Chip filtering and separating device for wafer cutting machine

Abstract

The invention relates to the technical field of solid-liquid separation, in particular to a chip filtering and separating device for a wafer cutting machine. The box body is provided with a filtering cavity; a filtering assembly is arranged in the filtering cavity; the box body is provided with a liquid outlet and a liquid inlet; a tray is movably arranged at the bottom of the filtering cavity in a lifting manner; the tray is provided with a waste seat; the waste seat is provided with a waste channel; a waste inlet is formed in the top of the waste seat; a waste outlet is formed in the bottom of the waste seat; the waste inlet is opposite to the top of the waste channel; the waste outlet is opposite to the bottom of the waste channel; an upper baffle is slidably arranged between the waste channel and the waste inlet. A lower baffle is slidably arranged between the waste channel and the waste outlet. A linkage mechanism is arranged between the upper baffle and the lower baffle. By arranging the upper baffle, the lower baffle and the linkage mechanism, communication and blocking between the waste inlet and the waste channel are controlled, communication and blocking between the waste outlet and the waste channel are controlled, and therefore solids can be automatically discharged.

Description

Technical Field

[0001] The present invention relates to the technical field of solid-liquid separation, and particularly to a chip filtering and separating device for a wafer cutting machine. Background Art

[0002] In the wafer cutting fluid circulation system, a large amount of suspended debris and particulate impurities will be mixed into the used cutting fluid. If these impurities are not removed in time, they will seriously affect the performance of the cutting fluid and the accuracy of the cutting process. Therefore, liquid-solid separation must be achieved through sedimentation and filtration means to ensure that the cutting fluid can be recycled. At present, most traditional filtering devices use sedimentation tanks as the main solid-liquid separation equipment. The principle is to use gravity to make the debris settle naturally in the sedimentation tank, and then the sediment at the bottom of the tank is cleaned regularly by artificial means. This method has many disadvantages: on the one hand, manual cleaning of the sediment not only requires a large amount of manpower and extremely high labor intensity; on the other hand, during the manual cleaning process, the operation of the filtration system needs to be suspended, and frequent cleaning operations are likely to cause the interruption of the filtration system operation, seriously affecting the continuity and stability of the whole machine operation, thereby reducing the production efficiency of wafer cutting, increasing production costs, and it is difficult to meet the requirements of the modern semiconductor manufacturing industry for high-efficiency and stable production. Summary of the Invention

[0003] The object of the present invention is to provide a chip filtering and separating device for a wafer cutting machine in view of the above deficiencies in the prior art.

[0004] The object of the present invention is achieved by the following technical solutions: A chip filtering and separating device for a wafer cutting machine, including a box body; the box body is provided with a filtering cavity; a filtering component is arranged in the filtering cavity; the box body is provided with a liquid outlet communicating with the filtering cavity at the top of the filtering component; the box body is provided with a liquid inlet communicating with the filtering cavity at the bottom of the filtering component;

[0005] A tray is arranged in a lifting and movable manner at the bottom of the filtering cavity; the tray is provided with a waste seat; the waste seat is provided with a waste channel; the top of the waste seat is provided with a waste inlet communicating with the filtering cavity; the bottom of the waste seat is provided with a waste outlet communicating with the outside; the waste inlet is arranged opposite to the top of the waste channel; the waste outlet is arranged opposite to the bottom of the waste channel;

[0006] An upper baffle is slidably arranged between the waste channel and the waste inlet; a lower baffle is slidably arranged between the waste channel and the waste outlet; a linkage mechanism is arranged between the upper baffle and the lower baffle;

[0007] A trigger hole is penetrated through the bottom of the box body; the waste seat is arranged in a telescopic and movable manner in the trigger hole.

[0008] The present invention is further configured such that a upper sliding groove is provided horizontally at the top of the waste seat; a lower sliding groove is provided horizontally at the bottom of the waste seat; the upper baffle is slidably arranged in the upper sliding groove; and the lower baffle is slidably arranged in the lower sliding groove.

[0009] The present invention is further configured such that the linkage mechanism includes an upper driving block that is telescopically and movably arranged horizontally in the waste seat and a lower driving block that is telescopically and movably arranged horizontally in the waste seat; the upper driving block is arranged on the top of the lower driving block; and linkage rods are provided between the upper driving block, the lower driving block, the upper baffle, and the lower baffle.

[0010] An upper inclined surface for abutting against the top of the trigger hole is provided at the bottom of the upper driving block; a lower inclined surface for abutting against the bottom of the trigger hole is provided at the top of the lower driving block; and a return spring is provided between the tray and the box body.

[0011] The present invention is further configured such that an upper strip-shaped groove and a lower strip-shaped groove are provided along the length direction of the linkage rod; an upper guiding pin is provided on the upper driving block; a lower guiding pin is provided on the lower driving block; the upper guiding pin is movably arranged in the upper strip-shaped groove; and the lower guiding pin is movably arranged in the lower strip-shaped groove.

[0012] The present invention is further configured such that an upper telescopic block is telescopically and movably arranged at the top of the linkage rod; an upper spring is provided between the linkage rod and the upper telescopic block; an upper horizontal groove is provided horizontally on the upper baffle; the upper telescopic block is movably arranged in the upper horizontal groove; a lower telescopic block is telescopically and movably arranged at the bottom of the linkage rod; a lower spring is provided between the linkage rod and the lower telescopic block; a lower horizontal groove is provided horizontally on the lower baffle; and the lower telescopic block is movably arranged in the lower horizontal groove.

[0013] The present invention is further configured such that a bubble generating disk is provided in the filtering cavity; the bubble generating disk is provided with a plurality of air holes; an air pipe communicating with the air holes is provided on the box body; and the bubble generating disk is arranged between the liquid inlet and the filtering assembly.

[0014] The present invention is further configured such that a diversion disk is provided at the top of the box body; a rotating seat is rotatably arranged at the bottom of the diversion disk; the rotating seat is provided with a liquid inlet channel; the bottom of the liquid inlet channel is the liquid inlet; and a driving motor for driving the rotating seat to rotate is provided on the diversion disk.

[0015] The present invention is further configured such that the filtering assembly includes a fixed ring fixedly arranged in the filtering cavity, a pressing plate that is lifted and lowered and arranged in the rotating seat, and a filter cotton arranged between the fixed ring and the pressing plate; and the pressing plate rotates synchronously with the rotating seat.

[0016] The present invention is further configured such that a cleaning inlet communicating with the filtering cavity is provided at the top of the box body above the filtering assembly; and a cleaning outlet communicating with the filtering cavity is provided at the bottom of the box body below the filtering assembly.

[0017] The present invention is further configured such that a cam ring is provided in the filtering cavity; the extrusion plate is provided with a connecting rod; and the connecting rod abuts against the cam ring.

[0018] Advantages of the present invention: By providing an upper baffle, a lower baffle and a linkage mechanism, the present invention controls the connection and disconnection between the waste inlet and the waste channel and the connection and disconnection between the waste outlet and the waste channel, so as to be able to automatically discharge solid substances. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of the present invention;

[0020] Figure 2 is a schematic structural diagram of another perspective of the present invention;

[0021] Figure 3 is a sectional view of the first state of the present invention;

[0022] Figure 4 is Figure 3 a partial enlarged view of part A in

[0023] Figure 5 is a sectional view of the second state of the present invention;

[0024] Figure 6 is Figure 5 a partial enlarged view of part B in

[0025] Wherein: 1, box body; 11, filtering cavity; 12, liquid outlet; 13, cleaning inlet; 14, cleaning outlet; 21, tray; 22, trigger hole; 23, return spring; 3, waste seat; 31, waste channel; 32, waste inlet; 33, waste outlet; 34, upper sliding groove; 35, lower sliding groove; 41, upper baffle; 42, lower baffle; 43, upper horizontal groove; 44, lower horizontal groove; 51, upper driving block; 52, lower driving block; 53, upper inclined surface; 54, lower inclined surface; 55, upper guide pin; 56, lower guide pin; 6, linkage rod; 61, upper strip-shaped groove; 62, lower strip-shaped groove; 63, upper telescopic block; 64, lower telescopic block; 65, upper spring; 66, lower spring; 7, bubble generating disc; 71, air hole; 72, air pipe; 8, diversion disc; 81, driving motor; 82, rotating seat; 83, liquid inlet channel; 84, liquid inlet; 91, fixed ring; 92, extrusion plate; 93, filter cotton; 94, cam ring; 95, connecting rod. Detailed Embodiments

[0026] The present invention will be further described in conjunction with the following embodiments.

[0027] By Figures 1 to 6It can be seen that a chip filtering and separating device for a wafer cutting machine according to this embodiment includes a box body 1; the box body 1 is provided with a filtering cavity 11; a filtering component is arranged in the filtering cavity 11; the box body 1 is provided with a liquid outlet 12 communicated with the filtering cavity 11 at the top of the filtering component; the box body 1 is provided with a liquid inlet 84 communicated with the filtering cavity 11 at the bottom of the filtering component;

[0028] A tray 21 is arranged at the bottom of the filtering cavity 11 in a lifting and movable manner; the tray 21 is provided with a waste seat 3; the waste seat 3 is provided with a waste channel 31; the top of the waste seat 3 is provided with a waste inlet 32 communicated with the filtering cavity 11; the bottom of the waste seat 3 is provided with a waste outlet 33 communicated with the outside; the waste inlet 32 is arranged opposite to the top of the waste channel 31; the waste outlet 33 is arranged opposite to the bottom of the waste channel 31;

[0029] An upper baffle 41 is slidably arranged between the waste channel 31 and the waste inlet 32; a lower baffle 42 is slidably arranged between the waste channel 31 and the waste outlet 33; a linkage mechanism is arranged between the upper baffle 41 and the lower baffle 42;

[0030] A trigger hole 22 is penetrated through the bottom of the box body 1; the waste seat 3 is arranged in the trigger hole 22 in a telescopic and movable manner.

[0031] Specifically, when the chip filtering and separating device for a wafer cutting machine according to this embodiment is in use, the waste liquid enters the filtering cavity 11 from the liquid inlet 84. The solid substances with heavier weight settle in the tray 21, and the liquid passes upward through the filtering of the filtering component and flows out from the liquid outlet 12, thereby completing the solid-liquid separation.

[0032] When the overall weight of the tray 21 is relatively light, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, and the upper baffle 41 does not block the waste inlet 32 and the waste channel 31. At this time, the waste inlet 32 and the waste channel 31 are in a communicating state; the solid substances enter the waste channel 31 from the waste inlet 32. Since the lower baffle 42 blocks the waste inlet 32 and the waste channel 31, the solid substances accumulate in the waste channel 31. When the weight of the solid substances accumulated on the tray 21 is sufficient, the tray 21 drives the waste seat 3 to move downward. Through the action of the linkage mechanism, the upper baffle 41 blocks the waste outlet 33 and the waste channel 31 to prevent the waste liquid from entering the waste channel 31, and the lower baffle 42 opens and communicates the waste inlet 32 and the waste channel 31, so that the solid substances in the waste channel 31 fall from the waste outlet 33.

[0033] In this embodiment, by providing an upper baffle 41, a lower baffle 42 and a linkage mechanism, the communication and blockage between the waste inlet 32 and the waste channel 31 and the communication and blockage between the waste outlet 33 and the waste channel 31 are controlled, so that solid objects can be automatically discharged.

[0034] For the chip filtering and separating device for a wafer cutting machine described in this embodiment, an upper sliding groove 34 is provided horizontally at the top of the waste seat 3; a lower sliding groove 35 is provided horizontally at the bottom of the waste seat 3; the upper baffle 41 is slidably arranged in the upper sliding groove 34; the lower baffle 42 is slidably arranged in the lower sliding groove 35. For the chip filtering and separating device for a wafer cutting machine described in this embodiment, the linkage mechanism includes an upper driving block 51 that is telescopically and movably arranged horizontally on the waste seat 3 and a lower driving block 52 that is telescopically and movably arranged horizontally on the waste seat 3; the upper driving block 51 is arranged on the top of the lower driving block 52; a linkage rod 6 is provided between the upper driving block 51, the lower driving block 52, the upper baffle 41 and the lower baffle 42; an upper inclined surface 53 for abutting against the top of the trigger hole 22 is provided at the bottom of the upper driving block 51; a lower inclined surface 54 for abutting against the bottom of the trigger hole 22 is provided at the top of the lower driving block 52; a return spring 23 is provided between the tray 21 and the box body 1. For the chip filtering and separating device for a wafer cutting machine described in this embodiment, the linkage rod 6 is provided with an upper strip-shaped groove 61 and a lower strip-shaped groove 62 along its length direction; the upper driving block 51 is provided with an upper guiding pin 55; the lower driving block 52 is provided with a lower guiding pin 56; the upper guiding pin 55 is movably arranged in the upper strip-shaped groove 61; the lower guiding pin 56 is movably arranged in the lower strip-shaped groove 62. For the chip filtering and separating device for a wafer cutting machine described in this embodiment, an upper telescopic block 63 is telescopically and movably arranged at the top of the linkage rod 6; an upper spring 65 is provided between the linkage rod 6 and the upper telescopic block 63; an upper horizontal groove 43 is provided horizontally on the upper baffle 41; the upper telescopic block 63 is movably arranged in the upper horizontal groove 43; a lower telescopic block 64 is telescopically and movably arranged at the bottom of the linkage rod 6; a lower spring 66 is provided between the linkage rod 6 and the lower telescopic block 64; a lower horizontal groove 44 is provided horizontally on the lower baffle 42; the lower telescopic block 64 is movably arranged in the lower horizontal groove 44.

[0035] Specifically, for the chip filtering and separating device for a wafer cutting machine described in this embodiment, when in use, the waste liquid enters the filtering chamber 11 from the liquid inlet 84, the solid objects with heavier weight settle in the tray 21, and the liquid then passes upward through the filtration of the filtration component and flows out from the liquid outlet 12, thus completing the solid-liquid separation.

[0036] When the solid objects with heavier weight settle in the tray 21, under the action of the return spring 23, as in Figure 3 the first state shown and Figure 4As shown, the upper driving block 51 is located at the top of the triggering hole 22. The upper driving block ५१ extends out of the waste seat 3 and does not contact the top of the triggering hole 22. The lower driving block 52 retracts into the waste seat 3. At this time, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, while the upper baffle 41 does not block the waste inlet 32 and the waste channel 31, and the waste inlet 32 and the waste channel 31 are in a connected state;

[0037] Solid objects enter the waste channel 31 from the waste inlet 32. Since the lower baffle 42 blocks the waste inlet 32 and the waste channel 31, the solid objects accumulate in the waste channel 31. When the weight of the solid objects accumulated on the tray 21 is sufficient, the tray 21 gradually moves downward against the action of the return spring 23 until the upper inclined surface 53 of the upper driving block 51 abuts against the top of the triggering hole 22, as Figure 5 shown in the second state and Figure 6 as shown, the triggering hole 22 pushes the upper driving block 51 to move inside the waste seat 3. When the upper driving block 51 is completely retracted into the waste seat 3, under the action of the linkage rod 6, the upper telescopic block 63 and the lower telescopic block 64, the upper baffle 41 blocks the waste outlet 33 and the waste channel 31 to prevent the waste liquid from entering the waste channel 31. The lower driving block 52 extends out of the waste seat 3 and does not contact the bottom of the triggering hole 22. At the same time, the lower baffle 42 opens and connects the waste inlet 32 and the waste channel 31, so that the solid objects in the waste channel 31 fall from the waste outlet 33, completing one discharge of solid objects.

[0038] After the solid objects are discharged from the waste channel 31, the weight of the tray 21 decreases. Thus, under the action of the return spring 23, the tray 21 moves upward. After the lower inclined surface 54 of the lower driving block 52 abuts against the bottom of the triggering hole 22, the triggering hole 22 pushes the lower driving block 52 to move inside the waste seat 3. When the lower driving block 52 is completely retracted into the waste seat 3, under the action of the linkage rod 6, the upper telescopic block 63 and the lower telescopic block 64, the upper driving block 51 is again located at the top of the triggering hole 22. The upper driving block 51 extends out of the waste seat 3 and does not contact the top of the triggering hole 22. The lower driving block 52 retracts into the waste seat 3. At this time, the lower baffle 42 blocks the waste outlet 33 and the waste channel 31, while the upper baffle 41 does not block the waste inlet 32 and the waste channel 31, and the waste inlet 32 and the waste channel 31 are in a connected state.

[0039] A chip filtering and separating device for a wafer cutting machine according to this embodiment. A bubble generating disc 7 is arranged in the filtering chamber 11; the bubble generating disc 7 is provided with a plurality of air holes 71; the box body 1 is provided with an air pipe 72 communicated with the air holes 71; the bubble generating disc 7 is arranged between the liquid inlet 84 and the filtering component. Specifically, by the above arrangement, gas can be introduced into the air pipe 72 to generate bubbles in the liquid in the filtering chamber , and the lighter solid substances are carried by the bubbles during the rising process, so that they gradually float up and adsorb to the filtering component; while the heavier solid substances continue to settle to the tray 21, which speeds up the overall liquid-solid separation efficiency and improves the filtering effect.

[0040] A chip filtering and separating device for a wafer cutting machine according to this embodiment. A diversion disc 8 is arranged at the top of the box body 1; a rotating seat 82 is rotatably arranged at the bottom of the diversion disc 8; the rotating seat 82 is provided with a liquid inlet channel 83; the bottom of the liquid inlet channel 83 is the liquid inlet 84; the diversion disc 8 is provided with a driving motor 81 for driving the rotating seat 82 to rotate. A chip filtering and separating device for a wafer cutting machine according to this embodiment. The filtering component includes a fixing ring 91 fixedly arranged in the filtering chamber 11, a pressing plate 92 arranged on the rotating seat 82 in a lifting and movable manner, and a filter cotton 93 arranged between the fixing ring 91 and the pressing plate 92; the pressing plate 92 rotates synchronously with the rotating seat 82. A chip filtering and separating device for a wafer cutting machine according to this embodiment. The box body 1 is provided with a cleaning inlet 13 communicated with the filtering chamber 11 at the top of the filtering component; the box body 1 is provided with a cleaning outlet 14 communicated with the filtering chamber 11 at the bottom of the filtering component. A chip filtering and separating device for a wafer cutting machine according to this embodiment. A cam ring 94 is arranged in the filtering chamber 11; the pressing plate 92 is provided with a connecting rod 95; the connecting rod 95 abuts against the cam ring 94.

[0041] Specifically, for the chip filtering and separating device for a wafer cutting machine according to this embodiment, when the waste liquid is normally subjected to solid-liquid separation, the driving motor 81 drives the rotating seat 82 to rotate, so that the pressing plate 92 rotates synchronously, so that the connecting rod 95 moves to the peak of the cam ring 94, so that the connecting rod 95 drives the pressing plate 92 to move downward, compresses the filter cotton 93, and makes the aperture of the filter cotton 93 smaller, effectively filtering the waste liquid.

[0042] When the filter cotton 93 needs to be cleaned, cleaning liquid is introduced from the cleaning inlet 13, and at the same time, the driving motor 81 is started to drive the rotating seat 82 to rotate continuously, so that the pressing plate 92 rotates continuously. When the connecting rod 95 moves along the cam ring 94, the pressing plate 92 moves up and down continuously, that is, continuously squeezes and relaxes the filter cotton 93, which can effectively clean the filter cotton 93, and the cleaning liquid is discharged from the cleaning outlet 14.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A chip filtering and separating device for a wafer cutting machine, characterized in that: It includes a box body (1); the box body (1) is provided with a filtering cavity (11); a filtering component is arranged in the filtering cavity (11); the box body (1) is provided with a liquid outlet (12) communicating with the filtering cavity (11) at the top of the filtering component; the box body (1) is provided with a liquid inlet (84) communicating with the filtering cavity (11) at the bottom of the filtering component; A tray (21) is arranged at the bottom of the filtering cavity (11) in a lifting and movable manner; a waste seat (3) is arranged on the tray (21); the waste seat (3) is provided with a waste channel (31); a waste inlet (32) communicating with the filtering cavity (11) is arranged at the top of the waste seat (3); a waste outlet (33) communicating with the outside is arranged at the bottom of the waste seat (3); the waste inlet (32) is arranged opposite to the top of the waste channel (31); the waste outlet (33) is arranged opposite to the bottom of the waste channel (31); An upper baffle (41) is slidably arranged between the waste channel (31) and the waste inlet (32); a lower baffle (42) is slidably arranged between the waste channel (31) and the waste outlet (33); a linkage mechanism is arranged between the upper baffle (41) and the lower baffle (42); A trigger hole (22) penetrates through the bottom of the box body (1); the waste seat (3) is arranged in the trigger hole (22) in a telescopic and movable manner.

2. The chip filtering and separating device for a wafer cutting machine according to claim 1, characterized in that: An upper sliding groove (34) is arranged horizontally at the top of the waste seat (3); a lower sliding groove (35) is arranged horizontally at the bottom of the waste seat (3); the upper baffle (41) is slidably arranged in the upper sliding groove (34); the lower baffle (42) is slidably arranged in the lower sliding groove (35).

3. The chip filtering and separating device for a wafer cutting machine according to claim 2, wherein: The linkage mechanism includes an upper driving block (51) arranged in the waste seat (3) in a horizontally telescopic and movable manner and a lower driving block (52) arranged in the waste seat (3) in a horizontally telescopic and movable manner; the upper driving block (51) is arranged at the top of the lower driving block (52); a linkage rod (6) is arranged among the upper driving block (51), the lower driving block (52), the upper baffle (41) and the lower baffle (42); An upper inclined surface (53) for abutting against the top of the trigger hole (22) is arranged at the bottom of the upper driving block (51); a lower inclined surface (54) for abutting against the bottom of the trigger hole (22) is arranged at the top of the lower driving block (52); a return spring (23) is arranged between the tray (21) and the box body (1).

4. A chip filtering and separating device for a wafer cutting machine according to claim 3, characterized in that: The linkage rod (6) is provided with an upper strip-shaped groove (61) and a lower strip-shaped groove (62) along the length direction; the upper driving block (51) is provided with an upper guiding pin (55); the lower driving block (52) is provided with a lower guiding pin (56); the upper guiding pin (55) is movably arranged in the upper strip-shaped groove (61); the lower guiding pin (56) is movably arranged in the lower strip-shaped groove (62).

5. A chip filtering and separating device for a wafer cutting machine according to claim 4, characterized in that: The top of the linkage rod (6) is telescopically and movably provided with an upper telescopic block (63); an upper spring (65) is arranged between the linkage rod (6) and the upper telescopic block (63); the upper baffle plate (41) is provided with an upper horizontal groove (43) in the horizontal direction; the upper telescopic block (63) is movably arranged in the upper horizontal groove (43); the bottom of the linkage rod (6) is telescopically and movably provided with a lower telescopic block (64); a lower spring (66) is arranged between the linkage rod (6) and the lower telescopic block (64); the lower baffle plate (42) is provided with a lower horizontal groove (44) in the horizontal direction; the lower telescopic block (64) is movably arranged in the lower horizontal groove (44).

6. The chip filtering and separating device for a wafer cutting machine according to claim 1, characterized in that: A bubble generating disc (7) is arranged in the filtering cavity (11); the bubble generating disc (7) is provided with a plurality of air holes (71); the box body (1) is provided with an air pipe (72) communicated with the air holes (71); the bubble generating disc (7) is arranged between the liquid inlet (84) and the filtering component.

7. A chip filtering and separating device for a wafer cutting machine according to claim 1, characterized in that: The top of the box body (1) is provided with a diversion disc (8); the bottom of the diversion disc (8) is rotatably provided with a rotating seat (82); the rotating seat (82) is provided with a liquid inlet channel (83); the bottom of the liquid inlet channel (83) is the liquid inlet (84); the diversion disc (8) is provided with a driving motor (81) for driving the rotating seat (82) to rotate.

8. The chip filtering and separating device for a wafer cutting machine according to claim 7, characterized in that: The filtering component includes a fixing ring (91) fixedly arranged in the filtering cavity (11), a pressing plate (92) arranged to be lifted and moved on the rotating seat (82), and a filtering cotton (93) arranged between the fixing ring (91) and the pressing plate (92); the pressing plate (92) rotates synchronously with the rotating seat (82).

9. The chip filtering and separating device for a wafer cutting machine according to claim 8, characterized in that: The box body (1) is provided with a cleaning inlet (13) communicated with the filtering cavity (11) at the top of the filtering component; the box body (1) is provided with a cleaning outlet (14) communicated with the filtering cavity (11) at the bottom of the filtering component.

10. A chip filtering and separating device for a wafer cutting machine according to claim 9, characterized in that: A cam ring (94) is arranged in the filtering cavity (11); the pressing plate (92) is provided with a connecting rod (95); the connecting rod (95) abuts against the cam ring (94).

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