Display panel, preparation method of display panel and spliced display screen

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and a spliced display screen, and relates to the technical field of display. In the display panel, a bonding layer is arranged in a groove of a first substrate, a second substrate is fixed to the first substrate through the bonding layer, and a first conductive pin arranged on the first substrate and a second conductive pin arranged on the second substrate are connected through side face wires at least distributed on the side face of the first substrate. In the structure, the bonding layer is arranged in the groove, and the side wires do not pass through the bonding layer, so that the structural stability of the side wires can be ensured, and the display effect of the display panel can be conveniently improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and a tiled display screen. Background Art

[0002] A micro light-emitting diode (Micro-LED) display is formed by thinning, miniaturizing, and arraying the structure design of a light-emitting device (LED), and then transferring it to a driving backplane through a mass transfer technology to form LEDs with a nanoscale pitch. Limited by the mass transfer technology, it is currently impossible to fabricate large-sized displays of this type. To increase the size of such displays, in related technologies, the display size is increased through a tiling technology. However, due to the relatively large tiling gap between adjacent tiled display panels, the display effect of the tiled display screen is affected. Summary of the Invention

[0003] To overcome the technical problems mentioned in the above technical background, embodiments of this application provide a display panel, a method for manufacturing the display panel, and a tiled display screen.

[0004] In a first aspect of this application, a display panel is provided. The display panel includes:

[0005] A first substrate, on the surface of which a groove is formed;

[0006] An adhesive layer, which is disposed in the groove. Wherein, in a direction perpendicular to the first substrate, the thickness of the adhesive layer is less than or equal to the depth of the groove;

[0007] A second substrate, which is fixed to the first substrate through the adhesive layer;

[0008] A first conductive pin is disposed on a side of the first substrate away from the second substrate, and a second conductive pin is disposed on a side of the second substrate away from the first substrate. The first conductive pin and the second conductive pin are connected through side traces at least distributed on the side surface of the first substrate.

[0009] In a possible implementation manner of this application, the first substrate is a display substrate, and the second substrate is a carrier substrate;

[0010] The first substrate includes a light-emitting side and a backlight side located on opposite sides, and the groove is disposed on the backlight side.

[0011] In a possible implementation manner of this application, the first substrate includes:

[0012] A substrate;

[0013] An array driving layer, which is located on the substrate;

[0014] A driving electrode, which is located on a side of the array driving layer away from the substrate, and adjacent driving electrodes are isolated from each other;

[0015] A light-emitting device, and a device electrode of the light-emitting device is electrically connected to the driving electrode;

[0016] The groove is disposed on a surface of the substrate away from the array driving layer;

[0017] In a direction perpendicular to the substrate, a depth of the groove is less than or equal to a thickness of the substrate.

[0018] In a possible implementation manner of the present application, the first substrate is a carrier substrate, and the second substrate is a display substrate;

[0019] The second substrate includes a light-emitting side and a backlight side located on opposite sides;

[0020] The backlight side of the second substrate is fixed to the first substrate through the adhesive layer.

[0021] In a possible implementation manner of the present application, a positive projection of the second substrate on the first substrate and a positive projection of the adhesive layer on the first substrate overlap;

[0022] In a direction perpendicular to the first substrate, a depth of the groove is greater than a thickness of the adhesive layer;

[0023] Preferably, in a direction perpendicular to the first substrate, a depth of the groove is equal to a sum of a thickness of the adhesive layer and a thickness of the second substrate;

[0024] Preferably, the first conductive pin and the second conductive pin are connected through a side trace distributed on a side surface of the first substrate.

[0025] In a possible implementation manner of the present application, at a junction position of the first substrate and the second substrate through which the side trace connecting the first conductive pin and the second conductive pin passes, a surface of the first substrate and a surface of the second substrate are smoothly transitioned.

[0026] In a possible implementation manner of the present application, a positive projection of the second substrate on the first substrate covers a positive projection of the adhesive layer on the first substrate;

[0027] In a direction perpendicular to the first substrate, a depth of the groove is equal to a thickness of the adhesive layer, wherein a surface of the second substrate facing the first substrate and a surface of the first substrate facing the second substrate are closely attached;

[0028] The first conductive pin and the second conductive pin are connected by side traces distributed on the side surface of the first substrate and the side surface of the second substrate;

[0029] Preferably, the corresponding side surfaces of the second substrate and the first substrate are flush.

[0030] In a second aspect of the present application, a method for manufacturing a display panel is provided, and the method includes:

[0031] Provide a first substrate, and fabricate a groove on the surface of the first substrate, wherein a first conductive pin is disposed on the surface of the first substrate away from the groove;

[0032] Fabricate an adhesive layer in the groove, wherein, in a direction perpendicular to the first substrate, the thickness of the adhesive layer is less than or equal to the depth of the groove;

[0033] Fix a second substrate on a side of the adhesive layer away from the first substrate, wherein a second conductive pin is disposed on a side of the second substrate away from the first substrate;

[0034] At least fabricate side traces on the side surface of the first substrate, and connect the first conductive pin and the second conductive pin by the side traces.

[0035] In a possible implementation manner of the present application, when the orthographic projection of the second substrate on the first substrate overlaps with the orthographic projection of the adhesive layer on the first substrate, the step of at least fabricating side traces on the side surface of the first substrate and connecting the first conductive pin and the second conductive pin by the side traces includes:

[0036] Fabricate a conductive layer on the side surface of the first substrate;

[0037] Etch the conductive layer to obtain side traces located on the side surface of the first substrate, and connect the first conductive pin and the second conductive pin by the side traces;

[0038] When the orthographic projection of the second substrate on the first substrate covers the orthographic projection of the adhesive layer on the first substrate, the step of at least fabricating side traces on the side surface of the first substrate and connecting the first conductive pin and the second conductive pin by the side traces includes:

[0039] Fabricate a conductive layer on the corresponding side surfaces of the first substrate and the second substrate;

[0040] Etch the conductive layer to obtain side traces located on the side surface of the first substrate and the side surface of the second substrate, and connect the first conductive pin and the second conductive pin by the side traces.

[0041] In the third aspect of the present application, a tiled display screen is further provided, and the tiled display screen is formed by tiling display panels in any possible implementation manner of the first aspect.

[0042] The embodiments of the present application provide a display panel, a preparation method of the display panel, and a tiled display screen. In the display panel, an adhesive layer is disposed in a groove of a first substrate, a second substrate is fixed to the first substrate through the adhesive layer, and a first conductive pin disposed on the first substrate and a second conductive pin disposed on the second substrate are connected through side traces at least distributed on a side surface of the first substrate. In the above structure, the adhesive layer is disposed in the groove, and the side traces do not pass through the adhesive layer, which can ensure the structural stability of the side traces and facilitate improving the display effect of the display panel. Description of the Drawings

[0043] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0044] Figure 1 A schematic structural diagram of a display panel provided by the related art;

[0045] Figure 2 For the side traces in Figure 1 A schematic distribution diagram of the side traces on the side surface of the display panel;

[0046] Figure 3 One of the schematic structural diagrams of the display panel provided by this embodiment;

[0047] Figure 4 Another schematic structural diagram of the display panel provided by this embodiment;

[0048] Figure 5 Another schematic structural diagram of the display panel provided by this embodiment;

[0049] Figure 6 Another schematic structural diagram of the display panel provided by this embodiment;

[0050] Figure 7 Another schematic structural diagram of the display panel provided by this embodiment;

[0051] Figure 8 Another schematic structural diagram of the display panel provided by this embodiment;

[0052] Figure 9Seventh structural schematic diagram of the display panel provided by this embodiment;

[0053] Figure 10 Eighth structural schematic diagram of the display panel provided by this embodiment;

[0054] Figure 11 Ninth structural schematic diagram of the display panel provided by this embodiment;

[0055] Figure 12 Tenth structural schematic diagram of the display panel provided by this embodiment;

[0056] Figure 13 Eleventh structural schematic diagram of the display panel provided by this embodiment;

[0057] Figure 14 Twelfth structural schematic diagram of the display panel provided by this embodiment;

[0058] Figure 15 Thirteenth structural schematic diagram of the display panel provided by this embodiment;

[0059] Figure 16 Fourteenth structural schematic diagram of the display panel provided by this embodiment;

[0060] Figure 17 Flow schematic diagram of the manufacturing method of the display panel provided by this embodiment;

[0061] Figure 18 is Figure 17 corresponding process flow chart;

[0062] Figure 19 is Figure 17 a process flow chart corresponding to step S14 in

[0063] Figure 20 is Figure 17 another process flow chart corresponding to step S14 in

[0064] Icons: 1 - display panel; 10 - first substrate; 10A - display substrate; 10B - carrier substrate; 101 - groove; 20’, 20 - adhesive layer; 30 - second substrate; 102A, 302A - light - emitting side; 102B, 302B - backlight side; 110, 310 - substrate; 120, 320 - array driving layer; 130, 330 - driving electrode; 140, 340 - light - emitting device; 1401, 3401 - light - emitting device body; 1402, 3402 - device electrode; 40 - first conductive pin; 50 - second conductive pin; 60’, 60 - side trace. Detailed implementation manners

[0065] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. Components of the embodiments of this application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0066] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is habitually placed during use. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this application.

[0067] The inventors found through research that in the related art, the side-wiring method is often used to narrow the border of the display panel, thereby reducing the splicing gap between the spliced display panels. Specifically, the side-wiring scheme is to transfer the pin bonding area on the display side to the backlight side, and connect the conductive pins on the display side and the backlight side through side-wiring. Exemplarily, please refer to Figure 1 , the display substrate 10A and the carrier substrate 10B are bonded and fixed through the adhesive layer 20' therebetween. When making the side-wiring 60', the side-wiring 60' will be distributed on the sides of the display substrate 10A, the adhesive layer 20', and the carrier substrate 10B. In the subsequent manufacturing process, the adhesive layer 20' will shrink due to heat, resulting in the breakage of the side-wiring 60' at the position of the adhesive layer 20', as Figure 2 shown, which will cause the electrical performance of the side-wiring 60' to be poor and affect the display effect of the display panel.

[0068] To solve the above technical problems, the inventors have innovatively designed the following technical solutions. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings.

[0069] It should be noted that the defects existing in the above solutions in the prior art are all the results obtained by the inventors through practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by the embodiments of this application below for the above problems should all be the contributions made by the inventors to this application during the invention and creation process, and should not be understood as the technical content known to those skilled in the art.

[0070] Please refer to Figure 3 , Figure 3Schematically illustrates one of the film layer structures of the display panel 1 provided in this embodiment. In this embodiment, the display panel 1 includes a first substrate 10, an adhesive layer 20, and a second substrate 30. A groove 101 is formed on the surface of the first substrate 10. Herein, the first substrate 10 includes two relatively arranged surfaces and a side surface connecting the two surfaces, and the groove 101 is formed on any one of the surfaces of the first substrate 10. The adhesive layer 20 is disposed in the groove 101, and the second substrate 30 is fixed to the first substrate 10 through the adhesive layer 20. In the direction perpendicular to the first substrate 10 (the Y-axis direction in the figure), the thickness d of the adhesive layer 20 is less than or equal to the depth h of the groove 101. With such a design, at least a part of the second substrate 30 can also be located in the groove 101, or the second substrate 30 and the first substrate 10 are closely attached together.

[0071] In this embodiment, the display panel 1 further includes a first conductive pin 40, a second conductive pin 50, and a side trace 60. The first conductive pin 40 is disposed on a side of the first substrate 10 away from the second substrate 30, the second conductive pin 50 is disposed on a side of the second substrate 30 away from the first substrate 10, and the first conductive pin 40 and the second conductive pin 50 are connected through the side trace 60 at least distributed on the side surface of the first substrate 10.

[0072] In the above structure, the adhesive layer 20 is disposed in the groove 101, and the side trace 60 does not pass through the adhesive layer 20, which can ensure the structural stability of the side trace 60, facilitate reducing the border of the display panel, and improve the display effect of the display panel 1.

[0073] In an implementation manner of this embodiment, please refer to Figure 3 again. The first substrate 10 may be a display substrate, and the second substrate 30 may be a carrier substrate. Herein, the first substrate 10 includes a light-emitting side 102A and a backlight side 102B located on opposite sides, and the groove 101 is disposed on the backlight side 102B.

[0074] In this implementation manner, please refer to Figure 4 again. The first substrate 10 includes a substrate 110, an array driving layer 120, driving electrodes 130, and light-emitting devices 140. The array driving layer 120 is disposed on the substrate 110. The array driving layer 120 includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. The array driving layer 120 includes pixel driving circuits formed by the cooperation of the above-mentioned conductive layers and insulating layers. The driving electrodes 130 are located on the surface of the array driving layer 120 away from the substrate. The driving electrodes 13 are arranged in an array on the array driving layer 120, and adjacent driving electrodes 13 are isolated, that is, there is a gap between adjacent driving electrodes 13. The driving electrodes 130 are connected to the pixel driving circuits in the array driving layer.

[0075] The light-emitting device 140 includes a light-emitting device body 1401 and a device electrode 1402 disposed on one side of the light-emitting device body 1401. The device electrode 1402 is electrically connected to the driving electrode 130. Exemplarily, the device electrode 1402 and the driving electrode 130 can be connected by solder bonding or can be bonded by an anisotropic conductive film (ACF for short).

[0076] In this embodiment, the groove 101 is disposed on the side of the substrate 110 away from the array driving layer 120. The groove 101 can be obtained by grooving after the display substrate is manufactured. In order to avoid damaging the function of the array driving layer 120 due to excessive depth of the grooving, in the direction perpendicular to the substrate 110, the depth of the groove 101 is less than the thickness of the substrate 110.

[0077] In one case of this embodiment, the orthographic projection of the second substrate 30 on the first substrate 10 and the orthographic projection of the bonding layer 20 on the first substrate 10 overlap. Exemplarily, as Figure 3 shown, the orthographic projection of the second substrate 30 on the first substrate 10 and the orthographic projection of the bonding layer 20 on the first substrate 10 completely overlap. In this case, in the direction perpendicular to the first substrate 10, the depth h of the groove 101 is greater than the thickness d of the bonding layer 20.

[0078] In this case, the second substrate 30 can be convex with respect to the first substrate 10, the second substrate 30 can also be concave with respect to the first substrate 10 (i.e., the first substrate 10 is completely recessed into the groove 101), and the second substrate 30 can also be flush with the surface of the first substrate 10 where the groove 101 is provided.

[0079] In order to ensure that the traces are continuously distributed at the junction position between the first substrate 10 and the second substrate 30, in this case, at the junction position between the first substrate 10 and the second substrate 30 through which the side trace 60 connecting the first conductive pin 40 and the second conductive pin 50 passes, the surfaces of the first substrate 10 and the second substrate 30 are smoothly transitioned.

[0080] Preferably, the second substrate 30 is flush with the surface of the first substrate 10 where the groove 101 is provided, that is, in the direction perpendicular to the first substrate 10, the depth of the groove 101 is equal to the sum of the thickness of the bonding layer 20 and the thickness of the second substrate 30. As Figure 3 shown, the first conductive pin 40 and the second conductive pin 50 are connected by the side trace 60 distributed on the side of the first substrate 10. In this case, without special treatment of the first substrate 10 and the second substrate 30, the surfaces of the first substrate 10 and the second substrate 30 can be smoothly transitioned at the junction position between the two, which is convenient for forming side traces at this position.

[0081] Please refer to Figure 5 , when the second substrate 30 protrudes outward relative to the first substrate 10, it is necessary to process the part of the second substrate 30 close to the first substrate 10 to form a smooth surface at the position where the second substrate 30 is close to the first substrate 10, so as to facilitate the smooth transition of the surface of the first substrate 10 and the surface of the second substrate 30 at the junction position of the two, and facilitate the formation of the side trace 60 at this position.

[0082] Please refer to Figure 6 , when the second substrate 30 is concave relative to the first substrate 10, it is necessary to process the part of the first substrate 10 close to the second substrate 20 to form a smooth surface at the position where the first substrate 10 is close to the second substrate 20, so as to facilitate the smooth transition of the surface of the first substrate 10 and the surface of the second substrate 30 at the junction position of the two, and facilitate the formation of the side trace 60 at this position.

[0083] In another case of this embodiment, please refer to Figure 7 , the orthographic projection of the second substrate 30 on the first substrate 10 covers the orthographic projection of the adhesive layer 20 on the first substrate 10.

[0084] In the direction perpendicular to the first substrate 10 (the Y-axis direction in the figure), the depth h of the groove 101 is equal to the thickness d of the adhesive layer 20, wherein the surface of the second substrate 30 facing the first substrate 10 and the surface of the first substrate 10 facing the second substrate 30 are closely attached.

[0085] In this case, the first conductive pin 40 and the second conductive pin 50 are connected through the side trace 60 distributed on the side surfaces of the first substrate 10 and the second substrate 30.

[0086] In this case, the corresponding side surfaces of the second substrate 30 and the first substrate 10 can be flush or relatively protruded. Preferably, the corresponding side surfaces of the second substrate 30 and the first substrate 10 are flush, and there is no need to polish the first substrate 10 and the second substrate 30, that is, a structurally stable side trace 60 can be formed on the side surfaces of the first substrate 10 and the second substrate 30.

[0087] When the second substrate 30 protrudes relative to the first substrate 10, please refer to Figure 8 , in order to form a structurally stable side trace 60, it is necessary to polish the part of the second substrate 30 that protrudes relative to the first substrate 10 to form an arc surface conducive to the formation of the side trace 60. Similarly, when the first substrate 10 protrudes relative to the third substrate 30, please refer to Figure 9 , in order to form a structurally stable side trace 60, it is necessary to polish the part of the first substrate 10 that protrudes relative to the second substrate 30 to form an arc surface conducive to the formation of the side trace 60.

[0088] In another possible implementation of this embodiment, please refer to Figure 10 , the first substrate 10 may be a carrier substrate, the second substrate 30 may be a display substrate. The second substrate 30 includes a light-emitting side 302A and a backlight side 302B located on opposite sides. The backlight side 302B of the second substrate 30 is fixed to the first substrate through the adhesive layer 20.

[0089] In this implementation, please refer to Figure 11 , the second substrate 30 includes a substrate 310, an array driving layer 320, driving electrodes 330, and light-emitting devices 340. The array driving layer 320 is disposed on the substrate 310. The array driving layer 120 includes a plurality of conductive layers and insulating layers located between adjacent conductive layers. The array driving layer 320 includes pixel driving circuits formed by the cooperation of the above-mentioned conductive layers and insulating layers. The driving electrodes 330 are located on the side of the array driving layer 320 away from the substrate 310. The driving electrodes 330 are arranged in an array on the array driving layer 320. Adjacent driving electrodes 330 are isolated from each other, that is, there is a gap between adjacent driving electrodes 330. The driving electrodes 330 are connected to the pixel driving circuits in the array driving layer.

[0090] The light-emitting device 340 includes a light-emitting device body 3401 and a device electrode 3402 disposed on one side of the light-emitting device body 3401. The device electrode 3402 is electrically connected to the driving electrode 330. Exemplarily, the device electrode 3402 and the driving electrode 330 can be connected by solder bonding, or can be bonded through an anisotropic conductive film (ACF for short).

[0091] In this implementation, the groove 101 can be provided on either of the two opposite sides of the first substrate 10. The substrate 310 in the second substrate 30 is fixed to the first substrate 10 through the adhesive layer 20.

[0092] In one case of this implementation, the orthographic projection of the second substrate 30 on the first substrate 10 and the orthographic projection of the adhesive layer 20 on the first substrate 10 overlap. Exemplarily, as Figure 10 shown, the orthographic projection of the second substrate 30 on the first substrate 10 and the orthographic projection of the adhesive layer 20 on the first substrate 10 completely overlap. In this case, in the direction perpendicular to the first substrate 10, the depth h of the groove 101 is greater than the thickness h of the adhesive layer 20.

[0093] In this case, the second substrate 30 can protrude outward relative to the first substrate 10, the second substrate 30 can also be recessed relative to the first substrate 10 (that is, the first substrate 10 is completely recessed into the groove 101), and the second substrate 30 can also be flush with the surface of the first substrate 10 where the groove 101 is provided.

[0094] In order to ensure that the traces are continuously distributed at the junction position between the first substrate 10 and the second substrate 30, in this case, at the junction position between the first substrate 10 and the second substrate 30 through which the side trace 60 connecting the first conductive pin 40 and the second conductive pin 50 passes, the surfaces of the first substrate 10 and the second substrate 30 are smoothly transitioned.

[0095] Preferably, the second substrate 30 is flush with the surface of the first substrate 10 provided with the groove 101, that is, in the direction perpendicular to the first substrate 10, the depth of the groove 101 is equal to the sum of the thickness of the adhesive layer 20 and the thickness of the second substrate 30, and the first conductive pin 40 and the second conductive pin 50 are connected by the side trace 60 distributed on the side of the first substrate 10. In this case, without special treatment of the first substrate 10 and the second substrate 30, the surfaces of the first substrate 10 and the second substrate 30 can be smoothly transitioned at the junction position between the two, which is convenient for forming the side trace at this position.

[0096] Please refer to Figure 12 , when the second substrate 30 protrudes outward relative to the first substrate 10, it is necessary to process the part of the second substrate 30 close to the first substrate 10 to form a smooth surface at the position of the second substrate 30 close to the first substrate 10, so as to facilitate the smooth transition of the surfaces of the first substrate 10 and the second substrate 30 at the junction position between the two, and facilitate the formation of the side trace 60 at this position.

[0097] Please refer to Figure 13 , when the second substrate 30 is concave relative to the first substrate 10, it is necessary to process the part of the first substrate 10 close to the second substrate 20 to form a smooth surface at the position of the first substrate 10 close to the second substrate 20, so as to facilitate the smooth transition of the surfaces of the first substrate 10 and the second substrate 30 at the junction position between the two, and facilitate the formation of the side trace 60 at this position.

[0098] In another case of this embodiment, please refer to Figure 14 , the orthographic projection of the second substrate 30 on the first substrate 10 covers the orthographic projection of the adhesive layer 20 on the first substrate 10.

[0099] In the direction perpendicular to the first substrate 10, the depth of the groove 101 is equal to the thickness of the adhesive layer 20, wherein the surface of the second substrate 30 facing the first substrate 10 and the surface of the first substrate 10 facing the second substrate 30 are closely attached.

[0100] In this case, the first conductive pin 40 and the second conductive pin 50 are connected by the side trace 60 distributed on the side of the first substrate 10 and the side of the second substrate 30.

[0101] In this case, the corresponding sides of the second substrate 30 and the first substrate 10 may be flush or may protrude relative to each other. Preferably, the corresponding sides of the second substrate 30 and the first substrate 10 are flush, and there is no need to polish the first substrate 10 and the second substrate 30, so that a structurally stable side trace 60 can be formed on the side surfaces of the first substrate 10 and the second substrate 30.

[0102] When the second substrate 30 protrudes relative to the first substrate 10, please refer to Figure 15 , in order to form a structurally stable side trace 60, the part of the second substrate 30 that protrudes relative to the first substrate 10 needs to be polished to form an arc surface that is conducive to the formation of the side trace 60. Similarly, when the first substrate 10 protrudes relative to the third substrate 30, please refer to Figure 16 , in order to form a structurally stable side trace 60, the part of the first substrate 10 that protrudes relative to the second substrate 30 needs to be polished to form an arc surface that is conducive to the formation of the side trace 60.

[0103] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel. Please refer to Figure 17 and Figure 18 , Figure 17 illustrates a schematic flow chart of the steps of the method for manufacturing the display panel provided in this embodiment, Figure 18 illustrates Figure 17 the corresponding process chart. The method for manufacturing the display panel provided in this embodiment will be described in detail below with reference to Figure 17 and Figure 18 .

[0104] Step S11: Provide a first substrate 10 and form a groove 101 on the surface of the first substrate 10.

[0105] In this embodiment, the first substrate 10 includes two opposite surfaces and a side surface connecting between the two surfaces, and the groove 101 is formed on any one of the surfaces of the first substrate 10. A first conductive pin 40 is provided on the surface of the first substrate 10 away from the groove 101.

[0106] Step S12: Form an adhesive layer 20 in the groove 110.

[0107] When forming the adhesive layer 20, the colloid required for the adhesive layer is injected into the groove 110, and a film layer with a uniform thickness of the adhesive layer 20 is formed in the groove 110 by the leveling of the colloid. Among them, in the direction perpendicular to the first substrate 10, the thickness of the adhesive layer 20 is less than or equal to the depth of the groove 101.

[0108] Step S13: Fix the second substrate 30 on the side of the adhesive layer 20 away from the first substrate 10.

[0109] In this embodiment, the first substrate 10 and the second substrate 30 are fixed through the adhesive layer 20, and a second conductive pin 50 is provided on the side of the second substrate 30 away from the first substrate 10.

[0110] Step S14: Fabricate side traces 60 on at least the side surface of the first substrate 10, and connect the first conductive pin 40 and the second conductive pin 50 by the side traces 60.

[0111] In the preparation method provided above, the adhesive layer 20 is disposed in the groove 101, and the side traces 60 do not pass through the adhesive layer 20, which can ensure the structural stability of the side traces 60, facilitate reducing the border of the display panel, and improving the display effect of the display panel 1.

[0112] Furthermore, in this embodiment, based on the different position structures of the first substrate 10 and the second substrate 30, step S14 can be implemented by different implementation manners.

[0113] Please refer to Figure 19 , in an implementation manner provided in this embodiment, the orthographic projection of the second substrate 30 on the first substrate 10 and the orthographic projection of the adhesive layer 20 on the first substrate 10 overlap, and step S14 can be implemented in the following manner.

[0114] First, fabricate a conductive layer on the side surface of the first substrate 10;

[0115] Next, etch the conductive layer to obtain the side traces 60 located on the side surface of the first substrate 10, and connect the first conductive pin and the second conductive pin by the side traces 60.

[0116] Please refer to Figure 20 , in an implementation manner provided in this embodiment, when the orthographic projection of the second substrate 30 on the first substrate 10 covers the orthographic projection of the adhesive layer 20 on the first substrate 10, step S14 can be implemented in the following manner.

[0117] First, fabricate a conductive layer on the corresponding side surfaces of the first substrate 10 and the second substrate 30;

[0118] Next, etch the conductive layer to obtain the side traces 60 located on the side surfaces of the first substrate 10 and the second substrate 30, and connect the first conductive pin and the second conductive pin by the side traces 60.

[0119] Based on the same inventive concept, this embodiment further provides a tiled display screen, which is formed by tiling the aforementioned display panels. Since the aforementioned display panels adopt the side-wiring method, the border of the display panel can be reduced, thereby reducing the tiling gap. In addition, the side-wiring does not pass through the adhesive layer, which can ensure the structural stability of the side-wiring. In this way, the display size of the display screen can be increased and the display effect can be ensured, enhancing the market competitiveness of the tiled display screen.

[0120] In summary, for the display panel, the preparation method of the display panel, and the tiled display screen provided in this embodiment, in the display panel, the adhesive layer is arranged in the groove of the first substrate, the second substrate is fixed to the first substrate through the adhesive layer, and the first conductive pins arranged on the first substrate and the second conductive pins arranged on the second substrate are connected through side-wirings at least distributed on the side of the first substrate. In the above structure, the adhesive layer is arranged in the groove, and the side-wirings do not pass through the adhesive layer, which can ensure the structural stability of the side-wirings and is convenient for improving the display effect of the display panel.

[0121] The foregoing is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A display panel, characterized in that, The display panel includes: A first substrate, on the surface of which a groove is formed; An adhesive layer, which is disposed in the groove. Wherein, in a direction perpendicular to the first substrate, the thickness of the adhesive layer is less than or equal to the depth of the groove; A second substrate, which is fixed to the first substrate through the adhesive layer; On a side of the first substrate away from the second substrate, a first conductive pin is provided. On a side of the second substrate away from the first substrate, a second conductive pin is provided. The first conductive pin and the second conductive pin are connected through side traces at least distributed on a side surface of the first substrate.

2. The display panel according to claim 1, characterized in that, The first substrate is a display substrate, and the second substrate is a carrier substrate; The first substrate includes a light-emitting side and a backlight side located on opposite sides, and the groove is disposed on the backlight side.

3. The display panel according to claim 2, wherein The first substrate includes: A substrate; An array driving layer, which is located on the substrate; Driving electrodes, which are located on a side of the array driving layer away from the substrate, and adjacent driving electrodes are isolated from each other; Light-emitting devices, and device electrodes of the light-emitting devices are electrically connected to the driving electrodes; The groove is formed on a surface of the substrate away from the array driving layer; In a direction perpendicular to the substrate, the depth of the groove is less than or equal to the thickness of the substrate.

4. The display panel according to claim 1, characterized in that, The first substrate is a carrier substrate, and the second substrate is a display substrate; The second substrate includes a light-emitting side and a backlight side located on opposite sides; The backlight side of the second substrate is fixed to the first substrate through the adhesive layer.

5. The display panel according to any one of claims 2-4, characterized in that, A positive projection of the second substrate on the first substrate overlaps a positive projection of the adhesive layer on the first substrate; In a direction perpendicular to the first substrate, the depth of the groove is greater than the thickness of the adhesive layer; Preferably, in a direction perpendicular to the first substrate, the depth of the groove is equal to the sum of the thickness of the adhesive layer and the thickness of the second substrate; Preferably, the first conductive pin and the second conductive pin are connected through side traces distributed on a side surface of the first substrate.

6. The display panel according to claim 5, wherein At a position where the side traces connecting the first conductive pin and the second conductive pin pass through a boundary between the first substrate and the second substrate, the surface of the first substrate and the surface of the second substrate are smoothly transitioned.

7. The display panel according to any one of claims 2-4, characterized in that, A positive projection of the second substrate on the first substrate covers a positive projection of the adhesive layer on the first substrate; In a direction perpendicular to the first substrate, the depth of the groove is equal to the thickness of the adhesive layer, wherein a surface of the second substrate facing the first substrate and a surface of the first substrate facing the second substrate are closely attached; The first conductive pin and the second conductive pin are connected through side traces distributed on a side surface of the first substrate and a side surface of the second substrate; Preferably, corresponding side surfaces of the second substrate and the first substrate are flush.

8. A method for manufacturing a display panel, characterized in that, The method includes: Providing a first substrate, and fabricating a groove on the surface of the first substrate. Wherein, a first conductive pin is provided on a surface of the first substrate away from the groove; A bonding layer is fabricated in the groove, wherein, in a direction perpendicular to the first substrate, the thickness of the bonding layer is less than or equal to the depth of the groove; A second substrate is fixed on a side of the bonding layer away from the first substrate, wherein a second conductive pin is provided on a side of the second substrate away from the first substrate; At least a side trace is fabricated on a side surface of the first substrate, and the first conductive pin is connected to the second conductive pin by the side trace.

9. The manufacturing method of the display panel according to claim 8, characterized in that, When a positive projection of the second substrate on the first substrate overlaps with a positive projection of the bonding layer on the first substrate, the step of at least fabricating a side trace on a side surface of the first substrate and connecting the first conductive pin to the second conductive pin by the side trace includes: Fabricating a conductive layer on a side surface of the first substrate; Etching the conductive layer to obtain a side trace located on the side surface of the first substrate, and connecting the first conductive pin to the second conductive pin by the side trace; When a positive projection of the second substrate on the first substrate covers a positive projection of the bonding layer on the first substrate, the step of at least fabricating a side trace on a side surface of the first substrate and connecting the first conductive pin to the second conductive pin by the side trace includes: Fabricating a conductive layer on corresponding side surfaces of the first substrate and the second substrate; Etching the conductive layer to obtain side traces located on the side surface of the first substrate and the side surface of the second substrate, and connecting the first conductive pin to the second conductive pin by the side traces.

10. A spliced display screen, characterized in that, The spliced display screen is formed by splicing a plurality of display panels according to any one of claims 1-7.

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