Photoelectric sensor packaging structure, preparation method thereof and camera module

Abstract

The invention provides a photoelectric sensor packaging structure, a preparation method thereof and a camera module. The photoelectric sensor packaging structure comprises a substrate module, a light emitting unit and a light receiving unit. The substrate module comprises a substrate and is provided with a plurality of first channels and a plurality of second channels; the light emitting unit and the light receiving unit are arranged on the substrate, and the light receiving unit comprises a photosensitive area and a non-photosensitive area connected to the photosensitive area; the two ends of the first channel extend to the substrate and the non-photosensitive area respectively, a first conductive layer is arranged on the inner wall of the first channel to form a first hollow conductive channel, and the first hollow conductive channel is electrically connected to the substrate and the non-photosensitive area; the two ends of the second channel extend to the substrate and the light emitting unit respectively, a second conductive layer is arranged on the inner wall of the second channel to form a second hollow conductive channel, and the second hollow conductive channel is electrically connected to the substrate and the light emitting unit.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to an optoelectronic sensor packaging structure, a preparation method thereof, and an imaging module. Background Art

[0002] An imaging module (such as a TOF camera) generally includes a substrate, a receiver and a light emitter disposed on the substrate. In the imaging module, the light emitter emits infrared light to an object, and the infrared light is reflected to the receiver after encountering the object. By calculating the time difference or phase difference between the emission and the reflection back to the receiver, a set of distance depth data is formed, thereby realizing the measurement of the three-dimensional structure or three-dimensional contour of the object.

[0003] In the above structure, wire bonding packaging technology or flip-chip packaging technology is usually adopted to realize the signal connection between the substrate and the receiver or the light emitter. However, the wire bonding packaging technology is limited by the wire bonding tool, resulting in a relatively large lateral dimension of the connection path between the receiver (or the light emitter) and the substrate, which is not conducive to miniaturization. Moreover, the flip-chip packaging technology requires the substrate to have high flatness and symmetrically distributed solder joints, resulting in poor universality. Summary of the Invention

[0004] In view of this, this application provides an optoelectronic sensor packaging structure, a preparation method thereof, and an imaging module to solve the above problems.

[0005] This application provides an optoelectronic sensor packaging structure, including a substrate module, a light emitting unit, and a light receiving unit. The substrate module includes a substrate, and the substrate module has a plurality of first channels and a plurality of second channels; the light emitting unit and the light receiving unit are disposed on the substrate, and the light receiving unit includes a photosensitive area and a non-photosensitive area connected to the photosensitive area; both ends of the first channel extend to the substrate and the non-photosensitive area respectively, and a first conductive layer is provided on the inner wall of the first channel to form a first hollow conductive channel, and the first hollow conductive channel is electrically connected to the substrate and the non-photosensitive area; both ends of the second channel extend to the substrate and the light emitting unit respectively, and a second conductive layer is provided on the inner wall of the second channel to form a second hollow conductive channel, and the second hollow conductive channel is electrically connected to the substrate and the light emitting unit.

[0006] In some embodiments, the light emitting unit includes a driving chip and a light source disposed on the driving chip, the driving chip is electrically connected to the light source, the substrate module further includes a plastic package, the substrate includes a first surface and a second surface disposed opposite to each other, the plastic package and the light receiving unit and the driving chip are disposed on the same surface of the substrate, the plastic package at least adheres to the side walls of the light receiving unit and the driving chip, and the second hollow conductive channel electrically connects the substrate and the driving chip.

[0007] In some embodiments, both the driving chip and the optical receiving unit are located on the first surface, and the first channel and the second channel are both disposed in the encapsulant; the first channel includes a first portion, a second portion, and a third portion connecting the first portion and the second portion. The first portion and the second portion both extend along the thickness direction of the photosensor packaging structure. One end of the first portion penetrates through the substrate, and one end of the second portion communicates with the non-photosensitive area.

[0008] In some embodiments, the encapsulant includes a first encapsulation block and a second encapsulation block disposed on the first encapsulation block. The first encapsulation block fits against the sidewalls of the optical receiving unit and the driving chip. The second encapsulation block covers at least part of the non-photosensitive area and part of the top surface of the driving chip. The first portion penetrates through the first encapsulation block and extends to the second encapsulation block. The second portion penetrates through the second encapsulation block, and the third portion is exposed on the second encapsulation block.

[0009] In some embodiments, a protective film is further provided on the surface of the second encapsulation block, and the protective film covers the third portion.

[0010] In some embodiments, the conductive materials of the first conductive layer and the second conductive layer both include conductive ink or conductive silver paste.

[0011] In some embodiments, the first channel and the second channel are both disposed on the substrate. The substrate is provided with a first opening and a second opening. The optical receiving unit is disposed on the second surface and the photosensitive area is exposed to the first opening. The first hollow conductive channel penetrates through the substrate and extends to the non-photosensitive area. The driving chip is disposed on the second surface, and the light source is exposed to the second opening. The second hollow conductive channel penetrates through the substrate and extends to the top surface of the driving chip.

[0012] In some embodiments, the photosensor packaging structure further includes a plurality of components, and the components are sealed in the encapsulant, or disposed outside the encapsulant, or disposed on the substrate.

[0013] In some embodiments, the thickness of the first conductive layer is greater than or equal to 500 nm.

[0014] The present application also provides a method for manufacturing an optoelectronic sensor packaging structure, including: disposing a light receiving unit and a light emitting unit on a substrate of a substrate module, where the light receiving unit includes a photosensitive area and a non-photosensitive area connected to the photosensitive area; opening a plurality of first channels and a plurality of second channels in the substrate module, with two ends of the first channels extending to the substrate and the non-photosensitive area respectively, and two ends of the second channels extending to the substrate and the light emitting unit respectively; disposing a first conductive layer on the inner wall of the first channel to form a first hollow conductive channel, and disposing a second conductive layer on the inner wall of the second channel to form a second hollow conductive channel, where the first hollow conductive channel is electrically connected to the substrate and the non-photosensitive area, and the second hollow conductive channel is electrically connected to the substrate and the light emitting unit, thereby obtaining the optoelectronic sensor packaging structure.

[0015] In some embodiments, the substrate module further includes a plastic package body, the light emitting unit includes a driving chip and a light source disposed on the driving chip, the substrate includes a first surface and a second surface disposed opposite to each other, the plastic package body and the light receiving unit and the driving chip are disposed on the same surface of the substrate, the plastic package body at least adheres to the side walls of the driving chip and the light receiving unit, and a part of the plastic package body is also located between the driving chip and the light receiving unit.

[0016] In some embodiments, both the first channels and the second channels are disposed on the plastic package body.

[0017] In some embodiments, disposing the light emitting unit and the light receiving unit on the substrate further includes: disposing a second plastic package block on the non-photosensitive area of the light receiving unit and the driving chip; fixing the light receiving unit and the driving chip having the second plastic package block on the first surface, and a plastic package preform is also provided on the substrate, and the plastic package preform at least adheres to the side walls of the light receiving unit and the driving chip; curing the plastic package preform to obtain a first plastic package block, and the first plastic package block and the second plastic package block form the plastic package body.

[0018] In some embodiments, the plastic package preform is disposed between the light receiving unit and the substrate and extends to the side walls of the light receiving unit and the driving chip.

[0019] In some embodiments, both the first channels and the second channels are disposed on the substrate.

[0020] In some embodiments, arranging the light emitting unit and the light receiving unit on the substrate further includes: fixing the light receiving unit and the driving chip on the second surface, exposing the photosensitive area through a first opening in the substrate, exposing the light source through a second opening in the substrate, and providing a pre-molding body on the second surface, where the pre-molding body at least adheres to the sidewalls of the light receiving unit and the driving chip and part of the pre-molding body is located between the light receiving unit and the driving chip; curing the pre-molding body to obtain the molding body.

[0021] In some embodiments, arranging the first conductive layer and the second conductive layer further includes:

[0022] Arranging conductive materials in the first channel and the second channel, and curing the conductive materials to form the first conductive layer and the second conductive layer respectively.

[0023] In some embodiments, the conductive material includes conductive ink or conductive silver paste.

[0024] In some embodiments, when the conductive material is the conductive ink, curing the conductive ink includes a first curing stage and a second curing stage performed in sequence; the first curing stage includes: after spraying the conductive ink in the first channel and the second channel, irradiating the conductive ink with ultraviolet light to pre-cure the conductive ink; the second curing stage includes: baking the pre-cured conductive ink to obtain the first conductive layer and the second conductive layer.

[0025] In some embodiments, the preparation method further includes: providing a board including a plurality of substrates arranged in an array, with a cutting area to be formed between adjacent substrates; manufacturing each substrate into a packaging unit, where the packaging unit includes the substrate and the driving chip, the molding body, the light emitting unit and the light receiving unit arranged on the substrate; arranging the first conductive layer and the second conductive layer in the packaging unit to form the first hollow conductive channel and the second hollow conductive channel, and then cutting the board along the cutting area to be formed to obtain a plurality of the optoelectronic sensor packaging structures.

[0026] This application further provides an imaging module, including a lens and an optoelectronic sensor packaging structure, where the lens is arranged on the substrate module of the optoelectronic sensor packaging structure.

[0027] In this application, by opening a first channel and a second channel on a substrate module, and providing a first conductive layer in the first channel and a second conductive layer in the second channel, a first hollow conductive channel and a second hollow conductive channel are obtained. The substrate is electrically connected to the non-photosensitive area through the first hollow conductive channel, and the substrate is electrically connected to the light-emitting unit through the second hollow conductive channel. The setting of metal wires is omitted, and it is not restricted by the shape of wire bonding tools. In this application, the shape of the channel can be adjusted according to requirements to the position of the guiding layer, and it is not limited by the wire bonding tools of metal wires. The lateral paths between the substrate and the non-photosensitive area, and between the substrate and the light-emitting unit can be reduced. Since the shape of the channel can also be adjusted correspondingly according to the installation positions of other components in this application, to a certain extent, the thickness of the optoelectronic sensor package can also be reduced, and it is not restricted by the brittleness of metal wires so that other functional components cannot be arranged around the area where the metal wires are located, which is conducive to the miniaturization development of the package structure. At the same time, compared with the flip-chip packaging technology, in this application, by forming a conductive layer on the inner wall of the channel, it is not limited to using chips with symmetrically distributed solder joints, and it is not restricted by the size of metal balls, thus avoiding the excessively high requirements for the flatness of the substrate as in the related art. Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of an imaging module provided by this application.

[0029] Figure 2 In one embodiment Figure 1 It is a schematic structural diagram of the optoelectronic sensor package structure of the imaging module shown.

[0030] Figure 3 For Figure 2 It is a schematic structural diagram of the optoelectronic sensor package structure shown in another embodiment.

[0031] Figure 4 For Figure 2 It is a schematic structural diagram of the optoelectronic sensor package structure shown in another embodiment.

[0032] Figure 5 For Figure 2 It is a schematic structural diagram of the optoelectronic sensor package structure shown in another embodiment.

[0033] Figure 6 For Figure 2 It is a top view of the sheet material of the optoelectronic sensor package structure shown.

[0034] Figure 7 It is a schematic structural diagram after the second encapsulation block is arranged on the light receiving unit and the driving chip.

[0035] Figure 8 For Figure 7Schematic diagram of the structure after setting a plate on the optical receiving unit and the driving chip shown.

[0036] Figure 9 For Figure 8 Schematic diagram of the structure after laminating the substrate, the optical receiving unit, and the driving chip shown.

[0037] Figure 10 For Figure 9 Schematic diagram of the structure with a channel opened on the plastic package shown.

[0038] Figure 11 For Figure 10 Schematic diagram of the structure with a conductive layer formed in the channel shown.

[0039] Figure 12 Schematic diagram of the optoelectronic sensor packaging structure provided by another embodiment of the present application.

[0040] Main element symbol description

[0041] Optoelectronic sensor packaging structure 100

[0042] Substrate module 10

[0043] Substrate 11

[0044] First surface 111

[0045] Second surface 112

[0046] First opening 113

[0047] Second opening 114

[0048] Plastic package 12

[0049] First plastic package block 121

[0050] Second plastic package block 122

[0051] First hollow conductive channel 13

[0052] First channel 131

[0053] First conductive layer 132

[0054] First part 133

[0055] Second part 134

[0056] Third part 135

[0057] Second hollow conductive channel 14

[0058] Second channel 141

[0059] Second conductive layer 142

[0060] Light emitting unit 20

[0061] Driver chip 21

[0062] Light source 22

[0063] Electrical connection part 23

[0064] Light receiving unit 30

[0065] Photosensitive area 31

[0066] Non - photosensitive area 32

[0067] Protective film 40

[0068] Component 50

[0069] Adhesive layer 60

[0070] Plastic - encapsulated preform 70

[0071] Sheet material 200

[0072] Packaging unit 210

[0073] Area to be cut 220

[0074] Camera module 1000

[0075] Lens assembly 300

[0076] Lens 310

[0077] Lens holder 320

[0078] Base 410

[0079] Optical lens element 420

[0080] The following specific embodiments will further illustrate the present application in conjunction with the above - mentioned appendices Figure 1-12 Specific embodiments Specific embodiments

[0081] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0082] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or there may be an intermediate element at the same time.

[0083] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0084] In the wire bonding packaging technology, metal wires are used to connect the substrate and the chip to achieve signal connection between the chip and the substrate. However, this technology is limited by the shape of the wire bonding tool, so that a large lateral distance needs to be reserved for the connection path from the chip end to the substrate end. And the metal wires are extremely thin and brittle, so that other components cannot be installed in the area occupied by the metal wires.

[0085] In the flip-chip packaging technology, metal balls or short metal posts are used to connect the substrate and the chip to achieve signal connection between the chip and the substrate. During the packaging process, due to the size limitation of the metal balls, not only is the flatness requirement of the substrate quite high, but also during the flip-chip soldering process, all solder joints are joined at one time. When applying pressure or ultrasonic energy to the chip surface, considering the average degree of energy transfer, only chips with symmetrically distributed solder joints can be used. The universality of this technology is not strong and it is not conducive to the development of chip miniaturization.

[0086] To further elaborate on the technical means and effects adopted by this application to achieve the predetermined purpose, the following provides a detailed description of this application in combination with the drawings and embodiments.

[0087] To improve the above problems, refer to Figure 1 , this application provides an imaging module 1000. The imaging module 1000 includes a photoelectric sensor packaging structure 100 and a lens assembly 300. The photoelectric sensor packaging structure 100 is used to integrate a light emitter and an ambient light sensor, and measures the time interval from the pulse signal emitted by the light emitter to the time received by the ambient light sensor or the phase difference generated by the laser round-trip to the measured object once by the time-of-flight method, so as to realize the measurement of the three-dimensional structure or three-dimensional contour of the measured object. The photoelectric sensor packaging structure 100 can be applied to fields such as somatosensory control, artificial intelligence, and machine vision. In this embodiment, the photoelectric sensor packaging structure 100 is applied to an imaging module, such as a TOF camera, as an example for illustration.

[0088] Please refer to Figure 1 andFigure 2 , the optoelectronic sensor packaging structure 100 includes a substrate module 10, a light emitting unit 20, and a light receiving unit 30. The substrate module 10 includes a substrate 11. The light emitting unit 20 and the light receiving unit 30 are disposed on the substrate 11. The lens assembly 300 is disposed on the substrate module 10, and the light receiving unit 30 is located within the lens assembly 300. The light emitting unit 20 is configured to emit a light beam to the object to be measured. The emitted light beam is reflected by the object to be measured and passes through the light sensing path of the lens assembly 300 to the light receiving unit 30, and is received by the light receiving unit 30. The light receiving unit 30 converts the light signal into a corresponding electrical signal, that is, realizes optoelectronic conversion, thereby realizing the measurement of the distance of the object to be measured.

[0089] Referring to Figure 1 and Figure 2 , the substrate module 10 has a plurality of first channels 131 and a plurality of second channels 141. The light receiving unit 30 includes a photosensitive region 31 and a non-photosensitive region 32 connected to the photosensitive region 31. The light receiving unit 30 includes a photosensitive chip. Both ends of the first channel 131 extend to the substrate 11 and the non-photosensitive region 32 respectively. The inner wall of the first channel 131 is provided with a first conductive layer 132 to form a first hollow conductive channel 13. The first hollow conductive channel 13 is electrically connected to the substrate 11 and the non-photosensitive region 32. Both ends of the second channel 141 extend to the substrate 11 and the light emitting unit 20 respectively. The inner wall of the second channel 141 is provided with a second conductive layer 142 to form a second hollow conductive channel 14. The second hollow conductive channel 14 is electrically connected to the substrate 11 and the light emitting unit 20.

[0090] Compared with the prior art, in the above technical solution, the first hollow conductive channel 13 and the second hollow conductive channel 14 replace the arrangement of metal wires. The arrangements of the first hollow conductive channel 13 and the second hollow conductive channel 14 are not limited by the shape of the wire bonding tool. In the present application, the shape of the channel can be adjusted according to requirements to the position of the guiding layer, and it is not limited by the wire bonding tool of the metal wire. The lateral paths between the substrate 11 and the non-photosensitive region 32, and between the substrate 11 and the light emitting unit 20 can be reduced. Since the shape of the channel can also be correspondingly adjusted according to the installation positions of other components in the present application, to a certain extent, the thickness of the optoelectronic sensor package can also be reduced, and it is not restricted by the brittleness of the metal wire so that other functional components cannot be arranged around the area where the metal wire is located, which is beneficial to the miniaturization development of the packaging structure. At the same time, compared with the flip-chip packaging technology, in the present application, by forming a conductive layer on the inner wall of the channel, it is not limited to using chips with symmetrically distributed solder joints, and it is not restricted by the size of the metal balls, resulting in too high requirements for the flatness of the substrate 11 as in the related art.

[0091] Referring to Figure 1, the substrate module 10 further includes a plastic package 12. The plastic package 12 is disposed on the substrate 11, and the plastic package 12 adheres to at least the sidewalls of the light receiving unit 30 and the driving chip 21. The provision of the plastic package 12 can improve the stability of the optoelectronic sensor packaging structure 100.

[0092] The lens assembly 300 includes a lens 310 and a lens holder 320. The lens holder 320 is disposed on the plastic package 12, and the light receiving unit 30 is placed inside the lens holder 320. The lens 310 is disposed on the lens holder 320. The light beam reflected by the object to be measured enters the imaging module 1000 through the lens 310. The lens 310 includes a plurality of lenses, and the light beam passes through the plurality of lenses and is received by the light receiving unit 30. In some other embodiments, the lens holder 320 can also be disposed on the substrate 11. When the lens holder 320 is disposed on the plastic package 12, it is beneficial to reduce the lateral size of the imaging module 1000.

[0093] Refer to Figure 1 , a base 410 and an optical lens element 420 are further provided on the substrate module 10. The optical lens element 420 is disposed on the base 410 and is located on the light emitting path of the light emitting unit 20. In some embodiments, the base 410 is disposed on the substrate 11 or the plastic package 12. When the base 410 is disposed on the plastic package 12, the lateral size of the imaging module 1000 can be reduced, which is beneficial to the miniaturization development of the imaging module 1000.

[0094] Refer to Figure 1 and Figure 2 , the light emitting unit 20 includes a driving chip 21 and a light source 22 disposed on the driving chip 21. The driving chip 21 is electrically connected to the light source 22. In this embodiment, the case where the base 410 is disposed on the plastic package 12 is taken as an example for illustration. The base 410 and the substrate module 10 enclose a cavity, and the light emitting unit 20 is located inside the cavity. The optical lens element 420 is disposed at one end of the base 410 facing away from the substrate 11. The optical lens element 420 can be a transparent glass, or a lens, or a diffusing lens, or a combination of at least two of the above. The diffusing lens is used to adjust the angle of the light emitted by the light source 22, and the lens is used to converge or diverge the light. The light beam emitted by the light source 22 is emitted to the object to be measured through the optical lens element 420.

[0095] In some embodiments, the light source 22 is a vertical cavity surface emitting laser (abbreviation: VCSEL) or a vertical external cavity surface emitting semiconductor laser (abbreviation: VECSEL). The driving chip 21 is a laser ranging chip. The driving chip 21 is disposed below the light source 22, and the driving chip 21 is used to output a signal to drive the light source 22 to emit light. In some embodiments, an electrical connection portion 23 is further provided between the driving chip 21 and the light source 22, and the light source 22 is electrically driven on the driving chip 21 through the electrical connection portion 23. The electrical connection portion 23 can be a conductive adhesive or solder paste.

[0096] In some embodiments, the second hollow conductive channel 14 is electrically connected to the substrate 11 and the driving chip 21. Both the first hollow conductive channel 13 and the second hollow conductive channel 14 are disposed on the substrate 11 or the plastic encapsulation body 12 simultaneously. The substrate 11 includes a first surface 111 and a second surface 112 which are oppositely disposed, and the plastic encapsulation body 12, the driving chip 21 and the light receiving unit 30 are disposed on the same surface of the substrate 11.

[0097] In some embodiments, at least a part of the first hollow conductive channel 13 and at least a part of the second hollow conductive channel 14 extend along the thickness direction of the photoelectric sensor packaging structure 100, so as to facilitate opening holes and also facilitate forming a conductive layer in the channels. For example, in some embodiments, by means of spraying conductive ink or the like, conductive ink is coated in the channels, and the conductive ink is cured to form a conductive layer.

[0098] In this application, taking the light receiving unit 30 and the light emitting unit 20 being disposed on the first surface 111 and the second surface 112 simultaneously as an example, the photoelectric sensor packaging structure 100 is specifically described through the following embodiments. In some embodiments, the light receiving unit 30 and the light emitting unit 20 may also be disposed on different surfaces of the substrate 11.

[0099] Embodiment 1

[0100] Referring to Figure 2 , in this embodiment, both the light emitting unit 20 and the light receiving unit 30 are located on the first surface 111, and the first channel 131 and the second channel 141 are both disposed in the plastic encapsulation body 12. The first channel 131 includes a first part 133, a second part 134, and a third part 135 connected between the first part 133 and the second part 134. Both the first part 133 and the second part 134 extend along the thickness of the plastic encapsulation body 12, and both the first part 133 and the second part 134 may be hole structures. One end of the first part 133 penetrates through to the substrate 11, for exposing a pad (not shown in the figure) on the substrate 11 in the first channel 131, so as to realize electrical connection between the first part 133 and the pad. One end of the second part 134 communicates with the non-photosensitive area 32, for exposing a pad (not shown in the figure) on the non-photosensitive area 32 in the first channel 131, so as to realize electrical connection between the second part 134 and the pad. In this embodiment, the pad connection part of the non-photosensitive area 32 referred to is located on the surface of the light receiving unit 30 away from the substrate 11.

[0101] In some embodiments, the plastic encapsulation body 12 serves as a carrier of the hollow conductive channel, and the shape and position of the channel can be adjusted according to actual requirements, so as to adjust the shape and position of the hollow conductive channel.

[0102] Referring to Figure 2, in some embodiments, the encapsulant 12 includes a first encapsulation block 121 and a second encapsulation block 122 disposed on the first encapsulation block 121. The first encapsulation block 121 and the second encapsulation block 122 are bonded and fixed. The first encapsulation block 121 fits against the sidewalls of the light receiving unit 30 and the driving chip 21. The second encapsulation block 122 covers at least a part of the non-photosensitive area 32 and a part of the top surface of the driving chip 21 facing away from the substrate 11. The first portion 133 penetrates through the first encapsulation block 121 and extends to the second encapsulation block 122, and the second portion 134 penetrates through the second encapsulation block 122.

[0103] In some embodiments, the third portion 135 is exposed on the second encapsulation block 122. The third portion 135 is located on the top surface of the second encapsulation block 122 or is formed by a concave in the top surface of the second encapsulation block 122. When the third portion 135 is located on the top surface of the second encapsulation block 122, a part of the conductive layer is laid flat on the second encapsulation block 122 and is electrically connected to the conductive layer in the first portion 133 and the conductive layer in the second portion 134 respectively to form the first conductive layer 132. The second channel 141 may also have the same structural shape as the first channel 131.

[0104] When the third portion 135 is formed by a concave in the second encapsulation block 122 to form a groove structure, a conductive layer is formed in the groove structure, the opening of the groove faces away from the first encapsulation block 121, and the setting of the groove structure is conducive to spraying a conductive material (such as conductive ink) into the third portion 135 in a subsequent process, and the conductive material is cured to form a conductive layer. And it is also conducive to spraying the entire first channel 131 sequentially in the horizontal direction during the spraying process of the conductive material.

[0105] The second encapsulation block 122 is used as a carrier for the paths of the second portion 134 and the third portion 135. Since the encapsulant 12 includes the first encapsulation block 121 and the second encapsulation block 122, during the encapsulation process, the second encapsulation block 122 can be first covered on the non-photosensitive area 32 and the driving chip 21, and then the first encapsulation block 121 can be fitted against the sidewalls of the light receiving unit 30 and the driving chip 21, which is convenient for assembly and can also improve the yield of the optoelectronic sensor packaging structure 100. In some other embodiments, after the light receiving unit 30 and the driving chip 21 are installed on the substrate 11 through a suitable mold, an integral encapsulant 12 can be injection-molded on the substrate 11.

[0106] In some embodiments, the first hollow conductive channel 13 and the second hollow conductive channel 14 have the same structure, and the steps of forming the first hollow conductive channel 13 and the second hollow conductive channel 14 can be carried out simultaneously. For example, the first channel 131 and the second channel 141 with the same structure are formed first, and the first conductive layer 132 and the second conductive layer 142 are provided (for example, when spraying conductive materials, they can be directly sprayed into the first channel 131 and the second channel 141 in the same step and cured to form conductive layers). Finally, the corresponding conductive channels are obtained simultaneously, so that the steps of obtaining the first hollow conductive channel 13 and the second hollow conductive channel 14 can be simplified. In other embodiments, the first channel 131 and the second channel 141 can also be adjusted according to specific situations, and the structures of the first hollow conductive channel 13 and the second hollow conductive channel 14 are different.

[0107] In some embodiments, in order to prevent the conductive layer in the third part 135 exposed on the second encapsulation block 122 from being electrically connected to other functional components and causing a short circuit, a protective film 40 is further provided on the second encapsulation block 122, and the protective film 40 covers the third part 135. In some embodiments, the protective film 40 is laid on the surface of the entire second encapsulation block 122 and also covers part of the second hollow conductive channel 14 exposed on the second encapsulation block 122. The protective film 40 can be made of UV glue.

[0108] The conductive materials of the first conductive layer 132 and the second conductive layer 142 both include conductive ink or conductive silver paste. The conductive ink can be a particle-free conductive ink, and the conductive ink contains at least one element of silver, platinum, gold, copper, nickel, and aluminum.

[0109] In some embodiments, the optoelectronic sensor packaging structure 100 further includes a plurality of components 50, and the components 50 include at least one of passive components and active components. The components 50 include active components and passive components. The passive components include resistors, capacitors, etc., and the active components include transistors, integrated circuits, or image tubes, etc.

[0110] In some embodiments, the components 50 are arranged on the second surface 112 of the substrate 11.

[0111] Refer to Figure 3 , in other embodiments, the components 50 are arranged on the first surface 111 of the substrate 11 and sealed in the first encapsulation block 121. Part of the components 50 are sealed between the light receiving unit 30 and the substrate 11, and the other part of the components 50 are sealed between the driving chip 21 and the substrate 11. The first encapsulation block 121 is arranged between the light receiving unit 30 and the substrate 11, and extends outside the light receiving unit 30 and wraps the side walls of the light receiving unit 30 and the driving chip 21, so as to improve the stability of the installation of the light receiving unit 30, the driving chip 21, and the components 50.

[0112] Refer to Figure 4 , in some other embodiments, the component 50 is disposed on one side of the optical receiving unit 30 and sealed within the first plastic encapsulation block 121, and the component 50 is located between the optical receiving unit 30 and the driving chip 21.

[0113] Refer to Figure 5 , in some other embodiments, the component 50 is located on one side of the optical receiving unit 30 and on the plastic encapsulation body 12, and the component 50 is not sealed by the plastic encapsulation body 12.

[0114] In some embodiments, in some embodiments, the thickness of the first conductive layer 132 is greater than or equal to 500 nm, and the thickness of the second conductive layer 142 is also greater than or equal to 500 nm. In some embodiments, the conductive layer is conductive ink. The conductive ink is sprayed into the channel, and the thickness is obtained after curing. In some embodiments, the thickness of the conductive layer can be set according to actual requirements, so as to adjust the impedance of each conductive layer.

[0115] The surface of the optoelectronic sensor packaging structure 100 provided by the present application is flat, which is conducive to mounting the lens assembly 300 on the surface of the optoelectronic sensor packaging structure 100. The difference in length between the optoelectronic sensor packaging structure 100 provided by the present application and the corresponding length of the optical receiving unit 30 is less than 500 μm, and the difference in width between the optoelectronic sensor packaging structure 100 and the corresponding width of the optical receiving unit 30 is also less than 500 μm. At the same time, the area of the optoelectronic sensor packaging structure 100 is smaller than that of the packages prepared by the wire bonding packaging technology and the flip chip packaging technology, and the thickness is also smaller than that of the package obtained by the flip chip packaging technology.

[0116] An embodiment of the present application further provides a method for preparing an optoelectronic sensor packaging structure 100, including the following steps:

[0117] S1. Refer to Figure 6 , provide a sheet material 200, the sheet material 200 includes a plurality of substrates 11 arranged in an array, and a cutting area 220 is formed between adjacent substrates 11.

[0118] S2. Refer to Figure 6 , fabricate each substrate 11 into a packaging unit 210.

[0119] The fabrication of the packaging unit 210 specifically includes the following steps:

[0120] (1) Refer to Figure 7 , dispose the second plastic encapsulation block 122 on the non-photosensitive area 32 of the optical receiving unit 30 and on the driving chip 21 of the optical transmitting unit 20.

[0121] The optical receiving unit 30 includes a photosensitive area 31 and a non-photosensitive area 32 connected to the photosensitive area 31. The second encapsulation block 122 can be bonded to the optical receiving unit 30 and the driving chip 21. A part of the second encapsulation block 122 is bonded to the optical receiving unit 30 and the driving chip 21 respectively, and another part of the second encapsulation block 122 is bonded to the optical receiving unit 30 and the driving chip 21 simultaneously. The driving chip 21 and the optical receiving unit 30 are disposed on the same surface of the second encapsulation block 122 with a gap therebetween.

[0122] The optical transmitting unit 20 includes a driving chip 21 and a light source 22 disposed on the driving chip 21, and the driving chip 21 and the light source 22 are electrically connected. Before the second encapsulation block 122 is disposed on the driving chip 21, the light source 22 is assembled on the driving chip 21.

[0123] (2) Refer to Figure 8 and Figure 9 Press and fix the optical receiving unit 30 with the second encapsulation block 122 and the driving chip 21 on the corresponding substrate 11. The substrate 11 is further provided with a preform 70 for encapsulation, and the preform 70 for encapsulation adheres to at least the side walls of the optical receiving unit 30 and the driving chip 21.

[0124] Meanwhile, a part of the preform 70 for encapsulation is disposed at least between the optical receiving unit 30 and the driving chip 21 to space the two apart.

[0125] The optical receiving unit 30 and the driving chip 21 can be bonded to the substrate 11 through an insulating adhesive layer. The preform 70 for encapsulation is coated on the substrate 11 and pressed to cover the side walls of the optical receiving unit 30 and the driving chip 21 and the space between the optical receiving unit 30 and the driving chip 21. The preform 70 for encapsulation is at least located between the second encapsulation block 122 and the substrate 11.

[0126] In some embodiments, the component 50 is pasted on the surface of the substrate 11 facing away from the optical receiving unit 30. Alternatively, the component 50 is sealed within the preform 70 for encapsulation and located between the optical receiving unit 30 and the substrate 11, and then the preform 70 for encapsulation is disposed between the optical receiving unit 30 and the substrate 11 and extends to the side wall of the optical receiving unit 30. Alternatively, the component 50 is sealed within the preform 70 for encapsulation and located between the optical receiving unit 30 and the driving chip 21. Alternatively, the component 50 is located on one side of the optical receiving unit 30 and on the second encapsulation block 122, and the component 50 is not encapsulated by the encapsulation body 12. The position of the component 50 can be set according to actual requirements.

[0127] In some embodiments, the material of the first encapsulation block 121 is at least one of epoxy resin and phenolic resin, and the material of the second encapsulation block 122 is at least one of polyimide glue, UV glue, black glue, and silica gel.

[0128] (3) Refer to Figure 9 The cured plastic encapsulation preform 70 is obtained to form the first plastic encapsulation block 121, and the first plastic encapsulation block 121 and the second plastic encapsulation block 122 form the plastic encapsulation body 12.

[0129] The plastic encapsulation preform 70 is cured by heating and pressing to obtain the first plastic encapsulation block 121 with stable structure and strength, so that the light receiving unit 30 and the driving chip 21 are sealed in the first plastic encapsulation block 121, and the first plastic encapsulation block 121 is located between the second plastic encapsulation block 122 and the substrate 11. During the curing process of the plastic encapsulation preform 70, the plastic encapsulation preform 70 is also bonded to the second plastic encapsulation block 122.

[0130] In some embodiments, the plastic encapsulation body 12 is a light-shielding material, and some light-shielding materials (such as black ink) can be introduced into the plastic encapsulation body 12 to prevent the light beam in the light source 22 from passing through the plastic encapsulation body 12 and transmitting light to the light receiving unit 30 and being absorbed by the light receiving unit 30, causing crosstalk of the light beam and thus affecting the accuracy of the measured object value.

[0131] S3. Refer to Figure 10 Multiple first channels 131 and multiple second channels 141 are formed on the plastic encapsulation body 12 in the encapsulation unit 210. Both ends of the first channel 131 extend to the substrate 11 and the non-photosensitive area 32 respectively, and both ends of the second channel 141 extend to the substrate 11 and the light emitting unit 20 respectively.

[0132] The pads on the substrate 11 are respectively exposed in the first channel 131 and the second channel 141, the pads on the non-photosensitive area 32 are exposed in the first channel 131, and the pads on the driving chip 21 in the light emitting unit 20 are exposed in the second channel 141.

[0133] In some embodiments, the first channel 131 and the second channel 141 are obtained by laser drilling.

[0134] The first channel 131 includes a first part 133, a second part 134, and a third part 135, and the third part 135 is connected between the first part 133 and the second part 134. Both the first part 133 and the second part 134 extend along the thickness direction of the plastic encapsulation body 12, the third part 135 is located on the second plastic encapsulation block 122, and the third part 135 can be obtained by drilling in a horizontal direction perpendicular to the thickness direction of the plastic encapsulation body 12 to obtain a groove structure with an opening facing away from the substrate 11. In some other embodiments, the second part 134 is located on the top surface of the second plastic encapsulation block 122, and no drilling treatment is performed on the second plastic encapsulation block 122.

[0135] In this embodiment, the second channel 141 has the same shape as the first channel 131.

[0136] S4. Refer to Figure 11, spray a conductive material in the first channel 131 and the second channel 141, and cure the conductive material to form a first conductive layer 132 and a second conductive layer 142 in the first channel 131 and the second channel 141 respectively, so as to form corresponding first and second hollow conductive channels 13 and 14.

[0137] Use a nozzle to spray the first channel 131 and the second channel 141 in sequence, so that the conductive material is coated in the first channel 131 and the second channel 141. The conductive material includes conductive ink or conductive silver paste. In this application, conductive ink is used for spraying, and the inner diameter of its channel can be set to be less than 50 μm. While using other conductive materials, such as conductive silver paste, the inner diameter of the required channel needs to be greater than 250 μm to enable the conductive silver paste to be formed in the channel. The use of conductive ink in this application can be applicable to channels with small apertures, which is more conducive to the miniaturization development of the optoelectronic sensor packaging structure 100.

[0138] When the conductive material is conductive ink, curing the conductive ink includes a first curing stage and a second curing stage carried out in sequence.

[0139] The first curing stage includes: after spraying the conductive ink in the first channel 131 and the second channel 141, irradiate the conductive ink with ultraviolet light, and the conductive ink is pre-cured. In this stage, through ultraviolet irradiation, the conductive ink is quickly pre-cured to avoid the flow of the conductive ink. The ultraviolet irradiation time is several seconds, specifically 1 - 5 s.

[0140] The second curing stage includes: baking the pre-cured conductive ink to obtain a conductive layer. After the conductive ink undergoes the first curing stage, the conductive ink is pre-cured on the inner walls of the first channel 131 and the second channel 141, and then baked at 60 °C - 100 °C for 0.5 h - 3 h, and the conductive ink is completely cured on the inner walls of the first channel 131 and the second channel 141.

[0141] S5. Refer to Figure 2 , coat a protective film 40 on the surface of the second encapsulation block 122 to obtain the optoelectronic sensor packaging structure 100.

[0142] The protective film 40 is provided to block part of the first and second hollow conductive channels 13 and 14 exposed on the second encapsulation block 122, and prevent the conductive layers in the first channel 131 and the second channel 141 from contacting other charged components in the optoelectronic sensor packaging structure 100 and causing a short circuit.

[0143] After the protective film 40 is formed on the packaging unit 210, cut and divide the plate 200 along the cutting area 220 to obtain a plurality of optoelectronic sensor packaging structures 100.

[0144] Embodiment 2

[0145] The difference between the second embodiment and the first embodiment is that both the optical receiving unit 30 and the driving chip 21 are disposed on the second surface 112, and the first channel 131 and the second channel 141 are both disposed on the substrate 11.

[0146] Referring to Figure 12 , the substrate 11 is provided with a first opening 113 and a second opening 114. The optical receiving unit 30 is disposed on the second surface 112 and the photosensitive area 31 is exposed to the first opening 113, and the non-photosensitive area 32 is attached to the second surface 112. The first hollow conductive channel 13 penetrates through the substrate 11, and one end of the first hollow conductive channel 13 extends to the non-photosensitive area 32, and the first hollow conductive channel 13 is electrically connected to the substrate 11.

[0147] The driving chip 21 is disposed on the second surface 112, and the light source 22 is exposed to the second opening 114. The second hollow conductive channel 14 penetrates through the substrate 11 and extends to the top surface of the driving chip 21.

[0148] In this embodiment, both the first hollow conductive channel 13 and the second hollow conductive channel 14 extend along the thickness direction of the substrate 11. The pads on the non-photosensitive area 32 are exposed to the first channel 131, and the two ends of the first hollow conductive channel 13 are electrically connected to the pads on the non-photosensitive area 32 and the pads on the first surface 111 of the substrate 11 respectively. The second hollow conductive channel 14 is electrically connected to the pads on the top surface of the driving chip 21 and the pads on the first surface 111 of the substrate 11 respectively.

[0149] In this embodiment, the encapsulant 12 is the first encapsulation block 121, and the second encapsulation block 122 is not provided. The encapsulant 12 is disposed on the two side walls where the optical receiving unit 30 and the driving chip 21 are away from each other and between the optical receiving unit 30 and the driving chip 21. There is also an adhesive layer 60 between the optical receiving unit 30 and the second surface 112, and the encapsulant 12 is also bonded to the second surface 112 through the adhesive layer 60.

[0150] In this embodiment, the preparation method of the optoelectronic sensor packaging structure 100 is different from that of the first embodiment in that: when manufacturing the packaging unit 210, the second encapsulation block 122 in step (1) of the first embodiment is omitted, and both the optical receiving unit 30 and the driving chip 21 are disposed on the second surface 112 of the substrate 11; in step S2 of the first embodiment, the first channel 131 and the second channel 141 are disposed on the substrate 11, specifically, the first channel 131 and the second channel 141 are opened on the substrate 11, and conductive ink is sprayed in the first channel 131 and the second channel 141, and the conductive ink is cured on the inner walls of the first channel 131 and the second channel 141 to form the first conductive layer 132 and the second conductive layer 142.

[0151] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An optoelectronic sensor packaging structure, characterized in that, Comprising: A substrate module including a substrate, the substrate module having a plurality of first channels and a plurality of second channels; And An optical emission unit and an optical reception unit disposed on the substrate, the optical reception unit including a photosensitive region and a non-photosensitive region connected to the photosensitive region; Both ends of the first channel extend to the substrate and the non-photosensitive region respectively, and a first conductive layer is provided on the inner wall of the first channel to form a first hollow conductive channel, and the first hollow conductive channel is electrically connected to the substrate and the non-photosensitive region; both ends of the second channel extend to the substrate and the optical emission unit respectively, and a second conductive layer is provided on the inner wall of the second channel to form a second hollow conductive channel, and the second hollow conductive channel is electrically connected to the substrate and the optical emission unit.

2. The optoelectronic sensor packaging structure according to claim 1, wherein, The optical emission unit includes a driving chip and a light source disposed on the driving chip, the driving chip is electrically connected to the light source, the substrate module further includes a plastic package, the substrate includes a first surface and a second surface disposed opposite to each other, the plastic package and the optical reception unit and the driving chip are disposed on the same surface of the substrate, the plastic package at least adheres to the side walls of the optical reception unit and the driving chip, and the second hollow conductive channel electrically connects the substrate and the driving chip.

3. The optoelectronic sensor packaging structure according to claim 2, wherein Both the driving chip and the optical reception unit are located on the first surface, the first channel and the second channel are both disposed in the plastic package; the first channel includes a first portion, a second portion, and a third portion connecting the first portion and the second portion, the first portion and the second portion both extend along the thickness direction of the optoelectronic sensor package structure, one end of the first portion penetrates through the substrate, and one end of the second portion communicates with the non-photosensitive region.

4. The optoelectronic sensor packaging structure according to claim 3, wherein, The plastic package includes a first plastic package block and a second plastic package block disposed on the first plastic package block, the first plastic package block adheres to the side walls of the optical reception unit and the driving chip, the second plastic package block at least covers part of the non-photosensitive region and part of the top surface of the driving chip, the first portion penetrates through the first plastic package block and extends to the second plastic package block, the second portion penetrates through the second plastic package block, and the third portion is exposed on the second plastic package block.

5. The optoelectronic sensor packaging structure according to claim 4, characterized in that, A protective film is further provided on the surface of the second plastic package block, and the protective film covers the third portion.

6. The optoelectronic sensor packaging structure according to claim 1, wherein, The conductive materials of the first conductive layer and the second conductive layer both include conductive ink or conductive silver paste.

7. The optoelectronic sensor packaging structure according to claim 2, characterized in that, The first channel and the second channel are both disposed on the substrate, first openings and second openings are provided on the substrate, the optical reception unit is disposed on the second surface and the photosensitive region is exposed to the first openings, and the first hollow conductive channel penetrates through the substrate and extends to the non-photosensitive region; The driving chip is disposed on the second surface, and the light source is exposed to the second openings, and the second hollow conductive channel penetrates through the substrate and extends to the top surface of the driving chip.

8. The optoelectronic sensor packaging structure according to any one of claims 1 to 7, characterized in that, The optoelectronic sensor packaging structure further includes a plurality of components, which are sealed in the plastic package, or disposed outside the plastic package, or provided on the substrate.

9. The optoelectronic sensor package structure according to any one of claims 1 to 7, characterized in that The thickness of the first conductive layer is greater than or equal to 500 nm.

10. A method for preparing an optoelectronic sensor packaging structure, characterized in that, Including: Disposing a light receiving unit and a light emitting unit on a substrate of a substrate module, the light receiving unit including a photosensitive area and a non-photosensitive area connected to the photosensitive area; Opening a plurality of first channels and a plurality of second channels in the substrate module, two ends of the first channel respectively extending to the substrate and the non-photosensitive area, and two ends of the second channel respectively extending to the substrate and the light emitting unit; And Providing a first conductive layer on an inner wall of the first channel to form a first hollow conductive channel, and providing a second conductive layer on an inner wall of the second channel to form a second hollow conductive channel, the first hollow conductive channel being electrically connected to the substrate and the non-photosensitive area, and the second hollow conductive channel being electrically connected to the substrate and the light emitting unit, thereby obtaining the optoelectronic sensor packaging structure.

11. The method for manufacturing the optoelectronic sensor packaging structure according to claim 10, characterized in that, The substrate module further includes a plastic package, the light emitting unit includes a driving chip and a light source disposed on the driving chip, the substrate includes a first surface and a second surface disposed opposite to each other, the plastic package and the light receiving unit and the driving chip are disposed on the same surface of the substrate, the plastic package at least adheres to side walls of the driving chip and the light receiving unit, and a part of the plastic package is also located between the driving chip and the light receiving unit.

12. The manufacturing method of the optoelectronic sensor packaging structure according to claim 11, characterized in that, Both the first channel and the second channel are provided on the plastic package.

13. The method for preparing the optoelectronic sensor packaging structure according to claim 12, wherein, Disposing the light emitting unit and the light receiving unit on the substrate further includes: Disposing a second plastic block on the non-photosensitive area of the light receiving unit and the driving chip; Fixing the light receiving unit and the driving chip having the second plastic block on the first surface, and a plastic package preform is further provided on the substrate, the plastic package preform at least adheres to side walls of the light receiving unit and the driving chip; Curing the plastic package preform to obtain a first plastic block, and the first plastic block and the second plastic block form the plastic package.

14. The manufacturing method of the optoelectronic sensor packaging structure according to claim 13, characterized in that, The plastic package preform is disposed between the light receiving unit and the substrate and extends to side walls of the light receiving unit and the driving chip.

15. The manufacturing method of the optoelectronic sensor packaging structure according to claim 11, characterized in that, Both the first channel and the second channel are provided on the substrate.

16. The manufacturing method of the optoelectronic sensor packaging structure according to claim 15, characterized in that, Disposing the light emitting unit and the light receiving unit on the substrate further includes: Fixing the light receiving unit and the driving chip on the second surface, the photosensitive area being exposed at a first opening of the substrate, the light source being exposed at a second opening of the substrate, and a plastic package preform is further provided on the second surface, the plastic package preform at least adheres to side walls of the light receiving unit and the driving chip and a part of the plastic package preform is located between the light receiving unit and the driving chip; Curing the plastic package preform to obtain the plastic package.

17. The method for manufacturing the optoelectronic sensor packaging structure according to claim 10, wherein Providing the first conductive layer and the second conductive layer further includes: A conductive material is disposed in the first channel and the second channel, and the conductive material is cured to form the first conductive layer and the second conductive layer respectively.

18. The manufacturing method of the optoelectronic sensor packaging structure according to claim 17, characterized in that, The conductive material includes conductive ink or conductive silver paste.

19. The preparation method of the optoelectronic sensor packaging structure according to claim 18, characterized in that, When the conductive material is the conductive ink, curing the conductive ink includes a first curing stage and a second curing stage that are sequentially performed; The first curing stage includes: after spraying the conductive ink in the first channel and the second channel, irradiating the conductive ink with ultraviolet light to pre-cure the conductive ink; The second curing stage includes: baking the pre-cured conductive ink to obtain the first conductive layer and the second conductive layer.

20. The manufacturing method of the optoelectronic sensor packaging structure according to claim 11, characterized in that, The preparation method further includes: providing a board, the board includes a plurality of the substrates arranged in an array, and a cutting area is formed between adjacent substrates; manufacturing each of the substrates into a packaging unit, the packaging unit includes the substrate and the driving chip, the plastic package, the light emitting unit and the light receiving unit disposed on the substrate; after disposing the first conductive layer and the second conductive layer in the packaging unit to form the first hollow conductive channel and the second hollow conductive channel, cutting the board along the cutting area to obtain a plurality of the optoelectronic sensor packaging structures.

21. An imaging module, comprising a lens, characterized in that, The camera module further includes the optoelectronic sensor packaging structure according to any one of claims 1 to 9, and the lens is disposed on the substrate module of the optoelectronic sensor packaging structure.

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