MEMS controller and MEMS device

Abstract

The invention relates to the field of control devices, and provides an MEMS controller and an MEMS device. The MEMS controller comprises at least one control unit and a packaging structure, the control unit comprises two anchoring structures which are spaced from each other and a vibrating diaphragm, each anchoring structure is provided with a bottom surface and a top surface which are opposite to each other, the vibrating diaphragm covers the top surfaces of the two anchoring structures, and the resonant frequency of the vibrating diaphragm is equal to the working frequency (greater than 20KHz) of the MEMS controller; the packaging structure comprises a bottom plate, a side plate and a top plate which are connected in sequence, and the bottom plate, the side plate and the top plate jointly define a cavity for accommodating the control unit; the top plate is opposite to the top surface of the vibrating diaphragm at an interval, and a first flow channel opening penetrating through the top plate is formed in the top plate and directly faces the vibrating diaphragm; the bottom plate is located on the bottom surfaces of the two anchoring structures, and a second flow channel opening which penetrates through the bottom plate and is staggered with the control unit is formed in the bottom plate; the first flow channel opening is communicated with the second flow channel opening so as to control fluid to flow in one direction.

Description

Technical Field

[0001] The present invention relates to the technical field of control devices, and particularly to a MEMS controller and a MEMS device.

Background Art

[0002] MEMS (Micro-Electro-Mechanical System, also known as microelectronic mechanical system or microsystem) refers to high-tech devices with dimensions in millimeters or even smaller, and their internal structures are generally in the micrometer or even nanometer scale. MEMS is an independent intelligent system developed based on microelectronic technology (semiconductor manufacturing technology), integrating technologies such as lithography, etching, thin film, LIGA (German for Lithographie, Galvanoformung and Abformung, translated as: lithography, electroforming and injection molding), silicon microfabrication, non-silicon microfabrication and precision machining.

[0003] MEMS technology is widely used in various fields, including but not limited to: consumer electronics products such as micro speakers, MEMS microphones, etc. These products have been widely used in devices such as laptops and smart phones due to their advantages of small size, low power consumption and mass production.

[0004] Therefore, it is necessary to provide a MEMS controller and a MEMS device to control the unidirectional flow of fluid.

Summary of the Invention

[0005] The purpose of the present invention is to provide a MEMS controller and a MEMS device, which can at least control the unidirectional flow of fluid.

[0006] The technical solution of the present invention is as follows: A MEMS controller includes: at least one control unit and a packaging structure;

[0007] The control unit includes: two anchoring structures arranged at intervals, the anchoring structure having opposite bottom and top surfaces; a diaphragm covering the top surfaces of the two anchoring structures;

[0008] The packaging structure includes a bottom plate, a side plate and a top plate connected in sequence, the bottom plate facing the top plate, and the side plate connecting the bottom plate and the top plate. The bottom plate, the side plate and the top plate jointly enclose a cavity for accommodating the control unit;

[0009] The top plate is spaced opposite to the top surface of the diaphragm, and a first fluid passage opening penetrating the top plate is provided on the top plate, and the first fluid passage opening faces the diaphragm; the bottom plate is located at the bottom surface of the two anchoring structures, and a second fluid passage opening penetrating the bottom plate and arranged in a staggered manner with the control unit is provided on the bottom plate; the first fluid passage opening and the second fluid passage opening are communicated with each other to allow fluid to flow in from the first fluid passage opening and flow out from the second fluid passage opening or flow in from the second fluid passage opening and flow out from the first fluid passage opening. The resonant frequency of the diaphragm is equal to the operating frequency of the MEMS controller, and the resonant frequency of the diaphragm is greater than 20KHz.

[0010] According to some embodiments of the present invention, the fluid flow rate through the first fluid passage opening and the second fluid passage opening is not less than 20m / s.

[0011] According to some embodiments of the present invention, the distance L1 between the center of the first fluid passage opening and the side end of the diaphragm in the same control unit is a multiple of one-fourth of the wavelength of the sound wave with the operating frequency of the MEMS controller in the fluid, and the side end of the diaphragm is the side end close to the second fluid passage opening.

[0012] According to some embodiments of the present invention, the height H1 of the anchoring structure is a multiple of one-fourth of the wavelength of the sound wave with the operating frequency of the MEMS controller in the fluid.

[0013] According to some embodiments of the present invention, the number of the control units can be greater than or equal to 2.

[0014] According to some embodiments of the present invention, when the MEMS controller realizes heat dissipation, the central displacement of the diaphragm satisfies: d = d1sin(2πf0t), where d represents the central displacement of the diaphragm, d1 represents the amplitude of vibration of the diaphragm, and f0 represents the operating frequency of the MEMS controller.

[0015] According to some embodiments of the present invention, when the MEMS controller realizes sound amplification, the central displacement of the diaphragm satisfies: d s = d1sin(2πf0t)sin(2πf a t), where d s represents the central displacement of the diaphragm, d1 represents the amplitude of vibration of the diaphragm, f0 represents the operating frequency of the MEMS controller, and f a represents the audible sound frequency.

[0016] According to some embodiments of the present invention, on the other hand, an embodiment of the present invention further provides a MEMS device including the MEMS controller described above.

[0017] The beneficial effects of the present invention are as follows: The diaphragm in the MEMS controller vibrates, sucking in fluid from one of the first fluid ports or the second fluid ports and flowing out through the other of the first fluid ports or the second fluid ports to complete the one-way flow control of the fluid.

Description of the Drawings

[0018] Figure 1 Schematic structural diagram of a MEMS controller according to an embodiment of the present invention;

[0019] Figure 2 Schematic diagram of the working state of a MEMS controller according to an embodiment of the present invention;

[0020] Figure 3 Schematic diagram of the first direction of fluid flow in the MEMS controller according to an embodiment of the present invention;

[0021] Figure 4 Schematic diagram of the second direction of fluid flow in the MEMS controller according to an embodiment of the present invention;

[0022] Figure 5 Schematic structural diagram of a MEMS controller according to another embodiment of the present invention;

[0023] Figure 6 Schematic structural diagram of a MEMS controller according to another embodiment of the present invention;

[0024] Figure 7 Curve graph of the relationship between the first distance L1 and the net flow rate per unit chip area in a MEMS controller according to an embodiment of the present invention;

[0025] Figure 8 Curve graph of the relationship between the height H1 of an anchoring structure and the net flow rate per unit chip volume in a MEMS controller according to an embodiment of the present invention;

[0026] Figure 9 Schematic structural diagram of a MEMS controller according to an embodiment of the present invention when used for heat dissipation, with the first fluid port as the fluid inlet and the second fluid port as the fluid outlet;

[0027] Figure 10 Schematic structural diagram of a MEMS controller according to an embodiment of the present invention when used for heat dissipation, with the second fluid port as the fluid inlet and the first fluid port as the fluid outlet;

[0028] Figure 11 Time-domain diagram of the central displacement of the diaphragm;

[0029] Figure 12 Time-domain diagram of the flow rate of the first fluid port;

[0030] Figure 13Schematic diagram of the structure where the second fluid outlet serves as the sound outlet when the MEMS controller according to an embodiment of the present invention is used for sound production;

[0031] Figure 14 Schematic diagram of the structure where the first fluid outlet serves as the sound outlet when the MEMS controller according to an embodiment of the present invention is used for sound production;

[0032] Figure 15 Spectrum diagram of ultrasonic waves generated by the vibration of the diaphragm in the sound channel;

[0033] Figure 16 Schematic diagram of the simulation structure during the sound production process;

[0034] Figure 17 Sound pressure spectrum diagram at the sound outlet.

Detailed implementation manners

[0035] The present invention will be further described below in conjunction with the accompanying drawings and implementation manners.

[0036] Figure 1 Schematic diagram of the structure of a MEMS controller according to an embodiment of the present invention, Figure 2 Schematic diagram of the working state of a MEMS controller according to an embodiment of the present invention. The MEMS controller 100 can drive the unidirectional flow of fluid. The present invention does not limit the fluid, and the fluid can be liquid, gas, sound wave, etc. Please refer to Figure 1 and Figure 2 , the MEMS controller 100 includes: at least one control unit 10 and a packaging structure 20.

[0037] Among them, the control unit 10 includes: two anchoring structures 11 arranged at intervals and a diaphragm 12. The anchoring structure 11 has opposite bottom surfaces 111 and top surfaces 112, and the diaphragm 12 covers the top surfaces 112 of the two anchoring structures 11.

[0038] The resonance frequency of the diaphragm 12 is equal to the working frequency of the MEMS controller 100. For example, the length and height of the diaphragm 12 can be adjusted so that the resonance frequency of the diaphragm 12 is equal to the working frequency of the MEMS controller 100, so that the system is in a resonance state, the energy transfer efficiency is maximized, the driving force requirement is reduced, and thus the power consumption is reduced. The resonance frequency of the diaphragm 12 is greater than 20KHz. This frequency is within the range of acoustic ultrasonic frequencies, and it can reduce the interference of working noise on the environment.

[0039] Please refer to Figure 1 , the packaging structure 20 includes a bottom plate 21, side plates 22 and a top plate 23 connected in sequence. The bottom plate 21 and the top plate 23 face each other, and the side plates 22 connect the bottom plate 21 and the top plate 13. The bottom plate 21, the side plates 22 and the top plate 23 jointly enclose a cavity 24 for accommodating the control unit 10.

[0040] Among them, the top plate 23 is spaced opposite to the top surface 121 of the diaphragm 12, and a first fluid passage opening 230 penetrating through the top plate 23 is provided on the top plate 23, and the first fluid passage opening 230 is directly opposite to the diaphragm 12; the bottom plate 21 is located at the bottom surface 111 of the two anchoring structures 11, and a second fluid passage opening 210 penetrating through the bottom plate 21 and arranged staggeredly with the control unit 10 is provided on the bottom plate 21; the first fluid passage opening 230 and the second fluid passage opening 210 are communicated with each other to supply fluid to flow in from the first fluid passage opening 230 and flow out from the second fluid passage opening 210, or flow in from the second fluid passage opening 210 and flow out from the first fluid passage opening 230, so as to realize the control of the unidirectional flow of the fluid.

[0041] As Figure 2 shown, the anchoring structure 11 in the MEMS controller 100 of the embodiment of the present invention provides a driving signal to drive the diaphragm 12 to vibrate, and further drives the fluid to flow, so as to suck the fluid from one of the first fluid passage opening 230 or the second fluid passage opening 210, and flow out through the other of the first fluid passage opening 230 or the second fluid passage opening 210, completing the control of the unidirectional flow of the fluid, as Figure 3 and Figure 4 shown. Among them, the fluid flow rate through the first fluid passage opening 230 and the second fluid passage opening 210 is not less than 20 m / s. The shape of the diaphragm 12 can be regular or irregular. For example, the cross-sectional shape of the diaphragm 12 can be rectangular, circular, hexagonal, etc., and the shape of the diaphragm 12 is not specifically limited herein.

[0042] In some embodiments, as Figures 2 - 4 shown, the second fluid passage opening 210 is arranged staggeredly with the control unit 10 and forms a gap 13 through which the fluid can pass. The first fluid passage opening 230 is staggered from the gap 13 in the same control unit 10, and the second fluid passage opening 210 is directly opposite to the gap 13 in the same control unit 10, which can reduce the loss and noise of the fluid flowing through the gap 13 to the second fluid passage opening 210 or flowing from the second fluid passage opening 210 to the gap 13 during the flow process, thereby improving the performance of the MEMS controller 100.

[0043] The number of the control units 10 can be greater than or equal to 2, and the following will be described in detail in combination with the arrangement manner of the control units 10.

[0044] Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of a MEMS controller according to another embodiment of the present invention. In this MEMS controller 100, a plurality of control units 10 are arranged at intervals along the extending direction of the bottom plate 21 or the top plate 23 of the packaging structure 20.

[0045] Please refer to Figure 5, taking four control units 10 as an example for illustration. The four control units 10 are arranged at intervals within the encapsulation structure 20. Among them, one side of the first control unit 101 at the first position is in contact with the side plate 22 of the encapsulation structure 20. The first control unit 101 and the second control unit 102 are arranged at intervals, the second control unit 102 and the third control unit 103 are arranged at intervals, the third control unit 103 and the fourth control unit 104 are arranged at intervals, and the fourth control unit 104 and the other side plate 22 of the encapsulation structure 20 are arranged at intervals. In this embodiment, the first fluid port 230 and the second fluid port 210 respectively correspond to the control unit 10. The second fluid port 210 is arranged staggeredly with the corresponding control unit 10 and forms a gap 13 through which the fluid can pass, and the gap 13 of the second fluid port 210 is directly opposite to the same control unit 10.

[0046] In some embodiments, please refer to Figure 6 , Figure 6 is a schematic structural diagram of a MEMS controller according to another embodiment of the present invention. In this MEMS controller 100, a plurality of control units 10 are arranged in sequence along the extension direction of the bottom plate 21 or the top plate 23 of the encapsulation structure 20, and the sides of at least two adjacent control units 10 are in contact with each other.

[0047] Please refer to Figure 6 , taking four control units 10 as an example for illustration. The four control units 10 are arranged in sequence within the encapsulation structure 20. Among them, one side of the first control unit 101 at the first position is in contact with the side plate 22 of the encapsulation structure 20. The first control unit 101 and the second control unit 102 are arranged at intervals. The second fluid port 210 is arranged staggeredly with the first control unit 101 and forms a gap 13 through which the fluid can pass. The sides of the second control unit 102 and the third control unit 103 are in contact with each other. The third control unit 103 and the fourth control unit 104 are arranged at intervals. The second fluid port 210 is arranged staggeredly with the third control unit 103 and forms a gap 13 through which the fluid can pass. The side of the fourth control unit 104 is in contact with the other side plate 22. In this embodiment, the first fluid port 230 corresponds to the control unit 10, the second fluid port 210 corresponds to the gap 13, and the number of gaps 13 is less than the number of control units 10.

[0048] In some embodiments, as Figure 1 shown, the distance L1 between the center of the first fluid port 230 and the side end 122 of the vibration membrane 12 within the same control unit 10 is a multiple of one-fourth of the wavelength of the sound wave of the operating frequency of the MEMS controller 100 in the fluid. The side end 122 of the vibration membrane 12 is the side end close to the second fluid port 210. Further, the distance L1 between the center of the first fluid port 230 and the side end 122 of the vibration membrane 12 within the same control unit 10 is 100 μm to 5000 μm.

[0049] Define the distance between the center of the first fluid port 230 and the side end of the diaphragm 12 within the same control unit 10 as the first distance L1. Please refer to Figure 7 , Figure 7 is a graph showing the relationship between the first distance L1 and the net flow rate per unit chip area in an embodiment of the present invention. Here, the net flow rate per unit chip area refers to: the total fluid flow rate output by the MEMS controller 100 per unit time divided by the planar area of the MEMS controller 100. For the MEMS controller 100, the first distance L1 is positively correlated with the net flow rate of the fluid driven by the MEMS controller 100. That is to say, the longer the first distance L1, the greater the net flow rate of the fluid that the MEMS controller 100 can pass through. However, if the first distance L1 is too long, the size of the entire MEMS controller 100 will be too large, which is not conducive to miniaturization; while if the first distance L1 is too small, it will increase the process difficulty of forming the MEMS controller 100. Moreover, within a certain range of the first distance L1, the relationship between the first distance L1 and the net flow rate per unit chip area follows a normal distribution. Therefore, while improving the performance of the MEMS controller 100, considering the process difficulty of forming the MEMS controller 100, the first distance L1 is set to 100 μm to 5000 μm.

[0050] In some embodiments, please refer to Figure 1 and Figure 2 , the anchoring structure 11 can be used to support the diaphragm 12. The top surfaces 112 of the two anchoring structures 11 are respectively fixedly connected to both ends of the diaphragm 12. The driving signal can be provided to the diaphragm 12 through the anchoring structure 11. For example, when the MEMS controller 100 needs to work, the driving signal can be provided to the diaphragm 12 through the anchoring structure 11 to drive the diaphragm 12 to vibrate.

[0051] The ways for the anchoring structure 11 to drive the diaphragm 12 can include: piezoelectric drive, electrostatic drive, thermoelectric drive, electromagnetic drive, etc. Taking piezoelectric drive as an example, using the inverse piezoelectric effect of piezoelectric materials, electrical energy is converted into mechanical energy to drive the diaphragm 12 to vibrate.

[0052] In some embodiments, the anchoring structure 11 can be the substrate layer of an SOI (Silicon-On-Insulator) chip.

[0053] In some embodiments, the height H1 of the anchoring structure 11 is a multiple of one - quarter of the wavelength of the acoustic wave at the operating frequency of the MEMS controller 100 in the fluid. Further, the height H1 of the anchoring structure 11 is 100 μm to 5000 μm, for example, 300 μm, 500 μm, 1000 μm, 1800 μm, 2500 μm, 3000 μm, 4000 μm, or 4800 μm, etc.

[0054] Please refer to Figure 8 , Figure 8 is a graph showing the relationship between the height H1 of the anchoring structure and the net flow rate per unit chip volume in an embodiment of the present invention. Here, the net flow rate per unit chip volume refers to: the total fluid flow rate output by the MEMS controller 100 per unit time divided by the volume of the MEMS controller 100. For the anchoring structure 11, the height H1 of the anchoring structure 11 is positively correlated with the net flow rate of the fluid driven by the MEMS controller 100. That is to say, the larger the height H1 of the anchoring structure 11, the larger the net flow rate of the fluid that the MEMS controller 100 can pass through. However, the larger the height H1 of the anchoring structure 11, the larger the size of the entire MEMS controller 100. Moreover, the larger the height H1 of the anchoring structure 11, the lower the net flow rate per unit chip volume, resulting in a waste of the performance of the anchoring structure 11; the smaller the height H1 of the anchoring structure 11, although the net flow rate of the fluid that the MEMS controller 100 can pass through will decrease, the net flow rate per unit chip volume will increase, that is to say, the performance utilization rate of the anchoring structure 11 will increase. Similarly, as the height H1 of the anchoring structure 11 decreases, the manufacturing process difficulty of the MEMS controller 100 will increase. Therefore, while increasing the net flow rate per unit chip volume, considering the manufacturing process difficulty of the MEMS controller 100, the height H1 of the anchoring structure 11 is set to 100 μm to 5000 μm.

[0055] In some embodiments, the packaging structure 20 can be used to protect the control unit 10, can be used to lead out signals, or transmit control signals to the control unit 10, thereby completing signal transmission. The packaging structure 20 can also be used to construct fluid flow channels, for example, construct gas flow channels to control the gas to enter from the first flow port 230 and exit from the second flow port 210, or control the gas to enter from the second flow port 210 and exit from the first flow port 230.

[0056] In some embodiments, the packaging structure 20 can be a metal plate or a PCB, etc.

[0057] The MEMS controller 100 of the embodiments of the present invention can not only be used to achieve heat dissipation (such as a MEMS radiator), but also be used to achieve sound amplification (such as a MEMS speaker).

[0058] In some embodiments, please refer to Figure 9 When the MEMS controller 100 is used for heat dissipation, the driving signal generated by the anchoring structure 11 controls the vibration of the diaphragm 12. The cold fluid flows in from the first flow port 230, passes through the gap 13, and flows out through the second flow port 210. The second flow port 210 can be directly opposite to the heat-generating structure 30 that needs to be cooled, so that the cold fluid flowing out of the second flow port 210 reaches the surface of the heat-generating structure 30 to dissipate heat from the heat-generating structure 30.

[0059] In some embodiments, please refer to Figure 10 When the MEMS controller 100 is used for heat dissipation, the driving signal generated by the anchoring structure 11 controls the vibration of the diaphragm 12. The cold fluid flows in from the second flow port 210, passes through the gap 13, and flows out through the first flow port 230. The first flow port 230 can be directly opposite to the heat-generating structure 30 that needs to be cooled, so that the cold fluid flowing out of the first flow port 230 reaches the surface of the heat-generating structure 30 to dissipate heat from the heat-generating structure 30.

[0060] In some embodiments, please refer to Figure 11 Figure 11 is the time-domain diagram of the displacement of the diaphragm center, and the initial displacement is 0. When the MEMS controller 100 is used for heat dissipation, the center displacement of the diaphragm 12 satisfies: d = d1sin(2πf0t), where d represents the center displacement of the diaphragm 12, d1 represents the amplitude of the vibration of the diaphragm 12, and f0 represents the operating frequency of the MEMS controller 100.

[0061] Refer to Figure 12 When the fluid flows in from the first flow port 230 and flows out through the second flow port 210, if the initial displacement of the diaphragm 12 is 0, the time-domain diagram of the flow rate of the first flow port 230 is as shown in Figure 12 a; if the initial displacement of the diaphragm 12 is not 0, the time-domain diagram of the flow rate of the first flow port 230 is as shown in Figure 12 b. When the fluid flows in from the second flow port 210 and flows out through the first flow port 230, if the initial displacement of the diaphragm 12 is 0, the time-domain diagram of the flow rate of the first flow port 230 is as shown in Figure 12 c; if the initial displacement of the diaphragm 12 is not 0, the time-domain diagram of the flow rate of the first flow port 230 is as shown in Figure 12 d.

[0062] In some embodiments, please refer to Figure 13 When the MEMS controller 100 is used for sound amplification, the driving signal generated by the anchoring structure 11 controls the vibration of the diaphragm 12 to control the sound to flow out from the second flow port 210.

[0063] In some embodiments, please refer to Figure 14, when the MEMS controller 100 is used for sound reproduction, the driving signal generated by the anchoring structure 11 controls the vibration of the diaphragm 12, and controls the sound to flow out from the first flow port 230.

[0064] In some embodiments, when the MEMS controller 100 is used for sound reproduction, the central displacement of the diaphragm 12 satisfies: d s = d1sin(2πf0t)sin(2πf a t), where d s represents the central displacement of the diaphragm 12, d1 represents the amplitude of the vibration of the diaphragm 12, f0 represents the operating frequency of the MEMS controller 100, and f a represents the audible sound frequency. The vibration of the diaphragm 12 generates ultrasonic waves in the sound channel, and the spectrum signal is as Figure 15 shown. The ultrasonic sound pressure satisfies: u s = u1sin(2πf0t)sin(2πf a t), where u s is the ultrasonic sound pressure, u1 is the amplitude of the sound pressure, f0 represents the operating frequency of the MEMS controller 100 (greater than 20KHz), and f a represents the audible sound frequency (less than 20KHz). The MEMS controller 100 according to the embodiment of the present invention can acoustically demodulate the above-mentioned sound pressure u s , that is, amplitude modulation, and the amplitude modulation satisfies: u mod = u2sin(2πf0t), where u mod is the amplitude modulation, u2 is the amplitude of the sound pressure, and f0 represents the operating frequency of the MEMS controller 100. When the ultrasonic sound pressure u s is amplitude modulated by the sound channel to output the sound pressure, as Figure 16 shown, the output sound pressure satisfies: u out = u s × u mod = u1sin(2πf0t)sin(2πf a t) × u2sin(2πf0t), to obtain the audible sound frequency f a , and the output sound pressure spectrum diagram is as Figure 17 shown.

[0065] The MEMS controller 100 provided by the present invention can demodulate the sound when used for sound reproduction, so as to convert the ultrasonic frequency into an audible sound frequency for humans.

[0066] Another embodiment of the present invention further provides a MEMS device, which may include the MEMS controller 100 in some or all of the above embodiments. It should be noted that for the same or corresponding parts in the foregoing embodiments, reference may be made to the corresponding descriptions in the foregoing embodiments, and will not be repeated hereinafter.

[0067] The MEMS device provided by the present invention can be used for heat dissipation or can be used for sound amplification.

[0068] The above are only the embodiments of the present invention. It should be noted here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but these all fall within the protection scope of the present invention.

Claims

1. A MEMS controller, comprising: At least one control unit and a packaging structure; The control unit includes: two anchoring structures arranged at intervals, the anchoring structures having opposite bottom and top surfaces; a diaphragm covering the top surfaces of the two anchoring structures; The packaging structure includes a bottom plate, a side plate and a top plate connected in sequence, the bottom plate facing the top plate, and the side plate connecting the bottom plate and the top plate. The bottom plate, the side plate and the top plate together enclose a cavity for accommodating the control unit; It is characterized in that the top plate is spaced opposite to the top surface of the diaphragm, and the top plate is provided with a first fluid port penetrating through the top plate, and the first fluid port is directly opposite to the diaphragm; the bottom plate is located at the bottom surfaces of the two anchoring structures, and the bottom plate is provided with a second fluid port penetrating through the bottom plate and arranged staggered with the control unit; the first fluid port and the second fluid port are communicated with each other for fluid to flow in from the first fluid port and flow out from the second fluid port or flow in from the second fluid port and flow out from the first fluid port. The resonance frequency of the diaphragm is equal to the operating frequency of the MEMS controller, and the resonance frequency of the diaphragm is greater than 20KHz.

2. The MEMS controller according to claim 1, wherein: The fluid flow rate through the first fluid port and the second fluid port is not less than 20m / s.

3. The MEMS controller according to claim 1, wherein: The distance L1 between the center of the first fluid port and the side end of the diaphragm within the same control unit is a multiple of one-fourth of the wavelength of the sound wave with the operating frequency of the MEMS controller in the fluid, and the side end of the diaphragm is the side end close to the second fluid port.

4. The MEMS controller according to claim 1, characterized in that: The height H1 of the anchoring structure is a multiple of one-fourth of the wavelength of the sound wave with the operating frequency of the MEMS controller in the fluid.

5. The MEMS controller according to claim 1, characterized in that: The number of the control units can be greater than or equal to 2.

6. The MEMS controller according to claim 1, characterized in that: When the MEMS controller realizes heat dissipation, the central displacement of the diaphragm satisfies: d = d1sin(2πf0t), where d represents the central displacement of the diaphragm, d1 represents the amplitude of vibration of the diaphragm, and f0 represents the operating frequency of the MEMS controller.

7. The MEMS controller according to claim 1, wherein: When the MEMS controller realizes sound amplification, the central displacement of the diaphragm satisfies: d s = d1sin(2πf0t)sin(2πf a t), where d s represents the central displacement of the diaphragm, d1 represents the amplitude of the diaphragm vibration, f0 represents the operating frequency of the MEMS controller, and f a represents the audible sound frequency.

8. A MEMS device, characterized in that, Including: The MEMS controller according to any one of claims 1-7.

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