Wafer detection positioning method and device, medium and product

Abstract

The invention provides a wafer detection positioning method and device, a medium and a product. The wafer detecting and positioning method comprises the following steps: receiving coordinates of a target position of a to-be-detected wafer in a preset coordinate system, wherein an image of the target position needs to be shot; coordinates of the target position in a preset coordinate system are corrected according to a pre-established target point data set, the target point data set comprises multiple target point data, and the target point data comprises coordinates and offset of target points in the preset coordinate system; and outputting the corrected coordinates of the target position so as to shoot the wafer to be detected according to the corrected coordinates of the target position. The coordinate of the target position in the preset coordinate system is corrected according to the coordinate deviation condition recorded by the target point data set, and the shooting position is positioned according to the corrected coordinate of the target position, so that the positioning accuracy is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor detection, and particularly to a wafer detection and positioning method, device, medium and product. Background Art

[0002] In the process of semiconductor manufacturing, defect detection of wafers is a very important step. In the prior art, generally, an image formed by electrons reflected from the surface of a wafer is obtained through a scanning electron microscope to detect the defects of the wafer. In order to obtain images of different grains on the wafer, that is, different target positions, during the detection process, it is necessary to move across grains according to the specific target position, so that the scanning electron microscope is aligned with the target position to obtain an image of the target position. However, due to the non-linear error caused by machine defects, the situation where the actually located position is inconsistent with the target position may occur, resulting in the inability to obtain an image of the target position, and thus the next operation cannot be carried out, affecting the detection efficiency. Summary of the Invention

[0003] An object of the present invention is to provide a wafer detection and positioning method, device, medium and product that helps to improve the positioning accuracy during wafer detection.

[0004] Specifically, the present invention provides a wafer detection and positioning method, including:

[0005] Receiving the coordinates of the target position where the image of the wafer to be detected needs to be taken in a preset coordinate system;

[0006] Correcting the coordinates of the target position in the preset coordinate system according to a pre-built set of fiducial point data, the set of fiducial point data includes a plurality of fiducial point data, and the fiducial point data includes the coordinates of the fiducial point in the preset coordinate system and the offset;

[0007] Outputting the corrected coordinates of the target position, so as to take the image of the wafer to be detected according to the corrected coordinates of the target position.

[0008] Optionally, the construction process of the set of fiducial point data includes:

[0009] Obtaining a reference image obtained by a scanning electron microscope photographing a reference unit of a test wafer, and recording the photographing position of the reference unit, the test wafer is pre-divided into a plurality of identical units, and the reference unit is one of them;

[0010] Obtain the comparison images obtained by the scanning electron microscope taking pictures of the comparison units of the test wafer respectively. The comparison units are other units of the test wafer except the reference unit, and the scanning electron microscope is configured to be consistent with the shooting position at the reference unit at the set shooting position of each comparison unit. Denote the set shooting position of each comparison unit as the target point;

[0011] Calculate the offset of the actual shooting position of each comparison unit from the set shooting position respectively according to the deviation between each comparison image and the reference image;

[0012] Record the coordinates of each target point in the preset coordinate system and the corresponding offset to obtain the initial target point data set;

[0013] Construct the target point data set finally applied according to the initial target point data set.

[0014] Optionally, the step of correcting the coordinates of the target position in the preset coordinate system according to the pre-constructed target point data set includes:

[0015] Calculate the compensation amount of the coordinates of the target position according to the preset method according to the target point data set;

[0016] Compensate and correct the coordinates of the target position according to the compensation amount, so as to obtain the corrected coordinates of the target position.

[0017] Optionally, the step of calculating the compensation amount of the coordinates of the target position according to the preset method according to the target point data set includes:

[0018] Find the preset number of target points in the target point data set that are closest to the target position;

[0019] Take the average value of the offsets corresponding to all the found target points, and use the average value as the compensation amount.

[0020] Optionally, the step of taking the average value of the offsets corresponding to all the found target points includes:

[0021] Perform weighted average calculation with the distance between the target point and the target position as the weight to obtain the average value.

[0022] Optionally, the step of correcting the coordinates of the target position in the preset coordinate system according to the pre-constructed target point data set includes:

[0023] Substitute the coordinates of the target position into a preset fitting relation formula to calculate the coordinates of the corrected target position, where the fitting relation formula is generated by fitting the coordinates of the target points in the target point dataset and the coordinates corrected by the corresponding offset amounts.

[0024] Optionally, the step of constructing the target point dataset for final application according to the initial target point dataset includes:

[0025] Obtain a control target point dataset of the test wafer rotated at a preset angle;

[0026] Merge the initial target point dataset and the control target point dataset to obtain the target point dataset for final application.

[0027] According to another aspect of the present invention, there is also provided a computer device, including a memory, a processor, and a computer executable program stored on the memory and running on the processor, and when the processor executes the computer executable program, it implements the wafer detection and positioning method according to any one of the above.

[0028] According to another aspect of the present invention, there is also provided a computer-readable storage medium, on which a computer executable program is stored, and when the computer executable program is executed by a processor, it implements the wafer detection and positioning method according to any one of the above.

[0029] According to another aspect of the present invention, there is also provided a computer program product, including a computer executable program, and when the computer executable program is executed by a processor, it implements the wafer detection and positioning method according to any one of the above.

[0030] The wafer detection and positioning method, device, medium and product of the present invention receive the coordinates of the target position of the wafer to be detected in the preset coordinate system for the image to be taken, correct the coordinates of the target position in the preset coordinate system according to the pre-established target point data set, and output the coordinates of the corrected target position, so as to take the image of the wafer to be detected according to the coordinates of the corrected target position. The target point data set records the coordinates of multiple target points in the preset coordinate system and the corresponding offsets. That is to say, the data in the target point data set reflects the coordinates of multiple positions in the preset coordinate system and the offsets generated during positioning due to machine errors at the corresponding positions. Therefore, the coordinates of the target position in the preset coordinate system can be corrected according to the coordinate offset situation recorded in the target point data set, and the shooting position is located according to the coordinates of the corrected target position, which helps to improve the positioning accuracy and effectively avoid the situation that the positioning is inaccurate due to machine errors and the image cannot be obtained, and further helps to ensure a high detection efficiency. In addition, the target point data set can be applied to wafers of different sizes after construction, improving the application universality.

[0031] From the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more apparent about the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Some specific embodiments of the present invention will be described in detail hereinafter with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0033] Figure 1 is a schematic flowchart of a wafer detection and positioning method according to an embodiment of the present invention;

[0034] Figure 2 is a schematic flowchart of the process of constructing the target point data set in the wafer detection and positioning method according to an embodiment of the present invention;

[0035] Figure 3 is a schematic flowchart of the step of constructing the finally applied target point data set according to the initial target point data set in the wafer detection and positioning method according to an embodiment of the present invention;

[0036] Figure 4 is a schematic flowchart of a wafer detection and positioning method according to another embodiment of the present invention;

[0037] Figure 5 is a schematic flowchart of the step of calculating the compensation amount of the coordinates of the target position according to the target point data set in a preset manner in the wafer detection and positioning method according to another embodiment of the present invention;

[0038] Figure 6 is a schematic flowchart of a wafer detection and positioning method according to another embodiment of the present invention;

[0039] Figure 7 is a schematic diagram of a computer device according to an embodiment of the present invention;

[0040] Figure 8 is a schematic diagram of a computer-readable storage medium according to an embodiment of the present invention;

[0041] Figure 9 is a schematic diagram of a computer program product according to an embodiment of the present invention. Detailed implementation manners

[0042] Those skilled in the art should understand that the embodiments described below are only a part of the embodiments of the present invention, rather than all embodiments of the present invention. This part of the embodiments is intended to explain the technical principles of the present invention, rather than to limit the protection scope of the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should still fall within the protection scope of the present invention.

[0043] It should be noted that the logic and / or steps represented in the flowchart or described in other ways herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch instructions from the instruction execution system, apparatus, or device and execute the instructions), or in combination with these instruction execution systems, apparatus, or devices.

[0044] The flowchart provided in this embodiment is not intended to indicate that the operations of the method will be executed in any specific order, or that all operations of the method are included in all cases. In addition, the method may include additional operations. Within the scope of the technical idea provided by the method in this embodiment, additional changes can be made to the above method.

[0045] As Figure 1 shown, in one embodiment, the wafer detection and positioning method generally includes:

[0046] Step S101: Receive the coordinates of the target position on the wafer to be detected where an image needs to be taken in a preset coordinate system. The preset coordinate system covers the placement area of the wafer to be detected on the wafer detection device. Specifically, the placement area is the area where the wafer detection device performs detection work on the wafer to be detected. The preset coordinate system covers the placement area, so that as long as the wafer to be detected is within the placement area, any position on the wafer to be detected has a corresponding coordinate in the preset coordinate system. In this step, a coordinate is received, which is the coordinate of the target position on the wafer to be detected where an image needs to be taken in the preset coordinate system.

[0047] Step S102: Correct the coordinates of the target position in the preset coordinate system according to a pre-established target point data set. The target point data set includes multiple target point data. The target point data includes the coordinates of the target point in the preset coordinate system and the offset. Specifically, due to various machine defects that may exist in the wafer detection device, such as insufficient flatness of the long scale mirror surface, etc., if the shooting position of the wafer to be detected is directly positioned according to the received coordinates of the target position, the actual positioned shooting position may be inconsistent with the required target position due to the error caused by the machine defect, that is, there is a deviation between the coordinates of the actual shooting position and the coordinates of the required target position. The generated coordinate deviation is the offset. The pre-established target point data set contains the coordinates of multiple target points in the preset coordinate system and the offset, that is, it reflects the positioning offset situations of multiple positions of the wafer detection device in the preset coordinate system due to machine defects. Therefore, the offset of the target position can be deduced based on the offset of the target points near the target position, and then the coordinates of the target position can be corrected according to the deduced offset to improve the positioning accuracy.

[0048] Refer to Figure 2 As shown, specifically, the construction process of the target point data set includes:

[0049] Step S201: Obtain a reference image taken by a scanning electron microscope of a reference unit on a test wafer, and record the shooting position of the reference unit. The test wafer is pre-divided into multiple identical units, and the reference unit is one of them.

[0050] Specifically, the test wafer can be a wafer with divided grains, and multiple grains are the multiple units divided from the test wafer. Or, the test wafer can also be a bare wafer, that is, a light sheet, and multiple units can be divided by charring on the light sheet.

[0051] For ease of explanation, in the following text, a test wafer divided into multiple dies is taken as an example, that is, one of the dies is used as a reference unit. Obtain a reference image captured by a scanning electron microscope for the reference unit and record the capture position on the reference unit. Specifically, a coordinate system can be established with a certain point within the reference unit area as the coordinate origin, so that each point on the reference unit has a corresponding coordinate in the above coordinate system, thereby recording the capture position of the scanning electron microscope on the reference unit by recording the coordinates. For example, a coordinate system can be established with the center point of the die serving as the reference unit as the origin, or a coordinate system can be established with one of the corner points of the die serving as the reference unit as the origin, and so on. Therefore, recording the capture position of the scanning electron microscope on the reference unit is to record the coordinates of the capture position in the coordinate system of the reference unit itself.

[0052] Step S202, obtain comparison images captured by a scanning electron microscope for the comparison units of the test wafer respectively. The comparison units are other units of the test wafer except the reference unit, and the set capture position of the scanning electron microscope for each comparison unit is configured to be the same as the capture position on the reference unit, and record the set capture position of each comparison unit as a target point.

[0053] That is to say, the capture position where the scanning electron microscope obtains the comparison image for the comparison unit is set to be the same as the capture position where the reference image is obtained for the reference unit. For example, if the center point of the reference unit is the capture position of the reference image, then the set capture position of each comparison unit is also the center point of the corresponding comparison unit.

[0054] Exemplarily, in the way of establishing a coordinate system with a certain point within the reference unit area as the coordinate origin and recording the capture position of the scanning electron microscope on the reference unit by recording the coordinates, each comparison unit also establishes a coordinate system with the same position within its own area as the coordinate origin. In this way, by making the coordinates of the set capture position of each comparison unit in its own coordinate system the same as the coordinates of the capture position of the reference image in the coordinate system of the reference unit, it can be ensured that the set capture position of the scanning electron microscope for each comparison unit is configured to be the same as the capture position on the reference unit.

[0055] For example, if the die serving as the reference unit establishes a coordinate system with its own lower left corner point as the coordinate origin, each die serving as a comparison unit also needs to establish a coordinate system with its own lower left corner point as the coordinate origin. On this basis, if the capture position of the reference image is the center of the reference unit and the coordinates of the capture position in the coordinate system of the reference unit are (a, a), then the set capture position of the comparison unit is also the center of each, and the coordinates in their respective coordinate systems are also (a, a). In other words, the position of the set capture position of each comparison unit relative to the origin of its own coordinate system is also the same as the position of the capture position of the reference image relative to the origin of the coordinate system of the reference unit.

[0056] This step is to obtain the comparison images obtained by the scanning electron microscope by taking pictures of each comparison unit at the set shooting positions of each comparison unit respectively.

[0057] Step S203: Calculate the offset of the actual shooting position and the set shooting position of each comparison unit respectively according to the deviation between each comparison image and the reference image.

[0058] Specifically, when there are no defects in the test wafer itself, the images taken at the same positions of each die should be exactly the same without deviation, that is, the reference image should be exactly the same as the comparison image. However, as mentioned above, due to the possible errors caused by machine defects, the actual located shooting position may be inconsistent with the required shooting position. That is to say, when taking the comparison image of the comparison unit, it should have been located at the set shooting position, but due to the existence of machine errors, it may not be accurately located at the set shooting position, that is, the actual shooting position is offset relative to the set shooting position, resulting in a deviation between the comparison image and the reference image.

[0059] Therefore, in this step, it is necessary to calculate the offset of the actual shooting position and the set shooting position of each comparison unit respectively according to the deviation between each comparison image and the reference image, that is, the offset of the coordinates of the actual shooting position of each comparison unit in the preset coordinate system and the coordinates of the set shooting position in the preset coordinate system.

[0060] It should be noted that the method of calculating the offset according to the deviation between two images is a prior art and will not be elaborated here.

[0061] Step S204: Record the coordinates of each target point in the preset coordinate system and the corresponding offset to obtain the initial target point data set. Specifically, that is to record the coordinates of the set shooting position of each comparison unit in the preset coordinate system and the corresponding offset to obtain the initial target point data set recording multiple target point data, and each target point data includes the coordinates and offset of the target point.

[0062] Step S205: Construct the target point data set for final application according to the initial target point data set.

[0063] Specifically, in one implementation manner, the initial target point data set can be directly used as the target point data set for final application.

[0064] Refer to Figure 3 As shown, in another implementation manner, this step includes:

[0065] Step S301: Obtain the control target point data set of the test wafer after rotation at a preset angle. Specifically, that is, after rotating the test wafer at a preset angle and reloading the wafer, multiple target point data are obtained according to steps S201 to S203, which constitutes the control target point data set.

[0066] Step S302: Merge the initial target point data set and the control target point data set to obtain the finally applied target point data set. Specifically, the merging can be achieved by taking the average of the two offsets at the same position in the initial target point data set and the control target point data set.

[0067] By obtaining the control target point data set of the test wafer after rotation at a preset angle after obtaining the initial target point data set, and merging the initial target point data set and the control target point data set to obtain the finally applied target point data set, it helps to reduce the error influence caused by the defects of the test wafer itself, such as the uneven surface of the wafer, so that the machine error can be more accurately corrected using the target point data set.

[0068] It should be noted that in some other embodiments, it may also be to obtain the control target point data set of another test wafer, and then merge the initial target point data set and the control target point data set to obtain the finally applied target point data set, which can achieve the same effect.

[0069] Step S103: Output the coordinates of the corrected target position, and then capture an image of the wafer to be detected according to the coordinates of the corrected target position. Specifically, after correcting the coordinates of the target position in the preset coordinate system according to the pre-built target point data set, the coordinates of the corrected target position are obtained, and the coordinates of the corrected target position are output, so as to perform positioning and capture an image of the wafer to be detected according to the coordinates of the corrected target position.

[0070] In the solution of this embodiment, by receiving the coordinates of the target position of the wafer to be detected for taking an image in a preset coordinate system, correcting the coordinates of the target position in the preset coordinate system according to a pre-built target point data set, and outputting the coordinates of the corrected target position, so as to take an image of the wafer to be detected according to the coordinates of the corrected target position. The target point data set records the coordinates of multiple target points in the preset coordinate system and the corresponding offsets. That is to say, the data in the target point data set reflects the coordinates of multiple positions in the preset coordinate system and the offsets generated during positioning due to machine errors at the corresponding positions. Therefore, it is possible to correct the coordinates of the target position in the preset coordinate system according to the coordinate offset situation recorded in the target point data set, and position the shooting position according to the coordinates of the corrected target position, which helps to improve the positioning accuracy, effectively avoid the situation that the positioning is inaccurate due to machine errors and the image cannot be obtained, and further helps to ensure a high detection efficiency. In addition, the target point data set can be applied to wafers of different sizes after construction, improving the application universality.

[0071] As Figure 4 shown, in one embodiment, the steps of correcting the coordinates of the target position in the preset coordinate system according to the pre-built target point data set include: calculating the compensation amount of the coordinates of the target position according to the target point data set in a preset manner; compensating and correcting the coordinates of the target position according to the compensation amount, so as to obtain the coordinates of the corrected target position.

[0072] Referring to Figure 4 shown, specifically, the wafer detection and positioning method of this embodiment generally includes:

[0073] Step S401, receiving the coordinates of the target position of the wafer to be detected for taking an image in a preset coordinate system, and the preset coordinate system covers the placement area of the wafer to be detected.

[0074] Step S402, calculating the compensation amount of the coordinates of the target position according to the target point data set in a preset manner.

[0075] Referring to Figure 5 shown, in one implementation, this step includes:

[0076] Step S501, finding a preset number of target points closest to the target position from the target point data set. Specifically, a preset number of target points closest to the target position can be found from the target point data set according to the Euclidean distance between the target points and the target position. The preset number is greater than or equal to 2.

[0077] Step S502: Take the average of the offsets corresponding to all the target points found, and use the average value as the compensation amount. Specifically, in this step, it can be directly taking the average value, or calculating the weighted average according to the distances between the target points and the target position as weights to obtain the average value. Exemplarily, take three target points, and the distances between the three target points and the target position are a, b, and c respectively, then the weights can be a / (a + b + c), b / (a + b + c), and c / (a + b + c). It should be noted that other ways known to those skilled in the art can also be used to calculate the weight coefficients according to the distances.

[0078] Alternatively, in some other embodiments, it is also possible to directly find a target point closest to the target position, and use the offset corresponding to the target point closest to the target position as the compensation amount.

[0079] Step S403: Compensate and correct the coordinates of the target position according to the compensation amount, so as to obtain the corrected coordinates of the target position. Specifically, that is to compensate the compensation amount into the coordinates of the target position.

[0080] Step S404: Output the corrected coordinates of the target position, and thus capture an image of the wafer to be detected according to the corrected coordinates of the target position.

[0081] In the solution of this embodiment, by calculating the compensation amount of the coordinates of the target position according to the preset method based on the target point data set each time after receiving the coordinates of the target position, it helps to make the compensation amount obtained each time more in line with the actual situation of the target position at that time. Compared with using the fitting formula for calculation, it helps to reduce the problem that the correction of some positions is not accurate enough caused by a large degree of data dispersion.

[0082] In addition, by finding a preset number of target points closest to the target position from the target point data set, taking the average of the offsets corresponding to all the target points found, and using the average value as the compensation amount, that is, it is possible to calculate the compensation amount of the coordinates of the target position by comprehensively considering the offsets of multiple target points, which helps to improve the accuracy of the calculated compensation amount.

[0083] It should be noted that the steps with the same name in this embodiment refer to those described above.

[0084] As Figure 6 shown, in one embodiment, the steps of correcting the coordinates of the target position in the preset coordinate system according to the pre-built target point data set include: substituting the coordinates of the target position into the preset fitting relationship formula to calculate the corrected coordinates of the target position, and the fitting relationship formula is generated by fitting the coordinates of the target points in the target point data set and the coordinates corrected by the corresponding offsets.

[0085] Refer toFigure 6 As shown, specifically, the wafer detection and positioning method of this embodiment generally includes:

[0086] Step S601: Receive the coordinates of the target position where the image of the wafer to be detected needs to be captured in a preset coordinate system, and the preset coordinate system covers the placement area of the wafer to be detected.

[0087] Step S602: Substitute the coordinates of the target position into the preset fitting relationship formula to calculate the coordinates of the corrected target position. The fitting relationship formula is generated by fitting the coordinates of the target points in the target point dataset and the coordinates corrected by the corresponding offset amounts. Specifically, that is, after obtaining the target point dataset, after correcting the coordinates of each target point by the corresponding offset amount, the corrected coordinates of each target point can be obtained. In this way, multiple groups of corresponding coordinates before trimming and after correction can be obtained, and thus a general fitting relationship formula for the coordinates before trimming and after correction can be fitted according to multiple groups of corresponding coordinates before trimming and after correction.

[0088] After obtaining the fitting relationship formula, after receiving the coordinates of the target position, that is, obtaining the coordinates before correction, directly substituting them into the fitting relationship formula can calculate the coordinates after correction.

[0089] Step S603: Output the coordinates of the corrected target position, and thus capture the image of the wafer to be detected according to the coordinates of the corrected target position.

[0090] In the solution of this embodiment, by constructing a fitting relationship formula, after receiving the coordinates of the target position, directly substituting the coordinates of the target position into the preset fitting relationship formula can calculate the coordinates of the corrected target position, which helps to improve the coordinate correction efficiency and thus helps to improve the detection efficiency.

[0091] It should be noted that the steps with the same name in this embodiment refer to the foregoing description.

[0092] In one embodiment, a computer device and a computer-readable storage medium are also provided. Figure 7 It is a schematic diagram of a computer device 10 according to an embodiment of the present invention. Figure 8 It is a schematic diagram of a computer-readable storage medium 20 according to an embodiment of the present invention.

[0093] The computer device 10 may include a memory 110, a processor 120, and a computer executable program 11 stored on the memory 110 and running on the processor 120, and when the processor 120 executes the computer executable program 11, it implements the wafer detection and positioning method of any of the foregoing embodiments.

[0094] A computer-readable storage medium 20 stores a computer-executable program 11, and when the computer-executable program 11 is executed by a processor, the wafer detection and positioning method of any of the above embodiments is implemented.

[0095] This embodiment also provides a computer program product. Figure 9 It is a schematic diagram of a computer program product 30 according to an embodiment of the present invention. The computer program product 30 includes a computer-executable program 11, and when the computer-executable program 11 is executed by a processor 120, any of the wafer detection and positioning methods described above is implemented.

[0096] Specifically, the computer-executable program 11 for performing the operations of the present invention can be assembly instructions, instruction set architecture (ISA) instructions, computer instructions, computer-related instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages.

[0097] For the description of this embodiment, the computer-readable storage medium 20 can be any device that can contain, store, communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of the computer-readable medium include the following: an electrical connection part (electronic device) having one or more wirings, a portable computer disk cartridge (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable storage medium 20 can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other appropriate processing as necessary, and then stored in a computer memory.

[0098] It should be understood that various parts of the present invention can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system.

[0099] The computer device 10 can be, for example, a server, a desktop computer, a laptop computer, a tablet computer, or a smart phone. In some examples, the computer device 10 can be a cloud acquisition node. The computer device 10 can be described in the general context of computer system executable instructions (such as program modules) executed by a computer system. Generally, program modules can include routines, programs, target programs, components, logics, data structures, etc. that perform specific tasks or implement specific abstract data types. The computer device 10 can be implemented in a distributed cloud acquisition environment where tasks are executed by remote processing devices linked through a communication network. In the distributed cloud acquisition environment, program modules can be located on local or remote acquisition system storage media including storage devices.

[0100] The computer device 10 can include a processor 120 adapted to execute stored instructions and a memory 110 that provides temporary storage space for the operation of the instructions during operation. The processor 120 can be a single-core processor, a multi-core processor, an acquisition cluster, or any number of other configurations. The memory 110 can include random access memory (RAM), read-only memory, flash memory, or any other suitable storage system.

[0101] The processor 120 can be connected through a system interconnect (such as PCI, PCI-Express, etc.) to an I / O interface (input / output interface) adapted to connect the computer device 10 to one or more I / O devices (input / output devices). The I / O devices can include, for example, a keyboard and a pointing device, where the pointing device can include a touchpad or a touch screen, etc. The I / O devices can be built-in components of the computer device 10 or can be devices externally connected to the acquisition device.

[0102] The processor 120 can also be linked through a system interconnect to a display interface adapted to connect the computer device 10 to a display device. The display device can include a display screen as a built-in component of the computer device 10. The display device can also include a computer monitor, a television, a projector, etc. externally connected to the computer device 10. In addition, a network interface controller (NIC) can be adapted to connect the computer device 10 to a network through a system interconnect. In some embodiments, the NIC can use any suitable interface or protocol (such as Internet Small Computer System Interface, etc.) to transmit data. The network can be a cellular network, a radio network, a wide area network (WAN), a local area network (LAN), or the Internet, etc. Remote devices can be connected to the computer device through the network.

[0103] At this point, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the disclosed content of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A wafer detection and positioning method, comprising: Receiving the coordinates of the target position where the image of the wafer to be detected needs to be captured in a preset coordinate system; Correcting the coordinates of the target position in the preset coordinate system according to a pre-established target point data set, the target point data set includes a plurality of target point data, and the target point data includes the coordinates of the target point in the preset coordinate system and the offset; Outputting the coordinates of the corrected target position, so as to capture the wafer to be detected according to the coordinates of the corrected target position.

2. The wafer detection and positioning method according to claim 1, wherein, The construction process of the target point data set includes: Obtaining a reference image captured by a scanning electron microscope for a reference unit of a test wafer, and recording the shooting position of the reference unit. The test wafer is pre-divided into a plurality of identical units, and the reference unit is one of them; Obtaining comparison images captured by the scanning electron microscope for each comparison unit of the test wafer respectively. The comparison unit is other units of the test wafer except the reference unit, and the scanning electron microscope is configured to be the same as the shooting position in the reference unit at the set shooting position of each comparison unit, and recording the set shooting position of each comparison unit as the target point; Calculating the offset of the actual shooting position of each comparison unit from the set shooting position respectively according to the deviation between each comparison image and the reference image; Recording the coordinates of each target point in the preset coordinate system and the corresponding offset to obtain an initial target point data set; Constructing the final target point data set for application according to the initial target point data set.

3. The wafer detection and positioning method according to claim 2, wherein, The step of correcting the coordinates of the target position in the preset coordinate system according to the pre-established target point data set includes: Calculating the compensation amount of the coordinates of the target position according to the target point data set in a preset manner; Compensating and correcting the coordinates of the target position according to the compensation amount, so as to obtain the coordinates of the corrected target position.

4. The wafer detection and positioning method according to claim 3, wherein, The step of calculating the compensation amount of the coordinates of the target position according to the target point data set in a preset manner includes: Searching for a preset number of target points in the target point data set that are closest to the target position; Taking the average value of the offsets corresponding to all the found target points, and taking the average value as the compensation amount.

5. The wafer detection and positioning method according to claim 4, wherein, The step of taking the average value of the offsets corresponding to all the found target points includes: Performing weighted average calculation according to the distance between the target point and the target position as the weight to obtain the average value.

6. The wafer detection and positioning method according to claim 2, wherein, The step of correcting the coordinates of the target position in the preset coordinate system according to the pre-established target point data set includes: Substitute the coordinates of the target position into a preset fitting relationship formula to calculate the coordinates of the corrected target position, where the fitting relationship formula is generated by fitting the coordinates of the target points in the target point dataset and the coordinates corrected by the corresponding offset amounts.

7. The wafer detection and positioning method according to claim 2, wherein the step of constructing the target point dataset finally applied according to the initial target point dataset includes: obtaining a control target point dataset of the test wafer rotated at a preset angle; merging the initial target point dataset and the control target point dataset to obtain the target point dataset finally applied.

8. A computer device, comprising a memory, a processor, and a computer executable program stored on the memory and running on the processor, and when the processor executes the computer executable program, the wafer detection and positioning method according to any one of claims 1 to 7 is implemented.

9. A computer-readable storage medium, on which a computer executable program is stored, and when the computer executable program is executed by a processor, the wafer detection and positioning method according to any one of claims 1 to 7 is implemented.

10. A computer program product, comprising a computer executable program, and when the computer executable program is executed by a processor, the wafer detection and positioning method according to any one of claims 1 to 7 is implemented.

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