Circuit board processing equipment and circuit board processing control method

Abstract

The invention discloses circuit board processing equipment, which comprises a working table, at least one processing station is arranged on the working table, and a target circuit board is placed in each processing station; the target circuit board comprises a first area and a second area; the cross beam is erected above the workbench, at least one main shaft assembly is connected to the cross beam in a sliding mode, and each main shaft assembly comprises a first main shaft and a second main shaft; the first main shaft picks up a first cutter, and the second main shaft picks up a second cutter to synchronously machine the first area; the second main shaft further picks up a first cutter to machine the second area. The invention further provides a circuit board processing control method. According to the circuit board processing equipment and the circuit board processing control method, the problem of service life waste of the cutter can be avoided, and the cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing equipment. More precisely, the present invention relates to a circuit board processing equipment and a circuit board processing control method. Background Art

[0002] With the increasingly fierce competition in the electronic product market, cost reduction and efficiency improvement have become an inevitable topic for circuit board factories. As an important process in the production of circuit boards, how to reduce costs and improve efficiency with the same labor and the same site has also become an important research topic for circuit board processing equipment. During the circuit board processing, as a consumable, how to reasonably utilize the cutting tools and avoid wasting the tool life has become an urgent technical problem to be solved for cost reduction and efficiency improvement. Summary of the Invention

[0003] In order to solve the problems existing in the prior art, the present invention provides a circuit board processing equipment and a circuit board processing control method.

[0004] According to a first aspect of the present invention, there is provided a circuit board processing equipment, including: a workbench, on which at least one processing position is provided, and each processing position contains a target circuit board; the target circuit board includes a first area and a second area; a cross beam, erected above the workbench, on which at least one spindle assembly is slidably connected, and the spindle assembly includes a first spindle and a second spindle; the first spindle picks up a first cutting tool, and the second spindle picks up a second cutting tool to synchronously process the first area; the second spindle also picks up the first cutting tool to process the second area.

[0005] In an embodiment of the present invention, the first spindle and the second spindle pick up the first cutting tool successively to process the second area.

[0006] In an embodiment of the present invention, after the first spindle picks up the first cutting tool to process the second area, it retracts the tool to the first tool holder or the second tool holder, and after the second spindle picks up the first cutting tool to process the second area, it retracts the tool to the first tool magazine.

[0007] In an embodiment of the present invention, the processing position includes a processing area, and each processing area contains a target circuit board. During the process that the second spindle picks up the first cutting tool to process the second area, in a first direction, the maximum stroke of the second spindle is less than or equal to three-quarters of the width of the processing area.

[0008] In an embodiment of the present invention, during the process that the first spindle processes the second area, the second spindle is in a closed state; during the process that the second spindle processes the second area, the first spindle is in a closed state.

[0009] In one embodiment of the present invention, before the second main shaft picks up the first cutting tool to machine the second area, the second main shaft retracts the second cutting tool to the second tool magazine through the second tool holder.

[0010] In one embodiment of the present invention, the circuit board processing equipment further includes a tool life management module, and the tool life management module respectively and real-time counts the service life of the first cutting tool on the first main shaft and the second main shaft.

[0011] In one embodiment of the present invention, the service life of the first cutting tool is the sum or cumulative value of the service lives on the first main shaft and the second main shaft.

[0012] In one embodiment of the present invention, the second area includes at least one of the following: (1) odd layout area; (2) peripheral area; (3) special-shaped area.

[0013] According to the second aspect of the present invention, there is provided a circuit board processing control method, including the following steps: controlling the first main shaft and the second main shaft to synchronously copy and machine the first area of the target circuit board; controlling the first main shaft and the second main shaft to pick up the first cutting tool in sequence to machine the second area of the target circuit board.

[0014] In one embodiment of the present invention, in the first area, the first main shaft and the second main shaft simultaneously replace the first cutting tool and the second cutting tool, and in the second area, the first main shaft and the second main shaft do not simultaneously replace the first cutting tool.

[0015] One beneficial effect of the present invention is that such a circuit board processing equipment and a circuit board processing control method can, on the one hand, avoid the problem of waste of tool life and save costs.

[0016] Through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0018] Figure 1 is a partial structural schematic diagram of a circuit board processing equipment provided by an embodiment of the present invention;

[0019] Figure 2 is a partial structural schematic diagram of a circuit board processing equipment provided by an embodiment of the present invention;

[0020] Figure 3a is a partial structural schematic diagram of a target circuit board provided by an embodiment of the present invention;

[0021] Figure 3b It is a schematic diagram of a partial structure of a target circuit board provided by an embodiment of the present invention;

[0022] Figure 4 It is a schematic diagram of a partial structure of a target circuit board provided by an embodiment of the present invention;

[0023] Figures 1 to 4 The one-to-one correspondence between the names of the components and the reference numerals in the figure is as follows:

[0024] 10, workbench; 20, main shaft assembly; 30, cross beam; 40, base; 21, first main shaft; 22, second main shaft; 11, processing position; 110, processing area; 111, first tool; 112, second tool; 113, first tool magazine; 114, second tool magazine; 115, first tool holder; 116, second tool holder; 12, target circuit board; 121, sub-circuit board; 122, first area; 123, second area; 124, central axis; 1231, odd layout area; 1232, peripheral area; 1233, special-shaped area; 1101, third area; 1102, fourth area. Detailed implementation manners

[0025] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or its use.

[0027] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and devices should be regarded as part of the specification.

[0028] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0029] The following describes the specific implementation manners of the present invention with reference to the accompanying drawings.

[0030] In this document, "upper", "lower", "front", "rear", "left", "right", etc. are only used to represent the relative positional relationships between relevant parts, rather than defining the absolute positions of these relevant parts.

[0031] In this text, "first", "second", etc. are only used for differentiation from each other, rather than indicating importance, order, and preconditions for each other's existence, etc.

[0032] In this text, "equal", "same", "synchronous", "successive", "consistent", etc. are not strict mathematical and / or geometric limitations, and also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use, etc.

[0033] With the rapid development of the circuit board industry, in order to improve the processing efficiency and maximize the use of site space, currently, a circuit board processing device with a single tabletop and two axes is newly launched. The circuit board at each processing position is completed by the coordinated cooperation of the first main shaft and the second main shaft. The stroke of each of the first main shaft and the second main shaft is two-thirds of the processing area. When processing the first area of the target circuit board, the first main shaft and the second main shaft process synchronously. The first main shaft and the second main shaft grab the tool simultaneously for processing, and then retract the tool simultaneously after processing. The service lives of the tools of the first main shaft and the second main shaft are kept consistent. For the second area of the target circuit board, the first main shaft and the second main shaft cannot process synchronously, but process successively. After the first main shaft finishes processing and retracts the tool, the second main shaft then picks up the tool for processing. However, in the second area, the processing workloads of the first main shaft and the second main shaft are not the same, and the tool life management module determines whether to replace the tool synchronously by taking the maximum value of the service lives of the first tool of the first main shaft and the second tool of the second main shaft. For the tool with a small workload, replacing the tool in advance results in a waste of the tool service life.

[0034] Specifically, for the second area of the target circuit board, the first main shaft and the second main shaft grab the tool simultaneously, the first main shaft and the second main shaft process their respective corresponding second areas successively, and then the first main shaft and the second main shaft retract the tool synchronously. The tool life management module compares the workloads of the first main shaft and the second main shaft, that is, compares the service lives of the first tool and the second tool, and then takes the larger value of the two as the service life of the tools of the first main shaft and the second main shaft to reduce frequent tool changes and facilitate tool management. Because the workloads of the first main shaft and the second main shaft in the second area are not the same, there will always be a problem that the service lives of the first tool and the second tool are different. So when the service life of the first tool reaches, although the service life of the second tool has not expired, or when the service life of the second tool reaches, although the service life of the first tool has not expired, however, the first main shaft and the second main shaft need to replace the tool synchronously, so it will cause a waste problem of the corresponding tool life.

[0035] To solve the above technical problems and reduce the waste of tool life, the present invention provides a circuit board processing device, including: a workbench, on which at least one processing position is provided, and a target circuit board is placed on each processing position; the target circuit board includes a first area and a second area; a cross beam, which is erected above the workbench, and at least one spindle assembly is slidably connected to the cross beam, and the spindle assembly includes a first spindle and a second spindle; the first spindle picks up a first tool, and the second spindle picks up a second tool to synchronously process the first area; the second spindle also picks up the first tool to process the second area. In this circuit board processing device, the second spindle uses the first tool of the first spindle to process the second area. During the processing, only the first tool needs to be replaced, and there is no second tool, which can avoid the problem of waste of the second tool life and save costs.

[0036] As Figure 1 and Figure 2 shown, the circuit board processing device of the present invention includes a base 40, a cross beam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40, and the cross beam 30 is erected above the workbench 10. At least one spindle assembly 20 is slidably connected to the cross beam 30, and at least one spindle assembly 20 moves along a first direction on the cross beam 30. Each spindle assembly 20 includes a first spindle 21 and a second spindle 22. The bottom end of the first spindle 21 clamps a first tool 111, and the bottom end of the second spindle 22 clamps a second tool 112. The workbench 10 is on the base 40 and moves along a second direction. At least one processing position 11 is provided on the workbench 10, and a target circuit board 12 is placed on each processing position 11. Each spindle assembly 20 corresponds to each target circuit board 12 one by one. The first spindle 21 clamps the first tool 111, and the second spindle 22 clamps the second tool 112 and moves along a third direction to process the corresponding target circuit board 12. The first direction, the second direction, and the third direction are perpendicular to each other. In the context of the embodiments of the present invention, the circuit board processing device can be implemented as a drilling device, a forming device, a routing device, a drilling and routing integrated device, etc., which is not limited here. In the context of the embodiments of the present invention, the number of spindle assemblies 20 of the circuit board processing device can be one, two, three, four, five, six, ten, twelve, etc., and the number of spindles included in each spindle assembly 20 can be one, two, three, four, etc., which is not limited here.

[0037] In the context of the embodiments of the present invention, as Figure 1 and Figure 2As shown, the circuit board processing equipment includes a workbench 10, on which at least one processing position 11 is provided, and a target circuit board 12 is placed in the processing area 110 of each processing position 11. The target circuit boards 12 have different types, with differences in materials, sizes, thicknesses, softness and hardness, etc. The physical characteristics of different types of circuit boards vary greatly. However, these target circuit boards 12 are all fixed in the processing area 110 on the workbench, and the spindle that moves at high speed holds the tool to process the circuit board. There are various ways to fix the circuit board on the workbench, including but not limited to: air clamps, bakelite boards, adsorption devices, etc. These fixing methods can stably and reliably fix the target circuit board 12 in the processing area 110 on the workbench 10, so that the target circuit board 12 does not displace when being processed by the tool moving at high speed.

[0038] In the upper and lower embodiments of the present invention, each spindle assembly 20 includes a first spindle 21 and a second spindle 22, and the first spindle 21 and the second spindle 22 synchronously replicate and process the first area of the target circuit board 12. The first spindle 21 is provided with a first manipulator on the common base plate, and the first tool 111 at the bottom end is transferred through the first tool holder 115 on the workbench 10; similarly, the second spindle 22 is provided with a second manipulator on the common base plate, and the second tool 112 at the bottom end is transferred through the second tool holder 116 on the workbench 10. The first tool magazine 113 is used to replace the first tool 111 with the first spindle 21, and the second tool magazine 114 is used to replace the second tool 112 with the second spindle 22. The structures and functions of the first manipulator, the second manipulator, the first tool holder 115, the second tool holder 116, the first tool magazine 113, and the second tool magazine 114 will not be elaborated in detail here.

[0039] In the upper and lower embodiments of the present invention, the first spindle 21 and the second spindle 22 pick up the first tool 111 in sequence to process the second area 123. For the first area 122 of the target circuit board 12, the first spindle 21 and the second spindle 22 synchronously replicate and process it to achieve the purpose of improving the processing efficiency. To adapt to the synchronous replication processing of the first spindle 21 and the second spindle 22, the first spindle 21 and the second spindle 22 grab the tool synchronously. Specifically, when the first spindle 21 picks up the first tool 111, the second spindle 22 picks up the second tool 112. As Figure 3a and Figure 3bAs shown, on the target circuit board 12, in addition to the first area 122, there is also a second area 123. According to the rules of the first object parameters preset by the circuit board processing equipment, the spindle assembly 20 first processes the first area 122 and then the second area 123, or the spindle assembly 20 first processes the second area 123 and then the first area 122. In the first area 122 of the target circuit board 12, the first spindle 21 and the second spindle 22 perform synchronous copying processing; in the second area 123, the first spindle 21 and the second spindle 22 pick up the first tool 111 in sequence for processing. Specifically, according to the preset rule sequence of the first object parameters, in the first step, the first spindle 21 picks up the first tool 111 to process the second area 123; in the second step, the second spindle 22 picks up the first tool 111 to process the second area 123; or the processing order of the first spindle 21 and the second spindle 22 is swapped, which is not particularly limited here. It should be noted here that as Figure 3a and Figure 3b shown, in the target circuit board 12, the second area 123 not only includes the intermediate odd layout area 1231 or the special-shaped area 1233, but also includes the peripheral area 1232. Due to travel limitations, the first spindle 21 and the second spindle 22 cannot process all of the second area 123 alone.

[0040] In the upper and lower embodiments of the present invention, after the first spindle picks up the first tool to process the second area, it retracts the tool to the first tool holder or the second tool holder. After the second spindle picks up the first tool and finishes processing, it retracts the tool to the first tool magazine. The first spindle and the second spindle realize picking up the same first tool in sequence for processing the second area through the transfer of the tool holder.

[0041] Specifically, after processing the first area, according to the preset rules, sequence or path of the first object parameters, the first spindle clamps the first tool to process the second area while closing the second spindle. During the process of the first spindle clamping the first tool to process the second area of the target circuit board, if the first tool reaches the end of its service life, the first spindle replaces the first tool with the first tool magazine through the corresponding first tool holder. There are some cases where non-conventional tools are used in the second area. When multiple types of first tools are required in the second area, the first spindle replaces the new and old first tools in the first tool magazine to meet the processing requirements with the first tool. During the process of the first spindle clamping the first tool to process the second area, closing the second spindle means that the second spindle no longer processes the second area; specifically, the second spindle no longer reciprocates in the third direction, the Z-axis motor is in the off state; the second spindle moves in the first direction at a predetermined distance from the first spindle; the second spindle no longer clamps the second tool, and the second spindle has unloaded the second tool to the second tool magazine.

[0042] The second area has a predetermined workload and is restricted by the spindle stroke. Not all of the second area can be machined solely by the first spindle. Therefore, at least part of the second area requires the second spindle for machining. When the second spindle picks up the first tool to machine the second area, the entire second area is machined using the first tool. With this machining method, when the first tool is exhausted and its service life expires, the first tool is replaced, and the second tool is not used, which can avoid the problem of waste of the service life of the second tool and save costs.

[0043] After the first spindle holds the first tool to complete the predetermined task of machining the second area, the service life of the first tool has not expired. Therefore, the second spindle can continue to pick up the first tool to machine the second area. Specifically, in the method where the first spindle and the second spindle share the first tool to machine the second area successively, after the first spindle finishes machining, it first retracts the first tool, then the second spindle picks up the first tool for machining, and then retracts it to the first tool magazine. It specifically includes the following three method steps:

[0044] For the first method, the first spindle retracts the first tool to the first tool holder, and the first manipulator or the second manipulator transfers the first tool from the first tool holder to the second tool holder. The second spindle picks up the first tool from the second tool holder and continues to perform the task of machining the second area. During the machining process, if there is a need to change the tool, the old first tool is transferred to the first tool magazine and the new first tool is transferred from the first tool magazine to the second spindle through the actions of the first manipulator and the second manipulator and the transfer through the first tool holder and the second tool holder. After the second spindle finishes machining, the first tool is first retracted to the second tool holder, then transferred to the first tool holder by the first manipulator or the second manipulator, and retracted to the first tool magazine through the first tool holder. This method of transferring the first tool is not affected by the position of the tool holder and the spindle stroke, and has a wider applicability.

[0045] For the second method, the first spindle retracts the first tool to the first tool holder, and the second spindle directly picks up the first tool from the first tool holder and performs the task of machining the second area. During the machining process, if there is a need to change the tool, the first manipulator, the second manipulator, and the first tool holder are used to perform the task of replacing the first tool. After the second spindle finishes machining, the first tool is first retracted to the first tool holder, and then retracted to the first tool magazine by the first manipulator. Compared with the first method of transferring the first tool, this transfer method is simpler and more efficient, saving time.

[0046] The third method: The first main shaft retracts the first cutting tool to the second tool holder, and the second main shaft directly picks up the first cutting tool from the second tool holder to perform the task of machining the second area. During the machining process, if there is a need to change the cutting tool, the first manipulator, the second manipulator, and the second tool holder are used to perform the task of replacing the first cutting tool. After the second main shaft finishes machining, the first cutting tool is first retracted to the second tool holder, and then retracted to the first tool magazine through the first manipulator or the second manipulator. Compared with the first method of transferring the first cutting tool, this transfer method is simpler and more efficient, saving time.

[0047] In the upper and lower embodiments of the present invention, the workbench includes at least one machining position, each machining position includes a machining area, and a target circuit board is placed in each machining area. The target circuit board includes a first area and a second area. During the process of the second main shaft picking up the first cutting tool to machine the second area, in the first direction, the maximum stroke of the second main shaft is less than or equal to three-quarters of the width of the machining area. The circuit board processing equipment includes multiple machining positions, and each machining position includes a machining area, a tool magazine and a tool holder outside the machining area. In the upper and lower embodiments of the present invention, the spindle assembly corresponding to the machining area includes a first main shaft and a second main shaft. A first tool magazine and a first tool holder are arranged outside the machining area for replacing the first cutting tool of the first main shaft. A second tool magazine and a second tool holder are also arranged outside the machining area for replacing the second cutting tool of the second main shaft.

[0048] Within the machining area, the first main shaft and the second main shaft have a predetermined stroke range. In one embodiment, in the first direction, the maximum stroke of both the first main shaft and the second main shaft is one-half of the width of the machining area. The first main shaft machines the left 50% of the machining area, and the second main shaft machines the right 50% of the machining area. The two jointly machine the target circuit board within the entire machining area. In another embodiment of the present invention, as Figure 4 shown, in the first direction, the maximum stroke of both the first main shaft and the second main shaft is three-quarters of the width of the machining area. When the maximum stroke of the second main shaft is expanded to three-quarters of the machining area, that is to say, during the process of the second main shaft picking up the first cutting tool to machine the second area, in the first direction, the maximum stroke of the second main shaft is less than or equal to three-quarters of the width of the machining area. In some other preferred embodiments, in the first direction, the maximum stroke of the first main shaft and the second main shaft is greater than two-thirds of the width of the machining area; that is to say, the maximum stroke of the first main shaft and the second main shaft in the first direction is greater than two-thirds of the width of the machining area in the first direction and less than or equal to three-quarters of the width of the machining area in the first direction. This large range of strokes can improve the compatibility of the first main shaft and the second main shaft, enable a single shaft to machine a circuit board in a larger range, and provide the possibility for the second main shaft to pick up the first cutting tool from the first tool holder. Indirectly, the machining efficiency is improved.

[0049] In the following embodiments of the present invention, during the process of machining the second area by the first main spindle, the second main spindle is in a closed state; during the process of machining the second area by the second main spindle, the first main spindle is in a closed state. Here, the closed state means that the first main spindle or the second main spindle no longer machines the second area, and specifically includes at least one of the following states: (1) The first main spindle or the second main spindle no longer reciprocates in the third direction, and the corresponding Z-axis motor is in a closed state; (2) The second main spindle and the first main spindle move synchronously in the first direction while maintaining a predetermined distance; (3) The first main spindle no longer holds the first tool, or the second main spindle no longer holds the second tool.

[0050] Specifically, since the first main spindle and the second main spindle pick up the first tool to machine the second area successively, during the process of the first main spindle machining the second area, the second main spindle cannot obstruct or interfere with the actions of the large-range stroke of the first main spindle, and the second main spindle is in the closed state; during the process of the second main spindle machining the second area, the first main spindle cannot obstruct or interfere with the actions of the large-range stroke of the second main spindle, and the first main spindle is in the closed state. As a preferred embodiment, when one of the first main spindle and the second main spindle is machining the second area, the other unloads the tool, turns off the Z-axis motor, and moves synchronously along the first direction at a predetermined distance; this state can be achieved through the control command of the first object parameter. In another embodiment of the present invention, when the first main spindle is machining the second area, the control command for the second main spindle to execute the closed state specifically includes: first, unload the second tool that the second main spindle may hold, so that the second main spindle does not hold the tool; then, the second main spindle maintains a predetermined distance from the first main spindle, and the second main spindle follows the first main spindle to move synchronously along the first direction, so that the second main spindle does not interfere with the first main spindle moving to the second tool holder; finally, the second main spindle has no executable work task, and turns off the Z-axis motor of the second main spindle, so that the second main spindle does not move along the third direction. The control command for the second main spindle to execute the closed state may include at least one of the above three states. Correspondingly, during the process of the second main spindle picking up the first tool to machine the second area, the first main spindle executes the closed control command, and here the control command also includes: the first main spindle has unloaded the first tool, and the first main spindle is in a state of not holding the tool; then, the first main spindle maintains a predetermined distance from the second main spindle, and the first main spindle follows the second main spindle to move synchronously along the first direction, so that the first main spindle does not interfere with the second main spindle moving to the first tool holder; finally, the first main spindle has no executable work task, and turns off the Z-axis motor of the first main spindle, so that the first main spindle does not move along the third direction. It should be noted here that the first main spindle and the second main spindle being in the closed state does not mean that they do not execute other control instructions, such as tool change. During the tool change process of the first main spindle, the first tool can be directly replaced with the first tool magazine through the first tool holder. However, when the second main spindle changes the tool, the first main spindle needs to assist. Specifically, the second main spindle unloads the first tool to the first tool holder or the second tool holder, and then the manipulator of the first main spindle directly transfers the first tool from the first tool holder to the first tool magazine; the process of loading a new tool is the opposite. That is to say, during the process of the second main spindle picking up the first tool to machine the second area, although the first main spindle is in the closed state, it also needs to assist in executing the work task of replacing the first tool.

[0051] In the upper and lower embodiments of the present invention, before the second main spindle picks up the first tool to machine the second area, it further includes that the second main spindle retracts the second tool to the second tool magazine through the second tool holder. In the upper and lower embodiments of the present invention, during the process of machining the target circuit board, the first main spindle and the second main spindle are divided into two steps: the first step is that the first main spindle and the second main spindle synchronously replicate and machine the first area; the second step is that the first main spindle and the second main spindle machine the second area successively. During the process of the first main spindle and the second main spindle machining the first area, the first main spindle picks up and holds the first tool, and the second main spindle picks up and holds the second tool. After entering the second step of machining the second area, until the second main spindle picks up the first tool, the second main spindle needs to retract the tool because one spindle cannot hold two tools simultaneously. Therefore, after the second main spindle finishes machining the first area and before the second main spindle picks up the first tool to machine the second area, the second main spindle needs to retract the tool. Specifically, the second main spindle retracts the second tool to the second tool holder, and then the second manipulator transfers the second tool to the second tool magazine.

[0052] In the upper and lower embodiments of the present invention, the circuit board processing equipment further includes a tool life management module, and the tool life management module respectively and real-time counts the service lives of the first tool on the first main spindle and the second main spindle. Each tool has a preset service life, which is determined by the machining tasks of the tool, such as 3000 times, 2000 times, 3000 meters, 2000 meters, etc. After exceeding this service life, the machining of the tool may not meet the process requirements, and there is a risk of unqualified machining. Therefore, generally through multiple tests, the reasonable service life of each type of tool is measured, and after reaching this service life, the tool change program is automatically started. The circuit board processing equipment includes a tool life management module to monitor the service life of each tool in real time. In some embodiments, the main spindle includes a CBD component, and the tool life management module indirectly monitors the machining tasks of the tool through the CBD component, and each time it is machined once or one meter, the count is incremented by 1, and the service life of the tool is incremented by 1. In some other embodiments, the main spindle includes a sensor, and the sensor monitors the number of reciprocating movements or the distance of the main spindle along the third direction, and each time it moves once or one meter, the count is incremented by 1, and the service life of the tool is incremented by 1. Regardless of which method is used to calculate the tool life, the tool management module can monitor, update, and identify the service life of the tool.

[0053] For the first cutting tool, the tool life management module monitors and counts in real time the service life of the first cutting tool on the first spindle and the second spindle, and this service life is displayed in real time on the human-machine interface of the circuit board processing equipment. In the embodiment of the present invention, there is a situation where the first cutting tool is transferred. During the process of machining the second area, the first cutting tool is transferred from the first spindle to the second spindle. During the transfer process, the service life of the first cutting tool is the sum or cumulative value of the service lives on the first spindle and the second spindle. In some embodiments, the tool life management module monitors and counts in real time the service lives of the first cutting tool on the first spindle and the second spindle respectively, and finally adds the service lives of the two. The service life of the first cutting tool is the sum of the two. For example, when the first spindle holds the first cutting tool to machine the second area 100 times and the second spindle holds the first cutting tool to machine the second area 100 times, the service life of the first cutting tool this time is 200 times. In some other embodiments, the tool life management module monitors in real time the service lives of the first cutting tool on the first spindle and the second spindle, and finally takes the cumulative value of the service lives of the two. The service life of the first cutting tool is the cumulative value of the two. For example, the service life of the first cutting tool on the first spindle is 200 times. This service life follows the first cutting tool to the second spindle. During the process of the second spindle using the first cutting tool for machining, counting starts from 201 times. When the first cutting tool finishes machining 300 times, the service life of the first cutting tool on the first spindle and the second spindle is 300 times. No matter which method is used to monitor the life of the first cutting tool, the tool life management module is to monitor the service life of the first cutting tool. When the service life of the first cutting tool reaches 2000 times, a program to replace the first cutting tool is started.

[0054] In the upper and lower embodiments of the present invention, when replacing the first cutting tool on the first spindle, the second spindle does not replace the second cutting tool. In the embodiment of the present invention, the first spindle and the second spindle pick up the first cutting tool to machine the second area successively. During the process of the first spindle picking up the first cutting tool to machine the second area, the first cutting tool may reach the end of its life, that is, affected by the work task of the second area, the first cutting tool may need to be replaced. The first cutting tool replaces the tool through the first manipulator and the first tool holder. During the process of the first spindle replacing the first cutting tool, the second spindle may be in a closed state and the second spindle does not need to replace the second cutting tool. Therefore, during the process of machining the second area, the tool life management module monitors in real time the service lives of the first cutting tool and the second cutting tool, and the service life of the first cutting tool is greater than or equal to the service life of the second cutting tool; when the first spindle replaces the first cutting tool, the second spindle does not replace the second cutting tool.

[0055] In the following embodiments of the present invention, the target circuit board includes a first region and a second region. The processing methods of the first region and the second region are different: in the first region, the first main shaft and the second main shaft perform synchronous copying processing; in the second region, the first main shaft and the second main shaft pick up the same first tool in sequence for processing. It should be noted that according to the rules of the first object parameter, the first region can be processed first and then the second region, or the second region can be processed first and then the first region, without any restrictions here. The target circuit board includes a first region and a second region. The first region is mirror-symmetrical about the central axis 124. The first main shaft clamping the first tool and the second main shaft clamping the second tool can achieve synchronous copying processing, and their processing paths are mirror-symmetrical about the central axis. In the second region, the first main shaft and the second main shaft cannot achieve synchronous copying processing and can only achieve sequential single-axis processing, and the first main shaft and the second main shaft pick up the same first tool. As Figure 3a , Figure 3b shown, the first region 122 of the target circuit board 12 is the regular region in the middle, and the two are mirror-symmetrical about the central axis 124; the second region 123 includes at least one of the following: (1) the odd-numbered layout area 1231; (2) the peripheral area 1232; (3) the irregular area 1233. Specifically, the odd-numbered layout area 1231 is the odd-numbered columns in the exact middle of the target circuit board. The odd-numbered layout area 1231 is a column of sub-circuit boards. The odd-numbered layout area 1231 cannot achieve synchronous copying processing of the first main shaft and the second main shaft, and needs to be processed alternately by the first main shaft and the second main shaft in sequence to complete the work task. The peripheral area 1232 is the area around the four sides of the plurality of sub-circuit boards 121. There are also a small number of processing work tasks in this area. For example, during the circuit board processing process, specific characters, patterns, etc. need to be formed. Specific numbers, letters, and patterns can be formed by processing a predetermined number of holes for recording the part number, mark points, etc. of the target circuit board 12. The irregular area 1233 is the irregular area that may exist on the target circuit board 12. Biaxial synchronous copying processing cannot be achieved in these areas, and only single-axis sequential processing can be performed. For the above-mentioned second region 123, the first main shaft and the second main shaft pick up the same first tool in sequence for processing. Only the first tool needs to be replaced, and the second tool does not need to be replaced. Each tool is replaced only when its service life expires, without wasting the service life of the second tool, saving costs.

[0056] In an embodiment of the invention, a method for controlling circuit board processing is disclosed, including: controlling a first main shaft and a second main shaft to synchronously replicate and process a first area of a target circuit board; controlling the first main shaft and the second main shaft to pick up a first tool in sequence to process the second area. The circuit board processing equipment includes at least one main shaft assembly, and each main shaft assembly includes a first main shaft and a second main shaft. In the first area, synchronous replication and processing by the first main shaft and the second main shaft can improve processing efficiency; in the second area, the first main shaft and the second main shaft pick up the same first tool in sequence for processing, avoiding waste of tool life and saving costs.

[0057] In the circuit board processing control method of the present invention, in the first area, the first main shaft and the second main shaft simultaneously replace the first tool and the second tool, and in the second area, the first main shaft and the second main shaft do not replace the first tool and the second tool simultaneously. Specifically, in the first area, the target circuit board is regular and mirror-symmetrical, and the first main shaft and the second main shaft perform synchronous replication processing, and both processing and tool replacement are carried out synchronously, with improving processing efficiency as the top priority. In the second area, only single-axis processing is possible, but in order not to waste tool life, one main shaft needs to be turned off. Therefore, while the first main shaft picks up the first tool for processing, the second main shaft is in the off state, and the second tool is not used, and its service life is not counted. While the second main shaft picks up the first tool for processing, the first main shaft is in the off state, and the service life of the first tool is counted by the second main shaft. Finally, the two are superimposed or accumulated to form the actual service life of the first tool. Since only the first tool is used for processing and the second tool is unloaded into the second tool magazine, no matter when the first tool is replaced, the second tool will not be replaced. Therefore, the first main shaft and the second main shaft do not replace the first tool and the second tool simultaneously. This processing control method reduces the number of tool replacements, saves time, and improves processing efficiency.

[0058] In the circuit board processing control method of the present invention, the number of first tools in the first tool magazine is greater than the number of second tools in the second tool magazine. During the process of processing the second area, the first main shaft and the second main shaft pick up the first tool for processing, and the usage frequency of the first tool is greater than that of the second tool. Therefore, there must be multiple cases of replacing the first tool. To meet the needs of circuit board processing and replacing the first tool, a predetermined number of first tools need to be stocked in the first tool magazine. During the process of processing the target circuit board, the number of first tools in the first tool magazine is greater than the number of second tools in the second tool magazine.

[0059] In the context of the embodiments of the present invention, the circuit board processing equipment includes a control system. The control system pre-sets first object parameters, and the circuit board processing equipment processes the target circuit board according to the first object parameters. The first object parameters are a set of pre-set data information, which correspond one-to-one with the target circuit board. Users or technicians can view, edit, and call the first object parameters through the human-machine interface of the circuit board processing equipment. The first object parameters record the point coordinate information of the target circuit board, the matrix arrangement diagram of the sub-circuit boards, the processing sequence of multiple points, etc. Through the first object parameters, the first main shaft and the second main shaft process the target circuit board according to a predetermined path and sequence.

[0060] In the context of the embodiments of the present invention, synchronous replication processing means that the first main shaft and the second main shaft move synchronously at a predetermined distance in the first direction, the circuit board moves in the second direction, and in the third direction, the first tool and the second tool move synchronously to process the same target circuit board; on the target circuit board, the processing paths of the first main shaft and the second main shaft are exactly the same and are mirror-symmetrical about the central axis of the target circuit board. Synchronous movement means that the movement parameters are basically the same. Here, the movement parameters include but are not limited to time, speed, acceleration, tools, etc. In the context of the embodiments of the present invention, mirror symmetry means mirror symmetry about the plane where the central axis is located; within the plane where the circuit board is located, the two can coincide after being translated a predetermined distance.

[0061] Embodiment 1

[0062] In this embodiment, taking the circuit board processing equipment as a 12-axis drilling equipment as an example, the structure and processing control method of the circuit board processing equipment are described in detail.

[0063] In this embodiment, as Figure 1 、 Figure 2 、 Figure 3bAs shown in the figure, the circuit board processing equipment includes a workbench 10, a spindle assembly 20, a cross beam 30, and a base 40. The workbench 10 is arranged on the base 40, and the cross beam 30 is erected above the workbench 10. A six-spindle assembly 20 is slidably connected to the cross beam 30, and each spindle assembly 20 moves along a first direction on the cross beam 30. Each spindle assembly 20 includes a first spindle 21 and a second spindle 22. The bottom end of the first spindle 21 clamps a first tool 111, and the bottom end of the second spindle 22 clamps a second tool 112. The workbench 10 moves on the base 40 along a second direction, and six processing positions 11 are arranged on the workbench 10. Each processing position 11 includes a processing area 110, a first tool magazine 113, a second tool magazine 114, a first tool holder 115, and a second tool holder 116. A target circuit board 12 is placed in each processing area 110. The target circuit board 12 includes 20 sub-circuit boards 121. On the target circuit board 12, all 20 sub-circuit boards and their peripheral areas are divided into a first area 122 and a second area 123. In the first area 122, the first spindle 21 picks up the first tool 111 and the second spindle picks up the second tool 112 for synchronous copying and processing; in the second area, the first spindle 21 and the second spindle 22 pick up the first tool for processing in sequence. Each spindle assembly 20 corresponds to each target circuit board 12 one by one. The spindle assembly 20 clamps the first tool 111 or the second tool 112 and moves along a third direction to process the corresponding target circuit board 12. The first direction, the second direction, and the third direction are perpendicular to each other.

[0064] In the circuit board processing equipment in this embodiment, as Figure 1 , Figure 2 , Figure 3b shown, the first spindle 21 picks up the first tool 111, and the second spindle 22 picks up the second tool 112 to synchronously process the first area 122; the second spindle 22 also picks up the first tool 111 to process the second area 123. In the technical solution of the present invention, the second spindle 22 picks up the first tool 111 to process the second area 123. Compared with picking up the second tool 112 to process the second area 123, the second tool 112 can be not used, and the first tool 111 is used together with the first spindle 21. When the life of the first tool 111 expires, the first tool 111 is replaced, and there is no need to use and replace the second tool 112, avoiding the problem of wasting part of the life due to inconsistent service lives of the two tools. From the perspective of overall processing, the problem of wasting the life of the second tool 112 can be avoided, thus saving costs.

[0065] In this embodiment, the first main shaft 21 and the second main shaft 22 pick up the first cutting tool 111 in sequence to machine the second area 123. For the second area, only the first cutting tool 111 is used for machining. Due to the stroke limitation of the first main shaft 21 and the second main shaft 22, it is necessary for the first main shaft 21 and the second main shaft 22 to machine alternately in sequence, so as to complete the machining task of the second area 123 in the shortest time. Specifically, as Figure 3b shown, the first main shaft 21 first picks up the first cutting tool 111 to machine the second area 123 on the left side of the central axis 124 of the target circuit board 12. After being transferred by the first tool holder 115 and / or the second tool holder 116, the second main shaft 22 then picks up the first cutting tool 111 to machine the second area 123 on the right side of the central axis 124 of the target circuit board 12. On the target circuit board 12 of this embodiment, the second area 123 includes an odd layout area 1231, a peripheral area 1232, etc. In the first object parameter, these areas are bounded by the central axis 124. The first main shaft 21 and the second main shaft 22 pick up the first cutting tool 111 in sequence to machine the corresponding areas respectively.

[0066] In this embodiment, after the first main shaft 21 picks up the first cutting tool 111 to machine the second area 123, it retracts the tool to the first tool holder 115. After the second main shaft 22 picks up the first cutting tool 111 and finishes machining, it retracts the tool to the first tool magazine 113. During the machining of the second area, the first main shaft 21 picks up the first cutting tool 111 for machining. After finishing machining, the first main shaft 21 retracts the first cutting tool 111 to the first tool holder 115. The first manipulator of the first main shaft 21 transfers the first cutting tool 111 from the first tool holder 115 to the second tool holder 116, and then the second main shaft 22 picks up the first cutting tool 111 from the second tool holder 116. In this way, the transfer process of the first cutting tool 111 from the first main shaft 21 to the second main shaft 22 is completed. When the second main shaft 22 picks up the first cutting tool 111 to machine the second area and finishes machining, the first cutting tool 111 retracts to the first tool magazine 113. Specifically, the second main shaft 22 first retracts the first cutting tool 111 to the second tool holder 116. The second manipulator of the second main shaft 22 transfers the first cutting tool 111 from the second tool holder 116 to the first tool holder 115 again, and the first manipulator of the first main shaft 21 transfers the first cutting tool 111 from the first tool holder 115 to the first tool magazine 113 again. In this way, the second main shaft 22 completes the process of retracting the tool to the first tool magazine 113.

[0067] In this embodiment, as Figure 1 、 Figure 2 、 Figure 4As shown, the processing position 11 includes a processing area 110, and a target circuit board 12 is placed in the processing area 110. The target circuit board 12 includes a first area 122 and a second area 123. During the process that the second main shaft 22 picks up the first tool 111 to process the second area 123, in the first direction, the maximum stroke of the second main shaft 22 is less than or equal to three-fourths of the width of the processing area 110. As Figure 4 shown, the width of the third area 1101 in the first direction is the maximum stroke range of the first main shaft 21, and the width of the fourth area 1102 in the first direction is the maximum stroke range of the second main shaft 22. In the first direction, the widths of the third area 1101 and the fourth area 1102 are three-fourths of the width of the processing area 110. The maximum stroke of the first main shaft 21 is less than or equal to three-fourths of the width of the processing area 110; the maximum stroke of the second main shaft 22 is less than or equal to three-fourths of the width of the processing area 110. In a preferred embodiment, in the first direction, the maximum stroke of the second main shaft 22 is greater than two-thirds of the width of the processing area 110; that is to say, the width of the fourth area 1102 in the first direction is greater than two-thirds of the width of the processing area 110; and less than or equal to three-fourths of the width of the processing area 110. Such a large range of stroke ensures that the first main shaft 21 and the second main shaft 22 can smoothly transfer the first tool 111 without restricting the positions of the first tool holder 115 and the second tool holder 116. Of course, the first main shaft 21 and the second main shaft 22 are provided with hardware and software anti-collision mechanisms, and it is a prerequisite to avoid collision or interference between the two main shafts within the large range of stroke.

[0068] In this embodiment, during the process that the first main shaft 21 processes the second area 123, the second main shaft 22 is in a closed state. Here, the closed state means that the second main shaft 22 does not process the second area 123, and specifically includes at least one of the following three states: (1) The second main shaft 22 no longer reciprocates in the third direction, and its corresponding Z-axis motor is in a closed state; (2) The second main shaft 22 moves synchronously in the first direction at a predetermined distance from the first main shaft 21; (3) The second main shaft 22 no longer clamps the second tool. During the process that the second main shaft 22 processes the second area 123, the first main shaft 21 is in a closed state. Here, the closed state means that the first main shaft 21 does not process the second area, and specifically includes at least one of the following three states: (1) The first main shaft 21 no longer reciprocates in the third direction, and its corresponding Z-axis motor is in a closed state; (2) The first main shaft 21 moves synchronously in the first direction at a predetermined distance from the second main shaft 22; (3) The first main shaft 21 no longer clamps the first tool.

[0069] Specifically, during the process of the first main spindle 21 machining the second area 123, the second main spindle 22 does not hold the second tool. If there is a tool, it needs to retract the tool first. In addition, the second main spindle 22 cannot interfere with the machining and tool transfer of the first main spindle 21. Therefore, the second main spindle 22 needs to move synchronously along the first direction at a predetermined distance from the first main spindle 21; there are specific parameter settings in the first object parameters to ensure a predetermined safety distance between the first main spindle 21 and the second main spindle 22, especially during the process of tool transfer. Finally, the second main spindle 22 has no work tasks to execute temporarily. Considering energy conservation, the second main spindle 22 turns off the Z-axis motor and no longer reciprocates along the third direction. Of course, this closed state does not mean that the second main spindle 22 cannot execute any instructions completely. It can also assist in executing the tool transfer command, specifically subject to the rules set in the first object parameters. For example, when the second main spindle 22 holds the first tool 111 to machine the second area 123, although the first main spindle 21 remains in the closed state, when the second main spindle 22 needs to replace the first tool 111, it requires the assistance of the first manipulator of the first main spindle 21. Therefore, after the second main spindle 22 starts the task of replacing the first tool 111, it wakes up the first main spindle 21 at the same time. When unloading the first tool 111, the manipulator of the first main spindle 21 assists in transferring the first tool 111 from the second main spindle 22 to the first tool magazine 113; when loading the first tool 111, the manipulator of the first main spindle 21 assists in transferring the first tool 111 from the first tool magazine 113 to the second main spindle 22.

[0070] The circuit board processing equipment of this embodiment further includes a tool life management module, which respectively and real-time counts the service life of the first tool 111 on the first main spindle 21 and the second main spindle 22. When the first tool 111 is transferred from the first main spindle 21 to the second main spindle 22, the tool life management module respectively counts the service life of the first tool 111 on the first main spindle 21 and the service life of the first tool 111 on the second main spindle 22, and then adds the two together, and takes the sum as the actual service life of the first tool 111. After the actual service life of the first tool 111 expires, a control command to replace the first tool 111 is started.

[0071] In an embodiment of the present invention, during the process of the first spindle 21 replacing the first tool 111, the second spindle 22 does not replace the second tool 112. Both the first spindle 21 and the second spindle 22 use the first tool 111 to process the second area. During the process of processing the second area 123, there is a situation where the first tool 111 needs to be replaced. Therefore, both the first spindle 21 and the second spindle 22 may need to replace the first tool 111. However, the second spindle 22 has already unloaded the second tool 112, or rather, has not used the second tool 112. Therefore, the first spindle 21 and the second spindle 22 do not replace the tools simultaneously. During the process of the first spindle 21 replacing the first tool 111, the second spindle 22 does not replace the second tool 112.

[0072] In the circuit board processing equipment of the present invention, the target circuit board 12 on the workbench 10 includes a first area 122 and a second area 123. The second area includes: (1) an odd layout area; (2) a peripheral area. As Figure 3b shown, the second spindle 22 uses the first tool 111 to process the second area 123. Specifically, it processes the odd layout area 1231 and the peripheral area 1232. As shown above, according to the path and sequence set by the first object parameter, the first spindle 21 first picks up the first tool 111 to process the odd layout area 1231 and the peripheral area 1232 on the left side of the central axis 124, and then the second spindle 22 picks up the first tool 111 to process the odd layout area 1231 and the peripheral area 1232 on the right side of the central axis 124. Here, the odd layout area means that in the first direction, the target circuit board 12 includes 5 columns of sub-circuit boards 121. Since 5 is an odd number, the middle column, the 3rd column, is selected as the odd layout area. The peripheral area refers to the four peripheral areas of the 20 sub-circuit boards 121, where specific characters or patterns to be processed are set. These characters or patterns are not mirror-symmetrical about the central axis 124 and need to be processed separately by the first spindle 21 or the second spindle 22.

[0073] The circuit board processing equipment of this embodiment also includes a circuit board processing control method. Specifically, during the process of the spindle assembly 20 processing the target circuit board 12, the following steps are included:

[0074] S20: Control the first spindle and the second spindle to synchronously replicate and process the first area of the target circuit board. As Figure 3b shown, in the first area of the target circuit board, the first spindle 21 and the second spindle 22 can synchronously replicate and process. Dual-spindle processing can improve processing efficiency. Here, synchronization means that the processing parameters of the first spindle 21 and the second spindle 22 are kept consistent; here, replication processing means that the processing paths of the first spindle 21 and the second spindle 22 on the target circuit board 12 are mirror-symmetrical about the central axis 124.

[0075] S40: Control the first main spindle and the second main spindle to pick up the first tool in sequence to machine the second area of the target circuit board. As Figure 3b shown, in the second area of the target circuit board, the first main spindle 21 picks up the first tool 111 to machine the odd layout area 1231 and the peripheral area 1232 on the left side of the central axis 124 of the target circuit board 12 first. After the transfer of the first tool 111 is completed, the second main spindle 22 picks up the first tool 111 to machine the odd layout area 1231 and the peripheral area 1232 on the left side of the central axis 124 of the target circuit board 12 first. There is a sequential order in time for the first main spindle 21 and the second main spindle 22 to machine the second area.

[0076] This circuit board machining control method uses the same first tool to machine the second area, avoiding the situation where the service lives of two tools are inconsistent, which can avoid wasting tool life and save costs.

[0077] In the circuit board machining control method of this embodiment, in the first area 122, the first main spindle 21 and the second main spindle 22 replace the first tool 111 and the second tool 112 simultaneously. In the second area 123, the first main spindle 21 and the second main spindle 22 do not replace the first tool 111 simultaneously. During the machining of the first area 122, the first main spindle 21 and the second main spindle 22 machine synchronously and change tools synchronously, which can save time and improve machining efficiency. In the second area, when the first main spindle 21 picks up the first tool 111 for machining, the second main spindle 22 is in the off state and there is no situation of replacing the first tool 111. When the second main spindle 22 picks up the first tool 111 for machining, the first main spindle 21 is in the off state and there is also no situation of replacing the first tool 111. Therefore, the first main spindle 21 and the second main spindle 22 do not replace the first tool 111 simultaneously.

[0078] In the circuit board machining control method of the present invention, the first main spindle 21 and the second main spindle 22 need to transfer the first tool 111. Before transferring the first tool 111, that is, before the second main spindle 22 picks up the first tool 111, the second main spindle 22 needs to unload the second tool 112 that may be clamped. Specifically, because each main spindle can only clamp one tool at the same time, before the second main spindle 22 picks up the first tool 111, the second main spindle 22 also needs to unload the second tool 112 to the second tool magazine 114. Specifically, this can be achieved through the second manipulator and the second tool holder 116.

[0079] Embodiment 2

[0080] In this embodiment, taking a 12-axis drilling device as the circuit board machining equipment as an example, the structure and machining control method of the circuit board machining equipment are described in detail.

[0081] In this embodiment, as Figure 1 、 Figure 2 、Figure 3a As shown in the figure, the circuit board processing equipment includes a workbench 10, a spindle assembly 20, a cross beam 30, and a base 40. The workbench 10 is arranged on the base 40, and the cross beam 30 is erected above the workbench 10. A six-spindle assembly 20 is slidably connected to the cross beam 30, and each spindle assembly 20 moves along a first direction on the cross beam 30. Each spindle assembly 20 includes a first spindle 21 and a second spindle 22. A first tool 111 is clamped at the bottom end of the first spindle 21, and a second tool 112 is clamped at the bottom end of the second spindle 22. The workbench 10 moves on the base 40 along a second direction, and six processing positions 11 are arranged on the workbench 10. Each processing position 11 includes a processing area 110, a first tool magazine 113, a second tool magazine 114, a first tool holder 115, and a second tool holder 116. A target circuit board 12 is placed in each processing area 110. The target circuit board 12 includes 22 sub-circuit boards 121. On the target circuit board 12, all 22 sub-circuit boards and the edge area are divided into a first area 122 and a second area 123. In the first area 122, the first spindle 21 picks up the first tool 111 and the second spindle picks up the second tool 112 for synchronous copying and processing; in the second area, the first spindle 21 and the second spindle 22 pick up the first tool for processing successively. Each spindle assembly 20 corresponds to each target circuit board 12 one by one. The spindle assembly 20 clamps the first tool 111 or the second tool 112 and moves along a third direction to process the corresponding target circuit board 12. The first direction, the second direction, and the third direction are perpendicular to each other.

[0082] The structure of the circuit board processing equipment in this embodiment is the same as that in Embodiment 1 and will not be described in detail. The difference lies in that there are fine-tuning in the processing control method: (1) The method of transferring the first tool 111 is different; (2) The circuit board layout structure is different. The circuit board layout structure here is as Figure 3a shown. In the second area, in addition to the odd layout area 1231 and the peripheral area 1232, there is also a special-shaped area 1233; the special-shaped area 1233 is a single-row and single-column sub-circuit board.

[0083] In the circuit board processing control method of this embodiment, it specifically includes the following steps:

[0084] S20: Control the first spindle and the second spindle to synchronously copy and process the first area of the target circuit board. As Figure 3a shown, in the first area of the target circuit board, the first spindle 21 and the second spindle 22 can synchronously copy and process, and double-spindle processing can improve the processing efficiency. Here, the synchronization means that the processing parameters of the first spindle 21 and the second spindle 22 are kept consistent; here, the copying and processing means that the processing paths of the first spindle 21 and the second spindle 22 on the target circuit board 12 are mirror-symmetrical about the central axis 124.

[0085] ​S40: Control the first main spindle and the second main spindle to pick up the first tool in sequence to process the second area of the target circuit board. As Figure 3a shown, in the second area of the target circuit board, the first main spindle 21 picks up the first tool 111 to first process the odd layout area 1231 and the peripheral area 1232 on the left side of the central axis 124 of the target circuit board 12. After the transfer of the first tool 111 is completed, the second main spindle 22 picks up the first tool 111 to process the odd layout area 1231, the peripheral area 1232 and the special-shaped area 1233 on the left side of the central axis 124 of the target circuit board 12 first.

[0086] In this embodiment, the method for the first main spindle 21 and the second main spindle 22 to transfer the first tool 111 is as follows: The first main spindle 21 retracts the first tool 111 to the first tool holder 115, and the second main spindle 22 directly picks up the first tool 111 from the first tool holder 115 to perform the task of processing the second area 123. During the processing, if there is a need to change the tool, the first manipulator, the second manipulator, and the first tool holder 115 are used to perform the task of replacing the first tool 111. After the second main spindle 22 finishes processing, the first tool 111 is first retracted to the first tool holder 115, and then retracted to the first tool magazine 113 through the first manipulator. This method of transferring the first tool 111 is simpler and more efficient, saving time.

[0087] Embodiment Three

[0088] In this embodiment, taking the circuit board processing equipment as a 12-axis drilling equipment as an example, the structure and processing control method of the circuit board processing equipment are described in detail.

[0089] The structure and processing control method of the circuit board processing equipment in this embodiment are the same as those in Embodiment One and will not be elaborated. The difference lies in the different method of transferring the first tool 111. In this embodiment, the first main spindle 21 retracts the first tool 111 to the second tool holder 116, and the second main spindle 22 directly picks up the first tool 111 from the second tool holder 116 to perform the task of processing the second area 123. During the processing, if there is a need to change the tool, the first manipulator, the second manipulator, and the second tool holder 116 are used to perform the task of replacing the first tool 111. After the second main spindle 22 finishes processing, the first tool 111 is first retracted to the second tool holder 116, and then retracted to the first tool magazine 113 through the first manipulator or the second manipulator. Compared with the method of transferring the first tool 111 in Embodiment One, this transfer method is simpler and more efficient, saving time.

[0090] The embodiments of the present invention have been described above. The above description is exemplary and not exhaustive, and is also not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of the technology in the market, or to enable other ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A circuit board processing device, characterized in that, Including: A workbench, on which at least one processing position is provided, and a target circuit board is placed in each processing position; the target circuit board includes a first area and a second area; A cross beam is erected above the workbench, and at least one spindle assembly is slidably connected to the cross beam. The spindle assembly includes a first spindle and a second spindle; the first spindle picks up a first tool and the second spindle picks up a second tool to synchronously process the first area; the second spindle also picks up the first tool to process the second area.

2. The circuit board processing equipment according to claim 1, characterized in that, The first spindle and the second spindle pick up the first tool in sequence to process the second area.

3. The circuit board processing equipment according to claim 2, characterized in that, After the first spindle picks up the first tool to process the second area, it retracts the tool to the first tool holder or the second tool holder. After the second spindle picks up the first tool to process the second area, it retracts the tool to the first tool magazine.

4. The circuit board processing equipment according to claim 3, wherein, The processing position includes a processing area, and a target circuit board is placed in each processing area. During the process that the second spindle picks up the first tool to process the second area, in the first direction, the maximum stroke of the second spindle is less than or equal to three-quarters of the width of the processing area.

5. The circuit board processing equipment according to claim 2, characterized in that, During the process that the first spindle processes the second area, the second spindle is in the closed state; during the process that the second spindle processes the second area, the first spindle is in the closed state.

6. The circuit board processing equipment according to claim 2, wherein Before the second spindle picks up the first tool to process the second area, it also includes that the second spindle retracts the second tool to the second tool magazine through the second tool holder.

7. The circuit board processing equipment according to any one of claims 1 to 6, characterized in that, The circuit board processing equipment further includes a tool life management module, and the tool life management module respectively and real-time counts the service life of the first tool on the first spindle and the second spindle.

8. The circuit board processing equipment according to claim 7, characterized in that, The service life of the first tool is the sum or cumulative value of the service life on the first spindle and the second spindle.

9. The circuit board processing equipment according to any one of claims 1 to 6, characterized in that, The second area includes at least one of the following: (1) an odd layout area; (2) a peripheral area; (3) a special-shaped area.

10. A circuit board processing control method, characterized in that, Including: Controlling the first spindle and the second spindle to synchronously copy and process the first area of the target circuit board; Controlling the first spindle and the second spindle to pick up the first tool in sequence to process the second area of the target circuit board.

11. The circuit board processing control method according to claim 10, wherein In the first area, the first spindle and the second spindle simultaneously replace the first tool and the second tool. In the second area, the first spindle and the second spindle do not replace the first tool simultaneously.

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