Heat exchange device and electronic equipment

Abstract

The invention discloses a heat exchange device and electronic equipment. The heat exchange device comprises a heat conduction substrate and a heat exchange plate, the heat dissipation units are arranged on the heat conduction substrate, each heat dissipation unit comprises a heat conduction fin, and each heat conduction fin comprises a connecting part; the thermoelectric unit comprises an electrode and a thermoelectric layer, the electrode is connected with the heat conduction substrate, and the thermoelectric layer is connected between the electrode and the heat conduction fins; and the electrode of each heat dissipation unit is electrically connected with the connecting part of the adjacent heat dissipation unit.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to a heat exchange device and an electronic device. Background Art

[0002] In related technologies, a heat exchange device is provided inside an electronic device to dissipate heat for components such as a control chip. The heat exchange device includes a fin heat sink, an interface material, and a thermoelectric refrigeration device. The fin heat sink includes a first substrate and fins. The thermoelectric refrigeration device includes a second substrate, a third substrate, and a plurality of conductive film groups. The plurality of conductive film groups are connected between the second substrate and the third substrate, and the interface material is connected between the first substrate and the second substrate. The fin heat sink, the interface material, and the thermoelectric refrigeration device are stacked. The interface thermal resistance of the heat exchange device is large, and the external dimension of the heat exchange device is large, which cannot meet the usage requirements of the thin and light electronic device. Summary of the Invention

[0003] This application aims to provide a heat exchange device and an electronic device, and solves the problems in related technologies that the interface thermal resistance of the heat exchange device is large, the external dimension of the heat exchange device is large, and it cannot meet the usage requirements of the thin and light electronic device.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect embodiment of this application, a heat exchange device is proposed, including: a heat-conducting substrate; a plurality of heat dissipation units provided on the heat-conducting substrate, and the heat dissipation unit includes: a heat-conducting fin, and the heat-conducting fin includes a connecting portion; a thermoelectric unit, and the thermoelectric unit includes an electrode and a thermoelectric layer, the electrode is connected to the heat-conducting substrate, and the thermoelectric layer is connected between the electrode and the heat-conducting fin; wherein, the electrode of each heat dissipation unit is electrically connected to the connecting portion of the adjacent heat dissipation unit.

[0006] In a second aspect embodiment of this application, an electronic device is proposed, including: a heat-generating device and the heat exchange device as in the first aspect, and the heat-generating device is provided on a side of the heat-conducting substrate away from the heat-conducting fin.

[0007] In an embodiment of this application, the heat exchange device includes a heat-conducting substrate and a plurality of heat dissipation units. Any one of the plurality of heat dissipation units is provided on the heat-conducting substrate. The heat-conducting substrate serves as an installation carrier for the plurality of heat dissipation units and has the function of installing and fixing the plurality of heat dissipation units.

[0008] The heat dissipation unit includes a heat-conducting fin and a thermoelectric unit. The thermoelectric unit includes an electrode and a thermoelectric layer. The heat-conducting fin includes a connecting portion. The electrode is connected to the heat-conducting substrate, and the thermoelectric layer is connected between the electrode and the heat-conducting fin.

[0009] The electrodes of each heat dissipation unit are electrically connected to the connection part of the adjacent heat dissipation unit. That is, among two adjacent heat dissipation units, the electrode of one heat dissipation unit is electrically connected to the connection part of the other heat dissipation unit to meet the usage requirements of series electrical connection of multiple heat dissipation units.

[0010] When the electrode is in an energized state, cold quantity (such as Peltier cold quantity) will be generated at the connection between the electrode and the thermoelectric layer. The cold quantity is transferred to the heat-generating device through the heat-conducting substrate, and the cold quantity can exchange heat with the heat-generating device to achieve the purpose of dissipating heat from the heat-generating device. At the same time, heat (such as Peltier heat) will be generated at the connection between the thermoelectric layer and the heat-conducting fin, and the heat-conducting fin will quickly transfer the heat to the air.

[0011] The present application reasonably designs the structure of the heat exchange device. Compared with the heat exchange device in the related art, the second substrate and the third substrate of the thermoelectric refrigeration device are omitted, and the interface material connecting the fin heat sink and the thermoelectric refrigeration device is omitted. While ensuring the performance of the heat exchange device, the structure of the heat exchange device is simplified, the material input of the heat exchange device is reduced, the overall thickness of the heat exchange device can be reduced, providing structural support for the thin and light usage requirements of electronic devices. At the same time, this setting eliminates the interface material with the largest thermal resistance in the heat exchange device, can reduce the thermal resistance inside the heat exchange device, and is conducive to greatly improving the heat exchange efficiency and transient response ability of the heat exchange device.

[0012] Additional aspects and advantages of the present application will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0014] Figure 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present application from a first perspective;

[0015] Figure 2 is a schematic structural diagram of a heat exchange device according to an embodiment of the present application from a second perspective;

[0016] Figure 3 is a schematic structural diagram of a first part of a heat exchange device according to an embodiment of the present application;

[0017] Figure 4 is a schematic structural diagram of a second part of a heat exchange device according to an embodiment of the present application.

[0018] REFERENCE MARKS

[0019] Figures 1 to 4 The corresponding relationship between the reference marks in and the component names is as follows:

[0020] 10 Heat exchange device, 100 Heat conducting substrate, 110 Groove, 200 Heat dissipation unit, 210 Electrode, 212 First part of the electrode, 214 Second part of the electrode, 220 Thermoelectric layer, 230 Heat conducting fin, 235 Fin body, 2352 Insertion part, 236 Connection part, 240 First solder layer, 250 Second solder layer, 260 Thermoelectric unit, 300 Insulating layer. Detailed implementation manners

[0021] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements including the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0022] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects. The character " / " generally means an "or" relationship between the associated objects before and after.

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must include a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0024] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0025] The following will describe the heat exchange device 10 and the electronic device provided by the embodiments of the present application in conjunction with the accompanying drawings. Figures 1 to 4 Describe the heat exchange device 10 and the electronic device provided by the embodiments of the present application.

[0026] As Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in, according to some embodiments of the present application, a heat exchange device 10 is proposed, including: a heat conduction substrate 100; a plurality of heat dissipation units 200 provided on the heat conduction substrate 100, and the heat dissipation unit 200 includes: a heat conduction fin 230, and the heat conduction fin 230 includes a connection portion 236; a thermoelectric unit 260, and the thermoelectric unit 260 includes an electrode 210 and a thermoelectric layer 220, the electrode 210 is connected to the heat conduction substrate 100, and the thermoelectric layer 220 is connected between the electrode 210 and the heat conduction fin 230; wherein, the electrode 210 of each heat dissipation unit 200 is electrically connected to the connection portion 236 of the adjacent heat dissipation unit 200.

[0027] In the embodiments of the present application, the heat exchange device 10 includes a heat conduction substrate 100 and a plurality of heat dissipation units 200. Any one of the plurality of heat dissipation units 200 is provided on the heat conduction substrate 100, and the heat conduction substrate 100 serves as an installation carrier for the plurality of heat dissipation units 200, and has the function of installing and fixing the plurality of heat dissipation units 200.

[0028] The heat dissipation unit 200 includes a heat conduction fin 230 and a thermoelectric unit 260. The thermoelectric unit 260 includes an electrode 210 and a thermoelectric layer 220. The heat conduction fin 230 includes a connection portion 236. The electrode 210 is connected to the heat conduction substrate 100, and the thermoelectric layer 220 is connected between the electrode 210 and the heat conduction fin 230.

[0029] The electrode 210 of each heat dissipation unit 200 is electrically connected to the connection portion 236 of the adjacent heat dissipation unit 200. That is, among two adjacent heat dissipation units 200, the electrode 210 of one heat dissipation unit 200 is electrically connected to the connection portion 236 of the other heat dissipation unit 200 to meet the use requirements of series electrical connection of the plurality of heat dissipation units 200.

[0030] When the electrode 210 is in an energized state, a cold quantity (such as, Peltier cold quantity) will be generated at the connection between the electrode 210 and the thermoelectric layer 220. The cold quantity is transmitted to the heat generating device through the heat conduction substrate 100, and the cold quantity can exchange heat with the heat generating device to achieve the purpose of dissipating heat from the heat generating device. At the same time, heat (such as, Peltier heat) will be generated at the connection between the thermoelectric layer 220 and the heat conduction fin 230, and the heat conduction fin 230 will quickly bring the heat into the air.

[0031] The present application rationally designs the structure of the heat exchange device 10. Compared with the heat exchange devices in related technologies, the second substrate and the third substrate of the thermoelectric refrigeration device are omitted, and the interface material connecting the fin radiator and the thermoelectric refrigeration device is also omitted. While ensuring the performance of the heat exchange device 10, the structure of the heat exchange device 10 is simplified, the material input of the heat exchange device 10 is reduced, the overall thickness of the heat exchange device 10 can be reduced, providing structural support for the thin and light use requirements of electronic devices. At the same time, this setting eliminates the interface material with the largest thermal resistance in the heat exchange device 10, can reduce the thermal resistance inside the heat exchange device 10, and is conducive to greatly improving the heat exchange efficiency and transient response ability of the heat exchange device 10.

[0032] It can be understood that the electrodes 210 of two adjacent heat dissipation units 200 are arranged at intervals, that is, the electrodes 210 of two adjacent heat dissipation units 200 are separated, and there is a gap between the electrodes 210 of two adjacent heat dissipation units 200.

[0033] Among them, Figure 4 the arrow in indicates the direction of current flow.

[0034] In some embodiments, multiple heat dissipation units 200 are located on the same side of the heat conduction substrate 100.

[0035] In this embodiment, the arrangement positions of the multiple heat dissipation units 200 are defined such that the multiple heat dissipation units 200 are located on the same side of the heat conduction substrate 100. This arrangement is conducive to reducing the size of the heat exchange device 10 in the thickness direction, providing structural support for the thin and light use requirements of electronic devices.

[0036] In addition, since the multiple heat dissipation units 200 are located on the same side of the heat conduction substrate 100, the multiple heat dissipation units 200 will not hinder the heat exchange between the heat conduction substrate 100 and the heat generating device, and the heat exchange efficiency of the heat exchange device 10 can be ensured.

[0037] Exemplarily, the multiple heat dissipation units 200 are arranged in a matrix.

[0038] In some other embodiments, a part of the multiple heat dissipation units 200 are located on the first side of the heat conduction substrate 100, and another part of the multiple heat dissipation units 200 are located on the second side of the heat conduction substrate 100, and the first side and the second side of the heat conduction substrate 100 are different sides of the heat conduction substrate 100.

[0039] In some embodiments, such as Figure 3As shown, a plurality of grooves 110 are provided on the heat-conducting substrate 100, and a plurality of heat dissipation units 200 are provided in one-to-one correspondence with the plurality of grooves 110; the heat-conducting fin 230 further includes a plug-in portion 2352, the plug-in portion 2352 is located in the groove 110, the connecting portion 236 is located outside the groove 110 and is connected to the heat-conducting substrate 100, and the electrode 210 is attached to the inner wall of the groove 110.

[0040] In this embodiment, the matching structure of the heat-conducting substrate 100 and the plurality of heat dissipation units 200 is further defined.

[0041] The heat-conducting substrate 100 is provided with a plurality of grooves 110, and each groove 110 cooperates with one heat dissipation unit 200. That is, the plurality of heat dissipation units 200 and the plurality of grooves 110 are in one-to-one cooperation.

[0042] The heat-conducting fin 230 further includes a plug-in portion 2352, the plug-in portion 2352 is located in the groove 110, that is to say, a part of the heat-conducting fin 230 is inserted into the groove 110. This setting increases the cooperation area and cooperation angle between the heat-conducting fin 230 and the heat-conducting substrate 100. The inner wall of the groove 110 has the function of limiting the heat-conducting fin 230, which can ensure the stability and reliability of the assembly of the plurality of heat dissipation units 200 and the heat-conducting substrate 100, and avoid the separation of the heat dissipation unit 200 from the heat-conducting substrate 100. At the same time, this structural setting enables the groove 110 to have the function of effectively aligning the heat-conducting fin 230, which can ensure the cooperation dimensions of the heat-conducting fin 230 and the electrode 210, and provides structural support for the effective electrical connection between the heat-conducting fins 230 and the electrodes 210 of two adjacent heat dissipation units 200 subsequently.

[0043] In addition, the connecting portion 236 is located outside the groove 110 and is connected to the heat-conducting substrate 100, and the electrode 210 is attached to the inner wall of the groove 110. This setting can meet the use requirement that the thermoelectric layer 220 of the heat dissipation unit 200 is connected between the electrode 210 and the heat-conducting fin 230.

[0044] In some embodiments, as Figure 3 shown, the first part 212 of the electrode fits with the inner wall of the groove 110, the second part 214 of the electrode extends out of the groove 110 and overlaps on one side of the heat-conducting substrate 100, and the second part 214 of the electrode is used for electrically connecting with the connecting portion 236 of the adjacent heat dissipation unit 200.

[0045] In this embodiment, the first part 212 of the electrode fits with the inner wall of the groove 110, and the second part 214 of the electrode extends out of the groove 110 and overlaps on one side of the heat-conducting substrate 100. That is, the second part 214 of the electrode is located outside the heat-conducting substrate 100. Among two adjacent heat dissipation units 200, the second part 214 of the electrode of one heat dissipation unit 200 is electrically connected to the connecting portion 236 of the other heat dissipation unit 200.

[0046] It can be understood that the portion of the heat-conducting substrate 100 located between two adjacent grooves 110 is connected to the second portion 214 of the electrode. It can also be said that the first portion 212 of the electrode is located within the groove 110, and the second portion 214 of the electrode is located outside the groove 110. Different heat dissipation units 200 are connected in series as a whole through heat-conducting fins 230 and electrodes 210 to meet the usage requirements of series electrical connection of multiple heat dissipation units 200, and a highly integrated structure in which the thermoelectric layer 220 and the heat-conducting fins 230 are combined into one is achieved.

[0047] The electrodes 210 in different grooves 110 are disconnected from each other.

[0048] A thermoelectric layer 220 is deposited on the surface of the electrode 210 in the groove 110.

[0049] Exemplarily, the shape of the groove 110 is the same as the shape of the insertion portion 2352 of the heat-conducting fin 230, and the shape of the groove 110 is adapted to the shape of the insertion portion 2352 of the heat-conducting fin 230 so that the heat-conducting fin 230 and the groove 110 are firmly assembled together.

[0050] In some embodiments, as Figure 3 and Figure 4 shown, the heat dissipation unit 200 further includes: a first solder layer 240, which is connected between the thermoelectric layer 220 and the insertion portion 2352; a second solder layer 250, which is provided on the side of the second portion 214 of the electrode facing away from the heat-conducting substrate 100, and the connecting portion 236 of each heat dissipation unit 200 and the electrode 210 of the adjacent heat dissipation unit 200 are electrically connected through the second solder layer 250.

[0051] In this embodiment, the structure of the heat dissipation unit 200 is further defined, so that the heat dissipation unit 200 further includes a first solder layer 240 and a second solder layer 250.

[0052] The first solder layer 240 is located between the thermoelectric layer 220 and the insertion portion 2352, and the first solder layer 240 functions to connect the thermoelectric layer 220 and the insertion portion 2352.

[0053] The second solder layer 250 is located on the side of the second portion 214 of the electrode facing away from the heat-conducting substrate 100, and the second solder layer 250 is used to connect to the heat-conducting fin 230 of the adjacent heat dissipation unit 200. That is, in two adjacent heat dissipation units 200, the connecting portion 236 of one heat dissipation unit 200 and the second portion 214 of the electrode of the other heat dissipation unit 200 are electrically connected through the second solder layer 250.

[0054] This setting enables the heat-conducting substrate 100 and multiple heat dissipation units 200 to be effectively and firmly assembled together.

[0055] Exemplarily, a composite first solder layer 240 is deposited on the surface of the thermoelectric layer 220, and a composite second solder layer 250 is deposited on the side of the second portion 214 of the electrode facing away from the heat-conducting substrate 100. At least one of the first solder layer 240 and the second solder layer 250 is formed by physical vapor deposition technology.

[0056] In some embodiments, as Figure 1 , Figure 2 and Figure 3 shown, the heat-conducting fin 230 includes: a fin body 235, a part of the fin body 235 constitutes a plug-in portion 2352, another part of the fin body 235 protrudes from the heat-conducting substrate 100, and a connecting portion 236 is connected to the peripheral side of the heat-conducting fin 230 body.

[0057] In this embodiment, the structure of the heat-conducting fin 230 is further defined.

[0058] The heat-conducting fin 230 includes a fin body 235 and a connecting portion 236, and the connecting portion 236 is connected to the peripheral side of the fin body 235. A part of the fin body 235 constitutes a plug-in portion 2352, and the plug-in portion 2352 is plugged into the groove 110, and another part of the fin body 235 protrudes from the heat-conducting substrate 100.

[0059] It can be understood that after the heat-conducting fin 230 is assembled with the heat-conducting substrate 100, the plug-in portion 2352 of the fin body 235 is inserted into the groove 110 and connected to the thermoelectric layer 220, the connecting portion 236 abuts against the part of the heat-conducting substrate 100 located on the peripheral side of the groove 110, and the connecting portion 236 is electrically connected to the electrode 210 of the adjacent heat dissipation unit 200. The connecting portion 236 has the function of restricting the depth of insertion of the fin body 235 into the groove 110 in the thickness direction of the heat exchange device 10, and can further realize the effective alignment and fixation of the heat-conducting fin 230 and the groove 110. This setting increases the mating area between the heat-conducting fin 230 and the heat-conducting substrate 100, and can ensure the mating dimensions of the heat-conducting fin 230 and the heat-conducting substrate 100.

[0060] In some embodiments, the connecting portion 236 is disposed around the fin body 235.

[0061] In this embodiment, the mating structure of the connecting portion 236 and the fin body 235 is further defined.

[0062] The connecting portion 236 is disposed around the fin body 235. It can be understood that the connecting portion 236 is an annular structure. This setting enables the connecting portion 236 to effectively restrict the depth of insertion of the fin body 235 into the groove 110 from various positions, so as to further increase the mating area between the heat-conducting fin 230 and the heat-conducting substrate 100, and can ensure the mating dimensions of the heat-conducting fin 230 and the heat-conducting substrate 100.

[0063] In some other embodiments, the connecting portion 236 is an arc-shaped structure extending along the circumferential direction of the fin body 235.

[0064] In still other embodiments, the connecting portion 236 includes a plurality of convex portions, and the plurality of convex portions are arranged at intervals along the circumferential direction of the fin body 235.

[0065] In some embodiments, there is a gap between the connecting portion 236 of each heat dissipation unit 200 and the fin body 235 of the adjacent heat dissipation unit 200.

[0066] In this embodiment, the structure of the heat dissipation unit 200 is further defined such that there is a gap between the connecting portion 236 of one heat dissipation unit 200 and the fin body 235 of the other heat dissipation unit 200 among two adjacent heat dissipation units 200. That is to say, among two adjacent heat dissipation units 200, the connecting portion 236 of one heat dissipation unit 200 and the fin body 235 of the other heat dissipation unit 200 are arranged at intervals. This setting can meet the safety regulations requirements. If the heat conduction fins 230 of two adjacent heat dissipation units 200 are in contact, it will cause a short circuit inside the device, which has a safety hazard.

[0067] In some embodiments, as Figure 3 and Figure 4 shown, the heat exchange device 10 further includes: an insulating layer 300, and the insulating layer 300 covers the part of the heat dissipation unit 200 that is exposed outside the heat conduction substrate 100, and the insulating layer 300 also covers the connection portion between the heat conduction substrate 100 and the heat dissipation unit 200.

[0068] In this embodiment, the structure of the heat exchange device 10 is further defined such that the heat exchange device 10 further includes an insulating layer 300. The insulating layer 300 covers the part of the heat dissipation unit 200 that is exposed outside the heat conduction substrate 100, that is, the insulating layer 300 covers the part of the heat dissipation unit 200 that is not blocked by the heat conduction substrate 100. The insulating layer 300 also covers the connection portion between the heat conduction substrate 100 and the heat dissipation unit 200. The insulating layer 300 has the function of protecting the heat conduction substrate 100 and the heat dissipation unit 200, can avoid the oxidation or moisture absorption of the heat dissipation unit 200, provides a structural support for ensuring the effectiveness of the use of the heat exchange device 10, and is also beneficial to extending the service life of the heat exchange device 10.

[0069] In some embodiments, the thermoelectric layer of each heat dissipation unit 200 is a P-type thermoelectric layer or an N-type thermoelectric layer.

[0070] In this embodiment, the structure of the heat dissipation unit 200 is further defined. The thermoelectric layer 220 of any one of the plurality of heat dissipation units 200 is a P-type thermoelectric layer. Alternatively, the thermoelectric layer 220 of any one of the plurality of heat dissipation units 200 is an N-type thermoelectric layer. This setting can further simplify the structure of the heat exchange device 10 and reduce the material input of the heat exchange device 10 while ensuring the performance of the heat exchange device 10, compared with the heat exchange device in the related art, and further reduce the production cost of the product by using a single type of thermoelectric layer 220.

[0071] In some other embodiments of the present application, an electronic device is provided, including: a heat generating device and the heat exchange device 10 as described in any of the above embodiments, and the heat generating device is disposed on a side of the heat conducting substrate 100 away from the heat conducting fins 230.

[0072] Since the electronic device provided by the present application includes the heat exchange device 10 as described in any of the above embodiments, it has all the beneficial effects of the above heat exchange device 10, and will not be elaborated one by one here.

[0073] Among them, the heat generating device is disposed on a side of the heat conducting substrate 100 away from the heat conducting fins 230, so that the heat at the heat conducting fins 230 can be prevented from being transferred to the heat generating device, providing a structural support for ensuring the heat exchange efficiency of the heat exchange device 10.

[0074] Exemplarily, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also referred to as an AR (Augmented Reality) device), a virtual reality device (also referred to as a VR (Virtual Reality) device), an extended reality device (also referred to as an XR (Extended Reality) device), and a handheld game console, etc.

[0075] Exemplarily, the heat exchange device 10 of the present application is a highly integrated thermal management device. The heat exchange device 10 includes a heat conducting substrate 100 and a plurality of heat dissipation units 200. The heat dissipation unit 200 includes a heat conducting fin 230 and a thermoelectric unit 260. The thermoelectric unit 260 includes electrodes 210 and a thermoelectric layer 220. The heat exchange device 10 of the present application introduces the thermoelectric layer 220 and embeds the heat dissipation unit 200 into the heat conducting substrate 100. Compared with the heat exchange device in the related art, this setting omits the second substrate and the third substrate of the thermoelectric refrigeration device, and also omits the interface material connecting the fin radiator and the thermoelectric refrigeration device. It not only simplifies the structure of the heat exchange device 10 and saves space (compared with the heat exchange device in the related art, the thickness of the heat exchange device 10 can be optimized by 20% to 30%), but also eliminates the interface material with the largest thermal resistance of the heat exchange device 10, reduces the internal thermal resistance of the heat exchange device 10, and greatly improves the refrigeration efficiency and transient response ability of the heat exchange device 10.

[0076] Exemplarily, the heat exchange device 10 includes a heat conducting substrate 100 and a plurality of heat dissipation units 200. The heat conducting substrate 100 is provided with a plurality of grooves 110 arranged in an array. The heat conducting substrate 100 includes an aluminum nitride plate, and the thickness of the heat conducting substrate 100 is greater than or equal to 1 mm and less than or equal to 2 mm. The heat dissipation unit 200 includes a heat conducting fin 230. The heat conducting fin 230 is a fin body 235 with a base, and the base is a connecting portion 236. The heat conducting fin 230 includes a metal sheet, and the metal sheet includes an aluminum sheet, a copper alloy sheet or an aluminum alloy sheet.

[0077] Exemplarily, the heat dissipation unit 200 includes electrodes 210, and the electrodes 210 are located in the grooves 110 of the heat conducting substrate 100. The electrodes 210 include a copper-silver mixed electrode. The thickness of the electrodes 210 is greater than or equal to 80 um. For example, the thickness of the electrodes 210 includes 90 um, 95 um, 100 um, 110 um, 120 um, etc., which are not listed one by one here. The electrodes 210 in different grooves 110 are disconnected from each other.

[0078] Exemplarily, a thermoelectric layer 220 is deposited on the surface of the electrodes 210 in the grooves 110 of the heat conducting substrate 100. The thermoelectric layer 220 is a P-type thermoelectric layer, or the thermoelectric layer 220 is an N-type thermoelectric layer. The thickness of the thermoelectric layer 220 is greater than or equal to 30 um and less than or equal to 50 um. The thickness of the thermoelectric layer 220 includes 35 um, 40 um, 45 um, 48 um, etc., which are not listed one by one here. When the thermoelectric layer 220 is a P-type thermoelectric layer, the thermoelectric layer 220 includes a P-type Bi 0.5 Sb 1.5 Te3 film.

[0079] Exemplarily, a first solder layer 240 is deposited on the surfaces of the portion of the electrode 210 located inside the groove 110 and the portion of the electrode 210 located outside the groove 110. The first solder layer 240 is a composite solder layer and is formed by physical vapor deposition. The thickness of the first solder layer 240 is greater than or equal to 30 μm. For example, the thickness of the first solder layer 240 includes 35 μm, 40 μm, 45 μm, 50 μm, 60 μm, etc., which are not listed one by one here. The first solder layer 240 includes an alloy of silver and tin, and the ratio of the two is 1:20.

[0080] Exemplarily, the fin body 235 is a columnar structure. The bottom of the heat-conducting fin 230 is inserted into the groove 110 of the heat-conducting substrate 100. The bottom of the fin body 235 is provided with a connecting portion 236, and the connecting portion 236 is used to fix the fin body 235. The heat-conducting fin 230 is used to connect the electrodes 210 at adjacent two grooves 110. The shape of the groove 110 is consistent with the shape of the root of the heat-conducting fin 230, and the shape can be cylindrical or polygonal.

[0081] Exemplarily, the thermoelectric layer 220 in each groove 110 on the heat-conducting substrate 100 and the heat-conducting fin 230 cooperating therewith form a heat dissipation unit 200. Different heat dissipation units 200 are connected in series as a whole through the heat-conducting fin 230 and the electrodes 210 on the heat-conducting substrate 100, realizing a highly integrated structure in which the thermoelectric device and the radiator are combined into one.

[0082] Exemplarily, in this application, the thermoelectric layer 220 is disposed in the groove 110 of the heat-conducting substrate 100, and a layer of insulating layer 300 is sprayed on the surfaces of the heat-conducting fin 230 and the electrode 210 to complete the encapsulation. In addition, the design of the groove 110 and the connecting portion 236 at the root of the heat-conducting fin 230 also facilitates the alignment and fixation of the heat-conducting fin 230 during the actual processing. During the actual processing, the insertion portion 2352 of the heat-conducting fin 230 is inserted into the groove 110 and heated to complete the fixation. In addition, only a single thermoelectric material can be used for the heat dissipation unit 200 of the heat exchange device 10 in this application, that is, the thermoelectric layer 220 is a P-type thermoelectric layer, or the thermoelectric layer 220 is an N-type thermoelectric layer.

[0083] Exemplarily, the current flows into the P-type thermoelectric layer through the electrode 210, and Peltier cooling is generated at the connection between the electrode 210 and the thermoelectric layer 220, and the cooling is transferred to the heat-generating device through the heat-conducting substrate 100. At the same time, Peltier heat is generated at the interface between the P-type thermoelectric layer and the heat-conducting fin 230, and the heat-conducting fin 230 quickly transfers the heat to the air. The multiple heat dissipation units 200 of this application are connected in series electrically.

[0084] Exemplarily, the junction temperature of the system-on-chip of an electronic device is optimized. In the present application, the structure of the heat exchange device 10 is reasonably set, and the thickness of the heat exchange device 10 is less than or equal to 3 mm. The heat exchange device 10 is combined with the fan in the electronic device and is arranged on the system-on-chip or at the back of the projection area of the system-on-chip. In the present application, the temperature of the system-on-chip can be improved, and its temperature can be reduced by 5°C to 10°C. This can not only significantly improve the thermal stress distribution in the system-on-chip area, but also effectively improve the energy efficiency ratio of the electronic device by reducing the junction temperature.

[0085] Exemplarily, the junction temperature of the system-on-chip of an electronic device is optimized and the lens is defogged. The heat exchange device 10 in the present application is combined with the fan in the electronic device. Not only can the purpose of reducing the junction temperature of the system-on-chip be achieved, but also the heat at the heat conducting fins 230 of the heat exchange device 10 in the present application can be used for heating. For example, the fan transfers the heat to the lens to solve the pain point problem of the lens fogging in a high humidity environment for the user.

[0086] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0087] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat exchange device, characterized in that, Comprising: A heat-conducting substrate; A plurality of heat-dissipating units provided on the heat-conducting substrate, the heat-dissipating units comprising: A heat-conducting fin, the heat-conducting fin comprising a connecting portion; A thermoelectric unit, the thermoelectric unit comprising an electrode and a thermoelectric layer, the electrode being connected to the heat-conducting substrate, and the thermoelectric layer being connected between the electrode and the heat-conducting fin; Wherein, the electrodes of each heat-dissipating unit are electrically connected to the connecting portions of adjacent heat-dissipating units.

2. The heat exchange device according to claim 1, characterized in that A plurality of grooves are provided on the heat-conducting substrate, and the plurality of heat-dissipating units are arranged in one-to-one correspondence with the plurality of grooves; The heat-conducting fin further comprises a plugging portion located within the groove, the connecting portion being located outside the groove and connected to the heat-conducting substrate, and the electrode being attached to the inner wall of the groove.

3. The heat exchange device according to claim 2, wherein A first portion of the electrode is in contact with the inner wall of the groove, a second portion of the electrode extends out of the groove and overlaps on one side of the heat-conducting substrate, and the second portion of the electrode is used for electrically connecting to the connecting portion of an adjacent heat-dissipating unit.

4. The heat exchange device according to claim 3, characterized in that, The heat-dissipating unit further comprises: A first solder layer connecting the thermoelectric layer and the plugging portion; A second solder layer provided on a side of the second portion of the electrode facing away from the heat-conducting substrate, and the connecting portion of each heat-dissipating unit is electrically connected to the electrode of an adjacent heat-dissipating unit through the second solder layer.

5. The heat exchange device according to any one of claims 2 to 4, characterized in that, The heat-conducting fin comprises: A fin body, a part of the fin body constituting the plugging portion, another part of the fin body protruding out of the heat-conducting substrate, and the connecting portion being connected to the periphery of the fin body.

6. The heat exchange device according to claim 5, wherein, The connecting portion surrounds the fin body.

7. The heat exchange device according to claim 5, characterized in that A gap exists between the connecting portion of each heat-dissipating unit and the fin body of an adjacent heat-dissipating unit.

8. The heat exchange device according to any one of claims 1 to 4, characterized in that, Further comprising: An insulating layer covering the part of the heat-dissipating unit exposed outside the heat-conducting substrate, and the insulating layer also covering the connection between the heat-conducting substrate and the heat-dissipating unit.

9. The heat exchange device according to any one of claims 1 to 4, characterized in that, The thermoelectric layer of each heat-dissipating unit is either a P-type thermoelectric layer or an N-type thermoelectric layer.

10. An electronic device, characterized in that, Comprising: A heating device and the heat exchange device according to any one of claims 1 to 9, the heating device being provided on a side of the heat-conducting substrate away from the heat-conducting fin.

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