Multi-chip integrated module, manufacturing method thereof and multi-chip integrated system

Abstract

The invention belongs to the technical field of electronic chip packaging, and provides a multi-chip integrated module, a manufacturing method thereof and a multi-chip integrated system, and the technical scheme is that the multi-chip integrated module comprises a bottom plate, at least one chip, a pin sleeve, a pin contact pin, epoxy resin and a plastic package mold; the upper surface of the bottom plate is provided with a chip designated position area and a needle sleeve designated position area. Chips to be laminated are placed in the specified position areas of the chips, and the chips are electrically connected or the chips are electrically connected with the bottom plate; a needle sleeve is welded in a specified position area of the needle sleeve; the plastic package mold comprises an upper mold and a lower mold, the lower mold is arranged at the bottom of the bottom plate, the upper mold is concave inwards to form a cavity, the bottom plate, the chip and the needle sleeve are contained in the cavity, epoxy resin is poured into the cavity after the plastic package mold is closed, and the plastic package mold is taken out after plastic package is completed; and the pin contact pin is connected with the plastic-packaged pin sleeve in an inserting manner. And compared with traditional glue pouring protection, the efficiency is higher, and the yield of finished products is higher.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic chip packaging, and particularly relates to a multi-chip integration module, a manufacturing method thereof, and a multi-chip integration system. Background Art

[0002] The statements in this part only provide background technical information related to the present invention and do not necessarily constitute prior art.

[0003] There are mainly two types of packaging methods for existing multi-chip integration modules: the first type is surface mount packaging, and the second type is pin-in-hole packaging. The surface mount packaging has the following problems: surface mount components are relatively small, especially for passive components, problems may occur due to equipment confusion; During potting applications, the connections may be damaged. Once through thermal cycling, the connections may be damaged, causing serious problems, and the yield of its finished products is relatively low; when the multi-chip integration module is pin-in-hole packaged, soft silicone is filled inside, and its airtightness and shock resistance are relatively average, suitable for ordinary normal temperature and humidity environments, but not applicable to complex environments such as humidity.

[0004] To solve this problem, the prior art has also proposed packaging methods, but the pin positions in the existing packaging methods are limited and cannot be adjusted arbitrarily. During the product design process, it may be necessary to adjust the arrangement position of the pins. The current packaging structure designs are all to avoid the design of the pin positions. If the pin positions need to be adjusted, the well-made packaging components need to be reprocessed, resulting in an extended verification delivery period, increased costs, and relatively large space occupation. Summary of the Invention

[0005] To solve at least one of the technical problems in the above background art, the first aspect of the present invention provides a multi-chip integration module, which has a more reliable protection effect and higher efficiency. Since the whole process uses machine equipment for operation, the yield of the finished products is also higher; it has strong shock resistance, and even when subjected to external forces, it will not damage its internal components. At the same time, it can effectively isolate the invasion of external air and moisture, enabling the module to work in a more complex environment.

[0006] To achieve the above object, the present invention adopts the following technical solutions: A multi-chip integration module includes a bottom plate, at least one chip, a pin sleeve and pin inserts, epoxy resin, and a plastic packaging mold; The upper surface of the bottom plate is provided with a chip designated position area and a pin sleeve designated position area; The chips to be bonded are placed in the chip designated position area, and the chips are electrically connected to each other or between the chips and the copper-ceramic substrate; a pin sleeve is welded in the pin sleeve designated position area; The plastic encapsulation mold includes an upper mold and a lower mold. The lower mold is disposed at the bottom of a bottom plate. The upper mold is concave to form a cavity, which accommodates the bottom plate, the chip, and the pin sleeve. After the plastic encapsulation mold is closed, epoxy resin is poured into the cavity. After the plastic encapsulation is completed, the plastic encapsulation mold is taken out; the pin insertion pins are inserted into the pin sleeve after the plastic encapsulation is completed.

[0007] As an implementation manner, a thin film is disposed between the top of the pin sleeve and the top of the cavity. After the plastic encapsulation mold is closed, the top of the pin sleeve, the thin film, and the top of the cavity of the upper mold are in contact.

[0008] As an implementation manner, the pin sleeves have the same height.

[0009] As an implementation manner, the chips are welded to each other or the chip and the copper-ceramic substrate are welded through bonding wires to form a path for transmitting electrical signals.

[0010] As an implementation manner, vacuum reflow soldering is used to combine the pin insertion pins and the pin sleeves.

[0011] As an implementation manner, the pin insertion pins are made of copper pins.

[0012] To solve the above problems, a second aspect of the present invention provides a manufacturing method for a multi-chip integrated module. Compared with the traditional potting protection, the protection effect of this invention is more reliable, and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0013] To achieve the above object, the present invention adopts the following technical solutions: A manufacturing method for a multi-chip integrated module includes the following steps: Divide a wafer into multiple bare chips; Print a predetermined shape on a specified position area of the bottom plate chip, and attach the bare chip to the surface of the printed solder paste; Electrically connect the chips to each other or the chip and the bottom plate; Weld the pin sleeves on the surface of the bottom plate; Use a plastic encapsulation mold to melt epoxy resin and pour it into the plastic encapsulation mold to coat the bottom plate, the chip, and the pin sleeve. After the plastic encapsulation is completed, take out the plastic encapsulation mold; Insert the pin insertion pins into the pin sleeves after the plastic encapsulation is completed.

[0014] To solve the above problems, a third aspect of the present invention provides a manufacturing method for a multi-chip integrated module. Compared with the traditional potting protection, the protection effect of this invention is more reliable, and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0015] To achieve the above object, the present invention adopts the following technical solutions: A manufacturing method of a multi-chip integrated module includes the following steps: Divide a wafer into multiple bare chips; Place solder pads at designated positions on the surface of a bottom plate, and attach the bare chips to the solder pads; Electrically connect between chips or between a chip and the bottom plate; Weld a needle sleeve on the surface of the bottom plate; Melt epoxy resin using a plastic encapsulation mold and pour it into the interior of the plastic encapsulation mold to cover the bottom plate, chips, and needle sleeve. After plastic encapsulation is completed, remove the plastic encapsulation mold; Insert and connect a pin and the needle sleeve after plastic encapsulation.

[0016] As an implementation manner, before melting epoxy resin and pouring it into the interior of the plastic encapsulation mold, use a plasma cleaner to clean the surface of the bottom plate.

[0017] To solve the above problems, a fourth aspect of the present invention provides a multi-chip integrated system, which can improve the reliability of products, enable them to be used in harsher environments, and improve the production efficiency of products.

[0018] To achieve the above object, the present invention adopts the following technical solutions: A multi-chip integrated system includes at least one multi-chip integrated module described in the first aspect.

[0019] Because a multi-chip integrated module provided in the first aspect of this application is adopted, its structure is the same as that of the first aspect, and details will not be described here.

[0020] The beneficial effects of the present invention are: 1. The present invention innovatively designs a multi-chip integrated module. The designed plastic encapsulation mold includes an upper mold and a lower mold. Through the cooperation of a needle seat and a thin film, overflow of glue is avoided, and normal function output can be achieved. The position of the inserted pin can be adjusted arbitrarily. It is not only applicable to one product, but also has strong versatility for encapsulating other products of the same size. It can quickly and efficiently complete the encapsulation of this type of module product and can achieve mass production. Compared with traditional potting protection, the protection effect of this invention is more reliable and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of finished products is also higher.

[0021] 2. The multi-chip integrated module of the present invention uses epoxy resin as a filling material inside. As a thermosetting material, after epoxy resin goes through three states of melting - cooling - curing, it will not melt again. Even when subjected to external forces, it will not damage the internal components. Its impact resistance is much higher than that of soft silicone filling; secondly, after epoxy resin melts, it is extruded into the module interior, combines with the internal components and the substrate and cures, which can effectively isolate the invasion of external air and moisture, enabling the module to work in a more complex environment.

[0022] Advantages of additional aspects of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings forming a part of this specification are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not unduly limit the present invention.

[0024] Figure 1 is a schematic diagram of the overall structure of a multi-chip integration module provided by an embodiment of the present invention; Figure 2 is a detailed structural diagram of the plastic encapsulation process of a multi-chip integration module provided by an embodiment of the present invention; Figure 3 is a schematic diagram of the die bonding result provided by an embodiment of the present invention; Figure 4 is a schematic diagram of the wire bonding result provided by an embodiment of the present invention; Figure 5 is a schematic diagram of the pin sleeve soldering provided by an embodiment of the present invention; Figure 6 is a schematic diagram of the plastic encapsulation result provided by an embodiment of the present invention; Figure 7 is a schematic diagram of the pin insertion result provided by an embodiment of the present invention; Description of the reference numerals: 1, bottom plate; 2, chip; 3, pin sleeve; 4, pin insertion; 5, epoxy resin; 6, plastic encapsulation mold, 601, upper mold, 602, lower mold; 7, film; 8, bonding wire. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present invention will be further described below in conjunction with the drawings and embodiments.

[0026] It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs.

[0027] It should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0028] In the present invention, terms such as "upper", "lower", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only relational terms determined for the convenience of describing the structural relationship of each component or element of the present invention, and do not specifically refer to any component or element in the present invention, and should not be construed as a limitation to the present invention.

[0029] In the present invention, terms such as "connected" and "coupled" should be understood in a broad sense, which may mean a fixed connection, an integral connection or a detachable connection; it may be directly connected or indirectly connected through an intermediate medium. For those skilled in relevant scientific research or technology in this field, the specific meanings of the above terms in the present invention can be determined according to specific circumstances, and should not be construed as a limitation to the present invention.

[0030] The multi-chip integration module provided by the present application can be applied in semiconductor circuits to realize functions such as AC-DC conversion and DC step-up / step-down power conversion. The multi-chip integration system can be applied to devices such as servo motors, frequency converters, and inverters.

[0031] As mentioned in the background art, the surface mount packaging and pin packaging of existing multi-chip integration modules have the problem of low finished product yield. The protection effect of the present invention is more reliable and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of finished products is also higher; in addition, for the problem that traditional multi-chip integration modules cannot work in complex environments, the multi-chip integration module of the present invention uses epoxy resin as a filling material inside. As a thermosetting material, after it goes through three states of melting - cooling - curing, it will not melt again. Even if it is subjected to external forces, it will not damage its internal components, and its impact resistance is much higher than that of soft silicone filling; secondly, after the epoxy resin melts, it is extruded into the module interior, combines with the internal components and the substrate and cures, which can effectively isolate the intrusion of external air and moisture, enabling the module to work in more complex environments.

[0032] Embodiment 1 As Figure 1 and Figure 2 shown, this embodiment provides a multi-chip integration module, which includes a bottom plate 1, at least one chip 2, a pin sleeve 3 and a pin 4, an epoxy resin 5 and a plastic encapsulation mold 6; Among them, the bottom plate 1 can be a copper frame, a PCB board, a ceramic substrate, a BT substrate, etc., which are plates that can carry chips and connect circuits. In this embodiment, a copper-clad ceramic substrate (DBC) is used, and the copper-clad ceramic substrate is used to carry the chip 2 and connect circuits; Among them, the chip 2 includes a power chip, a communication chip, a sensor chip, a power device or an integrated circuit, etc., which are core devices of the power module; The materials used to fix the chip include solder paste, solder sheet, glue, DAF, etc.; The welding wire 8 includes wire materials such as alloy wire, copper wire, copper strip, aluminum wire, aluminum strip, and gold wire that can connect the chip and the base plate to make their signals communicate.

[0033] The epoxy resin 5 is used to wrap the chip 2, circuit, etc., and its function is to protect the internal components.

[0034] The pin 4 and the bushing 3 are used to connect to the outside world to achieve signal transmission.

[0035] In addition to the above consumables, some molds, tooling fixtures, jigs, and a series of working tools used during the operation are also required, which are not described in detail one by one in this embodiment.

[0036] The upper surface of the base plate 1 is provided with a chip designated position area and a bushing designated position area; The to-be-bonded chip 2 is placed in the chip designated position area, and electrical connection is made between the chips 2 or between the chip 2 and the base plate 1; the bushing 3 is welded in the bushing designated position area; The plastic encapsulation mold 6 includes an upper mold 601 and a lower mold 602. The lower mold 602 is arranged at the bottom of the base plate 1. The upper mold is recessed to form a cavity, and the base plate 1, the chip 2, and the bushing 3 are accommodated in the cavity. After the plastic encapsulation mold 6 is closed, the epoxy resin 5 is poured into the cavity. After the plastic encapsulation is completed, the plastic encapsulation mold 6 is taken out; the pin 4 and the bushing 3 after plastic encapsulation are plugged together.

[0037] Specifically, the upper mold 601 and the lower mold 602 adopt flat molds; As a specific implementation manner, a thin film 7 is arranged between the top of the bushing and the top of the cavity. After the plastic encapsulation mold 6 is closed, the top of the bushing, the thin film 7, and the top of the cavity of the upper mold are in contact. Through the cooperation of the pin base and the thin film, glue overflow is avoided.

[0038] Among them, the heights of the bushings 3 are the same and kept flush.

[0039] Among them, the chips 2 are welded to each other or between the chip 2 and the base plate 1 through the welding wire 8 to form a path for conducting electrical signals.

[0040] In this embodiment, vacuum reflow soldering is used to combine the pin 4 and the bushing 3.

[0041] It can be understood that in this embodiment, the pin 4 is made of copper needle, and it can also be selected according to actual situations in other embodiments.

[0042] Through the above solution, the plastic-encapsulated mold designed in the present invention includes an upper mold and a lower mold. By cooperating the needle base with the thin film, glue overflow is avoided, and normal function output can be achieved. The position of the inserted pins can be adjusted arbitrarily. It is not only applicable to one product, but also to the encapsulation of other products of the same size. It has strong versatility, can complete the encapsulation of this type of module product quickly and efficiently, and can achieve mass production. Compared with the traditional potting protection, the protection effect of this invention is more reliable and the efficiency is higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0043] Embodiment 2 This embodiment provides a manufacturing method for a multi-chip integrated module, including the following steps: Step 1: Dicing, using a dicing machine to dice the wafer into single bare chips 2; Step 2: Chip mounting: Use solder paste for chip mounting. First, print a predetermined shape at the position on the bottom plate 1 where chip mounting is required, and then use a chip mounter to fix the single bare chip on the surface of the printed solder paste. Place the semi-finished product in a vacuum furnace for reflow soldering to firmly fix the chip on the bottom plate 1, and then perform cleaning, detection, etc.; as Figure 3 shown; Step 3: Bonding: Use bonding equipment to weld wires between chips or between a chip and the bottom plate 1 to make the circuit conductive and signals can be transmitted to each other; as Figure 4 shown.

[0044] Step 4: Sleeve welding: Use a soldering tool to weld the sleeve 3 to the designated position on the bottom plate 1, as Figure 5 shown.

[0045] Step 5: First, use a plasma cleaner to clean the semi-finished product to remove surface dirt, so that the epoxy resin 5 has better bonding with the semi-finished product. Then, use injection molding equipment and the plastic-encapsulated mold 6 to melt the epoxy resin and pour it into the interior of the plastic-encapsulated mold 6. After it cures, take it out and then put it into an oven for a post-curing process to eliminate internal stress and make it more stable and reliable, as Figure 6 shown.

[0046] Figure 2 The following shows the detailed structure diagram of the plastic encapsulation process: In this product, the heights of all sleeves 3 are kept flush. The lower mold 602 of the mold is a flat mold without other structures. The upper mold 601 is concave to form a cavity. There is a thin film 7 between the cavity and the sleeve. After the mold is closed, the sleeve 3, the thin film 7 and the upper cavity of the mold are closely attached. The thin film can not only play a certain sealing effect to prevent injection molding glue overflow, but also play a certain buffering role to prevent the mold from directly contacting the sleeve, damaging the product or the mold.

[0047] Step 6: Inserting pins: Use a pin insertion device to insert the pin 4 into the previously soldered pin socket 3 and perform reflow soldering using a vacuum furnace to tightly bond the pin 4 and the pin socket 3; as Figure 7 shown.

[0048] Through the above solution, the present invention can quickly and efficiently complete the encapsulation of this type of module product and can achieve mass production. Compared with traditional potting protection, the protection effect of this invention is more reliable and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0049] Embodiment 3 This embodiment provides a manufacturing method for a multi-chip integrated module, including the following steps: Step 1: Dicing, use a dicing machine to dice the wafer into single bare chips 2; Step 2: Chip mounting: Use solder pads for mounting. First, place the solder pads at the specified positions on the upper surface of the substrate, then attach the chip to the solder pads, and finally place the semi-finished product in a vacuum furnace for reflow soldering to firmly fix the chip. Finally, perform processes such as cleaning and detection; as Figure 3 shown.

[0050] Step 3: Bonding: Use a bonding device to weld wires between the chips or between the chip and the base plate 1 to make the circuit conductive and the signals can be transmitted to each other; as Figure 4 shown.

[0051] Step 4: Pin socket soldering: Use a soldering tool to solder the pin socket 3 at the specified position on the base plate 1, as Figure 5 shown.

[0052] Step 5: First, use a plasma cleaner to clean the semi-finished product to remove surface dirt, making the bonding between the epoxy resin 5 and the semi-finished product better. Then use an injection molding device and a plastic encapsulation mold 6 to melt the epoxy resin and pour it into the interior of the plastic encapsulation mold 6. After it cures, take it out and then put it into an oven for a post-curing process to eliminate internal stress and make it more stable and reliable, as Figure 6 shown.

[0053] The specific plastic encapsulation process is the same as that in Embodiment 2. In this product, the heights of all pin sockets 3 are kept flush. The lower mold 602 of the mold is a flat mold without other structures. The upper mold 601 is concave to form a cavity. There is a thin film 7 between the cavity and the pin socket. After the mold is closed, the pin socket 3, the thin film 7 and the upper cavity of the mold are tightly fitted. The thin film can not only play a certain sealing effect to prevent injection molding overflow, but also play a certain buffering role to prevent direct contact between the mold and the pin socket and damage the product or the mold.

[0054] Step 6: Inserting pins: Use a pin insertion device to insert the pin 4 into the previously soldered pin socket 3 and perform reflow soldering using a vacuum furnace to tightly bond the pin 4 to the pin socket 3; as Figure 7 shown.

[0055] Through the above solution, the present invention can quickly and efficiently complete the encapsulation of this type of module product and can achieve mass production. Compared with the traditional potting protection, the protection effect of this invention is more reliable and the efficiency is also higher. Since the whole process uses machine equipment for operation, the yield of the finished product is also higher.

[0056] Embodiment 4 This embodiment provides a multi-chip integration system, including at least one multi-chip integration module as described in Embodiment 1.

[0057] The structure adopted is the same as that of Embodiment 1, and will not be repeated in this embodiment.

[0058] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A multi-chip integrated module, characterized in that, It comprises a base plate (1), at least one chip (2), a pin sleeve (3), a pin plug (4), an epoxy resin (5) and a plastic encapsulation mold (6); The upper surface of the base plate (1) is provided with a chip designated position area and a needle sleeve designated position area; The chip (2) to be bonded is placed in the chip designated position area, and the chips are electrically connected to each other or to the base plate (1); and a needle sleeve is welded in the needle sleeve designated position area; The plastic encapsulation mold (6) comprises an upper mold (601) and a lower mold (602), wherein the lower mold (602) is arranged at the bottom of the base plate (1), and the upper mold is concave to form a cavity, wherein the base plate (1), the chip (2) and the needle sleeve (3) are accommodated in the cavity. After the plastic encapsulation mold (6) is closed, epoxy resin (5) is poured into the cavity. After the plastic encapsulation is completed, the plastic encapsulation mold (6) is taken out; and the pin pins (4) are plugged into the needle sleeve (3) after the plastic encapsulation is completed.

2. The multi-chip integrated module according to claim 1, wherein A film (7) is arranged between the top of the needle sleeve and the top of the cavity. After the plastic sealing mold (6) is closed, the top of the needle sleeve, the film (7) and the top of the upper mold cavity are fitted together.

3. The multi-chip integrated module according to claim 1, wherein The needle sleeves (3) are of consistent height.

4. The multi-chip integrated module according to claim 1, wherein Chips (2) and chips (2) or chips (2) and the base plate (1) are welded via welding wires to form a path for conducting electrical signals.

5. The multi-chip integrated module according to claim 1, wherein The pin plug (4) and the needle sleeve (3) are joined together by vacuum reflow soldering.

6. The multi-chip integrated module according to claim 1, characterized in that, The pin plug (4) is made of copper.

7. A manufacturing method of a multi-chip integration module, characterized in that The steps include: Dividing the wafer into a plurality of bare chips (2); Printing a predetermined shape on a designated chip position area of a base plate (1), and attaching the bare chip to the printed solder paste surface; Electrically connecting the chips (2) to the chips (2) or the chips (2) to the base plate (1); Welding the needle sleeve (3) to the surface of the base plate (1); The epoxy resin (5) is melted and poured into the interior of the plastic encapsulation mold (6) to cover the base plate (1), the chip (2) and the needle sleeve (3). After the plastic encapsulation is completed, the plastic encapsulation mold (6) is taken out; Insert the pin (4) into the plastic-sealed needle sleeve (3).

8. A manufacturing method of a multi-chip integrated module, characterized in that, The steps include: Dividing the wafer into a plurality of bare chips (2); Placing a soldering pad at a designated position on the surface of the base plate (1) and attaching the bare chip (2) to the soldering pad; Electrically connecting the chips (2) to the chips (2) or the chips (2) to the base plate (1); Welding the needle sleeve (3) to the surface of the base plate (1); The epoxy resin (5) is melted and poured into the interior of the plastic encapsulation mold (6) to cover the base plate (1), the chip (2) and the needle sleeve (3). After the plastic encapsulation is completed, the plastic encapsulation mold (6) is taken out; Insert the pin (4) into the plastic-sealed needle sleeve (3).

9. The manufacturing method of a multi-chip integrated module according to claim 7 or 8, characterized in that, Before the epoxy resin (5) is melted and poured into the interior of the plastic encapsulation mold (6), a plasma cleaning machine is used to clean the surface of the base plate (1).

10. A multi-chip integrated system, characterized in that, At least one multi-chip integrated module as described in any one of claims 1-6.

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