Air gap type thermal switch, inflation device, inflation method and dilution refrigerator

Abstract

The invention discloses an air gap type thermal switch, an air inflation device, an air inflation method and a dilution refrigerator. The air gap type thermal switch comprises a thermal switch body and an adsorption pump communicated with the thermal switch body, and the adsorption pump is filled with an adsorbent; the air charging device comprises a four-way pipe, a first pipe opening of which is communicated with the air charging opening of the thermal switch main body; the pressure monitoring device is communicated with a second pipe orifice of the four-way pipe; the gas tank is communicated with a third pipe opening of the four-way pipe, heat conduction gas is stored in the gas tank, and the first valve is arranged on a communication path of the third pipe opening and the gas tank and used for controlling inflation of the air gap type heat switch. The vacuum pump is communicated with a fourth pipe orifice of the four-way pipe; the second valve is arranged on a communication path of the fourth pipe orifice and the vacuum pump and is used for controlling the air gap type thermal switch to vacuumize; and the sealing device is used for sealing the inflation inlet of the air gap type thermal switch. The inflation device can realize accurate control of the inflation amount of the heat conduction gas, and ensures the stability and consistency of the performance of the air gap type thermal switch.

Description

Technical Field

[0001] The present invention relates to the technical field of quantum computers, and particularly to an air-gap thermal switch, an inflation device, an inflation method, and a dilution refrigerator. Background Art

[0002] A quantum computer is a physical device that performs high-speed mathematical and logical operations, stores, and processes quantum information in accordance with the laws of quantum mechanics. The characteristics of quantum computers mainly include relatively fast operating speed, strong information processing ability, wide application range, etc. Among many quantum computing technology routes, the superconducting technology route has very broad prospects, and quantum computers developed based on the superconducting technology route have attracted much attention in the industry.

[0003] The basic unit of superconducting quantum computing is a superconducting quantum chip, which needs to work in an ultra-low temperature environment, about 10 mK to 20 mK (Kelvins). The ultra-low temperature can effectively reduce the influence of environmental noise on the superconducting quantum chip. The ultra-low temperature environment is usually provided by a dilution refrigerator, which uses a hierarchical refrigeration technology to form temperature zones with different temperatures. The quantum chip is usually arranged in the temperature zone with the lowest temperature of the dilution refrigerator, and the signal source device and microwave monitoring device for controlling the quantum chip are usually arranged outside the dilution refrigerator; different temperature zones in the dilution refrigerator are separated by cold plates, which can effectively reduce the interference of heat transfer between different temperature zones. However, when the quantum chip needs to be taken out, all temperature zones of the dilution refrigerator need to be restored to room temperature, and here, heat connection between adjacent cold plates is required. In addition, during the pre-cooling process of the dilution refrigerator, in order to accelerate the pre-cooling speed, heat connection between adjacent cold plates is also required. After pre-cooling, the heat connection between the cold plates should be disconnected so that the dilution refrigeration can start to work. Currently, an air-gap thermal switch is commonly used to connect two adjacent cold plates to achieve heat connection and heat separation between the cold plates in different working states of the quantum chip. The air-gap thermal switch generally consists of a thermal switch body and an adsorption pump, and the adsorption pump needs to seal a certain amount of heat-conducting gas. When inflating the air-gap thermal switch, if the charging amount of the heat-conducting gas cannot be accurately controlled, it is difficult to ensure the stability of the performance of the air-gap thermal switch. At the same time, when inflating the same batch of identical air-gap thermal switches, it is very difficult to ensure that the amount of heat-conducting gas filled into the adsorption pump is the same, thus making it difficult to ensure the consistency of the performance of the same batch of air-gap thermal switches.

[0004] It should be noted that the information disclosed in the background art part of the present application is only intended to deepen the understanding of the general background technology of the present application, and should not be regarded as an admission or any form of implication that this information constitutes the prior art known to those skilled in the art. Summary of the Invention

[0005] The object of the present invention is to provide an air-gap thermal switch, an inflation device, an inflation method and a dilution refrigerator. The inflation device can achieve precise control of the filling amount of the heat-conducting gas, ensuring the stability and consistency of the performance of the air-gap thermal switch.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] In a first aspect of the present invention, an inflation device for an air-gap thermal switch is provided. The air-gap thermal switch includes a thermal switch main body and an adsorption pump communicated with the thermal switch main body, and the adsorption pump is filled with an adsorbent. The inflation device is characterized in that it includes: a four-way pipe, the first pipe orifice of which is communicated with the inflation port of the thermal switch main body; a pressure monitoring device communicated with the second pipe orifice of the four-way pipe; an air tank internally storing the heat-conducting gas communicated with the third pipe orifice of the four-way pipe, and a first valve for controlling the inflation of the air-gap thermal switch on the communication path between the third pipe orifice and the air tank; a vacuum pump communicated with the fourth pipe orifice of the four-way pipe, and a second valve for controlling the evacuation of the air-gap thermal switch on the communication path between the fourth pipe orifice and the vacuum pump; a sealing device for sealing the inflation port of the air-gap thermal switch.

[0008] For the inflation device of the air-gap thermal switch as described above, further, the first valve includes a micro-adjusting valve; and / or, the second valve includes a ball valve or an angle valve; and / or, the sealing device includes one of a manual cold welding pliers, a hydraulic sealing pliers, and an ultrasonic sealing machine; and / or, the pressure monitoring device includes a pressure transmitter.

[0009] For the inflation device of the air-gap thermal switch as described above, further, a pressure reducing valve is provided on the communication path between the air tank and the first valve.

[0010] For the inflation device of the air-gap thermal switch as described above, further, the heat-conducting gas includes helium.

[0011] For the inflation device of the air-gap thermal switch as described above, further, a cooling device is further included for cooling the adsorption pump.

[0012] For the inflation device of the air-gap thermal switch as described above, further, the cooling device is a tank filled with liquid nitrogen.

[0013] For the inflation device of the air-gap thermal switch as described above, further, a controller is further included for determining the closing time of the first valve during inflation according to the second pressure value monitored by the pressure monitoring device during inflation and for determining the closing time of the second valve during evacuation according to the first pressure value monitored by the pressure monitoring device during evacuation.

[0014] The gas filling device of the air-gap thermal switch as described above. Further, the controller includes:

[0015] A collection module for collecting the first pressure value monitored by the pressure monitoring device during vacuum pumping and the second pressure value monitored by the pressure monitoring device during gas filling;

[0016] A judgment module for judging whether the first pressure value is equal to a preset first threshold and whether the second pressure value is equal to a preset second threshold;

[0017] And a control module for receiving the judgment result of the judgment module and controlling the closing time of the first valve during gas filling and the closing time of the second valve during vacuum pumping according to the judgment result.

[0018] A second aspect of the present invention provides an air-gap thermal switch, including a thermal switch body, an adsorption pump communicated with the thermal switch body, and a heater installed on the adsorption pump. The adsorption pump is filled with an adsorbent. A gap filled with a heat-conducting gas is provided inside the thermal switch body, and the heat-conducting gas is filled into the adsorption pump through the above gas filling device.

[0019] A third aspect of the present invention provides a dilution refrigerator, including a plurality of cold plates, and a plurality of the above air-gap thermal switches are provided between adjacent cold plates.

[0020] A fourth aspect of the present invention provides a gas filling method for filling an air-gap thermal switch with the above gas filling device, including:

[0021] Vacuum pumping treatment: Close the gas tank and the first valve, open the second valve and the vacuum pump, evacuate the thermal switch body and the adsorption pump, monitor the first pressure value during vacuum pumping through the pressure monitoring device, and close the second valve when the first pressure value reaches the first threshold to end the vacuum pumping treatment;

[0022] Gas filling treatment: Open the gas tank and open the first valve to fill the adsorption pump with gas, monitor the second pressure value during gas filling through the pressure monitoring device, and close the first valve when the second pressure value reaches the second threshold to end the gas filling treatment;

[0023] Sealing treatment: Continuously observe the third pressure value monitored by the pressure monitoring device, and when the third pressure value reaches the third threshold, use the sealing device to seal the gas filling pipeline at the tail of the thermal switch body.

[0024] The beneficial effects of the present invention are as follows:

[0025] The inflation device of the present application can effectively inflate the air-gap thermal switch. Specifically, first, evacuate the pipeline, the main body of the thermal switch, and the adsorption pump through a vacuum pump, then inflate the pipeline, the main body of the thermal switch, and the adsorption pump through an air tank storing heat-conducting gas internally, and finally use a sealing device to seal the inflation pipeline at the tail of the main body of the thermal switch; by setting a pressure monitoring device, the pressure value of the whole process can be accurately monitored. Since the change of the pressure value is closely related to the charging amount of the heat-conducting gas, the accurate control of the charging amount of the heat-conducting gas can be realized, so as to ensure the stability and consistency of the performance of the air-gap thermal switch.

[0026] The air-gap thermal switch, inflation method, and dilution refrigerator provided by the present invention perform inflation operation on the air-gap thermal switch therein by using the above inflation device, so they have the same beneficial effects and will not be elaborated here. Brief Description of the Drawings

[0027] Figure 1 It is the first structural schematic diagram of the inflation device of the air-gap thermal switch provided by the embodiment of the present invention;

[0028] Figure 2 It is the second structural schematic diagram of the inflation device of the air-gap thermal switch provided by the embodiment of the present invention;

[0029] Figure 3 It is the structural schematic diagram of the controller provided by the embodiment of the present invention;

[0030] Figure 4 It is the flowchart of the inflation method provided by the embodiment of the present invention;

[0031] In the reference numerals: 1. Main body of the thermal switch; 2. Adsorption pump; 3. Four-way pipe; 4. Air tank; 5. Pressure reducing valve; 6. First valve; 7. Second valve; 8. Vacuum pump; 9. Sealing device; 10. Cooling device; 11. Pressure monitoring device; 12. Controller; 121. Acquisition module; 122. Judgment module; 123. Control module. Detailed Embodiments

[0032] In order to enable those skilled in the art to better understand the technical solutions in the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be construed as a limitation to the present application.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0034] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0035] Figure 1 FIG. 1 is a schematic diagram of the first structure of the gas filling device of the air-gap thermal switch provided by the embodiment of the present invention; as Figure 1 shown: The embodiment of the present application discloses a gas filling device for an air-gap thermal switch. The air-gap thermal switch includes a thermal switch body 1 and an adsorption pump 2 communicated with the thermal switch body 1. The adsorption pump 2 is filled with an adsorbent; the gas filling device includes: a four-way pipe 3, the first pipe orifice of which is communicated with the gas filling port of the thermal switch body 1; a pressure monitoring device 11 communicated with the second pipe orifice of the four-way pipe 3; a gas tank 4 internally storing a heat-conducting gas and communicated with the third pipe orifice of the four-way pipe 3, and a first valve 6 for controlling the gas filling of the air-gap thermal switch on the communication path between the third pipe orifice and the gas tank 4; a vacuum pump 8 communicated with the fourth pipe orifice of the four-way pipe 3, and a second valve 7 for controlling the vacuum pumping of the air-gap thermal switch on the communication path between the fourth pipe orifice and the vacuum pump 8; a sealing device 9 for sealing the gas filling port of the air-gap thermal switch.

[0036] The gas filling device of the present application can effectively fill the air-gap thermal switch. Specifically, first, the pipeline, the thermal switch body 1 and the adsorption pump 2 are evacuated by the vacuum pump 8, then the pipeline, the thermal switch body 1 and the adsorption pump 2 are filled with gas by the gas tank 4 internally storing a heat-conducting gas, and finally, the sealing device 9 is used to seal the gas filling pipeline at the tail of the thermal switch body 1; by setting the pressure monitoring device 11, the pressure value of the whole process can be accurately monitored. Since the change of the pressure value is closely related to the filling amount of the heat-conducting gas, the accurate control of the filling amount of the heat-conducting gas can be realized, thereby ensuring the stability and consistency of the performance of the air-gap thermal switch (specifically, by ensuring that the pressure value during the evacuation process, the gas filling process and the sealing process is a certain value, thereby ensuring the accurate control of the filling amount of the heat-conducting gas).

[0037] In some embodiments of the present embodiment, the first valve 6 includes a fine adjustment valve; by selecting a fine adjustment valve as the first valve 6, the flow rate of inflation can be adjusted very finely, so as to accurately control the total amount of heat-conducting gas filled. Exemplarily, the fine adjustment valve is a needle valve.

[0038] In some embodiments of the present embodiment, the second valve 7 includes a ball valve or an angle valve; by selecting a ball valve or an angle valve as the second valve 7, it is possible to quickly achieve full opening or closing.

[0039] In some embodiments of the present embodiment, the sealing device 9 is one of a manual cold welding pliers, a hydraulic sealing pliers, and an ultrasonic sealing machine.

[0040] In some embodiments of the present embodiment, the pressure monitoring device 11 is a pressure transmitter. By selecting a pressure transmitter as the pressure monitoring device 11, the pressure change in the gas-gap thermal switch can be monitored in real time.

[0041] In some embodiments of the present embodiment, a pressure reducing valve 5 is provided on the communication path between the gas tank 4 and the first valve 6. By providing the pressure reducing valve 5, the pressure at the outlet of the gas tank 4 can be automatically adjusted and stabilized, ensuring that a predetermined working pressure is always maintained in the pipeline downstream of the pressure reducing valve 5.

[0042] In some embodiments of the present embodiment, the type of the heat-conducting gas is not specifically limited and can be helium, neon, argon, or nitrogen. Preferably, the heat-conducting gas is helium, and helium has good heat-conducting performance, which can improve the heat transfer efficiency.

[0043] In some embodiments of the present embodiment, the gas charging device of the gas-gap thermal switch further includes a cooling device 10 for cooling the adsorption pump 2. By providing the cooling device 10, there are mainly the following advantages:

[0044] 1. Improve the adsorption efficiency: Lowering the temperature can increase the efficiency of the adsorption pump 2 in adsorbing gas. At a lower temperature, the thermal motion of gas molecules slows down, and it is easier to be adsorbed onto the surface of the adsorbent. The cooling device 10 promotes a more effective adsorption process by providing a low-temperature environment.

[0045] 2. Increase the adsorption capacity: Through cooling, the adsorption capacity of the adsorbent usually increases. At a lower temperature, the surface of the adsorbent can accommodate more gas molecules. Therefore, the adsorption capacity of the adsorption pump 2 is improved.

[0046] 3. Improve the pumping speed: The cooling device 10 also helps to improve the pumping speed of the adsorption pump 2. The pumping speed refers to the volume of gas that the adsorption pump 2 can extract per unit time. Through cooling, the adsorption process is more rapid, thereby increasing the pumping speed.

[0047] 4. Reducing back leakage: The cooling device 10 also helps to reduce back leakage, that is, when the adsorption pump 2 is working, some of the adsorbed gas molecules are released again. Through the low-temperature environment, the problem of back leakage can be minimized.

[0048] Generally speaking, placing the adsorption pump 2 in the cooling device 10 helps to improve the adsorption efficiency, adsorption capacity and pumping speed, while reducing back leakage.

[0049] In some embodiments of this embodiment, the cooling device 10 is a tank filled with liquid nitrogen. Specifically, the adsorption pump 2 is placed in the tank filled with liquid nitrogen to cool the adsorption pump 2.

[0050] Figure 2 This is the second structural schematic diagram of the gas filling device of the air-gap thermal switch provided by the embodiment of the present invention; as Figure 2 shown: In some embodiments of this embodiment, the gas filling device of the air-gap thermal switch further includes a controller 12, which is used to determine the closing time of the first valve 6 during gas filling according to the second pressure value monitored by the pressure monitoring device 11 during gas filling and to determine the closing time of the second valve 7 during vacuum pumping according to the first pressure value monitored by the pressure monitoring device 11 during vacuum pumping.

[0051] Figure 3 This is the structural schematic diagram of the controller 12 provided by the embodiment of the present invention; as Figure 3 shown: Further, the controller 12 includes: an acquisition module 121, which is used to acquire the first pressure value monitored by the pressure monitoring device 11 during vacuum pumping and the second pressure value monitored by the pressure monitoring device 11 during gas filling; a judgment module 122, which is used to judge whether the first pressure value is equal to the preset first threshold and whether the second pressure value is equal to the preset second threshold; and a control module 123, which is used to receive the judgment result of the judgment module 122 and control the closing time of the first valve 6 during gas filling and the closing time of the second valve 7 during vacuum pumping according to the judgment result; specifically, during vacuum pumping, when the first pressure value is equal to the preset first threshold, the second valve 7 is closed; during gas filling, when the second pressure value is equal to the preset second threshold, the first valve 6 is closed.

[0052] Based on the same application concept, the embodiment of the present application also proposes an air-gap thermal switch, which includes a thermal switch body 1, an adsorption pump 2 communicated with the thermal switch body 1, and a heater installed on the adsorption pump 2. The adsorption pump 2 is filled with an adsorbent, and a gap filled with a heat-conducting gas is provided inside the thermal switch body 1. The heat-conducting gas is filled into the adsorption pump 2 through the gas filling device of the above air-gap thermal switch.

[0053] The specific working principle of the air-gap thermal switch is as follows: When the air-gap thermal switch is applied to a dilution refrigerator, both ends of the thermal switch body 1 are respectively connected to two adjacent cold plates in the dilution refrigerant; when the heater is heated (the heater is preferably installed on the outer wall of the adsorption pump 2), the temperature of the adsorption pump 2 rises, and the heat-conducting gas adsorbed on the adsorbent (the adsorbent is preferably activated carbon) in the adsorption pump 2 is released and filled into the gap of the thermal switch body 1, realizing the conduction of the air-gap thermal switch; when the heater stops heating, the temperature of the adsorption pump 2 drops, and the adsorbent (the adsorbent is preferably activated carbon) in the adsorption pump 2 adsorbs the heat-conducting gas in the thermal switch body 1, thereby realizing the disconnection of the air-gap thermal switch.

[0054] Based on the same inventive concept, an embodiment of the present application further provides a dilution refrigerator, including a plurality of cold plates, and a plurality of the above-mentioned air-gap thermal switches are provided between adjacent cold plates.

[0055] Figure 4 It is a flowchart of the gas filling method provided by an embodiment of the present invention; as Figure 4 shown: Based on the same inventive concept, an embodiment of the present application further provides a gas filling method, using the above-mentioned gas filling device to fill the air-gap thermal switch, including:

[0056] Vacuum pumping treatment: Close the gas tank 4 and the first valve 6, open the second valve 7 and the vacuum pump 8, perform vacuum pumping treatment on the thermal switch body 1 and the adsorption pump 2, monitor the first pressure value during vacuum pumping through the pressure monitoring device 11, and when the first pressure value reaches the first threshold, close the second valve 7 to end the vacuum pumping treatment;

[0057] Gas filling treatment: Open the gas tank 4 and open the first valve 6 to fill the adsorption pump 2 with gas, monitor the second pressure value during gas filling through the pressure monitoring device 11, and when the second pressure value reaches the second threshold, close the first valve 6 to end the gas filling treatment;

[0058] Sealing treatment: Continue to observe the third pressure value monitored by the pressure monitoring device 11, and when the third pressure value reaches the third threshold, use the sealing device 9 to seal the gas filling pipeline at the tail of the thermal switch body 1.

[0059] Further, when the gas filling device includes a controller 12, the above-mentioned gas filling method is specifically as follows:

[0060] Vacuum pumping treatment: Close the gas tank 4 and the first valve 6, open the second valve 7 and the vacuum pump 8, perform vacuum pumping treatment on the thermal switch body 1 and the adsorption pump 2, the acquisition module 121 in the controller 12 acquires the first pressure value monitored by the pressure monitoring device 11 during the vacuum pumping treatment, and then the judgment module 122 judges whether the first pressure value is equal to the first threshold. When the first pressure value is equal to the first threshold, the control module 123 controls the second valve 7 to close to end the vacuum pumping treatment.

[0061] Inflation treatment: Open the gas cylinder 4 and open the first valve 6 to inflate the adsorption pump 2; the acquisition module 121 in the controller 12 acquires the second pressure value of the pressure monitoring device 11 during the inflation treatment, and then the judgment module 122 judges whether the second pressure value is equal to the second threshold value. When the second pressure value is equal to the second threshold value, the control module 123 controls the first valve 6 to close, and the inflation treatment ends;

[0062] Sealing treatment: Continue to observe the third pressure value monitored by the pressure monitoring device 11. When it reaches the third threshold value, use the sealing device 9 to seal the gas charging pipeline at the tail of the thermal switch body 1. Further, the sealing treatment can preferably be the following steps: After closing the first valve 6, put the adsorption pump 2 into the cooling device 10 for cooling treatment. During the cooling treatment, the adsorbent in the adsorption pump 2 will adsorb the heat-conducting gas. Continue to observe the third pressure value monitored by the pressure monitoring device 11. When the third pressure value reaches the third threshold value, use the sealing device 9 to seal the gas charging pipeline at the tail of the thermal switch body 1.

[0063] It should be noted that after the inflation treatment ends, continue to observe the third pressure value monitored by the pressure monitoring device 11. The reason for the change in the third pressure value is that the adsorbent in the adsorption pump 2 adsorbs the heat-conducting gas.

[0064] Among them, the determination of the preset third threshold value and the second threshold value in this application is related to the charging amount of the heat-conducting gas in the air-gap type thermal switch, and the charging amount of the heat-conducting gas is related to the type and weight of the adsorbent in the adsorption pump 2. Usually, it is determined through a cooling test experiment. Specifically, for an air-gap type thermal switch with the same type and weight of adsorbent, different amounts of heat-conducting gas are charged; a cooling experiment is carried out on the air-gap type thermal switch charged with the heat-conducting gas. During the cooling process, the air-gap type thermal switch can effectively conduct heat exchange, and when it is cooled to a certain specified temperature, the air-gap type thermal switch can be disconnected after stopping the heating of the adsorption pump 2. At this time, the charging amount of the heat-conducting gas is the charging amount that meets the requirements. This charging amount is the difference between the preset second threshold value and the third threshold value, and the specified temperature here is the temperature that the cold plate in the pre-cooling stage of the dilution refrigerator needs to reach.

[0065] In the description of this specification, the description with reference to terms such as "some embodiments" or "examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0066] The above are only the preferred embodiments of the present invention and do not impose any limitation on the present invention. Any person skilled in the art, within the scope of the technical solution of the present invention, makes any form of equivalent substitution or modification and other changes to the technical solution and technical content disclosed by the present invention, which are all within the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. An inflation device for an air-gap thermal switch, the air-gap thermal switch comprising a thermal switch body and an adsorption pump communicated with the thermal switch body, wherein an adsorbent is filled in the adsorption pump; characterized in that, The inflation device includes: A four-way pipe, the first pipe orifice of which is communicated with the inflation port of the thermal switch body; A pressure monitoring device communicated with the second pipe orifice of the four-way pipe; An air tank internally storing a heat-conducting gas communicated with the third pipe orifice of the four-way pipe, and a first valve for controlling the inflation of the air-gap thermal switch on the communication path between the third pipe orifice and the air tank; A vacuum pump communicated with the fourth pipe orifice of the four-way pipe, and a second valve for controlling the evacuation of the air-gap thermal switch on the communication path between the fourth pipe orifice and the vacuum pump; A sealing device for sealing the inflation port of the air-gap thermal switch.

2. The gas filling device of the air-gap thermal switch according to claim 1, characterized in that, The first valve includes a fine adjustment valve; And / or, the second valve includes a ball valve or an angle valve; And / or, the sealing device includes one of a manual cold welding pliers, a hydraulic sealing pliers, and an ultrasonic sealing machine; And / or, the pressure monitoring device includes a pressure transmitter; And / or, a pressure reducing valve is provided on the communication path between the air tank and the first valve.

3. The gas filling device of the air-gap thermal switch according to claim 1, characterized in that, The heat-conducting gas includes helium.

4. The gas filling device of the air-gap thermal switch according to claim 1, characterized in that, It further includes a cooling device for cooling the adsorption pump.

5. The gas filling device of the air-gap thermal switch according to claim 4, characterized in that, The cooling device is a tank filled with liquid nitrogen.

6. The gas filling device of the air gap type thermal switch according to claim 1, characterized in that, It further includes a controller for determining the closing time of the first valve during inflation according to the second pressure value monitored by the pressure monitoring device during inflation and for determining the closing time of the second valve during evacuation according to the first pressure value monitored by the pressure monitoring device during evacuation.

7. The gas filling device for the air-gap thermal switch according to claim 6, wherein The controller includes: An acquisition module for acquiring the first pressure value monitored by the pressure monitoring device during evacuation and the second pressure value monitored by the pressure monitoring device during inflation; A judgment module for judging whether the first pressure value is equal to a preset first threshold and whether the second pressure value is equal to a preset second threshold; And a control module for receiving the judgment result of the judgment module and controlling the closing time of the first valve during inflation and the closing time of the second valve during evacuation according to the judgment result.

8. An air-gap thermal switch, characterized in that It includes a thermal switch body, an adsorption pump communicated with the thermal switch body, and a heater installed on the adsorption pump. The adsorption pump is filled with an adsorbent. A gap filled with a heat-conducting gas is provided inside the thermal switch body. The heat-conducting gas is filled into the adsorption pump through the inflation device according to any one of claims 1-7.

9. A dilution refrigerator, characterized in that, It includes a plurality of cold plates, and a plurality of air-gap thermal switches according to claim 8 are provided between adjacent cold plates.

10. An inflation method, characterized in that, Inflating an air-gap thermal switch by using the inflation device according to any one of claims 1-7 includes: Evacuation treatment: Close the air tank and the first valve, open the second valve and the vacuum pump, evacuate the thermal switch body and the adsorption pump, monitor the first pressure value during evacuation through the pressure monitoring device, and close the second valve when the first pressure value reaches the first threshold to end the evacuation treatment; Inflation treatment: Open the air tank, open the first valve to inflate the adsorption pump, monitor the second pressure value during inflation through the pressure monitoring device, and close the first valve when the second pressure value reaches the second threshold to end the inflation treatment; Sealing treatment: Continuously observe the third pressure value monitored by the pressure monitoring device. When the third pressure value reaches the third threshold, use the sealing device to seal the gas charging pipeline at the tail of the thermal switch body.

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