Cooling device

Abstract

The invention relates to a cooling device (1) for cooling a component (2), comprising a base element (4), which has a first surface (5) and has a cooling structure, which has a cooling element (6), which is arranged on the base element (4) in a manner protruding from the first surface (5). The cooling element (6) is made of a sintered material and is produced by molding of the material of the base element (4). The base element (4) has an element height (10) of at most 3 mm, in particular between 1 mm and 2.5 mm.

Description

Technical Field

[0001] The present invention relates to a cooling device for a cooling component, the cooling device including a base element having a first surface and a cooling structure having cooling elements, the cooling structure being provided on the base element in a manner protruding from the first surface.

[0002] Furthermore, the present invention relates to a method for manufacturing a cooling device, the method including the steps of providing a material and constructing a cooling structure from the material. Background Art

[0003] So-called power electronic components, such as power semiconductors, are well known from the prior art. Such components are often used, for example, also in motor vehicles. It is also known that these components generate a large amount of heat during operation that usually has to be dissipated by means of a cooling medium. For this purpose, very different coolers are known in the prior art. Additionally, so-called pin-fin cooling bodies are also known, which are surrounded and flushed by a cooling medium and thus transfer heat from the pins to the cooling medium. For example, DE102019108106A1 describes a cooler for power semiconductors in an inverter. The cooler is designed in two parts and includes: a bottom plate as a first part, which is thermally conductively attached to the power semiconductor; a cooling body as a second part, which is provided on the bottom plate. The cooling body has at least one corrugated void portion that is continuously constructed from the side of the cooling body facing away from the bottom plate to the side facing the cooling body. The first part and the second part are connected to each other and are coated with a layer that protects the two parts from electrochemical reduction.

[0004] DE102018216859A1 discloses a device for cooling a component, the device having: a first base body and a second base body; columnar and / or conical first cooling ribs constructed in the first base body, which can be circulated by a coolant; and columnar and / or conical second cooling ribs constructed in the second base body, which can be circulated by a coolant. The second base body is joined to the first base body such that the second cooling ribs are located between the first cooling ribs without contacting the first base body. Summary of the Invention

[0005] The object of the present invention is to provide a cooling device for a component with improved cooling power.

[0006] The task of the present invention is solved in the cooling device mentioned at the beginning by the fact that the base element has an element thickness of at most 3 mm, in particular between 1 mm and 2.5 mm.

[0007] Furthermore, the object of the present invention is solved by the method mentioned at the beginning, according to which sintered powder is used as the material, a green body is manufactured from the sintered powder by pressing, the green body is sintered to form a shaped body, and the cooling structure in the form of a cooling element is manufactured from the shaped body by shaping. For this purpose, a part of the shaped body is pressed by a shaping die, the base element is formed from the shaped body, the cooling element is constructed on the base element, and the base element is manufactured with an element height of at most 3 mm, in particular 1 mm to 2.5 mm.

[0008] It is advantageous here that, compared with known cooling devices, the small element thickness (which can also be referred to as the element height) of the base element can improve heat exchange through a smaller thermal resistance. Such a small plate thickness cannot be manufactured using traditional processes or can only be manufactured at great expense because traditional processes use cutting methods. However, for cutting, the cooling plate must have a certain minimum thickness in order to be able to be cut. On the other hand, the materials used in traditional methods have a higher stiffness compared to sintered materials of the same composition, which has a counter-effect on shaping. These limitations can be avoided using the method according to the invention, and in this way, a cooling device with a base element having a smaller element thickness can also be manufactured. It is also advantageous that, by shaping the base element into a cooling element, no waste is produced during the manufacture of the cooling element, as is the case, for example, during machining. In addition, all the cooling elements of the cooling device can be manufactured simultaneously, whereby a corresponding increase in productivity can be achieved.

[0009] According to an implementation variant of the present invention, in order to increase the flexural strength of the base element, at least one reinforcing element can be provided. The reinforcing element is preferably arranged on the first surface of the base element, and the cooling element is also located on the first surface. Thereby, an additional effect can be achieved such that the cooling performance of the cooling device can be further improved using the reinforcing element.

[0010] Preferably, according to an implementation variant of the present invention, the at least one reinforcing element is rib-shaped or is constructed in such a way that the cooling agent flowing around the cooling element can flow through the reinforcing element better.

[0011] In order to be able to achieve a cooling structure constructed by the cooling element that is as little affected as possible, according to another implementation variant of the present invention, it can be stipulated that the reinforcing element is arranged around the perimeter of the base element. Here, the circumferential arrangement may also cause vortices in the cooling fluid, whereby the cooling power of the cooling device can be improved.

[0012] According to another variant implementation variant of the present invention, it can also be stipulated that the reinforcing element is arranged between the cooling elements, whereby the proportion of heat conducted through the reinforcing element can be increased.

[0013] In order to influence the flow characteristics of the cooling fluid flowing between the cooling elements and thus also to influence the heat transfer, according to an embodiment variant of the present invention, it can be provided that the reinforcing element is configured or constructed in a wavy shape.

[0014] Here, according to an embodiment variant, it can be provided that a plurality of wavy reinforcing elements form the cooling element, whereby the manufacture of the cooling device can be simplified.

[0015] According to another embodiment variant of the present invention, it can be provided that the reinforcing element has a height between 20% and 100% of the maximum height corresponding to the same direction along the cooling element. Thus, the forming of the cooling element or other non-cutting machining that may be carried out, such as compression, can be simplified.

[0016] Like the cooling element, according to an embodiment variant of the present invention, the at least one reinforcing element is preferably also made of sintered material and is manufactured by forming the material of the base element, in particular constructed on the base element by forming the green body according to an embodiment variant of the method. Thus, the advantages mentioned for the cooling element can be achieved.

[0017] In order to improve the flow characteristics of the cooling device and thus for improved heat transfer, according to an embodiment variant of the present invention, it can be provided that the reinforcing element is arranged along the flow direction of the cooling fluid through the cooling device with a longitudinal extension dimension. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] For a better understanding of the present invention, the present invention will be explained in detail with the aid of the following drawings.

[0019] In strongly simplified schematic diagrams respectively:

[0020] Figure 1 A side view of a cooling device having a component to be cooled is shown;

[0021] Figure 2 An axonometric view of the cooling device is shown;

[0022] Figure 3 A side view of an embodiment variant of the cooling device is shown;

[0023] Figure 4 A partial top view of another embodiment variant of the cooling device is shown;

[0024] Figure 5 A partial top view of another embodiment variant of the cooling device is shown;

[0025] Figure 6Shows an implementation variant of the parison;

[0026] Figure 7 Shows an implementation variant of a mold for manufacturing a cooling device. Detailed implementation

[0027] First of all, it should be pointed out that in the different described embodiments, the same components are provided with the same reference numerals or the same component names, and the disclosure contained in the entire specification can be meaningfully transferred to the same components with the same reference numerals or the same component names. The positional descriptions selected in the specification, such as upper, lower, lateral, etc., also refer to the directly described and shown drawings, and these positional descriptions are meaningfully transferred to the new positions when the positions change.

[0028] In Figure 1 a side view of the cooling device 1 is shown.

[0029] The cooling device 1 is used to cool a component 2 or multiple components 2 or an assembly. For this purpose, the cooling device 1 is in contact with at least one component 2 on the back side, especially directly, and thus is preferably in direct contact with the component 2 for heat exchange.

[0030] The component 2 is preferably an electronic component, especially a so-called power electronic component or a high-power electronic component or a power semiconductor or a high-power semiconductor, but can also be implemented differently. Such a component 2 or an assembly composed of these components 2 or having these components can especially be provided for power in the range from several kilowatts to megawatts. Such a component 2 is used, for example, to convert electrical energy using switching electronic components. Typical applications are converters or frequency converters in the field of electrical drive technology, solar inverters for regenerating energy grids or switching power supplies (usually converting AC voltage to DC voltage through a rectifier and converting DC voltage to AC voltage through an inverter), and converters for wind turbines, such as control systems, battery management systems, etc. in the drive technology of electric vehicle or hybrid vehicle power drive systems. Power electronic components can be semiconductors, especially so-called power semiconductors, such as IGBTs.

[0031] Since such a component 2 is itself known from the relevant prior art, to avoid repetition of details, reference is made to these prior arts in this regard.

[0032] The cooling device 1 includes a base element 4, which also forms the back side 3 of the cooling device 1, and the base element has a cooling structure on a first surface 5, or the cooling device is composed of the base element 4 and the cooling structure. The cooling structure is constituted by cooling elements 6, which are arranged on the base element 4 protruding from the first surface 5 and are integrally connected to the base element, as can also be seen fromFigure 2 It can be seen that. In other words, in a preferred embodiment variant, the cooling device consists of only a single component. Regardless of this unity, within the scope of the present invention, there is a possibility that for each component 2 or an assembly consisting of at least one such component 2 or having at least one such component 2, a plurality of cooling devices 1 according to the present invention can be combined with each other to form a cooling device group. Therefore, the cooling device 1 can in particular also be modularly assembled into a cooling device group.

[0033] The base element 4 and the cooling element 6 are made of or consist of sintered material. Additionally, the cooling element 6 is manufactured by forming from the base element 4 or the preform.

[0034] In a preferred embodiment variant, the density of the base element 4 and the cooling element 6 is at least 98%, in particular at least 98.5%, preferably at least 99% of the solid density of the material used.

[0035] Here, the solid density refers to the density of a cooling device manufactured by melting and metallurgy from the same material, i.e., a component consisting of solid material. The solid material here refers to a metallic material without pores except for defects, as it typically exists in sintered components.

[0036] The cooling element 6 is arranged for a cooling fluid, such as water, to circulate, so that the heat received by the cooling device 1 is transferred away via this cooling fluid. Preferably, the cooling device 1 is a so-called pin-fin cooling device.

[0037] The cooling element 6 of the shown embodiment variant is configured cylindrically. However, the cooling element can also have different shapes, such as a frustoconical shape, a mushroom shape, or generally a shape with a cross-section that widens or tapers in the direction of the cooling element head 7, such as a truncated pyramid shape.

[0038] The cross-section of the cooling element 6 can be circular, elliptical, rhombic, square, etc.

[0039] Additionally, all the cooling elements 6 can be constructed identically. However, cooling elements 6 with different shapes can also be provided or combined on the base element 4.

[0040] The height 8 of the cooling element 6 above the first surface 5 of the base element 4 is preferably between 2 mm and 20 mm.

[0041] In the simplest design of the cooling device 1, all the cooling elements 6 of the cooling device 1 have the same height 8 within the tolerance range. However, within the scope of the present invention, there is the following possibility (as this is the case in Figure 3As shown by way of example: The height of a part of the cooling elements 6 can be smaller than the height of the remaining cooling elements 6. The cooling elements 6 at the edge can, for example, be higher than the remaining cooling elements, or the cooling elements 6 can have a course from a height 8 that is low or high in the center of the cooling device 1 to a height 8 that is high or lower at the edge of the cooling device 1. Other embodiments with different heights 8 are possible within the scope of the present invention.

[0042] It can furthermore be provided that: 300 to 1300, in particular 300 to 1000, for example 300 to 750 cooling elements 6 are provided or configured per dm² of the first surface. In particular, this quantity has proven to be advantageous in the manufacture of the cooling device 1, i.e., in shaping the base element 4 or the preform into the cooling elements 6, because damage to the cooling elements 6 or incompletely configured cooling elements 6 can thus be avoided or reduced.

[0043] As can in particular be seen from Figure 1 As can be seen, according to an implementation variant of the cooling device 1, the back side 3 of the base element 4 is configured with a flat surface. However, there is also the possibility that the back side 3 is configured with one or more recesses 9 in which the component 2 is at least partially received. Thus, a better joining of the component 2 to the cooling device 1 can be achieved. Generally, the component 2 can be adhesively bonded or screwed or brazed or sintered etc. to the cooling device 1.

[0044] Within the scope of the manufacture of the cooling elements 6, the at least one recess 9 can be manufactured simultaneously with the cooling elements. Via the at least one recess 9, it is also possible to manufacture cooling elements 6 with a height 8 that is greater than the height of the remaining cooling elements 6.

[0045] It is provided that: The base element 4 has a maximum element height 10 of 3 mm. The base element 4 can in particular have an element height 10 between 1 mm and 2.5 mm. The element height 10 of the (plate-shaped) base element 4 is measured between its back side 3 and the first surface 5. If a recess 9 is provided in the back side 3, the element height 10 is measured next to the recess 9.

[0046] As can be seen from Figure 2 As can be seen, the cooling device 1 can have at least one reinforcing element 11 on the first surface 5 of the base element 4. The reinforcing element 11 is configured rib-shaped in the shown implementation variant, but can also have other shapes.

[0047] Furthermore, it is possible that the at least one reinforcing element 11, or a reinforcing element 11, is arranged on the back side 3 of the base element 4, in particular if the cooling device 1 has a larger surface area than the component 2, such that in this case the component 2 can also be applied to the cooling device 1 over a large area. In this embodiment variant, the component 2 can be arranged, for example, between the reinforcing elements 11.

[0048] Furthermore, there is the possibility that the at least one reinforcing element 11 is flush with the back side 3 or the first surface 5 and is made of a more rigid material that is different from the rest of the base element 4.

[0049] In Figure 2 Two reinforcing elements 11 are shown as an example, one extending over a section of the width 12 of the base element 4 at the edge of the base element 4 and the second being arranged centrally on the base element 4. These arrangements are only to be understood as examples. On the one hand, there can also be only a single reinforcing element 11 provided, or there can be more than two reinforcing elements 11 provided, for example three or four or five or six. On the other hand, there can also be (on the first surface 5) reinforcing elements 11 having the same or different shapes and / or lengths and / or sizes or configurations. The reinforcing element 11 can, for example, extend continuously over at least 80%, in particular at least 90%, for example between 90% and 98% of the width 12 of the base element 4. The same applies to the length 13 of the base element 4.

[0050] In a preferred embodiment variant, the one reinforcing element 11, or the plurality of reinforcing elements 11, is arranged only on the first surface 5 of the base element 4.

[0051] If only one reinforcing element 11 is discussed more below, these embodiments can also be applied to a plurality or all of the reinforcing elements 11 that are arranged on the first surface 5 of the base element 4 or on the base element 4, if a plurality of reinforcing elements 11 are provided.

[0052] The reinforcing element 11 can, for example, have a triangular or rectangular or trapezoidal cross-sectional shape, or it can also be other cross-sectional shapes.

[0053] In Figure 3 In the embodiment variant shown, reinforcing elements 11 are arranged along the wide sides of the base element 4 on the end sides between the cooling elements 6. Figure 4 A partial view of a variant embodiment of the cooling device 1 is shown, in which the reinforcing elements 11 are arranged continuously in a surrounding manner on the periphery of the base element 4. As can also be seen from this Figure 4 As can also be seen, the reinforcing element 11 can be arranged directly on the edge of the base element 4. As can be seen from Figure 2 andFigure 3 It can be seen that the reinforcing element 11 can also be arranged at a distance from the edge of the base element 4.

[0054] Furthermore, according to Figure 4 the reinforcing element 11 is implemented with a rounded shape in the corner region of the base element 4. However, it can also be implemented in a different way, for example, by following an inclined course with respect to the edge or corner of the base element 4.

[0055] In Figure 4 the reinforcing element 11 is arranged between the edge and the cooling element 6. As can be seen from Figure 1 the one or more reinforcing elements 11 can also be arranged between the cooling elements 6, for example, can also be arranged only between the cooling elements 6. However, with respect to the reinforcing element 11, it is also possible according to Figure 1 and Figure 4 a combination of implementation variants, so that the reinforcing element 11 can be arranged along the edge of the base element 4 and between the cooling elements 6.

[0056] The reinforcing element 11 can have a straight course (as shown, for example, in Figure 2 ) or can also have a non - straight, in particular wavy, course according to an implementation variant (as Figure 5 the partial view of the cooling device 1 in shows this). These wavy - shaped reinforcing elements 11 can also be arranged to extend between the cooling elements 6. However, in the Figure 5 implementation variant shown, the wavy reinforcing element 11 simultaneously forms the cooling element 6 of the cooling device 1. Here, according to another implementation variant, it can also be stipulated that the reinforcing element 11 with a longitudinal extension dimension is arranged at least approximately along the flow direction 14 for the cooling fluid to pass through the cooling device 1. This can also be stipulated in other implementation variants of the cooling device 1, that is, not limited to the Figure 5 implementation variant according to. In the Figure 5 implementation variant shown, a channel 15 for the cooling fluid is constructed between the reinforcing elements 11.

[0057] Preferably, the reinforcing element 11 is lower than the cooling element 6, especially if the reinforcing element does not simultaneously also form the cooling element 6. Here, according to another implementation variant, it can be stipulated that the reinforcing element 11 has a height 16, which corresponds to 20% to 100%, especially 60% to 90%, of the height 8 or, when the heights of the cooling elements 6 are different, the maximum height 8 in the same direction along the cooling elements 6.

[0058] The width of the reinforcing element 11 (parallel to the first surface 5 of the base element 4) can be between 0.5 mm and 4 mm.

[0059] In principle, the reinforcing element 11 can be attached to the base element 4 afterwards, for example after the cooling element 6 has been formed. However, according to one embodiment variant, the reinforcing element 11 can be pressed together from a sintered material or produced powder-metallurgically when the preform is pressed for producing the cooling device 1. According to another embodiment variant, the reinforcing element 11 can be produced from a sintered material by forming the material of the base part 4, preferably at the same time as the cooling element 6 is produced from the preform.

[0060] The reinforcing element 11 or the reinforcing elements 11 are therefore preferably designed in one piece with the base element 4 and the cooling element 6. It is also preferred that the reinforcing element 11 or the reinforcing elements 11 are produced or manufactured with net-shape or near-net-shape quality.

[0061] Sintered powders or (in particular metal) powders used in powder metallurgy are used to produce the cooling device 1. Sintered powders with correspondingly good thermal conductivity are preferably used. In particular, sintered powders based on aluminum or aluminum alloys or based on copper or copper alloys or MMC powders (metal matrix composites) are used.

[0062] The cooling device is produced by powder metallurgy according to the powder metallurgy method, and is therefore preferably a sintered component. For this purpose, a green body is produced in a corresponding die (die) from a sintering powder that can be produced from individual (metal) powders by mixing, and the powders can be used in prealloyed form if necessary. The density of the green body is preferably at least 80%, in particular between 80% and 96%, of the solid density of the material.

[0063] The green body is then dewaxed at room temperature and subjected to one-stage, two-stage or multi-stage sintering and then preferably cooled to room temperature. The sintering can be carried out at a temperature between 500° C. and 1300° C., for example.

[0064] Since these method sequences and the method parameters used therein are likewise known from the prior art, in order to avoid repetitions, reference is made to the relevant prior art in this regard.

[0065] By sintering, a preform 17 is formed from the green body, as is exemplified in Figure 6 The preform 17 can be designed as a flat plate, so that the rear side 3 and the first surface 5 can extend parallel to one another.

[0066] According to an implementation variant, it can be provided that the first surface 5 of the preform 17 is manufactured at least partially arched, and the cooling structure is constructed on the first surface and in particular on at least one reinforcing element 11. Given the improved formability of the preform 17, other shapes of the first surface 5 of the preform 17 are possible. Thus, it is already possible to preform a first pin-fin addition or a cooling element addition (circular, oval, elliptical, etc.) with a height between 0.1 mm and 2.0 mm. Similarly, if necessary, an attachment of at least one reinforcing element 11 can already be provided. Additionally, structures (waves, ribs, etc.) can be intentionally introduced into the first surface 5 of the preform 17 in order to increase the eddy current of the cooling fluid if necessary.

[0067] Subsequently, the preform 17 can be recompressed. The recompression can be carried out simultaneously with the shaping of the preform 17 into the cooling element 6 and / or the reinforcing element 11.

[0068] The shaping of the preform 17 is carried out in a shaping die 18. For this purpose, the preform 17 is placed into the shaping die 18 or the preform is placed against the shaping die. In the simplest case, the shaping die 18 for manufacturing the cooling element 6 consists of a perforated plate 19. The perforated plate 19 has voids 20, in particular through-penetrations, into which or through which a part of the material of the preform 17 is pressed, thereby forming the cooling element 6. In order to construct the one or more reinforcing elements 11, corresponding elongated or wavy voids 21 and / or through-penetrations can be provided according to their shape in the perforated plate 19.

[0069] The remaining part of the material of the preform 17 that is not pressed into the shaping die 18 or pressed through the shaping die 18 forms the base element 4. Here, the subsequent desired maximum element height 10 of the base element 4 has been taken into account in the shaping of the preform 17 for constructing the cooling element 6 and the one or more reinforcing elements 11.

[0070] The voids 20, 21, i.e., their cross-sections, are correspondingly adapted to the cross-section of the cooling element 6 or the reinforcing element 11 to be manufactured.

[0071] The shaping die 18 can also have a different appearance, i.e., it does not necessarily have to be a perforated plate 19. The shaping die 18 can in particular be constructed "pan-shaped" as a female die.

[0072] For shaping, the punch 22 is placed against the back side 3 of the preform 17 and pressed onto the preform 17 with a predefined pressure, and the back side also forms the back side 3 of the base element 4. The shaping can be carried out, for example, at a pressure between 700 MPa and 1600 MPa. Additionally, the shaping can be carried out during a time period of at most 10 seconds, in particular between 0.1 second and 10 seconds. Additionally, the shaping is preferably carried out at room temperature (20 °C), i.e., cold shaping, or the shaping can also be carried out after preheating the preform 17 to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C, and / or in or with a shaping die 18 heated to a temperature between 50 °C and 300 °C, for example between 50 °C and 150 °C.

[0073] After shaping the preform 17, i.e., forming, the cooling device 1 can be completed. However, there is also the possibility of reprocessing the cooling device 1. For example, the cooling element 6 and / or the reinforcing element 11 can be at least partially recompressed, for example in the free ends.

[0074] The shaping of the preform 17 can be carried out in one stage or in multiple stages, so that the cooling element 6 and / or the reinforcing element 11 can be formed in one or more steps.

[0075] Additionally, there is the possibility of providing the cooling element 6 and / or the reinforcing element 11 with a particularly corrosion-resistant coating.

[0076] The embodiments show possible implementation variants, and it should be noted here that combinations of the individual implementation variants with each other are also possible.

[0077] It is duly noted finally that, for a better understanding of the structure of the cooling device 1 or the shaping die 12, they are not necessarily shown to scale.

[0078] List of reference numerals

[0079] 1 Cooling device

[0080] 2 Component

[0081] 3 Back side

[0082] 4 Base element

[0083] 5 Surface

[0084] 6 Cooling element

[0085] 7 Cooling element head

[0086] 8 Height

[0087] 9 Recess

[0088] 10 Element height

[0089] 11 Enhancement element

[0090] 12 Width

[0091] 13 Length

[0092] 14 Flow direction

[0093] 15 Channel

[0094] 16 Height

[0095] 17 Parison

[0096] 18 Forming die

[0097] 19 Orifice plate

[0098] 20 Void part

[0099] 21 Void part

[0100] 22 Punch

Claims

1. Cooling device (1) for cooling a component (2), said cooling device comprising a base element (4) having a first surface (5) and having a cooling structure with cooling elements (6), said cooling structure being arranged on the base element (4) so as to protrude from the first surface (5), characterized in that, The cooling element (6) is made of sintered material, and the cooling element (6) is manufactured by shaping the material of the base element (4), and the base element (4) has an element height (10) of at most 3 mm, in particular between 1 mm and 2.5 mm.

2. The cooling device (1) according to claim 1, characterized in that, At least one reinforcing element (11) is provided on the base element (4), in particular on the first surface (5).

3. The cooling device (1) according to claim 2, characterized in that, The reinforcing element (11) is rib-shaped.

4. The cooling device (1) according to claim 2 or 3, characterized in that, The reinforcing element (11) is arranged around the periphery of the base element (4).

5. The cooling device (1) according to any one of claims 2 to 4, characterized in that, The reinforcing element (11) is arranged between the cooling elements (6).

6. The cooling device (1) according to any one of claims 2 to 5, characterized in that, The reinforcing element (11) is wave-shaped.

7. The cooling device (1) according to claim 6, characterized in that, A plurality of wave-shaped reinforcing elements (11) form the cooling element (6).

8. The cooling device (1) according to any one of claims 2 to 6, characterized in that, The reinforcing element (11) has a height (16) between 20% and 100% of the maximum height (8) of the cooling element (6).

9. The cooling device (1) according to any one of claims 2 to 8, characterized in that The reinforcing element (11) is made of sintered material and is manufactured by shaping the material of the base element (4).

10. The cooling device (1) according to any one of claims 2 to 9, characterized in that, The reinforcing element (11) is arranged in the flow direction of the cooling fluid through the cooling device (1) in the longitudinal extension dimension.

11. A method for manufacturing a cooling device (1), the method comprising the steps of providing a material and constructing a cooling structure from the material, characterized in that, Sintered powder is used as the material, a green body is manufactured from the sintered powder by pressing, the green body is sintered into a shaped blank (17), and the cooling structure in the form of the cooling element (6) is manufactured from the shaped blank (17) by shaping. For this purpose, a part of the shaped blank (17) is pressed by a shaping die (18), the base element (4) is formed from the shaped blank (17), the cooling element (6) is constructed on the base element, and the base element (4) is manufactured with an element height (10) of at most 3 mm, in particular 1 mm to 2.5 mm.

12. The method according to claim 11, characterized in that, At least one reinforcing element (11) is constructed on the base element (4) by shaping the shaped blank (17).

13. The method according to claim 12, wherein The reinforcing element (11) is rib-shaped.

14. The method according to claim 12 or 13, characterized in that, The reinforcing element (11) is wave-shaped.

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