Substrate processing apparatus and substrate processing method

Abstract

The invention relates to a substrate processing apparatus and a substrate processing method. This substrate processing apparatus (100) is provided with: a chamber (11) for accommodating a substrate (W) having a front surface (Wa) on which a device is provided and a back surface (Wb) positioned on the opposite side from the front surface (Wa); a substrate holding unit (20) that holds the substrate (W) in the chamber (11); a chemical solution supply unit (30) that supplies a chemical solution to the front surface (Wa) of the substrate (W) held by the substrate holding unit (20); a cleaning liquid supply unit (40) that supplies a cleaning liquid to the front surface (Wa) of the substrate (W) held by the substrate holding unit (20); a recovered liquid storage tank (210) for storing the recovered liquid; and a back surface treatment liquid supply unit (50) that supplies the recovery liquid stored in the recovery liquid storage tank (210) to the back surface (Wb) of the substrate (W).

Description

[0001] Related Applications

[0002] This application is based on Japanese Patent Application No. 2024-009545 filed on January 25, 2024, and claims priority thereto. The entire content of this application is incorporated herein by reference. Technical Field

[0003] The present invention relates to a substrate processing apparatus and a substrate processing method. Background Art

[0004] There is known a substrate processing apparatus for processing a substrate. The substrate processing apparatus is suitable for processing a semiconductor substrate. The substrate processing apparatus processes the substrate using a processing liquid.

[0005] Typically, after the substrate processing apparatus processes the substrate with a chemical solution, a cleaning liquid is supplied to the substrate to wash the substrate processed with the chemical solution. In the substrate processing apparatus, sometimes the chemical solution and the cleaning liquid are supplied not only to the front surface of the substrate but also to the back surface of the substrate (see Japanese Patent Laid-Open No. 2019-125634). In the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, after the chemical solution and the cleaning liquid are supplied to the front and back surfaces of the substrate, the substrate is dried. Then, infrared rays radiated from the processing liquid adhering to the back surface of the substrate pass through the substrate and are received by the light receiving portion of the detection unit, thereby detecting the liquid residue on the back surface of the substrate. At this time, the processing liquid scattered from the substrate is collected in a recovery cup, and the processing liquid collected in the recovery cup is discharged from the drain port at the bottom of the recovery cup to the outside of the processing unit. In the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, when a liquid remains on the back surface of the substrate, the liquid residue on the back surface of the substrate is eliminated by performing a recovery cleaning process. Summary of the Invention

[0006] In recent years, in order to reduce the environmental load, research has been conducted on reducing the resources required for substrate processing. However, in the substrate processing apparatus of Japanese Patent Laid-Open No. 2019-125634, when processing a substrate, there is a concern about an increase in the usage amount of a new processing liquid.

[0007] One embodiment of the present invention provides a substrate processing apparatus and a substrate processing method capable of reducing the usage amount of a new processing liquid.

[0008] A substrate processing apparatus according to an embodiment of the present invention includes: a chamber that houses a substrate having a front surface on which devices are provided and a back surface opposite to the front surface; a substrate holding unit that holds the substrate in the chamber; a chemical solution supply unit that supplies a chemical solution to the front surface of the substrate held by the substrate holding unit; and a cleaning solution supply unit that supplies a cleaning solution to the front surface of the substrate held by the substrate holding unit. Preferably, the substrate processing apparatus includes: a recovered liquid storage tank that stores a recovered liquid; and a back surface processing liquid supply unit that supplies the recovered liquid stored in the recovered liquid storage tank to the back surface of the substrate.

[0009] In an embodiment, the substrate processing apparatus further includes a control unit that determines whether to recover the liquid into the recovered liquid storage tank.

[0010] In an embodiment, the substrate processing apparatus further includes: a storage tank that stores a liquid; a heater that heats the liquid flowing from the storage tank; and a temperature measurement unit that measures the temperature of the liquid heated by the heater. The control unit determines whether to recover the liquid heated by the heater into the recovered liquid storage tank based on the temperature measured by the temperature measurement unit.

[0011] In an embodiment, the substrate processing apparatus further includes: an ozone gas generator that generates ozone gas; an ozone gas dissolution tank that dissolves the ozone gas generated by the ozone gas generator in a liquid to generate an ozone solution; and a concentration measurement unit that measures the ozone concentration of the ozone solution generated in the ozone gas dissolution tank. The control unit determines whether to recover the ozone solution generated in the ozone gas dissolution tank into the recovered liquid storage tank based on the ozone concentration measured by the concentration measurement unit.

[0012] In an embodiment, the chemical solution supply unit includes a chemical solution storage tank that stores the chemical solution, and the recovered liquid storage tank stores at least a part of the cleaning solution for cleaning the chemical solution storage tank as the recovered liquid.

[0013] In an embodiment, the substrate processing apparatus further includes: a cup that captures the processing liquid scattered from the substrate held by the substrate holding unit; a drain pipe that connects the cup to the recovered liquid storage tank; and a chamber cleaning pipe that is disposed in the chamber and sprays a cleaning solution for cleaning the chamber. The recovered liquid storage tank stores at least a part of the cleaning solution sprayed from the chamber cleaning pipe as the recovered liquid.

[0014] In one embodiment, the cleaning liquid supply unit includes: a cleaning liquid pipe through which the cleaning liquid flows; and a valve provided in the cleaning liquid pipe to adjust the flow rate of the cleaning liquid flowing in the cleaning liquid pipe. The substrate processing apparatus further includes a branch pipe that is connected to the cleaning liquid pipe upstream of the valve in the cleaning liquid pipe and through which the cleaning liquid flows even when the valve is closed. The recovered liquid storage tank stores the cleaning liquid flowing in the branch pipe as the recovered liquid.

[0015] A substrate processing method according to an embodiment of the present invention includes the following steps: supplying a chemical solution to the front surface of a substrate, where the substrate has the front surface on which devices are provided and a back surface opposite to the front surface; and after supplying the chemical solution to the front surface of the substrate, supplying a cleaning liquid to the front surface of the substrate. Preferably, the substrate processing method includes the following steps: supplying the recovered liquid from a recovered liquid storage tank that stores the recovered liquid to the back surface of the substrate.

[0016] The substrate processing method may also include one or any combination of various features described for the substrate processing apparatus.

[0017] The above or further other objects, features, and effects of the present invention are clarified by the description of the embodiments described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic top view of the substrate processing apparatus according to the present embodiment.

[0019] Figure 2 is a schematic view of the substrate processing apparatus according to the present embodiment.

[0020] Figure 3 is a block diagram of the substrate processing apparatus according to the present embodiment.

[0021] Figure 4 is a flowchart of the substrate processing method according to the present embodiment.

[0022] Figures 5A - 5C is a schematic view showing the process of the substrate processing apparatus according to the present embodiment.

[0023] Figure 6 is a schematic top view of the substrate processing apparatus according to the present embodiment.

[0024] Figure 7 is a schematic view of the substrate processing apparatus according to the present embodiment.

[0025] Figure 8 is a flowchart of the substrate processing method according to the present embodiment.

[0026] Figure 9 is a schematic top view of the substrate processing apparatus according to this embodiment.

[0027] Figure 10 is a schematic view of the substrate processing apparatus according to this embodiment.

[0028] Figure 11 is a flowchart of the substrate processing method according to this embodiment.

[0029] Figure 12 is a schematic view of the substrate processing apparatus according to this embodiment.

[0030] Figure 13 is a schematic view of the substrate processing apparatus according to this embodiment.

[0031] Figure 14 is a flowchart of the substrate processing method according to this embodiment.

[0032] Figure 15 is a schematic top view of the substrate processing apparatus according to this embodiment.

[0033] Figure 16 is a schematic view of the substrate processing apparatus according to this embodiment.

[0034] Figure 17 is a flowchart of the substrate processing method according to this embodiment.

[0035] Figures 18A - 18D is a schematic view showing the process of the substrate processing apparatus according to this embodiment.

[0036] Figure 19 is a schematic view of the substrate processing apparatus according to this embodiment.

[0037] Figure 20A and 20B is a schematic view showing the process of the substrate processing apparatus according to this embodiment.

[0038] Figure 21 is a schematic view of the substrate processing apparatus according to this embodiment.

[0039] Figure 22A and 22B is a schematic view showing the process of the substrate processing apparatus according to this embodiment.

[0040] Figure 23 is a schematic view of the substrate processing apparatus according to this embodiment.

[0041] Figures 24A - 24C is a schematic view showing the process of the substrate processing apparatus according to this embodiment.

[0042] Figure 25A and 25BIt is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0043] Figure 26 It is a schematic diagram of the substrate processing apparatus according to the present embodiment.

[0044] Figure 27A and 27B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0045] Figure 28A and 28B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0046] Figure 29A and 29B It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0047] Figure 30 It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0048] Figure 31 It is a schematic diagram of the substrate processing apparatus according to the present embodiment.

[0049] Figures 32A - 32C It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0050] Figures 33A - 33C It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment.

[0051] Figure 34 It is a schematic diagram showing the process of the substrate processing apparatus according to the present embodiment. Detailed Embodiments

[0052] Hereinafter, embodiments of the substrate processing apparatus and the substrate processing method of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated. In the present specification, for ease of understanding of the invention, the X-axis, Y-axis, and Z-axis that are orthogonal to each other are sometimes described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0053] First, with reference to Figure 1 , an embodiment of the substrate processing apparatus 100 of the present invention will be described. Figure 1 It is a schematic top view of the substrate processing apparatus 100 according to the present embodiment.

[0054] The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W in such a manner as to perform at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a part of the film, and cleaning.

[0055] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is in a substantially disc shape. Here, the substrate processing apparatus 100 processes the substrate W one by one.

[0056] As Figure 1 shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 10, a processing liquid tank 110, a processing liquid cassette 120, a plurality of load ports LP, a transfer robot IR, a center robot CR, and a control device 101 (controller). The control device 101 controls the load ports LP, the transfer robot IR, and the center robot CR. The control device 101 may also be configured or programmed to control the respective components within the substrate processing units 10, the processing liquid tank 110, and the processing liquid cassette 120. The control device 101 includes a control unit 102 and a storage unit 104.

[0057] Each load port LP stacks and accommodates a plurality of substrates W. The transfer robot IR transports the substrate W between the load port LP and the center robot CR. The center robot CR transports the substrate W between the transfer robot IR and the substrate processing unit 10. Each substrate processing unit 10 sprays a processing liquid onto the substrate W to process the substrate W. The processing liquid includes a chemical solution, a cleaning solution, a rinsing solution, a removing solution, and / or a waterproofing agent. The processing liquid tank 110 accommodates the processing liquid. In addition, the processing liquid tank 110 may also accommodate a gas.

[0058] Specifically, the plurality of substrate processing units 10 are configured to form a plurality of towers TW ( Figure 1 in this case, four towers TW) that surround the center robot CR in a top view. Each tower TW includes a plurality of substrate processing units 10 stacked vertically ( Figure 1 in this case, three substrate processing units 10). The processing liquid cassette 120 corresponds to each of the plurality of towers TW. The liquid in the processing liquid tank 110 is supplied to all of the substrate processing units 10 included in the tower TW corresponding to the processing liquid cassette 120 via any one of the processing liquid cassettes 120. In addition, the gas in the processing liquid tank 110 is supplied to all of the substrate processing units 10 included in the tower TW corresponding to the processing liquid cassette 120 via any one of the processing liquid cassettes 120.

[0059] In the substrate processing apparatus 100, a boundary wall is disposed between the area where the center robot CR and the substrate processing units 10 are provided and the area where the processing liquid tank 110 is provided.

[0060] Typically, the processing liquid tank 110 has a storage tank (tank) for preparing the processing liquid. The processing liquid tank 110 may have a storage tank for one type of processing liquid or may have storage tanks for a plurality of types of processing liquids. In addition, the processing liquid tank 110 has a pump, a valve, a heater, and / or a filter for circulating the processing liquid.

[0061] The processing liquid tank 110 includes a chemical liquid tank 110A and a cleaning liquid tank 110B. For example, the chemical liquid tank 110A and the cleaning liquid tank 110B are arranged separately from each other. Additionally, the chemical liquid tank 110A and the cleaning liquid tank 110B may also be arranged adjacent to each other.

[0062] For example, the chemical liquid tank 110A supplies the chemical liquid to the processing liquid cassette 120. In addition, the cleaning liquid tank 110B supplies the cleaning liquid to the processing liquid cassette 120. The processing liquid cassette 120 supplies the chemical liquid and the cleaning liquid to the substrate processing unit 10.

[0063] Here, the processing liquid tank 110 further includes a recovered liquid tank 110C. The recovered liquid tank 110C stores the recovered liquid of the recovered liquid. For example, the recovered liquid tank 110C recovers the liquid used once as the recovered liquid. In addition, the recovered liquid tank 110C supplies the recovered recovered liquid to the processing liquid cassette 120.

[0064] The recovered liquid tank 110C has a recovered liquid storage tank (tank) 210 that stores the liquid used once as the recovered liquid. The recovered liquid stored in the recovered liquid storage tank 210 is supplied to the processing liquid cassette 120.

[0065] The processing liquid tank 110 may have a recovered liquid storage tank 210 for storing one type of recovered liquid, or may have a recovered liquid storage tank 210 for storing multiple types of recovered liquid. In addition, the processing liquid tank 110 has a pump, a valve, a heater, and / or a filter for circulating the recovered liquid.

[0066] The control device 101 controls various operations of the substrate processing device 100. Through the control device 101, the substrate processing unit 10 processes the substrate W.

[0067] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a Central Processing Unit (CPU, central processing unit). Alternatively, the control unit 102 may have a general-purpose arithmetic unit.

[0068] The storage unit 104 is a storage device that stores data and computer programs. The data includes recipe data. The recipe data includes information representing multiple recipes. Each of the multiple recipes specifies the processing content and processing sequence of the substrate W.

[0069] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable medium. The control unit 102 executes the computer program stored in the storage unit 104 and performs the substrate processing operation.

[0070] Next, refer toFigure 2 , which illustrates the substrate processing unit 10 of the substrate processing apparatus 100 according to the present embodiment. Figure 2 is a schematic diagram of the substrate processing apparatus 100.

[0071] The substrate processing apparatus 100 includes a substrate processing unit 10, a chamber 11, a substrate holding unit 20, a chemical solution supply unit 30, a cleaning solution supply unit 40, a backside processing solution supply unit 50, a cup 80, a drainage mechanism 90, and a recovered solution storage tank 210.

[0072] The chamber 11 has a substantially box shape with an internal space. The chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes the substrate W one by one, and the substrate W is housed one by one in the chamber 11. The substrate W is housed in the chamber 11 and processed in the chamber 11. At least a part of each of the substrate holding unit 20, the chemical solution supply unit 30, the cleaning solution supply unit 40, the backside processing solution supply unit 50, and the cup 80 is housed in the chamber 11.

[0073] The substrate holding unit 20 is a substrate holder that holds the substrate W. Typically, it may also be a rotating chuck. The substrate W has a front surface Wa and a back surface Wb. The front surface Wa and the back surface Wb of the substrate W are the main surfaces of the substrate W, respectively. Devices are provided on the front surface Wa of the substrate W. The front surface Wa of the substrate W is the surface on which devices for forming an electronic circuit are provided, and the back surface Wb of the substrate W is the surface on which such devices are not provided. For example, a stacked structure with grooves is provided on the front surface Wa of the substrate W.

[0074] The substrate holding unit 20 holds the substrate W horizontally. The substrate holding unit 20 rotates the substrate W while holding the substrate W. Here, the front surface Wa of the substrate W faces vertically upward, and the back surface Wb of the substrate W faces vertically downward. However, the front surface Wa of the substrate W may also face vertically downward, and the back surface Wb of the substrate W may face vertically upward. In this way, the substrate holding unit 20 holds the substrate W horizontally such that one of the front surface Wa and the back surface Wb of the substrate W faces upward and the other faces downward.

[0075] For example, the substrate holding unit 20 may also be a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding unit 20 may have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holding unit 20 may be a vacuum type. In this case, the substrate holding unit 20 holds the substrate W horizontally by adsorbing the central portion of the non-device forming surface, that is, the back surface Wb of the substrate W, on the upper surface. Alternatively, the substrate holding unit 20 may combine a clamping type in which a plurality of chuck pins contact the peripheral end surface of the substrate W with a vacuum type.

[0076] For example, the substrate holding unit 20 includes a rotating base 21, a chuck member 22, a shaft 23, a motor 24, a housing 25, and a nozzle 51. The chuck member 22 is disposed on the rotating base 21. The chuck member 22 holds the substrate W. Typically, a plurality of chuck members 22 are provided on the rotating base 21.

[0077] The shaft 23 is a hollow shaft. The shaft 23 extends in the vertical direction along the rotation axis Ax. At the upper end of the shaft 23, the rotating base 21 is coupled. The substrate W is placed above the rotating base 21.

[0078] The rotating base 21 is disk-shaped and horizontally supports the substrate W. The shaft 23 extends downward from the central portion of the rotating base 21. The motor 24 imparts a rotational force to the shaft 23. By rotating the shaft 23 in the rotational direction, the motor 24 rotates the substrate W and the rotating base 21 about the rotation axis Ax. The housing 25 surrounds the shaft 23 and the motor 24.

[0079] The chemical liquid supply unit 30 supplies a chemical liquid to the substrate W. Typically, the chemical liquid supply unit 30 supplies the chemical liquid to the front surface Wa of the substrate W. At least a part of the chemical liquid supply unit 30 is accommodated in the chamber 11.

[0080] The chemical liquid contains hydrofluoric acid. For example, the hydrofluoric acid can be heated to 40 °C or higher and 70 °C or lower, or can be heated to 50 °C or higher and 60 °C or lower. However, the hydrofluoric acid may not be heated. In addition, the chemical liquid may contain phosphoric acid.

[0081] The chemical liquid may also contain hydrogen peroxide water. In addition, the chemical liquid may contain SC1 (ammonia hydrogen peroxide water mixture), SC2 (hydrochloric acid hydrogen peroxide water mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid). In addition, the chemical liquid may be diluted with a diluent.

[0082] The chemical liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 is connected to the pipe 32. The chemical liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. The nozzle 34 sprays the chemical liquid onto the front surface Wa of the substrate W.

[0083] The valve 36 adjusts the opening degree of the pipe 32 and adjusts the flow rate of the chemical liquid flowing in the pipe 32. Specifically, the valve 36 includes: a valve body (not shown) in which a valve seat is provided; a valve body that opens and closes the valve seat; and an actuator (not shown) that moves the valve body between an open position and a closed position.

[0084] The nozzle 34 may also be configured to be movable relative to the substrate W. The liquid chemical supply unit 30 may also include a nozzle moving unit 38. The nozzle moving unit 38 can move the nozzle 34 up and down, and can also rotate the nozzle 34 horizontally about the rotation axis. The nozzle moving unit 38 moves the nozzle 34 up and down. For example, the nozzle moving unit 38 includes a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism. In addition, the nozzle moving unit 38 rotates the nozzle 34 horizontally. For example, the nozzle moving unit 38 includes a motor.

[0085] In addition, the liquid chemical supply unit 30 may also include Figure 1 the liquid chemical tank 110A and the processing liquid cassette 120 shown.

[0086] The cleaning liquid supply unit 40 supplies the cleaning liquid to the substrate W. Typically, the cleaning liquid is used to clean the substrate W. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W. At least a part of the cleaning liquid supply unit 40 is housed in the chamber 11.

[0087] For example, the cleaning liquid is used to clean the substrate W after being treated with the liquid chemical. In one example, the cleaning liquid may include any one of deionized water (DIW), carbonated water, electrolyzed ion water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0088] The cleaning liquid supply unit 40 includes a pipe 42, a nozzle 44, and a valve 46. The nozzle 44 is connected to the pipe 42. The cleaning liquid is supplied to the pipe 42 from a supply source. The valve 46 opens and closes the flow path in the pipe 42. The nozzle 44 sprays the cleaning liquid onto the front surface Wa of the substrate W.

[0089] The valve 46 adjusts the opening degree of the pipe 42 and adjusts the flow rate of the cleaning liquid flowing in the pipe 42. Specifically, the valve 46 may have the same configuration as the valve 36.

[0090] The nozzle 44 may also be configured to be movable relative to the substrate W. The cleaning liquid supply unit 40 may also include a nozzle moving unit 48. The nozzle moving unit 48 may have the same configuration as the nozzle moving unit 38.

[0091] In addition, the cleaning liquid supply unit 40 may also include Figure 1 the cleaning liquid tank 110B and the processing liquid cassette 120 shown.

[0092] The back surface processing liquid supply unit 50 supplies the processing liquid to the back surface Wb of the substrate W. At least a part of the back surface processing liquid supply unit 50 is housed in the chamber 11.

[0093] For example, the back treatment liquid supply unit 50 supplies a chemical solution to the back surface Wb of the substrate W. Typically, during the period when the chemical solution supply unit 30 supplies a chemical solution to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 supplies a chemical solution to the back surface Wb of the substrate W. In one example, the back treatment liquid supply unit 50 supplies the same type of chemical solution to the back surface Wb of the substrate W as that supplied by the chemical solution supply unit 30.

[0094] Alternatively, the back treatment liquid supply unit 50 supplies a cleaning solution to the substrate W. Typically, during the period when the cleaning solution supply unit 40 supplies a cleaning solution to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 supplies a cleaning solution to the back surface Wb of the substrate W. In one example, the back treatment liquid supply unit 50 supplies the same type of cleaning solution to the back surface Wb of the substrate W as that supplied by the cleaning solution supply unit 40.

[0095] In addition, the back treatment liquid supply unit 50 may also supply a chemical solution diluted with a diluent (diluted chemical solution) to the back surface Wb of the substrate W. Typically, during the period when the chemical solution supply unit 30 supplies a diluted chemical solution to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 supplies a diluted chemical solution to the back surface Wb of the substrate W.

[0096] In the present embodiment, the back treatment liquid supply unit 50 supplies a recovered liquid to the back surface Wb of the substrate W. Typically, the recovered liquid is a liquid obtained by recovering a treatment liquid used once. In one example, the recovered liquid is a liquid obtained by recovering a cleaning solution used once. For example, the cleaning solution used to clean the substrate W is recovered and used as the recovered liquid.

[0097] Typically, the substrate W is used for a semiconductor device for microfabrication. Therefore, the chemical solution or cleaning solution supplied from the supply source is a unused new liquid, and the impurity concentration of the chemical solution or cleaning solution supplied from the supply source is low. On the other hand, the recovered liquid may also have a slightly higher impurity concentration compared with the chemical solution or cleaning solution supplied from the supply source. Thereby, the back surface Wb of the substrate W can be cleaned, or the particle adhesion on the back surface Wb of the substrate W after treating the front surface Wa of the substrate W with a chemical solution or the like can be suppressed. However, it is preferable that the impurity concentration of the recovered liquid is also low.

[0098] For example, during the period when the cleaning solution supply unit 40 supplies a cleaning solution to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 may supply a recovered liquid to the back surface Wb of the substrate W. Alternatively, during the period when the chemical solution supply unit 30 supplies a chemical solution to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 may supply a recovered liquid to the back surface Wb of the substrate W. Alternatively, during the period when the chemical solution supply unit 30 supplies a diluted chemical solution diluted with a diluent to the front surface Wa of the substrate W, the back treatment liquid supply unit 50 may supply a chemical solution diluted with a recovered liquid to the back surface Wb of the substrate W.

[0099] The back surface treatment liquid supply unit 50 includes a nozzle 51, a pipe 52, a pipe 52c, a chemical liquid supply unit 54, a cleaning liquid supply unit 56, and a recovered liquid supply unit 58. The pipe 52 is disposed within the chamber 11. The pipe 52 penetrates the center of the vertical direction through-axis 23. The nozzle 51 is disposed at the end of the pipe 52. The nozzle 51 is located opposite to the center of the back surface Wb of the substrate W. The pipe 52 is connected to the pipe 52c outside the chamber 11. In the pipe 52c and the pipe 52, the treatment liquid supplied to the back surface Wb of the substrate W flows. The treatment liquid flowing in the pipe 52c and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0100] The chemical liquid supply unit 54 supplies a chemical liquid to the back surface Wb of the substrate W. Specifically, the chemical liquid supply unit 54 supplies the chemical liquid to the back surface Wb of the substrate W via the pipe 52c and the pipe 52.

[0101] The chemical liquid supply unit 54 includes a pipe 54a and a valve 54b. The chemical liquid is supplied to the pipe 54a from a supply source. The valve 54b opens and closes the flow path within the pipe 54a. The valve 54b adjusts the opening degree of the pipe 54a and adjusts the flow rate of the chemical liquid flowing in the pipe 54a. Specifically, the valve 54b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0102] The chemical liquid flowing from the pipe 54a through the pipe 52c and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0103] The cleaning liquid supply unit 56 supplies a cleaning liquid to the back surface Wb of the substrate W. Specifically, the cleaning liquid supply unit 56 supplies the cleaning liquid to the back surface Wb of the substrate W via the pipe 52c and the pipe 52.

[0104] The cleaning liquid supply unit 56 includes a pipe 56a and a valve 56b. The cleaning liquid is supplied to the pipe 56a from a supply source. The valve 56b opens and closes the flow path within the pipe 56a. The valve 56b adjusts the opening degree of the pipe 56a and adjusts the flow rate of the cleaning liquid flowing in the pipe 56a. The valve 56b may also have the same configuration as the valve 54b.

[0105] The cleaning liquid flowing from the pipe 56a through the pipe 52c and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0106] The recovered liquid supply unit 58 supplies a recovered liquid to the back surface Wb of the substrate W. Specifically, the recovered liquid supply unit 58 supplies the recovered liquid to the back surface Wb of the substrate W via the pipe 52c and the pipe 52.

[0107] The recovered liquid supply unit 58 includes a pipe 58a and a valve 58b. The recovered liquid is supplied from the recovered liquid storage tank 210 serving as a supply source to the pipe 58a. The valve 58b opens and closes the flow path in the pipe 58a. The valve 58b adjusts the opening degree of the pipe 58a and regulates the flow rate of the recovered liquid flowing through the pipe 58a. The valve 58b may also have the same configuration as the valve 54b.

[0108] The recovered liquid flowing through the pipe 58a, the pipe 52c, and the pipe 52 is ejected from the nozzle 51 onto the back surface Wb of the substrate W.

[0109] The cup 80 moves up and down in the vertical direction. The cup 80 rises to an upper position above the side of the substrate W. In addition, the cup 80 descends to a lower position obliquely below the substrate W. Figure 2 In the case where the cup 80 is in the lower position, when any one of a chemical solution, a cleaning solution, and a recovered liquid is supplied to the substrate W, the cup 80 rises to a position beside the substrate W.

[0110] The cup 80 captures the processing liquid scattered around the substrate W by the rotation of the substrate W. For example, when the chemical solution supply unit 30 supplies a chemical solution to the rotating substrate W, the chemical solution scatters from the substrate W to the side. In this case, the cup 80 captures the chemical solution scattered from the substrate W to the side in the upper position. In addition, when the cleaning solution supply unit 40 supplies a cleaning solution to the rotating substrate W, the cup 80 captures the cleaning solution scattered from the substrate W to the side in the upper position. Similarly, when the back surface processing liquid supply unit 50 supplies a processing liquid to the rotating substrate W, the cup 80 captures the processing liquid scattered from the substrate W to the side in the upper position.

[0111] In this way, during the period when any one of the chemical solution supply unit 30, the cleaning solution supply unit 40, and the back surface processing liquid supply unit 50 supplies any one of a chemical solution, a cleaning solution, and a processing liquid to the substrate W, the cup 80 is in the upper position and captures any one of the chemical solution, the cleaning solution, and the processing liquid scattered from the substrate W to the side. In addition, when the period when any one of the chemical solution supply unit 30, the cleaning solution supply unit 40, and the back surface processing liquid supply unit 50 supplies any one of a chemical solution, a cleaning solution, and a processing liquid to the substrate W ends, the cup 80 descends to a lower position obliquely below the substrate W.

[0112] Specifically, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the liquid medicine supply unit 30 and / or the liquid medicine supply unit 54 supplies liquid medicine to the substrate W, then due to the rotation of the substrate W, the liquid medicine supplied to the substrate W scatters around the substrate W. When the liquid medicine supply unit 30 and / or the liquid medicine supply unit 54 supplies liquid medicine to the substrate W, the cup 80 is located above the side portion covering the substrate W, and the cup 80 captures the liquid medicine scattered around the substrate W due to the rotation of the substrate W. Similarly, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the cleaning liquid supply unit 40 and / or the cleaning liquid supply unit 56 supplies cleaning liquid to the substrate W, then due to the rotation of the substrate W, the cleaning liquid supplied to the substrate W scatters around the substrate W. When the cleaning liquid supply unit 40 and / or the cleaning liquid supply unit 56 supplies cleaning liquid to the substrate W, the cup 80 is located above the side portion covering the substrate W, and the cup 80 captures the cleaning liquid scattered around the substrate W due to the rotation of the substrate W.

[0113] Moreover, during the period when the substrate holding unit 20 holds the substrate W and rotates, if the recovered liquid supply unit 58 supplies recovered liquid to the substrate W, then due to the rotation of the substrate W, the recovered liquid supplied to the substrate W scatters around the substrate W. When the recovered liquid supply unit 58 supplies recovered liquid to the substrate W, the cup 80 is located above the side portion covering the substrate W, and the cup 80 captures the recovered liquid scattered around the substrate W due to the rotation of the substrate W. Thus, the cup 80 captures any one of the liquid medicine, cleaning liquid, and recovered liquid scattered around the substrate W due to the rotation of the substrate W.

[0114] The liquid discharge mechanism 90 discharges the liquid medicine, cleaning liquid, and / or recovered liquid captured in the cup 80. A pipe is connected to the cup 80, and the liquid medicine, cleaning liquid, and / or recovered liquid captured in the cup 80 flows through the pipe and is discharged to the outside. Additionally, the liquid discharge mechanism 90 may also be connected to the recovered liquid storage tank 210.

[0115] In the recovered liquid storage tank 210, the recovered liquid for storing the recovered liquid is stored. The recovered liquid storage tank 210 may also store the liquid used once as the recovered liquid. For example, the recovered liquid storage tank 210 may not discard the processing liquid during the adjustment process but store it as the recovered liquid. In one example, the recovered liquid storage tank 210 may not recover the liquid when the particle concentration in the liquid is relatively high, and recover the liquid when the particle concentration in the liquid becomes low. Or, the recovered liquid storage tank 210 may not discard the cleaning liquid used for cleaning the components but store it as the recovered liquid.

[0116] The liquid discharge mechanism 90 discharges the liquid medicine, cleaning liquid, and processing liquid captured in the cup 80 outside the chamber 11. The liquid discharge mechanism 90 has a pipe 91 for discharging the liquid medicine, cleaning liquid, and processing liquid captured in the cup 80. One end of the pipe 91 is connected to the bottom of the cup 80.

[0117] The liquid discharging mechanism 90 also has a pipe 92a and a valve 92b. The pipe 92a is connected to the pipe 91. The liquid medicine and the cleaning liquid collected in the cup 80 flow from the pipe 91 to the pipe 92a. The valve 92b opens and closes the flow path in the pipe 92a. The valve 92b adjusts the opening degree of the pipe 92a and regulates the flow rate of the liquid flowing in the pipe 92a. Specifically, the valve 92b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0118] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the liquid medicine supply unit 30, and / or the cup 80. In one example, the control unit 102 controls the motor 24, the valves 36, 46, 54b, 56b, 58b, 92b, and / or the cup 80.

[0119] The substrate processing apparatus 100 of the present embodiment is suitable for manufacturing semiconductor elements provided with semiconductors. Typically, in semiconductor elements, a conductive layer and an insulating layer are laminated on a substrate. When manufacturing semiconductor elements, the substrate processing apparatus 100 is suitable for cleaning and / or processing (such as etching, property change, etc.) of the conductive layer and / or the insulating layer.

[0120] In addition, Figure 2 In the illustrated substrate processing unit 10, the liquid medicine supply unit 30 can supply one kind of processing liquid. However, the present embodiment is not limited to this. The liquid medicine supply unit 30 can also supply a plurality of kinds of liquid medicines. For example, the liquid medicine supply unit 30 may be able to sequentially supply a plurality of kinds of liquid medicines for different purposes to the substrate W. Or, the liquid medicine supply unit 30 may be able to simultaneously supply a plurality of kinds of liquid medicines for different purposes to the substrate W.

[0121] Next, with reference to Figures 1 - 3 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 3 is a block diagram of the substrate processing apparatus 100.

[0122] As Figure 3 shown, the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the transfer robot IR, the center robot CR, the substrate holding unit 20, the liquid medicine supply unit 30, the cleaning liquid supply unit 40, the back surface processing liquid supply unit 50, the cup 80, and the liquid discharging mechanism 90. Specifically, the control device 101 controls the transfer robot IR, the center robot CR, the substrate holding unit 20, the liquid medicine supply unit 30, the cleaning liquid supply unit 40, the back surface processing liquid supply unit 50, the cup 80, and the liquid discharging mechanism 90 by sending control signals to the transfer robot IR, the center robot CR, the substrate holding unit 20, the liquid medicine supply unit 30, the cleaning liquid supply unit 40, the back surface processing liquid supply unit 50, the cup 80, and the liquid discharging mechanism 90.

[0123] In addition, the storage unit 104 stores computer programs and data. The data includes recipe data. The recipe data includes information representing a plurality of recipes. Each of the plurality of recipes specifies the processing content, processing order, and substrate processing conditions of the substrate W. The control unit 102 executes the computer program stored in the storage unit 104 and performs a substrate processing operation.

[0124] The control unit 102 controls the transfer robot IR and transfers the substrate W through the transfer robot IR.

[0125] The control unit 102 controls the central robot CR and transfers the substrate W through the central robot CR. For example, the central robot CR receives an unprocessed substrate W and transfers the substrate W into any one of the plurality of chambers 11. In addition, the central robot CR receives the processed substrate W from the chamber 11 and transfers out the substrate W.

[0126] The control unit 102 controls the substrate holding unit 20 and controls the start of rotation, change in rotation speed, and stop of rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 20 to change the rotation speed of the substrate holding unit 20. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the motor 24 of the substrate holding unit 20.

[0127] The control unit 102 controls the valve 36 of the chemical liquid supply unit 30 and can switch the state of the valve 36 between an open state and a closed state. Specifically, the control unit 102 controls the valve 36 of the chemical liquid supply unit 30 to set the valve 36 to the open state, and can cause the chemical liquid flowing in the pipe 32 to pass through the nozzle 34. In addition, the control unit 102 controls the valve 36 of the chemical liquid supply unit 30 to set the valve 36 to the closed state, and can stop supplying the chemical liquid flowing in the pipe 32 to the nozzle 34.

[0128] The control unit 102 controls the valve 46 of the cleaning liquid supply unit 40 and can switch the state of the valve 46 between an open state and a closed state. Specifically, the control unit 102 controls the valve 46 of the cleaning liquid supply unit 40 to set the valve 46 to the open state, and can cause the cleaning liquid flowing in the pipe 42 to pass through the nozzle 44. In addition, the control unit 102 controls the valve 46 of the cleaning liquid supply unit 40 to set the valve 46 to the closed state, and can stop supplying the cleaning liquid flowing in the pipe 42 to the nozzle 44.

[0129] The control unit 102 controls the valve 54b of the liquid medicine supply unit 54 and can switch the state of the valve 54b between an open state and a closed state. Specifically, the control unit 102 controls the valve 54b of the liquid medicine supply unit 54 to set the valve 54b to the open state, enabling the liquid medicine flowing in the pipe 54a, the pipe 52c, and the pipe 52 to pass through the nozzle 51. In addition, the control unit 102 controls the valve 54b of the liquid medicine supply unit 54 to set the valve 54b to the closed state, stopping the supply of the liquid medicine flowing in the pipe 54a to the nozzle 51.

[0130] The control unit 102 controls the valve 56b of the cleaning liquid supply unit 56 and can switch the state of the valve 56b between an open state and a closed state. Specifically, the control unit 102 controls the valve 56b of the cleaning liquid supply unit 56 to set the valve 56b to the open state, enabling the cleaning liquid flowing in the pipe 56a, the pipe 52c, and the pipe 52 to pass through the nozzle 51. In addition, the control unit 102 controls the valve 56b of the cleaning liquid supply unit 56 to set the valve 56b to the closed state, stopping the supply of the cleaning liquid flowing in the pipe 56a to the nozzle 51.

[0131] The control unit 102 controls the valve 58b of the recovered liquid supply unit 58 and can switch the state of the valve 58b between an open state and a closed state. Specifically, the control unit 102 controls the valve 58b of the recovered liquid supply unit 58 to set the valve 58b to the open state, enabling the recovered liquid flowing in the pipe 58a, the pipe 52c, and the pipe 52 to pass through the nozzle 51. In addition, the control unit 102 controls the valve 58b of the recovered liquid supply unit 58 to set the valve 58b to the closed state, stopping the supply of the recovered liquid flowing in the pipe 58a to the nozzle 51.

[0132] The control unit 102 can also control the cup 80 to move the cup 80 relative to the substrate W. Specifically, during the period when at least one of the liquid medicine supply unit 30, the cleaning liquid supply unit 40, the liquid medicine supply unit 54, the cleaning liquid supply unit 56, and the recovered liquid supply unit 58 supplies any one of the liquid medicine, the cleaning liquid, and the recovered liquid to the substrate W, the control unit 102 moves the cup 80 to the rising position on the side of the substrate W. In addition, when the period when at least one of the liquid medicine supply unit 30, the cleaning liquid supply unit 40, the liquid medicine supply unit 54, the cleaning liquid supply unit 56, and the recovered liquid supply unit 58 supplies any one of the liquid medicine, the cleaning liquid, and the recovered liquid to the substrate W ends, the control unit 102 lowers the cup 80 from the side of the substrate W to directly below.

[0133] The control unit 102 controls the valve 92b of the liquid discharge mechanism 90 and can switch the state of the valve 92b between an open state and a closed state. Specifically, the control unit 102 can set the valve 92b to the open state by controlling the valve 92b, enabling the liquid medicine and the cleaning liquid flowing in the pipes 91 and 92a to pass through. In addition, the control unit 102 can set the valve 92b to the closed state by controlling the valve 92b, stopping the liquid medicine and the cleaning liquid flowing in the pipes 91 and 92a from passing through.

[0134] In addition, the control unit 102 can also determine whether to recover the liquid as the recovered liquid into the recovered liquid storage tank 210. For example, the control unit 102 can also determine whether to recover the liquid as the recovered liquid into the recovered liquid storage tank 210 based on the measurement results of various measurement components.

[0135] The substrate processing apparatus 100 of the present embodiment is suitable for forming semiconductor elements. For example, the substrate processing apparatus 100 is suitable for processing a substrate W used for a semiconductor element having a stacked structure. The semiconductor element is a so-called 3D (Dimensional) structured memory (storage device). As an example, the substrate W is suitable for use as a NAND (Not and) type flash memory.

[0136] Next, with reference to Figures 1 - 4 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 4 is a flowchart of the substrate processing method of the present embodiment.

[0137] As Figure 4 shown, in step S102, the substrate W is carried into the chamber 11. Under the control of the control unit 102, the central robot CR carries the substrate W into the chamber 11. Here, the front surface Wa of the substrate W faces vertically upward, and the back surface Wb of the substrate W faces vertically downward.

[0138] In step S104, the substrate holding unit 20 holds the carried substrate W. Under the control of the control unit 102, the substrate holding unit 20 holds the substrate W.

[0139] In step S106, the rotation of the substrate W is started, and the liquid medicine is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 starts the rotation of the substrate W while holding the substrate W. In addition, under the control of the control unit 102, the liquid medicine supply unit 30 supplies the liquid medicine to the front surface Wa of the substrate W from the nozzle 34.

[0140] In addition, during the supply of the liquid medicine from the nozzle 34 to the front surface Wa of the substrate W, the back surface treatment liquid supply unit 50 can supply the liquid medicine to the back surface Wb of the substrate W from the nozzle 51 under the control of the control unit 102.

[0141] Under the control of the control unit 102, the cup 80 is located above the side of the substrate W. The cup 80 can also be raised in such a way that it is located on the side of the substrate W when starting to supply the liquid medicine to the front surface Wa of the substrate W from the nozzle 34. In addition, the cup 80 can also be raised in accordance with the timing of starting to supply the processing liquid to the substrate W.

[0142] Under the control of the control unit 102, the valve 92b is in an open state. In this case, the cup 80 captures the liquid medicine scattered from the substrate W, and the liquid medicine captured in the cup 80 flows through the pipe 92a with the valve 92b open and is discharged.

[0143] In step S108, while the substrate W is rotating, the cleaning liquid is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 continues to rotate the substrate W while holding the substrate W. In addition, under the control of the control unit 102, the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44.

[0144] In addition, during the supply of the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44, the back surface processing liquid supply unit 50 can supply the cleaning liquid to the back surface Wb of the substrate W from the nozzle 51 under the control of the control unit 102.

[0145] Under the control of the control unit 102, the cup 80 maintains the state of being located above the side of the substrate W. Under the control of the control unit 102, the valve 92b is in an open state. In this case, the cup 80 captures the cleaning liquid scattered from the substrate W, and the cleaning liquid captured in the cup 80 flows through the pipe 91 and then through the pipe 92a with the valve 92b open and is discharged.

[0146] In step S110, while the substrate W is rotating, the recovery liquid is supplied to the substrate W. Under the control of the control unit 102, the substrate holding unit 20 continues to rotate the substrate W while holding the substrate W. Under the control of the control unit 102, the cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the substrate W from the nozzle 44. Under the control of the control unit 102, the back surface processing liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W from the nozzle 51.

[0147] Under the control of the control unit 102, the valve 92b is in an open state. In this case, the cup 80 captures the cleaning liquid and the recovery liquid scattered from the substrate W, and the cleaning liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and then through the pipe 92a with the valve 92b open and are discharged.

[0148] In step S112, the substrate W is dried. At this time, the supply of the cleaning liquid and the recovery liquid is stopped, and the rotation speed of the substrate W is increased. Under the control of the control unit 102, the liquid supply unit 30 stops supplying the cleaning liquid from the nozzle 34 to the front surface Wa of the substrate W. In addition, under the control of the control unit 102, the supply of the recovery liquid from the nozzle 51 to the back surface Wb of the substrate W is stopped. Moreover, under the control of the control unit 102, the substrate holding unit 20 increases the rotation speed of the substrate W.

[0149] In addition, under the control of the control unit 102, the cup 80 is held in a state of being located above the side covering the substrate W. Under the control of the control unit 102, the valve 92b is held in a closed state. In this case, the cup 80 traps the cleaning liquid and the recovery liquid scattered from the substrate W, and the cleaning liquid and the recovery liquid trapped in the cup 80 flow through the pipe 92a with the valve 92b opened via the pipe 91 and are discharged. After that, under the control of the control unit 102, the substrate holding unit 20 stops the rotation of the substrate W.

[0150] In step S114, the substrate W is carried out from the substrate processing unit 10. Under the control of the control unit 102, the substrate holding unit 20 releases the holding of the substrate W, and the central robot CR takes out the substrate W from the chamber 11. After that, the substrate W is carried out to the outside of the substrate processing apparatus 100 via the transfer robot IR.

[0151] In the present embodiment, as described above, after the front surface Wa of the substrate W is treated with a chemical solution, it is treated with a cleaning liquid. According to the present embodiment, during at least a part of the period when the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0152] In addition, in the present embodiment, after a predetermined time has elapsed during the supply of the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. As a result, at the start of the cleaning process, the cleaning liquid with less impurities is also supplied to the back surface Wb of the substrate W, so that the substrate W can be more appropriately cleaned.

[0153] Next, referring to Figures 1 - 5C , the substrate processing apparatus 100 of the present embodiment will be described. Figures 5A - 5C is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment.

[0154] As Figure 5A shown, a chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the chemical solution. Figure 5A is Figure 4An example of step S106. The liquid supply unit 30 supplies a liquid medicine to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies a liquid medicine to the back surface Wb of the rotating substrate W. Here, the cup 80 is located at the upper position. Therefore, the cup 80 faces the side portion of the substrate W. The cup 80 captures the liquid medicine scattered as the substrate W rotates.

[0155] In the liquid discharge mechanism 90, the valve 92b is opened. Therefore, the liquid medicine captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0156] As Figure 5B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. Figure 5B is Figure 4 An example of step S108. The cleaning liquid supply unit 40 supplies a cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies a cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the cleaning liquid scattered as the substrate W rotates.

[0157] In the liquid discharge mechanism 90, the state where the valve 92b is opened is maintained. Therefore, the cleaning liquid captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0158] As Figure 5C shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. Figure 5C is Figure 4 An example of step S110. For example, the cleaning liquid supply unit 40 continuously supplies a cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies a recovery liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the cleaning liquid scattered as the substrate W rotates and captures the recovery liquid scattered as the substrate W rotates.

[0159] In the liquid discharge mechanism 90, the state where the valve 92b is opened is maintained. Therefore, the cleaning liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0160] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovery liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0161] According to this embodiment, as described above, after treating the front surface Wa of the substrate W with a chemical solution, it is treated with a cleaning solution. According to this embodiment, during at least a part of the period when the cleaning solution supply unit 40 supplies the cleaning solution to the front surface Wa of the substrate W, a recovery solution is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of this embodiment, the usage amount of the new processing solution can be reduced.

[0162] In addition, the recovery solution stored in the recovery solution storage tank 210 is recovered as follows.

[0163] Next, with reference to Figures 1 - 6 , the substrate processing apparatus 100 of this embodiment will be described. Figure 6 is a schematic top view of the substrate processing apparatus 100 of this embodiment. Figure 6 The substrate processing apparatus 100 has the same configuration as the substrate processing apparatus 100 shown in Figure 1 except that it includes a high-temperature liquid tank 110D in addition to the processing liquid tank 110. In order to avoid redundancy, repeated descriptions are omitted.

[0164] As shown in Figure 6 , in the substrate processing apparatus 100, the processing liquid tank 110 further includes a high-temperature liquid tank 110D. For example, the high-temperature liquid tank 110D prepares a high-temperature liquid. For example, in the high-temperature liquid tank 110D, the processing liquid is heated. In addition, the high-temperature liquid tank 110D supplies the high-temperature liquid to the processing liquid cassette 120.

[0165] The high-temperature liquid tank 110D prepares a high-temperature liquid obtained by heating a liquid. The high-temperature liquid may include any one of deionized water (DIW), carbonated water, electrolyzed ion water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water). In one example, the high-temperature liquid is 20°C or higher. For example, the high-temperature liquid may also be 30°C or higher and 100°C or lower.

[0166] The high-temperature liquid tank 110D may also prepare a high-temperature liquid obtained by heating a cleaning solution or a rinsing solution. For example, the high-temperature liquid is used as a cleaning solution for cleaning the substrate W after being treated with a chemical solution. Or, the high-temperature liquid may also be used as a chemical solution or a component of a chemical solution.

[0167] For example, the high-temperature liquid tank 110D is arranged adjacent to the recovery liquid tank 110C. For example, the high-temperature liquid tank 110D may also be subsequently installed in the existing processing liquid tank 110.

[0168] Next, with reference to Figures 1 - 7 , the substrate processing apparatus 100 of this embodiment will be described. Figure 7 is a schematic diagram of the substrate processing apparatus 100 of this embodiment. Figure 7The substrate processing apparatus 100 has the same configuration as the Figure 2 substrate processing apparatus 100 shown, except that it supplies high-temperature liquid and recovery liquid from the high-temperature liquid tank 110D. Redundant descriptions are omitted to avoid verbosity.

[0169] As Figure 7 shown, the substrate processing apparatus 100 includes a high-temperature liquid tank 110D. The high-temperature liquid tank 110D prepares high-temperature liquid by heating a liquid to a high temperature. The high-temperature liquid is used as at least a part of the chemical liquid and / or cleaning liquid for processing the substrate W in the substrate processing unit 10. The high-temperature liquid being prepared can also be recovered as recovery liquid.

[0170] The high-temperature liquid tank 110D has a storage tank 220, a pipe 221, a pipe 222, a pipe 223, a heater 224, a temperature measurement unit 225, a valve 226, and a valve 227. The storage tank 220 stores the liquid before it is heated to high-temperature liquid. The pipe 221 connects the storage tank 220, the pipe 222, and the pipe 223. The pipe 221, the pipe 222, and the pipe 223 are connected at the connection point 221c. One end of the pipe 221 is connected to the storage tank 220, and the other end of the pipe 221 is connected to the connection point 221c.

[0171] The heater 224 is installed in the pipe 221. The heater 224 heats the liquid flowing in the pipe 221. Through the heater 224, the liquid flowing in the pipe 221 is prepared into high-temperature liquid.

[0172] The temperature measurement unit 225 (temperature sensor) is installed in the pipe 221. The temperature measurement unit 225 measures the temperature of the high-temperature liquid flowing in the pipe 221. Typically, the temperature measurement unit 225 is located downstream of the heater 224 in the pipe 221.

[0173] The pipe 222 connects the substrate processing unit 10 and the connection point 221c via the processing liquid cassette 120. Therefore, the high-temperature liquid flowing in the pipe 222 is used as the processing liquid for the substrate processing unit 10. The valve 226 is installed in the pipe 222. The valve 226 adjusts the opening degree of the pipe 222 and regulates the flow rate of the high-temperature liquid flowing in the pipe 222.

[0174] The pipe 223 connects the recovery liquid storage tank 210 and the connection point 221c. Therefore, the high-temperature liquid flowing in the pipe 223 is recovered in the recovery liquid storage tank 210. The valve 227 is installed in the pipe 223. The valve 227 adjusts the opening degree of the pipe 223 and regulates the flow rate of the high-temperature liquid flowing in the pipe 223.

[0175] When the temperature of the high-temperature liquid measured by the temperature measurement unit 225 reaches a specified temperature, the control unit 102 opens the valve 226 and closes the valve 227, and the high-temperature liquid flows through the pipe 222 to the substrate processing unit 10. On the other hand, when the temperature of the high-temperature liquid measured by the temperature measurement unit 225 does not reach the specified temperature, the control unit 102 closes the valve 226 and opens the valve 227, and the high-temperature liquid flows through the pipe 223 to the recovered liquid storage tank 210.

[0176] In this way, before the high-temperature liquid prepared in the high-temperature liquid tank 110D reaches the specified temperature, the recovered liquid storage tank 210 recovers the high-temperature liquid as the recovered liquid. The recovered liquid recovered in the recovered liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0177] Next, with reference to Figures 1 - 8 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 8 is a flowchart of the substrate processing method of the present embodiment.

[0178] As Figure 8 shown, in step S201, the heating of the heater 224 is started. The control unit 102 drives a pump (not shown) so that the high-temperature liquid heated by the heater 224 flows in the pipe 221.

[0179] In step S202, the temperature is measured. The control unit 102 measures the temperature of the high-temperature liquid flowing in the pipe 221 by the temperature measurement unit 225.

[0180] In step S203, it is determined whether the measured value of the temperature is equal to or higher than the threshold value. The control unit 102 compares the measured value of the temperature measurement unit 225 with the threshold value and determines whether the measured value is equal to or higher than the threshold value.

[0181] When it is determined that the measured value of the temperature is equal to or higher than the threshold value (Yes in step S203), the process proceeds to step S204. On the other hand, when it is determined that the measured value of the temperature does not reach the threshold value (No in step S203), the process returns to step S211 again.

[0182] In step S204, the high-temperature liquid is supplied to the substrate processing unit 10. The control unit 102 supplies the high-temperature liquid to the substrate processing unit 10 through the pipe 222 by opening the valve 226 and closing the valve 227.

[0183] In step S205, it is determined whether to stop supplying the high-temperature liquid. For example, the control unit 102 determines whether high-temperature liquid is still required to process the substrate W.

[0184] In the case where it is determined not to stop supplying the high-temperature liquid (No in step S205), the process returns to step S202. On the other hand, in the case where it is determined to stop supplying the high-temperature liquid (Yes in step S205), the process proceeds to step S206.

[0185] In step S206, heating is stopped. Through the control unit 102, the heating of the heater 224 is stopped, and the driving of the pump is stopped. Then, the process ends.

[0186] In step S211, the high-temperature liquid is supplied to the recovered liquid storage tank 210. The control unit 102 closes the valve 226 and opens the valve 227 to recover the high-temperature liquid into the recovered liquid storage tank 210 via the pipe 223.

[0187] In step S212, it is determined whether a predetermined time has elapsed after starting to supply the high-temperature liquid to the recovered liquid storage tank 210. For example, the control unit 102 measures the time elapsed after starting to supply the high-temperature liquid and determines whether the elapsed time is above the threshold value.

[0188] In the case where it is determined that the predetermined time has not elapsed (No in step S212), the process returns to step S211 and repeats the determination until the predetermined time has elapsed. On the other hand, in the case where it is determined that the predetermined time has elapsed (Yes in step S212), the process returns to step S202. Then, the temperature is measured again in step S202 and the determination is repeated.

[0189] According to the present embodiment, the control unit 102 determines whether to store the high-temperature liquid as the recovered liquid in the recovered liquid storage tank 210 based on the measurement result of the temperature measurement unit 225. At this time, the high-temperature liquid with a temperature that has been heated by the heater 224 but has not reached the threshold value is used as the recovered liquid and recovered into the recovered liquid storage tank 210. As described above, during at least a part of the period when the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, the recovered liquid in the recovered liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0190] In addition, referring to Figures 6 - 8 In the above description, the processing liquid tank 110 includes the high-temperature liquid tank 110D for heating the liquid, but the present embodiment is not limited thereto. The processing liquid tank 110 may not include the high-temperature liquid tank 110D, and the cleaning liquid may be heated in the cleaning liquid tank 110B. In such a case, the cleaning liquid with a temperature that has not reached the threshold value can also be recovered into the recovered liquid storage tank 210. Similarly, the chemical liquid may be heated in the chemical liquid tank 110A. In such a case, the chemical liquid with a temperature that has not reached the threshold value can also be recovered into the recovered liquid storage tank 210.

[0191] In addition, referring to Figures 6 - 8In the above description, it is determined whether the recovered liquid is received in the recovered liquid storage tank 210 based on the temperature of the liquid, but the present embodiment is not limited thereto. It may also be determined whether the recovered liquid is received in the recovered liquid storage tank 210 based on the concentration of the liquid.

[0192] Next, with reference to Figures 1 - 9 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 9 is a schematic top view of the substrate processing apparatus 100 of the present embodiment. Figure 9 The substrate processing apparatus 100 of Figure 1 has the same configuration as the substrate processing apparatus 100 shown in

[0193] except that it further includes an ozone liquid tank 110E in addition to the processing liquid tank 110. Repeated descriptions are omitted for the sake of brevity. Figure 9 As shown in

[0194] , in the substrate processing apparatus 100, the processing liquid tank 110 further includes an ozone liquid tank 110E. The ozone liquid tank 110E prepares ozone liquid. For example, in the ozone liquid tank 110E, ozone gas is generated and dissolved in the liquid. The ozone liquid tank 110E supplies the ozone liquid to the processing liquid cassette 120.

[0195] Next, with reference to Figures 1 - 10 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 10 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 10 The substrate processing apparatus 100 of Figure 2 has the same configuration as the substrate processing apparatus 100 shown in

[0196] except that it further includes an ozone liquid tank 110E for supplying ozone liquid. Repeated descriptions are omitted for the sake of brevity. Figure 10 As shown in

[0197] in the substrate processing apparatus 100, the processing liquid tank 110 further includes an ozone liquid tank 110E. For example, the ozone liquid tank 110E prepares ozone liquid. For example, in the ozone liquid tank 110E, ozone gas is generated to produce ozone liquid in which the ozone gas is dissolved in the liquid. In addition, the ozone liquid tank 110E supplies the ozone liquid to the processing liquid cassette 120.

[0198] The ozone liquid tank 110E can also dissolve ozone gas in a cleaning liquid or a rinsing liquid to produce ozone liquid. For example, the ozone liquid is used as a cleaning liquid for rinsing the substrate W treated with a chemical solution. Alternatively, the ozone liquid can also be used as a chemical solution or a component of a chemical solution.

[0199] The ozone liquid tank 110E prepares ozone liquid in which the generated ozone gas is dissolved in a liquid. The ozone liquid is used as at least a part of the chemical solution and / or the cleaning liquid for treating the substrate W in the substrate processing unit 10. The ozone liquid in the preparation process can also be recovered as a recovery liquid.

[0200] The ozone liquid tank 110E includes an ozone gas generator 230s, an ozone gas dissolution tank 230t, a pipe 231, a pipe 232, a pipe 233, a pipe 234, a concentration measurement unit 235, a valve 236, a valve 237, a valve 238, and a valve 239. The ozone gas generator 230s generates ozone gas. The ozone gas generator 230s generates ozone gas from oxygen and carbon dioxide gas.

[0201] The ozone gas dissolution tank 230t dissolves the ozone gas generated in the ozone gas generator 230s in a liquid. Thereby, ozone liquid is produced.

[0202] The pipe 231 connects the ozone gas dissolution tank 230t, the pipe 232, and the pipe 233. The pipe 231, the pipe 232, and the pipe 233 are connected at a connection point 231c. One end of the pipe 231 is connected to the ozone gas dissolution tank 230t, and the other end of the pipe 231 is connected to the connection point 231c.

[0203] The concentration measurement unit 235 (concentration sensor) is installed in the pipe 231. The concentration measurement unit 235 measures the ozone concentration in the ozone liquid flowing in the pipe 231.

[0204] The pipe 232 connects the substrate processing unit 10 and the connection point 231c via the processing liquid cassette 120. Therefore, the ozone liquid flowing in the pipe 232 is used as the processing liquid of the substrate processing unit 10. Valves 236 and 237 are installed in the pipe 232. The valves 236 and 237 adjust the opening degree of the pipe 232 and adjust the flow rate of the ozone liquid flowing in the pipe 232.

[0205] The pipe 233 connects the recovery liquid storage tank 210 and the connection point 231c. Therefore, the ozone liquid flowing in the pipe 233 is recovered into the recovery liquid storage tank 210. A valve 239 is installed in the pipe 233. The valve 239 adjusts the opening degree of the pipe 233 and adjusts the flow rate of the ozone liquid flowing in the pipe 233.

[0206] The pipe 234 connects the position between the valves 236 and 237 in the pipe 232 and the recovered liquid storage tank 210. Thus, the ozone liquid flowing in the pipes 232 and 234 returns to the ozone gas dissolution tank 230t, and the ozone liquid circulates. A valve 238 is installed in the pipe 234. The valve 238 adjusts the opening degree of the pipe 234 and adjusts the flow rate of the ozone liquid flowing in the pipe 234.

[0207] When the concentration of the ozone liquid measured by the concentration measurement unit 235 reaches a specified concentration, the control unit 102 causes the ozone liquid to flow through the pipe 232 and be supplied to the substrate processing unit 10 by opening the valves 236 and 237 and closing the valves 238 and 239. In addition, when the concentration of the ozone liquid measured by the concentration measurement unit 235 is within the intermediate concentration range, the control unit 102 causes the ozone liquid to flow through the pipes 232 and 234 and flow to the ozone gas dissolution tank 230t for circulation by opening the valves 236 and 238 and closing the valves 237 and 239. Moreover, when the concentration of the ozone liquid measured by the concentration measurement unit 235 does not reach the specified concentration, the control unit 102 causes the ozone liquid to flow through the pipe 233 and be recovered into the recovered liquid storage tank 210 by closing the valve 236 and opening the valve 239.

[0208] In this way, the ozone liquid is recovered as the recovered liquid into the recovered liquid storage tank 210 until it reaches the intermediate concentration at which the ozone liquid prepared in the ozone liquid tank 110E starts to circulate. As described above, the recovered liquid recovered in the recovered liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the amount of new processing liquid used can be reduced.

[0209] Next, referring to Figures 1 - 11 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 11 is a flowchart of the substrate processing method of the present embodiment.

[0210] As Figure 11 shown, in step S221, the generation of ozone liquid is started. Through the control unit 102, an ozone liquid in which the ozone gas generated by the ozone gas generator 230s is dissolved in a liquid in the ozone gas dissolution tank 230t is generated, and a pump (not shown) is driven so that the ozone liquid flows through the pipe 221.

[0211] In step S222, the concentration of the ozone liquid is measured. Through the control unit 102, the concentration measurement unit 235 measures the concentration of the ozone liquid flowing in the pipe 231.

[0212] In step S223, it is determined whether the measured value of the ozone concentration is equal to or higher than the first threshold. The control unit 102 compares the measured value of the concentration measurement unit 235 with the first threshold and determines whether the measured value is equal to or higher than the first threshold.

[0213] When it is determined that the measured value of the ozone concentration is above the first threshold (Yes in step S223), the process proceeds to step S224. On the other hand, when it is determined that the measured value of the ozone concentration is below the first threshold (No in step S223), the process proceeds to step S231.

[0214] In step S224, the ozone liquid is supplied to the substrate processing unit 10. By the control unit 102, valves 236 and 237 are opened, and valves 238 and 239 are closed, whereby the ozone liquid flows through the pipe 232 and is supplied to the substrate processing unit 10. After that, the process proceeds to step S225.

[0215] In step S225, it is determined whether to stop supplying the ozone liquid. For example, by the control unit 102, it is determined whether ozone liquid is still required to process the substrate W.

[0216] When it is determined not to stop supplying the ozone liquid (No in step S225), the process returns to step S222. On the other hand, when it is determined to stop supplying the ozone liquid (Yes in step S225), the process proceeds to step S226.

[0217] In step S226, generation of the ozone liquid is stopped. By the control unit 102, generation of ozone gas by the ozone gas generator 230s is stopped, and the driving of the pump is stopped. After that, the process ends.

[0218] In step S231, it is determined whether the measured value of the ozone concentration is above the second threshold. The control unit 102 compares the measured value of the concentration measurement unit 235 with the second threshold and determines whether the measured value is above the second threshold. Here, the second threshold is less than the first threshold.

[0219] When it is determined that the measured value of the ozone concentration is above the second threshold (Yes in step S231), the process proceeds to step S232. On the other hand, when it is determined that the measured value of the ozone concentration is below the second threshold (No in step S231), the process proceeds to step S233.

[0220] In step S232, the ozone liquid is circulated. By the control unit 102, valves 236 and 238 are opened, and valves 237 and 239 are closed, whereby the ozone liquid flows through the pipe 232 and the pipe 234, flows into the ozone gas dissolution tank 230t, and is circulated. After that, the process returns to step S222.

[0221] In step S233, the ozone liquid is supplied to the recovery liquid storage tank 210. By the control unit 102, valve 236 is closed, and valve 239 is opened, and the ozone liquid flows through the pipe 233 and is recovered into the recovery liquid storage tank 210.

[0222] In step S234, it is determined whether a predetermined time has elapsed since the start of supplying the ozone solution to the recovery liquid storage tank 210. For example, the control unit 102 measures the time elapsed since the start of supplying the ozone solution, and determines whether the elapsed time is equal to or greater than a threshold value.

[0223] In the case where it is determined that the predetermined time has not elapsed (No in step S234), the process returns to step S233, and the determination is repeated until the predetermined time has elapsed. On the other hand, in the case where it is determined that the predetermined time has elapsed (Yes in step S234), the process returns to step S222. Thereafter, in step S222, the concentration of the ozone solution is measured again, and the subsequent steps are repeated.

[0224] According to the present embodiment, ozone gas is generated in the ozone gas generator 230s, and the ozone solution having a concentration in the intermediate range that is equal to or higher than the second threshold value and lower than the first threshold value is circulated. Thus, while circulating the ozone solution having a relatively high concentration although it is not sufficient, the ozone gas generated in the ozone gas generator 230s is dissolved, so that the concentration of the ozone solution can be effectively increased.

[0225] In addition, according to the present embodiment, the control unit 102 determines whether to store the ozone solution as the recovery liquid in the recovery liquid storage tank 210 based on the measurement result of the concentration measurement unit 235. In this case, although ozone gas is generated in the ozone gas generator 230s, the ozone solution having a concentration lower than the second threshold value is recovered as the recovery liquid and stored in the recovery liquid storage tank 210. As described above, at least a part of the recovery liquid in the recovery liquid storage tank 210 is supplied to the back surface Wb of the substrate W during at least a part of the period in which the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the amount of the new processing liquid used can be reduced.

[0226] In addition, Figure 10 In the illustrated substrate processing apparatus 100, the ozone solution having a low concentration is directly supplied to the recovery liquid storage tank 210, but the present embodiment is not limited thereto. Ozone may be evaporated from the ozone solution before the ozone solution is supplied to the recovery liquid storage tank 210.

[0227] Next, with reference to Figures 1 - 12 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 12 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 12 The substrate processing apparatus 100 has the same configuration as the substrate processing apparatus 100 shown in Figure 10 , except that the recovery liquid tank 110C has a heating tank 210h in addition to the recovery liquid storage tank 210. In order to avoid redundancy, repeated descriptions are omitted.

[0228] As shown in Figure 12As shown, the recovery liquid tank 110C has a heating tank 210h in addition to the recovery liquid storage tank 210. The heating tank 210h is connected to the pipe 233. The heating tank 210h is connected to the recovery liquid storage tank 210 via the pipe 210p.

[0229] The ozone liquid flowing in the pipe 233 is stored in the heating tank 210h. The heating tank 210h heats the ozone liquid flowing in via the pipe 233. By heating the ozone liquid with a relatively low concentration in the heating tank 210h, the ozone in the ozone liquid can be evaporated, further reducing the ozone concentration in the ozone liquid. Therefore, during at least a part of the period when the cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the substrate W, even if the recovery liquid stored in the recovery liquid storage tank 210 is supplied to the back surface Wb of the substrate W, the change in the characteristics of the back surface Wb of the substrate W can be suppressed. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be effectively reduced.

[0230] In addition, Figure 12 In the substrate processing apparatus 100 shown, the ozone liquid is heated to reduce the ozone concentration of the ozone liquid, but the ozone liquid can also be chemically treated to reduce the ozone concentration of the ozone liquid. For example, an alkaline chemical solution can be added to the ozone water to neutralize the ozone in the ozone liquid.

[0231] In addition, referring to Figures 6 - 12 the description above, the liquid in the process of preparing the processing liquid supplied to the substrate processing unit 10 for processing the substrate W is recovered into the recovery liquid storage tank 210, but the present embodiment is not limited thereto. The liquid other than the process of preparing the processing liquid can also be recovered into the recovery liquid storage tank 210.

[0232] Next, referring to Figures 1 - 13 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 13 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 13 The substrate processing apparatus 100 has the same configuration as the substrate processing apparatus 100 shown in Figure 2 except that the cleaning liquid is used as the recovery liquid and supplied from the chemical solution tank 110A to the recovery liquid storage tank 210. To avoid redundancy, the repeated description is omitted.

[0233] As Figure 13 shown, in the substrate processing apparatus 100, the chemical solution tank 110A is supplied with the chemical solution and the cleaning liquid. For example, the chemical solution tank 110A prepares the chemical solution. The chemical solution tank 110A supplies the chemical solution to the processing liquid cassette 120. Figure 13 In

[0234] Wash the liquid medicine tank 110A regularly or as needed. When washing the liquid medicine tank 110A, supply a cleaning liquid to the liquid medicine tank 110A.

[0235] The cleaning liquid may also include any one of deionized water (DIW), carbonated water, electrolyzed ion water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., around 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0236] Typically, the cleaning liquid supplied to the liquid medicine tank 110A is discharged. However, the cleaning liquid supplied to the liquid medicine tank 110A may also be recovered into the recovery liquid storage tank 210.

[0237] The liquid medicine tank 110A has a liquid medicine storage tank 110h. The liquid medicine storage tank 110h can store liquid medicine. When processing the substrate W with the liquid medicine in the substrate processing unit 10, the liquid medicine stored in the liquid medicine storage tank 110h is supplied to the substrate processing unit 10. For example, in order to process the front surface Wa of the substrate W, the liquid medicine stored in the liquid medicine storage tank 110h may be supplied. Or, in order to process the back surface Wb of the substrate W, the liquid medicine stored in the liquid medicine storage tank 110h may be supplied.

[0238] The liquid medicine tank 110A has a liquid medicine storage tank 110h, a pipe 112a, a pipe 112b, a pipe 112c, a valve 112e, a valve 112f, a pipe 112p, and a valve 112q. The liquid medicine storage tank 110h stores liquid medicine.

[0239] Supply liquid medicine to the liquid medicine storage tank 110h. The liquid medicine whose flow rate is controlled by the valve 110q is supplied to the liquid medicine storage tank 110h via the pipe 110p. Supply liquid medicine to the pipe 110p from a supply source. The valve 110q opens and closes the flow path in the pipe 110p. The valve 110q adjusts the opening degree of the pipe 110p and adjusts the flow rate of the liquid medicine flowing in the pipe 110p.

[0240] Wash the liquid medicine storage tank 110h with the cleaning liquid. When washing the liquid medicine storage tank 110h, supply the cleaning liquid to the liquid medicine storage tank 110h. The cleaning liquid whose flow rate is controlled by the valve 110t is supplied to the liquid medicine storage tank 110h via the pipe 110s. Supply the cleaning liquid to the pipe 110s from a supply source. The valve 110t opens and closes the flow path in the pipe 110s. The valve 110t adjusts the opening degree of the pipe 110s and adjusts the flow rate of the cleaning liquid supplied to the pipe 110s.

[0241] The pipe 112a connects the liquid medicine storage tank 110h, the pipe 112b, and the pipe 112c. The pipe 112a, the pipe 112b, and the pipe 112c are connected at the connection point 112d. One end of the pipe 112a is connected to the liquid medicine storage tank 110h, and the other end of the pipe 112a is connected to the connection point 112d.

[0242] The pipe 112b is connected to the connection point 112d of the substrate processing unit 10 via the processing liquid cassette 120. Therefore, the liquid medicine flowing in the pipe 112b is used as the processing liquid of the substrate processing unit 10. A valve 112e is installed in the pipe 112b. The valve 112e adjusts the opening degree of the pipe 112b and adjusts the flow rate of the liquid medicine flowing in the pipe 112b.

[0243] In addition, before the cleaning liquid medicine storage tank 110h, the liquid medicine is discharged from the liquid medicine storage tank 110h. The pipe 112p is connected to the liquid medicine storage tank 110h. The liquid medicine discharged from the liquid medicine storage tank 110h flows in the pipe 112p. A valve 112q is installed in the pipe 112p. The valve 112q adjusts the opening degree of the pipe 112p and adjusts the flow rate of the liquid medicine flowing in the pipe 112p.

[0244] In addition, in the case of the cleaning liquid medicine storage tank 110h, a cleaning liquid is supplied to the liquid medicine storage tank 110h. The cleaning liquid supplied to the liquid medicine storage tank 110h flows through the pipe 112p and is discharged. The valve 112q adjusts the opening degree of the pipe 112p and adjusts the flow rate of the cleaning liquid flowing in the pipe 112p.

[0245] The pipe 112c is connected to the connection point 112d of the recovered liquid storage tank 210. The cleaning liquid flowing in the pipe 112c is recovered into the recovered liquid storage tank 210. A valve 112f is installed in the pipe 112c. The valve 112f adjusts the opening degree of the pipe 112c and adjusts the flow rate of the cleaning liquid flowing in the pipe 112c.

[0246] Before the cleaning liquid medicine storage tank 110h, the control unit 102 discharges the liquid medicine stored in the liquid medicine storage tank 110h via the pipe 112c by opening the valve 112q and closing the valves 112e and 112f. After that, while the control unit 102 keeps the valve 112q open and the valves 112e and 112f closed, a cleaning liquid is supplied to the liquid medicine storage tank 110h to clean the liquid medicine storage tank 110h.

[0247] After that, the control unit 102 makes the cleaning liquid supplied to the liquid medicine storage tank 110h flow through the pipes 112a and 112c and be recovered into the recovered liquid storage tank 210 by opening the valve 112f and closing the valves 112e and 112q.

[0248] In this way, at least a part of the cleaning liquid in the cleaning liquid medicine storage tank 110h is recovered as the recovered liquid into the recovered liquid storage tank 210. As described above, the recovered liquid recovered in the recovered liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0249] Next, refer to Figures 1 - 14, which illustrates the substrate processing apparatus 100 of the present embodiment. Figure 14 is a flowchart of the substrate processing method of the present embodiment.

[0250] As Figure 14 shown, in step S302, the chemical solution is discharged from the chemical solution storage tank 110h. By opening the valve 112q by the control unit 102, the chemical solution stored in the chemical solution storage tank 110h is discharged via the pipe 112p.

[0251] In step S304, the cleaning liquid is supplied to the chemical solution storage tank 110h. By closing the valve 112q by the control unit 102 and opening the valve 110t, the cleaning liquid is supplied to the chemical solution storage tank 110h.

[0252] In step S306, the cleaning liquid supplied to the chemical solution storage tank 110h is discharged. By the control unit 102, with the valve 110t kept open, the valve 112q is opened, whereby the cleaning liquid supplied to the chemical solution storage tank 110h is discharged.

[0253] In step S308, it is determined whether a predetermined time has elapsed after the start of supplying or discharging the cleaning liquid. By the control unit 102, the time elapsed after the start of supplying or discharging the cleaning liquid is measured, and it is determined whether the elapsed time exceeds the threshold value.

[0254] If the predetermined time has not elapsed (No in step S308), the process returns to step S308 and repeats the determination until the predetermined time has elapsed. On the other hand, if it is determined that the predetermined time has elapsed (Yes in step S308), the process proceeds to step S310.

[0255] In step S310, the cleaning liquid supplied to the chemical solution storage tank 110h is made to flow into the recovered liquid storage tank 210. By closing the valve 112q by the control unit 102 and opening the valve 112f, the cleaning liquid supplied to the chemical solution storage tank 110h is made to flow into the recovered liquid storage tank 210 and recovered as the recovered liquid.

[0256] In step S312, it is determined whether a predetermined time has elapsed after the start of recovery into the recovered liquid storage tank 210. By the control unit 102, the time elapsed after the start of recovery into the recovered liquid storage tank 210 is measured, and it is determined whether the elapsed time exceeds the threshold value.

[0257] If it is determined that the predetermined time has not elapsed after the start of recovery into the recovered liquid storage tank 210 (No in step S312), the process returns to step S312 and repeats the determination until the predetermined time has elapsed. On the other hand, if it is determined that the predetermined time has elapsed after the start of recovery into the recovered liquid storage tank 210 (Yes in step S312), the process proceeds to step S314.

[0258] In step S314, the supply of the cleaning liquid to the liquid medicine storage tank 110h is stopped, and the recovery of the cleaning liquid to the recovery liquid storage tank 210 is stopped. By the control unit 102 closing the valves 110t and 112f, the flow of the cleaning liquid supplied to the liquid medicine storage tank 110h to the recovery liquid storage tank 210 is stopped and recovered as the recovery liquid. In addition, by the control unit 102 temporarily opening the valve 112q and then closing the valve 112q, the cleaning liquid in the liquid medicine storage tank 110h is discharged, and the liquid medicine storage tank 110h is emptied.

[0259] In step S316, the supply of the liquid medicine to the liquid medicine storage tank 110h is started. The control unit 102 opens the valve 110q to supply the liquid medicine to the liquid medicine storage tank 110h.

[0260] In step S318, it is determined whether a predetermined time has elapsed after the start of the supply of the liquid medicine to the liquid medicine storage tank 110h. The control unit 102 measures the time elapsed after the start of the supply of the liquid medicine and determines whether the elapsed time exceeds the threshold value.

[0261] In the case where the predetermined time has not elapsed after the start of the supply of the liquid medicine (No in step S318), the process returns to step S318 and the above determination is repeated until the predetermined time has elapsed. On the other hand, in the case where it is determined that the predetermined time has elapsed after the start of the supply of the liquid medicine (Yes in step S318), the process proceeds to step S320.

[0262] In step S320, the supply of the liquid medicine to the liquid medicine storage tank 110h is started. The control unit 102 closes the valve 110q to stop the supply of the liquid medicine to the liquid medicine storage tank 110h.

[0263] As described above, after discharging the liquid medicine stored in the liquid medicine storage tank 110h and cleaning the liquid medicine storage tank 110h with the cleaning liquid, the liquid medicine can be re-stored in the liquid medicine storage tank 110h.

[0264] After that, if necessary, the liquid medicine stored in the liquid medicine storage tank 110h is supplied to the front surface Wa of the substrate W. The control unit 102 opens the valves 110e and 36 to supply the liquid medicine stored in the liquid medicine storage tank 110h to the front surface Wa of the substrate W.

[0265] According to the present embodiment, the recovery liquid storage tank 210 recovers at least a part of the cleaning liquid for cleaning the liquid medicine storage tank 110h as the recovery liquid. The recovery liquid recovered in the recovery liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the amount of the new processing liquid used can be reduced.

[0266] In addition, in step S318, the supply of the liquid medicine to the liquid medicine storage tank 110h is controlled based on the opening time of the valve 110t, but the present embodiment is not limited thereto. The supply of the liquid medicine to the liquid medicine storage tank 110h may also be controlled based on the detection result of a sensor in the liquid medicine storage tank 110h.

[0267] In addition, referring to Figures 6 - 14 the description above, a part of the liquid used in the processing liquid tank 110 is recovered into the recovered liquid storage tank 210, but the present embodiment is not limited thereto. The recovered liquid storage tank 210 may also recover the cleaning liquid used for the internal cleaning of the chamber 11.

[0268] Next, referring to Figures 1 - 15 FIG. Figure 15 is a schematic top view of the substrate processing apparatus 100 of the present embodiment. Figure 15 The substrate processing apparatus 100 Figure 1 has the same configuration as the substrate processing apparatus 100 shown in FIG.

[0269] As shown in Figure 15 FIG.

[0270] Next, referring to Figures 1 - 16 FIG. Figure 16 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 16 The substrate processing apparatus Figure 2 has the same configuration as the substrate processing apparatus 100 shown in FIG.

[0271] As shown in Figure 16 FIG.

[0272] Typically, when the substrate holding portion 20 does not hold the substrate W, the cleaning liquid supplied to the pipe 11p is ejected from the opening of the pipe 11p into the chamber 11. Thus, the inside of the chamber 11 can be cleaned. In this specification, the pipe 11p is an example of a chamber cleaning pipe.

[0273] The liquid discharge mechanism 90 includes, in addition to the pipes 92a and the valve 92b, pipes 94a and a valve 94b.

[0274] The pipe 94a connects the pipe 91 and the recovered liquid storage tank 210. The cleaning liquid trapped in the cup 80 flows from the pipe 91 to the pipe 94a. The valve 94b opens and closes the flow path in the pipe 94a. The valve 94b adjusts the opening degree of the pipe 94a and adjusts the flow rate of the cleaning liquid flowing in the pipe 94a. The valve 94b may also have the same configuration as the valve 92b.

[0275] When the valve 94b is open, in the pipe 94a, the cleaning liquid trapped in the cup 80 flows to the recovered liquid storage tank 210. In this specification, the pipes 91 and 94a connecting the cup 80 and the recovered liquid storage tank 210 are an example of liquid discharge pipes.

[0276] Next, with reference to Figures 1 - 17 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 17 is a flowchart of the substrate processing apparatus 100 of the present embodiment.

[0277] Figure 17 In the flowchart of, steps S102 to S114 are the same as steps S102 to S114 described with reference to Figure 4 , and repeated descriptions are omitted to avoid redundancy. In step S114, after the substrate W is unloaded, the process proceeds to step S402.

[0278] In step S402, it is determined whether to clean the inside of the chamber 11. For example, the control unit 102 determines whether to clean the inside of the chamber 11 based on whether the number of substrates W processed after the last chamber cleaning exceeds a threshold value. Alternatively, the control unit 102 determines whether to clean the inside of the chamber 11 based on whether the time elapsed after the last chamber cleaning exceeds a threshold value. Alternatively, the control unit 102 may also determine whether to clean the inside of the chamber 11 based on measurement results such as the atmosphere and temperature inside the chamber 11.

[0279] When it is determined that the inside of the chamber 11 is to be cleaned (Yes in step S402), the process proceeds to step S404. On the other hand, when it is determined that the inside of the chamber 11 is not to be cleaned (No in step S402), the process proceeds to step S416.

[0280] In step S404, a cleaning liquid is supplied to the chamber 11. Thereby, the inside of the chamber 11 is cleaned. The control unit 102 supplies the cleaning liquid to the pipe 11p inside the chamber 11 to clean the inside of the chamber 11. The process proceeds to step S406.

[0281] In step S406, the cleaning liquid supplied to the chamber 11 is discharged. For example, the control unit 102 closes the valve 94b and opens the valve 92b, and discharges the cleaning liquid for cleaning the chamber 11 through the pipes 91 and 92a. The process proceeds to step S408.

[0282] In step S408, it is determined whether a predetermined time has elapsed since the start of supplying the cleaning liquid. For example, the control unit 102 measures the time elapsed since the start of supplying the cleaning liquid, and determines whether the elapsed time is equal to or greater than a threshold value.

[0283] If it is determined that the predetermined time has not elapsed (No in step S408), the process returns to step S408 and repeats the determination until the predetermined time has elapsed. On the other hand, if it is determined that the predetermined time has elapsed (Yes in step S408), the process proceeds to step S410.

[0284] In step S410, the cleaning liquid supplied to the chamber 11 is recovered into the recovery liquid storage tank 210. For example, the control unit 102 closes the valve 92b, and on the other hand, opens the valve 94b, whereby the cleaning liquid for cleaning the chamber 11 is recovered into the recovery liquid storage tank 210 through the pipes 91 and 94a. After that, the process proceeds to step S412.

[0285] In step S412, it is determined whether a predetermined time has elapsed since the start of recovering the cleaning liquid. For example, the control unit 102 measures the time elapsed since the start of recovering the cleaning liquid, and determines whether the elapsed time is equal to or greater than a threshold value.

[0286] If it is determined that the predetermined time has not elapsed (No in step S412), the process returns to step S412 and repeats the determination until the predetermined time has elapsed. On the other hand, if it is determined that the predetermined time has elapsed (Yes in step S412), the process proceeds to step S414.

[0287] In step S414, the supply of the cleaning liquid is stopped. The control unit 102 stops supplying the cleaning liquid to the pipe 11p inside the chamber 11, and ends the cleaning inside the chamber 11. In addition, the control unit 102 opens the valve 94b. The process proceeds to step S416.

[0288] In step S416, it is determined whether to process a new substrate W. For example, the control unit 102 does not end the substrate processing when receiving an instruction for the next substrate W to be processed, and ends the substrate processing when not receiving an instruction for the next substrate W to be processed.

[0289] In the case of determining to process a new substrate W (No in step S416), the process returns to step S102 to reprocess the substrate W. On the other hand, in the case of determining not to process a new substrate W (Yes in step S416), the process ends.

[0290] As described above, the recovery liquid storage tank 210 recovers at least a part of the cleaning liquid in the cleaning liquid storage tank 110h as the recovery liquid. As described above, the recovery liquid recovered in the recovery liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, according to the present embodiment, the amount of the newly used processing liquid can be reduced.

[0291] Next, with reference to Figures 1 - 18D , the substrate processing apparatus 100 of the present embodiment will be described. Figures 18A - 18D is a schematic diagram showing the process flow of the substrate processing apparatus 100 of the present embodiment. Figures 18A - 18D The flowchart of Figure 18D is the same as the schematic diagram of Figures 5A - 5C except for the newly added

[0292] As Figure 18A shown, a liquid medicine is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the liquid medicine. The liquid medicine supply unit 30 supplies the liquid medicine to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the liquid medicine to the back surface Wb of the rotating substrate W. Here, the cup 80 is located at the upper position. Therefore, the cup 80 faces the side portion of the substrate W. The cup 80 captures the liquid medicine scattered as the substrate W rotates.

[0293] In the liquid discharge mechanism 90, the valve 92b is opened and the valve 94b is closed. Therefore, the liquid medicine captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0294] As Figure 18B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the cleaning liquid scattered as the substrate W rotates.

[0295] In the liquid discharge mechanism 90, the state where the valve 92b is kept open and the valve 94b is closed is maintained. Therefore, the cleaning liquid captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0296] As Figure 18CAs shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. For example, the cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the rotating substrate W. The cup 80 traps the cleaning liquid scattered as the substrate W rotates, and also traps again the recovery liquid scattered as the substrate W rotates.

[0297] In the drainage mechanism 90, the holding valve 92b is kept open and the valve 94b is closed. Therefore, the cleaning liquid and the recovery liquid trapped in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0298] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovery liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0299] As Figure 18D shown, the inside of the cleaning chamber 11 is cleaned. For example, a cleaning liquid is supplied into the chamber 11 from the pipe 11p. The cup 80 traps the cleaning liquid.

[0300] In the drainage mechanism 90, the valve 92b is closed and the valve 94b is opened. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 94a and is recovered into the recovery liquid storage tank 210.

[0301] In this way, the recovery liquid storage tank 210 recovers at least a part of the cleaning liquid in the cleaning chamber 11 as the recovery liquid. The recovery liquid recovered in the recovery liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, according to the present embodiment, the usage amount of the new treatment liquid can be reduced.

[0302] Next, with reference to Figures 1 - 19 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 19 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 19 The substrate processing apparatus 100 of Figure 2 has the same configuration as the substrate processing apparatus 100 shown in

[0303] As Figure 19As shown, the substrate processing apparatus 100 further includes a pipe 11s, a cleaning liquid storage tank 11t, and a pipe 11u. The pipe 11s connects the pipe 42 of the cleaning liquid supply unit 40 and the cleaning liquid storage tank 11t. The pipe 11s is connected to the pipe 42 upstream of the valve 46. The cleaning liquid storage tank 11t stores the cleaning liquid flowing through the pipe 42 and the pipe 11s from the supply source. The cleaning liquid storage tank 11t is connected to the recovered liquid storage tank 210 via the pipe 11u. The cleaning liquid storage tank 11t may be disposed in the chamber 11. Alternatively, the cleaning liquid storage tank 11t may be disposed in the processing liquid tank 110 or the processing liquid cassette 120. In this specification, the pipe 42 is an example of a cleaning liquid pipe, and the pipe 11s is an example of a branch pipe.

[0304] The inner diameter of at least a part of the pipe 11s is smaller than the inner diameter of the pipe 42. Therefore, when the valve 46 is open, the flow rate of the cleaning liquid flowing in the pipe 42 is greater than the flow rate of the cleaning liquid flowing in the pipe 11s. However, when the valve 46 is closed, no cleaning liquid flows in the pipe 42, and the cleaning liquid flows in the pipe 11s. By constantly flowing the cleaning liquid in the pipe 11s connected to the supply source, bacteria generated in the pipe 42 and the pipe 11s connected to the supply source can be suppressed.

[0305] Here, the cleaning liquid storage tank 11t temporarily stores the cleaning liquid, and the cleaning liquid stored in the cleaning liquid storage tank 11t is recovered into the recovered liquid storage tank 210, but the present embodiment is not limited thereto. The cleaning liquid in the pipe connected to the supply source may also be constantly recovered directly into the recovered liquid storage tank 210 at a smaller flow rate.

[0306] In this way, the cleaning liquid forming a minute flow in the pipe 42 through which the cleaning liquid flows is recovered as the recovered liquid. The recovered liquid recovered in the recovered liquid storage tank 210 is supplied to the back surface Wb of the substrate W. Therefore, according to the present embodiment, the usage amount of the new processing liquid can be reduced.

[0307] In addition, in the substrate processing apparatus 100, the back surface processing liquid supply unit 50 can selectively supply the recovered liquid and the cleaning liquid to the back surface Wb of the substrate W, but the present embodiment is not limited thereto. The back surface processing liquid supply unit 50 may also supply only the recovered liquid to the back surface Wb of the substrate W.

[0308] For example, Figure 2In the substrate processing apparatus 100 shown, the backside processing liquid supply unit 50 includes a chemical liquid supply unit 54, a cleaning liquid supply unit 56, and a recovery liquid supply unit 58. In the substrate processing method described with reference to FIG. 5, the chemical liquid, the cleaning liquid, and the recovery liquid are selectively supplied to the backside Wb of the substrate W, but the present embodiment is not limited thereto. The backside processing liquid supply unit 50 may also have a recovery liquid supply unit 58. On the other hand, it does not have a chemical liquid supply unit 54 and a cleaning liquid supply unit 56. In such a case, the chemical liquid and the cleaning liquid may not be supplied to the backside Wb of the substrate W, and the recovery liquid may be supplied instead.

[0309] In addition, in the above description, while the cleaning liquid supply unit 40 supplies the cleaning liquid to the front side Wa of the substrate W, the backside processing liquid supply unit 50 supplies the cleaning liquid to the backside Wb of the substrate W and then supplies the recovery liquid, but the present embodiment is not limited thereto. It is also possible that while the cleaning liquid supply unit 40 supplies the cleaning liquid to the front side Wa of the substrate W, the backside processing liquid supply unit 50 does not supply the cleaning liquid to the backside Wb of the substrate W and supplies the recovery liquid instead. In such a case, the backside processing liquid supply unit 50 may also not have a cleaning liquid supply unit 56.

[0310] Next, with reference to Figures 1 - 20B , the substrate processing apparatus 100 of the present embodiment will be described. Figure 20A And Figure 20B are schematic diagrams showing the process of the substrate processing apparatus 100 of the present embodiment.

[0311] As Figure 20A shown, a chemical liquid is supplied to the front side Wa of the substrate W, the front side Wa of the substrate W is processed with the chemical liquid, and a recovery liquid is supplied to the backside Wb of the substrate W, and the backside Wb of the substrate W is processed with the recovery liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the rotating front side Wa of the substrate W. The backside processing liquid supply unit 50 supplies the recovery liquid to the backside Wb of the substrate W.

[0312] Here, the cup 80 is located at an upper position and faces the side portion of the substrate W. The cup 80 recovers the chemical liquid and the recovery liquid scattered as the substrate W rotates.

[0313] In the liquid discharge mechanism 90, the valve 92b is opened. Therefore, the chemical liquid and the recovery liquid captured in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0314] As Figure 20B shown, a cleaning liquid is supplied to the front side Wa of the substrate W, the front side Wa of the substrate W is processed with the cleaning liquid, and a recovery liquid is supplied to the backside Wb of the substrate W, and the backside Wb of the substrate W is processed with the recovery liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the rotating front side Wa of the substrate W, and the backside processing liquid supply unit 50 supplies the recovery liquid to the rotating backside Wb of the substrate W. Here, the cup 80 captures the cleaning liquid and the recovery liquid scattered as the substrate W rotates again.

[0315] In the liquid discharge mechanism 90, the holding valve 92b is kept open. Therefore, the cleaning liquid and the recovered liquid collected in the cup 80 flow through the pipe 91 and the pipe 92a and are discharged.

[0316] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovered liquid. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0317] In the present embodiment, as described above, the front surface Wa of the substrate W is treated with a chemical solution and then with a cleaning liquid. According to the present embodiment, during the supply of the chemical solution and the cleaning liquid to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0318] In addition, referring to Figures 1 - 19 the description above, the back surface treatment liquid supply unit 50 has both the chemical solution supply unit 54 and the cleaning liquid supply unit 56 at the same time, but the present embodiment is not limited to this. The back surface treatment liquid supply unit 50 may not have the cleaning liquid supply unit 56 and may have the chemical solution supply unit 54.

[0319] Next, referring to Figures 1 - 21 the substrate processing apparatus 100 of the present embodiment will be described. Figure 21 is a schematic diagram of the substrate processing apparatus 100 of the present embodiment. Figure 21 The substrate processing unit 10 of Figure 2 has the same configuration as the substrate processing apparatus 100 shown in

[0320] except that the diluted chemical solution obtained by diluting the chemical solution with the dilution liquid is supplied to the front surface Wa of the substrate W, and the diluted chemical solution obtained by diluting the chemical solution with the recovered liquid is supplied to the back surface Wb of the substrate W. In order to avoid redundancy, repeated descriptions are omitted. Figure 21 As shown in

[0321] in the substrate processing unit 10, the chemical solution supply unit 30 supplies the diluted chemical solution obtained by diluting the chemical solution with the dilution liquid to the front surface Wa of the substrate W.

[0322] The chemical solution supply unit 30 has a pipe 32, a nozzle 34, a pipe 32p, a valve 36p, a pipe 32q, and a valve 36q. The nozzle 34 is connected to one end of the pipe 32.

[0323] The liquid chemical solution contains, for example, hydrofluoric acid. The liquid chemical solution may also contain phosphoric acid. In addition, the liquid chemical solution may also contain hydrogen peroxide water. The liquid chemical solution may also contain SC1 (ammonia hydrogen peroxide water mixture), SC2 (hydrochloric acid hydrogen peroxide water mixture), or aqua regia (mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0324] The pipe 32q is connected to the other end of the pipe 32. A diluent is supplied to the pipe 32q from a supply source. The valve 36q opens and closes the flow path in the pipe 32q. When the valve 36q is opened, the diluent flows in the pipe 32q.

[0325] The diluent may also contain, for example, any one of deionized water (DIW), carbonated water, electrolyzed ionized water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (for example, around 10 ppm to 100 ppm), or reduced water (hydrogen water). Additionally, the diluent may be of the same type as the cleaning liquid.

[0326] When the valve 36p and the valve 36q are opened, the liquid chemical solution and the diluent flow in the pipe 32p and the pipe 32q respectively. Thus, a diluted liquid chemical solution obtained by diluting the liquid chemical solution with the diluent flows in the pipe 32. The nozzle 34 sprays the diluted liquid chemical solution onto the front surface Wa of the substrate W.

[0327] The back - side treatment liquid supply unit 50 supplies the recovered liquid alone or a mixture of the liquid chemical solution and the recovered liquid to the back surface Wb of the substrate W. The back - side treatment liquid supply unit 50 has a liquid chemical solution supply unit 54 and a recovered liquid supply unit 58. On the other hand, Figure 21 the substrate processing apparatus 100 shown in Figure 2 is different from the substrate processing apparatus 100 shown in

[0328] For example, the back - side treatment liquid supply unit 50 may supply the recovered liquid to the back surface Wb of the substrate W. In addition, the back - side treatment liquid supply unit 50 may mix the liquid chemical solution and the recovered liquid and supply it to the back surface Wb of the substrate W.

[0329] Next, referring to Figures 1 - 22B , the substrate processing apparatus 100 of the present embodiment will be described. Figure 22A and Figure 22B are schematic diagrams showing the flow of the substrate processing apparatus 100 of the present embodiment. Figure 22A and Figure 22B Except for treating the substrate W with the diluted liquid chemical solution, the flow is the same as that of the substrate processing apparatus 100 shown in Figures 5A - 5C . To avoid redundancy, repeated descriptions are omitted.

[0330] As shown in Figure 22AAs shown, a diluted liquid medicine is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the diluted liquid medicine. The liquid medicine supply unit 30 supplies the diluted liquid medicine to the front surface Wa of the rotating substrate W. Here, the valves 36p and 36q are opened, and the nozzle 34 sprays the diluted liquid medicine onto the front surface Wa of the substrate W.

[0331] The back surface treatment liquid supply unit 50 supplies the diluted liquid medicine to the back surface Wb of the rotating substrate W. The valves 54b and 58b are opened. Therefore, the liquid medicine flowing in the pipe 54a and the recovered liquid flowing in the pipe 58a are mixed in the pipe 52c to produce the diluted liquid medicine. Then, the nozzle 51 sprays the diluted liquid medicine onto the back surface Wb of the substrate W.

[0332] Here, the cup 80 is located at the upper position and faces the side portion of the substrate W. In this case, the cup 80 captures the diluted liquid medicine scattered from the substrate W as the substrate W rotates.

[0333] In the liquid discharge mechanism 90, the valve 92b is opened. Therefore, the diluted liquid medicine captured by the cup 80 flows through the pipes 91 and 92a and is discharged.

[0334] As Figure 22B shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is processed with the cleaning liquid, and a recovered liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is processed with the recovered liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovered liquid to the back surface Wb of the rotating substrate W. In the back surface treatment liquid supply unit 50, the valve 54b is closed to stop the supply of the liquid medicine. The cup 80 captures the cleaning liquid and the recovered liquid scattered as the substrate W rotates.

[0335] In the liquid discharge mechanism 90, the valve 92b is kept open. Therefore, the cleaning liquid and the recovered liquid captured by the cup 80 flow through the pipes 91 and 92a and are discharged.

[0336] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovered liquid. At this time, the substrate holding unit 20 can also increase the rotation speed of the substrate W to dry the substrate W. Then, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0337] According to the present embodiment, as described above, after the front surface Wa of the substrate W is processed with the diluted liquid medicine, it is processed with the cleaning liquid. According to the present embodiment, during the supply of the diluted liquid medicine and the cleaning liquid to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W as at least a part of the treatment liquid. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new treatment liquid can be reduced.

[0338] Next, with reference to Figures 1 - 23 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 23 FIG. is a schematic view of the substrate processing apparatus 100 of the present embodiment. Figure 23 The substrate processing apparatus 100, except for supplying the first liquid chemical and the second liquid chemical to the substrate W, has the same configuration as the Figure 2 substrate processing apparatus 100 shown, and redundant descriptions are omitted to avoid prolixity.

[0339] As shown in Figure 23 , the liquid chemical supply unit 30 includes a first liquid chemical supply unit 30a and a second liquid chemical supply unit 30b. The first liquid chemical supply unit 30a supplies the first liquid chemical to the front surface Wa of the substrate W. The second liquid chemical supply unit 30b supplies a second liquid chemical different from the first liquid chemical to the front surface Wa of the substrate W. For example, the first liquid chemical supply unit 30a supplies hydrofluoric acid to the front surface Wa of the substrate W, and the second liquid chemical supply unit 30b supplies an ammonia hydrogen peroxide water mixture (SC1) to the front surface Wa of the substrate W.

[0340] The first liquid chemical supply unit 30a includes a pipe 32a, a nozzle 34a, and a valve 36a. The nozzle 34a is connected to the pipe 32a. The first liquid chemical is supplied to the pipe 32a from a supply source. The valve 36a opens and closes the flow path in the pipe 32a. The nozzle 34a sprays the first liquid chemical onto the front surface Wa of the substrate W.

[0341] The valve 36a adjusts the opening degree of the pipe 32a and adjusts the flow rate of the first liquid chemical supplied to the pipe 32a. Specifically, the valve 36a includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0342] The nozzle 34a may also be movable. The first liquid chemical supply unit 30a may further include a nozzle moving unit 38a. The nozzle moving unit 38a can lift the nozzle 34a and can also horizontally rotate the nozzle 34a around a rotation axis. The nozzle moving unit 38a lifts the nozzle 34a. For example, the nozzle moving unit 38a includes a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism. In addition, the nozzle moving unit 38a horizontally rotates the nozzle 34. For example, the nozzle moving unit 38a includes a motor.

[0343] The second liquid medicine supply unit 30b includes a pipe 32b, a nozzle 34b, and a valve 36b. The nozzle 34b is connected to the pipe 32b. The second liquid medicine is supplied to the pipe 32b from a supply source. The valve 36b opens and closes the flow path in the pipe 32b. The nozzle 34b ejects the second liquid medicine onto the front surface Wa of the substrate W. The pipe 32b, the nozzle 34b, the valve 36b, and the nozzle moving unit 38b in the second liquid medicine supply unit 30b have the same configuration as the pipe 32a, the nozzle 34a, the valve 36a, and the nozzle moving unit 38a in the first liquid medicine supply unit 30a, and repeated descriptions are omitted.

[0344] The back surface treatment liquid supply unit 50 has a first liquid medicine supply unit 53 and a second liquid medicine supply unit 55. The first liquid medicine supply unit 53 supplies the first liquid medicine to the back surface Wb of the substrate W. The second liquid medicine supply unit 55 supplies a second liquid medicine different from the first liquid medicine to the back surface Wb of the substrate W. For example, the first liquid medicine supply unit 53 supplies hydrofluoric acid to the back surface Wb of the substrate W, and the second liquid medicine supply unit 55 supplies SC1 (ammonia hydrogen peroxide water mixture) to the back surface Wb of the substrate W.

[0345] The first liquid medicine supply unit 53 includes a pipe 53a and a valve 53b. The first liquid medicine is supplied to the pipe 53a from a supply source. The valve 53b opens and closes the flow path in the pipe 53a.

[0346] The valve 53b adjusts the opening degree of the pipe 53a and adjusts the flow rate of the first liquid medicine supplied to the pipe 53a. Specifically, the valve 53b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0347] The second liquid medicine supply unit 55 includes a pipe 55a and a valve 55b. The second liquid medicine is supplied to the pipe 55a from a supply source. The valve 55b opens and closes the flow path in the pipe 55a. The pipe 55a and the valve 55b in the second liquid medicine supply unit 55 have the same configuration as the pipe 53a and the valve 53b in the first liquid medicine supply unit 53, and repeated descriptions are omitted.

[0348] The liquid discharge mechanism 90 includes a pipe 93a and a valve 93b in addition to the pipe 92a and the valve 92b. The pipe 92a is connected to the pipe 91. The first liquid medicine and the cleaning liquid captured in the cup 80 flow from the pipe 91 to the pipe 92a.

[0349] The pipe 93a is connected to the pipe 91. The second liquid medicine and the cleaning liquid captured in the cup 80 flow from the pipe 91 to the pipe 93a. The valve 93b opens and closes the flow path in the pipe 93a. The valve 93b adjusts the opening degree of the pipe 93a and adjusts the flow rate of the second liquid medicine and the cleaning liquid flowing in the pipe 93a. Specifically, the valve 93b includes: a valve body (not shown) with a valve seat provided inside; a valve element that opens and closes the valve seat; and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0350] Next, with reference to Figures 1 - 25B , the substrate processing apparatus 100 of the present embodiment will be described. Figures 24A - 25B is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 24A - 25B Except for the point that two types of chemical liquids and the cleaning liquid are alternately supplied to the substrate W, the process is the same as that of the substrate processing apparatus 100 shown in FIG. 5, and repeated descriptions are omitted to avoid redundancy.

[0351] As Figure 24A shown, the first chemical liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the first chemical liquid. The first chemical liquid supply unit 30a supplies the first chemical liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the first chemical liquid to the back surface Wb of the rotating substrate W. In this case, the cup 80 captures the first chemical liquid scattered as the substrate W rotates.

[0352] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valve 93b is closed. Therefore, the first chemical liquid captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0353] As Figure 24B shown, the cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the cleaning liquid scattered as the substrate W rotates.

[0354] In the liquid discharge mechanism 90, the state where the valve 92b is kept open and the valve 93b is closed is maintained. Therefore, the cleaning liquid captured in the cup 80 flows through the pipe 91 and the pipe 92a and is discharged.

[0355] As Figure 24C shown, the second chemical liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the second chemical liquid. The second chemical liquid supply unit 30b supplies the second chemical liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the second chemical liquid to the back surface Wb of the rotating substrate W. The cup 80 captures the second chemical liquid scattered as the substrate W rotates.

[0356] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valve 92b is closed. Therefore, the second chemical liquid captured in the cup 80 flows through the pipe 91 and the pipe 93a and is discharged.

[0357] As Figure 25AAs shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The cup 80 traps the cleaning liquid scattered as the substrate W rotates.

[0358] In the drainage mechanism 90, the holding valve 93b is kept open and the valve 92b is closed. Therefore, the cleaning liquid trapped in the cup 80 flows through the pipe 91 and the pipe 93a and is discharged.

[0359] As Figure 25B shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid. Also, a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W. In this case, the cup 80 recovers the cleaning liquid and the recovery liquid scattered as the substrate W rotates.

[0360] In the drainage mechanism 90, the holding valve 93b is kept open and the valve 92b is closed. Therefore, the cleaning liquid and the recovery liquid trapped in the cup 80 flow through the pipe 91 and the pipe 93a and are discharged.

[0361] After that, the cleaning liquid supply unit 40 stops supplying the cleaning liquid, and the back surface treatment liquid supply unit 50 stops supplying the recovery liquid. At this time, the substrate holding unit 20 can also increase the rotation speed of the substrate W to dry the substrate W. After that, the substrate holding unit 20 stops the rotation of the substrate W and removes the substrate W from the chamber 11.

[0362] According to the present embodiment, as described above, the front surface Wa of the substrate W is alternately treated with the first chemical solution, the second chemical solution, and the cleaning liquid. According to the present embodiment, during the supply of the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new treatment liquid can be reduced.

[0363] In addition, referring to FIGS. 24 to Figure 25B In the description above, during the supply of the cleaning liquid after the supply of the second chemical solution to the front surface Wa of the substrate W, after a predetermined time, the recovery liquid is supplied to the back surface Wb of the substrate W, but the present embodiment is not limited thereto. Also, during the supply of the cleaning liquid after the supply of the first chemical solution to the front surface Wa of the substrate W, after a predetermined time, the recovery liquid may be supplied to the back surface Wb of the substrate W.

[0364] Furthermore, in the substrate processing apparatus 100, all the liquids scattered from the rotating substrate W are trapped in the same cup 80, but the present embodiment is not limited thereto. There may also be multiple cups 80.

[0365] In addition, in the substrate processing apparatus 100, the substrate holding unit 20 increases the rotation speed of the substrate W to dry the substrate W, but the present embodiment is not limited thereto. The substrate W may also be dried by supplying a gas. Further, after the cleaning process of the substrate W, a processing liquid having a relatively high volatility may be supplied to the substrate W to dry the substrate W.

[0366] Next, with reference to Figures 1 - 26 , the substrate processing apparatus 100 of the present embodiment will be described. Figure 26 is a schematic view of the substrate processing apparatus 100 of the present embodiment. Figure 26 The substrate processing apparatus 100 of Figure 23 includes a first cup 81 and a second cup 82 in the cup 80, and the substrate processing apparatus 100 further includes a shielding member 60, a processing liquid supply unit 72, and an inert gas supply unit 74. Except for this, it has the same configuration as the substrate processing apparatus 100 shown in

[0367] As shown in Figure 26 , the substrate processing apparatus 100 further includes a shielding member 60, a processing liquid supply unit 72, and an inert gas supply unit 74. The shielding member 60 is located above the front surface Wa of the substrate W. The shielding member 60 can move in the vertical direction with respect to the front surface Wa of the substrate W. When the shielding member 60 moves closer to the front surface Wa of the substrate W, the front surface Wa of the substrate W is shielded. The shielding member 60 supplies the processing liquid and the inert gas to the front surface Wa of the substrate W.

[0368] The shielding member 60 is configured to be movable with respect to the substrate W. The shielding member 60 further includes a shielding plate 62 and a moving unit 64. The shielding plate 62 is a plate-shaped member extending in the horizontal direction (XY plane). The shielding plate 62 is located above the front surface Wa of the substrate W held by the chuck member 22. The lower surface 62a of the shielding plate 62 faces the front surface Wa of the substrate W held by the chuck member 22. The lower surface 62a is, for example, circular in shape. The size of the diameter of the lower surface 62a may also be equal to or larger than the diameter of the substrate W.

[0369] The moving unit 64 moves the shielding plate 62 up and down in the vertical direction. For example, the moving unit 64 includes a ball screw mechanism and a motor that applies a driving force to the ball screw mechanism.

[0370] The moving unit 64 moves the shielding plate 62 up and down between a retracted position and a shielding position. The shielding position is a position lower than the retracted position. Specifically, the shielding position is a position closer to the substrate W held by the chuck member 22 than the retracted position. Figure 26 In

[0371] If the shielding plate 62 moves from the retreat position to the shielding position, the shielding plate 62 at the shielding position and the cup 80 at the upper position form a processing space. The processing space is a space that is substantially shielded from the external atmosphere. In other words, the processing space becomes a local space formed inside the chamber 11. The processing space is substantially shielded from the atmosphere inside the chamber 11.

[0372] The processing liquid supply unit 72 supplies the processing liquid to the front surface Wa of the substrate W. Here, the processing liquid is appropriately used for drying the cleaning liquid. The processing liquid is preferably a low surface tension liquid having a lower surface tension than the cleaning liquid. In the above case, the substrate W is not dried immediately after the cleaning liquid on the substrate W is shaken off, but after the cleaning liquid on the substrate W is replaced with the processing liquid, the substrate W is dried by shaking off the processing liquid on the substrate W. Therefore, if the processing liquid is a low surface tension liquid, the surface tension acting on the substrate W can be reduced when the substrate W is dried.

[0373] Examples of organic solvents that function as the treatment liquid include liquids containing at least one of IPA (isopropyl alcohol), HFE (hydrofluoroether), methanol, ethanol, acetone, PGEE (propylene glycol ethyl ether), and Trans-1,2-dichloroethylene. In addition, the treatment liquid may be a non-monomer component or a liquid mixed with other components. For example, it may be a mixed liquid of IPA and DIW, or a mixed liquid of IPA and HFE.

[0374] The processing liquid supply unit 72 includes a pipe 72a, a nozzle 72b, and a valve 72c. The nozzle 72b is mounted on the shielding plate 62. The processing liquid is supplied from the supply source to the pipe 72a. The valve 72c opens and closes the flow path in the pipe 72a. The nozzle 72b sprays the processing liquid onto the front surface Wa of the substrate W.

[0375] The valve 72c adjusts the opening of the pipe 72a to adjust the flow rate of the treatment liquid supplied to the pipe 72a. Specifically, the valve 72c includes: a valve body (not shown) with a valve seat disposed therein; a valve body that opens and closes the valve seat; and an actuator (not shown) that moves the valve body between an open position and a closed position.

[0376] The inert gas supply unit 74 supplies an inert gas to the front surface Wa of the substrate W. Even if the inert gas is supplied to the front surface Wa of the substrate W, the characteristics of the front surface Wa of the substrate W are not substantially changed. Typically, the inert gas is nitrogen gas. Alternatively, the inert gas may be a rare gas.

[0377] The inert gas supply unit 74 supplies an inert gas to the front surface Wa of the substrate W. The inert gas supply unit 74 includes a pipe 74a, a nozzle 74b, and a valve 74c. The nozzle 74b is mounted on the shielding plate 62. The inert gas is supplied from the supply source to the pipe 74a. The valve 74c opens and closes the flow path in the pipe 74a. The nozzle 74b ejects the inert gas to the front surface Wa of the substrate W.

[0378] The valve 74c adjusts the opening degree of the pipe 74a and adjusts the flow rate of the inert gas supplied to the pipe 74a. Specifically, the valve 74c includes: a valve body (not shown) with a valve seat provided inside; a valve body for opening and closing the valve seat; and an actuator (not shown) for moving the valve body between an open position and a closed position.

[0379] On the shielding plate 62, a nozzle 72b and a nozzle 74b are provided. The ejection ports of the nozzle 72b and the nozzle 74b are opened on the lower surface 62a of the shielding plate 62. The ejection ports of the nozzle 72b and the nozzle 74b may also be located opposite to the central portion of the substrate W held by the chuck member 22. The nozzle 72b ejects a processing liquid onto the front surface Wa of the substrate W. The nozzle 74b ejects an inert gas onto the front surface Wa of the substrate W.

[0380] The cup 80 has a first cup 81 and a second cup 82. The second cup 82 is located radially outside the substrate W with respect to the first cup 81. The first cup 81 and the second cup 82 are respectively lifted and lowered in the vertical direction. The first cup 81 and the second cup 82 rise to an upper position on the side of the substrate W. In addition, the first cup 81 and the second cup 82 descend to a lower position obliquely below the substrate W. The first cup 81 and the second cup 82 capture the liquid scattered from the substrate W.

[0381] In addition, the second cup 82 is located overlapping above the first cup 81. Therefore, when the first cup 81 descends, the second cup 82 can descend to the position where the first cup 81 descends.

[0382] The liquid discharge mechanism 90 discharges the chemical liquid, cleaning liquid, and processing liquid captured in the cup 80 to the outside of the chamber 11. The liquid discharge mechanism 90 has a pipe 91a for discharging the processing liquid captured in the first cup 81 and a pipe 91b for discharging the processing liquid captured in the second cup 82. One end of the pipe 91a is connected to the bottom of the first cup 81. One end of the pipe 91b is connected to the bottom of the second cup 82.

[0383] The liquid discharge mechanism 90 further includes a pipe 95a and a valve 95b in addition to the pipe 92a, the valve 92b, the pipe 93a, and the valve 93b. The pipes 92a and 93a are connected to the pipe 91a. The pipe 95a is connected to the pipe 91b. The valve 95b has the same configuration as the valves 92b and 93b.

[0384] For example, during the period when the first cup 81 continuously supplies the first chemical liquid to the substrate W from the first chemical liquid supply unit 30a, it is located directly above, even on the side of the substrate W. At this time, the second cup 82 is also located above, like the first cup 81.

[0385] In addition, during the period when the first cup 81 continuously supplies the cleaning liquid to the substrate W through the cleaning liquid supply unit 40, it is located on the side of the substrate W. After that, during the period when the first cup 81 continuously supplies the second chemical liquid and the cleaning liquid to the substrate W through the second chemical liquid supply unit 30b and the cleaning liquid supply unit 40 respectively, it is located on the side of the substrate W.

[0386] In this case, the first cup 81 captures the first chemical liquid, the cleaning liquid, the second chemical liquid, and the cleaning liquid that are scattered as the substrate W rotates. After that, when the period during which the cleaning liquid supply unit 40 supplies the cleaning liquid to the substrate W ends, the first cup 81 descends from the side of the substrate W to directly below vertically. In this case, the second cup 82 is located on the side of the substrate W.

[0387] After that, during the period when the second cup 82 continuously supplies the processing liquid to the substrate W through the shielding member 60, it is located on the side of the substrate W. After that, during the period when the second cup 82 continuously supplies the inert gas to the substrate W through the shielding member 60, it is located on the side of the substrate W. When the period during which the shielding member 60 supplies the inert gas to the substrate W ends, the second cup 82 descends from the side of the substrate W to directly below vertically.

[0388] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical liquid, the second chemical liquid, and the cleaning liquid. According to the present embodiment, during at least a part of the period when the cleaning liquid is supplied to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0389] Next, referring to Figures 1 - 30 , the substrate processing apparatus 100 of the present embodiment will be described. Figures 27A - 30 is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 27A - 30 Except that the cup 80 has the first cup 81 and the second cup 82, and the processing liquid and the inert gas are supplied to the front surface Wa of the substrate W from the shielding member 60, Figures 24A - 25B is the same, and in order to avoid redundancy, the repeated description is omitted.

[0390] As Figure 27A shows, the first chemical liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the first chemical liquid. The first chemical liquid supply unit 30a supplies the first chemical liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the first chemical liquid to the back surface Wb of the rotating substrate W.

[0391] Here, both the first cup 81 and the second cup 82 are located at the upper position. Therefore, the first cup 81 faces the side portion of the substrate W, and the first cup 81 captures the first chemical liquid that is scattered as the substrate W rotates.

[0392] In the liquid discharge mechanism 90, the valve 92b is open, and on the other hand, the valves 93b and 95b are closed. Therefore, the first liquid medicine collected in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0393] As Figure 27B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. The first cup 81 captures the cleaning liquid scattered as the substrate W rotates.

[0394] In the liquid discharge mechanism 90, the state where the valve 92b is kept open and the valves 93b and 95b are closed is maintained. Therefore, the cleaning liquid collected in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0395] As Figure 28A shown, a second liquid medicine is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the second liquid medicine. The second liquid medicine supply unit 30b supplies the second liquid medicine to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the second liquid medicine to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the second liquid medicine scattered as the substrate W rotates.

[0396] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valves 92b and 95b are closed. Therefore, the second liquid medicine collected in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0397] As Figure 28B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the cleaning liquid scattered as the substrate W rotates.

[0398] In the liquid discharge mechanism 90, the state where the valve 93b is kept open and the valves 92b and 95b are closed is maintained. Therefore, the cleaning liquid collected in the first cup 81 flows through the pipe 91a and the pipe 93a and is discharged.

[0399] As Figure 29A shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W.

[0400] In the liquid discharge mechanism 90, the holding valve 93b is opened, and the valves 92b and 95b are closed. Therefore, the cleaning liquid and the recovered liquid collected in the first cup 81 flow through the pipe 91a and the pipe 93a and are discharged.

[0401] As Figure 29B shown, a processing liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is processed with the processing liquid. The shielding member 60 supplies the processing liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 stops supplying the processing liquid to the back surface Wb of the substrate W.

[0402] Here, the first cup 81 moves from the upper position to the lower position, and the second cup 82 is located at the upper position. Therefore, the second cup 82 faces the side portion of the substrate W. The second cup 82 captures the processing liquid scattered as the substrate W rotates.

[0403] In the liquid discharge mechanism 90, the valve 95b is opened, and the valves 92b and 93b are closed. Therefore, the processing liquid collected in the second cup 82 flows through the pipe 91b and the pipe 95a and is discharged.

[0404] As Figure 30 shown, an inert gas is supplied to the front surface Wa of the substrate W to blow off the processing liquid on the front surface Wa of the substrate W. The shielding member 60 supplies the inert gas to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 maintains the state of stopping the supply of the processing liquid to the back surface Wb of the substrate W. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W.

[0405] Here, the second cup 82 remains in the upper position. The second cup 82 captures the processing liquid scattered as the substrate W rotates.

[0406] In the liquid discharge mechanism 90, the valve 95b is kept open, and the valves 92b and 93b are closed. Therefore, the processing liquid collected in the second cup 82 flows through the pipe 91b and the pipe 95a and is discharged.

[0407] After that, the shielding member 60 stops supplying the inert gas, and the substrate holding unit 20 stops the rotation of the substrate W. Thus, the substrate W is dried. After that, the substrate W is taken out of the chamber 11.

[0408] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical solution, the second chemical solution, and the cleaning liquid. According to the present embodiment, during at least a part of the period when the cleaning liquid is supplied to the front surface Wa of the substrate W, the recovered liquid is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0409] In addition, Figure 29BIn this case, when the masking member 60 supplies the processing liquid to the front surface Wa of the substrate W, the valve 93b is closed. However, when the masking member 60 supplies the processing liquid to the front surface Wa of the substrate W, the valve 93b through which the cleaning liquid and the recovered liquid flowing in the first cup 81 are trapped may be kept open. Thus, when the masking member 60 supplies the processing liquid to the front surface Wa of the substrate W, the cleaning liquid and the recovered liquid trapped in the first cup 81 can also be discharged. In addition, the valve 93b may be opened for a predetermined time after the start of the period during which the masking member 60 supplies the processing liquid to the front surface Wa of the substrate W, and may be closed after the elapse of the predetermined time.

[0410] In addition, Figures 26 - 30 In the substrate processing apparatus 100 shown, the cup 80 has the first cup 81 and the second cup 82, but the present embodiment is not limited thereto. The cup 80 may have three or more cups.

[0411] Next, Figures 1 - 31 the substrate processing apparatus 100 of the present embodiment will be described with reference to Figure 31 is a schematic view of the substrate processing apparatus 100 of the present embodiment. Figure 31 The substrate processing unit 10 of Figure 26 has the same configuration as the substrate processing apparatus 100 shown in

[0412] As Figure 31 shown, the cup 80 has the first cup 81, the second cup 82, and the third cup 83. The third cup 83 is located radially outside the substrate W with respect to the second cup 82. The first cup 81 to the third cup 83 are respectively lifted and lowered in the vertical direction. The first cup 81 to the third cup 83 rise to the upper position on the side of the substrate W. In addition, the first cup 81 to the third cup 83 descend to the lower position obliquely below the substrate W. The first cup 81 to the third cup 83 trap the liquid scattered from the substrate W.

[0413] In addition, the third cup 83 is located above and overlapping the second cup 82. Therefore, when the second cup 82 descends, the third cup 83 can descend to the position where the second cup 82 descends.

[0414] The liquid discharge mechanism 90 discharges the chemical liquid, the cleaning liquid, and the processing liquid trapped in the cup 80 to the outside of the chamber 11. The liquid discharge mechanism 90 has a pipe 91a for discharging the processing liquid trapped in the first cup 81, a pipe 91b for discharging the processing liquid trapped in the second cup 82, and a pipe 91c for discharging the processing liquid trapped in the third cup 83. One end of the pipe 91a is connected to the bottom of the first cup 81. One end of the pipe 91b is connected to the bottom of the second cup 82. One end of the pipe 91c is connected to the third cup 83.

[0415] In the liquid discharge mechanism 90, the pipe 92a is connected to the pipe 91a. The pipe 93a is connected to the pipe 91b. The pipe 95a is connected to the pipe 91c.

[0416] For example, during the period when the first cup 81 continuously supplies the first liquid medicine to the substrate W by the first liquid medicine supply unit 30a, it is located vertically above and even on the side of the substrate W. At this time, the second cup 82 is also located above like the first cup 81.

[0417] In addition, during the period when the first cup 81 continuously supplies the cleaning liquid to the substrate W by the cleaning liquid supply unit 40, it is located on the side of the substrate W. In this case, the first cup 81 respectively traps the first liquid medicine and the cleaning liquid scattered as the substrate W rotates.

[0418] After that, when the period of supplying the cleaning liquid to the substrate W by the cleaning liquid supply unit 40 ends, the first cup 81 descends from the side of the substrate W to directly below vertically. In this case, the second cup 82 is located on the side of the substrate W.

[0419] The second cup 82 is located on the side of the substrate W during the periods when the second liquid medicine supply unit 30b and the cleaning liquid supply unit 40 respectively supply the second liquid medicine and the cleaning liquid to the substrate W. In addition, the second cup 82 is located on the side of the substrate W during the period of supplying the recovery liquid to the substrate W. In this case, the second cup 82 respectively traps the second liquid medicine, the cleaning liquid and the recovery liquid scattered as the substrate W rotates.

[0420] After that, if the shielding member 60 shields the front surface Wa of the substrate W and starts to supply the processing liquid to the substrate W, then the second cup 82 descends from the side of the substrate W to directly below vertically. During the period when the shielding member 60 supplies the processing liquid to the substrate W, the third cup 83 is located on the side of the substrate W. After that, the third cup 83 is located on the side of the substrate W during the period when the shielding member 60 supplies the inert gas to the substrate W. The third cup 83 traps the processing liquid scattered as the substrate W rotates. When the period of supplying the inert gas to the substrate W by the shielding member 60 ends, the third cup 83 descends from the side of the substrate W to directly below vertically.

[0421] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first liquid medicine, the second liquid medicine and the cleaning liquid. According to the present embodiment, during at least a part of the period of supplying the cleaning liquid to the front surface Wa of the substrate W, the recovery liquid is supplied to the back surface Wb of the substrate W. Therefore, by the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0422] Next, referring to Figures 1 - 34 , the substrate processing apparatus 100 of the present embodiment will be described. Figures 32A - 34 is a schematic diagram showing the process of the substrate processing apparatus 100 of the present embodiment. Figures 32A - 34Except that in addition to the cup 80, the first cup 81 and the second cup 82, there is also a third cup 83, the process is the same as that of the substrate processing apparatus 100 described in the reference. In order to avoid redundancy, repeated descriptions are omitted. Figures 27A - 30 The process is the same as that of the substrate processing apparatus 100 described above. In order to avoid redundancy, repeated descriptions are omitted.

[0423] As Figure 32A shown, a first chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the first chemical solution. The first chemical solution supply unit 30a supplies the first chemical solution to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the first chemical solution to the back surface Wb of the rotating substrate W.

[0424] Here, the first cup 81 to the third cup 83 are all located in the upper position. Therefore, the first cup 81 faces the side portion of the substrate W. The first cup 81 captures the first chemical solution scattered as the substrate W rotates.

[0425] In the liquid discharge mechanism 90, the valve 92b is opened, and on the other hand, the valves 93b and 95b are closed. Therefore, the first chemical solution captured in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0426] As Figure 32B shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the cleaning liquid scattered as the substrate W rotates.

[0427] In the liquid discharge mechanism 90, the valve 92b is kept open, and the valves 93b and 95b are closed. Therefore, the cleaning liquid captured in the first cup 81 flows through the pipe 91a and the pipe 92a and is discharged.

[0428] As Figure 32C shown, a second chemical solution is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are processed with the second chemical solution. The second chemical solution supply unit 30b supplies the second chemical solution to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 supplies the second chemical solution to the back surface Wb of the rotating substrate W. Here, the first cup 81 captures the second chemical solution scattered as the substrate W rotates.

[0429] Here, the first cup 81 moves from the upper position to the lower position, and the second cup 82 and the third cup 83 are both located in the upper position. Therefore, the second cup 82 faces the side portion of the substrate W. The second cup 82 captures the second chemical solution scattered as the substrate W rotates.

[0430] In the liquid discharge mechanism 90, the valve 93b is opened, and on the other hand, the valves 92b and 95b are closed. Therefore, the second liquid medicine collected in the second cup 82 flows through the pipe 91b and the pipe 93a and is discharged.

[0431] As Figure 33A shown, a cleaning liquid is supplied to the front surface Wa and the back surface Wb of the substrate W, and the front surface Wa and the back surface Wb of the substrate W are treated with the cleaning liquid. The cleaning liquid supply unit 40 supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the cleaning liquid to the back surface Wb of the rotating substrate W. Here, the second cup 82 captures the cleaning liquid scattered as the substrate W rotates.

[0432] In the liquid discharge mechanism 90, the valve 93b is kept open and the valves 92b and 95b are closed. Therefore, the cleaning liquid captured in the second cup 82 flows through the pipe 91b and the pipe 93a and is discharged.

[0433] As Figure 33B shown, a cleaning liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the cleaning liquid, and a recovery liquid is supplied to the back surface Wb of the substrate W, and the back surface Wb of the substrate W is treated with the recovery liquid. The cleaning liquid supply unit 40 continuously supplies the cleaning liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 supplies the recovery liquid to the back surface Wb of the substrate W.

[0434] In the liquid discharge mechanism 90, the valve 93b is kept open and the valves 92b and 95b are closed. Therefore, the cleaning liquid and the recovery liquid captured in the second cup 82 flow through the pipe 91b and the pipe 93a and are discharged.

[0435] As Figure 33C shown, a processing liquid is supplied to the front surface Wa of the substrate W, and the front surface Wa of the substrate W is treated with the processing liquid. The shielding member 60 supplies the processing liquid to the front surface Wa of the rotating substrate W. The back surface treatment liquid supply unit 50 stops supplying the processing liquid to the back surface Wb of the substrate W.

[0436] Here, the second cup 82 moves from the upper position to the lower position, and the third cup 83 is located at the upper position. Therefore, the third cup 83 faces the side portion of the substrate W. The third cup 83 captures the processing liquid scattered as the substrate W rotates.

[0437] In the liquid discharge mechanism 90, the valve 95b is opened and the valves 92b and 93b are closed. Therefore, the processing liquid captured in the third cup 83 flows through the pipe 91c and the pipe 95a and is discharged.

[0438] As Figure 34As shown, an inert gas is supplied to the front surface Wa of the substrate W to blow away the processing liquid on the front surface Wa of the substrate W. The shielding member 60 supplies an inert gas to the front surface Wa of the rotating substrate W. The back surface processing liquid supply unit 50 maintains a state of stopping the supply of the processing liquid to the back surface Wb of the substrate W. At this time, the substrate holding unit 20 may also increase the rotation speed of the substrate W.

[0439] Here, the third cup 83 remains in the upper position. The third cup 83 traps the processing liquid scattered as the substrate W rotates.

[0440] In the drainage mechanism 90, the holding valve 95b is kept open and the valves 92b and 93b are closed. Therefore, the processing liquid trapped in the third cup 83 flows through the pipe 91c and the pipe 95a and is discharged.

[0441] After that, the shielding member 60 stops supplying the inert gas, and the substrate holding unit 20 stops the rotation of the substrate W. In this way, the substrate W is dried. After that, the substrate W is taken out of the chamber 11.

[0442] The substrate processing apparatus 100 of the present embodiment alternately processes the front surface Wa of the substrate W with the first chemical solution, the second chemical solution, and the cleaning solution. According to the present embodiment, during at least a part of the period of supplying the cleaning solution to the front surface Wa of the substrate W, a recovery solution is supplied to the back surface Wb of the substrate W. Therefore, with the substrate processing apparatus 100 of the present embodiment, the usage amount of the new processing liquid can be reduced.

[0443] As described above, embodiments of the present invention have been described with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and can be implemented in various ways without departing from the gist thereof. In addition, by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments, various inventions can be formed. For example, several constituent elements may be deleted from all the constituent elements shown in the embodiments. Moreover, constituent elements in different embodiments may be appropriately combined. The drawings schematically show each constituent element for easy understanding, and the thickness, length, number, interval, etc. of each constituent element shown in the drawings may be different from the actual ones for the convenience of making the drawings. In addition, the materials, shapes, sizes, etc. of the constituent elements shown in the above-described embodiments are examples and are not particularly limited, and various changes can be made without substantially departing from the effects of the present invention.

[0444] In addition, in the substrate processing apparatus 100, the front surface Wa of the substrate W faces vertically upward and the back surface Wb of the substrate W faces vertically downward, but the present embodiment is not limited thereto. The front surface Wa of the substrate W may face vertically downward and the back surface Wb of the substrate W may face vertically upward. In this case, the recovery solution is supplied to the back surface Wb of the substrate W facing vertically upward.

[0445] In addition, Figure 1In the substrate processing apparatus 100 shown, the recovered liquid storage tank 210 is disposed in the processing liquid tank 110, but the present embodiment is not limited thereto. The recovered liquid storage tank 210 may also be disposed in a place different from the processing liquid tank 110. For example, the recovered liquid storage tank 210 may also be disposed in the processing liquid cassette 120. Alternatively, the recovered liquid storage tank 210 may also be disposed in the chamber 11.

[0446] Although the embodiments of the present invention have been described in detail, these are merely specific examples for clarifying the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The scope of the present invention is defined only by the appended claims.

Claims

1. A substrate processing apparatus includes: a chamber that houses a substrate having a front surface on which devices are provided and a back surface opposite to the front surface; a substrate holding unit that holds the substrate in the chamber; a chemical solution supply unit that supplies a chemical solution to the front surface of the substrate held by the substrate holding unit; a cleaning solution supply unit that supplies a cleaning solution to the front surface of the substrate held by the substrate holding unit; a recovered solution storage tank that stores a recovered solution of the recovered liquid; and a back surface treatment solution supply unit that supplies the recovered solution stored in the recovered solution storage tank to the back surface of the substrate.

2. The substrate processing apparatus according to claim 1 further includes a control unit that determines whether to recover the liquid into the recovered solution storage tank.

3. The substrate processing apparatus according to claim 2 further includes: a storage tank that stores a liquid; a heater that heats the liquid flowing from the storage tank; and a temperature measurement unit that measures the temperature of the liquid heated by the heater; and the control unit determines whether to recover the liquid heated by the heater into the recovered solution storage tank based on the temperature measured by the temperature measurement unit.

4. The substrate processing apparatus according to claim 2 further includes: an ozone gas generator that generates ozone gas; an ozone gas dissolution tank that dissolves the ozone gas generated by the ozone gas generator in a liquid to generate an ozone solution; and a concentration measurement unit that measures the ozone concentration of the ozone solution generated in the ozone gas dissolution tank; and the control unit determines whether to recover the ozone solution generated in the ozone gas dissolution tank into the recovered solution storage tank based on the ozone concentration measured by the concentration measurement unit.

5. The substrate processing apparatus according to claim 1 or 2, wherein the chemical solution supply unit includes a chemical solution storage tank that stores the chemical solution, and the recovered solution storage tank stores at least a part of the cleaning solution for cleaning the chemical solution storage tank as the recovered solution.

6. The substrate processing apparatus according to claim 1 or 2 further includes: a cup that captures the processing solution scattered from the substrate held by the substrate holding unit; a drain pipe that connects the cup to the recovered solution storage tank; and a chamber cleaning pipe that is disposed in the chamber and sprays a cleaning solution for cleaning the inside of the chamber; and the recovered solution storage tank stores at least a part of the cleaning solution sprayed from the chamber cleaning pipe as the recovered solution.

7. The substrate processing apparatus according to claim 1 or 2, wherein the cleaning solution supply unit has: a cleaning solution pipe through which the cleaning solution flows; and a valve that is provided in the cleaning solution pipe and adjusts the flow rate of the cleaning solution flowing through the cleaning solution pipe; and the substrate processing apparatus further includes: a branch pipe that is connected to the cleaning solution pipe upstream of the valve in the cleaning solution pipe and through which the cleaning solution also flows when the valve is closed; and the recovered solution storage tank stores the cleaning solution flowing through the branch pipe as the recovered solution.

8. A substrate processing method includes the following steps: Supply a liquid medicine to the front side of a substrate, where the substrate has a front side on which devices are provided and a back side opposite to the front side; After supplying the liquid medicine to the front side of the substrate, supply a cleaning liquid to the front side of the substrate; and Supply the recovered liquid to the back side of the substrate from a recovered liquid storage tank that stores and recovers the liquid.

9. The substrate processing method according to claim 8 further includes a step of determining whether to recover the liquid to the recovered liquid storage tank.

10. The substrate processing method according to claim 9 further includes the following steps: heating the liquid flowing from a storage tank that stores the liquid; and Measuring the temperature of the heated liquid; and The determination step determines whether to recover the heated liquid to the recovered liquid storage tank based on the measured temperature.

11. The substrate processing method according to claim 9 further includes the following steps: dissolving ozone gas in a liquid to generate an ozone liquid; and Measuring the ozone concentration of the generated ozone liquid; and The determination step determines whether to recover the generated ozone liquid to the recovered liquid storage tank based on the measured ozone concentration.

12. The substrate processing method according to claim 8 or 9 further includes the following step: supplying at least a part of the cleaning liquid for cleaning a liquid medicine storage tank that stores the liquid medicine as the recovered liquid to the recovered liquid storage tank.

13. The substrate processing method according to claim 8 or 9 further includes the following steps: spraying a cleaning liquid into a chamber for processing the substrate to clean the chamber; and Supplying at least a part of the cleaning liquid sprayed into the chamber as the recovered liquid to the recovered liquid storage tank.

14. The substrate processing method according to claim 8 or 9 further includes the following step: closing a valve provided in a cleaning liquid pipe through which the cleaning liquid flows, connecting a branch pipe to the cleaning liquid pipe at a position upstream of the valve in the cleaning liquid pipe, flowing the cleaning liquid, and supplying the cleaning liquid flowing in the branch pipe as the recovered liquid to the recovered liquid storage tank.

Images