Chip monitoring method and device, electronic equipment and storage medium

Abstract

The invention provides a chip monitoring method and device, electronic equipment and a storage medium, and the method comprises the steps: employing the chip monitoring method, determining the characteristic frequency of a target chip based on a preset radio frequency signal, the characteristic frequency being the frequency at which a calculation unit representing the target chip generates a quantum state change, and obtaining phase space position distribution information of the calculation unit of the target chip in different quantum states, determining coherent characteristics between the target quantum state of the calculation unit and other quantum states based on the phase space position distribution information, and determining the temperature of the target chip based on the characteristic frequency and the coherent characteristics. By adopting the method, the chip temperature can be monitored, so that the state of the quantum chip can be confirmed in real time, the quantum chip is prevented from working at the lowest temperature in an unstable state, and the service life of the quantum chip is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the field of chip technology, and in particular, to a chip monitoring method, apparatus, electronic device, and storage medium. Background Art

[0002] With the continuous growth of the demand for chip computing power, the field of quantum chip research has gradually become a research hotspot. For example, superconducting quantum computing, as one of the ways to realize quantum computing, has attracted much attention. Different from the binary state of bits in traditional computing, quantum bits can exist in the |0> state, the |1> state, or the superposition state of |0> and |1>. A superconducting quantum chip generally needs to be placed in the lowest temperature region (also known as the mixing chamber) of a dilution refrigerator. The mixing chamber of the dilution refrigerator is equipped with a thermistor. Generally, the temperature condition of the mixing chamber can be judged by monitoring the resistance value change of the thermistor, and then it can be confirmed whether the dilution refrigerator has reached the lowest working temperature.

[0003] However, due to the limited refrigeration capacity of the dilution refrigerator, the temperature of the quantum chip is often difficult to be reduced to the lowest temperature in a stable state. Therefore, how to monitor the temperature of the quantum chip and confirm the state of the quantum chip has become a technical problem to be solved urgently. Summary of the Invention

[0004] The present disclosure provides a chip monitoring method, apparatus, electronic device, and storage medium.

[0005] According to a first aspect of the present disclosure, a chip monitoring method is provided, and the method includes:

[0006] Determining a characteristic frequency of a target chip based on a preset radio frequency signal, where the characteristic frequency is a frequency characterizing the generation of a quantum state change by a computing unit of the target chip;

[0007] Obtaining distribution information of phase space positions of the computing unit of the target chip in different quantum states;

[0008] Based on the distribution information of the phase space positions, determining a coherence characteristic between a target quantum state of the computing unit and other quantum states;

[0009] Based on the characteristic frequency and the coherence characteristic, determining the temperature of the target chip.

[0010] In an implementable manner, the determining a characteristic frequency of a target chip based on a preset radio frequency signal includes:

[0011] Obtaining a plurality of first radio frequency signals, where the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold;

[0012] Perform mixed-frequency processing on each of the first radio frequency signal and the second radio frequency signal to obtain a corresponding mixed-frequency signal, wherein the frequency of the second radio frequency signal is fixed;

[0013] Drive the target chip in response to each of the mixed-frequency signals, and monitor the target mixed-frequency signal corresponding to the change in the quantum state of the computing unit of the target chip;

[0014] Determine the characteristic frequency of the target chip based on the target mixed-frequency signal.

[0015] In an implementable manner, the obtaining the phase space position distribution information of the computing unit of the target chip in different quantum states includes:

[0016] Set the computing unit of the target chip to the first quantum state, and count the first position distribution information of the computing unit in the phase space when it is in the first quantum state;

[0017] Set the computing unit of the target chip to the second quantum state, and count the second position distribution information of the computing unit in the phase space when it is in the second quantum state, where the first quantum state is different from the second quantum state.

[0018] In an implementable manner, the setting the computing unit of the target chip to the first quantum state and counting the first position distribution information of the computing unit in the phase space when it is in the first quantum state includes:

[0019] Set the computing unit of the target chip to the first quantum state, and determine the first position of the computing unit in the phase space;

[0020] Determine whether the number of computing units in the first quantum state reaches a first preset number;

[0021] If so, determine the first position distribution information based on the first positions of each computing unit in the first quantum state in the phase space;

[0022] If not, for a new computing unit, return to execute the step of setting the computing unit of the target chip to the first quantum state.

[0023] In an implementable manner, the phase space position distribution information includes the first positions of each computing unit in the target chip in the phase space when they are in the first quantum state and the second positions of each computing unit in the phase space when they are in the second quantum state;

[0024] The determining the coherence characteristics between the target quantum state of the computing unit and other quantum states based on the phase space position distribution information includes:

[0025] Determine the first average position information in the phase space when each computing unit is in the first quantum state according to each of the first positions, and determine the second average position information in the phase space when each computing unit is in the second quantum state according to each of the second positions;

[0026] Set the computing unit of the target chip to the target quantum state, and determine the target position of the computing unit in the phase space;

[0027] Determine the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position and the target position.

[0028] In one implementable manner, the determining the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position and the target position includes:

[0029] Determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position;

[0030] Determine the quantum state change probability of the computing unit according to the first distance and the second distance corresponding to each computing unit in the target quantum state, and use the quantum state change probability as the coherence characteristics between the target quantum state of the computing unit and other quantum states.

[0031] In one implementable manner, the determining the temperature of the target chip based on the characteristic frequency and the coherence characteristics includes:

[0032] Use the following formula to determine the temperature of the target chip based on the characteristic frequency and the coherence characteristics:

[0033]

[0034] where T is the temperature of the target chip, ω q is the characteristic frequency, h is the Planck constant, k B is the Boltzmann constant, p e is the coherence characteristic.

[0035] According to a second aspect of the present disclosure, there is provided a chip monitoring device, the device includes:

[0036] A frequency information acquisition module, configured to determine the characteristic frequency of a target chip based on a preset radio frequency signal, where the characteristic frequency is a frequency characterizing the generation of quantum state changes by the computing unit of the target chip;

[0037] A distribution information acquisition module, configured to obtain the phase space position distribution information of the computing units of the target chip in different quantum states;

[0038] A feature determination module, configured to determine the coherence feature between the target quantum state of the computing unit and other quantum states based on the phase space position distribution information;

[0039] A temperature monitoring module, configured to determine the temperature of the target chip based on the characteristic frequency and the coherence feature.

[0040] In an implementable manner, the frequency information acquisition module is specifically configured to acquire a plurality of first radio frequency signals, where the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold; perform a frequency mixing process on each of the first radio frequency signals and a second radio frequency signal to obtain a corresponding mixed frequency signal, where the frequency of the second radio frequency signal is fixed; drive the target chip in response to each of the mixed frequency signals, and monitor the target mixed frequency signal corresponding to the change in the quantum state of the computing unit of the target chip; determine the characteristic frequency of the target chip based on the target mixed frequency signal.

[0041] In an implementable manner, the distribution information acquisition module is specifically configured to set the computing unit of the target chip to a first quantum state, and count the first position distribution information of the computing unit in the phase space when it is in the first quantum state; set the computing unit of the target chip to a second quantum state, and count the second position distribution information of the computing unit in the phase space when it is in the second quantum state, where the first quantum state is different from the second quantum state.

[0042] In an implementable manner, the distribution information acquisition module is specifically configured to set the computing unit of the target chip to a first quantum state, and determine the first position of the computing unit in the phase space; determine whether the number of computing units in the first quantum state reaches a first preset number; if so, determine the first position distribution information based on the first positions of the computing units in the first quantum state in the phase space; if not, for a new computing unit, return to execute the step of setting the computing unit of the target chip to the first quantum state.

[0043] In an implementable manner, the phase space position distribution information includes the first positions of the respective computing units in the target chip in the phase space when in the first quantum state and the second positions of the respective computing units in the phase space when in the second quantum state;

[0044] The feature determination module is specifically configured to determine, according to each of the first positions, the first average position information of each computing unit in the phase space when it is in the first quantum state, and determine, according to each of the second positions, the second average position information of each computing unit in the phase space when it is in the second quantum state; set the computing unit of the target chip to the target quantum state, and determine the target position of the computing unit in the phase space; and determine the coherence feature between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position.

[0045] In an implementable manner, the feature determination module is specifically configured to determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position; determine the quantum state change probability of the computing unit according to the first distance and the second distance corresponding to each computing unit in the target quantum state, and use the quantum state change probability as the coherence feature between the target quantum state of the computing unit and other quantum states.

[0046] In an implementable manner, the temperature monitoring module is specifically configured to use the following formula to determine the temperature of the target chip based on the characteristic frequency and the coherence feature:

[0047]

[0048] where T is the temperature of the target chip, ω q is the characteristic frequency, h is Planck's constant, k B is the Boltzmann constant, and p e is the coherence feature.

[0049] According to a third aspect of the present disclosure, there is provided an electronic device, including:

[0050] at least one processor; and

[0051] a memory communicatively connected to the at least one processor;

[0052] wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method described in the present disclosure.

[0053] According to a fourth aspect of the present disclosure, there is provided a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the method described in the present disclosure.

[0054] Using the chip monitoring method provided by the embodiments of the present disclosure, the characteristic frequency of the target chip is determined based on a preset radio frequency signal. The characteristic frequency is the frequency characterizing the change in the quantum state generated by the computing unit of the target chip. The phase space position distribution information of the computing unit of the target chip in different quantum states is obtained. Based on the phase space position distribution information, the coherence characteristics between the target quantum state and other quantum states of the computing unit are determined. The temperature of the target chip is determined based on the characteristic frequency and the coherence characteristics. In the present disclosure, the coherence characteristics between the quantum states of the computing unit can be determined through the phase space position distribution information of the computing unit of the chip in different quantum states. By using the coherence characteristics and the characteristic frequency that causes the quantum state of the computing unit of the target chip to change, the temperature of the chip can be obtained, realizing the monitoring of the chip temperature, thereby enabling the real-time confirmation of the state of the quantum chip, avoiding the operation of the quantum chip at the lowest temperature in an unstable state, and improving the operating life of the quantum chip.

[0055] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present disclosure will become easily understandable. In the drawings, several embodiments of the present disclosure are shown in an exemplary rather than restrictive manner, where:

[0057] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0058] Figure 1 It shows a schematic implementation flow diagram of the chip monitoring method provided by the embodiments of the present application;

[0059] Figure 2 It shows a schematic structural diagram of a radio frequency signal generation provided by the embodiments of the present application;

[0060] Figure 3 It shows a schematic diagram of the phase space position distribution information provided by the embodiments of the present application;

[0061] Figure 4 It shows a schematic coherence characteristic determination flow diagram provided by the embodiments of the present application;

[0062] Figure 5 It shows a schematic structural diagram of a chip monitoring device provided by the embodiments of the present application;

[0063] Figure 6 It shows a schematic diagram of the composition structure of an electronic device according to an embodiment of the present disclosure. Detailed implementation manners

[0064] To make the objectives, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.

[0065] Due to the limited refrigeration capacity of the dilution refrigerator, it is often difficult to reduce the temperature of the quantum chip to the lowest temperature in a stable state. Therefore, in order to monitor the temperature of the quantum chip and confirm the state of the quantum chip, the present application provides a chip monitoring method, device, electronic device, and storage medium. The electronic device provided in the present application can be devices such as mobile phones, computers, and tablet computers.

[0066] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0067] Figure 1 shows a schematic implementation flowchart of the chip monitoring method provided in the embodiments of the present application, as Figure 1 shown, the method includes:

[0068] S101, determining the characteristic frequency of the target chip based on a preset radio frequency signal.

[0069] The characteristic frequency is the frequency characterizing the change in the quantum state generated by the computing unit of the target chip.

[0070] In the present disclosure, the target chip may include a superconducting quantum chip, a topological quantum chip, an ion trap quantum chip, etc. The computing unit is the quantum bit of the chip. The quantum state of the computing unit may include the |0> state, the |1> state, and the superposition state of |0> and |1>, where "|>" is a symbol representing the quantum state. The preset radio frequency signal can be used to drive the target chip. There may be multiple preset radio frequency signals.

[0071] The characteristic frequency may be the frequency of the preset radio frequency signal that can drive the target chip and cause the computing unit of the target chip to generate a change in the quantum state. For example, the preset radio frequency signals include radio frequency signal RF1, radio frequency signal RF2, and radio frequency signal RF3. Drive the target chip with radio frequency signal RF1, radio frequency signal RF2, and radio frequency signal RF3 respectively. If, under the drive of radio frequency signal RF1, the quantum state of the computing unit of the target chip changes from the |0> state to the superposition state of |0> and |1>, the frequency of radio frequency signal RF1 can be determined as the characteristic frequency.

[0072] S102. Obtain the phase space position distribution information of the computing units of the target chip in different quantum states.

[0073] In the present disclosure, one or more computing units of the target chip can be placed in different quantum states, and the positions of the computing units in the phase space in the corresponding quantum states are monitored. Then, the corresponding phase space position distribution information is determined according to the positions of the computing units in the phase space in different quantum states.

[0074] For example, for the target chip, the quantum state of the computing unit N1 in the target chip can be set to the |0> state, so as to monitor the IQ value of the computing unit N1 on the complex plane when it is in the |0> state. Then, the quantum state of the computing unit N2 in the target chip can be set to the |0> state, so as to monitor the IQ value of the computing unit N2 on the complex plane when it is in the |0> state. In the same way, the IQ values of n computing units on the complex plane when they are in the |0> state are obtained in sequence. The IQ values of each computing unit are used as the phase space position distribution information of the n computing units of the target chip when they are in the |0> state. Among them, the IQ value includes two orthogonal components corresponding to the computing unit on the complex plane: the I value and the Q value.

[0075] For the target chip, the quantum state of the computing unit M1 in the target chip can also be set to the |1> state, so as to monitor the IQ value of the computing unit M1 on the complex plane when it is in the |1> state. In the same way, the IQ values of m computing units on the complex plane when they are in the |1> state are obtained in sequence. The IQ values of each computing unit are used as the phase space position distribution information of the m computing units of the target chip when they are in the |1> state. Among them, the values of n and m can be set according to actual application requirements, and n and m can be the same or different. For example, n and m can be set to 100 or 200.

[0076] S103. Based on the phase space position distribution information, determine the coherence characteristics between the target quantum state and other quantum states of the computing unit.

[0077] In the present disclosure, the target quantum state of the computing unit can be the |0> state.

[0078] S104. Based on the characteristic frequency and the coherence characteristics, determine the temperature of the target chip.

[0079] The quantum state of the computing unit can reflect the temperature condition of the computing unit. In the present disclosure, the phase space position distribution information can be used to evaluate the computing unit, so as to evaluate the possibility of the change of the target quantum state to other quantum states, and further evaluate the temperature of the target chip.

[0080] Using the chip monitoring method provided by the embodiments of the present disclosure, the characteristic frequency of the target chip is determined based on a preset radio frequency signal. The characteristic frequency is the frequency characterizing the change in the quantum state generated by the computing unit of the target chip. The phase space position distribution information of the computing unit of the target chip in different quantum states is obtained. Based on the phase space position distribution information, the coherence characteristics between the target quantum state and other quantum states of the computing unit are determined. The temperature of the target chip is determined based on the characteristic frequency and the coherence characteristics. In the present disclosure, the coherence characteristics between the quantum states of the computing unit can be determined through the phase space position distribution information of the computing unit of the chip in different quantum states. By using the coherence characteristics and the characteristic frequency that causes the quantum state of the computing unit of the target chip to change, the temperature of the chip can be obtained, realizing the monitoring of the chip temperature, so that the state of the quantum chip can be confirmed in real time, avoiding the quantum chip from operating at the lowest temperature in an unstable state, and improving the operating life of the quantum chip.

[0081] In a possible implementation manner, the determining the characteristic frequency of the target chip based on the preset radio frequency signal may include steps A1 - A4:

[0082] Step A1, obtain a plurality of first radio frequency signals, the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold.

[0083] In the present disclosure, the first frequency threshold and the second frequency threshold can be set according to actual application requirements on the premise that the second frequency threshold is greater than the first frequency threshold, and no specific limitation is made here.

[0084] In the present disclosure, a high - frequency signal generating device can be used to generate the first radio frequency signal. The high - frequency signal generating device can include a microwave source or an oscillator, etc. Optionally, the high - frequency signal generating device can generate a plurality of first radio frequency signals at a preset frequency step within the frequency range formed by the first frequency threshold and the second frequency threshold. The preset frequency step can be set according to actual application requirements, and no specific limitation is made here.

[0085] Step A2, perform mixed - frequency processing on each of the first radio frequency signals and a second radio frequency signal to obtain a corresponding mixed - frequency signal, and the frequency of the second radio frequency signal is fixed.

[0086] In the present disclosure, the second radio frequency signal can be a radio frequency signal with a fixed frequency generated by an arbitrary waveform generator. The frequency of the second radio frequency signal can be equal to the frequency of the first radio frequency signal or not equal to the frequency of the first radio frequency signal.

[0087] In the present disclosure, a mixer can be used to perform mixed - frequency processing on each first radio frequency signal and the second radio frequency signal, and the obtained mixed - frequency signal is used as the preset radio frequency signal to drive the target chip.Figure 2 shows a schematic diagram of a radio frequency signal generation structure provided by an embodiment of the present application. As Figure 2 shown, the high-frequency signal generation device 201 can be connected to the local oscillator terminal LO of the IQ mixer 202, and the two channels of the arbitrary waveform generator 203 are respectively connected to the I terminal and the Q terminal of the IQ mixer 202. As Figure 2 shown, the high-frequency signal generation device 201 can generate a first radio frequency signal, and the arbitrary waveform generator 203 can generate a second radio frequency signal. The IQ mixer 202 mixes the first radio frequency signal and the second radio frequency signal to generate a mixed signal RF, and the mixed signal RF can be used to drive the target chip 204.

[0088] Step A3: In response to driving the target chip by each of the mixed signals, monitor the target mixed signal corresponding to the change in the quantum state of the computing unit of the target chip.

[0089] In the present disclosure, the generated mixed signal can be input into the target chip to drive the qubits of the target chip. For example, the rotation angle of the qubit can be controlled by phase modulation and amplitude modulation to achieve the driving of the target chip. By inputting mixed signals with different frequencies into the target chip, the target chip can be driven so that the computing unit can execute computing tasks. Since the driving capabilities of mixed signals with different frequencies for the target chip are different, under the driving of a mixed signal with a specific frequency, the computing unit of the target chip may have a change in the quantum state. In the present disclosure, during the process of driving the target chip by each mixed signal in real time, the mixed signal that causes the quantum state of the computing unit of the target chip to change can be monitored as the target mixed signal.

[0090] Step A4: Determine the characteristic frequency of the target chip based on the target mixed signal.

[0091] For example, the frequency of the first radio frequency signal RF11 generated by the high-frequency signal generation device is f m , and the frequency of the second radio frequency signal RF21 is f if . The mixer performs frequency mixing processing on each first radio frequency signal RF11 and second radio frequency signal RF21, and the frequency of the obtained mixed signal RFX is (f m + f if ). If the target chip is driven by the mixed signal RFX such that the quantum state of the computing unit N1 of the target chip changes from the |0> state to a superposition state of |0> and |1>, then the mixed signal RFX can be determined as the target mixed signal, and the frequency (f m + f if ) of the mixed signal RFX can be determined as the characteristic frequency of the target chip.

[0092] In one implementable embodiment, obtaining the phase space position distribution information of the computing unit of the target chip in different quantum states may include steps B1 - B2:

[0093] Step B1, setting the computing unit of the target chip to a first quantum state, and statistically obtaining the first position distribution information of the computing unit in the phase space when it is in the first quantum state.

[0094] In the present disclosure, the first quantum state of the computing unit is the |0> state.

[0095] In a possible implementable embodiment, setting the computing unit of the target chip to a first quantum state, and statistically obtaining the first position distribution information of the computing unit in the phase space when it is in the first quantum state may include steps C1 - C4:

[0096] Step C1, setting the computing unit of the target chip to a first quantum state, and determining the first position of the computing unit in the phase space.

[0097] In the present disclosure, the first position in the phase space is the IQ value of the computing unit on the complex plane when the computing unit is in the |0> state. For example, for the target chip, the quantum state of the computing unit N1 in the target chip can be set to the |0> state, so as to monitor the IQ value of the computing unit N1 on the complex plane when it is in the |0> state as the first position of the computing unit N1 in the phase space.

[0098] In the present disclosure, the first preset number of computing units can be set to the |0> state simultaneously, and the IQ values of each computing unit on the complex plane are obtained as the first positions. Alternatively, the first preset number of computing units such as the computing unit N1, the computing unit N2... the computing unit Nm can be set to the |0> state in sequence, and the IQ values of each computing unit on the complex plane are obtained respectively as the first positions.

[0099] Step C2, determining whether the number of computing units in the first quantum state reaches the first preset number.

[0100] The first preset number can be set according to actual application requirements. For example, it can be set to 100 or 200, etc.

[0101] Step C3, if so, determining the first position distribution information based on the first positions of each computing unit in the first quantum state in the phase space.

[0102] In the present disclosure, the first positions of each computing unit in the |0> state in the phase space can be used as the first position distribution information. Alternatively, according to the first positions of each computing unit in the |0> state in the phase space, a position distribution diagram of each computing unit can be drawn, and the position distribution diagram can be used as the first position distribution information.

[0103] Step C4. If the answer is no, for the new computing unit, return to execute the step of setting the computing unit of the target chip to the first quantum state.

[0104] Step B2. Set the computing unit of the target chip to the second quantum state, and count the second position distribution information of the computing unit in the phase space when the computing unit is in the second quantum state, where the first quantum state is different from the second quantum state.

[0105] In the present disclosure, the first quantum state of the computing unit is the |1> state.

[0106] In a possible implementation manner, the step of setting the computing unit of the target chip to the second quantum state and counting the second position distribution information of the computing unit in the phase space when the computing unit is in the second quantum state may include steps D1 - D4:

[0107] Step D1. Set the computing unit of the target chip to the second quantum state, and determine the second position of the computing unit in the phase space.

[0108] In the present disclosure, the second position in the phase space is the IQ value of the computing unit on the complex plane when the computing unit is in the |1> state. For example, for the target chip, the quantum state of the computing unit M1 in the target chip can be set to the |1> state, so as to monitor the IQ value of the computing unit M1 on the complex plane when it is in the |1> state as the second position of the computing unit M1 in the phase space. In the present disclosure, the second preset number of computing units can be set to the |1> state simultaneously, and the IQ values of each computing unit on the complex plane are obtained as the second positions. Alternatively, the computing unit M1, the computing unit M2... the computing unit Mm, etc., of the second preset number of computing units can be set to the |1> state in sequence, and the IQ values of each computing unit on the complex plane are obtained as the second positions respectively.

[0109] Step D2. Determine whether the number of computing units in the second quantum state reaches the second preset number.

[0110] The second preset number can be set according to actual application requirements. For example, it can be set to 200 or 250, etc.

[0111] Step D3. If it is, determine the second position distribution information based on the second positions of each computing unit in the second quantum state in the phase space.

[0112] In the present disclosure, the second positions of the computing units in the |1> state in the phase space can be used as the second position distribution information. Alternatively, a position distribution diagram of each computing unit can be drawn according to the second positions of the computing units in the |1> state in the phase space, and the position distribution diagram can be used as the second position distribution information.

[0113] Step D4, if not, for the new computing unit, return to execute the step of setting the computing unit of the target chip to the second quantum state.

[0114] Figure 3 Shows a schematic diagram of the phase space position distribution information provided by an embodiment of the present application. As Figure 3 shown, the horizontal axis of the coordinate system is the I value of the complex plane, and the vertical axis of the coordinate system is the Q value of the complex plane. The first positions of the computing units in the |0> state in the phase space and the second positions of the computing units in the |1> state in the phase space of the target chip are plotted on the same coordinate system, and the first position distribution information 301 of the computing units in the |0> state in the phase space and the second position distribution information 302 of the computing units in the |0> state in the phase space of the target chip can be obtained.

[0115] In an implementable manner, the phase space position distribution information includes the first positions of each computing unit in the target chip in the phase space when in the first quantum state and the second positions of each computing unit in the phase space when in the second quantum state. Figure 4 Shows a schematic diagram of a coherence feature determination process provided by an embodiment of the present application. As Figure 4 shown, determining the coherence feature between the target quantum state of the computing unit and other quantum states based on the phase space position distribution information includes:

[0116] S401, according to each of the first positions, determine the first average position information of each computing unit in the phase space when in the first quantum state, and according to each of the second positions, determine the second average position information of each computing unit in the phase space when in the second quantum state.

[0117] In the present disclosure, for each computing unit in the |0> state, the average value of the I value and the average value of the Q value of each computing unit in the complex plane can be calculated, and the average value of the I value and the average value of the Q value are used as the first average position information. For each computing unit in the |1> state, the average value of the I value and the average value of the Q value of each computing unit in the complex plane can be calculated, and the average value of the I value and the average value of the Q value are used as the second average position information.

[0118] S402, set the computing unit of the target chip to the target quantum state, and determine the target position of the computing unit in the phase space.

[0119] In the present disclosure, the computing unit can be reset to the |0> state, and the IQ values of each computing unit in the |0> state are collected as the target positions of the computing units in the phase space.

[0120] S403. Determine the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position.

[0121] In the present disclosure, the determining the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position may include steps E1 - E2:

[0122] Step E1. Determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position.

[0123] In the present disclosure, the following formula can be used to determine the first distance between the target position of each computing unit in the target quantum state and the first average position:

[0124]

[0125] where d 0i is the first distance between the target position of the i-th computing unit and the first average position, I i is the I value in the target position of the i-th computing unit, Q i is the Q value in the target position of the i-th computing unit, I 0a is the I value in the first average position, Q 0a is the Q value in the first average position.

[0126] In the present disclosure, the following formula can be used to determine the second distance between the target position of each computing unit in the target quantum state and the second average position:

[0127]

[0128] where d 1i is the second distance between the target position of the i-th computing unit and the second average position, I i is the I value in the target position of the i-th computing unit, Q i is the Q value in the target position of the i-th computing unit, I 1a is the I value in the second average position, Q 1a is the Q value in the second average position.

[0129] Step E2: Determine the quantum state change probability of each computing unit in the target quantum state according to the first distance and the second distance corresponding to the computing unit, and use the quantum state change probability as the coherence feature between the target quantum state of the computing unit and other quantum states.

[0130] In the present disclosure, for each computing unit in the target quantum state, the magnitude of the first distance corresponding to the computing unit can be compared with the second distance. Count the number n01 of computing units for which the corresponding first distance is greater than the second distance, and count the number n11 of computing units for which the corresponding first distance is less than the second distance. If the first distance corresponding to the computing unit is greater than the second distance, it indicates that the quantum state of the computing unit is likely to change from the |0> state to the |1> state, and the quantum state is unstable. If the first distance corresponding to the computing unit is less than the second distance, it indicates that the quantum state of the computing unit is not likely to change and is relatively stable. In the present disclosure, the proportion of computing units with unstable quantum states can be counted by comparing the distance magnitudes. For example, if the number of computing units in the target quantum state is m, and the number of computing units with unstable quantum states is n01, then the proportion of computing units with unstable quantum states can be determined as pe = n01 / m. In the present disclosure, the proportion of computing units with unstable quantum states can be used as the quantum state change probability, and the quantum state change probability can be further used as the coherence feature between the target quantum state of the computing unit and other quantum states.

[0131] In a possible implementation manner, the following formula can also be used to determine the temperature of the target chip based on the characteristic frequency and the coherence feature:

[0132]

[0133] where T is the temperature of the target chip, ω q is the characteristic frequency, h is Planck's constant, k B is the Boltzmann constant, and p e is the coherence feature.

[0134] By using the chip monitoring method of the present disclosure, the coherence feature between the quantum states of the computing unit can be determined through the phase space position distribution information of the computing unit of the chip in different quantum states. By using the coherence feature and the characteristic frequency that causes the quantum state of the computing unit of the target chip to change, the temperature of the chip can be obtained, realizing the monitoring of the chip temperature, thereby enabling the real-time confirmation of the state of the quantum chip, avoiding the operation of the quantum chip at the lowest temperature in the non-stable state, and improving the operating life of the quantum chip.

[0135] Based on the same inventive concept, according to the chip monitoring method provided in the above embodiments of the present disclosure, correspondingly, another embodiment of the present disclosure further provides a chip monitoring device, and its structural schematic diagram is as Figure 5 shown, specifically including:

[0136] A frequency information acquisition module 501, configured to determine a characteristic frequency of a target chip based on a preset radio frequency signal, where the characteristic frequency is a frequency characterizing a change in the quantum state generated by a computing unit of the target chip;

[0137] A distribution information acquisition module 502, configured to obtain phase space position distribution information of the computing unit of the target chip in different quantum states;

[0138] A characteristic determination module 503, configured to determine a coherence characteristic between a target quantum state and other quantum states of the computing unit based on the phase space position distribution information;

[0139] A temperature monitoring module 504, configured to determine the temperature of the target chip based on the characteristic frequency and the coherence characteristic.

[0140] By using the chip monitoring device provided in the embodiments of the present disclosure, a characteristic frequency of a target chip is determined based on a preset radio frequency signal, where the characteristic frequency is a frequency characterizing a change in the quantum state generated by a computing unit of the target chip, phase space position distribution information of the computing unit of the target chip in different quantum states is obtained, a coherence characteristic between a target quantum state and other quantum states of the computing unit is determined based on the phase space position distribution information, and the temperature of the target chip is determined based on the characteristic frequency and the coherence characteristic. In the present disclosure, the coherence characteristic between each quantum state of the computing unit can be determined through the phase space position distribution information of the computing unit of the chip in different quantum states. By using the coherence characteristic and the characteristic frequency that causes the computing unit of the target chip to generate a change in the quantum state, the temperature of the chip can be obtained, realizing the monitoring of the chip temperature, so that the state of the quantum chip can be confirmed in real time, avoiding the quantum chip from working at the lowest temperature in an unstable state, and improving the operating life of the quantum chip.

[0141] In an implementable manner, the frequency information acquisition module 501 is specifically configured to acquire a plurality of first radio frequency signals, where the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold; perform a mixing frequency process on each of the first radio frequency signals and a second radio frequency signal to obtain a corresponding mixed frequency signal, where the frequency of the second radio frequency signal is fixed; drive the target chip in response to each of the mixed frequency signals, and monitor a target mixed frequency signal corresponding to a change in the quantum state of the computing unit of the target chip; determine the characteristic frequency of the target chip based on the target mixed frequency signal.

[0142] In an implementable embodiment, the distribution information acquisition module 502 is specifically configured to set the computing units of the target chip to a first quantum state, and count the first position distribution information of the computing units in the phase space when they are in the first quantum state; set the computing units of the target chip to a second quantum state, and count the second position distribution information of the computing units in the phase space when they are in the second quantum state, where the first quantum state is different from the second quantum state.

[0143] In an implementable embodiment, the distribution information acquisition module 502 is specifically configured to set the computing units of the target chip to a first quantum state, and determine the first position of the computing units in the phase space; determine whether the number of computing units in the first quantum state reaches a first preset number; if so, determine the first position distribution information based on the first positions of the computing units in the first quantum state; if not, for a new computing unit, return to execute the step of setting the computing units of the target chip to the first quantum state.

[0144] In an implementable embodiment, the phase space position distribution information includes the first positions of the respective computing units in the target chip in the phase space when they are in the first quantum state and the second positions of the respective computing units in the phase space when they are in the second quantum state;

[0145] The feature determination module 503 is specifically configured to determine, according to each of the first positions, the first average position information of each computing unit in the phase space when it is in the first quantum state, and determine, according to each of the second positions, the second average position information of each computing unit in the phase space when it is in the second quantum state; set the computing units of the target chip to a target quantum state, and determine the target position of the computing units in the phase space; determine the coherence feature between the target quantum state of the computing units and other quantum states according to the first average position, the second average position, and the target position.

[0146] In an implementable embodiment, the feature determination module 503 is specifically configured to determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position; determine the quantum state change probability of the computing unit according to the first distance and the second distance corresponding to each computing unit in the target quantum state, and use the quantum state change probability as the coherence feature between the target quantum state of the computing unit and other quantum states.

[0147] In one implementable manner, the temperature monitoring module 504 is specifically configured to use the following formula to determine the temperature of the target chip based on the characteristic frequency and the coherence characteristic:

[0148]

[0149] where T is the temperature of the target chip, ω q is the characteristic frequency, h is Planck's constant, k B is the Boltzmann constant, and p e is the coherence characteristic.

[0150] According to an embodiment of the present disclosure, the present disclosure also provides an electronic device and a readable storage medium.

[0151] Figure 6 FIG. shows a schematic block diagram of an exemplary electronic device 600 that can be used to implement the embodiments of the present disclosure. The electronic device is intended to represent various forms of digital computers, such as, for example, laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, for example, personal digital processors, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely exemplary and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0152] As Figure 6 shown, the device 600 includes a computing unit 601 that can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 602 or a computer program loaded from a storage unit 608 into a random access memory (RAM) 603. In the RAM 603, various programs and data required for the operation of the device 600 can also be stored. The computing unit 601, the ROM 602, and the RAM 603 are connected to each other via a bus 604. An input / output (I / O) interface 605 is also connected to the bus 604.

[0153] A plurality of components in the device 600 are connected to the I / O interface 605, including: an input unit 606, such as a keyboard, a mouse, etc.; an output unit 607, such as various types of displays, speakers, etc.; a storage unit 608, such as a magnetic disk, an optical disc, etc.; and a communication unit 609, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 609 allows the device 600 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0154] The computing unit 601 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 601 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 601 executes the various methods and processes described above, such as the chip monitoring method. For example, in some embodiments, the chip monitoring method can be implemented as a computer software program tangibly embodied in a machine-readable medium, such as the storage unit 608. In some embodiments, part or all of the computer program can be loaded and / or installed onto the device 600 via the ROM 602 and / or the communication unit 609. When the computer program is loaded into the RAM 603 and executed by the computing unit 601, one or more steps of the chip monitoring method described above can be executed. Alternatively, in other embodiments, the computing unit 601 can be configured to execute the chip monitoring method by any other suitable means (e.g., by means of firmware).

[0155] The electronic device 600 may further include an image acquisition device.

[0156] The various embodiments of the systems and techniques described above in this document can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special-purpose or general-purpose programmable processor, and can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0157] The program code for implementing the methods of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the program codes are executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program codes can be executed entirely on the machine, partially on the machine, as an independent software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0158] In the context of this disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0159] In order to provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the computer. Other kinds of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, speech input, or tactile input).

[0160] The systems and techniques described herein can be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of a communication network include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0161] A computer system may include a client and a server. The client and the server are generally far from each other and usually interact via a communication network. The relationship between the client and the server is generated by computer programs running on the respective computers and having a client-server relationship with each other. The server may be a cloud server, a server of a distributed system, or a server incorporating a blockchain.

[0162] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in this disclosure can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution disclosed in this disclosure can be achieved, and no limitation is imposed herein.

[0163] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "a plurality" means two or more, unless otherwise specifically defined.

[0164] The above is only the specific implementation manner of this disclosure, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed in this disclosure can easily think of changes or substitutions, which should all be covered by the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be subject to the protection scope of the claims.

Claims

1. A chip monitoring method, characterized in that, The method includes: Determining a characteristic frequency of a target chip based on a preset radio frequency signal, where the characteristic frequency is a frequency characterizing a change in the quantum state generated by a computing unit of the target chip; Obtaining distribution information of the phase space positions of the computing unit of the target chip in different quantum states; Determining the coherence characteristics between the target quantum state and other quantum states of the computing unit based on the phase space position distribution information; Determining the temperature of the target chip based on the characteristic frequency and the coherence characteristics.

2. The method according to claim 1, wherein The determining the characteristic frequency of the target chip based on a preset radio frequency signal includes: Obtaining a plurality of first radio frequency signals, where the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold; Performing mixed frequency processing on each of the first radio frequency signals and a second radio frequency signal to obtain a corresponding mixed frequency signal, where the frequency of the second radio frequency signal is fixed; In response to each of the mixed frequency signals driving the target chip, monitoring the target mixed frequency signal corresponding to a change in the quantum state of the computing unit of the target chip; Determining the characteristic frequency of the target chip based on the target mixed frequency signal.

3. The method according to claim 1, wherein The obtaining the distribution information of the phase space positions of the computing unit of the target chip in different quantum states includes: Setting the computing unit of the target chip to a first quantum state, and counting the first position distribution information of the computing unit in the phase space when it is in the first quantum state; Setting the computing unit of the target chip to a second quantum state, and counting the second position distribution information of the computing unit in the phase space when it is in the second quantum state, where the first quantum state is different from the second quantum state.

4. The method according to claim 3, characterized in that The setting the computing unit of the target chip to a first quantum state, and counting the first position distribution information of the computing unit in the phase space when it is in the first quantum state includes: Setting the computing unit of the target chip to a first quantum state, and determining the first position of the computing unit in the phase space; Determining whether the number of computing units in the first quantum state reaches a first preset number; If so, determining the first position distribution information based on the first positions of the computing units in the first quantum state in the phase space; If not, for a new computing unit, returning to execute the step of setting the computing unit of the target chip to the first quantum state.

5. The method according to claim 1, wherein The phase space position distribution information includes the first positions of the respective computing units in the target chip in the phase space when in the first quantum state and the second positions of the respective computing units in the phase space when in the second quantum state; The determining the coherence characteristics between the target quantum state and other quantum states of the computing unit based on the phase space position distribution information includes: Determining the first average position information of the respective computing units in the phase space when in the first quantum state according to the respective first positions, and determining the second average position information of the respective computing units in the phase space when in the second quantum state according to the respective second positions; Set the computing unit of the target chip to a target quantum state, and determine the target position of the computing unit in the phase space; Determine the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position.

6. The method according to claim 5, wherein The determining the coherence characteristics between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position includes: Determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position; According to the first distance and the second distance corresponding to each computing unit in the target quantum state, determine the probability of quantum state change of the computing unit, and use the probability of quantum state change as the coherence characteristics between the target quantum state of the computing unit and other quantum states.

7. The method according to claim 1, wherein The determining the temperature of the target chip based on the characteristic frequency and the coherence characteristics includes: Use the following formula to determine the temperature of the target chip based on the characteristic frequency and the coherence characteristics: Among them, T is the temperature of the target chip, ω q is the characteristic frequency, h is Planck's constant, k B is the Boltzmann constant, p e is the coherent characteristic.

8. A chip monitoring device, characterized in that, The device includes: A frequency information acquisition module, configured to determine the characteristic frequency of the target chip based on a preset radio frequency signal, where the characteristic frequency is the frequency characterizing the quantum state change generated by the computing unit of the target chip; A distribution information acquisition module, configured to obtain the phase space position distribution information of the computing unit of the target chip in different quantum states; A characteristic determination module, configured to determine the coherence characteristics between the target quantum state of the computing unit and other quantum states based on the phase space position distribution information; A temperature monitoring module, configured to determine the temperature of the target chip based on the characteristic frequency and the coherence characteristics.

9. The device according to claim 8, wherein, The frequency information acquisition module is specifically configured to acquire a plurality of first radio frequency signals, where the frequency of the first radio frequency signal is greater than or equal to a first frequency threshold and less than or equal to a second frequency threshold, and the second frequency threshold is greater than the first frequency threshold; perform mixing frequency processing on each of the first radio frequency signals and a second radio frequency signal to obtain a corresponding mixed frequency signal, where the frequency of the second radio frequency signal is fixed; drive the target chip in response to each of the mixed frequency signals, and monitor the target mixed frequency signal corresponding to the quantum state change of the computing unit of the target chip; determine the characteristic frequency of the target chip based on the target mixed frequency signal.

10. The device according to claim 8, characterized in that, The distribution information acquisition module is specifically configured to set the computing unit of the target chip to a first quantum state, and count the first position distribution information of the computing unit in the phase space when the computing unit is in the first quantum state; set the computing unit of the target chip to a second quantum state, and count the second position distribution information of the computing unit in the phase space when the computing unit is in the second quantum state, where the first quantum state is different from the second quantum state.

11. The device according to claim 10, characterized in that, The distribution information acquisition module is specifically configured to set the computing unit of the target chip to a first quantum state and determine a first position of the computing unit in the phase space; determine whether the number of computing units in the first quantum state reaches a first preset number; If so, determine first position distribution information based on the first positions of the computing units in the first quantum state in the phase space; if not, for a new computing unit, return to execute the step of setting the computing unit of the target chip to the first quantum state.

12. The device according to claim 8, characterized in that, The phase space position distribution information includes the first positions of the computing units in the target chip in the phase space when in the first quantum state and the second positions of the computing units in the phase space when in the second quantum state; The feature determination module is specifically configured to determine first average position information of each computing unit in the phase space when in the first quantum state according to each of the first positions, and determine second average position information of each computing unit in the phase space when in the second quantum state according to each of the second positions; Set the computing unit of the target chip to a target quantum state and determine a target position of the computing unit in the phase space; determine a coherence feature between the target quantum state of the computing unit and other quantum states according to the first average position, the second average position, and the target position.

13. The device according to claim 12, characterized in that, The feature determination module is specifically configured to determine a first distance between the target position of each computing unit in the target quantum state and the first average position, and a second distance between the target position and the second average position; determine a quantum state change probability of the computing unit according to the first distance and the second distance corresponding to each computing unit in the target quantum state, and use the quantum state change probability as the coherence feature between the target quantum state of the computing unit and other quantum states.

14. The device according to claim 8, characterized in that, The temperature monitoring module is specifically configured to use the following formula to determine the temperature of the target chip based on the characteristic frequency and the coherence feature: Among them, T is the temperature of the target chip, ω q is the characteristic frequency, h is Planck's constant, k B is the Boltzmann constant, p e is the coherent characteristic.

15. A computer device, comprising: A memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements the method according to any one of claims 1-7 when executing the program.

16. A storage medium containing computer-executable instructions, where the computer-executable instructions are used to execute the method according to any one of claims 1-7 when executed by a computer processor.

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