Display module, preparation method thereof, back film and display device

Abstract

The application provides a display module, a preparation method thereof, a back film and a display device, and relates to the technical field of display, aiming to improve the waterproof and corrosion resistance of the display module. The display module comprises a display panel, a flexible circuit board, a protective film and a protective layer. The display panel comprises a first part provided with a display area and a second part provided with a binding area. The first part comprises opposite display and non-display surfaces, and the second part is bent to a side close to the non-display surface. The flexible circuit board is arranged on a side of the second part away from the first part and connected with the binding area of the second part. The protective film is arranged on a side of the second part close to the first part, and the orthographic projection of the protective film on the second part is located in the binding area. The protective layer covers a side of the flexible circuit board close to the first part, covers the connection between the flexible circuit board and the second part, and covers a side of the protective film close to the first part.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module, a preparation method thereof, a back film and a display device. BACKGROUND

[0002] In an organic light-emitting diode (OLED) folding screen, the position (gold finger) where the flexible circuit board is bound to the back of the display panel is prone to water vapor intrusion, thereby causing corrosion problems in the internal structure of the display module. SUMMARY

[0003] The present application provides a display module, a preparation method thereof, a back film and a display device, which aims to improve the waterproof and corrosion resistance of the display module.

[0004] To achieve the above-mentioned purpose, the embodiments of the present application provide the following technical solutions:

[0005] In one aspect, a display module is provided, which includes a display panel, a flexible circuit board, a protective film and a protective layer. The display panel includes a first part provided with a display area, and a second part provided with a binding area, the first part includes opposite display and non-display surfaces, and the second part is bent to a side close to the non-display surface. The flexible circuit board is arranged on a side of the second part away from the first part, and is connected to the binding area of the second part. The protective film is arranged on a side of the second part close to the first part, and the orthographic projection of the protective film on the second part is located in the binding area. The protective layer covers a side of the flexible circuit board close to the first part, covers the connection between the flexible circuit board and the second part, and covers a side of the protective film close to the first part.

[0006] The display module provided by the present application includes a display panel, a flexible circuit board, a protective film and a protective layer, the display panel includes a first part provided with a display area, and a second part provided with a binding area, the flexible circuit board is connected to the binding area of the second part of the display panel, the connection is a "gold finger", and the gold finger is used to realize the electrical connection between the flexible circuit board and the display panel. A side of the second part close to the first part is provided with the protective film and the protective layer, the protective layer not only covers a side of the flexible circuit board close to the first part, covers the connection between the flexible circuit board and the second part, but also covers a side of the protective film close to the first part, that is, the protective layer covers the periphery of the gold finger, thereby improving the waterproof and corrosion resistance of the gold finger.

[0007] Furthermore, compared with the protective layer only covering the flexible circuit board and the connection between the flexible circuit board and the second part, by arranging the protective layer to also cover the protective film, the protection path of the protective layer can be prolonged, thereby prolonging the path of water vapor and salt mist corrosion, reducing the possibility of corrosion of the internal structure of the display module, and improving the waterproof and corrosion resistance of the display module.

[0008] In some embodiments, the second part includes a first boundary and a second boundary oppositely arranged, and the first boundary is connected to the first part. The display module further includes a cushion block arranged on a side of the second part close to the first part, and a boundary of the cushion block is located inside the second boundary in a direction opposite to the first boundary and the second boundary.

[0009] In some embodiments, the cushion block includes a first side close to the second boundary, and the protective film includes a second side close to the first boundary, and the second side is in contact with the first side.

[0010] In some embodiments, the protective film includes a third boundary away from the first boundary, and the third boundary is flush with the second boundary in a direction opposite to the first boundary and the second boundary.

[0011] In another aspect, a back film is also provided, which includes a first protective film, a first adhesive layer and a second adhesive layer, a first support layer and a second support layer, and a second protective film. The first adhesive layer and the second adhesive layer are arranged on a side of the first protective film. The first support layer is arranged on a side of the first adhesive layer away from the first protective film, and the second support layer is arranged on a side of the second adhesive layer away from the first protective film. The second protective film is formed into a first sub-protective film and a second sub-protective film by half punching, the first sub-protective film covers a part of the surface of the first support layer and the second support layer, and the second sub-protective film covers another part of the surface of the second support layer.

[0012] The back film provided in the present application includes a first protective film, a first adhesive layer and a second adhesive layer, a first support layer and a second support layer, and a second protective film. The stack structure of the first protective film and the first adhesive layer, and the stack structure of the second adhesive layer and the second support layer are arranged side by side between the first protective film and the second protective film. The second protective film is formed into a first sub-protective film and a second sub-protective film by half punching, that is, there is a half-cut trace between the first sub-protective film and the second sub-protective film, and in the process of tearing off the second protective film, the second sub-protective film is retained due to the existence of the half-cut trace. Since the first sub-protective film covers a part of the surface of the first support layer and the second support layer, and the second sub-protective film covers another part of the surface of the second support layer, the retained second sub-protective film can protect part of the surface of the second support layer.

[0013] In another aspect, a method for manufacturing a display module is provided. The method includes providing a display panel including a front surface and a back surface opposite to the front surface, the display panel further including a first portion provided with a display area and a second portion provided with a binding area. A protective film is attached to the back surface, the protective film is formed into a first sub-protective film and a second sub-protective film by half-cutting, and a normal projection of the second sub-protective film on the display panel is located in the binding area. A flexible printed circuit board is connected to the binding area of the second portion. A protective layer is formed to cover a side of the flexible printed circuit board close to the display panel, the protective layer covers a connection between the flexible printed circuit board and the display panel, and covers a side of the second sub-protective film away from the display panel. The first sub-protective film is removed, and the second sub-protective film is retained. The second portion is bent to a side close to the back surface of the first portion.

[0014] In the manufacturing method, the display panel is provided, the protective film is attached to the back surface of the display panel, the protective film is formed into the first sub-protective film and the second sub-protective film by half-cutting, the first sub-protective film and the second sub-protective film can be separated along the half-cutting trace, and a normal projection of the second sub-protective film on the display panel is located in the binding area of the second portion. The flexible printed circuit board is connected to the binding area of the second portion by a gold finger to realize electrical connection between the flexible printed circuit board and the display panel. The protective layer is formed to cover the gold finger periphery of the flexible printed circuit board close to the back surface, the protective layer covers the connection between the flexible printed circuit board and the second portion, and covers the side of the second sub-protective film away from the back surface, thereby improving waterproofness and corrosion resistance at the gold finger of the back surface.

[0015] The first sub-protective film is removed along the half-cutting trace, and the second sub-protective film covered by the protective layer is not subjected to peeling force to generate peeling. The second portion is bent to a side close to the back surface of the first portion to form the display module. By covering the second sub-protective film with the protective layer, a water vapor and salt mist erosion path of the protective layer is prolonged, thereby reducing a possibility of corrosion of internal structures of the display module, and improving waterproofness and corrosion resistance of the display module.

[0016] In some embodiments, attaching the protective film to the back surface includes providing a back film including a first protective film, a first adhesive layer, a second adhesive layer, a first support layer, a second support layer, and a second protective film. The first protective film is removed, and the remaining part is attached to the back surface, and the second protective film is the protective film.

[0017] In some embodiments, after the first sub-protective film is removed and before the second portion is bent to a side close to the back surface of the first portion, the method further includes providing a raised block on the back surface of the second portion. The second portion includes a first boundary and a second boundary opposite to each other, and the first boundary is connected to the first portion. In a direction opposite to the first boundary and the second boundary, a boundary of the raised block is located inside the second boundary, and the raised block does not overlap the second sub-protective film.

[0018] In some embodiments, after the protective film is pasted on the back surface, the preparation method further comprises: cutting the display panel, the first sub-protective film and the second sub-protective film. The second part comprises a first boundary and a second boundary arranged oppositely, and the first boundary is connected with the first part. The second sub-protective film comprises a third boundary away from the first boundary, and the third boundary is flush with the second boundary in the direction opposite to the first boundary and the second boundary.

[0019] In another aspect, a display device is provided, which comprises the display module in the above embodiments and a controller electrically connected with the display module.

[0020] The display device has the same structure and beneficial technical effects as the display module provided in some embodiments described above, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present application, the following will briefly introduce the drawings needed to be used in some embodiments of the present application. Obviously, the drawings described below are only the drawings of some embodiments of the present application, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limited to the actual size of the product involved in the embodiments of the present application, and the actual process of the method.

[0022] Figure 1 Structure diagram of the display device provided by the embodiments of the present application;

[0023] Figure 2 Structure diagram of the display device provided by the embodiments of the present application; Figure 1 Partial sectional view of the display device in FIG. 1 along the sectional line A-A';

[0024] Figure 3 Structure diagram of the back film provided by the embodiments of the present application;

[0025] Figure 4 Top view of the second protective film in the back film in FIG. 2; Figure 3 Top view of the second protective film in the back film in FIG. 2;

[0026] Figure 5 Flow chart of the method for preparing the display module provided by the embodiments of the present application;

[0027] Figures 6-13 Structure diagram of the method for preparing the display module provided by the embodiments of the present application; DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments provided by the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0029] Unless otherwise required by context, the term "including" as used in the specification and the claims is to be interpreted as open, meaning "including but not limited to".

[0030] Hereinafter, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0031] In describing some embodiments, the term "connected" and / or its derivatives can be used. The term "connected" is to be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated; can be directly connected, or indirectly connected through an intermediate medium. For example, in describing some embodiments, the term "connected" can be used to indicate that two or more components have direct physical contact or electrical contact with each other.

[0032] In addition, the use of "based on" means open and inclusive, because the process, step, calculation or other action "based on" one or more stated conditions or values can be based on additional conditions or values beyond those stated in practice.

[0033] It should be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or there can be an intervening layer between the layer or element and the other layer or substrate.

[0034] Exemplary embodiments are described herein with reference to cross-sectional illustrations that are idealized illustrations. In the drawings, the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will typically have rounded or curved features. Thus, the regions illustrated in the drawings are schematic in nature and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

[0035] Embodiments of the present application provide a display device 100, Figure 1 A structural diagram of the display device provided by embodiments of the present application is shown in FIG. 1.

[0036] Referring to Figure 1 The display device 100 includes a display module 10 and a controller 200 electrically connected to the display module. The controller 200 can be disposed on a non-display side of the display module 10 and used to control a display panel in the display module 10 to display a picture.

[0037] The display device described above can be any device that displays images whether moving (e.g., video) or stationary (e.g., still images) and whether text or graphics. More specifically, it is contemplated that embodiments can be implemented in or in association with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), hand-held or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, display of camera views (e.g., in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry) and the like.

[0038] Embodiments of the present application also provide a display module, Figure 2 A partial cross-sectional view of the display device along a cross-sectional line A-A' in Figure 1

[0039] Referring to Figure 2 The display module 10 includes a display panel 1, a flexible circuit board 2, a protective film 3, and a protective layer 4.

[0040] The display panel 1 includes a first portion 11 provided with an active area (AA) 110 and a second portion 12 provided with a bonding area 120. The bonding area 120 is provided with a gold finger, and the circuit board is electrically connected to the display panel 1 through the gold finger. The first portion 11 includes a display surface 101 and a non-display surface 102 opposite to each other, and the second portion 12 is bent to a side close to the non-display surface 102. The second portion 12 also includes a fanout area 121, which is provided with a plurality of signal lines such as data fanout lines, digital control lines, and power lines, and is a bending area of the display panel 1, which is conducive to realizing a narrow frame design of the display panel 1 and improving the packaging density of the display module 10.

[0041] ​The flexible circuit board (PCB) 2 is arranged on the side of the second part 12 away from the first part 11, and the flexible circuit board 2 is connected to the binding area 120 of the second part 12 to realize the electrical connection between the flexible circuit board 2 and the display panel 1. The connection between the flexible circuit board 2 and the binding area 120 is a "gold finger".

[0042] The protective film 3 is arranged on the side of the second part 12 close to the first part 11, and the orthographic projection of the protective film 3 on the second part 12 is located in the binding area 120. The gold finger is provided with an upper protective layer 40 and a lower protective layer 4 to protect the gold finger and prevent the gold finger from being corroded by water vapor. In addition, the lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12, and covers the side of the protective film 3 close to the first part 11. Exemplarily, the material of the upper protective layer 40 and the material of the lower protective layer 4 can be ultraviolet curing adhesive (UV adhesive), and the upper protective layer 40 can be referred to as "front adhesive", and the lower protective layer 4 can be referred to as "back adhesive".

[0043] The display module 10 provided in the present application includes a display panel 1, a flexible circuit board 2, a protective film 3 and a protective layer 4. The display panel 1 includes a first part 11 provided with a display area 110, and a second part 12 provided with a binding area 120. The flexible circuit board 2 is connected to the binding area 120 of the second part 12 of the display panel 1, and the connection is a "gold finger". The gold finger is used to realize the electrical connection between the flexible circuit board 2 and the display panel 1. The side of the second part 12 close to the first part 11 is provided with the protective film 3 and the protective layer 4. The protective layer 4 not only covers the side of the flexible circuit board 2 close to the first part 11, but also covers the connection between the flexible circuit board 2 and the second part 12. In addition, the protective layer 4 also covers the side of the protective film 3 close to the first part 12, that is, the protective layer 4 covers the periphery of the gold finger, thereby improving the waterproof and corrosion resistance of the gold finger.

[0044] In addition, compared with the protective layer 4 only covering the flexible circuit board 2 and the connection between the flexible circuit board 2 and the second part 12, by arranging the protective layer 4 to also cover the protective film 3, the protection path of the protective layer 4 is prolonged, thereby prolonging the path of water vapor and salt mist corrosion, reducing the possibility of corrosion of the internal structure of the display module 10, and improving the waterproof and corrosion resistance of the display module 10.

[0045] In some embodiments, referring to Figure 2The second part 12 includes a first boundary M and a second boundary N arranged oppositely, and the first boundary M is connected with the first part 11. The display module 10 further includes a spacer 5 arranged on the side of the second part 12 close to the first part 11, and the boundary 50 of the spacer 5 is located inside the second boundary N, i.e., the spacer 5 is designed to be recessed relative to the second part 12, so as to leave space for arranging the protective film 3 and the protective layer 4, thereby prolonging the path of water vapor and salt mist erosion of the protective layer 4, and thus facilitating improvement of the waterproof and corrosion-resistant performance of the display module 10.

[0046] For example, continuing to refer to Figure 2 The display module 10 further includes a back film 6, a support plate 7, and a protective adhesive layer 8. The back film 6 is arranged on the back of the display panel 1 and is in contact with the back of the display panel 1. For example, the back film 6 is arranged on the non-display surface 102 of the first part 11 and the back of the second part 21, respectively. For example, along the direction close to the display panel 1, the back film 6 includes a laminated adhesive layer and a support layer. The back film 6 is used to support the display panel 1.

[0047] The support plate 7 is arranged on the side of the spacer 5 away from the second part 12. For example, the material of the support plate 7 can include super clean foam (SCF), and the support plate 7 is a structure for high-strength support, buffering, and absorbing and dissipating heat. The protective adhesive layer 8 is arranged on the bending area of the first part 11. For example, the material of the protective adhesive layer 8 can be micro coating layer (MCL), and the protective adhesive layer 8 is coated on the bent part of the display panel 1, so as to prevent the bending area from being corroded by oxidizing gases such as water vapor, thereby improving the durability of the display panel 1.

[0048] In some embodiments, referring to Figure 2 The spacer 5 includes a first side surface 51 close to the second boundary N, and the protective film 3 includes a second side surface 32 close to the first boundary M, and the second side surface 32 is in contact with the first side surface 51. For example, along the direction Y, the sum of the length of the spacer 5 and the length of the protective film 3 is equal to the length of the second part 12. The second side surface 32 is in contact with the first side surface 51, i.e., there is no gap between the spacer 5 and the protective film 3, i.e., the spacer 5 and the protective film 3 cover the back film 6 in contact with the second part 12, thereby improving the support of the back film layer of the second part 12.

[0049] In some embodiments, referring to Figure 2The protective film 3 includes a third boundary 33 away from the first boundary M, and the third boundary 33 is flush with the second boundary N along the direction Y opposite to the first boundary M. Since the lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12, and covers the side of the protective film 3 close to the first part 11, that is, the side of the lower protective layer 4 covering the second boundary N and the third boundary 33. In the process of forming the lower protective layer (UV glue) 4 (pointing to the process of applying glue), since the third boundary 33 is flush with the second boundary N, the UV glue is more likely to cover the second boundary N and the third boundary 33 under the capillary effect, so that there is no gap between the lower protective layer 4 and the second part 12 and the protective film 3, preventing the entry of water vapor and salt mist, thereby improving the waterproof and corrosion-resistant performance of the gold finger.

[0050] In another aspect, a back film is also provided, Figure 3 a structural diagram of the back film provided by the embodiments of the present application; Figure 4 for Figure 3 a top view of the second protective film in the back film.

[0051] Referring to Figure 3 The back film 6 includes a first protective film 61, a first adhesive layer 63 and a second adhesive layer 64, a first support layer 65 and a second support layer 66, and a second protective film 62. The first adhesive layer 63 and the second adhesive layer 64 are arranged on one side of the first protective film 61. For example, the material of the first adhesive layer 63 and the material of the second adhesive layer 64 can be pressure sensitive adhesive (PSA). The first support layer 65 is arranged on the side of the first adhesive layer 63 away from the first protective film 61, and the second support layer 66 is arranged on the side of the second adhesive layer 64 away from the first protective film 61. For example, the material of the first support layer 65 and the material of the second support layer 66 can be polyimide (PI). For example, after the first protective film 61 and the second protective film 62 are removed, the remaining film layers of the back film 6 can be pasted to the back of the display panel through the first adhesive layer 63 and the second adhesive layer 64, as a support structure of the display panel.

[0052] Referring to Figure 3 and Figure 4 The second protective film 62 is formed into a first sub-protective film 30 and a second sub-protective film 3 by half punching. The first sub-protective film 30 covers part of the surface of the first support layer 65 and the second support layer 66, and the second sub-protective film 3 covers another part of the surface of the second support layer 66. It can be understood that L1 and L are traces formed on the second protective film 62 by the half punching process, wherein L1 is a full cutting trace and L is a half cutting trace. During the process of removing the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the trace L, so as to retain the second sub-protective film 3.

[0053] For example, referring to Figure 4 The width d of the second sub-protection film 3 along the direction Y can be 1 mm. The present application does not limit the shape of the full cut trace L1. For example, the L1-shaped protection film in the embodiment of the present application can be applied to the display module of a watch.

[0054] The back film 6 provided by the present application includes a first protection film 61, a first adhesive layer 63 and a second adhesive layer 64, a first support layer 65 and a second support layer 66, and a second protection film 62. The stack structure of the first protection film 61 and the first adhesive layer 63, and the stack structure of the second adhesive layer 64 and the second support layer 66 are arranged side by side between the first protection film 61 and the second protection film 62. The second protection film 62 is formed into a first sub-protection film 30 and a second sub-protection film 3 by half cutting, that is, there is a half-cut trace between the first sub-protection film 30 and the second sub-protection film 3. In the process of tearing off the second protection film 62, the second sub-protection film 3 is retained due to the existence of the half-cut trace. Since the first sub-protection film 30 covers part of the surface of the first support layer 65 and the second support layer 66, and the second sub-protection film 3 covers another part of the surface of the second support layer 66, the retained second sub-protection film 3 can protect part of the surface of the second support layer 66.

[0055] On the other hand, a preparation method of a display module is also provided, Figure 5 The method for preparing a display module provided by the embodiment of the present application is shown in the flowchart. Figures 6-13 The steps of the method for preparing a display module provided by the embodiment of the present application are shown in the diagram.

[0056] For example, referring to Figure 6 The preparation method includes the following steps S1-S6:

[0057] Step S1: referring to Figure 6 A display panel 1 is provided, which includes opposite front and back surfaces 101 and 102. The display panel 1 further includes a first part 11 provided with a display area (AA area) 110, and a second part 12 provided with a bonding area 120. The bonding area 120 is provided with a gold finger, and a circuit board is electrically connected to the display panel 1 through the gold finger. The first part 11 includes opposite display and non-display surfaces, and the non-display surface is part of the back surface 102. For example, the second part 12 further includes a fanout area 121, which is provided with a plurality of signal lines such as data fanout lines, digital control lines and power supply lines, and the fanout area 121 is a bending area of the display panel 1, which is beneficial to realize a narrow frame design of the display panel 1.

[0058] Step S2: referring to Figure 7The second protective film 62 is pasted onto the back surface 102. The second protective film 62 is partially punched to form a first sub-protective film 30 and a second sub-protective film 3. The orthogonal projection of the second sub-protective film 3 on the display panel 1 is located within the bonding area 120. The second sub-protective film 3 is set.

[0059] For example, the step S2 above, which involves attaching the second protective film 3 to the back surface 102, includes the following steps S201 to S202:

[0060] Step S201: See Figure 3 and Figure 4 A back film 6 is provided, comprising a first protective film 61, a first adhesive layer 63, a second adhesive layer 64, a first support layer 65, a second support layer 66, and a second protective film 62. The back film 6 is used to support the back surface 102 of the display panel 1. The second protective film 62 is formed by semi-punch-cutting to create a first sub-protective film 30 and a second sub-protective film 3. The first sub-protective film 30 covers a portion of the surface of the first support layer 65 and the second support layer 66, while the second sub-protective film 3 covers another portion of the surface of the second support layer 66. It is understood that L1 and L are cutting marks formed on the second protective film 62 by the semi-punch-cutting process, where L1 is a full cut mark and L is a partial cut mark. During the process of tearing off the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the mark L, thereby retaining the second sub-protective film 3.

[0061] Step S202: See Figure 7 Remove the first protective film 61, and attach the first support layer 65, the second support layer 66, and the second protective film 62 to the back surface 102 through the first adhesive layer 63 and the second adhesive layer 64.

[0062] In some embodiments, see Figure 8 After attaching the second protective film 3 to the back surface 102, the above preparation method further includes cutting the display panel 1, the first sub-protective film 30, and the second sub-protective film 3. For example, the first support layer 65, the second support layer 66, the first adhesive layer 63, and the second adhesive layer 64 are also cut. The second part 12 includes a first boundary M and a second boundary N disposed opposite to each other, with the first boundary M connected to the first part 11. The second sub-protective film 3 includes a third boundary 33 away from the first boundary M, and along the direction Y opposite to the first boundary M and the second boundary N, the third boundary 33 is flush with the second boundary N.

[0063] The lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12, and covers the side of the protective film 3 close to the first part 11, i.e. the side of the second boundary N and the third boundary 33. In the process of forming the lower protective layer (UV glue) 4 (dispensing process), because the third boundary 33 is flush with the second boundary N, the UV glue is more likely to cover the second boundary N and the third boundary 33 under capillary action, so that there is no gap between the lower protective layer 4 and the second part 12 and the protective film 3, preventing the entry of water vapor and salt mist, thereby improving the waterproof and corrosion-resistant performance of the gold finger.

[0064] Step S3: see Figure 9 The flexible circuit board (PCB) 2 is connected to the binding area 120 of the second part 12 to achieve electrical connection between the flexible circuit board 2 and the display panel 1. Exemplarily, the flexible circuit board 2 is connected to the binding area 120 by metal welding, and the metal welding is a "gold finger".

[0065] Step S4: see Figure 10 The upper protective layer 40 and the lower protective layer 4 are formed to protect the gold finger and prevent the gold finger from being eroded by water vapor. The lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12, and covers the side of the second sub-protective film 3 away from the back surface 102.

[0066] Exemplarily, the material of the upper protective layer 40 and the material of the lower protective layer 4 can be ultraviolet curing glue (UV glue), and the process of forming the upper protective layer 40 and the lower protective layer 4 is a "dispensing process". The upper protective layer 40 can be referred to as "front glue", and the lower protective layer 4 can be referred to as "back glue".

[0067] Step S5: see Figure 11 The first sub-protective film 30 is removed, and the second sub-protective film 3 is retained. Exemplarily, in the process of removing the second protective film 62, the first sub-protective film 30 and the second sub-protective film 3 can be separated along the trace of the half-cut, and the second sub-protective film 3 covered by the lower protective layer 4 will not be subjected to peeling force and thus peeling. Moreover, by covering the second sub-protective film 3 with the lower protective layer 4, the water vapor and salt mist erosion path of the lower protective layer 4 is prolonged, achieving corrosion protection of the gold finger at the back surface 102.

[0068] In some embodiments, see Figure 12 After removing the first sub-protective film 30, the above preparation method further includes arranging a spacer 5 on the back surface 102 of the second part 12.

[0069] The second part 12 includes a first boundary M and a second boundary N arranged oppositely, and the first boundary M is connected with the first part 11. In the direction (direction Y) opposite to the first boundary M and the second boundary N, the boundary 50 of the pad block 5 is located inside the second boundary N, and the pad block 5 does not overlap with the second sub-protection film 3, that is, the pad block 5 is designed to be inwardly recessed relative to the second part 12 to leave space for the protection film 3.

[0070] For example, referring to Figure 13 After the pad block 5 is arranged, the support plate 7 is arranged on the side of the pad block 5 away from the second part 12, and the material of the support plate 7 can include SCF. The support plate 7 is a structure for high-strength support, buffering, and absorbing and dissipating heat.

[0071] Step S6: referring to Figure 2 The second part 12 is bent to the side close to the back surface 102 of the first part 11 to form the display module 10.

[0072] For example, referring to Figure 2 After the second part 12 is bent to the side close to the back surface 102 of the first part 11, the protective glue layer 8 is arranged on the bent area of the first part 11. For example, the material of the protective glue layer 8 can be MCL. The protective glue layer 8 is coated on the bent part of the display panel 1 to prevent the bent area from being corroded by oxidizing gases such as water vapor, thereby improving the durability of the display panel 1.

[0073] In the preparation method provided in the present application, the display panel 1 is provided, the second protection film 62 is pasted on the back surface 102 of the display panel 1, the second protection film 62 is formed into the first sub-protection film 30 and the second sub-protection film 3 through half punching, the first sub-protection film 30 and the second sub-protection film 3 can be separated along the half punching trace, and the orthographic projection of the second sub-protection film 3 on the display panel 1 is located in the binding area 120 of the second part 12 of the display panel 1. The flexible circuit board 2 is connected with the binding area 120 of the second part 12 through a gold finger to realize the electrical connection between the flexible circuit board 2 and the display panel 1. The lower protective layer 4 covering the periphery of the gold finger close to the back surface 102 of the flexible circuit board 2 is formed, and the lower protective layer 4 covers the connection between the flexible circuit board 2 and the second part 12 and covers the side of the second sub-protection film 3 away from the back surface 102, thereby improving the waterproofness and corrosion resistance of the gold finger on the back surface.

[0074] The first sub-protection film 30 is removed along the half-cut trace, and the second sub-protection film 3 is reserved. The second sub-protection film 3 covered by the lower protective layer 4 is not affected by the peeling force and thus is not peeled. The second part 12 is bent to one side of the back surface 102 close to the first part 11 to form the display module 10. By covering the second sub-protection film 3 with the lower protective layer 4, the corrosion path of water vapor and salt mist of the lower protective layer 4 is extended, so as to reduce the possibility of corrosion of the internal structure of the display module 10, thereby improving the waterproof and corrosion resistance of the display module 10.

[0075] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can think of changes or replacements within the technical scope disclosed in the present application, which shall be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel includes a first part having a display area and a second part having a binding area. The first part includes opposing display surfaces and non-display surfaces, and the second part is bent to the side closer to the non-display surface. The second part includes opposing first and second boundaries, and the first boundary is connected to the first part. A flexible circuit board is disposed on the side of the second part away from the first part and is connected to the bonding area of ​​the second part; A shim block is disposed on the side of the second part close to the first part; along the direction opposite to the second boundary of the first boundary, the boundary of the shim block is located inside the second boundary, and the shim block includes a first side surface close to the second boundary. A protective film is disposed on the side of the second part near the first part, and the orthographic projection of the protective film on the second part is located within the bonding area; the protective film includes a second side surface near the first boundary and a third side surface away from the first boundary, and the second side surface is in contact with the first side surface; A protective layer covers the side of the flexible circuit board near the first part, covers the connection between the flexible circuit board and the second part, and covers the third side of the protective film and the side near the first part; the portion of the protective layer covering the protective film near the first part has a gap with the first side.

2. The display module according to claim 1, characterized in that, The protective film includes a third boundary away from the first boundary, and along the direction opposite to the first boundary and the second boundary, the third boundary is flush with the second boundary.

3. The display module according to claim 1, characterized in that, The display module also includes: First protective film; The first adhesive layer and the second adhesive layer are disposed on one side of the first protective film; A first support layer and a second support layer, wherein the first support layer is disposed on the side of the first adhesive layer away from the first protective film, and the second support layer is disposed on the side of the second adhesive layer away from the first protective film; The second protective film is formed by half-punching to form a first sub-protective film and a second sub-protective film. The first sub-protective film covers the first support layer and a portion of the surface of the second support layer, and the second sub-protective film covers another portion of the surface of the second support layer. The second sub-protective film is the protective film.

4. A method for manufacturing a display module, characterized in that, include: A display panel is provided, the display panel including a front side and a back side facing each other; the display panel also includes a first part having a display area and a second part having a binding area; the second part includes a first boundary and a second boundary facing each other, the first boundary being connected to the first part; The protective film is pasted onto the back side, and the protective film is half-cut to form a first sub-protective film and a second sub-protective film. The orthographic projection of the second sub-protective film on the display panel is located within the bonding area. The second sub-protective film includes a second side surface near the first boundary and a third side surface away from the first boundary. Connect the flexible circuit board to the bonding area of ​​the second part; A protective layer is formed, which covers the side of the flexible circuit board near the display panel, covers the connection between the flexible circuit board and the display panel, and covers the third side of the second sub-protective film and the side away from the display panel. Remove the first sub-protective film, and retain the second sub-protective film; A shim is provided on the back of the second part; along the direction opposite to the first boundary and the second boundary, the boundary of the shim is located inside the second boundary; the shim includes a first side surface near the second boundary, and the second side surface is in contact with the first side surface; the portion of the protective layer covering the side of the second sub-protective film away from the display panel has a gap with the first side surface; The second part is bent to the side close to the back of the first part.

5. The preparation method according to claim 4, characterized in that, Applying the protective film to the back side includes: A back film is provided, the back film comprising a first protective film, a first adhesive layer, a second adhesive layer, a first support layer, a second support layer, and a second protective film; Remove the first protective film and stick the remaining portion onto the back side; the second protective film is the protective film.

6. The preparation method according to claim 4, characterized in that, After attaching the protective film to the back side, the preparation method further includes: The display panel, the first sub-protective film, and the second sub-protective film are cut; The second part includes a first boundary and a second boundary that are disposed opposite to each other, and the first boundary is connected to the first part; The second sub-protective film includes a third boundary away from the first boundary, and the third boundary is flush with the second boundary along the direction opposite to the first boundary and the second boundary.

7. A display device, characterized in that, include: The display module as described in any one of claims 1 to 3; The controller is electrically connected to the display module.

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