Perovskite solar cell online scanning type magnetron sputtering equipment and coating method

Abstract

The invention discloses perovskite solar cell online scanning type magnetron sputtering equipment and a coating method, and the equipment comprises an equipment body, and a front loading and unloading cavity, at least one coating process cavity and a rear loading and unloading cavity which are sequentially arranged in the equipment body, valves for controlling connection and disconnection are arranged between the front loading and unloading cavity and the coating process cavities, between the adjacent coating process cavities and between the coating process cavities and the rear loading and unloading cavity; the coating process cavity comprises a front buffer cavity, a cathode cavity and a rear buffer cavity, a sputtering power supply and a cathode assembly are arranged in the cathode cavity, and the cathode assembly performs glow-up discharge to realize substrate coating; and a conveying device is further arranged in the equipment body, and according to the preset coating process requirements, the conveying device is used for achieving reciprocating conveying of a carrier plate loaded with substrates among the front buffer cavity, the cathode cavity and the rear buffer cavity so as to complete coating. The device has the advantages of compact structure, high integration level, high automation degree, good coating effect and the like, and is beneficial to improving the coating yield.

Description

Technical Field

[0001] The present invention belongs to the technical field of substrate coating equipment, and particularly relates to an on-line scanning magnetron sputtering equipment for perovskite solar cells and a coating method thereof. Background Art

[0002] As a new force in the next generation of photovoltaics, perovskite solar cells have higher ultimate efficiency. The theoretical efficiency of a single-junction perovskite cell can reach 31%, and the efficiency of a tandem perovskite cell can reach 43%. They also have lower costs. The cost of a single perovskite cell module is about 50% of that of a crystalline silicon cell. The scanning magnetron sputtering coating equipment can be used to prepare the hole transport layer (HTL), transparent conductive layer, back electrode, etc. of perovskite solar cells, and is a key equipment for the preparation of perovskite cells. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an on-line scanning magnetron sputtering equipment for perovskite solar cells and a coating method thereof, which have a compact structure, high integration, high automation, good coating effect, and are conducive to improving the coating output.

[0004] To solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An on-line scanning magnetron sputtering equipment for perovskite solar cells includes an equipment body, and a front loading and unloading chamber, at least one coating process chamber, and a rear loading and unloading chamber that are sequentially arranged inside the equipment body. Valves for controlling on / off are provided between the front loading and unloading chamber and the coating process chamber, between adjacent coating process chambers, and between the coating process chamber and the rear loading and unloading chamber. The coating process chamber includes a front buffer chamber, a cathode chamber, and a rear buffer chamber. A sputtering power supply and a cathode assembly are arranged inside the cathode chamber, and the cathode assembly generates glow discharge to achieve substrate coating. A transmission device is also arranged inside the equipment body. According to the preset coating process requirements, the transmission device is used to reciprocally transfer the carrier plate loaded with the substrate between the front buffer chamber, the cathode chamber, and the rear buffer chamber to complete scanning sputtering coating.

[0006] As a further improvement of the present invention, a positioning device is also arranged inside the equipment body, and the positioning device is used to assist the transmission and positioning of the carrier plate.

[0007] As a further improvement of the present invention, the coating process chamber includes a first coating process chamber and a second coating process chamber. Valves for controlling on-off are provided between the first coating process chamber and the front loading and unloading chamber, between the first coating process chamber and the second coating process chamber, and between the second coating process chamber and the rear loading and unloading chamber. The cathode assembly in the first coating process chamber is a planar cathode, and the cathode assembly in the second coating process chamber is a rotating cathode, so as to realize that different types of films are respectively coated on the substrate in the first coating process chamber and the second coating process chamber.

[0008] As a further improvement of the present invention, the planar cathode includes a single-plane upper coating cathode, a single-plane lower coating cathode, a double-plane upper coating cathode, or a double-plane lower coating cathode.

[0009] As a further improvement of the present invention, the rotating cathode includes a single-rotation upper coating cathode, a single-rotation lower coating cathode, a double-rotation upper coating cathode, or a double-rotation lower coating cathode.

[0010] As a further improvement of the present invention, the sputtering power supply includes a radio frequency power supply, a DC pulse power supply, a DC power supply, or an intermediate frequency power supply.

[0011] As a further improvement of the present invention, the first coating process chamber includes a first front buffer chamber, a first cathode chamber, and a first rear buffer chamber, and the planar cathode is arranged inside the first cathode chamber. The second coating process chamber includes a second front buffer chamber, a second cathode chamber, and a second rear buffer chamber, and the rotating cathode is arranged inside the second cathode chamber.

[0012] As a further improvement of the present invention, the types of coatings include a hole transport layer (HTL) for preparing a perovskite solar cell, a transparent conductive layer, or a back electrode.

[0013] As a general technical concept, the present invention also provides a coating method based on the above-mentioned perovskite solar cell on-line scanning magnetron sputtering equipment, including the following steps:

[0014] Step S1: Place the substrate on the carrier plate. With the assistance of the transmission device and the positioning device, the carrier plate enters the front buffer chamber of the coating process chamber through the front loading and unloading chamber to wait for coating.

[0015] Step S2: Introduce process gas into the coating process chamber. After the pressure inside the coating process chamber is stable, turn on the sputtering power supply, and the cathode assembly starts to glow discharge.

[0016] Step S3: After the sputtering is stable, the transmission device transports the carrier plate through the cathode chamber to perform on-line scanning sputtering coating, and stops in the rear buffer chamber to complete one coating.

[0017] Step S4: According to the preset coating process, the transfer device reciprocally conveys the carrier plate inside the coating process chamber for on-line scanning sputtering coating;

[0018] Step S5: After the coating is completed, the transfer device conveys the carrier plate out from the front loading and unloading chamber or the rear loading and unloading chamber.

[0019] As a further improvement of the present invention, in the said Step S4, the preset coating process includes: the carrier plate loaded with the substrate reciprocally performs coating multiple times in the first coating process chamber to complete the first coating process, and then is conveyed to the second coating process chamber to reciprocally perform coating multiple times to complete the second coating process, and finally is conveyed out from the rear loading and unloading chamber;

[0020] Or, the carrier plate loaded with the substrate reciprocally performs coating multiple times in the first coating process chamber, and finally is conveyed out from the front loading and unloading chamber or the rear loading and unloading chamber;

[0021] Or, the carrier plate loaded with the substrate is conveyed to the second coating process chamber through the first coating process chamber, and reciprocally performs coating multiple times in the second coating process chamber, and finally is conveyed out from the front loading and unloading chamber or the rear loading and unloading chamber;

[0022] Or, the double-carrier-plate coating method is adopted, wherein one carrier plate loaded with the substrate reciprocally performs coating multiple times in the first coating process chamber and finally is conveyed out from the front loading and unloading chamber, and at the same time, the other carrier plate loaded with the substrate reciprocally performs coating multiple times in the second coating process chamber and finally is conveyed out from the rear loading and unloading chamber.

[0023] Compared with the prior art, the advantages of the present invention are as follows:

[0024] 1. The on-line scanning magnetron sputtering equipment for perovskite solar cells of the present invention is provided with a front loading and unloading chamber, at least one coating process chamber and a rear loading and unloading chamber in sequence inside the equipment body. And valves for controlling on-off are provided between the front loading and unloading chamber and the coating process chamber, between adjacent coating process chambers, and between the coating process chamber and the rear loading and unloading chamber, realizing the partition between each cavity and preventing cross-contamination between the coating cavities. Further, the coating process chamber includes a front buffer chamber, a cathode chamber and a rear buffer chamber, and a sputtering power supply and a cathode assembly are provided inside the cathode chamber. The cathode assembly is used for glow discharge to realize substrate coating. According to the preset coating process requirements, the transfer device is used to reciprocally transfer the carrier plate carrying the substrate between the front buffer chamber, the cathode chamber and the rear buffer chamber to complete scanning sputtering coating. The present invention innovatively adopts the scanning magnetron sputtering coating method in the field of perovskite solar cell coating, which is compatible with different types of target materials, low and high temperature and sputtering damage processes; adopts a cathode with adjustable high magnetic field intensity, has high target utilization rate, has the function of isolating and sputtering multi-layer coating, and is compatible with different types of sputtering power supply processes; realizes on-line simultaneous coating of two or more perovskite solar cell films, improves the conversion efficiency of perovskite cells and reduces the cost.

[0025] 2. The coating method of the present invention is as follows: First, the transfer device is used to transfer the carrier plate and the substrate into the front buffer chamber of the coating process chamber through the front loading and unloading chamber to wait for coating; then process gas is introduced into the coating process chamber. After the sputtering is stable, the carrier plate and the substrate are transferred through the cathode chamber for on-line scanning sputtering coating; and in combination with the preset coating process, the carrier plate and the substrate are reciprocally transferred in the coating process chamber for multiple coatings. After the coating is completed, the substrate is taken out from the front loading and unloading chamber or the rear loading and unloading chamber, realizing on-line coating of perovskite solar cells. And by using at least two or more coating process chambers, MW-level mass production coating is realized, significantly improving the production efficiency of perovskite solar cells. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic structural principle diagram of the on-line scanning magnetron sputtering equipment for perovskite solar cells in a specific embodiment of the present invention.

[0027] Figure 2 It is a schematic process diagram of the coating process of the on-line scanning magnetron sputtering equipment for perovskite solar cells in a specific embodiment of the present invention.

[0028] Legend: 1. Equipment body; 100. Carrier plate; 101. Substrate; 102. Transfer device; 103. Positioning device; 200. Front loading and unloading chamber; 300. First coating process chamber; 400. Second coating process chamber; 301. First front buffer chamber; 401. Second front buffer chamber; 302. First cathode chamber; 402. Second cathode chamber; 303. First rear buffer chamber; 403. Second rear buffer chamber; 500. Valve; 600. Planar cathode; 700. Sputtering power supply; 800. Rotating cathode; 900. Rear loading and unloading chamber. Detailed implementation mode

[0029] The present invention will be further described below in conjunction with the accompanying drawings of the specification and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0030] Embodiment 1

[0031] As Figure 1 shown, the perovskite solar cell in-line scanning magnetron sputtering equipment of the present invention includes an equipment body 1, and a front loading and unloading chamber 200, two coating process chambers, and a rear loading and unloading chamber 900 that are sequentially arranged inside the equipment body 1. Valves 500 for controlling on-off are provided between the front loading and unloading chamber 200 and the coating process chamber, between adjacent coating process chambers, and between the coating process chamber and the rear loading and unloading chamber 900. The coating process chamber includes a front buffer chamber, a cathode chamber, and a rear buffer chamber. A sputtering power supply 700 and a cathode assembly are provided inside the cathode chamber, and the cathode assembly generates glow discharge to achieve substrate coating. A transfer device 102 is also provided inside the equipment body 1. According to the preset coating process requirements, the transfer device 102 is used to reciprocally transfer the carrier plate 100 loaded with the substrate 101 between the front buffer chamber, the cathode chamber, and the rear buffer chamber to complete scanning sputtering coating.

[0032] In this embodiment, a front loading and unloading chamber 200, two coating process chambers, and a rear loading and unloading chamber 900 are sequentially arranged inside the equipment body 1. Moreover, valves 500 for controlling on-off are provided between the front loading and unloading chamber 200 and the coating process chamber, between adjacent coating process chambers, and between the coating process chamber and the rear loading and unloading chamber 900, realizing the isolation between each chamber and preventing cross-contamination between the coating chambers. Moreover, the equipment adopts a modular design, with strong scalability, high integration, a compact structure, and a small floor area. Further, the coating process chamber includes a front buffer chamber, a cathode chamber, and a rear buffer chamber. Moreover, a sputtering power supply 700 and a cathode assembly are arranged inside the cathode chamber. The cathode assembly is used for glow discharge to realize substrate coating. According to the preset coating process requirements, a transfer device is used to realize the reciprocating transfer of the carrier plate for loading the substrate between the front buffer chamber, the cathode chamber, and the rear buffer chamber to complete scanning magnetron sputtering coating. The present invention innovatively adopts a scanning magnetron sputtering coating method in the field of perovskite solar cell coating, which is compatible with different types of target materials, low and high temperature, and sputtering damage processes; adopts a cathode with adjustable high magnetic field intensity, has a high target utilization rate, has the function of isolating and sputtering multi-layer coatings, and is compatible with different types of sputtering power supply processes; realizes the online simultaneous coating of two or more perovskite solar cell films, improves the conversion efficiency of perovskite cells, and reduces the cost.

[0033] As Figure 1 shown, in this embodiment, a positioning device 103 is further arranged inside the equipment body 1. The positioning device 103 is used to assist the transfer and positioning of the carrier plate 100 to improve the accuracy of substrate 101 transfer and the quality of substrate 101 coating.

[0034] As Figure 1 shown, in this embodiment, the coating process chamber includes a first coating process chamber 300 and a second coating process chamber 400. Valves 500 for controlling on-off are provided between the first coating process chamber 300 and the front loading and unloading chamber 200, between the first coating process chamber 300 and the second coating process chamber 400, and between the second coating process chamber 400 and the rear loading and unloading chamber 900. The cathode assembly in the first coating process chamber 300 is a planar cathode 600, and the cathode assembly in the second coating process chamber 400 is a rotating cathode 800, so as to realize that different types of films are respectively coated on the substrate 101 in the first coating process chamber 300 and the second coating process chamber 400, that is, a magnetron sputtering device can simultaneously meet different types of coating requirements.

[0035] Further, the first coating process chamber 300 includes a first front buffer chamber 301, a first cathode chamber 302, and a first rear buffer chamber 303. The planar cathode 600 is arranged inside the first cathode chamber 302. The magnetic field intensity of the planar cathode 600 is adjustable, and a target is provided on the planar cathode 600.

[0036] The second coating process chamber 400 includes a second front buffer chamber 401, a second cathode chamber 402, and a second rear buffer chamber 403. The rotating cathode 800 is disposed inside the second cathode chamber 402. The magnetic field intensity of the rotating cathode 800 is adjustable, and a target is provided on the rotating cathode 800.

[0037] In this embodiment, the planar cathode 600 includes: a single-plane upper coating cathode, a single-plane lower coating cathode, a double-plane upper coating cathode, or a double-plane lower coating cathode.

[0038] The rotating cathode 800 includes: a single-rotation upper coating cathode, a single-rotation lower coating cathode, a double-rotation upper coating cathode, or a double-rotation lower coating cathode.

[0039] The sputtering power supply 700 includes: a radio frequency power supply, a DC pulse power supply, a DC power supply, or an intermediate frequency power supply.

[0040] In the actual production process, the cathode assembly and the sputtering power supply can be flexibly matched according to process requirements. In this embodiment, the types of coatings include a hole transport layer (HTL) for preparing a perovskite solar cell, a transparent conductive layer, or a back electrode.

[0041] Embodiment 2

[0042] As Figure 2 shown, the coating method of the present invention is implemented based on the perovskite solar cell on-line scanning magnetron sputtering device in Embodiment 1, and includes the following steps:

[0043] Step S1: The substrate 101 is placed on the carrier plate 100. With the assistance of the transfer device 102 and the positioning device 103, the carrier plate 100 enters the front buffer chamber of the coating process chamber through the front loading and unloading chamber 200 to wait for coating.

[0044] Step S2: Process gas is introduced into the coating process chamber. After the pressure inside the coating process chamber is stabilized, the sputtering power supply 700 is turned on, and the cathode assembly starts to glow discharge.

[0045] Step S3: After sputtering is stabilized, the transfer device 102 transfers the carrier plate 100 through the cathode chamber for on-line scanning sputtering coating and stays in the rear buffer chamber to complete one coating.

[0046] Step S4: According to the preset coating process, the transfer device 102 reciprocally conveys the carrier plate 100 inside the coating process chamber for on-line scanning sputtering coating.

[0047] Step S5: After coating is completed, the transfer device 102 transfers the carrier plate 100 out through the front loading and unloading chamber 200 or the rear loading and unloading chamber 900.

[0048] In step S4 of this embodiment, the preset coating process is as follows: the carrier plate 100 loads the substrate 101 and reciprocates multiple times in the first coating process chamber 300 to complete the first coating process, and then is transferred to the second coating process chamber 400 to reciprocate multiple times to complete the second coating process, and finally exits from the rear loading and unloading chamber 900.

[0049] Specifically, the carrier plate 100 is transferred to the first front buffer chamber 301 to wait for coating, and process gas is introduced into the first coating process chamber 300. After the pressure in the first coating process chamber 300 is stable, the sputtering power supply 700 is turned on, and the planar cathode 600 starts to glow discharge. After the sputtering is stable, the carrier plate 100 is transferred from left to right by the transfer device 102, passes through the first cathode chamber 302, and stays in the first rear buffer chamber 303 to complete one coating. The carrier plate 100 then moves from the first rear buffer chamber 303 from right to left, passes through the first cathode chamber 302, and stays in the first front buffer chamber 301 to complete the second coating. The carrier plate 100 reciprocates between the first front buffer chamber 301, the first cathode chamber 302, and the first rear buffer chamber 303 under the transfer of the transfer device 102 to complete the first coating process.

[0050] The carrier plate 100 continues to be transferred by the transmission device 102 into the second coating process chamber 400. The carrier plate 100 is transferred to the second front buffer chamber 401 to wait for coating, and process gas is introduced into the second coating process chamber 400. After the pressure in the second coating process chamber 400 is stable, the sputtering power supply 700 is turned on, and the planar cathode 800 starts to glow discharge. After the sputtering is stable, the carrier plate 100 is transferred from left to right by the transfer device 102, passes through the second cathode chamber 402, and stays in the second rear buffer chamber 403 to complete one coating. The carrier plate 100 then moves from the second rear buffer chamber 403 from right to left, passes through the second cathode chamber 402, and stays in the second front buffer chamber 401 to complete the second coating. The carrier plate 100 reciprocates between the second front buffer chamber 401, the second cathode chamber 402, and the second rear buffer chamber 403 under the transfer of the transfer device 102 to complete the second coating process, and finally exits from the loading and unloading chamber 900.

[0051] It can be understood that in other embodiments, the preset coating process can also be: the carrier plate 100 loads the substrate 101 and reciprocates multiple times in the first coating process chamber 300, and finally exits from the front loading and unloading chamber 200. That is, neither the carrier plate 100 nor the substrate 101 passes through the second coating process chamber 400. Or, after the coating is completed, the carrier plate 100 and the substrate 101 pass through the second coating process chamber 400 and exit from the rear loading and unloading chamber 900.

[0052] Alternatively, the carrier plate 100 loaded with the substrate 101 is transferred to the second coating process chamber 400 through the first coating process chamber 300, and multiple coatings are reciprocally performed in the second coating process chamber 400, and finally, it is discharged from the rear loading and unloading chamber 900. That is, the carrier plate 100 and the substrate 101 pass through the first coating process chamber 300, but no coating is performed in the first coating process chamber 300. Or, after the coating is completed, the carrier plate 100 and the substrate 101 pass through the first coating process chamber 300 and are discharged from the front loading and unloading chamber 200.

[0053] Alternatively, a double-carrier plate coating method is adopted. One carrier plate 100 loaded with the substrate 101 reciprocally performs multiple coatings in the first coating process chamber 300 and is finally discharged from the front loading and unloading chamber 200. At the same time, the other carrier plate 100 loaded with the substrate 101 reciprocally performs multiple coatings in the second coating process chamber 400 and is finally discharged from the rear loading and unloading chamber 900.

[0054] In this embodiment, first, the transfer device 102 is used to transfer the carrier plate 100 and the substrate 101 into the front buffer chamber of the coating process chamber through the front loading and unloading chamber 200 to wait for coating; then, process gas is introduced into the coating process chamber. After the sputtering is stable, the carrier plate 100 and the substrate 101 are transferred through the cathode chamber to perform on-line scanning sputtering coating; and in combination with the preset coating process, the carrier plate 100 and the substrate 101 are reciprocally transferred in the coating process chamber to perform multiple coatings. After the coating is completed, the substrate 101 is discharged from the front loading and unloading chamber 200 or the rear loading and unloading chamber 900, realizing the on-line coating of perovskite solar cells. And by using at least two or more coating process chambers, MW-level mass production coating is realized, significantly improving the production efficiency of perovskite solar cells.

[0055] Although the present invention is disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make many possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of protection of the technical solution of the present invention.

Claims

1. An on-line scanning magnetron sputtering device for perovskite solar cells, characterized in that, It includes a device body (1), and a front loading and unloading chamber (200), at least one coating process chamber, and a rear loading and unloading chamber (900) that are sequentially arranged inside the device body (1). Valves (500) for controlling on-off are provided between the front loading and unloading chamber (200) and the coating process chamber, between adjacent coating process chambers, and between the coating process chamber and the rear loading and unloading chamber (900); the coating process chamber includes a front buffer chamber, a cathode chamber, and a rear buffer chamber. A sputtering power supply (700) and a cathode assembly are provided inside the cathode chamber. The cathode assembly generates glow discharge to achieve substrate coating; a transfer device (102) is also provided inside the device body (1). According to the preset coating process requirements, the transfer device (102) is used to reciprocally transfer the carrier plate (100) loaded with the substrate (101) between the front buffer chamber, the cathode chamber, and the rear buffer chamber to complete scanning sputtering coating.

2. The perovskite solar cell in-line scanning magnetron sputtering device according to claim 1, characterized in that, A positioning device (103) is also provided inside the device body (1), and the positioning device (103) is used to assist in the transfer and positioning of the carrier plate (100).

3. The perovskite solar cell in-line scanning magnetron sputtering device according to claim 2, wherein, The coating process chamber includes a first coating process chamber (300) and a second coating process chamber (400). Valves (500) for controlling on-off are provided between the first coating process chamber (300) and the front loading and unloading chamber (200), between the first coating process chamber (300) and the second coating process chamber (400), and between the second coating process chamber (400) and the rear loading and unloading chamber (900); the cathode assembly in the first coating process chamber (300) is a planar cathode (600), and the cathode assembly in the second coating process chamber (400) is a rotating cathode (800) to achieve different types of films being coated on the substrate (101) in the first coating process chamber (300) and the second coating process chamber (400) respectively.

4. The perovskite solar cell in-line scanning magnetron sputtering device according to claim 3, characterized in that, The planar cathode (600) includes a single-plane upper coating cathode, a single-plane lower coating cathode, a double-plane upper coating cathode, or a double-plane lower coating cathode.

5. The online scanning magnetron sputtering device for perovskite solar cells according to claim 3, characterized in that: The rotating cathode (800) includes: a single-rotation upper coating cathode, a single-rotation lower coating cathode, a double-rotation upper coating cathode, or a double-rotation lower coating cathode.

6. The perovskite solar cell in-line scanning magnetron sputtering device according to claim 3, characterized in that, The sputtering power supply (700) includes: a radio frequency power supply, a DC pulse power supply, a DC power supply, or an intermediate frequency power supply.

7. The perovskite solar cell in-line scanning magnetron sputtering device according to claim 3, wherein, The first coating process chamber (300) includes a first front buffer chamber (301), a first cathode chamber (302), and a first rear buffer chamber (303), and the planar cathode (600) is arranged inside the first cathode chamber (302); the second coating process chamber (400) includes a second front buffer chamber (401), a second cathode chamber (402), and a second rear buffer chamber (403), and the rotating cathode (800) is arranged inside the second cathode chamber (402).

8. The online scanning magnetron sputtering device for perovskite solar cells according to any one of claims 4 to 7, characterized in that: The types of coatings include a hole transport layer (HTL) for preparing a perovskite solar cell, a transparent conductive layer, or a back electrode.

9. A coating method for a perovskite solar cell based on the online scanning magnetron sputtering device according to any one of claims 1 to 8, characterized in that: It includes the following steps: Step S1: The substrate (101) is placed on the carrier plate (100). With the assistance of the transfer device (102) and the positioning device (103), the carrier plate (100) enters the pre-buffer chamber of the coating process chamber through the front loading and unloading chamber (200) to wait for coating. Step S2: Process gas is introduced into the coating process chamber. After the pressure inside the coating process chamber stabilizes, the sputtering power supply (700) is turned on, and the cathode assembly starts glow discharge. Step S3: After sputtering stabilizes, the transfer device (102) transfers the carrier plate (100) through the cathode chamber to perform on-line scanning sputtering coating and stops in the post-buffer chamber to complete one coating. Step S4: According to the preset coating process, the transfer device (102) reciprocally conveys the carrier plate (100) inside the coating process chamber to perform on-line scanning sputtering coating. Step S5: After coating is completed, the transfer device (102) transfers the carrier plate (100) out through the front loading and unloading chamber (200) or the rear loading and unloading chamber (900).

10. The coating method according to claim 9, wherein In the said Step S4, the preset coating process includes: the carrier plate (100) loaded with the substrate (101) reciprocally performs coating multiple times in the first coating process chamber (300) to complete the first coating process, and then is conveyed to the second coating process chamber (400) to reciprocally perform coating multiple times to complete the second coating process, and finally is transferred out through the rear loading and unloading chamber (900). Or, the carrier plate (100) loaded with the substrate (101) reciprocally performs coating multiple times in the first coating process chamber (300) and finally is transferred out through the front loading and unloading chamber (200) or the rear loading and unloading chamber (900). Or, the carrier plate (100) loaded with the substrate (101) is conveyed to the second coating process chamber (400) through the first coating process chamber (300) and reciprocally performs coating multiple times in the second coating process chamber (400), and finally is transferred out through the front loading and unloading chamber (200) or the rear loading and unloading chamber (900). Or, a double-carrier plate coating method is adopted. One carrier plate (100) loaded with the substrate (101) reciprocally performs coating multiple times inside the first coating process chamber (300) and finally is transferred out through the front loading and unloading chamber (200). Meanwhile, the other carrier plate (100) loaded with the substrate (101) reciprocally performs coating multiple times in the second coating process chamber (400) and finally is transferred out through the rear loading and unloading chamber (900).

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