Substrate processing apparatus and substrate processing method

Abstract

The invention relates to a substrate processing apparatus and a substrate processing method. This substrate processing apparatus (100) is provided with: a chamber (11) for accommodating a substrate (W) having a front surface (Wa) on which a device is provided and a back surface (Wb) positioned on the opposite side from the front surface (Wa); a substrate holding unit (20) that holds the substrate (W) in the chamber (11); a chemical solution supply unit (30) that supplies a chemical solution to the front surface (Wa) of the substrate (W) held by the substrate holding unit (20); and a cleaning liquid supply unit (40) that supplies a cleaning liquid to the front surface (Wa) of the substrate (W) held by the substrate holding unit (20). A substrate processing apparatus (100) is provided with: a cup (80) that collects a cleaning liquid that scatters from a substrate (W) held by a substrate holding unit (20); a recovered liquid storage tank (210) for storing the cleaning liquid collected in the cup (80) as a recovered liquid; and a back surface treatment liquid supply unit (50) that supplies the recovery liquid stored in the recovery liquid storage tank (210) to the back surface (Wb) of the substrate (W) held by the substrate holding unit (20).

Description

[0001] Related Applications

[0002] This application is based on Japanese Patent Application No. 2024-009546 filed on January 25, 2024, and claims priority thereto. The entire contents of this application are incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing apparatus and a substrate processing method. Background Art

[0004] There is known a substrate processing apparatus for processing a substrate. The substrate processing apparatus is suitable for processing a semiconductor substrate. The substrate processing apparatus processes the substrate using a processing liquid.

[0005] Typically, after the substrate processing apparatus processes the substrate with a chemical solution, a cleaning solution is supplied to the substrate to clean the substrate processed with the chemical solution. In the substrate processing apparatus, sometimes the chemical solution and the cleaning solution are supplied not only to the front surface of the substrate but also to the back surface of the substrate (see Japanese Patent Laid-Open No. 2019-125634). In the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, after the chemical solution and the cleaning solution are supplied to the front surface and the back surface of the substrate, the substrate is dried. Then, infrared rays radiated from the processing liquid attached to the back surface of the substrate pass through the substrate and are received by the light receiving portion of the detection unit, thereby detecting the liquid residue on the back surface of the substrate. At this time, the processing liquid scattered from the substrate is captured in a recovery cup, and the processing liquid captured in the recovery cup is discharged to the outside of the processing unit from the drain port at the bottom of the recovery cup. In the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, when a liquid remains on the back surface of the substrate, the liquid residue on the back surface of the substrate is eliminated by performing a recovery cleaning process. Summary of the Invention

[0006] In recent years, in order to reduce the environmental load, studies have been made to reduce the resources required for substrate processing. However, in the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, when processing a substrate, an increase in the usage amount of a new processing liquid is a concern.

[0007] One embodiment of the present invention provides a substrate processing apparatus and a substrate processing method capable of reducing the usage amount of a new processing liquid.

[0008] A substrate processing apparatus according to an embodiment of the present invention includes: a chamber that houses a substrate having a front surface on which devices are provided and a back surface opposite to the front surface; a substrate holding unit that holds the substrate in the chamber; a chemical solution supply unit that supplies a chemical solution to the front surface of the substrate held by the substrate holding unit; and a cleaning solution supply unit that supplies a cleaning solution to the front surface of the substrate held by the substrate holding unit. Preferably, the substrate processing apparatus includes: a cup that captures the cleaning solution scattered from the substrate held by the substrate holding unit; a recovered liquid storage tank that stores the cleaning solution captured by the cup as a recovered liquid; and a back surface treatment liquid supply unit that supplies the recovered liquid stored in the recovered liquid storage tank to the back surface of the substrate held by the substrate holding unit.

[0009] In a certain embodiment, the substrate processing apparatus further includes a pipe that connects the cup and the recovered liquid storage tank and through which the cleaning solution captured by the cup flows.

[0010] In a certain embodiment, during the period when the cleaning solution supply unit supplies the cleaning solution to the front surface of the substrate, the back surface treatment liquid supply unit supplies the recovered liquid to the back surface of the substrate.

[0011] In a certain embodiment, during the period when the cleaning solution supply unit supplies the cleaning solution to the front surface of the substrate, the back surface treatment liquid supply unit supplies the cleaning solution to the back surface of the substrate and then supplies the recovered liquid.

[0012] In a certain embodiment, during the period when the cleaning solution supply unit supplies the cleaning solution to the front surface of the substrate, the recovered liquid storage tank recovers the cleaning solution supplied to the substrate as a recovered liquid. The back surface treatment liquid supply unit supplies the recovered liquid to the back surface of the substrate.

[0013] In a certain embodiment, during each of the periods when the chemical solution supply unit supplies the chemical solution to the front surface of the substrate and when the cleaning solution supply unit supplies the cleaning solution to the front surface of the substrate, the back surface treatment liquid supply unit supplies the recovered liquid to the back surface of the substrate.

[0014] A substrate processing method according to an embodiment of the present invention includes the following steps: a substrate holding part holds a substrate having a front surface on which devices are provided and a back surface on the opposite side of the front surface; a chemical solution is supplied to the front surface of the substrate held by the substrate holding part; after the chemical solution is supplied to the front surface of the substrate, a cleaning solution is supplied to the front surface of the substrate held by the substrate holding part. Preferably, the substrate processing method includes the following steps: the cleaning solution supplied to the substrate is recovered as a recovered solution into a recovered solution storage tank; and the recovered solution in the recovered solution storage tank is supplied to the back surface of the substrate held by the substrate holding part.

[0015] The substrate processing method may also include one or any combination of various features described for the substrate processing apparatus.

[0016] The above or further other objects, features, and effects in the present invention are clarified by the description of the embodiments described below with reference to the drawings. Description of the Drawings

[0017] Figure 1 It is a schematic top view of the substrate processing apparatus of this embodiment.

[0018] Figure 2 It is a schematic view of the substrate processing apparatus of this embodiment.

[0019] Figure 3 It is a block diagram of the substrate processing apparatus of this embodiment.

[0020] Figure 4 It is a flowchart of the substrate processing method of this embodiment.

[0021] Figures 5A - 5D It is a schematic view showing the process of the substrate processing apparatus of this embodiment.

[0022] Figures 6A - 6C It is a schematic view showing the process of the substrate processing apparatus of this embodiment.

[0023] Figure 7 It is a schematic view of the substrate processing apparatus of this embodiment.

[0024] Figures 8A - 8C It is a schematic view showing the process of the substrate processing apparatus of this embodiment.

[0025] Figure 9 It is a schematic view of the substrate processing apparatus of this embodiment.

[0026] Figures 10A - 10C It is a schematic view showing the process of the substrate processing apparatus of this embodiment.

[0027] Figures 11A - 11CIt is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0028] Figure 12 It is a schematic diagram of the substrate processing apparatus according to the present embodiment.

[0029] Figure 13A and 13B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0030] Figure 14A and 14B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0031] Figure 15A and 15B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0032] Figure 16A and 16B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0033] Figure 17 It is a schematic diagram of the substrate processing apparatus according to the present embodiment.

[0034] Figures 18A - 18C It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0035] Figures 19A - 19C It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0036] Figure 20 It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment. Detailed Embodiment

[0037] Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to the accompanying drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and repeated description will be omitted. In the present application specification, in order to facilitate understanding of the invention, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are sometimes described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0038] First, with reference to Figure 1 , an embodiment of the substrate processing apparatus 100 of the present invention will be described. Figure 1 It is a schematic top view of the substrate processing apparatus 100 according to the present embodiment.

[0039] The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W in such a manner as to perform at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a part of a film, and cleaning on the substrate W.

[0040] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrate W one by one.

[0041] As Figure 1 shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid cassette 120, a plurality of load ports LP, a transfer robot IR, a central robot CR, and a control device 101 (controller). The control device 101 controls the load ports LP, the transfer robot IR, and the central robot CR. The control device 101 may also be configured or programmed to control each component in the substrate processing units 10, the processing liquid tank 110, and the processing liquid cassette 120. The control device 101 includes a control unit 102 and a storage unit 104.

[0042] The load ports LP stack and accommodate a plurality of substrates W respectively. The transfer robot IR transfers the substrate W between the load ports LP and the central robot CR. The central robot CR transfers the substrate W between the transfer robot IR and the substrate processing units 10. Each of the substrate processing units 10 sprays a processing liquid onto the substrate W to process the substrate W. The processing liquid includes a chemical solution, a cleaning solution, a rinsing solution, a removing solution, and / or a waterproofing agent. The processing liquid tank 110 accommodates the processing liquid. In addition, the processing liquid tank 110 may also accommodate a gas.

[0043] Specifically, the plurality of substrate processing units 10 form a plurality of towers TW ( Figure 1 in this case, four towers TW) arranged to surround the central robot CR in a plan view. Each tower TW includes a plurality of substrate processing units 10 stacked vertically ( Figure 1 in this case, three substrate processing units 10). The processing liquid cassettes 120 correspond to the plurality of towers TW respectively. The liquid in the processing liquid tank 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid cassette 120 via any one of the processing liquid cassettes 120. In addition, the gas in the processing liquid tank 110 is supplied to all the substrate processing units 10 included in the tower TW corresponding to the processing liquid cassette 120 via any one of the processing liquid cassettes 120.

[0044] In the substrate processing apparatus 100, a boundary wall is disposed between the area where the central robot CR and the substrate processing units 10 are provided and the area where the processing liquid tank 110 is provided.

[0045] Typically, the processing liquid tank 110 has a storage tank (tank) for preparing the processing liquid. The processing liquid tank 110 may have a storage tank for one type of processing liquid or may have storage tanks for multiple types of processing liquids. In addition, the processing liquid tank 110 has a pump, a valve, a heater, and / or a filter for circulating the processing liquid.

[0046] The processing liquid tank 110 includes a chemical liquid tank 110A and a cleaning liquid tank 110B. For example, the chemical liquid tank 110A and the cleaning liquid tank 110B are arranged separately from each other. Alternatively, the chemical liquid tank 110A and the cleaning liquid tank 110B may also be arranged adjacent to each other.

[0047] For example, the chemical liquid tank 110A supplies the chemical liquid to the processing liquid cassette 120. In addition, the cleaning liquid tank 110B supplies the cleaning liquid to the processing liquid cassette 120. The processing liquid cassette 120 supplies the chemical liquid and the cleaning liquid to the substrate processing unit 10.

[0048] Here, the processing liquid tank 110 further includes a recovered liquid tank 110C. The recovered liquid tank 110C stores the recovered liquid of the recovered liquid. For example, the recovered liquid tank 110C recovers the liquid used once as the recovered liquid. In addition, the recovered liquid tank 110C supplies the recovered recovered liquid to the processing liquid cassette 120.

[0049] The recovered liquid tank 110C has a recovered liquid storage tank (tank) 210 for storing the liquid used once as the recovered liquid. The recovered liquid stored in the recovered liquid storage tank (tank) 210 is supplied to the processing liquid cassette 120. Thus, the processing liquid tank 110 has the recovered liquid tank 110C.

[0050] The processing liquid tank 110 may have a recovered liquid storage tank 210 for storing one type of recovered liquid or may have a recovered liquid storage tank 210 for storing multiple types of recovered liquids. In addition, the processing liquid tank 110 has a pump, a valve, a heater, and / or a filter for circulating the recovered liquid.

[0051] The control device 101 controls various operations of the substrate processing apparatus 100. Through the control device 101, the substrate processing unit 10 processes the substrate W.

[0052] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU, central processing unit). Alternatively, the control unit 102 may also have a general-purpose arithmetic unit.

[0053] The storage unit 104 is a storage device for storing data and computer programs. The data includes recipe data. The recipe data includes information representing multiple recipes. Each of the multiple recipes specifies the processing content and processing order of the substrate W.

[0054] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable medium. The control unit 102 executes a computer program stored in the storage unit 104 and performs a substrate processing operation.

[0055] Next, with reference to Figure 2 , the substrate processing unit 10 of the substrate processing apparatus 100 of the present embodiment will be described. Figure 2 is a schematic diagram of the substrate processing apparatus 100.

[0056] The substrate processing apparatus 100 includes a substrate processing unit 10, a chamber 11, a substrate holding unit 20, a chemical solution supply unit 30, a cleaning solution supply unit 40, a back surface processing solution supply unit 50, a cup 80, a drainage mechanism 90, and a recovered solution storage tank 210.

[0057] The chamber 11 has a substantially box shape with an internal space. The chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a single wafer type that processes the substrate W one by one, and the substrate W is housed one by one in the chamber 11. The substrate W is housed in the chamber 11 and processed in the chamber 11. In the chamber 11, at least a part of each of the substrate holding unit 20, the chemical solution supply unit 30, the cleaning solution supply unit 40, the back surface processing solution supply unit 50, and the cup 80 is housed.

[0058] The substrate holding unit 20 is a substrate holder that holds the substrate W. Typically, it may also be a rotating chuck. The substrate W has a front surface Wa and a back surface Wb. The front surface Wa and the back surface Wb of the substrate W are the main surfaces of the substrate W, respectively. Devices are provided on the front surface Wa of the substrate W. The front surface Wa of the substrate W is the surface on which devices for forming an electronic circuit are provided, and the back surface Wb of the substrate W is the surface on which such devices are not provided. For example, a stacked structure with grooves is provided on the front surface Wa of the substrate W.

[0059] The substrate holding unit 20 holds the substrate W horizontally. The substrate holding unit 20 rotates the substrate W while holding the substrate W. Here, the front surface Wa of the substrate W faces vertically upward, and the back surface Wb of the substrate W faces vertically downward. However, the front surface Wa of the substrate W may face vertically downward, and the back surface Wb of the substrate W may face vertically upward. Thus, the substrate holding unit 20 holds the substrate W horizontally such that one of the front surface Wa and the back surface Wb of the substrate W faces upward and the other faces downward.

[0060] For example, the substrate holding part 20 may also be a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding part 20 may also have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding part 20 may also be a vacuum type. In this case, the substrate holding part 20 holds the substrate W horizontally by adsorbing the central part of the non-device forming surface, that is, the back surface Wb of the substrate W, on the upper surface. Alternatively, the substrate holding part 20 may combine a clamping type in which a plurality of chuck pins are in contact with the peripheral end surface of the substrate W and a vacuum type.

[0061] For example, the substrate holding part 20 includes a rotating base 21, a chuck member 22, a shaft 23, a motor 24, a housing 25, and a nozzle 51. The chuck member 22 is provided on the rotating base 21. The chuck member 22 clamps the substrate W. Typically, a plurality of chuck members 22 are provided on the rotating base 21.

[0062] The shaft 23 is a hollow shaft. The shaft 23 extends in the vertical direction along the rotation axis Ax. The rotating base 21 is coupled to the upper end of the shaft 23. The substrate W is placed above the rotating base 21.

[0063] The rotating base 21 is disk-shaped and horizontally supports the substrate W. The shaft 23 extends downward from the central part of the rotating base 21. The motor 24 imparts a rotational force to the shaft 23. The motor 24 rotates the shaft 23 in the rotational direction, and rotates the substrate W and the rotating base 21 about the rotation axis Ax. The housing 25 surrounds the shaft 23 and the motor 24.

[0064] The chemical liquid supply part 30 supplies chemical liquid to the substrate W. Typically, the chemical liquid supply part 30 supplies chemical liquid to the front surface Wa of the substrate W. At least a part of the chemical liquid supply part 30 is accommodated in the chamber 11.

[0065] The chemical liquid contains hydrofluoric acid. For example, the hydrofluoric acid can be heated to 40°C or higher and 70°C or lower, or can be heated to 50°C or higher and 60°C or lower. However, the hydrofluoric acid may not be heated. In addition, the chemical liquid may also contain phosphoric acid.

[0066] The chemical liquid may also contain hydrogen peroxide water. In addition, the chemical liquid may also contain SCl (ammonia hydrogen peroxide water mixture), SC2 (hydrochloric acid hydrogen peroxide water mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid). In addition, the chemical liquid may be diluted with a diluent.

[0067] The chemical liquid supply part 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 is connected to the pipe 32. Chemical liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. The nozzle 34 sprays chemical liquid onto the front surface Wa of the substrate W.

[0068] The valve 36 adjusts the opening degree of the pipe 32 and regulates the flow rate of the liquid medicine flowing in the pipe 32. Specifically, the valve 36 includes: a valve body (not shown) with a valve seat provided inside; a valve element for opening and closing the valve seat; and an actuator (not shown) for moving the valve element between an open position and a closed position.

[0069] The nozzle 34 can also be configured to be movable relative to the substrate W. The liquid medicine supply unit 30 may further include a nozzle moving unit 38. The nozzle moving unit 38 can raise and lower the nozzle 34 and can also rotate the nozzle 34 horizontally about the rotation axis. The nozzle moving unit 38 raises and lowers the nozzle 34. For example, the nozzle moving unit 38 includes a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism. In addition, the nozzle moving unit 38 rotates the nozzle 34 horizontally. For example, the nozzle moving unit 38 includes a motor.

[0070] In addition, the liquid medicine supply unit 30 may also include Figure 1 the liquid medicine tank 110A and the processing liquid cartridge 120 shown in the figure.

[0071] The cleaning liquid supply unit 40 supplies cleaning liquid to the substrate W. Typically, the cleaning liquid is used to clean the substrate W. The cleaning liquid supply unit 40 supplies cleaning liquid to the front surface Wa of the substrate W. At least a part of the cleaning liquid supply unit 40 is housed in the chamber 11.

[0072] For example, the cleaning liquid is used to clean the substrate W after being treated with the liquid medicine. In one example, the cleaning liquid may include any one of deionized water (DIW), carbonated water, electrolyzed ion water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0073] The cleaning liquid supply unit 40 includes a pipe 42, a nozzle 44, and a valve 46. The nozzle 44 is connected to the pipe 42. The cleaning liquid is supplied to the pipe 42 from a supply source. The valve 46 opens and closes the flow path in the pipe 42. The nozzle 44 sprays the cleaning liquid onto the front surface Wa of the substrate W.

[0074] The valve 46 adjusts the opening degree of the pipe 42 and regulates the flow rate of the cleaning liquid flowing in the pipe 42. Specifically, the valve 46 may have the same configuration as the valve 36.

[0075] The nozzle 44 can also be configured to be movable relative to the substrate W. The cleaning liquid supply unit 40 may further include a nozzle moving unit 48. The nozzle moving unit 48 may have the same configuration as the nozzle moving unit 38.

[0076] In addition, the cleaning liquid supply unit 40 may also include Figure 1 the cleaning liquid tank 110B and the processing liquid cartridge 120 shown in the figure.

[0077] The back surface treatment liquid supply unit 50 supplies a treatment liquid to the back surface Wb of the substrate W. At least a part of the back surface treatment liquid supply unit 50 is housed in the chamber 11.

[0078] For example, the back surface treatment liquid supply unit 50 supplies a chemical solution to the back surface Wb of the substrate W. Typically, while the chemical solution supply unit 30 supplies a chemical solution to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 supplies a chemical solution to the back surface Wb of the substrate W. In one example, the back surface treatment liquid supply unit 50 supplies the same type of chemical solution to the back surface Wb of the substrate W as the chemical solution supplied by the chemical solution supply unit 30.

[0079] Alternatively, the back surface treatment liquid supply unit 50 supplies a cleaning liquid to the substrate W. Typically, while the cleaning liquid supply unit 40 supplies a cleaning liquid to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 supplies a cleaning liquid to the back surface Wb of the substrate W. In one example, the back surface treatment liquid supply unit 50 supplies the same type of cleaning liquid to the back surface Wb of the substrate W as the cleaning liquid supplied by the cleaning liquid supply unit 40.

[0080] In addition, the back surface treatment liquid supply unit 50 may also supply a chemical solution diluted with a diluent (diluted chemical solution) to the back surface Wb of the substrate W. Typically, while the chemical solution supply unit 30 supplies a diluted chemical solution to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 supplies a diluted chemical solution to the back surface Wb of the substrate W.

[0081] In the present embodiment, the back surface treatment liquid supply unit 50 supplies a recovered liquid to the back surface Wb of the substrate W. Typically, the recovered liquid is a liquid obtained by recovering a treatment liquid used once. In one example, the recovered liquid is a liquid obtained by recovering a cleaning liquid used once. For example, the cleaning liquid used to clean the substrate W is recovered and used as the recovered liquid.

[0082] Typically, the substrate W is used for a semiconductor device for microfabrication. Therefore, the chemical solution or cleaning liquid supplied from the supply source is a unused new liquid, and the impurity concentration of the chemical solution or cleaning liquid supplied from the supply source is low. On the other hand, the recovered liquid may also have a slightly higher impurity concentration than the chemical solution or cleaning liquid supplied from the supply source. Thereby, the back surface Wb of the substrate W can be cleaned, or the particles adhering to the back surface Wb of the substrate W after treating the front surface Wa of the substrate W with a chemical solution or the like can be suppressed. However, it is preferable that the impurity concentration of the recovered liquid is also low.

[0083] For example, while the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 may supply the recovery liquid to the back surface Wb of the substrate W. Alternatively, while the chemical liquid supply unit 30 supplies the chemical liquid to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 may supply the recovery liquid to the back surface Wb of the substrate W. Alternatively, while the chemical liquid supply unit 30 supplies the diluted chemical liquid diluted with the diluent to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 may supply the chemical liquid diluted with the recovery liquid to the back surface Wb of the substrate W.

[0084] The back surface treatment liquid supply unit 50 includes a nozzle 51, a pipe 52, a pipe 52c, a chemical liquid supply unit 54, a cleaning liquid supply unit 56, and a recovery liquid supply unit 58. The pipe 52 is disposed in the chamber 11. The pipe 52 penetrates the center of the vertical direction through-axis 23. The nozzle 51 is disposed at the end of the pipe 52. The nozzle 51 is located opposite to the center of the back surface Wb of the substrate W. The pipe 52 is connected to the pipe 52c outside the chamber 11. In the pipes 52c and 52, the treatment liquid supplied to the back surface Wb of the substrate W flows. The treatment liquid flowing in the pipes 52c and 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0085] The chemical liquid supply unit 54 supplies the chemical liquid to the back surface Wb of the substrate W. Specifically, the chemical liquid supply unit 54 supplies the chemical liquid to the back surface Wb of the substrate W via the pipes 52c and 52.

[0086] The chemical liquid supply unit 54 includes a pipe 54a and a valve 54b. The chemical liquid is supplied to the pipe 54a from the supply source. The valve 54b opens and closes the flow path in the pipe 54a. The valve 54b adjusts the opening degree of the pipe 54a and adjusts the flow rate of the chemical liquid flowing in the pipe 54a. Specifically, the valve 54b includes: a valve body (not shown) in which a valve seat is provided; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0087] The chemical liquid flowing through the pipe 54a, the pipe 52c, and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0088] The cleaning liquid supply unit 56 supplies the cleaning liquid to the back surface Wb of the substrate W. Specifically, the cleaning liquid supply unit 56 supplies the cleaning liquid to the back surface Wb of the substrate W via the pipes 52c and 52.

[0089] The cleaning liquid supply unit 56 includes a pipe 56a and a valve 56b. The cleaning liquid is supplied to the pipe 56a from the supply source. The valve 56b opens and closes the flow path in the pipe 56a. The valve 56b adjusts the opening degree of the pipe 56a and adjusts the flow rate of the cleaning liquid flowing in the pipe 56a. The valve 56b may have the same configuration as the valve 54b.

[0090] The cleaning liquid flowing through the pipe 56a, the pipe 52c, and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0091] The recovery liquid supply unit 58 supplies the recovery liquid to the back surface Wb of the substrate W. Specifically, the recovery liquid supply unit 58 supplies the recovery liquid to the back surface Wb of the substrate W via the pipe 52c and the pipe 52.

[0092] The recovery liquid supply unit 58 includes a pipe 58a and a valve 58b. The recovery liquid is supplied from the recovery liquid storage tank 210 serving as a supply source to the pipe 58a. The valve 58b opens and closes the flow path in the pipe 58a. The valve 58b adjusts the opening degree of the pipe 58a and adjusts the flow rate of the recovery liquid flowing in the pipe 58a. The valve 58b may have the same configuration as the valve 54b.

[0093] The recovery liquid flowing through the pipe 58a, the pipe 52c, and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0094] The cup 80 moves up and down in the vertical direction. The cup 80 rises to an upper position above the side of the substrate W. In addition, the cup 80 descends to a lower position obliquely below the substrate W. Figure 2 In the case where the cup 80 is in the lower position. When supplying any one of the chemical solution, the cleaning liquid, and the recovery liquid to the substrate W, the cup 80 rises to a position beside the substrate W.

[0095] The cup 80 captures the processing liquid scattered around the substrate W by the rotation of the substrate W. For example, when the chemical solution supply unit 30 supplies the chemical solution to the rotating substrate W, the chemical solution scatters from the substrate W to the side. In this case, the cup 80 captures the chemical solution scattered from the substrate W to the side in the upper position. In addition, when the cleaning liquid supply unit 40 supplies the cleaning liquid to the rotating substrate W, the cup 80 captures the cleaning liquid scattered from the substrate W to the side in the upper position. Similarly, when the back surface processing liquid supply unit 50 supplies the processing liquid to the rotating substrate W, the cup 80 captures the processing liquid scattered from the substrate W to the side in the upper position.

[0096] In this way, during the period when any one of the chemical solution supply unit 30, the cleaning liquid supply unit 40, and the back surface processing liquid supply unit 50 supplies any one of the chemical solution, the cleaning liquid, and the processing liquid to the substrate W, the cup 80 is in the upper position and captures any one of the chemical solution, the cleaning liquid, and the processing liquid scattered from the substrate W to the side. In addition, when the period when any one of the chemical solution supply unit 30, the cleaning liquid supply unit 40, and the back surface processing liquid supply unit 50 supplies any one of the chemical solution, the cleaning liquid, and the processing liquid to the substrate W ends, the cup 80 descends to a lower position obliquely below the substrate W.

[0097] Specifically, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the liquid chemical supply unit 30 and / or the liquid chemical supply unit 54 supplies a liquid chemical to the substrate W, then due to the rotation of the substrate W, the liquid chemical supplied to the substrate W scatters around the substrate W. When the liquid chemical supply unit 30 and / or the liquid chemical supply unit 54 supplies a liquid chemical to the substrate W, the cup 80 is located at an upper position covering the side portion of the substrate W, and the cup 80 traps the liquid chemical scattered around the substrate W due to the rotation of the substrate W. Similarly, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the cleaning liquid supply unit 40 and / or the cleaning liquid supply unit 56 supplies a cleaning liquid to the substrate W, then due to the rotation of the substrate W, the cleaning liquid supplied to the substrate W scatters around the substrate W. When the cleaning liquid supply unit 40 and / or the cleaning liquid supply unit 56 supplies a cleaning liquid to the substrate W, the cup 80 is located at an upper position covering the side portion of the substrate W, and the cup 80 traps the cleaning liquid scattered around the substrate W due to the rotation of the substrate W.

[0098] Moreover, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the recovered liquid supply unit 58 supplies a recovered liquid to the substrate W, then due to the rotation of the substrate W, the recovered liquid supplied to the substrate W scatters around the substrate W. When the recovered liquid supply unit 58 supplies a recovered liquid to the substrate W, the cup 80 is located at an upper position covering the side portion of the substrate W, and the cup 80 traps the recovered liquid scattered around the substrate W due to the rotation of the substrate W. Thus, the cup 80 traps any one of the liquid chemical, the cleaning liquid, and the recovered liquid scattered around the substrate W due to the rotation of the substrate W.

[0099] The liquid discharge mechanism 90 discharges the liquid chemical, the cleaning liquid, and / or the recovered liquid trapped in the cup 80. A pipe is connected to the cup 80, and the liquid chemical, the cleaning liquid, and / or the recovered liquid trapped in the cup 80 flows through the pipe and is discharged to the outside.

[0100] The liquid discharge mechanism 90 is connected to the recovered liquid storage tank 210. At least a part of the liquid chemical, the cleaning liquid, and / or the recovered liquid trapped in the cup 80 flows through the liquid discharge mechanism 90 and into the recovered liquid storage tank 210, and is stored as a recovered liquid in the recovered liquid storage tank 210.

[0101] The recovered liquid storage tank 210 can also selectively recover the liquid chemical, the cleaning liquid, and / or the recovered liquid trapped in the cup 80. For example, the recovered liquid storage tank 210 recovers the cleaning liquid and / or the recovered liquid trapped in the cup 80. In one example, when the particle concentration in the cleaning liquid trapped in the cup 80 is relatively high, the recovered liquid storage tank 210 does not recover the cleaning liquid, and when the particle concentration in the cleaning liquid trapped in the cup 80 becomes low, the recovered liquid storage tank 210 can also recover the cleaning liquid. Or, the recovered liquid storage tank 210 may not recover the recovered liquid trapped in the cup 80 again. In addition, the recovered liquid storage tank 210 can also recover the liquid chemical trapped in the cup 80.

[0102] The liquid discharging mechanism 90 discharges the liquid medicine, cleaning liquid, and processing liquid collected in the cup 80 to the outside of the chamber 11. The liquid discharging mechanism 90 has a pipe 91 for discharging the liquid medicine, cleaning liquid, and processing liquid collected in the cup 80. One end of the pipe 91 is connected to the bottom of the cup 80.

[0103] The liquid discharging mechanism 90 further has a pipe 92a, a valve 92b, a pipe 94a, and a valve 94b. The pipe 92a is connected to the pipe 91. The liquid medicine and cleaning liquid collected in the cup 80 flow from the pipe 91 to the pipe 92a. The valve 92b opens and closes the flow path in the pipe 92a. The valve 92b adjusts the opening degree of the pipe 92a and adjusts the flow rate of the liquid flowing in the pipe 92a. Specifically, the valve 92b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0104] The pipe 94a connects the pipe 91 and the recovered liquid storage tank 210. The cleaning liquid collected in the cup 80 flows from the pipe 91 to the pipe 94a. The valve 94b opens and closes the flow path in the pipe 94a. The valve 94b adjusts the opening degree of the pipe 94a and adjusts the flow rate of the cleaning liquid flowing in the pipe 94a. The valve 94b may also have the same structure as the valve 92b.

[0105] When the valve 94b is open, in the pipe 94a, the cleaning liquid collected in the cup 80 flows to the recovered liquid storage tank 210.

[0106] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the liquid medicine supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the motor 24, the valves 36, 46, 54b, 56b, 58b, 92b, 94b, and / or the cup 80.

[0107] The substrate processing device 100 of the present embodiment is suitable for manufacturing semiconductor elements provided with semiconductors. Typically, in semiconductor elements, a conductive layer and an insulating layer are laminated on a substrate. When manufacturing semiconductor elements, the substrate processing device 100 is suitable for cleaning and / or processing (such as etching, property change, etc.) of the conductive layer and / or the insulating layer.

[0108] In addition, Figure 2 In the shown substrate processing unit 10, the liquid medicine supply unit 30 can supply one kind of processing liquid. However, the present embodiment is not limited to this. The liquid medicine supply unit 30 may also supply multiple kinds of liquid medicines. For example, the liquid medicine supply unit 30 may be able to sequentially supply multiple kinds of liquid medicines for different purposes to the substrate W. Or, the liquid medicine supply unit 30 may be able to simultaneously supply multiple kinds of liquid medicines for different purposes to the substrate W.

[0109] Next, referring to Figures 1 - 3, which illustrates the substrate processing apparatus 100 of the present embodiment. Figure 3 is a block diagram of the substrate processing apparatus 100.

[0110] As Figure 3 shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the transfer robot IR, the center robot CR, the substrate holding unit 20, the chemical solution supply unit 30, the cleaning solution supply unit 40, the backside processing solution supply unit 50, the cup 80, and the drainage mechanism 90. Specifically, the control device 101 controls the transfer robot IR, the center robot CR, the substrate holding unit 20, the chemical solution supply unit 30, the cleaning solution supply unit 40, the backside processing solution supply unit 50, the cup 80, and the drainage mechanism 90 by sending control signals to the transfer robot IR, the center robot CR, the substrate holding unit 20, the chemical solution supply unit 30, the cleaning solution supply unit 40, the backside processing solution supply unit 50, the cup 80, and the drainage mechanism 90.

[0111] In addition, the storage unit 104 stores computer programs and data. The data includes recipe data. The recipe data includes information representing a plurality of recipes. Each of the plurality of recipes specifies the processing content, processing sequence, and substrate processing conditions of the substrate W. The control unit 102 executes the computer programs stored in the storage unit 104 and performs substrate processing operations.

[0112] The control unit 102 controls the transfer robot IR and transfers the substrate W through the transfer robot IR.

[0113] The control unit 102 controls the center robot CR and transfers the substrate W through the center robot CR. For example, the center robot CR receives the unprocessed substrate W and transfers the substrate W into any one of the plurality of chambers 11. In addition, the center robot CR receives the processed substrate W from the chamber 11 and transfers out the substrate W.

[0114] The control unit 102 controls the substrate holding unit 20 to control the start of rotation, change of rotation speed, and stop of rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the motor 24 of the substrate holding unit 20.

[0115] The control unit 102 controls the valve 36 of the chemical solution supply unit 30 and can switch the state of the valve 36 between an open state and a closed state. Specifically, the control unit 102 controls the valve 36 of the chemical solution supply unit 30 to set the valve 36 to the open state, thereby enabling the chemical solution flowing in the pipe 32 to pass through the nozzle 34. In addition, the control unit 102 controls the valve 36 of the chemical solution supply unit 30 to set the valve 36 to the closed state, thereby stopping the supply of the chemical solution flowing in the pipe 32 to the nozzle 34.

[0116] The control unit 102 controls the valve 46 of the cleaning liquid supply unit 40 and can switch the state of the valve 46 between an open state and a closed state. Specifically, by controlling the valve 46 of the cleaning liquid supply unit 40, the control unit 102 sets the valve 46 to the open state, enabling the cleaning liquid flowing in the pipe 42 to pass through the nozzle 44. In addition, by controlling the valve 46 of the cleaning liquid supply unit 40, the control unit 102 sets the valve 46 to the closed state, stopping the supply of the cleaning liquid flowing in the pipe 42 to the nozzle 44.

[0117] The control unit 102 controls the valve 54b of the liquid medicine supply unit 54 and can switch the state of the valve 54b between an open state and a closed state. Specifically, by controlling the valve 54b of the liquid medicine supply unit 54, the control unit 102 sets the valve 54b to the open state, enabling the liquid medicine flowing in the pipes 54a, 52c, and 52 to pass through the nozzle 51. In addition, by controlling the valve 54b of the liquid medicine supply unit 54, the control unit 102 sets the valve 54b to the closed state, stopping the supply of the liquid medicine flowing in the pipe 54a to the nozzle 51.

[0118] The control unit 102 controls the valve 56b of the cleaning liquid supply unit 56 and can switch the state of the valve 56b between an open state and a closed state. Specifically, by controlling the valve 56b of the cleaning liquid supply unit 56, the control unit 102 sets the valve 56b to the open state, enabling the cleaning liquid flowing in the pipes 56a, 52c, and 52 to pass through the nozzle 51. In addition, by controlling the valve 56b of the cleaning liquid supply unit 56, the control unit 102 sets the valve 56b to the closed state, stopping the supply of the cleaning liquid flowing in the pipe 56a to the nozzle 51.

[0119] The control unit 102 controls the valve 58b of the recovered liquid supply unit 58 and can switch the state of the valve 58b between an open state and a closed state. Specifically, by controlling the valve 58b of the recovered liquid supply unit 58, the control unit 102 sets the valve 58b to the open state, enabling the recovered liquid flowing in the pipes 58a, 52c, and 52 to pass through the nozzle 51. In addition, by controlling the valve 58b of the recovered liquid supply unit 58, the control unit 102 sets the valve 58b to the closed state, stopping the supply of the recovered liquid flowing in the pipe 58a to the nozzle 51.

[0120] The control unit 102 can also control the cup 80 to move the cup 80 relative to the substrate W. Specifically, during the period when at least one of the chemical liquid supply unit 30, the cleaning liquid supply unit 40, the chemical liquid supply unit 54, the cleaning liquid supply unit 56, and the recovered liquid supply unit 58 supplies any one of the chemical liquid, the cleaning liquid, and the recovered liquid to the substrate W, the control unit 102 moves the cup 80 to the rising position on the side of the substrate W. In addition, when the period when at least one of the chemical liquid supply unit 30, the cleaning liquid supply unit 40, the chemical liquid supply unit 54, the cleaning liquid supply unit 56, and the recovered liquid supply unit 58 supplies any one of the chemical liquid, the cleaning liquid, and the recovered liquid to the substrate W ends, the control unit 102 lowers the cup 80 from the side of the substrate W to directly below.

[0121] The control unit 102 controls the valve 92b of the liquid discharge mechanism 90 and can switch the state of the valve 92b between the open state and the closed state. Specifically, the control unit 102 sets the valve 92b to the open state by controlling the valve 92b, and can allow the chemical liquid and the cleaning liquid flowing in the pipes 91 and 92a to pass through. In addition, the control unit 102 sets the valve 92b to the closed state by controlling the valve 92b, and can stop the chemical liquid and the cleaning liquid flowing in the pipes 91 and 92a from passing through.

[0122] The control unit 102 controls the valve 94b of the liquid discharge mechanism 90 and can switch the state of the valve 94b between the open state and the closed state. Specifically, the control unit 102 sets the valve 94b to the open state by controlling the valve 94b, and can allow the cleaning liquid flowing in the pipes 91 and 94a to pass through to the recovered liquid storage tank 210. In addition, the control unit 102 sets the valve 94b to the closed state by controlling the valve 94b, and can stop the cleaning liquid flowing in the pipes 91 and 94a from passing through to the recovered liquid storage tank 210.

[0123] The substrate processing apparatus 100 of the present embodiment is suitable for forming semiconductor elements. For example, the substrate processing apparatus 100 is suitable for processing the substrate W used for semiconductor elements having a stacked structure. The semiconductor element is a so-called 3D (Dimensional) structured memory (storage device). As an example, the substrate W is suitable for use as a NAND (Notand) type flash memory.

[0124] Next, with reference to Figures 1 - 4 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 4 is a flowchart of the substrate processing method of the present embodiment.

[0125] As Figure 4 shown, in step S102, the substrate W is carried into the chamber 11. Under the control of the control unit 102, the central robot CR carries the substrate W into the chamber 11. Here, the front surface Wa of the substrate W faces vertically upward, and the back surface Wb of the substrate W faces vertically downward.

[0126] In step S104, the substrate holding unit 20 holds the loaded substrate W. Under the control of the control unit 102, the substrate holding unit 20 holds the substrate W.

[0127] In step S106, the rotation of the substrate W is started, and the liquid medicine is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 starts the rotation of the substrate W while holding the substrate W. In addition, under the control of the control unit 102, the liquid medicine supply unit 30 supplies the liquid medicine to the front surface Wa of the substrate W from the nozzle 34.

[0128] In addition, during the supply of the liquid medicine from the nozzle 34 to the front surface Wa of the substrate W, under the control of the control unit 102, the back surface treatment liquid supply unit 50 may supply the liquid medicine to the back surface Wb of the substrate W from the nozzle 51.

[0129] Under the control of the control unit 102, the cup 80 is located above the side covering the substrate W. The cup 80 may also be raised so as to be located on the side of the substrate W when starting to supply the liquid medicine from the nozzle 34 to the front surface Wa of the substrate W. In addition, the cup 80 may be raised in coordination with the start of supplying the treatment liquid to the substrate W.

[0130] Under the control of the control unit 102, the valve 94b is closed in the state where the valve 92b is open. In this case, the cup 80 traps the liquid medicine scattered from the substrate W, and the liquid medicine trapped in the cup 80 flows through the pipe 92a with the valve 92b open and is discharged.

[0131] In step S108, while the substrate W is rotating, the cleaning liquid is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 continues to rotate the substrate W while holding the substrate W. In addition, under the control of the control unit 102, the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44.

[0132] In addition, during the supply of the cleaning liquid from the nozzle 44 to the front surface Wa of the substrate W, under the control of the control unit 102, the back surface treatment liquid supply unit 50 may supply the cleaning liquid to the back surface Wb of the substrate W from the nozzle 51.

[0133] Under the control of the control unit 102, the cup 80 maintains the state of being located above the side covering the substrate W. Under the control of the control unit 102, the state where the valve 94b is closed with the valve 92b open is maintained. In this case, the cup 80 traps the cleaning liquid scattered from the substrate W, and the cleaning liquid trapped in the cup 80 flows through the pipe 91 and then through the pipe 92a with the valve 92b open and is discharged.

[0134] In step S110, while the substrate W is rotating, the cleaning liquid supplied to the substrate W is recovered during the supply of the cleaning liquid to the substrate W. Under the control of the control unit 102, the cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44 while the substrate holding unit 20 rotates the substrate W.

[0135] In addition, while the cleaning liquid is being supplied from the nozzle 44 to the front surface Wa of the substrate W, under the control of the control unit 102, the back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the substrate W from the nozzle 51.

[0136] Under the control of the control unit 102, the cup 80 is held in a state above the side covering the substrate W. Under the control of the control unit 102, the valve 92b is closed and the valve 94b is opened. In this case, the cup 80 traps the cleaning liquid scattered from the substrate W, and the cleaning liquid trapped in the cup 80 flows through the pipe 94a with the valve 94b opened via the pipe 91 and is recovered as the recovered liquid into the recovered liquid storage tank 210.

[0137] In step S112, while the substrate W is rotating, the recovered liquid is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 continues to rotate the substrate W while holding the substrate W. Under the control of the control unit 102, the cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44. Under the control of the control unit 102, the back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the substrate W from the nozzle 51.

[0138] Under the control of the control unit 102, the cup 80 is held in a state above the side covering the substrate W. The recovered liquid storage tank 210 recovers the cleaning liquid and the recovered liquid supplied to the substrate W. Under the control of the control unit 102, the valve 92b is kept closed and the valve 94b is opened. In this case, the cup 80 traps the cleaning liquid and the recovered liquid scattered from the substrate W, and the cleaning liquid and the recovered liquid trapped in the cup 80 flow through the pipe 94a with the valve 94b opened via the pipe 91 and are recovered as the recovered liquid into the recovered liquid storage tank 210.

[0139] In step S114, the substrate W is dried. At this time, the supply of the cleaning liquid and the recovered liquid is stopped, and the rotation speed of the substrate W is increased. Under the control of the control unit 102, the liquid supply unit 30 stops supplying the cleaning liquid from the nozzle 34 to the front surface Wa of the substrate W. In addition, under the control of the control unit 102, the supply of the recovered liquid from the nozzle 51 to the back surface Wb of the substrate W is stopped. Moreover, under the control of the control unit 102, the substrate holding unit 20 increases the rotation speed of the substrate W.

[0140] In addition, under the control of the control unit 102, the cup 80 is maintained in a state of being located above the side of the substrate W. Under the control of the control unit 102, the valve 92b is closed and the valve 94b is opened. In this case, the cup 80 traps the cleaning liquid and the recovery liquid scattered from the substrate W, and the cleaning liquid and the recovery liquid trapped in the cup 80 flow through the pipe 94a with the valve 94b opened via the pipe 91 and are recovered as the recovery liquid into the recovery liquid storage tank 210. After that, under the control of the control unit 102, the substrate holding unit 20 stops the rotation of the substrate W.

[0141] In step S116, the substrate W is carried out from the substrate processing unit 10. Under the control of the control unit 102, the substrate holding unit 20 releases the holding of the substrate W, and the central robot CR takes out the substrate W from the chamber 11. After that, the substrate W is carried out to the outside of the substrate processing apparatus 100 via the transfer robot IR.

[0142] In the present embodiment, as described above, after the front surface Wa of the substrate W is treated with a chemical solution, it is treated with a cleaning liquid. According to the present embodiment, during at least a part of the period when the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0143] In addition, in the present embodiment, during the period when the cleaning liquid is supplied to the front surface Wa of the substrate W, after a predetermined time, the cleaning liquid used for processing the substrate W is recovered as the recovery liquid. Thereby, the cleaning liquid with relatively few impurities can be recovered as the recovery liquid, so problems occurring when the recovery liquid is supplied to the back surface Wb of the substrate W can be suppressed.

[0144] In addition, in the present embodiment, during the period when the cleaning liquid is supplied to the front surface Wa of the substrate W, after a predetermined time, the recovery liquid is supplied to the back surface Wb of the substrate W. Thereby, at the start of the cleaning process, the cleaning liquid with relatively few impurities is also supplied to the back surface Wb of the substrate W, so that the substrate W can be more appropriately cleaned.

[0145] In addition, in the above description, the supply of the recovery liquid to the back surface Wb of the substrate W in step S112 starts after the recovery of the recovery liquid in step S110, but the present embodiment is not limited thereto. The supply of the recovery liquid to the back surface Wb of the substrate W in step S112 may also start simultaneously with the recovery of the recovery liquid in step S110. Or, the supply of the recovery liquid to the back surface Wb of the substrate W in step S112 may also start after the recovery of the recovery liquid in step S110.

[0146] In addition, in step S112 described above, in step S110, the cleaning liquid supply units 40 and 56 supply the recovered liquid obtained by recovering the cleaning liquid for the front surface Wa and the back surface Wb of the substrate W supplied into the chamber 11 to the back surface Wb of the substrate W. However, the present embodiment is not limited thereto. In step S112, the recovered liquid supply unit 58 may also recover the cleaning liquid for the previously processed substrate W supplied into the chamber 11 and supply it as the recovered liquid to the back surface Wb of the current substrate W. Alternatively, in step S112, the recovered liquid supply unit 58 may also recover the cleaning liquid after processing the substrate W in other chambers 11 and supply it as the recovered liquid to the back surface Wb of the substrate W. In addition, in step S110, the recovered liquid collected in the recovered liquid storage tank 210 may be supplied to the back surface Wb of the next substrate W in the chamber 11, or may also be supplied to the back surface Wb of the substrate W accommodated in other chambers 11.

[0147] Next, referring to Figure 1 ~FIG. 5, the substrate processing apparatus 100 of the present embodiment will be described. Figures 5A - 5D It is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment.

[0148] As Figure 5A shown, a chemical liquid is supplied to the front surface Wa and the back surface Wb of the substrate W to process the front surface Wa and the back surface Wb of the substrate W with the chemical liquid. Figure 5A This is Figure 4 an example of step S106. The chemical liquid supply unit 30 supplies a chemical liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies a chemical liquid to the back surface Wb of the rotating substrate W. Here, the cup 80 is located at the upper position. Therefore, the cup 80 faces the side portion of the substrate W. The cup 80 captures the chemical liquid scattered as the substrate W rotates.

[0149] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valve 94b is closed. Therefore, the chemical liquid captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0150] As Figure 5B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W to process the front surface Wa and the back surface Wb of the substrate W with the cleaning liquid. Figure 5B This is Figure 4 an example of step S108. The cleaning liquid supply unit 40 supplies a cleaning liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies a cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the cleaning liquid scattered as the substrate W rotates.

[0151] In the liquid discharge mechanism 90, the state where the valve 92b is kept open and the valve 94b is closed is maintained. Therefore, the cleaning liquid captured in the cup 80 flows through the pipe 9l and the pipe 92a and is discharged.

[0152] As shown Figure 5C in FIG. 1, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. Figure 5C This Figure 4 is an example of step S110. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W, and the back surface treatment liquid supply unit 50 continuously supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0153] In the drainage mechanism 90, the valve 92b is closed, and on the other hand, the valve 94b is opened. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 94a, and flows into the recovered liquid storage tank 210 to be recovered.

[0154] As shown Figure 5D in FIG. 2, a cleaning liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovered liquid. Figure 5D This Figure 4 is an example of step S112. For example, the cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the rotating substrate W. The cup 80 traps the cleaning liquid scattered as the substrate W rotates, and also traps the recovered liquid scattered as the substrate W rotates again.

[0155] In the drainage mechanism 90, the state where the valve 94b is kept open and the valve 92b is closed is maintained. Therefore, the cleaning liquid and the recovered liquid trapped in the cup 80 flow through the pipe 91 and the pipe 94a, and flow into the recovered liquid storage tank 210 to be recovered.

[0156] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovered liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W, and takes out the substrate W from the chamber 11.

[0157] According to the present embodiment, as described above, after treating the front surface Wa of the substrate W with a chemical solution, it is treated with a cleaning liquid. According to the present embodiment, during at least a part of the period when the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new treatment liquid can be reduced.

[0158] In addition Figure 4 and Figures 5A - 5DIn the description shown, while the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, after the back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the substrate W, the recovery liquid is supplied, but this embodiment is not limited thereto. It is also possible that while the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 does not supply the cleaning liquid to the back surface Wb of the substrate W, but supplies the recovery liquid. In such a case, the back surface treatment liquid supply unit 50 may not have the cleaning liquid supply unit 56.

[0159] In addition, Figures 1 - 5D In the substrate processing apparatus 100 shown, the back surface treatment liquid supply unit 50 can selectively supply the recovery liquid and the cleaning liquid to the back surface Wb of the substrate W, but this embodiment is not limited thereto. The back surface treatment liquid supply unit 50 may also supply only the recovery liquid to the back surface Wb of the substrate W.

[0160] Specifically, Figure 4 In the substrate processing apparatus 100 shown, the back surface treatment liquid supply unit 50 has a chemical liquid supply unit 54, a cleaning liquid supply unit 56, and a recovery liquid supply unit 58. Refer to Figures 5A - 5D In the substrate processing method described, the chemical liquid, the cleaning liquid, and the recovery liquid are selectively supplied to the back surface Wb of the substrate W, but this embodiment is not limited thereto. The back surface treatment liquid supply unit 50 may also have a recovery liquid supply unit 58. On the other hand, it does not have the chemical liquid supply unit 54 and the cleaning liquid supply unit 56. In such a case, it is also possible not to supply the chemical liquid and the cleaning liquid to the back surface Wb of the substrate W, but to supply the recovery liquid.

[0161] Next, refer to Figures 1 - 6C to explain the substrate processing apparatus 100 of this embodiment. Figures 6A - 6C is a schematic diagram showing the process of the substrate processing apparatus 100 of this embodiment.

[0162] As Figure 6A shown, the chemical liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is processed with the chemical liquid, and the recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is processed with the recovery liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the rotating front surface Wa of the substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W.

[0163] Here, the cup 80 is located at the upper position and faces the side portion of the substrate W. The cup 80 recovers the chemical liquid and the recovery liquid scattered as the substrate W rotates.

[0164] In the liquid discharge mechanism 90, the valve 92b is opened and the valve 94b is closed. Therefore, the chemical liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0165] As Figure 6BAs shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. For example, the cleaning liquid supply unit 40 supplies a cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 continuously supplies a recovery liquid to the back surface Wb of the rotating substrate W. Here, the cup 80 captures again the cleaning liquid and the recovery liquid scattered as the substrate W rotates.

[0166] In the liquid discharge mechanism 90, the holding valve 92b is kept open and the valve 94b is closed. Therefore, the cleaning liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0167] As Figure 6C shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. The cleaning liquid supply unit 40 continuously supplies a cleaning liquid to the front surface Wa of the rotating substrate W, and the back surface treatment liquid supply unit 50 continuously supplies a recovery liquid to the back surface Wb of the rotating substrate W. Here, the cup 80 captures again the cleaning liquid and the recovery liquid scattered as the substrate W rotates.

[0168] In the liquid discharge mechanism 90, the valve 92b is closed, and on the other hand, the valve 94b is opened. Therefore, the cleaning liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and the pipe 94a, flow to the recovery liquid storage tank 210 and are recovered.

[0169] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovery liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0170] In the present embodiment, as described above, after the front surface Wa of the substrate W is treated with a chemical solution, it is treated with a cleaning liquid. According to the present embodiment, during the supply of the chemical solution and the cleaning liquid to the front surface Wa of the substrate W, a recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the amount of new processing liquid used can be reduced.

[0171] In addition, referring to Figures 1 - 6C the description, the back surface treatment liquid supply unit 50 has both a chemical solution supply unit 54 and a cleaning liquid supply unit 56, but the present embodiment is not limited thereto. The back surface treatment liquid supply unit 50 may not have the cleaning liquid supply unit 56 and may have the chemical solution supply unit 54.

[0172] Next, referring to Figures 1 - 7 , the substrate processing apparatus 100 of the present embodiment will be described.Figure 7 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 7 The substrate processing unit 10 of the present embodiment, except for supplying the diluted chemical solution obtained by diluting the chemical solution with the diluent to the front surface Wa of the substrate W and supplying the diluted chemical solution obtained by diluting the chemical solution with the recovery liquid to the back surface Wb of the substrate W, has the same configuration as the Figure 2 substrate processing apparatus 100 shown in FIG. 1. Repeated descriptions are omitted herein for the sake of brevity.

[0173] As Figure 7 shown in FIG. 2, in the substrate processing unit 10, the chemical solution supply unit 30 supplies the diluted chemical solution obtained by diluting the chemical solution with the diluent to the front surface Wa of the substrate W.

[0174] The chemical solution supply unit 30 includes a pipe 32, a nozzle 34, a pipe 32p, a valve 36p, a pipe 32q, and a valve 36q. The nozzle 34 is connected to one end of the pipe 32.

[0175] The pipe 32p is connected to the other end of the pipe 32. The chemical solution is supplied from a supply source to the pipe 32p. The valve 36p opens and closes the flow path in the pipe 32p. When the valve 36p is opened, the chemical solution flows in the pipe 32p.

[0176] The chemical solution contains, for example, hydrofluoric acid. The chemical solution may also contain phosphoric acid. In addition, the chemical solution may also contain hydrogen peroxide water. The chemical solution may also contain SCl (ammonia hydrogen peroxide water mixture), SC2 (hydrochloric acid hydrogen peroxide water mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0177] The pipe 32q is connected to the other end of the pipe 32. The diluent is supplied from a supply source to the pipe 32q. The valve 36q opens and closes the flow path in the pipe 32q. When the valve 36q is opened, the diluent flows in the pipe 32q.

[0178] The diluent may contain, for example, any one of deionized water (DIW), carbonated water, electrolyzed ion water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., about 10 ppm to 100 ppm), or reduced water (hydrogen water). In addition, the diluent may be of the same type as the cleaning solution.

[0179] When the valves 36p and 36q are opened, the chemical solution and the diluent flow in the pipes 32p and 32q, respectively. As a result, the diluted chemical solution obtained by diluting the chemical solution with the diluent flows in the pipe 32. The nozzle 34 sprays the diluted chemical solution onto the front surface Wa of the substrate W.

[0180] The back surface treatment liquid supply unit 50 supplies the recovery liquid alone or a mixture of the chemical solution and the recovery liquid to the back surface Wb of the substrate W. The back surface treatment liquid supply unit 50 includes a chemical solution supply unit 54 and a recovery liquid supply unit 58. On the other hand, Figure 7The substrate processing apparatus 100 shown is different from Figure 2 the substrate processing apparatus 100 shown. The back surface treatment liquid supply unit 50 does not have a cleaning liquid supply unit 56.

[0181] For example, the back surface treatment liquid supply unit 50 may also supply the recovered liquid to the back surface Wb of the substrate W. In addition, the back surface treatment liquid supply unit 50 may mix the chemical liquid and the recovered liquid and supply it to the back surface Wb of the substrate W.

[0182] Next, referring to Figures 1 - 8C , the substrate processing apparatus 100 of the present embodiment will be described. Figures 8A - 8C is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 8A - 8C Except for treating the substrate W with the diluted chemical liquid, the process is the same as that of the Figures 5A - 5D substrate processing apparatus 100 shown. In order to avoid redundancy, repeated descriptions are omitted.

[0183] As Figure 8A shown, the diluted chemical liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the diluted chemical liquid. The chemical liquid supply unit 30 supplies the diluted chemical liquid to the front surface Wa of the rotating substrate W. Here, the valves 36p and 36q are opened, and the nozzle 34 sprays the diluted chemical liquid onto the front surface Wa of the substrate W.

[0184] The back surface treatment liquid supply unit 50 supplies the diluted chemical liquid to the back surface Wb of the rotating substrate W. The valves 54b and 58b are opened. Therefore, the chemical liquid flowing in the pipe 54a and the recovered liquid flowing in the pipe 58a are mixed in the pipe 52c to produce the diluted chemical liquid. Then, the nozzle 51 sprays the diluted chemical liquid onto the back surface Wb of the substrate W.

[0185] Here, the cup 80 is located at the upper position and faces the side portion of the substrate W. In this case, the cup 80 captures the diluted chemical liquid scattered from the substrate W as the substrate W rotates.

[0186] In the drainage mechanism 90, the valve 92b is opened, and on the other hand, the valve 94b is closed. Therefore, the diluted chemical liquid captured by the cup 80 flows through the pipes 91 and 92a and is discharged.

[0187] As Figure 8B shown, the cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid, and the recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovered liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the rotating substrate W. In the back surface treatment liquid supply unit 50, the valve 54b is closed to stop the supply of the chemical liquid. The cup 80 captures the cleaning liquid and the recovered liquid scattered as the substrate W rotates.

[0188] In the liquid discharge mechanism 90, the holding valve 92b is opened and the valve 94b is closed. Therefore, the cleaning liquid and the recovered liquid collected in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0189] As Figure 8C shown, the cleaning liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is processed with the cleaning liquid, and the recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is processed with the recovered liquid. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 continuously supplies the recovered liquid to the back surface Wb of the rotating substrate W. Here, the cup 80 captures the cleaning liquid and the recovered liquid scattered as the substrate W rotates.

[0190] In the liquid discharge mechanism 90, the valve 94b is opened, and on the other hand, the valve 92b is closed. Therefore, the cleaning liquid and the recovered liquid collected in the cup 80 flow through the pipe 91 and the pipe 94a and are stored in the recovered liquid storage tank 210. The recovered liquid supply unit 58 supplies the recovered liquid stored in the recovered liquid storage tank 210 to the back surface Wb of the substrate W.

[0191] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface processing liquid supply unit 50 stops supplying the recovered liquid. At this time, the substrate holding unit 20 can also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0192] According to the present embodiment, as described above, after the front surface Wa of the substrate W is processed with the diluted chemical solution, it is processed with the cleaning liquid. According to the present embodiment, during the supply of the diluted chemical solution and the cleaning liquid to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W as at least a part of the processing liquid. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0193] Next, with reference to Figures 1 - 9 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 9 is a schematic view of the substrate processing apparatus 100 of the present embodiment. Figure 9 The substrate processing apparatus 100 of has the same configuration as the substrate processing apparatus 100 shown in except that the first chemical solution and the second chemical solution are supplied to the substrate W, and redundant descriptions are omitted to avoid redundancy. Figure 2 shown

[0194] As Figure 9As shown, the liquid medicine supply unit 30 includes a first liquid medicine supply unit 30a and a second liquid medicine supply unit 30b. The first liquid medicine supply unit 30a supplies the first liquid medicine to the front surface Wa of the substrate W. The second liquid medicine supply unit 30b supplies a second liquid medicine different from the first liquid medicine to the front surface Wa of the substrate W. For example, the first liquid medicine supply unit 30a supplies hydrofluoric acid to the front surface Wa of the substrate W, and the second liquid medicine supply unit 30b supplies an ammonia hydrogen peroxide water mixture (SCl) to the front surface Wa of the substrate W.

[0195] The first liquid medicine supply unit 30a includes a pipe 32a, a nozzle 34a, and a valve 36a. The nozzle 34a is connected to the pipe 32a. The first liquid medicine is supplied to the pipe 32a from a supply source. The valve 36a opens and closes the flow path in the pipe 32a. The nozzle 34a sprays the first liquid medicine onto the front surface Wa of the substrate W.

[0196] The valve 36a adjusts the opening degree of the pipe 32a and adjusts the flow rate of the first liquid medicine supplied to the pipe 32a. Specifically, the valve 36a includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0197] The nozzle 34a may also be movable. The first liquid medicine supply unit 30a may also include a nozzle moving unit 38a. The nozzle moving unit 38a can lift the nozzle 34a and can also horizontally rotate the nozzle 34a around a rotation axis. The nozzle moving unit 38a lifts the nozzle 34a. For example, the nozzle moving unit 38a includes a ball screw mechanism and a motor that gives a driving force to the ball screw mechanism. In addition, the nozzle moving unit 38a horizontally rotates the nozzle 34. For example, the nozzle moving unit 38a includes a motor.

[0198] The second liquid medicine supply unit 30b includes a pipe 32b, a nozzle 34b, and a valve 36b. The nozzle 34b is connected to the pipe 32b. The second liquid medicine is supplied to the pipe 32b from a supply source. The valve 36b opens and closes the flow path in the pipe 32b. The nozzle 34b sprays the second liquid medicine onto the front surface Wa of the substrate W. The pipe 32b, the nozzle 34b, the valve 36b, and the nozzle moving unit 38b in the second liquid medicine supply unit 30b have the same structure as the pipe 32a, the nozzle 34a, the valve 36a, and the nozzle moving unit 38a in the first liquid medicine supply unit 30a, and repeated descriptions are omitted.

[0199] The back surface treatment liquid supply unit 50 includes a first liquid medicine supply unit 53 and a second liquid medicine supply unit 55. The first liquid medicine supply unit 53 supplies the first liquid medicine to the back surface Wb of the substrate W. The second liquid medicine supply unit 55 supplies a second liquid medicine different from the first liquid medicine to the back surface Wb of the substrate W. For example, the first liquid medicine supply unit 53 supplies hydrofluoric acid to the back surface Wb of the substrate W, and the second liquid medicine supply unit 55 supplies SC1 (ammonia hydrogen peroxide water mixture) to the back surface Wb of the substrate W.

[0200] The first liquid medicine supply unit 53 includes a pipe 53a and a valve 53b. The first liquid medicine is supplied to the pipe 53a from a supply source. The valve 53b opens and closes the flow path in the pipe 53a.

[0201] The valve 53b adjusts the opening degree of the pipe 53a and regulates the flow rate of the first liquid medicine supplied to the pipe 53a. Specifically, the valve 53b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0202] The second liquid medicine supply unit 55 includes a pipe 55a and a valve 55b. The second liquid medicine is supplied to the pipe 55a from a supply source. The valve 55b opens and closes the flow path in the pipe 55a. The pipe 55a and the valve 55b in the second liquid medicine supply unit 55 have the same structure as the pipe 53a and the valve 53b in the first liquid medicine supply unit 53, and repeated descriptions are omitted.

[0203] The liquid discharging mechanism 90 includes a pipe 93a and a valve 93b in addition to the pipe 92a, the valve 92b, the pipe 94a, and the valve 94b. The pipe 92a is connected to the pipe 91. The first liquid medicine and the cleaning liquid captured in the cup 80 flow from the pipe 91 to the pipe 92a.

[0204] The pipe 93a is connected to the pipe 91. The second liquid medicine and the cleaning liquid captured in the cup 80 flow from the pipe 91 to the pipe 93a. The valve 93b opens and closes the flow path in the pipe 93a. The valve 93b adjusts the opening degree of the pipe 93a and regulates the flow rate of the liquid medicine flowing in the pipe 93a. Specifically, the valve 93b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0205] In addition, a recovered liquid may flow in at least one of the pipe 92a and the pipe 93a.

[0206] Next, referring to Figures 1 - 1 FIG. 1C, the substrate processing apparatus 100 of the present embodiment will be described. Figures 10A - 11C It is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 10A - 1 FIG. 1C is the same as the process of the substrate processing apparatus 100 shown in Figures 5A - 5D except that two kinds of liquid medicines and the cleaning liquid are alternately supplied to the substrate W, and repeated descriptions are omitted to avoid redundancy.

[0207] As shown in Figure 1As shown in Fig. 0A, a first chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the first chemical solution. The first chemical solution supply unit 30a supplies the first chemical solution to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the first chemical solution to the back surface Wb of the rotating substrate W. In this case, the cup 80 traps the first chemical solution scattered as the substrate W rotates.

[0208] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valves 93b and 94b are closed. Therefore, the first chemical solution trapped in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0209] As Figure 10B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0210] In the liquid discharge mechanism 90, the state where the valve 92b is kept open and the valves 93b and 94b are closed is maintained. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0211] As Figure 10C shown, a second chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the second chemical solution. The second chemical solution supply unit 30b supplies the second chemical solution to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the second chemical solution to the back surface Wb of the rotating substrate W. The cup 80 traps the second chemical solution scattered as the substrate W rotates.

[0212] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valves 92b and 94b are closed. Therefore, the second chemical solution trapped in the cup 80 flows through the pipe 91 and the pipe 93a and is discharged.

[0213] As Figure 1 shown in Fig. 1A, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0214] In the liquid discharge mechanism 90, the state where the valve 93b is kept open and the valves 92b and 94b are closed is maintained. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 93a and is discharged.

[0215] As Figure 11B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 continuously supplies the cleaning liquid to the back surface Wb of the substrate W. In this case, the cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0216] In the liquid discharge mechanism 90, the valve 94b is opened, and the valves 92b and 93b are closed. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 94a and flows into the recovered liquid storage tank 210.

[0217] As Figure 11C shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovered liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the substrate W. In this case, the cup 80 recovers the cleaning liquid and the recovered liquid scattered as the substrate W rotates.

[0218] In the liquid discharge mechanism 90, the valve 94b is kept open, and the valves 92b and 93b are closed. Therefore, the cleaning liquid and the recovered liquid trapped in the cup 80 flow through the pipe 91 and the pipe 94a and flow into the recovered liquid storage tank 210.

[0219] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovered liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0220] According to the present embodiment, as described above, the front surface Wa of the substrate W is alternately treated with the first chemical solution, the second chemical solution, and the cleaning liquid. According to the present embodiment, while the cleaning liquid is being supplied to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0221] In addition, referring to Figures 10A - 11C the description above, during the period from when the second chemical solution is supplied to the front surface Wa of the substrate W to when the cleaning liquid is supplied, after a predetermined time, the cleaning liquid is recovered as the recovered liquid, but the present embodiment is not limited to this. It is also possible to recover the cleaning liquid as the recovered liquid after a predetermined time during the period from when the first chemical solution is supplied to the front surface Wa of the substrate W to when the cleaning liquid is supplied.

[0222] Furthermore, referring to Figures 10A - 11CIn the above description, during the period when the cleaning liquid is supplied after the second liquid medicine is supplied to the front surface Wa of the substrate W, after a predetermined time, the recovery liquid is supplied to the back surface Wb of the substrate W. However, the present embodiment is not limited thereto. The recovery liquid may also be supplied to the back surface Wb of the substrate W after a predetermined time during the period when the cleaning liquid is supplied after the first liquid medicine is supplied to the front surface Wa of the substrate W.

[0223] In addition, Figure 2 , Figures 5A - 11C In the substrate processing apparatus 100 shown, all the liquid scattered from the rotating substrate W is collected into the same cup 80. However, the present embodiment is not limited thereto. The cup 80 may also be of multiple types.

[0224] In addition, Figures 1 - 11C In the substrate processing apparatus 100 shown, the substrate holding unit 20 increases the rotation speed of the substrate W to dry the substrate W. However, the present embodiment is not limited thereto. The substrate W may also be dried by supplying gas. In addition, after the cleaning process of the substrate W, a processing liquid with higher volatility may be supplied to the substrate W to dry the substrate W.

[0225] Next, with reference to Figures 1 - 12 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 12 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 12 The substrate processing apparatus 100 has the same configuration as the substrate processing apparatus 100 shown in Figure 9 , except that the cup 80 includes a first cup 81 and a second cup 82, and the substrate processing apparatus 100 further includes a shielding member 60, a processing liquid supply unit 72, and an inert gas supply unit 74. In order to avoid redundancy, the repeated description is omitted.

[0226] As Figure 12 shown, the substrate processing apparatus 100 further includes a shielding member 60, a processing liquid supply unit 72, and an inert gas supply unit 74. The shielding member 60 is located above the front surface Wa of the substrate W. The shielding member 60 can move in the vertical direction relative to the front surface Wa of the substrate W. If the shielding member 60 moves in a manner approaching the front surface Wa of the substrate W, the front surface Wa of the substrate W is shielded. The shielding member 60 supplies the processing liquid and the inert gas to the front surface Wa of the substrate W.

[0227] The shielding member 60 is configured to be movable relative to the substrate W. The shielding member 60 further includes a shielding plate 62 and a moving unit 64. The shielding plate 62 is a plate-shaped member extending in the horizontal direction (XY plane). The shielding plate 62 is located above the front surface Wa of the substrate W held by the chuck member 22. The lower surface 62a of the shielding plate 62 faces the front surface Wa of the substrate W held by the chuck member 22. The lower surface 62a is, for example, circular in shape. The size of the diameter of the lower surface 62a may also be equal to or larger than the diameter of the substrate W.

[0228] The moving part 64 moves the shielding plate 62 up and down in the vertical direction. For example, the moving part 64 includes a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism.

[0229] The moving part 64 moves the shielding plate 62 up and down between the retreat position and the shielding position. The shielding position is a position below the retreat position. Specifically, the shielding position is a position closer to the substrate W held by the chuck member 22 than the retreat position. Figure 12 , the shielding plate 62 is located in the retracted position.

[0230] If the shielding plate 62 moves from the retreat position to the shielding position, the shielding plate 62 at the shielding position and the cup 80 at the upper position form a processing space. The processing space is a space that is substantially shielded from the external atmosphere. In other words, the processing space becomes a local space formed inside the chamber 11. The processing space is substantially shielded from the atmosphere inside the chamber 11.

[0231] The processing liquid supply unit 72 supplies the processing liquid to the front surface Wa of the substrate W. Here, the processing liquid is appropriately used for drying the cleaning liquid. The processing liquid is preferably a low surface tension liquid having a lower surface tension than the cleaning liquid. In the above case, the substrate W is not dried immediately after the cleaning liquid on the substrate W is shaken off, but after the cleaning liquid on the substrate W is replaced with the processing liquid, the substrate W is dried by shaking off the processing liquid on the substrate W. Therefore, if the processing liquid is a low surface tension liquid, the surface tension acting on the substrate W can be reduced when the substrate W is dried.

[0232] Examples of organic solvents that function as the treatment liquid include liquids containing at least one of IPA (isopropyl alcohol), HFE (hydrofluoroether), methanol, ethanol, acetone, PGEE (propylene glycol ethyl ether), and Trans-1,2-dichloroethylene. In addition, the treatment liquid may be a non-monomer component or a liquid mixed with other components. For example, it may be a mixed liquid of IPA and DIW, or a mixed liquid of IPA and HFE.

[0233] The processing liquid supply unit 72 includes a pipe 72a, a nozzle 72b, and a valve 72c. The nozzle 72b is mounted on the shielding plate 62. The processing liquid is supplied from the supply source to the pipe 72a. The valve 72c opens and closes the flow path in the pipe 72a. The nozzle 72b sprays the processing liquid onto the front surface Wa of the substrate W.

[0234] The valve 72c adjusts the opening of the pipe 72a to adjust the flow rate of the treatment liquid supplied to the pipe 72a. Specifically, the valve 72c includes: a valve body (not shown) with a valve seat disposed therein; a valve body that opens and closes the valve seat; and an actuator (not shown) that moves the valve body between an open position and a closed position.

[0235] The inert gas supply unit 74 supplies an inert gas to the front surface Wa of the substrate W. Even if the inert gas is supplied to the front surface Wa of the substrate W, the characteristics of the front surface Wa of the substrate W will not change substantially. Typically, the inert gas is nitrogen. Additionally, the inert gas can also be a noble gas.

[0236] The inert gas supply unit 74 supplies an inert gas to the front surface Wa of the substrate W. The inert gas supply unit 74 includes a pipe 74a, a nozzle 74b, and a valve 74c. The nozzle 74b is installed on the shielding plate 62. An inert gas is supplied to the pipe 74a from a supply source. The valve 74c opens and closes the flow path inside the pipe 74a. The nozzle 74b ejects the inert gas to the front surface Wa of the substrate W.

[0237] The valve 74c adjusts the opening degree of the pipe 74a and regulates the flow rate of the inert gas supplied to the pipe 74a. Specifically, the valve 74c includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0238] On the shielding plate 62, a nozzle 72b and a nozzle 74b are provided. The ejection ports of the nozzle 72b and the nozzle 74b open on the lower surface 62a of the shielding plate 62. The ejection ports of the nozzle 72b and the nozzle 74b can also be located opposite to the central portion of the substrate W held by the chuck member 22. The nozzle 72b ejects a processing liquid to the front surface Wa of the substrate W. The nozzle 74b ejects an inert gas to the front surface Wa of the substrate W.

[0239] The cup 80 has a first cup 81 and a second cup 82. The second cup 82 is located radially outside the first cup 81 with respect to the substrate W. The first cup 81 and the second cup 82 are respectively lifted and lowered in the vertical direction. The first cup 81 and the second cup 82 rise to an upper position on the side of the substrate W. In addition, the first cup 81 and the second cup 82 descend to a lower position obliquely below the substrate W. The first cup 81 and the second cup 82 capture the liquid scattered from the substrate W.

[0240] In addition, the second cup 82 is located overlapping above the first cup 81. Therefore, when the first cup 81 descends, the second cup 82 can descend to the position where the first cup 81 descends.

[0241] The liquid discharge mechanism 90 discharges the chemical liquid, cleaning liquid, and processing liquid captured in the cup 80 to the outside of the chamber 11. The liquid discharge mechanism 90 has a pipe 91a for discharging the processing liquid captured in the first cup 81 and a pipe 91b for discharging the processing liquid captured in the second cup 82. One end of the pipe 91a is connected to the bottom of the first cup 81. One end of the pipe 91b is connected to the bottom of the second cup 82.

[0242] The liquid discharging mechanism 90 includes a pipe 95a and a valve 95b in addition to the pipes 92a, the valve 92b, the pipes 93a, the valve 93b, the pipes 94a and the valve 94b. The pipes 92a, 93a, 94a are connected to the pipe 91a. The pipe 95a is connected to the pipe 91b. The valve 95b has the same configuration as the valves 92b, 93b, 94b.

[0243] For example, while the first cup 81 is continuously supplied with the first liquid medicine to the substrate W by the first liquid medicine supply unit 30a, it is located directly above, and even on the side of the substrate W. At this time, the second cup 82 is also located above, just like the first cup 81.

[0244] In addition, while the first cup 81 is continuously supplied with the cleaning liquid to the substrate W by the cleaning liquid supply unit 40, it is located on the side of the substrate W. After that, while the first cup 81 is continuously supplied with the second liquid medicine and the cleaning liquid to the substrate W by the second liquid medicine supply unit 30b and the cleaning liquid supply unit 40 respectively, it is located on the side of the substrate W.

[0245] In the above case, the first cup 81 captures the first liquid medicine, the cleaning liquid, the second liquid medicine and the cleaning liquid scattered as the substrate W rotates respectively. After that, when the period of supplying the cleaning liquid to the substrate W by the cleaning liquid supply unit 40 ends, the first cup 81 descends from the side of the substrate W to directly below. In the above case, the second cup 82 is located on the side of the substrate W.

[0246] After that, while the second cup 82 is continuously supplied with the processing liquid to the substrate W by the masking member 60, it is located on the side of the substrate W. After that, while the second cup 82 is continuously supplied with the inert gas to the substrate W by the masking member 60, it is located on the side of the substrate W. When the period of supplying the inert gas to the substrate W by the masking member 60 ends, the second cup 82 descends from the side of the substrate W to directly below.

[0247] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first liquid medicine, the second liquid medicine and the cleaning liquid. According to the present embodiment, during at least a part of the period of supplying the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0248] Next, with reference to Figures 1 - 16B , the substrate processing apparatus 100 of the present embodiment will be described. Figures 13A - 16B It is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 13A - 16B Except that the cup 80 has the first cup 81 and the second cup 82, and the processing liquid and the inert gas are supplied to the front surface Wa of the substrate W from the masking member 60, it is the same as Figures 10A - 11C , and the repeated description is omitted to avoid redundancy.

[0249] As shown inFigure 1 As shown in FIG. 3A, a first chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the first chemical solution. The first chemical solution supply unit 30a supplies the first chemical solution to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the first chemical solution to the back surface Wb of the rotating substrate W.

[0250] Here, both the first cup 81 and the second cup 82 are located in the upper position. Therefore, the first cup 81 faces the side portion of the substrate W, and the first cup 81 captures the first chemical solution scattered as the substrate W rotates.

[0251] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valves 93b, 94b, and 95b are closed. Therefore, the first chemical solution captured in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0252] As Figure 13B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The first cup 81 captures the cleaning liquid scattered as the substrate W rotates.

[0253] In the liquid discharge mechanism 90, the valve 92b is kept open, and the valves 93b, 94b, and 95b are closed. Therefore, the cleaning liquid captured in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0254] As Figure 14A shown, a second chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the second chemical solution. The second chemical solution supply unit 30b supplies the second chemical solution to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the second chemical solution to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the second chemical solution scattered as the substrate W rotates.

[0255] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valves 92b, 94b, and 95b are closed. Therefore, the second chemical solution captured in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0256] As Figure 14B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the cleaning liquid scattered as the substrate W rotates.

[0257] In the liquid discharge mechanism 90, the holding valve 93b is open, and the valves 92b, 94b, and 95b are closed. Therefore, the cleaning liquid trapped in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0258] As Figure 15A shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the cleaning liquid. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 continuously supplies the cleaning liquid to the back surface Wb of the substrate W. In this case, the cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0259] In the liquid discharge mechanism 90, the valve 94b is opened, and the valves 92b, 93b, and 95b are closed. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91a and the pipe 94a and flows into the recovered liquid storage tank 210.

[0260] As Figure 15B shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is processed with the cleaning liquid, and a recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is processed with the recovered liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the substrate W.

[0261] In the liquid discharge mechanism 90, the valve 94b is open, and the valves 92b and 93b are closed. Therefore, the cleaning liquid and the recovered liquid trapped in the first cup 81 flow through the pipe 91a and the pipe 94a and flow into the recovered liquid storage tank 210.

[0262] As Figure 16A shown, a processing liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is processed with the processing liquid. The shielding member 60 supplies the processing liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 stops supplying the processing liquid to the back surface Wb of the substrate W.

[0263] Here, the first cup 81 moves from the upper position to the lower position, and the second cup 82 is located at the upper position. Therefore, the second cup 82 faces the side portion of the substrate W. The second cup 82 traps the processing liquid scattered as the substrate W rotates.

[0264] In the liquid discharge mechanism 90, the valve 95b is opened, and the valves 92b, 93b, and 94b are closed. Therefore, the processing liquid trapped in the second cup 82 flows through the pipe 91b and the pipe 95a and is discharged.

[0265] As Figure 16BAs shown, an inert gas is supplied to the front surface Wa of the substrate W to blow away the processing liquid on the front surface Wa of the substrate W. The shielding member 60 supplies an inert gas to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 maintains a state of stopping the supply of the processing liquid to the back surface Wb of the substrate W. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W.

[0266] Here, the second cup 82 maintains a state of being located at the upper position. The second cup 82 traps the processing liquid scattered as the substrate W rotates.

[0267] In the liquid discharge mechanism 90, the valve 95b is opened, and the valves 92b, 93b, and 94b are closed. Therefore, the processing liquid trapped in the second cup 82 flows through the pipe 91b and the pipe 95a and is discharged.

[0268] After that, the shielding member 60 stops supplying the inert gas, and the substrate holding unit 20 stops the rotation of the substrate W. In this way, the substrate W is dried. After that, the substrate W is taken out of the chamber 11.

[0269] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical solution, the second chemical solution, and the cleaning solution. According to the present embodiment, during at least a part of the period when the cleaning solution is supplied to the front surface Wa of the substrate W, a recovery solution is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0270] In addition, Figure 16A In, when the shielding member 60 supplies the processing liquid to the front surface Wa of the substrate W, the valve 94b is closed, but when the shielding member 60 supplies the processing liquid to the front surface Wa of the substrate W, the valve 94b through which the cleaning solution and the recovery solution trapped in the first cup 81 flow may be kept open. Thereby, when the shielding member 60 supplies the processing liquid to the front surface Wa of the substrate W, the recovery liquid storage tank 210 can also recover the cleaning solution and the recovery solution trapped in the first cup 81. In addition, the valve 94b may be opened for a predetermined time after the start of the period when the shielding member 60 supplies the processing liquid to the front surface Wa of the substrate W, and closed after the lapse of the predetermined time.

[0271] In addition, Figures 12 - 16B In the substrate processing apparatus 100 shown, the cup 80 has the first cup 81 and the second cup 82, but the present embodiment is not limited thereto. The cup 80 may have three or more cups.

[0272] Next, with reference to Figures 1 - 17 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 17 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 1The substrate processing unit 10 of 7 has, in addition to the cup 80 excluding the first cup 81 and the second cup 82, a third cup 83, and has the same configuration as the Figure 12 substrate processing apparatus 100 shown. Repeated descriptions are omitted to avoid redundancy.

[0273] As Figure 17 shown, the cup 80 has a first cup 81, a second cup 82, and a third cup 83. The third cup 83 is located radially outside the substrate W with respect to the second cup 82. The first cup 81 to the third cup 83 are respectively lifted and lowered in the vertical direction. The first cup 81 to the third cup 83 rise to the upper position on the side of the substrate W. In addition, the first cup 81 to the third cup 83 descend to the lower position obliquely below the substrate W. The first cup 81 to the third cup 83 capture the liquid scattered from the substrate W.

[0274] In addition, the third cup 83 is located overlapping above the second cup 82. Therefore, when the second cup 82 descends, the third cup 83 can descend to the position where the second cup 82 descends.

[0275] The liquid discharge mechanism 90 discharges the chemical liquid, cleaning liquid, and processing liquid captured in the cup 80 to the outside of the chamber 11. The liquid discharge mechanism 90 has a pipe 91a for discharging the processing liquid captured in the first cup 81, a pipe 91b for discharging the processing liquid captured in the second cup 82, and a pipe 91c for discharging the processing liquid captured in the third cup 83. One end of the pipe 91a is connected to the bottom of the first cup 81. One end of the pipe 91b is connected to the bottom of the second cup 82. One end of the pipe 91c is connected to the third cup 83.

[0276] In the liquid discharge mechanism 90, the pipes 92a, 93a are connected to the pipe 91a. The pipe 94a is connected to the pipe 91b. The pipe 95a is connected to the pipe 91c.

[0277] For example, during the period when the first cup 81 continuously supplies the first chemical liquid to the substrate W by the first chemical liquid supply unit 30a, it is located directly above, even on the side of the substrate W. At this time, the second cup 82 is also located above, the same as the first cup 81.

[0278] In addition, during the period when the first cup 81 continuously supplies the cleaning liquid to the substrate W by the cleaning liquid supply unit 40, it is located on the side of the substrate W. After that, during the period when the first cup 81 continuously supplies the second chemical liquid and the cleaning liquid to the substrate W by the second chemical liquid supply unit 30b and the cleaning liquid supply unit 40 respectively, it is located on the side of the substrate W.

[0279] In this case, the first cup 81 captures the first chemical solution, the cleaning solution, the second chemical solution, and the cleaning solution that scatter as the substrate W rotates. After that, when the period during which the cleaning solution supply unit 40 supplies the cleaning solution to the substrate W ends, the first cup 81 descends from the side of the substrate W to directly below vertically. In this case, the second cup 82 is located on the side of the substrate W.

[0280] After that, during the period when the second cup 82 flows and supplies the cleaning solution and the recovered solution to the substrate W in the recovered solution storage tank 210, the second cup 82 is located on the side of the substrate W.

[0281] After that, if the shielding member 60 shields the front surface Wa of the substrate W and starts to supply the processing solution to the substrate W, then the second cup 82 descends from the side of the substrate W to directly below vertically. During the period when the shielding member 60 supplies the processing solution to the substrate W, the third cup 83 is located on the side of the substrate W. After that, during the period when the shielding member 60 supplies the inert gas to the substrate W, the third cup 83 is continuously located on the side of the substrate W. The third cup 83 captures the processing solution that scatters as the substrate W rotates. When the period during which the shielding member 60 supplies the inert gas to the substrate W ends, the third cup 83 descends from the side of the substrate W to directly below vertically.

[0282] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical solution, the second chemical solution, and the cleaning solution. According to the present embodiment, during at least a part of the period of supplying the cleaning solution to the front surface Wa of the substrate W, the recovered solution is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the amount of the new processing solution used can be reduced.

[0283] Next, with reference to Figures 1 - 20 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 1 8A to Figure 20 is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 18A - 20 Except that in addition to the cups 80, the first cup 81 and the second cup 82, the third cup 83 is also provided, the process is the same as that of the substrate processing apparatus 100 described with reference to Figure 1 3A to Figure 16B . In order to avoid redundancy, repeated descriptions are omitted.

[0284] As shown in Figure 1 8A, the first chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the first chemical solution. The first chemical solution supply unit 30a supplies the first chemical solution to the front surface Wa of the rotating substrate W. The back surface processing solution supply unit 50 supplies the first chemical solution to the back surface Wb of the rotating substrate W.

[0285] Here, the first cup 81 to the third cup 83 are all in the upper position. Therefore, the first cup 81 faces the side of the substrate W. The first cup 81 traps the first liquid medicine scattered as the substrate W rotates.

[0286] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valves 93b, 94b, and 95b are closed. Therefore, the first liquid medicine trapped in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0287] As Figure 1 As shown in FIG. 8B, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the first cup 81 traps the cleaning liquid scattered as the substrate W rotates.

[0288] In the liquid discharge mechanism 90, the valve 92b is kept open, and the valves 93b, 94b, and 95b are closed. Therefore, the cleaning liquid trapped in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0289] As Figure 1 As shown in FIG. 8C, a second liquid medicine is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the second liquid medicine. The second liquid medicine supply unit 30b supplies the second liquid medicine to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the second liquid medicine to the back surface Wb of the rotating substrate W. Here, the first cup 81 traps the second liquid medicine scattered as the substrate W rotates.

[0290] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valves 92b, 94b, and 95b are closed. Therefore, the second liquid medicine trapped in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0291] As Figure 19A As shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the first cup 81 traps the cleaning liquid scattered as the substrate W rotates.

[0292] In the liquid discharge mechanism 90, the valve 93b is kept open, and the valves 92b, 94b, and 95b are closed. Therefore, the cleaning liquid trapped in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0293] As Figure 19BAs shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid. Also, a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W.

[0294] Here, the first cup 81 moves from the upper position to the lower position, and the second cup 82 and the third cup 83 are both in the upper position. Therefore, the second cup 82 faces the side portion of the substrate W. The second cup 82 captures the cleaning liquid and the recovery liquid that scatter as the substrate W rotates.

[0295] In the liquid discharge mechanism 90, the valve 94b is opened, and the valves 92b, 93b, and 95b are closed. Therefore, the cleaning liquid and the recovery liquid captured in the second cup 82 flow through the pipe 91b and the pipe 94a and are recovered by the recovery liquid storage tank 210.

[0296] As Figure 19C shown, a processing liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the processing liquid. The shielding member 60 supplies the processing liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 stops supplying the processing liquid to the back surface Wb of the substrate W.

[0297] Here, the second cup 82 moves from the upper position to the lower position, and the third cup 83 is in the upper position. Therefore, the third cup 83 faces the side portion of the substrate W. The third cup 83 captures the processing liquid that scatters as the substrate W rotates.

[0298] In the liquid discharge mechanism 90, the valve 95b is opened, and the valves 92b, 93b, and 94b are closed. Therefore, the processing liquid captured in the third cup 83 flows through the pipe 91c and the pipe 95a and is discharged.

[0299] As Figure 20 shown, an inert gas is supplied to the front surface Wa of the substrate W to blow off the processing liquid on the front surface Wa of the substrate W. The shielding member 60 supplies the inert gas to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 maintains the state of stopping the supply of the processing liquid to the back surface Wb of the substrate W. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W.

[0300] Here, the third cup 83 remains in the upper position. The third cup 83 captures the processing liquid that scatters as the substrate W rotates.

[0301] In the liquid discharge mechanism 90, the state where the valve 95b is open and the valves 92b, 93b, and 94b are closed is maintained. Therefore, the processing liquid captured in the third cup 83 flows through the pipe 91c and the pipe 95a and is discharged.

[0302] Thereafter, the shielding member 60 stops supplying the inert gas, and the substrate holding unit 20 stops the rotation of the substrate W. In this way, the substrate W is dried. Thereafter, the substrate W is carried out of the chamber 11.

[0303] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical solution, the second chemical solution, and the cleaning solution. According to the present embodiment, during at least a part of the period when the cleaning solution is supplied to the front surface Wa of the substrate W, the recovery solution is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing solution can be reduced.

[0304] As described above, embodiments of the present invention have been described with reference to the accompanying drawings. However, the present invention is not limited to the above-described embodiments, and can be implemented in various ways without departing from the gist thereof. In addition, by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments, various inventions can be formed. For example, several constituent elements can also be deleted from all the constituent elements shown in the embodiments. Moreover, the constituent elements in different embodiments can also be appropriately combined. For the sake of easy understanding, the drawings schematically show each constituent element on the whole, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings may be different from the actual ones for the convenience of making the drawings. In addition, the materials, shapes, sizes, etc. of the constituent elements shown in the above-described embodiments are examples and are not particularly limited, and various changes can be made without substantially departing from the effects of the present invention.

[0305] In addition, Figure 2 , Figures 5A - 20 In the substrate processing apparatus 100 shown, the front surface Wa of the substrate W faces vertically upward, and the back surface Wb of the substrate W faces vertically downward, but the present embodiment is not limited thereto. The front surface Wa of the substrate W may face vertically downward, and the back surface Wb of the substrate W may face vertically upward. In such a case, the recovery solution is supplied to the back surface Wb of the substrate W facing vertically upward.

[0306] In addition, Figure 1 In the substrate processing apparatus 100 shown, the recovery solution storage tank 210 is arranged in the processing solution tank 110, but the present embodiment is not limited thereto. The recovery solution storage tank 210 may also be arranged in a place different from the processing solution tank 110. For example, the recovery solution storage tank 210 may also be arranged in the processing solution cassette 120. Or, the recovery solution storage tank 210 may also be arranged in the chamber 11.

[0307] Although the embodiments of the present invention have been described in detail, these are merely specific examples for clarifying the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The scope of the present invention is only defined by the appended claims.

Claims

1. A substrate processing apparatus, comprising: a chamber that houses a substrate having a front surface on which devices are provided and a back surface opposite to the front surface; a substrate holding unit that holds the substrate in the chamber; a chemical solution supply unit that supplies a chemical solution to the front surface of the substrate held by the substrate holding unit; and a cleaning solution supply unit that supplies a cleaning solution to the front surface of the substrate held by the substrate holding unit; a cup that captures the cleaning solution scattered from the substrate held by the substrate holding unit; a recovered solution storage tank that stores the cleaning solution captured by the cup as a recovered solution; and a back surface treatment solution supply unit that supplies the recovered solution stored in the recovered solution storage tank to the back surface of the substrate held by the substrate holding unit.

2. The substrate processing apparatus according to claim 1, further comprising a pipe that connects the cup and the recovered solution storage tank and through which the cleaning solution captured by the cup flows.

3. The substrate processing apparatus according to claim 1 or 2, wherein, during the supply of the cleaning solution to the front surface of the substrate by the cleaning solution supply unit, the back surface treatment solution supply unit supplies the recovered solution to the back surface of the substrate.

4. The substrate processing apparatus according to claim 1 or 2, wherein, during the supply of the cleaning solution to the front surface of the substrate by the cleaning solution supply unit, the back surface treatment solution supply unit supplies a cleaning solution to the back surface of the substrate and then supplies the recovered solution.

5. The substrate processing apparatus according to claim 1 or 2, wherein, during the supply of the cleaning solution to the front surface of the substrate by the cleaning solution supply unit, the recovered solution storage tank recovers the cleaning solution supplied to the substrate as a recovered solution, and the back surface treatment solution supply unit supplies the recovered solution to the back surface of the substrate.

6. The substrate processing apparatus according to claim 1 or 2, wherein, during each of the supply of the chemical solution to the front surface of the substrate by the chemical solution supply unit and the supply of the cleaning solution to the front surface of the substrate by the cleaning solution supply unit, the back surface treatment solution supply unit supplies the recovered solution to the back surface of the substrate.

7. A substrate processing method, comprising the following steps: a substrate holding unit holds a substrate having a front surface on which devices are provided and a back surface opposite to the front surface; a chemical solution is supplied to the front surface of the substrate held by the substrate holding unit; after the supply of the chemical solution to the front surface of the substrate, a cleaning solution is supplied to the front surface of the substrate held by the substrate holding unit; the cleaning solution supplied to the substrate is recovered as a recovered solution into a recovered solution storage tank; and the recovered solution in the recovered solution storage tank is supplied to the back surface of the substrate held by the substrate holding unit.

8. The substrate processing method according to claim 7, wherein, during the supply of the cleaning solution to the front surface of the substrate, the recovered solution is supplied to the back surface of the substrate.

9. The substrate processing method according to claim 7 or 8, wherein during the supply of the cleaning liquid to the front surface of the substrate, after the supply of the cleaning liquid to the back surface of the substrate, the recovery liquid is supplied.

10. The substrate processing method according to claim 7 or 8, wherein during the supply of the cleaning liquid to the front surface of the substrate, the cleaning liquid supplied to the substrate is recovered as the recovery liquid into the recovery liquid storage tank, and the recovery liquid is supplied to the back surface of the substrate.

11. The substrate processing method according to claim 7 or 8, wherein during each of the supply of the chemical liquid to the front surface of the substrate and the supply of the cleaning liquid to the front surface of the substrate, the recovery liquid is supplied to the back surface of the substrate.

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