Circuit board structure for high-frequency signal transmission

Abstract

The invention discloses a circuit board structure for high-frequency signal transmission, and relates to the technical field of high-frequency signal transfer, the circuit board structure comprises a connecting piece, a transfer circuit board, a plug hole, a contact pin and a high-frequency connector, the contact pin is connected with the plug hole in an interference fit connection mode, and the contact pin is connected with the high-frequency connector in a clamping mode; a heat conducting wire is arranged in each pin and is used for conducting heat; a tin block I with constant weight is arranged at the bottom of each contact pin and is used for heating the top end of the contact pin to melt the tin block I so as to realize tin soldering connection between the top end of the contact pin and the high-frequency connector; the technical effects of accurately controlling the tin amount, avoiding echo generation caused by impedance change, improving the connection stability and reliability, reducing the loss in the signal transmission process, and improving the signal transmission stability and transmission efficiency can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of high-frequency signal transfer, and particularly to a circuit board structure for high-frequency signal transmission. Background Art

[0002] When transferring and transmitting high-frequency signals, welding is usually used to connect high-frequency connectors and adapter boards. However, during the welding process, it is difficult to precisely control the amount of solder at the solder joints. Too much or too little solder may cause signal echoes during transmission.

[0003] Chinese Patent No. CN119277645A discloses a high-frequency signal adapter board, which includes an adapter circuit board and a connector. The connector is also provided with a slot for fixing a high-frequency connector; the adapter circuit board is provided with a plurality of photosensitive board contact points, insertion holes, and high-frequency signal transmission microstrip lines. The photosensitive board contact points are connected to the connectors of the photosensitive board. Insertion pins are arranged inside the insertion holes for connecting the high-frequency connector and the high-frequency signal transmission microstrip lines. The other end of the high-frequency signal transmission microstrip line is connected to the photosensitive board contact points. The bottom of the insertion pin is snap-fitted with the high-frequency connector, and the side wall of the insertion pin is in interference fit with the insertion hole; by fixedly connecting the adapter circuit board and the connector, and opening a truncated cone-shaped insertion hole on the adapter circuit board, the reliable connection between the insertion pin and the insertion hole is ensured. Since the high-frequency signal transmission microstrip line and the high-frequency connector are connected in a plug-in form, echo is avoided and the signal transfer accuracy is improved.

[0004] Traditional connection methods mainly rely on soldering. The influence of solder volume control on signal transmission mainly stems from the microscopic mechanisms of impedance mismatch and signal reflection (echo). Moreover, when the above-mentioned solution is used for high-frequency signal transmission, the connection is mainly achieved through an interference fit plug-in method. Although the transmission effect is improved to a certain extent, in actual use, due to the influence of temperature changes, the insertion pins and jacks may have inconsistent dimensional changes due to the difference in the coefficient of thermal expansion of the materials, which may cause multiple problems, such as the failure of the interference fit, loosening, resulting in impaired signal transmission performance, fluctuations in contact impedance, signal reflection (echo) caused by impedance mismatch, and changes in parasitic parameters, affecting signal integrity; and considering that during long-term use or under external forces such as vibration and shock, the materials may experience fatigue, problems such as material fatigue cracks and coating wear caused by stress concentration may occur. At the same time, the contact between the insertion pin and the insertion hole may change, and there may be small gaps or poor contact at the plug-in points, affecting the stable transmission of signals, resulting in signal loss during transmission, affecting signal integrity and quality, and having an adverse impact on the performance and service life of the high-frequency signal adapter board. Summary of the Invention

[0005] The present application solves the technical problems in the prior art that inaccurate tin amount control leads to impedance changes and causes echoes, reduced connection stability and reliability, increased losses during signal transmission, and reduced signal transmission stability and transmission efficiency by providing a circuit board structure for high-frequency signal transmission. The application achieves the technical effects of accurately controlling the tin amount to avoid the generation of echoes caused by impedance changes, improving connection stability and reliability, reducing losses during signal transmission, and improving signal transmission stability and transmission efficiency.

[0006] The present application provides a circuit board structure for high-frequency signal transmission, including a connector, a transfer circuit board, a plug hole, a pin and a high-frequency connector, wherein the pin is connected to the plug hole by an interference fit connection, and the pin is connected to the high-frequency connector by a snap connection; A heat conducting wire is arranged inside each of the pins for conducting heat; a tin block of constant weight is arranged at the bottom of each of the pins for heating the top of the pin to melt the tin block and realize soldering connection between the top of the pin and the high-frequency connector.

[0007] Furthermore, a conducting plate is fixed on the top of the high-frequency connector, and a plurality of small holes are evenly opened in the middle of the conducting plate for soldering connection with the melted tin block.

[0008] Furthermore, a mounting hole is provided on the surface of the connector to provide a mounting position; a plurality of photosensitive board contact points are fixed in the middle of the adapter circuit board to connect the photosensitive board with a high-frequency signal transmission microstrip line.

[0009] Furthermore, the connecting member also includes a high-frequency signal transmission microstrip line, a photosensitive board, an insulating board, and a light-inlet channel; The adapter circuit board is a multi-layer printed circuit board, which is fixed on the connecting piece and is used to realize the switching and transmission of signals; a light inlet channel is arranged at the lower middle part of the connecting piece, and a photosensitive board is arranged at the top of the light inlet channel, and the photosensitive board is connected to the photosensitive board contact point on the adapter circuit board and is used to receive external optical signals and convert them into electrical signals; There are multiple high-frequency signal transmission microstrip lines, all of which are arranged on the adapter circuit board. One end of each microstrip line is connected to the contact point of the photosensitive board, and the other end is connected to the high-frequency connector through a pin. The high-frequency signal transmission microstrip lines are designed with equal length to achieve synchronous transmission of photosensitive signals; the insulating board is arranged at the bottom of the adapter circuit board and has the same shape as the adapter circuit board. The insulating board is used to prevent the circuit board from contacting other conductive objects to avoid short circuit.

[0010] Furthermore, the plug-in hole is a truncated cone structure, and the aperture gradually decreases from the top to the bottom of the adapter circuit board, and the aperture gradually changes from 1.5mm to 1.2mm; the thermal wire is made of copper wire, which is used to quickly melt the tin block after heating after rapid heat conduction to achieve soldering.

[0011] Furthermore, a groove is provided on the top of the high-frequency connector and on the guide surface engaged with the pin. The groove is an arc-shaped structure with a constant shape and size, and is used to control the shape and welding amount of the tin block after melting and ensure the stability and reliability of the connection.

[0012] Furthermore, a conducting ball is fixed at the bottom of the thermal wire, and the conducting ball is located inside the groove to ensure stable conduction at the connection.

[0013] Furthermore, a fixed cover is fixed to the top of the pin by a snap-fitting manner, and the shape and size of the fixed cover are constant, so as to ensure the constant amount of the tin block 2; a tin block 2 with a constant weight is arranged inside the fixed cover, and the tin block 2 is used to solder the socket and the pin after melting.

[0014] Furthermore, a plurality of conducting grooves are provided at the top of the pin and along its circumference. The conducting groove is a T-shaped structure, the upper end of which is connected to the interior of the fixed cover, and the two ends of which are respectively connected to the heat conducting wire and the plug hole, so that the tin block 2 flows along the conducting groove after melting to realize multi-point welding.

[0015] In addition, the technical solution of the present invention also provides a welding method for a circuit board structure for high-frequency signal transmission, and the specific steps are as follows: Step 1: Assemble the high-frequency signal adapter board device and ensure that all components are firmly and reliably connected; Step 2: Invert the overall structure of the circuit board, heat and weld the pins and the socket holes, and perform vacuum treatment to make the inside of the circuit board negative pressure state. The melted tin block 2 flows into the socket hole through the conduction groove, fills the gap between the pin and the socket hole, and assists in filling the channel between the pin and the high-frequency connector. The tin block 1 is melted by the heat conduction of the thermal wire and quickly flows into the groove where the thermal wire is located under the action of negative pressure. Step 3: Place the entire structure of the circuit board forward, stop the negative pressure treatment and quickly cool the pins and the plug holes, so that the melted tin block 2 at the pins and the plug holes will solidify quickly to achieve soldering treatment; Step 4: After forward placement, heat the connection between the pin and the high-frequency connector. Once the tin block melts, it flows into the groove through the guide plate to achieve a soldering connection between the pin and the high-frequency connector. Step 5: After the soldering connection is completed, cool the entire device to allow the soldering points to solidify quickly to ensure the stability and reliability of the connection.

[0016] One or more technical solutions provided in this application have at least the following technical effects or advantages: By adopting a double connection method of interference fit and soldering, as well as the precise design of heat-conducting wires and a tin block 1 with a constant weight, the reliability and stability of the connection can be ensured, effectively solving the technical problems in the prior art such as the generation of echoes caused by inaccurate tin amount control resulting in impedance changes, the reduction of connection firmness and reliability, the increase of losses during signal transmission, and the reduction of signal transmission stability and transmission efficiency. The technical effects of accurate tin amount control to avoid the generation of echoes caused by impedance changes, the improvement of connection firmness and reliability, the reduction of losses during signal transmission, and the improvement of signal transmission stability and transmission efficiency are achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is the overall structure diagram of the circuit board structure for high-frequency signal transmission of the present invention.

[0018] Figure 2 FIG. is the three-dimensional structure cross-sectional view of the connector of the circuit board structure for high-frequency signal transmission of the present invention.

[0019] Figure 3 FIG. is the three-dimensional structure diagram of the adapter circuit board of the circuit board structure for high-frequency signal transmission of the present invention.

[0020] Figure 4 For the circuit board structure for high-frequency signal transmission of the present invention Figure 3 exploded view of the structure.

[0021] Figure 5 FIG. is the three-dimensional structure diagram of the pin and the high-frequency connector of the circuit board structure for high-frequency signal transmission of the present invention.

[0022] Figure 6 FIG. is the three-dimensional structure diagram of the high-frequency connector of the circuit board structure for high-frequency signal transmission of the present invention. Figure 7 FIG. is the longitudinal full cross-sectional view of the pin and the high-frequency connector of the circuit board structure for high-frequency signal transmission of the present invention.

[0023] Figure 8 For the circuit board structure for high-frequency signal transmission of the present invention Figure 7 local enlarged schematic view at A in. Figure 9 For the circuit board structure for high-frequency signal transmission of the present invention Figure 7 local enlarged schematic view at B in.

[0024] In the figure: 100, connecting piece; 101, mounting hole; 102, photosensitive plate contact point; 110, adapter circuit board; 120, insertion hole; 130, high-frequency signal transmission microstrip line; 140, photosensitive plate; 150, insulating plate; 160, light inlet channel; 200, pin; 210, heat-conducting wire; 211, conducting ball; 220, first solder block; 230, fixing cover; 240, second solder block; 250, conducting groove; 300, high-frequency connector; 310, conducting plate; 320, groove. Specific embodiments

[0025] To facilitate the understanding of the present invention, the present application will be described more comprehensively with reference to the relevant drawings; the preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs; the terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0028] Please refer to Figure 1 , which is a schematic diagram of the overall structure of the circuit board structure for high-frequency signal transmission of the present invention; the circuit board structure for high-frequency signal transmission of the present application is ensured by the interference fit between the pin 200 and the insertion hole 120 and the double guarantee of soldering connection, making the connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300 more firm and stable, capable of resisting external forces such as vibration and impact during long-term use, and reducing the decline in signal transmission performance caused by poor contact or loose connection; achieving the technical effects of improved connection stability and reliability, reduced loss during signal transmission, and improved signal transmission stability and transmission efficiency.

[0029] Embodiment 1: As Figures 1 to 8 shown, the circuit board structure for high-frequency signal transmission of the present application includes a connecting piece 100, an adapter circuit board 110, an insertion hole 120, a pin 200 and a high-frequency connector 300. The pin 200 is connected to the insertion hole 120 by an interference fit connection method, and the pin 200 is connected to the high-frequency connector 300 by a clamping connection method; A heat conducting wire 210 is arranged inside each of the plug pins 200 for conducting heat; a tin block 220 of constant weight is arranged at the bottom of each of the plug pins 200 for heating the top of the plug pin 200 to melt the tin block 220 and realize soldering connection between the top of the plug pin 200 and the high-frequency connector 300.

[0030] A conducting plate 310 is fixed on the top of the high-frequency connector 300 , and a plurality of small holes are evenly opened in the middle of the conducting plate 310 for soldering connection with the melted tin block 220 .

[0031] The surface of the connector 100 is provided with a mounting hole 101 for providing a mounting position; a plurality of photosensitive board contact points 102 are fixed in the middle of the adapter circuit board 110 for connecting the photosensitive board 140 with the high-frequency signal transmission microstrip line 130 .

[0032] The connector 100 also includes a high-frequency signal transmission microstrip line 130, a photosensitive board 140, an insulating board 150, and a light inlet channel 160; the adapter circuit board 110 is a multi-layer printed circuit board, fixed on the connector 100, and used to achieve signal switching and transmission; a light inlet channel 160 is provided at the lower middle part of the connector 100, and a photosensitive board 140 is provided at the top of the light inlet channel 160, and the photosensitive board 140 is connected to the photosensitive board contact point 102 on the adapter circuit board 110, and is used to receive external optical signals and transmit them Converted into electrical signals; There are multiple high-frequency signal transmission microstrip lines 130, all of which are arranged on the adapter circuit board 110, one end of which is connected to the photosensitive board contact point 102, and the other end is connected to the high-frequency connector 300 through the pin 200. The high-frequency signal transmission microstrip lines 130 adopt an equal length design to achieve synchronous transmission of photosensitive signals; The insulating plate 150 is arranged at the bottom of the adapter circuit board 110 and has the same shape as the adapter circuit board 110. The insulating plate 150 is used to prevent the circuit board from contacting other conductive objects to avoid short circuit.

[0033] The plug hole 120 is a truncated cone structure, and the aperture gradually decreases from the top to the bottom of the adapter circuit board 110, and the aperture gradually changes from 1.5mm to 1.2mm; the heat conductive wire 210 is made of copper wire, which is used to quickly melt the tin block 220 after being heated to achieve soldering after rapid heat conduction. The conductive plate 310 is a hollow structure, which makes the connection between the pin 200 and the high-frequency connector 300 more firm and stable.

[0034] Since high-frequency signals rely on a constant characteristic impedance during transmission, when the impedance at the solder joint decreases due to a sudden change in geometric shape, the signal will encounter an impedance discontinuity point, and part of the energy will be reflected back to the source end, forming an echo (reflected wave), which reduces the quality and reliability of signal transfer. Excessive solder will cause the solder joint to form a raised "spherical" or "mushroom-shaped", resulting in a sudden increase in the cross-sectional area of the transmission line and changing the characteristic impedance of the transmission line; insufficient solder may cause microcracks, voids or incompletely wetted areas between the solder joint and the pin or PCB pad, which may introduce additional contact resistance and capacitance. An incomplete connection is equivalent to a series of high-impedance points, resulting in an increase in impedance and also causing reflection. Therefore, it is particularly important to set the constant-weight solder block - 220, which can not only ensure stronger structural stability at the connection, but also keep the impedance at the solder joint stable, effectively avoid the generation of echoes, and improve the transmission of high-frequency signals.

[0035] When the embodiment of the present application is actually running, the steps are as follows: Step 1: Assemble the high-frequency signal transfer board device to ensure that all components are firmly and reliably connected; Step 2: Heat the insertion pin 200 and the insertion hole 120 to quickly conduct heat through the heat-conducting wire 210 and melt the solder block - 220; Step 3: The melted solder block - 220 flows in through the small holes on the conducting board 310 and is soldered to the high-frequency connector 300 to achieve a reliable connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300; Step 4: After the soldering connection is completed, cool the device to quickly solidify the solder joint and ensure the stability and reliability of the connection.

[0036] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: In the present application, a constant-weight solder block - 220 is provided at the bottom of the insertion pin 200, and small holes are opened on the conducting board 310 of the high-frequency connector 300, so that the melted solder block - 220 can accurately and evenly flow into the small holes after being heated and melted, and form a reliable soldering connection with the high-frequency connector 300. This method effectively solves the problem that the solder volume control in the traditional welding process is inaccurate, resulting in impedance changes and then easy generation of echoes, reduces the interference of echoes on normal signal transmission, and improves the quality and reliability of signal transfer; through the double guarantee of the interference fit between the insertion pin 200 and the insertion hole 120 and the soldering connection, the connection between the high-frequency signal transmission microstrip line 130 and the high-frequency connector 300 is more firm and stable, can resist external forces such as vibration and impact during long-term use, and reduces the degradation of signal transmission performance caused by poor contact or loose connection.

[0037] Meanwhile, due to the rapid heat conduction characteristics of the heat conduction wire 210, the solder block 220 can be melted quickly and evenly, ensuring the reliability and stability of the connection in different temperature environments. In addition, this connection method can also reduce the problem of inconsistent dimensional changes caused by differences in the thermal expansion coefficients of materials to a certain extent, improving the adaptability of the high-frequency signal adapter board to temperature changes. By optimizing the connection method and improving the reliability and stability of the connection, the loss and distortion of signals during transmission are effectively reduced, the integrity and quality of signal transmission are improved, and the technical effects of improved connection firmness and reliability, reduced loss during signal transmission, and improved signal transmission stability and transmission efficiency are achieved.

[0038] Embodiment 2: In order to improve the quality of soldering and the stability of the connection, in view of the above technical problems, the present application proposes the following technical solutions, specifically: As Figure 7 Shown in Figure 8 As shown, a groove 320 is provided on the conductive surface at the top of the high-frequency connector 300 and clamped with the pin 200. The groove 320 is an arc-shaped structure with a constant shape and size, which is used to control the shape and welding amount of the solder block 220 after melting and ensure the stability and reliability of the connection.

[0039] A conduction ball 211 is fixed at the bottom of the heat conduction wire 210. The conduction ball 211 is located inside the groove 320 and is used to ensure stable conduction at the connection.

[0040] By providing the groove 320 with a determined size, the present application can ensure that its volume (i.e., the welding amount of the solder block 220 after melting) remains consistent, enabling the shape and amount of the solder block 220 after melting to be precisely controlled during the welding process, thereby ensuring the stability and reliability of the connection, helping to reduce connection problems caused by excessive or insufficient solder, and improving the reliability and quality of the connection; by fixing the conduction ball 211 at the bottom of the heat conduction wire 210, the conduction ball 211 can not only enhance the uniformity of heat conduction but also play a role in fixing and supporting after the solder melts, ensuring stable conduction at the connection; at the same time, the conduction ball 211 can also help control the amount of the solder block 220 because its position in the groove 320 can limit the flow range of the solder block 220, further ensuring the consistency of the solder amount and the stability of the connection.

[0041] Embodiment 3: Since the high-frequency connector 300 and the bottom of the pin 200 are connected by a clamping method, loosening or gaps may occur during long-term use. In order to prevent loosening from causing a decrease in connection stability, in view of the above technical problems, the present application proposes the following technical solutions, specifically: As Figure 7 Shown in Figure 9As shown, a fixing cover 230 is fixed to the top of the plug pin 200 by a snap-fitting manner. The fixing cover 230 has a constant shape and size, and is used to ensure that the amount of the second tin block 240 is constant. A second tin block 240 of constant weight is arranged inside the fixing cover 230. The second tin block 240 is used to solder the plug hole 120 and the plug pin 200 after melting.

[0042] A plurality of conducting grooves 250 are provided on the top of the plug pin 200 and along its circumference. The conducting groove 250 is a T-shaped structure, the upper end of which is connected to the interior of the fixing cover 230, and the two ends of which are respectively connected to the heat conducting wire 210 and the plug hole 120, so as to allow the tin block 240 to flow along the conducting groove 250 after melting, thereby realizing multi-point welding.

[0043] The present application fixes the fixing cover 230 on the pin 200 by snapping, and the shape and size of the fixing cover 230 are determined. A tin block 240 is arranged inside the fixing cover 230, which means that the amount of the tin block 240 is also determined. Therefore, the amount of the tin block 240 can be precisely controlled, thereby avoiding connection problems caused by too much or too little tin. By precisely controlling the amount of the tin block 240 and the soldering connection method, the electromagnetic radiation generated by poor connection or improper tin amount can be reduced, so that the connection between the plug hole 120 (that is, the adapter circuit board 110) and the pin 200 is more stable and reliable, and the connection problems caused by looseness or gaps are reduced. It helps to precisely control the amount and shape of the melted tin, thereby avoiding connection problems caused by too much or too little tin. The stable connection and precise tin amount control help to reduce losses and interference during signal transmission, thereby improving the performance and stability of signal transmission.

[0044] Embodiment 4: In order to improve the soldering quality and the stability of the connection, make the signal transmission faster and more convenient, and improve the stability of the signal transmission, the present application proposes the following technical solutions for the above technical problems, specifically: like Figures 5 to 9 As shown, the technical solution of the present invention also provides a welding method for a circuit board structure for high-frequency signal transmission, and the specific steps are as follows: Step 1: Assemble the high-frequency signal adapter board device and ensure that all components are firmly and reliably connected; Step 2: Invert the overall structure of the circuit board, heat and weld the pin 200 and the plug hole 120, and perform exhaust treatment to make the inside of the circuit board in a negative pressure state. The melted tin block 240 flows into the plug hole 120 through the conductive groove 250, fills the gap between the pin 200 and the plug hole 120, and assists in filling the channel between the pin 200 and the high-frequency connector 300. The tin block 1 220 is melted by the heat conduction of the heat conductive wire 210, and under the action of the negative pressure, it quickly flows into the groove where the heat conductive wire 210 is located; Step 3: Place the overall structure of the circuit board in the positive direction, stop the negative pressure treatment, and quickly cool the insertion pins 200 and the insertion holes 120, so that the melted solder block 240 at the insertion pins 200 and the insertion holes 120 quickly solidifies, realizing the soldering process; Step 4: After placing it in the positive direction, heat the connection between the insertion pins 200 and the high-frequency connector 300. The solder block 220 melts and flows into the groove 320 through the conducting plate 310, realizing the soldering connection between the insertion pins 200 and the high-frequency connector 300; Step 5: After the soldering connection is completed, cool the entire device to make the solder joints quickly solidify, ensuring the stability and reliability of the connection.

[0045] In this application, by optimizing the soldering process, air extraction treatment is performed on the insertion pins 200 and the insertion holes 120 to create a negative pressure environment. In this way, the melted solder block 240 can flow smoothly under the assistance of negative pressure, and flow into the insertion holes 120 through the conducting groove 250 and fill the gap between the insertion pins 200 and the insertion holes 120. This process not only ensures the precise control of the solder volume, but also effectively avoids the echo problem caused by too much or too little solder volume, thereby reducing the interference of the echo on the normal signal transmission.

[0046] The negative pressure environment enables the melted solder to flow smoothly to the position that needs to be filled, avoiding the accumulation and waste of solder during the soldering process. The negative pressure environment also helps to reduce the bubbles and defects generated during the soldering process, improving the soldering quality; after the solder block 240 melts and fills in place, the solder block 240 is solidified by rapid cooling. Rapid cooling also helps to reduce the heat affected zone during the soldering process, protecting other parts of the circuit board from thermal damage, realizing an efficient soldering process, and improving the integrity and quality of signal transmission; and the rapid heat conduction characteristics of the heat conducting wire 210 and the precise control of the solder volume by the groove 320 enable the connection structure to adapt to the influence of temperature changes to a certain extent and maintain stable signal transmission performance.

[0047] In this application, by keeping the masses of the first solder blocks 220 and the second solder blocks 240 inside multiple pins 200 on the same adapter circuit board 110 constant and consistent, it is possible to simultaneously solder multiple connection points on the circuit board by setting a unified temperature and melting time, greatly improving production efficiency, reducing the soldering time for each individual connection point, ensuring that the solder volume at each soldering point is consistent and stable, not only improving the solder volume stability at each soldering position, but also improving the soldering quality. Moreover, by ensuring the consistency of soldering parameters (such as temperature and time), the stability of the soldering quality is improved, and soldering quality problems caused by operation differences are reduced; by setting a unified temperature setting, it is ensured that each connection point on the circuit board can be evenly heated, avoiding poor soldering caused by excessive or too low local temperature; by precisely controlling the melting time of the solder blocks, it is possible to ensure that the solder flows into the connection points in the best state, fills the gaps, and forms a firm soldering joint, reducing soldering errors caused by improper operation or fatigue.

[0048] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. Circuit board structure for high-frequency signal transmission, comprising a connecting member (100), an adapter circuit board (110), a plug hole (120), a pin (200) and a high-frequency connector (300), wherein the pin (200) is connected to the plug hole (120) by an interference fit connection method, and the pin (200) is connected to the high-frequency connector (300) by a snap connection method, characterized in that: A heat-conducting wire (210) is arranged inside each pin (200) for conducting heat; a tin block one (220) with a constant weight is arranged at the bottom of each pin (200) for melting the tin block one (220) by heating the top end of the pin (200) to realize soldering connection between the top end of the pin (200) and the high-frequency connector (300).

2. The circuit board structure for high-frequency signal transmission according to claim 1, characterized in that, A conducting plate (310) is fixed on the top of the high-frequency connector (300), and a plurality of small holes are evenly formed in the middle of the conducting plate (310) for soldering connection with the melted tin block one (220).

3. The circuit board structure for high-frequency signal transmission according to claim 1, characterized in that Mounting holes (101) are formed on the surface of the connecting member (100) for providing mounting positions; a plurality of photosensitive plate contact points (102) are fixed in the middle of the adapter circuit board (110) for connecting the photosensitive plate (140) and the high-frequency signal transmission microstrip line (130).

4. The circuit board structure for high-frequency signal transmission according to claim 3, characterized in that, The connecting member (100) further comprises a high-frequency signal transmission microstrip line (130), a photosensitive plate (140), an insulating plate (150), and a light inlet channel (160); The adapter circuit board (110) is a multi-layer printed circuit board fixed on the connecting member (100) for realizing signal transfer and transmission; a light inlet channel (160) is arranged below the middle of the connecting member (100), a photosensitive plate (140) is arranged on the top of the light inlet channel (160), and the photosensitive plate (140) is connected to the photosensitive plate contact point (102) on the adapter circuit board (110) for receiving an external optical signal and converting it into an electrical signal; There are a plurality of high-frequency signal transmission microstrip lines (130), all of which are arranged on the adapter circuit board (110), one end of which is connected to the photosensitive plate contact point (102), and the other end is connected to the high-frequency connector (300) through the pin (200). The high-frequency signal transmission microstrip lines (130) adopt an equal-length design for realizing synchronous transmission of photosensitive signals; the insulating plate (150) is arranged at the bottom of the adapter circuit board (110) and has the same shape as the adapter circuit board (110), and the insulating plate (150) is used to prevent the circuit board from contacting other conductive objects and avoid short circuits.

5. The circuit board structure for high-frequency signal transmission according to claim 1, characterized in that, The plug hole (120) is in a frustum structure, and the aperture gradually decreases from the top to the bottom of the adapter circuit board (110), and the aperture gradually changes from 1.5 mm to 1.2 mm; the heat-conducting wire (210) is made of copper wire for quickly conducting heat and then quickly melting the tin block one (220) after being heated to realize soldering.

6. The circuit board structure for high-frequency signal transmission according to claim 5, wherein, A groove (320) is provided on the top of the high-frequency connector (300) and on the guide surface that is engaged with the plug pin (200). The groove (320) is an arc-shaped structure with a constant shape and size, and is used to control the shape and welding amount of the tin block (220) after melting and to ensure the stability and reliability of the connection.

7. The circuit board structure for high-frequency signal transmission according to claim 6, characterized in that, A conducting ball (211) is fixed to the bottom of the heat conducting wire (210); the conducting ball (211) is located inside the groove (320) and is used to ensure stable conduction at the connection.

8. The circuit board structure for high-frequency signal transmission according to claim 7, wherein A fixing cover (230) is fixed to the top of the plug pin (200) by means of a snap connection. The fixing cover (230) has a constant shape and size and is used to ensure that the amount of the second tin block (240) is constant. A second tin block (240) of constant weight is arranged inside the fixing cover (230). The second tin block (240) is used to solder the plug hole (120) and the plug pin (200) after melting.

9. The circuit board structure for high-frequency signal transmission according to claim 8, characterized in that, A plurality of conducting grooves (250) are provided on the top of the plug pin (200) and along its circumference. The conducting groove (250) is a T-shaped structure, the upper end of which is connected to the interior of the fixing cover (230), and the two ends of which are respectively connected to the heat conducting wire (210) and the plug hole (120), so as to allow the second tin block (240) to flow along the conducting groove (250) after melting, thereby realizing multi-point welding.

10. A soldering method for a circuit board structure for high-frequency signal transmission, characterized in that, The circuit board structure for high-frequency signal transmission according to claim 9 is adopted, and the specific steps are as follows: Step 1: Assemble the high-frequency signal adapter board device and ensure that all components are firmly and reliably connected; Step 2: Invert the entire structure of the circuit board, heat and weld the pin (200) and the plug hole (120), and perform a vacuum treatment to make the inside of the circuit board in a negative pressure state. The melted tin block 2 (240) flows into the plug hole (120) through the conductive groove (250), fills the gap between the pin (200) and the plug hole (120), and assists in filling the channel between the pin (200) and the high-frequency connector (300). The tin block 1 (220) is melted by the heat conduction of the heat conductive wire (210), and under the action of the negative pressure, it quickly flows into the groove where the heat conductive wire (210) is located; Step 3: Place the entire structure of the circuit board in a forward direction, stop the negative pressure treatment and quickly cool the pin (200) and the plug hole (120), so that the melted tin block 2 (240) at the pin (200) and the plug hole (120) is quickly solidified to achieve soldering treatment; Step 4: After forward placement, the connection between the plug pin (200) and the high-frequency connector (300) is heated, the tin block (220) melts, and flows into the groove (320) through the guide plate (310), thereby achieving a soldering connection between the plug pin (200) and the high-frequency connector (300); Step 5: After the soldering connection is completed, cool the entire device to allow the soldering points to solidify quickly to ensure the stability and reliability of the connection.

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