Soldering control method and system applied to battery, terminal and storage medium

Abstract

The invention relates to a tin soldering control method and system applied to a battery, a terminal and a storage medium, and relates to the technical field of welding, and the method comprises the steps that in response to a detected battery circuit board, the current working state of tin soldering equipment is obtained; target tin soldering equipment is determined according to the current working state; controlling the manipulator to grab the battery circuit board; the battery circuit board is transferred to target tin soldering equipment through a mechanical arm, and the battery circuit board is placed on the target tin soldering equipment; carrying out tin soldering treatment on the battery circuit board through the target tin soldering equipment; after tin soldering treatment, a test image of the battery circuit board is obtained; acquiring a test result of the battery circuit board according to the detection image; under the condition that the test result is that the test is passed, transferring the battery circuit board to a finished product area; and transferring the battery circuit board to an inferior-quality product area under the condition that the test result does not pass the test. The tin soldering equipment has the effect that the influence on manufacturing of the battery circuit board is reduced when the tin soldering equipment breaks down.

Description

Technical Field

[0001] The present application relates to the field of welding technology, and in particular, to a soldering control method, system, terminal and storage medium applied to batteries. Background Art

[0002] When manufacturing a battery circuit board, it is necessary to connect the circuit board and components through soldering technology to ensure the normal operation of the battery circuit board.

[0003] Related technologies adopt pipeline processing. There are several soldering devices arranged on the pipeline, and each soldering device is only responsible for processing specific solder joints on the battery circuit board. When the battery circuit board passes through all the soldering devices, the soldering of all the solder joints on the battery circuit board is completed.

[0004] In view of the above related technologies, if any soldering device on the pipeline fails, the entire pipeline will not be able to work normally, which will have a great impact on the soldering process of the battery circuit board. Summary of the Invention

[0005] In order to reduce the impact on the manufacture of battery circuit boards when the soldering device fails, the present application provides a soldering control method, system, terminal and storage medium applied to batteries.

[0006] In a first aspect, the present application provides a soldering control method applied to batteries, adopting the following technical solution: A soldering control method applied to batteries includes: In response to detecting a battery circuit board, obtaining the current working state of the soldering device; Determining a target soldering device according to the current working state; Controlling a manipulator to grasp the battery circuit board; Transferring the battery circuit board to the target soldering device through the manipulator and placing the battery circuit board on the target soldering device; Performing soldering treatment on the battery circuit board through the target soldering device; After the soldering treatment, obtaining a test image of the battery circuit board; Obtaining a test result of the battery circuit board according to the detection image; When the test result is a pass, transferring the battery circuit board to the finished product area; When the test result is not a pass, transferring the battery circuit board to the defective product area.

[0007] By adopting the above technical solution, a manipulator is used to place the battery circuit board on the soldering equipment. The soldering equipment processes all the solder joints on the battery circuit board, and the battery circuit board is placed in the finished product area or defective product area according to the test result of the battery circuit board. After the soldering equipment fails, other normally operating soldering equipment can still be used for soldering treatment, reducing the impact on the manufacturing of the battery circuit board.

[0008] Optionally, according to the current working state, count the number of first devices in the idle state and the number of second devices in the working state in the soldering equipment; When the number of the first devices is not zero, select the soldering equipment in the idle state as the target soldering equipment; When the number of the first devices is zero, determine the working soldering equipment in the working state; Obtain the remaining working duration of the working soldering equipment; Select the soldering equipment corresponding to the minimum value in the remaining working duration as the target soldering equipment.

[0009] By adopting the above technical solution, select the soldering equipment in the idle state as the target soldering equipment, or select the soldering equipment corresponding to the minimum value of the remaining working duration as the target soldering equipment, so that the battery circuit board can be soldered in time and the production efficiency of the battery circuit board is guaranteed.

[0010] Optionally, when there are at least two soldering equipment corresponding to the minimum value in the remaining working duration, determine the candidate soldering equipment corresponding to the minimum value; Obtain the solder joint quality distribution of the battery circuit board, where the solder joint quality distribution is used to represent the quality of each solder joint on the battery circuit board; According to the historical operation records, count the average processing duration of the candidate soldering equipment; Set the sorting priority of the candidate soldering equipment according to the solder joint quality distribution and the average processing duration; Determine the target soldering equipment according to the sorting priority.

[0011] By adopting the above technical solution, according to the solder joint quality distribution of the battery circuit board and the sorting priority of each soldering equipment, and determine the target soldering equipment from the sorting priority. On the premise of ensuring the processing efficiency of the target soldering equipment, the target soldering equipment has strong processing ability.

[0012] Optionally, extract the problem solder joints from the solder joint quality distribution, where the quality of the problem solder joints is less than the preset quality; Obtain the solder joint processing ability of the candidate soldering equipment, where the solder joint processing ability is used to represent the average duration for the soldering equipment to process different solder joints; Calculate the solder joint processing score of the candidate soldering equipment according to the problem solder joints, the solder joint processing ability, and the average processing duration; Based on the solder joint processing score, perform a descending order sorting on the candidate soldering equipment to obtain the sorting priority.

[0013] By adopting the above technical solution, using the solder joint processing ability and the average processing duration of the soldering equipment to calculate the solder joint processing score of the candidate soldering equipment, enabling the solder joint processing score to reflect the comprehensive processing ability of the soldering equipment and ensuring the rationality of the sorting priority.

[0014] Optionally, obtain the historical operation record of the candidate soldering equipment in the previous time period, where the historical operation record includes the types of circuit boards processed by the candidate soldering equipment and the solder joint processing duration; If there is a solder joint processing duration greater than the preset processing duration threshold, mark the candidate soldering equipment as a faulty state; If there is no solder joint processing duration greater than the preset processing duration threshold, screen the solder joint processing duration from the historical operation record; Generate the solder joint processing ability according to the solder joint processing duration.

[0015] By adopting the above technical solution, according to the magnitude relationship between the solder joint processing duration and the preset processing duration threshold, setting different ways to generate the solder joint processing ability ensures the accuracy of the solder joint processing ability, so as to obtain a reasonable target soldering equipment subsequently.

[0016] Optionally, obtain the first soldering parameters of the candidate soldering equipment in the previous time period, where the soldering parameters include pressure parameters and temperature parameters; Obtain the second soldering parameters of the reference soldering equipment during normal operation; Calculate the difference between the first soldering parameters and the second soldering parameters to obtain the parameter difference; Generate the maintenance strategy of the candidate soldering equipment based on the parameter difference.

[0017] By adopting the above technical solution, after the candidate soldering equipment is marked as a faulty state, the parameter difference between the first soldering parameters and the second soldering parameters can be used to repair the candidate soldering equipment, which can quickly locate the problems existing in the candidate soldering equipment and can achieve the rapid repair of the candidate soldering equipment.

[0018] Optionally, obtain the real-time image of the battery circuit board; Determine the solder joint positions on the battery circuit board in the real-time image; Obtain a solder joint image based on the solder joint positions; Invoke a vision detection model to perform vision detection and scoring on the solder joint image, and obtain a solder joint quality score; Integrate the solder joint quality scores to obtain the solder joint quality distribution.

[0019] By adopting the above technical solution, a vision detection model is invoked to perform vision detection and scoring on the real-time image of the battery circuit board, thereby obtaining a solder joint quality score, making the solder joint quality score more accurate.

[0020] In a second aspect, the present application provides a soldering control system for a battery, adopting the following technical solution: A soldering control system for a battery, comprising: An acquisition module for acquiring the current working state and a detection image; A memory for storing the program of the soldering control method for the battery; A processor, and the program in the memory can be loaded and executed by the processor to implement the soldering control method for the battery.

[0021] By adopting the above technical solution, a manipulator is used to place the battery circuit board on the soldering device, all the solder joints on the battery circuit board are processed by the soldering device, and the battery circuit board is placed in the finished product area or the defective product area according to the test result of the battery circuit board. After the soldering device fails, other normally working soldering devices can still be used for soldering processing, reducing the impact on manufacturing the battery circuit board.

[0022] In a third aspect, the present application provides an intelligent terminal, adopting the following technical solution: An intelligent terminal, comprising a memory and a processor, and a computer program capable of being loaded and executed by the processor is stored on the memory, which implements any one of the above-mentioned soldering control methods for the battery.

[0023] In a fourth aspect, the present application provides a computer storage medium, which can store a corresponding program and has the characteristic of facilitating reducing the impact on manufacturing the battery circuit board when the soldering device fails, adopting the following technical solution: A computer-readable storage medium stores a computer program capable of being loaded and executed by the processor to implement any one of the above-mentioned soldering control methods for the battery.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. Use a manipulator to place the battery circuit board on the soldering equipment, process all the solder joints on the battery circuit board through the soldering equipment, and place the battery circuit board in the finished product area or defective product area according to the test results of the battery circuit board. After the soldering equipment fails, other normal working soldering equipment can still be used for soldering treatment, reducing the impact on the manufacturing of battery circuit boards; 2. Select the soldering equipment in the idle state as the target soldering equipment, or select the soldering equipment corresponding to the minimum remaining working duration as the target soldering equipment, so that the battery circuit board can be soldered in time and the production efficiency of the battery circuit board is guaranteed; 3. According to the solder joint quality distribution of the battery circuit board and the sorting priority of each soldering equipment, determine the target soldering equipment from the sorting priorities, and on the premise of ensuring the processing efficiency of the target soldering equipment, make the target soldering equipment have strong processing capabilities. Description of the Drawings

[0025] Figure 1 is a schematic diagram of a soldering system for a battery circuit board provided by an embodiment of the present application.

[0026] Figure 2 is a schematic flow chart of a soldering control method applied to a battery provided by an embodiment of the present application.

[0027] Figure 3 is a schematic flow chart of a method for determining a target soldering equipment provided by an embodiment of the present application.

[0028] Figure 4 is a schematic flow chart of a method for determining a target soldering equipment provided by an embodiment of the present application.

[0029] Figure 5 is a schematic flow chart of a method for obtaining a sorting priority provided by an embodiment of the present application.

[0030] Figure 6 is a schematic flow chart of a method for generating a solder joint processing ability provided by an embodiment of the present application.

[0031] Figure 7 is a schematic flow chart of a method for repairing a soldering equipment provided by an embodiment of the present application.

[0032] Figure 8 is a schematic flow chart of a method for generating a solder joint quality distribution provided by an embodiment of the present application.

[0033] Figure 9 is a schematic diagram of a soldering control system applied to a battery provided by an embodiment of the present application. Detailed Embodiments

[0034] To make the objectives, technical solutions, and advantages of this application clearer and more understandable, the following further elaborates on this application in conjunction with the appended Figure 1 drawings Figure 9 and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0035] An embodiment of this application discloses a schematic diagram of a soldering device applied to a battery. Referring to Figure 1 , the device includes: a transmission component 11, a soldering device 12, a manipulator 13, and a controller 14.

[0036] The transmission component 11 is used to transmit the battery circuit board. For example, the transmission component 11 is a conveyor belt, and the transmission component 11 can transmit the battery circuit board to the waiting area.

[0037] The soldering device 12 is used to perform soldering on the battery circuit board. In this application, there are at least two soldering devices 12.

[0038] The manipulator 13 is used to transfer the battery circuit board. Exemplarily, the manipulator 13 transfers the battery circuit board from the waiting area to the soldering device 12, and after the soldering device 12 finishes soldering the battery circuit board, transfers the battery circuit board to the finished product area or the defective product area.

[0039] The controller 14 is used to control various devices in the soldering device.

[0040] Exemplarily, in response to the controller 14 detecting the battery circuit board, the controller 14 obtains the current working state of the soldering device 12. The controller 14 determines the target soldering device from the soldering devices 12 according to the current working state. The controller 14 controls the manipulator 13 to grab the battery circuit board on the transmission component 11 and transfer the battery circuit board to the target soldering device, thereby placing the battery circuit board on the target soldering device. The target soldering device performs soldering processing on the battery circuit board. After the soldering processing, the controller 14 obtains the test image of the battery circuit board. The controller 14 obtains the test result of the battery circuit board according to the detection image. In the case where the test result is a pass, the manipulator 13 transfers the battery circuit board to the finished product area. In the case where the test result is not a pass, the manipulator 13 transfers the battery circuit board to the defective product area.

[0041] An embodiment of this application discloses a soldering control method applied to a battery. Referring to Figure 2 , the method includes: Step S201: In response to detecting the battery circuit board, obtain the current working state of the soldering device.

[0042] The battery circuit board is a circuit board applied to the battery, and the battery circuit board is used to control the charging and discharging of the battery.

[0043] The soldering equipment is used for soldering on the battery circuit board. Optionally, the soldering equipment includes a soldering tip assembly, a feeding assembly, a positioning assembly, and a temperature control assembly. Among them, the soldering tip assembly is used for soldering operations, the feeding assembly is used to convey the solder used for soldering to the soldering tip assembly, the positioning assembly is used to determine the solder joints on the battery circuit board, and the temperature control assembly is used to control the temperature of the solder.

[0044] The current working state is used to indicate whether the soldering equipment is in a working state at the current moment. The current working state includes a working state and an idle state. The current moment is the moment when the battery board is detected.

[0045] Exemplarily, an image of the circuit board is captured by a camera. The object to be recognized within the detection frame in the circuit board image is recognized. When the object to be recognized is the battery circuit board and the area of the battery circuit board within the detection frame is greater than the preset area, it is determined that the battery circuit board has been detected. In other cases, it is considered that the battery circuit board has not been detected.

[0046] Exemplarily, a pair of optoelectronic sensors are arranged on the moving path of the battery circuit board. If the optoelectronic sensors detect that there is an object blocking, it is considered that the battery circuit board has been detected. If the optoelectronic sensors do not detect an object blocking, it is considered that the battery circuit board has not been detected.

[0047] Step S202: Determine the target soldering equipment according to the current working state.

[0048] The target soldering equipment refers to the soldering equipment that performs soldering operations on the battery circuit board.

[0049] Exemplarily, select the soldering equipment in the idle state as the target soldering equipment.

[0050] Step S203: Control the manipulator to grasp the battery circuit board.

[0051] Exemplarily, when the battery circuit board is detected, the battery circuit board is located in the preset waiting area. Then control the manipulator to move to the preset waiting area and control the manipulator to grasp the battery circuit board located in the preset waiting area.

[0052] Exemplarily, after obtaining the circuit board image through the camera, obtain the area where the circuit board is located according to the circuit board image. Control the manipulator to move to the aforementioned area where it is located and control the manipulator to grasp the battery circuit board located in the area where it is located.

[0053] Step S204: Transfer the battery circuit board to the target soldering equipment through the manipulator and place the battery circuit board on the target soldering equipment.

[0054] Exemplarily, obtain the movement path corresponding to the target soldering device. Through the manipulator, transfer the battery circuit board along the movement path to the target soldering device and place the battery circuit board on the working position of the target soldering device.

[0055] Step S205: Perform soldering treatment on the battery circuit board through the target soldering device.

[0056] The soldering treatment is used to solder the components to the battery circuit board. The soldering treatment will operate on the solder joints on the battery circuit board, and the positions of the solder joints on the battery circuit board are preset.

[0057] Step S206: After the soldering treatment, obtain the test image of the battery circuit board.

[0058] Exemplarily, a camera is provided on the target soldering device, and the camera can capture the test image of the battery circuit board from a top-down perspective.

[0059] Step S207: Obtain the test result of the battery circuit board according to the detection image.

[0060] The test result is used to represent the solder joint quality of the battery circuit board. Optionally, the test result includes pass, fail, and undetermined.

[0061] Optionally, extract the solder joint contour from the detection image. Obtain the solder joint features based on the solder joint contour, and the solder joint features include at least one of area, roundness, and shape. Perform a scoring process on the solder joint features to obtain the solder joint score. If the solder joint score is greater than the preset solder joint score threshold, set the test result to pass. If the solder joint score is not greater than the preset solder joint score threshold, set the test result to fail. Further, perform binarization processing on the detection image to obtain a binarized detection image. Separate the solder joint area and the non-solder joint area in the binarized detection image. Obtain the solder joint contour based on the solder joint area and the non-solder joint area.

[0062] Step S208: In the case where the test result is pass, transfer the battery circuit board to the finished product area.

[0063] The finished product area is used to place the battery circuit boards that meet the design standards. Optionally, the manipulator can be used to transfer the battery circuit board to the finished product area.

[0064] In the case where the test result is pass, it indicates that the solder joint quality of the battery circuit board meets the design requirements, so the battery circuit board is placed in the finished product area.

[0065] Step S209: In the case where the test result is not pass, transfer the battery circuit board to the defective product area.

[0066] The defective product area is used to place battery circuit boards that do not meet the design standards. Optionally, a robotic arm can be used to transfer the battery circuit boards to the defective product area.

[0067] In the case where the test result is not a pass, it indicates that the solder joint quality of the battery circuit board meets the design requirements, or it is difficult to determine the solder joint quality of the battery circuit board. Therefore, the battery circuit board is placed in the defective product area.

[0068] By adopting the above technical solution, a robotic arm is used to place the battery circuit board on the soldering equipment. The soldering equipment processes all the solder joints on the battery circuit board, and the battery circuit board is placed in the finished product area or the defective product area according to the test result of the battery circuit board. After the soldering equipment fails, other normally operating soldering equipment can still be used for soldering, reducing the impact on the manufacturing of battery circuit boards.

[0069] In the following embodiments, a method for determining the target soldering equipment will be given, so that the target soldering equipment can undertake the soldering task. Therefore, an embodiment of the present application discloses a method for determining a target soldering equipment one. Refer to Figure 3 , the method includes: Step S301: According to the current working state, count the number of the first devices in the idle state and the number of the second devices in the working state among the soldering equipment.

[0070] The idle state means that the soldering equipment is not performing soldering operations, and the working state means that the soldering equipment is performing soldering operations.

[0071] Exemplarily, the soldering equipment sends status information to the controller at preset time intervals, and the status information is used to represent the current working state of the soldering equipment. The controller determines the number of the first devices and the number of the second devices according to the status information.

[0072] Exemplarily, a status record table is set in the controller, and the status record table is used to record the status of each soldering equipment. When the soldering equipment changes from the working state to the idle state, the soldering equipment generates and sends a status switching information to the controller. After receiving the status switching information, the controller updates the status of the soldering equipment in the status record table using the status switching information. Therefore, the controller can determine the number of the first devices and the number of the second devices from the status record table. Further, after determining the target soldering equipment, update the status of the target soldering equipment in the status record table so that the status recorded in the status record table is consistent with the actual status of the soldering equipment.

[0073] Step S302: When the number of the first devices is not zero, select the soldering equipment in the idle state as the target soldering equipment.

[0074] When the number of the first devices is not zero, it indicates that at least one soldering device is in an idle state. Therefore, select the soldering device in the idle state as the target soldering device.

[0075] Optionally, when the number of the first devices is at least two, randomly select one soldering device from the soldering devices in the idle state as the target soldering device.

[0076] Optionally, preset the device sorting of the soldering devices. When the number of the first devices is at least two, select the target soldering device from the soldering devices in the idle state according to the device sorting.

[0077] Step S303: When the number of the first devices is zero, determine the working soldering devices in the working state.

[0078] When the number of the first devices is zero, it indicates that all soldering devices are in the working state, and there is no soldering device in the idle state that can immediately process the battery circuit board.

[0079] Step S304: Obtain the remaining working duration of the working soldering device.

[0080] The remaining working duration refers to the time required for the working soldering device to complete the current battery circuit board. The current battery circuit board refers to the battery circuit board that the working soldering device is processing.

[0081] Optionally, obtain the first timestamp when the working soldering device enters the working state. Obtain the second timestamp of the current time. Calculate the difference between the second timestamp and the first timestamp to obtain the working duration of the working soldering device. Obtain the average processing duration of the working soldering device. Calculate the difference between the average processing duration and the working duration to obtain the remaining working duration.

[0082] Optionally, obtain the remaining number of solder joints of the working soldering device. The remaining number of solder joints refers to the number of uncompleted solder joints in the current battery circuit board. Calculate the product of the remaining number of solder joints and the preset average real-time duration for processing a solder joint to obtain the remaining working duration.

[0083] Step S305: Select the soldering device corresponding to the minimum value in the remaining working duration as the target soldering device.

[0084] The soldering device corresponding to the minimum value in the remaining working duration is the soldering device that can complete the soldering operation fastest and enter the idle state. Therefore, in this step, select the soldering device corresponding to the minimum value in the remaining working duration as the target soldering device to ensure that the battery circuit board can be processed as soon as possible.

[0085] By adopting the above technical solution, selecting the soldering equipment in the idle state as the target soldering equipment, or taking the soldering equipment corresponding to the minimum remaining working duration as the target soldering equipment enables the battery circuit board to be soldered in a timely manner and ensures the production efficiency of the battery circuit board.

[0086] In the following embodiments, if there are at least two soldering equipments corresponding to the minimum value in the remaining working duration, it is necessary to further determine the soldering equipment from these soldering equipments. Therefore, the embodiments of the present application disclose a second method for determining the target soldering equipment. Referring to Figure 4 , the method includes: Step S401: When there are at least two soldering equipments corresponding to the minimum value in the remaining working duration, determine the candidate soldering equipments corresponding to the minimum value.

[0087] In this embodiment, if there exists a positive integer n such that the variance of the remaining durations corresponding to the n soldering equipments with the smallest remaining working durations is less than the preset variance threshold, then the foregoing n soldering equipments are used as candidate soldering equipments.

[0088] Step S402: Obtain the solder joint quality distribution of the battery circuit board, where the solder joint quality distribution is used to represent the quality of each solder joint on the battery circuit board.

[0089] It should be noted that in the embodiments of the present application, the solder joint quality distribution refers to the quality of each solder joint on the battery circuit board, and this battery circuit board refers to the circuit board that has not been soldered yet.

[0090] In the actual scenario, although the battery circuit boards are made of the same design standards and materials, and the solder joint qualities of these battery circuit boards are theoretically the same, in practice, due to factors such as transportation factors and incorrect operations of staff, the solder joint qualities of the battery circuit boards may be uneven. For example, battery circuit board 1 and battery circuit board 2 are products of the same batch, but the quality of solder joint A on battery circuit board 1 is better than that of solder joint A on battery circuit board 2.

[0091] Exemplarily, obtain the circuit board image of the battery circuit board. Perform binarization processing on the circuit board image to obtain a binarized image. Based on the binarized image, obtain the shape of the solder joints in the circuit board image. If the shape of the solder joint conforms to the preset standard solder joint shape, set the solder joint quality to the first value. If the shape of the solder joint does not conform to the preset standard solder joint shape, set the solder joint quality to the second value. For example, the first value is 1 and the second value is 0. Or, calculate the similarity between the shape of the solder joint and the preset standard solder joint shape to obtain a quality score. Take the quality score as the solder joint quality.

[0092] Step S403: According to the historical operation records, count the average processing duration of the candidate soldering equipments.

[0093] The average processing duration refers to the average time for the soldering equipment to complete the soldering of a single-piece battery circuit board.

[0094] Exemplarily, obtain the total processing duration of the candidate soldering equipment from the historical operation records. Calculate the mean of the total processing duration to obtain the average processing duration.

[0095] Step S404: Set the sorting priority of the candidate soldering equipment according to the solder joint quality distribution and the average processing duration.

[0096] Exemplarily, generate a solder joint quality score according to the solder joint quality distribution. Normalize the solder joint quality score to obtain. Normalize the average processing duration to obtain. Calculate the weighted sum of and to obtain the priority score of the candidate soldering equipment. Sort the candidate soldering equipment in descending order based on the priority score to obtain the sorting priority.

[0097] Step S405: Determine the target soldering equipment according to the sorting priority.

[0098] Exemplarily, set the first soldering equipment in the sorting priority as the target soldering equipment.

[0099] By adopting the above technical solution, according to the solder joint quality distribution of the battery circuit board and the sorting priority of each soldering equipment, and determining the target soldering equipment from the sorting priority, while ensuring the processing efficiency of the target soldering equipment, the target soldering equipment has strong processing capabilities.

[0100] In the following embodiments, when calculating the sorting priority, the priority of each soldering equipment will be adjusted according to the actual quality of each solder joint on the soldering equipment, so as to optimize the sorting priority. Therefore, the embodiments of the present application disclose a method for obtaining the sorting priority. Refer to Figure 5 , the method includes: Step S501: Extract problem solder joints from the solder joint quality distribution, and the quality of the problem solder joints is less than the preset quality.

[0101] It should be noted that the quality of the problem solder joints being less than the preset quality does not mean that the problem solder joints cannot be soldered, but only means that the soldering difficulty of these solder joints is relatively large, but they can still be soldered.

[0102] Exemplarily, if the solder joint quality distribution uses quality scores to represent the quality of each solder joint on the battery circuit board, set a quality score threshold, and use the solder joints with quality scores less than the quality score threshold as the problem solder joints.

[0103] In some other embodiments, if no problem solder joints can be extracted from the solder joint quality distribution, it means that the solder joint quality of the battery circuit board is qualified, and the subsequent steps of this embodiment do not need to be executed.

[0104] Step S502: Obtain the solder joint processing ability of the candidate soldering equipment, where the solder joint processing ability is used to represent the average duration for the soldering equipment to process different solder joints.

[0105] Exemplarily, extract the average duration for the candidate soldering equipment to process each solder joint from the historical operation records of the candidate soldering equipment. Statistically analyze the aforementioned average duration to obtain the solder joint processing ability. For example, if the average time for the candidate soldering equipment to process solder joint A is 4 seconds and the average time for processing solder joint B is 6 seconds from the historical operation records, then record the aforementioned solder joints and the corresponding average times in the historical operation records.

[0106] Step S503: Calculate the solder joint processing score of the candidate soldering equipment according to the problem solder joint, the solder joint processing ability, and the average processing duration.

[0107] The solder joint processing score is used to represent the comprehensive ability of the soldering equipment to process the problem solder joint.

[0108] Exemplarily, determine the problem solder joint processing ability corresponding to the problem solder joint from the solder joint processing ability, where the problem solder joint processing ability refers to the average duration for the soldering equipment to process the problem solder joint. Perform normalization processing on the problem solder joint processing ability to obtain the first normalized value. Perform normalization processing on the average processing duration to obtain the second normalized value, and the value ranges of the first normalized value and the second normalized value are both within a preset interval. Calculate the first normalized value and the second normalized value through weighted calculation to obtain the solder joint processing score. Among them, the weight value used for weighted calculation is a preset value.

[0109] Step S504: Perform a descending order sorting on the candidate soldering equipment based on the solder joint processing score to obtain the sorting priority.

[0110] The sorting priority obtained in this embodiment is based on the ability of the candidate soldering equipment to process the problem solder joint and the ability to process the complete battery circuit board.

[0111] By adopting the above technical solution, the solder joint processing score of the candidate soldering equipment is calculated using the solder joint processing ability and the average processing duration of the soldering equipment, so that the solder joint processing score can reflect the comprehensive processing ability of the soldering equipment and ensure the rationality of the sorting priority.

[0112] In the following embodiments, the solder joint processing ability will be generated based on the historical operation records of the candidate soldering equipment in the previous time period, and it will be determined whether the soldering equipment is working properly. This application embodiment discloses a method for generating the solder joint processing ability. Refer to Figure 6 , this method includes: Step S601: Obtain the historical operation records of the candidate soldering equipment in the previous time period, where the historical operation records include the types of circuit boards processed by the candidate soldering equipment and the solder joint processing duration.

[0113] The previous time period refers to the historical time period relative to the current time period. Optionally, the working time period is divided into several time periods. For example, if the working time period is from 10:00 to 18:00, the working time period is evenly divided into several time periods with a time length of 1 hour.

[0114] Step S602: If there is a solder joint processing duration greater than the preset processing duration threshold, mark the candidate soldering equipment as a faulty state.

[0115] The preset processing duration threshold is a preset empirical value, and the technical personnel can adjust the specific value of the preset processing duration threshold according to actual needs.

[0116] The faulty state is used to indicate that there are potential faults in the candidate soldering equipment.

[0117] If there is a solder joint processing duration greater than the preset processing duration threshold, it indicates that there is a high probability of a fault in the candidate tin equipment, resulting in an excessive time for the candidate soldering equipment to process the solder joints.

[0118] Step S603: If there is no solder joint processing duration greater than the preset processing duration threshold, screen the solder joint processing duration from the historical operation records.

[0119] If there is no solder joint processing duration greater than the preset processing duration threshold, it indicates that the candidate tin equipment is working properly. Optionally, mark the candidate soldering equipment as a normal state.

[0120] Optionally, the historical operation records in this step refer to the operation records of the previous time period.

[0121] Step S604: Generate the solder joint processing ability according to the solder joint processing duration.

[0122] Exemplarily, the solder joint processing duration includes the consumption duration of the candidate soldering equipment for each solder joint in the previous time period. Calculate the polyester of the solder joint processing duration to obtain the solder joint processing ability.

[0123] By adopting the above technical solution, different ways of generating the solder joint processing ability are set according to the size relationship between the solder joint processing duration and the preset processing duration threshold, ensuring the accuracy of the solder joint processing ability, so as to obtain a reasonable target soldering equipment subsequently.

[0124] In the following embodiments, if it is determined in the previous embodiment that the candidate soldering equipment is in a faulty state, it is necessary to quickly determine the problems existing in the candidate soldering equipment and perform repairs. Therefore, the embodiments of the present application disclose a repair method for a soldering equipment. Refer to Figure 7 , the method includes: Step S701: Obtain the first soldering parameters of the candidate soldering equipment in the previous time period, where the soldering parameters include pressure parameters and temperature parameters.

[0125] Optionally, the candidate soldering device sends the first soldering parameter to the controller, and the controller stores the first soldering data in its own storage space. Therefore, the controller can utilize the storage space to obtain the first soldering parameter of the candidate soldering device in the previous time period.

[0126] The pressure parameter refers to the pressure used by the candidate soldering device to discharge the solder.

[0127] The temperature parameter refers to the temperature of the solder used by the candidate soldering device.

[0128] Furthermore, the first soldering parameter is the average value of the candidate soldering device in the previous time period. For example, after statistically calculating the pressure parameter of the candidate soldering device in the previous time period, the average value of the pressure parameter is calculated to obtain the first soldering parameter.

[0129] Step S702: Obtain the second soldering parameter of the reference soldering device during normal operation.

[0130] The reference soldering device refers to the soldering parameter marked as the normal state. The acquisition method of the second soldering parameter is similar to that of the first soldering parameter, which will not be elaborated here.

[0131] Step S703: Calculate the difference between the first soldering parameter and the second soldering parameter to obtain the parameter difference.

[0132] The parameter difference includes the pressure parameter difference and the temperature parameter difference.

[0133] Exemplarily, obtain the first pressure parameter in the first soldering parameter and the second pressure parameter in the second soldering parameter. Calculate the difference between the first pressure parameter and the second pressure parameter to obtain the pressure parameter difference.

[0134] Exemplarily, obtain the first temperature parameter in the first soldering parameter and the second temperature parameter in the second soldering parameter. Calculate the difference between the first temperature parameter and the second temperature parameter to obtain the temperature parameter difference.

[0135] Step S704: Generate a maintenance strategy for the candidate soldering device based on the parameter difference.

[0136] Exemplarily, obtain a preset pressure parameter difference range, where each pressure parameter difference range corresponds to a first fault severity level one by one. Determine the target pressure parameter difference range into which the pressure parameter difference falls from the pressure parameter difference ranges, and determine the first target fault severity level corresponding to the target pressure parameter difference range. Generate a maintenance strategy based on the first target fault severity level, and this maintenance strategy is related to the feeding component and the welding nozzle component. For example, the first fault severity levels include minor, ordinary, and severe. If the first target fault severity level is minor, the maintenance strategy is to wait until the end of the working period and repair the soldering equipment. If the first target fault severity level is ordinary, the maintenance strategy is to turn off and repair the soldering equipment after it completes the current work task. If the first target fault severity level is severe, the maintenance strategy is to immediately turn off the soldering equipment and immediately perform repairs.

[0137] Exemplarily, obtain a preset temperature parameter difference range, where each temperature parameter difference range corresponds to a second fault severity level one by one. Determine the target temperature parameter difference range into which the temperature parameter difference falls from the temperature parameter difference ranges, and determine the second target fault severity level corresponding to the target temperature parameter difference range. Generate a maintenance strategy based on the second target fault severity level, and this maintenance strategy is related to the welding nozzle component and the temperature control component.

[0138] By adopting the above technical solution, after the candidate soldering equipment is marked as a fault state, the parameter difference between the first soldering parameter and the second soldering parameter can be used to repair the candidate soldering equipment, which can quickly locate the problems existing in the candidate soldering equipment and can achieve the rapid repair of the candidate soldering equipment.

[0139] In the following embodiments, the embodiments of the present application disclose a method for generating a solder joint quality distribution. Refer to Figure 8 , this method includes: Step S801: Obtain a real-time image of the battery circuit board.

[0140] The real-time image refers to an image including the battery circuit board. Optionally, the real-time image is obtained by taking a picture of the battery circuit board with a camera.

[0141] Step S802: Determine the solder joint positions on the battery circuit board in the real-time image.

[0142] Optionally, call an object recognition model to perform object recognition processing on the real-time image to obtain a detection frame, and this detection frame is used to frame the solder joints located on the battery circuit board.

[0143] Optionally, after obtaining the real-time image, the solder joint positions are located at preset positions in the real-time image.

[0144] Step S803: Obtain a solder joint image based on the solder joint positions.

[0145] Exemplarily, an image at the solder joint position in the real-time image is intercepted to obtain a solder joint image.

[0146] Step S804: Invoke the visual detection model to perform visual detection and scoring on the solder joint image to obtain a solder joint quality score.

[0147] The visual detection model is used to detect the shape and quality of the solder joints in the solder joint image. The solder joint quality score is used to evaluate the quality of each solder joint on the battery circuit board.

[0148] Step S805: Integrate the solder joint quality scores to obtain a solder joint quality distribution.

[0149] Optionally, combine the solder joint quality scores to obtain a solder joint quality distribution.

[0150] By adopting the above technical solution, the visual detection model is invoked to perform visual detection and scoring on the real-time image of the battery circuit board, so as to obtain a solder joint quality score, making the solder joint quality score more accurate.

[0151] Based on the same inventive concept, an embodiment of the present application provides a soldering control system for a battery. Please refer to Figure 9 , and the system includes: An acquisition module 901, configured to acquire the current working state and a detection image; A memory 902, configured to store a program of the soldering control method for a battery; A processor 903, and the program in the memory can be loaded and executed by the processor and implement the soldering control method for a battery.

[0152] By adopting the above technical solution, the manipulator is used to place the battery circuit board on the soldering device, all the solder joints on the battery circuit board are processed by the soldering device, and the battery circuit board is placed in the finished product area or the defective product area according to the test result of the battery circuit board. After the soldering device fails, other normally working soldering devices can still be used for soldering processing, reducing the impact on manufacturing the battery circuit board.

[0153] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the above division of each functional module is used as an example. In actual applications, the above functions can be allocated to different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. For the specific working processes of the system, device, and unit described above, reference can be made to the corresponding processes in the foregoing method embodiments, which will not be elaborated here.

[0154] An embodiment of the present application provides a computer-readable storage medium storing a computer program that can be loaded and executed by a processor to implement a soldering control method applied to a battery.

[0155] Computer storage media include, for example, various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs.

[0156] Based on the same inventive concept, an embodiment of the present application provides an intelligent terminal including a memory and a processor, where the memory stores a computer program that can be loaded and executed by the processor to implement a soldering control method applied to a battery.

[0157] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above division of each functional module is used as an example. In actual applications, the above functions can be allocated to different functional modules according to needs, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0158] The above are all preferred embodiments of the present application. Without limiting the protection scope of the present application accordingly, any feature disclosed in this specification (including the abstract and drawings), unless specifically stated, can be replaced by other equivalent or similar-purpose alternative features. That is, unless specifically stated, each feature is only an example of a series of equivalent or similar features.

Claims

1. A soldering control method applied to a battery, characterized in that, The method includes: In response to detecting the battery circuit board, obtaining the current working state of the soldering equipment; Determining the target soldering equipment according to the current working state; Controlling the manipulator to grasp the battery circuit board; Transferring the battery circuit board to the target soldering equipment through the manipulator and placing the battery circuit board on the target soldering equipment; Performing soldering treatment on the battery circuit board through the target soldering equipment; After the soldering treatment, obtaining the test image of the battery circuit board; Obtaining the test result of the battery circuit board according to the detection image; In the case where the test result is a pass, transferring the battery circuit board to the finished product area; In the case where the test result is not a pass, transferring the battery circuit board to the defective product area.

2. The soldering control method applied to a battery according to claim 1, wherein The determining the target soldering equipment according to the current working state includes: According to the current working state, counting the number of first devices in the idle state and the number of second devices in the working state among the soldering equipment; In the case where the number of the first devices is not zero, selecting the soldering equipment in the idle state as the target soldering equipment; In the case where the number of the first devices is zero, determining the working soldering equipment in the working state; Obtaining the remaining working duration of the working soldering equipment; Taking the soldering equipment corresponding to the minimum value in the remaining working duration as the target soldering equipment.

3. The soldering control method applied to a battery according to claim 2, characterized in that, The taking the soldering equipment corresponding to the minimum value in the remaining working duration as the target soldering equipment includes: In the case where there are at least two soldering equipment corresponding to the minimum value in the remaining working duration, determining the candidate soldering equipment corresponding to the minimum value; Obtaining the solder joint quality distribution of the battery circuit board, where the solder joint quality distribution is used to represent the quality of each solder joint on the battery circuit board; According to the historical operation records, counting the average processing duration of the candidate soldering equipment; Setting the sorting priority of the candidate soldering equipment according to the solder joint quality distribution and the average processing duration; Determining the target soldering equipment according to the sorting priority.

4. The soldering control method applied to a battery according to claim 3, wherein The setting the sorting priority of the candidate soldering equipment according to the solder joint quality distribution and the average processing duration includes: Extracting the problematic solder joints from the solder joint quality distribution, where the quality of the problematic solder joints is less than the preset quality; Obtaining the solder joint processing ability of the candidate soldering equipment, where the solder joint processing ability is used to represent the average duration for the soldering equipment to process different solder joints; Calculating the solder joint processing score of the candidate soldering equipment according to the problematic solder joints, the solder joint processing ability, and the average processing duration; Performing a descending order sorting on the candidate soldering equipment based on the solder joint processing score to obtain the sorting priority.

5. The soldering control method applied to a battery according to claim 4, wherein The obtaining the solder joint processing ability of the candidate soldering equipment includes: Obtaining the historical operation records of the candidate soldering equipment in the previous time period, where the historical operation records include the types of circuit boards processed by the candidate soldering equipment and the solder joint processing duration; If there is a solder joint processing duration greater than the preset processing duration threshold, marking the candidate soldering equipment as a faulty state; If there is no solder joint processing duration greater than the preset processing duration threshold, filter the solder joint processing duration from the historical operation records; Generate the solder joint processing ability according to the solder joint processing duration.

6. The soldering control method applied to a battery according to claim 5, characterized in that, After marking the candidate soldering equipment as a faulty state, it further includes: Obtain the first soldering parameters of the candidate soldering equipment in the previous time period, where the soldering parameters include pressure parameters and temperature parameters; Obtain the second soldering parameters of the reference soldering equipment during normal operation; Calculate the difference between the first soldering parameter and the second soldering parameter to obtain a parameter difference; Generate a maintenance strategy for the candidate soldering equipment based on the parameter difference.

7. The soldering control method applied to a battery according to claim 3, wherein The obtaining of the solder joint quality distribution of the battery circuit board includes: Obtain a real-time image of the battery circuit board; Determine the solder joint positions on the battery circuit board in the real-time image; Obtain a solder joint image based on the solder joint positions; Call a vision detection model to perform vision detection and scoring on the solder joint image to obtain a solder joint quality score; Integrate the solder joint quality scores to obtain the solder joint quality distribution.

8. A soldering control system applied to a battery, characterized in that, The system is used to execute the soldering control method for a battery according to any one of claims 1 to 7, including: An acquisition module for acquiring the current working state and a detection image; A memory for storing the program of the soldering control method for a battery; A processor, and the program in the memory can be loaded and executed by the processor to implement the soldering control method for a battery.

9. An intelligent terminal, characterized in that, It includes a memory and a processor, and a computer program capable of being loaded and executed by the processor to implement the soldering control method for a battery according to any one of claims 1 to 7 is stored on the memory.

10. A computer-readable storage medium, characterized in that, A computer program capable of being loaded and executed by the processor to implement the soldering control method for a battery according to any one of claims 1 to 7 is stored.

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