Battery pack

Abstract

There is provided a battery pack including: a plurality of battery modules; and a power control device configured to control power supplied by the plurality of battery modules. The power control device includes: a housing including a partition wall defining a seating area; an electrical component within the housing; and a heat transfer element in contact with or applied around the electrical element.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2024-0008296, filed with the Korean Intellectual Property Office on January 18, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] Aspects of embodiments of the present disclosure relate to a battery pack. Background Art

[0003] Secondary batteries are designed to be rechargeable and dischargeable and can be used as an energy source for mobile devices, electric vehicles, hybrid vehicles, electric bicycles, and uninterruptible power supplies. Depending on the type of external device to which the secondary battery is applied (e.g., power), the secondary battery can be used in the form of a single battery cell or in the form of a module or a group in which a plurality of battery cells are connected together and bundled into a unit.

[0004] The information disclosed in this background art section is for facilitating an understanding of the background art of the present disclosure, and thus, it may include information that does not constitute the prior art. Summary of the Invention

[0005] Embodiments of the present disclosure include a battery pack that exhibits enhanced heat dissipation performance of a power control device without increasing the specifications and / or dimensions of electrical components included in the power control device.

[0006] However, aspects and features of the present disclosure are not limited to the aspects and features mentioned above, and other aspects and features not mentioned will be clearly understood by those skilled in the art from the description of the present disclosure below.

[0007] Additional aspects and features will be set forth in part in the description below, and will in part be apparent from the description, or may be learned by practice of the presented embodiments of the present disclosure.

[0008] According to an embodiment of the present disclosure, a battery pack includes: a plurality of battery modules; and a power control device configured to control the power of the plurality of battery modules. The power control device includes: a housing including a partition wall defining an accommodation area; electrical components within the housing; and a heat transfer element in contact with the electrical components or applied around the electrical components.

[0009] The electrical components and the heat transfer element may be in the accommodation area.

[0010] The heat transfer element may be in contact with the partition wall and the electrical components.

[0011] The heat transfer element may be in contact with a plurality of surfaces of the electrical components.

[0012] The placement areas, electrical components, and heat transfer elements can each be provided in the housing as a plurality, and the plurality of placement areas can be spaced apart from each other.

[0013] The housing can have a first surface forming the bottom surface of the housing and a second surface extending along the edge of the first surface.

[0014] The partition wall can include: an inner partition wall extending from the first surface and spaced apart from the second surface; and an outer partition wall extending from the second surface toward the inner partition wall.

[0015] The heat transfer element applied within the inner partition wall can be in contact with one surface of the inner partition wall and the electrical component.

[0016] The outer partition wall can include two outer partition walls spaced apart from each other and extending from the second surface, and the heat transfer element is applied between the two outer partition walls.

[0017] The placement areas, electrical components, heat transfer elements, and partition walls can each be provided as a plurality.

[0018] The placement areas can include a first placement area, a second placement area, and a third placement area spaced apart from each other. The electrical components can include a first electrical component, a second electrical component, and a third electrical component corresponding to the first placement area, the second placement area, and the third placement area respectively. The heat transfer elements can include a first heat transfer element, a second heat transfer element, and a third heat transfer element corresponding to the first placement area, the second placement area, and the third placement area respectively. The partition walls can include a first partition wall, a second partition wall, and a third partition wall corresponding to the first placement area, the second placement area, and the third placement area respectively.

[0019] The first partition wall can include: a first inner partition wall extending upward from the first surface and having two ends extending toward the second surface in the width direction; and two first outer partition walls extending from the second surface toward the first inner partition wall and spaced apart from each other.

[0020] The first heat transfer element can include a first inner heat transfer element received in the first inner partition wall and in contact with one surface of the first electrical component.

[0021] The second partition wall can include: a second inner partition wall extending upward from the first surface, with the two ends of the second inner partition wall extending toward the second surface in the width direction; and two second outer partition walls extending from the second surface toward the second inner partition wall and spaced apart from each other.

[0022] The second electrical component can have an outer circumferential surface that is at least partially curved, and a part of the second heat transfer element can have a concave shape corresponding to the outer circumferential surface of the second electrical component.

[0023] The housing may have a third surface that protrudes upward from the first surface and a groove around the third surface.

[0024] The third partition wall may include: a third inner partition wall that extends upward from the first surface, with both ends of the third inner partition wall extending toward the second surface in the width direction; and two third outer partition walls that extend from the second surface toward the third inner partition wall and are spaced apart from each other.

[0025] The third heat transfer element may include a third inner heat transfer element that is received in the third inner partition wall and contacts one surface of the third electrical component.

[0026] The first electrical component may be a negative main relay, the second electrical component may be a fuse, and the third electrical component may be a positive main relay.

[0027] The heat transfer element may include a binder and a mixture of thermally conductive inorganic fillers. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects and features of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 is a diagram showing a vehicle including a battery pack according to an embodiment; Figure 2 is a diagram schematically showing a battery pack according to an embodiment; Figure 3 is a perspective view of a power control device; Figure 4 is a diagram showing Figure 3 the interior of the power control device shown in ; Figure 5 is a diagram showing the state of removing Figure 4 the electrical components shown in ; Figure 6 is a cross-sectional view taken along line A-A' in Figure 4 ; Figure 7 is a cross-sectional view taken along line B-B' in Figure 4 ; and Figure 8 is a cross-sectional view taken along line C-C' in Figure 4 . DETAILED DESCRIPTION

[0029] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. The given embodiments and the present disclosure may have different forms and should not be construed as limited to the descriptions or embodiments set forth herein. Therefore, the embodiments are described below only by referring to the accompanying drawings to explain the aspects and features of the present specification.

[0030] Some embodiments of the present disclosure and methods according to the embodiments can be understood by referring to the detailed description of the embodiments and the accompanying drawings. The described embodiments can have various modifications and can be implemented in different forms and are not limited to the following description. Additionally, some or all of the aspects and features of the various embodiments of the present disclosure can be combined with each other. Each embodiment can be implemented independently or in combination with each other.

[0031] The described embodiments are provided as examples so that the present disclosure is thorough and complete, and also aims to convey the spirit of the present disclosure to those skilled in the art to which the present disclosure pertains. The present disclosure includes all modifications, equivalents, and substitutions within the spirit and technical scope of the present disclosure. Therefore, processes, elements, and techniques that are not necessary for those skilled in the art to fully understand the present disclosure can be not described or can be described only briefly.

[0032] Unless otherwise specified, throughout the drawings and the specification, the same reference numerals, letters, or combinations thereof indicate the same components, and thus repeated descriptions are omitted. Additionally, in order to clearly explain the aspects and features of the present disclosure, parts that are not relevant to the description or are not associated with the description can be omitted or described only briefly.

[0033] For clarity, the relative sizes of elements, layers, and regions in the drawings can be exaggerated. The use of hatching and / or shading in the drawings is provided to make the boundaries between substantially adjacent elements clear. Therefore, the presence or absence of hatching or shading does not indicate specific materials, material properties, dimensions, ratios, commonalities between the elements shown, and / or other characteristics or properties of an unspecified element, requirements for a desired form or attribute, etc.

[0034] In the present disclosure, various embodiments are described with reference to cross-sectional examples of schematic illustrations of the embodiments and / or intermediate structures. Therefore, the appearance of the drawings can vary due to, for example, manufacturing techniques and / or tolerances. Additionally, the specific structural or functional descriptions in the specification are merely examples for explaining the embodiments of the present disclosure. Therefore, the embodiments disclosed in the present specification should not be construed as limited to the shapes of the regions shown, but include, for example, shape deviations caused by manufacturing.

[0035] The regions shown in the drawings are schematic in nature, and their shapes are not intended to limit or illustrate the actual shapes of the device regions. Additionally, as those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present disclosure.

[0036] Numerous specific details are set forth in the specification in order to provide a thorough understanding of the various embodiments. However, the various embodiments may be practiced without or with one or more of these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the various embodiments.

[0037] As shown in the drawings, spatial relative terms such as “below,” “above,” “lower,” “upper,” etc. may be used to more easily describe the relationship between one element or feature and another element or feature. In addition to those shown in the drawings, spatial relative terms are intended to encompass different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “beneath” another element or feature may face “above” the other element or feature. Thus, as illustrative terms, “downward” and “lower” may include both upward and downward directions. The device may be oriented in different directions (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used in this disclosure should be interpreted accordingly. Similarly, if a first portion is described as being disposed “above” a second portion, this means that the first portion is disposed above or below the second portion.

[0038] In addition, the expression “viewed from a plane” means viewing an object from above, and the expression “in a schematic cross-section” means a schematic cross-section taken by vertically cutting the object. The term “viewed from the side” means that a first object may be above, below, or to the side of a second object, and vice versa. Additionally, the terms “superposed” or “doubled” may include layers, stacks, surfaces, extensions, coverings, or partial coverings, or any other suitable terms understood by those of ordinary skill in the art. The expression “not superposed” may include meanings such as “spaced apart from,” “separated from,” “offset from,” and any other suitable equivalents recognized and understood by those skilled in the art. The terms “facing” and “surface” may mean that a first object may directly or indirectly face a second object. If there is a third object between the first object and the second object, the first object and the second object face each other, but may be understood to face each other indirectly.

[0039] If an element, layer, region, or component is referred to as "formed", "connected", or "coupled" to another element, it can be referred to as being directly formed on the layer, region, or component, formed on another element, layer, region, or component, or indirectly formed on another component, indirectly connected to or indirectly coupled to another component. It can also be collectively referred to as the direct combination or connection or indirect combination or connection of the element, layer, region, or component and the overall or non-overall combination or connection such that there can be one or more elements, layers, regions, or components. For example, if an element, layer, region, or component is referred to as "electrically connected" or "electrically coupled" to another element, layer, region, or component, this means that the element, layer, region, or component can be directly electrically connected or electrically coupled, or there can be other elements, layers, regions, or components. However, "directly connected" or "directly coupled" means that one component is directly connected or combined with another component without an intermediate component or existing on another component. Additionally, in this specification, if a part of a layer, film, region, plate, etc. is formed in another part, the forming direction is not limited to the upward direction and includes the case where the part is formed on the side or bottom. Conversely, if a part of a layer, film, region, plate, etc. is formed "under" another part, it includes not only the case where the part is "immediately below" the other part but also the case where there is another part between the part and the other part. Meanwhile, other expressions describing the relationship between components, such as "between", "immediately between", "adjacent to", and "immediately adjacent to", can be similarly interpreted. Additionally, if an element or layer is referred to as being "between" two elements or layers, it can be the only element between the two elements or layers, or there can be other elements between them.

[0040] When expressions such as "at least one of..." and "any one of..." are located after a list of elements, they modify the entire list of elements and not individual elements in the list. For example, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof. As used herein, the terms "use" and its variations can be considered to be synonymous with the terms "utilize" and its variations, respectively. As used herein, the terms "substantially", "about", and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent variations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0041] Although terms such as "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections are not limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another. Thus, without departing from the spirit and scope of the present disclosure, a first element, first component, first region, first layer, or first section described below may be referred to as a second element, second component, second region, second layer, or second section. Referring to an element as a "first" element does not require or imply the existence of a second element or another element. Terms such as "first", "second", etc. may be used herein to distinguish different categories or groups of elements in the present disclosure. For clarity, terms such as "first", "second", etc. may refer, respectively, to "a first category (or a first set)", "a second category (or a second set)", etc.

[0042] The terms used in this application are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used herein, unless the context clearly dictates otherwise, the singular terms are intended to include the plural terms, and the plural terms are also intended to include the singular terms. If the terms "comprising", "providing", and "having" are used herein to denote the presence of specified features, integers, or operations. These recitations do not preclude the presence or addition of one or more other features, steps, operations, components, and / or groups thereof.

[0043] If one or more embodiments can be implemented differently, a particular process order can be performed differently from the order described. For example, two consecutively described processes can be performed substantially simultaneously or can be performed in an order opposite to the order described.

[0044] As used herein, the terms "substantially", "about", and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent variations of measured or calculated values that would be recognized by a person of ordinary skill in the art. As used herein, the term "about" or "approximately" includes the stated value and means within an acceptable deviation range of a particular value as determined by a person of ordinary skill in the art in view of the corresponding measurements and associated errors (e.g., a deviation range caused by limitations of the measurement system). For example, the term "about" may mean within one or more standard deviations or within ±30%, ±20%, ±10%, or ±5% of the specified value.

[0045] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in a common dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or in this specification, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0046] Figure 1 is a view showing a vehicle 1 including a battery pack 10, Figure 2 is a view schematically showing the battery pack 10, Figure 3 is a perspective view of a power control device 100 of the battery pack 10, Figure 4 is a view showing Figure 3 the interior of the power control device 100 shown in Figure 5 is a view showing the state where the electrical component E shown in Figure 4 is removed, Figure 6 is a cross-sectional view taken along line A - A' in Figure 4 and Figure 7 is a cross-sectional view taken along line B - B' in Figure 4 and Figure 8 is a cross-sectional view taken along line C - C' in Figure 4 and

[0047] The battery pack 10 can be mounted on (or to) the vehicle 1. The vehicle 1 can be an electric vehicle, a hybrid vehicle, or a plug-in hybrid vehicle. The vehicle 1 can be a four-wheeled vehicle, a two-wheeled vehicle, etc. As Figure 1 shown, the battery pack 10 can be positioned inside the frame 2 of the vehicle 1 (e.g., within the frame 2 of the vehicle 1), for example, between the front end 4 and the rear end 5 of the vehicle 1. For example, the battery pack 10 can be positioned between the front wheels 3 and the rear wheels 3 and below the interior space 6 where the passengers are seated. The battery pack 10 can be applied to applications other than the vehicle 1. For example, the battery pack 10 can be applied to large-scale applications such as an energy storage system (ESS) or electronic devices such as power tools.

[0048] The battery pack 10 includes a plurality of battery modules 200 and a power control device 100 configured to control the power of the plurality of battery modules 200. The power control device 100 includes a partition wall W, a housing 110 including a placement area (e.g., accommodation space) 118 defined by the partition wall W, electrical components E within the housing 110, and a heat transfer element TM in contact with the electrical components E or applied around the electrical components E.

[0049] The battery pack 10 can include a power control device 100, battery modules 200, a housing 300, and a controller 400.

[0050] The power control device 100 is positioned within the housing 300 and can control the power of the battery pack 10. The power control device 100 is electrically connected to the battery module 200 and is controlled by the controller 400 to receive power supplied from the battery module 200 and deliver power to a load (e.g., a motor, an inverter, etc.). The power control device 100 not only supplies power to the load, but is also controlled by the controller 400 to cut off the power supplied from the battery module 200 to the load (or supplied by the battery module 200 to the load) in the case of problems such as overcurrent, overvoltage, leakage, or short circuit occurring in the battery module 200. For example, the power control device 100 may include a power relay assembly (PRA). The power control device 100 may be positioned at one end of the housing 300.

[0051] The power control device 100 may include electrical components E, a housing 110, and a cover 130.

[0052] One or more electrical components E may be included in the power control device 100 and may control the current supplied from the battery module 200 to an application (e.g., a load) such as a vehicle 1. The electrical components E may include relays and fuses. The electrical components E may include a first electrical component E1, a second electrical component E2, and a third electrical component E3, and the three electrical components E1, E2, E3 may include a negative (or cathode) main relay, a fuse, and a positive (or anode) main relay. For example, the first electrical component E1 may include a positive main relay, the second electrical component E2 may include a fuse, and the third electrical component E3 may include a negative main relay. The electrical components E may be within the housing 110 and may be in contact with or close to the heat transfer element TM. The heat generated by the electrical components E during operation is effectively dissipated through the heat transfer element TM, thereby preventing the electrical components E from overheating. The plurality of electrical components E may be spaced apart from each other. For example, each electrical component E is within the internal space 111 of the housing 110 and may be in the placement area 118 defined by the first surface 1111 and the second surface 1112 of the internal space 111. The electrical components E may be within the placement area 118 together with the heat transfer element TM.

[0053] The housing 110 may hold (e.g., may accommodate) and support the electrical components E. The housing 110 may form a space for accommodating the electrical components E and the heat transfer element TM. The housing 110 may form the lower frame of the power control device 100 and may include a bottom surface on which the electrical components E and the heat transfer element TM are placed.

[0054] The housing 110 may have an internal space 111, a placement area 118, a partition wall W, and a heat transfer element TM. The placement area 118, the electrical component E, the heat transfer element TM, and the partition wall W may respectively include a plurality of placement areas 118, a plurality of electrical components E, a plurality of heat transfer elements TM, and a plurality of partition walls W.

[0055] The internal space 111 may be a space in which other components of the housing 110 (such as the placement area 118, the partition wall W, and the heat transfer element TM) and the electrical component E are formed or positioned. The internal space 111 may be defined by the housing 110.

[0056] The internal space 111 may have a first surface 1111 and a second surface 1112 (or may be formed between the first surface 1111 and the second surface 1112).

[0057] For example, as Figure 4 shown, the first surface 1111 includes the bottom surface of the internal space 111, and the second surface 1112 may extend along the edge of the first surface 1111 (or may extend from the edge of the first surface 1111). The first surface 1111 may be a flat surface parallel to the floor or the surface of the area where the power control device 100 is installed. The electrical component E and the heat transfer element TM may be on the first surface 1111.

[0058] The internal space 111 may further have a third surface 1113 and a groove 1114 (or may be further formed between the third surface 1113 and the groove 1114).

[0059] The third surface 1113 and the groove 1114 may be formed in the internal space 111 to correspond to the electrical component E and the heat transfer element TM. The third surface 1113 may protrude upward from the first surface 1111 to form a step difference with the first surface 1111. The groove 1114 may be formed between the third surface 1113 and the first surface 1111 around the third surface 1113. For example, the portion of the heat transfer element TM on the third surface 1113 may be in the groove 1114 (such as may be inserted into the groove 1114), and may be supported by the first surface 1111, the second surface 1112, and the partition wall W. For example, the third surface 1113 and the groove 1114 may be formed to correspond to the second placement area 1182.

[0060] For example, as Figure 7As shown, the third surface 1113 may be formed to correspond to the second electrical component E2 and the second heat transfer element 115. The third surface 1113 may protrude upwardly toward the second electrical component E2 to form a step difference with the surrounding first surface 1111. In addition, grooves 1114 may be formed on both sides of the third surface 1113 (e.g., on the side facing the second inner partition wall 1141 and on the side facing the second surface 1112). The third surface 1113 is spaced apart from the second electrical component E2 by a distance D, and the second inner heat transfer element 1151 of the second heat transfer element 115 may be between the third surface 1113 and the second electrical component E2. The second outer heat transfer element 1152 extending downward from the second inner heat transfer element 1151 may be in the grooves 1114 (e.g., may be inserted into the grooves 1114).

[0061] The placement area 118 is an area for placing the electrical component E, and there may be a heat transfer element TM inside or around the placement area 118. One or more placement areas 118 may be defined in the internal space 111, and each placement area 118 may have at least one electrical component E thereon. For example, the number of placement areas 118 may be the same as the number of electrical components E, and in some embodiments, may be three. For example, the placement areas 118 may include a first placement area 1181, a second placement area 1182, and a third placement area 1183 corresponding to the first electrical component E1, the second electrical component E2, and the third electrical component E3, respectively.

[0062] The placement area 118 is defined by partition walls W formed on the first surface 1111 and the second surface 1112, and the electrical component E may be in the placement area 118. For example, the placement area 118 may be defined as the internal area of the first surface 1111, the second surface 1112, and the partition walls W. The electrical component E is placed in the placement area 118, and the heat transfer element TM is applied around the electrical component E and may surround or at least partially surround the electrical component E. The electrical component E and the heat transfer element TM are each in the placement area 118 and may not deviate (or may not extend) outside the placement area 118. Each placement area 118 may be distinguished from each other and spaced apart from each other. For example, the placement area 118 may be an area formed by extending the outer edges of the first surface 1111, the second surface 1112, and the partition walls W.

[0063] The first electrical component E1 and the first heat transfer element 113 may be in the first placement area 1181. For example, as Figure 5As shown in [FIGURE], the first placement area 1181 may be defined by a first surface 1111, a second surface 1112, and a first partition wall 112. The first electrical component E1 may be a positive main relay, and the first heat transfer element 113 may be disposed on both sides of the first electrical component E1 in the width direction of the power control device 100 (e.g., the Y-axis direction in [FIGURE]). For example, the first inner partition wall 1121 extends from the first surface 1111 in the height direction of the power control device 100 (e.g., the Z-axis direction in [FIGURE]), and the first outer partition wall 1122 may extend from the second surface 1112 toward the internal space 111 in the width direction of the power control device 100. The two first outer partition walls 1122 may be spaced apart in the length direction of the power control device 100 (e.g., the X-axis direction in [FIGURE]) and may extend from the second surface 1112, respectively. The first inner partition wall 1121 and the first outer partition wall 1122 may be spaced apart from each other in the width direction of the power control device 100 (e.g., the Y-axis direction in [FIGURE]). For example, the first placement area 1181 is formed toward one side of the power control device 100 (e.g., the left side in [FIGURE]) and may be spaced apart from the second placement area 1182 and the third placement area 1183. Figure 5 As shown in [FIGURE], the first inner partition wall 1121 extends from the first surface 1111 in the height direction of the power control device 100 (e.g., the Z-axis direction in [FIGURE]). Figure 3 As shown in [FIGURE], the first outer partition wall 1122 may extend from the second surface 1112 toward the internal space 111 in the width direction of the power control device 100. The two first outer partition walls 1122 may be spaced apart in the length direction of the power control device 100 (e.g., the X-axis direction in [FIGURE]) and may extend from the second surface 1112, respectively. The first inner partition wall 1121 and the first outer partition wall 1122 may be spaced apart from each other in the width direction of the power control device 100 (e.g., the Y-axis direction in [FIGURE]). Figure 5 As shown in [FIGURE], the two first outer partition walls 1122 may be spaced apart in the length direction of the power control device 100 (e.g., the X-axis direction in [FIGURE]) and may extend from the second surface 1112, respectively. The first inner partition wall 1121 and the first outer partition wall 1122 may be spaced apart from each other in the width direction of the power control device 100 (e.g., the Y-axis direction in [FIGURE]). Figure 5 As shown in [FIGURE], the first inner partition wall 1121 and the first outer partition wall 1122 may be spaced apart from each other in the width direction of the power control device 100 (e.g., the Y-axis direction in [FIGURE]). Figure 5 For example, the first placement area 1181 is formed toward one side of the power control device 100 (e.g., the left side in [FIGURE]) and may be spaced apart from the second placement area 1182 and the third placement area 1183.

[0064] The first placement area 1181 may be defined by the first inner partition wall 1121, the first outer partition wall 1122, and the first surface 1111 and the second surface 1112 corresponding to the first inner partition wall 1121 and the first outer partition wall 1122. The first electrical component E1 may be at the center of the first placement area 1181, and the first inner heat transfer element 1131 may be accommodated in the first inner partition wall 1121 to contact one side of the first electrical component E1 and the first inner partition wall 1121. In addition, the first outer heat transfer element 1132 may be accommodated in the first outer partition wall 1122 to contact the other side of the first electrical component E1 and the first outer partition wall 1122, respectively.

[0065] The heat emitted from the first electrical component E1 is absorbed by the first inner heat transfer element 1131 and the first outer heat transfer element 1132, respectively, and may be released to the outside of the power control device 100 through the first surface 1111, the second surface 1112, the first inner partition wall 1121, and the first outer partition wall 1122.

[0066] The second electrical element E2 and the second heat transfer element 115 may be in the second placement area 1182. For example, the second placement area 1182 may be defined by the first surface 1111, the second surface 1112, the third surface 1113, the groove 1114, and the second partition wall 114. The second electrical element E2 may be a fuse, and the second heat transfer element 115 may be applied to the second electrical element E2 in the width direction of the power control device 100 (for example, Figure 5 For example, the second inner partition wall 1141 may be disposed in the height direction of the power control device 100 (eg, Figure 3 The second outer partition wall 1142 may extend from the first surface 1111 in the Z-axis direction of the power control device 100, and the second outer partition wall 1142 may extend from the second surface 1112 toward the inner space 111 in the width direction of the power control device 100. Figure 5 The two second outer partition walls 1142 spaced apart in the X-axis direction (in the X-axis direction) may extend from the second surface 1112, respectively. The second inner partition wall 1141 and the second outer partition wall 1142 may be spaced apart in the width direction (eg, Figure 5 For example, the second placement area 1182 is formed at the center of the power control device 100 and may be spaced apart from the first placement area 1181 and the third placement area 1183.

[0067] The second seating area 1182 may be defined by the second inner partition wall 1141, the second outer partition wall 1142, and the first surface 1111, the second surface 1112, the third surface 1113, and the groove 1114 corresponding to the second inner partition wall 1141 and the second outer partition wall 1142. The second electrical element E2 may be at the center of the second seating area 1182, and the second inner heat transfer element 1151 may be below the second electrical element E2 and at the center of the second seating area 1182. For example, the second inner heat transfer element 1151 may be between the third surface 1113 and the second electrical element E2. The second inner heat transfer element 1151 may be in contact with the second inner partition wall 1141 and the second outer partition wall 1142, respectively, while surrounding at least a portion of the second electrical element E2. The second outer heat transfer element 1152 may extend from the second inner heat transfer element 1151 and may be inserted into the groove 1114, respectively.

[0068] The heat emitted from the second electrical element E2 is absorbed by the second inner heat transfer element 1151 and the second outer heat transfer element 1152 respectively, and can be released to the outside of the power control device 100 through the first surface 1111, the second surface 1112, the third surface 1113, the groove 1114, the second inner partition wall 1141 and the second outer partition wall 1142.

[0069] The third placement area 1183 may include a third electrical component E3 and a third heat transfer element 117. For example, as shown in Figure 5 , the third placement area 1183 may be defined by a first surface 1111, a second surface 1112, and a third partition wall 116. The third electrical component E3 may be a negative main relay, and the third heat transfer element 117 may be applied to both sides of the third electrical component E3 in the width direction of the power control device 100 (e.g., Figure 5 the Y-axis direction in Figure 3 ). For example, the third inner partition wall 1161 may extend from the first surface 1111 in the height direction of the power control device 100 (e.g., Figure 5 the Z-axis direction in Figure 5 ), and the third outer partition wall 1162 may extend from the second surface 1112 toward the inner space 111 in the width direction of the power control device 100. Two third outer partition walls 1162 spaced apart in the length direction of the power control device 100 (e.g., Figure 5 the X-axis direction in

[0070] The third placement area 1183 may be defined by the third inner partition wall 1161, the third outer partition wall 1162, and the first surface 1111 and the second surface 1112 corresponding to the third inner partition wall 1161 and the third outer partition wall 1162. The third electrical component E3 may be at the center of the third placement area 1183, and the third inner heat transfer element 1171 may be accommodated in the third inner partition wall 1161 to be in contact with one side of the third electrical component E3 and the third inner partition wall 1161, respectively. In addition, the third outer heat transfer element 1172 may be accommodated in the third outer partition wall 1162 to be in contact with the other side of the third electrical component E3 and the third outer partition wall 1162, respectively.

[0071] The heat emitted from the third electrical component E3 is respectively absorbed by the third inner heat transfer element 1171 and the third outer heat transfer element 1172, and may be released to the outside of the power control device 100 through the first surface 1111, the second surface 1112, the third inner partition wall 1161, and the third outer partition wall 1162.

[0072] The partition wall W can define an installation area 118 for disposing the electrical component E and the heat transfer element TM. The partition wall W can support the electrical component E and the heat transfer element TM such that the electrical component E and the heat transfer element TM do not leave (or migrate) from the installation area 118. One or more partition walls W can be formed in the housing 110. For example, the partition wall W can extend from the first surface 1111 and the second surface 1112 in one or more directions among the length direction, width direction, and height direction of the power control device 100. The partition wall W can extend from one or more of the first surface 1111 and the second surface 1112. One or more partition walls W can be formed in each installation area 118. The partition wall W can have a height smaller than the height of the housing 110 (e.g., the height of the second surface 1112) or a height equal to the height of the housing 110 (e.g., the height of the second surface 1112). The partition wall W can have a height greater than the height of the heat transfer element TM or a height equal to the height of the heat transfer element TM.

[0073] The partition wall W can adjust the area to which the heat transfer element TM is applied and the size and shape of the applied heat transfer element TM. For example, the electrical component E can be in one of the installation areas 118, and the heat transfer element TM can be applied around the electrical component E. Due to the electrical component E and the partition wall W, the applied heat transfer element TM does not flow to another area of the internal space 111 or another installation area 118. In addition, the thickness, height, and shape of the heat transfer element TM can be adjusted by the partition wall W as needed.

[0074] The partition wall W can include an inner partition wall extending from the first surface 1111 and spaced apart from the second surface 1112 and an outer partition wall extending from the second surface 1112 toward the inner partition wall. For example, the inner partition wall can include a first inner partition wall 1121, a second inner partition wall 1141, and a third inner partition wall 1161, which will be described in more detail below. For example, the outer partition wall can include a first outer partition wall 1122, a second outer partition wall 1142, and a third outer partition wall 1162, which will be described in more detail below. The outer partition wall can include two outer partition walls spaced apart from each other on the second surface 1112, and the heat transfer element TM is applied between the two outer partition walls.

[0075] The heat transfer element TM applied to the inner partition wall (e.g., the first inner heat transfer element 1131, the second inner heat transfer element 1151, and the third inner heat transfer element 1171 described below) can be in contact with one surface of the inner partition wall and the electrical component E. The heat transfer element TM applied to the inside of the outer partition wall (e.g., the first outer heat transfer element 1132, the second outer heat transfer element 1152, and the third outer heat transfer element 1172 described below) can be in contact with the outer partition wall, the second surface 1112, and the other surface of the electrical component E.

[0076] The dividing partition wall W may include a first dividing partition wall 112, a second dividing partition wall 114, and a third dividing partition wall 116.

[0077] The first dividing partition wall 112 may be formed to correspond to the first placement area 1181. The first dividing partition wall 112 may support the first electrical component E1 and the first heat transfer component 113. For example, the first dividing partition wall 112 may support the first electrical component E1 and the first heat transfer component 113 together with the first surface 1111 and the second surface 1112.

[0078] The first dividing partition wall 112 may include a first inner dividing partition wall 1121 and a first outer dividing partition wall 1122.

[0079] The first inner dividing partition wall 1121 may extend upward from the first surface 1111. For example, as Figure 4 shown, the first inner dividing partition wall 1121 is separated from the second surface 1112 and extends upward from the first surface 1111, and both ends of the first inner dividing partition wall 1121 may extend toward the first outer dividing partition wall 1122 respectively. For example, the first inner dividing partition wall 1121 may have a long side extending in the length direction of the power control device 100 (e.g., Figure 4 the X-axis direction in Figure 4 ), and two short sides each extending in the width direction of the power control device 100 (e.g.,

[0080] the Y-axis direction in Figure 4 ), (e.g., from both ends of the long side toward the first outer dividing partition wall 1122). The first inner dividing partition wall 1121 may accommodate the first heat transfer component 113 (e.g., the first inner heat transfer component 1131) therein. Both ends of the first inner dividing partition wall 1121 may contact one side surface of the first electrical component E1. In this regard, the side surface of the first inner heat transfer component 1131 may be completely surrounded by the first electrical component E1 and the first inner dividing partition wall 1121. The height of the first inner dividing partition wall 1121 may be equal to or greater than the height of the first inner heat transfer component 1131. Figure 4spaced apart in the X-axis direction (in the [specific context]). The first outer heat transfer element 1132 of the first heat transfer element 113 can be inserted into the space between the two first outer partition walls 1122. Both ends of the first outer partition wall 1122 can contact the other side of the first electrical component E1. In this regard, the side surface of the first outer heat transfer element 1132 can be completely surrounded by the first electrical component E1, the second surface 1112, and the first outer partition wall 1122. The height of the first outer partition wall 1122 can be equal to or greater than the height of the first outer heat transfer element 1132.

[0081] The second partition wall 114 can be formed to correspond to the second placement area 1182. The second partition wall 114 can support the second electrical component E2 and the second heat transfer element 115. For example, the second partition wall 114 can support the second electrical component E2 and the second heat transfer element 115 together with the first surface 1111, the second surface 1112, the third surface 1113, and the groove 1114.

[0082] The second partition wall 114 can include a second inner partition wall 1141 and a second outer partition wall 1142.

[0083] The second inner partition wall 1141 can extend upward from the first surface 1111. For example, as Figure 4 shown, the second inner partition wall 1141 can extend upward from the first surface 1111, and both ends of the second inner partition wall 1141 can extend toward the second outer partition wall 1142 respectively. The second inner partition wall 1141 can accommodate the second heat transfer element 115 therein. For example, the second inner partition wall 1141 can have a first portion extending in the length direction of the power control device 100 (e.g., Figure 4 the X-axis direction in the [specific context]) and two second portions extending in the width direction of the power control device 100 (e.g., Figure 4 the Y-axis direction in the [specific context]) (e.g., respectively toward the second outer partition wall 1142 at both ends of the first portion).

[0084] The second inner partition wall 1141 can have a shape corresponding to the shape of the second electrical component E2. For example, as Figure 7 shown, when the second electrical component E2 includes a shape with an outer circumferential surface at least a part of which is curved (e.g., a cylindrical coil), at least a part of the second inner partition wall 1141 (e.g., the two second portions at both ends) can have a partially curved shape (e.g., a concave shape) to correspond to the second electrical component E2. Thus, as Figure 4As shown, both ends of the second electrical component E2 in the length direction can be respectively placed or supported on both ends of the second inner partition wall 1141. The portion of the second inner partition wall 1141 in contact with the second electrical component E2 can have a height smaller than that of other portions of the second inner partition wall 1141.

[0085] The second outer partition wall 1142 can extend from the second surface 1112 toward the second inner partition wall 1141. The second outer partition wall 1142 can be continuously formed along the entire height direction of the second surface 1112, or can have a height smaller than that of the second surface 1112 by extending upward from the first surface 1111. A plurality of second outer partition walls 1142 can be included. For example, as Figure 4 shown, two second outer partition walls 1142 can be spaced apart in the length direction of the power control device 100 (e.g., Figure 4 the X-axis direction in ). The second outer heat transfer element 1152 of the second heat transfer element 115 can be inserted into the space between the two second outer partition walls 1142. The height of the second outer partition wall 1142 can be equal to or greater than the height of the second outer heat transfer element 1152.

[0086] The second inner partition wall 1141 and the second outer partition wall 1142 can be in contact with each other. For example, as Figure 5 shown, both ends of the second inner partition wall 1141 can be respectively in contact with the two second outer partition walls 1142. The second inner partition wall 1141 and the second outer partition wall 1142 can be integrally formed, that is, formed as a whole.

[0087] The third partition wall 116 can be formed to correspond to the third placement area 1183. The third partition wall 116 can support the third electrical component E3 and the third heat transfer element 117. For example, the third partition wall 116 can support the third electrical component E3 and the third heat transfer element 117 together with the first surface 1111 and the second surface 1112.

[0088] The third partition wall 116 can include a third inner partition wall 1161 and a third outer partition wall 1162.

[0089] The third inner partition wall 1161 can extend upward from the first surface 1111. For example, as Figure 4 shown, the third inner partition wall 1161 is spaced apart from the second surface 1112 and extends upward from the first surface 1111, and both ends of the third inner partition wall 1161 can extend toward the third outer partition wall 1162 respectively. For example, the third inner partition wall 1161 can have a long side extending in the length direction of the power control device 100 (e.g., Figure 4 the X-axis direction) and respectively in the width direction of the power control device 100 (e.g.,Figure 4 Two short sides extending in the Y-axis direction (e.g., from both ends of the long side toward the third inner partition wall 1162). The third inner partition wall 1161 can accommodate the third heat transfer element 117 (e.g., the third inner heat transfer element 1171) therein. Both ends of the third inner partition wall 1161 can contact one side surface of the third electrical component E3. In this regard, the side surface of the third inner heat transfer element 1171 can be completely surrounded by the third electrical component E3 and the third inner partition wall 1161. The height of the third inner partition wall 1161 can be equal to or greater than the height of the third inner heat transfer element 1171.

[0090] The third outer partition wall 1162 can extend from the second surface 1112 toward the third inner partition wall 1161. The third outer partition wall 1162 can be continuously formed along the entire height direction of the second surface 1112, or can extend upward from the top of the first surface 1111 and have a height smaller than the height of the second surface 1112. A plurality of third outer partition walls 1162 can be included. For example, as Figure 4 shown, two third outer partition walls 1162 can be spaced apart from each other in the length direction of the power control device 100 (e.g., Figure 4 the X-axis direction in). The third outer heat transfer element 1172 of the third heat transfer element 117 can be in the space between the two third outer partition walls 1162. Both ends of the third outer partition wall 1162 can contact the other side of the third electrical component E3. In this regard, the side surface of the third outer heat transfer element 1172 can be completely surrounded by the third electrical component E3, the second surface 1112, and the third outer partition wall 1162. The height of the third outer partition wall 1162 can be equal to or greater than the height of the third outer heat transfer element 1172.

[0091] The heat transfer element TM can effectively absorb the heat emitted from the electrical component E and transfer the heat to the outside of the power control device 100. For example, the heat transfer element TM can transfer the heat emitted from the electrical component E to the first surface 1111 and the second surface 1112 of the housing 110 or to the partition wall W. Therefore, the heat emitted from the electrical component E does not stay inside the power control device 100 including the internal space 111, but is dispersed throughout the housing 110 and quickly released to the outside of the power control device 100.

[0092] The heat transfer element TM can be applied to an area in contact with or adjacent to the electrical component E. For example, the heat transfer element TM can be applied together with the electrical component E to the placement area 118. The heat transfer element TM applied to the placement area 118 can contact multiple surfaces of the electrical component E. For example, the heat transfer element TM can contact one or more of the multiple side surfaces of the electrical component E and / or the bottom surface of the electrical component E. The heat transfer element TM applied to the placement area 118 can be positioned within the partition wall W. For example, the heat transfer element TM can contact one or more surfaces of the partition wall W and also contact (e.g., simultaneously contact) one or more surfaces of the electrical component E. The heat transfer element TM can be applied between the partition wall W and the electrical component E. The height of the heat transfer element TM can be equal to or smaller than the height of the housing 110 (e.g., the height of the second surface 1112). The height of the heat transfer element TM can be equal to or smaller than the height of the corresponding electrical component E. The heat transfer element TM can contact the partition wall W and the electrical component E. The heat transfer element TM corresponding to one placement area 118 can contact multiple surfaces of the electrical component E corresponding to that placement area 118.

[0093] For example, multiple placement areas 118, electrical components E, and heat transfer elements TM can be provided in the housing 110, and the multiple placement areas 118 can be spaced apart from each other.

[0094] For example, the heat transfer element TM can include a thermally conductive adhesive (TCA). The heat transfer element TM can include a mixture of a binder (e.g., one or more of epoxy resin, silicone resin, polyurethane, and other known binder materials) having a thermal conductivity of about 1.5 W / m•K or higher and a thermally conductive inorganic filler (e.g., copper, silver, and other known inorganic fillers). The heat transfer element TM can be a two-component type heat transfer element in which the base material and the hardener are separately mixed, or a one-component type heat transfer element in which the base material and the hardener are mixed. The two-component heat transfer element TM can be applied around the placement area 118 for placing the electrical component E by mixing the base material and the hardener via the use of a mixer or other mixing method. The one-component heat transfer element TM can be directly applied around the placement area 118 for placing the electrical component E without an additional mixing process. After the heat transfer element TM is applied, the heat transfer element TM can be hardened by heat treatment, ultraviolet irradiation, or natural curing for a period of time.

[0095] The heat transfer element TM can include a first heat transfer element 113, a second heat transfer element 115, and a third heat transfer element 117.

[0096] The first heat transfer element 113 may correspond to the first electrical component E1 in the first placement area 1181. The first heat transfer element 113 may be accommodated between the first surface 1111, the second surface 1112, and the first partition wall 112, and may transfer and disperse the heat generated from the first electrical component E1 to the first surface 1111 and the second surface 1112. The first heat transfer element 113 may contact one or more surfaces of the first electrical component E1. For example, the first heat transfer element 113 may contact both sides of the first electrical component E1 (e.g., both sides in the width direction of the power control device 100 (e.g., Figure 4 the Y-axis direction in

[0097] The first heat transfer element 113 may include a first inner heat transfer element 1131 and a first outer heat transfer element 1132.

[0098] The first inner heat transfer element 1131 may be accommodated in the first inner partition wall 1121 and may contact one side of the first electrical component E1. The first outer heat transfer element 1132 may be accommodated in the two first outer partition walls 1122 and the second surface 1112 and may contact the other side of the first electrical component E1. The first inner heat transfer element 1131 may have a shape and size corresponding to the inner surface of the first inner partition wall 1121. The first inner heat transfer element 1131 may have a height H1, and the height H1 may be equal to or smaller than the total height of the first electrical component E1 and equal to or smaller than the height of the second surface 1112. The first inner heat transfer element 1131 may have a thickness T1a, and the thickness T1a may be smaller than the thickness (or width) of the first electrical component E1 and larger than the thickness of the first partition wall 112. The first outer heat transfer element 1132 may have a height H1, and the height H1 may be equal to or smaller than the total height of the first electrical component E1 and equal to or smaller than the height of the second surface 1112. The first outer heat transfer element 1132 may have a thickness T1b, and the thickness T1b may be smaller than the thickness of the first electrical component E1 and larger than the thickness of the first partition wall 112. The first inner heat transfer element 1131 and the first outer heat transfer element 1132 may be separated from each other or spaced apart from each other.

[0099] The second heat transfer element 115 can correspond to the second electrical component E2 in the second placement area 1182. The second heat transfer element 115 can be accommodated between the first surface 1111, the second surface 1112, the third surface 1113, the groove 1114, and the second partition wall 114, and can transfer and disperse the heat generated from the third electrical component E3 to the first surface 1111, the second surface 1112, the third surface 1113, and the groove 1114. For example, as Figure 4 shown, a part of the second heat transfer element 115 can be accommodated between the first surface 1111, the second surface 1112, and the second partition wall 114. In addition, as Figure 7 shown, a part of the second heat transfer element 115 can be accommodated on the third surface 1113 and in the groove 1114. The second heat transfer element 115 has a shape corresponding to the second electrical component E2 and can surround at least a part of the second electrical component E2. For example, if the second electrical component E2 is a cylindrical coil, the second heat transfer element 115 can have a concave shape with a curvature corresponding to the outer circumferential surface of the second electrical component E2. In this regard, as Figure 7 shown, at least a part of the circumference of the second electrical component E2 can be surrounded by the second heat transfer element 115. The second heat transfer element 115 can have a height equal to or smaller than the height of the second surface 1112.

[0100] The second heat transfer element 115 can include a second inner heat transfer element 1151 and a second outer heat transfer element 1152.

[0101] The second inner heat transfer element 1151 is located on the third surface 1113 and can surround at least a part of the second electrical component E2. For example, as Figure 7 shown, the second inner heat transfer element 1151 has a concave shape corresponding to the outer circumferential surface of the cylindrical second electrical component E2, and the second electrical component E2 can be placed in the concave part. Both sides of the second inner heat transfer element 1151 (for example, Figure 7 both sides in the Y-axis direction in ) can be in contact with the second inner partition wall 1141 and the second outer partition wall 1142 respectively. The side surface of the second inner heat transfer element 1151 adjacent to the second outer partition wall 1142 can be in contact with the second surface 1112.

[0102] The second inner heat transfer element 1151 can surround at least a portion of the outer circumference of the second electrical component E2. For example, the second inner heat transfer element 1151 can surround from about 30% to about 60% of the total length of the outer circumference of the second electrical component E2. If the ratio is less than about 30%, the second inner heat transfer element 1151 will not be able to absorb the heat generated from the second electrical component E2 properly or sufficiently. Conversely, if the ratio exceeds about 60%, heat will not be dissipated smoothly from the second electrical component E2, and the second electrical component E2 will be damaged. The second inner heat transfer element 1151 has a shape corresponding to the second electrical component E2, so as to stably support the second electrical component E2, and during the operation of the power control device 100, the second electrical component E2 can be prevented from separating from the second placement area 1182 or the second heat transfer element 115.

[0103] At least one second outer heat transfer element 1152 can extend from the second inner heat transfer element 1151. For example, the second outer heat transfer element 1152 can extend downward from the second inner heat transfer element 1151 and can be inserted into (for example, can extend into) the groove 1114. For example, as Figure 7 shown, two second outer heat transfer elements 1152 can extend downward from the bottom surface of the second inner heat transfer element 1151 in the height direction of the power control device 100 (for example, Figure 7 the Z-axis direction in ). One of the second outer heat transfer elements 1152 can extend downward from the side of the second inner heat transfer element 1151 that contacts the second surface 1112, and the other second outer heat transfer element 1152 can extend downward from the side of the second inner heat transfer element 1151 that contacts the second inner partition wall 1141. In this regard, as Figure 7 shown, the two second outer heat transfer elements 1152 can be spaced apart from each other and inserted into each groove 1114. Since the second outer heat transfer element 1152 is inserted into the groove 1114, the second heat transfer element 115 can be stably supported in the second placement area 1182, and during the operation of the power control device 100, the second heat transfer element 115 can not leave (or can not deviate from) the second placement area 1182. In addition, since the second heat transfer element 115 contacts the housing 110 at an enlarged area, the heat emitted from the second electrical component E2 can be dissipated effectively and quickly.

[0104] The second inner heat transfer element 1151 and the second outer heat transfer element 1152 can be formed integrally (for example, can be integrally formed). The second inner heat transfer element 1151 and the second outer heat transfer element 1152 can be formed as a whole without being separated from each other or spaced apart from each other.

[0105] For example, as Figure 7As shown, the second heat transfer element 115 may have a height H2. The height H2 is the total height of the second heat transfer element 115 from the bottom of the second heat transfer element 115 (e.g., the bottom of the second outer heat transfer element 1152) to the top of the second heat transfer element 115 (e.g., the top of the second inner heat transfer element 1151). The second inner heat transfer element 1151 may have a height H2a, and the second outer heat transfer element 1152 may have a height H2b. The height H2a may be greater than the height H2b. The second inner heat transfer element 1151 may have a portion disposed between the second electrical component E2 and the third surface 1113, and the corresponding portion may include the thinnest (uninterrupted) portion of the second heat transfer element 115. For example, the corresponding portion may be the portion corresponding to D, where D is the minimum distance between the second electrical component E2 and the third surface 1113. The distance D may be between about 5% and about 20% of the height H2a. If the ratio is less than about 5%, the heat absorption efficiency of the second heat transfer element 115 decreases and the vibration of the second electrical component E2 is directly transmitted to the third surface 1113, which may cause damage to the second electrical component E2 and the third surface 1113. If the ratio exceeds about 20%, the thickness of the second inner heat transfer element 1151 becomes too thick, which may hinder the smooth dissipation of heat from the second electrical component E2. The second heat transfer element 115 may have a width T2. The width T2 is the total width of the second heat transfer element 115, and the width T2 represents the maximum width of the second heat transfer element 115 in the width direction of the power control device 100 (e.g., Figure 7 the Y-axis direction in

[0106] The third heat transfer element 117 may correspond to the third electrical component E3 in the third placement area 1183. The third heat transfer element 117 may be accommodated within the first surface 1111, the second surface 1112, and the third partition wall 116, and may transfer and disperse the heat generated from the third electrical component E3 to the first surface 1111 and the second surface 1112. The third heat transfer element 117 may contact one or more surfaces of the third electrical component E3. For example, the third heat transfer element 117 may contact both sides of the third electrical component E3 (e.g., both sides in the width direction of the power control device 100 (e.g., Figure 4 the Y-axis direction in

[0107] The third heat transfer element 117 may include a third inner heat transfer element 1171 and a third outer heat transfer element 1172.

[0108] The third internal heat transfer element 1171 can be accommodated in the third internal partition wall 1161 and can be in contact with one side of the third electrical component E3. The third external heat transfer element 1172 can be accommodated in the two third external partition walls 1162 and the second surface 1112 and can be in contact with the other surface of the first electrical component E1. The third internal heat transfer element 1171 can have a shape and size corresponding to the inner surface of the third internal partition wall 1161. The third internal heat transfer element 1171 can have a height H3, and the height H3 can be equal to or smaller than the total height of the third electrical component E3 and equal to or smaller than the height of the second surface 1112. The third internal heat transfer element 1171 can have a thickness T3a, and the thickness T3a can be smaller than the thickness of the third electrical component E3 and larger than the thickness of the third partition wall 116. The third external heat transfer element 1172 can have a height H3, and the height H3 can be equal to or smaller than the total height of the third electrical component E3 and equal to or smaller than the height of the second surface 1112. The third external heat transfer element 1172 can have a thickness T3b, and the thickness T3b can be smaller than the thickness of the third electrical component E3 and larger than the thickness of the third partition wall 116. The third internal heat transfer element 1171 and the third external heat transfer element 1172 can be separated from each other or spaced apart from each other.

[0109] One or more battery modules 200 are included in the battery pack 10 and can be electrically connected / physically connected to the power control device 100. The battery module 200 can include a plurality of battery cells electrically connected to each other through cell tabs or the like. If there are multiple battery modules 200, the multiple battery modules 200 can be electrically connected to each other through a bus bar. Although Figure 2 the embodiment shown in includes twelve battery modules 200, the number of the battery modules 200 is not limited thereto and can vary according to the specifications of the battery pack 10. The battery module 200 can be accommodated inside the housing 300. The battery cells included in the battery module 200 can be one or more of cylindrical battery cells, prismatic battery cells, and pouch battery cells.

[0110] The housing 300 can hold (or accommodate) and support other components of the battery pack 10 (such as the power control device 100, the battery module 200, and the controller 400). The housing 300 has an internal space, and the power control device 100, the battery module 200, and the controller 400 can be included in (e.g., can be accommodated in) the internal space. The housing 300 can protect other components of the battery pack 10 from external impacts and foreign objects.

[0111] The housing 300 may include attachable and detachable parts that are different from each other. For example, the housing 300 may include a case and a cover. In the case, a bottom and a plurality of side walls extending along the edges of the bottom are integrally formed, and the cover can be attached to and detached from the case. The housing 300 may be attachably and detachably mounted in other applications such as the vehicle 1.

[0112] The controller 400 may detect the current state of the battery pack 10 and accordingly control the charging / discharging and power supply of the battery pack 10. The controller 400 is mounted inside the housing 300 and may be electrically connected to the power control device 100 and the battery modules 200. For example, the controller 400 may regulate the voltage by balancing the voltages of each battery cell included in the battery modules 200 and control the battery cells to prevent overloading. In addition, the controller 400 may measure the temperature and current of the battery cells to prevent overcurrent and undercurrent of the battery cells and manage the temperature of the battery cells. The controller 400 may detect the current, voltage, and temperature of the battery cells to predict the state of charge (SOC) and prevent overcharging and over-discharging of the battery modules.

[0113] The controller 400 may control the power supplied to the application by controlling the power control device 100. For example, the controller 400 may allow the current supplied from the battery modules 200 to be supplied to a load such as a motor or an inverter of the vehicle 1 through the power control device 100. If an overcurrent flows in the battery modules 200 or a leakage or short circuit occurs, the controller 400 may cut off the current flowing through the power control device 100. For example, the controller 400 may cut off the current supplied to the coils of the positive main relay and the negative main relay, which are electrical components E included in the power control device 100, to cut off the current supplied from the power control device 100 to the application.

[0114] In the battery pack according to an embodiment of the present disclosure, the heat transfer element absorbs the heat generated from the electrical components of the power control device and effectively and quickly releases the heat to the outside of the case, thereby improving the reliability and durability of the electrical components, the power control device including the electrical components, and the entire battery pack.

[0115] In the battery pack according to an embodiment of the present disclosure, the partition wall controls the shape, size, area, and application area of the heat transfer element to prevent the heat transfer element from being applied to an area other than the placement area or having uneven shape and size.

[0116] In the battery pack according to an embodiment of the present disclosure, the heat transfer element absorbs the heat generated from the electrical components and releases the heat to one or more of the first surface, the second surface, the third surface, the groove, and the partition wall of the case, thereby preventing the electrical components from overheating.

[0117] However, aspects and features of the present disclosure are not limited to the above aspects and features, and other aspects and features not mentioned can be clearly understood by those skilled in the art from the description of the present disclosure and the appended claims.

[0118] Although the present disclosure has been described with reference to the embodiments shown in the drawings, these are only examples. Those of ordinary skill in the art will understand that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure. Therefore, the technical scope of the present disclosure is defined by the appended claims and their equivalents.

[0119] It should be understood that the embodiments described herein should be considered as descriptive rather than for the purpose of limitation. The description of a feature or aspect within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the drawings, those of ordinary skill in the art will understand that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. A battery pack, the battery pack comprising: a plurality of battery modules; and a power control device configured to control power supplied by the plurality of battery modules, the power control device comprising: a housing including a partition wall defining a placement area; electrical components within the housing; and a heat transfer element in contact with the electrical components or applied around the electrical components.

2. The battery pack according to claim 1, wherein, The electrical components and the heat transfer element are within the placement area.

3. The battery pack according to claim 1, wherein, The heat transfer element is in contact with the partition wall and the electrical components.

4. The battery pack according to claim 1, wherein, The heat transfer element is in contact with a plurality of surfaces of the electrical components.

5. The battery pack according to claim 1, wherein, The placement area, the electrical components, and the heat transfer element are each provided in plurality within the housing, and wherein the plurality of placement areas are spaced apart from each other.

6. The battery pack according to claim 1, wherein, The housing has: a first surface forming the bottom surface of the housing; and a second surface extending along an edge of the first surface, wherein the partition wall extends from at least one of the first surface and the second surface, and wherein the placement area is defined by the first surface, the second surface, and the partition wall.

7. The battery pack according to claim 6, wherein, The partition wall includes: an inner partition wall extending from the first surface and spaced apart from the second surface; and an outer partition wall extending from the second surface toward the inner partition wall.

8. The battery pack according to claim 7, wherein, The heat transfer element is applied within the inner partition wall and in contact with the inner partition wall and one surface of the electrical components, and wherein the heat transfer element is applied within the outer partition wall and in contact with the outer partition wall, the second surface, and another surface of the electrical components.

9. The battery pack according to claim 7, wherein, The outer partition wall includes two outer partition walls spaced apart from each other and extending from the second surface, and wherein the heat transfer element is applied between the two outer partition walls.

10. The battery pack according to claim 6, wherein, The placement area, the electrical components, the heat transfer element, and the partition wall respectively include a plurality of placement areas, a plurality of electrical components, a plurality of heat transfer elements, and a plurality of partition walls.

11. The battery pack according to claim 10, wherein, The placement area includes a first placement area, a second placement area, and a third placement area spaced apart from each other, wherein the electrical components include a first electrical component, a second electrical component, and a third electrical component corresponding to the first placement area, the second placement area, and the third placement area respectively, wherein the heat transfer elements include a first heat transfer element, a second heat transfer element, and a third heat transfer element corresponding to the first placement area, the second placement area, and the third placement area respectively, and wherein the partition walls include a first partition wall, a second partition wall, and a third partition wall corresponding to the first placement area, the second placement area, and the third placement area respectively.

12. The battery pack according to claim 11, wherein, The first partition wall includes: a first inner partition wall extending upward from the first surface and having ends extending in a width direction toward the second surface; and two first outer partition walls extending from the second surface toward the first inner partition wall and spaced apart from each other, wherein the first electrical component is at a central portion of the first placement area between the first inner partition wall and the first outer partition walls.

13. The battery pack according to claim 12, wherein, The first heat transfer element includes: A first internal heat transfer element, accommodated in the first internal partition wall and in contact with one surface of the first electrical component; and A first external heat transfer element, separated from the first internal heat transfer element, accommodated between the two first external partition walls, and in contact with the other surface of the first electrical component.

14. The battery pack according to claim 11, wherein, The second partition wall includes: A second internal partition wall, extending upward from the first surface, with both ends of the second internal partition wall extending toward the second surface in the width direction; and Two second external partition walls, extending from the second surface toward the second internal partition wall and spaced apart from each other, wherein the second electrical component is at the central portion of the second accommodation area between the second internal partition wall and the second external partition walls.

15. The battery pack according to claim 14, wherein, The second electrical component has an outer circumferential surface that is at least partially curved, and wherein a part of the second heat transfer element has a concave shape corresponding to the outer circumferential surface of the second electrical component.

16. The battery pack according to claim 15, wherein, The housing has: A third surface, protruding upward from the first surface; and A groove, around the third surface, wherein both the third surface and the groove correspond to the second accommodation area, and wherein the second heat transfer element includes: A second internal heat transfer element, between the third surface and the second electrical component; and A second external heat transfer element, extending from the second internal heat transfer element and extending into the groove.

17. The battery pack according to claim 11, wherein, The third partition wall includes: A third internal partition wall, extending upward from the first surface, with both ends of the third internal partition wall extending toward the second surface in the width direction; and Two third external partition walls, extending from the second surface toward the third internal partition wall and spaced apart from each other, wherein the third electrical component is at the central portion of the third accommodation area between the third internal partition wall and the third external partition walls.

18. The battery pack according to claim 17, wherein, The third heat transfer element includes: A third internal heat transfer element, accommodated in the third internal partition wall and in contact with one surface of the third electrical component; and A third external heat transfer element, separated from the third internal heat transfer element, accommodated between the two third external partition walls, and in contact with the other surface of the third electrical component.

19. The battery pack according to claim 11, wherein, The first electrical component includes a negative main relay, the second electrical component includes a fuse, and the third electrical component includes a positive main relay.

20. The battery pack according to claim 1, wherein, The heat transfer element includes a mixture of binder and thermally conductive inorganic filler.

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