Bearing material as well as preparation method and application thereof

Abstract

The invention provides a carrying material and a preparation method and application thereof, and the carrying material comprises the following components by weight: 30-50 parts of vinyl silicone oil; 35 to 45 parts of hydrogen-containing silicone oil; 5 to 25 parts of organic silicon MQ resin; 0.1 to 5 parts of a silicone powder auxiliary agent; 0.03 to 0.5 part of a catalyst; 0.03 to 5 parts of an inhibitor; the vinyl silicone oil comprises polyvinyl silicone oil. Functionalized modified polyvinyl and hydrogen-containing silicone oil systems are introduced into the carrying material provided by the invention and matched with other vinyl silicone oil, so that the system after cross-linking reaction can simultaneously have the special properties of high adhesion, high hardness and low residual adhesive, the risk of residual adhesive is avoided, and meanwhile, the purposes of adjustable thickness, good film surface TTV (Total Temperature Vulcanization), good adhesion and the like are achieved. And the bearing uniformity is good.

Description

Technical Field

[0001] The present invention belongs to the technical field of Micro-LED mass transfer, and relates to a carrier material, a preparation method thereof and an application, in particular to a carrier material for Micro-LED laser mass transfer, a preparation method thereof and an application. Background Art

[0002] Micro-LED (micro light-emitting diode) is a display technology that miniaturizes and matrices the traditional LED structure and uses CMOS integrated circuit technology to make a driving circuit to achieve address control and individual driving of each pixel. Compared with the currently mature technologies such as LCD and OLED, Micro-LED has obvious advantages in various indicators such as brightness, lifespan, contrast ratio, response time, energy consumption, viewing angle and resolution. Coupled with its advantages of self-luminescence, simple structure, small size and energy saving, it has significant application prospects in the field of high-end display technologies. This technology is particularly crucial in multiple application scenarios, including but not limited to virtual and augmented reality devices, smart wearable devices, and high-definition display screens. Precisely and efficiently transferring a large number of Micro-LED chips from their growth substrate to a receiving substrate or a driving circuit board is a key step in realizing commercial production. The industrialization of mass transfer faces the dual challenges of achieving large-scale transfer accuracy and efficiency of Micro-LED chips. This process requires extremely high positioning accuracy to ensure that each Micro-LED chip can be accurately aligned to the target position, and at the same time, it is necessary to ensure a high yield and production efficiency in the transfer process to meet the requirements of economy and large-scale production.

[0003] The selection of the carrier material is crucial for optimizing the Micro-LED transfer process. An ideal carrier medium should have excellent initial adhesion performance, appropriate hardness, sufficient support force, and excellent tensile strength and total thickness variation (TTV) control. In some application scenarios, it is required to have a high modulus to ensure the yield rate of Micro-LED chips in subsequent laser carrier and welding processes. To avoid insufficient brightness after lighting, the carrier layer also needs to ensure that there is no residual glue on the chip, which is also a key factor in ensuring the advantages of Micro-LED.

[0004] Therefore, in this field, there is a desire to develop a carrier material for Micro-LED laser mass transfer, which has excellent initial adhesion performance, high elastic modulus, etc. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a receiving material and a preparation method and application thereof, and specifically to provide a receiving material for Micro-LED laser mass transfer and a preparation method and application thereof. The receiving material provided by the present invention has high modulus and high initial adhesion.

[0006] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a receiving material, wherein the receiving material comprises the following components in parts by weight:

[0008]

[0009] The vinyl silicone oil includes polyvinyl silicone oil.

[0010] The receiving material provided by the present invention can not only effectively receive the chips after release and sorting, and perform laser welding process with high yield, but also effectively improve production efficiency, improve transfer yield, have a higher transfer window and welding bonding window, a larger equipment process window, strong practicality, high efficiency and high precision. The receiving material provided by the present invention introduces a functionally modified polyvinyl and hydrogen-containing silicone oil system, and is matched with other vinyl silicone oils (such as methyl vinyl silicone oil, etc.), so that the system after the cross-linking reaction can simultaneously have the special properties of high adhesion, high hardness and low residual glue, avoiding the risk of residual glue, and at the same time achieving the advantages of adjustable thickness, good membrane surface TTV and good receiving uniformity.

[0011] The present invention can design silicone films with different surface initial adhesion and different hardness through different types of silicone oils and silicone MQ resins to adapt to different customer application scenarios.

[0012] In the present invention, the amount of vinyl silicone oil used in the receiving material can be 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 46 parts, 48 parts, 50 parts, etc., based on weight parts.

[0013] In the present invention, the amount of hydrogen-containing silicone oil used in the receiving material can be 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts, 44 parts, 45 parts, etc., calculated by weight.

[0014] In the present invention, the receiving material is measured in parts by weight, and the amount of the silicone MQ resin can be 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 25 parts, etc.

[0015] In the present invention, for the receiving material by weight parts, the dosage of silicone powder additive can be 0.1 part, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, etc.

[0016] In the present invention, for the receiving material by weight parts, the dosage of the catalyst can be 0.03 part, 0.05 part, 0.08 part, 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, etc.

[0017] In the present invention, for the receiving material by weight parts, the dosage of the inhibitor can be 0.03 part, 0.05 part, 0.08 part, 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, etc.

[0018] Preferably, the polyvinyl silicone oil includes any one or a combination of at least two of phenyl polyvinyl silicone oil, methyl polyvinyl silicone oil, polyvinyl fluorosilicone oil, epoxy modified polyvinyl silicone oil, amino modified polyvinyl silicone oil, and alkane modified polyvinyl silicone oil.

[0019] Preferably, the weight parts of polyvinyl silicone oil in the receiving material are 25 - 45 parts, such as 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts, 44 parts, 45 parts, etc.

[0020] Preferably, the vinyl silicone oil also includes any one or a combination of at least two of methyl terminal vinyl silicone oil, polyether modified terminal vinyl silicone oil, terminal vinyl fluorosilicone oil, terminal hydroxyl vinyl silicone oil, and methyl vinyl silicone oil.

[0021] The vinyl silicone oil is the main component of the material system, the main component of the receiving material, and also the main component of the curing crosslinking reaction. It constitutes the backbone of the organosilicon molecular chain segment, has good acid and alkali resistance, can achieve good receiving, adhesion, support, and toughening effects, and is also the main material for better receiving micro light emitting diode chips. The silicone oil itself has good fluidity. Through the crosslinking of the organosilicon oil itself, a crosslinked network is formed, and the film will have excellent receiving performance and can withstand a certain pressure without structural damage. It is recommended to use less than 4 types and select them according to viscosity and special additional properties by yourself.

[0022] Preferably, the hydrogen-containing silicone oil includes any one of methyl-terminated hydrogen-containing silicone oil, phenyl-terminated hydrogen-containing silicone oil, methyl-terminated hydrogen-containing silicone oil, fluorocarbon-terminated hydrogen-containing silicone oil, epoxy-modified hydrogen-containing silicone oil, methyl side chain hydrogen-containing silicone oil, amino side chain hydrogen-containing silicone oil, mercapto side chain hydrogen-containing silicone oil, carboxyl side chain hydrogen-containing silicone oil, and polyether side chain hydrogen-containing silicone oil, or a combination of at least two of them. The recommended number is less than 3.

[0023] The hydrogen-containing silicone oil is another main component of the material system and also the main component of the curing cross-linking reaction. It constitutes the rest of the entire silicone molecular chain segment, causing the molecular chain to be cross-linked, and plays an important role in adjusting the final hardness and initial adhesion of the material.

[0024] Preferably, the organosilicon MQ resin includes liquid organosilicon MQ resin and / or solid organosilicon MQ resin, preferably liquid organosilicon MQ resin.

[0025] The organosilicon MQ resin is an auxiliary resin of the material system, a minor component of the receiving material, used for reinforcement, has a relatively high molecular weight, and can play a good role in toughening, reinforcing, improving hardness and resilience.

[0026] Preferably, the MQ value of the silicone MQ resin is 0.4 to 1.4, such as 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, etc. A silicone MQ resin with a lower MQ value can be selected according to the required hardness. By matching different MQ values, the heat resistance, elasticity, hardness and other physical properties of the final formula can be quantitatively controlled, and the recommended number of use is less than 3.

[0027] Preferably, the weight proportion of the silicone MQ resin in the receiving material is 5 to 10 parts, for example, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5 parts, 10 parts, etc.

[0028] Preferably, the silicone powder additive includes any one of vinyl silicone, hydroxy silicone, epoxy silicone, acrylic silicone, amino silicone, and ethoxy silicone, or a combination of at least two of them, and the recommended number is less than two.

[0029] The silicone powder additive is an auxiliary material of the material system. As an additive, the surface energy of the silicone system is usually low. Adding such additives can effectively help improve its bonding performance. The silicone powder additive can be cross-linked into the molecular chain of the matrix to improve the low-temperature cracking or high-temperature warping of the colloidal film or elastomer. However, if silicone powder is added excessively to the receiving material, it is easy to cause agglomeration due to the strong adsorption between silicone molecules, thereby restraining the movement of the molecular chain, resulting in the overall toughness of the adhesive material or film being lost, resulting in brittleness, so it is necessary to balance the bonding and mechanical properties.

[0030] Preferably, the weight parts of the silicone powder additive in the receiving material are 0.5 - 1 part, such as 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part, 1 part, etc.

[0031] Preferably, the catalyst includes any one or a combination of at least two of platinum catalyst, palladium catalyst, rhodium catalyst, nickel catalyst, ionic liquid complex metal catalyst, heterogeneous catalyst, and other transition metal catalysts.

[0032] Preferably, the catalyst includes any one or a combination of at least two of chloroplatinic acid, triphenylphosphine (Ph3P) palladium, bis(1,3 - divinyl - 1,1,3,3 - tetramethyldisiloxane) platinum, platinum((0)-1,3 - divinyl - 1,1,3,3 - tetramethyldisiloxane, platinum(0)-1,3 - divinyl - 1,1,3,3 - tetramethyldisiloxane, (trimethyl)methylcyclopentadienyl platinum, and rhodium acetylacetonate. It is recommended that the number of types used is less than or equal to 2.

[0033] The catalyst is an initiator for catalytic curing cross - linking reaction. The initiation conditions of different types of catalysts are different, such as light, heat, moisture, ultraviolet, etc. Different catalysts can be used to adjust the hardness, toughness, elongation at break, storage energy value, etc. of the final cured product.

[0034] Preferably, the weight parts of the catalyst in the receiving material are 0.05 - 0.1 part, such as 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, etc.

[0035] Preferably, the inhibitor includes any one or a combination of at least two of organic compound inhibitors containing nitrogen, phosphorus, and sulfur, heavy metal ion compound inhibitors, alkyne compound inhibitors, alkynol inhibitors, and alkoxysilylated alkynyl compounds.

[0036] Preferably, the inhibitor includes any one or a combination of at least two of butynedioate, 3 - phenyl - 1 - butyn - 3 - ol, 3,5 - dipropyl - 1 - octyn - 3 - ol, methyl butynol, 4 - methyl - 1 - butyn - 3 - ol, ethynylcyclohexanol, P2 - 1, and P2 - 2.

[0037] The inhibitor is an additive to inhibit curing cross - linking and maintain the stability of the catalyst during storage and transportation. Due to the instability of the formulation, it is prone to spontaneous cross - linking reaction under the catalysis of the catalyst. Therefore, the inhibitor is an essential additive in the formulation. Adding the inhibitor can greatly improve the stability of the overall formulation system, making it more in line with the needs of industrial production. In addition, the inhibitor can also control the curing reaction rate and inhibit unwanted side reactions.

[0038] Preferably, the weight parts of the inhibitor in the receiving material are 0.03 to 0.08 parts, such as 0.03 parts, 0.04 parts, 0.05 parts, 0.06 parts, 0.07 parts, 0.08 parts, etc.

[0039] Second, the present invention provides a preparation method of the receiving material as described in the first aspect, and the preparation method includes the following steps:

[0040] (1) Mix vinyl silicone oil, silicone MQ resin, silicone powder additive, and catalyst to obtain A glue;

[0041] (2) Mix hydrogen-containing silicone oil and inhibitor to obtain B glue;

[0042] (3) Mix A glue and B glue to obtain the receiving material.

[0043] Preferably, the mixing in step (1) is carried out in a high-speed disperser.

[0044] Preferably, the rotation speed of the high-speed disperser is 1000 - 2000 rpm, such as 1000 rpm, 1200 rpm, 1400 rpm, 1600 rpm, 1800 rpm, 2000 rpm, etc., and the dispersion time is not less than 5 h, such as 6 h, 8 h, etc.

[0045] Preferably, the temperature of the mixing in step (1) is lower than 35 °C, such as 33 °C, 30 °C, etc. By introducing cooling water, the mixing temperature can be controlled below 35 °C.

[0046] Preferably, the mixing in step (2) is carried out in a stirrer.

[0047] Preferably, the rotation speed of the mixing in step (2) is 300 - 500 rpm, such as 300 rpm, 350 rpm, 400 rpm, 450 rpm, 500 rpm, etc., and the mixing time is not less than 3 h, such as 4 h, 6 h, 8 h, etc.

[0048] Preferably, the rotation speed of the mixing in step (3) is 300 - 500 rpm, such as 300 rpm, 350 rpm, 400 rpm, 450 rpm, 500 rpm, etc., and the mixing time is not less than 12 h, such as 12 h, 14 h, 18 h, etc.

[0049] Preferably, the temperature of the mixing in step (3) is lower than 35 °C, such as 33 °C, 30 °C, etc. By introducing cooling water, the mixing temperature can be controlled below 35 °C.

[0050] Preferably, after the mixing in step (3), a filtering step is further included.

[0051] Preferably, the filtration specifically includes: filtering successively with filter elements of 1 μm and 0.45 μm.

[0052] In a third aspect, the present invention provides an application of the receiving material as described in the first aspect in Micro-LED laser mass transfer.

[0053] Preferably, the method of the application includes the following steps:

[0054] Coat the receiving material onto the second substrate and cure it to obtain a second substrate provided with a temporary receiving layer;

[0055] Place the first substrate provided with LED chips and a laser-induced release layer and the second substrate provided with a temporary receiving layer in a mass transfer device, such that the LED chips are disposed opposite to the temporary receiving layer and not connected; the LED chips are disposed on a side of the laser-induced release layer away from the first substrate;

[0056] Irradiate the laser-induced release layer with a laser to release the LED chips at corresponding positions to the temporary receiving layer of the second substrate, thus completing Micro-LED laser mass transfer.

[0057] Preferably, the temperature of the curing is ≥160 °C, such as 160 °C, 165 °C, 170 °C, 175 °C, 180 °C, 185 °C, 190 °C, 195 °C, 200 °C, 205 °C, 210 °C or 220 °C, etc., preferably 160 - 200 °C.

[0058] Preferably, the time of the curing is 5 - 20 min, such as 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, 11 min, 12 min, 13 min, 14 min, 15 min, 16 min, 17 min, 18 min, 19 min, 20 min, etc.

[0059] Preferably, the thickness of the temporary receiving layer is 5 - 150 μm, such as 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, etc.

[0060] Preferably, the distance between the surface of the laser-induced release layer away from the first substrate and the surface of the temporary receiving layer away from the second substrate is 20 - 200 μm, such as 20 μm, 40 μm, 60 μm, 80 μm, 100 μm, 120 μm, 140 μm, 160 μm, 180 μm, 200 μm, etc.

[0061] Preferably, the energy density of the laser irradiation is 50 - 300 mJ / cm2 , such as 50 mJ / cm 2 , 70 mJ / cm 2 , 100 mJ / cm 2 , 120 mJ / cm 2 , 150 mJ / cm 2 , 180 mJ / cm 2 , 200 mJ / cm 2 , 230 mJ / cm 2 , 250 mJ / cm 2 , 270 mJ / cm 2 , 300 mJ / cm 2 and so on.

[0062] Compared with the prior art, the present invention has the following beneficial effects:

[0063] The present invention provides a function - modified multi - vinyl and hydrogen - containing silicone oil system for the receiving material, which is combined with other vinyl silicone oils (such as methyl vinyl silicone oil, etc.), so that the system after cross - linking reaction can simultaneously possess special properties such as high adhesion force, high hardness, and low residual glue residue, avoiding the risk of residual glue, and at the same time achieving the advantages of adjustable thickness, good TTV of the film surface, and good receiving uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] Figure 1 It is a schematic diagram of chip accuracy after Micro - LED laser mass transfer using the receiving material provided in Example 1. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0065] The technical solutions of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be regarded as specific limitations to the present invention.

[0066] The sources of some components in the following examples and comparative examples are shown in Table 1 below:

[0067] Table 1

[0068]

[0069] Examples 1 - 4, Comparative Examples 1 - 3

[0070] Examples 1 - 4 and Comparative Examples 1 - 3 respectively provide a receiving material, and the preparation raw materials of the receiving material are shown in Table 2 below. The dosage of each component in Table 2 is in parts by weight.

[0071] The preparation method of the above - mentioned receiving material is as follows:

[0072] (1) Add vinyl silicone oil, silicone MQ resin, silicone powder additive, and catalyst into a high-speed disperser, and stir at a high speed at 1300 rpm and a temperature of 25 °C for 6 h to obtain Adhesive A;

[0073] (2) Add hydrogen-containing silicone oil and inhibitor into a blender, and mix and stir at 300 rpm for 5 h to obtain Adhesive B;

[0074] (3) Add Adhesive A into the blender where Adhesive B is located, start stirring and mixing, the stirring speed is 430 rpm, the stirring duration is 15 h, control the temperature below 35 °C, and then filter successively with filter cartridges of 1 μm and 0.45 μm sizes to obtain the said receiving material.

[0075] Table 2

[0076]

[0077]

[0078] Use the receiving materials provided by the above-mentioned examples and comparative examples for Micro-LED laser mass transfer, and the specific process method is as follows:

[0079] (1) Coat the laser-induced release layer material (LAP811, purchased from Shenzhen Huaxun Semiconductor Materials Co., Ltd.) on a sapphire substrate, and the coating thickness is 20 μm;

[0080] (2) Place the sapphire substrate coated with the laser-induced release layer material at 100 °C, and the solvent volatilizes to form a film to obtain a sapphire substrate 1 provided with a laser-induced release layer;

[0081] (3) Oppositely arrange the sapphire substrate 2 provided with an LED chip and the sapphire substrate 1 provided with a laser-induced release layer, and perform thermal compression bonding at 60 °C for 10 min;

[0082] (4) Use the laser lift-off technology, the laser wavelength is 355 nm, the spot size is 30*40 μm, and the laser energy density is about 200 mJ / cm 2 Treat the sapphire substrate 2 provided with an LED chip, and transfer the LED chip to the side of the laser-induced release layer away from the sapphire substrate 1;

[0083] (5) Remove the sapphire substrate 2 and clean it to obtain a sapphire substrate 1 provided with a laser-induced release layer, and an LED chip is arranged on the side of the laser-induced release layer away from the sapphire substrate 1;

[0084] (6) Spin-coat the said receiving material onto a sapphire substrate 3, the spinning speed is 800 rpm, the time is 60 s, and the thickness is 50 μm;

[0085] (7) The sapphire substrate 3 coated with the receiving material is cured at 180 °C for 12 min to obtain a sapphire substrate 3 provided with a temporary receiving layer;

[0086] (8) Place the sapphire substrate 1 provided with the laser-induced release layer obtained in step (5) (an LED chip is provided on the side of the laser-induced release layer away from the sapphire substrate 1) and the sapphire substrate 3 provided with the temporary receiving layer obtained in step (7) in a mass transfer device, so that the LED chip is disposed opposite to the temporary receiving layer and not connected;

[0087] The distance between the surface of the laser-induced release layer away from the sapphire substrate 1 and the surface of the temporary receiving layer away from the sapphire substrate 3 is 110 μm;

[0088] Use a multi-band laser with an energy density of 150 mJ / cm 2 to irradiate the laser-induced release layer, release the LED chip at the corresponding position to the temporary receiving layer of the sapphire substrate 3, and complete the Micro-LED laser mass transfer;

[0089] (9) Use a 1064 nm laser to transfer the LED chip on the surface of the temporary receiving layer to the TFT substrate for laser mass soldering.

[0090] Characterize the performance of the receiving materials provided in the above examples and comparative examples, and the yield of the chips during Micro-LED laser mass transfer using the receiving materials provided in the above examples and comparative examples. The specific tests are as follows:

[0091] The following categories are the characterizations of the chips during Micro-LED laser mass transfer for this receiving material:

[0092] 1. Initial adhesion: Automatically obtained by the instrument sensor after the indenter of the universal testing machine contacts the adhesive material.

[0093] 2. Hardness: Tested with reference to GB / T 531.1-2008.

[0094] 3. Storage value: The company independently developed a test method: a nanoindentation mechanical testing system, and the data curve is obtained by pressing with a fixed force, and the data can be read from the obtained curve.

[0095] 4. Storage modulus: The company independently developed a test method: a rotational rheometer is used to test the storage modulus, and the shear modulus is used for characterization. The storage modulus value can be directly read from the obtained data curve.

[0096] The following categories are the characterizations of the chips during Micro-LED laser mass transfer for this receiving material:

[0097] 1. Chip transfer yield: Samples are taken and observed under an optical microscope. Chip transfer yield = X2 / X1 * 100%;

[0098] Among them, X1 is the number of Micro-LED chips on the growth substrate, and X2 is the number of Micro-LED chips successfully transferred to the receiving layer (successful transfer means that the Micro-LED chips do not turn over or stand upright and are not broken).

[0099] 2. Cleaning loss rate: After cleaning, the number of chips washed away is divided by the total number of received chips.

[0100] Among them, after Micro-LED laser mass transfer using the receiving material provided in Example 1, the schematic diagram of chip accuracy is as Figure 1 shown, and it can be seen from Figure 1 that: The chip transfer yield in the figure is close to 99.99%.

[0101] The above performance test results are shown in Table 3 below:

[0102] Table 3

[0103]

[0104] It can be seen from Table 3 that the receiving materials provided in the embodiments of the present invention all have relatively high initial adhesion (0.63 - 1.37 N), chip transfer yield (99.97% - 99.99%), and relatively low cleaning loss rate (0.96% - 2.21%).

[0105] Compared with Example 1, the chip transfer yield of the receiving material provided in Comparative Example 1 is significantly reduced, and the cleaning loss rate is increased; the chip transfer yield of the receiving material provided in Comparative Example 2 is significantly reduced; the initial adhesion, chip transfer yield, and cleaning loss rate of the receiving material provided in Comparative Example 3 are significantly reduced.

[0106] The applicant declares that the present invention uses the above embodiments to illustrate the receiving material of the present invention and its preparation method and application, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent substitution of the raw materials selected by the present invention, addition of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A receiving material, characterized in that, The receiving material, by weight parts, comprises the following components: The vinyl silicone oil includes polyvinyl silicone oil.

2. The receiving material according to claim 1, wherein The polyvinyl silicone oil includes any one or a combination of at least two of phenyl polyvinyl silicone oil, methyl polyvinyl silicone oil, polyvinyl fluorosilicone oil, epoxy-modified polyvinyl silicone oil, amino-modified polyvinyl silicone oil, and alkane-modified polyvinyl silicone oil; Preferably, the weight parts of the polyvinyl silicone oil in the receiving material are 25 - 45 parts; Preferably, the vinyl silicone oil further includes any one or a combination of at least two of methyl-terminated vinyl silicone oil, polyether-modified terminal vinyl silicone oil, terminal vinyl fluorosilicone oil, terminal hydroxyl vinyl silicone oil, and methyl vinyl silicone oil.

3. The receiving material according to claim 1 or 2, characterized in that, The hydrogen-containing silicone oil includes any one or a combination of at least two of methyl-terminal-side hydrogen-containing silicone oil, phenyl-terminal-side hydrogen-containing silicone oil, methyl-terminal hydrogen-containing silicone oil, fluorohydrocarbon-group-terminal hydrogen-containing silicone oil, epoxy-group-modified terminal hydrogen-containing silicone oil, methyl-side-chain hydrogen-containing silicone oil, amino-side-chain hydrogen-containing silicone oil, mercapto-side-chain hydrogen-containing silicone oil, carboxyl-side-chain hydrogen-containing silicone oil, and polyether-side-chain hydrogen-containing silicone oil; 4. The receiving material according to any one of claims 1-3, characterized in that The organosilicon MQ resin includes liquid organosilicon MQ resin and / or solid organosilicon MQ resin; Preferably, the MQ value of the organosilicon MQ resin is 0.4 - 1.4; Preferably, the weight parts of the organosilicon MQ resin in the receiving material are 5 - 10 parts.

5. The receiving material according to any one of claims 1-4, characterized in that The silicone powder additive includes any one or a combination of at least two of vinyl silicone, hydroxyl silicone, epoxy silicone, acrylic silicone, amino silicone, and ethoxy silicone; Preferably, the weight parts of the silicone powder additive in the receiving material are 0.5 - 1 part.

6. The receiving material according to any one of claims 1-5, characterized in that, The catalyst includes any one or a combination of at least two of platinum catalyst, palladium catalyst, rhodium catalyst, nickel catalyst, ionic liquid complex metal catalyst, heterogeneous catalyst, and other transition metal catalysts; Preferably, the catalyst includes any one or a combination of at least two of chloroplatinic acid, triphenylphosphine palladium, bis(1,3-divinyl-1,1,3,3-tetramethyldisiloxane) platinum, platinum((0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane, platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane, (trimethyl)methylcyclopentadienyl platinum, and rhodium acetylacetonate; Preferably, the weight parts of the catalyst in the receiving material are 0.05 - 0.1 part.

7. The receiving material according to any one of claims 1-6, characterized in that, The inhibitor includes any one or a combination of at least two of organic compound inhibitors containing nitrogen, phosphorus, and sulfur, heavy metal ion compound inhibitors, alkyne compound inhibitors, alkynol inhibitors, and alkoxysilylated alkynyl compounds; Preferably, the inhibitor includes any one or a combination of at least two of butynedioate, 3-phenyl-1-butyn-3-ol, 3,5-propyl-1-octyn-3-ol, methyl butynol, 4-methyl-1-butyn-3-ol, ethynylcyclohexanol, P2-1, and P2-2; Preferably, the weight parts of the inhibitor in the receiving material are 0.03 - 0.08 part.

8. A method for preparing a material for receiving, as described in any one of claims 1-7, characterized in that, The preparation method includes the following steps: (1) Mix vinyl silicone oil, silicone MQ resin, silicone powder additive, and catalyst to obtain Adhesive A; (2) Mix hydrogen-containing silicone oil and inhibitor to obtain Adhesive B; (3) Mix Adhesive A and Adhesive B to obtain the said receiving material.

9. The preparation method according to claim 8, wherein The mixing in step (1) is carried out in a high-speed disperser; Preferably, the rotation speed of the high-speed disperser is 1000 - 2000 rpm, and the dispersion time is not less than 5 h; Preferably, the temperature of the mixing in step (1) is lower than 35°C; Preferably, the mixing in step (2) is carried out in a stirrer; Preferably, the rotation speed of the mixing in step (2) is 300 - 500 rpm, and the mixing time is not less than 3 h; Preferably, the rotation speed of the mixing in step (3) is 300 - 500 rpm, and the mixing time is not less than 12 h; Preferably, the temperature of the mixing in step (3) is lower than 35°C; Preferably, after the mixing in step (3), a filtering step is further included.

10. Application of the receiving material according to any one of claims 1 - 7 in Micro-LED laser mass transfer; Preferably, the method of the application includes the following steps: Coat the receiving material onto a second substrate and cure it to obtain a second substrate provided with a temporary receiving layer; Place a first substrate provided with an LED chip and a laser-induced release layer and a second substrate provided with a temporary receiving layer in a mass transfer device, such that the LED chip is disposed opposite to the temporary receiving layer and not connected; the LED chip is disposed on the side of the laser-induced release layer away from the first substrate; Irradiate the laser-induced release layer with laser to release the LED chip at the corresponding position to the temporary receiving layer of the second substrate, and complete Micro-LED laser mass transfer; Preferably, the curing temperature is ≥160°C, preferably 160 - 200°C; Preferably, the curing time is 5 - 20 min; Preferably, the thickness of the temporary receiving layer is 5 - 150 μm; Preferably, the distance between the surface of the laser-induced release layer away from the first substrate and the surface of the temporary receiving layer away from the second substrate is 20 - 200 μm; Preferably, the energy density of the laser irradiation is 50 to 300 mJ / cm 2 .

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