Electronic device and control method thereof

Abstract

The present disclosure may provide an electronic device for automatically determining operation performance of a CPU and a cooling module of the electronic device according to at least one of a calculated load, a charge state, an operation state, and a usage environment of the CPU, a cooling device includes a control unit including a CPU, a board on which the CPU is mounted, a cooling module, a temperature sensor for sensing a temperature of the CPU and a temperature of the board, and a battery, in which the control unit differently determines at least one of a power level related to power consumption of the CPU and a cooling level related to cooling performance of the cooling module according to a state of charge of the battery.

Description

Technical Field

[0001] The present disclosure relates to a method for controlling the performance and / or temperature of an electronic device and an electronic device implementing the method. Background Art

[0002] An electronic device includes a main circuit board and a number of electronic components, and can perform operations while sending and receiving electrical signals therebetween.

[0003] Through this process, heat is inevitably generated in the electronic device, and the generated heat may increase according to the operating degree of the electronic device.

[0004] Excessive heat generated from the electronic device increases the surrounding temperature and may cause harm or discomfort to a user who accidentally touches the electronic device. Overheating may reduce the durability of the electronic device.

[0005] Accordingly, many electronic devices include one or more cooling modules such as a fan, and a technique is used to reduce heat generation in the electronic device by controlling the rotation speed of the fan.

[0006] One of the most important sources of heat generation on the main circuit board is the central processing unit (CPU) (or application processor (AP)).

[0007] When the power consumed by the CPU is restricted to reduce heat generation in the electronic device, the computing performance of the CPU may deteriorate, which may lead to deterioration of the overall performance of the electronic device.

[0008] However, when the rotation speed of the fan is increased to reduce heat generation in the electronic device while maintaining or increasing the power consumed by the CPU, the noise caused by the rotation of the fan may increase, which causes discomfort to the user.

[0009] For this reason, the electronic device may provide the user with various operation modes regarding the performance of the CPU and the cooling module (e.g., high performance mode, recommended mode, low noise mode, or silent mode), and may operate according to the operation mode selected by the user from among these operation modes. However, it is inconvenient for the user to manually select one operation mode from among the various operation modes by determining the computing load required by the electronic device every time the electronic device is used, predicting the CPU power consumption suitable for the computing load, and checking the user's usage environment. Summary of the Invention

[0010] Technical Problem

[0011] The present disclosure is proposed to solve this problem and provides an electronic device and a control method thereof, which automatically determine the operating performance of a central processing unit (CPU) and a cooling module of the electronic device according to at least one of a computational load of the CPU or the electronic device, a charging state of the electronic device, an operating state of the electronic device, or a usage environment of the electronic device.

[0012] Technical solution

[0013] To achieve the above object, the present disclosure provides an electronic device, the electronic device including: a controller including a central processing unit (CPU); a board equipped with the CPU; a cooling module; a temperature sensor configured to sense a CPU temperature and a board temperature; and a battery, wherein the controller is configured to differently determine at least one of a power level regarding power consumption of the CPU or a cooling level regarding cooling performance of the cooling module according to a charging state of the battery.

[0014] The controller may be configured to perform control to adjust at least one of the power level of the CPU or the cooling level of the cooling module when the board temperature exceeds a first temperature and the CPU temperature exceeds a second temperature higher than the first temperature.

[0015] The controller may be configured to perform control to adjust at least one of the power level of the CPU or the cooling level of the cooling module when the CPU temperature exceeds the second temperature for a first time interval or longer.

[0016] The controller may be configured to perform control to differently adjust at least one of the power level of the CPU or the cooling level of the cooling module according to whether the electronic device is in a charging mode or a non - charging mode.

[0017] The controller may be configured to perform control to differently adjust at least one of the power level of the CPU or the cooling level of the cooling module according to a charging degree of the battery when the electronic device is in the charging mode.

[0018] The cooling level may be adjusted to be inversely proportional to the charging degree of the battery, and the power level may be adjusted to be proportional to the charging degree of the battery.

[0019] The controller may be configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module when the board temperature exceeds a third temperature between the first temperature and the second temperature and the CPU temperature exceeds the second temperature for a second time interval longer than the first time interval.

[0020] The electronic device may further include a microphone configured to measure ambient noise, wherein the controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the magnitude of the ambient noise.

[0021] The ambient noise may not include user speech recognized through artificial intelligence learning.

[0022] The cooling level and the power level may be adjusted in proportion to the magnitude of the ambient noise.

[0023] The electronic device may further include an acceleration sensor configured to sense an acceleration value of the electronic device, wherein the controller may be configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the installation state of the electronic device determined based on the acceleration value.

[0024] When the acceleration value is greater than or equal to a reference value, the power level may be adjusted to decrease.

[0025] The controller may be configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the type of the currently executed application.

[0026] When only background applications are executed, at least one of the cooling level or the power level may be adjusted to decrease.

[0027] The controller may be configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the position of the electronic device.

[0028] To achieve the above object, the present disclosure provides a method for controlling an electronic device, the method including the steps of: sensing a CPU temperature of a central processing unit (CPU) and a board temperature of a board equipped with the CPU; checking a charging state of a battery; and differently determining at least one of a power level regarding power consumption of the CPU or a cooling level regarding cooling performance of the cooling module according to the charging state of the battery.

[0029] Advantageous Effects

[0030] The effects of the electronic device and its control method according to the present disclosure are as follows.

[0031] According to one aspect of the present disclosure, there is an advantage that the operating performance of the central processing unit (CPU) and the cooling module of the electronic device can be automatically determined according to at least one of the computing load of the CPU of the electronic device, the charging state of the electronic device, the operating state of the electronic device, or the usage environment of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a block diagram related to the present disclosure.

[0033] Figure 2 Shows examples of various operating modes to be set in the electronic device related to the present disclosure.

[0034] Figure 3 Shows examples of the power consumption level of the central processing unit (CPU) and the cooling level of the cooling module according to one aspect of the present disclosure.

[0035] Figure 4 is Figure 3 a detailed example of each cooling level.

[0036] Figure 5 Shows examples of the cooling level of the cooling module and the power consumption level of the CPU selected according to the charging state of the electronic device according to one aspect of the present disclosure.

[0037] Figure 6 and Figure 7 is a flowchart for determining the cooling level of the cooling module and the power consumption level of the CPU to be applied to the electronic device according to one aspect of the present disclosure.

[0038] Figure 8 is a flowchart for adjusting the cooling level of the cooling module and / or the power consumption level of the CPU to be applied to the electronic device based on a first condition according to one aspect of the present disclosure.

[0039] Figure 9 and Figure 10 is a curve showing the acceleration value of the electronic device according to the installation state.

[0040] Figure 11 is a flowchart for adjusting the cooling level of the cooling module and / or the power consumption level of the CPU to be applied to the electronic device based on a second condition according to one aspect of the present disclosure.

[0041] Figure 12 is a flowchart for adjusting the cooling level of the cooling module and / or the power consumption level of the CPU to be applied to the electronic device based on a third condition according to one aspect of the present disclosure.

[0042] Figure 13A flowchart for adjusting a cooling level of a cooling module and / or a power consumption level of a CPU to be applied to an electronic device based on a fourth condition according to an aspect of the present disclosure. Detailed implementation

[0043] A description will now be given in detail with reference to the accompanying drawings and in accordance with the exemplary embodiments disclosed herein. For a brief description with reference to the accompanying drawings, the same or equivalent components may be provided with the same reference numerals, and their descriptions will not be repeated. Generally, suffixes such as “module” and “unit” may be used to refer to elements or components. The use of such suffixes herein is only for the convenience of the description of this specification, and the suffix itself is not intended to give any special meaning or function. In the present disclosure, for the sake of brevity, content well known to those of ordinary skill in the relevant art is usually omitted. The accompanying drawings are used to help easily understand various technical features, and it should be understood that the embodiments presented herein are not limited by these drawings. Therefore, the present disclosure should be construed as extending to any modifications, equivalents, and alternatives other than those specifically listed in the accompanying drawings.

[0044] Each of these elements may be configured as a separate individual hardware module, or may be implemented as two or more hardware modules. Two or more elements may be implemented as a single hardware module. In some cases, at least one of these elements may be implemented as software.

[0045] It will be understood that although terms such as first and second may be used herein to describe various elements, these elements should not be limited by these terms. These terms are generally only used to distinguish one element from another.

[0046] It will be understood that when an element is referred to as being “connected” to another element, the element may be directly connected to the other element, or there may also be an intermediate element. In contrast, when an element is referred to as being “directly connected” to another element, there is no intermediate element.

[0047] Singular expressions may include plural expressions unless they indicate a completely different meaning from the context. Terms such as “including” or “having” are used herein, and this term should be understood as being intended to indicate the presence of several components, functions, or steps disclosed in this specification, and it should also be understood that more or fewer components, functions, or steps may equally be utilized.

[0048] In the present disclosure, the expression “at least one of A or B” may mean “A”, “B”, or “A and B”.

[0049] Refer to Figure 1 , an electronic device related to the present disclosure will be described. Figure 1 is a block diagram related to the present disclosure.

[0050] The electronic device 100 is shown as having components such as a wireless communication unit 110, an input unit 120, a sensing unit 140, an output unit 150, an interface unit 160, a memory 170, a controller 180, a power supply unit 190, and a cooling module 195.

[0051] It should be understood that Figure 1 not all of the components shown in

[0052] The wireless communication unit 110 generally includes one or more modules that allow for communication, such as wireless communication between the electronic device 100 and a wireless communication system, communication between the electronic device 100 and another electronic device, and communication between the electronic device 100 and an external server. In addition, the wireless communication unit 110 generally includes one or more modules that connect the electronic device 100 to one or more networks.

[0053] To facilitate such communication, the wireless communication unit 110 includes one or more of a broadcast receiving module 111, a mobile communication module 112, a wireless Internet module 113, a short-range communication module 114, and a location information module 115.

[0054] The location information module 115 is generally configured to detect, calculate, derive, or otherwise identify the location of the electronic device. As an example, the location information module 115 includes a Global Positioning System (GPS) module, a Wi-Fi module, or both. If needed, the location information module 115 can alternatively or additionally cooperate with any one of the other modules of the wireless communication unit 110 to obtain data related to the location of the electronic device.

[0055] As an example, when the electronic device uses the GPS module, signals sent from GPS satellites can be used to obtain the location of the electronic device. As another example, when the electronic device uses the Wi-Fi module, the location of the electronic device can be obtained based on information related to a wireless access point (AP) that sends wireless signals to or receives wireless signals from the Wi-Fi module.

[0056] The input unit 120 includes: a camera 121 for obtaining an image or video; a microphone 122, which is an audio input device for inputting an audio signal; and a user input unit 123 (e.g., a touch key, a button, a mechanical key, a soft key, etc.) for allowing a user to input information. Data (e.g., audio, video, image, etc.) is obtained by the input unit 120 and can be analyzed and processed by the controller 180 according to device parameters, user commands, and their combinations.

[0057] The microphone 122 is generally implemented to allow audio input to the electronic device 100. This audio input can be processed in various ways according to the functions being executed in the electronic device 100. If necessary, the microphone 122 may include various noise removal algorithms to remove unwanted noise generated during the reception of external audio.

[0058] The sensing unit 140 is generally implemented using one or more sensors configured to sense internal information of the electronic device, the surrounding environment of the electronic device, user information, and the like.

[0059] If necessary, the sensing unit 140 may alternatively or additionally include other types of sensors or devices such as a touch sensor, an acceleration sensor, a magnetic sensor, a G-sensor, a gyro sensor, a motion sensor, an RGB sensor, an infrared (IR) sensor, a finger scan sensor, an ultrasonic sensor, an optical sensor (e.g., the camera 121), the microphone 122, a battery gauge, an environmental sensor (e.g., a barometer, a hygrometer, a thermometer, a radiation detection sensor, a thermal sensor, and a gas sensor, etc.), and a chemical sensor (e.g., an electronic nose, a healthcare sensor, a biosensor, etc.), to name a few. The electronic device 100 may be configured to utilize the information obtained from the sensing unit 140, and particularly the information obtained from one or more sensors of the sensing unit 140 and combinations thereof.

[0060] In particular, the sensing unit 140 may include a board temperature sensor configured to measure the temperature of the main circuit board of the electronic device (hereinafter referred to as the board temperature), and a CPU temperature sensor configured to measure the temperature of the CPU (or AP) to be mounted on the main circuit board (hereinafter referred to as the CPU temperature). The CPU temperature sensor may also be configured within the CPU.

[0061] The output unit 150 is generally configured to output various types of information such as audio, video, tactile output, and the like. The output unit 150 is shown to have a display unit 151, an audio output module 152, a tactile module 153, and an optical output module 154. The display unit 151 may have an interlayer structure or an integrated structure with a touch sensor to facilitate a touch screen. The touch screen may provide an output interface between the electronic device 100 and the user and serve as the user input unit 123 that provides an input interface between the electronic device 100 and the user.

[0062] The interface unit 160 serves as an interface with various types of external devices that can be connected to the electronic device 100. For example, the interface unit 160 may include any one of a wired or wireless port, an external power supply port, a wired or wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, a headphone port, etc. In some cases, in response to an external device connected to the interface unit 160, the electronic device 100 may perform various control functions associated with the connected external device.

[0063] The memory 170 is generally implemented to store data to support various functions or features of the electronic device 100. For example, the memory 170 may be configured to store application programs executed in the electronic device 100, data or instructions for the operation of the electronic device 100, etc. Some of these application programs may be downloaded from an external server via wireless communication. Other application programs may be installed within the electronic device 100 during manufacturing or shipping, which is typically the case for the basic functions of the electronic device 100 (e.g., answering a call, making a call, receiving a message, sending a message, etc.). Generally, the application programs are stored in the memory 170, installed in the electronic device 100, and executed by the controller 180 to perform operations (or functions) for the electronic device 100.

[0064] In addition to operations associated with application programs, the controller 180 is generally also used to control the overall operation of the electronic device 100.

[0065] The controller 180 can provide or process information or functions suitable for the user by processing signals, data, information, etc. input or output by various components shown in Figure 1 or activating application programs stored in the memory 170. The controller 180 may include a CPU (or AP) to be installed on the main circuit board of the electronic device.

[0066] The power supply unit 190 may be configured to receive external power or provide internal power so as to supply appropriate power required for the operating elements and components included in the electronic device 100. The power supply unit 190 may include a battery, and the battery may be configured to be embedded in the device body or configured to be detachable from the device body.

[0067] The cooling module 195 is used to reduce the temperature inside the electronic device under the control of the controller 180. The cooling module 195 may include an air-cooled cooling module and a water-cooled cooling module. The air-cooled cooling module may include a fan for air circulation, while the water-cooled cooling module may include a motor for coolant circulation. The similarity between the fan and the motor is that both the fan and the motor may generate noise during operation.

[0068] Artificial intelligence (AI) can be utilized to automatically select operational performance in an electronic device.

[0069] AI will be described in more detail hereinafter.

[0070] Artificial intelligence (AI) refers to a field that studies artificial intelligence or methods capable of achieving artificial intelligence. Machine learning refers to a field that defines various problems processed in the field of AI and studies methods for solving these problems. Machine learning can also be defined as an algorithm for improving the performance of any task through a stable task experience.

[0071] An artificial neural network (ANN) can refer to a model that generally has problem-solving capabilities and is composed of artificial neurons (nodes) that form a network through combinations of synapses as a model used in machine learning. An ANN can be defined by the connection pattern between neurons in different layers, the learning process of updating model parameters, and / or the activation function for generating output values.

[0072] An ANN can include an input layer, an output layer, and optionally one or more hidden layers. Each layer includes one or more neurons, and an ANN can include synapses connecting the neurons. In an ANN, each neuron can output an input signal, which is input through the function values of synapses, weights, and deflection activation functions.

[0073] Model parameters refer to parameters determined through learning and include the weights of synapse connections and the deflections of neurons. Hyperparameters refer to parameters that should be configured before learning in a machine learning algorithm and include the learning rate, the number of repetitions, the mini-batch size, the initialization function, etc.

[0074] The purpose of learning of an ANN can be understood as determining model parameters that minimize a loss function. The loss function can be used as an indicator for determining the optimal model parameters during the learning process of an ANN.

[0075] According to the learning scheme, machine learning can be classified into supervised learning, unsupervised learning, and reinforcement learning.

[0076] Supervised learning refers to a method of training an ANN in a state where labels for training data are given. The label can represent the correct answer (or result value) that the ANN should infer when the training data is input into the ANN. Unsupervised learning can refer to a method of training an ANN in a state where labels for training data are not given. Reinforcement learning can refer to a learning method in which an agent defined in a specific environment is trained to select behaviors or sequences of behaviors that maximize the cumulative reward in each state.

[0077] In an ANN, machine learning implemented as a deep neural network (DNN) including multiple hidden layers is also called deep learning. Deep learning is part of machine learning. In the following text, machine learning includes deep learning.

[0078] Object detection models using machine learning include the You Only Look Once (YOLO) model of a single-stage scheme, the Region with Convolutional Neural Network (R-CNN) model of a two-stage scheme, and the like.

[0079] The You Only Look Once (YOLO) model is such a model that when an image is only looked at once, the objects present in the image and the positions of the corresponding objects can be predicted.

[0080] The You Only Look Once (YOLO) model divides the original image into grids of the same size. Then, for each grid, the number of bounding boxes specified in a predefined form around the center of the grid is predicted, and the reliability is calculated based on the predicted number.

[0081] Thereafter, it can be included whether the image contains an object or only the background, and the positions with high object reliability can be selected, so that the object category can be identified.

[0082] The Region with Convolutional Neural Network (R-CNN) model is a model that can detect objects faster than the RCNN model and the Fast RCNN model.

[0083] The Region with Convolutional Neural Network (R-CNN) model will be described in detail.

[0084] First, a feature map is extracted from an image via a Convolutional Neural Network (CNN) model. Based on the extracted feature map, multiple Regions of Interest (RoIs) are extracted. RoI pooling is performed on each Region of Interest.

[0085] RoI pooling is such a process that a grid of the feature map onto which the Region of Interest is projected is set to adapt to a pre-determined H x W size, and the maximum value is extracted for each cell included in each grid to extract a feature map with an H x W size.

[0086] A feature vector can be extracted from the feature map with an H x W size, and the recognition information of the object can be obtained from the feature vector.

[0087] In the following text, reference will be made to Figure 2 Describe various operation modes in the electronic device. Figure 2 Examples of various operation modes to be set in the electronic device related to the present disclosure are shown.

[0088] In an electronic device, the power consumption of the CPU can be controlled by controlling the voltage and / or clock speed of the CPU. A plurality of operation modes can be predefined to determine the allowable range of the power consumption of the CPU. The range of the allowable board temperature in each operation mode can be defined.

[0089] For example, as Figure 2 shown in (2-1) of, the high performance mode, the recommended mode, the low noise mode, and the silent mode can be predefined as a plurality of operation modes. More or fewer modes than these can be predefined as a plurality of operation modes.

[0090] In the figure, for the high performance mode, the power consumption of the CPU is allowed to be in the range of about 16 watts to 28 watts, and the board temperature is allowed to be as high as about 61 degrees.

[0091] In the figure, for the recommended mode, the power consumption of the CPU is allowed to be in the range of about 12 watts to 25 watts, and the board temperature is allowed to be as high as about 54 degrees.

[0092] In the figure, for the low noise mode, the power consumption of the CPU is allowed to be in the range of about 8 watts to 12 watts, and the board temperature is allowed to be as high as about 54 degrees.

[0093] In the figure, for the silent mode, the power consumption of the CPU is allowed to be in the range of about 6 watts to 8 watts, and the board temperature is allowed to be as high as about 54 degrees.

[0094] In each operation mode, the rotational speed range of the fan (or motor) of the cooling module can be defined to keep the temperature within the corresponding maximum allowable board temperature range.

[0095] For example, assume that the user has manually set the electronic device 100 to operate in the low noise mode. Assume that the electronic device 100 drives the CPU with the power consumption corresponding to point A, and the cooling module operates to maintain the board temperature corresponding to point A.

[0096] While maintaining the low noise mode, a high-specification program (or application) with a computational load suitable for point B can be executed on the electronic device 100. For example, the executed high-specification program can be an editing program for high-definition video or a high-definition game program.

[0097] However, since the electronic device 100 is set to the low noise mode, the CPU of the electronic device 100 can only consume up to the maximum power consumption (about 12W) defined in the low noise mode, as indicated by point C. Therefore, the electronic device 100 may not be able to correctly execute the high-specification program.

[0098] Conversely, as Figure 2As shown in (2-2), for example, assume that the user manually sets the electronic device 100 to operate in the high-performance mode. Assume that the electronic device 100 drives the CPU with a power consumption corresponding to point B, and the cooling module operates to maintain the board temperature corresponding to point B.

[0099] While maintaining the low-noise mode, a low-specification program with a computational load suitable for point A can be executed on the electronic device 100. For example, the executed low-specification program can be a document editing program.

[0100] However, since the electronic device 100 is set to the high-performance mode, even if the electronic device 100 executes a low-specification program, the CPU may inevitably consume the minimum power consumption (about 16W) defined in the high-performance mode, as shown at point D. Despite executing the low-specification program, even if the electronic device 100 needs to operate the cooling module at a high speed to match the high-performance mode, this may cause unnecessary noise in the electronic device 100.

[0101] In addition to the multiple operation modes, the present disclosure newly proposes an automatic mode in which the power consumption level of the CPU and the cooling level of the cooling module (e.g., the rotation level of the fan or motor) in the electronic device 100 will be automatically set.

[0102] Hereinafter, examples of the power consumption level of the CPU and the cooling level of the cooling module according to one aspect of the present disclosure will be described. Figure 3 Examples of the power consumption level of the CPU and the cooling level of the cooling module according to one aspect of the present disclosure are shown.

[0103] Hereinafter, assume that the cooling module is air-cooled and includes a fan for air circulation. However, the following description can also be applied to a cooling module that is water-cooled and includes a motor for coolant circulation.

[0104] Multiple cooling levels can be pre-defined for the cooling module. The cooling level can also be understood as the cooling performance level of the cooling module. For example, as Figure 3 shown in (3-1), four cooling levels, namely the first cooling level, the second cooling level, the third cooling level, and the fourth cooling level, can be pre-defined. However, there can be fewer or more cooling levels than this.

[0105] In the figure, for the first cooling level, the cooling module rotates at a speed of up to 3500 rpm, and when rotating at the maximum speed, it is generally expected to generate about 25 dB of noise.

[0106] In the figure, for the second cooling level, the cooling module rotates at a speed of up to 4000 rpm, and when rotating at the maximum speed, it is generally expected to generate about 30 dB of noise.

[0107] In the figure, for the third cooling level, the cooling module rotates at a speed of up to 4500 rpm, and when rotating at the maximum speed, it is generally expected to generate a noise of about 35 dB.

[0108] In the figure, for the fourth cooling level, the cooling module rotates at a speed of up to 4700 rpm, and when rotating at the maximum speed, it is generally expected to generate a noise of about 40 dB.

[0109] Multiple power consumption levels (hereinafter also referred to as power levels) of the CPU can be pre-defined for the CPU. For example, as Figure 3 shown in (3-2) of , four power consumption levels, namely the first power level, the second power level, the third power level, and the fourth power level, can be pre-defined. However, there can be fewer or more cooling levels than this.

[0110] In the figure, for the first power level, the CPU operates such that the power consumption is 5W to 10W, and it is expected that at the maximum power consumption, the board temperature generally rises to about 48°C.

[0111] In the figure, for the second power level, the CPU operates such that the power consumption is 10W to 20W, and it is expected that at the maximum power consumption, the board temperature generally rises to about 57°C.

[0112] In the figure, for the third power level, the CPU operates such that the power consumption is 15W to 30W, and it is expected that at the maximum power consumption, the board temperature generally rises to about 60°C.

[0113] In the figure, for the fourth power level, the CPU operates such that the power consumption is 18W to 30W, and it is expected that at the maximum power consumption, the board temperature generally rises to about 64°C.

[0114] The controller 180 can control the electronic device 100 to operate according to one of the first cooling level to the fourth cooling level and one of the first power level to the fourth power level.

[0115] Each cooling level can be defined such that the rotational speed varies according to the CPU temperature without exceeding the maximum rotational speed of the cooling module. This will be further explained with reference to Figure 4 below. Figure 4 is Figure 3 a detailed example of each cooling level.

[0116] As Figure 4 shown in (4-1) of , in the case of the first cooling level, the cooling module can be driven at an intensity selected from the first intensity to the fifth intensity according to the CPU temperature.

[0117] AsFigure 4 As shown in (4-2), in the case of the second cooling level, the cooling module can be driven at an intensity selected from the first intensity to the sixth intensity according to the CPU temperature.

[0118] As Figure 4 shown in (4-3), in the case of the third cooling level, the cooling module can be driven at an intensity selected from the first intensity to the seventh intensity according to the CPU temperature.

[0119] As Figure 4 shown in (4-4), in the case of the fourth cooling level, the cooling module can be driven at an intensity selected from the first intensity to the eighth intensity according to the CPU temperature.

[0120] The figure shows that the CPU temperature for determining the intensity in each cooling level varies according to whether the electronic device 100 is charging and according to the expected noise at each intensity.

[0121] According to whether the electronic device 100 is currently charging, when the electronic device 100 is currently charging, one cooling level can be selected from multiple cooling levels and one power level can be selected from multiple power levels according to the charging level, and the electronic device 100 can operate according to the selected cooling level and power level. This will be further explained with reference to Figure 5 further. Figure 5 shows an example of the cooling level of the cooling module and the power consumption level of the CPU selected according to the charging state of the electronic device according to an aspect of the present disclosure.

[0122] When the electronic device 100 is connected to a power outlet and the battery of the electronic device 100 is currently charging (i.e., when the electronic device 100 is operating in a charging mode), the cooling level and the power level can be selected differently according to the charging level of the electronic device 100.

[0123] For example, when the charging level of the electronic device 100 is less than 30%, the fourth cooling level can be selected, and the second power level can be selected.

[0124] When the charging level of the electronic device 100 is 30% or more and less than 95%, the third cooling level can be selected, and the third power level can be selected.

[0125] When the charging level of the electronic device 100 is equal to or greater than 95%, the third cooling level can be selected, and the second power level can be selected.

[0126] When the electronic device 100 is not connected to a power outlet and the battery of the electronic device 100 is not currently charging (i.e., the electronic device 100 is operating in a non-charging mode), a third cooling level can be selected, and a second power level can be selected.

[0127] Multiple charging degrees can be examples and can be changed. The cooling level and power level in each charging state are only exemplary, and different cooling levels or different power levels can be applied in each charging state.

[0128] When Figure 5 the cooling level and power level in each charging state shown in Figure 6 and Figure 7 are applied to the electronic device 100, the board temperature and the CPU temperature can be further considered. This will be further explained with reference to Figure 6 and Figure 7 which are flowcharts for determining the cooling level to be applied to the cooling module of the electronic device and the power consumption level of the CPU according to an aspect of the present disclosure.

[0129] The controller 180 can control the electronic device 100 to operate according to a default cooling level and a default power level [S601]. In Figure 6 the default cooling level and the default power level are respectively illustrated as the first cooling level and the first power level, but are not limited thereto.

[0130] The controller 180 can determine whether the board temperature of the electronic device 100 exceeds a first temperature (e.g., 48 degrees) [S603].

[0131] When the board temperature does not exceed the first temperature, the controller 180 can control the electronic device 100 to continue operating according to the default cooling level and the default power level [S601].

[0132] When the board temperature exceeds the first temperature, the controller 180 can determine whether the CPU temperature of the electronic device 100 exceeds a second temperature (e.g., 75 degrees) and is maintained for a first time interval (e.g., 30 seconds) [S605]. This second temperature can be higher than the first temperature.

[0133] When the CPU temperature does not exceed the second temperature for the first time interval, the controller 180 can control the electronic device 100 to continue operating according to the default cooling level and the default power level [S601].

[0134] When the CPU temperature exceeds the second temperature and is maintained for the first time interval, the controller 180 can control the electronic device 100 to operate at another cooling level and / or another power level based on the charging state of the electronic device 100.

[0135] That is, the controller 180 may check the charging state of the electronic device 100 [S607].

[0136] For example, when the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged to the first charging level (e.g., 95%) or higher, the controller 180 may control the electronic device 100 to operate according to the third cooling level and the third power level [S609 and S611].

[0137] When the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged to the second charging level (e.g., 30%) or higher and less than the first charging level, the controller 180 may control the electronic device 100 to operate according to the third cooling level and the second power level [S613 and S615].

[0138] When the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged below the second charging level, the controller 180 may control the electronic device 100 to operate according to the fourth cooling level and the second power level [S617 and S619].

[0139] That is, compared with when the charging level is higher, when the charging level is lower, a higher cooling level is selected, so the factor of heat generation of the electronic device 100 can be reduced by selecting a lower power level. This is considering the fact that when the charging level is lower, the charging speed increases, which may increase the heat generation of the electronic device 100 due to charging.

[0140] When the electronic device 100 is in the non - charging mode, the controller 180 may control the electronic device 100 to operate according to the third cooling level and the second power level [S621].

[0141] Then, the controller 180 may determine whether the board temperature is less than or equal to the third temperature (e.g., 46 degrees) [S623]. This third temperature may be lower than the first temperature.

[0142] When the board temperature is less than the third temperature, the controller 180 may control the electronic device 100 to operate according to the default cooling level and the default power level [S601].

[0143] However, when the board temperature is not less than the third temperature, the controller 180 may determine whether the board temperature exceeds the fourth temperature (e.g., 57 degrees) [S703]. This fourth temperature may be between the first temperature and the second temperature.

[0144] When the board temperature does not exceed the fourth temperature, the process may return to operation S607.

[0145] When the board temperature exceeds the fourth temperature, the controller 180 may determine whether the CPU temperature of the electronic device 100 exceeds the second temperature and is maintained for a second time interval (e.g., 1 minute) [S705]. This second time interval may be longer than the first time interval. Operation S705 may be used to determine whether a high-specification program with a large computational load is currently being executed in the electronic device 100.

[0146] When the CPU temperature of the electronic device 100 does not exceed the second temperature for the second time interval, the process may return to operation S607.

[0147] When the CPU temperature exceeds the second temperature and is maintained for the second time interval, the controller 180 may control the electronic device 100 to operate at another cooling level and / or another power level based on the charging state of the electronic device 100. The fact that the second time interval is maintained while the CPU temperature exceeds the second temperature may be inferred to mean that a high-specification program with a large computational load is currently being executed in the electronic device 100.

[0148] That is, the controller 180 may check the charging state of the electronic device 100 [S707].

[0149] For example, when the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged to the first charging level or higher, the controller 180 may control the electronic device 100 to operate according to the fourth cooling level and the fourth power level [S709 and S711].

[0150] When the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged to the second charging level or higher and less than the first charging level, the controller 180 may control the electronic device 100 to operate according to the fourth cooling level and the fourth power level [S713 and S715].

[0151] When the electronic device 100 is in the charging mode and it is determined that the battery of the electronic device 100 is charged below the second charging level, the controller 180 may control the electronic device 100 to operate according to the fourth cooling level and the third power level [S717 and S719].

[0152] When the electronic device 100 is in the non-charging mode, the controller 180 may control the electronic device 100 to operate according to the fourth cooling level and the fourth power level [S721].

[0153] It can be seen that the corresponding cooling levels of operations S711, S715, S719, and S721 are equal to or higher than the above operations S611, S615, S619, and S621.

[0154] Then, the controller 180 may determine whether the board temperature is less than or equal to a fifth temperature (e.g., 55 degrees) [S723]. The fifth temperature may be higher than the first temperature and lower than the fourth temperature.

[0155] When the board temperature is equal to or greater than the fifth temperature, the process may return to operation S607.

[0156] When the board temperature is not equal to or greater than the fifth temperature, the process may return to operation S707.

[0157] The determined cooling level and / or power level for the electronic device 100 may be re-adjusted according to another first condition (ambient noise condition). For example, the cooling level and / or power level for the electronic device 100 may be adjusted according to the ambient noise when the user uses the electronic device 100. The adjustment of the cooling level and / or power level of the electronic device 100 according to the first condition will be described with reference to Figure 8 The adjustment of the cooling level and / or power level of the electronic device 100 according to the first condition will be further described. Figure 8 is a flowchart for adjusting the cooling level of a cooling module to be applied to an electronic device and / or the power consumption level of a CPU based on a first condition according to an aspect of the present disclosure.

[0158] As described above, it is assumed that a second cooling level and a third power level are determined for the electronic device 100 [S801].

[0159] The controller 180 may sense audio by activating the microphone 122 [S803].

[0160] The controller 180 may determine whether user speech is detected in the sensed audio [S805]. The user speech may be pre-stored in the electronic device 100 or learned through AI. The controller 10 may determine whether the user speech exists in the sensed audio by comparing the sensed audio with the user speech.

[0161] When user speech is detected, the controller 180 may control the electronic device 100 to continue operating according to the second cooling level and the third power level [S801].

[0162] When user speech is not detected, the controller 180 may measure the ambient noise level of the electronic device 100 from the sensed audio [S807].

[0163] The controller 180 may control the electronic device 100 to operate at another cooling level and / or another power level based on the ambient noise level of the electronic device 100.

[0164] For example, when the ambient noise level is equal to or greater than a first noise level (e.g., 70 dB), the controller 180 may control the electronic device 100 to operate according to a fourth cooling level and a fourth power level [S809 and S811]. The electronic device 100 is used in a noisy place, so the user becomes less sensitive to the noise of the cooling module. Therefore, the controller 180 may increase the cooling level and the power level to improve the performance of the electronic device 100.

[0165] When the ambient noise level is less than a second noise level (e.g., 30 dB), the controller 180 may control the electronic device 100 to operate according to a second cooling level and a first power level or a second power level [S813 and S815]. The electronic device 100 is used in a quiet place, so the user becomes more sensitive to the noise of the cooling module. Therefore, the controller 180 may increase the cooling level and the power level to reduce the noise of the electronic device 100.

[0166] When the ambient noise level is equal to or higher than the second noise level and less than the first noise level, the electronic device 100 may be controlled to continue operating according to a second cooling level and a third power level [S817 and S801].

[0167] The above operation S805 may be omitted. That is, the controller 180 may distinguish the type of sound through deep learning, limit and exclude the ambient noise of the user's voice (e.g., the noise of people around talking or car noise), and control the electronic device 100 to operate at another cooling level and / or another power level based on the magnitude of the limited ambient noise.

[0168] When an application for video conferencing is executed on the electronic device 100, the controller 180 may prevent the execution of the adjustment of the cooling level and / or the power level according to Figure 8 thereof.

[0169] The cooling level and / or power level thus determined for the electronic device 100 can be readjusted according to another second condition (the installation state of the electronic device). For example, the cooling level and / or power level for the electronic device 100 can be adjusted according to whether the user uses the electronic device 100 by placing it on a desk, table, or stand, or according to whether the user holds the electronic device 100 in his / her hand or on his / her knee. In a usage environment where the user is in contact with the electronic device on the human body (e.g., the knee) rather than on a desk or table, the user is more likely to use the electronic device for low-specification programs (e.g., document editing programs) rather than high-specification programs (e.g., high-definition video editing programs or high-definition game programs). In a usage environment where the user is in contact with the human body, the user may be sensitive to the surface temperature of the electronic device, and even a slight increase in the surface temperature may cause discomfort. Therefore, it is not necessary to increase the power level in a usage environment where the user is in contact with the human body.

[0170] First, the determination of the installation state of the electronic device 100 will be further explained with reference to Figure 9 and Figure 10 . Figure 9 and Figure 10 are curves showing the acceleration values of the electronic device according to the installation state.

[0171] The controller 180 can distinguish whether the electronic device 100 is used in a fixed installation state such as a desk, table, or stand or in a non-fixed installation state such as the user's knee by using the acceleration values sensed by the acceleration sensor of the sensing unit 140.

[0172] As Figure 9 shows, when the electronic device 100 is in a fixed installation state, the acceleration values of X, Y, and Z are maintained at relatively constant values, and when the electronic device 100 moves or is in a non-fixed installation state, the acceleration values of X, Y, and Z may change relatively significantly. When the electronic device is placed on the knee rather than in a fixed installation state, the degree of jitter increases due to typing and muscle movement based on the characteristics of human use, and the change in the acceleration value when placed on the knee is greater than when placed in a fixed installation state. As can be seen from Figure 10 , when the data of these acceleration values is frequency-converted, the acceleration values are relatively significantly larger in various frequency ranges.

[0173] Accordingly, the controller 180 may distinguish the mounting state of the electronic device 100 based on the acceleration value. For example, the controller 180 may distinguish the mounting state of the electronic device 100 by comparing the sum of the acceleration values of X, Y, and Z measured over a specific period with a predefined reference value (e.g., 0.5) in a specific frequency band (e.g., a band of 2 Hz or less) in the frequency domain when performing a frequency transformation (FFT) on the sum. If the sum of the acceleration values is greater than or equal to the reference value, the controller 180 may determine that the electronic device 100 is in a non-fixed mounting state, and if the sum of the acceleration values is less than the reference value, it may determine that the electronic device 100 is in a fixed mounting state.

[0174] Hereinafter, with reference to Figure 11 , the adjustment of the cooling level and / or power level of the electronic device 100 will be explained according to a second condition of the electronic device 100. Figure 11 is a flowchart for adjusting the cooling level of a cooling module to be applied to an electronic device and / or the power consumption level of a CPU based on a second condition according to an aspect of the present disclosure.

[0175] As described above, it is assumed that a third cooling level and a third power level are determined for the electronic device 100 [S1101].

[0176] The controller may determine the mounting state of the electronic device based on the acceleration value of the electronic device 100 sensed as described with reference to Figure 9 and Figure 10 [S103].

[0177] When it is determined that the electronic device 100 is in a fixed mounting state, the controller 180 may control the electronic device 100 to continue operating according to the third cooling level and the third power level [S1101].

[0178] However, when it is determined that the electronic device 100 is in a non-fixed mounting state, the controller 180 may control the electronic device 100 to operate according to the third cooling level and the first power level or the second power level [S105]. That is, while maintaining the cooling level, the power level may be reduced. However, the present disclosure is not limited thereto. The cooling level may be increased.

[0179] The cooling level and / or power level for the electronic device 100 determined as such may be readjusted according to another third condition (the type of the currently executed application). For example, in the electronic device 100, background applications (e.g., an OS update application or a security application) may be executed in a specific time domain (e.g., at night). In this case, when the noise of the electronic device 100 becomes large, it may disturb the sleeping user. Therefore, when only background applications are executed in the electronic device 100, it is not necessary to keep the power level of the electronic device 100 unchanged, and the cooling level also needs to be reduced. Reference will be made to Figure 12 to further describe the adjustment of the cooling level and / or power level of the electronic device 100 according to the third condition. Figure 12 is a flowchart for adjusting the cooling level of a cooling module to be applied to an electronic device and / or the power consumption level of a CPU based on a third condition according to an aspect of the present disclosure.

[0180] As described above, it is assumed that a third cooling level and a third power level are determined for the electronic device 100 [S201].

[0181] The controller 180 may check the applications currently executed in the electronic device 180 [S203].

[0182] When the applications currently executed in the electronic device 180 are only background applications, the controller 180 may control the electronic device 100 to operate at a second cooling level and a second power level [S1205 and S1207]. That is, the electronic device 180 may reduce at least one of the cooling level or the power level.

[0183] When the applications currently executed in the electronic device 180 include foreground applications, the controller 180 may control the electronic device 100 to continue operating at a third cooling level and a third power level [S1209 and S1201].

[0184] The cooling level and / or power level for the electronic device 100 determined as such may be readjusted according to another fourth condition (the location of the electronic device). For example, when the electronic device 100 is used in a quiet place such as a library, it is important to reduce noise even if the performance is somewhat reduced. When the electronic device 100 is used in a workplace such as a company, it may be necessary to improve the performance even if there is some noise. Reference will be made to Figure 13 to further describe the adjustment of the cooling level and / or power level of the electronic device 100 according to the fourth condition. Figure 13 is a flowchart for adjusting the cooling level of a cooling module to be applied to an electronic device and / or the power consumption level of a CPU based on a fourth condition according to an aspect of the present disclosure.

[0185] As described above, it is assumed that a third cooling level and a third power level are determined for the electronic device 100 [S1301].

[0186] The controller 180 may check the current position of the electronic device 100 [S1303]. The current position may be identified by the position information module 115.

[0187] When the position of the electronic device 100 is identified as a first position (e.g., home), the controller 180 may control the electronic device 100 to continue operating at the third cooling level and the third power level [S1305 and S1301].

[0188] When the position of the electronic device 100 is identified as a second position (e.g., company), the controller 180 may control the electronic device 100 to operate at a fourth cooling level and the third power level [S1307 and S1309]. In some cases, the power level may also increase as the cooling level increases.

[0189] When the position of the electronic device 100 is identified as a third position (e.g., company), the controller 180 may control the electronic device 100 to operate at a second cooling level and a second power level [S1311 and S1313]. In some cases, the power level may be maintained even when the cooling level is decreased.

[0190] Various embodiments may be implemented using a machine-readable medium storing instructions for execution by a processor to perform the various methods presented herein. Examples of possible machine-readable media include HDD (hard disk drive), SSD (solid state drive), SDD (silicon disk drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, other types of storage media presented herein, and combinations thereof. If desired, the machine-readable medium may be implemented in the form of a carrier wave (e.g., transmission via the Internet). The processor may include the controller 180 of the electronic device.

[0191] The above-described embodiments are merely exemplary and should not be considered as limiting the present disclosure. The present teachings can be easily applied to other types of methods and devices. This specification is intended to be illustrative and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. The features, structures, methods, and other features of the exemplary embodiments described herein may be combined in various ways to obtain additional and / or alternative exemplary embodiments.

Claims

1. An electronic device, the electronic device comprising: a controller including a central processing unit (CPU); a board equipped with the CPU; a cooling module; a temperature sensor configured to sense the CPU temperature and the board temperature; and a battery, wherein the controller is configured to differently determine at least one of a power level regarding the power consumption of the CPU or a cooling level regarding the cooling performance of the cooling module according to the charging state of the battery.

2. The electronic device according to claim 1, wherein, The controller is configured to perform control to adjust at least one of the power level of the CPU or the cooling level of the cooling module when the board temperature exceeds a first temperature and the CPU temperature exceeds a second temperature higher than the first temperature.

3. The electronic device according to claim 2, wherein, The controller is configured to perform control to adjust at least one of the power level of the CPU or the cooling level of the cooling module when the CPU temperature exceeds the second temperature for a first time interval or longer.

4. The electronic device according to claim 1, wherein, The controller is configured to perform control to differently adjust at least one of the power level of the CPU or the cooling level of the cooling module according to whether the electronic device is in a charging mode or a non - charging mode.

5. The electronic device according to claim 4, wherein, The controller is configured to perform control to differently adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the charging degree of the battery when the electronic device is in the charging mode.

6. The electronic device according to claim 5, wherein, The cooling level is adjusted to be inversely proportional to the charging degree of the battery, and the power level is adjusted to be proportional to the charging degree of the battery.

7. The electronic device according to claim 2, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module when the board temperature exceeds a third temperature between the first temperature and the second temperature and the CPU temperature exceeds the second temperature for a second time interval longer than the first time interval.

8. The electronic device according to claim 1, the electronic device further includes a microphone configured to measure ambient noise, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the magnitude of the ambient noise.

9. The electronic device according to claim 8, wherein, The ambient noise does not include user speech recognized through artificial intelligence learning.

10. The electronic device according to claim 8, wherein, The cooling level and the power level are adjusted proportionally to the magnitude of the ambient noise.

11. The electronic device according to claim 1, the electronic device further includes an acceleration sensor configured to sense an acceleration value of the electronic device, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the installation state of the electronic device determined based on the acceleration value.

12. The electronic device according to claim 12, wherein, When the acceleration value is greater than or equal to a reference value, the power level is adjusted to decrease.

13. The electronic device according to claim 1, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the type of the currently executed application.

14. The electronic device according to claim 14, wherein, When only background applications are executed, at least one of the cooling level or the power level is adjusted to decrease.

15. The electronic device according to claim 1, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the position of the electronic device.

16. A method for controlling an electronic device, the method for controlling the electronic device comprising the following steps: Sensing the CPU temperature of a central processing unit (CPU) and the board temperature of a board equipped with the CPU; Checking the charging state of a battery; And Differently determining at least one of a power level regarding the power consumption of the CPU or a cooling level regarding the cooling performance of a cooling module according to the charging state of the battery.

17. The method for controlling an electronic device according to claim 16, the method for controlling the electronic device further comprising the following steps: Performing control to differently adjust at least one of the power level of the CPU or the cooling level of the cooling module according to whether the electronic device is in a charging mode or a non-charging mode.

18. The method for controlling an electronic device according to claim 16, the method for controlling the electronic device further comprising the following steps: Measuring ambient noise; and Performing control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the magnitude of the ambient noise.

19. The method for controlling an electronic device according to claim 16, the method for controlling the electronic device further comprising the following steps: Sensing an acceleration value of the electronic device; And Performing control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the installation state of the electronic device determined based on the acceleration value.

20. The method of controlling an electronic device according to claim 16, wherein, The controller is configured to perform control to further adjust at least one of the power level of the CPU or the cooling level of the cooling module according to the type of the currently executed application.

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