Sprayable sensor integrated with millimeter wave radar and use method

Abstract

The invention discloses a throwing sensor integrated with a millimeter-wave radar and a use method. The sensor comprises a shell, a millimeter-wave radar detection module and a printed circuit board, wherein the millimeter-wave radar detection module and the printed circuit board are located in the shell; wherein the millimeter wave radar detection module comprises an antenna, a radiation patch, an RDL layer and a control chip; a radiation window is arranged on the printed circuit board; the antenna is located on one side face of the printed circuit board, and the antenna and the printed circuit board are connected in an embedded mode through a first metal through hole. The radiation patch, the RDL layer and the control chip are positioned on the other side surface of the printed circuit board; the radiation patch and the control chip are located on the two side faces of the RDL layer respectively, and the radiation patch is further located in the radiation window. The RDL layer is provided with a first signal window, and the control chip is connected with the radiation patch through the first signal window. The control chip feeds power to the antenna radiation structure, so that the transmission loss is reduced, and the transmission efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of millimeter-wave radar, and specifically provides a disposable sensor integrated with a millimeter-wave radar and a usage method thereof. Background Art

[0002] Traditional target detection sensors usually have single functions, large volumes, and high costs, making it difficult to meet the requirements of multi-parameter perception and target detection in complex environments. With the rapid development of the Internet of Things, intelligent perception, and unmanned technologies, the demand for multi-functional, miniaturized, and low-cost sensors is increasing. In addition, in some special scenarios, such as disaster rescue and environmental monitoring, sensors need to be quickly deployed to the target area, and real-time data transmission and networking collaboration need to be achieved. Traditional solutions mostly rely on optical or ultrasonic sensors, making it difficult to achieve stable detection in complex scenarios such as smoke and dust.

[0003] With the development of wireless communication technology, millimeter-wave sensors have gradually become a research hotspot, with high resolution and strong penetration ability. As the key components of millimeter-wave sensors, the integrated design of antennas and radio frequency chips helps to improve the overall performance of the system. The connection between traditional millimeter-wave radar antennas and radio frequency chips adopts the form of feeders, which is prone to large signal transmission losses and high module matching difficulties, resulting in a decline in the overall performance of the system and a large volume.

[0004] In the actual application scenarios of disposable sensors, the disadvantages of the integrated method of traditional millimeter-wave radar antennas and radio frequency chips are amplified, resulting in problems such as difficult disposal and reduced radiation performance.

[0005] The invention patent with the publication number of CN117876420A discloses a target tracking method and device for the fusion of high-resolution millimeter-wave radar and camera information. The method obtains the input first radar data and first camera data; performs time synchronization operations on the first radar data and the first camera data to obtain second radar data and second camera data; performs spatial registration operations on the second radar data and the second camera data to obtain target detection data; performs target detection and tracking on the target detection data to obtain radar tracking results and camera tracking results; and fuses the radar tracking results and the camera tracking results to obtain target tracking information. This patent uses millimeter-wave radar for target recognition, but it is applied in the fields of intelligent transportation and safety supervision, without considering the assembly difficulty in disposable sensors. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to solve the problems that the disadvantages of the integrated method of traditional millimeter-wave radar antennas and chips will cause difficulties in disposing disposable sensors and a decline in radiation performance.

[0007] To solve the above technical problems, the present invention provides the following technical solutions:

[0008] A disposable sensor integrated with a millimeter-wave radar, comprising: a housing 10, and a millimeter-wave radar detection module 200 and a printed circuit board 300 located inside the housing 10;

[0009] Wherein, the millimeter-wave radar detection module 200 includes an antenna 210, a radiation patch 220, an RDL layer 230, and a control chip 240;

[0010] A radiation window is provided on the printed circuit board 300;

[0011] The antenna 210 is located on one side of the printed circuit board 300, and the antenna 210 is inlaid and connected to the printed circuit board 300 through a first metal via 2300; the radiation patch 220, the RDL layer 230, and the control chip 240 are located on the other side of the printed circuit board 30;

[0012] The radiation patch 220 and the control chip 240 are respectively located on both sides of the RDL layer 230, and the radiation patch 220 is also located within the radiation window; a first signal window 231 is provided on the RDL layer 230, and the control chip 240 is connected to the radiation patch 220 through the first signal window 231.

[0013] Technical effects: In the existing disposable sensors, millimeter-wave radars are not integrated. By integrating a millimeter-wave radar, the present invention enables the disposable sensor to achieve wireless detection capabilities. The inlaid assembly between the antenna and the printed circuit board reduces the antenna size, while reducing the assembly error and improving the radiation performance.

[0014] In this embodiment, a plurality of first metal vias 2300 are arranged in a surrounding shape to form a first energy confinement circle 2310; and the radiation window and the radiation port of the antenna 210 are located within the energy confinement circle 2310.

[0015] In this embodiment, the metal wiring on the RDL layer 230 is connected to the printed circuit board 300 in the form of a ball grid array 232; wherein, the arrangement of the ball grid array 232 on the RDL layer 230 is as follows:

[0016] A ball grid rectangle 233 is formed around the RDL layer 230, and a sub-ball grid array 234 is formed within the ball grid rectangle 233, so that a second energy confinement circle 235 is formed between the ball grid rectangle 233 and the sub-ball grid array 234;

[0017] And the first signal window 231 is located within the sub-ball grid array 234.

[0018] In this embodiment, on the RDL layer 230 and within the second energy confinement circle 235, a second signal window 263 is provided, and a bump metal 365 is disposed within the second signal window 263.

[0019] On the GSG pad 241 of the control chip 240, a second metal via 243 is provided.

[0020] Through the second metal via 243, the signal led out from the GSG pad 241 is transmitted to the signal transmission feeder 364 located on the RDL layer 230, and the signal is transmitted to the radiation patch 220 through the bump metal 365.

[0021] In this embodiment, the first signal window 231 and the second signal window 263 communicate with each other to form a communication area; the signal transmission feeder 364 is located within the communication area.

[0022] In this embodiment, the one-transmit-one-receive antenna 210 employs a second-order rectangular horn antenna.

[0023] In this embodiment, the housing 10 is spherical, and a plurality of protruding antenna structures 11 are provided on the outer surface of the housing 10. Inside the housing 10, a bowl-shaped counterweight 12 is attached to the inner wall.

[0024] In this embodiment, the line connecting the center of gravity of the counterweight 12 and the center of the sphere of the housing 10 is perpendicular to the surface of the printed circuit board 300.

[0025] In this embodiment, the printed circuit board 300 integrates a micro control unit MCU, a multi-source environment detection module 320, a communication module 330, and a positioning module 340.

[0026] The micro control unit MCU is located in the central area, and the millimeter-wave radar detection module 200 and the communication module 330 are arranged diagonally; the multi-source environment detection module 320 and the positioning module 340 are respectively located on different sides of the micro control unit MCU.

[0027] The present invention also provides a method for using an integrated millimeter-wave radar disposable sensor, including:

[0028] Using a carrier device to scatter a plurality of integrated millimeter-wave radar disposable sensors, and the millimeter-wave radar detection module 200 performs target detection, obtains an echo signal and transmits it to the printed circuit board 300, and the printed circuit board 300 performs environmental information collection, target detection, positioning, and data transmission.

[0029] In this embodiment, the detection method of the millimeter-wave radar detection module 200 includes:

[0030] Transmitting a signal:

[0031] The control chip 240 generates radio frequency signals, which are transmitted to the radiation patch 220 through the first signal window 321. The radiation patch 220 radiates electromagnetic waves to the surroundings. The first metal via 2300 confines the electromagnetic waves, enabling them to be mainly transmitted to the antenna 210 through the radiation window and then radiated to the outside world through the antenna 210.

[0032] Receiving signals:

[0033] When the radio frequency signal radiates to the outside world and encounters a target, it reflects to form an echo signal, which is received by the antenna 210 again, returns along the path of the transmitted signal, is received by the control chip 240, and is transmitted to the printed circuit board 300 for target detection.

[0034] Compared with the prior art, the beneficial effects of the present invention are as follows: The bump metal and solder balls directly feed the antenna radiation structure from the control chip, reducing the transmission loss and improving the transmission efficiency. Through simulation verification, the transmission and radiation performance of the millimeter-wave radar detection module is stable and can be applied in practice.

[0035] The present invention adopts a one-transmit-one-receive antenna, enabling it to have the ability to detect personnel and targets at close range. The spherical housing of the sensor is made of a high-strength and wave-transparent material, ensuring that electromagnetic waves can be normally radiated while also guaranteeing the safety of the device during throwing. By setting protruding antenna structures on the surface of the sensor housing, the friction between the sensor and the ground is enhanced.

[0036] Multiple environmental parameter sensors can simultaneously sense various parameters in the environment and are suitable for complex environments. In addition, the positioning module equipped with the sensor provides users with real-time location information, facilitating target positioning and sensor management. At the same time, the integration of the wireless communication module can support self-organizing networks between sensor nodes, realizing multi-hop transmission of data and dynamic adjustment of network topology, and is suitable for large-scale deployment scenarios. Description of the Drawings

[0037] Figure 1 It is a schematic diagram of a disposable sensor integrated with a millimeter-wave radar according to an embodiment of the present invention.

[0038] Figure 2 It is an exploded three-dimensional view of the millimeter-wave radar detection module according to an embodiment of the present invention.

[0039] Figure 3 It is a schematic diagram of the RDL layer and ball grid array according to an embodiment of the present invention.

[0040] Figure 4 It is a partial cross-sectional view of the control chip according to an embodiment of the present invention.

[0041] Figure 5 It is a schematic diagram of the printed circuit board according to an embodiment of the present invention.

[0042] Figure 6 This is the antenna simulation standing wave diagram of the embodiment of the present invention.

[0043] Figure 7 This is the simulation isolation degree diagram of the antenna of the embodiment of the present invention.

[0044] Figures 8 - 10 They are respectively the simulation gain diagrams of the transmitting and receiving antennas of the embodiment of the present invention at 76.5, 78.5, and 80.5 GHz Specific embodiments

[0045] To facilitate the understanding of the technical solution of the present invention by those skilled in the art, the technical solution of the present invention will be further described below in conjunction with the accompanying drawings of the specification.

[0046] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0047] Please refer to Figure 1 As shown, this embodiment provides a disposable sensor integrated with a millimeter-wave radar, including: a housing 10, and a millimeter-wave radar detection module 200 and a printed circuit board 300 located inside the housing 10.

[0048] In an embodiment of the present invention, the housing 10 is spherical. A number of protruding antenna structures 11 are provided on the outer surface of the housing 10 to increase the friction coefficient of the housing 10. Inside the housing 10, a bowl-shaped weight 12 is attached to the inner wall. The housing 10 is made of an elastic, lightweight, high-strength and wave-transparent colloidal material. This special housing 10 material ensures the radiation performance of the millimeter-wave radar detection module 200 without increasing the weight of the device.

[0049] Please refer to Figures 1 to 4 As shown, in an embodiment of the present invention, the millimeter-wave radar detection module 200 includes an antenna 210, a radiation patch 220, an RDL layer 230, and a control chip 240. The antenna 210 is located on one side of the printed circuit board 300, and the antenna 210 is inlaid and connected to the printed circuit board 300 through a first metal via 2300. The radiation patch 220, the RDL layer 230, and the control chip 240 are located on the other side of the printed circuit board 30.

[0050] In this embodiment, the one-transmitting and one-receiving antenna 210 uses a second-order rectangular horn antenna. There is a transition step between the upper and lower horn antennas, and it shows an increasing trend from bottom to top. Without doubt, both the antenna radiation port for transmitting signals and the antenna radiation port for receiving signals use second-order rectangular horn antennas. In this implementation, the distance between the two antenna radiation ports is 5 mm. The sizes of the second-order rectangular horn antennas are 1.4 mm × 2.1 mm × 0.6 mm and 2.2 mm × 3 mm × 2.2 mm in sequence.

[0051] In this embodiment, the printed circuit board 300 includes an upper metal circuit board 301, a dielectric substrate 302, and a lower metal circuit board 303 arranged in sequence from top to bottom. Radiation windows are provided on both the upper metal circuit board 301 and the lower metal circuit board 303. Since the antenna 210 adopts a one-transmitting and one-receiving form, without doubt, two radiation windows are provided on both the upper metal circuit board 301 and the lower metal circuit board 303. Specifically, the radiation windows include a first radiation window 311, a second radiation window 312, a third radiation window 313, and a fourth radiation window 314 with the same structure. In this embodiment, the size of the radiation window is 0.65 mm × 1.27 mm.

[0052] In this embodiment, the first radiation window 311 and the second radiation window 312 are provided on the upper metal circuit board 301, the third radiation window 313 and the fourth radiation window 314 are provided on the lower metal circuit board 303, and the projections of the first radiation window 311 and the third radiation window 313 overlap, and the projections of the second radiation window 312 and the fourth radiation window 314 overlap. Also, the first radiation window 311 and the third radiation window 313 are within the top-down projection area of one of the antenna radiation ports of the antenna 210, and the second radiation window 312 and the fourth radiation window 314 are within the top-down projection area of the other antenna radiation port of the antenna 210. Also, without doubt, the millimeter-wave radar signal can penetrate the dielectric substrate 302.

[0053] In this embodiment, the first metal via hole 2300 penetrates through the first-order wall of the lower-layer metal circuit board 303 to the antenna 210. Moreover, a plurality of first metal via holes 2300 are arranged in a surrounding shape to form a first energy confinement loop 2310. The radiation window and the radiation port of the antenna 210 are located within the energy confinement loop 2310. It is undoubtedly that there are two first energy confinement loops 2310, including the first energy confinement loop one 2311 and the first energy confinement loop two 2312. The first radiation window 311, the third radiation window 313, and one of the antenna radiation ports of the corresponding antenna 210 are located within the first energy confinement loop one 2311, and the second radiation window 312, the fourth radiation window 314, and the other antenna radiation port of the corresponding antenna 210 are located within the first energy confinement loop two 2312. Among them, the diameter of the first metal via hole 2300 is 0.2 mm, the height is 0.69 mm, and the size of the first energy confinement loop 2310 is 1.81 mm × 2.46 mm.

[0054] In this embodiment, the radiation patch 220 and the control chip 240 are respectively located on two sides of the RDL layer 230. The radiation patch 220 is located within the radiation window, and a first signal window 231 is provided on the RDL layer 230. The control chip 240 is connected to the radiation patch 220 through the first signal window 231. Specifically, there are two radiation patches 220, which are respectively located within two radiation windows on the lower-layer metal circuit board 303. In this embodiment, the size of the radiation patch 220 is 0.5 mm × 0.53 mm.

[0055] In this embodiment, RDL (Redistribution Layer), the RDL layer 230 is a key integrated circuit packaging technology, mainly used to realize the high-frequency signal interconnection between the inside of the chip or between the chip and the antenna array. The metal wiring on the RDL layer 230 is connected to the printed circuit board 300 in the form of a ball grid array 232. Among them, the ball grid array 232 is a high-density and high-performance integrated circuit packaging technology, which is widely used in high-pin-count devices such as processors, FPGAs, and radio frequency chips. Its core feature is to replace the traditional wire bonding with a solder ball array to achieve better electrical performance and heat dissipation capacity.

[0056] In this embodiment, the arrangement of the ball grid array 232 on the RDL layer 230 is as follows: a ball grid rectangular loop 233 is formed around the RDL layer 230, and a sub-ball grid array 234 is formed within the ball grid rectangular loop 233, so that a second energy confinement loop 235 is formed between the ball grid rectangular loop 233 and the sub-ball grid array 234. Moreover, the first signal window 231 is located within the sub-ball grid array 234. In this embodiment, the interval between adjacent ball grids is 0.5 mm, and the diameter of the ball grid is 0.26 mm.

[0057] In this embodiment, the sub-ball grid array 234 is located in the middle of the ball grid rectangle 233. Undoubtedly, two second energy confinement circles 235 are formed. Also, two first signal windows 231 are provided within the sub-ball grid array 234.

[0058] In this embodiment, on the RDL layer 230 and within the second energy confinement circle 235, a second signal window 263 is provided, and a bump metal 365 is provided within the second signal window 263.

[0059] In this embodiment, specifically, the GSG pad 241 of the control chip 240 transmits the signal led out by the GSG pad 241 to the signal transmission feeder 364 located on the RDL layer 230 through the second metallization via 243 located in the first passivation layer 242, and the signal is transmitted to the radiation patch 220 through the bump metal 365.

[0060] Among them, the first signal window 231 and the second signal window 263 are interconnected to form a communication area, and the signal transmission feeder 364 is located within the communication area. In this embodiment, the feeder width of the signal transmission feeder 364 is 0.15 mm.

[0061] Please refer to Figures 1 to 5 As shown, in an embodiment of the present invention, the printed circuit board 300 is fixed in the housing 10 through a rigid bracket. Specifically, a micro control unit MCU, a multi-source environment detection module 320, a communication module 330, and a positioning module 340 are integrated on the printed circuit board 300.

[0062] In this embodiment, the micro control unit MCU is located in the central area, and the millimeter wave radar detection module 200 and the communication module 330 are arranged diagonally to prevent electromagnetic interference. The multi-source environment detection module 320 and the positioning module 340 are respectively located on different sides of the micro control unit MCU.

[0063] In this embodiment, among them, the multi-source environment detection module 320 includes a temperature sensor 321, a humidity environment sensor 322, a gas sensor 323, and an optical sensor 324. According to the specific environmental conditions and data requirements, other sensors can be integrated. The environmental parameters collected by these sensors help users to more comprehensively understand the environmental conditions of the sensor deployment location; in addition, a positioning module 340 can be added to enable users to obtain the location information of the device in real time, facilitating the deployment and recovery of the device. The micro control unit MCU manages the data collection and packaging of other modules, and then transmits them to the communication module 330 for sending to the terminal.

[0064] Please refer to Figures 6 to 10 As shown, through modeling and simulation, the standing wave of this one-transmit and one-receive antenna is obtained as Figure 6As shown, it can be seen that the standing wave in the working frequency band of 76 - 81 GHz is less than 2. The isolation between the transmit - receive antennas 210 is as Figure 7 shown. In the working frequency band of 76 - 81 GHz, the isolation is below - 30 dB. The gains of the antenna 210 at 76.5, 78.5, and 80.5 GHz are as Figures 8 - 10 shown, and the peak gains are all greater than 5 dB.

[0065] The disposable sensor of the integrated millimeter - wave radar in this embodiment can be applied in various scenarios. Additionally, through the packaging design of the antenna 210 and the control chip 240, with the control chip 240 located directly below the antenna 210, the output signal of the control chip 240 is directly transmitted to the antenna 210 by solder balls. This not only greatly reduces the packaging area of the antenna 210 but also reduces the transmission loss and improves the signal transmission efficiency. The inlaid connection between the antenna 210 and the printed circuit board 300 further reduces the packaging volume on the basis of reducing the assembly error. The antenna 210 has good transmission and radiation performance in the working frequency band of 76 - 81 GHz.

[0066] Please refer to Figures 1 to 10 shown. The present invention also provides a method for using a disposable sensor of an integrated millimeter - wave radar, including:

[0067] Using a carrier device to sprinkle multiple disposable sensors of the integrated millimeter - wave radar, detecting targets through the millimeter - wave radar detection module 200, obtaining echo signals and transmitting them to the printed circuit board 300. The printed circuit board 300 conducts environmental information collection, target detection, positioning, and data transmission. Specifically, the echo signals carry target information and are transmitted to the micro - control unit MCU to work in coordination with the multi - source environment detection module 320, the communication module 330, and the positioning module 340.

[0068] In another embodiment of the present invention, the detection method of the millimeter - wave radar detection module 200 includes:

[0069] Transmitting signals:

[0070] The control chip 240 generates a radio - frequency signal and transmits it to the radiation patch 220 through the first signal window 321. Specifically, it is transmitted to the radiation patch 220 through the RDL layer 230 and the bump metal 365. The radiation patch 220 radiates electromagnetic waves to the surrounding. The first metal via 2300 confines the electromagnetic waves so that they are mainly transmitted to the antenna 210 through the radiation window and radiated to the outside through the antenna 210.

[0071] Receiving signals:

[0072] The radio frequency signal radiates to the outside world and reflects off a target to form an echo signal, which is received by the antenna 210 again, returns along the path of the transmitted signal, is received by the control chip 240, and is transmitted to the printed circuit board 300 for target detection.

[0073] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention, and any reference signs in the claims should not be regarded as limiting the claims involved.

[0074] The above-described embodiments merely represent the implementation manners of the invention. The protection scope of the present invention is not limited to the above embodiments. For those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention.

Claims

1. A disposable sensor integrated with a millimeter-wave radar, characterized in that, Comprising: A housing (10), and a millimeter-wave radar detection module (200) and a printed circuit board (300) located inside the housing (10); Wherein, the millimeter-wave radar detection module (200) includes an antenna (210), a radiation patch (220), an RDL layer (230), and a control chip (240); A radiation window is provided on the printed circuit board (300); The antenna (210) is located on one side of the printed circuit board (300), and the antenna (210) is inlaid and connected to the printed circuit board (300) through a first metal via hole (2300); the radiation patch (220), the RDL layer (230), and the control chip (240) are located on the other side of the printed circuit board (30); The radiation patch (220) and the control chip (240) are respectively located on both sides of the RDL layer (230), and the radiation patch (220) is also located within the radiation window; a first signal window (231) is provided on the RDL layer (230), and the control chip (240) is connected to the radiation patch (220) through the first signal window (231).

2. The disposable sensor integrated with a millimeter-wave radar according to claim 1, characterized in that, A plurality of first metal via holes (2300) are arranged in a surrounding shape to form a first energy confinement ring (2310); and, the radiation window and the radiation port of the antenna (210) are located within the energy confinement ring (2310).

3. The disposable sensor integrated with a millimeter-wave radar according to claim 1, characterized in that The metal wiring on the RDL layer (230) is connected to the printed circuit board (300) in the form of a ball grid array (232); wherein, the arrangement of the ball grid array (232) on the RDL layer (230) is: A ball grid rectangular ring (233) is formed around the RDL layer (230), and a sub-ball grid array (234) is formed within the ball grid rectangular ring (233), so that a second energy confinement ring (235) is formed between the ball grid rectangular ring (233) and the sub-ball grid array (234); And, the first signal window (231) is located within the sub-ball grid array (234).

4. The disposable sensor integrated with a millimeter-wave radar according to claim 3, characterized in that, On the RDL layer (230) and within the second energy confinement ring (235), a second signal window (263) is provided; a bump metal (365) is provided within the second signal window (263); A second metal via hole (243) is provided on the GSG pad (241) of the control chip (240); Through the second metal via hole (243), the signal led out from the GSG pad (241) is transmitted to the signal transmission feeder line (364) located on the RDL layer (230), and the signal is transmitted to the radiation patch (220) through the bump metal (365).

5. The disposable sensor integrated with a millimeter-wave radar according to claim 4, characterized in that, The first signal window (231) and the second signal window (263) are interconnected to form a communication area; the signal transmission feeder line (364) is located within the communication area.

6. The disposable sensor integrated with a millimeter-wave radar according to claim 1, characterized in that The housing (10) is spherical, and a number of protruding antenna structures (11) are provided on the outer surface of the housing (10), and inside the housing (10), a bowl-shaped counterweight (12) is attached to the inner wall.

7. The disposable sensor integrated with a millimeter-wave radar according to claim 6, characterized in that, The line connecting the center of gravity of the counterweight (12) and the center of the sphere of the housing (10) is perpendicular to the surface of the printed circuit board (300).

8. The disposable sensor integrated with a millimeter-wave radar according to claim 1, characterized in that, A microcontroller unit (MCU), a multi-source environment detection module (320), a communication module (330), and a positioning module (340) are integrated on a printed circuit board (300). The microcontroller unit (MCU) is located in the central area, and the millimeter-wave radar detection module (200) and the communication module (330) are arranged diagonally; the multi-source environment detection module (320) and the positioning module (340) are located on different sides of the microcontroller unit (MCU) respectively.

9. A method for using a disposable sensor integrated with a millimeter-wave radar according to any one of claims 1-8, characterized in that, It includes: Using a carrier device, multiple disposable sensors integrated with millimeter-wave radars are scattered. Target detection is performed through the millimeter-wave radar detection module (200), and the echo signal is obtained and transmitted to the printed circuit board (300). The printed circuit board (300) performs environmental information collection, target detection, positioning, and data transmission.

10. The method for using the disposable sensor integrated with a millimeter-wave radar according to claim 9, characterized in that, The detection method including the millimeter-wave radar detection module (200): Transmitting a signal: The control chip (240) generates a radio frequency signal, which is transmitted to the radiation patch (220) through the first signal window (321). The radiation patch (220) radiates electromagnetic waves to the surroundings. The first metal via hole (2300) confines the electromagnetic waves so that they are mainly transmitted to the antenna (210) through the radiation window and radiated to the outside through the antenna (210). Receiving a signal: The radio frequency signal radiates to the outside and is reflected by a target to form an echo signal, which is received by the antenna (210) again, returns along the path of the transmitted signal, is received by the control chip (240), and is transmitted to the printed circuit board (300) for target detection.

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