Snakelike microstrip line of communication equipment antenna and manufacturing method thereof

Abstract

The invention relates to a method for manufacturing a snakelike microstrip line of a communication equipment antenna. The method comprises the following steps: providing a microstrip line blank; the microstrip line blank is placed on a continuous stamping die, the continuous stamping die is provided with a plurality of blanking stations which are arranged in sequence, and an upper die plate of the continuous stamping die is provided with a corresponding punch on each blanking station; the microstrip line blank is punched through a punch on the upper die plate, and after punching of the current punching station is completed, the microstrip line blank is conveyed to the next punching station; and after the microstrip line blank is punched by a punch at the last punching station of the continuous punching die, the snakelike microstrip line is obtained. Stamping on the snakelike microstrip line is decomposed into multiple times of stamping from traditional one-time stamping, the blanking sequence of the blanking station on the microstrip line blank is from inside to outside and from the middle to the two ends, the shape of the snakelike microstrip line can be kept, the snakelike microstrip line is not prone to deformation in the blanking process, errors are effectively reduced, the blanking precision is improved, and the production efficiency is improved. And the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing serpentine microstrip lines for communication device antennas, and particularly to a serpentine microstrip line for a communication device antenna and a manufacturing method thereof. Background Art

[0002] The serpentine microstrip line used on a communication base station antenna is both a structural member and a functional member for transmitting electrical signals. To meet the usage requirements in a high-frequency electromagnetic signal environment, the raw material used is a non-magnetic aluminum-based alloy material with a relatively low material hardness (58 - 75 HB). The product has characteristics such as a special and complex structural shape, a thin material thickness, and small structural dimensions; there are strict requirements for machining dimensional tolerances, geometric tolerances, and the height of edge burrs formed after machining. To produce such a serpentine microstrip line, there are two main processing techniques: chemical etching processing technique and conventional die stamping processing technique.

[0003] For the chemical etching processing technique, although it is easy to control product deformation, since the etching process is carried out using the principle of chemical corrosion, the corrosion degree at different position points is inconsistent, which will cause the processed edge of the product to be uneven; the processed cross-section is not perpendicular to form a trapezoidal cross-section, making it difficult to meet the overall dimensional accuracy requirements of the product. The etching processing technique also has deficiencies such as many production processes, low production efficiency, and high production costs. At the same time, since chemical raw materials are used in the processing process, the etching processing technique will have a very bad impact on personnel and the environment.

[0004] The conventional die stamping processing technique is completed by step-by-step blanking using a single-punch die. Due to the special and complex structure of the serpentine microstrip line product and the small size of the characteristic structure, affected by comprehensive factors such as die strength, multiple sets of dies need to be designed to produce one product, and the processing is completed through the cooperation of multiple processes, which is likely to cause deformation of the processed product, the height of the blanking edge burrs cannot meet the technical requirements, and multiple people, multiple dies, and multiple devices are required during the production process, making it difficult to meet the growing market demands in terms of production efficiency, production cost, and production safety.

[0005] Therefore, there is an urgent need for a manufacturing method of a serpentine microstrip line that can improve production efficiency and reduce production costs. Summary of the Invention

[0006] Based on this, it is necessary to provide a manufacturing method of a serpentine microstrip line for a communication device antenna.

[0007] A manufacturing method of a serpentine microstrip line for a communication device antenna includes:

[0008] Providing a microstrip line blank, wherein the material of the microstrip line blank is a non-magnetic aluminum-based alloy;

[0009] Place the microstrip line blank on a progressive stamping die. The progressive stamping die is provided with a plurality of punching stations arranged in sequence, and the upper template of the progressive stamping die is provided with corresponding punches at each punching station.

[0010] When the microstrip line blank is conveyed to a punching station, the upper die holder of the progressive stamping die closes with the lower die holder, and the punch on the upper template is used to punch the microstrip line blank. After the punching at the current punching station is completed, the microstrip line blank is conveyed to the next punching station.

[0011] After the punch at the last punching station of the progressive stamping die punches the microstrip line blank, the serpentine microstrip line is obtained.

[0012] Provide a microstrip line blank, wherein the material of the microstrip line blank is a non-magnetic aluminum-based alloy.

[0013] Place the microstrip line blank on a progressive stamping die. The progressive stamping die is provided with a plurality of punching stations arranged in sequence, and the upper template of the progressive stamping die is provided with corresponding punches at each punching station.

[0014] When the microstrip line blank is conveyed to a punching station, the upper die holder of the progressive stamping die closes with the lower die holder, and the punch on the upper template is used to punch the microstrip line blank. After the punching at the current punching station is completed, the microstrip line blank is conveyed to the next punching station.

[0015] After the punch at the last punching station of the progressive stamping die punches the microstrip line blank, the serpentine microstrip line is obtained.

[0016] In one embodiment, a side cutter is provided on the upper template of the progressive stamping die.

[0017] Before the step of when the microstrip line blank is conveyed to a punching station, it further includes:

[0018] The upper die holder of the progressive stamping die closes with the lower die holder, the microstrip line blank is pressed by the upper template and the lower template, and the side cutter is used to punch the edge of the microstrip line blank.

[0019] In one embodiment, the upper template of the progressive stamping die is provided with a side cutter at at least one punching station.

[0020] The step of when the microstrip line blank is conveyed to a punching station, the upper die holder of the progressive stamping die closes with the lower die holder, and the punch on the upper template is used to punch the microstrip line blank includes:

[0021] When the microstrip line blank is conveyed to a blanking station, the upper die holder of the continuous stamping die closes with the lower die holder to press the microstrip line blank, punches the microstrip line blank with the punch on the upper template, and punches and trims the edge of the microstrip line blank with the side cutting knife.

[0022] In one embodiment, a T-shaped lifting block is movably arranged on the lower template of the continuous stamping die at each blanking station;

[0023] When the microstrip line blank is conveyed to a blanking station, when the upper die holder of the continuous stamping die closes with the lower die holder and punches the microstrip line blank with the punch on the upper template, the T-shaped lifting block at the corresponding blanking station is driven to rise to support the preset part to be supported of the microstrip line blank.

[0024] In one embodiment, along the blanking sequence of each blanking station, the punching positions of the punches on the upper template at each blanking station on the microstrip line blank gradually shift from the inside of the microstrip line blank to the outside, and the punching positions of the punches on the upper template at each blanking station on the microstrip line blank gradually shift from the middle of the microstrip line blank to both ends.

[0025] In one embodiment, the steps of obtaining the serpentine microstrip line after the punch at the last blanking station of the continuous stamping die punches the microstrip line blank include:

[0026] After the punch at the last blanking station of the continuous stamping die punches the microstrip line blank, a prototype microstrip line is obtained, and the prototype microstrip line is taken out;

[0027] The prototype microstrip line is polished to remove the burrs on the edge of the prototype microstrip line to obtain the serpentine microstrip line.

[0028] In one embodiment, among the punches at each blanking station, there are two first punches and second punches with the same punching position; the first punch and the second punch are respectively located at two adjacent blanking stations.

[0029] In one embodiment, the width of the first punch corresponding to the blanking station with a relatively earlier blanking sequence is smaller than the width of the second punch corresponding to the blanking station with a relatively later blanking sequence.

[0030] In one embodiment, the steps of providing the microstrip line blank include:

[0031] Provide a non-magnetic aluminum-based alloy strip, and perform reverse curved surface rolling on the non-magnetic aluminum-based alloy strip so that the reverse pre-bending radius of the non-magnetic aluminum-based alloy strip reaches a preset radius;

[0032] Based on the preset size, cut the non-magnetic aluminum-based alloy strip along the direction parallel to the radial direction corresponding to the reverse pre-bending radius to obtain the microstrip line blank;

[0033] The step of placing the microstrip line blank on the continuous stamping die includes:

[0034] Place the microstrip line blank on the continuous stamping die, wherein the bending depression direction of the microstrip line blank faces the lower template of the continuous stamping die.

[0035] A manufacturing method of a serpentine microstrip line for a communication device antenna is manufactured by using the manufacturing method of the serpentine microstrip line for a communication device antenna described in any one of the above embodiments.

[0036] In the above manufacturing method of the serpentine microstrip line for a communication device antenna, the stamping of the serpentine microstrip line is decomposed from traditional single stamping into multiple stampings. The microstrip line blanks are sequentially fed into each blanking station on the continuous stamping die, and each blanking station on the continuous stamping die is used to blank the microstrip line blanks respectively. Moreover, the blanking sequence of the blanking station for the microstrip line blanks is from the inside to the outside and from the middle to both ends, which can maintain the shape of the serpentine microstrip line, making the serpentine microstrip line not easily deformed during the blanking process, effectively reducing the blanking error, improving the blanking accuracy, effectively improving the production efficiency, and reducing the cost. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0038] Figure 1 It is a flowchart of a manufacturing method of a serpentine microstrip line for a communication device antenna according to an embodiment;

[0039] Figure 2 It is a structural schematic diagram of a serpentine microstrip line for a communication device antenna according to an embodiment;

[0040] Figure 3A It is a partial plan view of the lower template according to an embodiment;

[0041] Figure 3B It is a partial plan view of the lower template according to an embodiment;

[0042] Figure 3C It is a partial plan schematic diagram of the lower template of an embodiment. Specific embodiments

[0043] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0044] As Figure 1 shown, it is a manufacturing method of a serpentine microstrip line of a communication device antenna according to an embodiment of the present invention, including:

[0045] Step 110, providing a microstrip line blank, wherein the material of the microstrip line blank is a non-magnetic aluminum-based alloy.

[0046] In this embodiment, the microstrip line blank is an unprocessed non-magnetic aluminum-based alloy thin sheet, and the microstrip line blank is pre-cut to be adaptable to the processing of a continuous stamping die. For example, the length of the microstrip line blank is adaptable to the width of the continuous stamping die, and the width of the microstrip line blank is adaptable to the width of each punching station of the stamping die.

[0047] It is worth mentioning that the microstrip line blank made of non-magnetic aluminum-based alloy material has a relatively low material hardness, with a hardness of 58-75 HB and a thickness of 0.5 mm. As Figure 2As shown, in the finished product of the processed and formed serpentine microstrip line, most of the structural dimensions are 3 - 5 mm, and some structural dimensions are only 1.5 mm. The overall product is in the shape of a slender strip, with an overall length of about 1200 mm and a width of about 40 mm, and the aspect ratio reaches 30:1. The serpentine microstrip line works in a high-frequency electromagnetic signal environment. The structural dimension error, form error, and burr height formed during processing of the product have a very large impact on its working performance. In order to meet the requirements of service performance, the technical requirements for product design are that the linear dimension error ≤ ±0.03 mm, the overall flatness error in the natural state ≤ 1 mm, and the burr height of the raised edge of the processed part ≤ 0.05 mm. Conventional processing techniques are difficult to meet the technical requirements. For example, when using the method of one-time stamping forming to stamp the microstrip line blank, on the one hand, in terms of the mold, because the serpentine microstrip line is long and thin and has an irregular shape, each punch needs to be installed in a narrow area on the mold, resulting in a small punch spacing, making it difficult to install the punches and difficult to improve the accuracy. In addition, it will also cause the insert holes on the upper template to be too dense, resulting in an unstable structure of the upper template and also making the installation of the punches not firm enough; on the other hand, in terms of the product, due to the large number of punching positions and the relatively close punching positions of the serpentine microstrip line formed by one-time stamping, the microstrip line cannot be fully pressed, resulting in easy slight deviation during the stamping process, easy generation of errors, and easy extrusion between the punched holes, resulting in the twisting of the microstrip line. Therefore, the yield rate of the microstrip line formed by one-time stamping is not high and the production cost is too high.

[0048] Step 120, place the microstrip line blank on a progressive die, wherein the progressive die is provided with a plurality of punching stations arranged in sequence, and the upper template of the progressive die is provided with corresponding punches at each punching station.

[0049] In this embodiment, as Figures 3A to 3C shown, Figures 3A to 3C shown in [reference] is the punching position and punching shape of the lower template, wherein, Figures 3A to 3C are partial views of the lower template respectively. Place Figures 3A to 3CCombining them can obtain the lower template. Specifically, the continuous stamping die includes a lower die base, a lower template, an upper die base, an upper template, a stripper plate, a lower backing plate, a punch, a T-shaped lifter block, a guiding member, a limiting member, and a ball guide pillar. The upper die base is arranged above the lower die base, the lower template is arranged on the lower die base, the upper template is arranged on the upper die base, the upper template and the lower template are arranged opposite to each other. The lower template is provided with a first punching hole and a first lifter hole. The lower backing plate is arranged on the side of the lower template facing the upper template. The lower backing plate is provided with a second punching hole and a second lifter hole corresponding to the first punching hole and the first lifter hole. The T-shaped lifter block is connected to the lower die base through a driving member. The T-shaped lifter block is movably arranged in the first lifter hole and the second lifter hole, and is flush with the side of the lower backing plate facing the upper template under the drive of the driving member. The stripper plate is movably arranged on the side of the upper template facing the lower template through a spring. The punch is arranged on the lower template, and the punch passes through the stripper hole on the stripper plate and is movably inserted into the first punching hole of the lower template. One end of the guiding member and the ball guide pillar is connected to the lower die base. The upper die base is slidably arranged on the guiding member and the ball guide pillar, and is movably abutted against the limiting member. Specifically, the upper die base of the continuous stamping die moves downward toward the lower die base under the action of a press. The upper die base drives the upper template and the punch to move downward toward the lower template, so that the stripper plate on the upper template abuts against the lower backing plate, compresses the microstrip line chip, and the punch punches holes in the microstrip line chip and inserts into the first punching hole.

[0050] In this embodiment, one side in the horizontal direction of the continuous stamping die is the feeding side, and the other side is the discharging side. A plurality of punching stations are sequentially arranged on the continuous stamping die from the feeding side to the discharging side, corresponding to a plurality of punching processes of the microstrip line. The width of each punching station matches the width of the microstrip line chip. The upper template of the continuous stamping die is provided with corresponding punches at each punching station, and the lower template is provided with corresponding first punching holes and first lifter holes at each punching station. As Figures 3A to 3C shown, the punching holes of each punching station are arranged along the first direction in the figure, and the punches and punching holes at each punching station are arranged along the second direction, and the second direction is perpendicular to the first direction.

[0051] In this embodiment, the punching of the microstrip line is decomposed into multiple processes. Each process punches a part of the holes in the microstrip line plate. Each process corresponds to a punching station, and each process corresponds to a plurality of punches and punching holes arranged along the second direction belonging to the same punching station.

[0052] In this embodiment, the punches are distributed on different punching stations, which avoids the congestion caused by the installation of punches on a long and narrow area on the die, makes the installation of punches easier and more stable, reduces the manufacturing cost of the die, and is beneficial to improving the accuracy of the die.

[0053] Step 130, when the microstrip line blank is conveyed to a blanking station, the upper die holder of the continuous stamping die closes with the lower die holder, and the punch on the upper template is used to punch the microstrip line blank. After the punching of the current blanking station is completed, the microstrip line blank is conveyed to the next blanking station. Among them, along the blanking sequence of each blanking station, the punching positions of the punches on the upper template at each blanking station on the microstrip line blank gradually shift from the inner side of the microstrip line blank to the outer side of the microstrip line blank, and the punching positions of the punches on the upper template at each blanking station on the microstrip line blank gradually shift from the middle of the microstrip line blank to both ends of the microstrip line blank.

[0054] In this embodiment, the microstrip line blank is fed into the continuous stamping die from one side of the feeding side of the continuous stamping die, and the microstrip line blank is fixed by the conveying component. The microstrip line blank is conveyed step by step from the feeding side to each blanking station according to the stamping process for blanking, and after the blanking is completed, it is sent out from the discharging side.

[0055] In this embodiment, the microstrip line blank is first blanked for the first process at the first blanking station closest to the feeding side. The upper die holder descends, so that the stripper plate on the upper template abuts against the microstrip line blank, pressing the microstrip line blank against the lower backing plate. The punch at the first cutting station punches the microstrip line blank. Subsequently, the upper die holder ascends, the punch disengages from the microstrip line blank, and the conveying component conveys the microstrip line blank to the second blanking station. The upper die holder descends again, and the punch at the second station punches the microstrip line blank. Subsequently, the upper die holder ascends... until the punch at the last blanking station completes the punching of the microstrip line blank. In this embodiment, the punching positions of the punches at different blanking stations on the microstrip line blank are different. In this way, the punches at different blanking stations punch the microstrip line blank at different positions respectively, avoiding multiple punches punching the microstrip line simultaneously, avoiding the congestion of the punches, avoiding the punching extrusion of the microstrip line caused by the congested punches, and avoiding the distortion of the microstrip line, so that the forming effect of the microstrip line is better and the error is smaller. In addition, since the thickness of the microstrip line blank is extremely small, step-by-step punching can avoid the microstrip line blank bearing too large a concentrated load during single punching, reducing the risk of wear or fracture.

[0056] In this embodiment, the punching and cutting positions of the punches on each punching station on the microstrip line blank gradually shift from the inner side to the outer side of the microstrip line blank and from the middle of the microstrip line blank to both ends of the microstrip line blank in the order from the feeding side to the discharging side. In this way, punching can start from the middle of the microstrip line blank and gradually punch outwards, which helps to evenly release the residual stress inside the microstrip line blank. If punching starts from the periphery first, the material in the middle area may warp or twist due to stress concentration. As the steps increase, the warping or twisting accumulates, ultimately resulting in the inability to form the microstrip line blank. In addition, due to the extremely small thickness of the microstrip line blank, after the punching of the middle area is completed, the remaining material still maintains symmetric support in the subsequent steps, which can reduce local deformation caused by asymmetric stress (such as wavy edges or hole position offsets). Moreover, the punching holes in the middle area can be used as the positioning reference for subsequent processes, reducing the cumulative error caused by material movement and improving the overall punching accuracy. Furthermore, the order from the middle to the outside can guide the microstrip line blank to evenly extend during the punching process, avoiding cracks or burrs in the edge area due to excessive stretching.

[0057] Step 140, after the punch on the last punching station of the continuous stamping die punches the microstrip line blank, the serpentine microstrip line is obtained.

[0058] In this embodiment, after the punching of the last punching station is completed, the microstrip line blank is punched and sent out from the discharging side, thereby obtaining the formed serpentine microstrip line.

[0059] In the above embodiment, the stamping of the serpentine microstrip line is decomposed from traditional single stamping into multiple stampings. The microstrip line blanks are successively fed into each punching station on the continuous stamping die, and each punching station on the continuous stamping die is used to punch the microstrip line blanks respectively. Moreover, the punching order of the punching stations for the microstrip line blanks is from the inside to the outside and from the middle to both ends, which can maintain the shape of the serpentine microstrip line, make the serpentine microstrip line not easily deformed during the punching process, effectively reduce the punching error, improve the punching accuracy, effectively improve the production efficiency, and reduce the cost.

[0060] In one embodiment, a first side cutting knife is provided on the upper template of the continuous stamping die; before the step of feeding the microstrip line blank to a punching station, it further includes: the upper die base of the continuous stamping die is closed with the lower die base, the microstrip line blank is pressed by the upper template and the lower template, and the edge of the microstrip line blank is punched by the first side cutting knife.

[0061] In this embodiment, a side cutting knife is designed for the continuous stamping die to cut the size of the microstrip line chip. Specifically, before the first blanking station, a cutting station is set up, and a side cutting knife is arranged at the cutting station. First, the microstrip line chip is fed into the cutting station, the upper die base descends to press the microstrip line chip, and the width of the microstrip line chip is precisely cut through the side cutting knife structure, so that the width dimension error of the microstrip line chip entering the die cavity is controlled within ±0.05 mm. After being cut by the side cutting knife, the microstrip line chip is conveyed to the first blanking station, and then the blanking operations of each blanking station are carried out in sequence. Through the cutting of the side cutting knife, the width accuracy of the microstrip line chip can be higher, so that the accuracy of the formed serpentine microstrip line is higher.

[0062] In one embodiment, a second side cutting knife is provided on the upper template of the continuous stamping die at at least one of the blanking stations; when the microstrip line chip is conveyed to a blanking station, the upper die base of the continuous stamping die is closed with the lower die base, and the step of punching the microstrip line chip by using the punch on the upper template includes:

[0063] When the microstrip line chip is conveyed to a blanking station, the upper die base of the continuous stamping die is closed with the lower die base to press the microstrip line chip, the microstrip line chip is punched by using the punch on the upper template, and the edge of the microstrip line chip is blanked and trimmed by using the second side cutting knife.

[0064] In this embodiment, side cutting knives are provided at some blanking stations. When the microstrip line chip is conveyed to a blanking station with a side cutting knife, the upper die base descends to press the microstrip line board. While the punch punches the microstrip line chip, the width of the microstrip line chip is locally and precisely cut by the side cutting knife. In this way, the width accuracy of the microstrip line chip can be higher, so that the accuracy of the formed serpentine microstrip line is higher.

[0065] In one embodiment, a T-shaped lifting block is movably arranged on the lower template of the continuous stamping die at each blanking station; when the microstrip line chip is conveyed to a blanking station, the upper die base of the continuous stamping die is closed with the lower die base, and when the microstrip line chip is punched by using the punch on the upper template, the corresponding T-shaped lifting block at the blanking station is driven to rise to support the preset part to be supported of the microstrip line chip.

[0066] In this embodiment, the T-shaped lifting block is first lifted and lowered by a driving member, which can be a spring or a pneumatic driving device. After the T-shaped lifting block is lifted, its top surface is flush with the surface of the lower backing plate. In this way, it can support a part of the microstrip line blank that has been blanked, avoiding depressions and deformations of the microstrip line blank during the punching process. In this embodiment, according to the product size, structure of the processed microstrip line and the width of the raw material, through the analysis of the force deformation of each process step, a plurality of T-shaped lifting blocks with different structural forms and sizes are designed at appropriate positions of the die. Using the scheme of bridge floating material, the problem of sagging in the middle part of the large-width strip (microstrip line blank) is solved, and the problem of affecting the processing accuracy of the product caused thereby is well avoided.

[0067] In one embodiment, the step of obtaining the serpentine microstrip line after the punch of the last blanking station of the continuous stamping die punches the microstrip line blank includes: after the punch of the last blanking station of the continuous stamping die punches the microstrip line blank, obtaining a prototype microstrip line, and taking out the prototype microstrip line; grinding the prototype microstrip line to remove the burrs on the edge of the prototype microstrip line to obtain the serpentine microstrip line.

[0068] In this embodiment, the primary product prototype microstrip line obtained by punching is ground to remove burrs, so as to remove the burrs on the edge of the microstrip line, thereby obtaining an accurate serpentine microstrip line.

[0069] In one embodiment, among the punches of each blanking station, there are two first punches and second punches with the same blanking position; the first punch and the second punch are respectively located at two adjacent blanking stations.

[0070] In this embodiment, the blanking positions of the first punch and the second punch on the microstrip line blank are the same. In this way, the first punch and the second punch are used to punch the same position on the microstrip line board two or more times, decomposing the complex contour into multiple levels of simple punching, and only completing the local shape for each punching, avoiding deformation due to excessive stretching during a single punching of a certain punching hole on the microstrip line. For example, the first punch is used to punch the central circular hole first, and then the second punch is used to punch the outer irregular groove with the central circular hole as the reference.

[0071] In one embodiment, the width of the first punch corresponding to the blanking station with a relatively earlier blanking order is smaller than the width of the second punch corresponding to the blanking station with a relatively later blanking order.

[0072] In this embodiment, the first punch and the second punch have the same punching position on the microstrip line blank. For example, the center point position of the punching hole on the microstrip line blank is the same. Since the width of the first punch is small, it can punch and form a smaller punching hole on the microstrip line blank. Then, the second punch is used to punch and form a larger and more complex punching hole at the same position. In this way, it can avoid deformation of the microstrip line blank due to excessive stretching caused by large-area punching. In addition, in some embodiments, the microstrip line blank has been pre-bent, and the first punch and the second punch punch the same position from small to large, so that the position of the punching hole with a larger area can gradually release stress, avoiding local warping of the microstrip line blank caused by large-area stress release.

[0073] In one embodiment, the step of providing a microstrip line blank includes: providing a non-magnetic aluminum-based alloy strip, performing reverse curved rolling on the non-magnetic aluminum-based alloy strip so that the reverse pre-bending radius of the non-magnetic aluminum-based alloy strip reaches a preset radius; based on a preset size, cutting the non-magnetic aluminum-based alloy strip along a radial direction parallel to the reverse pre-bending radius to obtain the microstrip line blank; the step of placing the microstrip line blank on a continuous stamping die includes: placing the microstrip line blank on a continuous stamping die, wherein the bending concave direction of the microstrip line blank is toward the lower template of the continuous stamping die.

[0074] In this embodiment, a curved surface rolling equipment is used to perform curved surface rolling on a whole non-magnetic aluminum-based alloy strip, so that the non-magnetic aluminum-based alloy strip forms a reverse bend, where the reverse bend refers to the reverse of the bending direction formed relative to the punching direction. In this embodiment, after the whole non-magnetic aluminum-based alloy strip is subjected to reverse curved surface rolling, the reverse bending radius reaches a preset radius, and each microstrip line chip obtained after cutting reaches the preset radius of the reverse bend. The preset radius can be determined according to the bending radius formed after the serpentine microstrip line undergoes multi-step punching, and the preset size is the size of the microstrip line chip fed into the continuous stamping die. For example, the preset radius is 10 m. The cutting direction is along the direction parallel to the radial direction corresponding to the reverse pre-bending radius, that is, the width direction of the cut microstrip line chip is parallel to the radial direction of the reverse pre-bending radius. In this embodiment, since the punching of the microstrip line chip is decomposed into multi-step punching, and each punching will cause the bending of the microstrip line chip, after multiple steps of punching, the bending amplitude will accumulate to form a large bend, which is not conducive to improving the accuracy. Therefore, in this embodiment, by performing reverse pre-bending treatment on the non-magnetic aluminum-based alloy strip, a reverse deformation is applied to the non-magnetic aluminum-based alloy strip to offset the bend formed by punching. In addition, the reverse pre-bending treatment is performed on the whole non-magnetic aluminum-based alloy strip, without the need to process each microstrip line chip, which improves the efficiency on the one hand and makes the operation more convenient and accurate on the other hand. In this embodiment, through the pre-bending treatment performed in advance, when the microstrip line chip is punched step by step, the material deformation after each punching will be "pulled back" by the reverse stress field formed by the pre-bending to form a dynamic stress balance. In addition, the punching interval time between two adjacent punching stations is 1.5 s to 2 s. In this way, the adjacent punching time intervals can allow the pre-bending stress to relax, so that each punching is in the best stress state. And through step-by-step punching, the stress area and stress magnitude of a single punching are reduced, and the punching process is carried out step by step from the middle area to the outside of the microstrip line chip. Each punching releases local stress, so that the compression stress band established by the pre-bending guides the residual stress released by the punching to symmetrically diffuse towards the center of the plate, rather than accumulating disorderly at the edge, thus avoiding the overall warping caused by the accumulation of residual stress along the edge of the microstrip line chip. Through multiple punches, the microstrip line chip can gradually release stress and gradually become flat, and further make the formed serpentine microstrip line keep flat. In this embodiment, by using the pre-bending treatment and combining the phased characteristics of step-by-step punching, the cumulative error can be reduced from ±0.1 mm to ±0.01 mm.

[0075] In one embodiment, a serpentine microstrip line for a communication device antenna is provided, which is manufactured by using the manufacturing method of the serpentine microstrip line for a communication device antenna described in any of the above embodiments.

[0076] In this embodiment, the stamping of the serpentine microstrip line is decomposed from traditional single stamping into multiple stampings. The microstrip line blanks are successively fed into each blanking station on the continuous stamping die, and each blanking station on the continuous stamping die is used to blank the microstrip line blanks respectively. Moreover, the blanking sequence of the blanking station for the microstrip line blanks is from inside to outside and from the middle to both ends, which can maintain the shape of the serpentine microstrip line, making the serpentine microstrip line not easily deformed during the blanking process, effectively reducing the blanking error, improving the blanking precision, effectively improving the production efficiency, and reducing the cost.

[0077] In this embodiment, the continuous stamping die integrates all the blanking processing steps of the serpentine microstrip line onto the same set of die for processing. The whole set of die consists of multiple main parts such as the lower die base, lower template, upper die base, upper template, stripper plate, backing plate, punch insert, side cutter, T-shaped lifter block, guiding part, limiting part, ball guide pillar, etc. According to the size and structure of the processed product, usually 6 - 12 blanking steps are set on the same set of die, and each step only processes a part of the structure of the serpentine microstrip line. With the cooperation of the automatic feeding equipment, a complete product can be processed by continuous blanking with multiple steps using one set of die. The materials of the die are selected from various steels such as 45 steel, Cr12, Cr12MoV, SKD11, D2, etc.

[0078] In order to overcome the influence of the width dimension error and distortion of the processing raw material on the processing precision of the product, the die is designed with a side cutter structure. When processing the product, the strip is first pressed tightly, and then the width of the strip is precisely cut by the side cutter structure, so that the width dimension error of the strip entering the die cavity is controlled within ±0.05 mm.

[0079] The die is designed with a T-shaped lifter block structure. According to the size and structure of the processed product and the width of the raw material, through the force deformation analysis of each step, multiple T-shaped lifter blocks with different structural forms and sizes are designed at appropriate positions on the die. Using the scheme of bridge-type floating material, the problem that the middle part of the wide strip sags, affecting the processing precision of the product, is solved.

[0080] In order to ensure the processing precision of the final serpentine microstrip line, the processing and manufacturing precision of the die itself should be at least one order of magnitude higher than the processing precision of the product. Therefore, during the die processing, the process of cutting one and repairing two is adopted to control the structural dimension error affecting the product processing precision within ±0.005 mm. Through 3 times of precision grinding, the processing error of the die thickness is controlled within ±0.002 mm. Then, through the cooperation and assembly of precision positioning holes and positioning pins, the processing and manufacturing precision of the whole set of die is controlled at the micron level.

[0081] After inspection, for the processed serpentine microstrip line products, the linear error of the structural dimensions is ≤ ±0.03 mm, the overall flatness error in the natural state is ≤ 0.7 mm, and the height of the raised burrs at the edges of the processed parts is ≤ 0.03 mm. The qualified rate of the detection of each key dimension is ≥ 99%, meeting the technical requirements of the product design.

[0082] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.

[0083] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A manufacturing method of an antenna serpentine microstrip line for a communication device, characterized in that, Including: Providing a microstrip chip, wherein the material of the microstrip chip is a non-magnetic aluminum-based alloy; Placing the microstrip chip on a progressive stamping die, wherein the progressive stamping die is provided with a plurality of punching stations arranged in sequence, and the upper template of the progressive stamping die is provided with corresponding punches at each of the punching stations; When the microstrip chip is conveyed to a punching station, the upper die base of the progressive stamping die closes with the lower die base, and the punch on the upper template is used to punch the microstrip chip. After the punching of the current punching station is completed, the microstrip chip is conveyed to the next punching station; After the punch at the last punching station of the progressive stamping die punches the microstrip chip, the serpentine microstrip line is obtained.

2. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, wherein A side cutter is provided on the upper template of the progressive stamping die; Before the step of when the microstrip chip is conveyed to a punching station, it further includes: The upper die base of the progressive stamping die closes with the lower die base, the microstrip chip is pressed by the upper template and the lower template, and the side cutter is used to punch the edge of the microstrip chip.

3. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, wherein, The upper template of the progressive stamping die is provided with side cutters at at least one of the punching stations; The step of when the microstrip chip is conveyed to a punching station, the upper die base of the progressive stamping die closes with the lower die base, and the punch on the upper template is used to punch the microstrip chip includes: When the microstrip chip is conveyed to a punching station, the upper die base of the progressive stamping die closes with the lower die base, the microstrip chip is pressed, the punch on the upper template is used to punch the microstrip chip, and the side cutter is used to punch and trim the edge of the microstrip chip.

4. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, characterized in that A T-shaped lifting block is movably provided on the lower template of the progressive stamping die at each of the punching stations; When the microstrip chip is conveyed to a punching station, the upper die base of the progressive stamping die closes with the lower die base, and when the punch on the upper template is used to punch the microstrip chip, the T-shaped lifting block at the corresponding punching station is driven to rise to support the preset part to be supported of the microstrip chip.

5. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, characterized in that, Along the punching sequence of each of the punching stations, the punching positions of the punches on the upper template at each of the punching stations on the microstrip chip gradually shift from the inside of the microstrip chip to the outside of the microstrip chip, and the punching positions of the punches on the upper template at each of the punching stations on the microstrip chip gradually shift from the middle of the microstrip chip to both ends of the microstrip chip.

6. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, characterized in that, The step of after the punch at the last punching station of the progressive stamping die punches the microstrip chip, the serpentine microstrip line is obtained includes: After the punch at the last punching station of the progressive stamping die punches the microstrip chip, a prototype microstrip line is obtained, and the prototype microstrip line is taken out; The prototype microstrip line is polished to remove the burrs on the edge of the prototype microstrip line, and the serpentine microstrip line is obtained.

7. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 1, characterized in that Among the punches of each blanking station, there are included a first punch and a second punch having the same blanking position; the first punch and the second punch are respectively located at two adjacent blanking stations.

8. The manufacturing method of the serpentine microstrip line of the communication device antenna according to claim 7, characterized in that The width of the first punch corresponding to the blanking station with a relatively earlier blanking sequence is smaller than the width of the second punch corresponding to the blanking station with a relatively later blanking sequence.

9. The manufacturing method of the serpentine microstrip line of the communication device antenna according to any one of claims 1-8, characterized in that, The step of providing the microstrip line blank includes: Providing a non-magnetic aluminum-based alloy strip, performing reverse curved surface rolling on the non-magnetic aluminum-based alloy strip, so that the reverse pre-bending radius of the non-magnetic aluminum-based alloy strip reaches a preset radius; Based on a preset size, cutting the non-magnetic aluminum-based alloy strip along a direction parallel to the radial direction corresponding to the reverse pre-bending radius to obtain the microstrip line blank; The step of placing the microstrip line blank on a progressive stamping die includes: Placing the microstrip line blank on a progressive stamping die, wherein the bending depression direction of the microstrip line blank faces the lower template of the progressive stamping die.

10. A serpentine microstrip line of a communication device antenna, characterized in that, It is manufactured by using the manufacturing method of the serpentine microstrip line of the communication device antenna according to any one of claims 1-9.

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