TGV through hole machining device and machining method

Abstract

The invention discloses a TGV through hole machining device and method, and belongs to the technical field of glass through hole machining. The TGV through hole machining device comprises a base, a workbench is arranged on the base, vertical plates are arranged on the portions, located on the two sides of the workbench, of the base, a transverse plate is arranged on the tops of the vertical plates, and a laser generator is arranged on the top of the transverse plate; according to the through hole machining device, the storage block capable of being rapidly mounted and dismounted is arranged, a glass substrate is placed on the storage block, and through cooperation of a first electric telescopic machine and a second electric telescopic machine, the storage block is driven to move, the height is adjusted, through hole machining is conducted, and the machining efficiency is improved; the storage block is conveniently fed into the water tank for etching operation, the storage block is driven by a third electric telescopic machine to move to the sliding groove through cooperation of the inclined plane, the inclined plate arranged at the bottom of the storage block and the sliding plate, etching operation is conveniently completed, continuous machining of the machining device is facilitated, and the time and cost of manual transfer are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of glass through-hole processing, and particularly relates to a TGV through-hole processing device and a processing method. Background Art

[0002] Laser modification selective etching technology, especially laser-induced deep etching (LIDE) technology, locally modifies glass through laser, and then uses chemical etching to remove the modified area, thereby realizing high-precision and high-efficiency micro-structure processing.

[0003] However, when the laser modification etching technology is used to process a large number of glass substrates, it cannot be carried out continuously, and a large amount of manual transfer and irradiation are required, and the processing efficiency is not high enough.

[0004] Therefore, we propose a TGV through-hole processing device and a processing method. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a TGV through-hole processing device and a processing method, which overcome the deficiencies of the prior art and aim to solve the problems in the background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A TGV through-hole processing device and a processing method, including a base, a workbench is arranged on the base, vertical plates are arranged on both sides of the base under the workbench, a cross plate is arranged at the top of the vertical plates, a laser generator is arranged at the top of the cross plate, the output end of the laser generator extends to the lower part of the cross plate, fixing plates are arranged on both sides of the workbench, a movable block is movably arranged at the top of the fixing plates, a first electric telescopic machine is arranged on the movable block, a moving plate is fixedly connected to the end of the first electric telescopic machine, a cavity is opened in the middle of the moving plate, an object placing block is slidably arranged in the cavity, an immersion tank is arranged on the workbench, a support mechanism is arranged at the top of the immersion tank, and a chute is opened in the middle of the workbench, and one end of the chute communicates with the immersion tank.

[0007] In a preferred example of the present invention, it can be further configured as follows: A second electric telescopic machine is arranged at one end of the fixing plate away from the vertical plate, a movable groove is opened at the top of the fixing plate, the output shaft of the second electric telescopic machine extends into the interior of the movable groove and is fixedly connected to the movable block, a limiting groove is opened on the opposite surface of the fixing plate, a limiting block is slidably arranged in the limiting groove, and an L-shaped plate is connected through the limiting block, and the L-shaped plate is connected to the bottom of the movable block through a connecting rod.

[0008] In a preferred example of the present invention, it can be further configured as follows: The object placing block is hollow, a through hole is opened in the middle of the object placing block, support plates are arranged on opposite surfaces of the through hole, and pressing plates are rotatably arranged above the support plates on opposite surfaces of the through hole.

[0009] In a preferred example, the present invention can be further configured as follows: grooves are provided at the four corners of the bottom of the storage block, springs are provided in the grooves, movable rods are connected through the springs, and a sloping plate and a sliding plate are respectively connected through the movable rods.

[0010] In a preferred example, the present invention can be further configured as follows: the sliding plate is adapted to the sliding groove, a water tank is provided in the soaking tank, an inclined surface is provided at one end of the water tank close to the sliding groove, and a third electric telescopic machine is provided at one end of the soaking tank away from the sliding groove, and the output shaft of the third electric telescopic machine extends into the interior of the soaking tank.

[0011] In a preferred example, the present invention can be further configured as follows: rotating rods are provided on the surfaces of the soaking tank, collar rings are sleeved on the rotating rods, and rotating baffles are installed through the collar rings, an extension box is provided on one side of the soaking tank close to the sliding groove, and a water inlet and outlet is provided on the extension box.

[0012] In a preferred example, the present invention can be further configured as follows: the sliding groove is inclined, guiding seats are symmetrically provided on both sides of the sliding groove, upper through grooves and lower through grooves are formed in the guiding seats, guiding blocks are slidably provided on the guiding seats, a guiding block is fixedly provided at the bottom of the guiding block, and water holes are uniformly formed on the surface of the sliding groove.

[0013] A processing method of a TGV through-hole processing device includes the following steps:

[0014] S1. First, place the glass substrate to be processed on the support plate provided on the storage block, limit the periphery of the substrate by rotating the pressing plate, and install the storage block on the moving plate.

[0015] S2. Then, start the second electric telescopic machine to move the moving plate to the bottom of the laser generator, drive the moving plate to adjust the height position through the first electric telescopic machine, start the laser generator for laser processing to perform local modification, turn off the laser generator after the processing is completed, and at the same time drive the moving plate to move to the height where it abuts against the L-shaped plate through the first electric telescopic machine and then turn off the first electric telescopic machine, and start the second electric telescopic machine to drive the moving plate and the storage block to move above the soaking tank and abut against the rotating baffle.

[0016] S3. Control the rotating rod through an external power supply to drive the rotating baffle to rotate, so that the storage block linearly falls into the water tank on the soaking tank, add the required specific chemical etching agent in the water tank in advance to carry out the etching operation. After the storage block falls into the water tank, the second electric telescopic machine drives the moving plate to move to the initial position, push the storage block through the third electric telescopic machine, so that the sloping plate on the storage block abuts against the inclined surface provided on the soaking tank, and push the storage block into the sliding groove, and pull the storage block to the outside of the workbench through the guiding block to complete the laser modification etching operation.

[0017] Advantages of the present invention:

[0018] By providing a storage block that can be quickly installed and disassembled, placing a glass substrate on the storage block, and through the cooperation of the first electric telescopic machine and the second electric telescopic machine, driving the storage block to move and adjust the height for through-hole processing, the processing efficiency is improved;

[0019] Through the setting of the rotating baffle and the soaking tank, the storage block can be conveniently sent into the water tank for etching operations. Through the cooperation of the inclined plane, the inclined plate and the sliding plate provided at the bottom of the storage block, and driven by the third electric telescopic machine, the storage block is moved onto the sliding groove, which facilitates the completion of the etching operation and enables the processing device to perform continuous processing, reducing the time and cost of manual transfer;

[0020] Through the action of the guiding block and the guiding block, by the guiding block contacting the bottom of the storage block, the fixation of the storage block is realized, further pulling the storage block and the glass substrate to move, and discharging the surface etching machine into the bottom extension box through the water hole. Description of the Drawings

[0021] Figure 1 It is the overall front view structural schematic diagram of the present invention;

[0022] Figure 2 It is the overall rear view structural schematic diagram of the present invention;

[0023] Figure 3 It is the structural schematic diagram of the soaking tank of the present invention;

[0024] Figure 4 It is the structural schematic diagram of the storage block of the present invention;

[0025] Figure 5 It is of the present invention Figure 2 The enlarged schematic diagram of the structure at A;

[0026] Figure 6 It is the structural schematic diagram of the guiding block of the present invention.

[0027] In the figure: 1. Base; 2. Vertical plate; 3. Horizontal plate; 4. Laser generator; 5. Workbench; 6. Column; 7. Fixed plate; 8. Limiting groove; 9. L-shaped plate; 10. Movable block; 11. First electric telescopic machine; 12. Movable groove; 13. Second electric telescopic machine; 14. Sliding groove; 15. Soaking tank; 16. Rotating rod; 17. Rotating baffle; 18. Water tank; 19. Third electric telescopic machine; 20. Storage block; 21. Movable rod; 22. Inclined plate; 23. Sliding plate; 24. Support plate; 25. Pressing plate; 26. Movable plate; 27. Extension box; 28. Inlet and outlet; 29. Guide seat; 30. Upper through groove; 31. Guiding block; 32. Guiding block; 33. Water hole; 34. Lower through groove. Detailed Embodiments

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0029] Please refer to Figures 1-6 , a TGV via hole processing device and a processing method, including a base 1, a workbench 5 is arranged on the base 1, vertical plates 2 are arranged on both sides of the base 1 and located at the two sides of the workbench 5, a cross plate 3 is arranged at the top of the vertical plates 2, a laser generator 4 is arranged at the top of the cross plate 3, the output end of the laser generator 4 extends to the lower part of the cross plate 3, fixing plates 7 are arranged on both sides of the workbench 5, a movable block 10 is movably arranged at the top of the fixing plate 7, a first electric telescopic machine 11 is arranged on the movable block 10, the end of the first electric telescopic machine 11 is fixedly connected with a moving plate 26, a cavity is formed in the middle of the moving plate 26, an object placing block 20 is slidably arranged in the cavity, an immersion tank 15 is arranged on the workbench 5, a support mechanism is arranged at the top of the immersion tank 15, a chute 14 is formed in the middle of the workbench 5, and one end of the chute 14 is communicated with the immersion tank 15.

[0030] Among them, the output end of the laser generator 4 extends to the lower part of the cross plate 3, and an ultrashort pulse beam is generated by the laser generator. A beam shaping unit is further arranged on the output end. The beam output by the laser is shaped by the beam shaping unit by means of the aperture method, so that the spot shape, energy distribution, etc. meet the requirements of subsequent processing. The ultrashort pulse beam has extremely high energy density and extremely short action time, can realize high-precision processing on the glass substrate, reduce the heat affected zone at the same time, and avoid unnecessary damage to the glass substrate. This laser processing method is particularly suitable for the manufacture of TGV via holes, because it can accurately remove materials and form the required via hole shape without damaging the glass substrate.

[0031] One end of the fixed plate 7 away from the vertical plate 2 is provided with a second electric telescopic machine 13. An activity groove 12 is opened at the top of the fixed plate 7. The output shaft of the second electric telescopic machine 13 extends into the interior of the activity groove 12 and is fixedly connected to the activity block 10. Limiting grooves 8 are opened on the opposite surfaces of the fixed plate 7. A limiting block is slidably arranged in the interior of the limiting groove 8, and an L-shaped plate 9 is connected through the limiting block. The L-shaped plate 9 and the bottom of the activity block 10 are connected through a connecting rod. This structural design enables the activity block 10 to move stably on the fixed plate 7, and through the cooperation of the limiting block and the L-shaped plate 9, the position of the activity block 10 can be accurately controlled, thereby realizing the precise positioning of the storage block 20. This precise positioning is crucial for the TGV through-hole processing because the position accuracy of the through-hole directly affects the subsequent interconnection performance.

[0032] Particularly, a moving plate 26 is arranged between two L-shaped plates 9. The two ends of the moving plate 26 respectively abut against the opposite surfaces of the two L-shaped plates 9. A plurality of columns 6 are arranged on the base 1 to support the workbench 5 through the columns 6. A protrusion is arranged at the bottom of the activity block 10 corresponding to the activity groove 12. The protrusion is embedded in the activity groove 12, and the end of the second electric telescopic machine 13 is fixedly connected to the protrusion. The L-shaped plate 9 is fixedly connected to the limiting block, which is convenient for the L-shaped plate 9 to always abut against the fixed plate 7. This structural design not only ensures the stability of the moving plate 26 but also realizes the precise movement of the moving plate 26 through the second electric telescopic machine 13. During the TGV through-hole processing, this precise movement ability enables the processing device to adjust the processing position as needed, thereby realizing high-precision processing.

[0033] The storage block 20 is hollowly arranged. A through-hole is opened in the middle of the storage block 20. Support plates 24 are arranged on the opposite surfaces of the through-hole. Pressing plates 25 are rotatably arranged above the support plates 24 on the opposite surfaces of the through-hole. This design enables the glass substrate to be stably placed on the storage block 20, and the glass substrate can be fixed by rotating the pressing plates 25. During the TGV through-hole processing, the stable fixation of the glass substrate is one of the key factors to ensure the processing quality.

[0034] It should be noted that notches are opened on both sides of the storage block 20. The moving plate 26 is provided with clamping blocks corresponding to the notches. A fourth electric telescopic machine for driving the clamping blocks to move is arranged inside the moving plate 26. The clamping blocks arranged on the moving block 26 are driven by the fourth electric telescopic machine to clamp and fix the storage block 20, which is convenient for the staff to quickly install the storage block 20 and quickly release the storage block 20 when the storage block 20 moves above the water tank 18, so that the storage block 20 falls onto the four rotating baffle plates 17, which is convenient for the next processing.

[0035] Grooves are provided at the four corners of the bottom of the storage block 20. Springs are provided in the grooves and are connected to the movable rods 21 through the springs. The inclined plate 22 and the sliding plate 23 are respectively connected through the movable rods 21.

[0036] Furthermore, the inclined plate 22 is adapted to the inclined surface angle provided on the soaking tank 15. The storage block 20 is pushed onto the sliding groove 14 through the inclined plate 22 and slides on the sliding groove 14 through the action of the sliding plate 23 and the inclined plate 22. The surface of the sliding groove 14 is smoothly arranged, and the storage block 20 is grabbed by the robotic arm gripper provided externally for the next processing and transportation. This design enables the storage block 20 to cooperate well with the inclined surface of the soaking tank 15 and the sliding groove 14 through the inclined plate 22 and the sliding plate 23 during the movement process. During the TGV through-hole processing, this good cooperation can ensure that the storage block 20 smoothly moves from the soaking tank 15 to the sliding groove 14, thereby realizing continuous processing.

[0037] The sliding plate 23 is adapted to the sliding groove 14. This design ensures the smooth movement of the storage block 20 in the sliding groove 14 and avoids jamming or wear caused by the mismatch between the sliding plate 23 and the sliding groove 14. A water tank 18 is provided in the soaking tank 15. One end of the water tank 18 close to the sliding groove 14 is provided with an inclined surface. This inclined surface design helps the storage block 20 to smoothly slide from the water tank 18 to the sliding groove 14 after soaking. A third electric telescopic machine 19 is provided at one end of the soaking tank 15 away from the sliding groove 14. The output shaft of the third electric telescopic machine 19 extends into the interior of the soaking tank 15, which enables the third electric telescopic machine 19 to directly push the storage block 20 to move it along the inclined surface into the sliding groove 14.

[0038] Among them, a baffle is provided in the water tank 18 of the soaking tank 15, and the height of the baffle is the same as the height of the inclined surface provided on the soaking tank 15. This design ensures that the storage block 20 after soaking can smoothly move to the sliding groove 14 through the inclined surface. Rotating rods 16 are provided on the surface of the soaking tank 15. Collars are sleeved on the rotating rods 16, and a rotating baffle 17 is installed through the collars. This structure enables the rotating baffle 17 to rotate flexibly, thereby controlling the entry and exit of the storage block 20. A rotating motor for driving the rotating rod 16 to rotate is provided inside the inner wall of the soaking tank 15, and the rotating motor is electrically connected to the external electronic control board through PLC programming of model S4-400. This enables the entire rotating process to be automatically controlled, improving the processing efficiency and accuracy. An extension box 27 is provided on one side of the soaking tank 15 close to the sliding groove 14, and a water inlet and outlet 28 is provided on the extension box 27. This design facilitates the replacement and discharge of the liquid in the soaking tank 15.

[0039] Furthermore, the extension box 27 is connected to the immersion box 15, and an electric control valve is provided between the extension box 27 and the immersion box 15. This design of the electric control valve enables the precise control of the liquid flow, avoiding liquid waste and pollution. The extension box 27 is connected to the external water pump pipeline through the water inlet and outlet 28, and the etching agent waste liquid in the extension box 27 is pumped and treated by the water pump. This not only improves the efficiency of waste liquid treatment but also reduces environmental pollution.

[0040] The sliding groove 14 is inclined, and guide seats 29 are symmetrically arranged on both sides of the sliding groove 14. Upper through grooves 31 and lower through grooves 34 are formed in the guide seats 29. A guide block 31 is slidably arranged on the guide seat 29. A guiding block 32 is fixedly arranged at the bottom of the guide block 31. Water holes 33 are evenly formed on the surface of the sliding groove 14. The moving direction of the object placing block 20 in the sliding groove 14 is guided by the guide block 31 and the guiding block 32 to ensure its smooth sliding. Excess liquid can be discharged through the water holes 33 to prevent the liquid from accumulating and affecting the sliding of the object placing block 20.

[0041] Particularly, the inclination angle of the sliding groove 14 is 20°. This inclination angle is precisely calculated to ensure the best sliding effect of the object placing block 20 in the sliding groove 14. An L-shaped connecting plate is arranged at the bottom of the guide block 31 and is connected to the guiding block 32 through the L-shaped connecting plate. The L-shaped connecting plate penetrates through the upper through groove 31 and the lower through groove 34, and an electric push rod is arranged in the L-shaped connecting plate. The end of the electric push rod is fixedly connected to one side end of the guiding block 32. This design enables the guiding block 32 to move through the drive of the electric push rod, thereby driving the guide block 31 to move together. A fillet is arranged on the connecting side of the sliding groove 14 and the immersion box 15, facilitating the movement of the inclined plate 22 onto the sliding groove 14. Then, the inclined plate 22 and the sliding plate 23 move onto the sliding groove 14 under the action of the third electric telescopic machine 19. The bottom of the object placing block 20 is in contact with the upper surface of the guide block 32. By arranging an anti-slip pad on the surface of the guide block 32 and driving the guide block 32 to move away from the immersion box 15 side through the guiding block 31, the glass substrate is tractioned.

[0042] Furthermore, a driving unit is arranged in the guide seat 29 for driving the guide block 31 to move back and forth. This design further improves the traction ability and ensures the smooth movement of the object placing block 20 in the sliding groove 14.

[0043] Working principle:

[0044] S1. First, place the glass substrate to be processed on the support plate 24 arranged on the object placing block 20, limit the periphery of the substrate by rotating the pressing plate 25, and install the object placing block 20 on the moving plate 26. This design ensures the stability and safety of the glass substrate during the processing.

[0045] S2. Next, by starting the second electric telescopic machine 13, the moving plate 26 is moved to the bottom of the laser generator 4. The first electric telescopic machine 11 drives the moving plate 26 to adjust the height position. The laser generator 4 is started for laser processing to perform local modification. After the processing is completed, the laser generator 4 is turned off. At the same time, the first electric telescopic machine 11 drives the moving plate 26 to move to a height where it abuts against the L-shaped plate 9 and then the first electric telescopic machine 11 is turned off. The second electric telescopic machine 13 is started to drive the moving plate 26 and the object placing block 20 to move above the soaking tank 15 and abut against the rotating baffle 17. This process realizes the smooth transfer of the glass substrate from the laser processing area to the soaking area.

[0046] S3. The rotating rod 16 is controlled by an external power source to drive the rotating baffle 17 to rotate, so that the object placing block 20 linearly falls into the water tank 18 on the soaking tank 15. By pre-adding the required specific chemical etching agent in the water tank 18, the etching operation is carried out. After the object placing block 20 falls into the water tank 18, the second electric telescopic machine 13 drives the moving plate 26 to move to the initial position. The third electric telescopic machine 19 is used to push the object placing block 20, so that the inclined plate 22 on the object placing block 20 abuts against the inclined surface provided on the soaking tank 15, and the object placing block 20 is pushed into the sliding groove 14. The object placing block 20 is pulled to the outside of the workbench 5 through the guiding block 32 to complete the laser modification etching operation. This process realizes the etching treatment and subsequent transfer of the glass substrate.

[0047] Through the combination of laser processing and chemical etching, high-precision and high-efficiency through-hole processing is realized, which is particularly suitable for the processing of glass substrates. The design of the entire device takes into account all aspects of the processing. From the placement of the glass substrate, laser processing, etching treatment to the final transfer, automation and high-precision control are achieved, greatly improving the processing efficiency and quality.

[0048] Finally, it should be noted that: in the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0049] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0050] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A TGV via processing device, characterized in that, It includes a base (1), on which a workbench (5) is provided. Vertical plates (2) are provided on both sides of the base (1) at the positions of the workbench (5). A cross plate (3) is provided at the top of the vertical plates (2), and a laser generator (4) is provided at the top of the cross plate (3). The output end of the laser generator (4) extends to the lower part of the cross plate (3). Fixed plates (7) are provided on both sides of the workbench (5), and movable blocks (10) are movably provided at the tops of the fixed plates (7). A first electric telescopic machine (11) is provided on the movable blocks (10), and a movable plate (26) is fixedly connected to the end of the first electric telescopic machine (11). A cavity is provided in the middle of the movable plate (26), and an object placing block (20) is slidably provided in the cavity. An immersion tank (15) is provided on the workbench (5), a support mechanism is provided at the top of the immersion tank (15), a chute (14) is provided in the middle of the workbench (5), and one end of the chute (14) communicates with the immersion tank (15).

2. The TGV via hole processing device according to claim 1, characterized in that A second electric telescopic machine (13) is provided at one end of the fixed plate (7) away from the vertical plate (2). An activity groove (12) is provided at the top of the fixed plate (7). The output shaft of the second electric telescopic machine (13) extends into the interior of the activity groove (12) and is fixedly connected to the movable block (10). Limit grooves (8) are provided on the opposite surfaces of the fixed plate (7), limit blocks are slidably provided in the interior of the limit grooves (8), and an L-shaped plate (9) is connected through the limit blocks. The L-shaped plate (9) and the bottom of the movable block (10) are connected through a connecting rod.

3. A TGV via processing device according to claim 2, characterized in that, The object placing block (20) is hollow, a through hole is provided in the middle of the object placing block (20), support plates (24) are provided on the opposite surfaces of the through hole, and pressing plates (25) are rotatably provided above the support plates (24) on the opposite surfaces of the through hole.

4. The TGV via hole processing device according to claim 3, characterized in that, Grooves are provided at the four corners of the bottom of the object placing block (20), springs are provided in the grooves, and movable rods (21) are connected through the springs, and are respectively connected to an inclined plate (22) and a sliding plate (23) through the movable rods (21).

5. The TGV via hole processing device according to claim 4, characterized in that, The sliding plate (23) is adapted to the chute (14). A water tank (18) is provided in the immersion tank (15). An inclined surface is provided at one end of the water tank (18) close to the chute (14). A third electric telescopic machine (19) is provided at one end of the immersion tank (15) away from the chute (14), and the output shaft of the third electric telescopic machine (19) extends into the interior of the immersion tank (15).

6. The TGV via processing device according to claim 5, wherein, Rotating rods (16) are provided on the surfaces of the immersion tank (15), sleeves are sleeved on the rotating rods (16), and rotating baffles (17) are installed through the sleeves. An extension tank (27) is provided on one side of the immersion tank (15) close to the chute (14), and a water inlet and outlet (28) is provided on the extension tank (27).

7. The TGV via processing device according to claim 6, characterized in that, The chute (14) is inclined, guide seats (29) are symmetrically provided on both sides of the chute (14), upper through grooves (31) and lower through grooves (34) are provided on the guide seats (29), guide blocks (31) are slidably provided on the guide seats (29), guide blocks (32) are fixedly provided at the bottoms of the guide blocks (31), and water holes (33) are evenly provided on the surface of the chute (14).

8. A processing method of a TGV via hole processing device, using the processing device described in any one of claims 1-7, characterized in that, It includes the following steps: S1. First, place the glass substrate to be processed on the pallet (24) provided on the object placing block (20), limit the periphery of the substrate by rotating the pressing plate (25), and install the object placing block (20) on the moving plate (26); S2. Then, start the second electric telescopic machine (13) to move the moving plate (26) to the bottom of the laser generator (4). Drive the moving plate (26) to adjust the height position by the first electric telescopic machine (11), start the laser generator (4) for laser processing and local modification. After the processing is completed, turn off the laser generator (4). At the same time, drive the moving plate (26) by the first electric telescopic machine (11) to move to the height where it abuts against the L-shaped plate (9), then turn off the first electric telescopic machine (11), and start the second electric telescopic machine (13) to drive the moving plate (26) and the object placing block (20) to move above the soaking tank (15) and abut against the rotating baffle (17); S3. Control the rotating rod (16) through an external power source to drive the rotating baffle (17) to rotate, so that the object placing block (20) linearly falls into the water tank (18) on the soaking tank (15). Add the required specific chemical etching agent to the water tank (18) in advance to carry out the etching operation. After the object placing block (20) falls into the water tank (18), the second electric telescopic machine (13) drives the moving plate (26) to move to the initial position. Push the object placing block (20) by the third electric telescopic machine (19) so that the inclined plate (22) on the object placing block (20) abuts against the inclined surface provided on the soaking tank (15), and push the object placing block (20) into the sliding groove (14). Pull the object placing block (20) to the outside of the workbench (5) by the guide block (31) to complete the laser modification etching operation.

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