Semiconductor cleaning carrier and semiconductor cleaning equipment

By designing a movable liquid contact tray in the semiconductor cleaning equipment to collect dripping cleaning liquid, the problem of cleaning liquid dropping damage to the cleaning tank shell is solved, and the service life of the equipment is improved.

CN120341146APending Publication Date: 2025-07-18BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202410073078.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-01-18
Publication Date
2025-07-18

AI Technical Summary

Technical Problem

In semiconductor cleaning equipment, cleaning liquid drips on the flower basket and wafer, causing damage to the outer shell of the cleaning tank, shortening the service life of the equipment.

Method used

A semiconductor cleaning vehicle is designed, including a mount, a flower basket and a liquid-conjugation tray. The liquid-conjugation tray can be moved between the working position and the avoiding position to collect dripping cleaning liquid to prevent it from dripping on the outer shell of the cleaning tank.

Benefits of technology

Effectively prevent cleaning liquid from dripping from damaging the cleaning tank housing and extending the service life of the cleaning tank and equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a semiconductor cleaning carrier and semiconductor cleaning equipment, in the semiconductor cleaning carrier, a flower basket and a liquid receiving disc are both mounted on a mounting seat, the flower basket can move relative to the mounting seat in the vertical direction, the liquid receiving disc has a working position and an avoiding position, and the working position and the avoiding position are arranged on the mounting seat. The liquid receiving disc can move between a working position and the avoiding position relative to the mounting seat; under the condition that the liquid receiving tray is located at the working position, the liquid receiving tray is located below the flower basket; under the condition that the liquid receiving disc is located at the avoiding position, the liquid receiving disc is located on the outer side of the flower basket in the vertical direction so as to avoid the lifting path of the flower basket. The semiconductor cleaning carrier can solve the problems that in the working process of existing semiconductor cleaning equipment, cleaning liquid drops on a shell of a cleaning tank, then the shell of the cleaning tank is damaged, and the overall service life of the semiconductor cleaning equipment is shortened.
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Description

Technical Field

[0001] This application belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor cleaning carrier and a semiconductor cleaning device. Background Art

[0002] In the process of semiconductor processing, cleaning is an important step to remove impurities such as dust, metal, organic matter, and oxide layer on the wafer surface to ensure a high cleanliness of the wafer. In the current technology, a tank-type cleaning device is usually used to perform the cleaning process on the wafer. The tank-type cleaning device usually includes multiple cleaning tanks, and cleaning liquids are added to each cleaning tank according to actual needs. At the same time, devices such as manipulators can be used to soak and clean carriers such as flower baskets that can accommodate wafers in the corresponding cleaning tanks to complete the cleaning process of the wafers.

[0003] In the process of cleaning the wafer using the above cleaning process, the manipulator needs to drive the flower basket to switch between different cleaning tanks. Since most cleaning liquids are acidic, alkaline, or corrosive, when the manipulator drives the flower basket to move between different cleaning tanks, it is inevitable that the cleaning liquid adhering to the flower basket and the wafer will drip under the action of its own gravity. This can easily cause different types of cleaning liquid to drip on the outer shell of the cleaning tank, thereby damaging the outer shell of the cleaning tank and shortening the overall service life of the semiconductor cleaning device. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a semiconductor cleaning carrier and a semiconductor cleaning device to solve the problem that during the operation of current semiconductor cleaning devices, cleaning liquid drips on the outer shell of the cleaning tank, thereby damaging the outer shell of the cleaning tank and shortening the overall service life of the semiconductor cleaning device.

[0005] In a first aspect, the embodiments of this application disclose a semiconductor cleaning carrier, which includes a mounting base, a flower basket, and a liquid receiving tray. The flower basket and the liquid receiving tray are both mounted on the mounting base, and the flower basket can move relative to the mounting base in the vertical direction. The liquid receiving tray has a working position and an avoidance position, and the liquid receiving tray can move relative to the mounting base between the working position and the avoidance position;

[0006] When the liquid receiving tray is in the working position, the liquid receiving tray is located below the flower basket; when the liquid receiving tray is in the avoidance position, in the vertical direction, the liquid receiving tray is located outside the flower basket to avoid the lifting path of the flower basket.

[0007] Second aspect, an embodiment of the present application discloses a semiconductor cleaning device, which includes a cleaning tank, a third driving mechanism, and the above-mentioned semiconductor cleaning carrier. It is characterized in that the number of the cleaning tanks is multiple, and the multiple cleaning tanks are distributed along the driving direction of the third driving mechanism. The mounting seat of the semiconductor cleaning carrier is mounted on the third driving mechanism, and the third driving mechanism is used to drive the semiconductor cleaning carrier to move along the distribution direction of the multiple cleaning tanks.

[0008] An embodiment of the present application discloses a semiconductor cleaning carrier, the flower basket and the liquid receiving tray of which are both mounted on the mounting seat. Therefore, when the mounting seat moves, it can drive the liquid receiving tray and the flower basket to move synchronously. At the same time, the flower basket can move relative to the mounting seat in the vertical direction to ensure that the flower basket can be immersed in the cleaning tank and lifted out of the cleaning tank. The liquid receiving tray can move relative to the mounting seat between the working position and the avoiding position. And when the liquid receiving tray is in the working position, the liquid receiving tray is located below the flower basket, so that the liquid receiving tray can collect the cleaning liquid dripping from the flower basket, preventing the cleaning liquid from dripping onto positions such as the outer shell of the cleaning tank and damaging the outer shell of the cleaning tank. This can improve the service life of the cleaning tank and further improve the service life of the entire semiconductor cleaning device. In the case where the liquid receiving tray is in the avoiding position, along the vertical direction, the liquid receiving tray is located outside the flower basket, so that the liquid receiving tray can avoid the lifting path of the flower basket and prevent the liquid receiving tray from interfering with the normal lifting operation of the flower basket. Description of the Drawings

[0009] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0010] Figure 1 is a schematic structural diagram of the semiconductor cleaning carrier disclosed in the embodiment of the present application;

[0011] Figure 2 is a schematic structural diagram of the semiconductor cleaning carrier disclosed in the embodiment of the present application in another direction;

[0012] Figure 3 is an enlarged schematic diagram of a part of the semiconductor cleaning carrier disclosed in the embodiment of the present application;

[0013] Figure 4 is another schematic structural diagram of the second driving component in the semiconductor cleaning carrier disclosed in the embodiment of the present application;

[0014] Figure 5 is a schematic state diagram of the semiconductor cleaning device disclosed in the embodiment of the present application;

[0015] Figure 6Another state schematic diagram of the semiconductor cleaning equipment disclosed in the embodiments of the present application.

[0016] Reference numerals:

[0017] 1 - mounting seat, 2 - second driving mechanism, 3 - liquid receiving tray, 4 - connecting block, 5 - fixing frame, 6 - base, 7 - synchronous belt, 8 - rotating motor, 9 - flange, 11 - guiding shaft, 12 - guiding seat, 14 - bearing seat, 15 - linkage member, 16 - first synchronous pulley, 17 - second synchronous pulley, 18 - second in-place detection component, 19 - photoelectric sensor, 20 - baffle

[0018] 30 - cleaning tank

[0019] 40 - wafer cassette Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0021] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order different from those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0022] As Figures 1 - 4 shown, the embodiments of the present application disclose a semiconductor cleaning carrier, and the semiconductor cleaning carrier disclosed in the embodiments of the present application can be applied to a semiconductor cleaning equipment to accommodate wafers to be cleaned by the semiconductor cleaning carrier, and the semiconductor cleaning carrier can drive the wafers to move up and down. As Figure 1 and Figure 2 shown, the semiconductor cleaning carrier disclosed in the embodiments of the present application includes a mounting seat 1, a wafer cassette 40 and a liquid receiving tray 3. Of course, the semiconductor cleaning carrier may further include a first driving mechanism to automatically drive the wafer cassette 40 to move up and down relative to the cleaning tank, so as to improve the control accuracy of the wafer cassette 40 and reduce the labor intensity of workers.

[0023] Among them, the mounting base 1 is the basic structure in the semiconductor cleaning carrier. It can serve as the mounting foundation for other components in the semiconductor cleaning carrier. Moreover, when the semiconductor cleaning carrier is applied to a semiconductor cleaning device, the mounting base 1 can also be connected to the corresponding components in the semiconductor cleaning device, enabling the semiconductor cleaning carrier to form a corresponding assembly relationship with other components in the semiconductor cleaning device. The specific shape, size, and other parameters of the mounting base 1 can be flexibly determined according to actual needs. Of course, the mounting base 1 can also have other functions. For example, a control device of the semiconductor cleaning carrier can be provided in the mounting base 1, so as to control components such as the first driving mechanism in the semiconductor cleaning carrier. This is not limited in this article.

[0024] The first driving mechanism is used to provide a driving effect, so that the components connected to it can move along a preset direction. The carrier 40 is used to hold wafers. It can be provided with structures such as receiving grooves to use the receiving grooves to hold wafers and provide a certain limiting effect on the wafers to prevent the wafers from moving relative to the carrier 40 as much as possible during the cleaning process. Of course, by correspondingly designing the structure and size of the carrier 40, the carrier 40 can hold multiple wafers at the same time. The liquid receiving tray 3 is used to collect liquid. Specifically, the liquid receiving tray 3 is used to collect the cleaning liquid dripping from the carrier 40. Of course, when there is also cleaning liquid adhering to the first driving mechanism, the cleaning liquid dripping from the first driving mechanism can also be collected by the liquid receiving tray 3, thereby preventing the cleaning liquid adhering to the carrier 40 from dripping onto the outer shell of the cleaning tank 30 for holding the cleaning liquid and damaging the outer shell of the cleaning tank 30 when the semiconductor cleaning carrier moves between multiple cleaning tanks 30.

[0025] Specifically, both the carrier 40 and the liquid receiving tray 3 are mounted on the mounting base 1. Thus, when the mounting base 1 moves relative to multiple cleaning tanks 30, the carrier 40 and the liquid receiving tray 3 can move synchronously. At the same time, when the semiconductor cleaning carrier includes the first driving mechanism, the first driving mechanism can be directly mounted on the mounting base 1, and the carrier 40 is indirectly assembled with the mounting base 1 by being mounted on the first driving mechanism. Based on this, when both the liquid receiving tray 3 and the carrier 40 are mounted on the mounting base 1 and without considering the driving effect of mechanisms such as the aforementioned first driving mechanism, during the process of the mounting base 1 moving relative to a working surface such as the ground (or relative to the cleaning tank), the carrier 40 can remain relatively stationary with respect to the liquid receiving tray 3.

[0026] As described above, the first driving mechanism is used to provide a driving function. More specifically, the first driving mechanism can drive the flower basket 40 to move in the vertical direction, so that the flower basket 40 can move up and down, ensuring that the flower basket 40 can be immersed in the cleaning tank 30 and can be lifted from the cleaning tank 30. Specifically, the first driving mechanism can include driving devices such as linear motors, cylinders or hydraulic cylinders to ensure that the first driving mechanism can drive the flower basket 40 to move up and down in the vertical direction. Of course, the first driving mechanism can be provided with a mounting function by designing the structure of the mounting seat 1 accordingly, and / or by additionally providing other devices such as a cantilever structure, so as to ensure that the flower basket 40 basically located above the cleaning tank 30 can be driven by the first driving mechanism.

[0027] In order to ensure that the liquid receiving tray 3 can provide the function of collecting the dripping cleaning liquid while not hindering the normal lifting and lowering action of the flower basket 40, in the semiconductor cleaning carrier disclosed in the embodiment of the present application, the liquid receiving tray 3 has a working position and an escape position, and the liquid receiving tray 3 is movably connected to the mounting seat 1, so that the liquid receiving tray 3 can move between the working position and the escape position relative to the mounting seat 1. Specifically, the movable direction between the liquid receiving tray 3 and the mounting seat 1 can be a straight line direction or a curved direction, that is, the liquid receiving tray 3 can be installed on the mounting seat 1 in a sliding installation manner along a straight line, and can also be installed on the mounting seat 1 in a rotating installation manner. Of course, in other embodiments of the present application, other mechanisms and methods can also be used to form a movable matching relationship between the liquid receiving tray 3 and the mounting seat 1.

[0028] Based on the above, when the liquid receiving tray 3 is in the working position, the liquid receiving tray 3 is located below the flower basket 40, so that the liquid receiving tray 3 can collect the cleaning liquid dripping from the flower basket 40, and prevent the cleaning liquid from dripping on the outer shell of the cleaning tank 30. Of course, the liquid receiving tray 3 needs to be designed and processed accordingly according to the specific shapes and sizes of components such as the flower basket 40 and the first driving mechanism, so as to ensure that the liquid receiving tray 3 located below the flower basket 40 can reliably provide the function of collecting the cleaning liquid.

[0029] In more detail, by designing the size and shape of the liquid receiving tray 3, when the liquid receiving tray 3 is located below the flower basket 40, the projections of the flower basket 40 and the portion of the first driving mechanism to which the cleaning liquid may adhere on the horizontal plane can be located within the projection of the liquid receiving area of the liquid receiving tray 3, ensuring that the dripping liquid can basically be collected by the liquid receiving tray 3. Of course, the size of the liquid receiving tray 3 can be further increased without hindering other devices in the cleaning process to maximize the comprehensiveness of the liquid receiving tray 3.

[0030] Correspondingly, when the liquid receiving tray 3 is located at the avoidance position, the liquid receiving tray 3 needs to be located outside the flower basket 40 in the vertical direction to avoid the lifting path of the flower basket 40. In other words, when the liquid receiving tray 3 is located at the avoidance position, the part of the first driving mechanism that moves relative to the mounting seat 1 in the vertical direction and the projection of the flower basket 40 on the horizontal plane and the projection of the liquid receiving tray 3 do not interfere with each other, thereby preventing the liquid receiving tray 3 from hindering the normal lifting of the flower basket 40. Of course, as mentioned above, the liquid receiving tray 3 is movably connected with the mounting seat 1, and then the mechanism for providing a movable connection relationship between the two needs to be connected between the liquid receiving tray 3 and the mounting seat 1. Based on this, the structure of the aforementioned mechanism for providing a movable connection relationship can be designed to ensure that when the liquid receiving tray 3 is located at the avoidance position, the aforementioned mechanism for providing a movable connection relationship is also located outside the flower basket 40 in the vertical direction, thereby ensuring that it will not hinder the lifting of the flower basket 40.

[0031] The embodiment of the present application discloses a semiconductor cleaning carrier, wherein the flower basket 40 and the liquid receiving tray 3 are both mounted on the mounting seat 1, so that when the mounting seat 1 moves, the liquid receiving tray 3 and the flower basket 40 can be driven to move synchronously. At the same time, the flower basket 40 can move in the vertical direction relative to the mounting seat 1 to ensure that the flower basket 40 can be immersed in the cleaning tank 30 and raised from the cleaning tank 30. The liquid receiving tray 3 can move relative to the mounting seat 1 between the working position and the avoidance position, and when the liquid receiving tray 3 is in the working position, the liquid receiving tray 3 is located below the flower basket 40, so that the cleaning liquid dripping from the flower basket 40 can be collected by the liquid receiving tray 3 to prevent the cleaning liquid from dripping on the outer shell of the cleaning tank 30 and other positions, thereby damaging the outer shell of the cleaning tank 30, which can increase the service life of the cleaning tank 30, and further increase the service life of the entire semiconductor cleaning equipment. When the liquid receiving tray 3 is located at the avoidance position, the liquid receiving tray 3 is located outside the flower basket 40 in the vertical direction, so that the liquid receiving tray 3 can avoid the lifting path of the flower basket 40 to prevent the liquid receiving tray 3 from interfering with the normal lifting of the flower basket 40.

[0032] As described above, the liquid receiving tray 3 can be switched between the working position and the avoidance position relative to the mounting seat 1. Optionally, during the semiconductor cleaning process, the position of the liquid receiving tray 3 can be manually controlled, and when the flower basket 40 moves up and down, the liquid receiving tray 3 is located in the avoidance position. After the flower basket 40 is lifted out of the cleaning tank 30 and moved above the position of the liquid receiving tray 3, the liquid receiving tray 3 can be switched from the avoidance position to the working position to collect the cleaning liquid dripping from the flower basket 40.

[0033] In another embodiment of the present application, the semiconductor cleaning carrier may further include a second driving mechanism 2, the second driving mechanism 2 is mounted on the mounting seat 1, and the liquid receiving tray 3 is connected to the second driving mechanism 2, and the second driving mechanism 2 can be used to drive the liquid receiving tray 3 to switch between the working position and the avoidance position. That is, in the embodiment of the present application, the second driving mechanism 2 can be used to drive the liquid receiving tray 3 to switch between the working position and the avoidance position, thereby reducing the workload of the staff and improving the driving accuracy of the liquid receiving tray 3. In addition, in the embodiment of the present application, the second driving mechanism 2 and the first driving mechanism can be connected to a control mechanism or other device for providing a control function, so that the second driving mechanism 2 can be controlled accordingly according to the action of the first driving mechanism, and drive the liquid receiving tray 3 to switch to the working position (or avoidance position) to improve the fluency of the entire equipment, thereby improving the efficiency of the semiconductor cleaning work.

[0034] Among them, the type and structure of the second driving mechanism 2 can be determined according to the movement form of the liquid receiving plate 3. For example, the liquid receiving plate 3 can be rotatably mounted on the mounting seat 1, and during the reciprocating (or cyclic) rotation of the liquid receiving plate 3, the liquid receiving plate 3 can be switched between the working position and the avoidance position. In this case, the second driving mechanism 2 can include a device such as a rotary motor 8 that can provide a rotational drive action. Of course, in this case, the second driving mechanism 2 can also include a linear drive device and a transmission member, and the linear drive action of the linear drive device is converted into a rotational drive action by the transmission member. In addition, as described above, the semiconductor cleaning carrier can include a first driving mechanism. In this case, the first driving mechanism and the second driving mechanism 2 can be two independent devices. In another embodiment of the present application, the first driving mechanism and the second driving mechanism can also be different parts of the same driving device, and the two can be used to provide driving actions in different directions.

[0035] In order to minimize the movement amplitude of the liquid receiving plate 3 when switching between the working position and the avoidance position, and reduce the required activity space, in another embodiment of the present application, the driving component of the second driving mechanism 2 is used to drive the liquid receiving plate 3 to move linearly, so that the liquid receiving plate 3 switches between the working position and the avoidance position. In detail, the second driving mechanism 2 may include a driving component, and the driving component may be installed on the mounting seat 1. Furthermore, the second driving mechanism 2 may also include a base 6, and the base 6 is installed on the mounting seat 1. The two can form a detachable fixed connection relationship through a detachable connecting member such as a screw. By further setting the base 6, the installation difficulty of some devices in the semiconductor cleaning carrier can be relatively low. Based on the above situation, the base 6 can be used as a mechanism for installing the driving component to reduce the installation difficulty of the driving component. The base 6 can be formed of a material with relatively large structural strength such as metal. The shape and size of the base 6 can be flexibly selected according to actual conditions, and this article does not limit this. In addition, in the following text, the device that can be mounted on the base 6 is indirectly mounted on the mounting base 1 , and thus, the device mounted on the base 6 is actually also mounted on the mounting base 1 .

[0036] During the assembly of the second driving mechanism 2, the driving assembly can be mounted on the base 6, and the driving assembly can be connected to the liquid receiving tray 3, so that the driving assembly can drive the liquid receiving tray 3 to move relative to the base 6, and the liquid receiving tray 3 can be switched between the working position and the avoidance position. Figure 4 As shown, the driving assembly may include devices such as a linear motor, a linear cylinder or a hydraulic cylinder. By fixing the liquid receiving tray 3 to the driving head of the driving assembly and installing the driving seat of the driving assembly on the base 6, when the driving head moves linearly relative to the driving seat, the liquid receiving tray 3 can move linearly relative to the base 6. Of course, in the process of arranging the above-mentioned driving assembly, it is necessary to make the driving direction of the driving assembly parallel to the moving direction of the liquid receiving tray 3 to ensure that the liquid receiving tray 3 can be reliably and accurately switched between the working position and the avoidance position.

[0037] In another embodiment of the present application, in order to improve the movement stability of the liquid receiving tray 3, as shown in FIG. Figures 1 - 3 As shown, optionally, the driving assembly includes a rotary motor 8 and a transmission mechanism, and the rotary motor 8 is installed on the base 6, and the rotary motor 8 is connected to the liquid receiving tray 3 through the transmission mechanism, so as to utilize the transmission function of the transmission mechanism to convert the rotary driving action of the rotary motor 8 into a linear driving action, thereby driving the liquid receiving tray 3 to perform linear motion relative to the base 6, and enabling the liquid receiving tray 3 to switch between the working position and the avoidance position. More specifically, the rotary motor 8 can be installed on the base 6 using a flange 9.

[0038] Specifically, the rotary electric machine 8 can be fixedly installed on the base 6 through connecting members such as bolts. Correspondingly, at least a part of the transmission assembly can also be installed on the base 6 to ensure the normal operation of the transmission assembly. The transmission assembly is used to convert the rotary driving action into a linear driving action. For this purpose, the transmission assembly can include a gear and a rack. The gear is installed on the rotating shaft of the rotary electric machine 8, and the rack is fixedly connected to the liquid receiving tray 3. Under the action of the mutually meshing gear and rack, the liquid receiving tray 3 can be driven by the rotary electric machine 8 and move linearly. Moreover, when the transmission assembly adopts the above technical solution, by rotating the rotary electric machine 8 clockwise or counterclockwise correspondingly, it can be ensured that the rotary electric machine 8 can drive the liquid receiving tray 3 to move from the working position to the avoiding position and can move from the avoiding position to the working position.

[0039] In another embodiment of the present application, as Figures 1 - 3 shown, the transmission mechanism includes a timing belt 7, a first synchronous pulley 16, and a second synchronous pulley 17. Generally speaking, the timing belt 7 is a belt with a tooth-shaped structure on its inner surface. Correspondingly, the outer surfaces of the first synchronous pulley 16 and the second synchronous pulley 17 are each provided with a corresponding tooth-shaped structure, and the timing belt 7 is sleeved outside the first synchronous pulley 16 and the second synchronous pulley 17, so that the first synchronous pulley 16 and the second synchronous pulley 17 can form a synchronous rotation relationship through the timing belt 7. Correspondingly, during the rotation of the first synchronous pulley 16 and the second synchronous pulley 17, any position on the timing belt 7 can also move relative to the base 6, and the moving direction of the aforementioned position is related to the installation positions of the first synchronous pulley 16 and the second synchronous pulley 17.

[0040] More specifically, the first synchronous pulley 16 is connected to the rotary electric machine 8, so that during the rotation of the rotary electric machine 8, the first synchronous pulley 16 can be driven to rotate together. The second synchronous pulley 17 is rotatably connected to the mounting base 1. Specifically, as described above, the second driving mechanism 2 can include a base 6 installed on the mounting base 1. For this purpose, the base 6 can be used as the installation basis for the second synchronous pulley 17. Moreover, in order to further reduce the installation difficulty, a fixing frame 5 can be provided on the base 6, and the second synchronous pulley 17 is directly rotatably installed on the fixing frame 5, which can ensure that the second synchronous pulley 17 can form an indirect rotational connection relationship with the mounting base 1. At the same time, the timing belt 7 is fixedly connected to the liquid receiving tray 3. In this case, by making the distribution directions of the first synchronous pulley 16 and the second synchronous pulley 17 parallel to the moving direction of the liquid receiving tray 3 and correspondingly designing the position on the timing belt 7 that is fixedly connected to the liquid receiving tray 3, it can be ensured that when the rotary electric machine 8 is working, the liquid receiving tray 3 can be driven by the timing belt 7 to move linearly relative to the base 6 and the liquid receiving tray 3 can be switched between the working position and the avoiding position. When the above technical solution is adopted, the transmission connection stability between the liquid receiving tray 3 and the rotary electric machine 8 is relatively higher, and the driving stability of the liquid receiving tray 3 can be further improved.

[0041] As described above, the liquid receiving tray 3 can be fixedly connected to the synchronous belt 7. Optionally, through connecting members such as adhesives or bolts, the synchronous belt 7 can be fixed on the liquid receiving tray 3, so that the liquid receiving tray 3 can be driven by the synchronous belt 7. In another embodiment of the present application, the transmission mechanism may further include a linkage member 15, and the synchronous belt 7 can be fixedly connected to the liquid receiving tray 3 through the linkage member 15. Specifically, the above-mentioned tooth-shaped structure may also be provided on the linkage member 15, and the linkage member 15 can be buckled on the inner surface of the synchronous belt 7. At the same time, connecting members such as bolts can be used to fixedly connect the linkage member 15 to the liquid receiving tray 3.

[0042] Specifically, the bolt can pass through the linkage member 15 and the synchronous belt 7, and the bolt is detachably fixedly connected to the liquid receiving tray 3. On the one hand, it ensures that a relatively stable fixed connection relationship can be formed between the synchronous belt 7 and the liquid receiving tray 3. On the other hand, it also enables the liquid receiving tray 3 to be detached from the transmission mechanism. Thus, when the amount of cleaning liquid collected in the liquid receiving tray 3 reaches a preset value, the liquid receiving tray 3 can be detached to pour out the cleaning liquid in the liquid receiving tray 3. Or, during the cleaning and maintenance of the semiconductor cleaning equipment, the liquid receiving tray 3 is detached and the cleaning liquid collected by the liquid receiving tray 3 is poured out. To further reduce the connection difficulty between the synchronous belt 7 and the liquid receiving tray 3, a connection block 4 can be provided on the liquid receiving tray 3, and at least a part of the connection block 4 extends below the liquid receiving tray 3. In this case, the entire liquid receiving tray 3 can be located above the synchronous belt 7, and the connection block 4 is fixedly connected to the linkage member 15. The connection block 4 and the liquid receiving tray 3 can be formed by integral molding or other means to ensure a good fixed connection relationship between the two.

[0043] To further improve the movement stability of the liquid receiving tray 3, in the embodiment of the present application, the second driving mechanism 2 may further include a guiding component. The guiding component may include a guiding shaft 11 and a guiding seat 12. The guiding shaft 11 is installed on the base 6, and the guiding seat 12 is slidably installed on the guiding shaft 11. By fixedly connecting the liquid receiving tray 3 to the guiding seat 12, the guiding shaft 11 can provide a guiding function for the liquid receiving tray 3 and can limit the movement of the liquid receiving tray 3 relative to the base 6 in a direction other than the axial direction of the guiding shaft 11, which can further improve the movement accuracy of the liquid receiving tray 3.

[0044] Specifically, the guide seat 12 is slidably mounted on the guide shaft 11. In order to further enhance the guiding and limiting effects provided by the guide assembly, in another embodiment of the present application, the guide seat 12 can be sleeved outside the guide shaft 11, and the guide seat 12 and the guide shaft 11 are mutually limited in a direction perpendicular to the guide shaft 11. In this case, the matching accuracy between the guide shaft 11 and the guide seat 12 is relatively higher, thereby further enhancing the accuracy of the linear relative motion between the liquid receiving tray 3 and the base 6. More specifically, the guide shaft 11 can be a circular rod-shaped structure, and the guide shaft 11 can be mounted on the base 6 through a bearing seat 14 and other devices, and the guide seat 12 can be connected to the liquid receiving tray 3 through a connecting member such as a screw. Of course, in order to ensure that the aforementioned screw does not affect the accommodating effect of the liquid receiving tray 3, a connecting structure can be provided on one side of the liquid receiving tray 3, and the aforementioned connecting structure is separated from the accommodating cavity of the liquid receiving tray 3.

[0045] When a guide assembly is provided, the guide shaft 11 and the transmission mechanism can be arranged side by side. Specifically, the extension direction of the guide shaft 11 can be parallel to the linear driving direction of the transmission mechanism. In this case, the installation stability of the liquid receiving tray 3 can be further improved.

[0046] As described above, the liquid receiving tray 3 can move relative to the mounting seat 1 to switch between the working position and the avoidance position, and the movement of the liquid receiving tray 3 can be rotation or linear movement. In the case where the liquid receiving tray 3 uses a linear movement to avoid the flower basket 40, the moving direction of the liquid receiving tray 3 can be set to be inclined with respect to the driving direction of the first driving mechanism, that is, the moving direction of the liquid receiving tray 3 has a component perpendicular to the driving direction of the first driving mechanism, thereby ensuring that the liquid receiving tray 3 can avoid the flower basket 40.

[0047] In order to improve the avoidance efficiency of the liquid receiving tray 3, in a specific embodiment of the present application, the moving direction of the liquid receiving tray 3 when switching between the working position and the avoidance position can be perpendicular to the driving direction of the first driving mechanism. For example, the moving direction of the liquid receiving tray 3 can be parallel to the movable direction of the mounting seat 1. In this case, the liquid receiving tray 3 can be guaranteed to have a high avoidance efficiency.

[0048] As described above, in the semiconductor cleaning equipment, a plurality of cleaning tanks 30 may be provided, and the plurality of cleaning tanks 30 are distributed along a certain horizontal straight line direction, and during the cleaning process, the mounting seat 1 drives the first driving mechanism, the flower basket 40 and the liquid receiving tray 3 to move relative to the plurality of cleaning tanks 30. In other words, the mounting seat 1 can drive the flower basket 40 to move along the distribution direction of the plurality of cleaning tanks 30, and the distribution direction of the plurality of cleaning tanks 30 is also perpendicular to the driving direction of the first driving mechanism. On this basis, the moving direction of the liquid receiving tray 3 can be perpendicular to the driving direction of the first driving mechanism, and the moving direction of the liquid receiving tray 3 can also be perpendicular to the distribution direction of the plurality of cleaning tanks 30. That is, any two of the moving direction of the liquid receiving tray 3, the driving direction of the first driving mechanism and the distribution direction of the plurality of cleaning tanks 30 are perpendicular to each other, which can further improve the matching reliability between the flower basket 40 and the liquid receiving tray 3, and improve the movement efficiency of each component during the cleaning process.

[0049] As described above, during the operation of the semiconductor cleaning carrier, the position of the liquid receiving tray 3 needs to be controlled according to the position of the flower basket 40, and the liquid receiving tray 3 needs to be switched between the working position and the avoidance position. In order to further improve the position control accuracy of the liquid receiving tray 3, in the embodiment of the present application, the semiconductor cleaning carrier also includes a first in-place detection component, which is arranged on the mounting seat 1, and when the liquid receiving tray 3 is in the working position, the first in-place detection component is used to send an in-place signal, so that the staff and / or the control device can obtain the information that the liquid receiving tray 3 has accurately reached the working position, and then the flower basket 40 is correspondingly controlled to move between different cleaning tanks 30, which can further prevent the situation that the liquid receiving tray 3 does not accurately reach the working position during the movement of the flower basket 40, and thus prevent the cleaning liquid dripping from the flower basket 40 from adhering to the outer shell of the cleaning tank 30.

[0050] Based on the above embodiment, in another embodiment of the present application, a second in-place detection component 18 may be provided together or separately, and the second in-place detection component 18 may be provided on the mounting seat 1. When the liquid receiving tray 3 is located at the avoidance position, the second in-place detection component 18 is used to send an in-place signal, so that the staff and / or the control device can obtain the information that the liquid receiving tray 3 has accurately reached the avoidance position. After that, the flower basket 40 is driven to rise and fall by the first driving mechanism to prevent the flower basket 40 from interfering with the liquid receiving tray 3 during the lifting process, thereby improving the independence of the movements of various components in the semiconductor cleaning carrier and improving the reliability of the cleaning work.

[0051] In addition, in the above embodiments, the semiconductor cleaning carrier may include a base 6 to reduce the installation difficulty of multiple components in the semiconductor cleaning carrier. Based on this, when the semiconductor cleaning carrier includes a first in-place detection component and a second in-place detection component 18, the first in-place detection component and / or the second in-place detection component 18 may also be installed on the base 6 according to the actual situation, thereby reducing the installation difficulty of the two components.

[0052] Among them, the types of the first in-place detection component and the second in-place detection component 18 may be the same or different, which is not limited herein. For example, the first in-place detection component and the second in-place detection component 18 may include microswitches, and by installing the two at corresponding positions, when the liquid receiving tray 3 moves to the corresponding positions (including the working position and the avoidance position), the microswitches can be triggered by squeezing the microswitches, and then the microswitches can send out corresponding in-place signals.

[0053] In another embodiment of the present application, both the first in-place detection component and the second in-place detection component 18 may include a photoelectric sensor 19 and a baffle 20. In the case of using this detection device, the detection accuracy can be improved. Among them, the photoelectric sensor 19 includes a transmitting part and a receiving part, the transmitting part and the receiving part are arranged oppositely, and the baffle 20 is installed at a corresponding position on the liquid receiving tray 3 so that when the liquid receiving tray 3 moves to the working position (and the avoidance position), the baffle 20 can block the detection path between the receiving part and the transmitting part of the photoelectric sensor 19, resulting in the receiving part being unable to receive the signal normally. In this case, the receiving part can send out an in-place signal, enabling the staff and / or the control device to obtain the in-place information of the liquid receiving tray 3.

[0054] Based on the semiconductor cleaning carrier disclosed in any of the above embodiments, an embodiment of the present application further discloses a semiconductor cleaning device, which includes a cleaning tank 30, a third driving mechanism, and any of the above semiconductor cleaning carriers. Among them, in order to ensure relatively good cleaning effect, the number of cleaning tanks 30 can usually be multiple, and the multiple cleaning tanks 30 are distributed along the driving direction of the third driving mechanism, so as to provide corresponding cleaning effects on the wafers to be cleaned by the multiple cleaning tanks 30 respectively during the cleaning operation. For this purpose, the mounting seat 1 of the semiconductor cleaning carrier is installed on the third driving mechanism, so as to drive the semiconductor cleaning carrier to move along the distribution direction of the multiple cleaning tanks 30 by the third driving mechanism, thereby ensuring that the cassette 40 for accommodating wafers in the semiconductor cleaning carrier can be switched between the multiple cleaning tanks 30. It should be noted that in the embodiment of the present application, the driving direction of the third driving mechanism (that is, the distribution direction of the multiple cleaning tanks 30) extends along a certain horizontal direction, that is, the driving direction of the third driving mechanism is perpendicular to the driving direction of the first driving mechanism, which makes the layout difficulty of the multiple cleaning tanks 30 relatively low, and can improve the cleaning efficiency of the cleaning operation. Of course, the specific number, shape, etc. of the cleaning tanks 30 can all be flexibly determined according to the actual situation, and this is not limited herein.

[0055] In addition, similar to the second driving mechanism 2, the third driving mechanism can also be independent of the first driving mechanism and the second driving mechanism 2, or the three can be different parts of the same driving device, and the three are respectively used to provide driving effects in different directions.

[0056] Furthermore, when the driving direction of the third driving mechanism is perpendicular to the driving direction of the first driving mechanism, the driving direction of the third driving mechanism and the driving direction of the first driving mechanism can both be perpendicular to the moving direction of the liquid receiving tray 3 between the working position and the avoiding position. That is, among the driving direction of the first driving mechanism, the driving direction of the third driving mechanism, and the moving direction of the liquid receiving tray 3, any two are perpendicular to each other. In the case of adopting this technical solution, the distinction degree between the moving paths of the components in the semiconductor cleaning device is relatively high, and it is convenient to arrange the positions of the devices, improving the overall working efficiency and reliability of the semiconductor cleaning device. More intuitively, the driving direction of the first driving mechanism can be Figure 5 and Figure 6 the direction Y in Figure 2 and the driving direction of the third driving mechanism can be Figure 5 and Figure 6 the direction X in

[0057] It should be noted that in this text, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also other elements not explicitly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or device comprising that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0058] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A semiconductor cleaning carrier, characterized in that, It includes a mounting base, a flower basket and a liquid receiving tray. The flower basket and the liquid receiving tray are both mounted on the mounting base, and the flower basket can move relative to the mounting base in the vertical direction. The liquid receiving tray has a working position and an avoidance position, and the liquid receiving tray can move relative to the mounting base between the working position and the avoidance position; When the liquid receiving tray is in the working position, the liquid receiving tray is located below the flower basket; when the liquid receiving tray is in the avoidance position, in the vertical direction, the liquid receiving tray is located outside the flower basket to avoid the lifting path of the flower basket.

2. The semiconductor cleaning carrier according to claim 1, wherein It further includes a second driving mechanism. The second driving mechanism is mounted on the mounting base, and the liquid receiving tray is connected to the second driving mechanism. The second driving mechanism can drive the liquid receiving tray to switch between the working position and the avoidance position.

3. The semiconductor cleaning carrier according to claim 2, wherein, The second driving mechanism includes a driving component. The driving component is mounted on the mounting base, and the driving component is in transmission connection with the liquid receiving tray and drives the liquid receiving tray to move linearly to switch between the working position and the avoidance position.

4. The semiconductor cleaning carrier according to claim 3, wherein, The driving component includes a rotary motor and a transmission mechanism. The rotary motor is mounted on the mounting base, and the rotary motor is in transmission connection with the liquid receiving tray through the transmission mechanism to drive the liquid receiving tray to move linearly.

5. The semiconductor cleaning carrier according to claim 4, wherein, The transmission mechanism includes a synchronous belt, a first synchronous pulley and a second synchronous pulley. The first synchronous pulley is connected to the rotary motor, the second synchronous pulley is rotatably connected to the mounting base, the synchronous belt is sleeved outside the first synchronous pulley and the second synchronous pulley, and the synchronous belt is fixedly connected to the liquid receiving tray.

6. The semiconductor cleaning carrier according to claim 3, wherein, The second driving mechanism further includes a guiding component. The guiding component includes a guiding shaft and a guiding seat. The guiding shaft is mounted on the mounting base, and the guiding seat is slidably mounted on the guiding shaft, and the liquid receiving tray is fixedly connected to the guiding seat.

7. The semiconductor cleaning carrier according to claim 1, wherein, The moving direction of the liquid receiving tray is perpendicular to the driving direction of the flower basket.

8. The semiconductor cleaning carrier according to claim 1, wherein, It further includes a first in-place detection component. The first in-place detection component is arranged on the mounting base, and when the liquid receiving tray is in the working position, the first in-place detection component is used to send an in-place signal; and / or it further includes a second in-place detection component. The second in-place detection component is arranged on the mounting base, and when the liquid receiving tray is in the avoidance position, the second in-place detection component is used to send an in-place signal.

9. A semiconductor cleaning device, characterized in that, It includes a cleaning tank, a third driving mechanism and the semiconductor cleaning carrier according to any one of claims 1-8. It is characterized in that the number of the cleaning tanks is multiple, and the multiple cleaning tanks are distributed along the driving direction of the third driving mechanism. The mounting base of the semiconductor cleaning carrier is mounted on the third driving mechanism, and the third driving mechanism is used to drive the semiconductor cleaning carrier to move along the distribution direction of the multiple cleaning tanks.

10. The semiconductor cleaning equipment according to claim 9, wherein, The driving direction of the third driving mechanism is perpendicular to the moving direction of the liquid receiving tray between the working position and the avoidance position, and both are perpendicular to the vertical direction.