Heat exchange devices, electronic equipment and server cabinets

Abstract

The present invention relates to the field of mechanical design technology, and discloses a heat exchange device, an electronic device, and a server cabinet. The heat exchange device of the present invention comprises: a device body; a first flow channel provided on the device body for connecting to a primary-side pipeline; a second flow channel provided on the device body for connecting to a secondary-side pipeline, the first flow channel being connected to the second flow channel for heat exchange; and a heat-conducting structure being connected to the first flow channel for heat exchange. The heat exchange device of the embodiment of the present invention can solve the problem in the related art that a cold liquid distribution unit needs to be reserved in a server cabinet, and the exhaust of the server affects the temperature in the computer room, requiring air conditioning to control the temperature of the computer room environment. The heat exchange device can also help reduce the overall energy consumption of the data center, save space in the cabinet, facilitate the high-density design of the cabinet, and reduce the cost of the coolant.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanism design, and in particular to a heat exchange device, electronic equipment and a server cabinet. Background Art

[0002] As server power demands continue to climb, the performance requirements for their internal heat exchange devices are becoming increasingly stringent.

[0003] In the related art, some heat exchange devices include a cold plate and heat dissipation fins arranged on the cold plate. The cold plate is used to connect to the high-power consumption components in the server, so as to perform liquid cooling and heat dissipation on the high-power consumption components. The heat dissipation fins are connected to the cold plate for heat exchange, so as to cooperate with the air cooling module in the server to perform air cooling and heat dissipation on the high-power consumption components. However, such a heat exchange device requires space to be reserved in the server cabinet to set up a cold liquid distribution unit, resulting in a large space occupation, and the air blown out by the air cooling module will carry some heat and be discharged into the computer room through the openings of the server chassis, and the temperature of the computer room environment needs to be controlled by air conditioning. Summary of the Invention

[0004] In view of this, the present invention provides a heat exchange device, an electronic device and a server cabinet to solve the problem in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust of the electronic equipment will affect the temperature in the computer room, and the temperature of the computer room environment needs to be controlled by air conditioning.

[0005] In a first aspect, the present invention provides a heat exchange device, comprising:

[0006] Device body;

[0007] A first flow channel is provided on the device body and is used to connect to the primary side pipeline;

[0008] The second flow channel is provided on the device body and is used to connect to the secondary side pipeline, and the first flow channel is connected to the second flow channel for heat exchange;

[0009] The heat-conducting structure is connected to the first flow channel for heat exchange.

[0010] In a second aspect, the present invention further provides an electronic device, comprising:

[0011] A chassis, wherein a first power consumption component and a second power consumption component can be arranged in the chassis, and the power consumption of the first power consumption component is greater than the power consumption of the second power consumption component;

[0012] a cold plate, disposed in the chassis and connected to the first power-consuming component for heat exchange;

[0013] The heat exchange device provided in the first aspect of the present invention is arranged in a chassis, and the second flow channel of the heat exchange device is connected to the cold plate through a secondary side pipeline;

[0014] The air cooling module is arranged in the chassis and can blow air to the heat conducting structure of the heat exchange device.

[0015] In a third aspect, the present invention provides a server cabinet, comprising:

[0016] Cabinet;

[0017] The electronic device provided in the second aspect of the present invention is arranged in a cabinet.

[0018] Through this application, the heat exchange device of the embodiment of the present invention can be installed in the chassis of an electronic device during use. The second flow channel can be connected to the cold plate in the electronic device through the secondary side pipeline, and the first flow channel can be connected to the cold source through the primary side pipeline. Then, the coolant in the secondary side pipeline can carry the heat released by the second power consumption component and exchange heat with the low-temperature coolant from the cold source in the first flow channel within the heat exchange device, thereby achieving liquid cooling of the first power consumption component. The first flow channel can be connected to the cold source and carry away the heat released by the first power consumption component and discharge it outside the system.

[0019] The heat-conducting structure is connected to the first flow channel in a heat exchange manner, thereby extracting cooling energy from the first flow channel. This, in turn, works with the air-cooling module within the electronic device to provide low-temperature cooling airflow to the second power-consuming component within the electronic device, thereby achieving air cooling and heat dissipation for the second power-consuming component. When the heat-conducting structure itself is heated, the heat is carried away by the primary-side piping through the connected first flow channel and discharged outside the heat exchange device, thereby continuously cooling the heat-conducting structure.

[0020] On this basis, since the heat-conducting structure can convert the airflow blown out by the air-cooling module into low-temperature cooling airflow, it can avoid the exhaust of electronic equipment from affecting the temperature of the computer room, and avoid controlling the temperature of the computer room through air conditioning, which in turn helps to reduce the overall energy consumption of the data center.

[0021] Furthermore, since the heat exchange device of the embodiment of the invention can be arranged in the chassis of the electronic equipment, and the first flow channel and the second flow channel are provided in the main body of the device, it can replace the cold liquid distribution unit to perform the heat exchange function, thereby eliminating the need to reserve separate space in the cabinet to set up the cold liquid distribution unit, which helps to save space in the cabinet, and enables the secondary side pipeline to be completely placed in the chassis of the electronic equipment without extending to the outside of the chassis and connecting to the cold liquid distribution unit, thereby shortening the length of the secondary side pipeline, thereby reducing the amount of high-quality coolant in the secondary side pipeline, and greatly saving the cost of the coolant.

[0022] Therefore, the heat exchange device of the embodiment of the present invention can solve the problem in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust of the server will affect the temperature in the computer room, and it is necessary to use air conditioning to control the temperature of the computer room environment. It also helps to reduce the overall energy consumption of the data center, save space in the cabinet, is conducive to the high-density design of the cabinet, and can reduce the cost of cooling liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in related technologies, the following briefly introduces the drawings required for use in the specific embodiments or related technical descriptions. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A cross-sectional view of a heat exchange device according to an embodiment of the present invention at an angle;

[0025] Figure 2 This is a cross-sectional view of a heat exchange device according to an embodiment of the present invention. To facilitate display of the first heat exchange pipe and the second heat exchange pipe, the heat conducting fins are hidden.

[0026] Figure 3 A first heat conducting plate of a heat exchange device according to an embodiment of the present invention;

[0027] Figure 4 A second heat conducting plate of a heat exchange device according to an embodiment of the present invention;

[0028] Figure 5 A cross-sectional view of a heat exchange device according to an embodiment of the present invention at another angle;

[0029] Figure 6 This is a schematic diagram of a heat exchange device according to an embodiment of the present invention;

[0030] Figure 7 is a schematic diagram of an electronic device according to an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of the layout of an electronic device according to an embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of airflow direction in an electronic device according to an embodiment of the present invention;

[0033] Figure 10 is a schematic diagram of an electronic device according to an embodiment of the present invention from a top view;

[0034] Figure 11The figure is a schematic diagram of an electronic device according to an embodiment of the present invention from a top view.

[0035] Description of reference numerals:

[0036] 100. Heat exchange device; 1. Device body; 101. Housing; 102. First heat exchange pipeline; 103. Second heat exchange pipeline; 104. Heat conducting plate; 1041. First heat conducting plate; 10411. First heat conducting pattern; 10412. Second heat conducting pattern; 1042. Second heat conducting plate; 10421. Third heat conducting pattern;

[0037] 105, primary side inlet; 106, primary side outlet; 107, secondary side inlet; 108, secondary side outlet; 109, partition plate;

[0038] 2. First flow channel;

[0039] 3. Second flow channel;

[0040] 4. Thermal conductive structure;

[0041] 5. Chassis; 501. Open box; 502. Cover; 503. Chassis inlet; 504. Chassis outlet;

[0042] 6011, storage module; 6012, mainboard; 60121, first notch; 60122, second notch; 6013, processor; 602, power supply module;

[0043] 8. Air cooling device;

[0044] 901, first air duct segment; 902, second air duct segment; 903, third air duct segment; 904, fourth air duct segment; 905, fifth air duct segment;

[0045] 10. Primary side pipeline; 1001. Liquid inlet pipeline; 1002. Liquid outlet pipeline;

[0046] 11. Secondary side piping; 1101. Liquid outlet main pipe; 1102. Liquid outlet branch pipe; 1103. Liquid return branch pipe; 1104. Liquid return main pipe; 1105. Filter; 1106. Pump;

[0047] 12. Cold source; 13. Control module. DETAILED DESCRIPTION

[0048] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0049] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0050] The following combination Figures 1 to 11 , describing embodiments of the present invention.

[0051] According to an embodiment of the present invention, on one hand, a heat exchange device 100 is provided, including a device body 1 , a first flow channel 2 , a second flow channel 3 and a heat conducting structure 4 .

[0052] The first flow channel 2 is provided on the device body 1 and is used to connect to the primary side pipeline 10. The second flow channel 3 is provided on the device body 1 and is used to connect to the secondary side pipeline 11. The first flow channel 2 and the second flow channel 3 are heat exchange connected. The heat conducting structure 4 is heat exchange connected to the first flow channel 2.

[0053] The heat exchange device 100 of the embodiment of the present invention can be placed in the chassis 5 of the electronic device during use, such as Figure 7As shown, the second flow channel 3 can be connected to a cold plate within the electronic device via a secondary-side pipe 11, and the first flow channel 2 can be connected to a cold source 12 via a primary-side pipe 10. The coolant in the secondary-side pipe 11 can then carry the heat released by the second power-consuming component and exchange heat with the low-temperature coolant from the cold source 12 in the first flow channel 2 within the heat exchange device 100, thereby achieving liquid cooling of the first power-consuming component. The first flow channel 2 can be connected to the cold source 12 and carry away the heat released by the first power-consuming component and discharge it outside the system.

[0054] The heat-conducting structure 4 is connected to the first flow channel 2 for heat exchange, thereby extracting cooling energy from the first flow channel 2. This, in turn, works with the air-cooling module within the electronic device to provide low-temperature cooling airflow to the second power-consuming components within the electronic device, thereby achieving air-cooling and heat dissipation for the second power-consuming components. When the heat-conducting structure 4 is heated, the heat is carried away by the primary-side pipeline 10 through the connected first flow channel 2 and discharged outside the heat exchange device 100, thereby continuously cooling the heat-conducting structure 4.

[0055] On this basis, since the heat-conducting structure 4 can convert the airflow blown out by the air-cooling module into low-temperature cooling airflow, it can avoid the exhaust of electronic equipment from affecting the temperature of the computer room, and avoid controlling the temperature of the computer room by air conditioning, thereby helping to reduce the overall energy consumption of the data center.

[0056] Furthermore, since the heat exchange device 100 of the embodiment of the invention can be arranged in the chassis 5 of the electronic device, and the first flow channel 2 and the second flow channel 3 are provided in the device body 1, it can replace the cold liquid distribution unit to perform the heat exchange function, thereby eliminating the need to reserve separate space in the cabinet to set up the cold liquid distribution unit, which helps to save space in the cabinet, and enables the secondary side pipeline 11 to be completely placed in the chassis 5 of the electronic device without extending to the outside of the chassis 5 and connecting to the cold liquid distribution unit, thereby shortening the length of the secondary side pipeline 11, thereby reducing the amount of high-quality coolant in the secondary side pipeline 11, and greatly saving the cost of the coolant.

[0057] Therefore, the heat exchange device 100 of the embodiment of the present invention can solve the problem in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust of electronic equipment will affect the temperature in the computer room, and it is necessary to use air conditioning to control the temperature of the computer room environment. It also helps to reduce the overall energy consumption of the data center, save space in the cabinet, is conducive to the high-density design of the cabinet, and can reduce the cost of cooling liquid.

[0058] In the description of the present invention, it should be noted that the terms "first," "second," and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. "Multiple" means two or more, unless otherwise specifically defined.

[0059] In one embodiment, the heat exchange device 100 is arranged in the chassis 5 of the electronic device. Such an arrangement can help save space in the cabinet and enable the secondary side pipeline 11 to be completely placed in the chassis 5 of the electronic device without extending outside the chassis 5 and connecting to the cold liquid distribution unit. This shortens the length of the secondary side pipeline 11 and further reduces the amount of high-quality coolant in the secondary side pipeline 11, greatly saving the cost of the coolant.

[0060] In one embodiment, the coolant in the secondary side pipeline 11 flows through components such as a cold plate and a manifold inside the electronic device, and directly or indirectly contacts power-consuming components such as the processor 6013 . Therefore, extremely high requirements are placed on the insulation, purity, and compatibility of the coolant in the secondary side pipeline 11 .

[0061] Therefore, high-quality coolant such as PG25 is usually used in the secondary side pipe 11.

[0062] In one embodiment, the coolant in the secondary side pipeline 11 mainly includes a base liquid and an antifreeze additive. The base liquid is mainly ultrapure water to ensure extremely low conductivity, usually less than or equal to 5 μS / cm, to avoid the risk of short circuit. The antifreeze additive is preferably but not limited to ethylene glycol (EG) or propylene glycol (PG), etc., with a concentration of about 30% to 50%, to improve low-temperature antifreeze performance.

[0063] The coolant in the primary side pipeline 10 is connected between the external cold source 12 and the heat exchange device 100 and does not directly contact the electronic equipment. Therefore, more attention is paid to environmental adaptability and cost. Therefore, lower quality coolant can be used in the secondary side pipeline 11.

[0064] For example, in an optional embodiment, the coolant in the secondary side pipeline 11 mainly includes traditional mixed liquid and industrial water. The traditional mixed liquid includes water and ethylene glycol to take into account both antifreeze and low cost. The industrial water is treated tap water and softened water, but preservatives need to be added.

[0065] As an alternative embodiment, in an embodiment not shown in the drawings, the heat exchange device 100 is located outside the chassis 5 of the electronic device. In this case, the secondary-side pipeline 11 passes through the chassis 5 and connects to the heat exchange device 100, but this will increase the length of the secondary-side pipeline 11 to a certain extent. In addition, when the heat exchange device 100 is located outside the chassis 5 of the electronic device, it is necessary to provide through-holes at positions corresponding to the chassis 5 and the heat exchange device 100 to allow airflow to flow through the heat-conducting structure 4 of the heat exchange device 100 and be converted into low-temperature cooling airflow, thereby dissipating heat from the second power-consuming component. However, this will result in a certain degree of loss of the low-temperature cooling airflow.

[0066] In one embodiment, Figure 1 and Figure 2As shown, the device body 1 includes a shell 101 , a first heat exchange pipeline 102 , a second heat exchange pipeline 103 and a heat conducting sheet 104 .

[0067] The first heat exchange pipeline 102 is disposed within the housing 101, and the first flow channel 2 is disposed within the first heat exchange pipeline 102. The second heat exchange pipeline 103 is disposed within the housing 101, and the second flow channel 3 is disposed within the second heat exchange pipeline 103. A plurality of heat conducting fins 104 are arranged at intervals along the extension direction of the first heat exchange pipeline 102 and the second heat exchange pipeline 103, and can fill the gaps between the first heat exchange pipeline 102, the second heat exchange pipeline 103, and the housing 101.

[0068] Through this arrangement, the heat conducting plate 104 not only provides a solid physical support for the first heat exchange pipeline 102 and the second heat exchange pipeline 103, ensuring their precise spatial positioning within the shell 101; more importantly, it efficiently integrates the first heat exchange pipeline 102 and the second heat exchange pipeline 103 into a compact, highly integrated heat transfer unit. This unit is tightly housed inside the shell 101, and its essence is to serve as an effective extension and significant expansion of the original heat transfer surface. This structural optimization ultimately achieves a dual improvement in heat exchange efficiency: on the one hand, it significantly enhances the heat transfer efficiency between the first heat exchange loop and the heat conducting structure 4; on the other hand, it also optimizes the heat exchange efficiency between the first heat exchange pipeline 102 and the second heat exchange pipeline 103.

[0069] In one embodiment, the heat conducting plate 104 is sleeved outside the first heat exchange pipe 102 and the second heat exchange pipe 103. As a convertible embodiment, in an embodiment not shown in the drawings, the heat conducting plate 104 is integrally formed outside the first heat exchange pipe 102 and the second heat exchange pipe 103.

[0070] In one embodiment, the extension directions of the first heat exchange pipeline 102 and the second heat exchange pipeline 103 are parallel to each other, which can extend the heat exchange time of the coolant in the first flow channel 2 and the second flow channel 3.

[0071] In one embodiment, the heat exchange plate is a heat conductive metal plate, such as copper, aluminum, stainless steel, titanium, silver, nickel, etc.

[0072] As an alternative embodiment, the heat conducting sheet 104 may also be made of non-metallic heat conducting materials such as graphite, carbon nanotubes, porous ceramic fibers or aluminum nitride.

[0073] In one embodiment, Figure 3 As shown, a first heat conducting pattern 10411 is provided on the heat conducting sheet 104 , one end of the first heat conducting pattern 10411 is connected to or close to the first flow channel 2 , and the other end extends towards the direction close to the heat conducting structure 4 .

[0074] The first heat-conducting pattern 10411 extends from the first flow channel 2 toward the direction close to the heat-conducting structure 4, which can guide the heat on the heat-conducting structure 4 to be efficiently and directionally conducted toward the first flow channel 2, significantly reduce thermal resistance, promote heat conduction, and improve the heat transfer efficiency between the first flow channel 2 and the heat-conducting structure 4.

[0075] In one embodiment, the first heat conducting sheet 1041 is a corrugated metal sheet, and the first heat conducting lines 10411 are lines protrudingly formed on the heat conducting sheet 104 . The protruding lines can penetrate the interface air layer, thereby increasing the effective contact area and reducing thermal resistance.

[0076] As a convertible implementation, in an embodiment not shown in the drawings, the plane where the heat sink is located can also be optionally arranged to form an angle with the airflow direction.

[0077] In one embodiment, the first heat conductive pattern 10411 is preferably formed on the heat conductive sheet 104 by, but not limited to, laser etching, electroplating, or chemical vapor deposition.

[0078] In one embodiment, a first heat exchange surface is provided between the shell 101 and the heat conductive structure 4, and there are multiple pairs of first heat conductive patterns 10411. The multiple pairs of first heat conductive patterns 10411 are arranged at intervals along the distance direction between the first heat exchange surface and the first flow channel 2. Along the direction approaching the first flow channel 2, each pair of first heat conductive patterns 10411 extends in a direction approaching each other.

[0079] Through the above structural design, each pair of adjacent first heat-conducting patterns 10411 encloses a triangular area. This unique triangular arrangement significantly enhances the heat concentration effect on the first heat exchange surface. Its core function is to efficiently direct and concentrate heat, which is originally distributed over a large area on the heat exchange surface, to the adjacent area of ​​the first flow channel 2. This concentrated heat transfer greatly promotes sufficient and efficient heat exchange between the flowing medium (such as coolant) in the first flow channel 2 and the entire heat-conducting structure 4.

[0080] As a variable implementation, in an embodiment not shown in the drawings, the first heat-conducting lines 10411 may also be centered on the first flow channel 2 and distributed radially.

[0081] In one embodiment, Figure 2 As shown, a partition plate 109 is provided in the shell 101, and the partition plate 109 separates the first chamber and the second chamber in the shell 101. The heat conducting plate 104 includes a first heat conducting plate 1041 and a second heat conducting plate 1042. The first flow channel 2 and the first heat conducting plate 1041 are provided in the first chamber, and the second flow channel 3 and the second heat conducting plate 1042 are provided in the second chamber.

[0082] Through the above-described structural configuration, the partition plate 109 precisely divides the interior of the housing 101 into a first chamber and a second chamber that are independent of each other. This physical isolation design effectively blocks the transfer of heat from the second flow channel 3 region to the heat transfer structure 4 region, thereby preventing adverse temperature effects there and ensuring that the heat transfer structure 4 maintains the ideal thermal state under the designed operating conditions.

[0083] With this thermal isolation guarantee, the heat conducting sheet 104 is able to fully utilize its heat conduction enhancement function. It not only significantly improves the heat transfer capacity of the heat conducting structure 4 itself, but more importantly, it acts as an efficient heat transfer bridge, optimizing the heat transfer between the heat conducting structure 4 and the first flow channel 2, as well as the heat exchange between the first flow channel 2 and the second flow channel 3.

[0084] In addition, the partition plate 109 can also ensure that leakage on one side can only affect the chamber itself, thereby reducing maintenance costs, and enables different chambers to withstand different pressures, thereby avoiding overpressure and pipe burst.

[0085] In one embodiment, a second heat conducting pattern 10412 is formed on the first heat conducting plate 1041 . The second heat conducting pattern 10412 extends from the partition plate 109 toward the first flow channel 2 .

[0086] like Figure 4 As shown, the second heat conducting sheet 1042 is a corrugated metal sheet. A third heat conducting pattern 10421 is provided on the second heat conducting sheet 1042 . One end of the third heat conducting pattern 10421 is connected to or close to the second heat exchange pipeline, and the other end extends toward the direction close to the partition plate 109 .

[0087] Through this structural design, the second thermal conductive pattern 10412 and the third thermal conductive pattern 10421 work together to create an efficient, directional heat conduction path. Its core function is to accurately capture and guide the heat carried by the coolant in the second flow channel 3, transferring it to the first flow channel 2 area with low loss and high efficiency.

[0088] This cross-channel heat transfer enabled by the thermal conductive pattern directly strengthens the ability of the first channel 2 to serve as the core heat dissipation channel. The coolant flowing through the first channel 2 continuously absorbs and removes the heat introduced by the second channel 3.

[0089] The circulating coolant in the secondary side pipeline 11 is continuously and efficiently cooled down through this path, thereby ensuring that it has sufficient heat carrying capacity and providing continuous and sufficient heat dissipation guarantee for the high-heat-generating components inside the electronic device, especially the first power consumption components.

[0090] In one embodiment, the second thermal conductive lines 10412 are lines protrudingly formed on the thermal conductive sheet 104 . The protrusions of the lines can penetrate the interface air layer, thereby increasing the effective contact area and reducing thermal resistance.

[0091] In one embodiment, the second thermal conductive pattern 10412 is preferably formed on the thermal conductive sheet 104 by, but not limited to, laser etching, electroplating, or chemical vapor deposition.

[0092] In one embodiment, there are multiple pairs of second thermal conductive lines 10412, which are spaced apart along the distance direction between the partition plate 109 and the first flow channel 2. Along the direction approaching the first flow channel 2, each pair of second thermal conductive lines 10412 extends in a direction approaching each other.

[0093] Through the above-described structural design, each pair of adjacent second heat-conducting patterns 10412 encloses a triangular area. This unique triangular arrangement significantly enhances the heat-collecting effect on the partition plate 109. Its core function is to efficiently direct and concentrate heat, which was originally distributed over a large area on the partition plate 109, toward the adjacent area of ​​the first flow channel 2. This concentrated heat transfer greatly promotes sufficient and efficient heat exchange between the flowing medium (such as coolant) in the first flow channel 2 and the entire second channel.

[0094] As a convertible implementation, in an embodiment not shown in the drawings, each heat conducting sheet 104 can allow the first heat exchange pipeline 102 and the second heat exchange pipeline 103 to pass through, and is provided with a first heat conducting pattern 10411 , a second heat conducting pattern 10412 and a third heat conducting pattern 10421 .

[0095] In one embodiment, the second flow channel 3 and the heat-conducting structure 4 are respectively arranged on opposite sides of the first flow channel 2, and multiple pairs of first heat-conducting patterns 10411 and multiple pairs of second heat-conducting patterns 10412 can form a triangular area. The cold energy in the first flow channel 2 can be transported toward the heat-conducting structure 4 and the second flow channel 3 respectively through the triangular heat-conducting patterns, so that the heat conduction between the first flow channel 2 and the heat-conducting structure 4 and the second flow channel 3 is smoother.

[0096] As a variable implementation, in an embodiment not shown in the drawings, the second heat-conducting lines 10412 may also be centered on the first flow channel 2 and distributed radially.

[0097] In one embodiment, there are multiple pairs of third thermal conductive lines 10421, which are spaced apart along the distance direction between the second heat exchange pipeline 103 and the partition plate 109. In the direction approaching the partition plate 109, each pair of third thermal conductive lines 10421 extends in a direction approaching each other.

[0098] Through the aforementioned geometric design, each pair of adjacent third heat-conducting lines 10421 encloses a triangular area. This unique triangular structure acts as a highly efficient heat collector from a thermodynamic perspective: its core function is to actively capture heat dissipated by the coolant flowing in the second flow channel 3 to the surrounding environment or adjacent structures, and to direct this heat energy, which would otherwise be lost, to a key location in the first flow channel 2.

[0099] This "heat collection and concentrated transfer" mechanism, enabled by the thermal conductive patterns, significantly enhances the thermal coupling effect between the first flow channel 2 and the second flow channel 3. As a direct result, an efficient and controllable heat transfer channel is established between the two, greatly promoting sufficient and efficient heat exchange between the cooling medium in the first flow channel 2 (usually with a lower temperature or greater heat capacity) and the cooling medium in the second flow channel 3.

[0100] As a variable implementation, in an embodiment not shown in the drawings, the third heat-conducting lines 10421 may also be centered on the middle of the partition plate 109 and distributed radially.

[0101] In one embodiment, the second flow channel 3 and the heat conducting structure 4 are respectively disposed on both sides of the first flow channel 2 .

[0102] Through the above structural configuration, the heat exchange device 100 of the embodiment of the present invention achieves the dual goals of thermal interference isolation and heat conduction optimization:

[0103] First, the design physically blocks the heat transfer path from the second flow channel 3 to the heat transfer structure 4. This active thermal isolation strategy effectively prevents the heat within the second flow channel 3 from adversely disturbing the temperature field of the heat transfer structure 4, ensuring that the heat transfer structure 4 can stably maintain its designed operating temperature and provide effective heat dissipation for the second power consumption component.

[0104] On this basis, the structural design significantly improves the thermal connection performance between the first flow channel 2 and the heat-conducting structure 4 and the second flow channel 3.

[0105] In one embodiment, the thermally conductive structure 4, first flow channel 2, and second flow channel 3 are arranged sequentially from top to bottom. This arrangement allows the thermally conductive structure 4, located at the top layer, to closely coordinate with the existing air cooling module within the electronic device. This layer specifically addresses the heat dissipation requirements of the device's secondary power-consuming components (such as the power supply module 602) through efficient heat conduction and convection.

[0106] The second flow channel 3 at the bottom, the cold plate at the first power consumption component, and the secondary side pipe 11 together form a closed secondary side cooling circuit. This circuit directly contacts the first power consumption component and is responsible for removing the heat generated by the first power consumption component through the coolant circulation.

[0107] The first flow channel 2 in the middle can play the role of heat collection and discharge. First, the first flow channel 2 can continuously absorb the heat carried by the bottom secondary side system through the efficient heat conduction of the first heat conducting plate 1041 and the second heat conducting plate 1042.

[0108] As the core circulation channel of the primary side cooling medium, the first flow channel 2 will eventually transfer the gathered heat to the external heat dissipation terminal (such as a cooling tower or a computer room-level cooling system) to achieve the final dissipation of heat.

[0109] The core advantages of this layered structure are:

[0110] Functional decoupling is achieved: the heat dissipation domains of air cooling and liquid cooling are clearly separated to avoid mutual interference.

[0111] Secondly, heat flow optimization is achieved, and an efficient, one-way heat transfer path is constructed from the first power consumption component, the secondary side coolant, the first heat conducting plate 1041, the second heat conducting plate 1042, the first flow channel 2, and finally to the external environment.

[0112] Finally, the layered structure also helps to improve the level of integration within electronic devices, fully utilizes vertical space, and achieves the coordination of air cooling and liquid cooling in a compact structure.

[0113] In one embodiment, the heat-conducting structure 4 includes heat-dissipating fins connected to the device body 1 .

[0114] The heat dissipation fins can increase the heat exchange area between the air flow blown out by the air cooling module and the heat conducting structure 4, which helps to improve the heat dissipation effect of the heat exchange device 100 on the second power consumption component.

[0115] In one embodiment, when heat exchange device 100 is installed in chassis 5, first flow channel 2 and second flow channel 3 may optionally extend along the width of chassis 5. The heat dissipation fins include multiple fins spaced apart along the direction in which first flow channel 2 and second flow channel 3 extend. This arrangement allows the airflow to flow smoothly along the direction in which the flow channels and fins extend when the air-cooling module in chassis 5 drives the cooling airflow. The parallel gaps formed between the fins force the airflow to fully sweep across and penetrate the surface of each fin, significantly increasing the heat exchange contact area and duration between the airflow and the fins.

[0116] The heat sink's spaced arrangement, parallel to the main airflow direction, significantly reduces resistance caused by airflow deflection and eddy currents, effectively lowering overall wind resistance as air passes through the fin area. This reduced wind resistance allows the air-cooled module to deliver a greater effective air volume at the same power consumption, or maintain the same heat dissipation capacity at a lower speed. This not only optimizes the heat exchange efficiency between the cooling medium and the air within the flow channel, but also reduces system cooling power consumption, contributing to improved overall energy efficiency.

[0117] As a convertible implementation, in an embodiment not shown in the drawings, the heat-conducting structure 4 can also be optionally a deflection baffle or a heat pipe array provided on the device body 1.

[0118] According to another aspect of an embodiment of the present invention, an electronic device is provided, including a chassis 5 , a cold plate, a heat exchange device 100 and an air cooling module.

[0119] Among them, such as Figure 7 and Figure 8 As shown, a first power-consuming component and a second power-consuming component can be disposed within the chassis 5, with the first power-consuming component consuming more power than the second power-consuming component. A cold plate is disposed within the chassis 5 and is connected to the first power-consuming component for heat exchange. The heat exchange device 100 is the heat exchange device 100 provided in the first aspect of the present invention. The heat exchange device 100 is disposed within the chassis 5, and the second flow channel 3 of the heat exchange device 100 is connected to the cold plate via a secondary side pipe 11. An air cooling module is disposed within the chassis 5 and is capable of blowing air toward the heat-conducting structure 4 of the heat exchange device 100.

[0120] The electronic device of the second aspect of the present invention includes or uses the heat exchange device 100 of the first aspect of the present invention, thereby achieving its beneficial effects. During use of the electronic device of the second aspect of the present invention, the second flow channel 3 can be connected to a cold plate within the electronic device via the secondary side pipe 11, and the first flow channel 2 can be connected to a cold source 12 via the primary side pipe 10. The coolant in the secondary side pipe 11 can then carry the heat released by the second power consumption component and exchange heat with the low-temperature coolant from the cold source 12 in the first flow channel 2 within the heat exchange device 100, thereby achieving liquid cooling of the first power consumption component. The first flow channel 2 can be connected to the cold source 12 and carry away the heat released by the first power consumption component and discharge it outside the system.

[0121] The heat-conducting structure 4 is connected to the first flow channel 2 for heat exchange, thereby extracting cooling energy from the first flow channel 2. This, in turn, works with the air-cooling module within the electronic device to provide low-temperature cooling airflow to the second power-consuming components within the electronic device, thereby achieving air-cooling and heat dissipation for the second power-consuming components. When the heat-conducting structure 4 is heated, the heat is carried away by the primary-side pipeline 10 through the connected first flow channel 2 and discharged outside the heat exchange device 100, thereby continuously cooling the heat-conducting structure 4.

[0122] On this basis, since the heat-conducting structure 4 can convert the airflow blown out by the air-cooling module into low-temperature cooling airflow, it can avoid the exhaust of electronic equipment from affecting the temperature of the computer room, and avoid controlling the temperature of the computer room by air conditioning, thereby helping to reduce the overall energy consumption of the data center.

[0123] Furthermore, since the heat exchange device 100 of the electronic device of the embodiment of the invention is integrated in the chassis 5, and the first flow channel 2 and the second flow channel 3 are provided in the device body 1, it can replace the cold liquid distribution unit to perform the heat exchange function, thereby eliminating the need to reserve separate space in the cabinet to set up the cold liquid distribution unit, which helps to save space in the cabinet, and enables the secondary side pipeline 11 to be completely placed in the chassis 5 of the electronic device without extending to the outside of the chassis 5 and connecting to the cold liquid distribution unit, thereby shortening the length of the secondary side pipeline 11, thereby reducing the amount of high-quality coolant in the secondary side pipeline 11, and greatly saving the cost of the coolant.

[0124] Therefore, the heat exchange device 100 of the embodiment of the present invention can solve the problem in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust of the server will affect the temperature in the computer room, and it is necessary to use air conditioning to control the temperature of the computer room environment. It also helps to reduce the overall energy consumption of the data center, save space in the cabinet, is conducive to the high-density design of the cabinet, and can reduce the cost of cooling liquid.

[0125] The first power consumption components preferably include, but are not limited to, a central processing unit 6013, a graphics processing unit 6013, and a storage module 6011. The first power consumption components generate heat, and the heat is transferred to the cold plate through direct contact.

[0126] In one embodiment, the cooling source 12 is preferably, but not limited to, an external cooling tower. The air cooling module is preferably, but not limited to, an axial flow fan or a centrifugal fan.

[0127] In one embodiment, the storage module 6011 is an HDD module. An HDD module generally refers to a standardized storage unit composed of multiple mechanical hard disks. It integrates power supply, data interface and cooling system through a hardware backplane and is typically used in servers, NAS or distributed storage devices.

[0128] The second power consumption component preferably includes, but is not limited to, a voltage regulation module, a bus network card, a power supply module 602, and the like.

[0129] In one embodiment, the electronic device is a computing node.

[0130] As a convertible implementation, the electronic device may also be selected as a switching node, a storage node, a cabinet server, etc.

[0131] In one embodiment, the chassis 5 includes an open box body 501 , a cover body 502 and a first sealing ring.

[0132] The open box 501 is an integrated structure. The cover 502 is provided on the open opening of the open box 501. The first sealing ring is sandwiched between the open box 501 and the cover 502.

[0133] Through the above structural configuration, the open box body 501, the cover body 502 and the first sealing ring together form a fully enclosed chassis 5. This sealing structure enables the air cooling module to be efficiently coupled with the heat conducting structure 4 of the heat exchange device 100, forming a closed-loop low-temperature cooling air circulation system inside the chassis 5.

[0134] Through such a setting, the closed-loop airflow flows precisely through the second power consumption components (such as the power supply module 602, memory, etc.), achieving efficient air cooling and heat dissipation, and completely blocking the internal heat of the electronic equipment from spreading to the computer room environment, eliminating local hot spots in the computer room caused by traditional system exhaust.

[0135] Furthermore, since the computer room does not need to compensate for the heat dissipation of the equipment, the electronic equipment of the embodiment of the present invention allows the traditional computer room air conditioning system to be completely eliminated, directly reducing the cooling-related power consumption by 30-50%.

[0136] On this basis, eliminating air-conditioning equipment and large air ducts simplifies the number of equipment in the computer room, effectively improving the space utilization of the data center.

[0137] In one embodiment, the first power consumption component includes a storage module 6011 and a mainboard 6012 .

[0138] The storage module 6011 is disposed in the chassis 5. The mainboard 6012 is disposed in the chassis 5. The storage module 6011, the air cooling module, the heat exchange device 100 and the mainboard 6012 are disposed in sequence along the air outlet direction of the air cooling module.

[0139] In one embodiment, Figure 9 As shown, a first supporting structure and a second supporting structure are provided in the electronic device, the first supporting structure is supported between the storage module 6011 and the bottom wall of the chassis 5, and the second supporting structure is supported between the mainboard 6012 and the bottom wall of the chassis 5. A circulating air duct is provided in the electronic device, and the circulating air duct includes a first air duct section 901, a second air duct section 902, a third air duct section 903, a fourth air duct section 904 and a fifth air duct section 905.

[0140] The first air duct section 901 is provided between the top wall of the chassis 5 and the mainboard 6012. The second air duct section 902 is provided between the mainboard 6012 and the rear window of the chassis 5 and is connected to the first air duct section 901. The third air duct section 903 is provided between the bottom wall of the chassis 5 and the mainboard 6012 and storage module 6011 and is connected to the second air duct section 902. The fourth air duct section 904 is provided between the storage module 6011 and the front window of the chassis 5 and is connected to the third air duct section 903. The fifth air duct section 905 is provided between the storage module 6011 and the top wall of the chassis 5 and is connected to the first air duct section 901.

[0141] Through the above-mentioned support structure design, the first support structure and the second support structure provide stable mechanical support for the storage module 6011 and the motherboard 6012 respectively, and at the same time form a critical height gap between their bottom and the bottom wall of the chassis 5, thereby forming an efficient circulation air duct inside the chassis 5.

[0142] During the operation of the electronic device, the air cooling module can drive the air flow to flow through the heat-conducting structure 4 of the heat exchange device 100, and reduce the air flow temperature to the target low temperature through forced convection heat exchange.

[0143] The low-temperature cooling airflow circulates along a preset path to dissipate heat from power-consuming components within the chassis 5. The low-temperature cooling airflow cools the processor 6013 and power supply module 602 while flowing through the first and second air duct segments 901, 902. It also cools the storage module 6011 while flowing through the third, fifth, and third air duct segments 903, 905, and then flows through the heat-conducting structure 4 again, transferring heat to the primary cooling medium via the first flow channel 2, returning the airflow temperature to its initial low temperature.

[0144] The cooled airflow returns to the first air duct section 901, starting a new cycle.

[0145] In one embodiment, the width of the critical height gap formed between the bottom of the mainboard 6012 and the storage module 6011 and the bottom wall of the chassis 5 can be selected to be 5-15 mm.

[0146] The first supporting structure and the second supporting structure are preferably but not limited to supporting columns or supporting protrusions.

[0147] As a convertible embodiment, the bottom wall of the chassis 5 is also formed with upwardly protruding reinforcing ribs, which extend along the length direction of the chassis 5, thereby supporting the storage module 6011 and the motherboard 6012 while guiding the low-temperature cooling airflow.

[0148] In one embodiment, Figure 11 As shown, a primary side inlet 105 and a primary side outlet 106 are provided on the device body 1, a first flow channel 2 connects the primary side inlet 105 and the primary side outlet 106, a chassis inlet 503 and a chassis outlet 504 are provided on the chassis 5, and the primary side pipeline 10 includes a liquid inlet pipeline 1001, a second sealing ring, a liquid outlet pipeline 1002 and a third sealing ring.

[0149] The liquid inlet pipeline 1001 passes through the chassis inlet 503 and is used to connect the cold source 12 and the primary side inlet 105.

[0150] The second sealing ring is sandwiched between the chassis inlet 503 and the liquid inlet pipeline 1001. The liquid outlet pipeline 1002 passes through the chassis outlet 504 and is used to connect the cold source 12 and the primary side outlet 106. The third sealing ring is sandwiched between the chassis outlet 504 and the liquid outlet pipeline 1002.

[0151] Through the above-described piping connection scheme, low-temperature coolant from the external cold source 12 is injected into the first flow channel 2 of the heat exchange device 100 via the liquid inlet pipe 1001. After completing the heat exchange, the high-temperature coolant flows back to the cold source 12 through the liquid outlet pipe 1002 for regeneration. This circulation system ensures the tightness of the chassis 5 through a double dynamic sealing design.

[0152] The second sealing ring can precisely fill the assembly gap between the liquid inlet pipeline 1001 and the chassis inlet 503 .

[0153] The third sealing ring can precisely fill the assembly gap between the liquid outlet pipeline 1002 and the chassis outlet 504 .

[0154] In one embodiment, the first sealing ring, the second sealing ring and the third sealing ring are made of fluororubber material, which can ensure elastic sealing under thermal shock.

[0155] In one embodiment, Figure 8 As shown, a first notch 60121 and a second notch 60122 are respectively provided on opposite sides of the mainboard 6012. The second power consumption component includes a power supply module 602. The power supply modules 602 are disposed within the chassis 5. The power supply modules 602 are arranged in pairs and are respectively disposed within the first notch 60121 and the second notch 60122. The chassis inlet 503 and the chassis outlet 504 are disposed between one power supply module 602 and the mainboard 6012.

[0156] This arrangement significantly shortens the physical distance between the power supply module 602 and the CPU 6013, thereby shortening the wiring from the power supply module 602 to the CPU 6013. Furthermore, the power supply unit adopts a mirror-symmetrical distribution design. This solution simultaneously improves circuit performance and electromagnetic compatibility.

[0157] In one embodiment, the inner walls of the first notch 60121 and the second notch 60122 are nickel-plated to prevent oxidation, and the gap between the first notch 60121 and the second notch 60122 of the power supply module 602 is filled with thermal grease.

[0158] As a convertible implementation, in an embodiment not shown in the drawings, the chassis inlet 503 and the chassis outlet 504 are respectively arranged in the first notch 60121 and the second notch 60122 and are located between the mainboard 6012 and the power supply module 602.

[0159] In one embodiment, the power supply module 602 is disposed at the rear end of the chassis 5 , and the chassis inlet 503 and the chassis outlet 504 are disposed on the rear window of the chassis 5 .

[0160] In one embodiment, the cold plate is multiple, such as Figure 10 As shown, the heat exchange device 100 has a secondary side inlet 107 and a secondary side outlet 108 on its main body 1, the second flow channel 3 connects the secondary side inlet 107 and the secondary side outlet 108, and the secondary side pipeline 11 includes a liquid outlet main pipe 1101, a liquid distributor, a liquid outlet branch pipe 1102, a liquid return branch pipe 1103, a liquid collector and a liquid return main pipe 1104.

[0161] The liquid outlet main pipe 1101 is connected to the secondary outlet 108. The input of the liquid distributor is connected to the liquid outlet main pipe 1101. The liquid outlet branch pipe 1102 is connected between the output of the liquid distributor and the input of the cold plate. The liquid return branch pipe 1103 is connected to the output of the cold plate. The input of the liquid collector is connected to the liquid return branch pipe 1103. The liquid return main pipe 1104 is connected between the output of the liquid collector and the secondary inlet 107.

[0162] With such an arrangement, a cold plate is provided above the first power consumption component, and the cold plate directly contacts the first power consumption component. When the electronic device is in operation, the first power consumption component generates heat under load, and the heat is transferred to the cold plate through direct contact with the cold plate. The cold plate obtains cooling liquid through the liquid outlet branch pipe 1102. After heat exchange with the first power consumption component in the cold plate, the cooling liquid passes through the liquid return branch pipe 1103, the liquid collector, and the liquid return main pipe 1104 in sequence to return to the second flow path of the heat exchange device 100. After heat exchange with the first flow path in the heat exchange device 100, the cooling liquid is converted into low-temperature cooling liquid, and then returns to the input end of the cold plate through the liquid outlet main pipe 1101, the liquid separator, and the liquid outlet branch pipe 1102.

[0163] In one embodiment, a high thermal conductivity cold plate is integrated above the first power consumption component, and the bottom surface of the cold plate is processed to achieve microscopic close contact with the component surface through nano-level flatness (roughness Ra≤0.1μm).

[0164] In one embodiment, the primary inlet 105 and the secondary inlet 107 are disposed on the same side of the device body 1 , and the secondary inlet 107 and the secondary outlet 108 are disposed on the other side of the device body 1 .

[0165] As a convertible embodiment, in an embodiment not shown in the drawings, the primary side inlet 105 and the secondary side outlet 108 are arranged on the same side of the device body 1, and the secondary side inlet 107 and the primary side outlet 106 are arranged on the same side of the device body 1.

[0166] In one embodiment, the secondary side pipeline 11 further includes a filter 1105 and a pump 1106 .

[0167] Filter 1105 is installed in the pipeline between the collector output and the secondary inlet 107. Its main function is to filter the coolant entering the collector. This design effectively intercepts impurities in the coolant, preventing them from entering the downstream secondary pipeline 11 and causing blockage.

[0168] Pump 1106, located downstream of the system, has its input connected to secondary outlet 108 and its output connected to the liquid distributor. As the power source for the system circulation, pump 1106 is responsible for driving the continuous flow of coolant in secondary pipe 11, ensuring stable operation of the cooling cycle.

[0169] In one embodiment, the electronic device further includes a temperature detection module, a pressure detection module, a flow sensor and a control module 13 .

[0170] The first and second power consumption components are each equipped with a temperature detection module. A pressure detection module is connected to the liquid outlet main pipe 1101 or the liquid return main pipe 1104. A flow sensor is connected to the liquid outlet main pipe 1101 or the liquid return main pipe 1104. The control module 13 is in communication with the temperature detection module, pressure detection module, flow sensor, pump 1106, and air cooling module, and is capable of controlling the power of the pump 1106 and the air cooling module based on the detection results of the temperature detection module, pressure detection module, and flow sensor.

[0171] Through such configuration, the control module 13 can achieve dynamic energy efficiency optimization and safety protection based on the detection data of the temperature detection module, the pressure detection module, and the flow sensor.

[0172] For example, in an optional embodiment, when the temperature of the first power consumption component exceeds a set threshold, the control module 13 immediately increases the power of the pump 1106 to increase the coolant flow; when the temperature drops back to a safe zone, the power of the pump 1106 is automatically reduced to achieve energy saving.

[0173] When the temperature of the second power consumption component exceeds the standard, the control module 13 increases the speed of the air cooling module fan to improve the heat dissipation effect of the second power consumption component; after the temperature returns to below the preset temperature, the speed is adjusted back to the silent mode to reduce the system operation noise.

[0174] On this basis, the secondary side pipeline 11 is usually filled with a coolant mainly composed of water, which will undergo phase change and boiling under low pressure and high temperature conditions, generating steam bubbles that block the microchannels.

[0175] The control module 13 can maintain the absolute pressure of the pipeline within a safe range in real time and ensure that the maximum junction temperature of the integrated circuit is less than 85° C. to prevent vaporization.

[0176] When the temperature of the cold plate approaches the boiling point, the control module 13 triggers the pump 1106 to enter the boosting mode, thereby rapidly increasing the output pressure.

[0177] When the pressure detection module detects that the liquid in the secondary side pipeline 11 is over-pressured, the control module 13 links the electromagnetic pressure relief valve to quickly open for protection.

[0178] In one embodiment, the control module 13 can analyze data through artificial intelligence to achieve dynamic adjustment.

[0179] Specifically, in an optional embodiment, the core mechanism of the control module 13 is to integrate physical models with real-time data, combining the basic physical equations describing fluid dynamics and thermodynamic behavior (such as the Navier-Stokes equations) with real-time operating data collected by sensors to build a high-fidelity system digital twin in virtual space.

[0180] Based on this digital twin environment, control module 13 uses its integrated machine learning model to perform real-time predictions of the IC's temperature distribution and its future trends. Based on these predictions, the module automatically and dynamically adjusts key actuators (such as valve opening and pump 1106 speed) to optimize cooling performance in real time, ensuring the IC operates within a safe and efficient temperature range. Furthermore, the AI-driven system continuously analyzes deviations between operating data and the prediction model, effectively identifying potential anomalies such as micro-leaks or pipe blockages, providing support for early warning and preventative maintenance.

[0181] In one embodiment, artificial intelligence can also be used to achieve sudden load response, natural cooling switching, and anti-condensation protection.

[0182] Specifically, when it is detected that the computing power of the processor 6013 has surged, the control module 13 can control the pump 1106 to increase the flow of the cold plate within 200ms. When the outdoor temperature is less than 15°C, the control module 13 can reduce the speed of the pump 1106. When the coolant temperature is close to the dew point, the control module 13 can control the automatic heating valve to operate.

[0183] The control module 13 may include a programmable logic control component (such as a PLC or a CPU), a memory, and electronic components connected to the programmable logic control component, etc., which are well known to those skilled in the art and will not be described in detail here.

[0184] According to an embodiment of the present invention, in a third aspect, a server cabinet is provided, comprising a cabinet body and electronic equipment, wherein the electronic equipment is the electronic equipment provided in the second aspect of the present invention and is disposed in the cabinet body.

[0185] The server cabinet of the third aspect of the present invention includes or uses the electronic device of the second aspect of the present invention, and thus has its beneficial effect, namely, it can solve the problem in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust of the electronic equipment will affect the temperature in the computer room, and it is necessary to use air conditioning to control the temperature of the computer room environment. It also helps to reduce the overall energy consumption of the data center, save space in the cabinet, is conducive to the high-density design of the cabinet, and can reduce the cost of cooling liquid.

[0186] In one embodiment, the server cabinet is preferably, but not limited to, a standard server cabinet, a network equipment cabinet, or a storage server cabinet.

[0187] In one embodiment, the cabinet can be an AI cabinet, a specialized cabinet used for AI computing. It typically houses multiple high-performance CPUs or GPUs to support large-scale deep learning model development and training. To increase computing power density, more nodes can be concentrated within the same cabinet to achieve efficient resource utilization.

[0188] In summary, the heat exchange device 100 of the first aspect, the electronic device of the second aspect, and the server cabinet of the third aspect of the present invention have the following beneficial effects:

[0189] The heat exchange device 100 of the embodiment of the present invention is built into the interior of the electronic equipment, concentrating the air-liquid interaction and liquid-liquid interaction in one heat exchange device 100, replacing the cold liquid exchange unit inside the cabinet in the traditional computer room, achieving efficient heat dissipation of the electronic equipment and greatly improving the cabinet space utilization.

[0190] On this basis, the upper heat-conducting structure 4 of the heat exchange device 100 uses the air-cooling module to assist in heat dissipation, and forms a circulating air duct design in the chassis 5, so that the heat of the second power-consuming component inside the electronic equipment is exchanged with the first flow channel 2 of the middle layer of the heat exchange device 100, and finally discharged directly to the outside of the computer room through the primary-side cooling system pipeline, achieving zero heat emission inside the computer room, further weakening the role of air conditioning in the data center, and greatly reducing PUE.

[0191] Furthermore, since the heat exchange device 100 of the embodiment of the present invention is built into the electronic device, the second flow channel 3 of the bottom layer can form a secondary cooling system with the cold plate of the first power-consuming component inside the electronic device, the circulation pump 1106, the secondary side pipeline high-quality coolant deionized water, the pipeline, the filtration system, etc. The secondary side cooling system is integrated into the electronic device, and the circulation loop is greatly shortened, which further saves the amount of high-quality coolant deionized water and reduces the cost of the data center.

[0192] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall fall within the scope of protection claimed by the present invention.

Claims

1. A heat exchange device, characterized in that: include: Device body (1); A first flow channel (2) is provided on the device body (1) and is used for connecting to a primary side pipeline (10); A second flow channel (3) is provided on the device body (1) and is used to connect to the secondary side pipeline (11); the first flow channel (2) and the second flow channel (3) are connected in heat exchange; A heat-conducting structure (4) connected to the first flow channel (2) for heat exchange; The device body (1) comprises: Housing (101); A first heat exchange pipeline (102) is provided in the shell (101), and the first flow channel (2) is provided in the first heat exchange pipeline (102); A second heat exchange pipeline (103) is provided in the shell (101), and the second flow channel (3) is provided in the second heat exchange pipeline (103); a plurality of heat conducting sheets (104) arranged at intervals along the extension direction of the first heat exchange pipeline (102) and the second heat exchange pipeline (103), and capable of filling the gap between the first heat exchange pipeline (102), the second heat exchange pipeline (103) and the shell (101); A partition plate (109) is provided in the shell (101), and the partition plate (109) separates a first chamber and a second chamber in the shell (101); the heat conducting plate (104) comprises a first heat conducting plate (1041) and a second heat conducting plate (1042); the first flow channel (2) and the first heat conducting plate (1041) are provided in the first chamber, and the second flow channel (3) and the second heat conducting plate (1042) are provided in the second chamber.

2. The heat exchange device according to claim 1, characterized in that: The heat conducting sheet (104) is provided with a first heat conducting pattern (10411), one end of the first heat conducting pattern (10411) is connected to or close to the first flow channel (2), and the other end extends in a direction close to the heat conducting structure (4).

3. The heat exchange device according to claim 2, characterized in that: A first heat exchange surface is provided between the shell (101) and the heat conductive structure (4), and the first heat conductive patterns (10411) are provided in a plurality of pairs. The plurality of pairs of the first heat conductive patterns (10411) are spaced apart along the distance direction between the first heat exchange surface and the first flow channel (2), and each pair of the first heat conductive patterns (10411) extends in a direction approaching each other in a direction approaching the first flow channel (2).

4. The heat exchange device according to claim 1, characterized in that The first heat conducting plate (1041) is provided with a second heat conducting pattern (10412), and the second heat conducting pattern (10412) extends from the partition plate (109) in a direction close to the first flow channel (2); A third heat-conducting pattern (10421) is provided on the second heat-conducting plate (1042), one end of the third heat-conducting pattern (10421) is connected to or close to the second heat exchange pipeline, and the other end extends in a direction close to the partition plate (109).

5. The heat exchange device according to claim 4, characterized in that: The second heat-conducting lines (10412) are provided in a plurality of pairs, and the plurality of pairs of the second heat-conducting lines (10412) are spaced apart along the distance direction between the partition plate (109) and the first flow channel (2). In the direction approaching the first flow channel (2), each pair of the second heat-conducting lines (10412) extends in a direction approaching each other.

6. The heat exchange device according to claim 4, characterized in that: The third heat-conducting ridges (10421) are provided in a plurality of pairs, and the plurality of pairs of the third heat-conducting ridges (10421) are spaced apart along the distance direction between the second heat exchange pipeline (103) and the partition plate (109). In the direction approaching the partition plate (109), each pair of the third heat-conducting ridges (10421) extends in a direction approaching each other.

7. The heat exchange device according to any one of claims 1 to 6, characterized in that: The second flow channel (3) and the heat-conducting structure (4) are respectively arranged on both sides of the first flow channel (2).

8. The heat exchange device according to any one of claims 1 to 6, characterized in that: The heat-conducting structure (4) comprises heat-dissipating fins connected to the device body (1).

9. An electronic device, characterized in that: include: A chassis (5), wherein a first power consumption component and a second power consumption component can be arranged in the chassis (5), and the power consumption of the first power consumption component is greater than the power consumption of the second power consumption component; A cold plate, disposed in the chassis (5), and used for heat exchange connection with the first power consumption component; The heat exchange device (100) according to any one of claims 1 to 8, arranged in the chassis (5), the second flow channel (3) of the heat exchange device (100) being connected to the cold plate via a secondary side pipeline (11); An air cooling module is provided in the chassis (5) and is capable of blowing air toward the heat-conducting structure (4) of the heat exchange device (100).

10. The electronic device according to claim 9, characterized in that The chassis (5) comprises: An open box (501), wherein the open box (501) is an integrated structure; A cover body (502) is provided on the opening of the open box body (501); The first sealing ring is sandwiched between the open box body (501) and the cover body (502).

11. The electronic device according to claim 9, wherein: The first power consumption component further includes: A storage module (6011) is provided in the chassis (5); The mainboard (6012) is arranged in the chassis (5), and the storage module (6011), the air cooling module, the heat exchange device (100) and the mainboard (6012) are arranged in sequence along the air outlet direction of the air cooling module.

12. The electronic device according to claim 11, wherein: The electronic device is provided with a first supporting structure and a second supporting structure, the first supporting structure being supported between the storage module (6011) and the bottom wall of the chassis (5), and the second supporting structure being supported between the mainboard (6012) and the bottom wall of the chassis (5). The electronic device is provided with a circulating air duct, the circulating air duct comprising: A first air duct section (901) is provided between the top wall of the chassis (5) and the mainboard (6012); A second air duct section (902) is located between the mainboard (6012) and the rear window of the chassis (5), and is connected to the first air duct section (901); A third air duct section (903) is provided between the bottom wall of the chassis (5), the mainboard (6012) and the storage module (6011), and is connected to the second air duct section (902); A fourth air duct section (904) is provided between the storage module (6011) and the front window of the chassis (5), and is connected to the third air duct section (903); The fifth air duct section (905) is provided between the storage module (6011) and the top wall of the chassis (5), and is connected to the first air duct section (901).

13. The electronic device according to claim 11, wherein: The device body (1) is provided with a primary side inlet (105) and a primary side outlet (106); the first flow channel (2) connects the primary side inlet (105) and the primary side outlet (106); the chassis (5) is provided with a chassis inlet (503) and a chassis outlet (504); and the primary side pipeline (10) comprises: A liquid inlet pipeline (1001) passes through the chassis inlet (503) and is used to connect the cold source (12) and the primary side inlet (105); a second sealing ring, sandwiched between the chassis inlet (503) and the liquid inlet pipeline (1001); a liquid outlet pipeline (1002), passing through the chassis outlet (504) and used to connect the cold source (12) and the primary side outlet (106); The third sealing ring is sandwiched between the chassis outlet (504) and the liquid outlet pipeline (1002).

14. The electronic device according to claim 13, wherein: A first notch (60121) and a second notch (60122) are respectively provided on opposite sides of the main board (6012), and the second power consumption component comprises: A power supply module (602) is provided in the chassis (5); the power supply modules (602) are arranged in pairs and are respectively provided in the first notch (60121) and the second notch (60122); a chassis inlet (503) and the chassis outlet (504) are provided between one of the power supply modules (602) and the mainboard (6012).

15. The electronic device according to claim 9, wherein There are multiple cold plates, a secondary side inlet (107) and a secondary side outlet (108) are provided on the device body (1) of the heat exchange device (100), the second flow channel (3) connects the secondary side inlet (107) and the secondary side outlet (108), and the secondary side pipeline (11) includes: A liquid outlet main pipe (1101) connected to the secondary side outlet (108); A liquid distributor, the input end of which is connected to the liquid outlet main pipe (1101); A liquid outlet branch pipe (1102) connected between the output end of the liquid distributor and the input end of the cold plate; A liquid return branch pipe (1103) connected to the output end of the cold plate; a liquid collector, wherein the input end of the liquid collector is connected to the liquid return branch pipe (1103); The liquid return main pipe (1104) is connected between the output end of the liquid collector and the secondary side inlet (107).

16. The electronic device according to claim 15, characterized in that The secondary side pipeline (11) also includes: a filter (1105) provided between the output end of the liquid collector and the secondary side inlet (107); and / or, A pump (1106), wherein the input end of the pump (1106) is connected to the secondary side outlet (108), and the output end of the pump (1106) is connected to the liquid dispenser.

17. The electronic device according to claim 16, wherein: Also includes: a temperature detection module, the first power consumption component and the second power consumption component are respectively provided with the temperature detection module; A pressure detection module connected to the liquid outlet main pipe (1101) or the liquid return main pipe (1104); A flow sensor connected to the liquid outlet main pipe (1101) or the liquid return main pipe (1104); The control module (13) is communicatively connected to the temperature detection module, the pressure detection module, the flow sensor, the pump (1106) and the air cooling module, and is capable of controlling the power of the pump (1106) and the air cooling module according to the detection results of the temperature detection module, the pressure detection module and the flow sensor.

18. A server cabinet, characterized in that: include: Cabinet; The electronic device according to any one of claims 9 to 17, arranged in the cabinet.

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