Auxiliary jig and manufacturing method and application thereof

Abstract

The invention relates to an auxiliary jig and a manufacturing method and application thereof, the auxiliary jig is characterized in that at least one substrate area and a peripheral area surrounding the substrate area are defined on the surface of a plate body, and a groove is formed in the substrate area, so that the groove is applicable to manufacturing of various packaging substrates in size specifications, and the auxiliary jig meets the requirement of universality.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging technology, and more particularly to an auxiliary jig for manufacturing a packaging substrate, a manufacturing method thereof, and an application thereof. Background Art

[0002] With the vigorous development of the electronics industry, electronic products tend to be thinner, lighter, shorter, and smaller in form, and are developed towards high performance, high functionality, and high speed in terms of functions. Therefore, in order to meet the requirements of high integration and miniaturization of semiconductor devices, in the packaging process, packaging substrates with high-density and fine-pitch lines are often used.

[0003] The commonly used glass at present, as an indispensable key material in the modern electronics industry, bears the core components of many high-tech products, and with its unique physical and chemical properties, is widely used in fields such as display technology, semiconductor technology, and photovoltaic industry.

[0004] In the semiconductor process, the performance of the existing glass substrates, such as flatness, thermal stability, and chemical stability, has been significantly improved, making the importance of glass substrates increasing day by day.

[0005] However, in the semiconductor process, the glass substrate is prone to uneven thermal stress due to the mismatch of the coefficient of thermal expansion (CTE) between heterogeneous bonds, resulting in the fragmentation of the glass substrate during thermal cycling.

[0006] Therefore, how to overcome the problems of the above-mentioned existing technologies has actually become an urgent issue to be solved at present. Summary of the Invention

[0007] The purpose of the present invention is to provide an auxiliary jig, a manufacturing method thereof, and an application thereof to solve at least one of the above problems.

[0008] In view of the various defects of the above-mentioned existing technologies, the present invention provides an auxiliary jig, including: a plate body, on the surface of which at least one substrate area and a peripheral area surrounding the substrate area are defined; a first metal layer formed on the peripheral area; and an insulating layer formed on the first metal layer, so as to form a groove surrounded by the first metal layer, the insulating layer, and the surface of the plate body of the substrate area, wherein the side wall of the groove includes the insulating layer and the first metal layer.

[0009] In a specific embodiment, the auxiliary jig further includes a metal bonding layer provided on the insulating layer, so that the side wall of the groove further includes the metal bonding layer.

[0010] In a specific embodiment, first metal layers and insulating layers are formed on the peripheral regions on opposite sides of the plate body, so that corresponding grooves are provided on opposite sides of the plate body.

[0011] The present invention also provides a method for manufacturing an auxiliary jig, including: providing a plate body having a first metal layer and a second metal layer thereon; forming a first boundary trench on the second metal layer, and the first boundary trench extends through the first metal layer and the second metal layer, so that the plate body defines at least one substrate region and a peripheral region surrounding the substrate region; removing the second metal layer in the peripheral region to expose the first metal layer in the peripheral region; forming an insulating layer on the plate body to cover the first metal layer and the second metal layer; forming a second boundary trench penetrating the insulating layer along the first boundary trench; and removing the structure on the substrate region, so as to form a groove surrounded by the first metal layer, the insulating layer in the peripheral region and the surface of the plate body in the substrate region, wherein the side wall of the groove includes the insulating layer and the first metal layer in the peripheral region.

[0012] In a specific embodiment of the manufacturing method, a metal bonding layer is formed on the surface of the formed insulating layer, so that after removing the structure on the substrate region, the groove is surrounded by the first metal layer, the insulating layer, the metal bonding layer and the surface of the plate body in the substrate region, and the side wall of the groove further includes the metal bonding layer provided on the insulating layer in the peripheral region.

[0013] In a specific embodiment of the manufacturing method, grooves are provided on both opposite sides of the plate body.

[0014] The present invention further provides an application of an auxiliary jig, including: providing a foregoing auxiliary jig; placing a substrate structure in the groove of the auxiliary jig, wherein the substrate structure includes a substrate body having opposite two sides, a wiring layer formed on one side of the substrate body, and a bonding layer formed on the other side of the substrate body, and the substrate structure is placed in the groove through the bonding layer to form a circuit structure on the auxiliary jig to cover the substrate structure, and the circuit structure is electrically connected to the wiring layer of the substrate structure; cutting along the side wall of the groove of the auxiliary jig to remove the peripheral region of the plate body of the auxiliary jig and the structure thereon, so as to form a package substrate on the substrate region of the plate body; and removing the bonding layer and the plate body to obtain the package substrate.

[0015] In a specific embodiment of the application, the substrate body is a semiconductor plate or a glass plate.

[0016] In a specific embodiment of the application, a plurality of conductive vias electrically connecting the wiring layer are formed in the substrate body.

[0017] In a specific embodiment of the application, after removing the bonding layer and the plate body, a solder mask layer is further formed on the substrate body and the circuit structure.

[0018] In a specific embodiment of the application, the circuit structure includes a dielectric layer formed on the substrate body and a circuit layer formed on the dielectric layer. In other specific embodiments, the number of layers of the circuit structure can be increased or decreased according to requirements, and then the cutting step is carried out. For example, a first circuit structure is first formed on the substrate body, and then a second circuit structure is formed on the first circuit structure.

[0019] As can be seen from the above, the auxiliary jig of the present invention, its manufacturing method and application mainly rely on the design of forming grooves on the substrate area of the plate body to be applicable to the production of various size specifications of packaging substrates (such as unit substrates, strip substrates arranged with multiple unit substrates, or full-panel substrates in an array matrix form, etc.), so that the auxiliary jig meets the requirements of universality.

[0020] Furthermore, through the design of the groove, the substrate structure (such as the substrate body made of glass material) is protected, and the side wall of the groove includes an insulating layer and a first metal layer. During the process of manufacturing the packaging substrate, when the coefficient of thermal expansion (CTE) between heterogeneous bonds does not match and thermal stress is uneven, the stress can be dispersed, so that when thermal cycling occurs, the problem of product failure caused by the rupture of the substrate body (such as glass material) can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A 、 Figure 1B 、 Figure 1C 、 Figure 1D and Figure 1E are cross-sectional schematic diagrams of the manufacturing method of the auxiliary jig of the present invention.

[0022] Figure 1A-1 and Figure 1A-2 are top-view schematic diagrams of different embodiments of Figure 1A .

[0023] Figures 2A to 2G is a cross-sectional schematic diagram of the application of the auxiliary jig of the present invention.

[0024] The reference numerals are as follows:

[0025] 1 Auxiliary jig

[0026] 10 Plate body

[0027] 100 Groove

[0028] 11 First metal layer

[0029] 12 Second metal layer

[0030] 13 Insulation layer

[0031] 14 Metal bonding layer

[0032] 15 Side wall

[0033] 2 Encapsulation substrate

[0034] 2a Substrate structure

[0035] 20 Substrate body

[0036] 200 Conductive via

[0037] 21 Wiring layer

[0038] 22 Bonding layer

[0039] 23 First circuit structure

[0040] 23a Metal layer

[0041] 230 First dielectric layer

[0042] 231 First circuit layer

[0043] 24 Second circuit structure

[0044] 240 Second dielectric layer

[0045] 241 Second circuit layer

[0046] 25 Solder mask layer

[0047] 250 Opening

[0048] A Substrate area

[0049] B Peripheral area

[0050] L1 First boundary trench

[0051] L2 Second boundary trench

[0052] S Edge Detailed implementation manners

[0053] The following illustrates the implementation manners of the present invention through specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have any substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that the present invention can produce and the purpose that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", "one", etc. cited in this specification are only for the convenience of clear narration and are not used to limit the scope for the implementation of the present invention. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope for the implementation of the present invention.

[0055] Figures 1A to 1E It is a schematic cross-sectional view of the manufacturing method of the auxiliary jig 1 of the present invention.

[0056] As Figure 1A shown, a plate body 10 is provided, and a first metal layer 11 and a second metal layer 12 are sequentially arranged on both opposite sides thereof. Then, a patterning process is performed to form a first boundary groove L1 on the second metal layer 12 by means of laser, and the first boundary groove L1 extends through the first metal layer 11 and the second metal layer 12, so that the plate body 10 defines at least one substrate area A and a peripheral area B surrounding the substrate area A.

[0057] In this embodiment, the plate body 10 is a bismaleimide / triazine (BT for short) board, and the first metal layer 11 is a thin copper foil with a thickness of about 3 microns, while the second metal layer 12 is a thick copper layer such as a copper foil with a thickness of about 18 micrometers (um), which is formed on the first metal layer 11 in a bonding manner.

[0058] Furthermore, the specifications of the substrate area A match the specifications of the base material, such as a strip, a panel as Figure 1A-1 shown, or a unit as Figure 1A-2 shown.

[0059] As Figure 1B shown, the second metal layer 12 in the peripheral area B is removed by a peeling method to expose the first metal layer 11 in the peripheral area B.

[0060] As Figure 1C shown, an insulating layer 13 is formed on both opposite sides of the plate body 10 to cover the first metal layer 11 and the second metal layer 12, and the insulating layer 13 fills the first boundary groove L1.

[0061] In this embodiment, the insulating layer 13 is an ABF film (Ajinomoto build-up film), polybenzoxazole (abbreviated as PBO), polyimide (abbreviated as PI), prepreg with glass fiber (abbreviated as PP), or other dielectric materials.

[0062] Furthermore, the insulating layer 13 can be formed on opposite sides of the board body 10 by a lamination method. In addition, the insulating layer 13 can have a metal lamination layer 14 such as a copper layer, so as to laminate the insulating layer 13 on opposite sides of the board body 10 by means of the metal lamination layer 14.

[0063] As Figure 1D shown, a second boundary groove L2 penetrating the metal lamination layer 14 and the insulating layer 13 is formed along the first boundary groove L1 by means of laser or drilling (such as steps of positioning, depth confirmation, extraction, etc.).

[0064] As Figure 1E shown, the structures on the substrate area A are removed, that is, including the metal lamination layer 14, the insulating layer 13, the first metal layer 11 and the second metal layer 12, so as to form a groove 100 on the substrate areas A on opposite sides of the board body 10. The groove 100 is surrounded by the first metal layer 11, the insulating layer 13 in the peripheral area B and the surface of the board body 10 in the substrate area A, and the side wall 15 of the groove 100 includes the metal lamination layer 14, the insulating layer 13 and the first metal layer 11 in the peripheral area B.

[0065] Therefore, the auxiliary jig 1 of the present invention mainly adopts the design of forming the groove 100 on the substrate area A, so as to be applicable to the production of various package substrate size specifications (such as strip, panel, unit, etc.), making the auxiliary jig 1 meet the requirements of universality.

[0066] Furthermore, the auxiliary jig 1 uses a conventional BT material as the core board body 10. After removing part of the second metal layer 12, an insulating layer (such as a PP material) is laminated to form the second boundary groove L2, and finally the auxiliary jig 1 is produced. Therefore, the auxiliary jig 1 is made of existing materials, which is not only easy to obtain, but also has a simple manufacturing method, thus meeting the requirements of being easy to manufacture.

[0067] Figures 2A to 2G This is a cross-sectional schematic diagram of the application of the auxiliary jig 1 of the present invention. In this embodiment, the auxiliary jig 1 is applied to the manufacturing method of the package substrate 2.

[0068] As Figure 2A shown, an auxiliary jig 1 as Figure 1E shown is provided, and then the substrate structure 2a is placed in the groove 100 of the auxiliary jig 1.

[0069] In this embodiment, the substrate structure 2a includes a substrate body 20 having opposite two sides, a wiring layer 21 formed on one side of the substrate body 20, and a bonding layer 22 formed on the other side of the substrate body 20. And the substrate structure 2a is placed on the plate body 10 in the groove 100 through the bonding layer 22. For example, the substrate body 20 is a semiconductor plate such as a glass material or a silicon plate. In addition, a plurality of conductive vias 200 electrically connecting the wiring layer 21 are formed in the substrate body 20. For example, the wiring layer 21 and the conductive vias 200 are made of copper material. Additionally, the bonding layer 22 is, for example, a metal layer, such as a thin copper layer, with a thickness of about 3 micrometers.

[0070] As Figure 2B As shown, a first dielectric layer 230 is formed on opposite two sides of the auxiliary jig 1 to cover and fix the substrate structure 2a.

[0071] In this embodiment, the first dielectric layer 230 is an ABF film (Ajinomoto build-up film), polybenzoxazole (abbreviated as PBO), polyimide (abbreviated as PI), prepreg with glass fiber (abbreviated as PP), or other dielectric materials.

[0072] Furthermore, the first dielectric layer 230 can be formed on opposite two sides of the auxiliary jig 1 and on the substrate body 20 of the substrate structure 2a by a lamination method. For example, a metal layer 23a such as a copper layer is provided on the first dielectric layer 230 to laminate the first dielectric layer 230 on opposite two sides of the auxiliary jig 1 through the metal layer 23a.

[0073] As Figure 2C As shown, a patterning process is performed to fabricate a first circuit layer 231 on the first dielectric layer 230 through the metal layer 23a, and the first circuit layer 231 extends into the first dielectric layer 230 to be electrically connected to the wiring layer 21 through a conductive blind via portion, so that the first circuit structure 23 includes the first dielectric layer 230 formed on the substrate body 20 and the first circuit layer 231 formed on the first dielectric layer 230.

[0074] In this embodiment, holes are formed in the first dielectric layer 230 by a laser drilling method, so that the conductive blind via portion of the first circuit layer 231 extends into the holes.

[0075] As Figure 2DAs shown, a build-up process is performed to form a second circuit structure 24 on the first circuit structure 23. The second circuit structure 24 includes a second dielectric layer 240 formed on the first dielectric layer 230 and the first circuit layer 231, and a second circuit layer 241 formed on the second dielectric layer 240. The second circuit layer 241 extends into the second dielectric layer 240 and is electrically connected to the first circuit layer 231 through a conductive blind via portion.

[0076] In this embodiment, the second dielectric layer 240 is an ABF film (Ajinomoto build-up film), polybenzoxazole (PBO), polyimide (PI), prepreg with glass fiber (PP), or other dielectric materials, and the second circuit layer 241 includes copper material.

[0077] It should be understood that the number of circuit structure layers can be increased or decreased according to requirements, and is not limited to the two layers described above.

[0078] As Figure 2E shown, cutting is performed along the edge S of the groove 100 of the auxiliary jig 1 to remove the peripheral area B of the plate body 10 of the auxiliary jig 1 and the structures thereon, so as to form a package substrate 2 on the substrate area A of the plate body 10.

[0079] In this embodiment, the structures on the peripheral area B include the side wall 15 (the first metal layer 11, the insulating layer 13, and the metal bonding layer 14) of the auxiliary jig 1, a part of the material of the first circuit structure 23, and a part of the material of the second circuit structure 24.

[0080] As Figure 2F shown, the bonding layer 22 is separated from the plate body 10 to remove the plate body 10 of the auxiliary jig 1.

[0081] In this embodiment, the bonding layer 22 remains on the package substrate.

[0082] As Figure 2G shown, the bonding layer 22 is removed by a rapid etching method to obtain the package substrate 2, and the end face of the conductive via 200 is exposed on the substrate body 20.

[0083] In this embodiment, a solder mask layer 25 can be formed on the substrate body 20 and the second circuit structure 24, and the solder mask layer 25 has a plurality of openings 250 to expose the second circuit layer 241 and the end face of the conductive via 200 through the plurality of openings 250.

[0084] Therefore, through the design of the groove 100, the auxiliary jig 1 effectively protects the substrate structure 2a (such as the substrate body 20 made of glass material), preventing the processing equipment from cracking the substrate body 20. Moreover, the side wall 15 of the groove 100 includes an insulating layer 13 (such as a PP material) and a copper layer (the first metal layer 11 and the metal bonding layer 14). During the manufacturing process of the packaged substrate 2, when there is a mismatch in the coefficient of thermal expansion (CTE) between heterogeneous bonds, resulting in uneven thermal stress, the stress can be dispersed. Thus, during thermal cycling, it can prevent the substrate body 20 (such as made of glass material) from cracking, which may lead to product defects, and even cause personal injury (such as being scratched by glass fragments) or damage to production line equipment (such as glass fragments getting stuck in the equipment).

[0085] Furthermore, since the groove 100 has a protective effect, the auxiliary jig 1 is applicable to the embedding of various heterogeneous materials (such as the substrate structure 2a), facilitating the production of various packaged substrates with embedded circuits.

[0086] In addition, if grooves 100 are provided on both opposite sides of the auxiliary jig 1, the packaged substrate 2 can be processed and manufactured simultaneously on both opposite sides of the auxiliary jig 1, thus improving production capacity.

[0087] Moreover, the auxiliary jig 1 is applicable to the production of various size specifications of packaged substrates (such as strip, panel, unit, etc.). Therefore, the auxiliary jig 1 is applicable to the fan-out type circuit structure of heterogeneous material bonding (such as the substrate body 20 made of glass material and the first dielectric layer 230).

[0088] The above embodiments are used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the patent protection of the present invention shall be as listed in the claims.

Claims

1. An auxiliary jig, characterized in that Comprising: A plate body, on the surface of which at least one substrate area and a peripheral area surrounding the substrate area are defined; A first metal layer formed on the peripheral area; And An insulating layer formed on the first metal layer, so as to form a groove surrounded by the first metal layer, the insulating layer and the surface of the plate body of the substrate area, wherein the side wall of the groove comprises the insulating layer and the first metal layer.

2. The auxiliary jig according to claim 1, characterized in that, The auxiliary jig further comprises a metal bonding layer disposed on the insulating layer, so that the side wall of the groove further comprises the metal bonding layer.

3. The auxiliary jig according to claim 1, characterized in that, The first metal layer and the insulating layer are both formed on the peripheral areas on the opposite sides of the plate body, so that corresponding grooves are provided on the opposite sides of the plate body.

4. A manufacturing method of an auxiliary jig, characterized in that, Comprising: Providing a plate body, on which a first metal layer and a second metal layer are provided; Forming a first boundary trench on the second metal layer, and the first boundary trench extends through the first metal layer and the second metal layer, so that the plate body defines at least one substrate area and a peripheral area surrounding the substrate area; Removing the second metal layer in the peripheral area to expose the first metal layer in the peripheral area; Forming an insulating layer on the plate body to cover the first metal layer and the second metal layer; Forming a second boundary trench penetrating through the insulating layer along the first boundary trench; And Removing the structure on the substrate area, so as to form a groove surrounded by the first metal layer in the peripheral area, the insulating layer and the surface of the plate body of the substrate area, wherein the side wall of the groove comprises the insulating layer in the peripheral area and the first metal layer.

5. The manufacturing method of the auxiliary jig according to claim 4, characterized in that, The formed surface of the insulating layer has a metal bonding layer, so that after removing the structure on the substrate area, the groove is surrounded by the first metal layer in the peripheral area, the insulating layer, the metal bonding layer and the surface of the plate body of the substrate area, and the side wall of the groove further comprises the metal bonding layer disposed on the insulating layer in the peripheral area.

6. The manufacturing method of the auxiliary jig according to claim 4, characterized in that, The grooves are provided on the opposite sides of the plate body.

7. Application of an auxiliary jig, characterized in that, Comprising: Providing an auxiliary jig as described in claim 1; Placing a substrate structure in the groove of the auxiliary jig, wherein the substrate structure comprises a substrate body having opposite sides, a wiring layer formed on one side of the substrate body, and a bonding layer formed on the other side of the substrate body, and placing the substrate structure in the groove by means of the bonding layer; Forming a circuit structure on the auxiliary jig to cover the substrate structure, and electrically connecting the circuit structure to the wiring layer of the substrate structure; Cutting along the side wall of the groove of the auxiliary jig to remove the peripheral area of the plate body of the auxiliary jig and the structures thereon, so as to form a packaged substrate on the substrate area of the plate body; and Removing the bonding layer and the plate body to obtain the packaged substrate.

8. The application of the auxiliary jig according to claim 7, wherein, The substrate body is a semiconductor plate or a glass plate.

9. The application of the auxiliary jig according to claim 7, characterized in that, A plurality of conductive vias electrically connecting the wiring layer are formed in the substrate body.

10. The application of the auxiliary jig according to claim 7, characterized in that The application of the auxiliary jig further comprises forming a solder mask layer on the substrate body and the circuit structure after removing the bonding layer and the plate body.

11. The application of the auxiliary jig according to claim 7, characterized in that, The circuit structure comprises a dielectric layer formed on the substrate body and a circuit layer formed on the dielectric layer.

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