Wafer cleaning equipment and method based on pure water cleaning agent

Abstract

The invention discloses wafer cleaning equipment and method based on a pure water cleaning agent, and belongs to the technical field of wafer cleaning equipment.The wafer cleaning equipment based on the pure water cleaning agent comprises a wafer cleaning equipment body and a cleaning platform embedded and fixed in the wafer cleaning equipment body; the wafer cleaning equipment is provided with a cleaning bin used for installing a cleaning platform, a flow guide ring is detachably fixed to the top end of the cleaning platform, a rotating ring is rotationally clamped in the cleaning platform, and driving equipment connected with the rotating ring is fixed to the bottom end of a cleaning platform body. According to the wafer cleaning equipment and method based on the pure water cleaning agent, pure water is stored through an arc-shaped groove, the influence of thrown-out pure water on cleaning of a wafer body is avoided, the cleaning efficiency of the wafer body is improved, and the cleaning efficiency of the wafer body is improved. The situation that pure water input of the pure water input pipe is affected by airflow and water mist is generated is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer cleaning equipment, and particularly relates to a wafer cleaning equipment and method based on pure water cleaning agent. Background Art

[0002] As the mainstream process band of wafers transitions from 65nm to 28nm, 14nm, 7nm or even smaller, the types of contaminants that need to be cleaned on the wafer surface change accordingly. Therefore, the cleaning process flow also successively uses ammonia water, hydrogen peroxide, hydrofluoric acid, nitric acid, etc. diluted and formulated in different proportions to clean the contaminants on the wafer surface.

[0003] The main function of the wafer cleaning equipment is to provide a cleaning container for wafer cleaning. The entire process of cleaning the wafer is carried out in the process chamber of the cleaning equipment. Each spraying mechanism sprays acidic and alkaline liquid medicines and ultrapure water with different dilution ratios onto the wafer surface for the cleaning process. The entire process of the wafer is carried out in the cleaning chamber, and the chuck holds the wafer and rotates at high speed.

[0004] The patent with application number 202322041996.8 discloses a wafer cleaning equipment, which is provided with a telescopic adjustment device connected to the nozzle to adjust the telescopic displacement of the nozzle, so that in the case of applying cleaning liquids with different flow configurations, the landing point of the cleaning liquid on the wafer can be adjusted; further, an arc-shaped support frame for fixing the telescopic adjustment device is provided, which can improve the installation convenience and effectively reduce the space occupied by the telescopic adjustment device; further, the telescopic adjustment device can be set as an automatic adjustment device communicating with the equipment controller to perform automatic adaptive debugging compensation of the cleaning liquid landing point according to the characteristics and flow requirements of the cleaning liquid, so as to improve the adjustment accuracy and operation convenience.

[0005] In the existing cleaning process system, pure water is sprayed on the surface of the high-speed rotating wafer. After the pure water is thrown off from the edge by the wafer, it is easy to adhere to the inner wall of the process chamber. The adhered liquid medicine or pure water may drop on the surface of the wafer in the next process step, affecting the overall cleaning process effect of the wafer. Summary of the Invention

[0006] (1) Technical Problems to be Solved Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a wafer cleaning equipment and method based on pure water cleaning agent. The wafer cleaning equipment and method based on pure water cleaning agent aims to solve the technical problem that after pure water is thrown off from the edge by the wafer in the prior art, it is easy to adhere to the inner wall of the process chamber, and the adhered liquid medicine or pure water may drop on the surface of the wafer in the next process step, affecting the overall cleaning process effect of the wafer.

[0007] (2) Technical Solutions In order to solve the above technical problems, the present invention provides a wafer cleaning device based on pure water cleaning agent, which includes a wafer cleaning device body and a cleaning platform embedded and fixed in the wafer cleaning device body, the wafer cleaning device is provided with a cleaning chamber for installing the cleaning platform, the top of the cleaning platform is detachably fixed with a guide ring, and a rotating ring is rotatably clamped in the cleaning platform, wherein the bottom end of the cleaning platform body is fixed with a driving device connected to the rotating ring, an air delivery groove is provided at the center position of the inner wall of the guide ring, and the top of the rotating ring is attracted and fixed with the wafer body, wherein drainage mechanisms are provided at both ends of the cleaning platform.

[0008] When using this technical solution, a guide ring is installed on the top of the cleaning platform, and the blocks on both sides of the bottom end surface of the guide ring are inserted into the grooves on both sides of the cleaning platform. After tightening, the bolts in the grooves are threaded into the screw holes on the side walls of the blocks, so that the guide ring is fixed on the top of the cleaning platform. An arc groove is opened at the top of the inner wall of the cleaning platform. The pure water generated when the wafer body rotates accumulates in the arc groove and is discharged along the outlet pipe through the drainage groove and the drainage box. The pure water is stored in the arc groove, which avoids the impact of the thrown pure water on the cleaning of the wafer body; at the same time, an air delivery groove is opened on the inner wall of the guide ring. The nitrogen delivery pump flows in the air delivery groove after passing through the nitrogen supply pipe, the nitrogen input pipe, and the nitrogen connecting pipe. The filter cotton between the mounting ring and the connecting seat filters the input nitrogen. The nitrogen dries the wafer body during the flow process. The dried air is discharged from the exhaust pipe and flows inside the air delivery groove through the air flow, which avoids the air flow affecting the pure water input of the pure water input pipe and generating water mist.

[0009] Preferably, the bottom end of the wafer cleaning equipment body is equipped with an anti-slip seat in a rectangular array, and a storage cabinet is rotatably installed on the bottom end of the wafer cleaning equipment body, wherein a control panel is embedded and fixed on the wafer cleaning equipment body, and a controller fixed in the wafer cleaning equipment body is provided below the control panel, and the side wall of the cleaning chamber is provided with transparent glass fixed to the wafer cleaning equipment body.

[0010] Furthermore, the bottom end of the cleaning chamber is provided with mounting columns in a rectangular array, and a plurality of drainage holes are provided on the bottom wall of the cleaning chamber, wherein a pure water storage tank is embedded and fixed on the top wall of the cleaning chamber, and a drainage pipe connected to the plurality of drainage holes is fixed on the side wall of the wafer cleaning equipment body, and an electromagnetic valve is installed on the drainage pipe.

[0011] Furthermore, a nitrogen delivery pump is fixedly installed at the top end of the main body of the wafer cleaning device. An electric push rod is fixedly embedded in the top wall of the cleaning chamber. The bottom end of the electric push rod is fixedly installed with a pure water input pipe. A delivery pipe is installed at the bottom end of the pure water storage tank. One end of the delivery pipe extends into the pure water storage tank and is equipped with a water pump, and the other end of the delivery pipe is fixed with a folding pipe connected to the pure water input pipe.

[0012] Furthermore, an installation ring is fixedly embedded in the top wall of the cleaning chamber. The top end of the nitrogen delivery pump is fixedly installed with a nitrogen supply pipe, and the bottom end of the nitrogen delivery pump is communicated with the installation ring. The bottom end of the installation ring is threadedly sleeved with a connection seat, and a filter cotton is fixedly embedded between the installation ring and the connection seat. The bottom end of the connection seat is fixedly installed with a nitrogen input pipe.

[0013] Furthermore, clamping grooves are formed on both sides of the top end surface of the cleaning platform. Clamping blocks that fit and insert into the clamping grooves are fixed on both sides of the bottom end surface of the cleaning platform. One end of the flow guiding ring is fixed with a nitrogen connection pipe communicated with the gas transmission groove, and the other end of the flow guiding ring is fixedly installed with an exhaust pipe. The top end of the nitrogen connection pipe is fixed to the nitrogen supply pipe.

[0014] Furthermore, a plurality of mounting seats are fixedly arranged in a rectangular array at the bottom end of the cleaning platform. The cleaning device is a rotating motor fixed at the central position of the bottom end surface of the cleaning platform. The top end of the mounting column is threadedly inserted into the mounting seat. The top end of the rotating motor extends into the cleaning platform and is fixed with a rotating shaft. Connecting rods fixed to the rotating ring are fixedly arranged in a circular array on the outer wall of the rotating shaft. A supporting part embedded in the cleaning platform is fixed on the outer wall of the rotating ring.

[0015] Furthermore, a threaded hole is formed in the side wall of the clamping plate. A groove is formed on the outer wall of the cleaning platform. A bolt that is threadedly inserted into the threaded hole is embedded in the groove. A vacuum pump is fixedly installed at the bottom end of the cleaning device, and a mesh plate communicated with the vacuum pump is fixedly embedded in the bottom wall of the main body of the cleaning device. Furthermore, the drainage mechanism includes an arc-shaped groove formed in the inner wall of the cleaning platform below the wafer main body and drainage grooves formed on both sides of the inner wall of the cleaning platform. Both drainage grooves are communicated with the arc-shaped groove. Drainage boxes communicated with the drainage grooves are fixed on both sides of the outer wall of the cleaning platform. The bottom ends of the two drainage boxes are fixed with a water outlet pipe connected to each other. A tee pipe is installed at the bottom end of the water outlet pipe.

[0016] Furthermore, the usage steps of the main body of the wafer cleaning device include: S1. Place the cleaning platform on multiple mounting columns, and rotate the mounting columns to threadedly insert them into the mounting seats to fixedly install the cleaning platform; S2. The wafer body is placed on the rotating ring at the top of the cleaning platform. After the vacuum pump is started, the bottom of the cleaning platform is evacuated through the mesh plate, so that the wafer body is suction-fixed at the top of the rotating ring. S3. The electric push rod drives the pure water input pipe to move downward above the wafer body. The delivery pipe moves synchronously with the folding pipe and the pure water input pipe. The water pump drips the pure water cleaning agent in the pure water storage tank along the pure water input pipe onto the surface of the wafer body. S4. The rotation motor is started to drive the rotating shaft, connecting rod, rotating ring and wafer body to rotate synchronously. The rotating ring is kept stable in the cleaning platform through the supporting part. During the rotation of the rotating ring, the pure water cleaning agent is evenly thrown onto the surface of the wafer body. The excess pure water cleaning agent flows into the drainage tank through the arc-shaped groove and the drainage groove, and is discharged from the sewage discharge hole and the sewage discharge pipe through the water outlet pipe. S5. After cleaning, the nitrogen delivery pump connected to the nitrogen storage tank is started. The nitrogen delivery pump flows in the air delivery groove after passing through the nitrogen supply pipe, nitrogen input pipe and nitrogen connecting pipe. The filter cotton between the mounting ring and the connecting seat filters the input nitrogen. During the flow of the nitrogen, the wafer body is air-dried, and the air-dried air is discharged from the exhaust pipe.

[0017] (3) Beneficial effects Compared with the prior art, the beneficial effects of the present invention are as follows: In the present invention, a diversion ring is installed at the top of the cleaning platform. The clamping blocks on both sides of the bottom end face of the diversion ring are inserted into the clamping grooves on both sides of the cleaning platform. The bolts in the grooves are threadedly inserted into the screw holes on the side walls of the clamping blocks after being tightened, so that the diversion ring is fixed at the top of the cleaning platform. An arc-shaped groove is opened at the top end of the inner wall of the cleaning platform. The pure water generated when the wafer body rotates accumulates in the arc-shaped groove and is discharged along the water outlet pipe through the drainage groove and the drainage tank. The arc-shaped groove stores the pure water, avoiding the influence of the thrown pure water on the cleaning of the wafer body. An air delivery groove is opened on the inner wall of the diversion ring. The nitrogen delivery pump flows in the air delivery groove after passing through the nitrogen supply pipe, nitrogen input pipe and nitrogen connecting pipe. The filter cotton between the mounting ring and the connecting seat filters the input nitrogen. During the flow of the nitrogen, the wafer body is air-dried, and the air-dried air is discharged from the exhaust pipe. By the flow of the air flow inside the air delivery groove, the situation of water mist generated by the influence of the air flow on the pure water input of the pure water input pipe is avoided. Description of the drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is a schematic structural diagram of the present invention; Figure 2 is a schematic structural diagram of the main body of the wafer cleaning equipment in the present invention; Figure 3 is a schematic structural diagram of the main body of the wafer cleaning equipment in the present invention from another angle; Figure 4 is a schematic cross-sectional structural diagram of the nitrogen delivery pump in the present invention; Figure 5 is a schematic exploded structural diagram of the cleaning platform in the present invention; Figure 6 is a schematic structural diagram of the cleaning platform in the present invention from another angle; Figure 7 is a schematic cross-sectional structural diagram of the cleaning platform in the present invention; Figure 8 of the present invention Figure 7 is an enlarged schematic diagram of the structure at position A in

[0020] The reference numerals in the drawings are: 1, main body of the wafer cleaning equipment; 2, sewage discharge pipe; 3, cleaning platform; 4, nitrogen delivery pump; 5, pure water storage tank; 6, control panel; 7, controller; 8, transparent glass; 9, storage cabinet; 10, mounting post; 11, electric push rod; 12, cleaning chamber; 13, sewage discharge hole; 14, delivery pipe; 15, anti-slip seat; 16, pure water input pipe; 17, folding pipe; 18, mounting ring; 19, filter cotton; 20, nitrogen input pipe; 21, connecting seat; 22, nitrogen supply pipe; 23, nitrogen connecting pipe; 24, gas delivery groove; 25, guide ring; 26, wafer main body; 27, drainage tank; 28, mounting seat; 29, rotating motor; 30, water outlet pipe; 31, vacuum pump; 32, exhaust pipe; 33, clamping plate; 34, rotating ring; 35, connecting rod; 36, rotating shaft; 37, perforated plate; 38, drainage groove; 39, screw hole; 40, arc groove; 41, supporting part; 42, groove; 43, bolt; 44, clamping groove. Detailed Embodiment

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] This detailed embodiment is a wafer cleaning equipment and method based on pure water cleaning agent, and its schematic structural diagram is as shown in Figures 1 to 8As shown in the figure, the wafer cleaning device based on pure water cleaning agent includes a wafer cleaning device main body 1 and a cleaning platform 3 fixedly embedded in the wafer cleaning device main body 1. A cleaning chamber 12 for installing the cleaning platform 3 is provided on the wafer cleaning device. A diversion ring 25 is detachably fixed to the top end of the cleaning platform 3, and a rotating ring 34 is rotationally clamped in the cleaning platform 3. A driving device connected to the rotating ring 34 is fixed to the bottom end of the main body of the cleaning platform 3. An air delivery groove 24 is provided at the central position of the inner wall of the diversion ring 25. A wafer main body 26 is suction-fixed to the top end of the rotating ring 34. Drainage mechanisms are provided at both ends of the cleaning platform 3.

[0023] Anti-slip seats 15 are installed in a rectangular array at the bottom end of the wafer cleaning device main body 1, and a storage cabinet 9 is rotatably installed at the bottom end of the wafer cleaning device main body 1. A control panel 6 is fixedly embedded in the wafer cleaning device main body 1. A controller 7 fixed in the wafer cleaning device main body 1 is provided below the control panel 6. A transparent glass 8 fixed to the wafer cleaning device main body 1 is provided on the side wall of the cleaning chamber 12.

[0024] Mounting columns 10 are rotatably arranged in a rectangular array at the bottom end of the cleaning chamber 12, and a plurality of sewage discharge holes 13 are provided on the bottom wall of the cleaning chamber 12. A pure water storage tank 5 is fixedly embedded in the top wall of the cleaning chamber 12. A sewage discharge pipe 2 communicating with the plurality of sewage discharge holes 13 is fixed to the side wall of the wafer cleaning device main body 1. An electromagnetic valve is installed on the sewage discharge pipe 2.

[0025] A nitrogen delivery pump 4 is fixedly installed at the top end of the wafer cleaning device main body 1. An electric push rod 11 is fixedly embedded in the top wall of the cleaning chamber 12. A pure water input pipe 16 is fixedly installed at the bottom end of the electric push rod 11. A delivery pipe 14 is installed at the bottom end of the pure water storage tank 5. A water pump is installed at one end of the delivery pipe 14 extending into the pure water storage tank 5, and the other end of the delivery pipe 14 is fixed with a folding pipe 17 connected to the pure water input pipe 16.

[0026] The top wall of the cleaning chamber 12 is fixedly embedded with an installation ring 18. The top end of the nitrogen delivery pump 4 is fixedly installed with a nitrogen supply pipe 22, and the bottom end of the nitrogen delivery pump 4 is communicated with the installation ring 18. The bottom end of the installation ring 18 is threadedly sleeved with a connection seat 21, and a filter cotton 19 is fixedly embedded between the installation ring 18 and the connection seat 21. The bottom end of the connection seat 21 is fixedly installed with a nitrogen input pipe 20. The drainage mechanism includes an arc-shaped groove 40 opened on the inner wall of the cleaning platform 3 below the wafer body 26 and drainage grooves 38 opened on both sides of the inner wall of the cleaning platform 3. Both drainage grooves 38 are communicated with the arc-shaped groove 40. Among them, drainage boxes 27 communicated with the drainage grooves 38 are fixedly installed on both sides of the outer wall of the cleaning platform 3. The bottom ends of the two drainage boxes 27 are fixedly connected with a water outlet pipe 30, and a three-way pipe is installed at the bottom end of the water outlet pipe 30. When using this technical solution, by installing a diversion ring 25 on the top end of the cleaning platform 3, the clamping blocks on both sides of the bottom end face of the diversion ring 25 are inserted into the clamping grooves 44 on both sides of the cleaning platform 3, and the bolts 43 in the grooves 42 are threadedly inserted into the screw holes 39 on the side walls of the clamping blocks after being tightened, so that the diversion ring 25 is fixed on the top end of the cleaning platform 3.

[0027] Clamping grooves 44 are opened on both sides of the top end face of the cleaning platform 3. Clamping blocks that fit and plug into the clamping grooves 44 are fixedly installed on both sides of the bottom end face of the cleaning platform 3. One end of the diversion ring 25 is fixedly installed with a nitrogen connection pipe 23 communicated with the gas transmission groove 24, and the other end of the diversion ring 25 is fixedly installed with an exhaust pipe 32. The top end of the nitrogen connection pipe 23 is fixed to the nitrogen supply pipe 22.

[0028] A plurality of mounting seats 28 are fixedly arranged in a rectangular array at the bottom end of the cleaning platform 3. The cleaning device is a rotating motor 29 fixed at the center position of the bottom end face of the cleaning platform 3. The top end of the mounting column 10 is threadedly inserted into the mounting seat 28. The top end of the rotating motor 29 extends into the cleaning platform 3 and is fixed with a rotating shaft 36. Connecting rods 35 fixed to the rotating ring 34 are fixedly arranged in a circular array on the outer wall of the rotating shaft 36. A supporting part 41 embedded in the cleaning platform 3 is fixed on the outer wall of the rotating ring 34.

[0029] A screw hole 39 is provided on the side wall of the card plate 33, and a groove 42 is provided on the outer wall of the cleaning platform 3. A bolt 43 threadedly inserted into the screw hole 39 is embedded in the groove 42. A vacuum pump 31 is fixedly installed on the bottom end of the cleaning equipment, and a mesh plate 37 connected to the vacuum pump 31 is embedded in the bottom wall of the cleaning equipment body. By providing an arc groove 40 on the top of the inner wall of the cleaning platform 3, the pure water generated when the wafer body 26 rotates is accumulated in the arc groove 40 and discharged along the water outlet pipe 30 through the drainage groove 38 and the drainage box 27. The pure water is stored through the arc groove 40 to avoid This prevents the thrown-out pure water from affecting the cleaning of the wafer body 26; at the same time, an air delivery groove 24 is opened on the inner wall of the guide ring 25, and the nitrogen delivery pump 4 flows through the nitrogen supply pipe 22, the nitrogen input pipe 20, and the nitrogen connecting pipe 23 and flows in the air delivery groove 24. The filter cotton 19 between the mounting ring 18 and the connecting seat 21 filters the input nitrogen. The nitrogen dries the wafer body 26 during the flow process, and the dried air is discharged from the exhaust pipe 32 and flows inside the air delivery groove 24 through the air flow, thereby avoiding the air flow affecting the pure water input of the pure water input pipe 16 and generating water mist.

[0030] The steps for using the wafer cleaning equipment body 1 include: S1. Place the cleaning platform 3 on a plurality of mounting posts 10. Rotate the mounting posts 10 so that they are threadedly inserted into the mounting seats 28 to securely install the cleaning platform 3. S2. The wafer body 26 is placed on the rotating ring 34 at the top of the cleaning platform 3. After the vacuum pump 31 is started, the bottom of the cleaning platform 3 is evacuated through the mesh plate 37, so that the wafer body 26 is sucked and fixed on the top of the rotating ring 34. S3: The electric push rod 11 drives the pure water inlet pipe 16 to move downward to above the wafer body 26. The delivery pipe 14 moves synchronously with the folding pipe 17 and the pure water inlet pipe 16. The water pump drips the pure water cleaning agent in the pure water storage tank 5 along the pure water inlet pipe 16 to the surface of the wafer body 26. S4. Start the rotating motor 29 to drive the rotating shaft 36, the connecting rod 35, the rotating ring 34 and the wafer body 26 to rotate synchronously. The rotating ring 34 is kept stable on the cleaning platform 3 by the support portion 41. During the rotation process, the rotating ring 34 evenly throws the pure water cleaning agent onto the surface of the wafer body 26. The excess pure water cleaning agent flows into the drainage box 27 through the arc groove 40 and the drainage groove 38, and is discharged from the drainage hole 13 and the drainage pipe 2 through the outlet pipe 30. S5. After cleaning, start the nitrogen delivery pump 4 connected to the nitrogen storage tank. The nitrogen delivery pump 4 flows through the nitrogen supply pipe 22, the nitrogen input pipe 20, and the nitrogen connection pipe 23 and then flows in the gas delivery tank 24. The filter cotton 19 between the mounting ring 18 and the connection seat 21 filters the input nitrogen. The nitrogen dries the wafer body 26 during the flowing process, and the dried air is discharged from the exhaust pipe 32.

[0031] All technical features in this embodiment can be freely combined according to actual needs.

[0032] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer cleaning device based on pure water cleaning agent, the wafer cleaning device based on pure water cleaning agent includes a wafer cleaning device main body (1) and a cleaning platform (3) fixedly embedded in the wafer cleaning device main body (1), and is characterized in that, The wafer cleaning equipment is provided with a cleaning chamber (12) for installing a cleaning platform (3). A flow guide ring (25) is detachably fixed to the top end of the cleaning platform (3), and a rotating ring (34) is rotatably clamped in the cleaning platform (3). A driving device connected to the rotating ring (34) is fixed to the bottom end of the main body of the cleaning platform (3). An air delivery groove (24) is formed at the center position of the inner wall of the flow guide ring (25). A wafer main body (26) is suction-fixed to the top end of the rotating ring (34). Drainage mechanisms are arranged at both ends of the cleaning platform (3).

2. The wafer cleaning equipment based on pure water cleaning agent according to claim 1, wherein, Anti-slip seats (15) are installed in a rectangular array at the bottom end of the wafer cleaning equipment main body (1), and a storage cabinet (9) is rotatably installed at the bottom end of the wafer cleaning equipment main body (1). A control panel (6) is embedded and fixed on the wafer cleaning equipment main body (1). A controller (7) fixed in the wafer cleaning equipment main body (1) is arranged below the control panel (6). A transparent glass (8) fixed to the wafer cleaning equipment main body (1) is arranged on the side wall of the cleaning chamber (12).

3. The wafer cleaning equipment based on pure water cleaning agent according to claim 1, characterized in that, Installation columns (10) are rotatably arranged in a rectangular array at the bottom end of the cleaning chamber (12), and a plurality of sewage discharge holes (13) are formed in the bottom wall of the cleaning chamber (12). A pure water storage tank (5) is embedded and fixed on the top wall of the cleaning chamber (12). A sewage discharge pipe (2) communicated with the plurality of sewage discharge holes (13) is fixed to the side wall of the wafer cleaning equipment main body (1). An electromagnetic valve is installed on the sewage discharge pipe (2).

4. A wafer cleaning device based on pure water cleaning agent according to claim 3, characterized in that, A nitrogen delivery pump (4) is fixedly installed at the top end of the wafer cleaning equipment main body (1). An electric push rod (11) is embedded and fixed on the top wall of the cleaning chamber (12). A pure water input pipe (16) is fixedly installed at the bottom end of the electric push rod (11). A delivery pipe (14) is installed at the bottom end of the pure water storage tank (5). A water pump is installed at one end of the delivery pipe (14) extending into the pure water storage tank (5), and a folding pipe (17) connected to the pure water input pipe (16) is fixed at the other end of the delivery pipe (14).

5. The wafer cleaning equipment based on pure water cleaning agent according to claim 4, wherein An installation ring (18) is embedded and fixed on the top wall of the cleaning chamber (12). A nitrogen supply pipe (22) is fixedly installed at the top end of the nitrogen delivery pump (4), and the bottom end of the nitrogen delivery pump (4) is communicated with the installation ring (18). A connection seat (21) is threadedly sleeved at the bottom end of the installation ring (18), and a filter cotton (19) is embedded and fixed between the installation ring (18) and the connection seat (21). A nitrogen input pipe (20) is fixedly installed at the bottom end of the connection seat (21).

6. The wafer cleaning equipment based on pure water cleaning agent according to claim 5, characterized in that, Card slots (44) are formed on both sides of the top end surface of the cleaning platform (3). Blocks that fit and plug into the card slots (44) are fixed on both sides of the bottom end surface of the cleaning platform (3). A nitrogen connection pipe (23) communicated with the air delivery groove (24) is fixed at one end of the flow guide ring (25), and an exhaust pipe (32) is fixedly installed at the other end of the flow guide ring (25). The top end of the nitrogen connection pipe (23) is fixed to the nitrogen supply pipe (22).

7. A wafer cleaning device based on pure water cleaning agent according to claim 6, characterized in that, A plurality of mounting seats (28) are fixedly arranged at the bottom end of the cleaning platform (3) in a rectangular array. The cleaning device is a rotating motor (29) fixed at the center position of the bottom end surface of the cleaning platform (3). The top end of the mounting column (10) is threadedly inserted into the mounting seat (28). The top end of the rotating motor (29) extends into the cleaning platform (3) and is fixed with a rotating shaft (36). A connecting rod (35) fixed to the rotating ring (34) is fixedly arranged on the outer wall of the rotating shaft (36) in an annular array. A supporting part (41) embedded in the cleaning platform (3) is fixed to the outer wall of the rotating ring (34).

8. The wafer cleaning equipment based on pure water cleaning agent according to claim 7, characterized in that, A threaded hole (39) is formed in the side wall of the clamping plate (33). A groove (42) is formed in the outer wall of the cleaning platform (3). A bolt (43) threadedly inserted into the threaded hole (39) is embedded in the groove (42). A vacuum pump (31) is fixedly installed at the bottom end of the cleaning device, and a mesh plate (37) communicated with the vacuum pump (31) is fixedly embedded in the bottom wall of the cleaning device main body.

9. The wafer cleaning equipment based on pure water cleaning agent according to claim 8, characterized in that, The drainage mechanism includes an arc-shaped groove (40) formed in the inner wall of the cleaning platform (3) below the wafer main body (26) and drainage grooves (38) formed on both sides of the inner wall of the cleaning platform (3). The two drainage grooves (38) are both communicated with the arc-shaped groove (40). Drainage boxes (27) communicated with the drainage grooves (38) are fixedly arranged on both sides of the outer wall of the cleaning platform (3). A water outlet pipe (30) connected to each other is fixed to the bottom ends of the two drainage boxes (27). A three-way pipe is installed at the bottom end of the water outlet pipe (30).

10. A method for a wafer cleaning equipment based on pure water cleaning agent, which is used for the use of a wafer cleaning equipment based on pure water cleaning agent according to any one of claims 1-9, characterized in that, The usage steps of the wafer cleaning device main body (1) include: S1. Place the cleaning platform (3) on a plurality of mounting columns (10), and rotate the mounting columns (10) to threadedly insert them into the mounting seats (28) to fixedly install the cleaning platform (3); S2. Place the wafer main body (26) on the rotating ring (34) at the top end of the cleaning platform (3). After the vacuum pump (31) is started, the bottom of the cleaning platform (3) is evacuated through the mesh plate (37) to suck and fix the wafer main body (26) on the top end of the rotating ring (34); S3. The electric push rod (11) drives the pure water input pipe (16) to move downward to the upper part of the wafer main body (26). The conveying pipe (14) moves synchronously with the folding pipe (17) and the pure water input pipe (16). The water pump drips the pure water cleaning agent in the pure water storage tank (5) along the pure water input pipe (16) onto the surface of the wafer main body (26); S4. Start the rotating motor (29) to drive the rotating shaft (36), the connecting rod (35), the rotating ring (34) and the wafer main body (26) to rotate synchronously. The rotating ring (34) is kept stable in the cleaning platform (3) through the supporting part (41). During the rotation of the rotating ring (34), the pure water cleaning agent is evenly thrown onto the surface of the wafer main body (26). The excess pure water cleaning agent flows into the drainage box (27) through the arc-shaped groove (40) and the drainage groove (38), and is discharged from the sewage discharge hole (13) and the sewage discharge pipe (2) through the water outlet pipe (30); S5. After cleaning, start the nitrogen delivery pump (4) connected to the nitrogen storage tank. The nitrogen delivery pump (4) flows through the nitrogen supply pipe (22), the nitrogen input pipe (20), and the nitrogen connection pipe (23) and then flows in the gas delivery groove (24). The filter cotton (19) between the mounting ring (18) and the connection seat (21) filters the input nitrogen. The nitrogen dries the wafer body (26) during the flowing process, and the dried air is discharged from the exhaust pipe (32).

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