Modularized combined multi-interface electronic connector

Abstract

The invention discloses a modular combined type multi-interface electronic connector, which comprises a base, a plurality of detachable interface modules, an elastic locking piece, a combined type circuit board and module connecting terminals, and is characterized in that the module connecting terminals are arranged along the length direction of the base and are in elastic contact with contact areas of the interface modules; each interface module comprises a module shell and at least two different types of standard interfaces, and the standard interfaces are integrated on the module shell in a parallel or stacked mode. The whole scheme gives consideration to miniaturization, multiple functions and high stability, can be widely applied to the fields of consumer electronics, industrial equipment, data centers and the like, and greatly improves the connection efficiency and equipment compatibility.

Description

Technical Field

[0001] This invention patent relates to the technical field of connectors, and specifically to a modular combined multi-interface electronic connector. Background Art

[0002] With the diversified development of electronic devices, the connection requirements between devices are becoming increasingly complex. Due to defects such as fixed interface types and single functions, traditional electronic connectors are gradually unable to meet user needs. For example, existing connectors usually only support a single standard interface (such as USB, HDMI). When a device needs to be compatible with multiple interfaces, it can only be achieved by splicing multiple independent connectors, resulting in a bulky volume, cumbersome installation, and prominent signal interference problems between different interfaces. In addition, problems such as insufficient heat dissipation in high-power transmission scenarios, interface looseness caused by frequent plugging and unplugging, and the risk of misplugging also restrict the reliability and service life of the connectors.

[0003] Content of the Invention Patent

[0004] In order to overcome the deficiencies of the prior art solutions, this invention patent provides a modular combined multi-interface electronic connector, which can effectively solve the problems raised in the background art.

[0005] The technical solution adopted by this invention patent to solve its technical problems is as follows:

[0006] A modular combined multi-interface electronic connector, including a base, a number of detachable interface modules, an elastic locking member, a combined circuit board, and module connection terminals. The module connection terminals are arranged along the length direction of the base and form elastic contact with the contact areas of each interface module. Each interface module includes a module housing and at least two different types of standard interfaces, and the standard interfaces are integrated on the module housing in a side-by-side or stacked manner;

[0007] The base is provided with a locking groove and two horizontally arranged mounting grooves on the front end face of the base. Symmetrically arranged guiding grooves are provided on the inner walls of each mounting groove. The elastic locking member is arranged at the rear of the module housing and forms a snap-fit with the locking groove on the base. A guiding block is provided on the side wall of the module housing and is matched with the guiding groove;

[0008] The combined circuit board includes a signal processing layer, a power distribution layer, and elastic contacts arranged in layers. Vertical conduction is achieved between the signal processing layer and the power distribution layer through the elastic contacts.

[0009] As a further description of the above technical solution, the guiding groove has a T-shaped structure, an anti-detachment protrusion is provided at the bottom of the guiding groove, and deformable claws are correspondingly provided on the guiding block.

[0010] As a further description of the above technical solution, the elastic locking member includes a U-shaped elastic piece and a hemispherical chuck provided at the end of the elastic piece, and the inner wall of the locking groove is provided with a wavy tooth pattern adapted to the chuck.

[0011] As a further description of the above technical solution, an electromagnetic shielding layer is provided between the signal processing layer and the power distribution layer, and the electromagnetic shielding layer is conductively connected to the metal frame of the base through side conductive strips.

[0012] As a further description of the above technical solution, an expansion interface is provided at the bottom of the base, and the expansion interface includes positioning posts, a magnetic adsorption ring, and an expansion terminal group connected to the combined circuit board.

[0013] As a further description of the above technical solution, an anti-misinsertion structure is provided on the front surface of the module housing, and the anti-misinsertion structure includes an identification protrusion at the top of the module housing and an identification groove at the bottom, and the identification protrusions and identification grooves of two adjacent interface modules form an interlocking fit.

[0014] As a further description of the above technical solution, a heat dissipation component is provided at the rear of the base, and the heat dissipation component includes a heat sink thermally connected to the combined circuit board and a fin group provided on the heat sink.

[0015] As a further description of the above technical solution, a combined connection mechanism is provided on one side of the base, and the combined connection mechanism includes a magnetic positioning block, a conductive connection post provided on the magnetic positioning block, and a locking knob connected to an adjacent base.

[0016] Compared with the prior art, the beneficial effects of the present invention patent are:

[0017] A modular combined multi-interface electronic connector of the present invention patent has at least one of the following beneficial effects during use:

[0018] The detachable design of the interface module supports the free combination of multiple standard interfaces (such as USB, HDMI, etc.). Users can customize functions according to their needs, reducing the usage cost. The T-shaped guide groove and anti-detachment protrusion accurately position the module. Combining the wavy teeth and U-shaped elastic sheet of the elastic locking part, it realizes a firm snap connection, resisting vibration and preventing loosening. The layered circuit board isolates the signal processing layer, power distribution layer, and electromagnetic shielding layer, reducing interference. The vertical conduction of the elastic contacts simplifies the assembly and improves the electrical stability. The heat dissipation component quickly conducts heat through the heat sink and fin group to ensure the stable operation of high-power interfaces; the magnetic adsorption and positioning post design of the bottom expansion interface support hot-pluggable peripheral expansion, enhancing the scene adaptability. The interlocking structure of the identification protrusions and grooves on the module housing avoids incorrect installation. At the same time, the electromagnetic shielding layer and the base metal frame are grounded to effectively suppress electromagnetic interference. The magnetic positioning block and conductive connection column support the quick splicing of multiple bases to meet the expansion needs of complex equipment clusters. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is the overall structural schematic diagram of a modular combined multi-interface electronic connector of the present invention patent;

[0020] Figure 2 is the first side structural schematic diagram of a modular combined multi-interface electronic connector of the present invention patent;

[0021] Figure 3 is the second side structural schematic diagram of a modular combined multi-interface electronic connector of the present invention patent;

[0022] Figure 4 is the perspective structural schematic diagram of a modular combined multi-interface electronic connector of the present invention patent.

[0023] Reference numerals in the figures:

[0024] 1. Base; 101. Circuit board; 102. Combined connection mechanism; 103. Installation groove; 104. Signal processing layer; 105. Power distribution layer; 2. Interface module; 201. Module connection terminal; 202. Elastic contact; 203. Heat dissipation component; 3. Elastic locking part; 301. Guide groove. DETAILED DESCRIPTION OF THE INVENTION

[0025] Next, the technical solutions in the embodiments of the present invention patent will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention patent. Obviously, the described embodiments are only a part of the embodiments of the present invention patent, rather than all the embodiments. Based on the embodiments of the present invention patent, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention patent.

[0026] Such as Figures 1-4As shown in the figure, the present invention patent provides a modular combined multi-interface electronic connector, including a base 1, a plurality of detachable interface modules 2, an elastic locking member 3, a combined circuit board 101, and module connection terminals 201. The module connection terminals 201 are arranged along the length direction of the base 1 and form elastic contact with the contact areas of each interface module 2. Each of the interface modules 2 includes a module housing and at least two different types of standard interfaces, and the standard interfaces are integrated on the module housing in a side-by-side or stacked manner.

[0027] The base 1 is provided with a locking groove and two horizontally arranged mounting grooves 103 on the front end face of the base 1. Symmetrically arranged guiding grooves 301 are provided on the inner walls of the mounting grooves 103. The elastic locking member 3 is arranged at the rear of the module housing and forms a snap-fit with the locking groove on the base 1. A guiding block that matches the guiding groove 301 is provided on the side wall of the module housing.

[0028] The combined circuit board 101 includes a signal processing layer 104, a power distribution layer 105, and elastic contacts 202 that are arranged in layers. Vertical conduction is achieved between the signal processing layer 104 and the power distribution layer 105 through the elastic contacts 202.

[0029] In this embodiment, the base 1 serves as the main support. The two mounting grooves 103 on both sides guide the insertion of the interface module 2 through the guiding grooves 301 and guiding blocks to ensure module alignment. The elastic locking member 3 is snap-connected to the locking groove of the base 1, and a locking force is generated by elastic deformation to fix the interface module 2. The module connection terminals 201 are in elastic contact with the contacts of the interface module 2 to achieve electrical conduction and adapt to the small displacements during module insertion and extraction. The combined circuit board 101 adopts a layered design: the signal processing layer 104 (transmits data), the power distribution layer 105 (supplies power), and the elastic contacts 202 (vertical conduction between layers), and the circuits of each layer are independently optimized for performance. The interface module 2 integrates at least two side-by-side or stacked standard interfaces (such as USB + HDMI, Type-C + audio), and function expansion is achieved by replacing the module.

[0030] In this embodiment, different interface modules 2 can be freely combined to meet diverse requirements, reduce customization costs, simplify the installation process, prevent module misalignment, ensure the stability of electrical connection, perform layered processing of signals and power, reduce interference, and improve transmission quality. The elastic contacts 202 avoid welding and are convenient for maintenance. The stacked / side-by-side interface layout saves space and meets the requirements of miniaturized devices.

[0031] Furthermore, the guiding groove 301 has a T-shaped structure, and an anti-disengagement protrusion is provided at the bottom of the guiding groove 301. The guiding block is correspondingly provided with deformable claws. The T-shaped guiding groove 301 restricts the lateral offset of the module. The anti-disengagement protrusion at the bottom engages with the deformable claws of the guiding block to prevent the module from accidentally falling off. The guiding accuracy is improved, and the anti-vibration performance is enhanced, which is suitable for in-vehicle / industrial scenarios. The anti-disengagement design avoids the loosening problem caused by frequent plugging and unplugging.

[0032] Furthermore, the elastic locking member 3 includes a U-shaped elastic piece and a hemispherical chuck provided at the end of the elastic piece. The inner wall of the locking groove is provided with wavy tooth patterns adapted to the chuck. The U-shaped elastic piece is compressed to generate a resilience force, and the hemispherical chuck at the end engages with the wavy tooth patterns of the locking groove at multiple points to form a progressive locking. The locking force is adjustable to adapt to modules of different thicknesses. The wavy tooth patterns provide multiple locking positions to prevent the module from sliding and enhance the anti-pulling ability.

[0033] Furthermore, an electromagnetic shielding layer is provided between the signal processing layer 104 and the power distribution layer 105. The electromagnetic shielding layer is conductively connected to the metal frame of the base 1 through side conductive strips. The electromagnetic shielding layer (such as a metal foil) is sandwiched between the signal layer and the power layer, and forms a grounding loop with the metal base 1 through side conductive strips to absorb high-frequency interference. The signal crosstalk is reduced, the EMC performance is improved, and the requirements for high-speed transmission (such as USB4 / Thunderbolt interface) are met. The shielding layer and the base 1 are integrally grounded, and no additional shielding cover is required, making the structure more compact.

[0034] Furthermore, an expansion interface is provided at the bottom of the base 1. The expansion interface includes positioning posts, a magnetic adsorption ring, and an expansion terminal group connected to the combined circuit board 101. The magnetic adsorption ring assists the base 1 to quickly adsorb and align with the expansion device, and the positioning posts ensure the accurate insertion of the expansion terminals. It supports hot-plugging expansion (such as external storage / charging dock). The expansion terminal group provides additional power / data channels. The magnetic adsorption simplifies the blind plugging operation and improves the user experience.

[0035] Furthermore, an anti-misinsertion structure is provided on the front surface of the module housing. The anti-misinsertion structure includes an identification protrusion at the top of the module housing and an identification groove at the bottom. The identification protrusions and identification grooves of two adjacent interface modules 2 form an interlocking fit. The identification protrusion at the top and the identification groove at the bottom of the module housing form a unique matching relationship. When adjacent modules are interlocked, only the correct arrangement and combination are allowed. The physical anti-fooling design avoids the incorrect installation of the interface module 2 (such as misinserting the HDMI module into the power slot), protecting the safety of the device. The interlocking between modules enhances the overall structural strength.

[0036] Further, a heat dissipation component 203 is provided at the rear of the base 1. The heat dissipation component 203 includes a heat sink thermally connected to the combined circuit board 101 and a fin group provided on the heat sink. The heat sink is in direct contact with the high-heat area of the circuit board 101 (such as the power management chip), and the fin group increases the heat dissipation area to cool down by air convection. This solves the heat dissipation problem of high-power interfaces (such as PD fast charging), avoids overheating and frequency reduction, and improves the long-term stability in high-current scenarios.

[0037] Further, a combined connection mechanism 102 is provided on one side of the base 1. The combined connection mechanism 102 includes a magnetic positioning block, a conductive connection post provided on the magnetic positioning block, and a locking knob for connecting to an adjacent base 1. The magnetic positioning block enables quick splicing of multiple bases 1, the conductive connection posts connect the circuits of each base 1 in series, and the locking knob mechanically strengthens the connection points. It supports horizontal / vertical expansion (such as building a multi-port matrix) to meet the needs of servers / workstations. The magnetic + mechanical double-insurance design takes into account both installation efficiency and connection reliability.

[0038] Further, a combined connection mechanism is provided on one side of the base. The combined connection mechanism includes a magnetic positioning block, a conductive connection post provided on the magnetic positioning block, and a locking knob for connecting to an adjacent base. The magnetic positioning block enables quick splicing of multiple bases, the conductive connection posts connect the circuits of each base in series, and the locking knob mechanically strengthens the connection points. It supports horizontal / vertical expansion (such as building a multi-port matrix) to meet the needs of servers / workstations. The magnetic + mechanical double-insurance design takes into account both installation efficiency and connection reliability.

[0039] For those skilled in the art, it is obvious that the details of the above exemplary embodiments are not limiting to the present invention, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any perspective, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A modular combined multi-interface electronic connector, characterized in that: It includes a base, a number of detachable interface modules, an elastic locking member, a combined circuit board and module connection terminals. The module connection terminals are arranged along the length direction of the base and form elastic contact with the contact areas of each interface module. Each of the interface modules includes a module housing and at least two different types of standard interfaces, and the standard interfaces are integrated on the module housing in a side-by-side or stacked manner; The base is provided with a locking groove and two horizontally arranged mounting grooves on the front end face of the base. Guide grooves are symmetrically provided on the inner walls of each mounting groove. The elastic locking member is arranged at the rear of the module housing and forms a snap-fit with the locking groove on the base. Guide blocks are provided on the side walls of the module housing and are matched with the guide grooves; The combined circuit board includes a signal processing layer, a power distribution layer and elastic contacts arranged in layers. Vertical conduction is achieved between the signal processing layer and the power distribution layer through the elastic contacts.

2. The modular combined multi-interface electronic connector according to claim 1, wherein: The guide groove has a T-shaped structure, and an anti-detachment protrusion is provided at the bottom of the guide groove. The guide block is correspondingly provided with deformable claws.

3. The modular combined multi-interface electronic connector according to claim 1, wherein: The elastic locking member includes a U-shaped elastic sheet and a hemispherical chuck provided at the end of the elastic sheet. Wave-shaped tooth patterns adapted to the chuck are provided on the inner wall of the locking groove.

4. The modular combined multi-interface electronic connector according to claim 1, wherein: An electromagnetic shielding layer is provided between the signal processing layer and the power distribution layer, and the electromagnetic shielding layer is conductively connected to the metal frame of the base through side conductive strips.

5. A modular combined multi-interface electronic connector according to claim 1, characterized in that: An expansion interface is provided at the bottom of the base. The expansion interface includes positioning posts, a magnetic adsorption ring and an expansion terminal group connected to the combined circuit board.

6. The modular combined multi-interface electronic connector according to claim 1, characterized in that: An anti-misinsertion structure is provided on the front surface of the module housing. The anti-misinsertion structure includes an identification protrusion at the top of the module housing and an identification groove at the bottom. The identification protrusions and identification grooves of two adjacent interface modules form an interlocking fit.

7. The modular combined multi-interface electronic connector according to claim 1, characterized in that: A heat dissipation component is provided at the rear of the base. The heat dissipation component includes a heat sink thermally connected to the combined circuit board and a fin group provided on the heat sink.

8. A modular combined multi-interface electronic connector according to claim 1, characterized in that: A combined connection mechanism is provided on one side of the base. The combined connection mechanism includes a magnetic positioning block, a conductive connection post provided on the magnetic positioning block and a locking knob connected to an adjacent base.

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