Special airborne infrared system data processing equipment

Abstract

The invention relates to the technical field of data processing, in particular to special airborne infrared system data processing equipment, which comprises an interface board, a first signal processing board, a second signal processing board, a signal loading board, a back board and a power supply board. The multi-path infrared data processing capability can be greatly improved, the multi-path infrared data can be reliably transmitted to a signal processing board at a high speed for target detection and tracking, instruction analysis and distribution, real-time reporting of processing results and optimization and upgrading functions of a core processor FPGA and a DSP, and the multi-path infrared data processing device is an important component of an airborne infrared system. The system has the characteristics of high-speed transmission of multi-path infrared data, good signal processing real-time performance, easy upgrading and maintenance of performance, and good impact and vibration resistance.

Description

Technical Field

[0001] This application relates to the technical field of data processing, and particularly to a data processing device for a dedicated airborne infrared system. Background Art

[0002] For an infrared system operating under complex airborne environmental conditions, in order to achieve the real-time signal processing function of multiple infrared images, complete the target detection and tracking in the multiple infrared image data, complete the parsing and distribution of instructions, complete the real-time reporting of processing results, and complete the optimization and upgrade functions of the core processors FPGA and DSP, and solve the problems of complex transmission links for multiple large-capacity infrared data, high real-time requirements for image processing, parsing and distribution transfer of data communication protocols and instruction protocols, packaging and transfer of processing results and infrared data, and software upgrade of the core processor. There is an urgent need to provide a data processing device for a dedicated airborne infrared system. Through this data processing device for a dedicated airborne infrared system, the flexible transmission of multiple data of the infrared system, the real-time processing of high-speed infrared data, and the software upgrade of the core processor can be effectively completed, and the target detection and tracking function of multiple infrared images can be realized. Summary of the Invention

[0003] An embodiment of this application provides a data processing device for a dedicated airborne infrared system, which is used to solve the problems of complex transmission links for multiple large-capacity infrared data, high real-time requirements for image processing, parsing and distribution transfer of data communication protocols and instruction protocols, packaging and transfer of processing results and infrared data, and software upgrade of the core processor.

[0004] In the first aspect of the embodiment of this application, a data processing device for a dedicated airborne infrared system is provided. The data processing device for a dedicated airborne infrared system includes an interface board, a first signal processing board, a second signal processing board, a signal loading board, a backplane, and a power supply board. Among them,

[0005] The interface board realizes the functions of high-speed transfer of multiple infrared data, protocol parsing and instruction distribution, superposition of processing results and image data, and upgrade loading information interaction by integrating multiple optical fiber interfaces and high-speed serial interfaces;

[0006] The first signal processing board is connected to the interface board through the backplane using a high-speed serial interface, and receives the first infrared image data transmitted by the interface board;

[0007] The second signal processing board is connected to the interface board through the backplane using a high-speed serial interface, and receives the second infrared image data transmitted by the interface board;

[0008] The signal loading board is connected to the interface board through a high-speed serial interface for information interaction of loading data. It is connected to the FPGA of the interface board, the FPGA of the signal processing board, and the DSP through multiple high-speed serial ports using the backplane to send relevant loading data to each processor.

[0009] The backplane is respectively connected to the interface board, the first signal processing board, the second signal processing board, the signal loading board, and the power supply board. Among them, the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board through a high-speed serial interface for image data transmission, processing result reporting, and loading data interaction; the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board through a high-speed serial port for loading data upgrade and loading progress feedback.

[0010] The power supply board performs power supply operations on the interface board, the first signal processing board, the second signal processing board, and the signal loading board through the backplane.

[0011] In an optional embodiment, the first signal processing board adopts an FPGA + dual-DSP architecture.

[0012] Preprocessing operations are performed through the FPGA, and the preprocessing results are respectively sent to the dual-DSPs.

[0013] Through the dual-DSPs, targets in different scenarios are detected and tracked, and the target processing results are fed back to the interface board through a high-speed serial interface for data fusion and information superposition processing.

[0014] In an optional embodiment, the second signal processing board adopts an FPGA + dual-DSP architecture.

[0015] Preprocessing operations are performed through the FPGA, and the preprocessing results are respectively sent to the dual-DSPs.

[0016] Through the dual-DSPs, targets in different scenarios are detected and tracked, and the target processing results are fed back to the interface board through a high-speed serial interface for data fusion and information superposition processing.

[0017] The present application provides a special airborne infrared system data processing device. The special airborne infrared system data processing device includes an interface board, a first signal processing board, a second signal processing board, a signal loading board, a backplane, and a power supply board. Among them, the interface board realizes the functions of high-speed transmission of multiplex infrared data, protocol parsing and instruction distribution, superposition of processing results and image data, and upgrade loading information interaction through integrating multiplex fiber optic interfaces and high-speed serial interfaces; the first signal processing board is connected to the interface board through the backplane using a high-speed serial interface and receives the first infrared image data transmitted by the interface board; the second signal processing board is connected to the interface board through the backplane using a high-speed serial interface and receives the second infrared image data transmitted by the interface board; the signal loading board is connected to the interface board through a high-speed serial interface for information interaction of loading data, and is respectively connected to the FPGA of the interface board, the FPGA of the signal processing board, and the DSP through multiplex high-speed serial ports using the backplane to send relevant loading data to each processor; the backplane is respectively connected to the interface board, the first signal processing board, the second signal processing board, the signal loading board, and the power supply board. Among them, the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board, and image data transmission, processing result reporting, and loading data interaction are carried out through high-speed serial interfaces; the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board, and loading data upgrade and loading progress feedback are carried out through high-speed serial ports; the power supply board supplies power to the interface board, the first signal processing board, the second signal processing board, and the signal loading board through the backplane.

[0018] Applying the special airborne infrared system data processing device provided by the embodiments of the present application can greatly improve the processing ability of multiplex infrared data, meet the requirements of high-speed and reliable transmission of multiplex infrared data to the signal processing board for target detection and tracking, complete the parsing and distribution of instructions, complete the real-time reporting of processing results, and complete the optimization and upgrade functions of the core processors FPGA and DSP. It is an important part of the airborne infrared system. It has the characteristics of high-speed transmission of multiplex infrared data, good real-time performance of signal processing, easy upgrade and maintenance of performance, and good anti-shock and vibration performance.

[0019] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features, and advantages of the present application more obvious and understandable, the specific embodiments of the present application are specifically listed below. Brief Description of the Drawings

[0020] By reading the following detailed description of the preferred embodiments, various other advantages and benefits will become apparent to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the present application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0021] Figure 1 It is a schematic structural diagram of a special airborne infrared system data processing device provided by an embodiment of the present application. Specific embodiments

[0022] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0023] In view of the continuous improvement of the multi-channel infrared data processing ability of the airborne infrared system, it is necessary to ensure that multi-channel infrared data is transmitted to the signal processing board for target detection and tracking at high speed and reliably, complete the parsing and distribution of instructions, complete the real-time reporting of processing results, and complete the optimization and upgrade functions of the core processors FPGA and DSP, and invent a special airborne infrared system data processing device.

[0024] The special airborne infrared system data processing device adopts a 3U 5-slot VPX architecture, and connects multi-channel infrared data through a fiber optic interface to the interface board of the special airborne infrared system data processing device to complete real-time reception of image data.

[0025] The interface board sends multi-channel infrared data to two signal processing boards through the SRIO bus via the backplane for target detection and tracking processing respectively.

[0026] The two signal processing boards send the target detection and tracking results back to the interface board through the backplane to complete the reporting of processing results. The interface board performs superposition processing on the processing results and the infrared image data.

[0027] Then it is externally sent through the fiber optic interface for data storage and display processing. A signal loading board is designed in the data processor and is connected to the interface board through the SRIO bus to receive external loading data information.

[0028] Then it is respectively connected to the FPGA of the interface board, the FPGA and DSP of the signal processing board through the high-speed serial port using the backplane, and the relevant loading data is sent to these core processors for software upgrade operations. A power board is designed in the data processor to supply power to the interface board, the two signal processing boards and a signal loading board respectively to ensure the normal operation of the special airborne infrared system data processing device.

[0029] According to the working environment and signal processing requirements of the airborne infrared system, corresponding technical measures are adopted in the embodiments of this application to ensure that multiple infrared data signals generated by the infrared system can be simultaneously transmitted and distributed at high speed to the signal processing board for target detection and tracking, complete the parsing and distribution of instructions, complete the real-time reporting of processing results, and complete the optimization and upgrade functions of the core processors FPGA and DSP. The dedicated airborne infrared system data processing device mainly includes an interface board 1, a signal processing board 2, a signal processing board 3, a signal loading board 4, a backplane 5, and a power supply board 6.

[0030] The interface board 1 uses a field programmable gate array (FPGA) as the core processing chip. By integrating multiple fiber optic interfaces and high-speed serial interfaces, it realizes the functions of high-speed transmission of multiple infrared data, protocol parsing and instruction distribution, superposition of processing results and image data, and interactive function of upgrade loading information.

[0031] The signal processing board 2 adopts an FPGA + dual DSP architecture. It is connected to the interface board through the backplane using a high-speed serial interface, receives the infrared image data 1 transmitted by the interface board, first enters the FPGA for preprocessing operations, and then sends the preprocessing results to the dual DSPs respectively to realize the detection and tracking processing of targets in different scenarios, and feeds back the target processing results to the interface board through the high-speed serial interface for data fusion and information superposition processing.

[0032] The signal processing board 3 adopts the same FPGA + dual DSP architecture. It is connected to the interface board through the backplane using a high-speed serial interface, receives the infrared image data 2 transmitted by the interface board, first enters the FPGA for preprocessing operations, and then sends the preprocessing results to the dual DSPs respectively to realize the detection and tracking processing of targets in different scenarios, and feeds back the target processing results to the interface board through the high-speed serial interface for data fusion and information superposition processing.

[0033] The signal loading board 4 uses a field programmable gate array (FPGA) as the core processing chip. It is connected to the interface board through a high-speed serial interface to complete the information interaction of loading data. Through multiple high-speed serial ports, it is respectively connected to the FPGA of the interface board, the FPGA of the signal processing board, and the DSP through the backplane, and sends the relevant loading data to these core processors for software upgrade operations.

[0034] The backplane 5 is respectively connected to the interface board 1, the signal processing board 2, the signal processing board 3, the signal loading board 4, and the power supply board 6. Among them, the backplane 5 completes the high-speed transmission of image data and the reporting of processing results, and the interaction of loading data with the interface board 1, the signal processing board 2, the signal processing board 3, and the signal loading board 4 through the high-speed serial interface. The backplane 5 respectively completes the upgrade of loading data and the feedback of loading progress with the interface board 1, the signal processing board 2, the signal processing board 3, and the signal loading board 4 through the high-speed serial port.

[0035] The power supply board 6 completes the power supply operation for the interface board 1, the signal processing board 2, the signal processing board 3, and the signal loading board 4 through the backplane 5, ensuring the normal operation of the dedicated airborne infrared system data processing device. The circuit connection is as Figure 1 shown. Figure 1 It is a schematic structural diagram of a dedicated airborne infrared system data processing device provided by an embodiment of the present application.

[0036] Applying the embodiment of the present application can greatly improve the multi-channel infrared data processing ability of the airborne infrared system, meet the requirements of high-speed and reliable transmission of multi-channel infrared data to the signal processing board for target detection and tracking, complete the parsing and distribution of instructions, complete the real-time reporting of processing results, and complete the optimization and upgrade functions of the core processors FPGA and DSP. It is an important part of the airborne infrared system. It has the characteristics of high-speed transmission of multi-channel infrared data, good real-time performance of signal processing, easy upgrade and maintenance of performance, and good anti-shock and vibration performance.

[0037] It should be noted that the above description is for specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve the desired result. Additionally, the processes depicted in the figures do not necessarily require the specific order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the embodiments of this specification.

[0038] In the above embodiments, the descriptions of the various embodiments have their own focuses. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0039] The preferred embodiments of this specification disclosed above are only used to help explain this specification. The alternative embodiments do not elaborate on all the details and do not limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of the embodiments of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the embodiments of this specification, so that those skilled in the art can understand and utilize this specification well. This specification is only limited by the claims and their full scope and equivalents.

Claims

1. A special airborne infrared system data processing device, characterized in that The dedicated airborne infrared system data processing device includes an interface board, a first signal processing board, a second signal processing board, a signal loading board, a backplane, and a power supply board. Among them, The interface board realizes the functions of high-speed transmission of multiplex infrared data, protocol parsing and instruction distribution, superposition of processing results and image data, and interactive function of upgrade loading information by integrating multiplex fiber optic interfaces and high-speed serial interfaces; The first signal processing board is connected to the interface board through the backplane using a high-speed serial interface, and receives the first infrared image data transmitted by the interface board; The second signal processing board is connected to the interface board through the backplane using a high-speed serial interface, and receives the second infrared image data transmitted by the interface board; The signal loading board is connected to the interface board through a high-speed serial interface for information interaction of loading data, and is respectively connected to the FPGA of the interface board, the FPGA of the signal processing board, and the DSP through multiplex high-speed serial ports using the backplane, and sends relevant loading data to each processor; The backplane is respectively connected to the interface board, the first signal processing board, the second signal processing board, the signal loading board, and the power supply board. Among them, the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board, and image data transmission, processing result reporting, and loading data interaction are carried out through high-speed serial interfaces; the backplane is connected to the interface board, the first signal processing board, the second signal processing board, and the signal loading board, and loading data upgrade and loading progress feedback are carried out through high-speed serial ports; The power supply board supplies power to the interface board, the first signal processing board, the second signal processing board, and the signal loading board through the backplane.

2. The data processing device for a dedicated airborne infrared system according to claim 1, characterized in that The first signal processing board adopts an FPGA + dual-DSP architecture; Preprocessing operations are carried out through the FPGA, and the preprocessing results are respectively sent to the dual-DSPs; Through the dual-DSPs, targets in different scenarios are detected and tracked, and the target processing results are fed back to the interface board through a high-speed serial interface for data fusion and information superposition processing.

3. The data processing device for a dedicated airborne infrared system according to claim 2, characterized in that The second signal processing board adopts an FPGA + dual-DSP architecture; Preprocessing operations are carried out through the FPGA, and the preprocessing results are respectively sent to the dual-DSPs; Through the dual-DSPs, targets in different scenarios are detected and tracked, and the target processing results are fed back to the interface board through a high-speed serial interface for data fusion and information superposition processing.

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