsorbent module including sidewalls, sized to encapsulate a zeolite material, and the encapsulated zeolite material being acoustically coupled to the sound cavity.

21. The headphone according to claim 20, wherein the sidewalls separate the zeolite material from the foam material.

22. The headphone according to claim 20, wherein the sidewalls include a sound-permeable mesh or fabric material that encapsulates the zeolite material.

23. The headphone according to claim 20, wherein the sidewalls compress the zeolite material encapsulated therein.

24. The headphone according to claim 20, wherein at least one of the sidewalls is a plastic sidewall that defines an opening to the zeolite material.

25. The headphone according to claim 20, wherein the earcup of the headphone includes the frame, the cushion, and the acoustic adsorbent module.

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