A loudspeaker module and earphone

Abstract

The application provides a loudspeaker module and earphone. The loudspeaker module comprises a first loudspeaker unit, a support and a second loudspeaker unit. The first loudspeaker unit comprises a basket and a terminal, the terminal being arranged on the basket; the support comprises a conductive part; the second loudspeaker unit is fixed to the basket by means of the support, and an electrode of the second loudspeaker unit is electrically connected to the terminal by means of the conductive part. According to the loudspeaker module of the application, the electrical connection relationship between the first loudspeaker unit and the second loudspeaker unit can be simplified at least to some extent, at least one signal line for electrically connecting the first loudspeaker unit and the second loudspeaker unit can be omitted, the structure of the whole loudspeaker module is simplified, and the loudspeaker module is also facilitated to be electrically connected to a circuit board by means of the terminal.

Description

[0001] This application is a divisional application. The original application has the application number 202111276330.X and the original application date is October 29, 2021. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and in particular to a speaker module and headphones. Background Technology

[0003] In order to allow users to listen to the sound information provided by electronic products without disturbing others, headphones have become an essential accessory for electronic products.

[0004] In related technologies, the speaker module inside the headphones has poor structural compactness and low assembly efficiency. Summary of the Invention

[0005] This application provides a speaker module and headphones with good structural compactness.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, this application provides a loudspeaker module, including: a first loudspeaker unit, a bracket, and a second loudspeaker unit. The first loudspeaker unit includes a frame and terminals, with the terminals disposed on the frame; the bracket includes conductive portions; the second loudspeaker unit is fixed to the frame by the bracket, and the electrodes of the second loudspeaker unit are electrically connected to the terminals by the conductive portions.

[0008] According to the speaker module of the first aspect of this application, by providing a bracket and fixing the frame of the first speaker unit and the second speaker unit with the bracket, the first speaker unit and the second speaker unit are connected as a whole, so as to facilitate the modularization of the speaker module. Thus, during speaker module installation, the first speaker unit and the second speaker unit can be installed as a whole, eliminating the need to install the first speaker unit and the second speaker unit separately into the earphone housing, simplifying the installation of the speaker module and achieving a compact structure. Furthermore, by having the bracket have conductive parts, and the electrodes of the second speaker unit being electrically connected to the terminals via the conductive parts, the electrical connection between the first speaker unit and the second speaker unit can be simplified to at least a certain extent. At least one signal line for electrically connecting the first speaker unit and the second speaker unit can be omitted, simplifying the overall structure of the speaker module and facilitating the electrical connection of the speaker module to the circuit board via the terminals.

[0009] In one possible implementation of the first aspect of this application, the wiring terminal includes a negative terminal. The negative terminal of the second speaker unit is electrically connected to the negative terminal via a conductive part, which can be electrically connected to a ground point on the circuit board. This configuration eliminates the need for a negative signal line connecting the negative terminal to the negative terminal of the second speaker unit, simplifying the structure of the speaker module. Furthermore, when the conductive part is grounded, it improves the reliability of the bracket and at least partially avoids short-circuit problems.

[0010] In one possible implementation of the first aspect of this application, the first loudspeaker unit includes a first diaphragm assembly supported on a frame; the support bracket includes a support plate and a connecting portion, the support plate being located on one axial side of the first loudspeaker unit and opposite to the outer surface of the first diaphragm assembly, the connecting portion connecting the outer peripheral edge of the support plate to the peripheral wall of the frame, and the second loudspeaker unit being supported on the side of the support plate opposite to the first loudspeaker unit. This arrangement facilitates the support of the second loudspeaker unit using the support plate. In other embodiments, the support bracket may not include the support plate.

[0011] In one possible implementation of the first aspect of this application, the conductive part may consist of only a portion of the connecting part.

[0012] In one possible implementation of the first aspect of this application, the conductive part may consist only of the connecting part.

[0013] In one possible implementation of the first aspect of this application, the conductive part may be composed of a connecting part and a supporting plate.

[0014] In one possible implementation of the first aspect of this application, the conductive part may consist of a portion of the connecting part and the entire support plate.

[0015] In one possible implementation of the first aspect of this application, the conductive part can be constituted by a bracket. This simplifies the structure of the bracket, facilitates its fabrication, and reduces processing costs.

[0016] In one possible implementation of the first aspect of this application, a first sound transmission channel is formed on the support plate, and the second speaker unit does not cover the first sound transmission channel. This arrangement avoids the support plate and the second speaker unit from obstructing the sound transmission generated by the vibration of the first diaphragm assembly, thus preventing any impact on the sound output of the first speaker unit.

[0017] In one possible implementation of the first aspect of this application, the first audio transmission channel is a plurality of spaced-apart channels.

[0018] In one possible implementation of the first aspect of this application, the support plate is formed as an annular ring to define a first sound transmission channel, and the second speaker unit is formed as an annular ring extending circumferentially along the support plate to define a clearance channel, the clearance channel being connected to the first sound transmission channel.

[0019] In one possible implementation of the first aspect of this application, the connecting portion includes at least two sub-parts spaced apart circumferentially from the basin frame. Each sub-part connects to the outer peripheral edge of the support plate and the outer peripheral surface of the basin frame. Each sub-part has a locking hole, and the outer peripheral surface of the basin frame has a locking rib that mates with the locking hole. This achieves a detachable connection between the support and the basin frame. In other implementations, locking ribs may be formed on the sub-parts, and locking holes may be formed on the basin frame.

[0020] In one possible implementation of the first aspect of this application, at least some of the two sub-parts have slots formed on them.

[0021] In one possible implementation of the first aspect of this application, a sound transmission channel can be formed between two adjacent sub-parts. This sound transmission channel is then used to transmit the sound generated by the vibration of the first diaphragm assembly, thereby improving the sound output of the first loudspeaker unit.

[0022] In one possible implementation of the first aspect of this application, a portion of the orthographic projection of the sound transmission channel lies within the outer contour of the orthographic projection of the first diaphragm group in a plane parallel to the first diaphragm group. This arrangement further enhances the sound transmission effect of the sound transmission channel on the sound emitted by the first loudspeaker unit.

[0023] In one possible implementation of the first aspect of this application, a second sound transmission channel is formed on the portion of each sub-part located between the first diaphragm assembly and the support plate. This arrangement further improves the transmission effect of the sound emitted by the first speaker unit.

[0024] In one possible implementation of the first aspect of this application, a second sound transmission channel is formed on the portion of at least two sub-parts located between the first diaphragm assembly and the support plate.

[0025] In one possible implementation of the first aspect of this application, the connecting portion is formed as a closed ring extending circumferentially along the basin frame, a locking hole is formed on the connecting portion, and a locking rib is formed on the outer peripheral surface of the basin frame to mate with the locking hole. This achieves a detachable connection between the support and the basin frame. In other implementations, a locking rib may be formed on the connecting portion, and a locking hole may be formed on the basin frame.

[0026] In one possible implementation of the first aspect of this application, a plurality of locking holes are formed on the connecting part, and the plurality of locking holes are spaced apart in the circumferential direction of the basin frame. This is beneficial to improving the reliability of the fit between the connecting part and the basin frame.

[0027] In one possible implementation of the first aspect of this application, a second sound transmission channel is formed on the portion of the connecting part located between the first diaphragm assembly and the support plate. This arrangement can, to some extent, prevent the sub-part from obstructing the first speaker unit and affecting the sound transmission of the first speaker unit.

[0028] In one possible implementation of the first aspect of this application, a plurality of second sound transmission channels are formed on the portion of the connecting part located between the first diaphragm assembly and the support plate, and the plurality of second sound transmission channels are spaced apart in the circumferential direction of the frame. This arrangement can, to a certain extent, prevent the sub-parts from obstructing the first speaker unit and affecting the sound transmission of the first speaker unit.

[0029] In one possible implementation of the first aspect of this application, the orthographic projection of the second sound transmission channel lies within the outer contour of the orthographic projection of the first diaphragm group in a plane parallel to the first diaphragm group. This arrangement can further improve the sound transmission effect of the second sound transmission channel to the first speaker unit.

[0030] In one possible implementation of the first aspect of this application, the first loudspeaker unit includes a first voice coil connected to the inner surface of a first diaphragm assembly. The negative terminal has a conductive extension located within the frame, which can be electrically connected to the negative lead of the first voice coil. Since the negative lead of the first voice coil is relatively thin and has weak structural strength, it is easily scratched and damaged. Therefore, by electrically connecting the conductive extension to the negative lead of the first voice coil, the length of the negative lead can be shortened, avoiding the problem of scratching and damage between the negative lead and the frame, and improving the reliability of the first voice coil's operation.

[0031] In one possible implementation of the first aspect of this application, the peripheral wall of the speaker frame has a first opening, and the negative terminal has a conductive extension located inside the speaker frame, extending to the first opening. The portion of the conductive part facing the first opening is connected to the conductive extension. This allows for electrical connection between the second speaker unit and the negative terminal via a bracket. Furthermore, compared to directly connecting the conductive part to the negative terminal located outside the speaker frame, the negative terminal does not need to extend excessively beyond the outside of the speaker frame, thus avoiding interference with the internal structure of the housing due to excessive extension of the negative terminal beyond the speaker frame.

[0032] In one possible implementation of the first aspect of this application, the speaker module includes a conductive element, the wiring terminals include a positive terminal, and the positive terminal of the second speaker unit is electrically connected to the positive terminal via the conductive element.

[0033] In one possible implementation of the first aspect of this application, the conductive element can be enameled wire. This allows for insulation between the conductive element and the support.

[0034] In one possible implementation of the first aspect of this application, the first loudspeaker unit includes a first voice coil connected to the inner surface of a first diaphragm assembly. The positive terminal has a conductive connection portion located within the frame, which can be electrically connected to the positive lead of the first voice coil. Since the positive lead of the first voice coil is relatively thin and has weak structural strength, it is easily scratched and damaged. Therefore, by providing a conductive connection portion electrically connected to the positive lead of the first voice coil, the length of the positive lead can be shortened, avoiding the problem of scratching and damage between the positive lead and the frame, and improving the reliability of the first voice coil's operation.

[0035] In one possible implementation of the first aspect of this application, the positive terminal has a conductive wiring portion located inside the frame, and the peripheral wall of the frame has a second opening. The conductive element extends into the frame through the second opening and is electrically connected to the conductive wiring portion. This not only enables the second speaker unit to be electrically connected to the positive terminal through the conductive element, but also, compared to directly connecting the conductive element to the positive terminal located outside the frame, the positive terminal does not need to extend excessively beyond the frame, thus avoiding interference with the internal structure of the housing due to excessive extension of the positive terminal beyond the frame.

[0036] In one possible implementation of the first aspect of this application, a portion of the conductive element is located on the side facing the outer surface of the connector, and a wiring groove is formed on the outer surface of the connector, with the portion of the conductive element located within the wiring groove. This arrangement avoids interference between the conductive element protruding from the outer surface of the connector and other structures within the housing.

[0037] In one possible implementation of the first aspect of this application, the second speaker unit is a piezoelectric ceramic speaker unit, which is stacked with the support plate. This arrangement results in a more compact structure.

[0038] In one possible implementation of the first aspect of this application, the negative terminal of the second speaker unit is located at one end of the second speaker unit adjacent to the support plate, and the negative terminal of the second speaker unit is connected to the support plate by conductive adhesive. This arrangement facilitates the electrical connection between the negative terminal of the second speaker unit and the support plate, eliminating the need for additional signal lines or other structures for electrical connection. This simplifies the structure of the speaker module, reduces its cost, and also facilitates assembly.

[0039] In one possible implementation of the first aspect of this application, the positive terminal of the second speaker unit is located at the end of the second speaker unit away from the support plate, and the positive terminal of the second speaker unit is connected to the conductive component by conductive adhesive or welding. This arrangement facilitates the separation of the positive and negative terminals of the second speaker unit, and can at least partially avoid the problem of short circuits.

[0040] In one possible implementation of the first aspect of this application, the piezoelectric ceramic speaker unit includes a piezoelectric ceramic sheet. The piezoelectric ceramic sheet includes a piezoelectric body, a first electrode layer, and a second electrode layer. The first electrode layer is disposed on the surface of the piezoelectric body facing the support plate to form the negative electrode of the piezoelectric ceramic speaker unit, and the first electrode layer and the support plate are electrically connected via conductive adhesive. The second electrode layer is disposed on the surface of the piezoelectric body facing away from the support plate to form the positive electrode of the piezoelectric ceramic speaker unit, and the second electrode layer can be electrically connected to a conductive element.

[0041] In one possible implementation of the first aspect of this application, the second speaker unit is a moving-iron speaker unit, which is vertically supported on a support plate. This arrangement results in a more compact structure.

[0042] In one possible implementation of the first aspect of this application, the moving-iron loudspeaker unit includes a second diaphragm assembly, which is perpendicular to the first diaphragm assembly. This allows for at least some degree of avoidance of interference from the sound output of the first loudspeaker unit on the vibration of the second diaphragm assembly.

[0043] In one possible implementation of the first aspect of this application, the second loudspeaker unit further includes: a protective shell, a reed, a transmission rod, a second magnetic circuit system, and a second voice coil. The second diaphragm assembly is disposed within the protective shell to divide the space within the protective shell into a front cavity and a rear cavity. The reed, transmission rod, second magnetic circuit system, and second voice coil are all located within the rear cavity. The reed, transmission rod, second magnetic circuit system, and second voice coil cooperate to drive the second diaphragm assembly to vibrate.

[0044] In one possible implementation of the first aspect of this application, the second diaphragm assembly is axially parallel to the first speaker unit to divide the space within the protective housing into a front cavity and a rear cavity. The second magnetic circuit system is coaxially arranged with the second voice coil. This results in a simple structure and small size.

[0045] In one possible implementation of the first aspect of this application, the reed includes a first sheet, a second sheet, and a connecting sheet. Both the first and second sheets are arranged parallel to the second diaphragm assembly. The second sheet is located on the side of the first sheet away from the second diaphragm assembly. One end of the second sheet has a support extending beyond the edge of the first sheet. The connecting sheet connects the end of the second sheet away from the support and the end of the first sheet away from the support. The support is connected to one end of a transmission rod, and the other end of the transmission rod is connected to the second diaphragm assembly.

[0046] In one possible implementation of the first aspect of this application, the second magnetic circuit system includes a magnetically conductive portion and two magnet portions. The magnetically conductive portion is annular, and its axial direction is the same as that of the first speaker unit. A first sheet is supported on one side surface of the magnetically conductive portion adjacent to the second diaphragm assembly. The two magnet portions are disposed within the magnetically conductive portion and are arranged opposite each other in the radial direction of the magnetically conductive portion. The second sheet extends from one axial end of the magnetically conductive portion to the other axial end of the magnetically conductive portion, such that the support is located outside the magnetically conductive portion, and the second sheet is located between the two magnet portions.

[0047] In one possible implementation of the first aspect of this application, the sidewall of the protective shell adjacent to the support plate can be configured as a conductive structure. This conductive structure forms the negative electrode of the second speaker unit. The conductive structure is electrically connected to the support plate via conductive adhesive, and the negative lead of the second voice coil is welded to the conductive structure. This configuration allows the negative electrode of the second speaker unit to be electrically connected to the negative terminal block via a bracket.

[0048] In one possible implementation of the first aspect of this application, a through hole is provided on the peripheral wall of the protective shell, through which the negative lead of the second voice coil can pass and be electrically connected to the bracket.

[0049] In one possible implementation of the first aspect of this application, a wire-passing hole is formed on the peripheral wall of the protective shell, through which the conductive element can be electrically connected to the positive lead of the second voice coil, or through which the positive lead of the second voice coil can be electrically connected to the conductive element.

[0050] In one possible implementation of the first aspect of this application, the emission frequency of the second speaker unit is greater than that of the first speaker unit. Therefore, by including a first speaker unit and a second speaker unit with different emission frequencies in the headphones, it is advantageous to utilize the frequency difference between the first and second speaker units to ensure good sound performance across different frequency ranges, thereby improving the sound output effect of the speaker module.

[0051] Secondly, this application provides an earphone, comprising: a housing, a circuit board, and a speaker module as described in any of the above technical solutions. A sound outlet is formed on the housing; the circuit board is disposed inside the housing; the speaker module is disposed inside the housing, and both the first speaker unit and the second speaker unit emit sound towards the sound outlet, and the speaker module is electrically connected to the circuit board via terminals.

[0052] According to the second aspect of the present application, the earphones, by providing a speaker module including a bracket, and using the bracket to fix the frame of the first speaker unit and the second speaker unit, connect the first speaker unit and the second speaker unit into one unit, thereby facilitating the modularization of the speaker module. This allows the first and second speaker units to be installed as a single unit during speaker module installation, eliminating the need to separately install the first and second speaker units into the earphone housing, simplifying speaker module installation and achieving a compact structure. Furthermore, by having the bracket have conductive portions, and the electrodes of the second speaker unit being electrically connected to terminals via these conductive portions, the electrical connection between the first and second speaker units can be simplified to at least a certain extent. At least one signal line for electrically connecting the first and second speaker units can be omitted, simplifying the overall structure of the speaker module and facilitating electrical connection of the speaker module to the circuit board via terminals. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of the earphone provided in some embodiments of this application;

[0054] Figure 2 for Figure 1 The diagram shows the exploded structure of the headphones.

[0055] Figure 3 for Figures 1-2 The diagram shows the charging connection between the earphones and the wireless charging dock.

[0056] Figure 4 Cross-sectional views of the headphones provided in other embodiments of this application;

[0057] Figure 5 for Figure 4 A schematic diagram of the structure of the first speaker unit of the headphones shown;

[0058] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure of the first loudspeaker unit shown;

[0059] Figure 7 This is a partial structural diagram of the earphone provided in some embodiments of this application;

[0060] Figure 8 for Figure 7 A schematic diagram of the speaker module of the headphones shown;

[0061] Figure 9 for Figure 8 The diagram shows the structural design of the bracket in the speaker module.

[0062] Figure 10 for Figure 8 A schematic diagram of the speaker module from another angle;

[0063] Figure 11 This is a schematic diagram of the structure of the bracket according to other embodiments of this application;

[0064] Figure 12a This is a schematic diagram of the structure of the bracket in some embodiments of this application;

[0065] Figure 12b This is a schematic diagram of the structure of the bracket in some other embodiments of this application;

[0066] Figure 13 for Figure 8 A schematic diagram of the speaker module from another angle;

[0067] Figure 14a for Figure 13 The enlarged view of the speaker module shown in the image, specifically the circled portion at point A;

[0068] Figure 14b for Figure 13 The image shows a cross-sectional view of the speaker module at the BB line;

[0069] Figure 15 for Figure 8 The diagram shows the connection of the speaker module's bracket, second speaker unit, wiring terminals, and conductive components.

[0070] Figure 16 This is a schematic diagram of the speaker module structure in some other embodiments of this application;

[0071] Figure 17 for Figure 8 The diagram shows a cross-sectional view of the speaker module.

[0072] Figure 18 This is a schematic diagram of the structure of a speaker module according to some embodiments of this application;

[0073] Figure 19 for Figure 18 A schematic diagram of the cross-sectional structure of the second speaker unit shown;

[0074] Figure 20 for Figure 19A schematic diagram of the structure of the second diaphragm assembly of the second loudspeaker unit shown in the figure;

[0075] Figure 21 for Figure 19 A schematic diagram of the reed structure of the second speaker unit shown;

[0076] Figure 22 for Figure 19 A schematic diagram of the second magnetic circuit system of the second speaker unit shown in the figure;

[0077] Figure 23 This is a schematic diagram of a speaker module according to some other embodiments of this application.

[0078] Figure Labels

[0079] 100. Headphones;

[0080] 1. Outer shell; 10. Accommodating space; 101. First accommodating cavity; 11. Front shell; 110. Sound outlet; 111. Main body; 112. Extension; 1121. Limiting rib; 12. Rear shell; 102. Second accommodating cavity; 121. Cover; 122. Rod; 13. Contact sleeve;

[0081] 2. Motherboard;

[0082] 3. Battery;

[0083] 4. Speaker module;

[0084] 4a. First loudspeaker unit; 4a21. First diaphragm assembly; 4a211. First connecting part; 4a212. First surround; 4a213. First dome; 4a22. First voice coil; 4a23. First magnetic circuit system; 4a23a. Magnetic gap; 4a231. Side magnetic part; 4a232. First center magnetic part; 4a233. Second center magnetic part; 4a234. Magnetic yoke; 4a24. Frame; 4a241. First opening; 4a242. Second opening; 4a2413. Annular groove; 4a25. Terminal block; 4a251. Negative terminal block; 4a2511. Conductive extension; 4a252. Positive terminal block; 4a2521. Conductive connection part;

[0085] 4b. Second loudspeaker unit; 4b1. Protective shell; 4b1 a. First shell portion; 4b1 b. Second shell portion; 4b11. Sound outlet channel; 4b21. Second diaphragm assembly; 4b21 a. Second connecting portion; 4b21 b. Second surround; 4b21c. Second dome; 4b22. Reed; 4b221. First sheet; 4b222. Second sheet; 4b223. ​​Connecting sheet; 4b224. Support body; 4b23. Drive rod; 4b24. Second magnetic circuit system; 4b241. Magnetic guide portion; 4b242. Magnet portion; 4b25. Second voice coil; 4b3. Clearance channel; 4b41. First electrode layer; 4b42. Second electrode layer; 4b43. Piezoelectric element;

[0086] 4c, bracket; 4c1, support plate; 4c11, first sound transmission channel; 4c2, connecting part; 4c21, sub-part; 4c211, slot; 4c22, wiring channel; 4c23, sound transmission channel; 4c24, second sound transmission channel;

[0087] 4d, conductive components;

[0088] 4e. Conductive adhesive;

[0089] 5. Wireless charging module; 51. Receiving coil; 52. AC / DC power conversion component; 53. Charging control component; 6. Wireless communication module;

[0090] 200. Wireless charging base; 201. Charging coil; 202. DC / AC power conversion component; 203. Power interface. Detailed Implementation

[0091] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0092] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "inner" and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to two or more.

[0093] In the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0094] This application provides an earphone 100 that can be used with electronic products such as mobile phones, tablets, and laptops to receive sound information provided by the electronic products and output it to the user. By using the earphone 100 with electronic products, the sound from the electronic products can be prevented from disturbing others. The earphone 100 can be a wireless earphone or a wired earphone.

[0095] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the earphone 100 provided in some embodiments of this application; Figure 2 for Figure 1 The exploded view of the earphone 100 shown is illustrated. Figure 1 and Figure 2 The illustrated earphone 100 is a wireless earphone as an example. In this embodiment, the earphone 100 may include a housing 1, a circuit board 2, a battery 3, a wireless charging module 5, a wireless communication module 6, and a speaker module 4.

[0096] Understandable, Figure 1 , Figure 2 The accompanying drawings below only schematically illustrate some of the components included in the earphone 100; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 , Figure 2 As well as the accompanying drawings below. Furthermore, when the earphone 100 is a wired earphone, it may not include the battery 3, the wireless communication module 6, and the wireless charging module 5.

[0097] The outer shell 1 can serve as a carrier for the functional components within the earphone 100, protecting these components located within the accommodating space 10 of the outer shell 1. Furthermore, when a user wears the earphone 100, the earphone 100 contacts the user's ear through the outer shell 1. Therefore, to improve the user's comfort when wearing the earphone 100, the outer shell 1 can be shaped to fit the shape of the human ear.

[0098] Since the outer shell 1 is directly exposed to the external environment and in contact with the human ear, or the earphone 100 comes into contact with other external structures through the outer shell 1, scratches and corrosion on the outer surface of the outer shell 1 are inevitable. To avoid this technical problem, the outer shell 1 can have certain properties such as wear resistance, corrosion resistance, and scratch resistance, or a layer of functional material for wear resistance, corrosion resistance, and scratch resistance can be coated on the outer surface of the outer shell 1.

[0099] In some embodiments, the outer shell 1 can be a single structural unit, meaning it can be a one-piece molded part, which provides higher structural strength. In other embodiments, the outer shell 1 can also be formed by assembling multiple parts. Please continue reading. Figure 1 and Figure 2 In this embodiment, the outer shell 1 may include a front shell 11 and a rear shell 12. The front shell 11 faces the user's ear when the earphone 100 is in use, and the rear shell 12 faces away from the user's ear. The outer shell 1 is formed by assembling the front shell 11 and the rear shell 12. This facilitates the separate processing of the front shell 11 and the rear shell 12, simplifies the mold structure of the front shell 11 and the rear shell 12, reduces the molding difficulty of the front shell 11 and the rear shell 12, and consequently reduces the manufacturing difficulty of the outer shell 1. Specifically, the front shell 11 can be fixedly connected to the rear shell 12 by a snap-fit ​​method. The front shell 11 can also be connected to the rear shell 12 by screws. Alternatively, in other embodiments, the front shell 11 can also be fixedly connected to the rear shell 12 by glue or tape.

[0100] The front shell 11 can be made of materials including but not limited to hard plastic, metal, and a combination of plastic and metal. To achieve a lightweight design for the Headphones 100, the front shell 11 can be made of hard plastic.

[0101] Please see Figure 2 A first receiving cavity 101 is formed inside the front shell 11, and the side of the first receiving cavity 101 adjacent to the rear shell 12 is open. A sound outlet 110 communicating with the first receiving cavity 101 is formed on the front shell 11, and the sound of the earphone 100 can be conducted to the outside of the earphone 100 through the sound outlet 110.

[0102] Specifically, the front housing 11 may include a main body 111 and an extension 112. The extension 112 may be located on one side of the main body 111 and extend in a direction away from the main body 111. See also Figure 2 The first receiving cavity 101 can be formed inside the main body 111, and the sound outlet 110 can be formed in the extension 112. It is understood that in some other embodiments, the front shell 11 may not include the extension 112, but instead the sound outlet 110 is directly formed on the wall of the main body 111.

[0103] To improve user comfort when wearing the headphones 100, the headphones 100 may also be provided with a contact sleeve 13, which can be used to contact the user's ear. For example, the contact sleeve 13 may surround the outer peripheral surface of the extension 112, and the contact sleeve 13 may be similar in shape to the human ear canal to improve the fit of wearing the headphones 100. At the same time, the contact sleeve 13 may be made of flexible materials such as silicone and rubber to improve user comfort when wearing the headphones 100.

[0104] Please see Figure 2 A limiting rib 1121 can be formed on the outer peripheral surface of the extension 112, so that when the contact sleeve 13 surrounds the outer peripheral surface of the extension 112, the limiting rib 1121 can abut against the contact sleeve 13, thereby limiting the contact sleeve 13 and reducing the probability of the contact sleeve 13 falling off the extension 112 naturally. Of course, in order to reduce costs, the earphone 100 may not include the contact sleeve 13.

[0105] The material of the back cover 12 can be the same as that of the front cover 11. Of course, the material of the back cover 12 can also be different from that of the front cover 11. In order to achieve the lightweight design of the earphone 100, the material of the back cover 12 can be hard plastic.

[0106] Please continue reading. Figure 2 The rear shell 12 may include a cover 121 and a rod 122. The cover 121 may be connected to the front shell 11, and the rod 122 may be disposed on the side of the cover 121 away from the front shell 11. A second receiving cavity 102 may be formed inside the cover 121, and the side of the second receiving cavity 102 adjacent to the front shell 11 is open, so that the second receiving cavity 102 can communicate with the first receiving cavity 101, and the second receiving cavity 102 and the first receiving cavity 101 can together form the receiving space 10 of the outer shell 1.

[0107] The cover 121 and the rod 122 can be an integral structure, meaning they form a single unit. This simplifies the manufacturing process of the rear shell 12 and improves the connection strength between the cover 121 and the rod 122. However, this application is not limited to this; the cover 121 and the rod 122 can also be assembled, and connected by adhesive, snap-fit, screws, or welding.

[0108] The circuit board 2 can be accommodated within the receiving space 10. Specifically, the circuit board 2 can be installed within the second receiving cavity 102. The installation methods of the circuit board 2 within the housing 1 include, but are not limited to, snap-fit, screw connection, or adhesive bonding.

[0109] Circuit board 2 is used to integrate control chips, such as application processors (APs), double data rate synchronous dynamic random access memory (DDR), and universal first-flash storage (UFS). Circuit board 2 is electrically connected to functional components such as wireless communication module 6, wireless charging module 5, battery 3, and speaker module 4 to realize signal control and data signal processing between different functional components.

[0110] Circuit board 2 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. Circuit board 22 can be an FR-dielectric board, a Rogers-dielectric board, or a hybrid FR- and Rogers-dielectric board, etc. Here, FR- is a designation for a flame-retardant material grade, and Rogers-dielectric board is a high-frequency board.

[0111] The wireless communication module 6 can be integrated onto the circuit board 2. For example, the wireless communication module 6 can be soldered and fixed onto the circuit board 2. Optionally, the wireless communication module 6 can be a Bluetooth, infrared, or Wi-Fi module. The earphone 100 can wirelessly interact with electronic products via the wireless communication module 6 to receive audio information from the electronic products.

[0112] Battery 3 provides power to functional devices within the earphone 100, such as circuit board 2, wireless communication module 6, and speaker module 4. Battery 3 may include, but is not limited to, nickel-cadmium, nickel-metal hydride, lithium, or other types of batteries. Furthermore, the number of batteries 3 in this embodiment may be multiple or a single battery. The shape of battery 3 includes, but is not limited to, a cuboid, cylinder, or frustum. In some examples, battery 3 may be located within the second receiving cavity 102, and battery 3 may be located on the side of circuit board 2 closest to the first receiving cavity 101. In other examples, battery 3 may also be located on the side of circuit board 2 opposite to the first receiving cavity 101. The installation method of battery 3 within the housing 1 includes, but is not limited to, snap-fit, screw connection, or adhesive bonding.

[0113] The wireless charging module 5 can be integrated onto the circuit board 2 and wirelessly charges the battery 3 inside the earphone 100. For details, please refer to [link / reference needed]. Figure 3 , Figure 3 for Figures 1-2 The diagram shows a charging connection between the earphone 100 and the wireless charging dock 200. In this embodiment, the wireless charging module 5 includes a receiving coil 51, an AC / DC conversion component 52, and a charging control component 53. The receiving coil 51, the AC / DC conversion component 52, and the charging control component 53 are all electrically connected to the circuit board 2.

[0114] The receiving coil 51 can receive the wireless charging input from the wireless charging dock 200 of the earphone 100. Of course, this application is not limited to this; the receiving coil 51 can also receive the wireless charging input from other terminals that support wireless charging. The receiving coil 51 is a receiving (Rx) coil. The AC / DC conversion component 52 can be an Rx chip.

[0115] The wireless charging dock 200 includes a power interface 203, a charging coil 201, and a DC / AC conversion component 202. The charging coil 201 can be a transmitting (Tx) coil. The DC / AC conversion component 202 can be a Tx chip.

[0116] In the embodiments of this application, the wireless charging dock 200 serves as the transmitter of the wireless charging signal, and the earphone 100 serves as the receiver of the wireless charging signal. The wireless charging dock 200 wirelessly charges the earphone 100. Specifically, the DC / AC conversion component 202 of the wireless charging dock 200 can receive the DC signal input from the power interface 203. The DC / AC conversion component 202 can convert the DC signal into an AC signal, and then input the AC signal to the charging coil 201. The charging coil 201 responds to the AC signal and can generate an alternating electromagnetic field.

[0117] The receiving coil 51 of the earphone 100 is coupled to the charging coil 201. The receiving coil 51 (i.e., the Rx coil) senses the alternating electromagnetic field emitted by the charging coil 201 (i.e., the Tx coil), generating an alternating current signal, which is then input to the AC / DC converter 52. The AC / DC converter 52 rectifies the AC signal into a DC signal and inputs it to the charging control unit 53. The charging control unit 53 can then charge the battery 3 based on the DC signal.

[0118] Of course, this application is not limited to this. In other examples, the earphone 100 can also support wired charging. Specifically, the housing 1 is provided with a charging interface, which is electrically connected to the circuit board 2. The charging interface can be connected to a wired charger (also called a power adapter) and receive charging input from the wired charger for the battery 3. For example, the charging interface described above can be a Universal Serial Bus (USB) interface.

[0119] Please return to the reference. Figure 2The speaker module 4 can be installed within the accommodating space 10, and is located on the side of the battery 3 near the sound outlet 110. Specifically, the speaker module 4 can be installed within the first accommodating cavity 101. The assembly method between the speaker module 4 and the housing 1 includes, but is not limited to, snap-fit, threaded connection, or adhesive bonding. The speaker module 4 is electrically connected to the circuit board 2 to obtain audio electrical signals such as music and voice, and the speaker module 4 can convert the audio electrical signals into sound signals to support audio playback.

[0120] The speaker module 4 used in the headphone 100 of the above embodiment is a dynamic woofer. While this enables the headphone 100 to have low-frequency performance and makes the headphone 100 cheaper to manufacture, the dynamic woofer has a large vibrating mass and poor transient response. The asymmetrical distribution of mass distribution, diaphragm compliance, and BL electromagnetic driving force will produce varying degrees of rocking vibration and segmented vibration at different frequencies, resulting in severe peaks and valleys in the high-frequency response. This makes it impossible to achieve high-frequency performance, resulting in poor audio output performance and poor sound quality of the headphone 100.

[0121] Please see Figure 4 , Figure 4 This is a cross-sectional view of the earphone 100 provided in some other embodiments of this application. In this embodiment, the speaker module 4 includes a first speaker unit 4a and a second speaker unit 4b.

[0122] The first speaker unit 4a and the second speaker unit 4b are spaced apart and disposed within the housing 1. Both the first speaker unit 4a and the second speaker unit 4b emit sound towards the sound outlet 110. The emission frequency of the second speaker unit 4b is higher than that of the first speaker unit 4a. Therefore, by including the first speaker unit 4a and the second speaker unit 4b with different emission frequencies in the headphone 100, it is advantageous to utilize the difference in emission frequencies between the first speaker unit 4a and the second speaker unit 4b to enable the headphone 100 to have better sound performance in different frequency ranges, thereby improving the sound output effect of the speaker module 4.

[0123] Specifically, in this embodiment, the first speaker unit 4a can be used as a woofer. For example, the first speaker unit 4a can be a moving-coil woofer. The second speaker unit 4b can be a tweeter. For example, the second speaker unit 4b can be a moving-iron speaker unit, a planar voice coil speaker unit, or a piezoelectric ceramic speaker unit.

[0124] In the embodiments of this application, the first speaker unit 4a is used as a woofer and the second speaker unit 4b is used as a tweeter, thereby enabling the headphones 100 to have performance in both the low-frequency and high-frequency ranges and improving the sound output effect of the speaker module 4.

[0125] Please see Figure 5 and Figure 6 , Figure 5 for Figure 4 A schematic diagram of the structure of the first speaker unit 4a of the headphones shown; Figure 6 for Figure 5 The diagram shows a cross-sectional view of the first loudspeaker unit 4a. In this embodiment, the first loudspeaker unit 4a includes a first diaphragm assembly 4a21, a first voice coil 4a22, a first magnetic circuit system 4a23, a frame 4a24, and a terminal block 4a25.

[0126] Understandable, Figure 5 and Figure 6 The accompanying drawings below only schematically illustrate some components included in the first speaker unit 4a. The actual size, location, and construction of these components are not subject to change. Figure 5 and Figure 6 As well as the limitations of the accompanying figures below.

[0127] Specifically, the first speaker unit 4a is fixed inside the housing 1 by means of a frame 4a24. The assembly method between the frame 4a24 and the housing 1 includes, but is not limited to, snap-fit, threaded connection, or adhesive bonding. The frame 4a24 serves as the "support skeleton" of the first speaker unit 4a, supporting the first diaphragm assembly 4a21, the first voice coil 4a22, and the first magnetic circuit system 4a23. The material of the frame 4a24 includes, but is not limited to, metal, plastic, and a combination of metal and plastic. The frame 4a24 can be a one-piece molded part, that is, the frame 4a24 is a monolithic structure. This helps to improve the connection strength of the frame 4a24. Of course, this application is not limited to this; the frame 4a24 can also be assembled from different components, and multiple different components can be connected by means of snap-fit, threaded connection, adhesive bonding, or welding.

[0128] Please continue reading. Figure 6The inner circumferential surface of the frame 4a24 is provided with an annular groove 4a2413 recessed in a direction away from the central axis of the frame 4a24. The annular groove 4a2413 extends in a ring shape along the circumference of the frame 4a24 and extends to the end face of the open end of the frame 4a24, that is, the end face facing the sound outlet 110. The outer edge of the first diaphragm assembly 4a21 is received in the annular groove 4a2413 and fixed to the wall surface of the annular groove 4a2413 opposite to the sound outlet 110. By housing the outer edge of the first diaphragm assembly 4a21 within the annular groove 4a2413 and fixing it to the wall surface of the annular groove 4a2413 opposite to the sound outlet 110, it is beneficial to effectively support the first diaphragm assembly 4a21 using the annular groove 4a2413. Simultaneously, the annular groove 4a2413 increases the volume of the space within the frame 4a24, allowing for a larger size of the first diaphragm assembly 4a21, thereby increasing the effective vibration area of ​​the first diaphragm assembly 4a21 and improving the sound output performance of the first speaker unit 4a. It is understood that the annular groove 4a2413 may not be provided on the frame 4a24, and the outer edge of the first diaphragm assembly 4a21 may be connected to the open end face of the frame 4a24.

[0129] It should be noted that the effective vibration area of ​​the diaphragm assembly mentioned in this article refers to the area of ​​the part of the diaphragm assembly that can drive air movement.

[0130] The outer surface of the first diaphragm assembly 4a21 faces the sound outlet 110, so that the first speaker unit 4a can emit sound towards the sound outlet 110. The first speaker unit 4a can use the first diaphragm assembly 4a21 to divide the outer shell 1 into a front cavity C1 and a rear cavity C2 (in combination). Figure 4 The first voice coil 4a22, the first magnetic circuit system 4a23, and the frame 4a24 are located within the rear cavity C2. The sound outlet 110 communicates with the front cavity C1. Of course, this application is not limited to this; in other examples, the first loudspeaker unit 4a may also include a housing. The first loudspeaker unit 4a is fixed within the outer casing 1 by means of the housing. The frame 4a24 is fixed to the inner wall of the housing. The first diaphragm assembly 4a21 divides the housing into a front cavity and a rear cavity, and the front cavity of the housing communicates with the sound outlet 110.

[0131] It should be explained that the "outer surface" of the first diaphragm group 4a21 refers to the side surface of the first diaphragm group 4a21 that is away from the inside of the frame 4a24, and the inner surface of the first diaphragm group 4a21 is opposite to the outer surface of the first diaphragm group 4a21.

[0132] Please continue reading. Figure 6 The first diaphragm assembly 4a21 includes: a first connecting portion 4a211, a first folded ring 4a212, and a first dome 4a213 surrounded by the first folded ring 4a212.

[0133] The first connecting portion 4a211 is in the shape of an annular plate. For example, the first connecting portion 4a211 is a circular ring or a rectangular ring. The first connecting portion 4a211 is stacked on the wall surface of the annular groove 4a2413 opposite to the sound outlet 110, thereby connecting the first diaphragm assembly 4a21 to the frame 4a24 via the first connecting portion 4a211. The connection method between the first connecting portion 4a211 and the annular groove 4a2413 includes, but is not limited to, adhesive bonding, snap-fitting, welding, or screw connection.

[0134] The outer peripheral edge of the first folding ring 4a212 is connected to the inner peripheral edge of the first connecting portion 4a211. The cross-sectional shape of the first folding ring 4a212 is arc-shaped or approximately arc-shaped. The circumferential extension trajectory of the first folding ring 4a212 along the frame 4a24 is circular or rectangular. The first folding ring 4a212 protrudes towards the sound outlet 110. This allows the first folding ring 4a212 to deform under external force, enabling the first dome 4a213 to vibrate axially relative to the first connecting portion 4a211 along the first diaphragm assembly 4a21. Of course, it is understood that the first folding ring 4a212 can also protrude in a direction away from the sound outlet 110.

[0135] In some examples, the first diaphragm assembly 4a21 is a single molded part. That is, the first connecting part 4a211, the first folded ring 4a212, and the first dome 4a213 are a single integrated structure. This design improves the structural strength of the first diaphragm assembly 4a21 and facilitates its manufacturing. However, this application is not limited to this; the first connecting part 4a211, the first folded ring 4a212, and the first dome 4a213 can also be independently molded parts. The first connecting part 4a211 and the first folded ring 4a212 can be bonded together with adhesive, and the first folded ring 4a212 and the first dome 4a213 can also be bonded together with adhesive. The material of the first diaphragm assembly 4a21 includes, but is not limited to, metal, plastic, plant fiber, and animal fiber.

[0136] The first voice coil 4a22 is connected to the inner surface (i.e., the surface facing away from the sound outlet 110) of the first dome 4a213. The connection between the first voice coil 4a22 and the first dome 4a213 includes, but is not limited to, adhesive bonding.

[0137] The first magnetic circuit system 4a23 is fixed inside the frame 4a24. The first magnetic circuit system 4a23 has an annular magnetic gap 4a23a. The end of the first voice coil 4a22 away from the first diaphragm assembly 4a21 can extend into the magnetic gap 4a23a. In this way, the first magnetic circuit system 4a23 can cooperate with the first voice coil 4a22 to drive the first diaphragm assembly 4a21 to vibrate synchronously. Specifically, after the first voice coil 4a22 is energized, it can generate an induced magnetic field. The first magnetic circuit system 4a23 can respond to the induced magnetic field, thereby causing the first voice coil 4a22 to be displaced by the magnetic force of the first magnetic circuit system 4a23, so as to drive the first diaphragm assembly 4a21 to vibrate, which in turn drives the air in the front cavity C1 to vibrate and form sound. This sound is output from the sound outlet 110.

[0138] Please continue reading. Figure 6 The first magnetic circuit system 4a23 includes: a side magnetic portion 4a231, a first central magnetic portion 4a232, and a second central magnetic portion 4a233. The side magnetic portion 4a231 is located on the outer periphery of the first central magnetic portion 4a232 to define a magnetic gap 4a23a with the first central magnetic portion 4a232. The magnetization directions of the side magnetic portion 4a231 and the first central magnetic portion 4a232 are opposite, so that the side magnetic portion 4a231 and the first central magnetic portion 4a232 can form a magnetic circuit for driving the movement of the first voice coil 4a22. For example, along the axial direction of the frame 4a24 and in a direction away from the first diaphragm assembly 4a21, the magnetization direction of the side magnetic portion 4a231 is from the north pole (N) to the south pole (S), and the magnetization direction of the first central magnetic portion 4a232 is from the south pole (S) to the north pole (N).

[0139] Please continue reading. Figure 6 The edge magnetic portion 4a231 can be formed as a ring. For example, the edge magnetic portion 4a231 can be formed as a circular ring or a rectangular ring. Of course, it is understood that the edge magnetic portion 4a231 can also be non-ring-shaped, and there can be multiple edge magnetic portions 4a231, which are spaced apart in the circumferential direction of the first central magnetic portion 4a232.

[0140] The second central magnet 4a233 blocks the end of the side magnet 4a231 that is away from the first diaphragm assembly 4a21, and the first central magnet 4a232 and the second central magnet 4a233 are stacked. The second central magnet 4a233 and the side magnet 4a231 can be integrally formed. That is, the second central magnet 4a233 and the side magnet 4a231 can be a single structural unit. Of course, this application is not limited to this, and the second central magnet 4a233 and the side magnet 4a231 can also be connected by means of adhesive, snap-fit, threaded connection, etc.

[0141] Specifically, the second central magnetic part 4a233 can be made of a magnetically conductive material. This allows the second central magnetic part 4a233 to confine the leakage of magnetic field lines, increasing the magnetic induction intensity of the first magnetic circuit system 4a23. Of course, this application is not limited to this; in other examples, the second central magnetic part 4a233 can be a magnet. Specifically, the magnet is a magnetic steel magnet or a magnetic steel magnet.

[0142] In some examples, both the edge magnetic portion 4a231 and the first central magnetic portion 4a232 can be magnets. Exemplarily, both the edge magnetic portion 4a231 and the first central magnetic portion 4a232 are magnets or magnetic steel. Of course, this application is not limited to this; in other embodiments, one of the edge magnetic portion 4a231 and the first central magnetic portion 4a232 is a magnet, and the other is a magnetically conductive material.

[0143] In order to increase the magnetic induction intensity of the first magnetic circuit system 4a23, the first magnetic circuit system 4a23 also includes a magnetic yoke 4a234. The magnetic yoke 4a234 is located on the side of the first central magnetic part 4a232 facing the first diaphragm group 4a21, and is used to constrain the leakage of magnetic lines of force, thereby increasing the driving force on the first diaphragm group 4a21.

[0144] Specifically, the outer peripheral surface of the magnetic yoke 4a234 is flush with the outer peripheral surface of the first central magnetic part 4a232 along the axial direction of the first magnetic circuit system 4a23. This helps to further improve the constraint effect of the magnetic yoke 4a234 on the magnetic lines of force, increase the magnetic induction intensity of the first magnetic circuit system 4a23, and the magnetic yoke 4a234 does not affect the magnetic gap 4a23a, which helps to improve the compatibility between the first magnetic circuit system 4a23 and the first voice coil 4a22.

[0145] Please see Figure 5 The terminal block 4a25 is disposed on the basin frame 4a24. Specifically, the terminal block 4a25 is located on the outer side of the basin frame 4a24. For example, the terminal block 4a25 may protrude from the outer peripheral surface of the basin frame 4a24. As another example, a groove may be formed on the outer peripheral surface of the basin frame 4a24, and the terminal block 4a25 may be located within the groove. Regarding the arrangement of the terminal block 4a25, those skilled in the art can design it according to actual needs, as long as the terminal block 4a25 is located on the outer side of the basin frame 4a24.

[0146] Terminal 4a25 includes a positive terminal 4a252 and a negative terminal 4a251.

[0147] The positive terminal 4a252 has a conductive connection portion located within the frame 4a24. This conductive connection portion can be electrically connected to the positive lead of the first voice coil 4a22. In some examples, the positive lead of the first voice coil 4a22 can be soldered to the conductive connection portion.

[0148] The negative terminal 4a251 has a conductive extension located within the frame 4a24. The conductive extension can be electrically connected to the negative lead of the first voice coil 4a22. In some examples, the negative lead of the first voice coil 4a22 and the conductive extension can be connected by soldering.

[0149] In the embodiments of this application, since the positive and negative leads of the first voice coil 4a22 are relatively thin and have weak structural strength, they are easily scratched and damaged. Therefore, by electrically connecting the conductive wiring portion located inside the frame 4a24 to the positive lead of the first voice coil 4a22, the length of the positive lead can be shortened, avoiding the problem of scratching and damage between the positive lead and the frame 4a24. Similarly, by electrically connecting the conductive extension portion located inside the frame 4a24 to the negative lead of the first voice coil 4a22, the length of the negative lead can be shortened, avoiding the problem of scratching and damage between the negative lead and the frame 4a24, which is beneficial to improving the reliability of the first voice coil 4a22.

[0150] The first speaker unit 4a is electrically connected to the circuit board 2 through the positive terminal 4a252 and the negative terminal 4a251, thereby acquiring audio electrical signals such as music and voice.

[0151] As described above, the first speaker unit 4a and the second speaker unit 4b are spaced apart within the housing 1. This requires the first speaker unit 4a and the second speaker unit 4b to be installed separately with the housing 1, resulting in a complex assembly process and low assembly efficiency. Furthermore, the spaced arrangement of the first speaker unit 4a and the second speaker unit 4b within the housing 1 is detrimental to the compactness of the speaker module 4. To address this technical problem, please refer to the embodiments of this application. Figure 7 and Figure 8 , Figure 7 A partial structural schematic diagram of the earphone 100 provided in some embodiments of this application; Figure 8 for Figure 7 The diagram shows a schematic of the speaker module 4 of the earphone 100. In this embodiment, the speaker module 4 also includes a bracket 4c. The second speaker unit 4b can be connected to the frame 4a24 of the first speaker unit 4a via the bracket 4c, thereby achieving a fixed connection between the first speaker unit 4a and the second speaker unit 4b. When installing the speaker module 4, it is advantageous to install the speaker module 4 as a whole into the housing 1, thus eliminating the need to install the first speaker unit 4a and the second speaker unit 4b into the housing 1 separately. This simplifies the installation of the speaker module 4 and also achieves a compact structure for the speaker module 4.

[0152] For details, please refer to Figure 9 , Figure 9 for Figure 8The diagram shows the structure of the bracket 4c in the speaker module 4. In this embodiment, the bracket 4c includes a support plate 4c1 and a connecting part 4c2.

[0153] The support plate 4c1 is located on one side of the axial direction of the first speaker unit 4a, and the support plate 4c1 is opposite to the outer surface of the first diaphragm assembly 4a21 of the first speaker unit 4a. The second speaker unit 4b is supported on the side of the support plate 4c1 opposite to the first speaker unit 4a, that is, the second speaker unit 4b is supported on the side of the support plate 4c1 facing the sound outlet 110. Thus, the support plate 4c1 can be used to support the second speaker unit 4b, facilitating its installation. The connection method between the second speaker unit 4b and the support plate 4c1 includes, but is not limited to, adhesive bonding, snap-fitting, welding, or screw connection.

[0154] To avoid the support plate 4c1 and the second speaker unit 4b obstructing the sound transmission generated by the vibration of the first diaphragm assembly 4a21, thus affecting the sound output of the first speaker unit 4a, please refer to [further details]. Figure 9 and combined Figure 8 A first sound transmission channel 4c11 is formed on the support plate 4c1. The second speaker unit 4b does not cover the first sound transmission channel 4c11, so that the sound emitted by the vibration of the first diaphragm assembly 4a21, which drives the air to vibrate, can be transmitted towards the sound outlet 110 through the first sound transmission channel 4c11. There can be multiple first sound transmission channels 4c11, or only one. For example, the support plate 4c1 is formed as a ring to define the first sound transmission channel 4c11, and the second speaker unit 4b is formed as a ring extending circumferentially along the support plate 4c1 to define a clearance channel 4b3, which communicates with the first sound transmission channel 4c11. Of course, this application is not limited to this; in other examples, the second speaker unit 4b may not be ring-shaped, and the second speaker unit 4b may cover a portion of the support plate 4c1. For example, the second speaker unit 4b may be offset from the center of the support plate 4c1.

[0155] The outer perimeter of the support plate 4c1 is circular, rectangular, triangular, trapezoidal, or irregular in shape. The material of the support plate 4c1 includes, but is not limited to, metal, plastic, and a combination of metal and plastic.

[0156] The connecting part 4c2 connects the outer peripheral edge of the support plate 4c1 to the peripheral wall of the frame 4a24, so that the second speaker unit 4b can be fixed to the frame 4a24 by means of the connecting part 4c2. In some examples, the connecting part 4c2 and the support plate 4c1 can be integrally molded, that is, the connecting part 4c2 and the support plate 4c1 can be a single structure, which helps to improve the connection strength between the connecting part 4c2 and the support plate 4c1. In other examples, the connecting part 4c2 can also be connected to the support plate 4c1 by means of adhesive, snap-fit, welding or screw connection. The connection methods of the connecting part 4c2 and the frame 4a24 include, but are not limited to, snap-fit, adhesive, welding and screw connection. The material of the connecting part 4c2 includes, but is not limited to, metal, plastic and metal and plastic combination.

[0157] For details, please continue reading. Figure 9 The connecting part 4c2 includes at least two sub-parts 4c21, which are spaced apart in the circumferential direction of the support plate 4c1. Each sub-part is connected between the outer peripheral edge of the support plate 4c1 and the peripheral wall of the frame 4a24.

[0158] Please continue reading. Figure 9 Each sub-part 4c21 extends in a plate shape in the circumferential direction of the support plate 4c1. This arrangement reduces the volume and weight of the bracket 4c while also helping to improve the structural strength of the sub-part 4c21, thereby improving the reliability of the connection between the bracket 4c and the frame 4a24, and further improving the reliability of the bracket 4c in fixing the first speaker unit 4a and the second speaker unit 4b.

[0159] For details, please continue reading. Figure 9 Each sub-part 4c21 has a locking hole 4c211, and a retaining rib (not shown) is formed on the outer peripheral surface of the basin frame 4a24. The retaining rib engages into the locking hole 4c211, thereby achieving a detachable connection between the support 4c and the basin frame 4a24. Of course, this application is not limited to this. In other embodiments, retaining ribs can also be formed on each sub-part 4c21, and locking holes can be formed on the outer peripheral surface of the basin frame 4a24. The retaining ribs can engage into the locking holes, which can also achieve a detachable connection between the support 4c and the basin frame 4a24.

[0160] Since the support plate 4c1 is spaced apart from the first speaker unit 4a, the sub-part 4c21 is connected between the outer peripheral edge of the support plate 4c1 and the peripheral wall of the frame 4a24. In this way, a sound transmission channel 4c23 can be formed between two adjacent sub-parts 4c21, thereby transmitting the sound generated by the vibration of the first diaphragm assembly 4a21 and improving the sound output of the first speaker unit 4a.

[0161] To prevent sub-section 4c21 from obstructing the first speaker unit 4a and thus affecting the sound transmission of the first speaker unit 4a, and to improve the sound output performance of the first speaker unit 4a, please refer to [further details needed]. Figure 9 Each sub-part 4c21 has a second sound transmission channel 4c24 formed on the portion located between the first diaphragm assembly 4a21 and the support plate 4c1. Of course, this application is not limited to this, and the sub-part 4c21 may not have a second sound transmission channel 4c24.

[0162] To further improve the sound transmission effect of the sound transmission channel 4c23 on the sound emitted by the first speaker unit 4a, please refer to... Figure 10 , Figure 10 for Figure 8 The speaker module 4 is shown from another angle. In a plane parallel to the first diaphragm group 4a21, a portion of the orthographic projection of the sound transmission channel 4c23 lies within the outer contour of the orthographic projection of the first diaphragm group 4a21.

[0163] To further improve the sound transmission effect of the second sound transmission channel 4c24 to the first speaker unit 4a, please refer to [link / reference needed]. Figure 10 In a plane parallel to the first diaphragm group 4a21, the orthographic projection of the second sound transmission channel 4c24 is located within the outer contour of the orthographic projection of the first diaphragm group 4a21. In this way, the second sound transmission channel 4c24 can be opposite to the first diaphragm group 4a21 in the axial direction of the first speaker unit 4a, which is more conducive to the sound output of the first speaker unit 4a and ensures the sound output effect of the first speaker unit 4a.

[0164] Please see Figure 11 , Figure 11 This is a schematic diagram of the structure of the bracket 4c in some other embodiments of this application. Figure 11 The structure of the bracket 4c shown is similar to Figure 9 The difference in the structure of the bracket 4c shown is that the second sound transmission channel 4c24 is no longer provided on each sub-part 4c21, and each sub-part 4c21 is rod-shaped. This reduces the volume and weight of the sub-part 4c21, thereby reducing the weight and volume of the speaker module 4. It also helps to increase the area of ​​the sound transmission channel 4c23 and improve the sound output effect of the first speaker unit 4a.

[0165] Please see Figure 12a , Figure 12aThis is a schematic diagram of the structure of the bracket 4c in some embodiments of this application. The connecting portion 4c2 may also not include multiple spaced-apart sub-parts, and the connecting portion 4c2 is a closed ring extending in the entire circumference of the frame 4a24. This configuration helps to improve the structural strength of the connecting portion 4c2, thereby improving the connection reliability between the bracket 4c and the frame 4a24, and further improving the reliability of the bracket 4c in fixing the first speaker unit 4a and the second speaker unit 4b.

[0166] For details, please continue reading. Figure 12a A locking hole 4c211 is formed on the connecting part 4c2. A retaining rib (not shown) is formed on the outer peripheral surface of the basin frame 4a24. The retaining rib engages into the locking hole 4c211, thereby realizing a detachable connection between the bracket 4c and the basin frame 4a24. Of course, this application is not limited to this. In other embodiments, a retaining rib can also be formed on the connecting part 4c2, and a locking hole can be formed on the outer peripheral surface of the basin frame 4a24. The retaining rib can engage into the locking hole, which can also realize a detachable connection between the bracket 4c and the basin frame 4a24.

[0167] To prevent the connecting part 4c2 from obstructing the first speaker unit 4a and affecting the sound transmission of the first speaker unit 4a, and to improve the sound output performance of the first speaker unit 4a, please refer to [further details]. Figure 12a A second sound transmission channel 4c24 is formed on the portion of the connecting part 4c2 located between the first diaphragm assembly 4a21 and the support plate 4c1. Of course, this application is not limited to this, and the connecting part 4c2 may not have a second sound transmission channel 4c24.

[0168] To further improve the sound transmission effect of the second sound transmission channel 4c24 to the first speaker unit 4a, the orthographic projection of the second sound transmission channel 4c24 is located within the outer contour of the orthographic projection of the first diaphragm group 4a21 in a plane parallel to the first diaphragm group 4a21. In this way, the second sound transmission channel 4c24 can be opposite to the first diaphragm group 4a21 in the axial direction of the first speaker unit 4a, which is more conducive to the sound output of the first speaker unit 4a and ensures the sound output effect of the first speaker unit 4a.

[0169] Please see Figure 12b , Figure 12b This is a schematic diagram of the structure of the bracket 4c in some other embodiments of this application. The difference between this embodiment and the above embodiment is that the bracket 4c may not include the support plate 4c1, but includes a connecting part 4c2, and the second speaker unit 4b may be supported on the end of the connecting part 4c2 away from the first speaker unit 4a.

[0170] Based on the above embodiments, in some embodiments of this application, the bracket 4c has a conductive part, and the electrode of the second speaker unit 4b is electrically connected to the terminal 4a25 via the conductive part. This allows the speaker module 4 to be electrically connected to the circuit board 2 via the terminal 4a25. Specifically, the negative electrode of the second speaker unit 4b can be electrically connected to the negative terminal 4a251 via the conductive part; or the positive electrode of the second speaker unit 4b can be electrically connected to the positive terminal 4a252 via the conductive part; or, the conductive parts are two insulated and spaced apart, with the negative electrode of the second speaker unit 4b electrically connected to the negative terminal 4a251 via one of the conductive parts, and the positive electrode of the second speaker unit 4b electrically connected to the positive terminal 4a252 via the other conductive part.

[0171] Optionally, when the positive terminal of the second speaker unit 4b is electrically connected to the positive terminal 4a252 via the conductive part, in order to improve the reliability of the bracket 4c and avoid short circuit problems caused by the bracket 4c contacting other structures inside the earphone 100 housing 1, an insulating protective layer may be provided on the surface of the conductive part.

[0172] When the negative terminal of the second speaker unit 4b is electrically connected to the negative terminal 4a251 via the conductive part, in order to improve the reliability of the bracket 4c and avoid short circuit problems caused by the bracket 4c contacting other structures inside the earphone 100 housing 1, the conductive part can be electrically connected to the grounding point on the circuit board 2 to achieve grounding.

[0173] Specifically, the conductive part is composed of at least a portion of the connecting part 4c2. More specifically, the conductive part may be composed of only a portion of the connecting part 4c2, or it may be composed of only the connecting part 4c2, or it may be composed of a portion of the connecting part 4c2 and a portion of the support plate 4c2, or it may be composed of a portion of the connecting part 4c2 and the entire support plate 4c2, or it may be composed of a bracket 4c.

[0174] According to the speaker module 4 of this application embodiment, by including a first speaker unit 4a and a second speaker unit 4b with different sound emission frequencies in the earphone 100, it is advantageous to utilize the difference in sound emission frequencies between the first speaker unit 4a and the second speaker unit 4b to enable the earphone 100 to have good sound performance in different frequency ranges, thereby improving the sound output effect of the speaker module. Furthermore, by providing a bracket 4c and using the bracket 4c to fix the frame 4a24 of the first speaker unit 4a and the second speaker unit 4b, the first speaker unit 4a and the second speaker unit 4b are connected as a whole, facilitating the modularization of the speaker module 4. Thus, during the installation of the speaker module 4, the first speaker unit 4a and the second speaker unit 4b can be installed as a single unit, eliminating the need to separately install the first speaker unit 4a and the second speaker unit 4b into the housing 1 of the earphone 100, simplifying the installation of the speaker module 4, and also achieving a compact structure for the speaker module 4. Additionally, by providing a conductive portion to the bracket 4c, the electrodes of the second speaker unit 4b are electrically connected to the terminal 4a25 via the conductive portion. This simplifies the electrical connection between the first speaker unit 4a and the second speaker unit 4b to at least a certain extent, eliminates the need for at least one signal line for electrically connecting the first speaker unit 4a and the second speaker unit 4b, simplifies the structure of the entire speaker module 4, and also facilitates the electrical connection of the speaker module 4 to the circuit board 2 via the terminal block 4a25.

[0175] In some embodiments of this application, the conductive portion is part of the bracket 4c, and the conductive portion can be a metal insert, while the remaining portion of the bracket 4c can be a plastic part. Exemplarily, the bracket 4c is manufactured using an in-mold injection molding process. This configuration simplifies the manufacturing process and results in high structural strength for the bracket 4c.

[0176] In some other embodiments of this application, the bracket 4c defines a conductive portion, meaning that the entire bracket 4c is conductive. The negative terminal of the second speaker unit 4b is electrically connected to the negative terminal 4a251 via the bracket 4c, and the bracket 4c is grounded. This configuration simplifies the structure of the bracket 4c.

[0177] For further details, please refer to Figure 13 , Figure 14a , Figure 14b and Figure 15 , Figure 13 for Figure 8 A schematic diagram of speaker module 4 from another angle; Figure 14a for Figure 13 The enlarged view of the portion circled at point A in the image shows speaker module 4; Figure 14b for Figure 13 The image shows a cross-sectional view of speaker module 4 at line BB; Figure 15 for Figure 8 The diagram shows the connection of the bracket 4c, second speaker unit 4b, terminal block 4a25, and conductive element 4d of the speaker module 4. The peripheral wall of the frame 4a24 has a first opening 4a241. The negative terminal block 4a251 has a conductive extension 4a2511 located within the frame 4a24, extending to the first opening 4a241. The portion of the connecting part 4c2 facing the first opening 4a241 is connected to the conductive extension 4a2511. For example, the portion of the connecting part 4c2 facing the first opening 4a241 is welded to the conductive extension 4a2511.

[0178] In this way, not only can the second speaker unit 4b be electrically connected to the negative terminal 4a251 via the bracket 4c, but compared to the scheme where the connecting part 4c2 is directly electrically connected to the negative terminal 4a251, the negative terminal 4a251 does not need to extend excessively beyond the outside of the frame 4a24, thus avoiding interference with the internal structure of the housing 1 due to excessive extension of the negative terminal 4a251 beyond the frame 4a24. In other examples, the first opening 4a241 may not be provided on the peripheral wall of the frame 4a24, and the connecting part 4c2 may be directly electrically connected to the negative terminal 4a251.

[0179] Please continue reading. Figure 13 and Figure 15 The speaker module 4 also includes a conductive element 4d, and the positive terminal of the second speaker unit 4b is electrically connected to the positive terminal 4a252 through the conductive element 4d.

[0180] Optionally, to achieve insulation between the conductive element 4d and the support 4c, the conductive element 4d can be enameled wire. Of course, this application is not limited to this; the conductive element 4d can also be a flexible printed circuit board (FPC) or a wire, as long as the insulation distance between the support 4c and the conductive element 4d is ensured.

[0181] For further details, please refer to Figure 13The peripheral wall of the frame 4a24 has a second opening 4a242. The positive terminal 4a252 has a conductive wiring portion 4a2521 located inside the frame 4a24. The conductive member 4d extends into the frame 4a24 through the second opening 4a242 and is electrically connected to the conductive wiring portion 4a2521. In this way, not only can the second speaker unit 4b be electrically connected to the positive terminal 4a252 through the conductive member 4d, but compared with the scheme of directly connecting the conductive member 4d to the positive terminal 4a252, the positive terminal 4a252 does not need to extend too far out of the frame 4a24, thereby avoiding interference with the structure inside the housing 1 due to the positive terminal 4a252 extending too far out of the frame 4a24. In other examples, the peripheral wall of the frame 4a24 may not have a second opening 4a242, and the conductive member 4d may be directly electrically connected to the positive terminal 4a252.

[0182] Please see Figure 16 , Figure 16 This is a schematic diagram of the speaker module 4 according to other embodiments of this application. A portion of the conductive element 4d is located on the side facing the outer surface of the connecting portion 4c2. To avoid the conductive element 4d protruding entirely from the outer surface of the connecting portion 4c2 and interfering with other structures within the housing 1, a wiring groove 4c22 can be formed on the outer surface of the connecting portion 4c2, and a portion of the conductive element 4d is located within the wiring groove 4c22. Of course, it is understood that the wiring groove 4c22 may not be provided on the outer surface of the connecting portion 4c2.

[0183] Here, the outer surface of the connecting part 4c2 refers to the side surface of the connecting part 4c2 that is away from the central axis of the first speaker unit 4a.

[0184] Optionally, the conductive element 4d is located on the side facing the outer peripheral surface of the basin frame 4a24. To prevent the conductive element 4d from protruding entirely from the outer peripheral surface of the basin frame 4a24 and interfering with other structures within the outer casing 1, a clearance groove can be formed on the outer peripheral surface of the basin frame 4a24, with the conductive element 4d located within the clearance groove. Of course, it is understood that the clearance groove may not be provided on the outer peripheral surface of the basin frame 4a24.

[0185] In some embodiments of this application, please refer to Figure 17 , Figure 17 for Figure 8The diagram shows a cross-sectional view of the speaker module 4. The negative terminal of the second speaker unit 4b is located at one end of the second speaker unit 4b adjacent to the support plate 4c1, and the negative terminal of the second speaker unit 4b is connected to the support plate 4c1 by conductive adhesive 4e. This arrangement facilitates the electrical connection between the negative terminal of the second speaker unit 4b and the support plate 4c1, eliminating the need for additional signal lines or other structures for electrical connection. The positive terminal of the second speaker unit 4b is located at the end of the second speaker unit 4b opposite to the support plate 4c1, and the positive terminal of the second speaker unit 4b is connected to the conductive component 4d by conductive adhesive or soldering. This arrangement facilitates the separation of the positive and negative terminals of the second speaker unit 4b, which can at least partially prevent short circuits.

[0186] Please refer to some embodiments of this application. Figure 17 The second speaker unit 4b is a piezoelectric ceramic speaker unit, which is stacked with the support plate 4c1. The connection method between the piezoelectric ceramic speaker unit and the support plate 4c1 includes, but is not limited to, adhesive bonding or welding. In the embodiments of this application, the piezoelectric ceramic speaker unit is thin, small in size, and has good high-frequency sound effects.

[0187] Specifically, the piezoelectric ceramic speaker unit includes a piezoelectric ceramic sheet 4bb. The piezoelectric ceramic sheet 4bb includes a piezoelectric element 4b43, a first electrode layer 4b41, and a second electrode layer 4b42.

[0188] Understandable, Figure 17 The accompanying drawings below only schematically illustrate some components of the second speaker unit 4b; the actual shape, size, location, and construction of these components are not subject to change. Figure 17 As well as the limitations of the accompanying figures below.

[0189] The first electrode layer 4b41 constitutes the negative electrode of the piezoelectric ceramic speaker unit, and the second electrode layer 4b42 constitutes the positive electrode of the piezoelectric ceramic speaker unit. The first electrode layer 4b41 and the second electrode layer 4b42 sandwich a piezoelectric element 4b43. The piezoelectric element 4b43 can be made of ceramic material. For example, the material of the piezoelectric element 4b43 includes, but is not limited to, lead zirconate, lead zirconate titanate, lanthanum lead zirconate titanate, barium titanate, tungsten bronze structural compounds, and solid solutions of barium titanate and bismuth ferrite. The first electrode layer 4b41 and the second electrode layer 4b42 can be formed on the piezoelectric element 4b43 by vapor deposition, electroplating, sputtering, etc. The materials of the first electrode layer 4b41 and the second electrode layer 4b42 can be metals. Specifically, for example, the materials of the first electrode layer 4b41 include, but are not limited to, gold, platinum, silver, copper, palladium, chromium, molybdenum, iron, tin, aluminum, and nickel. The materials of the second electrode layer 4b42 include, but are not limited to, gold, platinum, silver, copper, palladium, chromium, molybdenum, iron, tin, aluminum, and nickel. The materials of the first electrode layer 4b41 and the second electrode layer 4b42 can be the same or different. When alternating current is applied to the piezoelectric ceramic speaker unit, the piezoelectric body 4b43 will expand and contract, thereby driving air vibration to produce sound. In this embodiment, the first electrode layer 4b41 of the piezoelectric ceramic speaker unit is provided on the side surface of the piezoelectric body 4b43 facing the support plate 4c1, and the first electrode layer 4b41 and the support plate 4c1 can be electrically connected by conductive adhesive 4e. The second electrode layer 4b42 is provided on the side surface of the piezoelectric body 4b43 away from the support plate 4c1, and the second electrode layer 4b42 can be welded to the conductive component 4d.

[0190] In other embodiments of this application, please refer to Figure 18 , Figure 18 This is a schematic diagram of the structure of a speaker module 4 according to some embodiments of this application. The second speaker unit 4b is a moving iron speaker unit. The second speaker unit 4b is vertically supported on the side surface of the support plate 4c1 facing the sound outlet 110, and the second speaker unit 4b is located between the inner peripheral surface of the first sound transmission channel 4c11 and the outer peripheral surface of the support plate 4c1.

[0191] Please see Figure 19 , Figure 19 for Figure 18 The diagram shows a cross-sectional view of the second speaker unit 4b. In this embodiment, the second speaker unit 4b may include: a protective shell 4b1, a second diaphragm assembly 4b21, a reed 4b22, a transmission rod 4b23, a second magnetic circuit system 4b24, and a second voice coil 4b25.

[0192] Understandable, Figure 19 The accompanying drawings below only schematically illustrate some components of the second speaker unit 4b; the actual shape, size, location, and construction of these components are not subject to change. Figure 19 As well as the limitations of the accompanying figures below.

[0193] The protective shell 4b1 serves as a carrier for the various components within the second speaker unit 4b, protecting the second diaphragm assembly 4b21, reed 4b22, transmission rod 4b23, second magnetic circuit system 4b24, and second voice coil 4b25, among others. The connection between the protective shell 4b1 and the support plate 4c1 includes, but is not limited to, snap-fit, adhesive, welding, or screw connection.

[0194] A sound outlet channel 4b11 is formed on one side of the protective shell 4b1 adjacent to the sound outlet 110. The sound of the second speaker unit 4b can be emitted through the sound outlet channel 4b11, so that both the second speaker unit 4b and the first speaker unit 4a can emit sound towards the sound outlet 110.

[0195] The protective shell 4b1 may be made of materials including, but not limited to, metal, plastic, and a combination of metal and plastic. In some embodiments, the protective shell 4b1 is made of plastic, which is low in cost and easy to mold, thus reducing the processing cost of the second speaker unit 4b. In other examples, to improve the structural strength of the protective shell 4b1, it may be made of metal.

[0196] The protective shell 4b1 extends along the sound outlet direction of the sound outlet 110; that is, the length direction of the protective shell 4b1 is in the same direction as the sound outlet direction of the sound outlet 110. For details, please refer to [link / reference]. Figure 19 The protective shell 4b1 can be rectangular in shape.

[0197] The protective shell 4b1 can be a single structural unit or assembled from multiple parts. In some embodiments, please refer to [further details]. Figure 19 The protective shell 4b1 includes a first shell portion 4b1a and a second shell portion 4b1b. The first shell portion 4b1a and the second shell portion 4b1b are arranged radially and spliced ​​together on the first speaker unit 4a. This facilitates the separate processing of the first shell portion 4b1a and the second shell portion 4b1b, simplifies the mold structure of the first shell portion 4b1a and the second shell portion 4b1b, reduces the molding difficulty of the first shell portion 4b1a and the second shell portion 4b1b, and thus reduces the processing and manufacturing difficulty of the protective shell 4b1.

[0198] Please continue reading. Figure 19 The second diaphragm assembly 4b21 is housed within the protective shell 4b1. The second diaphragm assembly 4b21 is parallel to the axis of the first speaker unit 4a, thus allowing it to be positioned perpendicular to the first diaphragm assembly 4a21. This, at least to a certain extent, prevents the sound output from the first speaker unit 4a from interfering with the vibration of the second diaphragm assembly 4b21.

[0199] The second speaker unit 4b divides the space inside the protective shell 4b1 into a front cavity k1 and a rear cavity k2 by means of the second diaphragm assembly 4b21, so that the front cavity k1 and the rear cavity k2 are arranged radially in the first speaker unit 4a.

[0200] Please see Figure 20 , Figure 20 for Figure 19 The diagram shows the structure of the second diaphragm assembly 4b21 of the second speaker unit 4b. The second diaphragm assembly 4b21 includes a second connecting portion 4b21a, a second surround 4b21b, and a second dome 4b21c.

[0201] The second connecting part 4b21 a is in the shape of an annular plate, and the second connecting part 4b21 a is a rounded rectangular ring.

[0202] Please see Figure 20 and combined Figure 19 The protective shell 4b1 has a stepped portion 4b12 on its inner circumferential surface, and the second connecting portion 4b21a is stacked on the stepped portion 4b12. The connection between the second connecting portion 4b21a and the stepped portion 4b12 includes, but is not limited to, adhesive bonding. Of course, in some other examples, the protective shell 4b1 may not have the stepped portion 4b12, but instead the second connecting portion 4b21a may be set in an annular cylindrical shape and connected to the inner circumferential surface of the protective shell 4b1.

[0203] The second folding ring 4b21b is disposed on the outer periphery of the second dome 4b21c and surrounded by the second connecting portion 4b21a. The second folding ring 4b21b is a rounded rectangular ring. The second folding ring 4b21b is recessed towards the side closer to the rear cavity K2 to form an arc-shaped or approximately arc-shaped cross-section. This arrangement can save space in the front cavity K1. Of course, this application is not limited to this. In other embodiments, the second folding ring 4b21b is recessed towards the side closer to the front cavity K1 to form an arc-shaped or approximately arc-shaped cross-section.

[0204] In some examples, the second diaphragm assembly 4b21 can be a single-piece molded component. That is, the second connecting portion 4b21a, the second folded ring 4b21b, and the second dome 4b21c are integrally molded and connected as a whole. This configuration not only simplifies the manufacturing process and reduces production costs, but also improves the connection strength between the second connecting portion 4b21a and the second folded ring 4b21b, as well as between the second folded ring 4b21b and the second dome 4b21c. Of course, this application is not limited to this. In other embodiments, the second connecting portion 4b21a, the second folded ring 4b21b, and the second dome 4b21c can also be manufactured independently and then connected by adhesive or other methods.

[0205] Please continue reading. Figure 19The reed 4b22 is disposed within the rear cavity K2 of the second speaker unit 4b and is used to provide driving force for the vibration of the second diaphragm assembly 4b21. The material of the reed 4b22 includes, but is not limited to, metal.

[0206] Please see Figure 21 , Figure 21 for Figure 19 The diagram shows the structure of the reed 4b22 of the second speaker unit 4b. The reed 4b22 includes a first plate 4b221, a second plate 4b222, and a connecting plate 4b223.

[0207] The first sheet 4b221 is rectangular in shape. The first sheet 4b221 is arranged parallel to the second diaphragm assembly 4b21. The second sheet 4b222 is also rectangular in shape. The second sheet 4b222 is arranged parallel to the second diaphragm assembly 4b21, and is located on the side of the first sheet 4b221 furthest from the second diaphragm assembly 4b21. The second sheet 4b222 may have the same dimensions as the first sheet 4b221.

[0208] The second piece 4b222 has a support 4b224 extending beyond the edge of the first piece 4b221 at one end, and the support 4b224 is triangular in shape. In some examples, the support 4b224 and the second piece 4b222 can be integrally molded, that is, the support 4b224 and the second piece 4b222 are connected to form a structural unit. In other examples, the support 4b224 and the second piece 4b222 can be connected by means of adhesive, snap-fit, welding or threaded connection.

[0209] The shape of the connecting piece 4b223 includes, but is not limited to, "C" and "V" shapes. The connecting piece 4b223 is connected between the end of the second piece 4b222 that is away from the support 4b224 and the end of the first piece 4b221 that is away from the support 4b224.

[0210] The spring 4b22 can be a single molded part. That is, the first piece 4b221, the second piece 4b222, and the connecting piece 4b223 are connected as a whole. This arrangement not only simplifies the manufacturing process and reduces production costs, but also improves the connection strength between the first piece 4b221 and the connecting piece 4b223, as well as between the second piece 4b222 and the connecting piece 4b223. ​​Of course, this application is not limited to this. In other embodiments, the first piece 4b221, the second piece 4b222, and the connecting piece 4b223 can also be manufactured independently and then connected by means of adhesive bonding or welding.

[0211] Please continue reading. Figure 19The transmission rod 4b23 is rod-shaped and connects the support body 4b224 and the second dome 4b21c. The transmission rod 4b23 is perpendicular to the second sheet body 4b222. Through the connection of the transmission rod 4b23, the vibration of the reed 4b22 can be transmitted to the second diaphragm assembly 4b21, thereby causing the second speaker unit 4b to produce sound.

[0212] The material of the transmission rod 4b23 includes, but is not limited to, metal or rigid plastic. The connection method between the transmission rod 4b23 and the second diaphragm 4b222 includes, but is not limited to, adhesive bonding, welding, snap-fitting, or threaded connection. The connection method between the transmission rod 4b23 and the second diaphragm assembly 4b21 includes, but is not limited to, adhesive bonding, welding, snap-fitting, or threaded connection.

[0213] Please see Figure 22 and combined Figure 19 ,in, Figure 22 for Figure 19 The diagram shows the structure of the second magnetic circuit system 4b24 of the second speaker unit 4b. The second magnetic circuit system 4b24 is located within the rear cavity K2 of the second speaker unit 4b. The second magnetic circuit system 4b24 includes a magnetically conductive part 4b241 and two magnet parts 4b242.

[0214] The magnetic conductive part 4b241 is rectangular and annular. The axis of the magnetic conductive part 4b241 is the same as the axis of the frame 4a24. The first sheet 4b221 is supported on one side surface of the magnetic conductive part 4b241 adjacent to the second diaphragm assembly 4b21. The connection between the first sheet 4b221 and the magnetic conductive part 4b241 includes, but is not limited to, adhesive bonding or snap-fitting.

[0215] Two magnet parts 4b242 are disposed inside the magnetic conductive part 4b241 and are arranged opposite to each other in the radial direction of the magnetic conductive part 4b241.

[0216] The shape of the magnet part 4b242 includes, but is not limited to, a cuboid, a cylinder, or an irregular shape. The magnetization directions of the two magnet parts 4b2422 are opposite. For example, one magnet part 4b242 has an N pole at the end near the central axis of the magnetically conductive part 4b241 and an S pole at the end away from the central axis of the magnetically conductive part 4b241; the other magnet part 4b242 has an S pole at the end near the central axis of the magnetically conductive part 4b241 and an N pole at the end away from the central axis of the magnetically conductive part 4b241.

[0217] Please continue reading. Figure 19 The second piece 4b222 extends from one axial end of the magnetic conductive part 4b241 to the other axial end of the magnetic conductive part 4b241 so that the support 4b224 is located outside the magnetic conductive part 4b241, and the second piece 4b222 is located between the two magnetic parts 4b242.

[0218] The second voice coil 4b25 is located on one side of the magnetic conductor 4b241 adjacent to the connecting plate 4b223 in the axial direction, and the second voice coil 4b25 surrounds the outer periphery of the second plate 4b222.

[0219] In some examples, the sidewall of the protective shell 4b1 adjacent to the support plate 4c1 can be constructed as a conductive structure. The negative lead of the second voice coil 4b25 is electrically connected to the conductive structure, for example, by welding. The conductive structure can form the negative terminal of the second speaker unit 4b. This conductive structure can be welded to the support plate 4c1 or connected by conductive adhesive. This arrangement allows the negative terminal of the second speaker unit 4b to be electrically connected to the negative terminal 4a251. Of course, this application is not limited to this. In other examples, a through hole can be provided on the peripheral wall of the protective shell 4b1, through which the negative lead of the second voice coil 4b25 can pass and be electrically connected to the bracket 4c.

[0220] In some examples, a wire-passing hole can be formed on the peripheral wall of the protective shell 4b1 or on the side wall of the protective shell 4b1 away from the support plate 4c1. The conductive element 4d can pass through the wire-passing hole and be electrically connected to the positive lead of the second voice coil 4b25, or the positive lead of the second voice coil 4b25 can pass through the wire-passing hole and be electrically connected to the conductive element 4d.

[0221] When the second voice coil 4b25 is energized, it generates a magnetic field, which magnetizes the second plate 4b222 within it, creating magnetic poles. This creates a driving force between the second voice coil 4b25 and the magnet portion 4b242, causing the second plate 4b222 to vibrate along the interval between the two magnet portions 4b242. The vibration of the second plate 4b222 drives the transmission rod 4b23 to vibrate, which in turn drives the second diaphragm assembly 4b21 to vibrate. The vibration of the second diaphragm assembly 4b21 then vibrates the air within the front cavity K1, producing sound, which is emitted through the sound outlet channel 4b11.

[0222] Please see Figure 23 , Figure 23 This is a schematic diagram of the speaker module 4 in some other embodiments of this application. In this embodiment, the second speaker unit 4b can also be laterally supported on the side surface of the support plate 4c1 facing the sound outlet 110, that is, the length direction of the second speaker unit 4b is parallel to the support plate 4c1.

[0223] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0224] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A pair of headphones (100), characterized in that, The earphone includes a shell (1) and a speaker module (4); The housing (1) is partially fitted into the user's ear. The housing (1) has a sound outlet (110). The speaker module (4) is disposed within the housing (1). The speaker module (4) includes: a first speaker unit (4a), a second speaker unit (4b), a bracket (4c), and a conductive element (4d). The first speaker unit (4a) includes a terminal block (4a25) and a frame (4a24). The inner circumferential surface of the frame (4a24) is provided with a groove, at least a portion of the first speaker unit (4a) is disposed in the groove, the bracket (4c) connects the frame (4a24), the first speaker unit (4a), the bracket (4c) and the second speaker unit (4b) are stacked, the first speaker unit (4a) is located on the side of the bracket (4c) away from the sound outlet (110), and the second speaker unit (4b) is located on the side of the bracket (4c) facing the sound outlet (110); The terminal block (4a25) includes a first terminal block, a second terminal block, a conductive wiring portion (4a2521), and a conductive extension portion (4a2511). The second speaker unit (4b) is electrically connected to the bracket (4c). The frame (4a24) has a second opening (4a242). The conductive wiring portion (4a2521) is shielded by the outer surface of the frame (4a24). The second speaker unit (4b) is connected to the conductive element (4d). The conductive element (4d) extends into the frame (4a24) through the second opening (4a242) and connects to the conductive wiring portion (4a2521). The conductive wiring portion (4a2521) is connected to the first terminal block. The bracket (4c) is connected to the conductive extension portion (4a2511). The conductive extension portion (4a2511) is connected to the second terminal block.

2. The earphone (100) according to claim 1, characterized in that, The earphone (100) also includes a circuit board (2) and a battery (3). The circuit board (2) includes a wireless communication module (6). The battery (3) is located between the circuit board (2) and the speaker module (4). The circuit board (2) is electrically connected to the battery (3) and the speaker module (4). At least a portion of the terminal block (4a25) protrudes from the frame (4a24). The speaker module (4) is connected to the circuit board (2) through the terminal block (4a25).

3. The earphone (100) according to claim 1 or 2, characterized in that, The first loudspeaker unit (4a) includes a first diaphragm assembly (4a21), and the second loudspeaker unit (4b) is located within the outer contour of the first diaphragm assembly (4a21) in the first plane, with the first plane being parallel to the plane containing the first diaphragm assembly (4a21).

4. The earphone (100) according to claim 1 or 2, characterized in that, The first speaker unit (4a) is a moving-coil speaker unit, and the second speaker unit (4b) is a piezoelectric ceramic speaker unit.

5. The earphone (100) according to claim 1 or 2, characterized in that, The outer shell (1) includes a front shell (11) and a rear shell (12). The sound outlet (110) is located in the front shell (11). The rear shell (12) includes a cover (121) and a rod (122). The cover (121) is connected to the front shell (11), and the rod (122) is located on the side of the cover (121) away from the front shell (11).

6. The earphone (100) according to claim 1 or 2, characterized in that, Both the first speaker unit (4a) and the second speaker unit (4b) emit sound toward the sound outlet (110).

7. The earphone (100) according to claim 1 or 2, characterized in that, The first terminal (4a252) is a positive terminal (4a252), the second terminal is a negative terminal (4a251), and the second speaker unit (4b) is connected to the conductive element (4d), comprising: The positive electrode of the second speaker unit (4b) is electrically connected to the conductive element (4d); The second speaker unit (4b) is electrically connected to the bracket (4c), comprising: The negative terminal of the second speaker unit (4b) is electrically connected to the bracket (4c). The conductive wiring portion (4a2521) is connected to the first terminal block and includes: The conductive wiring part (4a2521) is electrically connected to the positive terminal (4a252); The conductive extension (4a2511) is connected to the second terminal block and includes: The conductive extension (4a2511) is electrically connected to the negative terminal (4a251).

8. The earphone (100) according to claim 1 or 2, characterized in that, The bracket (4c) connects to the conductive extension (4a2511) and includes: The bracket (4c) is detachably connected to the conductive extension (4a2511); or, the bracket (4c) is non-detachably connected to the conductive extension (4a2511); or, the bracket (4c) is directly connected to the conductive extension (4a2511); or, the bracket (4c) is indirectly connected to the conductive extension (4a2511) through an intermediate medium; or, the bracket (4c) is electrically connected to the conductive extension (4a2511); or, the bracket (4c) is connected to the conductive extension (4a2511) through a conductive part.

9. The earphone (100) according to claim 8, characterized in that, The outer surface of the conductive part is provided with an insulating protective layer.

10. The earphone (100) according to claim 8, characterized in that, The conductive part is a metal insert.

11. The earphone (100) according to claim 8, characterized in that, The bracket (4c) includes a connecting part (4c2) and a support plate (4c1), and the first speaker unit (4a) includes a first diaphragm assembly (4a21), which is located on the frame (4a24). The support plate (4c1) is located on one axial side of the first speaker unit (4a) and opposite to the outer surface of the first diaphragm assembly (4a21). The connecting part (4c2) is connected between the outer peripheral edge of the support plate (4c1) and the peripheral wall of the frame (4a24). The second speaker unit (4b) is located on the side of the support plate (4c1) away from the first speaker unit (4a). The connection method between the connecting part (4c2) and the frame (4a24) includes any one or more of the following methods: snap-fit, adhesive, welding and screw connection.

12. The earphone (100) according to claim 11, characterized in that, The conductive part is part of the bracket (4c); or, the conductive part is only a part of the connecting part (4c2); or, the conductive part is only the entire connecting part (4c2); or, the conductive part is a part of the connecting part (4c2) and a part of the support plate (4c1); or, the conductive part is a part of the connecting part (4c2) and the entire support plate (4c1); or, the conductive part is the bracket (4c).

13. The earphone (100) according to claim 11, characterized in that, The negative terminal of the second speaker unit (4b) is located at one end of the second speaker unit (4b) adjacent to the support plate (4c1), and the negative terminal of the second speaker unit (4b) is electrically connected to the support plate (4c1).

14. The earphone (100) according to claim 11, characterized in that, The support plate (4c1) has a third opening, and the second speaker unit (4b) does not cover the third opening. The sound emitted by the vibration of the first speaker unit (4a) is transmitted through the third opening toward the sound outlet (110).

15. The earphone (100) according to claim 14, characterized in that, The third opening is circular, and the second speaker unit (4b) is annular.

16. The earphone (100) according to claim 3, characterized in that, The bracket (4c) also has a fourth opening through which the sound emitted by the vibration of the first speaker unit (4a) is transmitted toward the sound outlet (110). In the first plane, a portion of the orthographic projection of the fourth opening lies within the outer contour of the orthographic projection of the first diaphragm assembly (4a21).

17. The earphone (100) according to claim 1 or 2, characterized in that, The speaker module (4) has a wiring groove (4c22) on its outer surface, and part of the conductive element (4d) is located in the wiring groove (4c22).

18. The earphone (100) according to claim 2, characterized in that, The circuit board (2) is one of a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.

19. The earphone (100) according to claim 2, characterized in that, The circuit board (2) is one of FR- dielectric board, Rogers dielectric board, or a hybrid dielectric board of FR- and Rogers.

20. The earphone (100) according to claim 1 or 2, characterized in that, The conductive element (4d) is one of enameled wire, flexible circuit board or wire.

21. The earphone (100) according to claim 1 or 2, characterized in that, The second speaker unit (4b) has a higher frequency of sound emission than the first speaker unit (4a).

22. The earphone (100) according to claim 1 or 2, characterized in that, The second speaker unit (4b) is a moving iron speaker unit, which is vertically supported on the bracket (4c).

23. The earphone (100) according to claim 22, characterized in that, The first speaker unit (4a) includes a first diaphragm group (4a21), and the moving iron speaker unit includes a second diaphragm group (4b21), which is arranged perpendicularly to the first diaphragm group (4a21).

24. The earphone (100) according to claim 23, characterized in that, The moving iron loudspeaker unit includes a protective shell (4b1), a reed (4b22), a transmission rod (4b23), a second magnetic circuit system (4b24), and a second voice coil (4b25). The second diaphragm assembly (4b21) is disposed inside the protective shell (4b1) to divide the space inside the protective shell (4b1) into a front cavity (K1) and a rear cavity (K2). The reed (4b22), the transmission rod (4b23), the second magnetic circuit system (4b24), and the second voice coil (4b25) are all located in the rear cavity (K2). The reed (4b22), the transmission rod (4b23), the second magnetic circuit system (4b24), and the second voice coil (4b25) cooperate to drive the second diaphragm assembly (4b21) to vibrate.

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