Copper deposition device and horizontal copper deposition wire

Abstract

The invention provides a copper deposition device and a horizontal copper deposition wire, relates to the technical field of circuit board production, and is used for solving the problem that copper deposition is easy to occur on an anode plate. The copper deposition device comprises a copper deposition cylinder, liquid medicine, a rectifier, an anode plate and a moving assembly. The copper deposition cylinder is arranged on the rack, and liquid medicine is contained in the copper deposition cylinder. And the anode plate is fixedly arranged in the copper deposition cylinder and is immersed in the liquid medicine. The rectifier is arranged beside the copper deposition cylinder, the positive electrode of the rectifier is electrically connected with the anode plate, the negative electrode of the rectifier is electrically connected with the moving assembly and the rack, and the moving assembly conveys the circuit board. The cathode of the rectifier is electrically connected with the rack, so that the rack is communicated with the nearest cathode potential, the influence of induced voltage generated on the rack is counteracted or reduced, the voltage of the rack is lower than that of the anode plate, the rack is a cathode relative to the anode plate, and anode copper hardening is avoided.

Description

Technical Field

[0001] This application relates to the technical field of circuit board production, and particularly to a copper deposition device and a horizontal copper deposition line. Background Art

[0002] With the progress of technology, the degree of automation is getting higher and higher. As one of the important components in various electronic products, the circuit board is the support for electronic components in the electronic product and the carrier of electrical connection, which has a great impact on the performance of electronic products.

[0003] Circuit boards usually need to undergo chemical copper deposition. Chemical copper deposition is a self-catalytic oxidation-reduction reaction. By immersing the circuit board to be copper-deposited in the chemical solution, the copper ions in the chemical solution gain electrons and are reduced to metallic copper, which is deposited on the circuit board. However, the anode plates used in the process of chemical copper deposition on circuit boards tend to form copper deposits easily, and frequently replacing the anode plates increases production costs. Summary of the Invention

[0004] In view of the above problems, the embodiments of this application provide a copper deposition device and a horizontal copper deposition line to reduce copper deposition on the anode plate and lower costs.

[0005] To achieve the above object, in a first aspect, the embodiments of this application provide a copper deposition device, which includes: a copper deposition tank, a chemical solution, a rectifier, an anode plate, and a moving component;

[0006] The copper deposition tank is configured to be arranged on a frame, and the chemical solution is contained in the copper deposition tank. The anode plate is fixedly arranged in the copper deposition tank and immersed in the chemical solution. The rectifier is arranged beside the copper deposition tank. The positive electrode of the rectifier is electrically connected to the anode plate, the negative electrode of the rectifier is electrically connected to the moving component, and the negative electrode of the rectifier is configured to be electrically connected to the frame. The moving component is configured to convey the circuit board.

[0007] In some possible examples, the negative electrode of the rectifier is connected to the frame through a wire.

[0008] In some possible examples, the resistance of the wire is less than a preset value to cancel out the induced voltage of the frame, so that the remaining induced voltage of the frame is less than the voltage of the anode plate.

[0009] In some possible examples, the copper deposition device further includes a ground wire, and the ground wire is connected to the frame.

[0010] In some possible examples, the moving component includes a plurality of horizontally arranged roller groups, each of the roller groups includes a first roller and a second roller arranged opposite to each other, the lower portions of the first roller and at least the second roller are immersed in the potion, and a gap is formed between the first roller and the second roller for moving the circuit board.

[0011] In some possible examples, the copper sinking device further includes a driving component, which is disposed on the copper sinking cylinder and is in transmission connection with the first roller and / or the second roller to pull the circuit board to move.

[0012] In some possible examples, the copper sinking device further includes a controller, which is fixedly disposed on an outer wall of the copper sinking cylinder and electrically connected to the rectifier.

[0013] In some possible examples, there are at least two copper sinking cylinders, which are configured to be placed horizontally on the rack, and each copper sinking cylinder is correspondingly provided with a rectifier, and the negative pole of any rectifier is configured to be electrically connected to the rack.

[0014] In some possible examples, the copper sinking device further includes a water washing tank disposed beside the copper sinking tank and in communication with the copper sinking tank, and the water washing tank is configured to be disposed on the frame.

[0015] The copper deposition device in the embodiment of the present application has at least the following advantages:

[0016] The copper sinking device in the embodiment of the present application includes a copper sinking cylinder, a solution, a rectifier, an anode plate, and a moving assembly. The copper sinking cylinder is arranged on a frame, and the copper sinking cylinder is filled with a solution. The anode plate is fixedly arranged in the copper sinking cylinder and immersed in the solution. The rectifier is arranged next to the copper sinking cylinder, the positive pole of the rectifier is electrically connected to the anode plate, the negative pole of the rectifier is electrically connected to the moving assembly, and the negative pole of the rectifier is electrically connected to the frame, and the moving assembly transports the circuit board. By electrically connecting the negative pole of the rectifier to the frame so that the frame is connected to the nearest negative pole potential, the influence of the induced voltage generated on the frame is offset or reduced, so that the voltage of the frame is lower than the voltage of the anode plate, and the frame is negative relative to the anode plate, thereby avoiding copper accumulation on the anode plate, ensuring the quality of copper sinking, reducing the replacement and removal of the anode plate, and saving labor and material costs.

[0017] A second aspect of the present application provides a horizontal copper deposition line, comprising a frame and a copper deposition device as described above, disposed on the frame. This horizontal copper deposition line, including the copper deposition device, offers at least the advantages of preventing copper buildup on the anode plate and reducing production costs. The specific effects are described above and will not be further elaborated here.

[0018] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by the technical features of these technical solutions, other technical problems that can be solved by the copper deposition device and the horizontal copper deposition line provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manners. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 Schematic diagram of anode plate copper deposition in the related art;

[0021] Figure 2 Schematic diagram of the horizontal copper deposition line in the embodiment of the present application;

[0022] Figure 3 Schematic diagram of the copper deposition device in the embodiment of the present application;

[0023] Figure 4 Schematic diagram of the connection of the anode plate, the frame, and the rectifier in the embodiment of the present application.

[0024] Description of the Reference Numerals:

[0025] 10 - Fluffing device;

[0026] 20 - Degumming device;

[0027] 30 - Adjusting device;

[0028] 40 - Micro - etching device;

[0029] 50 - Activation device;

[0030] 60 - Copper deposition device;

[0031] 61 - Copper deposition tank;

[0032] 62 - Rectifier;

[0033] 63 - Anode plate;

[0034] 64 - Moving component;

[0035] 70 - Frame. Specific Embodiment

[0036] In the related art, there is a phenomenon of copper deposition on the anode plate. After research by the inventor, it is found that: when mass-producing circuit boards, especially when plating copper on filled vias (Plating over filled via, abbreviated as POFV) circuit boards, copper deposition on the anode plate is likely to occur. By adjusting the production line, process, and chemical solution, the improvement of copper deposition on the anode plate is not obvious.

[0037] The inventor's research also finds that: the normal service life of the anode plate is 7 days, during which no copper deposition occurs on the anode plate. Each time the phenomenon of copper on the anode plate shows that: the current of the rectifier becomes higher or the current of the rectifier fluctuates (that is, the current of the rectifier jumps abnormally), and the copper deposition period gradually becomes more and more frequent. When it is the most serious, when making boards for 2 - 3 hours, copper deposition will occur on the anode plate.

[0038] Among them, the current of the rectifier fluctuating means that when passing through the same circuit board, the current change shows a high - low - high change. When copper deposition occurs on the anode plate, the copper particles contained in the chemical solution will increase rapidly, resulting in copper skin or copper particles on the circuit board, causing the produced products to be scrapped, and requiring special personnel to conduct regular spot checks, wasting manpower and material resources.

[0039] The inventor continues to research and finds that: referring to Figure 1 , the motor, rectifier 62, etc. cause the frame to generate induced electricity, and the induced voltage of the frame is greater than the voltage of the anode plate 63. The frame contacts the chemical solution through structures such as cooling coils, forming a path between the frame and the anode plate 63. The frame always provides a positive voltage to the anode plate 63, and the anode plate 63 presents a negative pole to the frame, and copper ions directly form copper ion deposition on the anode plate 63, resulting in copper deposition on the anode plate 63. Especially in the standby state, or during the interval between board runs, the copper deposition on the anode plate 63 is more obvious.

[0040] The inventor attempts to connect the frame to the ground wire and finds that it is difficult to eliminate the induced electricity on the frame. The reason is that the induced voltage of the frame is usually more than 1V, and its value is small. If the wire is routed over a long distance, the voltage drop is large, and the induced voltage on the frame is still more than 1V.

[0041] Therefore, the embodiment of the present application provides a copper deposition device. By electrically connecting the negative pole of the rectifier to the frame, the frame is connected to the nearest negative potential, thereby offsetting or reducing the influence of the induced voltage generated on the frame, so that the voltage of the frame is lower than the voltage of the anode plate, and the frame is negative relative to the anode plate, thereby avoiding copper deposition on the anode plate, ensuring the quality of copper deposition, reducing the replacement and copper removal of the anode plate, and saving labor costs and material costs.

[0042] In order to make the above-mentioned objectives, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0043] Referring to Figure 1 , the embodiments of the present application provide a horizontal copper deposition line. The horizontal copper deposition line refers to a copper deposition production line of a horizontal line. Each device in the horizontal copper deposition line is horizontally arranged and connected in sequence, and the circuit board is horizontally transported in the horizontal copper deposition line. The horizontal copper deposition line has no electrolytic oxidation-reduction deposition and can be applied to various printed circuit boards (PCBs for short) and flexible printed circuit boards (FPCs for short), which can improve the hole metallization reliability of small holes and micro-holes in FPC multi-layer boards and rigid-flex boards.

[0044] Referring to Figures 2 to 4 , the horizontal copper deposition line includes a frame 70 and a copper deposition device 60 arranged on the frame 70. The frame 70 is used to support various devices thereon, and its material can be metal to have a certain strength. The copper deposition device 60 is used for hole metallization of the circuit board, that is, to form a copper layer on the hole wall of the circuit board.

[0045] Specifically, under the catalytic action of activating palladium nuclei, the chemical solution in the copper deposition device 60 undergoes an autocatalytic oxidation-reduction reaction with formaldehyde and other substances as reducing agents to generate an electroless copper layer on the hole wall. The copper deposition time is 4 min - 8 min, such as 5 min, and the copper deposition thickness is 12 μm - 20 μm, with high production efficiency.

[0046] As Figure 2 and Figure 4 shown, the horizontal copper deposition line further includes a swelling device 10, a degumming device 20, an adjusting device 30, a micro-etching device 40, and an activating device 50 that are arranged on the frame 70 and connected in sequence. The swelling device 10 is used for swelling the gum residue and drilling dirt on the hole wall of the circuit board, and the swelling agent in the swelling device 10 can be 302S.

[0047] The degumming device 20 is used to remove the gum residue and drilling dirt on the hole wall of the circuit board, for example, to remove the gum residue and drilling dirt on the hole wall by potassium permanganate or sodium permanganate to increase the bonding force after subsequent copper deposition on the hole wall. The adjusting device 30 is used for hole conditioning of the hole wall of the circuit board, adjusting the charge of the hole wall to make the hole wall carry a positive charge to improve the subsequent palladium adsorption force, and the adjusting agent in the adjusting device 30 can be 321C.

[0048] The micro-etching device 40 is used to remove the residues on the copper surface. The micro-etching agent in the micro-etching device 40 can be SPS or hydrogen peroxide solution in sulfuric acid. The time for micro-etching treatment is 30 - 120 s. The activation device 50 is used to reduce ionic palladium to activated palladium nuclei and deposit them on the surface of the hole wall. The activator in the activation device 50 can be colloidal palladium solution.

[0049] The horizontal copper deposition line further includes a plurality of water washing devices (not shown in the figure). The plurality of water washing devices are respectively arranged between the swelling device 10 and the desmearing device 20, between the desmearing device 20 and the adjusting device 30, between the adjusting device 30 and the micro-etching device 40, between the micro-etching device 40 and the activation device 50, and between the activation device 50 and the copper deposition device 60 to clean the processed circuit board.

[0050] Refer to Figure 3 , the copper deposition device 60 includes a copper deposition tank 61, chemical solution, a rectifier 62, an anode plate 63, and a moving component 64. Among them, the copper deposition tank 61 is arranged on the frame 70. The chemical solution is contained in the copper deposition tank 61. The chemical solution is a conventional copper deposition reagent in the art and will not be exemplified here. One end of the copper deposition tank 61 away from the frame 70 can be open to facilitate the cleaning and installation of the copper deposition tank 61.

[0051] The anode plate 63 is fixed in the copper deposition tank 61. The anode plate 63 can be directly fixed on the inner side wall of the copper deposition tank 61 through fasteners such as screws or fixed on a bracket in the copper deposition tank 61. And the anode plate 63 is immersed in the chemical solution, that is, the anode plate 63 is entirely located in the chemical solution, and the liquid level of the chemical solution is higher than the top surface of the anode plate 63 so that the chemical solution submerges the anode plate 63.

[0052] The anode plate 63 is an indispensable electrode in the electrochemical reaction and electrolysis process during copper deposition. The anode plate 63 undergoes an oxidation reaction during copper deposition, that is, the anode plate 63 loses electrons, that is, the anode plate 63 is oxidized in the chemical solution to form metal ions. Among them, the material of the anode plate 63 can be 316L, which has good oxidation resistance and corrosion resistance.

[0053] The moving component 64 conveys the circuit board, that is, the moving component 64 can pull the circuit board to move horizontally. Part of the moving component 64 can be arranged in the copper deposition tank 61. The moving component 64 contacts the circuit board and together serves as another indispensable electrode in the electrochemical reaction and electrolysis process during copper deposition. It accepts electrons and is converted into copper ions to deposit and form copper, so that at least the surface of the circuit board is plated with a layer of fine copper layer.

[0054] In some possible implementations, the moving assembly 64 includes multiple horizontally arranged roller assemblies, each roller assembly including a first roller and a second roller positioned opposite each other. The first roller is positioned below the corresponding second roller, with a gap between the first and second rollers providing space for the circuit board to move. The first and second rollers cooperate to convey the circuit board, with the circuit board being transferred between the first and second rollers. The first and second rollers can be columnar, such as cylindrical, to improve smoothness of circuit board transfer.

[0055] The first roller is immersed in the solution, and at least the lower portion of the second roller is immersed in the solution, so that the circuit board is completely immersed in the solution, thereby achieving copper deposition on the circuit board. The first and second rollers are both located within the copper deposition cylinder 61, for example, connected to the copper deposition cylinder 61. Connecting shafts are provided at both ends of the first and second rollers. Bearing seats are provided on the sidewalls of the copper deposition cylinder 61. The connecting shafts extend through the corresponding bearing seats and extend outward from the copper deposition cylinder 61.

[0056] To move the circuit board, the copper deposition device 60 further includes a drive assembly (not shown). The drive assembly is disposed on the copper deposition cylinder 61 and is in driving connection with the first roller and / or the second roller to pull the circuit board to move. The drive assembly can be disposed on the outer wall of the copper deposition cylinder 61 and connected to the first roller and / or the second roller to drive the first roller and the second roller to rotate.

[0057] In some possible implementations, the drive assembly includes a transmission motor, a first transmission gear disposed between adjacent first rollers, and a second transmission gear disposed between adjacent second rollers, with the outermost first transmission gear and the second transmission gear being respectively connected to the transmission motor. Alternatively, the drive assembly includes a transmission motor, a first transmission chain connected to the first rollers, and a second transmission chain connected to the second rollers, with the first transmission chain and the second transmission chain being respectively connected to the transmission motor.

[0058] Continue reading Figure 3 The rectifier 62 is arranged beside the copper sinking cylinder 61. For example, the rectifier 62 is fixedly arranged on the outer wall of the copper sinking cylinder 61 so that the rectifier 62 is adjacent to the copper sinking cylinder 61, which is convenient for external connection of the rectifier 62. The rectifier 62 is used as a power supply device during copper sinking and provides unidirectional current.

[0059] The positive electrode of the rectifier 62 is electrically connected to the anode plate 63, and the negative electrode of the rectifier 62 is electrically connected to the moving component 64, so that the moving component 64 is negatively charged. The moving component 64 contacts the circuit board, so that the circuit board is negatively charged.

[0060] The negative electrode of the rectifier 62 is also electrically connected to the frame 70, so that the frame 70 is connected to the nearest negative potential, thereby canceling or reducing the influence of the induced voltage generated on the frame 70. Before the negative electrode of the rectifier 62 is connected to the frame 70, the induced voltage of the frame 70 is positive and even exceeds the voltage on the anode plate 63, making the frame 70 positive relative to the anode plate 63. Copper ions are directly deposited on the anode plate 63, causing copper to accumulate on the anode plate 63.

[0061] After the negative electrode of the rectifier 62 is connected to the frame 70, it is measured that the voltage of the anode plate 63 relative to the negative electrode of the rectifier plate is 1.414V, and the voltage of the frame 70 relative to the negative electrode of the rectifier 62 is -0.009V. The voltage of the frame 70 is 1.405V lower than the voltage of the anode plate 63, so that the voltage of the frame 70 is lower than the voltage of the anode plate 63, and the frame 70 is negative relative to the anode plate 63. Thus, copper accumulation on the anode plate 63 is avoided, the copper deposition quality of the circuit board is ensured, the replacement and copper removal of the anode plate 63 are reduced, and the labor cost and material cost are saved.

[0062] In some possible examples, the negative electrode of the rectifier 62 is connected to the frame 70 through a wire. Exemplarily, one end of the wire is connected to the negative electrode of the rectifier 62, and the other end of the wire is connected to the frame 70, making the connection between the rectifier 62 and the frame 70 simple and easy to operate.

[0063] Wherein, the resistance of the wire is less than a preset value to cancel at least part of the induced voltage of the frame 70, so that the remaining induced voltage of the frame 70 is less than the voltage of the anode plate 63. The voltage of the anode plate 63 is basically close to the voltage of the positive electrode of the rectifier 62, and the voltage of the positive electrode of the rectifier 62 can be used to replace the voltage of the anode plate 63. With such a setting, it is not necessary to measure the voltage of the anode plate 63, and the measurement operation can be simplified.

[0064] In some possible implementation manners, the length of the wire can be less than 2m to control the resistance of the wire to be less than a preset value, where the preset value can be less than zero. By controlling the length of the wire, the voltage drop on the wire can be reduced, so that the induced electricity of the frame 70 can be smoothly led out to reduce the induced voltage of the frame 70. Compared with pulling the frame 70 into the computer room for grounding, the line used to connect the frame 70 to the negative electrode of the rectifier 62 is shorter, so that the induced electricity on the frame 70 can be better eliminated.

[0065] In some possible examples, the copper deposition device 60 further includes a ground wire (not shown in the figure), and the ground wire is connected to the frame 70. By connecting the frame 70 through the ground wire, a low-impedance path from the frame 70 to the ground can be provided, so that the induced electricity of the frame 70 can safely return to the ground. Especially in the case where the rectifier current becomes higher or the rectifier current fluctuates, etc., the excessive induced electricity on the frame 70 can be avoided from causing damage.

[0066] The copper deposition device 60 further includes a controller (not shown), which is fixedly mounted on the outer wall of the copper deposition cylinder 61 and electrically connected to the rectifier 62. The controller is used to control the opening or closing of the rectifier 62, thereby controlling the copper deposition of the circuit board.

[0067] In some possible examples, there are at least two copper sinking cylinders 61, and at least two copper sinking cylinders 61 are configured to be placed horizontally on the rack 70, and each copper sinking cylinder 61 is correspondingly provided with a rectifier 62, and the negative pole of any rectifier 62 is configured to be electrically connected to the rack 70.

[0068] It is understood that at least two copper sinking cylinders 61 are both provided on the frame 70 and are arranged horizontally at intervals, and the two copper sinking cylinders 61 can be connected. An anode plate 63 and a movable assembly 64 are correspondingly provided in each copper sinking cylinder 61, and a rectifier 62 is correspondingly provided on the outside of each copper sinking cylinder 61, and the rectifier 62 is connected to the corresponding anode plate 63 and the movable assembly 64. The negative pole of any one of the at least two rectifiers 62 is electrically connected to the frame 70, which can reduce the copper accumulation of each anode plate 63. Of course, the negative poles of all rectifiers 62 can be electrically connected to the frame 70.

[0069] In some possible examples, the copper sinking device 60 further includes a water washing tank, which is disposed next to and communicates with the copper sinking tank 61 and is configured to be disposed on the frame 70. By disposing the water washing tank next to the copper sinking tank 61, the circuit board after copper sinking can be cleaned to remove residual chemicals on the surface of the circuit board.

[0070] In summary, the copper sinking device 60 in the embodiment of the present application includes a copper sinking cylinder 61, a solution, a rectifier 62, an anode plate 63, and a moving assembly 64. The copper sinking cylinder 61 is set on a frame 70, and the copper sinking cylinder 61 is filled with a solution. The anode plate 63 is fixedly set in the copper sinking cylinder 61 and immersed in the solution. The rectifier 62 is set next to the copper sinking cylinder 61, the positive pole of the rectifier 62 is electrically connected to the anode plate 63, the negative pole of the rectifier 62 is electrically connected to the moving assembly 64, and the negative pole of the rectifier 62 is electrically connected to the frame 70, and the moving assembly 64 transports the circuit board. By electrically connecting the negative electrode of the rectifier 62 to the rack 70, the rack 70 is connected to the nearest negative electrode potential, thereby offsetting or reducing the influence of the induced voltage generated on the rack 70, so that the voltage of the rack 70 is lower than the voltage of the anode plate 63. The rack 70 is negative relative to the anode plate 63, thereby avoiding copper deposition on the anode plate 63, ensuring the quality of copper deposition, reducing the replacement and copper removal of the anode plate 63, and saving labor and material costs.

[0071] It should be noted that all the directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this specification are only used to explain the relative positional relationship, movement relationship, etc. between components in a specific posture (as shown in the attached drawings). If this specific posture changes, the directional indications will also change accordingly.

[0072] Unless otherwise clearly specified and defined, terms such as "installation", "equipped with", "connection", etc. shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] The embodiments or implementation manners in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0074] In the description of this specification, the descriptions with reference to terms such as "one implementation manner", "some implementation manners", "illustrative implementation manners", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0075] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A copper deposition device, characterized in that, Comprising: A copper deposition tank, chemicals, a rectifier, anode plates, and a moving component; The copper deposition tank is configured to be arranged on a frame, and the chemicals are contained in the copper deposition tank. The anode plates are fixedly arranged in the copper deposition tank and immersed in the chemicals. The rectifier is arranged beside the copper deposition tank. The positive pole of the rectifier is electrically connected to the anode plates, the negative pole of the rectifier is electrically connected to the moving component, and the negative pole of the rectifier is configured to be electrically connected to the frame. The moving component is configured to convey a circuit board.

2. The copper deposition device according to claim 1, wherein The negative pole of the rectifier is connected to the frame through a wire.

3. The copper deposition device according to claim 2, characterized in that, The resistance of the wire is less than a preset value to offset the induced voltage of the frame, so that the remaining induced voltage of the frame is less than the voltage of the anode plates.

4. The copper deposition device according to claim 1, characterized in that The copper deposition device further includes a ground wire, and the ground wire is connected to the frame.

5. The copper deposition device according to any one of claims 1-4, characterized in that, The moving component includes a plurality of horizontally arranged roller groups. Each roller group includes a first roller and a second roller arranged oppositely. The lower parts of the first roller and at least the second roller are both immersed in the chemicals, and a gap for the circuit board to move is formed between the first roller and the second roller.

6. The copper deposition device according to claim 5, characterized in that, The copper deposition device further includes a driving component. The driving component is arranged on the copper deposition tank and is in transmission connection with the first roller and / or the second roller to pull the circuit board to move.

7. The copper deposition device according to any one of claims 1-4, characterized in that, The copper deposition device further includes a controller. The controller is fixedly arranged on the outer side wall of the copper deposition tank and is electrically connected to the rectifier.

8. The copper deposition device according to any one of claims 1-4, characterized in that, There are at least two copper deposition tanks. The at least two copper deposition tanks are configured to be horizontally placed on the frame, and each copper deposition tank is correspondingly provided with a rectifier. The negative pole of any one rectifier is configured to be electrically connected to the frame.

9. The copper deposition device according to any one of claims 1-4, characterized in that, The copper deposition device further includes a water washing tank arranged beside the copper deposition tank and communicated with the copper deposition tank. The water washing tank is configured to be arranged on the frame.

10. A horizontal copper deposition line, characterized in that, Comprising a frame, and the copper deposition device as described in any one of claims 1-9 arranged on the frame.

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