Gluing tool and control method

Abstract

The invention relates to the technical field of photovoltaics, in particular to a gluing tool and a control method, the gluing tool comprises a glue storage device, a gluing device, a driving device and a silk screen, the glue storage device is used for storing glue, a first cavity of the gluing device communicates with an outlet of the glue storage device, the driving device communicates with an inlet of the glue storage device, and a second cavity of the gluing device communicates with an outlet of the silk screen; and the silk screen is arranged at the outlet of the first cavity, and the projection of the silk screen and the projection of the welding strip in the height direction of the gluing tool are at least partially overlapped. In the gluing process, the driving device can apply first pressure to the glue to enable the glue to flow into the first cavity and cover the silk screen and can also apply second pressure to the glue to enable the glue to permeate the silk screen and cover the welding strip and the battery piece, and the second pressure is larger than the first pressure. Therefore, the glue can be uniformly distributed through the silk screen and then drips on the welding strip and the battery piece through the silk screen, so that the coverage uniformity of the glue is improved, and the bonding strength between the welding strip and the battery piece is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic technology, and particularly to a glue application tooling and a control method thereof. Background Art

[0002] During the assembly process of photovoltaic modules, the connection effect between the solder ribbon and the solar cell is one of the key factors to ensure the overall working performance of the photovoltaic module. Currently, the solder ribbon and the solar cell are usually fixedly connected by glue through a dispensing method. However, during the dispensing process, it is difficult for workers to accurately control the amount and distribution of the glue, resulting in glue dots of different sizes during the dispensing process, and some glue dots cannot evenly cover the solder ribbon and the solar cell, thus affecting the stability and reliability of the connection between the solder ribbon and the solar cell, making it possible for them to become detached during subsequent testing, and thus easily affecting the working performance of the photovoltaic module. Summary of the Invention

[0003] In view of this, the present application provides a glue application tooling and a control method thereof to solve the technical problem in the prior art that the connection effect between the solder ribbon and the solar cell is poor due to uneven distribution of glue dots, thus affecting the working performance of the photovoltaic module.

[0004] The present application provides a glue application tooling for fixing a solder ribbon on a solar cell. The glue application tooling includes a glue storage device, a glue application device, a driving device, and a wire mesh. The glue storage device is used for storing glue. The glue application device includes a first cavity, and the first cavity is communicated with the outlet of the glue storage device. The driving device is communicated with the inlet of the glue storage device, and the driving device is used for applying pressure to the glue. The wire mesh is arranged at the outlet of the first cavity. Wherein, along the height direction of the glue application tooling, at least part of the projection of the wire mesh overlaps with the solder ribbon.

[0005] During the glue application process, the driving device can apply a first pressure to the glue in the glue storage device to make the glue flow into the first cavity and cover the wire mesh. The driving device can also apply a second pressure to the glue in the first cavity to make the glue penetrate the wire mesh and cover the solder ribbon and the solar cell. The second pressure is greater than the first pressure.

[0006] In the embodiments of the present application, the glue can be evenly distributed by the wire mesh first and then drip onto the solder ribbon and the solar cell through the wire mesh, so as to improve the uniformity of the glue coverage and the bonding strength between the glue and the solder ribbon and the solar cell, thereby improving the stability and reliability of the connection between the solder ribbon and the solar cell, and further improving the finished product quality and production yield of the photovoltaic module. And by adopting a staged pressure control method, a time interval can be provided between the first pressure and the second pressure applied by the driving device to the glue, and this time interval can provide sufficient time for the flow of the glue on the wire mesh to improve the uniformity of the glue distribution on the wire mesh.

[0007] In a possible embodiment, the glue coating tool also includes a switching device, which is arranged at the inlet of the glue storage device. The driving device includes a first power source and a second power source, and the first power source and the second power source are respectively connected to the glue storage device through the switching device.

[0008] The glue coating tool also includes a control system. The first power source, the second power source and the switching device are respectively electrically connected or signal connected to the control system. The control system is used to control the switching device to connect the first power source and the glue storage device, and control the first power source to apply a first pressure to the glue. It is also used to control the switching device to connect the second power source and the glue storage device, and control the second power source to apply a second pressure to the glue.

[0009] In a possible implementation, the first cavity further includes a supporting portion, which protrudes toward the first cavity relative to the inner wall of the first cavity, and the screen can be placed on the supporting portion along the height direction of the glue coating tooling.

[0010] In a possible implementation, the glue coating device further includes a second cavity, which is located on a side of the first cavity away from the glue storage device along the height direction of the glue coating tooling and is connected to the first cavity, and the second cavity is used to accommodate the welding strip.

[0011] In a possible implementation, the second cavity further includes a limiting portion, which is disposed on two opposite side walls of the second cavity along the length direction or the width direction of the glue coating tooling, and is used to be clamped with the welding ribbon.

[0012] In a possible implementation manner, the mesh number of the wire mesh is X, and X satisfies 150 mesh≤X≤250 mesh; the wire diameter of the wire mesh is Y, and Y satisfies 20 μm≤Y≤40 μm.

[0013] In a possible implementation, the glue is a light-curing glue.

[0014] In a possible implementation manner, the glue coating device is detachably connected to the glue storage device.

[0015] The present application also provides a control method for a glue coating tool, which is used to control the glue coating tool described in any of the above items to coat the solder strip with glue, and the control method includes: controlling the glue coating tool to move to a position corresponding to the solder strip; controlling a driving device to apply a first pressure to the glue in the glue storage device; waiting for a first preset time to allow the glue to flow into the first cavity and cover the wire mesh; controlling the driving device to apply a second pressure to the glue in the first cavity; waiting for a second preset time to allow the glue to penetrate the wire mesh and cover the solder strip and the battery cell; wherein the second pressure is greater than the first pressure.

[0016] In the embodiments of the present application, the glue can be evenly distributed through a screen first and then dripped onto the solder tape and the battery cell through the screen, so as to improve the uniformity of the glue coverage and the bonding strength between the glue and the solder tape and the battery cell, thereby improving the stability and reliability of the connection between the solder tape and the battery cell, and further improving the finished product quality and production yield of the photovoltaic module. Moreover, by adopting the method of staged pressure control, the first pressure and the second pressure applied by the driving device to the glue can have a first preset time, which is used to provide sufficient time for the flow of the glue on the screen to improve the uniformity of the glue distribution on the screen. After the second pressure, a second preset time is also set, which is used to provide sufficient time for the flow of the glue on the solder tape and the battery cell, so that the glue can fill the gap between the two, reducing the possibility of air bubbles existing inside the glue after curing and improving the quality of the glue dots.

[0017] In a possible implementation manner, before controlling the driving device to apply a first pressure to the glue in the glue storage device, the control method further includes: controlling the switching device to connect the first power source and the glue storage device; before controlling the driving device to apply a second pressure to the glue in the first cavity, the control method further includes: controlling the switching device to connect the second power source and the glue storage device.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 is a schematic structural diagram of the glue application tooling provided by the present application in one embodiment; Figure 2 is a cross-sectional view of the glue application device provided by the present application in one embodiment; Figure 3 is a top view of the glue and the solder tape provided by the present application in one embodiment; Figure 4 is a cross-sectional view of the glue and the solder tape provided by the present application in one embodiment.

[0021] Description of the reference numerals: 1 - Glue storage device; 11 - Glue dot; 2 - Glue application device; 21 - Connection part; 211 - First cavity; 211a - Support part; 22 - Glue - applying part; 221 - Second cavity; 221a - Limiting part; 3 - Driving device; 31 - First power source; 311 - First pipeline; 32 - Second power source; 321 - Second pipeline; 4 - Wire mesh; 5 - Welding strip; 6 - Solar cell; 7 - Switching device.

[0022] The accompanying drawings here are incorporated into and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Detailed implementation manners

[0023] To better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0024] It should be clear that the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0025] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The singular forms of "a", "the" and "said" used in the embodiments of the present application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be understood that the term " / and / " used herein is only a description of the associated relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0027] The embodiments of the present application provide a glue - applying tooling for fixing a welding strip on a solar cell. As Figure 1 and Figure 2 shown, the glue - applying tooling includes a glue storage device 1, a glue - applying device 2, a driving device 3 and a wire mesh 4.

[0028] The glue storage device 1 is used to store glue, and the glue coating device 2 includes a first cavity 211, which is connected to the outlet of the glue storage device 1. The driving device 3 is connected to the inlet of the glue storage device 1 and is used to apply pressure to the glue. The wire mesh 4 is arranged at the outlet of the first cavity 211, wherein, along the height direction of the glue coating tooling, the projections of the wire mesh 4 and the welding strip 5 at least partially overlap.

[0029] During the glue coating process, the driving device 3 can apply a first pressure to the glue in the glue storage device 1 so that the glue flows into the first cavity 211 and covers the wire mesh 4. The driving device 3 can also apply a second pressure to the glue in the first cavity 211 so that the glue penetrates the wire mesh 4 and covers the solder strip 5 and the battery cell 6, wherein the second pressure is greater than the first pressure.

[0030] In the embodiment of the present application, the outlet of the glue storage device 1 is connected to the glue coating device 2, and the inlet of the glue storage device 1 is connected to the driving device 3. Along the height direction of the glue coating tool, the end of the glue coating device 2 away from the glue storage device 1 can cover at least part of the soldering ribbon 5 and the battery cell 6. When the glue in the glue storage device 1 flows into the glue coating device 2 under the action of the driving device 3, the glue can be directly covered on the soldering ribbon 5 and the battery cell 6 through the glue coating device 2, so that the soldering ribbon 5 and the battery cell 6 are tightly wrapped together by the fluidity of the glue, and after the glue is solidified, the fixed connection between the soldering ribbon 5 and the battery cell 6 can be achieved.

[0031] Among them, the glue coating device 2 includes a first cavity 211 connected to the outlet of the glue storage device 1, and a wire mesh 4 is arranged at the outlet of the first cavity 211. Along the height direction of the glue coating tooling, the welding strip 5 is located on the side of the wire mesh 4 away from the glue storage device 1, so that the projection of the wire mesh 4 and the welding strip 5 at least partially overlap.

[0032] When the glue in the glue storage device 1 flows into the first cavity 211 under the action of the first pressure of the driving device 3, the wire mesh 4 located at the outlet of the first cavity 211 will hinder the glue from continuing to flow downward, so that it is temporarily unable to cover the welding ribbon 5 and the battery cell 6, so that the glue dripping on the wire mesh 4 can be evenly spread on the wire mesh 4 through its own fluidity, which is beneficial to improve the uniformity of subsequent coverage of the glue, and avoid the risk of poor connection between the welding ribbon 5 and the battery cell 6 due to uneven coverage of the glue dripping on the welding ribbon 5 and the battery cell 6, thereby reducing the possibility of relative displacement between the welding ribbon 5 and the battery cell 6 during subsequent lamination, which is beneficial to improve the production yield of photovoltaic modules and ensure the working performance of photovoltaic modules.

[0033] When the glue in the first cavity 211 (i.e., the glue covering the wire mesh 4) penetrates the wire mesh 4 under the action of the second pressure of the driving device 3, since the glue has been evenly distributed above the solder strip 5 and the solar cell 6 through the wire mesh 4, the glue can be evenly dripped onto the solder strip 5 and the solar cell 6, so as to improve the uniformity of glue coverage. Furthermore, the solder strip 5 has glue with the same or slightly different amounts on both sides along its extending direction, avoiding the risk that the large difference in the amount of glue on both sides of the solder strip 5 leads to poor connection effect, which is beneficial to improving the finished product quality of the photovoltaic module and increasing the passing rate of subsequent tests such as thermal cycling.

[0034] Meanwhile, by setting the wire mesh 4 and the solder strip 5 to have at least partially overlapping projections, it can also ensure that the glue dripping from the wire mesh 4 only covers the target area (i.e., the area where the solder strip 5 and the solar cell 6 are covered by the gluing device 2), avoiding the risk of glue overflow after the glue drops, which is beneficial to reducing the possibility of rework and ensuring the production efficiency of the photovoltaic module.

[0035] During the gluing process of the gluing tooling, by setting the first pressure applied by the driving device 3 to the glue to be small, it can ensure that the glue covers the surface of the wire mesh 4 after flowing from the glue storage device 1 into the first cavity 211, avoiding the risk of direct penetration when the glue drops onto the permeable wire mesh 4 due to excessive first pressure, which is beneficial to improving the stability and reliability of the glue flowing on the wire mesh 4; by setting the second pressure applied by the driving device 3 to the glue to be large, it can prompt the glue to penetrate from the surface of the wire mesh 4 into its interior and then gradually drip onto the solder strip 5 and the solar cell 6 through the wire mesh 4, so that the glue can gradually fill the gap between the solder strip 5 and the solar cell 6, which is beneficial to improving the bonding strength between the glue and the solder strip 5 and the solar cell 6.

[0036] Among them, by setting the glue to drip onto the solder strip 5 and the solar cell 6 through the wire mesh 4 under the action of the second pressure, it can also ensure that the dripping speed of the glue is appropriate, avoiding the risks of glue splashing, local accumulation on the solder strip 5 and the solar cell 6, and bubbles inside the glue after curing due to too fast dripping speed of the glue. Thus, it is beneficial to improve the quality and aesthetics of the cured glue, and further can reduce the waste of glue and lower the production cost.

[0037] Therefore, during the glue application process of the glue application tooling in this embodiment, the glue can be first evenly distributed through the screen 4 and then dropped onto the solder tape 5 and the solar cell 6 through the screen 4, so as to improve the uniformity of glue coverage and the bonding strength between the glue and the solder tape 5 and the solar cell 6, thereby improving the stability and reliability of the connection between the solder tape 5 and the solar cell 6, and further improving the finished product quality and production yield of the photovoltaic module. Moreover, by adopting the method of staged pressure control, a time interval can be provided between the first pressure and the second pressure applied by the driving device 3 to the glue, and this time interval can provide sufficient time for the flow of the glue on the screen 4 to improve the uniformity of the glue distribution on the screen 4.

[0038] It should be noted that during the process of the glue covering the screen 4, it is possible that part of the glue may first drop onto the solder tape 5 and the solar cell 6 through the screen 4 under the action of gravity, as long as most of the glue can evenly cover the screen 4.

[0039] In a specific embodiment, as Figure 1 shown, the glue application tooling further includes a switching device 7. The switching device 7 is arranged at the inlet of the glue storage device 1. The driving device 3 includes a first power source 31 and a second power source 32. The first power source 31 and the second power source 32 are respectively communicated with the glue storage device 1 through the switching device 7.

[0040] The glue application tooling further includes a control system. The first power source 31, the second power source 32 and the switching device 7 are respectively electrically connected or signal-connected to the control system. The control system is used to control the switching device 7 to communicate the first power source 31 and the glue storage device 1, and control the first power source 31 to apply a first pressure to the glue. It is also used to control the switching device 7 to communicate the second power source 32 and the glue storage device 1, and control the second power source 32 to apply a second pressure to the glue.

[0041] In the embodiment of the present application, the first power source 31 is communicated with the switching device 7 through the first pipeline 311, and the second power source 32 is communicated with the switching device 7 through the second pipeline 321, so that the switching device 7 can realize the rapid switching between the first power source 31 and the second power source 32, avoiding the possibility of pressure fluctuation during the switching process resulting in premature penetration of the glue or reduced penetration efficiency, which is beneficial to improving the uniformity and efficiency of the glue application work.

[0042] During the process of applying glue to the welding tape 5 and the battery chip 6 by the glue application tooling, the control system can first control the switching device 7 to switch to the first working state to connect the first power source 31 and the glue storage device 1, so that the first power source 31 can apply a first pressure to the glue in the glue storage device 1, enabling the glue in the glue storage device 1 to flow into the first cavity 211 of the glue application device 2 and drip onto the surface of the wire mesh 4; after the glue in the first cavity 211 evenly covers the surface of the wire mesh 4, the control system can then control the switching device 7 to switch to the second working state to connect the second power source 32 and the glue storage device 1, so that the second power source 32 can apply a second pressure to the glue in the first cavity 211, enabling the glue in the first cavity 211 to penetrate through the wire mesh 4 and drip onto the welding tape 5 and the battery chip 6; after the glue on the welding tape 5 and the battery chip 6 cures, the fixed connection between the two can be achieved.

[0043] Through such a design method, the driving device 3 can be divided into two independent power sources, namely the first power source 31 and the second power source 32, so as to realize the automatic glue application of the glue application tooling through the switching device 7, the control system and in combination with the staged pressure control method, which is beneficial to improving the automation degree of the glue application tooling, reducing manual intervention and improving the glue application efficiency of the glue application tooling. At the same time, in combination with the staged pressure control method, it can not only ensure the uniformity of the glue distribution on the welding tape 5 and the battery chip 6, but also reduce the defect rate of the glue dots 11 after the glue cures to form the glue dots 11, improving the stability and reliability of the connection between the welding tape 5 and the battery chip 6, so as to achieve the balance between production efficiency and product quality and better meet the actual production requirements. In addition, by controlling the first power source 31, the second power source 32 and the switching device 7 through the control system, the control accuracy of the glue application tooling during the glue application process can also be improved, and the risk of premature penetration of the glue due to excessive pressure in the first pressure stage (i.e., the process of the glue flowing from the glue storage device 1 to the first cavity 211) can be avoided to ensure the uniformity of the subsequent glue covering the welding tape 5 and the battery chip 6, and the risk of too low efficiency of the glue penetration due to too small pressure in the second pressure stage (i.e., the process of the glue penetrating the wire mesh 4) can also be avoided to ensure the glue application efficiency of the glue application tooling.

[0044] In a possible implementation manner, the control system can control the start and stop of the first power source 31 and the second power source 32, and the change of the working state of the switching device 7 according to a preset program to further improve the automation degree of the glue application tooling, enabling it to more accurately control the flowing time of the glue on the wire mesh 4, the penetration efficiency of the glue and the curing time of the glue.

[0045] In other possible embodiments, since the driving device 3 includes two independent power sources, namely a first power source 31 and a second power source 32, the first power source 31 can be directly communicated with the glue storage device 1 through a first pipeline 311, and the second power source 32 can be directly communicated with the first cavity 211 through a second pipeline 321. As a result, the glue application tooling does not need to be provided with a switching device 7, and the staged pressure control of the glue can be achieved only by respectively controlling the start and stop of the first power source 31 and the second power source 32 through a control system, which is beneficial to further reducing the production cost of the glue application tooling.

[0046] In a specific embodiment, as Figure 2 shown, the first cavity 211 further includes a supporting portion 211a, and the supporting portion 211a protrudes towards the inside of the first cavity 211 relative to the inner wall of the first cavity 211. Along the height direction of the glue application tooling, the wire mesh 4 can be placed on the supporting portion 211a.

[0047] In the embodiment of the present application, along the height direction of the glue application tooling, the supporting portion 211a is arranged at one end of the first cavity 211 close to the solder strip 5, so as to shorten the distance between the wire mesh 4 and the solder strip 5, reduce the possibility of splashing during the glue penetration process, and ensure that the glue flowing into the first cavity 211 can completely cover the solder strip 5 and the battery chip 6, so as to avoid waste of the glue.

[0048] Among them, by arranging the supporting portion 211a in the first cavity 211, the installation stability and reliability of the wire mesh 4 can be improved to realize the solid installation of the wire mesh 4, avoid the risk of the wire mesh 4 shifting or tilting due to factors such as vibration during the glue application process, and thus reduce the possibility of glue leakage from the gap between the wire mesh 4 and the inner wall of the first cavity 211, so as to ensure the uniformity of the subsequent glue coverage, and further improve the accuracy of the glue covering the target area. And when the wire mesh 4 is placed on the supporting portion 211a, the supporting portion 211a can support the wire mesh 4, avoid the risk of the wire mesh 4 falling on the solder strip 5 and the battery chip 6 due to the influence of pressure and gravity during the glue application process, and improve the reliability of the glue application work.

[0049] At the same time, the supporting portion 211a can also disperse the pressure borne by the wire mesh 4 to improve the uniformity of the force on the wire mesh 4, reduce the possibility of local deformation of the wire mesh 4 during the glue application process, and avoid the risk of uneven glue penetration and slow glue penetration caused by changes in the porosity of the wire mesh 4.

[0050] In addition, by supporting the screen 4 with the support part 211a, a detachable connection between the screen 4 and the glue coating device 2 can be realized, so that the glue coating device 2 can match screens 4 of different apertures, thicknesses or materials, so as to meet the different requirements of the glue coating process, which is conducive to improving the versatility of the glue coating tool. The detachable connection method can also realize rapid assembly and disassembly between the two. When the screen 4 is severely worn or even damaged, only the screen 4 needs to be replaced without replacing the glue coating device 2, which is not only conducive to reducing the failure rate of the glue coating tool to ensure its reliability during the glue coating process, but also conducive to shortening the maintenance time, reducing the maintenance cost, and extending the service life of the glue coating tool.

[0051] In a possible embodiment, the first cavity 211 may include one or more supporting portions 211a. When the first cavity 211 includes one supporting portion 211a, the supporting portion 211a may be a ring protruding relative to the inner wall of the first cavity 211 along the direction from the glue storage device 1 to the glue coating device 2, so as to improve the stability and reliability of the placement of the screen 4; when the first cavity 211 includes multiple supporting portions 211a, the multiple supporting portions 211a are distributed at intervals along the circumference of the first cavity 211 to reduce the weight of the glue coating device 2 and achieve the purpose of lightweight design.

[0052] In a specific embodiment, Figure 2 As shown, the glue coating device 2 also includes a second cavity 221. Along the height direction of the glue coating tooling, the second cavity 221 is located on the side of the first cavity 211 away from the glue storage device 1 and is connected to the first cavity 211. The second cavity 221 is used to accommodate the welding strip 5.

[0053] In the embodiment of the present application, the second cavity 221 is located on the side of the first cavity 211 away from the glue storage device 1, so that the glue-applying tool can abut against the surface of the battery cell 6 through the second cavity 221 during the glue-applying process, and at least part of the soldering strip 5 on the battery cell 6 is contained in the second cavity 221, so that the glue-applying tool can accurately apply glue to the soldering strip 5 in the target area to achieve a fixed connection between the soldering strip 5 and the battery cell 6. The second cavity 221 is connected to the first cavity 211, so that the projection of the screen 4 and the soldering strip 5 in the second cavity 221 along the height direction of the glue-applying tool at least partially overlaps, which is conducive to improving the accuracy of the glue-applying tool during the glue-applying process. At the same time, the second cavity 221 abuts against the surface of the battery cell 6, so that the glue that penetrates from the silk screen 4 to the soldering tape 5 can only flow in the second cavity 221, which is beneficial to reduce the possibility of the glue overflowing from the second cavity 221 to the external environment, and thus can ensure the amount of glue in the second cavity 221, so as to improve the stability and reliability of the connection between the soldering tape 5 and the battery cell 6.

[0054] In a possible implementation, the capacity of the second cavity 221 is greater than the amount of glue used to cover the target area. After the glue covers the solder tape 5 and the solar cell 6, there is a gap between the glue and the screen 4 along the height direction of the glue application tooling, so as to avoid the risk that the cured glue forms glue dots 11 and is fixedly connected to the screen 4 or causes the screen 4 to be blocked. Therefore, it is possible to reduce the possibility of pulling the solder tape 5 through the glue dots 11 during the separation process of the glue application device 2 from the surface of the solar cell 6, which is conducive to reducing the damage degree of the screen 4, improving the service life of the screen 4 and the glue application effect on the solder tape 5.

[0055] In a possible implementation, as Figure 2 、 Figure 3 and Figure 4 shown, the cross-sectional shape of the second cavity 221 is one of a rectangle, a trapezoid, a triangle, and a semi-circle. Through such a design method, the cross-sectional shape of the cured glue to form the glue dots 11 can be one of the corresponding rectangle, trapezoid, triangle, and semi-circle, so that it can fully cover the solder tape 5 and the solar cell 6 while also being able to fully fill the gap between the two, which is conducive to improving the connection effect of the glue. At the same time, through the limitation of the second cavity 221, it can also ensure that the glue dots 11 formed after the glue is cured have the characteristic of small volume, so as to avoid the risk of increasing production costs due to excessive glue input, and different-shaped glue dots 11 can also meet different usage requirements.

[0056] In a possible implementation, the length of the second cavity 221 is L3, and L3 satisfies 2mm ≤ L3 ≤ 4mm. Among them, L3 can specifically be 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm, 4mm, etc.

[0057] In a possible implementation, the width of the second cavity 221 is L4, and L4 satisfies 0.1mm ≤ L4 ≤ 1.5mm. Among them, L4 can specifically be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.

[0058] In a possible implementation, the depth of the second cavity 221 is H2, and H2 satisfies 0.4 mm ≤ H2 ≤ 1.5 mm. Specifically, H2 can be 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1 mm, 1.05 mm, 1.1 mm, 1.15 mm, 1.2 mm, 1.25 mm, 1.3 mm, 1.35 mm, 1.4 mm, 1.45 mm, 1.5 mm, etc.

[0059] In a specific implementation, as Figure 2 , Figure 3 and Figure 4 shown, the second cavity 221 further includes a limiting portion 221a. Along the length direction or the width direction of the glue application tooling, the limiting portion 221a is disposed on two opposite side walls of the second cavity 221, and the limiting portion 221a is used for clamping connection with the solder ribbon 5.

[0060] In the embodiment of the present application, when the glue application tooling abuts against the surface of the battery cell 6 through the glue application device 2, the glue application device 2 can be cooperatively connected with the solder ribbon 5 located on the battery cell 6 through the limiting portion 221a to limit the movement of the solder ribbon 5 relative to the glue application device 2, improve the stability when the solder ribbon 5 is placed on the battery cell 6, so that during the curing process of the glue, the risk that the solder ribbon 5 is affected by the flow of the glue and thus shifted can be avoided, and further the possibility of uneven glue coverage can be reduced, which is beneficial to improving the stability and reliability of the connection between the solder ribbon 5 and the battery cell 6. When the glue application tooling needs to coat a plurality of glue dots 11 along the extending direction of the solder ribbon 5, through the limiting effect of the limiting portion 221a on the solder ribbon 5, it can be ensured that the plurality of glue dots 11 on the same solder ribbon 5 have the same volume size, and the projections of the plurality of glue dots 11 along the extending direction of the solder ribbon 5 can overlap, which is beneficial to improving the uniformity of glue application, so that the pulling forces that the glue dots 11 can apply to the solder ribbon 5 are equal, thereby being beneficial to improving the connection effect between the solder ribbon 5 and the battery cell 6 while improving the quality and aesthetics of the glue dots 11.

[0061] In a possible implementation, sealing members are disposed on the side of the glue application device 2 for abutting against the battery cell 6 and the limiting portion 221a. When the glue application device 2 abuts against the battery cell 6 and the limiting portion 221a is clamped with the solder ribbon 5, the sealing members can further avoid the possibility that the glue overflows from the second cavity 221 under the action of the second pressure, so as to improve the glue application quality.

[0062] In a possible implementation manner, the limiting part 221a of the second cavity 221 is an adjustable structure (for example, the limiting part 221a includes a plurality of sliders, and each slider is slidably connected to the side wall of the second cavity 221 through an elastic member), so that the limiting part 221a can adapt to solder tapes 5 of different sizes or shapes to meet different requirements in the production process. Moreover, the adjustable limiting part 221a can fix the solder tape 5 in a flexible clamping manner to avoid the risk of damage to the solder tape 5 caused by hard clamping, which is beneficial to improving the stability and reliability of the connection between the solder tape 5 and the battery cell 6 while ensuring the safety of the solder tape 5 during the glue application process.

[0063] In a specific implementation manner, the mesh number of the wire mesh 4 is X, and X satisfies 150 meshes ≤ X ≤ 250 meshes.

[0064] In the embodiments of the present application, the mesh number of the wire mesh 4 can specifically be 150 meshes, 155 meshes, 160 meshes, 165 meshes, 170 meshes, 175 meshes, 180 meshes, 185 meshes, 190 meshes, 195 meshes, 200 meshes, 205 meshes, 210 meshes, 215 meshes, 220 meshes, 225 meshes, 230 meshes, 235 meshes, 240 meshes, 245 meshes, 250 meshes, etc.

[0065] When the mesh number of the wire mesh 4 is too small (for example, X is less than 150 meshes), the mesh holes of the wire mesh 4 are large. During the process of the glue dropping onto the wire mesh 4 under the action of the first pressure, the glue will penetrate in advance and cover the solder tape 5 and the battery cell 6, resulting in uneven distribution of the glue and affecting the connection reliability between the solder tape 5 and the battery cell 6.

[0066] When the mesh number of the wire mesh 4 is too large (for example, X is greater than 250 meshes), the mesh holes of the wire mesh 4 are small. During the process of the glue dropping onto the solder tape 5 and the battery cell 6 under the action of the second pressure, the glue is not easy to penetrate through the wire mesh 4, resulting in a decrease in the penetration efficiency of the glue and affecting the working efficiency of the glue application tooling. When the second pressure continues to increase, there is also a possibility that the wire mesh 4 is deformed under pressure and damaged.

[0067] When the mesh number of the wire mesh 4 satisfies 150 meshes ≤ X ≤ 250 meshes, the size of the mesh holes of the wire mesh 4 is appropriate, so as to ensure that the glue can be evenly laid on the wire mesh 4 under the action of the first pressure and can smoothly penetrate through the wire mesh 4 under the action of the second pressure, which is beneficial to improving the uniformity of the glue covering the solder tape 5 and the battery cell 6 and the glue application efficiency of the glue application tooling.

[0068] In a specific implementation manner, the wire diameter of the wire mesh 4 is Y, and Y satisfies 20 μm ≤ Y ≤ 40 μm.

[0069] In the embodiments of the present application, the wire diameter of the wire mesh 4 can specifically be 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm, 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, 40μm, etc.

[0070] When the wire diameter of the wire mesh 4 is too small (for example, Y is less than 20μm), it is easy to cause the strength of the wire mesh 4 to decrease. During the process of the glue dropping onto the wire mesh 4 under the action of the first pressure, the wire mesh 4 cannot be supported and is likely to break, thus easily causing damage to the wire mesh 4, and further affecting the service life of the photovoltaic module.

[0071] When the wire diameter of the wire mesh 4 is too large (for example, Y is greater than 40μm), it is easy to cause the thickness of the wire mesh 4 to increase. During the process of the glue dropping onto the solder strip 5 and the solar cell 6 under the action of the second pressure, the penetration path of the glue increases, thus easily causing the penetration efficiency of the glue to decrease, and there will be a part of the glue remaining in the wire mesh 4, which is likely to cause waste of the glue and increase the production cost.

[0072] When the wire diameter of the wire mesh 4 satisfies 20μm ≤ Y ≤ 40μm, it can ensure that the wire mesh 4 has strong structural strength while also avoiding excessive thickness of the wire mesh 4, thereby facilitating the penetration of the glue through the wire mesh 4, and further improving the glue application efficiency of the glue application tooling.

[0073] In a possible implementation manner, the length of the wire mesh 4 is L1, and L1 satisfies 0.2mm ≤ L1 ≤ 1.5mm. Among them, L1 can specifically be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.

[0074] In a possible implementation manner, the width of the wire mesh 4 is L2, and L2 satisfies 0.1mm ≤ L2 ≤ 1.5mm. Among them, L2 can specifically be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.

[0075] In a possible implementation, the thickness of the wire mesh 4 is H1, and H1 satisfies 60μm ≤ H1 ≤ 100μm. Specifically, H1 can be 60μm, 62μm, 64μm, 66μm, 68μm, 70μm, 72μm, 74μm, 76μm, 78μm, 80μm, 82μm, 84μm, 86μm, 88μm, 90μm, 92μm, 94μm, 96μm, 98μm, 100μm, etc.

[0076] In a specific implementation, the glue is a photo-curing glue.

[0077] In the embodiments of the present application, when the solder tape 5 and the battery cell 6 are fixedly connected by using a photo-curing glue, the photo-curing glue can be rapidly cured under the irradiation of ultraviolet rays, which is beneficial to realizing seamless connection between glue distribution and curing, thereby shortening the production cycle.

[0078] Optionally, the housing of the glue application device 2 is made of a transparent material, so that after the glue evenly covers the solder tape 5 and the battery cell 6, the glue in the second cavity 221 can be directly irradiated to cure the glue in the second cavity 221 into the glue dots 11. Through such a design method, the risk of glue overflow or uneven coverage caused by diffusion in the traditional glue application process (thermal curing or chemical curing) can be avoided, so that while improving the connection effect of the glue on the solder tape 5 and the battery cell 6, the working efficiency of the glue application tooling and the quality of the glue dots 11 can be improved.

[0079] In a specific implementation, as Figure 1 shown, the glue application device 2 is detachably connected to the glue storage device 1.

[0080] In the embodiments of the present application, the glue application device 2 includes a connecting portion 21 and a glue application portion 22 that are connected in communication. The glue application portion 22 is provided with the above-mentioned second cavity 221, and the connecting portion 21 is provided with the above-mentioned first cavity 211.

[0081] When the glue application device 2 is detachably connected to the glue storage device 1 through the connecting portion 21, the glue storage device 1 containing different glues can be replaced according to the glue application process to apply different glues to the solder tape 5 and the battery cell 6, which is beneficial to improving the versatility of the glue application tooling. And during the production process, when the glue in the glue storage device 1 is blocked or the like, it is not necessary to re-clean or re-inject the glue storage device 1, and only need to replace it, which is beneficial to saving maintenance time and improving work efficiency. In the subsequent maintenance process, the replaced glue storage device 1 can be deeply cleaned to reduce the risk of blockage caused by glue curing and improve the reliability during subsequent work.

[0082] Meanwhile, by setting the glue application device 2 and the glue storage device 1 to be detachably connected, the glue application tooling can be equipped with multiple glue storage devices 1, so that different glues are stored in independent and detachable glue storage devices 1, avoiding the possibility of glue performance degradation or process failure caused by mixing, which is beneficial to improving the quality of the glue dots 11 and ensuring the stability and reliability of the connection between the welding tape 5 and the battery cell 6.

[0083] An embodiment of the present application also provides a control method for a glue application tooling, which is used to control the glue application tooling described in any one of the above to apply glue to the welding tape 5. The control method includes: Controlling the glue application tooling to move to a position corresponding to the welding tape 5; controlling the driving device 3 to apply a first pressure to the glue in the glue storage device 1; waiting for a first preset time to enable the glue to flow into the first cavity 211 and cover the screen 4; controlling the driving device 3 to apply a second pressure to the glue in the first cavity 211; waiting for a second preset time to enable the glue to penetrate the screen 4 and cover the welding tape 5 and the battery cell 6; wherein, the second pressure is greater than the first pressure.

[0084] In an embodiment of the present application, when the glue application tooling is controlled to move to a position corresponding to the welding tape 5, the glue application tooling can be controlled to move in the direction of the battery cell 6, so that the glue application tooling abuts against the surface of the battery cell 6 through the glue application device 2, and at least a part of the welding tape 5 is located in the second cavity 221 of the glue application device 2 to form a target area for glue application. Through such a design method, the screen 4 in the glue application device 2 and the projection of the welding tape 5 can overlap at least partially, which is beneficial to improving the glue application accuracy and ensuring that the glue can completely cover the welding tape 5 and the battery cell 6 in the target area to achieve the fixed connection between the welding tape 5 and the battery cell 6 in this target area. Among them, when the glue application device 2 abuts against the battery cell 6, the glue application device 2 can also be clamped and matched with the welding tape 5 through the limiting part 221a to limit the movement of the welding tape 5 relative to the glue application device 2, improve the stability of the welding tape 5 during placement, so as to facilitate avoiding the risk of the welding tape 5 being affected by the flow of the glue and shifting during the curing process of the glue, and further reducing the possibility of uneven glue coverage, which is beneficial to improving the stability and reliability of the connection between the welding tape 5 and the battery cell 6. In addition, by setting the glue application device 2 to abut against the battery cell 6 and be clamped with the welding tape 5, the flow range of the glue in the second cavity 221 can also be limited, reducing the possibility of the glue overflowing from the second cavity 221 during the flow process, which is beneficial to improving the quality of the cured glue dots 11 and reducing the production cost.

[0085] When the control drives the device 3 to apply a first pressure to the glue in the glue storage device 1, the glue in the glue storage device 1 flows into the first cavity 211 under the action of the first pressure of the driving device 3. The wire mesh 4 located at the outlet of the first cavity 211 will prevent the glue from flowing downward continuously, making it temporarily unable to cover the solder strip 5 and the battery cell 6, so that the glue dripping on the wire mesh 4 can evenly cover the wire mesh 4 through its own fluidity within the first preset time, which is beneficial to improving the uniformity of the subsequent glue coverage, and avoiding the risk that the glue dripping on the solder strip 5 and the battery cell 6 has a poor connection effect due to uneven coverage. Thereby, it can reduce the possibility of relative displacement between the solder strip 5 and the battery cell 6 during subsequent lamination, and further is beneficial to improving the production yield of the photovoltaic module and ensuring the working performance of the photovoltaic module.

[0086] When the control drives the device 3 to apply a second pressure to the glue in the first cavity 211, the glue in the first cavity 211 (i.e., the glue covering the wire mesh 4) penetrates the wire mesh 4 under the action of the second pressure of the driving device 3. Since the glue has been evenly distributed above the solder strip 5 and the battery cell 6 through the wire mesh 4, the glue can evenly drip on the solder strip 5 and the battery cell 6 within the second preset time, so as to improve the uniformity of the glue coverage. Furthermore, the glue dots 11 with the same or relatively small difference in glue amount are formed on both sides of the solder strip 5 along its extending direction, avoiding the risk that the glue amount on both sides of the solder strip 5 varies too much and results in a poor connection effect, which is beneficial to improving the finished product quality of the photovoltaic module and increasing the passing rate of subsequent tests such as thermal cycling.

[0087] During the glue application process of the glue application tooling, by setting the first pressure applied by the driving device 3 to the glue to be relatively small, it can ensure that the glue covers the surface of the wire mesh 4 after flowing into the first cavity 211 from the glue storage device 1, avoiding the risk of direct penetration when the glue drops on the permeable wire mesh 4 due to excessive first pressure, which is beneficial to improving the stability and reliability of the glue flowing on the wire mesh 4; by setting the second pressure applied by the driving device 3 to the glue to be relatively large, it can prompt the glue to penetrate from the surface of the wire mesh 4 into its interior and then gradually drip on the solder strip 5 and the battery cell 6 through the wire mesh 4, so that the glue can gradually fill the gap between the solder strip 5 and the battery cell 6, which is beneficial to improving the bonding strength between the glue and the solder strip 5 and the battery cell 6.

[0088] Therefore, during the glue application process of the glue application tooling in this embodiment, the glue can be first evenly distributed through the screen 4 and then drip onto the solder tape 5 and the solar cell 6 through the screen 4, so as to improve the uniformity of glue coverage and the bonding strength between the glue and the solder tape 5 and the solar cell 6, thereby improving the stability and reliability of the connection between the solder tape 5 and the solar cell 6, and further improving the finished product quality and production yield of the photovoltaic module. And by adopting the method of phased pressure control, the first pressure and the second pressure applied by the driving device 3 to the glue can have a first preset time, which is used to provide sufficient time for the flow of the glue on the screen 4 to improve the uniformity of the glue distribution on the screen 4. And a second preset time is also set after the second pressure, which is used to provide sufficient time for the flow of the glue on the solder tape 5 and the solar cell 6, so that the glue can fill the gap between the two, reducing the possibility of bubbles existing inside the glue after curing to form the glue dot 11, and improving the quality of the glue dot 11.

[0089] In a specific implementation manner, before controlling the driving device 3 to apply the first pressure to the glue in the glue storage device 1, the control method further includes controlling the switching device 7 to connect the first power source 31 and the glue storage device 1; before controlling the driving device 3 to apply the second pressure to the glue in the first cavity 211, the control method further includes controlling the switching device 7 to connect the second power source 32 and the glue storage device 1.

[0090] In the embodiment of the present application, first control the switching device 7 to switch to connect the first power source 31 and the glue storage device 1, so that the first power source 31 can apply the first pressure to the glue in the glue storage device 1, so that the glue in the glue storage device 1 can flow into the first cavity 211 of the glue application device and drip onto the surface of the screen 4; after the glue in the first cavity 211 evenly covers the surface of the screen 4, then control the switching device 7 to switch to connect the second power source 32 and the glue storage device 1, so that the second power source 32 can apply the second pressure to the glue in the first cavity 211, so that the glue in the first cavity 211 can penetrate through the screen 4 and drip onto the solder tape 5 and the solar cell 6; after the glue on the solder tape 5 and the solar cell 6 cures to form the glue dot 11, the fixed connection between the two can be realized.

[0091] Among them, the switching device 7 can achieve rapid switching between the first power source 31 and the second power source 32, avoiding the possibility of pressure fluctuations during the switching process, which may cause the glue to penetrate prematurely or reduce the penetration efficiency, thus facilitating the improvement of the uniformity and efficiency of the glue application work. Through such a design method, the driving device 3 can be divided into two independent power sources, namely the first power source 31 and the second power source 32, so as to realize the automatic glue application of the glue application tooling through the switching device 7 and the control system in combination with the phased pressure control method, thus facilitating the improvement of the automation degree of the glue application tooling, reducing manual intervention, and improving the glue application efficiency of the glue application tooling.

[0092] The structure, features, and function effects of the present application have been described in detail based on the embodiments shown in the drawings. The above is only the preferred embodiment of the present application, but the present application is not limited to the scope shown in the drawings. Any changes made according to the concept of the present application, or equivalent embodiments modified to equivalent changes, shall still be within the protection scope of the present application as long as they do not exceed the spirit covered by the specification and the drawings.

Claims

1. A glue - applying tooling for fixing a welding tape on a battery cell, characterized in that The gluing tooling comprises: A glue storage device, wherein the glue storage device is used to store glue; A glue coating device, the glue coating device comprising a first cavity, the first cavity being connected to an outlet of the glue storage device; A driving device, the driving device is connected to the inlet of the glue storage device, and the driving device is used to apply pressure to the glue; A wire mesh, the wire mesh being arranged at the outlet of the first cavity; Wherein, along the height direction of the glue coating tool, the projections of the silk screen and the welding strip at least partially overlap; During the glue coating process, the driving device can apply a first pressure to the glue in the glue storage device so that the glue flows into the first cavity and covers the wire mesh, and the driving device can also apply a second pressure to the glue in the first cavity so that the glue penetrates the wire mesh and covers the solder strip and the battery cell; The second pressure is greater than the first pressure.

2. The glue - applying tooling according to claim 1, characterized in that, The glue coating tool further includes a switching device, which is arranged at the inlet of the glue storage device, and the driving device includes a first power source and a second power source, and the first power source and the second power source are respectively connected to the glue storage device through the switching device; The glue coating tool also includes a control system, and the first power source, the second power source and the switching device are respectively electrically connected or signal-connected to the control system. The control system is used to control the switching device to connect the first power source and the glue storage device, and control the first power source to apply a first pressure to the glue, and is also used to control the switching device to connect the second power source and the glue storage device, and control the second power source to apply a second pressure to the glue.

3. The glue - applying tooling according to claim 1, characterized in that, The first cavity further includes a supporting portion, which protrudes toward the first cavity relative to an inner wall of the first cavity, and the screen can be placed on the supporting portion along a height direction of the glue coating tool.

4. The glue - applying tooling according to claim 1, wherein, The glue coating device also includes a second cavity. Along the height direction of the glue coating tooling, the second cavity is located on a side of the first cavity away from the glue storage device and is connected to the first cavity. The second cavity is used to accommodate the welding strip.

5. The glue application tooling according to claim 4, characterized in that, The second cavity further includes a limiting portion, which is disposed on two opposite side walls of the second cavity along the length direction or the width direction of the glue coating tool, and is used for clamping with the welding ribbon.

6. The glue - applying tooling according to any one of claims 1 - 5, characterized in that, The mesh number of the wire mesh is X, and X satisfies 150 mesh≤X≤250 mesh; the wire diameter of the wire mesh is Y, and Y satisfies 20 μm≤Y≤40 μm.

7. The glue - applying tooling according to any one of claims 1 - 5, characterized in that, The glue is a light-curing glue.

8. The glue - applying tooling according to any one of claims 1 - 5, characterized in that, The glue coating device is detachably connected to the glue storage device.

9. A control method for a glue - applying tooling, which is used to control the glue - applying tooling as described in any one of claims 1 - 8 to apply glue to a welding tape, characterized in that, The control method comprises: Controlling the glue coating tool to move to a position corresponding to the welding strip; Controlling the driving device to apply a first pressure to the glue in the glue storage device; Waiting for a first preset time to allow the glue to flow into the first cavity and cover the screen; Controlling the driving device to apply a second pressure to the glue in the first cavity; Waiting for a second preset time to allow the glue to penetrate the screen and cover the solder strip and the battery cell; Wherein, the second pressure is greater than the first pressure.

10. The control method according to claim 9, wherein The glue application tooling further includes a switching device, which is arranged at the inlet of the glue storage device. The driving device includes a first power source and a second power source, and the first power source and the second power source are respectively communicated with the glue storage device through the switching device; Before controlling the driving device to apply a first pressure to the glue in the glue storage device, the control method further includes: Controlling the switching device to communicate the first power source and the glue storage device; Before controlling the driving device to apply a second pressure to the glue in the first cavity, the control method further includes: Controlling the switching device to communicate the second power source and the glue storage device.

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