Wafer test probe station

Abstract

The invention relates to a wafer test probe station which comprises a machine body, a mounting table, a plurality of adjusting seats and probes, the mounting table is mounted on the machine body, the adjusting seats are mounted on the machine body, the probes are mounted on the adjusting seats, the adjusting seats are provided with adjusting columns and adjusting assemblies for adjusting the angles of the adjusting columns, the adjusting columns are provided with mounting assemblies, and the mounting assemblies are mounted on the mounting table. The installation assembly comprises an installation pipe, a cushion cylinder, an extrusion spring and an extrusion block, one end of the installation pipe is connected to the end of the adjusting column, a plurality of extrusion grooves are formed in the side wall of the installation pipe, the extrusion block is slidably matched in the extrusion grooves, the movement direction of the extrusion block passes through the axis of the installation pipe, and the extrusion spring is installed between the installation pipe and the extrusion block. The cushion cylinder is connected to the inner wall of the installation pipe, during installation, the probe penetrates through the cushion cylinder and is located among the multiple extrusion blocks, and an unlocking assembly for unlocking the probe is arranged on the installation pipe. The wafer test probe station has the effect of improving the applicability of the wafer test probe station.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a wafer testing probe station. Background Art

[0002] The wafer test probe station is an important equipment used in semiconductor manufacturing and testing. It is mainly used to perform electrical testing and functional verification on chips on wafers. Its important functions include electrical testing, functional testing, fault analysis, process research and development, process quality control, design verification and research purposes.

[0003] A Chinese patent with announcement number CN206930687U discloses a probe test and correction device for wafer testing, which includes a base plate, a rotating disk is arranged on the base plate, a screw is arranged in the rotating disk, the extension directions of the screw are perpendicular to each other, a placement disk is arranged on the rotating disk, a protruding block is arranged in the placement disk, the screw is adjacent to the protruding block, an adsorption groove is arranged on the end face of the placement disk, a vacuum tube is passed through the rotating disk and the placement disk, the vacuum tube is connected to the adsorption groove, a connecting rod is arranged on the base plate, a first end of the connecting rod is connected to the first rotating rod, and a second end of the connecting rod is adjacent to the vacuum tube, fixed frames are arranged on both sides of the rotating disk, the placement disk is arranged between the fixed frames, and a correction plate is also arranged on the fixed frame, the center of the opening on the correction plate is collinear with the center of the placement disk, adopting the above structure, through the multi-dimensional free adjustment of the correction yellow diamond, in the process of auxiliary welding probe, the probe can accurately contact the chip on the wafer to ensure the accuracy of the probe welding position.

[0004] Regarding the related technologies mentioned above, it is mentioned in the prior art that the movable block is driven to move by the fifth screw to clamp the probe between the movable block and the fixed block. However, the probe body is very slender. In the above clamping method, one side (fixed block) is stationary and the other side (movable block) applies force. The probe is prone to deformation and bending after being subjected to unidirectional force. The deformed probe will affect the subsequent installation of the probe on the one hand, and the operability of the probe test on the other hand, thereby reducing the applicability of the wafer test probe station. Summary of the invention

[0005] In order to improve the applicability of a wafer testing probe station, the present application provides a wafer testing probe station.

[0006] The wafer test probe station provided in this application adopts the following technical solution: A wafer testing probe station comprises a body, a mounting platform, an adjustment seat and a probe, wherein the mounting platform is mounted on the body, a plurality of adjustment seats are mounted on the body, and the probe is mounted on the adjustment seat, an adjustment column and an adjustment component for adjusting the angle of the adjustment column are provided on the adjustment seat, and a mounting component is provided on the adjustment column, and the mounting component comprises a mounting tube, a cushion tube, an extrusion spring and an extrusion block, one end of the mounting tube is connected to the end of the adjustment column, a plurality of extrusion grooves are provided on the side wall of the mounting tube, the extrusion block is slidably fitted in the extrusion groove, and the moving direction of the extrusion block passes through the axis of the mounting tube, the extrusion spring is mounted between the mounting tube and the extrusion block, the cushion tube is connected to the inner wall of the mounting tube, and during installation, the probe passes through the cushion tube and is located between a plurality of the extrusion blocks, and an unlocking component for unlocking the probe is provided on the mounting tube.

[0007] By adopting the above technical solution, when installing the probe, the unlocking assembly is used to move several squeezing blocks, and then the probe is inserted into the cushion tube until the squeezing block is located, and the unlocking assembly is released. The squeezing block is moved by the squeezing spring force until the probe is squeezed, thereby limiting the freedom of the probe and realizing the installation of the probe. The probe is firmly installed by installing the assembly, and several squeezing blocks squeeze the probe at the same time, so that all angles of the probe are subjected to the same squeezing force at the same time. Compared with the unilateral squeezing force in the prior art, the possibility of deformation of the probe is reduced, the operability of the probe when in use is ensured, and the applicability of the wafer test probe station is improved.

[0008] Optionally, the unlocking assembly includes a rotating ring, a resistance block and a connecting column, the rotating ring is rotatably connected to the mounting tube, the resistance block is connected to the rotating ring, a resistance arc surface is provided on the resistance block, and the distance between the resistance arc surface and the axis of the mounting tube gradually increases from one end to the other end of the resistance block as a reference direction, and the connecting column is connected to the extrusion block and resists the resistance arc surface.

[0009] By adopting the above technical solution, when unlocking the probe, the rotating ring is turned to drive the resistance block to rotate, and the resistance arc surface applies pressure to the connecting column, driving the extrusion block to move, so that the probe is freed from the pressure of the extrusion block. At this time, the probe can be directly pulled out to achieve the effect of unlocking the probe.

[0010] Optionally, the adjustment assembly includes a connecting frame, an adjusting screw and an adjusting block, the connecting frame is connected to the adjustment seat, the adjusting column is rotatably connected to the connecting frame, an adjustment groove is opened at one end of the adjusting column close to the connecting frame, two oppositely arranged sliding rods are connected to the adjusting block, the adjusting block is slidably engaged with the adjusting grooves through the sliding rods, the adjusting screw is vertically rotatably connected to the connecting frame, the adjusting screw passes through the adjusting block and is threadably engaged with the adjusting block.

[0011] By adopting the above technical solution, when adjusting the probe angle, the adjusting screw is rotated to move the adjusting block, driving the adjusting column to rotate. At this time, a sliding fit occurs between the adjusting block and the adjusting column, thereby driving the mounting tube to rotate, thereby achieving the effect of adjusting the probe angle.

[0012] Optionally, the mounting table includes a rotating table and a fixed seat, the rotating table is rotatably connected to the fixed seat, a rotating component for driving the rotating table to rotate is provided on the fixed seat, a placement groove is provided on the rotating table, an exhaust pipe is installed in the rotating table, an exhaust pump is installed on the rotating table, and the exhaust pipe connects the placement groove and the exhaust pump.

[0013] By adopting the above technical solution, when placing the wafer, the wafer is placed in the placement groove, and the vacuum pump is started to form a negative pressure inside the vacuum pipe to suck the wafer and achieve the effect of wafer installation.

[0014] Optionally, the rotating component includes a toggle gear and a connecting gear ring, an installation cavity is opened in the fixed seat, a connecting cylinder is connected to the rotating platform, the connecting cylinder is located in the installation cavity, the connecting gear ring is connected to the connecting cylinder, the toggle gear is rotatably connected to the fixed seat and meshes with the connecting gear ring, and a limiting component that limits the rotation of the toggle gear is provided on the fixed seat.

[0015] By adopting the above technical solution, when adjusting the wafer test angle, the toggle gear is rotated to rotate the connecting gear ring, drive the connecting cylinder to rotate, and rotate the rotating table. Finally, the limiting component is used to limit the rotation of the toggle gear to achieve the effect of adjusting the wafer test angle.

[0016] Optionally, the limiting assembly includes a toggle block, a limiting rod, a limiting block and a limiting spring. A limiting hole is formed on the fixed seat, and the limiting rod is slidably fitted in the limiting hole. The limiting block is connected to one end of the limiting rod. A limiting groove is formed on the limiting block that matches the shape of a single tooth of the toggle gear. The limiting spring is installed in the limiting hole and is located between the inner end wall of the limiting hole and the limiting rod. An extension rod is connected to the limiting rod, and an avoidance groove is formed on the fixed seat. The extension rod is slidably fitted in the avoidance groove. The toggle block is connected to the end of the extension rod and is located outside the fixed seat.

[0017] By adopting the above technical solution, when limiting the toggle gear, the toggle block is moved to drive the limiting rod to move, and the limiting spring is compressed until the wafer rotates to a specified angle. The toggle block is released, and the limiting rod moves in the opposite direction due to the force of the limiting spring, driving the limiting block to move, so that a tooth in the toggle gear is embedded in the limiting groove, thereby achieving the effect of limiting the rotation of the toggle gear.

[0018] Optionally, a lifting assembly is provided on the fixed seat, and the lifting assembly includes a lifting platform, a hydraulic box, a piston block and a driving rod. A receiving groove is opened on the bottom wall of the placement groove, and the lifting platform is located in the receiving groove. A connecting rod is connected to the lifting platform, and the connecting rod is slidably matched with the rotating table. The hydraulic box is connected to the bottom wall of the installation cavity, and one end of the hydraulic box is connected to a fixed cylinder, and the bottom end of the connecting rod is slidably matched in the fixed cylinder. The piston block is slidably matched inside the hydraulic box, and hydraulic oil is filled in the hydraulic box corresponding to the area between the piston block and the connecting rod. The piston block is connected to a fixed rod, and the driving rod is rotatably connected to the fixed seat and is threadedly matched with the fixed rod.

[0019] By adopting the above technical solution, after the wafer test is completed, the vacuum pump is turned off, the driving rod is rotated to move the fixed rod, driving the piston block to move, and the connecting rod is pressurized by hydraulic oil to raise the lifting platform, so that the wafer rises and leaves the placement slot, providing convenience for removing the wafer.

[0020] Optionally, a connecting ring is connected to the rotating table, a plurality of balls are embedded on the bottom wall of the connecting ring, a fixing ring is connected to the fixing seat, the connecting ring is slidably fitted in the fixing ring, and the balls abut against the inner bottom wall of the fixing ring.

[0021] By adopting the above technical solution and arranging the connecting ring, the balls and the fixing ring, a stable rotating environment of the rotating table is provided on the one hand, and the rotating table is made to rotate more smoothly on the other hand.

[0022] In summary, the present application includes at least one of the following beneficial technical effects: 1. When installing the probe, use the unlocking assembly to move several squeezing blocks, then insert the probe into the cushion tube until the squeezing block is in position, release the unlocking assembly, and the squeezing block moves under the force of the squeezing spring until the probe is squeezed, thereby limiting the freedom of the probe and achieving the installation of the probe. The probe is firmly installed by installing the assembly, and several squeezing blocks squeeze the probe at the same time, so that all angles of the probe are subjected to the same squeezing force at the same time. Compared with the unilateral squeezing force in the prior art, the possibility of deformation of the probe is reduced, the operability of the probe when in use is ensured, and the applicability of the wafer test probe station is improved; 2. To unlock the probe, turn the rotating ring to drive the resistance block to rotate. The resistance arc surface applies pressure to the connecting column, driving the extrusion block to move, so that the probe is free from the pressure of the extrusion force. At this time, the probe can be directly pulled out to achieve the effect of unlocking the probe; 3. After the wafer test is completed, turn off the vacuum pump, rotate the drive rod to move the fixed rod, drive the piston block to move, apply pressure to the connecting rod through hydraulic oil, so that the lifting platform rises, the wafer rises and leaves the placement slot, which provides convenience for removing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the wafer test probe station in the embodiment of the present application.

[0024] Figure 2 It is an exploded view used to illustrate the structure of the adjustment component in the embodiment of the present application.

[0025] Figure 3 It is a cross-sectional view used to illustrate the structure of the installation component in the embodiment of the present application.

[0026] Figure 4 It is a schematic diagram of the structure of the unlocking component in the embodiment of the present application.

[0027] Figure 5 It is a cross-sectional view used to reflect the structure of the mounting platform in the embodiment of the present application.

[0028] Figure 6 yes Figure 5 Enlarged view of point A in the middle.

[0029] Figure 7 It is a cross-sectional view used to illustrate the structure of the rotating component and the limiting component in the embodiment of the present application.

[0030] Figure 8 yes Figure 7 Enlarged view of point B in the middle.

[0031] Description of reference numerals: 1, machine body; 2, mounting platform; 21, rotating platform; 211, connecting ring; 212, ball bearing; 213, placement groove; 22, fixing seat; 221, mounting cavity; 222, fixing ring; 23, exhaust pipe; 24, exhaust pump; 3, adjustment seat; 31, adjustment column; 32, unlocking assembly; 321, rotating ring; 322, resistance block; 3221, resistance arc surface; 323, connecting column; 4, probe; 5, adjustment assembly; 51, connecting frame; 52, adjustment screw; 53. Adjustment block; 6. Mounting assembly; 61. Mounting tube; 62. Spacer cylinder; 63. Extrusion spring; 64. Extrusion block; 7. Rotation assembly; 71. Toggle gear; 72. Connecting gear ring; 8. Limitation assembly; 81. Toggle block; 82. Limitation rod; 821. Extension rod; 83. Limitation block; 831. Limitation groove; 84. Limitation spring; 9. Lifting assembly; 91. Lifting table; 92. Hydraulic box; 921. Fixed cylinder; 93. Piston block; 931. Fixed rod; 94. Drive rod. DETAILED DESCRIPTION

[0032] The following is combined with Figures 1 - 8 This application is described in further detail.

[0033] The present application embodiment discloses a wafer test probe station. Figure 1The wafer test probe station includes a body 1, a mounting platform 2, an adjustment seat 3 and a probe 4. A detection area is set on the body 1, and the adjustment seat 3 is installed at a position corresponding to the detection area on the body 1. This embodiment takes four seats as an example.

[0034] Reference Figure 2 The adjusting seat 3 is provided with an adjusting column 31 and an adjusting assembly 5, and the adjusting assembly 5 includes a connecting frame 51, an adjusting screw 52 and an adjusting block 53. The connecting frame 51 is fixedly connected to the adjusting seat 3, and the adjusting column 31 is hinged in the connecting frame 51. An adjusting slot is provided at one end of the adjusting column 31 close to the connecting frame 51. Two sliding rods are fixedly connected to the adjusting block 53, and the two sliding rods are arranged opposite to each other. The adjusting block 53 is slidably fitted in the adjusting slot through the sliding rods. The adjusting screw 52 is vertically rotatably connected to the connecting frame 51, and the adjusting screw 52 passes through the adjusting block 53 and is threadedly fitted with the adjusting block 53.

[0035] Reference Figure 2 and Figure 3 , the other end of the adjusting column 31 is provided with a mounting assembly 6, and the mounting assembly 6 includes a mounting tube 61, a cushion tube 62, an extrusion spring 63 and an extrusion block 64. One end of the mounting tube 61 is fixedly connected to the other end of the adjusting column 31, and a plurality of extrusion grooves are provided on the surface of the mounting tube 61. In this embodiment, two are taken as an example, and the two extrusion grooves are arranged opposite to each other. The extrusion block 64 is slidably fitted in the extrusion groove, and the moving direction passes through the axis of the mounting tube 61, and an extrusion arc groove is provided on the extrusion block 64. Several extrusion springs 63 are installed between the mounting tube 61 and the extrusion block 64. The cushion tube 62 is fixedly connected to the inner wall of the mounting tube 61. The probe 4 passes through the cushion tube 62 and is located between the two extrusion arc grooves.

[0036] Reference Figure 3 and Figure 4 , an unlocking assembly 32 is provided on the mounting tube 61, and the unlocking assembly 32 includes a rotating ring 321, a contact block 322 and a connecting column 323. The rotating ring 321 is rotatably connected to the mounting tube 61, one side of the extrusion block 64 extends to the outside of the mounting tube 61, and a receiving groove is provided at the position of the rotating ring 321 corresponding to the extrusion block 64. A connecting column 323 is fixedly connected to each side of the extrusion block 64, and the contact block 322 is fixedly connected to the rotating ring 321. A contact arc surface 3221 is provided on the contact block 322. From one end to the other end of the contact block 322 is a reference direction, and the distance between the contact arc surface 3221 and the axis of the mounting tube 61 gradually increases, and the contact arc surface 3221 contacts the connecting column 323.

[0037] When installing the probe 4, turn the rotating ring 321 to drive the abutting block 322 to rotate, so as to apply pressure to the connecting column 323, drive the extrusion block 64 to move away from the installation pipe 61, pass the probe 4 through the cushion cylinder 62 until it reaches the position of the extrusion block 64, release the rotating ring 321, and the extrusion block 64 moves reversely under the action of the extrusion spring 63 until the extrusion arc groove extrudes the probe 4 to install the probe 4. Then rotate the adjusting screw 52 to move the adjusting block 53 and drive the adjusting column 31 to rotate until the end of the probe 4 is moved to an appropriate angle, achieving the effect of installing and adjusting the angle of the probe 4.

[0038] Refer to Figure 1 、 Figure 5 and Figure 6 As shown in FIGS.

[0039] Refer to Figure 5 FIG.

[0040] Refer to Figure 5 and Figure 7 FIG.

[0041] Refer to Figure 7 and Figure 8The fixing seat 22 is provided with a limiting assembly 8, which includes a toggle block 81, a limiting rod 82, a limiting block 83 and a limiting spring 84. The fixing seat 22 is fixedly connected with a second stabilizing block, which is welded from two rectangular blocks. A limiting hole is provided in the fixing seat 22, and the limiting rod 82 is slidably fitted in the limiting hole. An extension rod 821 is fixedly connected to the limiting rod 82, and an avoidance groove is provided in the fixing seat 22. The extension rod 821 passes through the avoidance groove and extends to the outside of the fixing seat 22. The toggle block 81 is fixedly connected to the end of the extension rod 821.

[0042] Reference Figure 8 The limiting block 83 is fixedly connected to one end of the limiting rod 82, and a limiting groove 831 is formed on the side wall of the limiting block 83 facing the shifting gear 71, and the limiting groove 831 matches the outer shape of a single tooth of the shifting gear 71. The limiting spring 84 is installed in the limiting hole and is located between the other end of the limiting rod 82 and the inner end wall of the limiting hole.

[0043] When adjusting the wafer detection angle, move the toggle block 81 to drive the limiting rod 82 to move, compress the limiting spring 84, and then rotate the toggle gear 71 to drive the connecting tube to rotate, so that the rotating table 21 rotates until the wafer is adjusted to a suitable angle. Release the toggle block 81, and the limiting rod 82 moves in the opposite direction under the action of the limiting spring 84, driving the limiting block 83 to move, so that a single tooth of the toggle gear 71 enters the limiting groove 831 to limit the rotation of the rotating tube, thereby achieving the effect of adjusting the wafer detection angle.

[0044] Reference Figure 5 A lifting assembly 9 is arranged between the fixed seat 22 and the rotating platform 21, and the lifting assembly 9 includes a lifting platform 91, a hydraulic box 92, a piston block 93 and a driving rod 94. A receiving groove is provided on the bottom wall of the placement groove 213, and the lifting platform 91 is placed in the receiving groove and is flush with the bottom wall of the placement groove 213. A connecting rod is fixedly connected to the bottom wall of the lifting platform 91, and the connecting rod is slidably fitted in the connecting cylinder.

[0045] Reference Figure 5 The hydraulic box 92 is fixedly connected to the bottom wall of the installation cavity 221, one end of the hydraulic box 92 is fixedly connected to a fixed cylinder 921, the connecting rod is plugged into the fixed cylinder 921, and the area between the corresponding connecting rod and the piston block 93 in the hydraulic box 92 is filled with hydraulic oil. The piston block 93 is slidably fitted in the hydraulic box 92, and a fixed rod 931 is fixedly connected to the piston block 93. The driving rod 94 is rotatably connected to the fixed seat 22, and the driving rod 94 passes through the fixed rod 931 and is threadedly matched with the fixed rod 931.

[0046] After wafer inspection, the vacuum pump 24 is turned off, and the driving rod 94 is rotated to move the connecting rod, driving the piston block 93 to move. The connecting rod is pushed by hydraulic oil to raise the lifting platform 91, driving the wafer out of the placement groove 213, so as to achieve the effect of convenient wafer removal.

[0047] The implementation principle of a wafer test probe station in an embodiment of the present application is as follows: when installing the probe 4, turn the rotating ring 321 to drive the resistance block 322 to rotate, drive the extrusion block 64 to move in the direction away from the installation tube 61, pass the probe 4 through the cushion tube 62 until the position of the extrusion block 64, loosen the rotating ring 321, squeeze the arc groove to squeeze the probe 4 to limit the probe 4, and then rotate the adjusting screw 52 to move the adjusting block 53, drive the adjusting column 31 to rotate until the end of the probe 4 is moved to a suitable angle, thereby achieving the effect of installing and adjusting the angle of the probe 4.

[0048] When installing the wafer, place the wafer in the placement groove 213, start the vacuum pump 24 to limit the wafer, then move the toggle block 81 and rotate the toggle gear 71 until the wafer rotates to a suitable angle, release the toggle block 81, and the single tooth of the toggle gear 71 enters the limiting groove 831 to limit the rotation of the wafer; after the wafer is tested, turn off the vacuum pump 24, rotate the drive rod 94, and the piston block 93 moves to push the lifting platform 91 up, so that the wafer is out of the placement groove 213 to facilitate the removal of the wafer.

[0049] By installing the component 6, the probe 4 is firmly installed, and a plurality of extrusion blocks 64 squeeze the probe 4 at the same time, so that each angle of the probe 4 is subjected to the same extrusion force at the same time. Compared with the unilateral extrusion in the prior art, the possibility of deformation of the probe 4 is reduced, the operability of the probe 4 during use is ensured, and the applicability of the wafer test probe 4 is improved.

[0050] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer test probe station, comprising a body (1), a mounting table (2), an adjustment base (3) and a probe (4), wherein the mounting table (2) is mounted on the body (1), a plurality of the adjustment bases (3) are mounted on the body (1), and the probe (4) is mounted on the adjustment base (3), and is characterized in that: The adjusting seat (3) is provided with an adjusting column (31) and an adjusting assembly (5) for adjusting the angle of the adjusting column (31); the adjusting column (31) is provided with a mounting assembly (6); the mounting assembly (6) comprises a mounting tube (61), a cushion tube (62), an extrusion spring (63) and an extrusion block (64); one end of the mounting tube (61) is connected to the end of the adjusting column (31); a plurality of extrusion grooves are provided on the side wall of the mounting tube (61); the extrusion block (64) is slidably fitted to the mounting tube (61) and the extrusion spring (63) is provided to the adjusting column (31). In the extrusion groove, the moving direction of the extrusion block (64) passes through the axis of the mounting tube (61), the extrusion spring (63) is installed between the mounting tube (61) and the extrusion block (64), the cushion tube (62) is connected to the inner wall of the mounting tube (61), and when installed, the probe (4) passes through the cushion tube (62) and is located between a plurality of the extrusion blocks (64), and an unlocking component (32) for unlocking the probe (4) is provided on the mounting tube (61).

2. The wafer test probe station according to claim 1, characterized in that: The unlocking assembly (32) comprises a rotating ring (321), a resistance block (322) and a connecting column (323); the rotating ring (321) is rotatably connected to the mounting tube (61); the resistance block (322) is connected to the rotating ring (321); a resistance arc surface (3221) is provided on the resistance block (322); a distance between the resistance arc surface (3221) and the axis of the mounting tube (61) gradually increases from one end to the other end of the resistance block (322); and the connecting column (323) is connected to the extrusion block (64) and resists the resistance arc surface (3221).

3. The wafer test probe station according to claim 1, wherein: The adjustment assembly (5) comprises a connecting frame (51), an adjusting screw (52) and an adjusting block (53); the connecting frame (51) is connected to the adjusting seat (3); the adjusting column (31) is rotatably connected to the connecting frame (51); an adjusting groove is formed at one end of the adjusting column (31) close to the connecting frame (51); two sliding rods arranged opposite to each other are connected to the adjusting block (53); the adjusting block (53) is slidably matched with the adjusting grooves through the sliding rods; the adjusting screw (52) is vertically rotatably connected to the connecting frame (51); the adjusting screw (52) passes through the adjusting block (53) and is threadably matched with the adjusting block (53).

4. The wafer test probe station according to claim 1, characterized in that: The mounting platform (2) comprises a rotating platform (21) and a fixed seat (22); the rotating platform (21) is rotatably connected to the fixed seat (22); a rotating assembly (7) for driving the rotating platform (21) to rotate is arranged on the fixed seat (22); a placement groove (213) is arranged on the rotating platform (21); an exhaust pipe (23) is installed in the rotating platform (21); an exhaust pump (24) is installed on the rotating platform (21); and the exhaust pipe (23) communicates with the placement groove (213) and the exhaust pump (24).

5. The wafer test probe station according to claim 4, characterized in that: The rotating assembly (7) comprises a toggle gear (71) and a connecting gear ring (72); a mounting cavity (221) is provided in the fixed seat (22); a connecting cylinder is connected to the rotating platform (21); the connecting cylinder is located in the mounting cavity (221); the connecting gear ring (72) is connected to the connecting cylinder; the toggle gear (71) is rotatably connected to the fixed seat (22) and meshes with the connecting gear ring (72); a limiting assembly (8) for limiting the rotation of the toggle gear (71) is provided on the fixed seat (22).

6. The wafer test probe station according to claim 5, wherein: The limiting assembly (8) comprises a toggle block (81), a limiting rod (82), a limiting block (83) and a limiting spring (84); a limiting hole is formed on the fixed seat (22); the limiting rod (82) is slidably fitted in the limiting hole; the limiting block (83) is connected to one end of the limiting rod (82); a limiting groove (831) is formed on the limiting block (83) and matches the single tooth shape of the toggle gear (71); the limiting spring (84) is installed in the limiting hole and is located between the inner end wall of the limiting hole and the limiting rod (82); an extension rod (821) is connected to the limiting rod (82); an avoidance groove is formed on the fixed seat (22); the extension rod (821) is slidably fitted in the avoidance groove; the toggle block (81) is connected to the end of the extension rod (821) and is located outside the fixed seat (22).

7. The wafer test probe station according to claim 5, wherein: The fixed seat (22) is provided with a lifting assembly (9), the lifting assembly (9) comprising a lifting platform (91), a hydraulic box (92), a piston block (93) and a driving rod (94); a receiving groove is provided on the bottom wall of the placement groove (213); the lifting platform (91) is located in the receiving groove; a connecting rod is connected to the lifting platform (91); the connecting rod is slidably matched with the rotating platform (21); the hydraulic box (92) is connected to the bottom wall of the installation cavity (221); the hydraulic box One end of (92) is connected to a fixed cylinder (921), the bottom end of the connecting rod is slidably fitted in the fixed cylinder (921), the piston block (93) is slidably fitted in the hydraulic box (92), the hydraulic box (92) is filled with hydraulic oil in the area corresponding to the piston block (93) and the connecting rod, the piston block (93) is connected to a fixed rod (931), and the driving rod (94) is rotatably connected to the fixed seat (22) and is threadedly fitted with the fixed rod (931).

8. The wafer test probe station according to claim 4, characterized in that: The rotating platform (21) is connected to a connecting ring (211), a plurality of balls (212) are embedded on the bottom wall of the connecting ring (211), a fixing ring (222) is connected to the fixing seat (22), the connecting ring (211) is slidably fitted in the fixing ring (222), and the balls (212) abut against the inner bottom wall of the fixing ring (222).

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