Audio processing circuit, digital silicon microphone, integrated circuit board and electronic equipment

Abstract

The invention discloses an audio processing circuit, a digital silicon microphone, an integrated circuit board and electronic equipment, the audio processing circuit is applied to the digital silicon microphone, the digital silicon microphone is arranged on the electronic equipment, and the audio processing circuit comprises an audio processing module arranged on a mainboard of the electronic equipment and a clock generation module arranged outside the mainboard. The audio processing module sends a low-frequency enable signal to the clock generation module through a control signal line, and the clock generation module responds to the low-frequency enable signal to generate a high-frequency clock signal and outputs the high-frequency clock signal to the digital silicon microphone through a clock signal line. The audio processing module is arranged on the main board and can be far away from the digital silicon microphone, the design limitation on the audio processing module is reduced, the selection range is expanded, the clock generation module arranged outside the main board sends the high-frequency clock signal to the digital silicon microphone, the length of a clock signal line for transmitting the high-frequency clock signal is shortened, and the power consumption is reduced. And the high-frequency electromagnetic radiation of the whole electronic equipment is reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and particularly to an audio processing circuit, a digital silicon microphone, an integrated circuit board, and an electronic device. Background Art

[0002] Currently, digital silicon microphones are widely used in large conference tablets. Their application circuits mainly include a power supply and a digital sound signal line for Pulse Density Modulation (PDM). Among them, the PDM signal includes a data signal and a clock signal.

[0003] For example, in the application of a large display screen in a whole machine, the routing of the clock signal is usually long, which is likely to cause serious electromagnetic radiation. In related technologies, in order to overcome electromagnetic radiation, an independent audio processing chip is selected to be close to the digital silicon microphone, so as to shorten the clock signal line between the audio processing chip and the digital silicon microphone.

[0004] However, in this way in related technologies, since the audio processing chip is arranged close to the digital silicon microphone, the area of the audio processing chip cannot be too large, resulting in limitations in the selection of the audio processing chip. Summary of the Invention

[0005] In view of the above problems, the present application provides an audio processing circuit, a digital silicon microphone, an integrated circuit board, and an electronic device to solve the above technical problems.

[0006] In a first aspect, the present application provides an audio processing circuit. This audio processing circuit is applied to a digital silicon microphone, and the digital silicon microphone is arranged in an electronic device. The audio processing circuit includes an audio processing module arranged on the main board of the electronic device and a clock generation module arranged outside the main board. A control signal line is arranged between the audio processing module and the clock generation module, and a clock signal line is arranged between the clock generation module and the digital silicon microphone;

[0007] The audio processing module sends a low-frequency enable signal to the clock generation module through the control signal line. The clock generation module generates a high-frequency clock signal in response to the low-frequency enable signal and outputs the high-frequency clock signal to the digital silicon microphone through the clock signal line.

[0008] In a possible implementation manner of the present application, the distance between the clock generation module and the digital silicon microphone is less than the distance between the audio processing module and the clock generation module.

[0009] In a possible implementation manner of the present application, the clock generation unit includes at least one of a clock oscillation circuit, a clock generation chip, and a crystal oscillator.

[0010] In a possible implementation manner of the present application, the low-frequency enable signal is a high-level signal or a low-level signal.

[0011] In a possible implementation manner of the present application, the audio processing circuit further includes a buffer module. A first data line is provided between the buffer module and the digital silicon microphone, and a second data line is provided between the buffer module and the audio processing module. The buffer module acquires the microphone data of the digital silicon microphone through the first data line, stores the microphone data, and sends the stored microphone data to the audio processing module through the second data line.

[0012] In a possible implementation manner of the present application, the clock generation module is provided on the signal transfer board. The signal transfer board is located outside the main board. A buffer unit is also provided on the signal transfer board. A third data line is provided between the buffer unit and the digital silicon microphone, and a fourth data line is provided between the buffer unit and the audio processing module. The buffer unit acquires the microphone data of the digital silicon microphone through the third data line, stores the microphone data, and sends the stored microphone data to the audio processing module through the fourth data line.

[0013] In a second aspect, the present application further provides a digital silicon microphone, which includes a microphone main body and the above-mentioned audio processing circuit connected to the microphone main body.

[0014] In a possible implementation manner of the present application, the microphone main body includes a first microphone and a second microphone symmetrically arranged on the electronic device. The clock generation module of the audio processing circuit is connected to the first microphone and the second microphone respectively through clock signal lines, and the clock generation module is arranged between the first microphone and the second microphone.

[0015] In a third aspect, the present application further provides an integrated circuit board, which includes a circuit board main body and the above-mentioned audio processing circuit or digital silicon microphone provided on the circuit board main body.

[0016] In a fourth aspect, the present application further provides an electronic device, which includes a device main body and the above-mentioned audio processing circuit, digital silicon microphone or integrated circuit board provided on the device main body.

[0017] It can be concluded from the above content that the present application has the following beneficial effects:

[0018] 1. The audio processing circuit provided by this application includes an audio processing module and a clock generation module. The audio processing module is disposed on the main board of the electronic device, and the clock generation module is disposed outside the main board. A low-frequency enable signal is sent from the audio processing module and output to the clock generation module through a control signal line. The clock generation module can generate a high-frequency clock signal in response to the low-frequency enable signal and send the high-frequency clock signal to the digital silicon microphone through a clock signal line. Since the audio processing module is disposed on the main board, it can be set far away from the digital silicon microphone, thereby reducing the design limitations on the audio processing module and expanding the selection range. At the same time, the clock generation module is disposed outside the main board and can be set close to the digital silicon microphone. The audio processing module on the main board sends a low-frequency enable signal through the control signal line, so that the clock generation module sends a high-frequency clock signal through the clock signal line to the digital silicon microphone, greatly shortening the length of the clock signal line for transmitting the high-frequency clock signal, effectively reducing the high-frequency electromagnetic radiation of the entire electronic device, and improving the reliability of the audio processing circuit.

[0019] 2. In this application, by setting the distance between the clock generation module and the digital silicon microphone to be less than the distance between the audio processing module and the clock generation module, it can be ensured that while the clock generation module is set close to the digital silicon microphone, the audio processing module is set far away from the digital silicon microphone. Thus, when selecting an audio processing module in the design, it is no longer limited to low-end audio processing chips with a small area and poor performance, and high-end audio processing chips are also applicable to this circuit. Moreover, setting the clock generation module close to the digital silicon microphone can shorten the length of the clock signal line to the greatest extent, ensuring good electromagnetic compatibility of the circuit.

[0020] These aspects or other aspects of this application will be more clearly understood in the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 is a schematic diagram of an application circuit structure of a digital silicon microphone in the related art;

[0023] Figure 2 is a schematic diagram of an application circuit structure of a digital silicon microphone applied to a large-screen whole machine in the related art;

[0024] Figure 3 is another schematic diagram of an application circuit structure of a digital silicon microphone applied to a large-screen whole machine in the related art;

[0025] Figure 4 is a schematic diagram of a module of the audio processing circuit provided in the embodiments of the present application;

[0026] Figure 5 is another schematic diagram of a module of the audio processing circuit provided in the embodiments of the present application;

[0027] Figure 6 is yet another schematic diagram of a module of the audio processing circuit provided in the embodiments of the present application;

[0028] Figure 7 is a schematic diagram of the structure of a microphone body provided in the embodiments of the present application;

[0029] Figure 8 is a schematic diagram of the structure of a display screen provided in the embodiments of the present application. Detailed implementation manners

[0030] The following details the implementation manners of the present application. The examples of the implementation manners are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The implementation manners described below with reference to the accompanying drawings are exemplary only for explaining the present application and should not be construed as limiting the present application.

[0031] To enable those skilled in the art of the present technology to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.

[0032] In the embodiments of the present application, it should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0033] Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that an article or device including a series of elements not only includes those elements but also other elements not explicitly listed, or further includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the article or device including the said element.

[0034] In the description of the embodiments of this application, words such as "example" or "for example" are used to indicate an example, illustration, or description. Any embodiment or design described as "for example" or "for example" in the embodiments of this application is not to be construed as being preferred or having more advantages than another embodiment or design. The use of words such as "example" or "for example" is intended to clearly present relative concepts.

[0035] It should be noted that in the embodiments of the present application, "connection" can be understood as electrical connection, and the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components.

[0036] Before introducing the audio processing circuit, digital silicon microphone, integrated circuit board and electronic device of the present application, relevant background information of the embodiments of the present application is first introduced.

[0037] like Figure 1 As shown in the figure, it is a schematic diagram of the application circuit structure of a digital silicon microphone in the related art. The application circuit includes a first microphone MIC1 and a second microphone MIC2. Each microphone corresponds to a power supply VDD and a pulse density modulation (PDM) digital sound signal circuit. The PDM signal includes a data signal and a clock signal. The data signal is output from the DATA port of the microphone to the codec CODEC, and the clock signal is output from the codec CODEC to the CLK port of the microphone.

[0038] In the application of large-screen display screens, the clock signal routing is usually long, which can easily cause serious electromagnetic radiation. In order to overcome electromagnetic radiation, Figure 2 In the related technology shown, an independent audio processing chip is selected to be close to the digital silicon microphone (left mic and right mic). The audio processing chip communicates with the motherboard's on-chip system SOC through the Universal Serial Bus (USB), thereby shortening the clock signal line between the audio processing chip and the digital silicon microphone, thereby reducing electromagnetic radiation.

[0039] However, since the audio processing chip is set close to the digital silicon microphone, the area of the audio processing chip cannot be too large, and only some low-end audio processing chips with small area and poor performance can be selected, which limits the selection of audio processing chips and makes it impossible to use high-end audio processing chips.

[0040] like Figure 3In another related technology shown below, to address the limitations of the audio processing chip, the audio processing chip is selected to be integrated on the main board, and data signals and clock signals are transmitted through communication with the adapter board. However, the link of the clock signal in this method is stretched to the maximum extent, resulting in serious electromagnetic radiation.

[0041] Based on the above problems in the related technology, embodiments of the present application provide an audio processing circuit, a digital silicon microphone, an integrated circuit board, and an electronic device. The audio processing circuit integrates the audio processing module on the main board, and sends a low-frequency enable signal from the audio processing module to a clock generation module arranged close to the digital silicon microphone. In response to the low-frequency enable signal, the clock generation module outputs a high-frequency clock signal to the digital silicon microphone. Since the clock generation module is arranged outside the main board and close to the digital silicon microphone, the length of the clock signal line for transmitting the high-frequency clock signal can be shortened, reducing electromagnetic radiation. Also, since the audio processing module is integrated on the main board, the selection range of the audio processing module and the applicable range of the audio processing circuit are expanded.

[0042] First, please refer to Figure 4 , Figure 4 FIG. is a schematic diagram of a module of the audio processing circuit provided in the embodiments of the present application. The audio processing circuit 100 can be applied to the digital silicon microphone 200, and the digital silicon microphone 200 is arranged in the electronic device 300. The audio processing circuit 100 can include an audio processing module 110 arranged on the main board 310 of the electronic device 300 and a clock generation module 120 arranged outside the main board 310. A control signal line 131 is arranged between the audio processing module 110 and the clock generation module 120, and a clock signal line 132 is arranged between the clock generation module 120 and the digital silicon microphone 200.

[0043] Among them, the audio processing module 110 can send a low-frequency enable signal to the clock generation module 120 through the control signal line 131. The clock generation module 120 can generate a high-frequency clock signal in response to the low-frequency enable signal, and output the high-frequency clock signal to the digital silicon microphone 200 through the clock signal line 132.

[0044] The electronic device 300 can be any existing electronic device capable of configuring a digital silicon microphone, such as a display screen, a tablet computer, a conference tablet, etc.

[0045] In the embodiments of the present application, the number of digital silicon microphones 200 provided on the electronic device 300 may be 1, or may be 2 or even more. For example, if only monophonic sound data is to be collected, 1 digital silicon microphone 200 may be configured; if stereo sound data is to be collected, 2 digital silicon microphones 200 may be configured, where one digital silicon microphone is used to collect the sound data of the left channel and the other digital silicon microphone is used to collect the sound data of the right channel. Of course, if multi-channel sound data is to be collected, a larger number of digital silicon microphones 200 may be configured. It can be understood that the number of digital silicon microphones 200 on the electronic device 300 can be determined according to the actual application scenario, and specific details are not limited here.

[0046] In this embodiment, taking 1 digital silicon microphone as an example for illustration, the audio processing module 110 of the audio processing circuit 100 is provided on the main board 310. For example, it may be integrated on the main board 310 of the electronic device 300. The audio processing module 110 may be an audio processing chip or a system-on-chip (SOC) configured with audio processing functions, and can be specifically determined according to the actual application scenario.

[0047] In this embodiment, different from the audio processing module 110, the clock generation module 120 of the audio processing circuit 100 is provided outside the main board 310. For example, the clock generation module 120 may be arranged close to the digital silicon microphone 200. The clock generation module 120 may be connected to the audio processing module 110 through a control signal line 131, and connected to the digital silicon microphone 200 through a clock signal line 132.

[0048] The audio processing module 110 may output a low-frequency enable signal to the control signal line 131 in response to a relevant collection instruction, and transmit the low-frequency enable signal to the signal transfer module 120 through the control signal line 131. After receiving the low-frequency enable signal, the clock generation module 120 may generate a high-frequency clock signal in response to the low-frequency enable signal, and output the high-frequency clock signal to the clock signal line 132, so as to output the high-frequency clock signal to the digital silicon microphone 200 through the clock signal line 132, enabling the digital silicon microphone 200 to work based on the high-frequency clock signal and collect the sound data in the environment.

[0049] The audio processing circuit 100 provided by the embodiment of the present application. The audio processing module 110 is disposed on the main board 310 of the electronic device 300, the signal transfer module 120 is disposed outside the main board 310, and the clock generation module 120 is disposed outside the main board 310. The low-frequency enable signal sent by the audio processing module 110 is output to the clock generation module 120 through the control signal line 131. The clock generation module 120 can generate a high-frequency clock signal in response to the low-frequency enable signal, and send the high-frequency clock signal to the digital silicon microphone 200 through the clock signal line 132. Since the audio processing module 110 is disposed on the main board 310 and far from the digital silicon microphone, the design limitation on the audio processing module 110 is reduced, and the selection range is expanded. At the same time, the audio processing module 110 on the main board 310 sends a low-frequency enable signal through the control signal line 131, so that the clock generation module 120 sends a high-frequency clock signal to the digital silicon microphone 200 through the clock signal line 132. Since the clock generation module 120 is disposed outside the main board 310 and can be close to the digital silicon microphone, the length of the clock signal line 132 for transmitting the high-frequency clock signal is greatly shortened, and the high-frequency electromagnetic radiation of the whole electronic device 300 is reduced. In addition, the integration of the audio processing module 110 on the main board 310 also improves the system integration degree and reduces the cost.

[0050] Next, continue to Figure 4 elaborate in detail on each module shown and the specific implementation manners that may be adopted in practical applications.

[0051] In some embodiments of the present application, the distance between the clock generation module 120 and the digital silicon microphone 200 may be less than the distance between the audio processing module 110 and the clock generation module 120.

[0052] In the embodiment of the present application, by setting the distance between the clock generation module 120 and the digital silicon microphone 200 to be less than the distance between the audio processing module 110 and the clock generation module 120, it can be ensured that while the clock generation module is close to the digital silicon microphone 200, the audio processing module 110 is far from the digital silicon microphone 200. Thus, when designing and selecting the audio processing module 110, it is no longer limited to low-end audio processing chips with small area and poor performance, and high-end audio processing chips are also applicable to this circuit. Moreover, the clock generation module 120 being close to the digital silicon microphone 200 can shorten the length of the clock signal line 132 to the greatest extent, ensuring that the circuit has good electromagnetic compatibility.

[0053] Specifically, the distance between the clock generation module 120 and the digital silicon microphone 200 may refer to the straight-line distance between the clock generation module 120 and the digital silicon microphone 200, or may refer to the wiring distance between the clock generation module 120 and the digital silicon microphone 200, for example, the wiring length of the clock signal line 132 set between the clock generation module 120 and the digital silicon microphone 200.

[0054] Similarly, the distance between the audio processing module 110 and the clock generating module 120 can refer to the straight-line distance between the audio processing module 110 and the clock generating module 120, or it can refer to the routing distance between the audio processing module 110 and the clock generating module 120, for example, the routing length of the control signal line 131 set between the audio processing module 110 and the clock generating module 120.

[0055] In some embodiments, the length of the control signal line 131 can be 1.5 times or more of the length of the clock signal line 132. For example, for a large screen, the length of the control signal line 131 can be 3 times the length of the clock signal line 132. For a small display screen, the length of the control signal line 131 can be 1.8 times the length of the clock signal line 132. It can be understood that the length ratio relationship between the control signal line 131 and the clock signal line 132 can be determined according to the actual application scenario, and is not specifically limited here.

[0056] In some embodiments of the present application, the clock generation module 120 may include any one or more existing clock generation devices, including but not limited to a clock oscillator circuit, a clock generation chip, and a crystal oscillator. It is understood that the selection of the clock generation module 120 may be determined based on the actual application scenario and is not specifically limited herein.

[0057] In one implementation, the clock generation module 120 can be configured to be triggered by a high-level signal, and the low-frequency enable signal can be a high-level signal. Specifically, the audio processing module 110 outputs a high-level low-frequency enable signal to the clock generation module 120 to trigger the clock generation module 120 to respond to the high-level low-frequency enable signal to generate a high-frequency clock signal and output it to the digital silicon microphone 200.

[0058] In another implementation, the clock generation module 120 can be configured to be triggered by a low-level signal, and the low-frequency enable signal can be a low-level signal. Specifically, the audio processing module 110 outputs a low-level low-frequency enable signal to the clock generation module 120 to trigger the clock generation module 120 to respond to the low-level low-frequency enable signal to generate a high-frequency clock signal and output it to the digital silicon microphone 200.

[0059] See also Figure 5, in some embodiments of the present application, the audio processing circuit 100 may further include a buffer module 140. A first data line 133 is provided between the buffer module 140 and the digital silicon microphone 200, and a second data line 134 is provided between the buffer module 140 and the audio processing module 110. The buffer module 140 can obtain the microphone data of the digital silicon microphone 200 through the first data line 133, store the microphone data, and send the stored microphone data to the audio processing module 110 through the second data line 134.

[0060] In the embodiments of the present application, the input end of the buffer module 140 can be connected to the output end of the digital silicon microphone 200 through the first data line 133. The first data line 133 can be used to transmit the microphone data signal from the digital silicon microphone 200 to the buffer module 140, so that the buffer module 140 can store the microphone data carried in the microphone data signal.

[0061] The output end of the buffer module 140 can be connected to the input end of the audio processing module 110 through the second data line 134. The second data line 134 can be used to transmit the microphone data stored in the buffer module 140 to the audio processing module 110.

[0062] It can be understood that in some embodiments, after transmitting the microphone data to the audio processing module 110, the buffer module 140 can clear the microphone data stored in itself to provide storage space for the next data storage.

[0063] In this embodiment, the buffer module 140 can be any existing buffer memory. The digital silicon microphone 200 can collect the sound data in the environment in response to the high-frequency clock signal and output the microphone data signal. The buffer module 140 can receive the microphone data signal from the digital silicon microphone 200, store the microphone data carried in the microphone data signal, and then send the stored microphone data to the audio processing module 110 based on a certain frequency or in response to a related trigger signal, so that the audio processing module 110 can perform related processing on the microphone data, that is, the sound data.

[0064] Such as Figure 6As shown, in some embodiments of the present application, the clock generation module 120 is disposed on the signal transfer board 150. The signal transfer board 150 is located outside the main board 310, and a buffer unit 160 is also disposed on the signal transfer board 150. A third data line 135 is provided between the buffer unit 160 and the digital silicon microphone 200, and a fourth data line 136 is provided between the buffer unit 160 and the audio processing module 110. The buffer unit 160 can obtain the microphone data of the digital silicon microphone 200 through the third data line 135, store the microphone data, and send the stored microphone data to the audio processing module 110 through the fourth data line 136.

[0065] In this embodiment, the input end of the buffer unit 160 can be connected to the output end of the digital silicon microphone 200 through the third data line 135. The third data line 135 can be used to transmit the microphone data signal from the digital silicon microphone 200 to the buffer unit 160, so that the buffer unit 160 can store the microphone data carried in the microphone data signal.

[0066] The output end of the buffer unit 160 can be connected to the input end of the audio processing module 110 through the fourth data line 136. The fourth data line 136 can be used to transmit the microphone data stored in the buffer unit 160 to the audio processing module 110.

[0067] It can be understood that in some embodiments, after the buffer unit 160 transmits the microphone data to the audio processing module 110, it can clear the microphone data stored in itself to provide storage space for the next data storage.

[0068] In this embodiment, the buffer unit 160 can be any existing buffer memory. The digital silicon microphone 200 can collect sound data in the environment in response to the high-frequency clock signal and output a microphone data signal. The buffer unit 160 can receive the microphone data signal from the digital silicon microphone 200, store the microphone data carried in the microphone data signal, and then send the stored microphone data to the audio processing module 110 based on a certain frequency or in response to a related trigger signal, so that the audio processing module 110 can perform related processing on the microphone data, that is, the sound data.

[0069] Based on the above embodiments, an embodiment of the present application further provides a digital silicon microphone, which may include a microphone body and an audio processing circuit 100 in any corresponding embodiment connected to the microphone body. Figures 4 to 6 The corresponding audio processing circuit 100 in any one of the embodiments.

[0070] Since the digital silicon microphone is provided with the audio processing circuit 100 of the above embodiment, it has all the beneficial effects of the audio processing circuit 100 in any of the above embodiments, which will not be elaborated here.

[0071] As Figure 7 shown, in some embodiments, the microphone body may include a first microphone 201 and a second microphone 202 symmetrically arranged above the electronic device 300. The clock generation module 120 of the audio processing circuit 100 may be connected to the first microphone 201 and the second microphone 202 respectively through clock signal lines 132, and the clock generation module 120 is arranged between the first microphone 201 and the second microphone 202.

[0072] It can be understood that the first microphone 201 can be used to collect sound data of the left channel, and the second microphone 202 can be used to collect sound data of the right channel. The two microphones can respectively respond to the high-frequency clock signal transmitted by the clock signal line 132 to collect the corresponding sound data, and then carry the collected sound data in their own microphone data signals and feedback it to the audio processing module 110 for the audio processing module 110 to process the sound data.

[0073] Based on the above embodiments, an embodiment of the present application further provides an integrated circuit board, which may include a circuit board body and the audio processing circuit or digital silicon microphone as described above provided on the circuit board body. The integrated circuit board may be a microcircuit, a microchip, a wafer / chip, and the chip may be but not limited to a system-on-chip (SOC), a system-in-package (SIP) chip, etc.

[0074] Since the integrated circuit board is provided with the audio processing circuit 100 of the above embodiment, it has all the beneficial effects of the audio processing circuit 100 in any of the above embodiments, which will not be elaborated here.

[0075] It can be understood that, based on the above embodiments, an embodiment of the present application further provides an electronic device, which may be but not limited to a display screen, a tablet computer, a conference tablet, etc.

[0076] Since the electronic device is provided with the audio processing circuit 100 of the above embodiment, it has all the beneficial effects of the audio processing circuit 100 in any of the above embodiments, which will not be elaborated here.

[0077] Next, in combination with Figure 8 the display screen shown, the solution of the present application will be described in detail.

[0078] The upper part of the display screen is symmetrically provided with a left microphone and a right microphone. An audio processing chip is integrated on the main board of the display screen. The output end of the audio processing chip is connected to a clock generation module 120 on a signal transfer board 150 through a control signal line 131. The clock generation module 120 is arranged between the left microphone and the right microphone and is connected to the left microphone and the right microphone respectively through a clock signal line 132. At the same time, the left microphone and the right microphone are also respectively connected to a buffer unit 160 on the signal transfer board 150 through a data line. The output end of the buffer unit 160 is connected to the input end of the audio processing chip through a data line.

[0079] The audio processing chip outputs a high-level low-frequency enable signal to the control signal line 131, and transmits the high-level low-frequency enable signal to the clock generation module 120 through the control signal line 131. The clock generation module 120 responds to the high-level low-frequency enable signal to generate a high-frequency clock signal CLK and outputs it to the left microphone and the right microphone respectively. The left microphone and the right microphone collect sound data data in the environment according to the high-frequency clock signal CLK, and respectively send the collected sound data data to the buffer unit 160 for storage, and then the buffer unit 160 sends the stored sound data data to the audio processing chip so that the audio processing chip can process the sound data data.

[0080] In this display screen, most of the clock signal lines are replaced by the control signal line 131. Compared with the solutions in the related art, the clock signal lines are shortened to the greatest extent, the high-frequency electromagnetic radiation of the display screen is reduced, and the electromagnetic compatibility (EMC) is better. At the same time, the audio processing chip is integrated on the main board, which improves the integration degree of the entire display screen, reduces the cost, and can also select high-end audio processing chips, expanding the selection range of the audio processing chips.

[0081] The above are only the preferred embodiments of the present application, and do not impose any form of limitation on the present application. Although the present application has been disclosed above with the preferred embodiments, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the equivalent embodiments by using the above-disclosed technical content within the scope of the technical solution of the present application. However, as long as it does not depart from the content of the technical solution of the present application, any brief modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application still fall within the scope of the technical solution of the present application.

Claims

1. An audio processing circuit, characterized in that, Applied to a digital silicon microphone, the digital silicon microphone is disposed in an electronic device. The audio processing circuit includes an audio processing module disposed on the main board of the electronic device and a clock generation module disposed outside the main board. A control signal line is provided between the audio processing module and the clock generation module, and a clock signal line is provided between the clock generation module and the digital silicon microphone; The audio processing module sends a low-frequency enable signal to the clock generation module through the control signal line. The clock generation module generates a high-frequency clock signal in response to the low-frequency enable signal and outputs the high-frequency clock signal to the digital silicon microphone through the clock signal line.

2. The audio processing circuit according to claim 1, wherein The distance between the clock generation module and the digital silicon microphone is less than the distance between the audio processing module and the clock generation module.

3. The audio processing circuit according to claim 1, wherein The clock generation module includes at least one of a clock oscillation circuit, a clock generation chip, and a crystal oscillator.

4. The audio processing circuit according to claim 1, wherein The low-frequency enable signal is a high-level signal or a low-level signal.

5. The audio processing circuit according to claim 1, wherein The audio processing circuit further includes a buffer module. A first data line is provided between the buffer module and the digital silicon microphone, and a second data line is provided between the buffer module and the audio processing module. The buffer module acquires microphone data of the digital silicon microphone through the first data line, stores the microphone data, and sends the stored microphone data to the audio processing module through the second data line.

6. The audio processing circuit according to claim 1, wherein, The clock generation module is disposed on a signal transfer board, the signal transfer board is located outside the main board, and a buffer unit is further disposed on the signal transfer board. A third data line is provided between the buffer unit and the digital silicon microphone, and a fourth data line is provided between the buffer unit and the audio processing module. The buffer unit acquires microphone data of the digital silicon microphone through the third data line, stores the microphone data, and sends the stored microphone data to the audio processing module through the fourth data line.

7. A digital silicon microphone, characterized in that The digital silicon microphone includes a microphone body and the audio processing circuit according to any one of claims 1-6 connected to the microphone body.

8. The digital silicon microphone according to claim 7, wherein, The microphone body includes a first microphone and a second microphone symmetrically disposed on the electronic device. The clock generation module of the audio processing circuit is connected to the first microphone and the second microphone respectively through a clock signal line, and the clock generation module is disposed between the first microphone and the second microphone.

9. An integrated circuit board, characterized in that, The integrated circuit board includes a circuit board body and the audio processing circuit according to any one of claims 1-6 or the digital silicon microphone according to any one of claims 7-8 disposed on the circuit board body.

10. An electronic device, characterized in that, The electronic device includes a device body and the audio processing circuit according to any one of claims 1-6, the digital silicon microphone according to any one of claims 7-8, or the integrated circuit board according to claim 9 disposed on the device body.

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