A crystal silicon plate breaking device

Abstract

The application discloses a convenient-to-position crystal silicon plate breaking device and relates to the technical field of crystal silicon plate processing. The device comprises two symmetrically arranged conveying devices, two groups of transmission devices arranged between the two conveying devices, and mounting frames fixedly installed on the two sides of the transmission devices. The device is provided with clamping metal blocks. When the crystal silicon plate is subjected to the breaking treatment, the clamping metal blocks are clamped on the ruled lines of the crystal silicon plate, thereby providing further support for the breaking position of the crystal silicon plate. The clamping metal blocks are clamped on the pre-ruled lines, thereby providing physical support and stress guidance for the crystal silicon plate, ensuring that the breaking is controllable along the ruled line position, reducing the breaking deviation problem caused by stress deviation, limiting the accidental crack propagation in the breaking process, avoiding the generation of additional cracks from defects (such as grain boundaries and impurities), reducing the plate fragmentation probability, and reducing the generation of splashing fragments through the local stress concentration control in the breaking process of the crystal silicon plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of crystalline silicon plate processing, in particular to a crystalline silicon plate breaking device facilitating positioning. BACKGROUND

[0002] Crystalline silicon plate is a flat plate material made of high-purity single-crystal silicon or polycrystalline silicon, which is a core basic material in the fields of photovoltaic, semiconductor, and electronics. To save costs, some crystalline silicon plates are made of polycrystalline silicon. In the process of processing polycrystalline silicon plates in the prior art, the crystalline silicon plate needs to be pre-scribed, and then the crystalline silicon plate is broken according to the pre-scribed position by mechanical equipment. If external force (such as cutting or stamping) is directly applied to the crystalline silicon plate, the local stress may be too large to cause cracking or delamination. The breaking process controls the stress point and the breaking speed, reduces mechanical vibration and impact, and protects the material surface and edge integrity.

[0003] When breaking the crystalline silicon material, the prior art directly fixes one end of the crystalline silicon plate and then applies downward pressure to the surface of the crystalline silicon plate to complete the breaking of the crystalline silicon plate. The breaking surface of polycrystalline silicon is usually not smooth, but has a rough and uneven grain or "ice" texture. This is because polycrystalline silicon is composed of multiple small grains randomly oriented, and the binding force between the grains is weak. When the grains break, they expand randomly along the grain boundaries, forming a rough breaking surface. In the process of breaking the polycrystalline silicon plate, the crystalline silicon plate is usually fixed at one end (near the center of the crystalline silicon plate), and then pressure is applied to the edge of the crystalline silicon plate. At this time, the pre-scribed line of the crystalline silicon plate is located between the two. The breaking device only applies downward pressure from one side. When pressure is applied from only one side, the side of the crystalline silicon plate near the force application point will bear a large local stress, while the side far from the force application point will bear less stress. This uneven stress distribution will cause the fracture to start expanding from the stress concentration area (near the force application point) rather than uniformly along the pre-scribed line direction, resulting in a large stress concentration in the local area. The fracture in the non-pre-scribed line area will produce a jagged edge or cracking gap, and a large amount of irregular debris will be generated, affecting the subsequent use of the crystalline silicon plate.

[0004] To solve the above problems, we propose a crystalline silicon plate breaking device facilitating positioning. SUMMARY

[0005] Technical problems solved

[0006] Therefore, in view of the deficiencies of the prior art, the present application provides a crystalline silicon plate breaking device facilitating positioning to solve the problems raised in the background.

[0007] Technical solutions

[0008] In order to achieve the above object, the present application provides the following technical scheme: A convenient positioning broken equipment for crystalline silicon plate, comprising two symmetrically arranged conveying devices, two groups of transmission devices are arranged between the two conveying devices, installation frames are fixedly installed on both sides of the transmission devices, an electric control cylinder one is fixedly installed on the installation frame, the bottom output shaft of the electric control cylinder one penetrates through the installation frame, a lower metal plate is fixedly connected to the bottom output shaft of the electric control cylinder one, an electric control cylinder two is fixedly installed on the installation frame, the bottom output shaft of the electric control cylinder two penetrates through the installation frame, a positioning roller is fixedly connected to the bottom output shaft of the electric control cylinder two, a guide rod is fixedly installed on the top of the lower metal plate, the lower metal plate is slidably connected to the installation frame through the guide rod, and an auxiliary broken component is arranged on the positioning roller;

[0009] The auxiliary broken component comprises positioning links fixedly connected to the outer surface of the positioning roller near the lower metal plate, driven links are rotatably connected to the ends of the positioning links away from the positioning roller, a hollow limiting plate is fixedly connected to the ends of the driven links away from the positioning links, a clamping metal block is slidably connected in the hollow limiting plate, metal round rods are fixedly connected to the top ends of the clamping metal block, positioning springs are sleeved on the outer surfaces of the metal round rods, spring telescopic rods are rotatably connected to the top ends of the hollow limiting plate, and auxiliary wheels are spherically hinged to the outer surface of the bottom of the hollow limiting plate near the positioning roller.

[0010] Preferably, the included angle between the positioning links and the driven links is obtuse, the hollow limiting plate is inclined towards the lower metal plate with reference to the vertical plane in which the positioning roller is located, the metal round rods penetrate through and extend to the top ends of the hollow limiting plate, the positioning springs are arranged in the hollow limiting plate, the ends of the spring telescopic rods away from the hollow limiting plate are rotatably connected to the outer surface of the top end of the positioning roller, and the auxiliary wheels are inclinedly arranged towards the positioning roller with reference to the plane in which the hollow limiting plate is located.

[0011] Preferably, the auxiliary positioning component further comprises an auxiliary positioning component arranged on the installation frame;

[0012] The auxiliary positioning component comprises a positioning ring fixedly connected to the guide rod on the top of the lower metal plate, a connecting rack is fixedly connected to the outer surface of the positioning ring, an inclined gear is engaged with the outer surface of the bottom end of the connecting rack, a rotating wheel is fixedly connected to the bottom end of the inclined gear, a driven rack is engaged with the side tooth surface of the rotating wheel, the rotating wheel is rotatably connected to a support base, a limiting sleeve is slidably connected to the end of the driven rack towards the positioning roller, an extrusion plate is fixedly connected to the end of the limiting sleeve away from the driven rack, and connecting springs are fixedly connected to the outer surfaces of the bottom ends of the extrusion plate.

[0013] Preferably, the rotating wheel is rotatably connected to the center of the support base, the support base is fixedly connected to the upper surface of the installation frame, a through groove with a size suitable for the connecting rack is formed in the installation frame, the limiting sleeve is hollow, and a sliding groove with a size suitable for the extrusion plate is formed in the installation frame.

[0014] Preferably, a limiting spring is provided inside the limiting sleeve, one end of the driven rack is provided inside the limiting sleeve and is fixedly connected to the limiting spring, both ends of the extrusion plate are slidably connected to the mounting frame through a slide groove, and the connecting spring is provided inside the slide groove.

[0015] Preferably, it further comprises a closing component provided on the extrusion plate;

[0016] The closing assembly includes telescopic sleeves symmetrically fixedly mounted on both sides of the extrusion plate, the tops of the telescopic sleeves are fixedly connected to auxiliary plates, and the outer surface of the lower metal plate close to the positioning roller is fixedly connected to a special-shaped plate;

[0017] One end of the telescopic sleeve away from the extrusion plate is fixedly connected to the outer surface of the mounting frame, and the side surface of the telescopic sleeve is in contact with the outer surface of the pressing metal plate.

[0018] Preferably, it further comprises a collecting assembly disposed on the extrusion plate;

[0019] The collecting assembly includes an inclined push plate fixedly connected to the outer surface of the extrusion plate close to the downward pressing metal plate, a shielding plate is fixedly connected to the outer surface of the bottom end of the inclined push plate away from the extrusion plate, a vertical guide plate is fixedly connected to the outer surface of the bottom end of the inclined push plate at equal distances, and a hollow support plate is fixedly connected to the outer surface of the mounting frame.

[0020] Preferably, a hollow groove is opened through the inside of the hollow support plate close to the pressing metal plate, and through grooves are opened equidistantly through the inside of the hollow support plate close to the extrusion plate, and the bottom end of the baffle is slidably connected to the upper surface of the hollow support plate.

[0021] Preferably, the vertical guide plate is horizontally slidably connected to a through slot provided in the hollow supporting plate.

[0022] Beneficial effects

[0023] Compared with the prior art, the present invention provides a crystalline silicon plate breaking device that is easy to position and has the following beneficial effects:

[0024] By setting up the clamping metal block, when the crystalline silicon plate is broken, it can be clamped at the scribed line on the crystalline silicon plate to provide further support for the breaking position of the crystalline silicon plate. The clamping metal block is clamped at the pre-scribed line to provide physical support and stress guidance for the crystalline silicon plate, ensuring that the fracture is controllable along the scribed line position, reducing the problem of fracture offset caused by stress deviation. The supporting effect of the clamping metal block can limit the unexpected crack propagation during the fracture process, avoid additional cracks from defects (such as grain boundaries and impurities), and reduce the probability of plate breakage. In addition, by controlling the local stress concentration during the breaking process of the crystalline silicon plate, the generation of flying debris is reduced.

[0025] The squeezing plate can squeeze the edges of the crystalline silicon plate during the breaking process, ensuring that the edges of the crystalline silicon plate are in the same horizontal plane during the breaking process, avoiding the crystalline silicon plate from deflecting, thereby achieving the positioning of the crystalline silicon plate during the breaking process. The squeezing plate uniformly applies external force to correct the tilt of the crystalline silicon plate caused by its own gravity or uneven stress, forcing the edge to remain in the preset plane, thereby guiding the fracture to proceed along the pre-scored line.

[0026] The dual arrangement of the clamping metal block and the extrusion plate ensures that the stress at the scribed portion of the crystalline silicon sheet is in a balanced state during the breaking process. The clamping metal block disperses the concentrated stress at the scribed portion through local rigid support, while the extrusion plate applies uniform pressure to prevent sheet edge cracking or delamination due to uneven stress. This dual action reduces the dynamic impact of sheet fracture and reduces the occurrence of edge fragmentation or microcracks.

[0027] By setting up auxiliary plates and special-shaped plates, a protective layer can be formed on the outside of the crystalline silicon plate during the breaking process. At the moment of breaking, it absorbs and restrains the impact energy generated by the plate fracture, suppressing the high-speed splash of fragments. At the same time, the protective layer can cover the entire path of the plate fracture, forming a physical barrier. In addition, the protective layer constrains the fragments generated by the fracture within a controllable range, preventing the fragments from flying everywhere and wasting resources.

[0028] By setting the inclined push plate, the shielding plate and the hollow supporting plate, the waste crystalline silicon plates that have been broken can be quickly collected, and the inclined setting of the inclined push plate and the shielding plate can buffer the instantaneous impact force after the waste crystalline silicon plates are broken. At the same time, as the batch breaking process of the crystalline silicon plates proceeds, the inclined push plate and the shielding plate can further clean the waste crystalline silicon plates remaining on the hollow supporting plate. The inclined push plate and the shielding plate can periodically push the waste to prevent it from accumulating on the hollow supporting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the overall appearance of the present invention;

[0030] Figure 2 For the present invention Figure 1 Another perspective structural diagram;

[0031] Figure 3 This is a schematic diagram of the position relationship of the pressing metal plate of the present invention;

[0032] Figure 4 For the present invention Figure 3 A schematic diagram of the structure at center A;

[0033] Figure 5 This is a schematic diagram of the positional relationship of the mounting frame of the present invention;

[0034] Figure 6 For the present invention Figure 5 A magnified schematic diagram of the structure at point B in the middle;

[0035] Figure 7 For the present invention Figure 5 A magnified schematic diagram of the structure at point C in the middle;

[0036] Figure 8 This is a schematic diagram of the connection relationship of the positioning ring of the present invention;

[0037] Figure 9 This is a schematic diagram of the position relationship of the extrusion plate of the present invention;

[0038] Figure 10 This is a schematic diagram of the connection relationship of the hollow support plate of the present invention;

[0039] Figure 11 This is a schematic diagram of the positional relationship of the connection rack of the present invention;

[0040] Figure 12 For the present invention Figure 11 A magnified schematic diagram of the structure at D in the middle;

[0041] Figure 13 This is a schematic diagram of the positional relationship of the clamping metal blocks of the present invention.

[0042] In the figure: 11, conveying device; 12, transmission device; 13, mounting frame; 14, electric control cylinder 1; 15, pressing metal plate; 16, electric control cylinder 2; 17, positioning roller;

[0043] 21. Positioning connecting rod; 22. Driven connecting rod; 23. Hollow limit plate; 24. Clamping metal block; 25. Metal round rod; 26. Positioning spring; 27. Spring telescopic rod; 28. Auxiliary wheel;

[0044] 31. Positioning ring; 32. Connecting rack; 33. Bevel gear; 34. Rotating wheel; 35. Driven rack; 36. Support base; 37. Limiting sleeve; 38. Extrusion plate; 39. Connecting spring;

[0045] 41. Telescopic sleeve; 42. Auxiliary plate; 43. Special-shaped plate;

[0046] 51. Inclined push plate; 52. Shielding plate; 53. Vertical guide plate; 54. Hollow supporting plate; 5501. Hollow slot; 5502. Through slot. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] Embodiments of the present invention

[0049] See also Figures 1 to 5 、 Figure 7 and Figure 9 A breaking device for a crystalline silicon plate that is easy to position includes two symmetrically arranged conveying devices 11, two groups of conveying devices 12 are arranged between the two conveying devices 11, and mounting frames 13 are fixedly installed on both sides of the conveying devices 12. An electric-controlled cylinder 14 is fixedly installed on the mounting frame 13, and the output shaft of the bottom end of the electric-controlled cylinder 14 passes through the mounting frame 13. The output shaft of the bottom end of the electric-controlled cylinder 14 is fixedly connected to a pressing metal plate 15. An electric-controlled cylinder 2 16 is fixedly installed on the mounting frame 13, and the output shaft of the bottom end of the electric-controlled cylinder 2 16 passes through the mounting frame 13. The output shaft of the bottom end of the electric-controlled cylinder 2 16 is fixedly connected to a positioning roller 17. A guide rod is fixedly installed on the top of the pressing metal plate 15, and the pressing metal plate 15 is slidably connected to the mounting frame 13 through the guide rod. The device also includes an auxiliary breaking component arranged on the positioning roller 17;

[0050] The auxiliary breaking assembly includes a positioning link 21 which is equidistantly fixedly connected to the outer surface of the positioning roller 17 close to the downward pressing metal plate 15. The positioning link 21 is connected to a driven link 22 at a damped rotation at the end away from the positioning roller 17. The driven link 22 is fixedly connected to a hollow limit plate 23 at the end away from the positioning link 21. The hollow limit plate 23 is slidingly connected to a clamping metal block 24 inside. The top of the clamping metal block 24 is equidistantly fixedly connected to a metal round rod 25. The outer surface of the metal round rod 25 is sleeved with a positioning spring 26. The outer surface of the top of the hollow limit plate 23 is equidistantly connected to a spring telescopic rod 27. The bottom of the hollow limit plate 23 is equidistantly spherically hinged to an auxiliary wheel 28 on the outer surface close to the positioning roller 17.

[0051] Among them, the angle between the positioning link 21 and the driven link 22 is an obtuse angle, the hollow limit plate 23 is inclined toward the downward pressure metal plate 15 with reference to the vertical plane where the positioning roller 17 is located, the top of the metal round rod 25 passes through and extends to the top of the hollow limit plate 23, the positioning spring 26 is arranged inside the hollow limit plate 23, and the spring telescopic rod 27 is rotatably connected to the outer surface of the top of the positioning roller 17 at one end away from the hollow limit plate 23, and the auxiliary wheel 28 is inclined toward the positioning roller 17 with reference to the plane where the hollow limit plate 23 is located.

[0052] The bottom end of the clamping metal block 24 is lower than the bottom end of the positioning roller 17, the clamping metal block 24 is wide at the top and narrow at the bottom, and the size of the bottom end of the clamping metal block 24 is smaller than the line width on the crystalline silicon plate.

[0053] The auxiliary wheel 28 is used to keep the hollow limiting plate 23 stable on the crystalline silicon plate and avoid deviation.

[0054] Further embodiments

[0055] Please refer to Figure 5 , Figure 6 and Figures 8 to 12 The broken equipment for positioning the crystalline silicon plate further comprises an auxiliary positioning assembly arranged on the mounting frame 13.

[0056] The auxiliary positioning assembly comprises a positioning ring 31 fixedly connected to the top guide rod of the lower metal plate 15, a connecting rack 32 fixedly connected to the outer surface of the positioning ring 31, a bevel gear 33 engaged with the bottom end outer surface of the connecting rack 32, a rotating wheel 34 fixedly connected to the bottom end of the bevel gear 33, a driven rack 35 engaged with the side tooth surface of the rotating wheel 34, a support base 36 rotationally connected to the bottom end of the rotating wheel 34, a limiting sleeve 37 slidingly connected to one end of the driven rack 35 towards the positioning roller 17, an extrusion plate 38 fixedly connected to one end of the limiting sleeve 37 away from the driven rack 35, and connecting springs 39 fixedly connected to the bottom end outer surfaces of the extrusion plate 38.

[0057] The bottom end of the rotating wheel 34 is rotationally connected to the center of the support base 36, the support base 36 is fixedly connected to the upper surface of the mounting frame 13, the mounting frame 13 is internally provided with a through groove with a size suitable for the connecting rack 32, the limiting sleeve 37 is internally hollow, and the mounting frame 13 is internally provided with a sliding groove with a size suitable for the extrusion plate 38.

[0058] The limiting sleeve 37 is internally provided with a limiting spring, one end of the driven rack 35 inside the limiting sleeve 37 is fixedly connected to the limiting spring, the two ends of the extrusion plate 38 are slidingly connected to the mounting frame 13 through the sliding groove, and the connecting springs 39 are arranged inside the sliding groove.

[0059] Further embodiments

[0060] Please refer to Figure 3 , Figure 9 and Figure 10 The broken equipment for positioning the crystalline silicon plate further comprises a sealing assembly arranged on the extrusion plate 38.

[0061] The sealing assembly comprises telescopic sleeves 41 symmetrically and fixedly installed on the two sides of the extrusion plate 38, auxiliary plates 42 fixedly connected to the top ends of the telescopic sleeves 41, and a special-shaped plate 43 fixedly connected to the outer surface of the lower metal plate 15 near the positioning roller 17.

[0062] The telescopic sleeve 41 is fixedly connected to the outer surface of the mounting frame 13 away from one end of the pressing plate 38, and the side surface of the telescopic sleeve 41 is attached to the outer surface of the lower pressing metal plate 15.

[0063] The special-shaped plate 43 is composed of two horizontal plates with different vertical heights and an inclined plate connecting the two horizontal plates, and the included angles between the horizontal plates and the inclined plate are obtuse angles.

[0064] Further embodiments

[0065] Please refer to Figure 9 , Figure 10 and Figure 13 The crystal silicon plate breaking device for easy positioning also includes a collecting assembly arranged on the pressing plate 38;

[0066] The collecting assembly includes an inclined push plate 51 fixedly connected to the outer surface of the pressing plate 38 near the lower pressing metal plate 15, a shielding plate 52 fixedly connected to the bottom end of the inclined push plate 51 away from the outer surface of the pressing plate 38, vertically oriented plates 53 fixedly connected to the outer surface of the bottom end of the inclined push plate 51 at equal distances, and a hollow supporting plate 54 fixedly connected to the outer surface of the mounting frame 13.

[0067] The hollow supporting plate 54 has a hollow slot 5501 penetratingly arranged in the inner side near the lower pressing metal plate 15, and a through slot 5502 penetratingly arranged in the inner side near the pressing plate 38 at equal distances, and the bottom end of the shielding plate 52 is slidingly connected to the upper surface of the hollow supporting plate 54.

[0068] The vertically oriented plates 53 are slidingly connected to the through slot 5502 arranged in the hollow supporting plate 54.

[0069] The working process and principle of the above embodiments are as follows:

[0070] The worker places the crystal silicon plate to be processed on the conveying device 11, and then the crystal silicon plate is conveyed to the transmission device 12 via the conveying device 11. Then the worker starts the electric control cylinder one 14 and the electric control cylinder two 16, so that the positioning roller 17 fixedly connected to the bottom end of the electric control cylinder two 16 fixes the edge of the crystal silicon plate on the upper surface of the transmission device 12, and the lower pressing metal plate 15 fixedly connected to the bottom end of the electric control cylinder one 14 breaks the edge of the crystal silicon plate, thus completing the breaking process of the crystal silicon plate.

[0071] It should be noted that, as shown in the figure, the breaking assembly in the crystal silicon plate breaking device is provided with four groups, i.e. the device can simultaneously break four crystal silicon plates;

[0072] It should be noted that, in the above process, the start-up and operation of the conveying device 11, the transmission device 12, the electric-controlled cylinder 14, and the electric-controlled cylinder 2 16 are all existing technologies, so they will not be described in detail here. In addition, before the crystalline silicon plate is broken, its upper surface needs to be scribed to determine the breaking position of the crystalline silicon plate, and the scribed position on the crystalline silicon plate is located between the lower metal plate 15 and the positioning roller 17. The scribed position of the crystalline silicon plate is not located on the conveying device 12, that is, the scribed position of the crystalline silicon plate is in a suspended state.

[0073] Specifically, the conveying device 11 and the transmission device 12 are each composed of a plurality of conveying rollers, which are connected to each other by a transmission belt, and one of the conveying rollers is fixedly connected to the output shaft end of the motor. When the motor is started, the conveying roller rotates, and then the transmission belt causes the plurality of conveying rollers to rotate synchronously, so that the conveying device 11 and the transmission device 12 convey the crystalline silicon plate to a designated location;

[0074] Furthermore, during the transportation of the crystalline silicon plate, since the crystalline silicon plate itself has a certain weight, when the staff starts the motor and transports the crystalline silicon plate to the breaking position through the conveying device 11 and the conveying device 12, the large size of the crystalline silicon plate itself will cause it to maintain its original position during the transportation process. That is, the staff places the crystalline silicon plate on the conveying device 11 and the conveying device 12, thereby preventing the crystalline silicon plate from shifting during the transportation process. The transportation of the crystalline silicon plate by the conveying device 11 and the conveying device 12 is a prior art, so it will not be described in detail here.

[0075] During the above process, as the second electric cylinder 16 is activated, the positioning roller 17 is driven downward until the positioning roller 17 contacts the upper surface of the crystalline silicon plate. The hollow limit plate 23 fixed to the positioning roller 17 via the positioning link 21 and the driven link 22 is then pressed downward. At the same time, the clamping metal block 24 slidably connected to the interior of the hollow limit plate 23 is also pressed downward.

[0076] It should be noted that the bottom end of the clamping metal block 24 is lower than the bottom end of the positioning roller 17. Therefore, before the positioning roller 17 contacts the crystalline silicon plate, the clamping metal block 24 will first contact the upper surface of the crystalline silicon plate. At the same time, the auxiliary wheel 28 spherically hinged to the outer surface of the bottom end of the hollow limit plate 23 will also contact the upper surface of the crystalline silicon plate. When the bottom end of the clamping metal block 24 contacts the top surface of the crystalline silicon plate, the positioning roller 17 will continue to move downward under the action of the second electric control cylinder 16. During the above process, as the positioning roller 17 continues to move, the bottom end of the clamping metal block 24 will move on the upper surface of the crystalline silicon plate in a direction away from the positioning roller 17.

[0077] During this process, the movement of the clamping metal block 24 is affected by the downward pressure of the positioning roller 17 and the upper surface of the crystalline silicon plate. Since the position of the crystalline silicon plate is fixed, as the positioning roller 17 continues to move, the driven connecting rod 22 fixedly connected to the hollow limiting plate 23 will move in the direction away from the positioning roller 17 with its connection point with the positioning connecting rod 21 as a fulcrum. The movement of the hollow limiting plate 23 will synchronously drive the clamping metal block 24 to move until the bottom end of the clamping metal block 24 moves to the scribe line on the upper surface of the crystalline silicon plate, and the bottom end of the clamping metal block 24 is stuck inside the scribe line.

[0078] It should be noted that the clamping metal block 24 is wide at the top and narrow at the bottom. The bottom of the clamping metal block 24 is smaller than the width of the score line on the crystalline silicon plate. At the same time, the score line on the crystalline silicon plate has a certain depth to ensure the breaking effect of the crystalline silicon plate, which is sufficient for the bottom of the clamping metal block 24 to be clamped.

[0079] After the clamping metal block 24 is clamped on the crystalline silicon plate, as the positioning roller 17 continues to press downward, the clamping metal block 24 is restricted by the crystalline silicon plate and cannot continue to move on the upper surface of the crystalline silicon plate. Therefore, the position of the hollow limit plate 23 cannot continue to move. As the positioning roller 17 presses downward, the angle between the positioning link 21 and the driven link 22 between the hollow limit plate 23 and the positioning roller 17 will gradually decrease. At the same time, the spring telescopic rod 27 rotatably connected to the top of the hollow metal plate will be squeezed and contracted synchronously.

[0080] During the above process, when the hollow limiting plate 23 moves, the clamping metal block 24 is always in contact with the crystalline silicon plate on the upper surface under the action of the positioning spring 26 and the metal round rod 25. At this time, the positioning spring 26 is in a compressed state. When the clamping metal block 24 moves to the scribe line, the clamping metal block 24 extends from the inside of the hollow limiting plate 23 while the positioning spring 26 is extended, until it is clamped into the scribe line of the crystalline silicon plate.

[0081] At the same time, the movement of the hollow limiting plate 23 on the crystalline silicon plate is also limited by the auxiliary wheel 28, which is used to maintain the stable movement of the hollow limiting plate 23 on the crystalline silicon plate to avoid deviation;

[0082] When the clamping metal block 24 is inserted into the pre-scored part of the crystalline silicon plate, at the edge of the crystalline silicon plate, the positioning roller 17 applies a clamping force to the edge of the crystalline silicon plate, and the pressing metal plate 15 applies a downward extrusion force to the crystalline silicon plate. At this time, the pre-scored position of the crystalline silicon plate is located between the positioning roller 17 and the pressing metal plate 15. At this time, the force on the crystalline silicon plate is analyzed. To ensure that the breaking process of the crystalline silicon plate is carried out, the pre-scored position of the crystalline silicon plate is in a suspended state. When the pressing metal plate 15 applies pressure, the force of the pressing metal plate 15 acts preferentially on the contact position between the pressing metal plate 15 and the crystalline silicon plate. At this time, the side of the crystalline silicon plate close to the force application point will be subjected to greater local stress, while the stress on the side away from the force application point is smaller. When pressure is applied from one side, the stress direction and the pre-scoring direction may form an angle (θ), causing the crack propagation path to deviate from the pre-scored line. According to the maximum circumferential stress criterion in fracture mechanics, the crack will extend in the direction perpendicular to the maximum principal stress (σ1), that is, θ=1 / 2arctan(σ1 / σ2), where σ1 and σ2 are the maximum and minimum principal stresses, respectively. When unilateral pressure is applied, the direction of σ1 is inconsistent with the pre-marked line, resulting in crack deflection.

[0083] When the clamping metal block 24 is clamped to the pre-scribed line, its sharp edge or specific shape will form an artificial stress concentration point (similar to a "crack source") at the pre-scribed line position. When external pressure is applied, the stress will preferentially concentrate in the pre-scribed line area where the clamping metal block 24 contacts, causing the crack to initiate from the pre-scribed line and propagate along the pre-scribed line direction. The shape design of the clamping metal block 24 can limit the crack propagation path, thereby preventing edge cracking of the crystalline silicon plate during the breaking process.

[0084] By providing the clamping metal block 24, when the crystalline silicon plate is broken, it can be clamped at the scribed line on the crystalline silicon plate to provide further support for the breaking position of the crystalline silicon plate. The clamping metal block 24 is clamped at the pre-scribed line to provide physical support and stress guidance for the crystalline silicon plate, ensuring that the fracture is controllably carried out along the scribed line position, reducing the problem of fracture offset caused by stress deviation. The supporting effect of the clamping metal block 24 can limit the accidental crack propagation during the fracture process, avoid additional cracks from defects (such as grain boundaries and impurities), and reduce the probability of plate breakage. In addition, by controlling the local stress concentration during the breaking process of the crystalline silicon plate, the generation of flying debris is reduced.

[0085] Subsequently, the staff drives the pressing metal plate 15 downward through the electronically controlled cylinder 14, and finally contacts the outer surfaces of both ends of the crystalline silicon plate, thereby breaking the crystalline silicon plate;

[0086] During the above process, as the pressing metal plate 15 descends, the positioning ring 31 fixedly connected to the guide rod of the pressing metal plate 15 will move downward accordingly, and drive the connecting rack 32 fixedly connected to its outer surface to move downward synchronously. Since the connecting rack 32 is configured as a helical rack, the helical gear 33 meshing with it will rotate under the action of the connecting rack 32, thereby driving the rotating wheel 34 fixedly connected to it to rotate on the supporting base 36 through the rotation of the helical gear 33;

[0087] Through the meshing between the driven rack 35 and the rotating wheel 34, the driven rack 35 will move on the support base 36 toward the positioning roller 17 under the action of the rotating wheel 34. The movement of the driven rack 35 will cause the extrusion plate 38 to move toward the edge of the crystalline silicon plate through the limiting sleeve 37. During the movement of the extrusion plate 38, the connecting springs 39 set at both ends thereof will be simultaneously compressed until the extrusion plate 38 contacts the edge of the crystalline silicon plate. It should be noted that when the extrusion plate 38 is in contact with the edge of the crystalline silicon plate but the pressing metal plate 15 is still in the descending state, the driven rack 35 will continue to move toward the direction of the crystalline silicon plate under the action of the rotating wheel 34. At this time, the movement of the driven rack 35 will compress the limiting spring set inside the limiting sleeve 37, and the position of the extrusion plate 38 is still close to the edge of the crystalline silicon plate under the action of the driven rack 35.

[0088] It should be noted that the connection rack 32, the bevel gear 33, the rotating wheel 34, and the driven rack 35 are provided to ensure that the limited moment when the extrusion plate 38 clamps the edge of the crystalline silicon plate is synchronized with the pressing metal plate 15, without the need for a complex sensing device or an additional driving source to cause the extrusion plate 38 to clamp the edge of the crystalline silicon plate.

[0089] As the metal plate 15 is pressed down and contacts the upper surface of the crystalline silicon plate, the crystalline silicon plate is broken;

[0090] The squeezing plate 38 can squeeze the edges of the crystalline silicon plate during the breaking process, ensuring that the edges of the crystalline silicon plate are in the same horizontal plane during the breaking process, preventing the crystalline silicon plate from deflecting, thereby achieving positioning during the breaking process of the crystalline silicon plate. The squeezing plate 38 uniformly applies external force to correct the tilt of the crystalline silicon plate caused by its own gravity or uneven stress, forcing the edge to remain in a preset plane, thereby guiding the fracture to proceed along the pre-scored line.

[0091] Through the double setting of the clamping metal block 24 and the extrusion plate 38, the stress at the scored line of the crystalline silicon plate is in a balanced state during the breaking process of the crystalline silicon plate. The clamping metal block 24 disperses the concentrated stress at the pre-scored line through local rigid support, and the extrusion plate 38 avoids the edge of the plate from cracking or delaminating due to uneven stress through uniform pressure. Under the dual action, the dynamic impact when the plate breaks is reduced, and the edge cracking or micro-cracking is reduced;

[0092] At the same time, during the movement of the extrusion plate 38 to the edge of the crystalline silicon plate, the telescopic sleeve 41 fixedly connected between the extrusion plate 38 and the mounting frame 13 is synchronously extruded to a contracted state. With the contraction of the telescopic sleeve 41, the auxiliary plate 42 fixedly connected to the top end of the telescopic sleeve 41 also moves towards the edge of the crystalline silicon plate. When the extrusion plate 38 is attached to the edge of the crystalline silicon plate, the auxiliary plate 42 is located on both sides of the crystalline silicon plate, further limiting the position of the crystalline silicon plate.

[0093] In the above process, with the depression of the depression metal plate 15, the special-shaped plate 43 fixedly connected to the depression metal plate 15 will descend until the special-shaped plate 43 is above the crystalline silicon plate. It should be noted that the special-shaped plate 43 is composed of two horizontal plates with different vertical heights and an inclined plate connecting the two horizontal plates, and the included angle between the horizontal plate and the inclined plate is obtuse. Therefore, after the auxiliary plate 42 limits the two sides of the crystalline silicon plate, the special-shaped plate 43 will be above the crystalline silicon plate. During the breaking process of the crystalline silicon plate by the depression metal plate 15, a protective layer is formed at the edge of the breaking point of the crystalline silicon plate, avoiding the splashing of debris during the breaking process of the crystalline silicon plate.

[0094] Through the setting of the auxiliary plate 42 and the special-shaped plate 43, a protective layer can be formed outside the crystalline silicon plate during the breaking process of the crystalline silicon plate. The protective layer absorbs and restrains the impact energy generated by the breaking of the plate at the moment of breaking, and suppresses the high-speed flying of debris. At the same time, the protective layer can cover the entire path of the breaking of the plate, forming a physical barrier. In addition, the protective layer restrains the debris generated by the breaking within a controllable range, avoiding the waste of resources caused by the flying of debris everywhere.

[0095] During the above process, as the extrusion plate 38 moves, the inclined push plate 51 fixedly connected to the bottom end of the extrusion plate 38 will move accordingly, and the inclined push plate 51 will also drive the shielding plate 52 fixedly connected to its bottom end to move horizontally on the hollow supporting plate 54 toward the direction of the positioning roller 17. At the same time, the vertical guide plate 53 fixedly connected to the bottom end of the inclined push plate 51 will also move horizontally on the hollow supporting plate 54. When the extrusion plate 38 is in contact with the edge of the outer surface of the crystalline silicon plate, the horizontally moving shielding plate 52 will block the hollow groove 5501 provided on the hollow supporting plate 54. This inclined push plate 51, the shielding plate 52 and the hollow plate will form a collection bin at the bottom end of the broken crystalline silicon plate for collecting waste materials that fall after the crystalline silicon plate is broken.

[0096] After the waste material is broken off from the crystalline silicon plate and falls, it will contact the inclined planes of the inclined push plate 51 and the shielding plate 52, which will cushion the gravity of the waste material falling. Then, the waste material will fall onto the hollow supporting plate 54 along the inclined planes of the inclined push plate 51 and the shielding plate 52, thereby collecting the processed waste material.

[0097] As the breaking process is completed, the above structure will move in the opposite direction according to the above process under the action of the retraction of the output shafts of the electric control cylinder 14 and the electric control cylinder 2 16, thereby loosening the fixation of the crystalline silicon plate. In addition, as the inclined push plate 51 and the shielding plate 52 move, the hollow groove 5501 on the hollow supporting plate 54 will gradually leak out, and the waste originally on the hollow supporting plate 54 will fall from the hollow supporting plate 54. The staff can place a collection device at the bottom of the hollow supporting plate 54 to collect the waste generated during the breaking process. As the next crystalline silicon plate is broken, the inclined push plate 51 and the shielding plate 52 continue to move, which will push the waste that has not fallen on the hollow supporting plate 54 to the hollow groove 5501, further completing the collection of the waste.

[0098] By setting the inclined push plate 51, the shielding plate 52 and the hollow supporting plate 54, the waste crystalline silicon plates that have been broken can be quickly collected. The inclined setting of the inclined push plate 51 and the shielding plate 52 can buffer the instantaneous impact force after the waste crystalline silicon plates are broken. At the same time, as the batch breaking process of the crystalline silicon plates proceeds, the inclined push plate 51 and the shielding plate 52 can further clean the waste crystalline silicon plates remaining on the hollow supporting plate 54. The inclined push plate 51 and the shielding plate 52 can periodically push the waste to prevent it from accumulating on the hollow supporting plate 54.

[0099] After the crystalline silicon plate breaking process is completed, the staff transports the crystalline silicon plate to the next process through the transmission device 12 and the conveying device 11;

[0100] It should be noted that, in the collection process of the broken waste of the crystalline silicon plate, firstly, the relatively small debris will fall through the through slot 5502 and the hollow slot 5501 of the hollow supporting plate 54 in the initial stage, and the collection of the small debris is completed. In addition, the breaking process of the crystalline silicon plate will also produce large pieces of plate broken from the pre-scribed line of the crystalline silicon plate. The large pieces of plate will be affected by the inclined push plate 51 and the shielding plate 52 during the falling process, and will slide down along the inclined plane, buffer the impact force of the falling, and then fall through the hollow slot of the hollow supporting plate 54 under the pushing of the shielding plate 52, so as to reduce the further fragmentation of the large waste caused by the direct falling of the large waste during the collection process, ensure the integrity of the large waste, and facilitate the separate collection and treatment of the waste.

[0101] It should be noted that, in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "include" "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a…" does not exclude the existence of other identical elements in the process, method, article or equipment including the element.

[0102] Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A device for breaking a crystalline silicon plate that is easy to position, comprising two symmetrically arranged conveying devices (11), two groups of conveying devices (12) are arranged between the two conveying devices (11), mounting frames (13) are fixedly installed on both sides of the conveying devices (12), an electric control cylinder (14) is fixedly installed on the mounting frame (13), the output shaft of the bottom end of the electric control cylinder (14) passes through the mounting frame (13), the output shaft of the bottom end of the electric control cylinder (14) is fixedly connected to a pressing metal plate (15), an electric control cylinder (16) is fixedly installed on the mounting frame (13), the output shaft of the bottom end of the electric control cylinder (16) passes through the mounting frame (13), the output shaft of the bottom end of the electric control cylinder (16) is fixedly connected to a positioning roller (17), a guide rod is fixedly installed on the top of the pressing metal plate (15), and the pressing metal plate (15) is slidably connected to the mounting frame (13) through the guide rod, characterized in that: It also includes an auxiliary breaking component arranged on the positioning roller (17); The auxiliary breaking assembly comprises a positioning link (21) fixedly connected to the outer surface of the positioning roller (17) close to the pressing metal plate (15) at equal intervals, the positioning link (21) is connected to a driven link (22) at one end away from the positioning roller (17) in a damped rotation manner, the driven link (22) is fixedly connected to a hollow limit plate (23) at one end away from the positioning link (21), the hollow limit plate (23) is slidably connected to a clamping metal block (24), the top of the clamping metal block (24) is fixedly connected to a metal round rod (25) at equal intervals, the outer surface of the metal round rod (25) is sleeved with a positioning spring (26), the outer surface of the top of the hollow limit plate (23) is rotatably connected to a spring telescopic rod (27), and the outer surface of the bottom of the hollow limit plate (23) close to the positioning roller (17) is spherically hinged to an auxiliary wheel (28) at equal intervals.

2. The crystalline silicon plate breaking device that is easy to position according to claim 1, characterized in that: The angle between the positioning link (21) and the driven link (22) is an obtuse angle. The hollow limit plate (23) is tilted toward the downward pressing metal plate (15) with the vertical plane where the positioning roller (17) is located as a reference. The top end of the metal round rod (25) passes through and extends to the top end of the hollow limit plate (23). The positioning spring (26) is arranged inside the hollow limit plate (23). The end of the spring telescopic rod (27) away from the hollow limit plate (23) is rotatably connected to the outer surface of the top end of the positioning roller (17). The auxiliary wheel (28) is tilted toward the positioning roller (17) with the plane where the hollow limit plate (23) is located as a reference.

3. The crystalline silicon plate breaking device that is easy to position according to claim 1, characterized in that: Also included is an auxiliary positioning assembly disposed on the mounting frame (13); The auxiliary positioning assembly includes a positioning ring (31) fixedly connected to the top guide rod of the pressing metal plate (15), the outer surface of the positioning ring (31) is fixedly connected to a connecting rack (32), the outer surface of the bottom end of the connecting rack (32) is meshed with a bevel gear (33), the bottom end of the bevel gear (33) is fixedly connected to a rotating wheel (34), the side tooth surface of the rotating wheel (34) is meshed with a driven rack (35), the bottom end of the rotating wheel (34) is rotatably connected to a supporting base (36), the driven rack (35) is slidably connected to a limiting sleeve (37) at one end toward the positioning roller (17), the limiting sleeve (37) is fixedly connected to an extrusion plate (38) at one end away from the driven rack (35), and the outer surfaces of both sides of the bottom end of the extrusion plate (38) are fixedly connected to connecting springs (39).

4. The crystalline silicon plate breaking device that is easy to position according to claim 3, characterized in that: The bottom end of the rotating wheel (34) is rotatably connected to the center of the supporting base (36), and the supporting base (36) is fixedly connected to the upper surface of the mounting frame (13). A through groove having a size that matches the connecting rack (32) is provided inside the mounting frame (13). The limiting sleeve (37) is hollow inside, and a sliding groove having a size that matches the extrusion plate (38) is provided inside the mounting frame (13).

5. The crystalline silicon plate breaking device that is easy to position according to claim 4, characterized in that: A limiting spring is provided inside the limiting sleeve (37), one end of the driven rack (35) provided inside the limiting sleeve (37) is fixedly connected to the limiting spring, both ends of the extrusion plate (38) are slidably connected to the mounting frame (13) through a slide groove, and a connecting spring (39) is provided inside the slide groove.

6. The crystalline silicon plate breaking device that is easy to position according to claim 3, characterized in that: Also included is a closing assembly disposed on the extrusion plate (38); The closing assembly includes telescopic sleeves (41) symmetrically fixedly mounted on both sides of the extrusion plate (38), the top ends of the telescopic sleeves (41) are fixedly connected to auxiliary plates (42), and the outer surface of the lower pressing metal plate (15) close to the positioning roller (17) is fixedly connected to a special-shaped plate (43); One end of the telescopic sleeve (41) away from the extrusion plate (38) is fixedly connected to the outer surface of the mounting frame (13), and the side surface of the telescopic sleeve (41) is in contact with the outer surface of the pressing metal plate (15).

7. The crystalline silicon plate breaking device that is easy to position according to claim 3, characterized in that: Also included is a collecting assembly disposed on the extrusion plate (38); The collecting assembly comprises an inclined push plate (51) fixedly connected to the outer surface of the side of the extrusion plate (38) close to the downward pressing metal plate (15), a shielding plate (52) fixedly connected to the outer surface of the bottom end of the inclined push plate (51) away from the extrusion plate (38), a vertical guide plate (53) fixedly connected to the outer surface of the bottom end of the inclined push plate (51) at equal distances, and a hollow supporting plate (54) fixedly connected to the outer surface of the mounting frame (13).

8. The crystalline silicon plate breaking device that is easy to position according to claim 7, characterized in that: A hollow groove (5501) is provided inside the hollow supporting plate (54) close to the pressing metal plate (15), and a through groove (5502) is provided inside the hollow supporting plate (54) close to the extrusion plate (38) at equal intervals. The bottom end of the shielding plate (52) is slidably connected to the upper surface of the hollow supporting plate (54).

9. The crystalline silicon plate breaking device that is easy to position according to claim 8, characterized in that: The vertical guide plate (53) is horizontally slidably connected to a through slot (5502) provided in the hollow supporting plate (54).

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