Inner core, loudspeaker module and electronic equipment

By introducing the enhancement part and the main body into the core of the speaker module, the problem of low frequency sensitivity of the speaker module becomes lowered after the thinning design is solved, and the low frequency sensitivity and linear stroke are improved.

CN120358439APending Publication Date: 2025-07-22HONOR DEVICE CO LTD
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Patent Information

Application Number
CN202410056558.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-01-12
Publication Date
2025-07-22

AI Technical Summary

Technical Problem

In the prior art, the low frequency sensitivity of speaker modules becomes lowered after thinning design.

Method used

In the core of the speaker module, the enhancement part is introduced and the main body part cooperate to form a superimposed magnetic field to enhance the magnetic field strength of the magnetic circuit system acting on the voice coil assembly, and improve the magnetic line density by increasing the magnet size and optimizing the magnet magnetic charging direction.

Benefits of technology

The low-frequency sensitivity and linear stroke of the speaker module are improved, and the ability of the diaphragm assembly to push air is increased, taking into account the mid-frequency and low-frequency performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a kernel, a loudspeaker module and electronic equipment. The inner core comprises a frame, a vibration system and a magnetic circuit system, and the frame is provided with an accommodating space; the vibration system comprises a vibrating diaphragm assembly and a voice coil assembly, at least part of the vibrating diaphragm assembly is arranged in the accommodating space and is connected with the frame, and the voice coil assembly is connected with the inner side surface of the vibrating diaphragm assembly; the magnetic circuit system is located on the inner side of the vibrating diaphragm assembly and is connected with the basin frame; the magnetic circuit system is used for cooperating with the voice coil assembly to drive the diaphragm assembly to vibrate and produce sound. Wherein the magnetic circuit system comprises a main body part and an enhancement part, the main body part is located in a first projection area of the vibration system in the thickness direction, the enhancement part is located outside the first projection area, and the enhancement part is used for being matched with the main body part to form a superimposed magnetic field so as to enhance the intensity of a magnetic field, acting on the voice coil assembly, of the magnetic circuit system. According to the inner core, the loudspeaker module and the electronic equipment provided by the invention, the low-frequency sensitivity can be improved to a certain extent.
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Description

Technical Field

[0001] This application relates to the field of microphones, and particularly to a core, a speaker module, and an electronic device. Background Art

[0002] Currently, electronic devices are getting thinner and thinner, especially folding models, and their thickness has entered the millimeter era. In order to reduce the thickness of electronic devices, the electronic components in the electronic devices also need to be thinned. For example, the speaker module commonly found in electronic devices also needs to be thinned. Among them, the core is the core component of the speaker module, and thinning the core will result in a lower low-frequency sensitivity of the speaker module. Summary of the Invention

[0003] This application provides a core, a speaker module, and an electronic device, which improve the problem that the low-frequency sensitivity of the speaker module becomes lower due to the thinning of the core in the prior art.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] In a first aspect, a core is provided. The core includes a chassis, a vibration system, and a magnetic circuit system. Among them, the chassis has an accommodation space. The vibration system includes a diaphragm assembly and a voice coil assembly. At least part of the diaphragm assembly is disposed in the accommodation space and is connected to the chassis. The voice coil assembly is connected to the inner side surface of the diaphragm assembly. The magnetic circuit system is located inside the diaphragm assembly and is connected to the chassis. The magnetic circuit system is used to cooperate with the voice coil assembly to drive the diaphragm assembly to vibrate and generate sound. The magnetic circuit system includes a main body portion and a reinforcing portion. The main body portion is located within the first projection area of the vibration system in the thickness direction. The reinforcing portion is located outside the first projection area. The reinforcing portion is used to cooperate with the main body portion to form a superimposed magnetic field to enhance the intensity of the magnetic field acting on the voice coil assembly by the magnetic circuit system.

[0006] In the embodiment of the present application, through the setting of the enhancement part, the size of the magnet in the magnetic circuit system can be increased while the thickness of the first magnet in the main body part remains unchanged. At the same time, the superimposed magnetic field formed by the enhancement part and the main body part in this embodiment mainly acts within the above-mentioned magnetic gap. In this way, the density of the magnetic field lines perpendicular to the vibration direction of the voice coil assembly can be increased. Therefore, compared with the magnetic circuit system only provided with the main body part, the intensity of the magnetic field acting on the voice coil assembly by the magnetic circuit system can be enhanced to a certain extent, that is, the magnitude of the Lorentz force acting on the voice coil assembly by the magnetic circuit system is increased, the linear stroke of the core in the speaker module is improved, the ability of the diaphragm assembly to push air is increased, and the low-frequency sensitivity is improved. At the same time, the core provided by the embodiment of the present application can also be understood as reducing the size of the vibration system on the basis of the related technology, that is, reducing the effective radiation area of the speaker module of the core, so that the air stiffness received by the diaphragm assembly during vibration becomes smaller, thereby improving the linear stroke of the core in the speaker module, increasing the ability of the diaphragm assembly to push air, and improving the low-frequency sensitivity, that is, improving the sensitivity of the low frequency. It can be understood that the core provided by the embodiment of the present application is applicable not only to folding machines and ultra-thin speaker module cores, but also to electronic devices or other devices with normal thickness.

[0007] In some embodiments, the magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked along the thickness direction. The first magnetic conductive sheet is located on the side of the first magnet close to the diaphragm assembly. The first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located within the hollow structure, and the outer wall of the second magnetic steel is spaced from the inner wall of the hollow structure, and a magnetic gap for the voice coil assembly to insert and vibrate is formed therebetween. The second projection area of the combination of the first magnetic conductive sheet, the first magnet, and the second magnetic conductive sheet in the thickness direction is larger than the size of the first projection area in at least one direction. The part of the combination located within the first projection area forms the main body part, and the part of the combination located outside the first projection area forms the enhancement part. The magnetic circuit system adopts the structure provided by this embodiment, which is simple in structure and convenient for preparation.

[0008] In some embodiments, the magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked along the thickness direction. The first magnetic conductive sheet is located on the side of the first magnet close to the diaphragm assembly. The second projection area of the assembly composed of the first magnetic conductive sheet, the first magnet, and the second magnetic conductive sheet in the thickness direction is larger than the size of the first projection area in at least one direction. The part of the assembly located within the first projection area forms a main body part, and the part of the assembly located outside the first projection area forms an extension part. The magnetic circuit system further includes a second magnet disposed on the side of the extension part close to the chassis. The second magnet and the extension part are combined to form an enhancement part. By adopting the solution provided in this embodiment, compared with the above solution of not changing the structure of the magnetic circuit system but only enlarging its size, the magnetic circuit system can further enhance the intensity of the magnetic field acting on the voice coil assembly, increase the linear stroke of the core in the speaker module, improve the ability of the diaphragm assembly to push air, and enhance the low-frequency sensitivity.

[0009] In some embodiments, the first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located within the hollow structure, and the outer wall of the second magnetic steel is spaced from the inner wall of the hollow structure, forming a magnetic gap for the voice coil assembly to insert and vibrate therebetween. The magnetization direction of the second magnet is opposite to that of the first magnetic steel. This can result in a relatively large increase in L, thereby achieving a relatively high low-frequency sensitivity.

[0010] In some embodiments, the magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked along the thickness direction. The first magnetic conductive sheet is located on the side of the first magnet close to the diaphragm assembly. Among them, the first magnetic conductive sheet and the first magnet are both located within the first projection area. The first part of the second magnetic conductive sheet is located within the first projection area, and the second part of the second magnetic conductive sheet is located outside the first projection area. The first magnetic conductive sheet, the first magnet, and the first part are combined to form a main body part. The magnetic circuit system further includes a third magnet disposed on the side of the second part close to the chassis. The third magnet and the second part are combined to form an enhancement part. By adopting the solution provided in this embodiment, compared with the above solution of not changing the structure of the magnetic circuit system but only enlarging its size, the thickness and magnetization direction of the third magnet can be set differently from those of the first magnet, further enhancing the intensity of the magnetic field acting on the voice coil assembly, increasing the linear stroke of the core in the speaker module, improving the ability of the diaphragm assembly to push air, and enhancing the low-frequency sensitivity.

[0011] In some embodiments, the first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located inside the hollow structure, and the outer wall of the second magnetic steel is spaced from the inner wall of the hollow structure, forming a magnetic gap for the voice coil assembly to be inserted and vibrate therebetween. The magnetization direction of the third magnet is set at an angle with respect to the magnetization direction of the first magnetic steel. Adopting this solution can, to a certain extent, make the low-frequency sensitivity of the core relatively high.

[0012] In some embodiments, the first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located inside the hollow structure, and the outer wall of the second magnetic steel is spaced from the inner wall of the hollow structure, forming a magnetic gap for the voice coil assembly to be inserted and vibrate therebetween. The magnetization direction of the third magnet is perpendicular to the magnetization direction of the first magnetic steel. Adopting this solution, the setting of the third magnet can significantly increase the magnetic induction line density at the edge of the main body part, thereby increasing its magnetic field strength and improving the low-frequency sensitivity of the core.

[0013] In some embodiments, the thickness of the third magnet is greater than the thickness of the first magnet. Adopting this solution, compared with the case where the thickness of the third magnet is the same as that of the first magnet, or the thickness of the third magnet is less than that of the first magnet, the setting of the third magnet can enhance the magnetic field strength acting on the voice coil assembly by the magnetic circuit system better.

[0014] In some embodiments, the thickness of the third magnet is greater than the sum of the thicknesses of the first magnet and the first magnetic conductive sheet. In this way, compared with the case where the thickness of the third magnet is greater than the thickness of the first magnet but less than the sum of the thicknesses of the first magnet and the first magnetic conductive sheet, the low-frequency sensitivity can be further improved.

[0015] In some embodiments, there are multiple enhancement parts, and the multiple enhancement parts are arranged around the main body part. In this way, the enhancement parts can enhance the magnetic field strength generated by the magnetic circuit system from different directions and improve the low-frequency sensitivity.

[0016] In some embodiments, at least one first avoidance structure is provided on the chassis. The position of the first avoidance structure corresponds to the position of the enhancement part. The first avoidance structure is used for the corresponding enhancement part to be inserted or passed through. In this way, the thickness setting of at least one enhancement part is not restricted by the space between the chassis and the housing, or is less restricted, so that the thickness of the enhancement part is relatively large, so that the magnetic field generated by it is relatively strong, and the enhancement effect on the magnetic field generated by the main body part can be better, which helps to improve the low-frequency sensitivity.

[0017] In some embodiments, the first avoidance structure is a through structure that penetrates the chassis in the thickness direction. In this way, the volume of the enhancement part can be relatively large, the magnetic field generated by it is relatively strong, and the enhancement effect on the magnetic field generated by the main body part can be better, which helps to improve the low-frequency sensitivity.

[0018] In some embodiments, the basin frame includes a plurality of sub - frames which are arranged at intervals, and at least one reinforcing portion is arranged between two adjacent sub - frames. This can enable the thickness setting of at least one reinforcing portion to be unrestricted by the space size between the basin frame and the housing, such that the thickness of the reinforcing portion is relatively large, so that the magnetic field generated by it is relatively strong, and the enhancement effect on the magnetic field generated by the main body portion can be better, which helps to improve the low - frequency sensitivity.

[0019] In some embodiments, at least one reinforcing portion is arranged between any two adjacent sub - frames. This can enable the thickness setting of all the reinforcing portions to be unrestricted by the space size between the basin frame and the housing, such that the thickness of each reinforcing portion is relatively large, so that the magnetic field generated by it is relatively strong, and the enhancement effect on the magnetic field generated by the main body portion can be better, which helps to improve the low - frequency sensitivity.

[0020] In some embodiments, at least one outer surface of the reinforcing portion and the corresponding surface of the basin frame are in the same plane. This can make the appearance of the inner core beautiful.

[0021] In some embodiments, there are two sub - frames, and two reinforcing portions are arranged between the two sub - frames, and the two reinforcing portions are respectively arranged on both sides of the main body portion. This can not only enable the reinforcing portions to enhance the intensity of the magnetic field generated by the magnetic circuit system from different directions, improving the low - frequency sensitivity, but also make the number of reinforcing portions relatively small, facilitating assembly.

[0022] In some embodiments, the basin frame includes a first frame body and a second frame body, and the second frame body is integrally formed with at least part of the first magnetic conductive sheet to form a combined frame, and the first frame body is detachably installed on the second frame body. In this way, at least part of the second frame body and the first magnetic conductive sheet can form one piece, which can be manufactured and installed synchronously, and can improve the assembly rate of the inner core to a certain extent.

[0023] In some embodiments, the combined frame is a stamping part, which is convenient for preparation.

[0024] In some embodiments, the first frame body includes a plurality of sub - parts which are arranged at intervals and are respectively located at the corners of the first frame body. This is convenient for the connection between the second frame body and the vibration system and the installation of the first frame body, and can improve the assembly efficiency of the inner core to a certain extent.

[0025] In some embodiments, there are a plurality of voice coil assemblies which are arranged at intervals. Adopting the solution provided in this embodiment, compared with the solution in which there is one voice coil assembly, the utilization rate of the magnetic field and the Lorentz force generated by the magnetic circuit system can be improved to a certain extent, the driving force of the magnetic circuit system on the vibration system can be increased, and then the linear stroke of the vibration system can be increased, improving the low - frequency sensitivity.

[0026] In some embodiments, the outer contour of the cross-section of the voice coil assembly is a rectangular structure, having a long side portion and a short side portion. The reinforcing portion has a length direction, and the length direction of any one of the reinforcing portions is arranged parallel to the extending direction of the long side portion or the short side portion of the adjacent voice coil assembly. In this way, the size of the reinforcing portion in the length direction can be made larger, so that the volume of the reinforcing portion can be made larger, and further the magnetic field generated by it can be made stronger. It can make the intensity of the superimposed magnetic field formed by its cooperation with the main body portion larger, and the contact area with the voice coil assembly is larger, which helps to improve the low-frequency sensitivity.

[0027] In some embodiments, the first projection area is a rectangular area, and the first direction is the length direction of the rectangular area. In this way, the outer shape of the kernel can be made regular, which is convenient for design and processing.

[0028] In some embodiments, the vibration system further includes a flexible circuit board. The flexible circuit board is located inside the diaphragm assembly and is connected to the chassis. One part of the flexible circuit board is fixedly connected to the voice coil assembly and is electrically connected to the lead of the voice coil assembly, and the other part of the flexible circuit board is used to connect to an external circuit. The flexible circuit board includes two connection ends and a connection portion connecting the two connection ends. The connection ends are located inside the accommodation space, and at least part of the connection portion is located outside the accommodation space. In this way, the size of the accommodation space occupied by the flexible circuit board in the chassis can be reduced, so that the available space for the main body portion becomes larger, and further the volume of the main body portion is larger, which can increase the magnetic field intensity generated by the main body portion to a certain extent and improve the low-frequency sensitivity.

[0029] In some embodiments, more than half of the area of the connection portion is located outside the accommodation space. In this way, most of the connection portion can be located outside the accommodation space, so that the volume of the main body portion is larger, which can increase the magnetic field intensity generated by the main body portion to a certain extent and improve the low-frequency sensitivity.

[0030] In some embodiments, the part of the connection portion located outside the accommodation space is attached to the outer wall of the chassis. In this way, the structure of the assembly formed by the flexible circuit board and the chassis can be made compact, and the occupied space is smaller.

[0031] In some embodiments, the connection end and the part of the connection portion located outside the chassis are perpendicular to each other. In this way, the size of the assembly formed by the flexible circuit board and the chassis can be further reduced, which is convenient for the miniaturization design of the kernel.

[0032] In some embodiments, a second avoidance structure is provided at a position corresponding to the connection end in the magnetic circuit system. The second avoidance structure is used to provide an avoidance space for the connection end to vibrate with the voice coil assembly. By adopting the solution provided in this embodiment, it can be ensured that the magnetic circuit system is arranged such that the part of the flexible circuit board that moves with the voice coil assembly, that is, the connection end, can vibrate normally, and further it will not affect the vibration of the voice coil assembly and the normal sound production of the kernel.

[0033] In some embodiments, a second avoidance structure may be formed between one side of the basin frame facing the magnetic circuit system and the outer wall of the magnetic circuit system. The second avoidance structure is used to provide an avoidance space for the connection end to vibrate with the voice coil assembly. The solution provided in this embodiment can be understood as that the size of the projection area of the magnetic circuit system in the thickness direction is smaller than the size of the projection area corresponding to the outer contour of the projection of the basin frame in the thickness direction, so that a notch structure, that is, the second avoidance structure, can be formed between the inner side surface of the basin frame and the outer wall of the magnetic circuit system. In this way, the part of the flexible circuit board that moves with the voice coil assembly, that is, the connection end, can vibrate normally, and thus the vibration of the voice coil assembly and the normal sound generation of the core will not be affected.

[0034] In a second aspect, a loudspeaker module is provided, including the core provided in any of the above embodiments. The loudspeaker module provided in the embodiments of the present application includes the above core, which can improve the low-frequency sensitivity to a certain extent.

[0035] In a third aspect, an electronic device is provided, including the loudspeaker module provided in any of the above embodiments. The electronic device provided in the embodiments of the present application includes the above loudspeaker module, which can improve the low-frequency sensitivity to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a three-dimensional structural schematic diagram of the electronic device provided in the embodiment of the present application;

[0037] Figure 2 is a partial structural schematic diagram of the electronic device provided in the embodiment of the present application;

[0038] Figure 3 is a front view structural schematic diagram of the loudspeaker module provided in the embodiment of the present application;

[0039] Figure 4 is a cross-sectional structural schematic diagram of the core in the related art;

[0040] Figure 5 is Figure 4 a partial enlarged schematic diagram at A in;

[0041] Figure 6 is a cross-sectional structural schematic diagram of the core provided in the first embodiment of the present application;

[0042] Figure 7 is a three-dimensional structural schematic diagram of the core provided in the second embodiment of the present application;

[0043] Figure 8 is Figure 7 an exploded structural schematic diagram of the core shown;

[0044] Figure 9 is Figure 7Schematic diagram of the front view structure of the kernel shown;

[0045] Figure 10 Is the Figure 9 Schematic diagram of the sectional view structure along the A-A line in;

[0046] Figure 11 Schematic diagram of the three-dimensional structure of the kernel provided in the third embodiment of the present application;

[0047] Figure 12 Is Figure 11 Schematic diagram of the exploded structure of the kernel shown;

[0048] Figure 13 Is Figure 11 Schematic diagram of the front view structure of the kernel shown;

[0049] Figure 14 Is along Figure 13 Schematic diagram of the sectional view structure along the B-B line in;

[0050] Figures 15(a) and 15(b) are schematic diagrams of the comparison of the magnetic induction line density between the kernel provided in the embodiment of the present application and the kernel in the related art;

[0051] Figure 16 Schematic diagram of the comparison of the change of the BL value of the kernel provided in the embodiment of the present application and the kernel in the related art with displacement; in the figure, the blue curve is the curve of the change of the BL value of the kernel provided in the embodiment of the present application with displacement, and the red curve is the curve of the change of the BL value of the kernel in the related art with displacement;

[0052] Figures 17(a), 17(b) and 17(c) are schematic diagrams of the detection result curves of SPL, IMP and DIS of the kernel provided in the embodiment of the present application respectively;

[0053] Figure 18 Schematic diagram of the three-dimensional structure of the kernel provided in another embodiment of the present application;

[0054] Figure 19 Is Figure 18 Schematic diagram of the exploded structure of the kernel shown;

[0055] Figure 20 Is Figure 18 Schematic diagram of the front view structure of the kernel shown;

[0056] Figure 21 Is along Figure 20 Schematic diagram of the sectional view structure along the C-C line in;

[0057] Figure 22 Is Figure 18 Schematic diagram of the structure of the flexible circuit board in the kernel shown;

[0058] Figure 23 For Figure 18 the combined structural schematic diagram of the second frame body, the first magnetic conductive sheet and the flexible circuit board in the kernel shown in the figure.

[0059] Description of the reference numerals in the drawings:

[0060] 10. Support device; 20. Battery; 30. Circuit board assembly; 40. Screen assembly; 50. Speaker module; 51. Housing; 52. Kernel;

[0061] 521. Basin frame; 521a. Accommodating space; 5211. Sub-frame; 5212. First frame body; 5212a. Sub-portion; 5213. Second frame body;

[0062] 523. Vibration system; 5231. Diaphragm assembly; 5232. Flexible circuit board; 5232a. Connection end; 5232b. Connection portion; 5233. Voice coil assembly; 5233a. Long side portion; 5233b. Short side portion;

[0063] 524. Magnetic circuit system; 524a. First magnetic conductive sheet; 524b. First magnet; 524c. Second magnetic conductive sheet; 524c1. First part; 524c2. Second part; 524d. First magnetic steel; 524e. Second magnetic steel; 524f. Magnetic gap; 524g. Second avoidance structure; 5241. Main body portion; 5242. Reinforcing portion; 5242a. Extension portion; 5242b. Second magnet; 5242c. Third magnet;

[0064] X. First direction. Detailed implementation manners

[0065] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation to the present application.

[0066] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0067] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish identical or similar items with basically the same functions and roles. For example, the first limiting portion and the second limiting portion are only used to distinguish different limiting portions, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and the terms "first" and "second" do not necessarily limit being different.

[0068] It should be noted that in the present application, words such as "in one of the embodiments" or "for example" are used to give examples, illustrations or explanations. Any embodiment or design solution described as "in one of the embodiments" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "in one of the embodiments" or "for example" aims to present relevant concepts in a specific manner.

[0069] In the present application, unless otherwise clearly specified and limited, terms such as "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0070] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments.

[0071] With the development of society, electronic devices such as smart watches, mobile phones, and laptop computers are increasingly used in various aspects such as modern life and work communication, and have gradually become one of the necessities of modern people's lives. In order to meet the auditory experience of users, speaker modules are generally provided in electronic devices.

[0072] Currently, electronic devices are getting thinner and thinner, especially folding models, and the thickness has entered the millimeter era. In order to reduce the thickness of electronic devices, the electronic components in the electronic devices also need to be thinned. For example, the speaker modules commonly found in electronic devices also need to be thinned. Among them, the kernel is the core component of the speaker module, and thinning the kernel will cause the low-frequency sensitivity of the speaker module to decrease. Therefore, in the case of overall thinning of the device, designing an ultra-thin speaker module kernel while ensuring its performance is crucial.

[0073] To solve or at least partially solve the above problems, an embodiment of the present application provides a kernel. In this kernel, the magnetic circuit system includes a main body part and an enhancement part. The main body part is located within the first projection area of the vibration system in the thickness direction. The enhancement part is located outside the first projection area. The enhancement part is used to cooperate with the main body part to form a superimposed magnetic field, so as to enhance the intensity of the magnetic field acting on the voice coil assembly by the magnetic circuit system. Through the setting of the enhancement part, in the case where the thickness of the first magnet in the main body part remains unchanged, the size of the magnet in the magnetic circuit system can be increased, and then the density of the magnetic force lines perpendicular to the vibration direction of the voice coil assembly can be increased. Therefore, compared with the magnetic circuit system only having the main body part, the intensity of the magnetic field acting on the voice coil assembly by the magnetic circuit system can be enhanced to a certain extent, that is, the magnitude of the Lorentz force acting on the voice coil assembly by the magnetic circuit system can be increased, the linear stroke of the kernel in the speaker module can be improved, the ability of the diaphragm assembly to push air can be increased, and the low-frequency sensitivity can be improved. At the same time, the kernel provided by the embodiment of the present application can also be understood as reducing the size of the vibration system on the basis of the related technology, that is, reducing the effective radiation area of the speaker module of the kernel, so that the air stiffness received by the diaphragm assembly during vibration becomes smaller, and then the linear stroke of the kernel in the speaker module is improved, the ability of the diaphragm assembly to push air is increased, and the low-frequency sensitivity is improved. It can be understood that the kernel provided by the embodiment of the present application is applicable not only to folding machines and ultra-thin speaker module kernels, but also to electronic devices or other devices with normal thickness.

[0074] The kernel provided by the embodiment of the present application can be used in a speaker module and also in an electronic device having a speaker module. For the convenience of description in the following embodiments, a mobile phone is taken as an example of an electronic device for illustration.

[0075] Such as Figure 1 And Figure 2As shown in the figure, a mobile phone generally includes a support device 10, a battery 20, a circuit board assembly 30, a screen assembly 40, and a speaker module 50. Among them, the support device 10 may include at least one housing. When the support device 10 includes multiple housings, two adjacent housings may be connected by a rotating shaft structure. The screen assembly 40 generally covers one side of the support device 10, or the screen assembly 40 may be provided on both sides of the support device 10, which can be determined according to actual usage needs. When the screen assembly 40 covers one side of the support device 10, a housing is generally installed on the other side of the support device 10. The housing and the screen assembly 40 can enclose a closed space, and the battery 20, the circuit board assembly 30, and the speaker module 50 are all installed in the above-mentioned closed space. The battery 20 provides electrical energy for the circuit board assembly 30. The circuit board assembly 30 may include a main board assembly and a sub-board assembly. The main board assembly and the sub-board assembly generally include a circuit board and electronic components provided on the circuit board. The electronic components may include, but are not limited to, a system on chip (SoC), UFS (abbreviation of UNIX File System), computer-aided manufacturing (CAM), a universal serial bus (USB) interface, a subscriber identity module (SIM) card, an antenna module, a Bluetooth module, a wireless-fidelity (WiFi) module, a global positioning system (GPS) module, a power supply, a charging module, a screen display and operation module, etc. The screen assembly 40 is generally electrically connected to the above-mentioned screen display and operation module so that the screen assembly 40 can realize display or operation functions.

[0076] The speaker module 50 can be electrically connected to the above-mentioned circuit board assembly 30 to obtain audio electrical signals such as music and voice, and can restore the audio electrical signal into sound to support the function of external audio playback. The number of speaker modules 50 can be one or multiple. The more the number of speaker modules 50, the better the external audio performance and the better the sound effect.

[0077] As Figure 3 shown, the speaker module 50 generally includes a housing 51 and a core 52, etc. Among them, the housing 51 is generally provided with a fixing structure, and the fixing structure includes, but is not limited to, through holes, threaded holes, buckles, card slots, limiting steps, etc. Through this fixing structure, the connection between the speaker module 50 and the above-mentioned housing, the circuit board assembly 30, or other structures in the above-mentioned closed space can be realized, so that the speaker module 50 can be fixed in the above-mentioned closed space.

[0078] As Figure 3As shown, the core 52 is the core component in the speaker module 50 and is disposed within the housing 51. As Figure 4 and Figure 5 shown, the core 52 generally includes a chassis 521, a vibration system 523, and a magnetic circuit system 524. Among them, the chassis 521 is used to support the vibration system 523 and fix the magnetic circuit system 524. The material of the chassis 521 includes but is not limited to metal and plastic. The chassis 521 has an accommodation space 521a and can cooperate with the housing 51 to enclose an installation cavity. Both the above-mentioned vibration system 523 and magnetic circuit system 524 can be connected to the chassis 521 and installed within the above-mentioned installation cavity.

[0079] The vibration system 523 can include a diaphragm assembly 5231, a flexible circuit board 5232 (Flexible Printed Circuit, FPC), and a voice coil assembly 5233. All or part of the diaphragm assembly 5231 is disposed within the accommodation space 521a and is connected to the chassis 521. It can be understood that when all of the diaphragm assembly 5231 is located within the above-mentioned accommodation space 521a, it can be that the outer peripheral wall of the diaphragm assembly 5231 is connected to the chassis 521; when part of the diaphragm assembly 5231 is located within the above-mentioned accommodation space 521a, it can be that the edge of the diaphragm assembly 5231 is placed on the chassis 521 and is connected to the chassis 521. The diaphragm assembly 5231 has an outer side and an inner side. The outer side refers to the side of the diaphragm assembly 5231 that is exposed outside the above-mentioned installation cavity after the core 52 is installed on the housing 51, and the inner side is the side opposite to the outer side and is disposed facing the magnetic circuit system 524.

[0080] The voice coil assembly 5233 is located inside the diaphragm assembly 5231, and the voice coil assembly 5233 is connected to the inner side of the diaphragm assembly 5231. Specifically, the diaphragm assembly 5231 generally includes a dome and a diaphragm surrounding the dome, and the voice coil assembly 5233 is generally connected to the dome. The voice coil assembly 5233 can vibrate under the drive of the magnetic circuit system 524 to drive the diaphragm assembly 5231 to vibrate and emit sound.

[0081] The flexible circuit board 5232 is located inside the diaphragm assembly 5231 and is connected to the chassis 521. The inner side of the diaphragm assembly 5231 is the side where the above-mentioned inner side is located and is also the side of the diaphragm assembly 5231 close to the magnetic circuit system 524. One part of the flexible circuit board 5232 is fixedly connected to the voice coil assembly 5233 and is electrically connected to the lead of the voice coil assembly 5233, and the other part of the flexible circuit board 5232 is used to connect to an external circuit to realize the conduction between the voice coil assembly 5233 and the external circuit. Among them, the external circuit can be a circuit connected to the above-mentioned circuit board assembly 30 or a circuit connected to the battery 20.

[0082] The magnetic circuit system 524 is a component for the electro - mechanical conversion of the speaker module 50 and is an essential part in the entire electro - mechanical - acoustic conversion process of the speaker module 50. The design result of the magnetic circuit system 524 will directly affect the quality of the final sound output frequency response of the speaker module 50.

[0083] The magnetic circuit system 524 is located inside the diaphragm assembly 5231 and is connected to the chassis 521. The magnetic circuit system 524 is used to cooperate with the voice coil assembly 5233 to drive the diaphragm assembly 5231 to vibrate and generate sound. The magnetic circuit system 524 generally includes a first magnetic conductive sheet 524a, a first magnet 524b, and a second magnetic conductive sheet 524c stacked in the thickness direction. The first magnetic conductive sheet 524a is located on the side of the first magnet 524b close to the diaphragm assembly 5231, and the second magnetic conductive sheet 524c is located on the side of the first magnet 524b away from the diaphragm assembly 5231.

[0084] Among them, the first magnetic conductive sheet 524a and the second magnetic conductive sheet 524c can both concentrate the magnetic field and are used to fix the first magnet 524b.

[0085] The first magnet 524b includes a first magnetic steel 524d and a second magnetic steel 524e. The first magnetic steel 524d encloses at least one hollow structure. The number of the second magnetic steels 524e is the same as the number of the above - mentioned hollow structures. Any one of the second magnetic steels 524e is located inside one of the hollow structures, and the outer wall of the corresponding second magnetic steel 524e is spaced from the inner wall of the hollow structure, forming a magnetic gap 524f for the voice coil assembly 5233 to insert and vibrate.

[0086] In the related art, the projection area of the vibration system 523 in the thickness direction generally completely covers the projection area of the magnetic circuit system 524 in the thickness direction, that is, the dimension of the vibration system 523 in the length direction is generally equivalent to or larger than the dimension of the magnetic circuit system 524 in the length direction. At the same time, the dimension of the vibration system 523 in the width direction is also equivalent to or larger than the dimension of the magnetic circuit system 524 in the width direction.

[0087] However, with this structure, when the thickness of the electronic device is relatively thin, that is, when the thickness of the speaker module 50 is relatively thin, the thickness of the magnetic circuit system 524 will be relatively thin, the generated magnetic field intensity will be weak, the Lorentz force exerted on the voice coil assembly 5233 will be small, the vibration amplitude of the diaphragm assembly 5231 will be small, the linear stroke of the core 52 of the speaker module will be small, and further its ability to push air will be poor, and the low - frequency sensitivity will be poor.

[0088] To improve the above problems, an embodiment of the present application provides a core 52. As Figure 6As shown in the figure, in the core 52, the magnetic circuit system 524 includes a main body portion 5241 and a reinforcing portion 5242. The main body portion 5241 is located within the first projection area of the vibration system 523 in the thickness direction. The reinforcing portion 5242 is located outside the first projection area. The reinforcing portion 5242 is used to cooperate with the main body portion 5241 to form a superimposed magnetic field, so as to enhance the intensity of the magnetic field of the magnetic circuit system 524 acting on the voice coil assembly 5233.

[0089] It can be understood that the above-mentioned main body portion 5241 can be understood as the entire magnetic circuit system in the related art, and the reinforcing portion 5242 can be understood as a structure capable of generating a magnetic field added outside the original magnetic circuit system. Figure 6 The dotted line box in the figure is an auxiliary line added to help understand the ranges of the main body portion 5241 and the reinforcing portion 5242, and is not a structural line of the core.

[0090] It is known that the performance of the core in the speaker module is affected by the Lorentz force F, where F = BL * I (BL is called the force-electric coupling factor and I is the current). And BL is affected by the size of the magnet in the magnetic circuit system 524. By setting the reinforcing portion 5242, the core provided in the embodiment of the present application can increase the size of the magnet in the magnetic circuit system 524 without changing the thickness of the first magnet in the main body portion 5241. At the same time, the superimposed magnetic field formed by the reinforcing portion 5242 and the main body portion 5241 in this embodiment mainly acts within the above-mentioned magnetic gap 524f. In this way, the density of the magnetic field lines perpendicular to the vibration direction of the voice coil assembly 5233 can be increased. Therefore, compared with the magnetic circuit system 524 only provided with the main body portion 5241, the intensity of the magnetic field of the magnetic circuit system 524 acting on the voice coil assembly 5233 can be enhanced to a certain extent, that is, the magnitude of the Lorentz force of the magnetic circuit system 524 acting on the voice coil assembly 5233 is increased, the linear stroke of the core 52 in the speaker module 50 is increased, the ability of the diaphragm assembly 5231 to push air is increased, and the low-frequency sensitivity is improved. At the same time, the core 52 provided in the embodiment of the present application can also be understood as reducing the size of the vibration system on the basis of the related art, that is, reducing the effective radiation area SD of the core, so that the air stiffness received by the diaphragm assembly 5231 during vibration becomes smaller, thereby increasing the linear stroke of the core 52 in the speaker module 50, increasing the ability of the diaphragm assembly 5231 to push air, and improving the low-frequency sensitivity. It can be understood that the core provided in the embodiment of the present application is applicable not only to the cores of folding machines and ultra-thin speaker modules, but also to normal-thickness electronic devices or other devices.

[0091] The core provided in the embodiment of the present application places as many magnets as possible within the limited core size (including but not limited to the size in the length direction, the size in the width direction and the size in the height direction), and reasonably utilizes the space, which can improve the overall performance of the low-frequency of the speaker module to a certain extent. Among them, the vibration system occupies the middle position of the core, and the side position of the core is left for the reinforcement part, which can improve the BL to a certain extent and further improve the sensitivity of the core full-band. At the same time, by using a small SD and a light voice coil assembly solution, both mid-frequency and low-frequency can be taken into account.

[0092] There are many ways to set the magnetic circuit system 524. For ease of understanding, examples are given below.

[0093] First embodiment:

[0094] like Figure 6 As shown, the structure of the magnetic circuit system 524 is the same as that of the magnetic circuit system 524 in the related art, only the size is increased. That is, the magnetic circuit system 524 includes a first magnetic conductive sheet 524a, a first magnet 524b and a second magnetic conductive sheet 524c stacked in the thickness direction. Among them, the second projection area of the assembly composed of the first magnetic conductive sheet 524a, the first magnet 524b and the second magnetic conductive sheet 524c in the thickness direction has a size greater than the size of the first projection area in at least one direction. For example, when the outer contour of the cross section of the first projection area and the second projection area is a rectangular structure, the length of the second projection area can be greater than the length of the first projection area, the width of the second projection area can be greater than the width of the first projection area, or the length and width of the second projection area can be respectively greater than the length and width of the first projection area. At this time, the part of the assembly located in the first projection area forms the main body 5241, and the part of the assembly located outside the first projection area forms the reinforcement part 5242. The magnetic circuit system 524 adopts the structure provided by this embodiment, which is simple in structure and easy to prepare.

[0095] Second embodiment:

[0096] like Figures 7 to 10 As shown, the magnetic circuit system 524 includes a first magnetic conductive sheet 524a, a first magnet 524b and a second magnetic conductive sheet 524c stacked in a thickness direction. The first magnetic conductive sheet 524a is located on a side of the first magnet 524b close to the diaphragm assembly 5231.

[0097] The second projection area of the assembly consisting of the first magnetic conductive sheet 524a, the first magnet 524b and the second magnetic conductive sheet 524c in the thickness direction has a dimension larger than the size of the first projection area in at least one direction. The portion of the assembly located within the first projection area forms a main body 5241, and the portion of the assembly located outside the first projection area forms an extension portion 5242a.

[0098] The magnetic circuit system 524 further includes a second magnet 5242b disposed on the side of the extension 5242a close to the chassis 521. The second magnet 5242b and the extension 5242a are combined to form a reinforcement portion 5242.

[0099] In this embodiment, the magnetization direction of the second magnet 5242b may be the same as or different from the magnetization direction of any one of the magnetic steels in the first magnet 524b, and specifically, it may be determined according to the use effect.

[0100] The magnetic circuit system 524 adopts the solution provided in this embodiment. Compared with the above solution of only enlarging the size of the magnetic circuit system 524 without changing its structure, it can further enhance the strength of the magnetic field of the magnetic circuit system 524 acting on the voice coil assembly 5233, improve the linear stroke of the core 52 in the speaker module 50, increase the ability of the diaphragm assembly 5231 to push air, and improve the low-frequency sensitivity.

[0101] Since BL is affected not only by the size of the magnet but also by the magnetization direction of the magnet, on the basis of the above embodiment, in order to obtain a higher low-frequency sensitivity, as Figure 10 shown, the magnetization direction of the second magnet 5242b can be set to be opposite to the magnetization direction of the first magnetic steel 524d. It should be noted that Figure 10 the arrows in represent the magnetization direction. By adopting the above magnetization direction, BL can be increased significantly, and thus the low-frequency sensitivity can be higher.

[0102] Third Embodiment:

[0103] As Figures 11 to 14 shown, the magnetic circuit system 524 includes a first magnetic conductive sheet 524a, a first magnet 524b, and a second magnetic conductive sheet 524c stacked in the thickness direction. The first magnetic conductive sheet 524a is located on the side of the first magnet 524b close to the diaphragm assembly 5231.

[0104] Among them, both the first magnetic conductive sheet 524a and the first magnet 524b are located within the first projection area. The first part 524c1 of the second magnetic conductive sheet 524c is located within the first projection area, and the second part 524c2 of the second magnetic conductive sheet 524c is located outside the first projection area. The first magnetic conductive sheet 524a, the first magnet 524b, and the first part 524c1 are combined to form a main body portion 5241.

[0105] The magnetic circuit system 524 further includes a third magnet 5242c disposed on the side of the second part 524c2 close to the chassis 521. The third magnet 5242c and the second part 524c2 are combined to form a reinforcement portion 5242.

[0106] In this embodiment, the magnetization direction of the third magnet 5242c may be the same as or different from the magnetization direction of any magnet steel in the first magnet 524b, and specifically, it may be determined according to the use effect.

[0107] For the magnetic circuit system 524 adopting the solution provided in this embodiment, compared with the solution of only enlarging its size without changing the structure of the magnetic circuit system 524 described above, the thickness and magnetization direction of the third magnet 5242c can be set to be different from the thickness and magnetization direction of the first magnet 524b, further enhancing the intensity of the magnetic field of the magnetic circuit system 524 acting on the voice coil assembly 5233, improving the linear stroke of the core 52 in the speaker module 50, increasing the ability of the diaphragm assembly 5231 to push air, and improving the low-frequency sensitivity.

[0108] On the basis of the above embodiment, in order to have a relatively high low-frequency sensitivity, as Figure 14 shown, the magnetization direction of the third magnet 5242c can be set to form an angle with the magnetization direction of the first magnet steel 524d. The angle mentioned here is a non-zero angle, which can be an acute angle or an obtuse angle, and specifically can be determined according to the sound production effect. It can be understood that Figure 14 the arrows in

[0109] represent the magnetization directions of each magnet steel or magnet. In some embodiments, the magnetization direction of the third magnet 5242c is perpendicular to the magnetization direction of the first magnet steel 524d. As shown in FIG. 15, where (a) in FIG. 15 is a schematic diagram of the magnetic force line distribution of the magnetic circuit system in the related art, and (b) in FIG. 15 is a schematic diagram of the magnetic force line distribution of the magnetic circuit system adopting the embodiment of the present application. Through comparison, it can be seen that when the magnetization direction of the third magnet 5242c is perpendicular to the magnetization direction of the first magnet steel 524d, the setting of the third magnet 5242c can significantly enhance the magnetic induction line density at the edge of the main body and in the above-mentioned magnetic gap 524f, thereby increasing its magnetic field strength and improving the low-frequency sensitivity of the core 52.

[0110] To verify the performance difference between the solution provided in this embodiment and the core in the related art, the performance of the core provided in this embodiment and the core in the related art was tested. The rear cavities of the core provided in this embodiment and the core in the related art selected are both 0.9 CC, as shown in Table 1 below and Figure 16 shown. As shown in Table 1, adopting the solution provided in this embodiment, the sensitivity of the low frequency (500 Hz) can be increased by at least 2.0 dB compared with the core in the related art, and the sensitivity of the middle frequency (2000 Hz) is equivalent to that of the middle frequency of the core in the related art, that is, the core provided in this embodiment can take into account both the middle frequency and the low frequency. As Figure 16 shown, the BL value of the core provided in this embodiment is higher than the BL value of the core in the related art.

[0111] Table 1

[0112] Sensitivity (dB) at 500 Hz Sensitivity (dB) at 2000 Hz Traditional dual voice coil components in the related art 83 94 The solution provided in this embodiment 86.3 93.5

[0113] In addition, to verify the performance of the kernel provided in this embodiment, in addition to the above tests, other performances of the kernel were also tested, as shown in FIGS. 17(a), 17(b), and 17(c). It can be seen from FIGS. 17(a), 17(b), and 17(c) that by adopting the solution provided in this embodiment, the sound pressure level (SPL) of the kernel is about 87 dB(A) at 500 Hz, and can reach about 93.5 dB(A) at 2000 Hz, and the displacement (DIS) is 0.4 mm.

[0114] The thickness d1 of the above-mentioned third magnet 5242c can be set to be the same as the thickness d2 of the first magnet 524b according to the usage requirements, or can be set to be different. When the thickness d1 of the third magnet 5242c is greater than the thickness d2 of the first magnet 524b, compared with the case where the thickness d1 of the third magnet 5242c is the same as the thickness d2 of the first magnet 524b, or the thickness d1 of the third magnet 5242c is less than the thickness d2 of the first magnet 524b, the setting of the third magnet 5242c has a better enhancement effect on the intensity of the magnetic field of the magnetic circuit system 524 acting on the voice coil assembly 5233.

[0115] In some embodiments, the thickness d1 of the third magnet 5242c is greater than the sum d3 of the thicknesses of the first magnet 524b and the first magnetic conductive sheet 524a. In this way, compared with the case where the thickness d1 of the third magnet 5242c is greater than the thickness d2 of the first magnet 524b but less than the sum d3 of the thicknesses of the first magnet 524b and the first magnetic conductive sheet 524a, the low-frequency sensitivity can be further improved.

[0116] One or more of the above-mentioned enhancement parts 5242 can be provided. In some embodiments, a plurality of enhancement parts 5242 are provided, and the plurality of enhancement parts 5242 are arranged around the main body part 5241. In this way, the enhancement parts 5242 can enhance the intensity of the magnetic field generated by the magnetic circuit system 524 from different directions, and improve the low-frequency sensitivity.

[0117] Based on the above embodiments, in order to further increase the volume of the reinforcing portion 5242, in some embodiments, at least one first avoidance structure is provided on the chassis 521. The position of the first avoidance structure corresponds to the position of the reinforcing portion 5242, and the first avoidance structure is used for the corresponding reinforcing portion 5242 to be inserted or passed through. It can be understood that the first avoidance structure can be arranged in various ways, such as a blind hole, a groove, a through hole, etc. When the first avoidance structure is a blind hole, a groove, etc., it can only be used for the corresponding reinforcing portion 5242 to be inserted. When the first avoidance structure is a through hole, it can be used for the corresponding reinforcing portion 5242 to pass through. By adopting the solution provided in this embodiment, the thickness setting of at least one reinforcing portion 5242 is not restricted by the space size between the chassis 521 and the housing 51, or is less restricted, so that the thickness of the reinforcing portion 5242 is larger, and thus the magnetic field generated by it is stronger, which can make the enhancement effect of the magnetic field generated by it on the main body portion 5241 better, and is helpful to improve the low-frequency sensitivity.

[0118] As described above, the first avoidance structure can be a blind hole, a groove, or a through structure that penetrates the chassis 521 in the thickness direction. When the first avoidance structure is a through structure, the volume of the reinforcing portion 5242 can be made larger, and the generated magnetic field is stronger, which can make the enhancement effect of the magnetic field generated by it on the main body portion 5241 better, and is helpful to improve the low-frequency sensitivity. The above through structure can be a through hole, a notch, etc., and can be specifically determined according to the use needs, and is not uniquely limited here.

[0119] As Figures 11 to 14 shown, in some other embodiments, the chassis 521 includes a plurality of sub-chassis 5211, and the plurality of sub-chassis 5211 are arranged at intervals. At least one reinforcing portion 5242 is arranged between two adjacent sub-chassis 5211. In this way, the thickness setting of at least one reinforcing portion 5242 is not restricted by the space size between the chassis 521 and the housing 51, so that the thickness of the reinforcing portion 5242 is larger, and thus the magnetic field generated by it is stronger, which can make the enhancement effect of the magnetic field generated by it on the main body portion 5241 better, and is helpful to improve the low-frequency sensitivity.

[0120] In some embodiments, at least one reinforcing portion 5242 is provided between any two adjacent sub-chassis 5211. In this way, the thickness setting of all the reinforcing portions 5242 is not restricted by the space size between the chassis 521 and the housing 51, so that the thickness of each reinforcing portion 5242 is larger, and thus the magnetic field generated by it is stronger, which can make the enhancement effect of the magnetic field generated by it on the main body portion 5241 better, and is helpful to improve the low-frequency sensitivity.

[0121] In addition, to make the appearance of the core 52 aesthetically pleasing, in some embodiments, at least one outer surface of the reinforcing portion 5242 is coplanar with the corresponding surface of the chassis 521. The corresponding surface of the chassis 521 refers to the surface in the same orientation as the outer surface of the reinforcing portion 5242. For example, the upper surface of the reinforcing portion 5242 can be coplanar with the upper surface of the chassis 521, and the left side surface of the reinforcing portion 5242 can be coplanar with the left side surface of the chassis 521, and so on.

[0122] In some embodiments, there are two sub-chassis 5211. There are two reinforcing portions 5242 between the two sub-chassis 5211, and the two reinforcing portions 5242 are respectively disposed on both sides of the main body portion 5241. This can not only enhance the intensity of the magnetic field generated by the magnetic circuit system 524 from different directions, improving the low-frequency sensitivity, but also reduce the number of the reinforcing portions 5242, facilitating assembly.

[0123] In addition to the solutions provided in the above embodiments, the chassis 521 can also adopt other settings. For example, Figures 18 to 21 As shown, in some embodiments, the chassis 521 includes a first frame body 5212 and a second frame body 5213. The second frame body 5213 and at least part of the first magnetic conductive sheet 524a are integrally formed to form a combined frame, and the first frame body 5212 is detachably mounted on the second frame body 5213. In this embodiment, the first frame body 5212 can be a whole structure or composed of multiple parts, which can be specifically determined according to the installation needs. At least part of the above-mentioned first magnetic conductive sheet 524a can be the part of the first magnetic conductive sheet 524a that contacts the second frame body 5213, such as the part of the first magnetic conductive sheet 524a located on the above-mentioned first magnet 524d. The second frame body 5213 and at least part of the first magnetic conductive sheet 524a can be made by integral forming processes such as stamping process and injection molding process. In this way, at least part of the second frame body 5213 and the first magnetic conductive sheet 524a can form one piece, which can be manufactured and installed synchronously, and can improve the assembly rate of the core 52 to a certain extent.

[0124] In some embodiments, the above-mentioned combined frame is a stamping part, which is convenient for preparation.

[0125] For example, Figure 19 As shown, in some embodiments, the first frame body 5212 includes a plurality of sub-parts 5212a. The plurality of sub-parts 5212a are spaced apart and are respectively located at the corners of the first frame body 5212. This is convenient for the connection between the second frame body 5213 and the vibration system 523, as well as the installation of the first frame body 5212, and can improve the assembly efficiency of the core 52 to a certain extent.

[0126] For example, Figure 12As shown, one or more of the above voice coil assemblies 5233 may be provided. In some embodiments, a plurality of voice coil assemblies 5233 are provided, and the plurality of voice coil assemblies 5233 are arranged at intervals. The plurality of voice coil assemblies 5233 may have various arrangements, such as Figure 12 As shown, the plurality of voice coil assemblies 5233 may be arranged at intervals along the first direction X, and two adjacent voice coil assemblies 5233 may also be arranged vertically, or other included angles may be used. Among them, the first direction X may be the length direction of the diaphragm assembly 5231, the width direction of the diaphragm assembly 5231, or other directions, which may be specifically determined according to the usage requirements. By adopting the solution provided in this embodiment, compared with the solution in which only one voice coil assembly 5233 is provided, the utilization rate of the magnetic field and the Lorentz force generated by the magnetic circuit system 524 can be improved to a certain extent, the driving force of the magnetic circuit system 524 on the vibration system 523 can be increased, and thus the linear stroke of the vibration system 523 can be increased, and the low-frequency sensitivity can be improved.

[0127] In some embodiments, the outer contour of the cross-section of the voice coil assembly 5233 is a rectangular structure, having a long side portion 5233a and a short side portion 5233b. The reinforcing portion 5242 has a length direction, and the length direction of any one of the reinforcing portions 5242 is arranged parallel to the extending direction of the long side portion 5233a or the short side portion 5233b of the adjacent voice coil assembly 5233.

[0128] Such as Figure 12 As shown, the length direction of the reinforcing portion 5242 is arranged parallel to the extending direction of the long side portion 5233a. In other embodiments, the voice coil assembly 5233 may also be rotated by 90 degrees with the position of the reinforcing portion 5242 unchanged, so that the length direction of the reinforcing portion 5242 becomes parallel to the extending direction of the short side portion 5233b; it is also possible that the length directions of some of the reinforcing portions 5242 are arranged parallel to the extending direction of the long side portion 5233a, and the length directions of some other reinforcing portions 5242 are arranged parallel to the extending direction of the short side portion 5233b.

[0129] This can make the size of the reinforcing portion 5242 larger in the length direction, so that the volume of the reinforcing portion 5242 can be larger, and thus the magnetic field generated by it can be stronger, and the intensity of the superimposed magnetic field formed by its cooperation with the main body portion 5241 can be larger, and the contact area with the voice coil assembly 5233 is larger, which helps to improve the low-frequency sensitivity.

[0130] In some embodiments, the first projection area is a rectangular area, and the first direction X is the length direction of the rectangular area. This can make the outer shape of the kernel 52 regular, facilitating design and processing.

[0131] On the basis of the above embodiments, in order to further increase the volume of the main body portion 5241, such as Figure 23 And Figure 22As shown, in some embodiments, the flexible printed circuit board 5232 includes two connection ends 5232a and a connection portion 5232b connecting the two connection ends 5232a. The connection ends 5232a are located within the accommodation space 521a, and at least a part of the connection portion 5232b is located outside the accommodation space 521a. This can reduce the size of the flexible printed circuit board 5232 occupying the accommodation space 521a surrounded by the speaker frame 521, making the available space for the main body portion 5241 larger. As a result, the volume of the main body portion 5241 is relatively large, which can increase the magnetic field strength generated by the main body portion 5241 to a certain extent and improve the sensitivity of low frequencies.

[0132] In some embodiments, more than half of the area of the connection portion 5232b is located outside the accommodation space 521a. This can make most of the connection portion 5232b located outside the accommodation space 521a, making the volume of the main body portion 5241 relatively large, which can increase the magnetic field strength generated by the main body portion 5241 to a certain extent and improve the sensitivity of low frequencies.

[0133] In some embodiments, the part of the connection portion 5232b located outside the accommodation space 521a is attached to the outer wall of the speaker frame 521. This can make the structure of the assembly formed by the FPC and the speaker frame 521 compact and occupy less space.

[0134] In some embodiments, the connection ends 5232a and the part of the connection portion 5232b located outside the speaker frame 521 are perpendicularly arranged. This can further reduce the space occupied by the assembly formed by the FPC and the speaker frame 521, facilitating the miniaturized design of the core 52.

[0135] As Figure 19 shown, in some embodiments, a second avoidance structure 524g is provided at a position corresponding to the connection ends 5232a in the magnetic circuit system 524. The second avoidance structure 524g is used to provide an avoidance space for the connection ends 5232a to vibrate along with the voice coil assembly 5233.

[0136] The second avoidance structure 524g can be a notch, a blind hole, or other structures, which can be determined according to specific usage requirements. By adopting the solution provided in this embodiment, the setting of the magnetic circuit system 524 allows the part of the flexible printed circuit board that moves in conjunction with the voice coil assembly 5233, that is, the connection ends 5232a, to vibrate normally, and thus does not affect the vibration of the voice coil assembly 5233 and the normal sound generation of the core.

[0137] In some embodiments, the second avoidance structure 524g is a notch or a groove penetrating the magnetic circuit system 524. The second avoidance structure 524g adopting the structure provided in this embodiment has a simple structure and is easy to process.

[0138] In some other embodiments, a second avoidance structure 524g may be formed between one side of the chassis 521 facing the magnetic circuit system 524 and the outer wall of the magnetic circuit system 524. The second avoidance structure 524g is used to provide an avoidance space for the connection end 5232a to vibrate along with the voice coil assembly 5233. The solution provided in this embodiment can be understood as that the size of the projection area of the magnetic circuit system 524 in the thickness direction is smaller than the size of the projection area corresponding to the outer contour of the projection of the chassis 521 in the thickness direction, so that a notch structure, that is, the second avoidance structure 524g, can be formed between the inner side surface of the chassis 521 and the outer wall of the magnetic circuit system 524. In this way, the part of the flexible circuit board that moves along with the voice coil assembly 5233, that is, the connection end 5232a, can vibrate normally, and thus will not affect the vibration of the voice coil assembly 5233 and the normal sound production of the core.

[0139] It can be understood that since the outer side surface and the inner side surface of the vibration system should be separated to isolate the air inside and outside the vibration system to ensure the vibration effect of the vibration system and the sound production effect of the speaker module, in each drawing of this application, the gap between the chassis and the reinforcing part is generally sealed by means such as gluing.

[0140] Another embodiment of the present application further provides a speaker module, including the core provided in any of the above embodiments. In addition, it generally also includes the above-mentioned housing. The speaker module provided in the embodiment of the present application, including the above-mentioned core, can improve the low-frequency sensitivity to a certain extent.

[0141] Another embodiment of the present application further provides an electronic device, including the speaker module provided in any of the above embodiments. The electronic device provided in the embodiment of the present application can be a mobile phone, a tablet computer, etc., which can be specifically determined according to the usage needs. The electronic device provided in the embodiment of the present application, including the above-mentioned speaker module, can improve the low-frequency sensitivity to a certain extent.

[0142] Finally, it should be noted that the above are only the specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A kernel, characterized in that, Comprising: A basin frame having an accommodation space; A vibration system including a diaphragm assembly and a voice coil assembly, at least a part of the diaphragm assembly being disposed in the accommodation space and connected to the basin frame, and the voice coil assembly being connected to the inner side surface of the diaphragm assembly; and A magnetic circuit system located inside the diaphragm assembly and connected to the basin frame; the magnetic circuit system is used to cooperate with the voice coil assembly to drive the diaphragm assembly to vibrate and generate sound; Wherein, the magnetic circuit system includes a main body portion and a reinforcing portion, the main body portion is located within a first projection area of the vibration system in the thickness direction, the reinforcing portion is located outside the first projection area, and the reinforcing portion is used to cooperate with the main body portion to form a superimposed magnetic field to enhance the intensity of the magnetic field of the magnetic circuit system acting on the voice coil assembly.

2. The kernel according to claim 1, wherein The magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked in the thickness direction, the first magnetic conductive sheet being located on a side of the first magnet close to the diaphragm assembly, the first magnet including a first magnetic steel and a second magnetic steel, the first magnetic steel enclosing at least one hollow structure, the second magnetic steel being located within the hollow structure, and an outer wall of the second magnetic steel being spaced from an inner wall of the hollow structure, a magnetic gap being formed therebetween for the voice coil assembly to be inserted and vibrate; A second projection area of the assembly composed of the first magnetic conductive sheet, the first magnet, and the second magnetic conductive sheet in the thickness direction has a dimension in at least one direction greater than that of the first projection area, a part of the assembly located within the first projection area forms the main body portion, and a part of the assembly located outside the first projection area forms the reinforcing portion.

3. The kernel according to claim 1, characterized in that, The magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked in the thickness direction, the first magnetic conductive sheet being located on a side of the first magnet close to the diaphragm assembly; A second projection area of the assembly composed of the first magnetic conductive sheet, the first magnet, and the second magnetic conductive sheet in the thickness direction has a dimension in at least one direction greater than that of the first projection area, a part of the assembly located within the first projection area forms the main body portion, and a part of the assembly located outside the first projection area forms an extension portion; The magnetic circuit system further includes a second magnet disposed on a side of the extension portion close to the basin frame, and the second magnet and the extension portion are combined to form the reinforcing portion.

4. The core according to claim 3, characterized in that The first magnet includes a first magnetic steel and a second magnetic steel, the first magnetic steel enclosing at least one hollow structure, the second magnetic steel being located within the hollow structure, and an outer wall of the second magnetic steel being spaced from an inner wall of the hollow structure, a magnetic gap being formed therebetween for the voice coil assembly to be inserted and vibrate, and a magnetization direction of the second magnet is opposite to that of the first magnetic steel.

5. The core according to claim 1, characterized in that, The magnetic circuit system includes a first magnetic conductive sheet, a first magnet, and a second magnetic conductive sheet stacked in the thickness direction, the first magnetic conductive sheet being located on a side of the first magnet close to the diaphragm assembly; Among them, the first magnetic conductive sheet and the first magnet are both located within the first projection area. A first part of the second magnetic conductive sheet is located within the first projection area, and a second part of the second magnetic conductive sheet is located outside the first projection area. The first magnetic conductive sheet, the first magnet, and the first part are combined to form the main body part; The magnetic circuit system further includes a third magnet disposed on a side of the second part close to the chassis. The third magnet and the second part are combined to form the reinforcing part.

6. The core according to claim 5, characterized in that, The first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located within the hollow structure, and an outer wall of the second magnetic steel is spaced apart from an inner wall of the hollow structure, forming a magnetic gap therebetween for the voice coil assembly to be inserted and vibrate. A magnetization direction of the third magnet is disposed at an angle with respect to a magnetization direction of the first magnetic steel.

7. The core according to claim 5, characterized in that, The first magnet includes a first magnetic steel and a second magnetic steel. The first magnetic steel encloses at least one hollow structure. The second magnetic steel is located within the hollow structure, and an outer wall of the second magnetic steel is spaced apart from an inner wall of the hollow structure, forming a magnetic gap therebetween for the voice coil assembly to be inserted and vibrate. A magnetization direction of the third magnet is perpendicular to a magnetization direction of the first magnetic steel.

8. The core according to any one of claims 5-7, characterized in that, The thickness of the third magnet is greater than the thickness of the first magnet.

9. The kernel according to any one of claims 5 to 7, characterized in that, The thickness of the third magnet is greater than the sum of the thicknesses of the first magnet and the first magnetic conductive sheet.

10. The kernel according to any one of claims 1-9, characterized in that, There are multiple reinforcing parts, and the multiple reinforcing parts are arranged around the main body part.

11. The core according to claim 10, characterized in that, At least one first avoidance structure is provided on the chassis. A position of the first avoidance structure corresponds to a position of the reinforcing part, and the first avoidance structure is used for the corresponding reinforcing part to be inserted or passed through.

12. The kernel according to claim 11, wherein The first avoidance structure is a through structure that penetrates the chassis in the thickness direction.

13. The kernel according to claim 10, wherein The chassis includes multiple sub-chassis, and the multiple sub-chassis are spaced apart. At least one reinforcing part is disposed between two adjacent sub-chassis.

14. The core according to claim 13, characterized in that, There is at least one reinforcing part between any two adjacent sub-chassis.

15. The core according to claim 13 or 14, characterized in that, At least one outer surface of the reinforcing part and a corresponding surface of the chassis are in the same plane.

16. The kernel according to any one of claims 13 - 15, characterized in that, There are two sub-chassis, and there are two reinforcing parts between the two sub-chassis. The two reinforcing parts are respectively disposed on two sides of the main body part.

17. The kernel according to any one of claims 2-9, characterized in that, The chassis includes a first frame body and a second frame body. The second frame body and at least a part of the first magnetic conductive sheet are integrally formed to form a combined frame, and the first frame body is detachably mounted on the second frame body.

18. The core according to claim 17, characterized in that, The combined frame is a stamping part.

19. The kernel according to claim 17 or 18, characterized in that, The first frame body includes multiple sub-parts, and the multiple sub-parts are spaced apart and are respectively located at corners of the first frame body.

20. The core according to any one of claims 1-19, characterized in that, There are multiple voice coil assemblies, and the multiple voice coil assemblies are spaced apart.

21. The core according to claim 20, characterized in that, An outer contour of a cross-section of the voice coil assembly is a rectangular structure, having a long side part and a short side part. The reinforcing part has a length direction, and the length direction of any one of the reinforcing parts is arranged parallel to an extending direction of a long side part or a short side part of an adjacent voice coil assembly.

22. The core according to claim 20 or 21, characterized in that, The first projection area is a rectangular area, and the first direction is a length direction of the rectangular area.

23. The kernel according to any one of claims 1-22, characterized in that, The vibration system further includes a flexible circuit board, which is located inside the diaphragm assembly and connected to the chassis. A part of the flexible circuit board is fixedly connected to the voice coil assembly and electrically connected to the lead of the voice coil assembly, and another part of the flexible circuit board is used for connecting to an external circuit; The flexible circuit board includes two connection ends and a connection part connecting the two connection ends. The connection ends are located inside the accommodation space, and at least part of the connection part is located outside the accommodation space.

24. The core according to claim 23, characterized in that, More than half of the area of the connection part is located outside the accommodation space.

25. The core according to claim 23 or 24, characterized in that The part of the connection part located outside the accommodation space is arranged in close fit with the outer wall of the chassis.

26. The kernel according to any one of claims 23-25, characterized in that, The connection ends and the part of the connection part located outside the chassis are vertically arranged.

27. The core according to any one of claims 23-26, characterized in that, A second avoidance structure is arranged at a position corresponding to the connection ends in the magnetic circuit system, and the second avoidance structure is used to provide an avoidance space for the connection ends to vibrate with the voice coil assembly; Alternatively, a second avoidance structure can be formed between one side of the chassis facing the magnetic circuit system and the outer wall of the magnetic circuit system, and the second avoidance structure is used to provide an avoidance space for the connection ends to vibrate with the voice coil assembly.

28. A speaker module, characterized in that, Including the kernel according to any one of claims 1-27.

29. An electronic device, characterized in that, Including the speaker module according to claim 28.