Double-groove GPU air increasing and cooling equipment and method

Abstract

The invention discloses a double-groove GPU air increasing and cooling device and method, and the device comprises an air inlet upper cover, one side of the air inlet upper cover is provided with a uniform temperature plate module, one side of the uniform temperature plate module is provided with a fan, one side of the uniform temperature plate module is provided with a pedestal, one side of the pedestal is connected with a mainboard, the mainboard is provided with a GPU chip, and the GPU chip is connected with the mainboard. The air inlet upper cover comprises a first cover plate and a half-height plate, and a first inclined plate is connected between the first cover plate and the half-height plate. In the design, the bending part between the half-height plate and the first cover plate and the upper air inlet in the half-height plate are introduced. Through the combined action of the designs, more cold air can flow into the system at the same time through the improvement, and sufficient cooling resources are provided for all heating components. And even under the condition that multiple display cards work in parallel, sufficient cold air supply can be ensured, the overheating phenomenon caused by heat accumulation is prevented, and the service life of hardware is prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field of cooling devices, and particularly relates to a double-slot GPU air-increasing cooling device and method. Background Art

[0002] With the rapid development of computer technology, especially the growth of high-performance computing and graphics processing requirements, parallel operation of multiple graphics cards has become a common configuration. This configuration is particularly important in fields such as deep learning, big data analysis, and high-end gaming. However, a major challenge in such multi-GPU systems lies in the heat dissipation problem. Especially when multiple graphics cards are installed side by side, how to ensure sufficient air intake space to maintain efficient cooling has become a key technical problem. Traditional cooling solutions usually rely on increasing the number of fans or improving the radiator design, but these methods often struggle to effectively solve the problem of poor air circulation caused by the close distance between graphics cards. Therefore, in the face of high-density graphics card systems, existing cooling technologies have obvious deficiencies in improving air flow efficiency.

[0003] When multiple graphics cards are used side by side, due to physical space limitations, the gap between the graphics cards is very limited, which greatly restricts the inflow path of cold air and the exhaust path of hot air, resulting in low cooling efficiency. Especially in high-performance application scenarios, the graphics cards need to process a large amount of data and generate a huge amount of heat. If the heat cannot be dissipated in a timely and effective manner, it will seriously affect the performance of the graphics cards and may cause hardware damage. In addition, the existing cooling devices also have weak direct cooling capabilities for components such as video memory, further exacerbating the risk of local overheating. Therefore, in view of the special requirements of using multiple graphics cards side by side, it is particularly necessary to develop a new type of cooling device that can significantly improve the utilization rate of air intake space and enhance the overall heat dissipation effect.

[0004] The design of traditional cooling systems fails to fully consider the air circulation obstacles brought about by the close arrangement of graphics cards. As a result, even if additional fans are added or more efficient heat dissipation materials are used, the ventilation condition between the graphics cards cannot be fundamentally improved. Specifically, the narrow gap between the graphics cards not only restricts the effective entry of cold air but also hinders the rapid exhaust of hot air, forming a so-called "heat island effect", causing the temperature in certain areas to rise abnormally, and further affecting the stability and reliability of the entire system. In addition, the existing technology has imperfect targeted heat dissipation measures for video memory and other heat-generating components, further increasing the risk of local overheating. Therefore, we propose a double-slot GPU air-increasing cooling device and method. Summary of the Invention

[0005] Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a double-slot GPU air-increasing and cooling device and method. By optimizing the air intake structure, expanding the air intake area, and adopting an efficient heat pipe module, the problem of insufficient air intake space when multiple graphics cards are used side by side is successfully solved, achieving a more uniform and efficient heat dissipation effect, and ensuring the long-term stable operation of the graphics card and other key components.

[0006] The present invention is implemented as follows. A double-slot GPU air-increasing and cooling device includes an upper air intake cover. One side of the upper air intake cover is provided with a heat pipe module. One side of the heat pipe module is provided with a fan. One side of the heat pipe module is provided with a base. One side of the base is connected to a main board, and a GPU chip is installed on the main board. The upper air intake cover includes a first cover plate and a half-height plate. A first inclined plate is connected between the first cover plate and the half-height plate. Bending parts are respectively provided on the first cover plate and the half-height plate. Side air inlets are provided on both the left and right sides of the first inclined plate. An upper air inlet is opened on the half-height plate. The heat pipe module includes a lower fin radiator. One side of the lower fin radiator is fixedly connected to a second fin radiator. The height of the end of the second fin radiator close to the lower fin radiator is greater than the end far from the lower fin radiator. A first aluminum plate is welded to the upper part of the lower fin radiator. An upper fin radiator is fixedly connected to the upper part of the first aluminum plate. A second aluminum plate is welded to the lower part of the lower fin radiator. A video memory contact copper block is connected to the lower part of the second aluminum plate.

[0007] Optionally, a backplane module is connected to the lower part of the main board, and a heat pipe back buckle is connected to the backplane module.

[0008] Optionally, second inclined plates are provided on both the left and right sides of the half-height plate, and a triangular connecting plate is connected between the second inclined plates and the first inclined plate.

[0009] Optionally, a plurality of ventilation strips are opened on the second inclined plate, and the width of the ventilation strips is 0.1-2 mm.

[0010] Optionally, an air intake groove is opened on the second fin radiator, and two first inclined surfaces are provided on the air intake groove.

[0011] Optionally, a transition section is provided between the first aluminum plate and the second fin radiator, and the transition section includes a first inclined edge, a second inclined edge, and an arc edge.

[0012] Optionally, the included angle β between the first inclined edge and the vertical direction is set to 113-120°, and the included angle α between the second inclined edge and the vertical direction is set to 43-50°.

[0013] Optionally, a third aluminum plate is fixedly connected to the upper part of the upper fin radiator, and the included angle γ between the second fin radiator and the vertical direction is set to 63-68°.

[0014] Optionally, a MOS transistor, an inductor, and a video memory are installed on the main board. A MOS thermal pad is covered on the MOS transistor, thermal grease is provided on the GPU chip, a video memory thermal pad is provided on the video memory, and an inductor thermal pad is provided on the inductor. The fan is connected to the base through fan screws, the base is connected to the upper air inlet cover through base connection screws, the main board is connected to the base through main board screws, and the backplane module is connected to the main board through backplane screws.

[0015] The present invention also provides a method for increasing air flow and cooling a dual-slot GPU, including the dual-slot GPU air flow increasing and cooling device, and comprising the following steps:

[0016] S1. Prepare two plates with different widths, respectively bend them to make bending parts, which are respectively used to manufacture the first cover plate and the half-height plate, so that the heights of the first cover plate and the half-height plate are different;

[0017] S2. Connect the first cover plate and the half-height plate together with a first inclined plate, and process an upper air inlet on the half-height plate to complete the manufacture of the upper air inlet cover;

[0018] S3. Machine the second fin radiator so that the height of the end close to the lower fin radiator is greater than the end far from the lower fin radiator, and connect the lower fin radiator to the heat pipe module;

[0019] S4. Install the processed upper air inlet cover, heat pipe module, fan, and second fin radiator above the base and assemble them.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. The design introduces the bending part between the half-height plate and the first cover plate, and the upper air inlet on the half-height plate. These designs work together to greatly expand the air inlet area of the device. This improvement allows more cold air to flow into the system simultaneously, providing sufficient cooling resources for each heat-generating component. Even when multiple graphics cards are working in parallel, it can ensure sufficient cold air supply, prevent overheating caused by heat accumulation, and extend the service life of the hardware.

[0022] 2. By designing the first inclined plate and the second inclined plate and setting side air inlets and ventilation strips on these plates, the optimization of the air flow path is achieved. This design not only increases the angle and area of air entering the system but also improves the cooling efficiency by guiding the air flow to directly act on the heat source area. While increasing the air intake volume, the air flow resistance is reduced, ensuring that the cold air can efficiently reach the surface of the heating elements, thereby effectively reducing the temperature. The effect of significantly improving the overall heat dissipation performance of the system ensures the stable operation of the graphics card and other key components under high load.

[0023] 3. The vapor chamber module includes components such as a lower fin radiator, a second fin radiator, and a first aluminum plate, forming a complex heat conduction network. Especially the design of the height change of the second fin radiator and the special geometric shape of the transition section further enhance the heat conduction efficiency. Such a configuration can not only quickly absorb the heat from the GPU chip and other heating elements but also quickly dissipate it, maintaining the temperature balance of the system. Therefore, it effectively reduces the possibility of hot spot formation and improves the thermal stability of the entire system, which is crucial for improving computing performance and reliability.

[0024] Other features and advantages of the present invention will become clear through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is an exploded structural schematic diagram from the first perspective provided by the present invention;

[0026] Figure 2 is a schematic diagram of the base and the main board provided by the present invention;

[0027] Figure 3 is an exploded structural schematic diagram from the second perspective provided by the present invention;

[0028] Figure 4 is a schematic diagram of the air intake upper cover of Embodiment 1 provided by the present invention;

[0029] Figure 5 is a schematic diagram of the lower part of the video memory contact copper block provided by the present invention;

[0030] Figure 6 is a schematic diagram of the air intake upper cover of Embodiment 2 provided by the present invention;

[0031] Figure 7 is a schematic diagram of the air intake upper cover of Embodiment 3 provided by the present invention;

[0032] Figure 8 A schematic diagram of the vapor chamber module of Embodiment 1 provided by the present invention;

[0033] Figure 9Schematic diagram of the heat pipe module of Embodiment 2 provided by the present invention;

[0034] Figure 10 Stereoscopic schematic diagram of the heat pipe module of Embodiment 3 provided by the present invention;

[0035] Figure 11 Planar structure schematic diagram of the heat pipe module of Embodiment 3 provided by the present invention;

[0036] In the figure: 1. Upper air inlet cover; 11. First inclined plate; 12. Half-height plate; 121. Second inclined plate; 122. Triangular connecting plate; 123. Ventilation strip; 13. Upper air inlet; 14. First cover plate; 15. Side air inlet; 16. Bending part; 2. Heat pipe module; 21. Video memory contact copper block; 22. Second fin radiator; 221. Air inlet groove; 222. First inclined surface; 23. Lower fin radiator; 24. First aluminum plate; 25. Second aluminum plate; 26. Third aluminum plate; 27. Upper fin radiator; 28. Transition section; 281. First bevel edge; 282. Second bevel edge; 283. Arc edge; 29. Heat pipe back buckle; 3. Fan; 31. Fan screw; 4. Base; 41. Base connection screw; 5. Main board; 51. MOS tube; 52. MOS thermal pad; 53. GPU chip; 54. Thermal grease; 55. Video memory; 56. Video memory thermal pad; 57. Inductor; 58. Inductor thermal pad; 59. Main board screw; 6. Backplane module; 61. Backplane screw. Detailed implementation manners

[0037] In order to further understand the content, features and effects of the present invention, the following embodiments are cited and described in detail in conjunction with the accompanying drawings.

[0038] Embodiment 1

[0039] As Figures 1-5 , Figure 8 shown, a dual-slot GPU air-increasing and temperature-reducing device provided by an embodiment of the present invention.

[0040] It includes an air inlet upper cover 1. A heat pipe module 2 is provided on one side of the air inlet upper cover 1. A fan 3 is provided on one side of the heat pipe module 2. A base 4 is provided on one side of the heat pipe module 2. One side of the base 4 is connected to a main board 5. A GPU chip 53 is installed on the main board 5. The air inlet upper cover 1 includes a first cover plate 14 and a half-height plate 12. A first inclined plate 11 is connected between the first cover plate 14 and the half-height plate 12. Bending parts 16 are respectively provided on the first cover plate 14 and the half-height plate 12. Side air inlets 15 are provided on both the left and right sides of the first inclined plate 11. An upper air inlet 13 is formed on the half-height plate 12; the heat pipe module 2 includes a lower fin radiator 23. A second fin radiator 22 is fixedly connected to one side of the lower fin radiator 23. The height of the end of the second fin radiator 22 close to the lower fin radiator 23 is greater than the end far from the lower fin radiator 23; a first aluminum plate 24 is welded to the upper part of the lower fin radiator 23. An upper fin radiator 27 is fixedly connected to the upper part of the first aluminum plate 24. A second aluminum plate 25 is welded to the lower part of the lower fin radiator 23. A video memory contact copper block 21 is connected to the lower part of the second aluminum plate 25.

[0041] A backplane module 6 is connected to the lower part of the main board 5. A heat pipe back buckle 29 is connected to the backplane module 6.

[0042] A third aluminum plate 26 is fixedly connected to the upper part of the upper fin radiator 27.

[0043] A MOS tube 51, an inductor 57 and a video memory 55 are installed on the main board 5. A MOS thermal pad 52 is covered on the MOS tube 51. A thermal grease 54 is provided on the GPU chip 53. A video memory thermal pad 56 is provided on the video memory 55. An inductor thermal pad 58 is provided on the inductor 57. The fan 3 is connected to the base 4 through a fan screw 31. The base 4 is connected to the air inlet upper cover 1 through a base connection screw 41. The main board 5 is connected to the base 4 through a main board screw 59. The backplane module 6 is connected to the main board 5 through a backplane screw 61.

[0044] The present invention also provides a method for increasing air flow and cooling a double-slot GPU, including a double-slot GPU air flow increasing and cooling device, which includes the following steps:

[0045] S1. Prepare two plates with different widths, respectively bend them to make bending parts 16, and use them to manufacture the first cover plate 14 and the half-height plate 12 respectively, so that the heights of the first cover plate 14 and the half-height plate 12 are different;

[0046] S2. Connect the first cover plate 14 and the half-height plate 12 together with the first inclined plate 11, and process an upper air inlet 13 on the half-height plate 12 to complete the manufacture of the air inlet upper cover 1;

[0047] S3. Cut the second fin heat sink 22 so that the height of the end close to the lower fin heat sink 23 is greater than that of the end far from the lower fin heat sink 23, and connect the lower fin heat sink 23 to the heat pipe module 2;

[0048] S4. Install the processed air inlet upper cover 1, heat pipe module 2, fan 3 and second fin heat sink 22 above the base 4 and assemble them.

[0049] Working principle: The device adopts an innovative air inlet design, including the first cover plate 14 and the half-height plate 12 on the air inlet upper cover 1, which are connected by the first inclined plate 11 and are provided with side air inlets 15 on both sides. In addition, an upper air inlet 13 is also opened on the half-height plate 12. This design with height difference not only increases the air inlet area but also improves the air flow path, enabling the cooling air to enter the device interior more effectively.

[0050] The heat pipe module 2 is composed of a lower fin heat sink 23, a second fin heat sink 22, a first aluminum plate 24, a second aluminum plate 25, a third aluminum plate 26, an upper fin heat sink 27, etc. These components work together to form an efficient heat conduction system. Among them, the height of the end of the second fin heat sink 22 close to the lower fin heat sink 23 is relatively large, which helps to guide the air flow direction and improve the heat dissipation efficiency.

[0051] Heat first transfers from the GPU chip 53, MOS tube 51, inductor 57 and video memory 55 on the main board 5 to their respective thermal pads or thermal grease 54, and then diffuses through the heat pipe module 2. The video memory contact copper block 21 is directly connected to the second aluminum plate 25, further enhancing the heat transfer ability to the external environment.

[0052] The fan 3 is located on one side of the heat pipe module 2, and its function is to accelerate the air flow and help quickly take away the heat absorbed by the heat pipe module 2. The fan screw 31 is used to firmly install the fan 3 on the base 4 to ensure its stability and safety.

[0053] Embodiment 2:

[0054] As Figure 6 、 Figure 9 shown, on the basis of Embodiment 1, this embodiment adds that second inclined plates 121 are provided on both the left and right sides of the half-height plate 12, and a triangular connecting plate 122 is connected between the second inclined plates 121 and the first inclined plate 11.

[0055] The second fin heat sink 22 is provided with an air inlet groove 221, and two first inclined surfaces 222 are provided on the air inlet groove 221.

[0056] Adding the second inclined plates 121 and the first inclined plate 11 to the half-height plate 12 can increase the space on the left and right inclined surfaces to facilitate the introduction of air flow.

[0057] An air inlet groove 221 is formed in the second fin radiator 22, so as to reduce the air resistance entering below and better concentrate on cooling the core area below. Two first inclined surfaces 222 are provided on the air inlet groove 221 to make the air flow play a role in gathering and accelerating.

[0058] Embodiment Three

[0059] As Figure 7 、 Figure 10 、 Figure 11 shown, on the basis of Embodiment One, this embodiment adds that second inclined plates 121 are provided on both the left and right sides of the semi-height plate 12, and a triangular connecting plate 122 is connected between the second inclined plates 121 and the first inclined plate 11.

[0060] A plurality of ventilation strips 123 are formed in the second inclined plate 121, and the width of the ventilation strips 123 is 0.9 mm.

[0061] A transition section 28 is provided between the first aluminum plate 24 and the second fin radiator 22. The transition section 28 includes a first inclined edge 281, a second inclined edge 282 and an arc edge 283.

[0062] The included angle β between the first inclined edge 281 and the vertical direction is set to 117°, and the included angle α between the second inclined edge 282 and the vertical direction is set to 48°.

[0063] A third aluminum plate 26 is fixedly connected to the upper part of the upper fin radiator 27, and the included angle γ between the second fin radiator 22 and the vertical direction is set to 65°.

[0064] A plurality of ventilation strips 123 are formed in the second inclined plate 121, and the width of the ventilation strips 123 is 0.9 mm, which can play a role in increasing the air inlet path and making the amount of cold air entering larger.

[0065] A transition section 28 is provided between the first aluminum plate 24 and the second fin radiator 22. It can reduce the air resistance. The transition section 28 includes a first inclined edge 281, a second inclined edge 282 and an arc edge 283, which can optimize the flow rate and make the air volume more evenly distributed on the upper and lower fins;

[0066] The included angle β between the first inclined edge 281 and the vertical direction is set to 117°, the included angle α between the second inclined edge 282 and the vertical direction is set to 48°, and the included angle γ between the second fin radiator 22 and the vertical direction is set to 65°, which can optimize the flow rate, reduce the air resistance, and make the air volume more evenly distributed on the upper and lower fins.

[0067] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual-slot GPU air-increasing and temperature-reducing device, comprising an air inlet upper cover (1). One side of the air inlet upper cover (1) is provided with a heat pipe module (2). One side of the heat pipe module (2) is provided with a fan (3). One side of the heat pipe module (2) is provided with a base (4). One side of the base (4) is connected to a main board (5). A GPU chip (53) is installed on the main board (5). It is characterized in that: The air inlet upper cover (1) includes a first cover plate (14) and a half-height plate (12). A first inclined plate (11) is connected between the first cover plate (14) and the half-height plate (12). Bending parts (16) are respectively provided on the first cover plate (14) and the half-height plate (12). Side air inlets (15) are provided on both the left and right sides of the first inclined plate (11). An upper air inlet (13) is opened on the half-height plate (12); The heat pipe module (2) includes a lower fin radiator (23). One side of the lower fin radiator (23) is fixedly connected to a second fin radiator (22). The height of one end of the second fin radiator (22) close to the lower fin radiator (23) is greater than that of the end far from the lower fin radiator (23); A first aluminum plate (24) is welded to the upper part of the lower fin radiator (23). An upper fin radiator (27) is fixedly connected to the upper part of the first aluminum plate (24). A second aluminum plate (25) is welded to the lower part of the lower fin radiator (23). A video memory contact copper block (21) is connected to the lower part of the second aluminum plate (25).

2. The double-slot GPU air-increasing and temperature-reducing device according to claim 1, wherein: A backplane module (6) is connected to the lower part of the main board (5). A heat pipe back buckle (29) is connected to the backplane module (6).

3. The double-slot GPU air-increasing and temperature-reducing device according to claim 1, wherein: Second inclined plates (121) are provided on both the left and right sides of the half-height plate (12). A triangular connecting plate (122) is connected between the second inclined plates (121) and the first inclined plate (11).

4. A dual-slot GPU air-increasing and temperature-reducing device according to claim 3, characterized in that: A plurality of ventilation strips (123) are opened on the second inclined plate (121). The width of the ventilation strips (123) is 0.1 - 2 mm.

5. The double-slot GPU air-increasing and temperature-reducing device according to claim 1, wherein: An air inlet groove (221) is opened on the second fin radiator (22). Two first inclined surfaces (222) are provided on the air inlet groove (221).

6. A dual-slot GPU air-increasing and temperature-reducing device according to claim 1, characterized in that: A transition section (28) is provided between the first aluminum plate (24) and the second fin radiator (22). The transition section (28) includes a first inclined edge (281), a second inclined edge (282), and an arc edge (283).

7. The dual-slot GPU air-increasing and temperature-reducing device according to claim 6, characterized in that: The included angle β between the first inclined edge (281) and the vertical direction is set to 113 - 120°. The included angle α between the second inclined edge (282) and the vertical direction is set to 43 - 50°.

8. A double-slot GPU air-increasing and temperature-reducing device according to claim 1, characterized in that: A third aluminum plate (26) is fixedly connected to the upper part of the upper fin radiator (27). The included angle γ between the second fin radiator (22) and the vertical direction is set to 63 - 68°.

9. A double-slot GPU air-increasing and temperature-reducing device according to claim 2, characterized in that: A MOS transistor (51), an inductor (57), and a video memory (55) are installed on the main board (5). A MOS thermal pad (52) is covered on the MOS transistor (51). A thermal grease (54) is provided on the GPU chip (53). A video memory thermal pad (56) is provided on the video memory (55). An inductor thermal pad (58) is provided on the inductor (57). The fan (3) is connected to the base (4) through a fan screw (31). The base (4) is connected to the air inlet upper cover (1) through a base connection screw (41). The main board (5) is connected to the base (4) through a main board screw (59). The backplane module (6) is connected to the main board (5) through a backplane screw (61).

10. A dual-slot GPU air-increasing and temperature-reducing method, comprising the dual-slot GPU air-increasing and temperature-reducing device according to any one of claims 1-9, characterized in that: It includes the following steps: S1. Prepare two plates with different widths, respectively bend them to make bending parts (16) for manufacturing the first cover plate (14) and the half-height plate (12) respectively, so that the heights of the first cover plate (14) and the half-height plate (12) are different; S2. Connect the first cover plate (14) and the half-height plate (12) together with the first inclined plate (11), and process an upper air inlet (13) on the half-height plate (12) to complete the manufacture of the air inlet upper cover (1); S3. Machine the second fin radiator (22) so that the height of one end close to the lower fin radiator (23) is greater than the height of the end far from the lower fin radiator (23), and connect the lower fin radiator (23) to the heat pipe module (2); S4. Install the machined air inlet upper cover (1), heat pipe module (2), fan (3), and second fin radiator (22) above the base (4) and assemble them.

Images