Automatic die cutting system

Abstract

The invention discloses an automatic die cutting system. The automatic die cutting system comprises a die cutting machine, a conveying device and an automatic optical detection machine, the conveying device is arranged between the die cutting machine and the automatic optical detection machine, the die cutting machine is used for die cutting machining, the conveying device is used for conveying materials, and the automatic optical detection machine is used for detecting the materials. The automatic optical detection machine is used for performing optical detection and generating an optical detection result; the die-cutting machine is in communication connection with the automatic optical detection machine, and the automatic optical detection machine is further used for generating a parameter adjusting instruction according to the optical detection result and sending the parameter adjusting instruction to the die-cutting machine; the die cutting machine is further used for adjusting working parameters according to the parameter adjusting instruction, wherein the working parameters comprise at least one of the cutting die pressure, the cutting die stroke and the cutting speed. According to the automatic die cutting system, the working parameters of the die cutting machine can be adjusted in real time through the automatic optical detection machine, so that the working efficiency and the die cutting quality of the die cutting machine are improved.

Description

Technical Field

[0001] This application relates to the field of die-cutting technology, and particularly to an automated die-cutting system. Background Art

[0002] In traditional die-cutting processing, the die-cutting machine and the automatic optical inspection machine usually operate independently. During processing, first, the die-cutting machine performs die-cutting processing according to the set working parameters, and then the automatic optical inspection machine performs automatic optical inspection on the material after die-cutting processing. However, the independent operation mode of the die-cutting machine and the automatic optical inspection machine has many defects. First, due to the independent operation of the die-cutting machine and the automatic optical inspection machine, the feedback of the automatic optical inspection machine is relatively lagged, and the inspection results cannot guide the adjustment of die-cutting parameters in real time, resulting in continuous production of defective products. Second, the adjustment of die-cutting parameters is blind, relying on manual experience to adjust parameters such as die pressure and cutting speed, with low efficiency and insufficient accuracy. Third, there is no direct mapping relationship between the inspection results of the automatic optical inspection machine and the working parameters of the die-cutting machine, making it difficult to accurately trace the cause of defects. Summary of the Invention

[0003] This application provides an automated die-cutting system to solve the technical problems existing in the independent operation of the die-cutting machine and the automatic optical inspection machine.

[0004] To solve the above technical problems, in a first aspect, this application provides an automated die-cutting system, including a die-cutting machine, a conveying device, and an automatic optical inspection machine. The conveying device is arranged between the die-cutting machine and the automatic optical inspection machine. The die-cutting machine is used for die-cutting processing, the conveying device is used for conveying materials, and the automatic optical inspection machine is used for optical inspection and generating an optical inspection result;

[0005] The die-cutting machine is communicatively connected to the automatic optical inspection machine. The automatic optical inspection machine is further used for generating a parameter adjustment instruction according to the optical inspection result and sending the parameter adjustment instruction to the die-cutting machine;

[0006] The die-cutting machine is further used for adjusting the working parameters according to the parameter adjustment instruction. The working parameters include at least one of die pressure, die stroke, and cutting speed.

[0007] The above-mentioned automated die-cutting system includes a die-cutting machine, a conveying device, and an automatic optical inspection machine. The conveying device is arranged between the die-cutting machine and the automatic optical inspection machine. The die-cutting machine is used for die-cutting processing, the conveying device is used for conveying materials, and the automatic optical inspection machine is used for optical inspection and generating an optical inspection result. The die-cutting machine is communicatively connected to the automatic optical inspection machine. The automatic optical inspection machine is further used for generating a parameter adjustment instruction according to the optical inspection result and sending the parameter adjustment instruction to the die-cutting machine. The die-cutting machine is also used for adjusting working parameters according to the parameter adjustment instruction, and the working parameters include at least one of the die pressure, die stroke, and cutting speed. When the automated die-cutting system is working, first, the die-cutting machine can perform die-cutting processing on the material, then the conveying device conveys the die-cut material to the automatic optical inspection machine, then the automatic optical inspection machine performs optical inspection on the die-cut material and generates an optical inspection result, then the automatic optical inspection machine generates a parameter adjustment instruction according to the optical inspection result and sends the parameter adjustment instruction to the die-cutting machine, and finally the die-cutting machine adjusts the working parameters according to the parameter adjustment instruction. Through the parameter adjustment instruction generated by the automatic optical inspection machine, the working parameters of the die-cutting machine can be adjusted in real time, thereby effectively improving the die-cutting quality and die-cutting efficiency of the die-cutting machine.

[0008] In one embodiment, the automatic optical inspection machine includes an optical inspection table and a processor. The optical inspection table is used for placing the material to be inspected.

[0009] Above the optical inspection table, a first light wave generator and a second light wave generator are provided. The first light wave generator is used for emitting a first light wave signal with a first preset light intensity to the material to be inspected, and the second light wave generator is used for emitting a second light wave signal with a second preset light intensity to the material to be inspected. The wavelength of the first light wave signal is different from the wavelength of the second light wave signal.

[0010] Below the optical inspection table, a light intensity sensor is provided. The light intensity sensor is respectively used for detecting the first transmitted light intensity after the first light wave signal penetrates the material to be inspected and the second transmitted light intensity after the second light wave signal penetrates the material to be inspected.

[0011] The light intensity sensor is electrically connected to the processor, and the light intensity sensor is used for sending the first transmitted light intensity and the second transmitted light intensity to the processor.

[0012] The processor is used for determining the first transmittance corresponding to the material to be inspected according to the first transmitted light intensity and the first preset light intensity, and determining the second transmittance corresponding to the material to be inspected according to the second transmitted light intensity and the second preset light intensity, generating a die pressure adjustment instruction according to the first transmittance and the second transmittance, and sending the die pressure adjustment instruction to the die-cutting machine for the die-cutting machine to adjust the die pressure according to the die pressure adjustment instruction.

[0013] In one embodiment, the first light wave signal is visible light, and the second light wave signal is near-infrared light;

[0014] The processor is further configured to determine the material type corresponding to the material to be inspected, and respectively determine a first transmittance threshold and a second transmittance threshold according to the material type. The first transmittance threshold is the transmittance of the corresponding material type for the first light wave signal at the yield point, and the second transmittance threshold is the transmittance of the corresponding material type for the second light wave signal at the yield point;

[0015] If both the first transmittance and the second transmittance indicate that the material to be inspected has not reached the yield point, a first die cutting pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to increase the die cutting pressure according to the first die cutting pressure adjustment instruction;

[0016] If both the first transmittance and the second transmittance indicate that the material to be inspected has reached the yield point, a second die cutting pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to reduce the die cutting pressure according to the second die cutting pressure adjustment instruction.

[0017] In one embodiment, the processor is further configured to:

[0018] If the first transmittance indicates that the material to be inspected has not reached the yield point, while the second transmittance indicates that the material to be inspected has reached the yield point, a third die cutting pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to reduce the die cutting pressure according to the third die cutting pressure adjustment instruction;

[0019] If the first transmittance indicates that the material to be inspected has reached the yield point, while the second transmittance indicates that the material has not reached the yield point, a die cutting stroke adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to adjust the die cutting stroke according to the die cutting stroke adjustment instruction.

[0020] In one embodiment, the automatic optical inspection machine includes a CCD camera, the CCD camera is electrically connected to the processor, and the CCD camera is disposed above the optical inspection table;

[0021] The CCD camera is configured to collect an original image of the material to be inspected and send the original image to the processor;

[0022] The processor is configured to detect whether there are burr defects based on the original image, and generate a first cutting speed adjustment instruction according to the burr area when burr defects are detected, and send the first cutting speed adjustment instruction to the die-cutting machine for the die-cutting machine to adjust the cutting speed according to the first cutting speed adjustment instruction.

[0023] In one embodiment, the processor is configured to generate the first cutting speed adjustment instruction through the following formula:

[0024] V new =V current ×(1 - A defect / A threshold );

[0025] Wherein, V new represents the cutting speed after the die-cutting machine is adjusted by the first cutting speed adjustment instruction, V current represents the cutting speed before the die-cutting machine is adjusted by the first cutting speed adjustment instruction, A defect represents the burr area, and A threshold is a constant.

[0026] In one embodiment, the automatic optical inspection machine includes a temperature sensor, and the temperature sensor is electrically connected to the processor;

[0027] The temperature sensor is configured to collect the ambient temperature and send the ambient temperature to the processor;

[0028] The processor is configured to generate a second cutting speed adjustment instruction according to the ambient temperature, and send the second cutting speed adjustment instruction to the die-cutting machine for the die-cutting machine to adjust the cutting speed according to the second cutting speed adjustment instruction.

[0029] In one embodiment, the processor generates the second cutting speed adjustment instruction through the following formula:

[0030] V_ new =V_ current ×(1 + △L / L0);

[0031] △L = L0×(α m -α t )×△T;

[0032] Wherein, V_ new represents the cutting speed after the die-cutting machine is adjusted by the second cutting speed adjustment instruction, V_ current represents the cutting speed before the die-cutting machine is adjusted by the second cutting speed adjustment instruction, △L represents the thermal deformation compensation amount of the die cutting tool stroke, L0 represents the length of the material to be die-cut in the feeding direction, △T represents the temperature change amount, and α mDenotes the coefficient of thermal expansion of the material to be die-cut, α t Denotes the equivalent coefficient of thermal expansion of the tool holder.

[0033] In one embodiment, the light intensity sensor employs a dual-channel photodiode.

[0034] In one embodiment, the spot diameters generated by the first light wave generator and the second light wave generator are both 2 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 Is a schematic structural diagram of the automated die-cutting system shown in the embodiments of the present application;

[0036] Figure 2 Is a schematic structural diagram of the automatic optical inspection machine in the automated die-cutting system shown in the embodiments of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0038] Please refer to Figure 1 , the automated die-cutting system of the embodiments of the present application includes a die-cutting machine, a conveying device, and an automatic optical inspection machine. The conveying device is disposed between the die-cutting machine and the automatic optical inspection machine. The die-cutting machine is used for die-cutting processing, the conveying device is used for conveying materials, and the automatic optical inspection machine is used for performing optical inspection and generating an optical inspection result; the die-cutting machine is communicatively connected to the automatic optical inspection machine, and the automatic optical inspection machine is further configured to generate a parameter adjustment instruction according to the optical inspection result and send the parameter adjustment instruction to the die-cutting machine; the die-cutting machine is further configured to adjust the working parameters according to the parameter adjustment instruction, and the working parameters include at least one of the die pressure, the die stroke, and the cutting speed.

[0039] The above-mentioned automated die-cutting system includes a die-cutting machine, a conveying device, and an automatic optical inspection machine. The conveying device is arranged between the die-cutting machine and the automatic optical inspection machine. The die-cutting machine is used for die-cutting processing, the conveying device is used for conveying materials, and the automatic optical inspection machine is used for optical inspection and generating an optical inspection result. The die-cutting machine is communicatively connected to the automatic optical inspection machine. The automatic optical inspection machine is further used for generating a parameter adjustment instruction according to the optical inspection result and sending the parameter adjustment instruction to the die-cutting machine. The die-cutting machine is also used for adjusting working parameters according to the parameter adjustment instruction, and the working parameters include at least one of the die pressure, die stroke, and cutting speed. When the automated die-cutting system is working, the die-cutting machine can first perform die-cutting processing on the material, then the conveying device conveys the die-cut material to the automatic optical inspection machine, then the automatic optical inspection machine performs optical inspection on the die-cut material and generates an optical inspection result, then the automatic optical inspection machine generates a parameter adjustment instruction according to the optical inspection result and sends the parameter adjustment instruction to the die-cutting machine, and finally the die-cutting machine adjusts the working parameters according to the parameter adjustment instruction. Through the parameter adjustment instruction generated by the automatic optical inspection machine, the working parameters of the die-cutting machine can be adjusted in real time, thereby effectively improving the die-cutting quality and die-cutting efficiency of the die-cutting machine.

[0040] Further, when the automated die-cutting system is working, it is also possible that the automatic optical inspection machine first performs an initial optical inspection on the material before processing and generates a first optical inspection result, then the conveying device conveys the material before processing to the die-cutting machine, then the die-cutting machine performs die-cutting processing on the material, then the conveying device conveys the die-cut material to the automatic optical inspection machine, then the automatic optical inspection machine performs a second optical inspection on the die-cut material and generates a second optical inspection result, then the automatic optical inspection machine generates a parameter adjustment instruction according to the first optical inspection result and the second optical inspection result and sends the parameter adjustment instruction to the die-cutting machine, and finally the die-cutting machine adjusts the working parameters according to the parameter adjustment instruction.

[0041] It should be noted that when the die-cutting machine performs die-cutting processing, if the die pressure is too small, the cutting will be incomplete, seriously affecting the die-cutting quality; while if the die pressure is too large, not only will the edge of the die be easily damaged, but also the material will be irreversibly damaged due to excessive internal stress. The damage to the edge of the die can be identified and detected by a high-definition camera, while the internal stress of the material is often difficult to quickly identify. According to the photoelastic effect, the material will exhibit birefringence under stress, and the stress levels are different, and the transmittance of the material to the light wave signal is different.

[0042] Please refer to Figure 2, The automatic optical inspection machine includes an optical inspection table and a processor. The optical inspection table is used to place the material to be inspected. Above the optical inspection table, a first light wave generator and a second light wave generator are provided. The first light wave generator is used to emit a first light wave signal with a first preset light intensity to the material to be inspected, and the second light wave generator is used to emit a second light wave signal with a second preset light intensity to the material to be inspected. The wavelength of the first light wave signal is different from the wavelength of the second light wave signal. Below the optical inspection table, a light intensity sensor is provided. The light intensity sensor is respectively used to detect the first transmitted light intensity after the first light wave signal penetrates the material to be inspected and the second transmitted light intensity after the second light wave signal penetrates the material to be inspected. The light intensity sensor is electrically connected to the processor, and the light intensity sensor is used to send the first transmitted light intensity and the second transmitted light intensity to the processor. The processor is used to determine the first transmittance corresponding to the material to be inspected according to the first transmitted light intensity and the first preset light intensity, and determine the second transmittance corresponding to the material to be inspected according to the second transmitted light intensity and the second preset light intensity, generate a die cutting pressure adjustment instruction according to the first transmittance and the second transmittance, and send the die cutting pressure adjustment instruction to the die cutting machine for the die cutting machine to adjust the die cutting pressure according to the die cutting pressure adjustment instruction.

[0043] Further, the types of materials to be inspected include transparent polymers, photoelastic coating materials, and foam and rubber materials, etc. The materials to be inspected have different transmittances for the first light wave signal and the second light wave signal under different internal stresses. According to the first transmittance and the second transmittance, the processor can judge whether the internal stress of the material to be inspected is too large or too small; when it is judged that the internal stress of the material to be inspected is too large, the die cutting machine is controlled to reduce the die cutting pressure through the die cutting pressure adjustment instruction; when it is judged that the internal stress of the material to be inspected is too small, the die cutting machine is controlled to increase the die cutting pressure through the die cutting pressure adjustment instruction.

[0044] Preferably, the first light wave signal is visible light and the second light wave signal is near-infrared light. The processor is also used to determine the material type corresponding to the material to be inspected, and respectively determine the first transmittance threshold and the second transmittance threshold according to the material type. The first transmittance threshold is the transmittance of the corresponding material type for the first light wave signal at the yield point, and the second transmittance threshold is the transmittance of the corresponding material type for the second light wave signal at the yield point; if both the first transmittance threshold and the second transmittance threshold indicate that the material to be inspected has not reached the yield point, a first die cutting pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to increase the die cutting pressure according to the first die cutting pressure adjustment instruction; if both the first transmittance threshold and the second transmittance threshold indicate that the material to be inspected has reached the yield point, a second die cutting pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to reduce the die cutting pressure according to the second die cutting pressure adjustment instruction.

[0045] The yield point refers to the stress value at which a material transitions from elastic deformation to plastic deformation during the process of being compressed and deformed. In mechanics of materials, the yield point is an important indicator for judging whether a material undergoes permanent deformation. After the material reaches the yield point, the first transmittance and the second transmittance change significantly. Different material types correspond to different first transmittance thresholds and second transmittance thresholds. When a die-cutting machine performs die-cutting processing, the initial die-cutting pressure can be set in advance according to the material type, and die-cutting processing is carried out with the initial die-cutting pressure. Then, the die-cutting machine adjusts the initial die-cutting pressure according to the die-cutting pressure adjustment instruction of the automatic optical inspection machine, and continues the die-cutting processing with the adjusted die-cutting pressure.

[0046] It should be noted that although the material type has certain reference significance for determining the die-cutting pressure, in actual production, even if the material types are the same, if the material thickness, material purity, material preparation process or environment are different, the die-cutting pressure required by the die-cutting machine will also be different. Therefore, by judging whether the material to be inspected reaches the yield point through the first transmittance and the second transmittance, the magnitude of the internal stress of the material to be inspected can be better evaluated, avoiding the technical defect of inaccurate die-cutting pressure setting caused by setting the die-cutting pressure only according to the material type.

[0047] Under normal circumstances, the first transmittance and the second transmittance both characterize that the material to be inspected has not reached the yield point, or the first transmittance and the second transmittance both characterize that the material to be inspected has reached the yield point. However, in special cases, there will be a situation where the first transmittance characterizes that the material to be inspected has not reached the yield point, while the second transmittance characterizes that the material to be inspected has reached the yield point; or the first transmittance characterizes that the material to be inspected has reached the yield point, while the second transmittance characterizes that the material has not reached the yield point.

[0048] When the first light wave signal is visible light and the second light wave signal is near-infrared light, the first light wave signal is mainly used to characterize the geometric deformation of the material to be inspected, and the second light wave signal is mainly used to characterize the change in the molecular structure of the material to be inspected. If the first transmittance characterizes that the material to be inspected has not reached the yield point, while the second transmittance characterizes that the material to be inspected has reached the yield point, it means that microscopic damage has occurred inside the material, but the geometric deformation is insufficient, which is common in material aging or composite materials. At this time, the die-cutting pressure should be reduced; if the first transmittance characterizes that the material to be inspected has reached the yield point, while the second transmittance characterizes that the material to be inspected has not reached the yield point, it means that surface deformation has occurred in the material, but the internal stress is insufficient, which is common in tool wear or uneven material thickness. At this time, the die-cutting stroke should be increased or the uniformity of the material thickness should be detected.

[0049] Further, the processor is further configured to: if the first transmittance indicates that the material to be inspected has not reached the yield point while the second transmittance indicates that the material to be inspected has reached the yield point, generate a third die cutting pressure adjustment instruction and send the third die cutting pressure adjustment instruction to the die cutting machine for the die cutting machine to reduce the die cutting pressure according to the third die cutting pressure adjustment instruction; if the first transmittance indicates that the material to be inspected has reached the yield point while the second transmittance indicates that the material has not reached the yield point, generate a die cutting stroke adjustment instruction and send the die cutting stroke adjustment instruction to the die cutting machine for the die cutting machine to adjust the die cutting stroke according to the die cutting stroke adjustment instruction.

[0050] The cutting speed of the die cutting machine is one of the key parameters of the die cutting machine. If the cutting speed is too fast, burrs will appear on the cutting edge; if the cutting speed is too slow, the production efficiency will be affected. To adjust the cutting speed of the die cutting machine according to the burr condition of the material cutting edge, the automatic optical inspection machine includes a CCD camera. The CCD camera is electrically connected to the processor and is disposed above the optical inspection table. The CCD camera is configured to collect the original image of the material to be inspected and send the original image to the processor. The processor is configured to detect whether there is a burr defect according to the original image and generate a first cutting speed adjustment instruction according to the burr area when detecting a burr defect, and send the first cutting speed adjustment instruction to the die cutting machine for the die cutting machine to adjust the cutting speed according to the first cutting speed adjustment instruction.

[0051] Further, the processor is configured to generate the first cutting speed adjustment instruction through the following formula:

[0052] V new =V current ×(1 - A defect / A threshold );

[0053] Wherein, V new represents the cutting speed adjusted by the die cutting machine according to the first cutting speed adjustment instruction, V current represents the cutting speed of the die cutting machine before being adjusted by the first cutting speed adjustment instruction, A defect represents the burr area, and A threshold is a constant. Further, A defect can be characterized by the area of the region where the burr edge exceeds the ideal contour line.

[0054] When the die-cutting machine performs high-precision die-cutting processing, the ambient temperature has a significant impact on the die-cutting quality. Specifically, when the ambient temperature changes greatly, due to the difference in the thermal expansion coefficients of the tool holder and the material to be die-cut, if the cutting speed of the die-cutting machine is not compensated, the processing position of the die-cutting machine will shift. In order to prevent the processing position of the die-cutting machine from shifting when the ambient temperature changes greatly, the automatic optical inspection machine includes a temperature sensor, which is electrically connected to the processor; the temperature sensor is used to collect the ambient temperature and send the ambient temperature to the processor; the processor is used to generate a second cutting speed adjustment instruction according to the ambient temperature and send the second cutting speed adjustment instruction to the die-cutting machine for the die-cutting machine to adjust the cutting speed according to the second cutting speed adjustment instruction.

[0055] Further, the processor generates the second cutting speed adjustment instruction through the following formula:

[0056] V_ new =V_ current ×(1 + △L / L0);

[0057] △L = L0×(αm - α t )×△T;

[0058] Wherein, V_ new represents the cutting speed after the die-cutting machine is adjusted by the second cutting speed adjustment instruction, V_ current represents the cutting speed before the die-cutting machine is adjusted by the second cutting speed adjustment instruction, △L represents the thermal deformation compensation amount of the die cutting tool travel, L0 represents the length of the material to be die-cut in the feeding direction, △T represents the temperature change amount, α m represents the thermal expansion coefficient of the material to be die-cut, and α t represents the equivalent thermal expansion coefficient of the tool holder.

[0059] Further, the light intensity sensor can be set according to actual needs. Preferably, the light intensity sensor uses a dual-channel photodiode. The dual-channel photodiode is a special photoelectric conversion device that can convert light signals into electrical signals. Its working principle is based on the photoelectric effect. When light irradiates on the diode, photons are absorbed and electrons are excited, thus generating a photocurrent. The dual-channel design enables the dual-channel photodiode to process two different wavelength light signals simultaneously, improving the efficiency and accuracy of photoelectric conversion.

[0060] Further, the spot diameters generated by the first light wave generator and the second light wave generator can be set according to actual needs. Preferably, the spot diameters generated by the first light wave generator and the second light wave generator are both 2 mm.

[0061] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present application. It should be understood that the above description is only specific embodiments of the present application and is not used to limit the protection scope of the present application. It is particularly pointed out that for those skilled in the art, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An automated die-cutting system, characterized in that, It includes a die-cutting machine, a conveying device, and an automatic optical inspection machine. The conveying device is arranged between the die-cutting machine and the automatic optical inspection machine. The die-cutting machine is used for die-cutting processing. The conveying device is used for conveying materials. The automatic optical inspection machine is used for optical inspection and generating an optical inspection result; The die-cutting machine is communicatively connected to the automatic optical inspection machine. The automatic optical inspection machine is further used for generating a parameter adjustment instruction according to the optical inspection result and sending the parameter adjustment instruction to the die-cutting machine; The die-cutting machine is further used for adjusting working parameters according to the parameter adjustment instruction. The working parameters include at least one of die mold pressure, die mold stroke, and cutting speed.

2. The automated die-cutting system according to claim 1, wherein The automatic optical inspection machine includes an optical inspection table and a processor. The optical inspection table is used for placing the material to be inspected; Above the optical inspection table, a first light wave generator and a second light wave generator are arranged. The first light wave generator is used for emitting a first light wave signal with a first preset light intensity to the material to be inspected. The second light wave generator is used for emitting a second light wave signal with a second preset light intensity to the material to be inspected. The wavelength of the first light wave signal is different from the wavelength of the second light wave signal; Below the optical inspection table, a light intensity sensor is arranged. The light intensity sensor is respectively used for detecting a first transmitted light intensity after the first light wave signal penetrates the material to be inspected and a second transmitted light intensity after the second light wave signal penetrates the material to be inspected; The light intensity sensor is electrically connected to the processor. The light intensity sensor is used for sending the first transmitted light intensity and the second transmitted light intensity to the processor; The processor is used for determining a first transmittance corresponding to the material to be inspected according to the first transmitted light intensity and the first preset light intensity, and determining a second transmittance corresponding to the material to be inspected according to the second transmitted light intensity and the second preset light intensity. Generating a die mold pressure adjustment instruction according to the first transmittance and the second transmittance, and sending the die mold pressure adjustment instruction to the die-cutting machine for the die-cutting machine to adjust the die mold pressure according to the die mold pressure adjustment instruction.

3. The automated die-cutting system according to claim 2, wherein, The first light wave signal is visible light, and the second light wave signal is near-infrared light; The processor is further used for determining the material type corresponding to the material to be inspected, and respectively determining a first transmittance threshold and a second transmittance threshold according to the material type. The first transmittance threshold is the transmittance of the corresponding material type for the first light wave signal at the yield point. The second transmittance threshold is the transmittance of the corresponding material type for the second light wave signal at the yield point; If both the first transmittance and the second transmittance indicate that the material to be inspected has not reached the yield point, then generate a first die mold pressure adjustment instruction and send the first die mold pressure adjustment instruction to the die-cutting machine for the die-cutting machine to increase the die mold pressure according to the first die mold pressure adjustment instruction; If both the first transmittance and the second transmittance indicate that the material to be inspected reaches the yield point, a second die pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to reduce the die pressure according to the second die pressure adjustment instruction.

4. The automated die-cutting system according to claim 3, wherein, The processor is further configured to: If the first transmittance indicates that the material to be inspected does not reach the yield point while the second transmittance indicates that the material to be inspected reaches the yield point, a third die pressure adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to reduce the die pressure according to the third die pressure adjustment instruction; If the first transmittance indicates that the material to be inspected reaches the yield point while the second transmittance indicates that the material does not reach the yield point, a die stroke adjustment instruction is generated and sent to the die cutting machine for the die cutting machine to adjust the die stroke according to the die stroke adjustment instruction.

5. The automated die-cutting system according to any one of claims 2 to 4, characterized in that The automatic optical inspection machine includes a CCD camera, which is electrically connected to the processor and is disposed above the optical inspection table; The CCD camera is configured to collect an original image of the material to be inspected and send the original image to the processor; The processor is configured to detect whether there are burr defects based on the original image, and generate a first cutting speed adjustment instruction according to the burr area when detecting burr defects, and send the first cutting speed adjustment instruction to the die cutting machine for the die cutting machine to adjust the cutting speed according to the first cutting speed adjustment instruction.

6. The automated die-cutting system according to claim 5, wherein The processor generates the first cutting speed adjustment instruction through the following formula: V new = V current × (1 - A defect / A threshold ); Among them, V new represents the cutting speed after the die-cutting machine is adjusted by the first cutting speed adjustment instruction, and V current represents the cutting speed before the die-cutting machine is adjusted by the first cutting speed adjustment instruction. A defect represents the burr area, and A threshold is a constant.

7. The automated die-cutting system according to any one of claims 2 to 4, characterized in that, The automatic optical inspection machine includes a temperature sensor, which is electrically connected to the processor; The temperature sensor is configured to collect the ambient temperature and send the ambient temperature to the processor; The processor is configured to generate a second cutting speed adjustment instruction according to the ambient temperature and send the second cutting speed adjustment instruction to the die cutting machine for the die cutting machine to adjust the cutting speed according to the second cutting speed adjustment instruction.

8. The automated die-cutting system according to claim 7, wherein The processor generates the second cutting speed adjustment instruction through the following formula: V_ new = V_ current ×(1 + △L / L0); △L = L0×(α m - α t ) × △T; Among them, V_ new represents the cutting speed of the die-cutting machine after being adjusted by the second cutting speed adjustment instruction, V_ current represents the cutting speed of the die-cutting machine before being adjusted by the second cutting speed adjustment instruction, △L represents the thermal deformation compensation amount of the die cutter stroke, L0 represents the length of the material to be die-cut in the feeding direction, △T represents the temperature change amount, α m represents the thermal expansion coefficient of the material to be die-cut, α t represents the equivalent thermal expansion coefficient of the tool holder.

9. The die-cutting automatic adjustment system with a double-layer coating according to claim 2, characterized in that The light intensity sensor uses a dual-channel photodiode.

10. The die-cutting automatic adjustment system with a double-layer coating as described in claim 9, characterized in that, The spot diameters generated by the first light wave generator and the second light wave generator are both 2 mm.

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