Shell assembly and electronic equipment

Abstract

The invention provides a shell assembly and electronic equipment. The shell assembly provided by the embodiment of the invention comprises a shell, wherein the shell is provided with a sinking groove; and the magnetic attraction assembly is partially embedded in the sinking groove, the magnetic attraction assembly comprises a magnet and a first magnetic isolation sheet, and the magnet is located between the shell and the first magnetic isolation sheet. The shell assembly provided by the embodiment of the invention has a relatively thin thickness, so that electronic equipment with a wireless charging function can be lighter and thinner.

Description

Technical Field

[0001] This application relates to the field of electronics, and particularly to a housing assembly and an electronic device. Background Art

[0002] For electronic devices such as mobile phones equipped with a wireless charging function, in order to achieve more accurate alignment, so as to make the charging speed faster, the efficiency higher, and the convenience stronger, it is necessary to add a ring-shaped magnet for magnetic attraction alignment, simply referred to as an alignment magnetic ring, to the mobile phone. The alignment magnetic ring can be provided on the external protective case of the electronic device. In this way, the electronic device only has the function of magnetic attraction positioning and alignment when wearing a protective case with an alignment magnetic ring, and the use is relatively inconvenient. Moreover, if the user replaces the protective case, due to the limited thickness of the protective case or the inconsistency of the magnetic attraction of the alignment magnetic ring, the magnetic attraction function may also be affected. In addition, if the alignment magnetic ring is built into the electronic device, the alignment magnetic ring will occupy a relatively large internal space of the electronic device, thus squeezing the space of other components, which is not conducive to the thinness and lightness of the electronic device. Summary of the Invention

[0003] An embodiment of this application provides a housing assembly, which has a relatively thin thickness and can make an electronic device with a wireless charging function thinner and lighter.

[0004] In a first aspect, an embodiment of this application provides a housing assembly, which includes:

[0005] A housing having a sunken groove; and

[0006] A magnetic attraction assembly, part of which is embedded in the sunken groove. The magnetic attraction assembly includes a magnet and a first magnetic isolation sheet, and the magnet is located between the housing and the first magnetic isolation sheet.

[0007] In a second aspect, an embodiment of this application provides an electronic device, which includes:

[0008] A display screen having a display surface;

[0009] The housing assembly described in the first aspect of this application, the housing assembly is disposed on one side of the display screen, and the magnetic attraction assembly is located between the housing and the display screen; and

[0010] A processor, which is electrically connected to the display screen and is used to control the display screen to display.

[0011] The shell assembly of the embodiment of the present application includes a shell and a magnetic suction assembly, the shell has a sink; the magnetic suction assembly is partially arranged in the sink; the magnetic suction assembly includes a magnet and a first magnetic isolation sheet, and the magnet is located between the shell and the first magnetic isolation sheet. When the shell assembly is applied to an electronic device, the magnetic suction assembly can accurately align the receiving end wireless charging module of the electronic device with the receiving end wireless charging module of the wireless charging device, avoid the misalignment of the receiving end wireless charging module and the transmitting end wireless charging module, and improve the charging speed and charging efficiency of the electronic device. In addition, the magnetic suction assembly is partially arranged in the sink, and when the shell assembly is used as the back cover of the electronic device, the magnetic suction assembly can reduce the encroachment of the internal space of the electronic device, so that the thickness of the electronic device can be made thinner or under the same thickness conditions, the volume and capacity of the power supply module can be increased, and the endurance of the electronic device can be improved. Furthermore, the magnetic suction assembly includes a magnet and a first magnetic isolation sheet, and the first magnetic isolation sheet is located on the side of the magnet away from the shell, so that the magnetic field generated by the magnet can be better prevented from overflowing, thereby affecting the signal of the electronic device, so that the operation of the electronic device is smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 It is a structural schematic diagram of a shell assembly according to an embodiment of the present application.

[0014] Figure 2 It is a schematic diagram of the exploded structure of a shell assembly according to an embodiment of the present application.

[0015] Figure 3 It is the edge of the shell component of one embodiment of the present application. Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0016] Figure 4 It is a cross-sectional view of a shell according to an embodiment of the present application.

[0017] Figure 5 It is a schematic diagram of the exploded structure of a shell assembly according to another embodiment of the present application.

[0018] Figure 6 The shell assembly of another embodiment of the present application is Figure 1 Schematic diagram of the cross-sectional structure in the AA direction.

[0019] Figure 7 The shell assembly of another embodiment of the present application isFigure 1 Schematic cross-sectional structure diagram in the A-A direction.

[0020] Figure 8 It is the cross-sectional structure diagram of the housing assembly of another embodiment of the present application along Figure 1 the A-A direction.

[0021] Figure 9 It is the cross-sectional structure diagram of the housing assembly of another embodiment of the present application along Figure 1 the A-A direction.

[0022] Figure 10 It is the cross-sectional structure diagram of the housing assembly of another embodiment of the present application along Figure 1 the A-A direction.

[0023] Figure 11 It is the structural schematic diagram of the appearance layer of an embodiment of the present application.

[0024] Figure 12 It is the structural schematic diagram of the appearance layer of another embodiment of the present application.

[0025] Figure 13 It is the structural schematic diagram of the appearance layer of still another embodiment of the present application.

[0026] Figure 14 It is the structural schematic diagram of an electronic device of an embodiment of the present application.

[0027] Figure 15 It is the partial exploded structural schematic diagram of an electronic device of an embodiment of the present application.

[0028] Figure 16 It is the circuit block diagram of an electronic device of an embodiment of the present application.

[0029] Figure 17 It is the circuit block diagram of an electronic device of another embodiment of the present application.

[0030] Explanation of reference numerals:

[0031] 100 - Housing assembly, 10 - Housing, 11 - Sunk groove, 12 - First surface, 13 - Second surface, 14 - Fiber resin layer, 20 - Magnetic attraction assembly, 21 - Magnet, 22 - First magnetic isolation sheet, 23 - Second adhesive layer, 30 - Receiver wireless charging module, 31 - Wireless charging coil, 32 - Second magnetic isolation sheet, 33 - Fourth adhesive layer, 30a - First adhesive layer, 40 - Third adhesive layer, 50 - Appearance layer, 51 - Primer layer, 52 - Intermediate paint layer, 53 - Topcoat layer, 54 - First texture layer, 55 - Coating layer, 56 - Second texture layer, 57 - Fingerprint-proof layer, 200 - Electronic device, 210 - Display screen, 211 - Display surface, 220 - Middle frame, 230 - Processor, 250 - Memory, 260 - Power supply module, 270 - Camera module, 101 - Light-transmitting part. Detailed implementation manners

[0032] In order to enable those skilled in the art to better understand the solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of this application.

[0033] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned accompanying drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0034] The technical solutions in the embodiments of this application will be described below in conjunction with the accompanying drawings.

[0035] It should be noted that for the convenience of description, in the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, in different embodiments, the detailed description of the same components is omitted.

[0036] The wireless charging device is used to charge an electronic device (such as a mobile phone, a tablet, etc.). The transmitting end wireless charging module (TX end for short) of the wireless charging device transfers energy through its coil to the coil of the receiving end wireless charging module (RX end for short) of the electronic device, thereby realizing wireless charging.

[0037] For electronic devices such as mobile phones equipped with wireless charging functions, in order to achieve more precise alignment, so as to make the charging speed faster, the efficiency higher, and the convenience stronger, it is necessary to add a ring magnet for magnetic alignment, abbreviated as an alignment magnetic ring, to the mobile phone.

[0038] The alignment magnetic ring can be set on the external protective cover of the electronic device. In this way, the electronic device only has the function of magnetic attraction positioning and alignment when wearing a protective cover with an alignment magnetic ring, and the use is relatively inconvenient; moreover, if the user replaces the protective cover, due to the limitation of the thickness of the protective cover or the inconsistency of the magnetic attraction of the alignment magnetic ring, the magnetic attraction function may also be affected.

[0039] In addition, if the alignment magnetic ring is built into the electronic device, the thickness of the alignment magnetic ring is generally relatively thick and the area is relatively large. When set inside the electronic device, the alignment magnetic ring will occupy a relatively large internal space of the electronic device, thus squeezing the space of other components, which is not conducive to the thinning of the electronic device; or if a thinning design is to be achieved, the battery volume and capacity need to be reduced, which reduces the battery life of the electronic device and the user experience.

[0040] In view of this, the embodiment of the present application provides a housing assembly.

[0041] Figure 1 It is a schematic structural diagram of a housing assembly 100 according to an embodiment of the present application. Figure 2 It is an exploded structural diagram of a housing assembly 100 according to an embodiment of the present application. Figure 3 It is along Figure 1 in the housing assembly 100 according to an embodiment of the present application. The cross-sectional structural diagram in the A-A direction.

[0042] Please refer to Figures 1 to 3 , the embodiment of the present application provides a housing assembly 100, which includes a housing 10 and a magnetic attraction assembly 20. The housing 10 has a sunk groove 11; a part of the magnetic attraction assembly 20 is disposed in the sunk groove 11, and the magnetic attraction assembly 20 includes a magnet 21 and a first magnetic isolation sheet 22, and the magnet 21 is located between the housing 10 and the first magnetic isolation sheet 22.

[0043] The housing assembly 100 of the present application can be applied to portable electronic devices such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc. Optionally, the housing assembly 100 of the present application can be the rear cover (battery cover) of the electronic device, the external protective case of the electronic device, etc. In the schematic drawings and description of the present application, the housing assembly 100 is schematically illustrated and described by taking the rear cover of an electronic device (such as a mobile phone) as an example, and should not be construed as a limitation on the housing assembly 100 and the electronic device of the embodiments of the present application. It should be noted that the "protective case" refers to a protective member, protective sleeve, etc. that is sleeved on at least a part of the outer periphery of the electronic device for protecting the electronic device and can be independent of the electronic device. The housing assembly 100 of the embodiments of the present application can be a 2D structure, a 2.5D structure, a 3D structure, etc. When compared with the solution where the housing assembly 100 is an external protective case, when the housing assembly 100 is the rear cover of the electronic device, it can make it more convenient for users to use and improve user convenience.

[0044] Understandably, the housing 10 has a first surface 12 and a second surface 13 that are opposite to each other. The sunk groove 11 is located on the first surface 12, and the second surface 13 is the appearance surface of the housing assembly 100. In other words, when the housing assembly 100 is applied to an electronic device and serves as the battery rear cover of the electronic device, the second surface 13 of the housing 10 serves as a part of the appearance surface of the electronic device.

[0045] Understandably, the magnet 21 and the first magnetic isolation sheet 22 are stacked. The first magnetic isolation sheet 22 is located on the side of the magnet 21 away from the housing 10. It can also be understood that the housing 10, the magnet 21, and the first magnetic isolation sheet 22 are stacked in sequence.

[0046] Understandably, part of the magnetic attraction assembly 20 is embedded in the housing 10, and part protrudes from the housing 10. That is, part of the magnetic attraction assembly 20 is located in the sunk groove 11, and part protrudes from the sunk groove 11, that is, it protrudes from the first surface 12.

[0047] It should be noted that when the housing assembly 100 is applied to an electronic device and the electronic device is charged using a wireless charging device, the magnetic attraction assembly 20 is used to adsorb to the magnetic member of the wireless charging device, so that the receiving-end wireless charging module of the electronic device is accurately aligned with the receiving-end wireless charging module of the wireless charging device, avoiding misalignment between the receiving-end wireless charging module and the transmitting-end wireless charging module, and improving the charging speed and charging efficiency of the electronic device.

[0048] The shell assembly 100 of the embodiment of the present application includes a shell 10 and a magnetic suction assembly 20, wherein the shell 10 has a sink 11; the magnetic suction assembly 20 is partially arranged in the sink 11; the magnetic suction assembly 20 includes a magnet 21 and a first magnetic isolation sheet 22, wherein the magnet 21 is located between the shell 10 and the first magnetic isolation sheet 22. When the shell assembly 100 is applied to an electronic device, the magnetic suction assembly 20 can accurately align the receiving end wireless charging module of the electronic device with the receiving end wireless charging module of the wireless charging device, thereby avoiding the misalignment between the receiving end wireless charging module and the transmitting end wireless charging module, and improving the charging speed and charging efficiency of the electronic device. In addition, the magnetic suction assembly 20 is partially arranged in the sink 11. When the shell assembly 100 is used as the back cover of the electronic device, the magnetic suction assembly 20 can reduce the encroachment on the internal space of the electronic device, thereby making the thickness of the electronic device thinner or, under the same thickness conditions, increasing the volume and capacity of the power supply module, and improving the endurance of the electronic device. Furthermore, the magnetic attraction component 20 includes a magnet 21 and a first magnetic isolation plate 22. The first magnetic isolation plate 22 is located on the side of the magnet 21 away from the shell 10. This can better prevent the magnetic field generated by the magnet 21 from overflowing, thereby affecting the signal of the electronic device, thereby making the operation of the electronic device smoother.

[0049] In some embodiments, the material of the housing 10 may be, but is not limited to, at least one of a fiber resin composite material (i.e., including a fiber resin layer), glass, and plastic. These materials can all be formed into a sink 11 on the housing 10 by a heating molding process. By designing a local boss structure on the molding die, a locally thinned sink 11 is formed during the heating process without the need for additional preparation. In addition, the sink 11 formed by the molding process is not prone to local stress concentration, so that the housing 10 can have better mechanical strength and structural strength.

[0050] Optionally, the glass may be, but is not limited to, at least one of Corning Gorilla Glass, AGC Dragon Trace Glass, Panda Glass, and the like.

[0051] Optionally, the plastic may be, but is not limited to, at least one of polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), a polycarbonate-polymethyl methacrylate composite board, and the like.

[0052] Figure 4 1 is a cross-sectional view of a housing 10 according to an embodiment of the present application.

[0053] See also Figure 4, optionally, the housing 10 includes at least one layer of fiber resin layer 14. When the number of the fiber resin layers 14 is multiple, the multiple fiber resin layers 14 are stacked in sequence; the fiber resin layer 14 includes a fiber cloth and a resin, and the resin is wrapped on the surface of the fiber cloth. It can be understood that the resin is wrapped on the surface of the fiber cloth and enters the gaps between the fiber lines of the fiber cloth. In the schematic illustration of the drawings of the present application, taking the housing 10 including three fiber resin layers 14 as an example for illustration, it should not be construed as a limitation on the housing 10 of the embodiments of the present application, nor should it be construed as a limitation on the housing assembly 100 of the embodiments of the present application.

[0054] Optionally, the fiber resin layer 14 is a sheet structure or a layered structure.

[0055] Optionally, the fiber cloth can be formed by weaving or knitting.

[0056] Optionally, the fiber cloth can be, but is not limited to, at least one of ultra-high molecular weight polyethylene fiber cloth (abbreviated as UPE fiber), carbon fiber cloth, glass fiber cloth, aramid fiber cloth, poly(p-phenylene benzobisoxazole) fiber cloth (abbreviated as PBO fiber), liquid crystal polymer cloth (abbreviated as LCP fiber), ceramic fiber cloth, basalt fiber cloth, etc.

[0057] Optionally, the resin can be, but is not limited to, at least one of epoxy resin, phenolic resin, bismaleimide resin, benzoxazine resin, etc.

[0058] Optionally, the housing 10 can be prepared by the following steps: 1) providing a fiber cloth and a resin sizing; 2) immersing the fiber cloth in the resin sizing, and after removing, performing semi-curing or pre-curing to obtain a semi-cured fiber resin layer 14; 3) stacking at least one layer of semi-cured fiber resin layer 14 and performing hot press curing to form the housing 10. During the hot press curing process, through the design of the hot press curing mold, a sink 11 is formed, and there is no need to additionally process the sink 11 on the plate, and the process is simple and easy to implement.

[0059] In this embodiment, using the fiber resin layer 14 to prepare the housing 10 can make the housing 10 have higher mechanical strength, higher toughness and impact resistance, so that the housing assembly 100 can be made thinner, and the thinness and lightness of the housing assembly 100 can be better realized; in addition, the fiber resin layer 14 has good corrosion resistance and flame retardancy, which can make the housing assembly 100 have higher safety; furthermore, the fiber resin layer 14 has a lower cost, which can reduce the manufacturing cost of the housing assembly 100.

[0060] Optionally, the thickness of the single-layer fiber resin layer 14 ranges from 0.03 mm to 0.15 mm. Specifically, the thickness of the single-layer fiber resin layer 14 can be, but is not limited to, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, etc.

[0061] In the embodiments of the present application, when it comes to the numerical range from a to b, if not specifically specified, it means that the numerical value can be any value between a and b, including the endpoint values a and b.

[0062] Optionally, the number of fiber resin layers 14 included in the housing 10 can range from, but is not limited to, 3 layers to 10 layers; specifically, the number of fiber resin layers 14 included in the housing 10 can be, but is not limited to, 3 layers, 4 layers, 5 layers, 6 layers, 7 layers, 8 layers, 9 layers, 10 layers, etc.

[0063] In some embodiments, the thickness of the housing 10 ranges from 0.25 mm to 1 mm. Specifically, the thickness of the housing 10 can be, but is not limited to, 0.25 mm, 0.28 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, etc. If the thickness of the housing 10 is too thin, the mechanical strength of the housing 10 is reduced, thereby reducing the mechanical strength of the housing assembly 100; if the thickness of the housing 10 is too thick, the cost of the housing assembly 100 is increased, and the thickness and weight of the housing assembly 100 are increased, which is not conducive to the thinning and lightening of the housing assembly 100.

[0064] Exemplarily, when the housing 10 includes the fiber resin layer 14, the thickness of the housing 10 ranges from 0.25 mm to 0.8 mm. Again exemplarily, when the material of the housing 10 is glass, the thickness of the housing 10 ranges from 0.3 mm to 0.8 mm. Again exemplarily, when the material of the housing 10 is plastic, the thickness of the housing 10 ranges from 0.3 mm to 1 mm.

[0065] Optionally, the thickness of the part of the housing 10 corresponding to the sink 11 is greater than or equal to 0.2 mm. Specifically, the thickness of the part of the housing 10 corresponding to the sink 11 can be, but is not limited to, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, etc. If the thickness of the part of the housing 10 corresponding to the sink 11 is too thin, the mechanical strength of the housing 10 at the position corresponding to the sink 11 is reduced.

[0066] In some embodiments, the depth of the sinking groove 11 ranges from 10 μm to 200 μm. Specifically, the depth of the sinking groove 11 can be, but is not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, etc. In this embodiment, if the depth of the sinking groove 11 is too shallow, when the housing 10 is applied to an electronic device, the thinning effect on the electronic device is not obvious; if the depth of the sinking groove 11 is too deep, the thickness of the housing 10 corresponding to the sinking groove 11 is reduced, and the mechanical strength of the housing 10 is reduced.

[0067] Exemplarily, when the housing 10 includes a fiber resin layer 14, the thickness of the housing 10 ranges from 0.25 mm to 0.8 mm; the depth of the sinking groove 11 ranges from 10 μm to 150 μm. Further exemplarily, when the material of the housing 10 is glass, the thickness of the housing 10 ranges from 0.3 mm to 0.8 mm; the depth of the sinking groove 11 ranges from 10 μm to 200 μm. Further exemplarily, when the material of the housing 10 is plastic, the thickness of the housing 10 ranges from 0.3 mm to 1 mm; the depth of the sinking groove 11 ranges from 10 μm to 200 μm.

[0068] In some embodiments, the sinking groove 11 is an arc ring, and the inner diameter of the sinking groove 11 ranges from 45.7 mm to 46.2 mm. Specifically, the inner diameter of the sinking groove 11 can be, but is not limited to, 45.7 mm, 45.8 mm, 45.9 mm, 46.0 mm, 46.1 mm, 46.2 mm, etc. If the inner diameter of the sinking groove 11 is too small, the thinning area on the housing 10 is too large, reducing the mechanical strength of the housing 10; if the inner diameter of the sinking groove 11 is too large, it is difficult for the magnet 21 of the standard size to be embedded in the sinking groove 11 and requires additional customization. In addition, if the inner diameter of the sinking groove 11 is too large, the size of the magnet 21 is too large. When the housing assembly 100 is applied to an electronic device, it is easy for the magnet 21 of the electronic device to be mismatched with the magnet 21 of the wireless charging device, which is not conducive to the precise alignment of the electronic device and the wireless charging device and reduces the efficiency of wireless charging.

[0069] Optionally, the outer diameter of the sinking groove 11 ranges from 53.9 mm to 54.5 mm. Specifically, the outer diameter of the sinking groove 11 can be, but is not limited to, 53.9 mm, 54.0 mm, 54.1 mm, 54.2 mm, 54.3 mm, 54.4 mm, 54.5 mm, etc. If the outer diameter of the sinking groove 11 is too small, it is difficult to embed the magnet 21 of the standard size into the sinking groove 11 and additional customization is required. In addition, the size of the magnet 21 that can be embedded in the sinking groove 11 is too small, reducing the magnetic attraction force of the magnet 21. When the housing assembly 100 is applied to an electronic device, it is not conducive to the precise alignment between the electronic device and the wireless charging device, reducing the efficiency of wireless charging; if the outer diameter of the sinking groove 11 is too large, the thinning area on the housing 10 is too large, reducing the mechanical strength of the housing 10.

[0070] In other embodiments, the shape of the sinking groove 11 can also be other shapes, such as at least one of a rectangular ring, an elliptical arc ring, etc. The present application does not specifically limit the shape of the sinking groove 11.

[0071] Optionally, the sinking groove 11 has a notch. In other words, the sinking groove 11 is not a complete ring structure.

[0072] Optionally, the width of the notch ranges from 7 mm to 9 mm. Specifically, the width of the notch can be, but is not limited to, 7 mm, 7.2 mm, 7.4 mm, 7.6 mm, 7.8 mm, 8 mm, 8.2 mm, 8.4 mm, 8.6 mm, 8.65 mm, 8.8 mm, 9 mm, etc.

[0073] In some embodiments, the thickness of the first magnetic isolation sheet 22 ranges from 0.05 mm to 0.5 mm. Specifically, the thickness of the first magnetic isolation sheet 22 can be, but is not limited to, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc. In this embodiment, if the thickness of the first magnetic isolation sheet 22 is too thin, the cross-sectional area (the area of the cross-section along the thickness direction) of the first magnetic isolation sheet 22 becomes smaller. Under the same magnetic flux, the magnetic induction intensity becomes larger, and magnetic saturation is likely to occur, reducing the magnetic isolation effect of the first magnetic isolation sheet 22; if the thickness of the first magnetic isolation sheet 22 is too thick, the thickness of the magnetic attraction assembly 20 is increased.

[0074] Optionally, the material of the first magnetic isolation sheet 22 can be, but is not limited to, non-magnetic iron; in addition, the first magnetic isolation sheet 22 can also be at least one of iron-based soft magnetic alloys such as FeNi, FeSi, FeSiB, FeSiNbCuB, FeSiAl, etc.

[0075] Optionally, the magnet 21 can be, but is not limited to, a permanent magnet 21. Optionally, the permanent magnet 21 can be, but is not limited to, a magnet.

[0076] In some embodiments, the magnet 21 may be a magnet with an integral structure.

[0077] In other embodiments, the magnet 21 includes a plurality of sub-magnets (not shown in the figure), and the plurality of sub-magnets are sequentially arranged at intervals along the extending direction of the sunk groove 11.

[0078] It can be understood that when the magnet 21 has an integral structure, the plurality of sub-magnets are connected in sequence to form an integral body. Optionally, when the magnet 21 has an integral structure, the magnet 21 has an opening at the position corresponding to the notch.

[0079] In some embodiments, the thickness of the magnet 21 ranges from 0.1 mm to 1 mm. Specifically, the thickness of the magnet 21 may be, but is not limited to, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. In this embodiment, if the thickness of the magnet 21 is too thin, the magnetic attraction of the magnetic attraction assembly 20 is reduced. When the electronic device using the housing assembly 100 is charged by a wireless charging device, the electronic device and the wireless charging device are likely to be misaligned, reducing the alignment accuracy between the electronic device and the wireless charging device and the wireless charging efficiency of the electronic device; if the thickness of the magnet 21 is too thick, the overall thickness of the housing assembly 100 is increased, and the thickness of the electronic device using the housing assembly 100 is increased, which is not conducive to the thin and light design of the electronic device.

[0080] Figure 5 FIG. is an exploded structural schematic diagram of a housing assembly 100 according to another embodiment of the present application. Figure 6 is another embodiment of the housing assembly 100 of the present application along Figure 1 the cross-sectional structural schematic diagram taken along the A-A direction in

[0081] Please refer to Figure 5 and Figure 6 , in some embodiments, the housing assembly 100 further includes a receiving-end wireless charging module 30, the receiving-end wireless charging module 30 includes a wireless charging coil 31, the wireless charging coil 31 is disposed on one side of the housing 10 having the sunk groove 11, and the magnetic attraction assembly 20 is disposed around the outer periphery of the receiving-end wireless charging module 30.

[0082] It can be understood that the receiving-end wireless charging module 30 and the magnetic attraction assembly 20 are disposed on the same side of the housing 10.

[0083] It can be understood that, that is, the magnetic attraction assembly 20 is sleeved around the outer periphery of the receiving-end wireless charging module 30.

[0084] Understandably, the sunken groove 11 is disposed around the outer periphery of the receiving-end wireless charging module 30.

[0085] It should be noted that the wireless charging coil 31 of the housing assembly 100 is used to sense the electromagnetic signal of the wireless charging device, thereby generating current for the use of the electronic device or charging the power supply module (such as the battery module) of the electronic device. Through the coupling effect of the wireless charging coil 31 of the electronic device and the wireless charging coil 31 of the wireless charging device, electrical energy is transferred from the wireless charging device to the electronic device to achieve the wireless charging function.

[0086] Understandably, the receiving-end wireless charging module 30 is disposed on the first surface 12 of the housing 10.

[0087] In this embodiment, by disposing the receiving-end wireless charging module 30 on the housing 10, the magnetic attraction assembly 20 is disposed around the outer periphery of the receiving-end wireless charging module 30. This can make the relative position between the receiving-end wireless charging module 30 and the magnetic attraction assembly 20 more accurate when the housing assembly 100 is applied to the electronic device. The magnetic attraction assembly 20 of the electronic device can be more accurately aligned with the magnetic component of the wireless charging device, so that the receiving-end wireless charging module 30 of the electronic device can be more accurately aligned with the transmitting-end wireless charging module of the wireless charging device, and thus the wireless charging efficiency can be better improved.

[0088] Please refer to Figure 5 and Figure 6 , in some embodiments, the receiving-end wireless charging module 30 further includes a second magnetic isolation sheet 32, and the second magnetic isolation sheet 32 is disposed on a side of the wireless charging coil 31 away from the housing 10; the thickness of the second magnetic isolation sheet 32 ranges from 0.01 mm to 0.5 mm.

[0089] Specifically, the thickness of the second magnetic isolation sheet 32 may be, but is not limited to, 0.01 mm, 0.03 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc. In this embodiment, if the thickness of the second magnetic isolation sheet 32 is too thin, the second magnetic isolation sheet 32 is likely to be saturated under the action of the magnetic attraction magnetic field, resulting in magnetic leakage, reducing the inductance of the receiving-end wireless charging module 30, reducing the magnetic isolation effect, and affecting the wireless charging efficiency; if the thickness of the second magnetic isolation sheet 32 is too thick, the thickness of the magnetic attraction assembly 20 is increased.

[0090] Optionally, the second magnetic isolation sheet 32 may be, but is not limited to, a nano-wafer.

[0091] Optionally, the material of the second magnetic isolation sheet 32 may be, but is not limited to, Fe73.5 Cu1Nb3Si1 3.5 B9, Fe 89 Zr7B3Cu1, (Fe 0.5 Co 0.5 ) 88 Zr7B4Cu1, Fe 83.3 Si4B8P4Cu 0.7 , Fe 83.25 P 10 C6Cu 0.75 , Fe 78 Si9B 13 , at least one of silicon steel, etc. Using these materials as the second magnetic isolation sheet 32, magnetic saturation and magnetic leakage are less likely to occur, and the receiving end wireless charging module 30 can have a higher inductance, so that the wireless charging efficiency can be better improved.

[0092] In this embodiment, by providing the second magnetic isolation sheet 32, the magnetic field lines radiating outwards can be reduced, preventing the generation of eddy currents and signal interference; by providing the second magnetic isolation sheet 32, the coupling coefficient can also be increased, improving the magnetoelectric conversion efficiency, realizing a coil with a higher inductance using fewer turns, reducing the resistance of the wireless charging coil 31, and reducing the efficiency reduction caused by heat generation; by providing the second magnetic isolation sheet 32, the charging efficiency can also be improved.

[0093] Optionally, the wireless charging module and the magnetic attraction component 20 are coaxially arranged.

[0094] Figure 7 is a schematic cross-sectional structure view of the housing assembly 100 in the A-A direction of another embodiment of the present application. Figure 1 in the A-A direction.

[0095] Please refer to Figure 7 , in some embodiments, the housing assembly 100 further includes a first adhesive layer 30a, and the first adhesive layer 30a is located between the housing 10 and the magnet 21 for bonding the magnet 21 to the housing 10.

[0096] Optionally, the first adhesive layer 30a can be at least one of adhesive glues such as but not limited to UV glue, hot melt glue, double-sided tape, optical glue, silicone glue, glue, etc.

[0097] Optionally, the thickness of the first adhesive layer 30a ranges from 0.005 mm to 0.1 mm. Specifically, the thickness of the first adhesive layer 30a can be, but is not limited to, 0.005 mm, 0.008 mm, 0.01 mm, 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. If the thickness of the first adhesive layer 30a is too thin, the adhesive force between the magnet 21 and the housing 10 is reduced; if the thickness of the first adhesive layer 30a is too thick, the overall thickness of the housing assembly 100 is increased, which is not conducive to the thin and light design of the electronic device when the housing assembly 100 is applied to the electronic device.

[0098] Please refer to Figure 7 , optionally, the magnetic attraction assembly 20 further includes a second adhesive layer 23, which is located between the magnet 21 and the first magnetic isolation sheet 22 and is used to bond the magnet 21 and the first magnetic isolation sheet 22.

[0099] Optionally, the second adhesive layer 23 can be, but is not limited to, at least one of adhesive glues such as UV glue, hot melt glue, double-sided tape, optical glue, silica gel, and glue.

[0100] Optionally, the thickness of the second adhesive layer 23 ranges from 0.005 mm to 0.1 mm. Specifically, the thickness of the second adhesive layer 23 can be, but is not limited to, 0.005 mm, 0.008 mm, 0.01 mm, 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. If the thickness of the second adhesive layer 23 is too thin, the adhesive force between the magnet 21 and the first magnetic isolation sheet 22 is reduced; if the thickness of the second adhesive layer 23 is too thick, the overall thickness of the housing assembly 100 is increased, which is not conducive to the thin and light design of the electronic device when the housing assembly 100 is applied to the electronic device.

[0101] Figure 8 is a schematic cross-sectional structure diagram of the housing assembly 100 according to another embodiment of the present application along Figure 1 the A-A direction in

[0102] Please refer to Figure 8 , in some embodiments, the housing assembly 100 further includes a third adhesive layer 40, which is located between the housing 10 and the wireless charging coil 31 and is used to bond the wireless charging coil 31 and the housing 10.

[0103] Optionally, the third adhesive layer 40 can be, but is not limited to, at least one of adhesive glues such as UV glue, hot melt glue, double-sided tape, optical glue, silica gel, and glue.

[0104] Optionally, the thickness of the third adhesive layer 40 ranges from 0.002 mm to 0.1 mm. Specifically, the thickness of the third adhesive layer 40 can be, but is not limited to, 0.002 mm, 0.005 mm, 0.008 mm, 0.01 mm, 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. If the thickness of the third adhesive layer 40 is too thin, the adhesion between the housing 10 and the wireless charging coil 31 is reduced; if the thickness of the third adhesive layer 40 is too thick, the overall thickness of the housing assembly 100 is increased, which is not conducive to the thinness and lightness of the electronic device when the housing assembly 100 is applied to the electronic device.

[0105] Please refer to Figure 8 , in some embodiments, the receiving-end wireless charging module 30 further includes a fourth adhesive layer 33, which is located between the wireless charging coil 31 and the second magnetic isolation sheet 32 and is used to bond the second magnetic isolation sheet 32 and the wireless charging coil 31.

[0106] Optionally, the fourth adhesive layer 33 can be at least one of adhesive glues such as, but not limited to, UV glue, hot melt glue, double-sided tape, optical glue, silica gel, glue, etc.

[0107] Optionally, the thickness of the fourth adhesive layer 33 ranges from 0.002 mm to 0.1 mm. Specifically, the thickness of the fourth adhesive layer 33 can be, but is not limited to, 0.002 mm, 0.005 mm, 0.008 mm, 0.01 mm, 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. If the thickness of the fourth adhesive layer 33 is too thin, the adhesion between the second magnetic isolation sheet 32 and the wireless charging coil 31 is reduced; if the thickness of the fourth adhesive layer 33 is too thick, the overall thickness of the housing assembly 100 is increased, which is not conducive to the thinness and lightness of the electronic device when the housing assembly 100 is applied to the electronic device.

[0108] Figure 9 is a schematic cross-sectional structure diagram of the housing assembly 100 of another embodiment of the present application along Figure 1 the A-A direction in Figure 10 is a schematic cross-sectional structure diagram of the housing assembly 100 of another embodiment of the present application along Figure 1 the A-A direction in

[0109] Please refer to Figure 9 and Figure 10In some embodiments, the shell assembly 100 further includes an appearance layer 50, which is disposed on the surface of the shell 10 away from the magnetic attraction component 20, and is used to make the shell assembly 100 have color and preset texture effects, so that the shell assembly 100 has a better appearance effect. In addition, when the shell 10 includes a fiber resin layer 14, since the surface of the fiber resin layer 14 is rough, the appearance layer 50 can also well shield the rough surface of the fiber resin layer 14, so that the shell assembly 100 has a better visual effect. When the shell 10 is made of glass or plastic, since glass and plastic are usually transparent, the sink 11 and the magnetic attraction component 20 can be seen on the outer surface of the shell assembly 100. The appearance layer 50 is disposed on the surface of the shell 10 away from the magnetic attraction component 20, so that the sink 11 and the magnetic attraction component 20 can be shielded, so as to have a better appearance effect.

[0110] It can be understood that the exterior layer 50 is disposed on the second surface 13 of the housing 10 .

[0111] Figure 11 Schematic diagram of the structure of the appearance layer 50 according to an embodiment of the present application.

[0112] See also Figure 11 Optionally, the appearance layer 50 includes a primer layer 51, a mid-paint layer 52 and a top-paint layer 53 which are stacked in sequence, and the primer layer 51 is disposed on the surface of the housing 10 away from the magnetic attraction component 20. The primer layer 51 is used to improve the adhesion of the mid-paint layer 52 on the surface of the housing 10 and to cover some defects on the surface of the housing 10; the mid-paint layer 52 is used to cover the texture (such as the texture of the fiber cloth in the housing 10) and defects on the surface of the housing 10 and to improve the adhesion of the top-paint layer 53 on the primer layer 51, and the top-paint layer 53 is used to cover the texture and defects on the surface of the housing 10 and the surface of the mid-paint layer 52.

[0113] Figure 12 Schematic diagram of the structure of the appearance layer 50 of another embodiment of the present application.

[0114] See also Figure 12 In some embodiments, the appearance layer 50 further includes at least one of a first texture layer 54, a coating layer 55, and a second texture layer 56. When the appearance layer 50 includes a primer layer 51, a mid-paint layer 52, a top-paint layer 53, a first texture layer 54, a coating layer 55, and a second texture layer 56, the first texture layer 54, the coating layer 55, and the second texture layer 56 are sequentially stacked on a side of the top-paint layer 53 away from the mid-paint layer 52, and the first texture layer 54 is located between the top-paint layer 53 and the coating layer 55.

[0115] Optionally, the surface of the first texture layer 54 facing away from the housing 10 has a first texture structure (such as a periodic texture structure), so that the housing assembly 100 has a textured effect. Optionally, the first texture layer 54 has a color, so that the housing assembly 100 has various colors. By providing the first texture layer 54, the housing assembly 100 can have a better appearance effect.

[0116] Optionally, after the first texture layer 54 is subjected to texture transfer by a photocurable glue (such as UV glue), it is formed by photocuring. For example, a texture mold is provided, and the texture mold has a texture pattern complementary to the first texture structure of the first texture layer 54; UV glue is coated on the texture mold, and after the solvent is removed, a UV glue layer is formed; and the UV glue layer is transferred to the surface of the housing 10 facing away from the fireproof layer and photocured under ultraviolet light (such as a mercury lamp) to cure the UV glue layer to form the first texture layer 54.

[0117] Optionally, the coating layer 55 can be, but is not limited to, vacuum coating or optical coating. When the coating layer 55 is vacuum coating, the housing assembly 100 can have a metallic luster, and the reflection of the coating layer 55 on visible light can make the first texture layer 54 have a better three-dimensional effect and appearance effect; when the coating layer 55 is optical coating, the housing assembly 100 can have a good iridescent effect.

[0118] Optionally, the optical coating layer 55 can include, but is not limited to, one or more of TiO2, Ti3O5, NbO2, Nb2O3, Nb2O2, Nb2O5, SiO2, ZrO2, etc.

[0119] Optionally, the number of the coating layers 55 can be one layer or multiple layers. In one embodiment, the number of the coating layers 55 can be 3 to 15 layers. Specifically, it can be, but is not limited to, 3 layers, 4 layers, 5 layers, 6 layers, 7 layers, 8 layers, 9 layers, 10 layers, 11 layers, 12 layers, 13 layers, 14 layers, 15 layers, etc. Optionally, the total thickness of the multiple coating layers 55 can be, but is not limited to, 50 nm to 1000 nm; specifically, it can be, but is not limited to, 50 nm, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, 600 nm, 800 nm, 1000 nm, etc. Optionally, the thickness of each coating layer 55 is 20 nm to 60 nm. Specifically, it can be, but is not limited to, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 50 nm, 60 nm, etc.

[0120] Optionally, the coating layer 55 can be formed by one or more of non-conductive vacuum metalization (NCVM), evaporation coating process, sputtering coating process, atomic layer deposition (ALD) technology, etc.

[0121] Optionally, the surface of the second texture layer 56 facing away from the housing 10 has a second texture structure. The second texture layer 56 is used to give the housing assembly 100 a textured feel (such as a matte feel), so that the housing assembly 100 has a better appearance effect.

[0122] Optionally, after the second texture layer 56 is subjected to texture transfer by a photocurable glue (such as UV glue), it is formed by photocuring. For example, a texture mold is provided, and the texture mold has a texture pattern complementary to the second texture structure of the second texture layer 56; UV glue is coated on the texture mold, and a UV glue layer is formed after removing the solvent; and the UV glue layer is transferred to the surface of the housing 10 facing away from the fireproof layer and photocured under ultraviolet light (such as a mercury lamp) to cure the UV glue layer to form the second texture layer 56.

[0123] In this embodiment, through the cooperation of the first texture layer 54, the coating layer 55 and the second texture layer 56, the housing assembly 100 has a double texture effect, and can present a textured or colorful texture with metallic luster, having a better appearance effect.

[0124] Figure 13 It is a schematic structural diagram of the appearance layer 50 of another embodiment of the present application.

[0125] Please refer to Figure 13 , the appearance layer 50 further includes an anti-fingerprint layer 57. The anti-fingerprint layer 57 is disposed on the side of the second texture layer 56 facing away from the housing 10 for anti-fingerprint and anti-fouling.

[0126] Optionally, the anti-fingerprint layer 57 can include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, etc.

[0127] Figure 14 It is a schematic structural diagram of an electronic device 200 according to an embodiment of the present application. Figure 15 It is a partial exploded structural diagram of an electronic device 200 according to an embodiment of the present application. Figure 16 It is a circuit block diagram of an electronic device 200 according to an embodiment of the present application.

[0128] Please refer to Figures 14 to 16, An embodiment of the present application further provides an electronic device 200, which includes a display screen 210, the housing assembly 100 of the embodiment of the present application, and a processor 230. The display screen 210 has a display surface 211; the housing assembly 100 is disposed on one side of the display screen 210, and the magnetic attraction assembly 20 is located between the housing 10 and the display screen 210; the processor 230 is electrically connected to the display screen 210 and is used to control the display screen 210 to perform display.

[0129] Figure 17 is a circuit block diagram of the electronic device 200 according to another embodiment of the present application.

[0130] Please refer to Figure 17 , It can be understood that the processor 230 is also electrically connected to the wireless charging coil 31 of the receiving end wireless charging module 30 of the housing assembly 100, and is used to control the receiving end wireless charging module 30 to convert the received wireless electric energy into direct current for the use of the electronic device 200 or to charge the power supply module (such as a battery module) of the electronic device 200.

[0131] It can be understood that the housing assembly 100 is disposed opposite to the display screen 210, and the processor 230 is located between the display screen 210 and the housing assembly 100.

[0132] The electronic device 200 of the embodiment of the present application can be, but is not limited to, portable electronic devices 200 such as mobile phones, tablet computers, laptop computers, desktop computers, smart bracelets, smart watches, e-readers, game consoles, etc.

[0133] For a detailed description of the housing assembly 100, please refer to the corresponding part of the above embodiment and will not be elaborated here.

[0134] Optionally, the display screen 210 can be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a submillimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0135] Optionally, the processor 230 includes one or more general-purpose processors. Among them, the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, and an ASIC, etc. The processor 230 is used to execute various types of digital storage instructions, such as software or firmware programs stored in the memory 250, and it can enable the computing device to provide a wide variety of services.

[0136] Optionally, the electronic device 200 further includes a memory 250, which is electrically connected to the processor 230 and is used to store the program code required for the operation of the processor 230, the program code required for controlling the display screen 210, the display content of the display screen 210, and the like.

[0137] Optionally, the memory 250 may include a volatile memory, such as a random access memory (RAM); the memory 250 may also include a non-volatile memory (NVM), such as a read-only memory (ROM), a flash memory (FM), a hard disk drive (HDD), or a solid-state drive (SSD). The memory 250 may also include a combination of the above types of memories 250.

[0138] In some embodiments, the electronic device 200 of the present application embodiment further includes a middle frame 220 and a camera module 270. The middle frame 220 is disposed between the display screen 210 and the housing assembly 100, and the side surface of the middle frame 220 is exposed between the housing assembly 100 and the display screen 210. The middle frame 220 and the housing assembly 100 enclose an accommodation space (not shown in the figure), and the accommodation space is used to accommodate the processor 230, the memory 250, the camera module 270, and the like. The camera module 270 is electrically connected to the processor 230 and is used to perform shooting under the control of the processor 230.

[0139] Optionally, the electronic device 200 further includes a power supply module 260. The power supply module 260 is electrically connected to the display screen 210, the processor 230, the wireless charging coil 31 of the housing assembly 100, the camera module 270, and the like, and is used to store electrical energy and supply power to the display screen 210, the processor 230, the camera module 270, and the like.

[0140] Optionally, the power supply module 260 may be, but is not limited to, a battery. Optionally, the number of batteries may be one or more. Optionally, the battery may be, but is not limited to, at least one of a lithium battery, a sodium battery, and the like.

[0141] Optionally, the housing assembly 100 has a light-transmitting portion 101, and the camera module 270 can shoot through the light-transmitting portion 101 on the housing assembly 100, that is, the camera module 270 in this embodiment is a rear camera module 270. It can be understood that in other embodiments, the light-transmitting portion 101 can be set on the display screen 210, that is, the camera module 270 is a front camera module 270. In the schematic diagram of this embodiment, the light-transmitting portion 101 is illustrated as an opening. In other embodiments, the light-transmitting portion 101 may not be an opening, but a light-transmitting material, such as plastic, glass, etc.

[0142] The electronic device 200 of the embodiment of the present application includes a shell assembly 100. The shell assembly 100 includes a shell 10 and a magnetic attraction assembly 20, wherein the shell 10 has a sink 11; the magnetic attraction assembly 20 is partially disposed in the sink 11; the magnetic attraction assembly 20 includes a magnet 21 and a first magnetic isolation sheet 22, wherein the magnet 21 is located between the shell 10 and the first magnetic isolation sheet 22. The magnetic attraction assembly 20 can enable the receiving end wireless charging module 30 of the electronic device 200 to be precisely aligned with the receiving end wireless charging module 30 of the wireless charging device, thereby avoiding misalignment between the receiving end wireless charging module 30 and the transmitting end wireless charging module, and improving the charging speed and charging efficiency of the electronic device 200. In addition, the magnetic component 20 is partially disposed in the sink 11. When the shell component 100 serves as the back cover of the electronic device 200, the magnetic component 20 can reduce the encroachment on the internal space of the electronic device 200, thereby making the thickness of the electronic device 200 thinner or, under the condition of the same thickness, increasing the volume and capacity of the power supply module, and improving the endurance of the electronic device 200. Furthermore, the magnetic component 20 includes a magnet 21 and a first magnetic isolation sheet 22. The first magnetic isolation sheet 22 is located on the side of the magnet 21 away from the shell 10. This can better prevent the magnetic field generated by the magnet 21 from overflowing, thereby affecting the signal of the electronic device 200, thereby making the operation of the electronic device 200 smoother.

[0143] It can be understood that the electronic device 200 described in this embodiment is merely a form of electronic device 200 used by the shell assembly 100, and should not be understood as a limitation on the electronic device 200 provided in this application, nor should it be understood as a limitation on the shell assembly 100 provided in each embodiment of this application.

[0144] References to "embodiments" or "implementation manners" in this application mean that specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appearing at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of this application may be arbitrarily combined with each other without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of this application.

[0145] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solutions of this application and not to limit them. Although the technical solutions of this application have been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that modifications or equivalent replacements of the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A housing assembly, characterized in that, Comprising: A housing having a sunk groove; And A magnetic attraction assembly, part of which is embedded in the sunk groove. The magnetic attraction assembly includes a magnet and a first magnetic isolation sheet, and the magnet is located between the housing and the first magnetic isolation sheet.

2. The housing assembly according to claim 1, wherein, The thickness of the housing ranges from 0.25 mm to 1.0 mm, and the depth of the sunk groove ranges from 10 μm to 200 μm.

3. The housing assembly according to claim 1, wherein The housing includes at least one layer of fiber resin layer. When the number of the fiber resin layers is multiple, the multiple fiber resin layers are stacked in sequence; the fiber resin layer includes a fiber cloth and a resin, and the resin wraps the surface of the fiber cloth.

4. The housing assembly according to claim 1, wherein The sunk groove is an arc ring. The inner diameter R1 of the sunk groove ranges from 45.7 mm to 46.2 mm, and the outer diameter of the sunk groove ranges from 53.9 mm to 54.5 mm.

5. The housing assembly according to claim 1, wherein The thickness of the first magnetic isolation sheet ranges from 0.05 mm to 0.5 mm.

6. The housing assembly according to claim 1, characterized in that, The thickness of the magnet ranges from 0.1 mm to 1 mm.

7. The housing assembly according to claim 1, characterized in that, The housing assembly further includes a receiving-end wireless charging module. The receiving-end wireless charging module includes a wireless charging coil. The wireless charging coil is disposed on one side of the housing having the sunk groove, and the magnetic attraction assembly is disposed around the outer periphery of the receiving-end wireless charging module.

8. The housing assembly according to claim 7, characterized in that, The receiving-end wireless charging module further includes a second magnetic isolation sheet. The second magnetic isolation sheet is disposed on the side of the wireless charging coil group facing away from the housing; the thickness of the second magnetic isolation sheet ranges from 0.01 mm to 0.5 mm.

9. The housing assembly according to claim 1, wherein The housing assembly further includes a first adhesive layer located between the housing and the magnet for bonding the magnet to the housing; the magnetic attraction assembly further includes a second adhesive layer located between the magnet and the first magnetic isolation sheet for bonding the magnet to the first magnetic isolation sheet.

10. An electronic device, characterized in that, The electronic device includes: A display screen having a display surface; The housing assembly according to any one of claims 1-9, the housing assembly is disposed on one side of the display screen, and the magnetic attraction assembly is located between the housing and the display screen; and A processor electrically connected to the display screen for controlling the display screen to display.

Images